Acoustic device and its magnetic circuit component

Abstract

An embodiment of this specification discloses an acoustic device, including: a housing having an accommodation cavity; a speaker disposed in the accommodation cavity, the speaker including: a magnetic circuit assembly, a voice coil, a vibration assembly, and a vibration transmission plate; the magnetic circuit assembly forms a magnetic gap; one end of the voice coil is disposed in the magnetic gap, the other end of the voice coil is connected to the vibration assembly, the vibration assembly is connected to the vibration transmission plate, and the vibration transmission plate is connected to the housing.

Description

[0001] Cross-reference

[0002] This application claims priority to Chinese Application No. 202010358223.0 filed on April 29, 2020 and Chinese Application No. 202021689802.5 filed on August 12, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of acoustic technologies, and particularly to a bone conduction acoustic device. Background Art

[0004] Bone conduction is a sound conduction method, that is, converting sound into mechanical vibrations of different frequencies and transmitting the sound through human bones and tissues (such as the skull, bony labyrinth, endolymph of the inner ear, spiral organ, auditory nerve, and auditory center). A bone conduction acoustic device (such as a bone conduction headset) is closely attached to the bone and receives sound using bone conduction technology. Sound waves can directly reach the auditory nerve through the bone, thus enabling both ears to be open without damaging the eardrum, and it can be widely applied to bone conduction technologies in different scenarios, such as hearing aids. Since the sound quality of a bone conduction acoustic device directly affects the user's auditory experience, improving the sound quality is particularly important for bone conduction acoustic devices. Summary of the Invention

[0005] This application relates to an acoustic device. The acoustic device includes: a housing having an accommodation cavity; a speaker disposed in the accommodation cavity, the speaker including: a magnetic circuit assembly, a voice coil, a vibration assembly, and a vibration transfer plate; the magnetic circuit assembly forms a magnetic gap; one end of the voice coil is disposed in the magnetic gap, the other end of the voice coil is connected to the vibration assembly, the vibration assembly is connected to the vibration transfer plate, and the vibration transfer plate is connected to the housing.

[0006] In some embodiments, the vibration assembly includes an inner bracket, an outer bracket, and a vibration sheet; the other end of the voice coil is connected to the inner bracket; one end of the outer bracket is physically connected to both sides of the magnetic circuit assembly; the vibration sheet is physically connected to the inner bracket and the outer bracket and is used to restrict the relative movement of the inner bracket and the outer bracket in a first direction; the first direction is the radial direction of the accommodation cavity; at least one of the inner bracket, the outer bracket, and the vibration sheet is connected to the vibration transfer plate so that vibrations are transmitted to the vibration transfer plate.

[0007] In some embodiments, the outer bracket and the inner bracket are movably connected to the vibration sheet to restrict the relative movement of the outer bracket and the inner bracket in the first direction, while allowing the inner bracket and the vibration sheet to move relative to the outer bracket in a second direction; the second direction is the extending direction of the inner bracket and the outer bracket.

[0008] In some embodiments, a first convex post is provided at the other end of the outer bracket, a first through hole is formed in the vibrating piece, and the first convex post is movably connected to the vibrating piece through the first through hole.

[0009] In some embodiments, a second convex post is provided at one end of the inner bracket, a second through hole is formed in the vibrating piece, and the second convex post is movably connected to the vibrating piece through the second through hole.

[0010] In some embodiments, the loudspeaker further includes an elastic shock-absorbing piece, and the elastic shock-absorbing piece is disposed between the vibrating piece and one end of the inner bracket to reduce the vibration of the inner bracket in the second direction.

[0011] In some embodiments, the second convex post includes a first post section and a second post section that are physically connected, and the second post section is disposed above the first post section; the first post section passes through the second through hole, and the second post section is inserted into the vibration transmission plate; the elastic shock-absorbing piece is provided with a third through hole, and the elastic shock-absorbing piece is sleeved on the second post section through the third through hole and supported on the first post section.

[0012] In some embodiments, a protective element is further included; the protective element includes a fitting portion, a receiving portion, and a supporting portion, and the fitting portion and the receiving portion form a second receiving cavity; the vibration transmission plate is disposed in the second receiving cavity, the fitting portion is disposed in contact with the outer end face of the vibration transmission plate, and the supporting portion is connected to the second receiving cavity and disposed above the housing.

[0013] In some embodiments, an annular bearing platform is provided on the inner wall of the housing for supporting the annular supporting portion and the elastic shock-absorbing piece.

[0014] In some embodiments, the magnetic circuit assembly includes a magnetic element group and a magnetic guide cover; the magnetic guide cover includes a cover body bottom, a cover body side portion, and a cylindrical groove, and the cover body bottom and the cover body side portion form the cylindrical groove; the magnetic element group is disposed in the cylindrical groove, and a magnetic gap is formed between the magnetic element group and the magnetic guide cover.

[0015] In some embodiments, a fixing member is further included, and the fixing member is used to fix the magnetic element group to the cover body bottom; the fixing member includes a bolt and a nut, and the bolt passes through the magnetic element group in sequence and then passes out of the cover body bottom to fixedly connect the magnetic element group and the cover body bottom through threaded connection.

[0016] In some embodiments, the inner bracket forms a cover groove, a part of the magnetic element group extends into the cover groove, and the outer bracket is provided in a cylindrical shape.

[0017] In some embodiments, the magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap; the first magnetic circuit assembly includes a first magnetic element and a second magnetic element, and the magnetic field strength of the total magnetic field generated by the magnetic circuit assembly in the magnetic gap is greater than the magnetic field strength of the first magnetic element or the second magnetic element in the magnetic gap.

[0018] In some embodiments, the included angle between the magnetization directions of the first magnetic element and the second magnetic element is between 150° and 180°.

[0019] In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are opposite.

[0020] In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are both perpendicular to or parallel to the vibration direction of the voice coil in the magnetic gap.

[0021] In some embodiments, the second magnetic circuit assembly includes a third magnetic element, and the first magnetic circuit assembly includes a first magnetic conduction element; the first magnetic conduction element is disposed between the first magnetic element and the second magnetic element, and the third magnetic element is disposed at least partially around the first magnetic element and the second magnetic element.

[0022] In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are both perpendicular to the surface where the first magnetic element is connected to the first magnetic conduction element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite.

[0023] In some embodiments, the included angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the second magnetic element is between 60° and 120°.

[0024] In some embodiments, the included angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the second magnetic element is between 0° and 30°.

[0025] In some embodiments, the second magnetic circuit assembly includes a first magnetic conduction element and the first magnetic circuit assembly includes a second magnetic conduction element; the second magnetic conduction element is disposed between the first magnetic element and the second magnetic element; the first magnetic conduction element is disposed at least partially around the first magnetic element and the second magnetic element.

[0026] In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are both perpendicular to the surface where the first magnetic element is connected to the second magnetic conductive element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite to each other.

[0027] In some embodiments, the second magnetic conductive element is arranged to surround the first magnetic element, and the first magnetic element is between the second magnetic elements in a surrounding manner.

[0028] In some embodiments, the upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element.

[0029] In some embodiments, the magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly. The second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap. The first magnetic circuit assembly includes a first magnetic element and the second magnetic circuit assembly includes a first magnetic conductive element. The first magnetic conductive element at least partially surrounds the first magnetic element. The magnetization direction of the first magnetic element points from the central region of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the first magnetic element.

[0030] In some embodiments, the magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly. The second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap. The first magnetic circuit assembly includes a first magnetic element and the second magnetic circuit assembly includes a second magnetic element. The second magnetic element at least partially surrounds the first magnetic element. The magnetization direction of the first magnetic element points from the central region of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the first magnetic element.

[0031] In some embodiments, the magnetization direction of the second magnetic element points from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the inner ring of the second magnetic element.

[0032] Some additional features of the present application can be described below. Through the examination of the following description and the corresponding drawings, or the understanding of the production or operation of the embodiments, some additional features of the present application are obvious to those skilled in the art. The features disclosed in the present application can be realized and achieved by practicing or using various methods, means and combinations of the specific embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute a limitation to the present application. In the drawings, the same reference numerals denote the same components.

[0034] Figure 1 is a structural block diagram of an exemplary acoustic device shown in some embodiments of the present application;

[0035] Figure 2 is a schematic structural diagram of an exemplary acoustic device shown in some embodiments of the present application;

[0036] Figure 3A shown in some embodiments of the present application Figure 2 schematic diagram of the disassembled structure of the acoustic device in;

[0037] Figure 3B shown in some embodiments of the present application Figure 3A schematic cross-sectional structure diagram of the acoustic device in;

[0038] Figure 3C is shown in some embodiments of the present application Figure 3A schematic diagram of the structure of the diaphragm of the acoustic device in;

[0039] Figure 4 is a schematic longitudinal cross-sectional view of a bone conduction acoustic device shown in some embodiments of the present application;

[0040] Figure 5 is a schematic longitudinal cross-sectional view of an air conduction acoustic device shown in some embodiments of the present application;

[0041] Figure 6 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly shown in some embodiments of the present application;

[0042] Figure 7 is according to the present application Figure 6 schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown;

[0043] Figure 8 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly shown in some embodiments of the present application;

[0044] Figure 9 is according to the present application Figure 8 schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown;

[0045] Figure 10 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly shown in some embodiments of the present application;

[0046] Figure 11 is according to the present applicationFigure 10 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0047] Figure 12 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0048] Figure 13 Is according to the present application Figure 12 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0049] Figure 14 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0050] Figure 15 Is according to the present application Figure 14 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0051] Figure 16 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0052] Figure 17 Is according to the present application Figure 16 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0053] Figure 18 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0054] Figure 19 Is according to the present application Figure 18 Schematic diagram of the magnetic field strength change of a magnetic circuit component shown;

[0055] Figure 20 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0056] Figure 21 Is according to the present application Figure 20 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0057] Figure 22 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0058] Figure 23 Is according to the present application Figure 22 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0059] Figure 24 Is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0060] Figure 25 Is according to the present applicationFigure 24 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0061] Figure 26 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0062] Figure 27 According to the present application Figure 26 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0063] Figure 28 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0064] Figure 29 According to the present application Figure 28 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0065] Figure 30 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0066] Figure 31 According to the present application Figure 38 Schematic diagram of the magnetic field strength change of a magnetic circuit component shown

[0067] Figure 32 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0068] Figure 33 According to the present application Figure 32 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0069] Figure 34 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0070] Figure 35 According to the present application Figure 34 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0071] Figure 36 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0072] Figure 37 According to the present application Figure 36 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0073] Figure 38 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0074] Figure 39 According to the present applicationFigure 38 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0075] Figure 40 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0076] Figure 41 According to the present application Figure 40 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0077] Figure 42 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0078] Figure 43 According to the present application Figure 42 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0079] Figure 44 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0080] Figure 45 According to the present application Figure 44 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0081] Figure 46 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0082] Figure 47 According to the present application Figure 46 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0083] Figure 48 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0084] Figure 49 According to the present application Figure 48 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0085] Figure 50 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0086] Figure 51 According to the present application Figure 50 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown;

[0087] Figure 52 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application;

[0088] Figure 53 According to the present applicationFigure 52 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0089] Figure 54 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0090] Figure 55 According to the present application Figure 54 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0091] Figure 56 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0092] Figure 57 According to the present application Figure 56 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown

[0093] Figure 58 Schematic cross-sectional view of a magnetic element structure shown according to some embodiments of the present application

[0094] Figure 59 Schematic cross-sectional view of a magnetic element structure shown according to some embodiments of the present application

[0095] Figure 60 Schematic diagram of a magnetic element structure shown according to some embodiments of the present application

[0096] Figure 61 Schematic longitudinal sectional view of a magnetic circuit component shown according to some embodiments of the present application

[0097] Figure 62 Schematic longitudinal sectional view of a magnetic circuit component shown according to some embodiments of the present application

[0098] Figure 63 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application

[0099] Figure 64 According to the present application, respectively using Figure 63 and Figure 56 Schematic diagram of the frequency response curve comparison of the loudspeaker with the magnetic circuit components shown Detailed implementation manners

[0100] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. It should be understood that these exemplary embodiments are only provided to enable those skilled in the relevant art to better understand and then implement the present invention, rather than limiting the scope of the present invention in any way. Unless obvious from the language context or otherwise stated, the same reference numerals in the figures represent the same structure or operation.

[0101] As shown in the present application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". The relevant definitions of other terms will be given in the following description.

[0102] In the following, without loss of generality, when describing the bone conduction related technologies of the present invention, the description of "bone conduction speaker" or "bone conduction earphone" will be adopted. This description is merely a form of bone conduction application. For those of ordinary skill in the art, the "speaker" or "earphone" can also be replaced by other similar terms, such as "player", "hearing aid", etc. In fact, various implementation manners in the present invention can be conveniently applied to other non-speaker hearing devices. For example, for professionals in this field, after understanding the basic principle of the bone conduction speaker, various modifications and changes in form and details may be made to the specific implementation manners and steps of implementing the bone conduction speaker without departing from this principle. In particular, an ambient sound pickup and processing function can be added to the bone conduction speaker to enable the speaker to implement the function of a hearing aid. For example, a microphone or other microphone can pick up the sound of the surrounding environment of the user / wearer, and after being processed by a certain algorithm (or the generated electrical signal), it is transmitted to the bone conduction speaker part. That is, the bone conduction speaker can be modified to add the function of picking up ambient sound, and after a certain signal processing, the sound is transmitted to the user / wearer through the bone conduction speaker part, thereby implementing the function of a bone conduction hearing aid. As an example, the algorithms mentioned here can include one or a combination of noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, etc.

[0103] In some embodiments, the acoustic device can be a device with acoustic output ability. For example, hearing aids, listening bracelets, earphones, speakers, and smart glasses, etc. Among them, a hearing aid is a small amplifier that amplifies the originally inaudible sound and then uses the residual hearing of the hearing-impaired person to send the sound to the auditory center of the brain. In some embodiments, the hearing aid uses ear canal sound transmission. However, when the low-frequency hearing of the hearing-impaired person is poor or the overall hearing loss is severe, the way of ear canal sound transmission has a relatively limited improvement on the auditory effect of the hearing-impaired person.

[0104] In some embodiments, the acoustic device can include a bone conduction earphone. The bone conduction earphone can convert audio into mechanical vibrations of different frequencies, use the human bone as the medium for transmitting mechanical vibrations, and then transmit the mechanical vibrations to the auditory nerve. In this way, the user can receive sound without passing through the ear canal and eardrum of the ear.

[0105] Figure 1 is a structural block diagram of an exemplary acoustic device shown according to some embodiments of the present application. As Figure 1 shown, the acoustic device 100 (for example, a bone conduction speaker, a bone conduction earphone, etc.) can include a magnetic circuit component 102, a vibration component 104, a support component 106, and a storage component 108.

[0106] The magnetic circuit component 102 can provide a magnetic field. The magnetic field can be used to convert a signal containing sound information into a vibration signal. In some embodiments, the sound information may include videos, audio files with specific data formats, or data or files that can be converted into sound through specific means. The signal containing sound information can come from the storage component 108 of the acoustic device 100 itself, or from an information generation, storage, or transmission system outside the acoustic device 100. The signal containing sound information can include one or a combination of electrical signals, optical signals, magnetic signals, mechanical signals, etc. The signal containing sound information can come from one signal source or multiple signal sources. The multiple signal sources can be related or unrelated. In some embodiments, the acoustic device 100 can obtain the signal containing sound information in a variety of different ways. The acquisition of the signal can be wired or wireless, and can be real-time or delayed. For example, the acoustic device 100 can receive an electrical signal containing sound information through wired or wireless means, or directly obtain data from a storage medium (e.g., the storage component 108) to generate a sound signal. Another example is that a bone conduction hearing aid may include a component with a sound collection function. By picking up the sound in the environment, the mechanical vibration of the sound is converted into an electrical signal, and an electrical signal meeting specific requirements is obtained after being processed by an amplifier. In some embodiments, the wired connection may include a metal cable, an optical cable, or a hybrid cable of metal and optical, such as a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metallic sheathed cable, a metallic sheathed cable, a multi-core cable, a twisted pair cable, a ribbon cable, a shielded cable, a telecommunications cable, a twin cable, a parallel twin conductor, a twisted pair, etc., or a combination of multiple types. The examples described above are only for convenience of illustration, and the medium of the wired connection can also be other types, such as other transmission carriers for electrical signals or optical signals, etc.

[0107] Wireless connections may include radio communication, free space optical communication, acoustic communication, and electromagnetic induction, etc. Among them, radio communication may include IEEE 802.11 series standards, IEEE 802.15 series standards (such as Bluetooth technology and ZigBee technology, etc.), the first generation of mobile communication technology, the second generation of mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), General Packet Radio Service technology, the third generation of mobile communication technology (such as CDMA2000, WCDMA, TD-SCDMA, and WiMAX, etc.), the fourth generation of mobile communication technology (such as TD-LTE and FDD-LTE, etc.), satellite communication (such as GPS technology, etc.), Near Field Communication (NFC) and other technologies operating in the ISM band (such as 2.4 GHz, etc.); free space optical communication may include visible light, infrared signals, etc.; acoustic communication may include sound waves, ultrasonic signals, etc.; electromagnetic induction may include near field communication technology, etc. The examples described above are only for convenience of illustration, and the medium of wireless connection may also be other types, for example, Z-wave technology, other licensed civilian radio bands and military radio bands, etc. For example, as some application scenarios of the present technology, the acoustic device 100 may obtain signals containing sound information from other devices through Bluetooth technology.

[0108] The vibration component 104 can generate mechanical vibrations. The generation of vibrations is accompanied by energy conversion. The speaker 100 can use a specific magnetic circuit component 102 and the vibration component 104 to achieve the conversion of a signal containing sound information into mechanical vibrations. The conversion process may involve the coexistence and conversion of various different types of energy. For example, an electrical signal can be directly converted into mechanical vibrations through a transducer device to produce sound. Another example is that sound information can be contained in an optical signal, and a specific transducer device can achieve the process of converting the optical signal into a vibration signal. Other types of energy that can coexist and be converted during the operation of the transducer device include thermal energy, magnetic field energy, etc. The energy conversion methods of the transducer device can include moving coil type, electrostatic type, piezoelectric type, moving iron type, pneumatic type, electromagnetic type, etc. The frequency response range and sound quality of the acoustic device 100 are affected by the vibration component 104. For example, in a moving coil transducer device, the vibration component 104 includes a wound cylindrical voice coil and a vibrating body (e.g., a vibrating plate or a vibrating diaphragm). The cylindrical voice coil driven by a signal current drives the vibrating body to vibrate and generate sound. The stretching and contraction of the vibrating body material, the deformation of wrinkles, size, shape, and fixing method, as well as the magnetic density of the magnetic field, will all have a great impact on the sound quality of the acoustic device 100. The vibrating body in the vibration component 104 can be a mirror-symmetrical structure, a centrosymmetric structure, or an asymmetric structure. Discontinuous hole-like structures can be provided on the vibrating body to enable the vibrating body to generate a greater displacement, thereby enabling the speaker to achieve higher sensitivity and improve the output power of vibration and sound. The vibrating body can be a toroidal structure, and a plurality of struts converging towards the center can be provided inside the toroid. The number of struts can be two or more.

[0109] The support component 106 can support the magnetic circuit component 102, the vibration component 104, and / or the storage component 108. The support component 106 can include one or more housings and one or more connectors. The one or more housings can form an accommodation space for accommodating the magnetic circuit component 102, the vibration component 104, and / or the storage component 108. The one or more connectors can connect the housing to the magnetic circuit component 102, the vibration component 104, and / or the storage component 108.

[0110] The storage component 108 can store signals containing voice information. In some embodiments, the storage component 108 can include one or more storage devices. The storage devices can include storage devices on storage systems such as Direct Attached Storage, Network Attached Storage, and Storage Area Network. The storage devices can include various types of storage devices such as solid-state storage devices (solid-state drives, solid-state hybrid hard drives, etc.), mechanical hard drives, USB flash drives, memory sticks, memory cards (such as CF, SD, etc.), other drives (such as CD, DVD, HD DVD, Blu-ray, etc.), random access memory (RAM), and read-only memory (ROM). Among them, RAM can include decade counters, digital selectors, delay line memories, Williams tubes, dynamic random access memory (DRAM), static random access memory (SRAM), thyristor random access memory (T-RAM), and zero-capacitance random access memory (Z-RAM), etc.; ROM can include bubble memories, magnetic core memories, thin-film memories, magnetic plating wire memories, magnetic core memories, magnetic drum memories, optical disc drives, hard disks, magnetic tapes, early non-volatile random access memories (NVRAMs), phase change memories, magnetoresistive random access memories, ferroelectric random access memories, non-volatile SRAMs, flash memories, electrically erasable programmable read-only memories, erasable programmable read-only memories, programmable read-only memories, screen-printed stack read memories, floating gate random access memories, nano random access memories, racetrack memories, resistive random access memories, and programmable metallization cells, etc. The above-mentioned storage devices / storage units are examples, and the storage devices that can be used by the storage devices / storage units are not limited thereto.

[0111] The above description of the structure of the acoustic device is merely a specific example and should not be regarded as the only feasible implementation. Obviously, for professionals in this field, after understanding the basic principles of the acoustic device, various modifications and changes in form and details may be made to the specific ways and steps of implementing the acoustic device without departing from this principle, but these modifications and changes are still within the scope described above. For example, the acoustic device 100 may include one or more processors, and the processors may execute one or more sound signal processing algorithms. The sound signal processing algorithms may correct or enhance the sound signals. For example, noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active noise cancellation, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or other similar or any combination of the above processing of the sound signals, and these modifications and changes are still within the scope of protection of the claims of the present invention. Another example is that the acoustic device 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, etc. The sensors may collect user information or environmental information. Another example is that the storage component 108 may not be necessary and may be removed from the acoustic device 100.

[0112] Figure 2 is a schematic structural diagram of an exemplary acoustic device shown according to some embodiments of the present application. As Figure 2 shown, the acoustic device 1 may include a housing 11, a speaker assembly 12, and a protective element 13. The speaker assembly 12 may be disposed within the housing 11. The protective element 13 may be supported on the housing 11 for protecting the speaker assembly 12.

[0113] As Figure 2 shown, the housing 11 has a receiving cavity 110 (which may also be referred to as the first receiving cavity), and the receiving cavity 110 is used for placing the speaker assembly 12, that is, the speaker assembly 12 is disposed within the receiving cavity 110. In some embodiments, when the acoustic device 1 is in use, one side of the housing 11 facing the open end 111 of the receiving cavity 110 is close to the user's head, and the mechanical vibration generated by the speaker assembly 12 can be transmitted to the user's head through the side of the housing facing the open end 111.

[0114] In some embodiments, an annular bearing platform 112 is provided on the inner wall of the housing 11, and the inner wall of the housing 11 refers to the inner wall of the accommodation cavity 110 of the housing 11. In some embodiments, the annular bearing platform 112 may be provided at a position on the inner wall close to the opening end 111. In some embodiments, the annular bearing platform 112 may be provided on the inner wall of the housing above the speaker assembly 12. The annular bearing platform 112 can be used to support the protection element 13. By arranging the protection element 13 on the annular bearing platform 112, the protection element 13 can shield or substantially shield the opening end 111, thereby protecting the speaker assembly 12 in the accommodation cavity 110.

[0115] In some embodiments, the speaker assembly 12 may include a magnetic circuit assembly (not shown in the figure), a voice coil (not shown in the figure), a vibration assembly (not shown in the figure), and a vibration transmission plate 121. The magnetic circuit assembly forms a magnetic gap, at least part of the voice coil is disposed in the magnetic gap, the other end of the voice coil is physically connected to the vibration assembly, the vibration assembly is physically connected to the vibration transmission plate 121, and the vibration transmission plate 121 is physically connected to the housing 11. Specifically, the magnetic circuit assembly can form a magnetic field. The voice coil is located in the magnetic gap, that is, in the magnetic field formed by the magnetic circuit assembly, and will be affected by the Ampere force. The Ampere force drives the voice coil to vibrate, thereby driving the vibration assembly to generate mechanical vibration. The vibration assembly transmits the vibration to the vibration transmission plate 121, and the vibration transmission plate 121 transmits the vibration to the housing 11. Finally, the housing 11 transmits the vibration to the auditory nerve through the tissues and bones of the human body, enabling the user to hear the sound. In some embodiments, the vibration transmission plate 121 and at least part of the housing 11 may also be referred to as elements in the vibration assembly.

[0116] In some embodiments, the magnetic circuit assembly, the voice coil, and the vibration assembly may be disposed in the accommodation cavity 110. The vibration transmission plate 121 is connected to the vibration assembly and is exposed outside the accommodation cavity 110 through the opening end. By exposing the vibration transmission plate 121 outside the accommodation cavity 110, the vibration transmission plate 121 can be closer to the user's head. The vibration of the exposed vibration transmission plate 121 can be transmitted to the user's bones more quickly and powerfully. Furthermore, the mechanical vibration transmitted to the human ear is more complete and not easily loses frequency bands, effectively improving the auditory effect of the hearing-impaired.

[0117] Such as Figure 2As shown, the protective element 13 can be disposed above the open end 111 and attached to the outer end face of the vibration transmission plate 121. In some embodiments, the protective element 13 can include a fitting portion 131 (i.e., the bottom), a receiving portion 132 (i.e., the side wall), and a supporting portion 133 (e.g., an annular supporting portion, i.e., an extending portion). The fitting portion 131 and the receiving portion 132 form a receiving cavity (which can also be referred to as a second receiving cavity, e.g., a cylindrical receiving cavity), and the vibration transmission plate 121 can be disposed in the second receiving cavity. The fitting portion 131 is attached to the outer end face of the vibration transmission plate 121, and the supporting portion 133 is connected to the receiving portion 132 and disposed above the housing 11. Specifically, the outer end face of the vibration transmission plate 121 refers to the end face away from the receiving cavity 110 or away from the vibration assembly.

[0118] During the assembly process of the protective element 13, the protective element 13 can be covered above the open end 111, and the vibration transmission plate 121 exposed outside the receiving cavity 110 can be extended into the second receiving cavity, and then the outer end face of the vibration transmission plate 121 is attached to the fitting portion 131. In some embodiments, the supporting portion 133 can be disposed above the annular bearing platform 112.

[0119] In some embodiments, the protective element 13 can include a protective screen. Through the mesh structure of the protective screen, during the process of the speaker assembly 12 generating mechanical vibration, the air inside and outside the receiving cavity 110 can flow through each other to balance the air pressure difference inside and outside the receiving cavity 110, thereby reducing the sound generated by the air inside the receiving cavity 110 due to vibration, attenuating the sound generated by the air vibration near the vibration transmission plate 121, reducing the sound leakage phenomenon, and improving the sound quality and sound effect of the overall acoustic device 1.

[0120] In some embodiments, in order to improve the connection stability between the supporting portion 133 and the annular bearing platform 112, as Figure 2 shown, the acoustic device 1 can include an upper cover 14 (e.g., an annular upper cover), and the upper cover 14 is used to press the supporting portion 133 onto the annular bearing platform 112. In this way, the protective element 13 can be stably disposed (or supported) on the annular bearing platform 112, reducing the situation where the supporting portion 133 falls off.

[0121] For the positional relationship and supporting structure among the upper cover 14, the supporting portion 133, and the annular bearing platform 112, there are various implementation manners.

[0122] Figure 3A According to some embodiments of the present application, the Figure 2 disassembly structure schematic diagram of the acoustic device; Figure 3B According to some embodiments of the present application, the Figure 3A cross-sectional structure schematic diagram of the acoustic device; Figure 3C is according to some embodiments of the present application, the Figure 3ASchematic diagram of the structure of the diaphragm of the acoustic device. As Figure 3A shown, the acoustic device 300 may include a housing 11 and a speaker assembly 12. The speaker assembly 12 may be disposed within the housing 11. The speaker assembly 12 may include a vibration plate 121, a vibration assembly, a magnetic circuit assembly, and a voice coil 124.

[0123] As Figure 3A and 3B shown, the magnetic circuit assembly may include a first magnetic circuit assembly 1231 and a second magnetic circuit assembly 1232 (e.g., a magnetic shield). In some embodiments, the first magnetic circuit assembly 1231 may include one or more magnetic elements and / or one or more magnetic conductive elements. In some embodiments, the second magnetic circuit assembly 1232 may include one or more magnetic elements and / or one or more magnetic conductive elements. In some embodiments, the magnetic elements of the magnetic circuit assembly may have corresponding magnetization directions to facilitate the formation of a relatively stable magnetic field. As described herein, a magnetic element refers to an element that can generate a magnetic field. In some embodiments, the magnetic element may include a single magnet or a combination of multiple magnets. In some embodiments, the second magnetic circuit assembly 1232 is used to adjust the magnetic field generated by the first magnetic circuit assembly 1231 to increase the utilization rate of the magnetic field. In some embodiments, the vibration assembly may be physically connected to the second magnetic circuit assembly 1232. For more descriptions of the magnetic circuit assembly, the first magnetic circuit assembly 1231, and the second magnetic circuit assembly 1232, reference may be made to Figure 4-61 the detailed description in

[0124] For ease of illustration, Figure 3A taking the second magnetic circuit assembly 1231 as a magnetic shield for illustration, it should be noted that the description of the second magnetic circuit assembly 1231 as a magnetic shield in this specification is only for illustration and is not intended to limit the scope of this specification. The magnetic shield may include a shield bottom 12321, a shield side 12322, and a cylindrical groove 12323, and the shield bottom 12321 and the shield side 12322 form the cylindrical groove 12323. In some embodiments, the shield side 12322 may be configured as a cylinder.

[0125] In some embodiments, the first magnetic circuit assembly 1231 is disposed within the cylindrical groove 12323 and forms a magnetic gap with the magnetic shield 1232. Correspondingly, at least a part of the voice coil 124 is in the magnetic gap, that is, the voice coil 124 is in the magnetic field formed between the first magnetic circuit assembly 1231 and the magnetic shield 1232. Thus, the voice coil 124 can generate an Ampere force under the excitation of an electrical signal (e.g., an audio signal), and then drive the vibration plate 121 to generate mechanical vibration. In some embodiments, the first magnetic circuit assembly 1231 includes one or more magnetic elements and / or one or more magnetic conductive elements, which are disposed on or inside the first magnetic circuit assembly 1231. For more descriptions of the first magnetic circuit assembly 1231, reference may be made toFigure 6-64 Detailed description in .

[0126] In some embodiments, the first magnetic circuit component 1231 is physically connected to the magnetic cover 1232. For example, the bottom 12321 of the cover body of the magnetic cover 1232 can be connected by magnetic adsorption, gluing, snap-fitting, threaded connection, or a combination thereof.

[0127] In some embodiments, Figure 3B As shown, the acoustic device 300 includes a fixing member 126 for fixing the first magnetic circuit assembly 1231 to the bottom 12321 of the cover.

[0128] In some embodiments, the fixing member 126 may include a bolt 1261 and a nut 1262, wherein the bolt 1261 passes through the first magnetic circuit assembly 1231 and then passes through the bottom 12321 of the cover body, so as to fix the first magnetic circuit assembly 1231 and the bottom 12321 of the cover body through a threaded connection. In this arrangement, since the nut 1262 is embedded in the bottom 12321 of the cover body, the size of the speaker assembly 12 in the extension direction of the inner and outer brackets is compressed, which is beneficial to control the overall size of the speaker assembly 12. Of course, if the above-mentioned overall size allows, the nut 1262 can also be set on the side of the bottom 12321 of the cover body away from the barrel groove 12323, and the relative fixation between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 can also be achieved.

[0129] In some embodiments, the fixing member 126 can connect the first magnetic circuit component 1231 and the magnetic cover 1232 together. In this case, a colloid ( Figure 3A and Figure 3B ), so that the gap between the two can be filled and the relative fixation between the two is more stable, thereby preventing the first magnetic circuit component 1231 and the magnetic cover 1232 from moving relative to each other under mechanical vibration, causing the acoustic device 300 to generate noise.

[0130] When the first magnetic circuit component 1231 and the magnetic conductive cover 1232 are relatively fixed, there is a gap between the first magnetic circuit component 1231 and the magnetic conductive cover 1232 ( Figure 3A The first magnetic circuit assembly 1231 is not marked in the figure, and is used to accommodate the voice coil 124. The magnetic field generated by the first magnetic circuit assembly 1231 can be distributed in the gap (also referred to as the magnetic gap). In some embodiments, the size of the magnetic gap is as uniform as possible to increase the uniformity of the magnetic field distribution, thereby increasing the smoothness of the vibration of the voice coil 124 under the action of the magnetic field.

[0131] It should be noted that in order to increase the smoothness of the vibration of the voice coil 124 under the action of the magnetic field, the distance between the voice coil 124 and the first magnetic circuit component 1231 or the magnetic conductive cover 1232 is equal everywhere. In some embodiments, during the pre-processing and the subsequent assembly of the speaker assembly, the coaxiality of structural components such as the first magnetic circuit component 1231, the magnetic conductive cover 1232, and the voice coil 124 can be ensured.

[0132] In some embodiments, such as Figure 3A and Figure 3B shown, the vibration assembly may include an inner bracket 1221, an outer bracket 1222, and a diaphragm 1223. One end of the outer bracket 1222 is physically connected to both sides of the magnetic circuit component (for example, the housing side portion 12322 of the magnetic conductive cover 1232). In some embodiments, the physical connection may include one or a combination of magnetic adsorption, snap connection, and threaded connection, etc. In some embodiments, one end of the outer bracket 1222 may be integrally formed with both sides of the magnetic circuit component (for example, the housing side portion 12322 of the magnetic conductive cover 1232). For example, one end of the outer bracket 1222 is integrally formed with both sides of the magnetic circuit component (for example, the housing side portion 12322 of the magnetic conductive cover 1232) by injection molding. By setting the outer bracket 1222 and an element in the magnetic circuit component (for example, the housing side portion 12322 of the magnetic conductive cover 1232) as an integrally formed part, the assembly error between the outer bracket 1222 and the magnetic circuit component can be effectively reduced, and the coaxiality of the two can be ensured.

[0133] One end of the inner bracket 1221 is physically connected to the voice coil 124. As described above, in the magnetic field formed by the magnetic circuit component, the voice coil 124 will be affected by the Ampere force, and the Ampere force drives the voice coil 124 to vibrate. Consequently, the inner bracket 1221 connected to the voice coil 124 will vibrate. The inner bracket 1221 and the outer bracket 1222 are connected by the diaphragm 1223. Therefore, the outer bracket 1222 and the diaphragm 1223 will also vibrate. In some embodiments, at least one of the inner bracket 1221, the outer bracket 1222, and the diaphragm 1223 is connected to the vibration transmission plate 121 so that the vibration is transmitted to the vibration transmission plate 121.

[0134] In some embodiments, the diaphragm 1223 physically connects the inner bracket 1221 and the outer bracket 1222 and can be used to limit the relative movement of the inner bracket 1221 and the outer bracket 1222 in the first direction; the first direction is the radial direction of the accommodation cavity 110. Since the diaphragm 1223 connects the inner bracket 1221 and the outer bracket 1222, the assembly error of the outer bracket 1222 will also cause the assembly error between the inner bracket 1221 and the magnetic circuit component, thereby reducing the smoothness of the vibration of the voice coil 124 under the action of the magnetic field, that is, the smoothness of the mechanical vibration generated by the voice coil 124 driving the vibration assembly becomes worse, and further affecting the sound quality of the acoustic device 300.

[0135] In some embodiments, the outer bracket 1222 and / or the inner bracket 1221 are movably connected to the vibrating piece 1223 to limit the relative movement of the outer bracket 1222 and the inner bracket 1221 in the first direction, while allowing the inner bracket 1221 and the vibrating piece 1223 to move relative to the outer bracket 1222 in the second direction; the second direction is the extending direction of the inner bracket 1221 and the outer bracket 1222.

[0136] In some embodiments, the outer bracket 1222 is movably connected to the vibrating piece 1223. As described herein, the first element (e.g., the outer bracket 1222) being movably connected to the second element means that the first element and the second element can perform relative movement through the connecting portion. In some embodiments, a first convex post 12221 is provided at one end of the outer bracket 1222 away from the magnetic circuit assembly (i.e., close to the vibration transmission plate 1121), and the vibrating piece 1223 is provided with a first through hole 12231. The first convex post 12221 is movably connected to the vibrating piece 1223 through the first through hole 12231, that is, the vibrating piece 1223 can move up and down along the first convex post 12221. In some embodiments, the first convex post 12221 and the first through hole 12231 are adapted to each other. The first convex post 12221 is movably inserted through the first through hole 12231.

[0137] In some embodiments, the number of the first convex posts 12221 and the first through holes 12231 can be multiple.

[0138] In some embodiments, the inner bracket 1221 is movably connected to the vibrating piece 1223. In some embodiments, a second convex post 12211 can be provided at one end of the inner bracket 1221, and the vibrating piece 1223 is provided with a second through hole 12232. The second convex post 12211 is movably connected to the vibrating piece 1223 through the second through hole 12232.

[0139] In some embodiments of this specification, by the cooperation of the first convex post 12221 and the first through hole 12231 and the cooperation of the second convex post 12211 and the second through hole 12232, the relative movement of the outer bracket 1222 and the inner bracket 1221 in the first direction can be limited, while allowing the inner bracket 1221 and the vibrating piece 1223 to move relative to the outer bracket 1222 in the second direction, so as to facilitate the transmission of the mechanical vibration generated by the vibration assembly. Other parts of the inner bracket 1221 can be fixedly connected to the vibrating piece 1223, so that under the vibration of the voice coil, the inner bracket 1221 can transmit the vibration to the vibrating piece 1223 through the inner bracket 1221. As described herein, the first element (e.g., the inner bracket 1221) being fixedly connected to the second element means that the first element and the second element cannot perform relative movement through the connecting portion, that is, the first element and the second element remain relatively stationary through the connecting portion.

[0140] AsFigure 3C As shown, in some embodiments, the vibrating piece 1223 may include an annular edge portion 12233 and one or more ribs 12234 connected within the annular edge portion 12233. The annular edge portion 12233 is provided with a first through hole 12231. A surface of the inner bracket 1221 facing the vibration transmission plate 121 may be provided with a through groove (not shown in the figure) corresponding to the rib 12234. The rib 12234 may be received in the through groove, thereby restricting the relative movement of the outer bracket 1222 and the inner bracket 1221 in the first direction, while allowing the inner bracket 1221 and the vibrating piece 1223 to move relative to the outer bracket 1222 in the second direction; the second direction is the extending direction of the inner bracket 1221 and the outer bracket 1222.

[0141] Figure 3C is a schematic structural view of a vibrating piece shown according to some embodiments of the present application. As Figure 3C shown, in some embodiments, the vibrating piece 1223 may further include an annular intermediate portion 12235, and one or more ribs 12234 are connected between the annular edge portion 12233 and the annular intermediate portion 12235. The annular intermediate portion 12235 is provided with a second through hole 12232, and the position of the second convex column 12211 corresponds to the position of the second through hole 12232 (not limited to Figure 3A the shown situation). The annular edge portion 12233 is provided with a first through hole 12231, and the position of the first convex column 12221 corresponds to the position of the first through hole 12231.

[0142] In some embodiments, the speaker assembly 12 may include an elastic damping piece 125. The elastic damping piece 125 is disposed between one end of the vibration transmission plate 121 and the inner bracket 1221 to slow down the vibration of the inner bracket 1221 in the second direction.

[0143] In some embodiments, the second convex column 12211 may include a first column section 12212 and a second column section 12213 that are physically connected. As Figure 3A shown, the second column section 12213 is disposed above the first column section 12212; the first column section 12212 passes through the second through hole 12232, and the second column section 12213 is inserted into the vibration transmission plate 121; the elastic damping piece 125 is provided with a third through hole 1251. The elastic damping piece 125 is sleeved on the second column section 12213 through the third through hole 1251 and supported on the first column section 12212.

[0144] In some embodiments, the first column section 12212 and the second column section 12213 are integrally formed, and the cross-sectional area of the second column section 12213 is smaller than the cross-sectional area of the first column section 12212.

[0145] In some embodiments, the outer edge of the elastic shock-absorbing sheet 125 may be connected to the housing 11. In some embodiments, the outer edge of the elastic shock-absorbing sheet 125 may be disposed between the housing 11 and a protective element (not shown in the figure, refer to Figure 2 the protective element 13 in

[0146] In some embodiments, the elastic shock-absorbing sheet 125 may be clamped between an annular bearing platform provided on the inner wall of the housing 11 and a support portion of the protective element (not shown in the figure, refer to Figure 2 the support portion 133 in

[0147] Regarding that the elastic shock-absorbing sheet 125 may be clamped between the annular bearing platform and the support portion, the annular bearing platform may support the elastic shock-absorbing sheet 125. In some embodiments, the inner surface of the support portion may be adhesively connected to the elastic shock-absorbing sheet 125, and the elastic shock-absorbing sheet 125 may be adhesively connected to the annular bearing platform.

[0148] Regarding that in some embodiments, the elastic shock-absorbing sheet 125 may be clamped between a second cover body of the upper cover (not shown in the figure, refer to Figure 2 the second cover body 142 in

[0149] In some embodiments of the present specification, by providing the elastic shock-absorbing sheet 125 to slow down the vibration of the inner bracket 11401 in the second direction, the smoothness of the vibration of the vibration transmission plate 121 can be increased.

[0150] In some embodiments, the inner bracket 1221 forms a cover groove 12214. In some embodiments, one end of the inner bracket 1221 facing the first magnetic circuit assembly 1231 forms the cover groove 12214. The first magnetic circuit assembly 1231 partially extends into the cover groove 12214. In some embodiments, one end of the inner bracket 1221 (the end facing the first magnetic circuit assembly 1231) covers the first magnetic circuit assembly 1231, so that the first magnetic circuit assembly 1231 can partially extend into the cover groove 12214. With such a setting, while meeting the sound generation requirements of the speaker assembly 12, the size of the speaker assembly 12 in the extension direction of the inner and outer brackets can be compressed, which is beneficial to controlling the overall size of the speaker assembly 12.

[0151] Figure 4It is a schematic longitudinal cross-sectional view of a bone conduction acoustic device according to some embodiments of the present application. As shown in the figure, the bone conduction acoustic device 400 may include a magnetic circuit assembly (not shown in the figure), a vibration assembly 403, and a voice coil 404. In some embodiments, the magnetic circuit assembly may include a first magnetic circuit assembly 401 and a second magnetic circuit assembly 402. The second magnetic circuit assembly 402 is disposed around the first magnetic circuit assembly 401 to form a magnetic gap. The voice coil 404 may be disposed in the magnetic gap, and the voice coil 404 is connected to the vibration assembly 403.

[0152] At least one of the first magnetic circuit assembly 401 and the second magnetic circuit assembly 402 may include a magnetic element and / or a magnetic conductive element. In the present application, by combining and varying the positions of the magnetic elements and the magnetic conductive elements, and by setting the magnetization directions of the respective magnetic elements, the intensity and distribution of the magnetic field in the magnetic gap can be changed.

[0153] In some embodiments, the first magnetic circuit assembly may include a first magnetic element and a second magnetic element. The magnetic field intensity of the total magnetic field generated by the magnetic circuit assembly in the magnetic gap is greater than the magnetic field intensity of the first magnetic element or the second magnetic element in the magnetic gap. In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are opposite. In some embodiments, the included angle between the magnetization directions of the first magnetic element and the second magnetic element is between 150° and 180°. For example, the included angle between the magnetization directions of the first magnetic element and the second magnetic element may be equal to, for example, 150°, 170°, or 180°, etc. In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are both perpendicular or parallel to the vibration direction of the voice coil in the magnetic gap and the magnetization directions are opposite. As described herein, the vibration direction of the voice coil in the magnetic gap refers to the vibration direction of the voice coil at a certain moment. In some embodiments, if the magnetization directions of the first magnetic element and the second magnetic element are parallel to the vibration direction of the voice coil in the magnetic gap, the first magnetic element and the second magnetic element may be stacked along the vibration direction of the voice coil in the magnetic gap; if the magnetization directions of the first magnetic element and the second magnetic element are perpendicular to the vibration direction of the voice coil in the magnetic gap, the first magnetic element and the second magnetic element may be stacked along a direction perpendicular to the vibration direction of the voice coil in the magnetic gap. For more details regarding the first magnetic circuit assembly, reference may be made to Figure 6-Figure 63 .

[0154] In some embodiments, the first magnetic circuit assembly includes a first magnetic element, a second magnetic element, and a first magnetic conductive element, and the second magnetic circuit assembly may include a third magnetic element. The first magnetic conductive element is disposed between the first magnetic element and the second magnetic element, and the third magnetic element is disposed at least partially surrounding the first magnetic element and the second magnetic element. In some embodiments, the magnetization directions of both the first magnetic element and the second magnetic element are perpendicular to the surface where the first magnetic element is connected to the first magnetic conductive element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite. In some embodiments, the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the second magnetic element may be in the range of 60-120 degrees, and / or 0-30 degrees. For more descriptions of the first magnetic conductive element of the first magnetic circuit assembly and the third magnetic element of the second magnetic circuit assembly, reference can be made to Figure 6 , 8 , 34, 36, 38, 40, 42, 54 and / or 56.

[0155] In some embodiments, the first magnetic circuit assembly may include a first magnetic element, a second magnetic element, and a second magnetic conductive element, and the second magnetic circuit assembly includes a first magnetic conductive element; the second magnetic conductive element is disposed between the first magnetic element and the second magnetic element; the first magnetic conductive element at least partially surrounds the first magnetic element and the second magnetic element. In some embodiments, the magnetization directions of both the first magnetic element and the second magnetic element are perpendicular to the surface where the first magnetic element is connected to the first magnetic conductive element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite. In some embodiments, the second magnetic conductive element is disposed to surround the first magnetic element, and the first magnetic element is disposed between the second magnetic elements. In some embodiments, the upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element. In some embodiments, if the first magnetic element and the second magnetic element can be stacked along the vibration direction of the voice coil in the magnetic gap, the upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element. In some embodiments, if the first magnetic element and the second magnetic element can be stacked along a direction perpendicular to the vibration direction of the voice coil in the magnetic gap, the outer wall of the second magnetic conductive element is connected to the inner surfaces of the first magnetic element and the second magnetic element. As described herein, the inner surface (or inner wall or inner ring or inner side region) of the magnetic element refers to the surface that is substantially parallel to the vibration direction of the voice coil in the magnetic gap and away from the voice coil. The outer surface (or outer wall or outer ring or outer side region) of the magnetic element refers to the surface that is substantially parallel to the vibration direction of the voice coil in the magnetic gap and close to the voice coil; the inner surface of the magnetic element refers to the surface that is substantially parallel to the vibration direction of the voice coil in the magnetic gap and away from the voice coil; the upper surface (i.e., the top surface) of the magnetic element refers to the surface that is substantially perpendicular to the vibration direction of the voice coil in the magnetic gap and close to the diaphragm; the lower surface (i.e., the bottom surface) of the magnetic element refers to the surface that is substantially perpendicular to the vibration direction of the voice coil in the magnetic gap and away from the diaphragm. For more descriptions of the first magnetic circuit assembly and the second magnetic circuit assembly, reference can be made to Figure 10 、 12 、44, 46, 48, 50, and / or 52.

[0156] In some embodiments, the first magnetic circuit assembly may include a first magnetic element, and the second magnetic circuit assembly may include a first magnetic conductive element; the first magnetic conductive element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element points from the central region (or inner side region) of the first magnetic element to the outer side region of the first magnetic element or from the outer side region of the first magnetic element to the central region (or inner side region) of the first magnetic element. In some embodiments, the first magnetic element is annular. In some embodiments, the first magnetic element is cylindrical. For more descriptions of the first magnetic circuit assembly and the second magnetic circuit assembly, reference can be made to Figure 24 、26 , 28, 30, 32, 61, and / or 62.

[0157] In some embodiments, the first magnetic circuit component may include a first magnetic element, and the second magnetic circuit component may include a second magnetic element; the second magnetic element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element points from the central region (or inner region) of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the central region (or inner region) of the first magnetic element. In some embodiments, the magnetization direction of the second magnetic element points from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the inner ring of the second magnetic element. For more descriptions of the first magnetic circuit component and the second magnetic circuit component, reference may be made to Figure 14 , 16 , 18, 20, 22, and / or 63.

[0158] The magnetic element described in this application refers to an element that can generate a magnetic field, such as a magnet, etc. The magnetic element may have a magnetization direction, which refers to the magnetic field direction inside the magnetic element, that is, the direction of the magnetic induction lines inside the magnetic element or the direction from the S pole to the N pole of the magnetic element. The above-mentioned magnetic element may include one or more magnets. For example, two magnets. In some embodiments, the magnet may include a metal alloy magnet, ferrite, etc. Among them, the metal alloy magnet may include neodymium iron boron, samarium cobalt, alnico, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or a combination of multiple of them. Ferrite may include barium ferrite, steel ferrite, magnesium manganese ferrite, lithium manganese ferrite, or the like, or a combination of multiple of them. It should be noted that the magnetic conductor mentioned here can also be called a magnetic field concentrator or an iron core. The magnetic conductor can adjust the distribution of the magnetic field generated by the magnetic element. The magnetic conductor may include an element processed from a soft magnetic material. In some embodiments, the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, etc., such as iron, iron-silicon alloy, iron-aluminum alloy, nickel-iron alloy, iron-cobalt alloy, low-carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc. In some embodiments, the magnetic conductor can be processed by one or a combination of methods such as casting, plastic processing, cutting processing, powder metallurgy, etc. Casting may include sand casting, investment casting, die casting, centrifugal casting, etc.; plastic processing may include a combination of one or more of rolling, casting, forging, stamping, extrusion, drawing, etc.; cutting processing may include turning, milling, planing, grinding, etc. In some embodiments, the processing method of the magnetic conductor may include 3D printing, numerical control machine tools, etc. The connection method between the magnetic conduction element and the magnetic element may include one or a combination of bonding, clamping, welding, riveting, bolt connection, etc. In some embodiments, the magnetic element and the magnetic conduction element may be arranged in an axisymmetric structure. The axisymmetric structure may be an annular structure, a columnar structure, or other structures with an axisymmetric structure.

[0159] In some embodiments, when a current is passed through the voice coil 404, the voice coil 404 is located in the magnetic field formed by the first magnetic circuit assembly 401 and the second magnetic circuit assembly 402 and will be affected by the Ampere force. The Ampere force drives the voice coil 404 to vibrate, and then drives the vibration assembly 403 to vibrate. The vibration assembly 403 transmits the vibration to the auditory nerve through tissues and bones, so that a person can hear the sound. The vibration assembly 403 can be in direct contact with the human skin, or can be in contact with the skin through a vibration transmission layer composed of a specific material. For more descriptions of the vibration assembly 403, reference can be made to Figure 2-3C the detailed description.

[0160] Figure 5 is a longitudinal sectional view of the air conduction acoustic device shown in some embodiments of the present application. As Figure 5As shown in the figure, the air conduction acoustic device may include a first magnetic circuit assembly 501, a diaphragm 503, and a voice coil 504. Among them, the diaphragm 503 at least partially surrounds the first magnetic circuit assembly 501, a magnetic gap is formed between the first magnetic circuit assembly 501 and the diaphragm 503, the voice coil 504 may be disposed in the magnetic gap, and the diaphragm 503 is connected to the voice coil 504. The diaphragm 503 may be connected to the housing (or bracket) of the air conduction speaker through one or more suspension rings. The first magnetic circuit assembly 501 and the vibrating diaphragm 503 may include magnetic elements and / or magnetic conductive elements. In the present application, by combining magnetic elements, magnetic conductive elements and changing their positions, and setting the magnetization directions of the respective magnetic elements, the intensity and the intensity distribution of the magnetic field in the magnetic gap can be changed. Similar to the principle of sound generation of the bone conduction speaker, when the voice coil 504 is subjected to the Ampere force, it will vibrate in the magnetic gap, and the vibration of the voice coil 504 drives the diaphragm 503 to vibrate, thereby pushing the air to vibrate, so that people can hear the sound.

[0161] The above descriptions of the structures of the bone conduction acoustic device and the air conduction acoustic device are only specific examples. It should not be regarded as the only feasible implementation. Obviously, for professionals in the field, after understanding the basic principle of the bone conduction speaker, various modifications and changes in form and details may be made to the specific ways and steps of implementing the bone conduction speaker without departing from this principle, but these modifications and changes are still within the scope of the above description. For example, the bone conduction acoustic device may include a housing and a connecting member. The connecting member connects the vibrating plate to the housing. Another example is that the air conduction speaker may include a non-metallic housing, and the voice coil is connected to the non-metallic housing through a suspension ring.

[0162] Figure 6 is a longitudinal sectional view of a magnetic circuit assembly shown in some embodiments according to the present application; Figure 7 is according to the present specification Figure 6 shown magnetic field intensity change diagram of the magnetic circuit assembly.

[0163] As Figure 6 shown, the magnetic circuit assembly 600 may include a first magnetic element 601, a second magnetic element 602, a third magnetic element 603, and a first magnetic conductive element 604.

[0164] In some embodiments, the first magnetic conductive element 604 is disposed between the first magnetic element 601 and the second magnetic element 602, and the third magnetic element 603 is disposed at least partially surrounding the first magnetic element 601 and the second magnetic element 602. A magnetic gap is formed between the first magnetic element 601 and the second magnetic element 602 and the third magnetic element 603. In some embodiments, the magnetization directions of the first magnetic element 601 and the second magnetic element 602 are both perpendicular to the surface where the first magnetic conductive element 604 is connected to the first magnetic element 601 and / or the second magnetic element 602 (i.e., the vertical direction in the figure, and the arrow direction on each magnetic element in the figure represents the magnetization direction of the magnetic element), and the magnetization directions of the first magnetic element 601 and the second magnetic element 602 are opposite.

[0165] In some embodiments, the placement of the first magnetic element 601 and the second magnetic element 602 may include the same magnetic poles of the first magnetic element 601 and the second magnetic element 602 being close to the first magnetic conductive element 604; and different magnetic poles being away from the first magnetic conductive element 604. For example, the N pole of the first magnetic element 601 is closer to the first magnetic conductive element 604 compared to the S pole of the first magnetic element 601, and the N pole of the second magnetic element 602 is closer to the first magnetic conductive element 604 compared to the S pole of the second magnetic element 602. That is, inside the first magnetic element 601 and the second magnetic element 602, the magnetic induction line or the magnetic field direction (i.e., the direction from the S pole to the N pole) is directed towards the first magnetic conductive element 604. Another example is that the S pole of the first magnetic element 601 is closer to the first magnetic conductive element 604 compared to the N pole of the first magnetic element 601, and the S pole of the second magnetic element 602 is closer to the first magnetic conductive element 604 compared to the N pole of the second magnetic element 602. That is, inside the first magnetic element 601 and the second magnetic element 602, the magnetic induction line or the magnetic field direction (i.e., the direction from the S pole to the N pole) is directed away from the first magnetic conductive element 604.

[0166] By setting the magnetization directions of the first magnetic element 601 and the second magnetic element 602 to the vertical direction and opposite to each other, the first magnetic element 601 and the second magnetic element 602 are arranged with opposite magnetization, so that the magnetic induction lines generated by the first magnetic element 601 and the second magnetic element 602 are generally in the same direction within the magnetic gap. For example, they both point from the first magnetic conduction element 604 to the third magnetic element 603; or they both point from the third magnetic element 603 to the first magnetic conduction element 604, thereby increasing the magnetic field strength within the magnetic gap. In addition, by setting the magnetization directions of the first magnetic element 601 and the second magnetic element 602 to the vertical direction and opposite to each other, the magnetic field generated by the first magnetic element 601 and the second magnetic element 602 within the magnetic gap can be suppressed, so that the magnetic induction lines corresponding to the magnetic field are distributed in the horizontal direction within the magnetic gap. For example, when the magnetic induction lines or magnetic field directions (i.e., the direction from the S pole to the N pole) within the first magnetic element 601 and the second magnetic element 602 both point to the first magnetic conduction element 604, the magnetic induction lines can extend from the end of the first magnetic conduction element 604 into the magnetic gap along the horizontal or nearly horizontal direction; when the magnetic induction lines or magnetic field directions (i.e., the direction from the S pole to the N pole) within the first magnetic element 601 and the second magnetic element 602 both deviate from the first magnetic conduction element 604, the magnetic induction lines extend from the magnetic gap along the horizontal or nearly horizontal direction to the end of the first magnetic conduction element 604.

[0167] In some embodiments, the magnetization direction of the third magnetic element 603 is perpendicular to the magnetization direction of the first magnetic element 601 or the second magnetic element 602. By setting the magnetization directions to be perpendicular to each other, the magnetic induction lines within the magnetic gap can be further guided to extend along the horizontal or nearly horizontal direction. For example, when the magnetic induction lines or magnetic field directions (i.e., the direction from the N pole to the S pole) within the first magnetic element 601 and the second magnetic element 602 both point to the first magnetic conduction element 604, the magnetic induction lines can extend from the end of the first magnetic conduction element 604 into the magnetic gap along the horizontal or nearly horizontal direction and pass through the third magnetic element 603; when the magnetic induction lines or magnetic field directions (i.e., the direction from the S pole to the N pole) within the first magnetic element 601 and the second magnetic element 602 both deviate from the first magnetic conduction element 604, the magnetic induction lines pass through the third magnetic element 603 and extend from the magnetic gap along the horizontal or nearly horizontal direction to the end of the first magnetic conduction element 604. In this way, the magnetic field direction at the voice coil position within the magnetic gap can be mainly distributed along the horizontal direction or nearly horizontal direction, improving the uniformity and intensity of the magnetic field, and effectively improving the sound effect generated by the vibration of the voice coil.

[0168] It should be noted that in some other embodiments, the magnetization directions of the respective magnetic elements can also be other directions. Combining magnetic elements with different magnetization directions can also achieve the effect of increasing the magnetic field strength and / or making the magnetic field strength distribution more uniform.

[0169] It should be noted that the vertical direction can be understood as the direction in which the voice coil vibrates, that is, the direction perpendicular to the plane where the top surface of the first magnetic element 601 is located. In some embodiments, the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 may be set not to be perpendicular to each other, and a preset angle may exist between the two magnetization directions. Among them, the preset angle can be set within a certain angle range. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 60 degrees and 120 degrees. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 50 degrees and 130 degrees. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 0 degrees and 30 degrees. For example, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 may be equal to 0°, 60°, 80°, 90°, 100°, 180°, etc.

[0170] In some embodiments, a preset angle may also exist between the magnetization direction of the first magnetic element 601 and the magnetization direction of the second magnetic element 602. In some embodiments, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 is between 150 degrees and 180 degrees. For example, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 may be equal to, for example, 170°, 180°, etc. The connection manner between the magnetic conduction element and the magnetic element may include one or a combination of more of bonding, clamping, welding, riveting, and bolt connection. As described herein, the angle between the two magnetization directions may refer to the angle that needs to be rotated to the direction where the other magnetization direction is located with one of the magnetization directions as the reference, where the angle of clockwise rotation is a positive number and the angle of counterclockwise rotation is a negative number.

[0171] In some embodiments, such as Figure 6As shown, the magnetic circuit assembly further includes a second magnetic conductive element 605, a third magnetic conductive element 606, and a fourth magnetic conductive element 607. The bottom surface of the second magnetic conductive element 605 is connected to the top surface of the first magnetic element 601, and the bottom surface of the third magnetic conductive element 606 is connected to the top surface of the third magnetic element 603. The second magnetic conductive element 605 and the third magnetic conductive element 606 are spaced apart at the magnetic gap. The top surface of the fourth magnetic conductive element 607 can be connected to both the bottom surface of the second magnetic element 602 and the bottom surface of the third magnetic element 603.

[0172] In some embodiments, the first magnetic element 601, the second magnetic element 602, the first magnetic conductive element 604, the second magnetic conductive element 605, and the fourth magnetic conductive element 607 can all be cylinders, cuboids, triangular prisms, etc. The third magnetic element 603 and the third magnetic conductive element 606 can be annular (continuously annular, discontinuously annular, rectangular annular, triangular annular, etc.). In some embodiments, the first magnetic element 601, the second magnetic element 602, the first magnetic conductive element 604, and the second magnetic conductive element 605 can have the same shape and size in a cross-section perpendicular to the vertical direction, and the third magnetic element 603 and the third magnetic conductive element 606 can have the same shape and size in a cross-section perpendicular to the vertical direction. In some embodiments, the sum of the thicknesses of the first magnetic element 601, the second magnetic element 602, the first magnetic conductive element 604, and the second magnetic conductive element 605 can be equal to the sum of the thicknesses of the third magnetic element 603 and the third magnetic conductive element 606. In some embodiments, the fourth magnetic conductive element 607 and the third magnetic conductive element 606 can have the same thickness.

[0173] In some embodiments, the first magnetic element 601, the second magnetic element 602, the third magnetic element 603, the first magnetic conduction element 604, the second magnetic conduction element 605, the third magnetic conduction element 606, and the fourth magnetic conduction element 607 form a magnetic circuit. In some embodiments, the magnetic circuit assembly 6000 can generate a total magnetic field or a complete magnetic field, and the first magnetic element 601 can generate a first magnetic field. The complete magnetic field is generated by the combined action of all components in the magnetic circuit assembly 600 (e.g., the first magnetic element 601, the second magnetic element 602, the third magnetic element 603, the first magnetic conduction element 604, the second magnetic conduction element 605, the third magnetic conduction element 606, and the fourth magnetic conduction element 607). The magnetic field intensity (which can also be referred to as magnetic induction intensity or magnetic flux density) of the complete magnetic field in the magnetic gap is greater than the magnetic field intensity of the first magnetic field in the magnetic gap. In some embodiments, the second magnetic element 602 can generate a second magnetic field, and the third magnetic element 603 can generate a third magnetic field. The second magnetic field and / or the third magnetic field can increase the magnetic field intensity of the complete magnetic field at the magnetic gap. The statement that the second magnetic field and / or the third magnetic field increase the magnetic field intensity of the complete magnetic field means that the magnetic field intensity of the complete magnetic field in the magnetic gap when the second magnetic field and / or the third magnetic field exist (i.e., when the second magnetic element 602 and / or the third magnetic element 603 exist) is greater than that of the complete magnetic field when the second magnetic field and / or the third magnetic field do not exist (i.e., when the second magnetic element 602 and / or the third magnetic element 603 do not exist). For example, the magnetic field intensity of the complete magnetic field generated when the second magnetic element 602 and the third magnetic element 603 exist in the magnetic gap is greater than the magnetic field intensity of the complete magnetic field generated when the second magnetic element 602 and the third magnetic element 603 do not exist (i.e., when only the first magnetic element 601 exists) in the magnetic gap. Another example, the magnetic field intensity of the complete magnetic field generated when the third magnetic element 603 exists in the magnetic gap is greater than the magnetic field intensity of the complete magnetic field in the magnetic gap generated when the third magnetic element 603 does not exist (i.e., when only the first magnetic element 601 and the second magnetic element 602 exist). In other embodiments of this specification, unless otherwise specified, the magnetic circuit assembly refers to a structure including all magnetic elements and magnetic conduction elements, the complete magnetic field refers to the magnetic field generated by the entire magnetic circuit assembly, the second magnetic field, the second magnetic field, the third magnetic field,..., the Nth magnetic field respectively refer to the magnetic fields generated by the corresponding magnetic elements. In different embodiments, the magnetic elements generating the first magnetic field (or the second magnetic field, the third magnetic field,..., the Nth magnetic field) can be the same or different.

[0174] Figure 7 is according to the present application Figure 6 is a schematic diagram of the change in the magnetic field intensity of the magnetic circuit assembly shown. In the magnetic gap, along Figure 6The Z-axis direction measurement magnetic field measures the intensity of each point in the Z-axis direction. For the sake of convenience in description only, the Z-axis in this specification is an axis disposed in the magnetic gap and extending along the vertical direction, and is used to characterize the distribution of the magnetic field intensity in the vertical direction. Those skilled in the art can set the zero position of the Z-axis according to actual measurement requirements. For example, the zero position of the Z-axis can be set at the vertical center of the first magnetic element 601, the first magnetic conductive element 604, and the second magnetic element 602; for another example, at the midpoint in the thickness direction of the third magnetic element 603; for yet another example, at the vertical center of the first magnetic conductive element 604. As Figure 7 shown, due to the opposition of the first magnetic element 601 and the second magnetic element 602, the magnetic field intensity is the highest near the zero point of the Z-axis (for example, -0.110 mm), the highest value of the magnetic field intensity is about 0.61 T, and the distribution of the magnetic field intensity changes relatively uniformly near the zero point (for example, within the range of -0.110 mm to 0.171 mm).

[0175] Figure 8 is a longitudinal sectional view of a magnetic circuit assembly shown according to some embodiments of the present application. As Figure 8 shown, in some embodiments, the magnetic circuit assembly 800 may include a first magnetic element 801, a second magnetic element 802, a third magnetic element 803, a first magnetic conductive element 804, a second magnetic conductive element 805, a third magnetic conductive element 806, a fourth magnetic conductive element 807, and a fifth magnetic conductive element 808. Compared with the embodiment shown in Figure 6 shown, the difference is that compared with the fourth magnetic conductive element 607 in the embodiment shown in Figure 6 shown, the fourth magnetic conductive element 807 and the fifth magnetic conductive element 808 in this embodiment are spaced apart at the magnetic gap, the top surface of the fourth magnetic conductive element 807 is connected to the bottom surface of the second magnetic element 802, and the top surface of the fifth magnetic conductive element 808 is connected to the bottom surface of the third magnetic element 803.

[0176] In some embodiments, the fourth magnetic conductive element 807 may be a cylinder, a cuboid, a triangular prism, etc., and the fifth magnetic conductive element 808 may be annular (continuous circular ring, discontinuous circular ring, rectangular ring, triangular ring, etc.). In some embodiments, the fourth magnetic conductive element 807 may have the same shape and size as the first magnetic element 801, the second magnetic element 802, the first magnetic conductive element 804, and the second magnetic conductive element 805 in the cross-section perpendicular to the Z-axis. The fourth magnetic conductive element 807 and the fifth magnetic conductive element 808 may have the same thickness. In some embodiments, the fifth magnetic conductive element 808 may have the same thickness, shape, and size as the third magnetic conductive element 806 in the cross-section perpendicular to the Z-axis.

[0177] Figure 9 is according to the present application's Figure 8Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the alkali gap, along Figure 8 the Z-axis direction shown, the magnetic field strength at each point in the Z-axis direction is measured. As Figure 9 shown, due to the more symmetrical distribution of the magnetic conduction elements on both sides of the first magnetic element 801 and the second magnetic element 802 compared to Figure 6 ..., the distribution of the magnetic field strength generated by the magnetic circuit component in the magnetic gap is more symmetrical on both sides of the zero point (for example, on both sides of 0.031 mm), and the change is relatively uniform in the vicinity of the zero point (for example, from -0.344 mm to 0.075 mm). However, due to the discontinuity of the fourth magnetic conduction element 807 and the fifth magnetic conduction element 808, the maximum value of the magnetic field strength decreases compared to the magnetic circuit component 600 with a continuous fourth magnetic conduction element 607, about 0.4 T.

[0178] It should be noted that in the Figure 6 and Figure 8 embodiments shown, on the basis of setting each magnetic element, those skilled in the art can further determine the number, setting position, and setting form of the magnetic conduction elements according to needs, and the present application does not make further limitations in this regard. For example, Figure 6 the second magnetic conduction element 605 and the third magnetic conduction element 603 in the embodiment shown can also be connected together.

[0179] Figure 10 is a longitudinal sectional view of the magnetic circuit component according to some embodiments of the present application. As Figure 10 shown, the magnetic circuit component 1000 may include a first magnetic element 1001, a second magnetic element 1002, a first magnetic conduction element 1003, and a second magnetic conduction element 1004.

[0180] In some embodiments, the second magnetic conduction element 1004 is disposed between the first magnetic element 1001 and the second magnetic element 1002; the first magnetic conduction element 1003 at least partially surrounds the first magnetic element 1001 and the second magnetic element 1002, and a magnetic gap is formed between the first magnetic element 1001 and the second magnetic element 1002 and the first magnetic conduction element 1003; the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 are both perpendicular to the surface where the second magnetic conduction element 1004 is connected to the first magnetic element 1001 and / or the second magnetic element 1002 (i.e., the vertical direction in the figure, and the arrow direction on each magnetic element in the figure represents the magnetization direction of the magnetic element), and their magnetization directions are opposite.

[0181] In some embodiments, the placement of the first magnetic element 1001 and the second magnetic element 1002 may include the same magnetic poles of the first magnetic element 1001 and the second magnetic element 1002 being close to the second magnetic conductive element 1004; and different magnetic poles being away from the second magnetic conductive element 1004. For example, the N pole of the first magnetic element 1001 is closer to the second magnetic conductive element 1004 than the S pole of the first magnetic element 1001, and the N pole of the second magnetic element 1002 is closer to the second magnetic conductive element 1004 than the S pole of the second magnetic element 1002. That is, inside the first magnetic element 1001 and the second magnetic element 1002, the direction of magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) is directed towards the second magnetic conductive element 1004. Another example is that the S pole of the first magnetic element 1001 is closer to the second magnetic conductive element 1004 than the N pole of the first magnetic element 1001, and the S pole of the second magnetic element 1002 is closer to the second magnetic conductive element 1004 than the N pole of the second magnetic element 1002. That is, inside the first magnetic element 1001 and the second magnetic element 1002, the direction of magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) is away from the second magnetic conductive element 1004.

[0182] By setting the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 to be in the vertical direction and opposite to each other, so that the first magnetic element 1001 and the second magnetic element 1002 are arranged with opposite magnetization, the directions of the magnetic induction lines generated by the first magnetic element 1001 and the second magnetic element 1002 in the magnetic gap can be made substantially the same. For example, they are all directed from the second magnetic conductive element 1004 to the first magnetic conductive element 1003; or they are all directed from the first magnetic conductive element 1003 to the second magnetic conductive element 1004, thereby increasing the magnetic field strength in the magnetic gap. In addition, by setting the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 to be in the vertical direction and opposite to each other, the magnetic fields generated by the first magnetic element 1001 and the second magnetic element 1002 can be suppressed, so that the magnetic induction lines corresponding to the magnetic fields are distributed in the horizontal direction in the magnetic gap. For example, when the direction of the magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) inside the first magnetic element 1001 and the second magnetic element 1002 is directed towards the second magnetic conductive element 1004, the magnetic induction lines can extend from the end of the second magnetic conductive element 1004 along the horizontal or nearly horizontal direction into the magnetic gap and pass through the first magnetic conductive element 1003. This can make the magnetic field direction at the voice coil position in the magnetic gap mainly distributed along the horizontal direction or nearly horizontal direction, improving the uniformity and strength of the magnetic field, and effectively improving the sound effect generated by the vibration of the voice coil.

[0183] In some other embodiments, the magnetization directions of the respective magnetic elements can also be in other directions. By combining magnetic elements with different magnetization directions, it is also possible to achieve the effect of increasing the intensity of the magnetic field and / or making the intensity distribution of the magnetic field more uniform. Additionally, there can be a preset angle between the magnetization direction of the first magnetic element 1001 and the magnetization direction of the second magnetic element 1002. Among them, the preset angle can be set within a certain angular range. For example, 60°, 80°, 90°, 100°, etc. The connection methods between the magnetic conductive element and the magnetic elements can include one or more combinations of bonding, snap connection, welding, riveting, bolt connection, etc. In some embodiments, there can also be a preset angle between the magnetization direction of the first magnetic element 601 and the magnetization direction of the second magnetic element 602. For example, 170°, 190°, etc. The relevant descriptions regarding the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 can refer to Figure 6 the magnetization directions of the first magnetic element 601 and the second magnetic element 602 therein.

[0184] In some embodiments, as Figure 10 shown, the magnetic circuit assembly further includes a third magnetic conductive element 1005 and a fourth magnetic conductive element 1006. The bottom surface of the third magnetic conductive element 1005 can be connected to the top surface of the first magnetic element 1001, and the top surface of the fourth magnetic conductive element 1006 can be connected to both the bottom surface of the second magnetic element 1002 and the bottom surface of the second magnetic conductive element 1004.

[0185] In some embodiments, the first magnetic element 1001, the second magnetic element 1002, the second magnetic conductive element 1004, and the third magnetic conductive element 1005 can all be cylinders, cuboids, triangular prisms, etc. The first magnetic conductive element 1003 can be in a ring shape (continuous circular ring shape, discontinuous circular ring shape, rectangular ring shape, triangular ring shape, etc.). In some embodiments, the shapes and sizes of the cross-sections of the first magnetic element 1001, the second magnetic element 1002, the second magnetic conductive element 1004, and the third magnetic conductive element 1005 in the plane perpendicular to the Z-axis can be the same. In some embodiments, the sum of the thicknesses of the first magnetic element 1001, the second magnetic element 1002, the second magnetic conductive element 1004, and the third magnetic conductive element 1005 can be equal to the thickness of the first magnetic conductive element 1003.

[0186] Figure 11 is according to the present application Figure 10 shown is a schematic diagram of the change in the magnetic field intensity of the magnetic circuit assembly. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured along the Figure 10 shown Z-axis direction, as Figure 11 shown, because compared with Figure 6The magnetic circuit component is missing a third magnetic element 603 for further enhancing the magnetic field. The intensity of the magnetic field weakens near the zero point (for example, within the range of -0.500 - 0.188 mm), and the highest value that can be achieved is only about 0.38 T. However, the magnetic field intensity distribution near the zero point is still relatively uniform.

[0187] Figure 12 is a schematic longitudinal sectional view of a magnetic circuit component shown in some embodiments of the present application. As Figure 12 shown, the magnetic circuit component 1200 may include a first magnetic element 1201, a second magnetic element 1202, a first magnetic conduction element 1203, a second magnetic conduction element 1204, a third magnetic conduction element 1205, and a fourth magnetic conduction element 1206. Compared with the Figure 10 embodiment shown, the difference is that Figure 12 in the embodiment shown, the fourth magnetic conduction element 1206 is no longer connected to the first magnetic conduction element 1203, and the top surface of the fourth magnetic conduction element 1206 is connected to the bottom surface of the second magnetic element 1202. The fourth magnetic element 1206 and the second magnetic conduction element 1204 are arranged at intervals at the magnetic gap. The relevant descriptions about the magnetization directions of the first magnetic element 1201 and the second magnetic element 1202 can refer to Figure 6 the descriptions about the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in

[0188] In some embodiments, the first magnetic element 1201, the second magnetic element 1202, the second magnetic conduction element 1204, the third magnetic conduction element 1205, and the fourth magnetic conduction element 1206 may all be cylinders, cuboids, triangular prisms, etc., and the first magnetic conductor 1203 may be annular (circular annular, rectangular annular, triangular annular, etc.).

[0189] In some embodiments, the sum of the thicknesses of the first magnetic element 1201, the second magnetic element 1202, the second magnetic conduction element 1204, the third magnetic conduction element 1205, and the fourth magnetic conduction element 1206 may be equal to the thickness of the first magnetic conduction element 1203.

[0190] It should be noted that in the Figure 10 and Figure 12 embodiments shown, on the basis of setting the first magnetic element, the second magnetic element, and the second magnetic conduction element, those skilled in the art can further change the number, setting position, and setting form of the magnetic conduction elements as needed, and the present application does not make further limitations. For example, Figure 10 the second magnetic conduction element 1004 and the third magnetic conduction element 1005 of the magnetic circuit component in the embodiment shown may also be connected together.

[0191] Figure 13 is according to the present application's Figure 12Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along Figure 12 the Z-axis direction shown, the magnetic field strength at each point in the Z-axis direction is measured. As Figure 13 shown, since the fourth magnetic conduction element 1206 is no longer connected to the first magnetic conduction element 1203, the highest value of the magnetic field strength is Figure 10 higher than that of the magnetic component 1000 with the continuous fourth magnetic conduction element 1006 in

[0192] Figure 14 Schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application. As Figure 14 shown, the magnetic circuit component 1400 may include a first magnetic element 1401 and a second magnetic element 1402. The second magnetic element 1402 at least partially surrounds the first magnetic element 1401 (i.e., the inner surface or inner wall of the second magnetic element 1402 surrounds the outer surface or outer wall of the first magnetic element 1401), and a magnetic gap is formed between the first magnetic element 1401 and the second magnetic element 1402. A voice coil may be disposed in the magnetic gap.

[0193] In some embodiments, the magnetization directions of the first magnetic element 1401 and the second magnetic element 1402 are both parallel to the top surface of the first magnetic element 1401 (i.e., the horizontal direction in the figure) or perpendicular to the inner and outer surfaces. For example, the magnetization direction of the first magnetic element 1401 may be the direction from its center outward (i.e., from the central region to the outer region), and the magnetization direction of the second magnetic element 1402 is the direction from its inner side (the side close to the first magnetic element 1401) to the outer side (the side far from the first magnetic element 1401). Another example is that the magnetization direction of the first magnetic element 1401 may be the direction from the outer side to the center, and the magnetization direction of the second magnetic element 1402 is the direction from its outer side (the side far from the first magnetic element 1401) to the inner side (the side close to the first magnetic element 1401).

[0194] In some embodiments, the placement of the first magnetic element 1401 and the second magnetic element 1402 may include the different magnetic poles of the first magnetic element 1401 and the second magnetic element 1402 approaching or moving away from each other. For example, the N pole of the first magnetic element 1401 is located in the central region of the first magnetic element 1401, and the S pole is located in the outer region of the first magnetic element 1401. That is, inside the first magnetic element 1401, on the same plane parallel to the upper surface or the lower surface of the first magnetic element 1401, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the center to the outside; the N pole of the second magnetic element 1402 is located in the outer region of the second magnetic element 1402, and the S pole is located in the inner region of the second magnetic element 1402. That is, inside the second magnetic element 1402, on the same plane parallel to the upper surface or the lower surface of the second magnetic element 1402, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the inside to the outside. Another example is that the S pole of the first magnetic element 1401 is located in the central region of the first magnetic element 1401, and the N pole is located in the outer region of the first magnetic element 1401. That is, inside the first magnetic element 1401, on the same plane parallel to the upper surface or the lower surface of the first magnetic element 1401, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the outside to the inside; the S pole of the second magnetic element 1402 is located in the outer region of the second magnetic element 1402, and the N pole is located in the inner region of the second magnetic element 1402. That is, inside the second magnetic element 1402, on the same plane parallel to the upper surface or the lower surface of the second magnetic element 1402, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the outside to the inside.

[0195] In some alternative embodiments, the first magnetic element 1401 may include two magnets. The placement of the two magnets may include being arranged adjacent to each other, and the same magnetic poles of the two are close to each other while the opposite magnetic poles are away from each other. For example, the N poles of the two magnets are close to each other (the magnetization directions of the left and right magnets of the first magnetic element 1401 shown in the figure are opposite). Another example is that the S poles of the two magnets are close to each other. In some embodiments, the second magnetic element 1402 may also include two magnets. The two magnets are respectively close to the first magnetic element 1401, and the magnetic induction lines or the magnetic field directions inside the two are opposite. For example, the magnetic induction lines or the magnetic field directions inside the two magnets of the second magnetic element 1402 both deviate from the first magnetic element 1401.

[0196] By setting the magnetization direction of the first magnetic element 1401 to the horizontal direction, it is possible to better make the magnetic field generated by the first magnetic element 1401 extend along the horizontal direction or close to the horizontal direction in the magnetic gap. And the magnetization direction of the second magnetic element 1402 is the same as that of the first magnetic element 1401, which can further guide the magnetic induction lines in the magnetic gap to be distributed in the magnetic gap along the horizontal or close to the horizontal direction. For example, when the magnetic induction lines or the magnetic field directions inside the first magnetic element 1401 and the second magnetic element 1402 both point from the first magnetic element 1401 to the second magnetic element 1402 (i.e., the S pole points to the N pole direction), the magnetic induction lines can extend from the outside of the first magnetic element 1401 along the horizontal or close to the horizontal direction into the magnetic gap and pass through the second magnetic element 1402, and the second magnetic element 1402 can emit from the outside of the second magnetic element 1402 and extend along the horizontal or close to the horizontal direction in the magnetic gap and penetrate into the inside of the second magnetic element 1402. Another example is that when the magnetic induction lines or the magnetic field directions inside the first magnetic element 1401 and the second magnetic element 1402 both point from the second magnetic element 1402 to the first magnetic element 1401 (i.e., the S pole points to the N pole direction), the magnetic induction lines can emit from the inside of the first magnetic element 1401 and extend along the horizontal or close to the horizontal direction from the magnetic gap and penetrate into the outside of the first magnetic element 1401, and the second magnetic element 1402 can emit from the inside of the second magnetic element 1402 and extend along the horizontal or close to the horizontal direction in the magnetic gap and penetrate into the outside of the first magnetic element 1402. In this way, the magnetic field direction at the voice coil position in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, improving the uniformity and intensity of the magnetic field, and effectively improving the sound effect generated by the vibration of the voice coil.

[0197] In some other embodiments, the magnetization directions of the respective magnetic elements can also be other directions. The combination of magnetic elements with different magnetization directions can also achieve the effect of improving the intensity of the magnetic field and / or making the intensity distribution of the magnetic field more uniform. It should be noted that in this embodiment, the horizontal direction can be understood as the direction perpendicular to the vibration direction of the voice coil, that is, the direction parallel to the plane where the top surface of the first magnetic element is located. In addition, the magnetization directions of the first magnetic element 1401 and the second magnetic element 1402 can be parallel, and a certain angular deviation is allowed. For example, the included angle between the magnetization directions of the two can be between 170° and 190°.

[0198] In some embodiments, the magnetic circuit assembly further includes a first magnetic conduction element 1403 and a second magnetic conduction element 1404. The bottom surface of the first magnetic conduction element 1403 is connected to the top surface of the second magnetic element 1402, and the top surface of the second magnetic conduction element is connected to the bottom surface of the second magnetic element 1402. The connection method between the magnetic conduction element and the magnetic element can include one or more combinations of bonding, clamping, welding, riveting, bolt connection, etc.

[0199] In some embodiments, the first magnetic element 1401 can be a cylinder, a cuboid, a triangular prism, etc., and the second magnetic element 1402, the first magnetic conduction element 1403, and the second magnetic conduction element 1404 can be annular (continuously annular, discontinuously annular, rectangular annular, triangular annular, etc.). In some embodiments, the first magnetic element 1401 can be formed by splicing two semi-cylinders, two cuboids, or two magnets of other shapes, and the magnetization directions of the two magnets constituting the first magnetic element 1401 can be opposite. In some embodiments, the second magnetic element 1402, the first magnetic conduction element 1403, and the second magnetic conduction element 1404 can be the same in terms of the shape and size of the cross-section perpendicular to the Z-axis. In some embodiments, the total thickness of the second magnetic element 1402, the first magnetic conduction element 1403, and the second magnetic conduction element 1404 can be equal to the thickness of the first magnetic element 1401.

[0200] Figure 15 is according to the present application Figure 14 The schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, along the Figure 14 Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As Figure 15 shown, the intensity of the magnetic field is basically symmetric about the zero position of the Z-axis, and the intensity of the magnetic field is relatively uniform along the Z-axis. The difference between the highest value and the lowest value of the magnetic field intensity is small. The highest value of the magnetic field intensity is near the zero point (for example, -0.002 mm or 0.002 mm), and is about 0.48 T.

[0201] Figure 16 is the longitudinal sectional view of the magnetic circuit assembly shown according to some embodiments of the present application. As Figure 16 shown, the magnetic circuit assembly 1600 can include a first magnetic element 1601, a second magnetic element 1602, a first magnetic conduction element 1603, and a second magnetic conduction element 1604. Compared with the embodiment Figure 14 shown, the difference is that the top surface of the second magnetic conduction element 1604 in this embodiment is connected to the bottom surfaces of both the first magnetic element 1601 and the second magnetic element 1602. In some embodiments, the second magnetic conduction element 1604 can be a cylinder. In some embodiments, the sum of the thicknesses of the second magnetic element 1602 and the first magnetic conduction element 1603 can be equal to the thickness of the first magnetic element 1601.

[0202] Figure 17 is according to the present application Figure 16 The schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, along the Figure 16 Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As Figure 17As shown, a relatively uniform magnetic field is generated near the zero point of the Z-axis. Since the second magnetic conduction element 1604 connects the first magnetic element 1601 and the second magnetic element 1602, compared with Figure 14 the magnetic circuit assembly, the magnetic field strength near the zero point (for example, 0.292 mm) is increased, approximately 0.53 T.

[0203] Figure 18 is a longitudinal sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As Figure 18 shown, the magnetic circuit assembly 1800 may include a first magnetic element 1801, a second magnetic element 1802, a first magnetic conduction element 1803, a second magnetic conduction element 1804, and a third magnetic conduction element 1805. Compared with the embodiment Figure 14 shown, the difference is that this embodiment further includes a third magnetic conduction element 1805, and the top surface of the third magnetic conduction element 1805 is connected to the bottom surface of the first magnetic element 1801. The third magnetic conduction element 1802 and the second magnetic conduction element 1804 are spaced apart on both sides of the magnetic gap.

[0204] In some embodiments, the first magnetic element 1801 and the third magnetic conduction element 1805 may be cylinders, cuboids, triangular prisms, etc. In some embodiments, the sum of the thicknesses of the second magnetic element 1802, the first magnetic conduction element 1803, and the second magnetic conduction element 1804 may be equal to the sum of the thicknesses of the first magnetic element 1801 and the third magnetic conduction element 1805. The second magnetic conduction element 1804 and the third magnetic conduction element 1805 may be equal in thickness.

[0205] Figure 19 is a schematic diagram of the magnetic field strength change of a magnetic circuit assembly according to Figure 18 the present application. In the magnetic gap, the magnetic field strength at each point in the Z-axis direction is measured along the Figure 18 Z-axis direction shown. As Figure 19 shown, the maximum magnetic field strength is near the zero point of the Z-axis (for example, 0.0209 mm), approximately 0.5 T, and the magnetic field strength is relatively uniform on both sides of the zero point position of the Z-axis, especially above. Compared with the magnetic circuit assembly 1400 without the third magnetic conduction element in Figure 14 , the maximum magnetic field strength in the magnetic gap is increased.

[0206] Figure 20 is a longitudinal sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As Figure 20 shown, the magnetic circuit assembly 2000 may include a first magnetic element 2001, a second magnetic element 2002, a first magnetic conduction element 2003, a second magnetic conduction element 2004, and a third magnetic conduction element 2005. This embodiment and Figure 16Compared with the embodiment shown, the difference is that this embodiment further includes a third magnetic conductive element 2005, and the bottom surface of the third magnetic conductive element 2005 is connected to the top surface of the first magnetic element 2001.

[0207] In some embodiments, the third magnetic conductive element 2005 and the first magnetic element 2001 can be cylinders, cuboids, triangular prisms, etc. The shapes and sizes of the cross-sections of the third magnetic conductive element 2005 and the first magnetic element 2001 perpendicular to the Z-axis can be the same. In some embodiments, the sum of the thicknesses of the first magnetic element 2001 and the third magnetic conductive element 2005 can be the same as the sum of the thicknesses of the second magnetic element 2002 and the second magnetic conductive element 2003.

[0208] Figure 21 is according to the present application Figure 20 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along Figure 20 the Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As Figure 21 shown, since a magnetic conductive element is added to the Figure 16 magnetic circuit component, the maximum value of the magnetic field strength (for example, -0.016 mm) reaches 0.6 T.

[0209] Figure 22 is a longitudinal sectional view of the magnetic circuit component according to some embodiments of the present application. As Figure 22 shown, the magnetic circuit component 2200 can include a first magnetic element 2201, a second magnetic element 2202, a first magnetic conductive element 2203, a second magnetic conductive element 2204, a third magnetic conductive element 2205, and a fourth magnetic conductive element 2206. Compared with the Figure 18 embodiment shown, the difference is that this embodiment further includes a fourth magnetic conductive element 2206, and the bottom surface of the fourth magnetic conductive element 2206 is connected to the surface of the first magnetic element 2201. The fourth magnetic conductive element 2206 and the first magnetic conductive element 2203 are spaced apart on both sides of the magnetic gap. In some embodiments, the first magnetic element 2201, the third magnetic conductive element 2205, and the fourth magnetic conductive element 2206 can be cylinders, cuboids, triangular prisms, etc. In some embodiments, the sum of the thicknesses of the second magnetic element 2202, the first magnetic conductive element 2203, and the second magnetic conductive element 2204 can be equal to the sum of the thicknesses of the first magnetic element 2201, the third magnetic conductive element 2205, and the fourth magnetic conductive element 2206. The first magnetic conductive element 2203 and the fourth magnetic conductive element 2206 can be equal in thickness.

[0210] Figure 23 is according to the present application Figure 22 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along Figure 22The Z-axis direction measurement magnetic field measures the intensity of each point in the Z-axis direction. As Figure 23 shown, the highest value of the magnetic field intensity (for example, the highest value at -0.039 mm) is about 0.53 T, and since Figure 23 the magnetic circuit components are more evenly distributed in the Z-axis direction relative to Figure 18 the magnetic circuit components, the magnetic field intensity is relatively evenly distributed near the zero point of the Z-axis.

[0211] It should be noted that in Figure 14 、 Figure 16 、 Figure 18 、 Figure 20 、 Figure 22 the embodiments shown, on the basis of setting the first magnetic element and the second magnetic element, those skilled in the art can further determine the number, setting position and setting form of the magnetic conduction elements according to needs, and this application does not make further limitations. For example, Figure 14 the magnetic circuit components of the embodiments shown can also include a third magnetic conduction element (not shown in the figure) and a fourth magnetic conduction element (not shown in the figure). The bottom surface of the third magnetic conduction element is connected to the top surface of the first magnetic element 1401, and the top surface of the fourth magnetic conduction element is connected to the bottom surface of the first magnetic element 1401.

[0212] Figure 24 is a longitudinal sectional view of a magnetic circuit component according to some embodiments of the present application. As Figure 24 shown, the magnetic circuit component 2400 can include a first magnetic element 2401 and a first magnetic conduction element 2402. The first magnetic conduction element 2402 at least partially surrounds the first magnetic element 2401, and a magnetic gap is formed between the inner ring of the first magnetic conduction element 2402 and the first magnetic element 2401. The voice coil 124 of the speaker assembly 12 can be disposed in the magnetic gap.

[0213] In some embodiments, the magnetization direction of the first magnetic element 2401 is parallel to the top surface of the first magnetic element 2401 (i.e., the horizontal direction in the figure). For example, the magnetization direction of the first magnetic element 2401 can be the direction from its center to the outside.

[0214] In some alternative embodiments, the first magnetic element 2401 can include two magnets. The placement of the two magnets can include adjacent setting, and the same magnetic poles of the two are close, and the opposite magnetic poles are far away. For example, the N poles of the two magnets are close to each other (as shown in the figure, the magnetization directions of the left and right side magnets of the first magnetic element 2401 are opposite, and the magnetization directions of the two magnets can both point to the first magnetic conduction element 2402). For more descriptions about the first magnetic element 2401 and its magnetization direction, reference can be made to Figure 14 the detailed description of the first magnetic element 1401 in

[0215] It should be noted that, in this embodiment, the horizontal direction can be understood as the direction perpendicular to the direction of the voice coil vibration, that is, the direction parallel to the plane where the top surface of the first magnetic element 2401 is located.

[0216] By setting the magnetization direction of the first magnetic element 2401 to the horizontal direction, it can better make the magnetic field generated by the first magnetic element 2401 extend along the horizontal direction or close to the horizontal direction in the magnetic gap. In this way, the magnetic field direction at the voice coil position in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, improving the magnetic field uniformity and effectively improving the sound effect generated by the voice coil vibration. The connection method between the magnetic conduction element and the magnetic element can include one or more combinations of bonding, clamping, welding, riveting, bolt connection, etc.

[0217] In some embodiments, the first magnetic element 2401 can be a cylinder, a cuboid, a triangular prism, etc., and the first magnetic conduction element 2402 can be annular (continuous circular ring, discontinuous circular ring, rectangular ring, triangular ring, etc.). In some embodiments, the first magnetic element 2401 can be composed of two semi-cylinders, two cuboids or two magnets of other shapes spliced together, and the magnetization directions of the two magnets constituting the first magnetic element 2401 can be opposite. In some embodiments, the first magnetic element 2401 and the first magnetic conduction element 2402 can be the same in thickness.

[0218] Figure 25 is according to the present application Figure 24 Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, measure the magnetic field strength at each point in the Z-axis direction along the Figure 24 Z-axis direction shown. As Figure 25 shown, the magnetic field strength is smaller compared to the Figure 14 magnetic element 1400 in because there are no more magnetic elements provided, and the highest value of the magnetic field strength (for example, the highest value at -0.338 mm) is about 0.26 T, but the distribution of the magnetic field strength is relatively uniform, and the difference between the highest value and the lowest value of the magnetic field strength is relatively small.

[0219] Figure 26 is a longitudinal sectional view of the magnetic circuit assembly shown according to some embodiments of the present application. As Figure 26 shown, the magnetic circuit assembly 2600 can include a first magnetic element 2601, a first magnetic conduction element 2602, and a second magnetic conduction element 2603. The difference between this embodiment and the Figure 24 embodiment shown is that this embodiment further includes a second magnetic conduction element 2603, and the top surface of the second magnetic conduction element 2603 is connected to both the bottom surface of the first magnetic element 2601 and the bottom surface of the first magnetic conduction element 2602.

[0220] Figure 27is according to the present application Figure 26 Schematic diagram of the magnetic field strength variation of the magnetic circuit component shown. In the magnetic gap, along Figure 26 the Z-axis direction shown, the strength of the magnetic field at each point in the Z-axis direction is measured. As Figure 27 shown, the strength of the magnetic field is relatively uniform near the zero point of the Z-axis (for example, 0.312 mm), and since the second magnetic conduction element 2603 connects the first magnetic element 2601 and the first magnetic conduction element 2602, compared with Figure 24 the magnetic circuit component of

[0221] Figure 28 is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application. As Figure 28 shown, the magnetic circuit component 2800 may include a first magnetic element 2801, a first magnetic conduction element 2802, and a second magnetic conduction element 2803. Compared with the embodiment Figure 24 shown, the difference is that this embodiment further includes a second magnetic conduction element 2803, and the top surface of the second magnetic conduction element 2803 is connected to the bottom surface of the first magnetic element 2801. The difference between this embodiment and the embodiment Figure 26 shown is that the top surface of the second magnetic conduction element 2803 is only connected to the bottom surface of the first magnetic element 2801 and is not connected to the bottom surface of the first magnetic conduction element 2802.

[0222] In some embodiments, the first magnetic element 2801 and the second magnetic conduction element 2802 may be cylinders, cuboids, triangular prisms, etc., and the first magnetic element 2801 and the second magnetic conduction element 2802 may be the same in shape and size in the cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 2801 and the second magnetic conduction element 2803 may be equal to the thickness of the first magnetic conduction element 2802.

[0223] Figure 29 is according to the present application Figure 28 Schematic diagram of the magnetic field strength variation of the magnetic circuit component shown. In the magnetic gap, along Figure 28 the Z-axis direction shown, the strength of the magnetic field at each point in the Z-axis direction is measured. As Figure 29 shown, the strength of the magnetic field is very uniform near the zero point position (for example, within the range of -0.03 mm - 0.5 mm). And since the second magnetic conduction element 2803 is added, compared with Figure 24 the magnetic circuit component of Figure 26The magnetic circuit component has a reduced magnetic field strength near the zero point of the Z-axis (e.g., 0.49 mm).

[0224] Figure 30 is a schematic longitudinal cross-sectional view of a magnetic circuit component according to some embodiments of the present application. As Figure 30 shown, the magnetic circuit component 3000 may include a first magnetic element 3001, a first magnetic conduction element 3002, a second magnetic conduction element 3003, and a third magnetic conduction element 3004. Compared with the embodiment Figure 26 shown, the difference is that this embodiment further includes a third magnetic conduction element 3004, and the bottom surface of the third magnetic conduction element 3004 is connected to the top surface of the first magnetic element 3001.

[0225] In some embodiments, the first magnetic element 3001 and the third magnetic conduction element 3004 may be cylinders or cuboids, etc., and the first magnetic element 3001 and the third magnetic conduction element 3004 may have the same shape and size in the cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 3001 and the third magnetic conduction element 3004 may be equal to the thickness of the first magnetic conduction element 3002.

[0226] Figure 31 is a schematic diagram of the magnetic field strength change of a magnetic circuit component according to the present application Figure 38 shown. In the magnetic gap, the magnetic field strength at each point in the Z-axis direction is measured along the Figure 30 Z-axis direction shown. As Figure 31 shown, the magnetic field strength in the magnetic gap is relatively uniform near the zero point of the Z-axis (e.g., within the range of -0.095 - 0.106 mm), and due to the bottom surface of the third magnetic conduction element 3004 being connected to the top surface of the first magnetic element 3001, compared with the Figure 26 magnetic circuit component, the magnetic field strength near the zero point of the Z-axis (e.g., 0.081 mm) is reduced, approximately 0.28 T.

[0227] Figure 32 is a schematic longitudinal cross-sectional view of a magnetic circuit component according to some embodiments of the present application. As Figure 32 shown, the magnetic circuit component 3200 may include a first magnetic element 3201, a first magnetic conduction element 3202, a second magnetic conduction element 3203, and a third magnetic conduction element 3204. Compared with the embodiment Figure 28 shown, the difference is that this embodiment further includes a third magnetic conduction element 3204, and the bottom surface of the third magnetic conduction element 3204 is connected to the top surface of the first magnetic element 401.

[0228] In some embodiments, the first magnetic element 3201, the second magnetic conductive element 3203, and the third magnetic conductive element 3204 may be cylinders, cuboids, triangular prisms, etc. The first magnetic element, the second magnetic conductive element, and the third magnetic conductive element may have the same shape and size in the cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 3201, the second magnetic conductive element 3203, and the third magnetic conductive element 3204 may be equal to the thickness of the first magnetic conductive element 3201.

[0229] Figure 33 is according to the present application Figure 32 Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, along Figure 32 the Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As Figure 33 shown, the intensity of the magnetic field in the magnetic gap is relatively evenly distributed near the zero point of the Z-axis, and since the bottom surface of the third magnetic conductive element 3204 is connected to the top surface of the first magnetic element 401, compared to Figure 28 the magnetic circuit assembly of, the magnetic field intensity near the zero point of the Z-axis (e.g., 0.000 mm) is reduced, approximately 0.26 T.

[0230] It should be noted that in Figure 24 , Figure 26 , Figure 28 , Figure 30 , Figure 32 the embodiments shown, on the basis of setting the first magnetic element and the first magnetic conductive element, those skilled in the art can further determine the number, setting position, and setting form of the magnetic conductive elements according to needs, and the present application does not make further limitations in this regard. For example, Figure 32 the third magnetic conductive element 3204 of the magnetic circuit assembly in the embodiment shown can be connected to the first magnetic conductive element 3202.

[0231] Figure 34 is a longitudinal sectional view of the magnetic circuit assembly according to some embodiments of the present application. As Figure 34 shown, the magnetic circuit assembly 3400 may include a first magnetic element 3401, a second magnetic element 3402, and a first magnetic conductive element 3403. The first magnetic element 3401 at least partially surrounds the first magnetic conductive element 3403 (i.e., the inner surface or inner wall of the first magnetic element 3401 surrounds the outer surface or outer wall of the first magnetic conductive element 3403), the second magnetic element 3402 at least partially surrounds the first magnetic element 3401 (i.e., the inner surface or inner wall of the second magnetic element 3402 surrounds the outer surface or outer wall of the first magnetic element 3401), and a magnetic gap is formed between the inner rings of the first magnetic element 3401 and the second magnetic element 3402. The voice coil can be arranged in the magnetic gap.

[0232] The magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 are both parallel to the top surface of the first magnetic element 3401 and / or the second magnetic element 3402 (i.e., the horizontal direction in the figure) or perpendicular to the inner and outer surfaces, and the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 are parallel.

[0233] In some embodiments, the magnetization direction of the first magnetic element 3401 may be a direction from its center outward (i.e., from the center to the outside), and the magnetization direction of the second magnetic element 3402 is a direction from its inner side (the side close to the first magnetic element 3401) to the outside (the side far from the first magnetic element 3401). For another example, the magnetization direction of the first magnetic element 3401 may be a direction from the outside to the center, and the magnetization direction of the second magnetic element 3402 is a direction from its outside (the side far from the first magnetic element 3401) to its inner side (the side close to the first magnetic element 3401).

[0234] In some embodiments, the placement of the first magnetic element 3401 and the second magnetic element 3402 may include different magnetic poles of the first magnetic element 3401 and the second magnetic element 3402 approaching or separating from each other. For example, the N pole of the first magnetic element 3401 is located in the central region of the first magnetic element 3401, and the S pole is located in the outer region of the first magnetic element 3401. That is, inside the first magnetic element 3401, on the same plane parallel to the upper or lower surface of the first magnetic element 3401, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the center to the outside; the N pole of the second magnetic element 3402 is located in the outer region of the second magnetic element 3402, and the S pole is located in the inner region of the second magnetic element 3402. That is, inside the second magnetic element 3402, on the same plane parallel to the upper or lower surface of the second magnetic element 3402, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the inner side to the outside. For another example, the S pole of the first magnetic element 3401 is located in the central region of the first magnetic element 3401, and the N pole is located in the outer region of the first magnetic element 3401. That is, inside the first magnetic element 3401, on the same plane parallel to the upper or lower surface of the first magnetic element 3401, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the outside to the inside; the S pole of the second magnetic element 3402 is located in the outer region of the second magnetic element 3402, and the N pole is located in the inner region of the second magnetic element 3402. That is, inside the second magnetic element 3402, on the same plane parallel to the upper or lower surface of the second magnetic element 3402, the magnetic induction lines or the magnetic field direction (i.e., the direction from the S pole to the N pole) is from the outside to the inside.

[0235] In some alternative embodiments, the first magnetic element 3401 may include two or more magnets, and the magnetization directions of the two or more magnets may all point to the second magnetic element 3402 (as shown in the figure, the magnetization directions of the left and right magnets of the first magnetic element 3401 are opposite and point to the second magnetic element 3402 respectively).

[0236] In some embodiments, the second magnetic element 3402 may also include two or more magnets, and the magnetization directions of the two or more magnets all point from the inside to the outside of the second magnetic element 3402. In some other embodiments, the magnetization directions of each magnetic element may also be other directions, and the combination of magnetic elements with different magnetization directions can also achieve the effect of improving the magnetic field strength and / or making the magnetic field strength distribution more uniform.

[0237] It should be noted that in this embodiment, the horizontal direction can be understood as the direction perpendicular to the direction of the voice coil vibration, that is, the direction parallel to the plane where the top surface of the first magnetic element 3401 is located. In addition, the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 may be parallel or there may be a preset included angle. Among them, the preset included angle can be set within a certain angle range, for example, 60°, 80°, 90°, 100°, etc. The connection methods between the magnetic conductive element and the magnetic element may include one or more combinations of bonding, clamping, welding, riveting, bolt connection, etc. The relevant descriptions about the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 can be referred to Figure 6 the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in

[0238] In some embodiments, the magnetic circuit assembly may further include a second magnetic conductive element 3404 and a third magnetic conductive element 3405. The bottom surface of the second magnetic conductive element 3404 is connected to the top surface of the second magnetic element 3402, and the top surface of the third magnetic conductive element 3405 is connected to the bottom surface of the second magnetic element 3402. In some embodiments, the first magnetic conductive element 3403 may be a cylinder, a cuboid, a triangular prism, etc. The first magnetic element 3401, the second magnetic element 3402, the second magnetic conductive element 3404, and the third magnetic conductive element 3405 may be annular (continuous circular ring, discontinuous circular ring, rectangular ring, triangular ring, etc.). The second magnetic element 3402, the second magnetic conductive element 3404, and the third magnetic conductive element 3405 may have the same shape and size in the cross-section perpendicular to the Z-axis. In some embodiments, the first magnetic element 3401 and the first magnetic conductive element 3403 may have the same thickness. The sum of the thicknesses of the second magnetic element 3402, the second magnetic conductive element 3404, and the third magnetic conductive element 3405 may be equal to the thickness of the first magnetic element 3401 and may be equal to the thickness of the first magnetic conductive element 3403.

[0239] Figure 35 is according to the present application Figure 34 Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along Figure 34 the Z-axis direction shown, the magnetic field strength at each point in the Z-axis direction is measured. As Figure 35 shown, since the first magnetic conduction element 3405 reduces the magnetic leakage of the magnetic circuit component, compared with Figure 14 the magnetic circuit component of

[0240] Figure 36 is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application. As ​ shown, the magnetic circuit component 3600 may include a first magnetic element 3601, a second magnetic element 3602, a first magnetic conduction element 3603, a second magnetic conduction element 3604, and a third magnetic conduction element 3605. Compared with the embodiment ​ shown, the difference is that the top of the third magnetic conduction element 3605 in this embodiment is connected to the bottom surfaces of the first magnetic element 3601, the second magnetic element 3602, and the first magnetic conduction element 3603.

[0241] In some embodiments, the sum of the thicknesses of the second magnetic element 3602 and the second magnetic conduction element 3604 may be equal to the thickness of the first magnetic element 3601, and may be equal to the thickness of the first magnetic conduction element 3603.

[0242] ​ is according to the present application ​ Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along ​ the Z-axis direction shown, the magnetic field strength at each point in the Z-axis direction is measured. As ​ shown, the magnetic field strength is relatively uniform near the zero point of the Z-axis (within the range of -0.091 - 0.232 mm), and since the top of the third magnetic conduction element 3605 is connected to the bottom surfaces of the first magnetic element 3601, the second magnetic element 3602, and the first magnetic conduction element 3603, compared with ​ the magnetic circuit component of

[0243] ​ is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application. As ​ shown, the magnetic circuit component 3800 may include a first magnetic element 3801, a second magnetic element 3802, a first magnetic conduction element 3803, a second magnetic conduction element 3804, a third magnetic conduction element 3805, and a fourth magnetic conduction element 3806. This embodiment and ​Compared with the illustrated embodiment, the difference is that this embodiment further includes a fourth magnetic conductive element 3806, and the top surface of the fourth magnetic conductive element 3806 is connected to both the bottom surfaces of the first magnetic conductive element 3803 and the first magnetic element 3801. The third magnetic conductive element 3805 and the fourth magnetic conductive element 3806 are arranged at intervals at the magnetic gap.

[0244] In some embodiments, the outer contour shape and dimensions of the fourth magnetic conductive element 3806 and the outer ring of the first magnetic element 3801 in the cross-section perpendicular to the Z-axis can be the same. In some embodiments, the third magnetic conductive element 3805 and the fourth magnetic conductive element 3806 can have the same thickness, and the first magnetic conductive element 3803, the first magnetic element 3801, and the second magnetic element 3802 can have the same thickness.

[0245] ​ is according to the present application ​ Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, measure the intensity of the magnetic field at each point in the Z-axis direction along the ​ Z-axis direction shown. As ​ shown, the intensity of the magnetic field is relatively evenly distributed near the zero position of the Z-axis (for example, within the range of 0.227 - 0.5 mm), and due to the addition of the fourth magnetic conductive element 3806, compared with the ​ magnetic circuit assembly, the magnetic field intensity near the zero point of the Z-axis (for example, 0.109 mm) is increased, approximately 0.54 T.

[0246] ​ is a longitudinal sectional view of the magnetic circuit assembly shown according to some embodiments of the present application. As ​ shown, the magnetic circuit assembly 4000 can include a first magnetic element 4001, a second magnetic element 4002, a first magnetic conductive element 4003, a second magnetic conductive element 4004, a third magnetic conductive element 4005, and a fourth magnetic conductive element 4006. Compared with the ​ illustrated embodiment, the difference is that this embodiment further includes a fourth magnetic conductive element 4006, and the bottom surface of the fourth magnetic conductive element 4006 is connected to both the top surfaces of the first magnetic conductive element 4003 and the first magnetic element 4001.

[0247] In some embodiments, the first magnetic conductive element 4003, the third magnetic conductive element 4005, and the fourth magnetic conductive element 4006 can be cylinders, cuboids, triangular prisms, etc. The second magnetic conductive element 4004 can be annular (continuous circular ring, discontinuous circular ring, rectangular ring, triangular ring, etc.). The first magnetic element 4001, the second magnetic element 4002, and the first magnetic conductive element 4003 can have the same thickness, and the second magnetic conductive element 4004 and the fourth magnetic conductive element 4006 can have the same thickness.

[0248] ​ is according to the present application ​ Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along ​ the Z-axis direction shown, the strength of the magnetic field at each point in the Z-axis direction is measured. As ​ shown, the magnetic field is relatively symmetric about the zero position of the Z-axis, and due to the addition of the fourth magnetic conduction element 4006, compared with ​ the magnetic circuit component of, the magnetic field strength near the zero point of the Z-axis (for example, 0.312 mm) is reduced, about 0.52 T.

[0249] ​ is a schematic longitudinal sectional view of the magnetic circuit component shown according to some embodiments of the present application. As ​ shown, the magnetic circuit component 4200 may include a first magnetic element 4201, a second magnetic element 4202, a first magnetic conduction element 4203, a second magnetic conduction element 4204, a third magnetic conduction element 4205, a fourth magnetic conduction element 4206, and a fifth magnetic conduction element 4207. Compared with the embodiment shown in ​ , the difference is that this embodiment further includes a fifth magnetic conduction element 4207, and the bottom surface of the fifth magnetic conduction element 4207 is connected to both the top surface of the first magnetic conduction element 4203 and the first magnetic element 4201. The fifth magnetic conduction element 4207 and the second magnetic conduction element 4204 are spaced apart at the magnetic gap.

[0250] In some embodiments, the fourth magnetic conduction element 4206 and the fifth magnetic conduction element 4207 may be the same in terms of thickness and the shape and size of the cross-section perpendicular to the Z-axis. The fifth magnetic conduction element 4207 and the second magnetic conduction element 4204 may be the same in terms of thickness.

[0251] ​ is according to the present application ​ Schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, along ​ the Z-axis direction shown, the strength of the magnetic field at each point in the Z-axis direction is measured. As ​ shown, the strength distribution of the magnetic field is highly symmetric about the zero position of the Z-axis, and due to the addition of the fifth magnetic conduction element 4207, compared with the magnetic circuit component of ​ , the magnetic field strength near the zero point of the Z-axis (for example, 0.151 mm) is similar.

[0252] It should be noted that in ​ , ​ , ​ , ​ , ​In the illustrated embodiments, based on the provision of the first magnetic element, the second magnetic element, and the first magnetic conduction element, those skilled in the art can further determine the number, installation position, and installation form of the magnetic conduction elements as needed, and the present application does not further limit this. For example, ​ The fourth magnetic conduction element 4006 of the magnetic circuit assembly of the illustrated embodiment can be connected to the second magnetic conduction element 4004.

[0253] ​ is a longitudinal sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As ​ shown, the magnetic circuit assembly can include a first magnetic element 4401, a first magnetic conduction element 4402, and a second magnetic conduction element 4403. The first magnetic element 4401 at least partially surrounds the second magnetic conduction element 4403, the first magnetic conduction element 4402 surrounds the first magnetic element 4401, and a magnetic gap is formed between the first magnetic element 4401 and the first magnetic conduction element 4402. The voice coil of the speaker can be disposed in the magnetic gap.

[0254] In some embodiments, the magnetization direction of the first magnetic element 4401 is parallel to the top surface of the first magnetic element 4401 (i.e., the horizontal direction in the figure). In some embodiments, the magnetization direction of the first magnetic element 4401 points from the first magnetic element 4401 to the first magnetic conduction element 4402. In some embodiments, the magnetization direction of the first magnetic element 4401 points from the first magnetic element 4401 to the second magnetic conduction element 4403. For more descriptions about the first magnetic element 4401 and its magnetization direction, reference can be made to ​ the detailed description of the first magnetic element 1401 in

[0255] It should be noted that in this embodiment, the horizontal direction can be understood as the direction perpendicular to the vibration direction of the voice coil, that is, the direction parallel to the plane where the top surface of the first magnetic element 4401 is located. The connection manner between the magnetic conduction element and the magnetic element can include one or more combinations of bonding, clamping, welding, riveting, bolt connection, etc.

[0256] In some embodiments, the shape of the second magnetic conduction element 4403 can be a cylinder, a cuboid, or the like. In some embodiments, the first magnetic element 4401, the first magnetic conduction element 4402, and the second magnetic conduction element 4403 can have the same thickness.

[0257] ​ is according to the present application ​ shown magnetic field strength change schematic diagram of the magnetic circuit assembly. In ​ the shown magnetic gap, along ​ the shown Z-axis direction, the intensity of the magnetic field at each point in the Z-axis direction is measured. As ​As shown, the highest value of the magnetic field strength (e.g., the highest value at the zero point position) is approximately 0.3T. The magnetic field strength is very uniform along the Z-axis, and the magnetic field strength is highly symmetric at the zero point position of the Z-axis.

[0258] ​ is a schematic longitudinal sectional view of a magnetic circuit component shown according to some embodiments of the present application. As ​ shown, the magnetic circuit component 4600 may include a first magnetic element 4601, a first magnetic conduction element 4602, a second magnetic conduction element 4603, and a third magnetic conduction element 4604. Compared with the ​ embodiment shown, the difference is that this embodiment further includes a third magnetic conduction element 4604, and the top surface of the third magnetic conduction element 4604 is connected to the bottom surfaces of the first magnetic conduction element 4602, the second magnetic conduction element 4603, and the first magnetic element 4601.

[0259] ​ is according to some embodiments of the present application ​ schematic diagram of the magnetic field strength change of the magnetic circuit component shown. In the magnetic gap, the magnetic field strength at each point in the Z-axis direction is measured along the ​ Z-axis direction shown. As ​ shown, the magnetic field strength is relatively uniform along the Z-axis (e.g., in the range of -0.041 - 0.500 mm), and due to the addition of the third magnetic conduction element 4604, compared with the ​ magnetic circuit component, the magnetic field strength near the zero point of the Z-axis (e.g., 0.348 mm) is increased, approximately 0.43T.

[0260] ​ is a schematic longitudinal sectional view of a magnetic circuit component shown according to some embodiments of the present application. As ​ shown, the magnetic circuit component may include a first magnetic element 4801, a first magnetic conduction element 4802, a second magnetic conduction element 4803, and a third magnetic conduction element 4804. Compared with the ​ embodiment shown, the difference is that this embodiment further includes a third magnetic conduction element 4804, and the top surface of the third magnetic conduction element 4804 is connected to the bottom surface of the first magnetic element 4801 and the bottom surface of the second magnetic conduction element 4803. Compared with the ​ embodiment shown, the difference is that the top surface of the third magnetic conduction element 4804 in this embodiment is only connected to the bottom surface of the second magnetic conduction element 4803 and the bottom surface of the first magnetic element 4801, and is no longer connected to the bottom surface of the first magnetic conduction element 4802.

[0261] In some embodiments, the third magnetic conductive element 4804 can be a cylinder, a cuboid, a triangular prism, etc. The outer contour shape and size of the third magnetic conductive element 4804 and the outer ring of the first magnetic element 4801 in the cross-section perpendicular to the Z-axis can be the same. In some embodiments, the sum of the thicknesses of the first magnetic element 4801 and the third magnetic conductive element 4804 can be equal to the thickness of the first magnetic conductive element 4802.

[0262] ​ is according to the present application ​ Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, along ​ the Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As ​ shown, the intensity of the magnetic field is relatively uniform along the Z-axis as a whole, and due to the addition of the third magnetic conductive element 4804, compared with ​ the magnetic circuit assembly, the magnetic field strength near the zero point of the Z-axis (for example, -0.088 mm) is increased, approximately 0.34 T.

[0263] ​ is a schematic longitudinal sectional view of the magnetic circuit assembly according to some embodiments of the present application. As ​ shown, the magnetic circuit assembly 5000 can include a first magnetic element 5001, a first magnetic conductive element 5002, a second magnetic conductive element 5003, a third magnetic conductive element 5004, and a fourth magnetic conductive element 5005. Compared with the embodiment Figure 48 shown, the difference is that this embodiment further includes a fourth magnetic conductive element 5005, and the bottom surface of the fourth magnetic conductive element 5004 is connected to the top surface of the second magnetic conductive element 5003 and the top surface of the first magnetic element 5001.

[0264] In some embodiments, the fourth magnetic conductive element 5005 can be a cylinder or a cuboid, etc. The outer contour shape and size of the fourth magnetic conductive element 5005 and the outer ring of the first magnetic element 5001 in the cross-section perpendicular to the Z-axis can be the same. In some embodiments, the sum of the thicknesses of the fourth magnetic conductive element 5005 and the first magnetic element 5001 can be equal to the thickness of the first magnetic conductive element 5002 and equal to the thickness of the second magnetic conductive element 5003.

[0265] Figure 51 is according to the present application Figure 50 Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, along Figure 50 the Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As Figure 50 shown, the intensity of the magnetic field is very uniform along the Z-axis, and due to the addition of the fourth magnetic conductive element 5005, compared with Figure 48The magnetic circuit component reduces the magnetic field intensity near the zero point of the Z-axis (e.g., -0.194 mm), approximately 0.3 T.

[0266] Figure 52 is a longitudinal sectional schematic view of a magnetic circuit component shown in some embodiments of the present application. As Figure 52 shown, the magnetic circuit component 5200 may include a first magnetic element 5201, a first magnetic conduction element 5202, a second magnetic conduction element 5203, a third magnetic conduction element 5204, and a fourth magnetic conduction element 5205. Compared with the embodiment Figure 48 shown, the difference is that this embodiment further includes a fourth magnetic conduction element 5205, and the bottom surface of the fourth magnetic conduction element 5205 is connected to the top surface of the second magnetic conduction element 5203 and the top surface of the first magnetic element 5201.

[0267] In some embodiments, the fourth magnetic conduction element 5205 may be a cylinder, a cuboid, a triangular prism, etc., and the fourth magnetic conduction element 5205 and the third magnetic conduction element 5204 may have the same shape and size in the cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 5201, the third magnetic conduction element 5204, and the fourth magnetic conduction element 5205 may be equal to the thickness of the first magnetic conduction element 5202.

[0268] Figure 53 is according to the present application Figure 52 shown magnetic field intensity change schematic diagram of the magnetic circuit component. In the magnetic gap, the magnetic field intensity at each point in the Z-axis direction is measured along the Figure 52 shown Z-axis direction. As Figure 53 shown, compared with the magnetic circuit component of Figure 48 , the highest value of the magnetic field intensity (e.g., the highest value at the position of -0.011 mm) is similar, about 0.3 T, but the magnetic field intensity is very uniform along the entire Z-axis distribution.

[0269] It should be noted that in the embodiments shown in Figure 44 , Figure 46 , Figure 48 , Figure 50 , Figure 52 , on the basis of setting the first magnetic element, the first magnetic conduction element, and the second magnetic conduction element, those skilled in the art can further determine the number, setting position, and setting form of the magnetic conduction elements according to needs, and the present application does not make further limitations. For example, Figure 50 shown in the magnetic circuit component of the embodiment, the fourth magnetic conduction element 5005 can be connected to the second magnetic conduction element 5003.

[0270] Figure 54 is a longitudinal sectional schematic view of a magnetic circuit component shown in some embodiments of the present application. As Figure 54As shown, the magnetic circuit component 5400 may include a first magnetic element 5401, a second magnetic element 5402, a third magnetic element 5403, a fourth magnetic element 5404, a fifth magnetic element 5405, a sixth magnetic element 5406, and a first magnetic conductive element 5407. The first magnetic element 5401 at least partially surrounds the first magnetic conductive element 5407, and the second magnetic element 5402 surrounds the first magnetic element 5401. A magnetic gap is formed between the outer ring of the first magnetic element 5401 and the second magnetic element 5402 (e.g., between the inner rings). The voice coil of the speaker may be disposed in the magnetic gap.

[0271] In some embodiments, the bottom surface of the third magnetic element 5403 is connected to the top surface of the second magnetic element 5402, and the top surface of the fourth magnetic element 5404 is connected to the bottom surface of the second magnetic element 5402. The bottom surface of the fifth magnetic element 5405 is connected to both the top surface of the first magnetic element 5401 and the top surface of the first magnetic conductive element 5407, and the top surface of the sixth magnetic element 5406 is connected to both the bottom surface of the first magnetic element 5401 and the bottom surface of the first magnetic conductive element 5407. The third magnetic element 5403 and the fifth magnetic element 5405 are spaced apart at the magnetic gap, and the fourth magnetic element 5404 and the sixth magnetic element 5406 are spaced apart at the magnetic gap.

[0272] In some embodiments, the magnetization directions of both the first magnetic element 5401 and the second magnetic element 5402 are parallel to the top surface of the first magnetic element 5401 and / or the second magnetic element 5402 (i.e., the horizontal direction in the figure) or perpendicular to the inner and outer surfaces, and the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 are parallel to each other. For example, the magnetization direction of the first magnetic element 5401 is along the direction from its center to the outside (i.e., from the center to the outside), and the magnetization direction of the second magnetic element 5402 is along the direction from the inside (the side close to the first magnetic element 5401) to the outside (the side far from the first magnetic element 5401). Also for example, the magnetization direction of the first magnetic element 5401 may be the direction from the outside to the center, and the magnetization direction of the second magnetic element 5402 is along the direction from its outside (the side far from the first magnetic element 5401) to the inside (the side close to the first magnetic element 5401).

[0273] In some embodiments, the magnetization directions of both the third magnetic element 5403 and the fourth magnetic element 5404 are perpendicular to the surface where the second magnetic element 5402 is connected to the third magnetic element 5403 and / or the fourth magnetic element 5404 (i.e., the vertical direction in the figure, and the arrow direction on each magnetic element in the figure represents the magnetization direction of the magnetic element), and the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404 are opposite to each other.

[0274] In some embodiments, the magnetization directions of the fifth magnetic element 5405 and the sixth magnetic element 5406 are both perpendicular to the surface where the first magnetic element 5401 is connected to the fifth magnetic element 5405 or the sixth magnetic element 5406 (i.e., the vertical direction in the figure, and the arrow direction on each magnetic element in the figure represents the magnetization direction of that magnetic element), and the magnetization directions of the fifth magnetic element 5405 and the sixth magnetic element 5406 are opposite to each other.

[0275] In some embodiments, the placement of the third magnetic element 5403 and the fourth magnetic element 5404 may include the same magnetic poles of the third magnetic element 5403 and the fourth magnetic element 5404 being close to the second magnetic element 5402; and the different magnetic poles being far from the second magnetic element 5402. For example, the N pole of the third magnetic element 5403 is closer to the second magnetic element 5402 compared to the S pole of the third magnetic element 5403, and the N pole of the fourth magnetic element 5404 is closer to the second magnetic element 5402 compared to the S pole of the fourth magnetic element 5404. That is, inside the third magnetic element 5403 and within the third magnetic element 5403, the direction of magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) is towards the second magnetic element 5402. Another example is that the S pole of the third magnetic element 5403 is closer to the first magnetic conduction element 5407 compared to the N pole of the third magnetic element 5403, and the S pole of the fourth magnetic element 5404 is closer to the first magnetic conduction element 5407 compared to the N pole of the fourth magnetic element 5404. That is, inside the third magnetic element 5403 and the fourth magnetic element 5404, the direction of magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) is away from the second magnetic element 5402.

[0276] In some embodiments, the placement of the fifth magnetic element 5405 and the sixth magnetic element 5406 may include the same magnetic poles of the fifth magnetic element 5405 and the sixth magnetic element 5406 being close to the first magnetic conduction element 5407; and the different magnetic poles being far from the first magnetic conduction element 5407. For example, the N pole of the fifth magnetic element 5405 is closer to the first magnetic conduction element 5407 compared to the S pole of the fifth magnetic element 5405, and the N pole of the sixth magnetic element 5406 is closer to the first magnetic conduction element 5407 compared to the S pole of the sixth magnetic element 5406. That is, inside the fifth magnetic element 5405 and the sixth magnetic element 5406, the direction of magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) is towards the first magnetic conduction element 5407. Another example is that the S pole of the fifth magnetic element 5405 is closer to the first magnetic conduction element 5407 compared to the N pole of the fifth magnetic element 5405, and the S pole of the sixth magnetic element 5406 is closer to the first magnetic conduction element 5407 compared to the N pole of the sixth magnetic element 5406. That is, inside the fifth magnetic element 5405 and the sixth magnetic element 5406, the direction of magnetic induction lines or the magnetic field (i.e., the direction from the S pole to the N pole) is away from the first magnetic conduction element 5407.

[0277] By magnetizing the fifth magnetic element 5405 and the sixth magnetic element 5406 in an opposed manner, the magnetic induction lines generated by the fifth magnetic element 5405 and the sixth magnetic element 5406 can have substantially the same direction within the magnetic gap. For example, they can both point from the first magnetic conduction element 5407 to the second magnetic element 5402; or both point from the second magnetic element 5402 to the first magnetic conduction element 5407, thereby increasing the magnetic field strength within the magnetic gap. Additionally, by setting the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404, the fifth magnetic element 5405 and the sixth magnetic element 5406, and the third magnetic element 5403 and the fifth magnetic element 5405 to be vertical and in opposite directions, the magnetic field generated by the first magnetic element 5401 within the magnetic gap can be suppressed, causing the magnetic induction lines corresponding to the magnetic field to extend horizontally within the magnetic gap. For example, they extend from the end of the first magnetic element 5401 along a horizontal or nearly horizontal direction into the magnetic gap. In this way, the magnetic field direction at the voice coil position within the magnetic gap can be mainly distributed along the horizontal direction or nearly horizontal direction, improving the magnetic field uniformity and effectively enhancing the sound effect generated by the vibration of the voice coil. In some other embodiments, the magnetization directions of the respective magnetic elements can also be other directions, and combinations of magnetic elements with different magnetization directions can also achieve the effect of increasing the magnetic field strength and / or making the magnetic field strength distribution more uniform.

[0278] It should be noted that in this embodiment, the horizontal direction can be understood as the direction perpendicular to the vibration direction of the voice coil, that is, the direction parallel to the plane where the top surface of the first magnetic element 5401 is located, and the vertical direction can be understood as the vibration direction of the voice coil, that is, the direction perpendicular to the plane where the top surface of the first magnetic element 5401 is located.

[0279] In some embodiments, the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 can be parallel, and the magnetization directions of the third magnetic element 5403, the fourth magnetic element 5404, the fifth magnetic element 5405, and the sixth magnetic element 5406 can be parallel or have a preset included angle. For example, the included angle between the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 can be between 170° and 190°. The relevant description regarding the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 can refer to Figure 6 the description regarding the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in

[0280] The third magnetic element 5403, the fourth magnetic element 5404, the fifth magnetic element 5405, and the sixth magnetic element 5406 can form a magnetic shielding field, thereby increasing the magnetic field strength within the magnetic gap. The connection methods for connecting the magnetic elements to each other can include one or a combination of bonding, clamping, welding, riveting, bolt connection, etc.

[0281] In some embodiments, the first magnetic conductive element 5407, the fifth magnetic element 5405, and the sixth magnetic element 5406 can be a cylinder, a cuboid, a triangular prism, etc. The first magnetic element 5401, the second magnetic element 5402, the third magnetic element 5403, and the fourth magnetic element 5404 can be annular (continuously annular, discontinuously annular, rectangular annular, triangular annular, etc.).

[0282] In some embodiments, the second magnetic element 5402, the third magnetic element 5403, and the fourth magnetic element 5404 can be the same in terms of the shape and size of the cross-section perpendicular to the Z-axis. The outer rings of the first magnetic element 5401, the fifth magnetic element 5405, and the sixth magnetic element 5406 can be the same in terms of the outer contour shape and size of the cross-section perpendicular to the Z-axis. In some embodiments, the first magnetic conductive element 5407, the first magnetic element 5401, and the second magnetic element 5402 can be the same in thickness, the third magnetic element 5403 and the fifth magnetic element 5405 can be the same in thickness, and the fourth magnetic element 5404 and the sixth magnetic element 5406 can be the same in thickness.

[0283] Figure 55 is according to the present application Figure 54 Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, the magnetic field strength at each point in the Z-axis direction is measured along the Figure 55 Z-axis direction shown. As Figure 55 shown, due to the added magnetic elements forming a magnetic shielding field, the magnetic field strength is symmetric about the zero height of the Z-axis, and the magnetic field strength is relatively high.

[0284] Figure 56 is a schematic longitudinal sectional view of the magnetic circuit assembly according to some embodiments of the present application. As Figure 56 shown, the magnetic circuit assembly includes a first magnetic element 5601, a second magnetic element 5602, a third magnetic element 5603, a fourth magnetic element 5604, a fifth magnetic element 5605, a sixth magnetic element 5606, and a first magnetic conductive element 5607. This embodiment is the same as Figure 54Compared with the illustrated embodiment, the difference lies in that the size of the inner ring of the third magnetic element 5603 is smaller than that of the inner ring of the second magnetic element 5602, the size of the inner ring of the fourth magnetic element 5604 is smaller than that of the inner ring of the second magnetic element 5602, the size of the outer contour of the fifth magnetic element 5605 is larger than that of the outer ring of the first magnetic element 5601, and the size of the outer contour of the sixth magnetic element 5606 is larger than that of the outer ring of the first magnetic element 5601. With such an arrangement, the fifth magnetic element 5605 and the sixth magnetic element 5606 protrude towards the magnetic gap relative to the first magnetic element 5601, and the third magnetic element 5603 and the fourth magnetic element 5604 protrude towards the magnetic gap relative to the second magnetic element 5602.

[0285] Figure 57 is according to the present application Figure 56 Schematic diagram of the magnetic field strength change of the magnetic circuit assembly shown. In the magnetic gap, along Figure 56 the Z-axis direction shown, the intensity of the magnetic field at each point in the Z-axis direction is measured. As Figure 57 shown, due to the additional magnetic elements forming a magnetic shielding field, the intensity of the magnetic field is symmetric about the zero height of the Z-axis, and the overall intensity of the magnetic field is Figure 54 higher than that of the illustrated embodiment.

[0286] Figure 58 and Figure 59 are both cross-sectional schematic diagrams of a magnetic element structure according to some embodiments of the present application. The magnetic element can be applied to any magnetic circuit assembly composed of magnetic circuit elements and magnetic conductive elements in the present application.

[0287] As shown in the figure, the cross-section of the magnetic element located inside can be circular (e.g., Figure 58 magnetic element 661), oval, rectangular (e.g., Figure 59 magnetic element 681), triangular, any polygon, etc. The magnetic element surrounding the outside can be annular, such as circular (e.g., Figure 58 magnetic element 662), elliptical, rectangular (e.g., Figure 59 magnetic element 682), triangular, any polygon, etc.

[0288] A magnetic gap is formed between the magnetic element 661 and the magnetic element 662. The magnetic element can include an inner ring and an outer ring. In some embodiments, the shape of the inner ring and / or the outer ring can be circular, elliptical, triangular, quadrilateral or any other polygon. Additionally, Figure 6 , 8 , 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, the magnetic circuit assemblies in the illustrated embodiments can be arranged to be similar to Figure 58The structure shown; Figure 32 , 34 , the magnetic circuit components in the embodiments shown in 36, 38, 40, 42, 44, 46, 48, 50, 52, 54 can all be set to be similar to Figure 59 The structure shown.

[0289] In some embodiments, the magnetization direction of the magnetic element 661 can be radiating outward from the center, and the magnetization direction of the magnetic element 662 can be pointing from its inner side to the outer side. In some embodiments, the magnetic element 681 is composed of different magnets, and the magnetization direction of each magnet correspondingly points to one side of the magnetic element 682 opposite thereto.

[0290] Figure 60 is a schematic diagram of a magnetic element structure shown in some embodiments of the present application. The magnetic element can be applied to any magnetic circuit component composed of a magnetic circuit element and a magnetic conductive element in the present application. As shown in the figure, the magnetic element can be arranged and composed of a plurality of magnets. The two ends of any one of the magnets can be connected to the two ends of the adjacent magnets or there can be a certain spacing. The spacing between the plurality of magnets can be the same or different. In some embodiments, the magnetic element can be equidistantly arranged and composed of 2 or 3 sheet-shaped magnets (for example, magnets 671, 672, and 673). The shape of the sheet-shaped magnet can be fan-shaped, quadrilateral, etc.

[0291] Based on the foregoing various embodiments, in order to further increase the intensity of the magnetic field in the magnetic gap, the magnetic circuit component can further include other structural forms (such as Figure 61 and Figure 62 shown), so that the intensity of the magnetic field in the magnetic gap is greater. Those skilled in the art can combine the embodiments shown in Figure 61 and Figure 62 with the embodiments shown above, so that the intensity of the magnetic field in the magnetic gap is relatively large and the distribution is relatively uniform.

[0292] Figure 61 is a longitudinal sectional view of a magnetic circuit component shown in some embodiments of the present application. As Figure 61As shown, the magnetic circuit component 6100 may include a first magnetic element 6101, a first magnetic conductive element 6102, a second magnetic conductive element 6103, and a second magnetic element 6104. In some embodiments, the first magnetic element 6101 and / or the second magnetic element 6104 may include any one or several magnets described in this application. In some embodiments, the first magnetic element 6101 may include a first magnet, and the second magnetic element 6104 may include a second magnet, and the first magnet and the second magnet may be the same or different. The first magnetic conductive element 6102 and / or the second magnetic conductive element 6103 may include any one or several magnetic conductive materials described in this application. The processing method of the first magnetic conductive element 6102 and / or the second magnetic conductive element 6103 may include any one or several processing methods described in this application. In some embodiments, the first magnetic element 6101 and / or the first magnetic conductive element 6102 may be set as an axisymmetric structure. For example, the first magnetic element 6101 and / or the first magnetic conductive element 6102 may be a cylinder, a cuboid, or a hollow ring (for example, the cross-section is in the shape of a runway).

[0293] In some embodiments, the first magnetic element 6101 and the first magnetic conductive element 6102 may be coaxial cylinders with the same or different diameters. In some embodiments, the second magnetic conductive element 6103 may be a groove-type structure. The groove-type structure may include a U-shaped cross-section (as Figure 61 shown). The groove-type second magnetic conductive element 6103 may include a bottom plate and side walls. In some embodiments, the bottom plate and the side walls may be integrally formed. For example, the side walls may be formed by extending the bottom plate in a direction perpendicular to the bottom plate.

[0294] In some embodiments, the bottom plate may be connected to the side walls by any one or several connection methods described in this application. The second magnetic element 6104 may be set as a ring or a sheet. For the shape of the second magnetic element 6104, reference may be made to the description in other parts of the specification. In some embodiments, the second magnetic element 694 may be coaxial with the first magnetic element 6101 and / or the first magnetic conductive element 6102.

[0295] The upper surface of the first magnetic element 6101 may be connected to the lower surface of the first magnetic conductive element 6102. The lower surface of the first magnetic element 6101 may be connected to the bottom plate of the second magnetic conductive element 6103. The lower surface of the second magnetic element 6104 is connected to the side walls of the second magnetic conductive element 6103. The connection methods between the first magnetic element 6101, the first magnetic conductive element 6102, the second magnetic conductive element 6103, and / or the second magnetic element 6104 may include one or more combinations of bonding, clamping, welding, riveting, bolt connection, etc.

[0296] A magnetic gap is formed between the first magnetic element 6101 and / or the first magnetic conductive element 6102 and the inner ring of the second magnetic element 6104. The voice coil 6105 can be disposed in the magnetic gap. In some embodiments, the second magnetic element 6104 and the voice coil 6105 have the same height relative to the bottom plate of the second magnetic conductive element 6103. In some embodiments, the first magnetic element 6101, the first magnetic conductive element 6102, the second magnetic conductive element 6103, and the second magnetic element 6104 can form a magnetic circuit.

[0297] In some embodiments, the magnetic circuit assembly can generate a total magnetic field (which can also be referred to as "the total magnetic field of the magnetic circuit assembly"), and the first magnetic element 6101 can generate a first magnetic field. The total magnetic field is jointly formed by the magnetic fields generated by all components in the magnetic circuit assembly (for example, the first magnetic element 6101, the first magnetic conductive element 6102, the second magnetic conductive element 6103, and the second magnetic element 6104). The magnetic field intensity (which can also be referred to as magnetic induction intensity or magnetic flux density) of the total magnetic field in the magnetic gap is greater than the magnetic field intensity of the first magnetic field in the magnetic gap. In some embodiments, the second magnetic element 6104 can generate a second magnetic field, and the second magnetic field can increase the magnetic field intensity of the total magnetic field at the magnetic gap. The statement that the second magnetic field increases the magnetic field intensity of the total magnetic field means that the magnetic field intensity of the total magnetic field in the magnetic gap when the second magnetic field exists (i.e., when the second magnetic element exists) is greater than the magnetic field intensity of the total magnetic field in the magnetic gap when the second magnetic field does not exist (i.e., when the second magnetic element does not exist).

[0298] In other embodiments of this specification, unless otherwise specified, the magnetic circuit assembly refers to a structure including all magnetic elements and magnetic conductive elements, the total magnetic field refers to the magnetic field generated by the entire magnetic circuit assembly, and the first magnetic field, the second magnetic field, the third magnetic field,..., the Nth magnetic field respectively refer to the magnetic fields generated by the corresponding magnetic elements. In different embodiments, the magnetic elements generating the second magnetic field (or the third magnetic field,..., the Nth magnetic field) can be the same or different.

[0299] In some embodiments, the included angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is between 45 degrees and 145 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 6101 is perpendicular to the lower or upper surface of the first magnetic element 6101 and vertically upward (in the direction shown as a in the figure), and the magnetization direction of the second magnetic element 6104 points from the inner ring (inner surface) to the outer ring (outer surface) of the second magnetic element 6104 (in the direction shown as b in the figure, on the right side of the first magnetic element, the magnetization direction of the first magnetic element deflects 90 degrees in the clockwise direction).

[0300] In some embodiments, at the position of the second magnetic element 6104, the included angle between the direction of the total magnetic field and the magnetization direction of the second magnetic element 6104 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 6104, the included angle between the direction of the magnetic field generated by the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 can be an included angle less than or equal to 90 degrees such as 0 degree, 10 degrees, 20 degrees, etc. Compared with the magnetic circuit component of a single magnetic element, the second magnetic element 6104 can increase Figure 60 the total magnetic flux in the magnetic gap in the magnetic circuit component, thereby increasing the magnetic induction intensity in the magnetic gap. Moreover, under the action of the second magnetic element 6104, the originally divergent magnetic induction lines will converge towards the position where the magnetic gap is located, further increasing the magnetic induction intensity in the magnetic gap.

[0301] The above description of the structure of the magnetic circuit component is only a specific example and should not be regarded as the only feasible implementation scheme. Obviously, for professionals in the field, after understanding the basic principle of the magnetic circuit component, various modifications and changes in form and details may be made to the specific ways and steps of implementing the magnetic circuit component without departing from this principle, but these modifications and changes are still within the scope described above. For example, the second magnetic guiding element 6103 can be an annular structure or a sheet structure. Another example is Figure 61 the magnetic circuit component can further include a magnetic guiding cover, and the magnetic guiding cover can surround the first magnetic element 6101, the first magnetic guiding element 6102, the second magnetic guiding element 6103, and the second magnetic element 6104.

[0302] Figure 62 is a schematic longitudinal sectional view of a magnetic circuit component according to some embodiments of the present application. As shown in the figure, compared with Figure 61Different from the magnetic circuit component, the magnetic circuit component may further include a third magnetic element. The upper surface of the third magnetic element 6205 is connected to the second magnetic element 6204, and the lower surface is connected to the side wall of the second magnetic conductive element 6203. A magnetic gap may be formed between the first magnetic element 6201, the first magnetic conductive element 6202, the second magnetic element 6204, and / or the third magnetic element 6205. The voice coil 6209 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 6201, the first magnetic conductive element 6202, the second magnetic conductive element 6203, the second magnetic element 6204, and the third magnetic element 6205 may form a magnetic circuit. In some embodiments, the magnetization direction of the second magnetic element 6204 may refer to the detailed description of the present application Figure 52 of this application.

[0303] In some embodiments, the magnetic circuit component may generate a first total magnetic field, and the first magnetic element 701 may generate a second magnetic field. The magnetic field strength of the first total magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the third magnetic element 6205 may generate a third magnetic field, and the third magnetic field may increase the magnetic field strength of the second magnetic field at the magnetic gap.

[0304] In some embodiments, the included angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is between 45 degrees and 145 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 6201 is perpendicular to the lower surface or the upper surface of the first magnetic element 6201 and is vertically upward (as shown by the direction a in the figure), and the magnetization direction of the third magnetic element 6205 points from the upper surface to the lower surface of the third magnetic element 6205 (as shown by the direction c in the figure, on the right side of the first magnetic element, the magnetization direction of the first magnetic element deflects 180 degrees along the clockwise direction).

[0305] In some embodiments, at the position of the third magnetic element 6205, the included angle between the direction of the total magnetic field and the magnetization direction of the third magnetic element 6205 is not higher than 90 degrees. In some embodiments, at the position of the third magnetic element 6205, the included angle between the direction of the magnetic field generated by the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 may be an included angle less than or equal to 90 degrees such as 0 degrees, 10 degrees, 20 degrees, etc.

[0306] Compared with Figure 61 the magnetic circuit component of Figure 62The magnetic circuit component further adds a third magnetic element 6205. The third magnetic element 6205 can further increase the total magnetic flux in the magnetic gap of the magnetic circuit component, thereby increasing the magnetic induction intensity in the magnetic gap. Moreover, under the action of the third magnetic element 6205, the magnetic induction lines will further converge towards the position where the magnetic gap is located, further increasing the magnetic induction intensity in the magnetic gap.

[0307] The above description of the structure of the magnetic circuit component is only a specific example and should not be regarded as the only feasible implementation. Obviously, for professionals in this field, after understanding the basic principle of the magnetic circuit component, various modifications and changes in form and details may be made to the specific implementation methods and steps of the magnetic circuit component without departing from this principle, but these modifications and changes are still within the scope described above. For example, the second magnetic conductive element can be an annular structure or a sheet-like structure. Another example is that the magnetic circuit component may not include the second magnetic conductive element. Another example is that the magnetic circuit component can further add at least one magnetic element. In some embodiments, the lower surface of the further added magnetic element can be connected to the upper surface of the second magnetic element. The magnetization direction of the further added magnetic element is opposite to that of the third magnetic element. In some embodiments, the further added magnetic element can be connected to the side walls of the first magnetic element and the second magnetic conductive element. The magnetization direction of the further added magnetic element is opposite to that of the second magnetic element. Regarding other magnetic circuit structures that can increase the magnetic field intensity in the magnetic gap, reference can be made to the PCT application with the application number PCT / CN2018 / 071851 filed on January 8, 2018, the entire content of which is incorporated into this application by reference and will not be elaborated here.

[0308] Figure 63 is a longitudinal cross-sectional schematic diagram of the magnetic circuit component shown in some embodiments of this specification. In some embodiments, as Figure 63As shown, the magnetic circuit component 6300 may include a first magnetic element 6301, a second magnetic element 6302, a first magnetic conductive element 6303, a second magnetic conductive element 6304, and a third magnetic conductive element 6305. The second magnetic element 6302 surrounds the first magnetic element 6301, and a magnetic gap is formed between the first magnetic element 6301 and the second magnetic element 6302. The voice coil of the speaker may be disposed in the magnetic gap. The bottom surface of the first magnetic conductive element 6303 is connected to the top surface of the second magnetic element 6302, the bottom surface of the second magnetic conductive element 6304 is connected to the top surface of the first magnetic element 6301, and the top surface of the third magnetic conductive element 6305 is connected to the top surfaces of the first magnetic element 6301 and the second magnetic element 6302. The magnetization directions of the first magnetic element 6301 and the second magnetic element 6302 are both along the vertical direction, and the magnetization direction of the first magnetic element 6301 is opposite to that of the second magnetic element 6302. In some embodiments, the N pole of the first magnetic element 6301 points to the second magnetic conductive element 6304 (i.e., Figure 63 the upward direction in Figure 63 ), and the N pole of the second magnetic element 6302 points to the third magnetic conductive element 6305 (i.e.,

[0309] Figure 64 is a schematic diagram comparing the frequency response curves of speakers respectively using Figure 63 and Figure 56 shown magnetic circuit components according to the present application. As Figure 64 shown, compared with the speaker using the magnetic circuit component shown in Figure 56 (which may also be called "ultra-linear magnetic circuit") and the speaker using the magnetic circuit component shown in Figure 63 (which may also be called "conventional magnetic circuit"), the speaker using the magnetic circuit component shown in Figure 63 has higher volume in each frequency band of the sound, and the changes in the low-frequency and high-frequency ranges are more gentle, the overall frequency response is more linear, and the sound quality is better.

[0310] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only an example and does not constitute a limitation to the present application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to the present application. Such modifications, improvements, and corrections are proposed in the present application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of the present application.

[0311] In the meantime, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be combined appropriately.

[0312] In addition, those skilled in the art can understand that various aspects of this application can be illustrated and described by several patentable types or situations, including any new and useful process, machine, product, or combination of substances, or any new and useful improvement to them. Accordingly, various aspects of this application can be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above-mentioned hardware or software can all be referred to as "data block", "module", "engine", "unit", "component", or "system". In addition, various aspects of this application may be manifested as a computer product located in one or more computer-readable media, and this product includes computer-readable program codes.

[0313] In addition, unless clearly stated in the claims, the order of the processing elements and sequences, the use of numerical letters, or the use of other names in this application is not used to limit the order of the processes and methods of this application. Although some currently considered useful invention embodiments are discussed through various examples in the above disclosure, it should be understood that such details only serve the purpose of illustration. The appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that conform to the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only through software solutions, such as installing the described system on existing servers or mobile devices.

[0314] Similarly, it should be noted that, in order to simplify the expression of the disclosure of this application and thus help the understanding of one or more invention embodiments, in the previous description of the embodiments of this application, sometimes multiple features are merged into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0315] In some embodiments, numbers are used to describe components and the quantity of attributes. It should be understood that such numbers used in the description of embodiments are modified by modifiers such as "about", "approximate" or "substantially" in some examples. Unless otherwise specified, "about", "approximate" or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximate values, and such approximate values may vary according to the characteristics required by individual embodiments. In some embodiments, the numerical data should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and data used to confirm the breadth of their scope in some embodiments of the present application are approximate values, in specific embodiments, such numerical settings are as precise as possible within the feasible range.

[0316] Finally, it should be understood that the embodiments described in the present application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. An acoustic device, characterized in that: include: A housing having a first accommodating cavity; A loudspeaker is arranged in the first accommodating cavity, and the loudspeaker includes: a magnetic circuit component, a voice coil, a vibration component and a vibration plate; the vibration component includes an inner bracket, an outer bracket and a vibration plate; the magnetic circuit component forms a magnetic gap; one end of the voice coil is arranged in the magnetic gap, the other end of the voice coil is connected to the inner bracket, one end of the outer bracket is physically connected to the two sides of the magnetic circuit component, and the vibration plate is physically connected to the inner bracket and the outer bracket to limit the relative movement of the inner bracket and the outer bracket in a first direction; the first direction is the radial direction of the accommodating cavity, and at least one of the inner bracket, the outer bracket and the vibration plate is connected to the vibration plate so that the vibration is transmitted to the vibration plate, and the vibration plate is connected to the shell.

2. The acoustic device according to claim 1, characterized in that: The outer bracket and the inner bracket can be movably connected to the vibration plate to limit the relative movement of the outer bracket and the inner bracket along the first direction, while allowing the inner bracket and the vibration plate to move relative to the outer bracket in a second direction; the second direction is the extension direction of the inner bracket and the outer bracket.

3. The acoustic device according to claim 2, characterized in that: A first convex column is disposed at the other end of the outer bracket, a first through hole is formed in the vibration plate, and the first convex column is movably connected to the vibration plate through the first through hole.

4. The acoustic device according to claim 2, characterized in that: A second convex column is disposed at one end of the inner bracket, a second through hole is formed in the vibration plate, and the second convex column is movably connected to the vibration plate through the second through hole.

5. The acoustic device according to claim 4, characterized in that: The speaker further comprises an elastic shock absorbing sheet, which is arranged between the vibration transmission plate and one end of the inner bracket to reduce the vibration of the inner bracket in the second direction.

6. The acoustic device according to claim 5, characterized in that: The second convex column includes a first column segment and a second column segment that are physically connected, and the second column segment is arranged above the first column segment; the first column segment is inserted into the second through hole, and the second column segment is inserted into the vibration transmission plate; The elastic shock absorbing sheet is provided with a third through hole, and the elastic shock absorbing sheet is sleeved on the second column segment through the third through hole and supported on the first column segment.

7. The acoustic device according to claim 1, wherein: Also included are protective elements; The protective element comprises a fitting portion, a receiving portion and a supporting portion, wherein the fitting portion and the receiving portion form a second receiving cavity; The vibration transmission plate is arranged in the second accommodating cavity, the fitting portion is fitted with the outer end surface of the vibration transmission plate, and the supporting portion is connected to the accommodating portion and is arranged above the shell.

8. The acoustic device according to claim 7, characterized in that: The speaker also includes an elastic shock absorbing plate, which is arranged between the vibration transmission plate and one end of the inner bracket. The inner wall of the shell is provided with an annular support for supporting the support part and the elastic shock absorbing plate.

9. The acoustic device according to claim 1, wherein: The magnetic circuit assembly includes a magnetic element group and a magnetic shield; The magnetic shield includes a bottom of the shield body, a side portion of the shield body, and a cylindrical groove, and the bottom of the shield body and the side portion of the shield body form the cylindrical groove; The magnetic element group is disposed in the cylindrical groove, and a magnetic gap is formed between the magnetic element group and the magnetic shield.

10. The acoustic device according to claim 9, wherein: It further includes a fixing member for fixing the magnetic element group to the bottom of the shield body; The fixing member includes a bolt and a nut. The bolt passes through the magnetic element group in sequence and then passes through the bottom of the shield body to fixedly connect the magnetic element group and the bottom of the shield body through threaded connection.

11. The acoustic device according to claim 10, wherein: The inner bracket forms a cover groove, a part of the magnetic element group extends into the cover groove, and the outer bracket is arranged in a cylindrical shape.

12. The acoustic device according to claim 1, wherein: The magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly. The second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap; The first magnetic circuit assembly includes a first magnetic element and a second magnetic element. The magnetic field strength of the total magnetic field generated by the magnetic circuit assembly in the magnetic gap is greater than the magnetic field strength of the first magnetic element or the second magnetic element in the magnetic gap.

13. The acoustic device according to claim 12, characterized in that: The included angle between the magnetization directions of the first magnetic element and the second magnetic element is between 150 - 180 degrees.

14. The acoustic device according to claim 12, wherein: The magnetization directions of the first magnetic element and the second magnetic element are opposite.

15. The acoustic device according to claim 14, wherein: The magnetization directions of the first magnetic element and the second magnetic element are both perpendicular to or parallel to the vibration direction of the voice coil in the magnetic gap.

16. The acoustic device according to claim 12, wherein: The second magnetic circuit assembly includes a third magnetic element, and the first magnetic circuit assembly includes a first magnetic conductive element; The first magnetic conductive element is disposed between the first magnetic element and the second magnetic element, and the third magnetic element at least partially surrounds the first magnetic element and the second magnetic element.

17. The acoustic device according to claim 16, characterized in that: The magnetization directions of the first magnetic element and the second magnetic element are both perpendicular to the surface where the first magnetic element is connected to the first magnetic conductive element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite.

18. The acoustic device according to claim 16, characterized in that: The included angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the second magnetic element is between 60 - 120 degrees.

19. The acoustic device according to claim 16, wherein: The included angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the second magnetic element is between 0 - 30 degrees.

20. The acoustic device according to claim 12, wherein: The second magnetic circuit assembly includes a first magnetic conductive element and the first magnetic circuit assembly includes a second magnetic conductive element; The second magnetic conductive element is disposed between the first magnetic element and the second magnetic element; the first magnetic conductive element at least partially surrounds the first magnetic element and the second magnetic element.

21. The acoustic device according to claim 20, characterized in that: The magnetization directions of the first magnetic element and the second magnetic element are both perpendicular to the surface where the first magnetic element is connected to the second magnetic conductive element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite to each other.

22. The acoustic device according to claim 20, characterized in that: The second magnetic conductive element is arranged to surround the first magnetic element, and the first magnetic element is surrounded between the second magnetic elements.

23. The acoustic device according to claim 20, characterized in that: The upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element.

24. The acoustic device according to claim 1, wherein: The magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap; The first magnetic circuit assembly includes a first magnetic element and the second magnetic circuit assembly includes a first magnetic conductive element; The first magnetic conductive element at least partially surrounds the first magnetic element; The magnetization direction of the first magnetic element points from the central region of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the first magnetic element.

25. The acoustic device according to claim 1, wherein: The magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap; The first magnetic circuit assembly includes a first magnetic element and the second magnetic circuit assembly includes a second magnetic element; The second magnetic element at least partially surrounds the first magnetic element; The magnetization direction of the first magnetic element points from the central region of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the first magnetic element.

26. The acoustic device according to claim 25, wherein: The magnetization direction of the second magnetic element points from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the inner ring of the second magnetic element.

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