Position error compensation of discrete component assembly using adjustment of optical system characteristics

Abstract

A method includes: determining an alignment error between discrete components of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including discrete components attached to a support via a dynamic release layer; determining beam offset characteristics based on the alignment error; and providing a signal indicating the beam offset characteristics to an optical element of the laser-assisted transfer system, the optical element being configured to adjust the position of a beam pattern relative to the discrete components according to the beam offset characteristics.

Description

[0001] Priority requirements

[0002] This application claims priority to U.S. Patent Application 62 / 859,830, filed June 11, 2019, the entire contents of which are incorporated herein by reference. Background Technology

[0003] This invention typically relates to assembling discrete components on a substrate. Summary of the Invention

[0004] In one aspect, an assembly includes: a substrate; a coating including Bingham fluid disposed on a surface of the substrate; and discrete components partially embedded in or disposed on the coating including the Bingham fluid.

[0005] An embodiment may include any one or more of the following features.

[0006] Bingham fluids include one or more of flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert materials.

[0007] Discrete components include light-emitting diodes (LEDs).

[0008] The substrate includes a semiconductor wafer. The substrate includes a strip. The substrate includes a rigid substrate. The substrate includes a printed circuit board.

[0009] In one aspect, an assembly includes a substrate; and a coating comprising Bingham fluid disposed on the substrate, a first surface of the coating contacting the substrate, wherein the coating is configured such that when a discrete component is incident on a second surface of the coating opposite to the first surface, the discrete component is disposed on or partially embedded in the coating.

[0010] An embodiment may include any one or more of the following features.

[0011] Bingham fluids include one or more of fluxes, solder pastes, conductive inks, semiconductive inks, gels, and chemically inert materials. Bingham fluids include conductive pastes.

[0012] The substrate includes a printed circuit board.

[0013] In one aspect, a method includes: irradiating a dynamically released structure disposed on a carrier, wherein a discrete component is attached to the dynamically released structure, the irradiation causing the discrete component to be released from the carrier; and accommodating the released discrete component in or on a coating disposed on a surface of a substrate, the coating comprising Bingham fluid.

[0014] An embodiment may include any one or more of the following features.

[0015] Irradiating the dynamic release layer involves using laser energy to irradiate the dynamic release layer.

[0016] Irradiation causes erosion of at least a portion of the dynamically released layer.

[0017] This method involves reducing the adhesion of the dynamically released layer before irradiation.

[0018] Irradiation of the dynamic release layer includes irradiation of the dynamic release layer by a carrier.

[0019] Discrete components include LEDs.

[0020] The second substrate includes a strip. The second substrate includes a printed circuit board.

[0021] In one aspect, a method includes: forming a coating on the surface of a target substrate, the coating comprising Bingham fluid; and accommodating a discrete component in or on the coating, the discrete component having been transferred from a carrier by a laser-assisted transfer process.

[0022] In an embodiment, forming a coating including Bingham fluid involves distributing one or more of a flux, solder paste, conductive ink, semiconductive ink, gel, and chemically inert material on the surface of a target substrate.

[0023] In one aspect, a method includes: determining an alignment error between discrete components of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including the discrete components attached to a support via a dynamic release layer; determining beam offset characteristics based on the alignment error; and providing a signal indicative of the beam offset characteristics to an optical element of the laser-assisted transfer system, the optical element being configured to adjust the position of a beam pattern relative to the discrete components according to the beam offset characteristics.

[0024] An embodiment may include any one or more of the following features.

[0025] The method includes adjusting the position of the beam pattern relative to the discrete component using the optical element based on the beam offset characteristics. The method also includes using a galvanometer-type laser scanner to adjust the position of the beam pattern.

[0026] Determining the alignment error includes determining one or more of the magnitude and direction of the alignment error.

[0027] Determining the beam offset characteristics includes: determining the offset between the center of the discrete component and the offset position of the discrete component. Determining the offset includes: determining one or more of the magnitude and direction of the offset between the center of the discrete component and the offset position of the discrete component.

[0028] The method includes: determining beam offset characteristics to at least partially compensate for the alignment error. The method further includes: determining beam offset characteristics such that, when the beam pattern is incident on the discrete component assembly according to the beam offset characteristics, the discrete component is transferred to the target position on the substrate.

[0029] The method includes using a machine vision system to determine the alignment error.

[0030] The method includes: irradiating the dynamic release layer with a light beam, adjusting the position of the light beam pattern relative to the discrete component according to the light beam offset characteristics, and the irradiation causing the discrete component to release from the carrier substrate.

[0031] The method includes: accommodating the discrete component at the target location on the target substrate.

[0032] In one aspect, a system includes: a computing system including one or more processors coupled to a memory, and said one or more processors being configured to: determine an alignment error between discrete components of a discrete component assembly and a target position on a target substrate, said discrete component assembly including said discrete components attached to a support via a dynamic release layer, said discrete component assembly being mounted in a laser-assisted transfer system; determine beam offset characteristics based on said alignment error; and provide an optical element of the laser-assisted transfer system with a signal indicating said beam offset characteristics, said optical element being configured to adjust the position of a beam pattern relative to said discrete components according to said beam offset characteristics.

[0033] An embodiment may include any one or more of the following features.

[0034] The system includes the optical element. The optical element includes a galvanometer-type laser scanner.

[0035] Determining the beam offset characteristics includes: determining the offset between the center of the discrete component and the offset position of the discrete component. Determining the offset includes: determining one or more of the magnitude and direction of the offset between the center of the discrete component and the offset position of the discrete component.

[0036] The one or more processors and memory are configured to determine beam offset characteristics to at least partially compensate for the alignment error. The one or more processors and memory are configured to determine beam offset characteristics such that, when the beam pattern is incident on the discrete component assembly according to the beam offset characteristics, the discrete component is transferred to the target position on the substrate.

[0037] The machine vision system is implemented using one or more processors and memories. Attached Figure Description

[0038] Figure 1A and 1B This is a diagram of laser-assisted transfer processing.

[0039] Figures 2A to 2C This is a diagram of laser-assisted transfer processing.

[0040] Figure 3 This is a diagram of a system used for laser-assisted transfer.

[0041] Figure 4 It is a diagram of discrete components and the target substrate.

[0042] Figures 5A to 5C This is a diagram of laser-assisted transfer processing. Detailed Implementation

[0043] We describe here a method for addressing positional errors in laser-assisted processing for transferring discrete components from a support to a target substrate. In some examples, the beam pattern incident on the discrete component assembly may be offset relative to the discrete component to be transferred to the target substrate. This beam pattern offset can cause placement errors when the discrete component is transferred to the target substrate. The beam pattern offset can be adjusted so that the placement error compensates for alignment errors between the target substrate and the discrete component assembly, thereby improving the accuracy of the laser-assisted transfer processing. The beam pattern offset can be achieved using optical elements, providing rapid adjustment and enabling high-throughput transfer.

[0044] Figure 1AA laser-assisted transfer process is described for high-throughput, low-cost, contactless assembly of discrete components 102 onto a substrate 130. The term "discrete component" generally refers to any unit to be part of a product or electronic device, such as an electronic, electromechanical, photovoltaic, photonic, or optoelectronic component, module, or system, such as any semiconductor material on which a circuit is formed. In some examples, a discrete component may be a light-emitting diode (LED). Discrete components can be ultra-thin, meaning having a maximum thickness of 100 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. Discrete components can be ultra-small, meaning having a maximum length or width dimension less than or equal to 300 μm / side, 100 μm / side, 50 μm / side, 20 μm / side, or 10 μm / side. Discrete components can be both ultra-thin and ultra-small.

[0045] In laser-assisted transfer processing, a discrete component assembly 108 is positioned within a component transfer system 100. The discrete component assembly 108 includes a support member 110, on the front side of which a dynamic release structure 112 is disposed. The discrete component 102 is attached to the support member 110 via the dynamic release structure 112. The support member 110 can be a rigid support member such as glass or a rigid polymer substrate, or a flexible support member such as a strip. The dynamic release structure 112 can be a single-layer structure or a multi-layer structure such as having two, three, four, or more than four layers.

[0046] In laser-assisted transfer processing, radiation such as a laser (e.g., beam pattern 116) is used to irradiate the back surface of the support 110. The beam pattern 116 can be a single beam (as shown) or a pattern of multiple beams, for example, from a single light source or multiple light sources. The support 110 is transmissive to the wavelength of the radiation (e.g., laser energy). An element transmissive to a given wavelength is an element to which at least some of the radiation of that given wavelength passes. The radiation passes through the support 110 and is incident on a region of the dynamic release structure 112, thereby abrading at least a portion of the thickness of the dynamic release layer in the region where the laser beam pattern 116 is incident (referred to as the irradiation region). Abrasion generates an expanding, enclosed gas, thereby generating stress in the dynamic release structure 112. The stress deforms at least a portion of the material of the dynamic release structure 112, thereby forming one or more bubbles 118. For example, a single bubble 118 is formed when the beam pattern 116 is a pattern of a single beam or multiple closely spaced beams. When the beam pattern 116 comprises a plurality of beams that are sufficiently spaced apart, a pattern of a plurality of bubbles 118 is formed. Here, the term “bubble” 118 generally refers to a single bubble or a pattern of a plurality of bubbles.

[0047] Bubble 118 applies mechanical force to discrete component 102. When the mechanical force applied by bubble 118 is sufficient to overcome the adhesion between discrete component 102 and dynamic release structure 112, the mechanical force applied by bubble 118 (combined with gravity) causes discrete component (e.g., in the downward direction) to move away from support 110 for transfer to target substrate 130.

[0048] Further description of the laser-assisted transfer process can be found in U.S. Patent Publication US 2014 / 0238592, the entire contents of which are incorporated herein by reference.

[0049] The transfer vector 150 indicates the direction of travel when the discrete component 102 is released from the support 110 and points to the final placement of the discrete component 102 on the target substrate 130. The direction of the transfer vector 150 is a function of the position of the laser beam pattern 116 relative to the discrete component 102. Figure 1A and 1B As shown, when the incident laser beam pattern 116 is centered relative to the discrete component 102, the resulting bubble 118 (e.g., a pattern of a single bubble or multiple bubbles) is also centered relative to the discrete component 102, and the transfer vector 150 (referred to as the normal transfer vector) is perpendicular to the surface of the dynamic release structure 112. As a result, the discrete component 102 falls on the target substrate 130 at a position directly below the location of the discrete component 102 in the discrete component assembly 108.

[0050] The purpose of laser-assisted transfer processing can be to transfer discrete component 102 to a specific target location 140 on target substrate 130. Target location 140 can be the position where the center of discrete component 102 on target substrate 130 is intended to be positioned. For example, if target substrate 130 is a device substrate such as a printed circuit board, target location 140 can be the position where interconnect elements such as pads on target substrate 130 will be aligned with interconnect elements on discrete component 102.

[0051] To align the target position 140 on the target substrate 130 with the position of the discrete component 102 in the discrete component assembly 108, the target substrate 130 may be moved relative to the discrete component assembly 108, or the discrete component assembly 108 may be moved relative to the target substrate 130, or both. This relative movement can be achieved using a mechanical adjustment mechanism such as a linear translation stage, actuator, or other suitable mechanical adjustment device. For example, the coordinates of the center of the discrete component 102 in the discrete component assembly 108 in the global xy coordinate system can be adjusted to match the global xy coordinates of the target position.

[0052] Mechanical adjustments to the relative positioning of the discrete component assembly 108 and the target substrate 130 may sometimes be subject to errors such as deviations along the x-axis, y-axis, or both, due to inaccuracies in the mechanical adjustment device. Such errors may result in alignment errors between the xy coordinates of the discrete component 102 and the xy coordinates of the target position 140. For example, errors from other sources, in addition to or instead of errors caused by mechanical adjustments, may also cause alignment errors between the xy coordinates of the discrete component 102 and the xy coordinates of the target position 140. For instance, during prior processing such as during the singulation of the discrete component or the placement of the discrete component 102 on the support 110, a difference may occur between the desired position of the discrete component 102 in the discrete component assembly 108 and the actual position of the discrete component 102 in the discrete component assembly 108. When the xy-coordinate alignment between the target location 140 and the position of the discrete component 102 in the discrete component assembly 108 is based on the desired position of the discrete component 102, this difference caused by previous processing may result in alignment errors between the xy-coordinates of the discrete component 102 and the xy-coordinates of the target location 140. In some examples, such alignment errors can be at least partially addressed by fine mechanical adjustment of the relative positions of the target substrate 130 and the discrete component assembly 108 before initiating the laser-assisted transfer process.

[0053] refer to Figures 2A to 2C In some examples, the beam pattern 116 may be offset from the center of the discrete component 102 during the laser-assisted transfer process, meaning that the beam pattern 116 is incident at a position offset from the center of the discrete component. The offset of the beam pattern 116 can be used to at least partially compensate for alignment errors between the xy coordinates of the discrete component 102 and the xy coordinates of the target position 140.

[0054] When the beam pattern 116 is offset from the discrete component 102 (e.g., not centered on the discrete component 102), the resulting bubble 118 (e.g., a pattern of a single bubble or multiple bubbles) is also not centered relative to the discrete component 102. This offset causes the transfer vector 150 to deviate from the surface normal by an angle α (referred to as an angled transfer vector). The angle α of the transfer vector 150 is related to the magnitude d and direction of the offset of the beam pattern 116 from the center of the discrete component 102 (sometimes referred to as beam offset). Using the normal transfer vector (e.g., as... Figure 1A As shown, discrete component 102 will be transferred to a target position 140 directly below the position of discrete component 102 in the discrete component assembly. An angular transfer vector causes discrete component 102 to be transferred to an offset position 134 on the target substrate 130 relative to the target position 140.

[0055] Figure 2B and 2C A top view of a discrete component assembly 108 with attached discrete components 102 is shown, wherein the beam pattern 116 is offset from the center of the discrete component 102. A dashed box 132 depicts the position of the discrete component 102 on the target substrate 130 after transfer, with the dashed box centered at the offset position 134. The distance between the target position 140 and the offset position 134 is the placement error ε caused by the offset of the beam pattern 116. The placement error ε can be: as... Figure 2B As shown along the x-axis; along the y-axis (not shown); as Figure 2C The diagram can have components along each axis in the x-axis and y-axis.

[0056] The magnitude of the placement error ε is related to the magnitude of the beam offset d and the height g of the gap 135 between the bottom surface of the discrete component 102 in the discrete component assembly 108 and the top surface of the target substrate 130. For example, given a gap height g, the magnitude of the beam offset d can have a direct linear relationship with the placement error ε. The spatial direction pointed to by the transfer vector 150 is opposite to the direction of the beam offset. For example, in Figure 2A In the figure, when the transfer vector 150 is pointing to the right side of the figure, the beam pattern 116 is shifted to the left side of the figure.

[0057] As discussed above, alignment errors may occur between the xy coordinates of discrete component 102 and the xy coordinates of target position 140. To compensate for this error, the beam pattern 116 can be intentionally offset so that the placement error ε matches the alignment error between the xy coordinates of discrete component 102 and target position 140. Compensating for alignment errors by introducing an offset of beam pattern 116 can help achieve precise alignment for laser-assisted transfer processing and enables rapid alignment, thereby facilitating high-throughput transfer processing.

[0058] In the example, refer to Figure 3 In the laser-assisted transfer system 300, an alignment error 'a' (not shown) may exist between the xy coordinates of the discrete component 102 and the xy coordinates of the target position 140. This alignment error 'a' can be caused by, for example, inaccuracies in the mechanical alignment mechanism, positional errors of the discrete component 102 on the support 110, or other reasons. To compensate for the alignment error, the beam pattern 116 can be offset to obtain an angular transfer vector 150 that results in a placement error ε equal to the alignment error 'a'. Then, despite the alignment error 'a' between the xy coordinates of the discrete component 102 in the discrete component assembly 108 and the xy coordinates of the target position 140, the discrete component 102 is directly transferred to its target position 140.

[0059] The laser-assisted transfer system 300 includes a light source 302, such as a laser. A beam 306 from the light source 302 can be incident on one or more optical elements 304, such as lenses, diffractive optical elements (e.g., beam splitters), that can shape the beam 306 from the light source 302 into a beam pattern 116. The beam pattern 116 can be a single beam (as shown), or it can include multiple beamlets of light having a smaller size (e.g., diameter) compared to the beam 306.

[0060] A photodetector 310, such as a camera, is positioned to capture an image of the relative positions of discrete component 102 and target position 140 on target substrate 130. The image 312 from the photodetector 310 is provided to a computing system 314 including one or more processors coupled to a memory and configured to process the image 312 to determine an alignment error α. For example, the computing system 314 may implement a machine vision method for identifying discrete component 102 and target position 140 and determining the size and orientation of the separation between the center of discrete component 102 and target position 140.

[0061] The calculation system 314 determines the beam offset characteristics of the beam pattern 116 based on the alignment error 'a', such that when the beam pattern 116 is offset according to these beam offset characteristics, the discrete component 102 will be moved to the target position 140. The beam offset characteristics indicate the magnitude 'd' and direction of the beam offset. In some examples, the beam offset characteristics may indicate other parameters such as the number or arrangement of fine beams in the beam pattern 116.

[0062] The computing system 314 provides a signal 316 indicating beam offset characteristics to the laser-assisted transfer system 300 to control one or more optical elements 318 to adjust the position of the beam pattern 116, for example, based on the beam offset characteristics. In the example, one or more optical elements 318 may be a scanner such as a galvanometer-type laser scanner capable of adjusting the position of the beam pattern 116.

[0063] By implementing beam offset characteristics using a scanner, alignment errors can be quickly compensated for, resulting in low transfer time for each discrete component and thus increasing the throughput of laser-assisted transfer processing.

[0064] refer to Figure 4In some examples, the target substrate 430 used to accommodate the discrete component 102 in the laser-assisted transfer process may include a coating comprising a die-catching material 402 disposed on the surface of the coating. The die-catching material (DCM) 402 may be a material used to accommodate the discrete component as it is transferred from the carrier substrate and to hold the discrete component in its target position while reducing movement after transfer on the target substrate. The process of accommodating and holding the discrete component in its target position is sometimes referred to as die-catching. The DCM may be a viscous fluid that slows the velocity of the discrete component 102 when it is incident on the coating 402.

[0065] In some cases, once discrete component 102 is engaged by the DCM of coating 402, discrete component 102 can "float" within the coating. Floating of discrete component 102 is a slow displacement of discrete component 102 from its original placement position by any distance. Floating can be caused by surface tension, thermal drift, fluid leveling after component impact, Brownian motion, or other factors, or a combination of these factors. Floating of the contained discrete component may be undesirable, for example, because it may cause overall placement errors during the transfer process. For instance, component floating may cause placement errors to exceed established standards, rendering the placed discrete component unusable for its intended application. In some examples, such as applications involving tightly spaced discrete components, component floating may cause an incoming discrete component to come into contact with a previously placed discrete component, thereby adding further placement errors to the previously placed discrete component or introducing other undesirable characteristics into the discrete component cluster.

[0066] In some examples, the rheological properties of the DCM of coating 402 can be tuned for specific applications, such as for discrete components of a specific size or mass, to improve the accuracy and reliability of laser-assisted transfer processing.

[0067] refer to Figure 5A and 5B In some examples, the target substrate 530 includes a coating 502 comprising Bingham fluid disposed on the surface of the substrate 504. Bingham fluid is a viscoplastic material that behaves as a rigid body at low stresses but flows like a viscous fluid at or above its yield stress. Bingham fluid is sometimes also referred to as Bingham liquid, Bingham plastic, structured liquid, or viscoplastic solid. Bingham fluid may include gels (e.g., alcogels, hydrogels, organic gels, or other types of gels), synthetic polymers, adhesives, fluxes, solder pastes, suspensions, conductive or semiconductive inks (e.g., organic inks), chemically inert materials, or any combination of two or more of these.

[0068] When the discrete component 102 is transferred to the target substrate 530 during laser-assisted transfer processing, the discrete component 102 is engaged by a coating 502 comprising Bingham fluid and is partially embedded in the coating (e.g., Figure 5B (As shown) or arranged on the coating. Partial embedding means that the bottom surface 136 of the discrete component 102 is lower than the top surface 506 of the coating 502, while the top surface 508 of the discrete component 102 is higher than the top surface 506 of the coating 502. Once the discrete component 102 is partially embedded in the coating 502, the rheological properties of the Bingham fluid prevent the discrete component 102 from spontaneously shifting or floating. By using a coating comprising Bingham fluid as a die-clamping material, the precision and accuracy of component placement can be improved.

[0069] Substrate 504 may be a strip such as a wafer strip. Substrate 504 may be a rigid substrate such as a glass substrate or a semiconductor substrate. Substrate 504 may be a device substrate such as a printed circuit board (PCB). In some examples, substrate 504 may be a semiconductor substrate such as a semiconductor wafer or a portion thereof, intended for use in a multi-chip stack.

[0070] When substrate 504 is a device substrate, the coating 502 including Bingham fluid can facilitate the interconnection of discrete component 102 with electrical contacts such as pads on substrate 504. For example, the coating 502 including Bingham fluid can be a conductive paste such as conductive solder paste. (Reference) Figure 5C In some examples, a processing step can be performed after the laser-assisted transfer of discrete component 102 to bring the bottom surface 136 of discrete component 102 into contact with electrical contacts on substrate 504. In some examples, the coating 502, which includes Bingham fluid, can be flux that is removed during the soldering process. In some examples, the assembly of substrate 504, with discrete component 102 partially embedded in coating 502, is subjected to pressure, for example from a thermoelectric electrode, to expel Bingham fluid between discrete component 102 and substrate 504, thereby enabling electrical contact between discrete component 102 and substrate 504.

[0071] Many embodiments have been described. However, it will be understood that various modifications can be made without departing from the spirit and scope of this disclosure. For example, some of the steps described above may be order-independent and therefore may be performed in a different order than that described.

[0072] Other implementations are also within the scope of the appended claims.

Claims

1. A method comprising: Determine the alignment error between discrete components of a discrete component assembly mounted in a laser-assisted transfer system and a target position on a target substrate, the discrete component assembly including the discrete components attached to a support via a dynamic release layer; The beam offset characteristics are determined based on the alignment error; as well as A signal indicating the beam offset characteristics is provided to the optical elements of the laser-assisted transfer system, the optical elements being configured to adjust the position of the beam pattern relative to the discrete components according to the beam offset characteristics.

2. The method according to claim 1, comprising: The optical element adjusts the position of the beam pattern relative to the discrete component based on the beam offset characteristics.

3. The method according to claim 2, comprising: A galvanometer-type laser scanner is used to adjust the position of the beam pattern.

4. The method according to any one of claims 1 to 3, wherein, Determining the alignment error includes determining one or more of the magnitude and direction of the alignment error.

5. The method according to any one of claims 1 to 3, wherein, Determining the beam offset characteristics includes determining the offset between the center of the discrete component and the offset position of the discrete component.

6. The method according to claim 5, wherein, Determining the offset includes determining one or more of the magnitude and direction of the offset between the center of the discrete component and the offset position of the discrete component.

7. The method according to any one of claims 1 to 3, comprising: Determine the beam offset characteristics to at least partially compensate for the alignment error.

8. The method of claim 7, comprising: Determine the beam offset characteristics such that, when the beam pattern is incident on the discrete component assembly according to the beam offset characteristics, the discrete component is transferred to the target position on the substrate.

9. The method according to any one of claims 1 to 3, comprising: The alignment error is determined using a machine vision system.

10. The method according to any one of claims 1 to 3, comprising: The dynamic release layer is irradiated with a light beam, and the position of the light beam pattern relative to the discrete component is adjusted according to the light beam offset characteristics, thereby causing the discrete component to be released from the carrier substrate.

11. The method of claim 10, comprising: The discrete component is housed at the target location on the target substrate.

12. A system comprising: A computing system comprising one or more processors coupled to memory, wherein the one or more processors are configured to: Determine the alignment error between discrete components of a discrete component assembly and a target position on a target substrate, the discrete component assembly including the discrete components attached to a support via a dynamic release layer, the discrete component assembly being mounted in a laser-assisted transfer system; The beam offset characteristics are determined based on the alignment error; as well as A signal indicating the beam offset characteristics is provided to the optical elements of the laser-assisted transfer system, the optical elements being configured to adjust the position of the beam pattern relative to the discrete components according to the beam offset characteristics.

13. The system of claim 12, comprising the optical element.

14. The system according to claim 13, wherein, The optical element includes a galvanometer-type laser scanner.

15. The system according to any one of claims 12 to 14, wherein, Determining the beam offset characteristics includes determining the offset between the center of the discrete component and the offset position of the discrete component.

16. The system according to claim 15, wherein, Determining the offset includes determining one or more of the magnitude and direction of the offset between the center of the discrete component and the offset position of the discrete component.

17. The system according to any one of claims 12 to 14, wherein, The one or more processors and memory are configured to determine beam offset characteristics to at least partially compensate for the alignment error.

18. The system according to claim 17, wherein, The one or more processors and memory are configured to determine beam offset characteristics such that, when the beam pattern is incident on the discrete component assembly according to the beam offset characteristics, the discrete component is transferred to the target position on the substrate.

19. The system according to claim 17, wherein, The machine vision system is implemented using one or more processors and memories.

20. A computer program product comprising a program that, when executed by a computer, implements the steps of the method according to any one of claims 1 to 11.

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