Cutting base, cutting device and cutting method

Abstract

The present application relates to a cutting base, a cutting device, and a cutting method. The cutting base includes a bearing surface for cooperating with a substrate, and a cutting groove aligned with the cutting line of the substrate is provided on the bearing surface; a connecting member, the connecting member includes a first connecting surface and a second connecting surface, the first connecting surface is used for detachably connecting to the substrate, and the second connecting surface is detachably connected to the inner wall of the cutting groove, and the substrate is fixed to the base body through the connecting member. The technical solution of the present application effectively solves the problem that the substrate in the prior art is prone to warping during cutting.

Description

Technical Field

[0001] The present application relates to the technical field of cutting, and particularly relates to a cutting base, a cutting device, and a cutting method. Background Art

[0002] As Figure 1 shown, in display manufacturing, the cutting process is a necessary process for changing a whole substrate 1 into independent displays. This process can realize the production of displays of various sizes and shapes, and lasers are often selected for cutting in practice. The laser is located directly above the substrate 1. When cutting the substrate 1, a large amount of carbide impurities will be generated. Some impurities are sucked away by the pipe orifice with a suction function in the laser device itself, which can effectively reduce the impurity particles 2 landing on the back of the substrate 1. At the same time, the laser cutting path is located directly above the cutting groove 4 of the cutting base 3 so that the impurities generated during cutting fall into the cutting groove 4. Currently, a channel is connected to the bottom of the cutting groove 4 of some cutting bases, and then a power device is used to suck away and discharge the impurity particles in the groove.

[0003] However, the impurities are very tiny in size and extremely light in mass. This characteristic causes the impurity particles 2 not to fall to the bottom of the cutting groove 4 after the cutting process is completed, and the impurity particles 2 will be suspended in the space of the cutting groove 4. On the other hand, after the substrate 1 is cut by the laser, its four sides are warped to a certain extent compared with before cutting, and the impurity particles 2 will fall into the gap between the back of the substrate 1 and the surface of the cutting base 3. After the cutting process is completed, the robotic arm uses the vacuum adsorption function to transfer and place the independent display product. When there are impurities in the display area of the product, the adsorption pressure will cause the impurities to pierce the surface protective film of the product, thereby affecting the quality of the product. In severe cases, the product will be damaged and scrapped, greatly reducing the yield rate. Summary of the Invention

[0004] The present application provides a cutting base, a cutting device, and a cutting method for solving the problem that the substrate is prone to warping during cutting in the prior art.

[0005] To solve the above problems, the present application provides a cutting base, including: a base body including a bearing surface for cooperating with a substrate, and a cutting groove aligned with the cutting line of the substrate is provided on the bearing surface; a connecting member including a first connecting surface and a second connecting surface. The first connecting surface is used for detachably connecting to the substrate, and the second connecting surface is detachably connected to the inner wall of the cutting groove. The substrate is fixed to the base body through the connecting member.

[0006] Further, the edge of the first connecting surface away from the base body is parallel to the cutting line of the substrate, and the ratio of the distance between the outer edge of the first connecting surface and the cutting line of the substrate to the width of the cutting groove is M, where the first preset value ≤ M ≤ the second preset value.

[0007] Further, the first preset value is 1.5% and the second preset value is 40%.

[0008] Further, the surface of the connecting member facing the substrate is the first connecting surface, and the surface of the substrate facing the inner wall of the cutting groove is the second connecting surface. Both the first connecting surface and the second connecting surface are bonding surfaces.

[0009] Further, the cutting groove has the same extending direction as the substrate cutting line, and the substrate cutting line is completely located within the orthographic projection plane of the cutting groove. The connecting member is hermetically connected outside the joint seam between the inner side wall of the cutting groove and the bottom surface of the substrate.

[0010] Further, the connecting member is made of an elastic material, and the height of the connecting member is equal to or greater than the depth of the cutting groove.

[0011] Further, the connecting member further includes an adsorption surface, which is a surface adjacent to the first connecting surface and the second connecting surface and facing the middle of the cutting groove.

[0012] Further, two connecting members are arranged in one cutting groove, and the two connecting members are respectively adjacent to the two side walls of the cutting groove.

[0013] Further, the connecting member is a multi-layer structure.

[0014] Further, the connecting member includes a plurality of connecting layers, and the connecting layers are stacked in the direction from the side wall of the cutting groove to the central axis of the cutting groove.

[0015] Further, the connecting member includes a plurality of connecting layers, and the connecting layers are stacked in the direction from the bottom wall of the cutting groove to the substrate.

[0016] Further, the connecting member includes a plurality of connecting layers, and each connecting layer includes an integrally structured first sub-connecting layer and a second sub-connecting layer. The first sub-connecting layers of each connecting layer are stacked in the direction from the bottom wall of the cutting groove to the substrate, and the second sub-connecting layers of each connecting layer are stacked in the direction from the side wall of the cutting groove to the central axis of the cutting groove.

[0017] According to another aspect of the present application, there is also provided a cutting device, including: a cutting base and a cutting device for cutting a substrate on the cutting base, and the cutting base is the above-mentioned cutting base.

[0018] According to another aspect of the present application, there is also provided a cutting method, using the above-mentioned cutting base. The cutting method includes the following steps: fixing the connecting member in the cutting groove of the base body; fitting the substrate to the first connecting surface of the connecting member; cutting the substrate; and transferring the cut substrate.

[0019] Further, if the connecting member does not meet the sealing requirements, the outermost layer of the connecting member can be removed, and then the substrate is continuously attached to the connecting member and cut; if the connecting member meets the sealing requirements, the substrate is continuously attached to the connecting member and cut.

[0020] The above technical solution provided by this application has the following advantages compared with the prior art:

[0021] In the technical solution of this application, when the substrate is cut, the cutting position corresponds to the cutting groove, and the connecting member is detachably connected to both the base body and the substrate. In this way, the substrate will be restricted by the connecting member during or after cutting, and the substrate will not warp, and there will be no gap between the lower surface of the substrate and the base body. The above cutting base makes it not easy for impurities to exist in the display area of the product.

[0022] On the other hand, it can also be understood that the cutting groove is used to accommodate the connecting member on the one hand and provide a space for the cutting process on the other hand. In this way, not only the space of the cutting groove is efficiently utilized, but also the display product is further protected. Therefore, the above structure greatly protects the product and improves the yield rate of the product. The technical solution of this application effectively solves the problem that the substrate is prone to warping during cutting in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present invention and used together with the specification to explain the principles of the present invention.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 A cross-sectional schematic view showing the cutting process of the cutting base and the substrate in the prior art;

[0026] Figure 2 A cross-sectional schematic view showing the cutting process of the cutting base and the substrate in the first embodiment of this application;

[0027] Figure 3 Showing Figure 2 A schematic view of the mating structure of the cutting base and the substrate;

[0028] Figure 4 Showing Figure 2 A schematic view of the structure of the connecting layer of the connecting member of the cutting base;

[0029] Figure 5Shows a schematic structural diagram of the connection layer of the connector of the cutting base in the second embodiment of the present application;

[0030] Figure 6 Shows a schematic structural diagram of the connection layer of the cutting base in the third embodiment of the present application;

[0031] Figure 7 Shows a schematic flow diagram of the cutting method of the present application.

[0032] Among them, the above-mentioned drawings include the following reference numerals:

[0033] 1. Substrate; 2. Impurity particles; 3. Cutting base; 4. Cutting groove;

[0034] 10. Base body; 11. Cutting groove; 20. Connector; 21. Contour line; 22(23, 24). Connection layer; 241. First sub-connection layer; 242. Second sub-connection layer; 25. Adsorption surface; 100. Substrate; 200. Impurity particles. Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0036] As Figures 2 to 6 shown, the present application provides a cutting base for cutting a substrate 100. The substrate 100 can be a flexible substrate or a rigid substrate. The flexible substrate is, for example, an OLED substrate, and the rigid substrate is, for example, an LCD substrate. When the substrate 100 is cut, impurity particles 200 accumulate on the surface of the cutting base and in the cutting groove 11 for a long time, forcing the cutting base to be frequently cleaned, which greatly affects the production efficiency and causes damage to the product after cutting. Even, if the residue of the impurity particles 200 in the cutting groove 11 is too much and the cleaning is not thorough, the time between adjacent cleanings will be gradually shortened, wasting human resources and production time, greatly affecting the work efficiency, and having low economic benefits.

[0037] As Figures 2 to 4As shown in the figure, the cutting base of the first embodiment includes: a base body 10 and a connecting member 20. The cutting base includes a bearing surface that cooperates with the substrate 100, and a cutting groove 11 is provided on the bearing surface. The connecting member 20 is disposed in the cutting groove 11 and is detachably connected to the base body 10, and the connecting member 20 is detachably connected to the substrate 100. The connecting member 20 includes a first connecting surface and a second connecting surface. The second connecting surface is detachably connected to the inner wall of the cutting groove 11, and the first connecting surface is used to be detachably connected to the substrate 100, and the substrate 100 is bound to the base body 10 through the connecting member 20.

[0038] In the technical solution of the first embodiment, when the substrate 100 is being cut, the cutting position of the substrate 100 corresponds to the cutting groove 11 and is located above the cutting groove 11. The connecting member 20 is fixed to the base body 10 and is in contact with the substrate 100. In this way, the substrate 100 will be restricted by the connecting member 20 during or after cutting, and the substrate 100 will not warp due to cutting, resulting in a gap between the substrate 100 and the base body 10. That is, whether during cutting or after cutting, the impurity particles 200 will not enter the gap between the lower surface of the substrate 100 and the cutting base. The above cutting base makes it difficult for impurities to exist in the display area of the product. Therefore, the above structure greatly protects the product and improves the yield of the product. The technical solution of this embodiment effectively solves the problem that the substrate 100 is prone to warping during cutting in the prior art.

[0039] As Figure 2 shown in the figure, in the technical solution of this embodiment, the surface of the connecting member 20 facing the substrate 100 is the first connecting surface, and the first connecting surface is adhesively connected to the lower bottom surface of the substrate 100. The width of the first connecting surface is less than or equal to the distance from the edge of the cutting groove 11 to the cutting line to be cut of the substrate 100. The cutting line here is the cutting line closest to the edge of the corresponding cutting groove 11. The second connecting surface of the connecting member 20 is adhesively connected to the inner wall of the cutting groove 11. The above structure enables the connecting member 20 not only to play a role in restricting the substrate 100, but also to play a sealing role, that is, the connecting member 20 can prevent impurity particles 200 from entering between the substrate 100 and the base body 10. Moreover, during cutting, the above connecting member 20 will not be damaged. It should be noted that in the technical solution of this embodiment, the second connecting surface includes a surface that fits the side wall of the cutting groove 11 and also includes a surface that fits the bottom wall of the cutting groove 11. As another implementable technical solution, the second connecting surface only includes a surface that fits the side wall of the cutting groove 11, or the second connecting surface only includes a surface that fits the bottom wall of the cutting groove 11.

[0040] As Figure 2As shown, in the technical solution of the first embodiment, the edge of the first connection surface away from the base body 10 is parallel to the cutting line of the substrate 100, and the ratio of the distance between the outer edge of the first connection surface and the cutting line of the substrate 100 to the width of the cutting groove 11 is M, where the first preset value ≤ M ≤ the second preset value. The setting of the first preset value avoids the situation that when the substrate 100 is laser-cut, the connector 20 will be cut, causing pollution to the substrate 100. The setting of the second preset value can play a good role in blocking and restraining the substrate 100. Specifically, the first preset value is 1.5%, and the second preset value is 40%. As Figure 2 As shown, in the technical solution of the first embodiment, the connector 20 is cut along a plane perpendicular to the extension line of the cutting groove 11 to form a cross-section. In the direction from near the substrate 100 to far from the substrate 100, the width of the cross-section gradually decreases. The connector 20 with the above structure has a large acting area with the substrate 100. On the one hand, this ensures that the binding force of the connector 20 on the substrate 100 is large. On the other hand, it ensures that the lower surface of the substrate 100 above the cutting groove 11 is closely attached to the connector 20, reducing the pollution probability of the product by the impurity particles 200. The fact that the width of the cross-section of the connector 20 is larger at the top and smaller at the bottom can also ensure that the impurity particles 200 are not prone to accumulation problems, that is, it is easier for the impurity particles 200 after cutting to fall to the bottom of the cutting groove 11. Specifically, this embodiment further includes a negative pressure adsorption structure. The adsorption port of the negative pressure adsorption structure is located on the bottom wall of the cutting groove 11, and the vacuum pump is connected to the adsorption port through a pipeline, and the impurity particles 200 are more likely to fall through negative pressure adsorption.

[0041] It should be noted that through the structural setting of the connector 20, the impurity particles 200 can be easily adsorbed by the connector 20. In addition, the connector 20 is made of an elastic material, and the height of the connector 20 is higher than the depth of the cutting groove 11. Specifically, the height of the connector 20 is between 100% and 103% of the depth of the cutting groove 11. The connector 20 can be made of materials such as plastic and PET, and static charges that are easy to attract the impurity particles 200 can be set on the connector 20, so that the impurity particles 200 are more likely to be adsorbed on the outermost layer of the connector 20. As another implementation method, static electricity is set on the connector 20, and this static electricity is the same as the static electricity carried by the impurity particles 200 after cutting. In this way, the impurity particles 200 and the connector 20 form a mutually repulsive force, further ensuring that the impurity particles 200 are not easily adsorbed on the connector 20 and are even less likely to accumulate on the connector 20.

[0042] As Figure 2 and Figure 4As shown, in the technical solution of this embodiment, the contour line 21 of the cross-section of the connecting member 20 near the central axis of the cutting groove 11 is arc-shaped. On the one hand, such a connecting member 20 is easy to set. On the other hand, the contour line 21 being an arc makes it easier for the impurity particles 200 to adsorb on the connecting member 20.

[0043] As Figure 2 shown, in the technical solution of Embodiment 1, the cutting groove 11 is in the same extending direction as the cutting line of the substrate 100, and the cutting line of the substrate 100 is completely within the orthographic projection plane of the cutting groove 11. The connecting member 20 is hermetically connected outside the joint seam between the inner side wall of the cutting groove 11 and the bottom surface of the substrate 100. The above structure enables the connecting member 20 to block the gap between the base body 10 and the substrate 100. Specifically, the connecting member 20 is attached to the lower surface of the substrate 100 and the base body 10 by bonding. The cutting line is located at the midline of the cutting groove 11.

[0044] As Figure 2 and Figure 4 shown, in the technical solution of this embodiment, the connecting member 20 is adhesively bonded to the inner wall of the cutting groove 11. On the one hand, the bonding method ensures good fixation of the connecting member 20 and the cutting base and is convenient for disassembly and assembly. On the other hand, there will be no gap between the connecting member 20 and the cutting base, so that the impurity particles 200 are not easily embedded between the connecting member 20 and the cutting base. In the technical solution of this embodiment, the connecting member 20 is adhesively bonded to both the bottom wall and the side wall of the cutting groove 11, and the entire bottom plane of the connecting member 20 is adhesively bonded to the bottom wall of the cutting groove 11, and the side wall of the connecting member 20 close to the cutting groove 11 is entirely adhesively bonded to the side wall of the cutting groove 11. As another implementation method, the connecting member 20 may be adhesively bonded only to the bottom wall of the cutting groove 11, or the connecting member 20 may be adhesively bonded only to the side wall of the cutting groove 11.

[0045] As Figure 2 and Figure 4As shown, in the technical solution of the first embodiment, the connector 20 has a multi-layer structure. The connector 20 with a multi-layer structure can reduce the replacement cycle of the connector 20. For example, after the connector 20 has been used for a long time, impurity particles 200 will accumulate more on one side of the middle part of the connector 20 close to the cutting groove. At this time, only the outermost layer of the connector 20 needs to be removed, instead of replacing the entire connector 20. As another implementation, the connector 20 can also be an integral structure, that is, the entire connector 20 is an integrated structure. The connector 20 further includes an adsorption surface 25. The adsorption surface 25 is the surface with the above-mentioned contour line 21 being an arc. The adsorption surface 25 is used to adsorb the impurity particles 200 in the cutting groove 11. The structure of each connection layer of the connector 20 is as follows: glue + PET. The glue is composed of PU + Acrylic + PU. When the glue fails, tearing off the PET film can expose the glue part of the next layer of film. The connector 20 regains the ability to adsorb impurity particles. The second surface of the connector 20 is a layer of glue, which is used to tightly adsorb on the base body 10; the surface of the connector 20 that is opposite to the second surface attached to the side wall of the cutting groove 11 is the adsorption surface. The adsorption surface is a layer of PET, which is used to protect the glue behind from being damaged. Tearing it off to expose the glue part can start using. The glue of the connector 20 can stick to the lower surface of the substrate 100 without leaving sticky substances on the lower surface of the substrate 100.

[0046] As Figure 2 and Figure 4 shown, in the technical solution of the first embodiment, the connector 20 includes a plurality of connection layers 22, and the connection layers 22 are stacked in the direction from the side wall of the cutting groove 11 to the central axis of the cutting groove 11. The connector 20 with the above structure can be removed layer by layer until each layer of the connection layer 22 is used up and then a new connector 20 is replaced. Of course, according to needs, when the connector 20 cannot meet the requirements before being completely used up, the connector 20 can be replaced without being completely used up. It should be noted that the adjacent connection layers 22 are attached to each other by bonding, and there is no gap between the adjacent connection layers 22.

[0047] It should be noted that the relationship between the thickness of each connection layer of the connector 20 and the number of layers of the connector 20 is as follows:

[0048] In Figure 2 the direction of the cross-sectional view of, the length S1 of the first connection surface of the connector 20: S1 is greater than 0 and less than 48.5% of the cutting groove width. (Corresponding to the position where the first connection surface of the connector 20 cannot exceed 1.5% of the cutting line, which can effectively avoid laser cutting the connector 20). The length S2 of the connector 20 in contact with the bottom wall of the cutting groove 11: S2 is always less than the position from the outermost edge of the bottom suction port to the side wall of the cutting groove 11. AsFigure 4 As shown, the thicknesses of the respective connection layers of the connector 20 are consistent; the thickness of each connection layer 22 in contact with the lower surface of the substrate 100 is H1, and the thickness in contact with the bottom wall of the cutting groove 11 is H2. The value of H1 / H2 is between 1 / 5 and 9 / 5, that is, it is also possible that the thickness of the upper part of the connector 20 is less than the thickness of the lower part of the connector 20. In this embodiment, the value of H1 / H2 is 11 / 10, that is Figure 4 in the connector 20, the thickness of the upper part is greater than the thickness of the lower part. Assuming that the connector 20 has N layers, then it is necessary to satisfy H1*N = S1, and S1 should be greater than 0 and less than 48.5% of the width of the cutting groove 11; H2*N = S2, and S2 should always be less than the distance from the outermost edge of the bottom suction port to the side wall of the cutting groove 11.

[0049] As Figure 3 shown, in the technical solution of the first embodiment, two connectors 20 are arranged in one cutting groove 11, and the two connectors 20 are respectively arranged adjacent to the two side walls of the cutting groove 11. The arrangement of the two connectors 20 ensures that when the substrate 100 is cut, the products on both sides of the upper part of the cutting groove 11 will not warp, effectively preventing the impurity particles 200 from entering the lower surface of the substrate 100. Such a structure is beneficial to reducing the breakage rate of the product.

[0050] It should be noted that multiple cutting grooves 11 are provided on the same cutting base. The multiple cutting grooves 11 here can be in the same vertical direction or the same horizontal direction. Although the vertical cutting groove 11 and the horizontal cutting groove 11 are connected and can be called different cutting grooves 11, rather than the same cutting groove 11. Connectors 20 are respectively arranged on both sides of the same cutting groove 11, and there is a cutting channel between the two connectors 20 in the same cutting groove 11. In this way, when the substrate 100 is laser cut, the connectors 20 will not be damaged, and the impurity particles 200 can be adsorbed by the negative pressure adsorption structure through the cutting channel.

[0051] Taking the substrate 100 as a flexible substrate as an example, from the above, in the technical solution of the first embodiment, a cleaning device (connector 20) in the shape of an arc-shaped wedge, which is composed of multiple layers of double-sided adhesive films. The cross-section of the cleaning device is as Figure 2 shown. Using this cleaning device, it is possible to prevent the impurity particles 200 generated by cutting from entering the gap between the back surface of the substrate and the cutting base. The cleaning device can also achieve self-cleaning and can continuously adhere to the impurity particles generated by laser cutting. While meeting the requirements of low cost and convenient use, it effectively reduces the influence of the impurity particles 200 on the display product and improves the yield. From Figure 2From the cross-sectional view of the arc-shaped wedge body, the upper surface of the entire wedge body fits against the back surface of the substrate, and the outermost thin film on the upper surface does not exceed the outermost edge of the display product. The lower surface fits against the bottom of the cutting groove, and the surface of the connecting member 20 in contact with the side wall of the cutting groove 11 fits against the side wall of the cutting groove 11, and the adsorption surface is exposed to the air. When the adhesion degree of the wedge body to the impurity particles 200 decreases, the outermost thin film of the connecting member 20 can be manually or driven by a power device to tear off the mechanical arm, and the surface of the adsorption surface of the wedge body returns to the state with strong adhesion at the beginning.

[0052] The advantages of this design are as follows:

[0053] 1. The arc-shaped wedge body as a whole has adhesiveness. When the upper surface of the entire wedge body fits against the back surface of the substrate, the four peripheral edges of the display product after laser cutting will not warp. This design effectively ensures that the impurity particles generated during laser cutting will not enter the gap between the back surface of the display product and the cutting base, blocking the impurity particles from entering the back surface of the substrate at the source.

[0054] 2. The surface of the adsorption surface of the entire wedge body is exposed to the air, which can adhere to some impurity particles during the cutting process, reducing the number and time of impurity particles suspended in the groove, and reducing the cleaning pressure of the dynamic suction device on the impurity particles deposited in the bottom channel of the cutting groove.

[0055] As Figure 5 shown, the difference between the technical solution of the second embodiment and the first embodiment is that the connecting member 20 includes a plurality of connection layers 23, and the connection layers 23 are stacked in the direction from the bottom wall of the cutting groove 11 to the substrate 100. When the connection layer 23 close to the substrate 100 shows wear, adhesion force, etc. that do not meet the requirements, remove this connection layer 23, and the lower connection layer 23 is attached to the substrate 100. The width of each connection layer 23 gradually decreases from the direction close to the substrate 100 to the direction away from the substrate 100. One side of each connection layer 23 close to the cutting channel is a plane or an arc surface. When it is a plane, processing and assembly are relatively convenient. When one side of each connection layer 23 close to the cutting channel is an arc surface, the width of the side of the connection layer 23 close to the substrate 100 is greater than the width of the side of the connection layer 23 away from the substrate 100, and the adjacent connection layers 23 have the following characteristics: the width of the lower part of the upper connection layer 23 is equal to the width of the upper part of the lower connection layer 23.

[0056] By the same token, in the technical solution of the second embodiment, when the substrate 100 is cut, the cutting position of the substrate 100 corresponds to the cutting groove 11 and is located above the cutting groove 11. The connecting member 20 is attached to the base body 10 and the connecting member 20 is attached to the substrate 100. In this way, the substrate 100 will be restricted by the connecting member 20 during or after cutting, and there will be no gap between the substrate 100 and the base body 10 due to warping of the substrate 100 during cutting. That is, whether during cutting or after cutting, the impurity particles 200 are not easily introduced into the gap between the back surface of the substrate 100 and the cutting base. The above cutting base makes it difficult for impurities to exist in the display area of the product. Therefore, the above structure greatly protects the product and improves the yield of the product.

[0057] It should be noted that at this time, the connecting member 20 is lower than the depth of the cutting groove 11. The cutting base of this embodiment is provided with a lifting structure, and the lifting structure can push the cutting groove 11 attached with the connecting member 20 to move up and down. In this way, the bottom wall of the cutting groove 11 has a movable part, the part attached with the connecting member 20 is movable, and the part not attached with the connecting member 20 is integrally fixed with the base body 10 and does not move. The lifting structure includes a motor, a lead screw and a connecting block. The motor is connected to the lead screw, and the connecting block is matched with the lead screw through a thread. The connecting block is fixed on the movable wall of the cutting groove 11. The lifting structure further includes a limit post. The connecting block has a light hole, and the light hole is adapted to the limit post, so as to ensure the accuracy of movement. The two sides of the bottom wall and the inner wall surface of the side wall are provided with matching protrusions and sliding grooves to ensure high accuracy when the bottom wall moves up and down. At this time, the connecting member 20 is not attached to the side wall.

[0058] As Figure 6 shown, the difference between the technical solution of the third embodiment and the second embodiment is that the connecting member 20 includes a plurality of connecting layers 24. Each connecting layer 24 includes a first sub-connecting layer 241 and a second sub-connecting layer 242 with an integral structure. The first sub-connecting layers 241 of each connecting layer 24 are stacked in the direction from the bottom wall of the cutting groove 11 to the substrate 100, and the second sub-connecting layers 242 of each connecting layer 24 are stacked in the direction from the side wall of the cutting groove 11 to the central axis of the cutting groove 11. In this way, the third embodiment combines the advantages of the first embodiment and the second embodiment. When removing the outermost layer, all the accumulated impurity particles 200 can be removed, so that the adsorption capacity of the connecting member 20 for the impurity particles 200 can be restored to the initial state.

[0059] Similar to Embodiment 2, when removing the outermost connection layer 24, there will be a problem of the reduction of the connector 20. The cutting base of this embodiment is provided with a lifting structure, which can push the cutting groove 11 attached with the connector 20 to move up and down. In this way, the bottom wall of the cutting groove 11 has a movable part, the part attached with the connector 20 is movable, and the part not attached with the connector 20 is integrally fixed with the base body 10 and does not move. The lifting structure includes a motor, a lead screw and a connecting block. The motor is connected to the lead screw, and the connecting block is matched with the lead screw through a thread. The connecting block is fixed on the movable wall of the cutting groove 11. The lifting structure further includes a limit post. The connecting block has a light hole, and the light hole is adapted to the limit post, which ensures the accuracy of the movement. The cross-sections of the first sub-connection layer 241 and the second sub-connection layer 242 are inverted L-shaped, and a plurality of L-shapes are stacked.

[0060] The present application also provides a cutting device, including: a cutting base and a cutting device for cutting a substrate 100 on the cutting base, and the cutting base is the above-mentioned cutting base. The cutting device of the present application has a relatively high yield rate for cutting the substrate 100.

[0061] As Figure 7 shown, the present application also provides a cutting method, using the above-mentioned cutting base. The cutting method includes the following steps: fixing the connector 20 in the cutting groove 11 of the base body 10; pasting the lower surface of the substrate 100 with the first surface of the connector 20; cutting the substrate 100; transferring the cut substrate 100. If the connector 20 does not meet the sealing requirements, the outermost layer of the connector 20 can be removed, and then the substrate 100 is pasted with the connector 20 again and cut; if the connector 20 meets the sealing requirements, the substrate 100 is pasted with the connector 20 again and cut. This process is repeated until the removed and delaminated connector 20 completely does not meet the sealing requirements of the substrate 100. At this time, a new connector 20 can be replaced, and the above steps are repeated, which will not be elaborated here.

[0062] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0063] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather will conform to the broadest scope consistent with the principles and novel features claimed herein.

Claims

1. A cutting base, characterized in that, it includes: A base body including a bearing surface for cooperating with a substrate, and a cutting groove aligned with the cutting line of the substrate is provided on the bearing surface; A connecting member, the connecting member includes a first connecting surface and a second connecting surface, the first connecting surface is used to detachably connect to the substrate, and the second connecting surface is detachably connected to the inner wall of the cutting groove, and the substrate is fixed to the base body through the connecting member; The connecting member is a multi-layer structure; The connecting member includes a plurality of connecting layers, and each of the connecting layers is stacked in a direction from the side wall of the cutting groove to the central axis of the cutting groove; or The connecting member includes a plurality of connecting layers, and each of the connecting layers is stacked in a direction from the bottom wall of the cutting groove to the substrate; or The connecting member includes a plurality of connecting layers, and each of the connecting layers includes an integrally structured first sub-connecting layer and a second sub-connecting layer. The first sub-connecting layers of each of the connecting layers are stacked in a direction from the bottom wall of the cutting groove to the substrate, and the second sub-connecting layers of each of the connecting layers are stacked in a direction from the side wall of the cutting groove to the central axis of the cutting groove.

2. The cutting base according to claim 1, characterized in that, The edge of the first connecting surface away from the base body is parallel to the cutting line of the substrate, and the ratio of the distance between the outer edge of the first connecting surface and the cutting line of the substrate to the width of the cutting groove is M, and the first preset value ≤ M ≤ the second preset value.

3. The cutting base according to claim 2, characterized in that, The first preset value is 1.5%, and the second preset value is 40%.

4. The cutting base according to claim 2, characterized in that, The surface of the connecting member facing the substrate is the first connecting surface, and the surface of the connecting member facing the inner wall of the cutting groove is the second connecting surface, and both the first connecting surface and the second connecting surface are adhesive surfaces.

5. The cutting base according to claim 2, characterized in that, The cutting groove has the same extension direction as the cutting line of the substrate, and the cutting line of the substrate is completely located within the orthographic projection plane of the cutting groove, and the connecting member is hermetically connected outside the joint seam between the inner side wall of the cutting groove and the bottom surface of the substrate.

6. The cutting base according to claim 1, characterized in that, The connecting member is made of an elastic material, and the height of the connecting member is equal to or greater than the depth of the cutting groove.

7. The cutting base according to claim 1, characterized in that, The connecting member further includes an adsorption surface, and the adsorption surface is a surface adjacent to the first connecting surface and the second connecting surface and facing the middle of the cutting groove.

8. The cutting base according to claim 1, characterized in that, Two connecting members are provided in one cutting groove, and the two connecting members are respectively adjacent to the two side walls of the cutting groove.

9. A cutting device, characterized in that, it includes: A cutting base and a cutting device for cutting a substrate on the cutting base, and the cutting base is the cutting base according to any one of claims 1 to 8.

10. A cutting method, Characterized in that, using the cutting base described in any one of claims 1 to 8, the cutting method comprising the steps of: fixing a connecting member in the cutting groove of the base body; fitting the substrate to the first joint surface of the connecting member; cutting the substrate; transferring the cut substrate.

11. The cutting method according to claim 10, characterized in that, if the connecting member does not meet the sealing requirements, the outermost layer of the connecting member can be removed, and the substrate is continuously fitted to the connecting member and cut; if the connecting member meets the sealing requirements, the substrate is continuously fitted to the connecting member and cut.

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