Advanced fluid connection design for multiphase systems

Abstract

A cooling arrangement for an electronic rack for a data center has a rack manifold having a liquid supply line for receiving a first cooling liquid from a source of cooling liquid and a liquid return line for returning a first warmer liquid to the source of cooling liquid. A plurality of server enclosures are arranged in a stack, each server enclosure including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the electronic rack, each connector module providing a fluid connection between the fluid cooling devices and the source of cooling liquid on the rack; wherein each of the connector modules includes a frame having a mount configured to attach the frame to the electronic rack, a plurality of channels formed in the frame to accommodate fluid connectors, and a plurality of fluid connectors slidably mounted in the channels.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to data center and electronic device cooling. More specifically, embodiments of the present invention relate to modular fluid connections and hardware designs that are particularly advantageous for multiphase systems. Background Technology

[0002] Cooling is a critical consideration in computer system and data center design. The number of high-performance electronic components, such as high-performance processors, encapsulated within servers is steadily increasing, leading to a rise in heat generated and dissipated during normal server operation. If the environment in which servers used in data centers are allowed to operate experiences rising temperatures over time, the reliability of these servers will decrease. Maintaining a proper thermal environment is crucial for the proper operation, performance, and lifespan of these servers in data centers. More effective and efficient cooling solutions are needed, especially for cooling these high-performance servers.

[0003] Servers and various types of IT equipment, based on systems with different computing, storage, and other functions, include multiple connectors located at the rear to deliver electrical communications, power, cooling fluid, etc. These connectors can be blind-mating connectors, where male-female connections are automatically performed through the self-alignment of mating connectors, eliminating the need for the user to reach the back of the unit to connect or disconnect various connectors. To achieve this blind-mating, the connectors must be positioned in a fixed orientation to accept mating connections. However, with the integration of advanced multiphase cooling systems, different systems may require different fluid connector arrangements, thus complicating the design of fluid cooling connections.

[0004] Interoperability of different cooling elements is important for adapting to different rack configurations, fluid systems, and rack-level fluid port availability in actual use. Summary of the Invention

[0005] One aspect of this disclosure provides a connector module for an electronic rack, comprising: a frame having a mounting element configured to attach the frame to the electronic rack; a plurality of channels formed in the frame to accommodate fluid connectors; and a plurality of fluid connectors slidably mounted in the channels.

[0006] Another aspect of this disclosure provides an electronic rack for a data center, comprising: a rack manifold having a rack liquid supply line and a rack liquid return line, the rack liquid supply line for receiving a first cooling liquid from a cooling liquid source, and the rack liquid return line for returning the first warmer liquid to the cooling liquid source; a plurality of server chassis arranged in a stacked manner, each server chassis including one or more fluid cooling devices associated with one or more information technology components; and a plurality of connector modules attached to the servers, each connector module providing a fluid connection between the fluid cooling devices and the cooling liquid source; wherein each of the connector modules includes: a frame having a mounting element configured to attach the frame to the electronic rack; a plurality of channels formed in the frame to receive fluid connectors; and a plurality of fluid connectors slidably mounted in the channels.

[0007] Another aspect of this disclosure provides a method for providing cooling fluid to an electronic rack of multiple server chassis, comprising: mounting a plurality of connector modules to the electronic rack, each connector module having at least two channels; attaching a plurality of fluid connectors to the connector modules by attaching at least one fluid connector in each of the channels; and for each of the server chassis, verifying the spatial orientation of an inlet connector and an outlet connector, sliding two of the plurality of fluid connectors to match the spatial orientation of the inlet connector and the outlet connector, securing the two fluid connectors in the spatial orientation, and then mounting the server chassis in the electronic rack by engaging the two fluid connectors with the inlet connector and the outlet connector. Attached Figure Description

[0008] Embodiments of the invention are shown in the accompanying drawings by way of example rather than limitation, in which the same reference numerals indicate similar elements.

[0009] Figure 1 This is a block diagram illustrating an example of a data center facility according to one implementation.

[0010] Figure 2 This is a block diagram illustrating an example of an electronic rack according to one embodiment.

[0011] Figure 3 This is a block diagram illustrating an example of a cold plate configuration according to one embodiment.

[0012] Figure 4A This is a general schematic diagram showing the connector module according to an embodiment, while Figure 4B This is its side view.

[0013] Figure 5A This is a general schematic diagram showing the connector module 500 according to an embodiment, while Figure 5BThis is a general schematic diagram illustrating another implementation without interconnections.

[0014] Figure 6A This is a general schematic diagram showing the connector module 600 according to an embodiment, while Figure 6B It is the overall side view of the module, and Figure 6C It is shown Figure 6A A side view of one of the connectors shown.

[0015] Figures 7A to 7C An implementation of server-level integration for connector modules is shown.

[0016] Figure 8 An implementation of the rack-level connector module is shown.

[0017] Figure 9 An implementation method particularly suitable for achieving closed-loop thermosiphon cooling is shown.

[0018] Figure 10 This is a general schematic diagram illustrating an implementation of a connector module used in a portion of a heterogeneous computer rack.

[0019] Figure 11 This is a flowchart illustrating the process according to an implementation method. Detailed Implementation

[0020] Various embodiments and aspects of the invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and drawings are illustrative of the invention and are not to be construed as limiting the invention. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in some cases, well-known or conventional details have not been described in order to provide a concise discussion of embodiments of the invention.

[0021] The use of "one embodiment" or "implementation" in the specification means that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of the invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0022] The disclosed embodiments provide a flexible interface for connectors in computing systems, particularly suitable for blind-mating fluid connectors in systems that can utilize multiphase fluid cooling. In such systems, fluid flow can depend on gravity and / or fluid pressure, allowing the connector location to differ for each supply and return line of each FRU within the housing. The disclosed embodiments introduce an interface that allows for easy repositioning of blind-mating connectors for fluid applications.

[0023] In the disclosed embodiments, the interface includes a frame that can be mounted onto a computing housing and has multiple channels or tracks. Each channel can slidably accommodate one or more connectors, allowing the connectors to slide to different positions within the channel. Preset positions can be configured for each channel, allowing each connector to slide to one of the preset positions. Each pair of connectors can be interconnected, moving them in unison to maintain a fixed spatial orientation between them. Thus, moving one connector will force the paired connectors to also move to maintain spatial orientation.

[0024] In one aspect, a connector module for an electronic rack includes: a frame having a mounting member configured to attach the frame to the electronic rack; a plurality of channels formed in the frame to receive fluid connectors; and a plurality of fluid connectors slidably mounted in the channels. The connector module also includes interconnectors attached to at least two fluid connectors to maintain a fixed spatial orientation between the two fluid connectors. Each of the fluid connectors further includes a locking mechanism that secures the fluid connector in a fixed position within the channel. The locking mechanism includes a tight fit of the fluid connector within the channel, thereby providing resistance to movement of the fluid connector within the channel to prevent free sliding. The locking mechanism includes an arm extending from the fluid connector and engaging teeth within the channel. The frame also includes a plurality of positioners positioned at preset locations and configured to lock the fluid connectors in the preset positions. Each of the fluid connectors includes an interconnect kit configured to interconnect each of the fluid connectors to another fluid connector to maintain a fixed spatial orientation.

[0025] According to another aspect, the electronic rack includes: a rack manifold having a rack liquid supply line and a rack liquid return line, the rack liquid supply line for receiving a first cooling liquid from a cooling liquid source, and the rack liquid return line for returning the first warmer liquid to the cooling liquid source; a plurality of server chassis arranged in a stacked manner, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components; and a plurality of connector modules attached to the electronic rack, each connector module providing a fluid connection between the fluid cooling devices and the cooling liquid source. Each connector module includes the components described above.

[0026] According to another aspect, a method for providing cooling fluid to an electronic rack of multiple server chassis includes: mounting a plurality of connector modules to the electronic rack, each connector module having at least two channels; attaching a plurality of fluid connectors to the connector modules by attaching at least one fluid connector in each of the channels; and for each of the server chassis, verifying the spatial orientation of an inlet connector and an outlet connector, sliding two of the plurality of connectors to match the spatial orientation of the inlet connector and the outlet connector, securing the two connectors in the spatial orientation, and then mounting the server chassis in the electronic rack by engaging the two connectors with the inlet connector and the outlet connector.

[0027] Fixing the two connectors includes positioning them in selected, predetermined dedicated locations, identified by pre-arranged locators applied to the channel. The method also includes mounting the multi-equipment chassis by engaging multiple pairs of fluid connectors with a multi-equipment chassis having multiple cooling units. The method further includes, for each pair of fluid connectors, fixing the riser connector at a height higher than the return connector.

[0028] The following disclosure begins by providing background information on the application of the disclosed embodiments, and then proceeds to disclose specific embodiments. In this context, embodiments may simply refer to connectors, and this designation is intended to include blind-mating fluid connectors, including connectors that can be engaged and disengaged without fluid leakage. Such connectors may include valves that close when the mating connector is disconnected, thereby preventing fluid leakage.

[0029] Figure 1 This is a block diagram illustrating an example of a data center or data center unit according to one implementation. In this example, Figure 1 A top-down view of at least a portion of the data center is shown. (See reference...) Figure 1 According to one embodiment, a data center system 100 includes one or more rows of electronic racks 101-102 containing information technology (IT) components, equipment, or tools, such as computer servers or computing nodes that provide data services to various clients via a network (e.g., the Internet). In this embodiment, each row includes an array of electronic racks, such as electronic racks 110A-110N. However, more or fewer rows of electronic racks can be implemented. Typically, rows 101-102 are aligned in parallel, with their front ends facing each other and their rear ends facing away from each other, thus forming an aisle 103 between them to allow administrators to walk through it. However, other configurations or arrangements can also be applied. For example, two rows of electronic racks may face each other back-to-back without forming an aisle between them, while their front ends face away from each other. The rear ends of the electronic racks may be coupled to a room cooling fluid manifold.

[0030] In one implementation, each of the electronic racks (e.g., electronic racks 110A-110N) includes a housing to accommodate multiple IT components arranged in a stack and operating therein. The electronic rack may include a cooling liquid manifold, multiple server slots (e.g., standard shelves or chassis configured with the same or similar form factor), and multiple server enclosures (also referred to as server blades or server racks) capable of being inserted into and removed from the server slots. Each server enclosure represents a compute node having one or more processors, memory, and / or permanent storage devices (e.g., hard drives), wherein the compute node may include one or more servers operating therein. At least one of the processors is attached to a liquid cold plate (also referred to as a cold plate assembly) to receive cooling liquid. Additionally, one or more optional cooling fans are associated with the server enclosure to provide air cooling to the compute nodes contained therein. Note that the cooling system 120 may be coupled to multiple data center systems, such as data center system 100.

[0031] In one embodiment, the cooling system 120 includes an external liquid loop connected to a cooling tower or dry cooler outside the building / container. The cooling system 120 may include, but is not limited to, evaporative cooling, free air cooling, rejection of large amounts of heat, and waste heat recovery designs. The cooling system 120 may include or be coupled to a source of cooling liquid that provides the cooling liquid.

[0032] In one implementation, each server chassis is modularly coupled to the coolant manifold, allowing the server chassis to be removed from the electronics rack without affecting the operation of the coolant manifold and the remaining server chassis within the electronics rack. In another implementation, each server chassis is coupled to the coolant manifold via a quick-release coupling assembly having a server coolant inlet connector and a server coolant outlet connector that connect to a flexible hose to distribute coolant to the processor. The server coolant inlet connector receives coolant from the coolant manifold, which is mounted at the rear of the electronics rack, via a rack coolant inlet connector. The server coolant outlet connector discharges warmer or hotter liquid, carrying heat exchanged from the processor, into the coolant manifold and then back to the coolant distribution unit (CDU) within the electronics rack.

[0033] In one embodiment, a cooling fluid manifold located at the rear end of each electronics rack is connected to a fluid supply line 132 (also referred to as a room supply manifold) to receive cooling fluid from the cooling system 120. The cooling fluid is distributed via a fluid distribution loop attached to a cold plate assembly, on which a processor is mounted to remove heat from the processor. The cold plate is configured similarly to a radiator in which the fluid distribution pipe is attached or embedded. The resulting warmer or hotter fluid, carrying the heat exchanged from the processor, is returned to the cooling system 120 via a fluid return line 131 (also referred to as a room return manifold).

[0034] Liquid supply / return lines 131-132, referred to as data center or room liquid supply / return lines (e.g., global liquid supply / return lines), supply cooling fluid to all electronic rack rows 101-102. Liquid supply lines 132 and liquid return lines 131 are connected to heat exchangers within each CDU located in the electronic rack, forming a primary loop. Secondary loops of the heat exchangers are connected to each server chassis within the electronic rack to deliver cooling fluid to the processor's cold plate.

[0035] In one embodiment, the data center system 100 also includes an optional airflow system for generating airflow to pass through the air space of the server chassis of the electronic racks, thereby exchanging heat generated by the computing nodes (e.g., servers) due to their operation, and dissipating the heat exchanged by the airflow to the external environment or a cooling system (e.g., an air-to-liquid heat exchanger) to reduce the temperature of the airflow. For example, an air supply system 135 generates a cooling / cold airflow to circulate from aisle 103 through electronic racks 110A-110N, thereby carrying away the exchanged heat.

[0036] Cooling airflow enters the electronics rack through the front end, while warm / hot airflow exits from the rear end. The warm / hot air, with exchanged heat, is exhausted from the room / building or cooled using a separate cooling system such as an air-to-liquid heat exchanger. Therefore, the cooling system is a liquid-air hybrid cooling system, in which a portion of the heat generated by the processor is removed by a cooling liquid via corresponding cold plates, while the remaining heat generated by the processor (or other electronic or processing equipment) is removed by airflow cooling. Furthermore, liquid cooling can be a multiphase system in which the fluid flows in either a liquid or gas phase.

[0037] Figure 2 This is a block diagram illustrating an electronic rack according to one embodiment. The electronic rack 200 can be represented as follows: Figure 1 Any electronic rack shown, such as, for example, electronic rack 110A-110N. (See reference...) Figure 2According to one embodiment, the electronic rack 200 includes, but is not limited to, a CDU 201, a rack management unit (RMU) 202, and one or more server chassis 203A-203E (collectively referred to as server chassis 203). The server chassis 203 can be inserted into an array of server slots (e.g., standard racks) from either the front end 204 or the rear end 205 of the electronic rack 200. Note that although five server chassis 203A-203E are shown here, more or fewer server chassis can be maintained within the electronic rack 200. It should also be noted that the specific locations of the CDU 201, RMU 202, and / or server chassis 203 are shown for illustrative purposes only; other arrangements or configurations of the CDU 201, RMU 202, and / or server chassis 203 may also be implemented. In one embodiment, the electronic rack 200 may be open to the environment or partially contained within a rack container, provided that cooling fans can generate airflow from the front to the rear end.

[0038] In addition, for at least some of the server chassis 203, optional fan modules (not shown) are associated with the server chassis. Each of the fan modules includes one or more cooling fans. The fan modules may be mounted on the rear end or electronic rack of the server chassis 203 to generate airflow that flows from the front end 204, travels through the air space of the server chassis 203, and exits at the rear end 205 of the electronic rack 200.

[0039] In one embodiment, CDU 201 primarily includes a heat exchanger 211, a liquid pump 212, and a pump controller (not shown), as well as other components such as a reservoir, power supply, and monitoring sensors. The heat exchanger 211 can be a liquid-to-liquid or multiphase heat exchanger. The heat exchanger 211 includes a first loop having an inlet port and an outlet port, the inlet and outlet ports having a first pair of liquid connectors that connect to external liquid supply / return lines 131-132 to form a main loop. The connectors connecting to the external liquid supply / return lines 131-132 can be disposed on or mounted on the rear end 205 of the electronics rack 200. The liquid supply / return lines 131-132, also referred to as room liquid supply / return lines, can be connected to the cooling system 120 as described above.

[0040] In addition, heat exchanger 211 includes a second loop with two ports having a second pair of liquid connectors coupled to liquid manifold 225 (also called a rack manifold) to form a secondary loop. This may include a supply manifold (also called a rack liquid supply line or rack supply manifold) and a return manifold (also called a rack liquid return line or rack return manifold). The supply manifold supplies cooling liquid to server chassis 203, and the return manifold returns warmer liquid to CDU 201. Note that CDU 201 can be any type of commercially available or custom-made CDU. Therefore, details of CDU 201 will not be described herein.

[0041] Each of the server chassis 203 may include one or more IT components (e.g., a central processing unit or CPU, a general-purpose / graphics processing unit (GPU), memory, and / or storage devices). Each IT component can perform data processing tasks, and the IT component may include software installed on storage devices, loaded into memory, and run by one or more processors to perform data processing tasks. The server chassis 203 may include a host server (referred to as a host node) connected to one or more computing servers (also referred to as computing nodes, such as CPU servers and GPU servers). The host server (with one or more CPUs) typically interfaces with clients via a network (e.g., the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services such as backup and / or recovery), or running applications to perform certain operations (e.g., image processing, deep data learning algorithms, or modeling, etc., as part of service software or a SaaS platform). In response to the request, the host server assigns the task to one or more of the computing nodes or computing servers (with one or more GPUs) managed by the host server. The computing servers perform the actual tasks, which may generate heat during operation.

[0042] The electronic rack 200 also includes an optional RMU 202 configured to provide and manage power supplied to the server chassis 203 and CDU 201. The RMU 202 can be coupled to a power supply unit (not shown) to manage the power supply unit's power consumption. The power supply unit may include necessary circuitry (e.g., AC-to-DC or DC-to-DC power converters, batteries, transformers, or voltage regulators) to provide power to the remaining components of the electronic rack 200.

[0043] In one implementation, RMU 202 includes an optimization module 221 and a rack management controller (RMC) 222. RMC 222 may include a monitor to monitor the operational status of various components within electronic rack 200, such as server chassis 203, CDU 201, and fan modules. Specifically, the monitor receives operational data representing the operating environment of electronic rack 200 from various sensors. For example, the monitor may receive operational data representing the temperature of the processor, coolant, and airflow, which may be captured and collected via various temperature sensors. The monitor may also receive data representing the fan power and pump power generated by the fan modules and liquid pump 212, which may be proportional to their respective speeds. This operational data is referred to as real-time operational data. Note that the monitor may be implemented as a separate module within RMU 202.

[0044] Based on the operating data, optimization module 221 performs optimization using a predetermined optimization function or model to derive a set of optimal fan speeds for the fan module and an optimal pump speed for the liquid pump 212, minimizing the total power consumption of the liquid pump 212 and the fan module, while ensuring that the operating data associated with the cooling fans of the liquid pump 212 and the fan module are within their respective design specifications. Once the optimal pump speed and optimal fan speed are determined, RMC 222 configures the cooling fans of the liquid pump 212 and the fan module based on the optimal pump speed and fan speed.

[0045] As an example, based on the optimal pump speed, RMC 222 communicates with the pump controller of CDU 201 to control the speed of liquid pump 212, which in turn controls the liquid flow rate of the coolant supplied to liquid manifold 225 for distribution to at least some of the coolant in server chassis 203. Similarly, based on the optimal fan speed, RMC 222 communicates with each of the fan modules to control the speed of each cooling fan in the fan module, which in turn controls the airflow rate of the fan module. Note that each of the fan modules can be individually controlled with its specific optimal fan speed, and different fan modules and / or different cooling fans within the same fan module can have different optimal fan speeds.

[0046] Notice, Figure 2The rack configuration shown is for illustrative purposes only; other configurations or arrangements may be applied. For example, CDU 201 may be an optional unit. The cold plate of server chassis 203 may be connected to a rack manifold, which may be directly connected to liquid supply / return lines 131-132, without using a CDU. Although not shown, a power supply unit may be located within the electronics rack 200. The power supply unit may be implemented as a standard chassis identical or similar to the server chassis, wherein the power supply chassis can be inserted into any standard rack in place of any server chassis 203. Furthermore, the power supply chassis may also include a backup battery unit (BBU) for providing battery power to server chassis 203 when mains power is unavailable. The BBU may include one or more battery packs, and each battery pack includes one or more battery cells, as well as the necessary charging and discharging circuitry for charging and discharging the battery cells.

[0047] Figure 3 This is a block diagram illustrating a processor cold plate configuration according to one embodiment. The processor / cold plate assembly 300 can be represented as follows: Figure 2 Any processor / cold plate structure of the server chassis 203 shown. (Refer to...) Figure 3 The processor 301 is inserted into a processor socket mounted on a printed circuit board (PCB) or motherboard 302, which is connected to other electronic components or circuitry of the data processing system or server. The processor 301 also includes a cold plate 303 attached thereto, which is connected to a rack manifold, for example, via a blind-mating connector, to a liquid supply line 132 and / or a liquid return line 131. A portion of the heat generated by the processor 301 is removed via cooling liquid through the cold plate 303. The remaining heat enters the air space below or above, where it can be removed by airflow generated by a cooling fan 304.

[0048] Rack fluid distribution systems can be equipped with different types of connectors positioned at different locations and / or with different spacing and orientations, including different integration positions such as parallel or staggered. This can increase the difficulty of implementing liquid-cooled servers in a rack, especially when considering multiphase cooling arrangements. Therefore, the disclosed embodiments introduce adapter designs that can be used to adapt different server systems to different rack fluid distribution hardware designs. Various embodiments enable each configuration of the blind-mating connector to accommodate the different connectivity requirements of the computing system.

[0049] An advantageous feature of the disclosed embodiments is that, since the connectors can be moved to different locations, it may not be necessary to integrate many connectors on the rack side. Because the fluid connectors on the server side can be moved to provide different fluid connection designs, fewer connectors are required, thereby reducing costs.

[0050] Furthermore, different types of servers may require different fluid systems for thermal management. The disclosed connector adapter implementations help meet these diverse needs. Similarly, rack configurations can differ for different IT equipment and systems. Rack-level allocations can be designed differently, and / or rack-level fluid ports can have different availability, especially when servers are already installed in the rack, thus occupying some ports. Individual servers can have different cooling modules designed and implemented for them. Therefore, fluid flow directions can differ, and different fluid flow directions (e.g., using thermosiphon) can produce different performance. The disclosed implementations enable easy modification of the fluid inlet and outlet locations based on different cooling module designs and rack liquid systems.

[0051] The following describes an embodiment of a fluid connection module particularly advantageous for multiphase cooling systems or heterogeneous racks. The connection module can serve as an interface for multiple blind-mating fluid connectors, wherein internal channels or tracks allow for adjustment of connector positions. The entire unit can be an integrated unit on a server chassis or a standalone unit easily installed or removed from the server chassis. In embodiments for blind-mating applications, the connectors are interconnected, and the internal channels are also sliding to adjust connector positions. This flexible design ensures compatibility with different rack-level design specifications. In the embodiments, the connection module can have two types of channels: one for the connectors and another for the internal connection of the connectors (internal connection). Variations in channel and connector positions can be used to assemble different cooling fluid operating requirements, whether single-phase or two-phase fluid.

[0052] The ability of the sliding fluid connector within the channel provides further advantages in a variety of use cases. For example, rack ports may be occupied by other systems on existing racks, so this solution enables greater possibilities to utilize different available rack ports and adapt other system connections for new system installations. Furthermore, the flexibility of the internal channel allows for the integration of multiple sets of connectors and sub-loops from the server chassis.

[0053] Figure 4A This is a general schematic diagram showing the connector module 400 according to an embodiment, while Figure 4B This is its side view. The connector module 400 forms a housing or frame 405 with mounting points 410 for mounting the housing 405 to the server. In this embodiment, the mounting points 410 are located in the middle of the connector module so that the module can be rotated (as indicated by the curved arrow) to be positioned in different orientations as needed.

[0054] Connectors 422 and 424 are slidably mounted on housing 405. In this embodiment, connectors 422 and 424 are paired, with one serving as an inlet and the other as a return for a liquid cooling element. Each of connectors 422 and 424 can slide within a channel or track 430 to change its position within housing 405. In one example, channel 430 is configured to fit tightly against the connector, allowing the connector to slide by applying force, but once positioned, it remains in that position. In this sense, a tight fit means that the connector will not slide due to gravity, requiring additional force to change its height. In this embodiment, no mechanical locking mechanism is required to hold the connector in a given position, although a locking mechanism may be used in other embodiments if needed.

[0055] Furthermore, to facilitate blind mating to the corresponding connectors (e.g., service chassis connectors), interconnect 440 is used to maintain the relative orientation of the paired connectors 422 and 424. Interconnect 440 ensures that the paired connectors 422 and 424 maintain a relative orientation conforming to a standard rack configuration. This feature ensures that blind mating can be easily achieved.

[0056] In the disclosed embodiments, the interconnects of the paired connectors also facilitate locking of the two connectors, thereby preventing any unintentional movement, such as movement from gravity. In one embodiment, during blind mating, forces in different directions can be applied to connectors 424 and 422 when mating with corresponding connectors on rack-level fluid distribution systems. The interconnects also provide additional protection.

[0057] Figure 4B It shows Figure 4A A side view of the embodiment shows connector 422, which can be positioned at different locations along channel 430. Interconnector 440 is also shown, which is located within and can slide within secondary channel 435, and is connected to the paired connectors. Thus, when connector 422 moves, connector 424 moves with it to keep the distance between the paired connectors constant.

[0058] In one implementation, two channels can be merged into one, while two dedicated channels can involve additional structural enhancements.

[0059] Figure 5A This is a general schematic diagram showing a connector module 500 according to one embodiment, while Figure 5B This is a general schematic diagram illustrating another embodiment without interconnects. Figure 5AAn embodiment in which multiple pairs of connectors are mounted within channel 530 is shown. As illustrated in this example, connectors 522a and 524a are paired, and connectors 522b and 524b are paired. Interconnectors 540 are disposed between each pair of connectors and between two pairs of connectors such that the distance between any two connectors remains fixed, regardless of their position within channel 530. Thus, although connectors can move within channel 530 in this embodiment, the distance between one entry connector and another entry connector is fixed, the distance between one return connector and another return connector is fixed, and the distance between one entry connector and its paired return connector is fixed, all depending on the rack configuration.

[0060] on the other hand, Figure 5B An embodiment is shown in which no interconnecting elements are provided between the connectors because the connectors are fixed within a track that can move within the channel. Since the connectors are fixed to the movable track, the distance between the connectors remains constant as the track moves, thereby achieving [the desired connection / connection]. Figure 5A It serves the same function as in the previous section. That is, the movable track is used both to move the connector to different positions and as an interconnect between connectors. The track can move within channel 530.

[0061] Figure 6A This is a general schematic diagram showing the connector module 600 according to an embodiment, while Figure 6B It is shown Figure 6A A general schematic diagram of the side view of the implementation method. Figure 6C Show Figure 6A and Figure 6B A side view of one of the connectors shown. Figure 6A As shown, connectors 622 and 624 are slidable within channel 630. In this embodiment, each of connectors 622 and 624 includes an engagement arm 628. The engagement arm 628 is designed to engage a space 631 formed between the two portions 633 and 636 of channel 630. In the illustration, connector 624 is shown in its insertion orientation. Once inserted into channel 630, it rotates 90 degrees such that the engagement arm 628 is inserted into space 631, thereby engaging between portions 633 and 636, thus mounting within channel 630. The orientation of engagement is shown by connector 622.

[0062] According to an optional feature, a toothed track 626 is provided within space 631, such that when the connector rotates to the engagement position shown by connector 622, engagement arm 628 engages the toothed track and secures the connector in that position. Conversely, when the connector rotates as shown by connector 624, the connector slides freely within channel 630 to be positioned at any location along channel 630. Figure 6BAs shown, when it is desired to interconnect the connectors to maintain their relative positions, the interconnect kit 642 can also be assembled to each connector.

[0063] Figures 7A to 7C An implementation of server-level integration for connector modules is illustrated. As shown, multiple modules 700 can be attached to the chassis and used to achieve various fluid connections, depending on cooling requirements. The ability to vary the height of each connector becomes particularly advantageous when the fluid flow design is assisted by gravity or thermosiphon; for gravity or thermosiphon, differences in height can generate dynamics. For example, in... Figure 7A In this configuration, cooling element 703 can employ phase change cooling, where "hot" line 702 delivers steam to connector 722, while return line 704 delivers cooled liquid from connector 724. To facilitate fluid circulation, connector 722 is positioned vertically above connector 724, conforming to natural thermosiphon flow.

[0064] exist Figure 7B In the example, two microchips, 753 and 755, are mounted on PCB 760. Microchip 755 is cooled by cooling device 705, while microchip 753 is cooled by cooling device 703. Cooling devices 703 and 705 can be the same or different types of cooling devices and can operate using single-phase or multi-phase cooling cycles. Therefore, lines 702, 704, 702', and 704' may require different blind-mating connectors to accommodate different specifications. Therefore, each of the modules 700 is designed to accommodate different types of blind-mating connectors, and the channels allow these connectors to be positioned in any orientation required by the chassis design.

[0065] Figure 7C The implementation shown is similar to Figure 7B The embodiment shown differs in that each pair of connectors is fixed at the same vertical height. For example, connectors 722 and 724 are at the same vertical height, while connectors 722' and 724' are at the same vertical height. This arrangement is more useful when the power applied to the fluid may include mechanical forces such as those of a pump.

[0066] It should be understood that, Figures 7A to 7C The illustrated implementation also demonstrates the beneficial use of the connector module for port availability in different racks. That is, regardless of the type of cooling employed, different rack port configurations may be available when servers are to be installed in a rack, either due to prior equipment installation or the specific design of the rack. Therefore, the connector module can be customized to match the specific ports available on the rack.

[0067] Figure 8An embodiment of a rack-level connector module 800 is illustrated. The connector module 800 provides a cooling fluid connection to the rack manifold 864 in a manner similar to that shown in other embodiments. Connectors 822 and 824 are slidable within a channel 830 to be positioned at any location along the channel 830. Optionally, a positioner 870 is provided to enable the connector to be secured in a predetermined dedicated location, which matches different port mating scenarios depending on the rack manifold design. That is, the positioner 870 is placed at a height that conforms to different rack manifold designs and standards. The positioner 870 may include markings on a frame, or may include mechanical stops for positioning the connector in a pre-selected position within the channel.

[0068] Figure 8 The diagram also illustrates how the connector module can be used in different types of racks. For example, the width of module 800 can be set according to the dimensions of rack manifold 864. Similarly, the positioner can be set according to the spacing of different port arrangements on the rack. Furthermore, as in the previous embodiments, the entire module 800 can be rotated around mounting point 810 to accommodate different port arrangements.

[0069] Figure 9 An implementation method particularly suitable for achieving closed-loop thermosiphon cooling is shown. Figure 9 In this system, connector module 900 is used in a two-phase cooling system, where it is positioned to connect cooling device 903 (e.g., an evaporator mounted on microchip 953) to heat exchanger 908 (e.g., a condenser). Fluid flow can be achieved via thermosiphon, whereline 902 serves as a riser to deliver gaseous fluid to gas connector 922, positioned vertically above liquid connector 924. Once the gas condenses within condenser 908, it returns via liquid return line 904, connected to liquid connector 924 at a lower height than gas connector 922. By using connector module 900, gas connector 922 can be raised to an optimal position to allow hot and high-pressure gas to rise, while liquid connector 924 can be positioned lower to provide gravity assistance for optimized liquid flow. In this way, connector module 900 enables blind-mating connections of the cooling system's piping while also enhancing fluid flow within the cooling system.

[0070] Incidentally, Figure 9The annotations illustrate a simple example for forming the positioner 970. In this non-limiting example, the positioner is formed as a simple ball and braking mechanism. The ball 972 is pushed against the wall of the module 900 by a spring 974. When the ball slides against the flat wall, the friction is minimal, but the connector can move easily. Conversely, a mechanical stop is created when the ball enters the brake 976 located in any position 970 of the positioner. This mechanical stop can be easily overcome by the user moving the connector, but it prevents the connector from sliding freely, especially due to gravity.

[0071] Figure 10 This is a general schematic diagram illustrating an implementation of connector modules used in a heterogeneous computer rack. Standard computer racks are typically designed according to the spacing of rack space specifications. This unit of measurement typically defines the dimensions of the rack frame and the dimensions of the equipment mounted within the frame, such that dimensions are expressed in rack units such as U and / or shape factors. For example, a typical full-size rack cage may be 42U high, and the dimensions of each particular device mounted within the rack may typically be 1U, 2U, 3U, or 4U.

[0072] Heterogeneous racks will have devices with different U-sizes installed within them. Figure 10 The embodiments illustrate how connector modules can be used to provide different connection arrangements to different units within a rack. It is noteworthy that although all connector modules 111 have the same design, each is capable of implementing different connection configurations to accommodate different requirements.

[0073] exist Figure 10 In this design, each rack is divided into 4U sections, although the devices within each section can have different sizes, such as two 2U units, one 1U unit, and one 3U unit in one space. Since the connectors can slide within the channels of each connector module 111, the height of each connector within its 4U space can be selected to accommodate the device mounted in that space. For example, in the bottom space, connector 122 is positioned at a 3U height, while connector 124 is positioned at a 1U height. This is, for example, compared to… Figure 9 The implementation shown corresponds to this. Conversely, in the second 4U space, connectors 122 and 124 are both positioned horizontally aligned at the 3U space, in the third 4U space they are horizontally aligned at a height of 1U, and in the top space they are aligned at a height of 4U.

[0074] Figure 11This is a flowchart illustrating a process according to an embodiment. The process provides fluid connectivity using any connector module described herein. In block 1100, multiple modules can be mounted onto an electronics rack. Each module has at least two channels. In block 1105, multiple fluid connectors are attached to the connector module, with at least one connector attached to each channel. Then, for each chassis to be mounted onto the electronics rack, in block 1110, the chassis is examined to identify the spatial orientation of the fluid inlet and outlet connectors. Then, in block 1115, connectors in at least two channels are slid to align them with the spatial orientation of the chassis's inlet and outlet connectors. In block 1120, the chassis is mounted by mating the inlet and outlet connectors to the fluid connectors of the connector module. In this case, it is desirable for the connectors to be of a blind-mating type, therefore... Figure 11 This includes box 1123, used for blind-fit connection to the rack. If it is determined in box 1125 that more chassis need to be installed, the process returns to box 1110. Otherwise, the process ends.

[0075] In the foregoing description, embodiments of the invention have been described with reference to specific exemplary embodiments. It will be apparent that various modifications can be made thereto without departing from the broader spirit and scope of the invention as set forth in the appended claims. Therefore, the description and drawings are to be considered illustrative rather than restrictive.

Claims

1. A connector module for an electronic rack, comprising: A frame having mounting elements configured to attach the frame to the electronic rack; Multiple channels are formed in the frame to accommodate the fluid connector; as well as Multiple fluid connectors are slidably mounted in the channel, each of the multiple fluid connectors sliding within the channel to different preset positions within the channel, the different preset positions corresponding to different server chassis to be installed in the electronic rack. In each of the server chassis, two of the plurality of fluid connectors slide within the channel to match the spatial orientation of the inlet and outlet connectors of the server chassis, and are fixed to the spatial orientation.

2. The connector module of claim 1 further includes an interconnector attached to at least two fluid connectors to maintain a fixed spatial orientation between the two fluid connectors.

3. The connector module according to claim 1, wherein, Each of the fluid connectors also includes a locking mechanism that secures the fluid connector in a fixed position within the channel.

4. The connector module according to claim 3, wherein, The locking mechanism includes a tight fit between the fluid connector and the channel, thereby providing resistance to the movement of the fluid connector within the channel to prevent free slippage.

5. The connector module according to claim 3, wherein, The locking mechanism includes an arm that extends from the fluid connector and engages teeth within the channel.

6. The connector module according to claim 1, wherein, The frame also includes a plurality of positioners positioned at a plurality of preset locations and configured to lock the fluid connector at the corresponding preset location.

7. The connector module according to claim 1, wherein, Each of the fluid connectors includes an interconnecting kit configured to interconnect each of the fluid connectors to another fluid connector to maintain a fixed spatial orientation.

8. An electronic rack for a data center, comprising: A rack manifold having a rack liquid supply line and a rack liquid return line, the rack liquid supply line being used to receive a first cooling liquid from a cooling liquid source, and the rack liquid return line being used to return a first warmer liquid to the cooling liquid source; Multiple server chassis are stacked together, and each server chassis includes one or more fluid cooling devices associated with one or more information technology components; as well as Multiple connector modules are attached to the electronic rack, each connector module providing a fluid connection between the fluid cooling device and the cooling liquid source; Each of the connector modules includes: A frame having mounting hardware configured to attach the frame to the electronics rack. Multiple channels are formed in the frame to accommodate the fluid connector, and Multiple fluid connectors are slidably mounted in the channel, each of the multiple fluid connectors sliding within the channel to different preset positions within the channel, the different preset positions corresponding to different server chassis. In each of the server chassis, two of the plurality of fluid connectors slide within the channel to match the spatial orientation of the inlet and outlet connectors of the server chassis, and are fixed to the spatial orientation.

9. The electronic rack according to claim 8, wherein, The fluid cooling equipment is selected from cooling plates and condensers.

10. The electronic rack according to claim 8, wherein, At least one of the fluid cooling devices includes a riser gas line and a liquid return line, wherein the riser gas line is connected to a connector mounted on a first connector module, and the liquid return line is connected to a connector mounted on a second connector module, wherein the first connector module is mounted vertically above the second connector module.

11. The electronic rack according to claim 8, wherein, At least one of the fluid cooling devices includes a hot liquid line and a cold liquid line, wherein the hot liquid line is connected to a first connector mounted on a first channel, and the cold liquid line is connected to a second connector mounted on a second channel, wherein the first connector is mounted at the same vertical height as the second connector.

12. The electronic rack according to claim 8, wherein, The plurality of fluid connectors includes a plurality of pairs of inlet connectors and return connectors, wherein a subset of the pairs of inlet connectors and return connectors are mounted at the same vertical height, and the remainder of the pairs of inlet connectors and return connectors are mounted such that the inlet connectors are mounted at a vertical height higher than the return connectors.

13. The electronic rack of claim 8 further includes a plurality of interconnects, each interconnect being attached to at least two fluid connectors to maintain a fixed spatial orientation between the two fluid connectors.

14. The electronic rack according to claim 8, wherein, Each of the fluid connectors also includes a locking mechanism that secures the fluid connector in a fixed position within the channel.

15. The electronic rack according to claim 14, wherein, The locking mechanism includes one of the following: a tight fit of the fluid connector within the channel, thereby providing resistance to the movement of the fluid connector within the channel to prevent free slippage; or an arm extending from the fluid connector and engaging teeth within the channel.

16. The electronic rack according to claim 8, wherein, The frame also includes a plurality of positioners positioned at a plurality of preset locations and configured to lock the fluid connector at the corresponding preset location.

17. A method for providing cooling fluid to an electronic rack of multiple server chassis, comprising: Multiple connector modules are mounted onto the electronic rack, each connector module having at least two channels; Multiple fluid connectors are attached to the connector module by attaching at least one fluid connector in each of the channels; as well as For each of the server chassis, the spatial orientation of the inlet and outlet connectors is verified, and two of the plurality of fluid connectors are slid to match the spatial orientation of the inlet and outlet connectors, and the two fluid connectors are secured in the spatial orientation. The server chassis is then installed in the electronic rack by engaging the two fluid connectors with the inlet and outlet connectors. Each of the plurality of fluid connectors slides within the channel to different preset positions within the channel, the different preset positions corresponding to different server chassis.

18. The method according to claim 17, wherein, Fixing the two fluid connectors includes positioning the two fluid connectors in selected predetermined dedicated positions, the selected predetermined dedicated positions being identified by pre-arranged locators applied to the channel.

19. The method of claim 17, further comprising mounting the multi-device chassis by engaging a multi-device chassis having a plurality of cooling devices with a plurality of pairs of fluid connectors.

20. The method according to claim 19, wherein, For each fluid connector pair, fix the riser connector at a higher height than the return connector.

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