Display panel and display device

Abstract

The present invention provides a display panel and a display device. The display panel includes a substrate, a COF film and a heat sink. The COF film is arranged on the substrate. The heat sink is arranged on the substrate and covers the COF film. The heat sink is provided with a plurality of heat dissipation holes, and the heat accumulation at the COF end of the display panel is reduced through the heat dissipation holes, thereby reducing the risk of short circuit of the panel circuit.

Description

Technical Field

[0001] The present invention relates to the field of display equipment, and in particular to a display panel and a display device. Background Art

[0002] Currently, the panels are diversified, among which the resolution and color of Mini-LED (micro light-emitting diode) display screen are better than LCD (Liquid Crystal Display) and close to the display effect of OLED (Organic Light-Emitting Diode) display screen. Mini-LED display screen has the advantages of low power consumption and thinner weight. In addition, Mini-LED display screen can be spliced ​​into the required size by multiple small display panels, can be flexibly disassembled and assembled, and is easy to repair.

[0003] Unlike LCD products, Mini-LED is current driven. After a period of lighting, the temperature of the display panel at the signal input end, that is, the end close to the COF (Chip On Film), will rise, resulting in heating. In actual tests, it was found that after the display panel was lit for a long time, the temperature of the end close to the COF was more than 40°C higher than the temperature of the end far from the COF. When the heat accumulates to a certain temperature, it will increase the power consumption of the display panel and burn out the circuits in the display panel. Summary of the invention

[0004] The object of the present invention is to provide a display panel and a display device to solve the problem in the prior art that the power consumption of the panel increases and the circuit in the panel is burned out due to the inability to dissipate heat technically.

[0005] To achieve the above object, the present invention provides a display panel, the display panel comprising a substrate, a chip-on-chip film and a heat sink. The chip-on-chip film is arranged on the substrate. The heat sink is arranged on the substrate and covers the chip-on-chip film. The heat sink is provided with a plurality of heat dissipation holes.

[0006] Furthermore, the distance between two adjacent heat dissipation holes is less than or equal to 100 micrometers.

[0007] Furthermore, the heat dissipation hole is at least one of a cylindrical shape, a truncated cone shape, a prism shape and a truncated cone shape, and the aperture of the heat dissipation hole is less than or equal to 100 microns.

[0008] Furthermore, the COF has a first connection end, the first connection end is located at one side of the COF and connected to the substrate. The heat sink extends from the substrate to a surface of the first connection end away from the substrate.

[0009] Furthermore, the display panel has a display area and a binding area connected to the display area, and the first connection end is located in the binding area. The display panel also includes a display layer, which is arranged on the substrate and located in the display area.

[0010] Furthermore, the COF has a second connection end, and the second connection end is located at a side of the COF away from the display layer. The display panel also includes a printed circuit board, and the printed circuit board is electrically connected to the second connection end.

[0011] Furthermore, a plurality of light-emitting devices are provided in the display layer, and the light-emitting devices are at least one of micro light-emitting diodes, mini light-emitting diodes and organic light-emitting semiconductors.

[0012] Furthermore, the display panel further comprises a moisture-proof layer, and the moisture-proof layer is arranged between the COF film and the heat sink.

[0013] Furthermore, the thickness of the heat sink is less than 200 micrometers. The material of the heat sink includes at least one of metal, graphite, carbon nanotube and resin.

[0014] The present invention further provides a display device, which includes the display panel as described above.

[0015] The advantages of the present invention are: in a display panel and a display device of the present invention, a heat sink with multiple heat dissipation holes is provided to dissipate heat in the shading area of ​​the display panel, thereby reducing heat accumulation at the COF end of the display panel, reducing the risk of short circuit in the panel circuit, and also reducing the power consumption of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a front view of a display panel in an embodiment of the present invention;

[0018] Figure 2 for Figure 1 The middle part shows the schematic diagram of the layered structure of the panel after being cut along the AA' line;

[0019] Figure 3 It is a schematic diagram of the layered structure of the display panel after the chip-on-film is bent in an embodiment of the present invention;

[0020] Figure 4It is a front view of the triangular prism-shaped heat dissipation hole in the embodiment of the present invention;

[0021] Figure 5 It is a front view of a quadrangular prism-shaped heat dissipation hole in an embodiment of the present invention;

[0022] Figure 6 Schematic diagram of the layered structure of a display panel in other embodiments of the present invention.

[0023] The components in the figure are shown as follows:

[0024] Display panel 1; Display area 1A;

[0025] Binding area 1B; substrate 10;

[0026] Display layer 20; Light emitting device 21;

[0027] Packaging layer 22; Chip-on-film 30;

[0028] A first connection end 31; A second connection end 32;

[0029] Printed circuit board 40; Moisture barrier 50;

[0030] Heat sink 60; Heat dissipation hole 61;

[0031] Hollow structure 70. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0033] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0034] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0035] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0036] In an embodiment of the present invention, a display device is provided, which may be a Mini-LED display device, comprising a plurality of display panels 1, which are spliced ​​together to form a large display panel 1, thereby providing a better display effect for the display device. The display device may be any display device with a display function, such as a mobile phone, a laptop computer, a tablet computer, etc.

[0037] like Figure 1 and Figure 2 As shown, the display panel 1 has a display area 1A and a binding area 1B connected to the display area 1A. The display panel 1 includes a substrate 10 , a display layer 20 , a COF 30 and a printed circuit board 40 .

[0038] The substrate 10 is an array substrate, which is provided with a plurality of thin film transistors and a plurality of connecting pins. The thin film transistor array is arranged in the display area 1A, and the connecting pins are located in the binding area 1B. The thin film transistors are electrically connected to the connecting pins located in the binding area 1B through signal wiring.

[0039] The display layer 20 is disposed on a surface of the substrate 10 and is located in the display area 1A. The display layer 20 includes a plurality of light-emitting devices 21 and an encapsulation layer 22. The light-emitting devices 21 are arranged in the display area 1A and are electrically connected to the thin film transistors in the display area 1A. The encapsulation layer 22 covers the light-emitting devices 21 and encapsulates and protects the light-emitting devices 21. In an embodiment of the present invention, the light-emitting device 21 is a Mini-LED (mini light-emitting diode). In other embodiments of the present invention, Micro-LED (micro light-emitting diode) or OLED (organic semiconductor) may also be used.

[0040] like Figure 2 As shown, the COF 30 has two connection ends, a first connection end 31 and a second connection end 32, and the two connection ends are respectively located on both sides of the COF 30. The first connection end 31 is provided on the substrate 10 in the binding area 1B and is electrically connected to the connection pin in the binding area 1B. The second connection end 32 is located on the side of the COF 30 away from the display layer 20 and is electrically connected to the printed circuit board 40.

[0041] like Figure 3 As shown, the printed circuit board 40 can be bent to the back of the substrate 10 through the flip chip film 30, thereby reducing the area of ​​the binding area 1B of the display panel 1 that cannot display the image, and increasing the area of ​​the display area 1A of the display panel 1, achieving a narrow frame or borderless display effect.

[0042] The printed circuit board 40 is provided with an IC chip, which is used to process display data and send display signals according to the display data. The display signals are transmitted to the substrate 10 through the COF 30, and the thin film transistors in the substrate 10 turn on or off the light emitting devices 21 according to the received display signals, thereby controlling the light emission of each light emitting device 21 to form a display screen.

[0043] like Figure 1 and Figure 2 As shown, the display panel 1 further includes a moisture-proof layer 50 and a heat sink 60 .

[0044] The moisture-proof layer 50 is disposed on a surface of the COF 30 away from the substrate 10, and is used to protect the conductive structure in the COF 30 and prevent circuit short circuit caused by water and oxygen corrosion. The moisture-proof layer 50 is a glue layer structure, which can be prepared on the surface of the COF 30 by coating and curing. Specifically, the thickness of the moisture-proof layer 50 is 200-300 microns, and the moisture-proof layer 50 covers the first connection end 31 of the COF 30.

[0045] The heat sink 60 covers the moisture barrier 50 and the COF 30 and is used to dissipate heat and cool the COF 30, thereby reducing the operating temperature of the substrate 10 and the COF 30 in the binding area 1B, reducing heat accumulation, and thus reducing the panel power consumption due to temperature rise, while also preventing the circuit in the display panel 1 from burning out. Figure 2 As shown, the heat sink 60 extends from the substrate 10 to the COF 30, thereby covering the first connection end 31 of the COF 30, thereby accurately reducing the temperature of the COF end of the display panel 1. Specifically, the material of the heat sink 60 includes at least one of metal, graphite, carbon nanotubes and resin, and its thickness is less than 200 microns. Preferably, the thickness of the heat sink 60 is 100 microns.

[0046] Since the COF 30 is laminated on the surface of the substrate 10, a height difference is generated between the COF 30 and the substrate 10. The height difference is further increased with the installation of the moisture-proof layer 50, which results in the heat sink 60 being unable to be attached to the sides of the COF 30 and the moisture-proof layer 50, and a closed hollow structure 70 is formed around the edges of the COF 30 and the moisture-proof layer 50. In addition, since the space in the hollow structure 70 is relatively closed, air cannot circulate, and heat accumulation will still occur.

[0047] Therefore, a plurality of heat dissipation holes 61 are provided on the heat sink 60. The heat dissipation holes 61 penetrate the heat sink 60 and are evenly distributed on the heat sink 60, and can be prepared by a laser laser method. The heat dissipation holes 61 connect the hollow structure 70, so that the air in the hollow structure 70 can be replaced with the outside air, thereby dissipating the temperature in the hollow structure 70 and preventing heat accumulation in the hollow structure. At the same time, the provision of the heat dissipation holes 61 can also increase the heat dissipation area of ​​the heat sink 60 and further improve the heat dissipation efficiency of the heat sink 60. Specifically, the heat dissipation holes 61 are cylindrical, truncated cone-shaped, or can be as follows: Figure 4-Figure 5 The heat dissipation holes 61 may be at least one of the triangular prism, quadrangular prism or prism-shaped holes shown in the figure, and have an aperture of 50-100 microns, and a distance between two adjacent heat dissipation holes 61 is 50-100 microns.

[0048] In the display panel 1 provided in the embodiment of the present invention, the heat sink 60 is used to dissipate heat from the light shielding area of ​​the display panel 1, thereby reducing the risk of short circuit of the panel circuit and also reducing the power consumption of the display panel 1. At the same time, a plurality of heat dissipation holes 61 are provided on the heat sink 60 to improve the heat dissipation efficiency of the heat sink 60, prevent heat from being accumulated at the edge of the COF 30, and further improve the stability of the panel performance.

[0049] In other embodiments of the present invention, there is also provided Figure 6 The heat dissipation holes 61 in the heat sink 60 shown in the figure only correspond to the display panel 1 and the display device provided with the hollow structure 70, and its layered structure is similar to the heat sink 60 provided in the embodiment of the present invention, so it will not be described in detail here. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0050] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: The display panel has a display area and a binding area connected to the display area, and the display panel includes: substrate; A chip-on-chip film is disposed on the substrate, the chip-on-chip film has a first connection end, the first connection end is located at one side of the chip-on-chip film and is connected to the substrate, and the first connection end is located in the binding area; A heat sink is disposed on the substrate and covers the first connection end of the COF film, wherein the heat sink extends from the substrate to a surface of the first connection end away from the substrate; A moisture-proof layer, disposed between the chip-on-film and the heat sink; The heat sink is provided with a plurality of heat dissipation holes, which penetrate through the heat sink and are evenly distributed on the heat sink. The material of the heat sink includes at least one of metal, graphite, carbon nanotubes and resin.

2. The display panel according to claim 1, wherein: The distance between two adjacent heat dissipation holes is less than or equal to 100 micrometers.

3. The display panel according to claim 1, wherein: The heat dissipation hole is at least one of a cylindrical shape, a truncated cone shape, a prism shape and a truncated cone shape, and the aperture of the heat dissipation hole is less than or equal to 100 micrometers.

4. The display panel according to claim 1, wherein: The display panel further includes: The display layer is arranged on the substrate and located in the display area.

5. The display panel according to claim 4, wherein: The chip-on-film further has a second connection end, and the second connection end is located at a side of the chip-on-film away from the display layer; The display panel further includes: A printed circuit board is electrically connected to the second connection end.

6. The display panel according to claim 4, wherein: The display layer is provided with a plurality of light emitting devices, and the light emitting devices are at least one of micro light emitting diodes, mini light emitting diodes and organic light emitting semiconductors.

7. The display panel according to claim 1, wherein: The thickness of the heat sink is less than 200 microns.

8. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-7.

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