A method of processing a wide-field sensing probe

Abstract

The application relates to the technical field of wide-field temperature measuring probes, and discloses a processing method of a wide-field sensing probe, which comprises the following steps: S1, preparing a microparticle mixed solution; S2, uniformly distributing microparticles in a mold; S3, manufacturing a semi-solid substrate; S4, combining the substrate and the microparticles; and S5, obtaining a finished product. The processing method can uniformly distribute batches of diamond microparticles containing NV color centers on the substrate, and can effectively ensure that the detection ends of the diamond microparticles are located in one detection surface.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wide-field temperature measurement probes, and particularly relates to a processing method of a wide-field sensing probe for detecting temperature. BACKGROUND

[0002] In recent years, the integration of electronic circuits is continuously improved, and many circuits are assembled in a chip, and the power consumption is proportional to the size of the circuit, in such a case, the chip temperature rises, and the most serious case can cause the chip to burn. In order to avoid this situation, it is required to detect the chip temperature of the semiconductor device and control the semiconductor device system so as to protect the chip. And the local temperature of the semiconductor chip is also a very important indicator, and the local temperature is too high, which can cause the loss of the function of the module. Therefore, how to realize the calculation of the chip temperature and the scanning of the chip temperature gradient in the local range is an urgent problem to be solved.

[0003] At present, in order to obtain a sensor with higher sensitivity and measurement accuracy, researchers have shifted their focus to the concepts and technologies of quantum physics, in which the research on magnetic field measurement and temperature information detection using electron spin has made great progress. Under the action of external laser and microwave, the electron spin paramagnetic characteristics and optical properties of the diamond nitrogen vacancy center (NV color center) can realize ultra-high sensitivity magnetic field measurement. At the same time, the NV color center diamond is used as a sensitive element of a temperature sensor, under the action of multiple physical fields such as external laser, microwave and given magnetic field, the light detection magnetic resonance spectrum (ODMR spectrum) of the NV color center can realize temperature measurement. The NV color center electron spin currently studied mainly has two types: single NV color center electron spin and ensemble NV color center. Among them, the NV color center diamond with high concentration and high uniformity is used as a sensitive element, which has higher signal-to-noise ratio and higher sensitivity and measurement accuracy.

[0004] However, at present, the temperature measurement technology using NV color center is a point-to-point measurement method, that is, a small particle of NV color center diamond is used to measure the chip surface point by point, but this measurement method is extremely slow, which is not conducive to quickly obtaining chip temperature data. In order to improve the detection efficiency, the research on large-size NV diamond probe (wide-field probe) is rising, but the existing wide-field probe manufacturing method based on NV color center is relatively single (a large-size diamond film can be manufactured), which is difficult to meet the diversity of probe manufacturing.

[0005] Therefore, the present application designs a new processing method of a wide-field sensing probe. SUMMARY

[0006] The application provides a processing method of a wide-field sensing probe.

[0007] To achieve the above object, the application provides the following technical scheme.

[0008] The application provides a processing method of a wide-field sensing probe, which comprises the following steps.

[0009] S1, preparing a microparticle mixture: preparing a diamond microparticle mixture with a certain concentration, wherein the diamond microparticle contains NV color centers;

[0010] S2, uniformly distributing microparticles in a mold: pouring the mixture into a first mold, and standing for a period of time until the liquid in the mixture evaporates and the diamond microparticles are uniformly distributed in the first mold;

[0011] S3, making a semi-solid substrate: pouring a substrate raw material in a fluid state into a second mold to shape, and then standing for a period of time until the substrate raw material is in a semi-solid state, that is, the substrate raw material is in a plastic state but will not deform within a short time when it is placed upside down;

[0012] S4, combining the substrate and the microparticles: taking out the substrate raw material from the second mold and placing it on the diamond microparticles in the first mold until the substrate raw material is completely solidified;

[0013] S5, obtaining a finished product: after the substrate raw material is solidified, the diamond microparticles are embedded in one side surface of the substrate, the substrate is taken out after demolding, and post-processing is performed on the substrate to obtain a finished product.

[0014] Preferably, the solution used in the diamond NV color center microparticle mixture is ethanol or isopropyl alcohol.

[0015] Preferably, the size of the diamond NV color center microparticles is less than 0.1 mm.

[0016] Preferably, the second mold comprises a frame body and an inner plate, the inner plate is movably inserted into the inner cavity of the frame body, and the gap width between the periphery of the inner plate and the inner wall of the frame body is not greater than 50 um; in use, first, the inner plate is kept in the frame body, a certain amount of substrate raw material is poured on the surface of the inner plate, and the semi-solidification is performed and the surface of the semi-solidified substrate is flattened, then the second mold is inverted, the inner plate is pushed to make the semi-solidified substrate protrude out of the frame body, and the semi-solidified substrate is controlled to be pressed on the diamond microparticles in the first mold at a certain pressure until the substrate raw material is completely solidified.

[0017] Preferably, the inner cavity of the first mold is larger than the size of the frame, and after the second mold is inverted, the frame is first pressed in the middle area of the inner cavity of the first mold, and then the inner plate is pushed to make the semi-solidified substrate flatly contact the lower side of the diamond particles.

[0018] Preferably, the substrate is cured transparent epoxy resin, glass and organic glass.

[0019] Preferably, the post-processing includes cutting the non-uniform particle area of the edge of the substrate using a cutting device.

[0020] Preferably, the post-processing includes flattening the side of the substrate away from the diamond particles, and adding a layer of anti-reflection film on the flattened side.

[0021] Preferably, in step S3, after the substrate raw material is in a semi-solid state, a reflective heat insulation coating is sprayed on it by a spraying device to form a thin layer of reflective heat insulation coating, and the side is used as the side in flat contact with the diamond particles.

[0022] Compared with the prior art, the beneficial effects of the present application are: the present application provides a new processing method of a wide-field sensing probe, which can uniformly distribute a batch of diamond particles containing NV color centers on a substrate, and can effectively ensure that the detection ends of the diamond particles are in the same detection plane. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0024] Figure 1 The process flow chart for manufacturing the temperature sensing wide-field probe in embodiment one is shown in the figure.

[0025] Figure 2 The structure schematic diagram of the temperature sensing wide-field probe in embodiment one is shown in the figure.

[0026] Figure 3 The schematic diagram of pouring the mixed solution into the first mold in embodiment one is shown in the figure.

[0027] Figure 4 The schematic diagram of pouring the substrate raw material into the second mold in embodiment one is shown in the figure.

[0028] Figure 5 The structure schematic diagram of the second mold in embodiment one is shown in the figure.

[0029] Figure 6This is a schematic diagram of the bonding of a semi-solid substrate and diamond microparticles in Example 1;

[0030] Figure 7 This is a schematic diagram showing the distribution of diamond microparticles in the first mold in Example 1;

[0031] Figure 8 This is a schematic diagram of the particle distribution on the substrate in Example 1;

[0032] Figure 9 This is a schematic diagram of the temperature sensing wide-field probe in Example 2;

[0033] Figure 10 This is a schematic diagram showing the state of diamond microparticles on the substrate in Example 2.

[0034] Reference numerals: 1-Wide-field temperature sensor probe, 11-Substrate, 12-Diamond microparticles, 2-First mold, 3-Second mold, 31-Frame, 32-Inner plate, 33-Holding rod, 34-Anti-detachment flange. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Example 1

[0037] See appendix Figure 2 The temperature sensing wide-field probe 1 to be fabricated in Example 1 includes a substrate 11. The substrate 11 is a square planar thin plate structure made of a light-transmitting material with low thermal conductivity. It can be glass, plexiglass, epoxy resin, etc. In this example, transparent epoxy resin is used to make the substrate 11. One side of the substrate 11 is a particle surface and the other side is a light-illuminated surface. Diamond particles 12 (containing NV color centers) are distributed at intervals on the particle surface. The size range of the diamond particles 12 is 50um-120um. To improve the detection sensitivity, it is preferable that the ends of all diamond particles 12 away from the light-transmitting plane substrate 11 are close to the same virtual plane.

[0038] See appendix Figure 1 Regarding the wide-field temperature sensing probe mentioned above, this embodiment discloses a manufacturing method, the specific process of which is as follows:

[0039] A method for fabricating a wide-field sensing probe, characterized by comprising the following steps:

[0040] S1, preparing a micro-particle mixture: specifically, a certain amount of diamond micro-particles with NV color centers with a size of 60um-100um is added to isopropyl alcohol, and the diamond micro-particles in the mixture are uniformly distributed by vibration, stirring, etc. The concentration of the diamond micro-particles in the prepared mixture is 0.4mg / ml-1mg / ml;

[0041] S2, uniformly distributing the micro-particles in the mold: specifically, referring to the attached Figure 3 A small amount of the mixture is poured into the first mold 2, and isopropyl alcohol is volatilized after a period of time, and the diamond micro-particles are left in the first mold 2, and the diamond micro-particles are uniformly distributed. In this example, the structure of the first mold 2 is shown in the attached Figure 3 , which is a square shell structure with a smooth and flat inner bottom surface;

[0042] S3, making a semi-solid substrate: specifically, referring to the attached Figure 4 The liquid epoxy resin is mixed with the curing agent and then poured into the second mold 3 to shape, and then placed for a period of time until it becomes semi-solid, i.e. the substrate raw material is in a plastic state but will not deform within a short period of time when placed upside down. In this example, the structure of the second mold 3 is shown in the attached Figure 5 , which includes a frame 31 and an inner plate 32, the inner plate 32 is movably inserted into the inner cavity of the frame 31, the gap between the periphery of the inner plate 32 and the inner wall of the frame is not greater than 50um (under this gap width, the fluid raw material poured will not leak from the gap without additional pressure), the inner plate 32 is provided with a handle 33 at the middle of the bottom end, and one end of the frame 31 is provided with an anti-loose flange 34. In use, the inner plate 32 is first kept in the frame 31, a certain amount of substrate raw material is poured on the surface of the inner plate 32, and is left until it is semi-cured, and the surface of the semi-cured substrate is flattened by a flat plate;

[0043] S4, combining the substrate with the micro-particles: referring to the attached Figure 6 The second mold 3 is inverted, the inner plate 32 is pushed to make the semi-cured substrate protrude out of the frame 31, and the semi-cured substrate is controlled to be flattened on the diamond micro-particles in the first mold 2 with a certain pressure until the substrate raw material is completely cured;

[0044] In this example, the inner cavity size of the first mold 2 is larger than the size of the frame 31, after the second mold 3 is inverted, the frame 31 is first pressed in the middle area of the inner cavity of the first mold 2, and then the inner plate 32 is pushed to flatten the diamond micro-particles on the lower side of the semi-cured substrate;

[0045] Explanation of the above steps: referring to the attached Figure 7, it is found through experiments that, after the mixed solution of microparticles is poured into the first mold 2 and isopropanol volatilizes, the diamond microparticles in the middle part of the inner cavity of the first mold 2 are uniformly distributed, and the concentration of the diamond microparticles near the angle position is obviously higher than that in the middle part. In order to ensure the uniformity of the distribution of the diamond microparticles on the substrate, only the middle part of the first mold 2 is selected as the covering area of the semi-solid substrate in step S4.

[0046] S5, obtaining a finished product: after the substrate raw material is solidified, the diamond microparticles are embedded in one side surface of the substrate, the substrate is demolded and taken down, and post-processing is performed on the substrate to obtain a finished product.

[0047] The post-processing includes cutting the non-uniformly distributed microparticles in the edge of the substrate using a cutting device. The specific reasons for implementing the cutting step are as follows:

[0048] Referring to FIG. 6, which is a schematic diagram of the temperature sensing wide field probe in the embodiment, the temperature sensing wide field probe includes a substrate 1 and a plurality of diamond microparticles 2. Figure 8 It is found through inspection that, after the substrate is bonded with the diamond microparticles and is solidified, the concentration of the diamond microparticles in the edge part of the substrate is lower than that in the middle part of the substrate. The reason is that, in order to ensure reliable bonding of the diamond microparticles, pressure is applied to the top surface of the substrate during solidification. The pressure causes the edge of the substrate to slightly stretch outward, and the concentration of the diamond microparticles in the stretched part is relatively low, that is, the non-uniformly distributed microparticle area in the figure.

[0049] Design purpose: The temperature sensing wide field probe has high requirements for the uniformity of the distribution of the diamond microparticles thereon. If the diamond microparticles are not uniformly distributed, the detection accuracy will be affected. Based on this reason, the embodiment is designed to place the diamond microparticles uniformly in the mold first, and then to make the probe by the method of pressing the semi-solid substrate against the diamond microparticles in the mold and then solidifying. This method can effectively ensure the uniformity of the distribution of the diamond microparticles on the substrate. Compared with the method of directly pouring the substrate raw material in a fluid state into the mold to cover the diamond microparticles to make the probe (this method will impact the diamond microparticles, causing them to shift and gather, and thus resulting in uneven distribution), the probe made by the method has higher quality.

[0050] Embodiment two

[0051] Referring to FIG. 6, which is a schematic diagram of the temperature sensing wide field probe in the embodiment, the temperature sensing wide field probe includes a substrate 1 and a plurality of diamond microparticles 2. Figure 9 The temperature sensing wide field probe is to be made in the embodiment, and the overall structure thereof is similar to that of the temperature sensing wide field probe in Embodiment One. The difference is that a layer of anti-reflection film is arranged on the light-irradiated surface of the substrate, which can effectively improve the light transmittance of the substrate and reduce reflected light. A thin layer of reflective heat insulation paint is arranged on the microparticle surface. The thin layer of reflective heat insulation paint can reflect the trigger light that does not act on the diamond particles, that is, reduce the irradiation of the trigger light on the chip, reduce the warming effect of the trigger light on the chip, and is conducive to accurately measuring the temperature of the surface of the chip.

[0052] Based on the design of the above-mentioned anti-reflection film and the reflective thermal insulation coating layer, the following steps are additionally provided in the manufacturing method in the present embodiment:

[0053] 1) Adding a thin layer of reflective thermal insulation coating

[0054] In step S3, after the substrate raw material is in a semi-solid state, a thin layer (extremely thin, thickness not greater than 40 um) of reflective thermal insulation coating is sprayed on the substrate by a spraying device, and the surface is used as the surface for flat contact with the diamond particles. Referring to FIG. 2, when the surface is used to contact the diamond particles, the diamond particles will pierce the thin layer of reflective thermal insulation coating, so that the diamond particles themselves are not affected by the reflective thermal insulation coating, but the part of the substrate surface without diamond particles is affected by the reflective thermal insulation coating. Figure 10

[0055] 2) Adding an anti-reflection film

[0056] After the substrate is demolded and taken out, an anti-reflection film is provided on the upper surface of the substrate by sputtering.

[0057] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details and do not limit the present application to the specific embodiments. Obviously, many modifications and changes can be made according to the content of the present specification. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and utilize the present application. The present application is limited only by the claims and their entire scope and equivalents.​

Claims

1. A method of processing a wide-field sensing probe, characterized by, The method comprises the following steps: S1, preparing a micro-particle mixture: preparing a micro-particle mixture of a certain concentration, wherein the diamond micro-particles contain NV color centers; S2, uniformly distributing the micro-particles in a mold: pouring the mixture into a first mold, and standing for a period of time until the liquid in the mixture evaporates, and the diamond micro-particles containing NV color centers are uniformly distributed in the first mold; S3, making a semi-solid substrate: pouring a substrate raw material in a fluid state into a second mold to shape, and then standing for a period of time until the substrate raw material is in a semi-solid state, i.e., the substrate raw material is in a plastic state but will not deform in a short time when it is placed upside down; after the substrate raw material is in a semi-solid state, a reflective thermal insulation coating is sprayed on the substrate raw material by a spraying device to form a thin layer of the reflective thermal insulation coating, and the surface is used as the surface in contact with the diamond micro-particles in a flat pressing manner; S4, combining the substrate and the micro-particles: after the substrate raw material is taken out of the second mold, it is placed in the first mold to be flat pressed on the diamond micro-particles in the first mold until the substrate raw material is completely solidified; S5, obtaining a finished product: after the substrate raw material is solidified, the diamond micro-particles are embedded in one side surface of the substrate, the substrate is demolded, and post-processing is performed on the substrate to obtain a finished product.

2. The method of claim 1, wherein, The solution used in the diamond NV color center micro-particle mixture is ethanol or isopropyl alcohol.

3. The method of claim 1, wherein The size of the diamond NV color center micro-particles is less than 0.1 mm.

4. The method of claim 1, wherein, The second mold comprises a frame and an inner plate, the inner plate is movably inserted into the inner cavity of the frame, and the gap width between the periphery of the inner plate and the inner wall of the frame is not greater than 50 um; in use, first, keep the inner plate in the frame, pour a certain amount of substrate raw material on the surface of the inner plate, stand until it is semi-solidified, and then perform flattening treatment on the surface of the semi-solidified substrate; then, invert the second mold, push the inner plate to make the semi-solidified substrate protrude out of the frame, control the semi-solidified substrate to be flat pressed on the diamond micro-particles in the first mold with a certain pressure, and then completely solidify the substrate raw material.

5. The method of claim 4, wherein, The inner cavity size of the first mold is greater than the size of the frame, after the second mold is inverted, first, press the frame in the middle area of the inner cavity of the first mold, and then push the inner plate to make the semi-solidified substrate flat press on the diamond micro-particles on the lower side.

6. The method of claim 1, wherein The substrate is a cured transparent epoxy resin, glass, or organic glass.

7. The method of claim 1, wherein The post-processing includes cutting the non-uniformly distributed micro-particles on the edge of the substrate using a cutting device.

8. The method of claim 1, wherein, The post-processing includes flattening the surface of the substrate away from the diamond micro-particles, and adding a layer of anti-reflection film on the flattened surface.

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