A flat panel loudspeaker based on a digital sound chip

Abstract

The application discloses a flat panel loudspeaker based on a digital sound production chip, and relates to the field of digital loudspeakers, and aims to solve the problems of large size, slow response, poor sound quality and insufficient bass of existing flat panel loudspeakers. A plurality of digital sound production chips are arranged on a substrate in the flat panel loudspeaker, and the digital sound production chip comprises an ASIC module and a plurality of groups of sound production pixel unit arrays. Each digital sound production chip can play the same audio; or a plurality of digital sound production chips can play one audio in combination; so that the sound quality and the sound pressure level of the flat panel loudspeaker are improved.

Description

Technical Field

[0001] This invention relates to the field of digital loudspeaker technology, and more particularly to a flat panel loudspeaker based on a digital sound-generating chip. Background Technology

[0002] A loudspeaker is an electromechanical component that converts electrical signals into sound signals that propagate through the air, playing a vital role in many fields of consumer electronics and acoustic technology. Classified by transduction method, loudspeakers can be categorized into electrodynamic (moving coil), electromagnetic (reed), piezoelectric (crystal), capacitive (electrostatic), compressed air, and ionizing types. Among the many types of loudspeakers, the planar loudspeaker, also often called a flat-panel diaphragm loudspeaker, has a vibration generator. A planar loudspeaker consists of a sound source input device, a signal amplifier (power amplifier), and the speaker, forming a complete system. Sound is produced by an exciter (driver) exciting bending waves in the sound-producing plate. It is currently widely used in home theater systems, background music systems, multimedia audio systems, and public address systems. Compared to point-source loudspeakers, planar loudspeakers have better angular coverage in the mid-frequency range, resulting in a wider sound directivity.

[0003] However, existing flat panel speakers are large in size, slow in response, have poor sound quality, and insufficient bass extension.

[0004] Therefore, there is an urgent need to provide a more reliable flat panel speaker system based on digital sound-generating chips. Summary of the Invention

[0005] The purpose of this invention is to provide a flat panel speaker based on a digital sound chip, which solves the problems of existing flat panel speakers such as large size, slow response, poor sound quality and insufficient bass extension.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A flat panel speaker based on a digital sound chip, the flat panel speaker comprising at least:

[0008] substrate;

[0009] The substrate is provided with a microprocessor and multiple digital sound-generating chips. Each digital sound-generating chip includes multiple sound-generating pixel unit arrays and an ASIC module. The sound-generating pixel units are divided into multiple groups. The ASIC module uses a digital sound reconstruction algorithm to split the audio into multiple digital switching signals and distribute them to each group of sound-generating pixel units. The sound-generating pixel units are used to emit pulse sound waves.

[0010] Optionally, each of the digital sound-generating chips plays the same target audio.

[0011] Alternatively, several of the aforementioned digital sound chips can be combined into a single digital sound system to play a target audio.

[0012] Optionally, the diaphragm mass is less than a preset threshold to control the transient response time of the pixel sound-emitting unit to be in the microsecond range.

[0013] Optionally, the digital sound chip is divided into multiple groups, each group generating a specific directional sound wave;

[0014] Alternatively, the ASIC module processes the same target audio signal so that each group of digital sound chips emits sound separately, forming a virtual stereo surround sound.

[0015] Optionally, the thickness of one of the digital sound-generating chips is less than or equal to 2 mm, the length is less than 20 mm, and the size of the flat panel speaker covers up to 5000 mm.

[0016] Optionally, the digital sound-generating chips are arranged in a line or an array; multiple flat panel speakers are cascaded together to generate sound.

[0017] Optionally, the shape of the flat panel speaker includes: a flat rectangular plate formed by a layer of chips arranged on a plane, or any shape in which the chips are arranged on a two-dimensional or three-dimensional plane.

[0018] Optionally, when the flat panel speaker is of any shape on a three-dimensional plane, the sound directionality range is greater than 180°.

[0019] Optionally, the digital sound chip is covered by a housing, the housing is provided with a sound-transparent membrane, and the housing is provided with a sound outlet hole that penetrates the housing in a direction perpendicular to the substrate.

[0020] Optionally, MEMS technology can be used to ensure that multiple digital sound chips are on the same wafer.

[0021] Compared with existing technologies, the present invention provides a flat panel speaker system based on digital sound-generating chips. The flat panel speaker includes at least a substrate, on which a microprocessor and multiple digital sound-generating chips are disposed. Each digital sound-generating chip includes multiple arrays of sound-generating pixel units, which are divided into multiple groups. The digital sound-generating chips have small planar dimensions and thin thickness, which not only allows for a small overall size of the flat panel speaker based on digital sound-generating chips, enabling flexible arrangement within a limited space, but also allows for the formation of larger flat panel speakers by increasing the number of cascaded chips, resulting in a higher sound pressure level and thus a wider range of applications. Furthermore, the superposition of sound waves from multiple cascaded digital sound-generating chips into an array also improves the response speed and signal-to-noise ratio. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0023] Figure 1 A schematic diagram of a flat panel speaker based on a digital sound chip array provided in an embodiment of the present invention;

[0024] Figure 2 This is a top view of the structure of the digital sound-generating chip provided in an embodiment of the present invention.

[0025] Figure label:

[0026] 10. Digital sound chip; 20. Substrate; 30. Housing; 40. Acoustic membrane; 100. Sound-emitting pixel unit; 110. ASIC module; 120. Digital sound chip substrate. Detailed Implementation

[0027] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. For example, the first threshold and the second threshold are merely used to distinguish different thresholds and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" are not necessarily different.

[0028] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0029] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0030] Next, the solutions provided in the embodiments of this specification will be described in conjunction with the accompanying drawings:

[0031] Figure 1 This is a schematic diagram of a flat panel speaker based on a digital sound-generating chip array, provided as an embodiment of the present invention. Figure 1 As shown, the flat panel speaker includes a digital sound-generating chip 10, a substrate 20, a housing 30, and a sound-permeable diaphragm 40. The substrate 20 is used to fix and support the various components and to connect them. The digital sound-generating chips 10 are the basic components for cascading into an array. The flat panel speaker also includes a microprocessor. The substrate 20 connects and supports the various components; the housing 30 protects the digital sound-generating chips and prevents the sound waves emitted by the chips from overlapping with other chips too quickly (guiding function); the sound-permeable diaphragm 40 also protects the digital sound-generating chips and provides a certain degree of waterproofing. The flat panel speaker consists of an array of M*N cascaded digital sound-generating chips, with a length and width of approximately 10-5000 mm and a thickness of approximately 2-20 mm, where M≥1 and N≥1.

[0032] Furthermore, the structure of the digital voice chip can be combined with... Figure 2 , Figure 2 This is a top view of the structure of a digital sound-generating chip provided in an embodiment of the present invention. Figure 2 As shown, each digital sound-generating chip 10 may include multiple sound-generating pixel units 100, forming a sound-generating pixel unit array, and also includes an ASIC module 110 and a digital sound-generating chip substrate 120. The sound-generating pixel units 100 can be divided into multiple groups. The sound-generating pixel unit 100 is the basic transducer element constituting the digital sound-generating chip, converting electrical pulse signals into acoustic pulse signals. Each chip consists of an array of X*Y cascaded sound-generating pixel units, which together superimpose sound waves to generate sound, where X≥1 and Y≥1. The ASIC module 110 can calculate the required number and position of working pixels based on the input digital audio signal using the DSR algorithm, decompose the audio signal into multiple quantized digital pulse signals, and output them to each sound-generating pixel unit 100. The digital sound-generating chip substrate 120 is used to connect and support the various components.

[0033] It should be noted that when the number of cascaded digital sound-generating chips 10 is small, the ASIC module 110 on the digital sound-generating chip 10 can be removed, and the microprocessor can execute the DSR algorithm to directly distribute the split digital pulse signal to each sound-generating pixel unit 100 on different digital sound-generating chips 10.

[0034] ASIC stands for Application Specific Integrated Circuit, which is considered in the integrated circuit industry to be an integrated circuit designed for a specific purpose.

[0035] The sound-emitting pixel unit 100 may include:

[0036] The device comprises an electrode, a diaphragm, a substrate, a support structure, and a dielectric structure; the substrate forms a cavity, and the electrode has a through hole for allowing air in the cavity to circulate with the outside; the support structure connects the diaphragm, and the dielectric structure is disposed between the diaphragm and the electrode, separating the diaphragm and the electrode to form a gap.

[0037] Each of the digital sound-generating chips can play the same target audio. For example, a flat panel speaker includes chip 1, chip 2 and chip 3, and the audio to be played is audio A. In one implementation, chip 1 plays audio A, chip 2 plays audio A, and chip 3 plays audio A.

[0038] Alternatively, several of the aforementioned digital sound chips can be combined into a single digital sound system to play a target audio, thereby increasing the bit count and improving the sound quality of the played target audio. Continuing the previous example, chip 1, chip 2, and chip 3 can be considered as a single unit X, with X playing audio A.

[0039] The sound-emitting pixel unit includes a diaphragm with a mass less than a preset threshold to control the transient response time of the pixel sound-emitting unit in the microsecond range. This preset threshold can be a typical diaphragm size used in the industry; here, the diaphragm mass in this solution is relatively small, allowing the transient response time of the pixel sound-emitting unit to be controlled in the microsecond range, for example, 10 microseconds.

[0040] The digital sound chip can be divided into two groups, one group for emitting left channel sound waves and the other group for emitting right channel sound waves; the microprocessor processes the actual audio signal to make the two groups of digital sound chips emit sound respectively, forming a virtual stereo surround sound.

[0041] The digital sound-generating chips can be arranged in rows and columns or in an array; multiple flat panel speakers can be cascaded to produce sound together, achieving surround sound playback with 5, 7, or higher channels. The shape of the flat panel speaker can include: a flat rectangular plate formed by a layer of chips arranged on a plane, or any shape of chips arranged on a two-dimensional or three-dimensional plane. When the shape of the flat panel speaker is any shape on a three-dimensional plane, the sound directionality is greater than 180°.

[0042] The digital sound chip is covered by a housing, which has a sound-permeable membrane and a sound outlet hole that extends through the housing in a direction perpendicular to the substrate.

[0043] Figure 1The flat panel speaker in the system has a directional function when emitting sound. The specific implementation process may include: the system receiving the azimuth angle of the target audio, and calculating the phase that each digital sound chip needs to advance or lag according to the azimuth angle; allocating the acquired actual audio signal to each digital sound chip; the actual audio signal includes phase information; driving multiple sound-emitting pixel units of each digital sound chip to emit pulse sound waves of different phases based on a driving signal; and superimposing the pulse sound waves of different phases corresponding to each digital sound chip to reconstruct the directional target audio.

[0044] A planar loudspeaker system based on digital sound chips. The planar loudspeaker includes at least a substrate, on which a microprocessor and multiple digital sound chips are mounted. Each digital sound chip includes multiple arrays of sound-emitting pixel units, which are divided into multiple groups. The digital sound chips are small in size and thin, which not only allows for a small overall size of the planar loudspeaker and flexible arrangement within a limited space, but also enables the formation of larger planar loudspeakers by increasing the number of cascaded chips, resulting in higher sound pressure levels and a wider range of applications. The superposition of multiple cascaded digital sound chips into an array to generate sound waves improves response speed and signal-to-noise ratio, and allows audio signals to be received only in a specified direction, thus ensuring both improved response speed and signal-to-noise ratio while maintaining directional characteristics.

[0045] In practical implementation, the antenna baseband receives the wireless positioning signal to obtain the desired azimuth of the sound. The microprocessor calculates the azimuth angle based on the azimuth angle. Using a directivity algorithm, the microprocessor calculates the phase that each digital sound-emitting chip needs to advance or lag behind based on the required azimuth angle. The input audio signal is decoded by the microprocessor, which then distributes the audio signal with phase information to each digital sound-emitting chip. The ASIC module of the digital sound-emitting chip performs modulation and decimation operations using the DSR algorithm based on the input audio signal, obtaining multiple quantized digital pulse signals, which are then distributed to each transducer element. Each pixel sound-emitting unit receives the digital pulse signal and applies a potential difference between the electrode and the diaphragm to generate electrostatic force. The diaphragm then adheres to the electrode, exhibiting significant acceleration, thus generating a pulsed sound wave. The sound waves emitted by the pixels of a single digital sound-emitting chip superimpose to form advanced or delayed sound waves. The sound waves of different phases generated by each digital sound-emitting chip are superimposed again to form a directional audio wave.

[0046] The sound-generating array, whether a linear sound source or an N*M array, can be used in miniature MEMS loudspeakers. In these loudspeakers, the electrode plates can have arrayed circular or elongated holes to allow air to flow between the electrode plates and the resonating plate, creating air damping. Multiple MEMS loudspeakers can be used, arranged in an array, line, or row-column configuration. Correspondingly, during sound generation, multiple quantized audio digital streams can be converted into driving electrical signals, which are then used to drive the transducer array to obtain the sound signal.

[0047] Optionally, the flat panel speaker may further include a positioning device, which can be used to locate the receiving direction of the target audio and send the receiving direction to the microprocessor; the microprocessor calculates the receiving azimuth angle based on the receiving direction. The positioning device may be a wireless positioning transmitter. The flat panel speaker may also include an antenna baseband for receiving the wireless positioning signal sent by the positioning device and transmitting it to the microprocessor.

[0048] It should be noted that in the above embodiments, there can be several input azimuth angles; furthermore, the directional function of the flat panel speaker can be bypassed to emit omnidirectional audio. When the digital sound chip is divided into two parts (a number of chips in one part play the left, and a number in the other part play the right), the audio of the left and right channels is played respectively, and directed towards the left and right ears of the listener, thus achieving a stereo effect. On this basis, the microprocessor can also process the audio before playback to achieve virtual surround sound.

[0049] The implementation scheme in the above embodiments is a flat panel speaker based on a digital sound chip array. Multiple digital sound chips are cascaded into an array to superimpose sound waves for sound generation. Simultaneously, the azimuth angle of the desired audio signal is input, and a directivity algorithm adjusts the phase of each chip in the array to advance or lag its sound emission. After the sound waves are superimposed, audio signals can be received only in that direction. This design offers advantages such as thinness, fast response, high signal-to-noise ratio, and a flat frequency response curve, while also providing directivity.

[0050] In addition, the flat panel speaker based on a digital sound chip array provided in this solution can be further described in terms of response time, form factor, cascading, and applicable scenarios:

[0051] First, regarding the response time of a flat panel speaker based on a digital sound chip array, since the diaphragm of each pixel sound unit is extremely light and has high damping, the transient response time can be controlled within ten to tens of microseconds, which is far lower than the millisecond-level response time of traditional speakers.

[0052] The size advantages of flat panel speakers based on digital sound chip arrays are as follows: the thickness of the speaker can preferably be 2mm or less, and no acoustic back cavity is required; the length and width of a single chip can be less than 20mm, and by cascading multiple chips and adjusting the number and spacing of the chips, the size of the flat panel speaker can cover up to 5000mm.

[0053] The form of a flat panel speaker based on a digital sound chip array can vary: it can be a flat, rectangular plate, consisting of a single layer of chips arranged on a surface; these can all be referred to as a flat panel speaker. It can also be any shape on a two-dimensional plane, such as a circle, rectangle, hexagon, etc. Furthermore, it can be any shape on a three-dimensional plane, such as a convex mirror with a larger divergence angle, providing a directional range greater than 180°; or a concave mirror to focus sound. It can also be ring-shaped, hemispherical, spherical, etc., to achieve a realistic surround sound effect.

[0054] For cascading flat panel speakers based on digital sound chip arrays: Besides row and column arrangements, chip cascading can also be done using arrays, including linear, circular, and spiral arrangements. Multiple flat panel speakers can also be cascaded to produce sound together, communicating with each other via wired or wireless means.

[0055] For the application scenarios of flat panel speakers based on digital sound chip arrays: smaller flat panel speakers can be placed in home appliances such as TVs, monitors, and audio equipment, mainly for indoor use; larger flat panel speakers can be used outdoors; multiple flat panel speakers arranged separately in a surround sound configuration can be used to achieve surround sound in a home theater; and ring-shaped flat panel speakers can be used in special occasions such as cinemas and exhibitions.

[0056] Furthermore, for the flat panel speaker based on a digital sound chip array in this solution, the sound-emitting pixel units of a digital sound chip are divided into k groups, with each group having 2 0 ,2 1 ,2 2 ……2 k-1 There are k sound-producing pixels. From k groups of pixels, 0 to 2 can be reconstructed. k-1 The desired integer number of pixels within the range. At this point, a single chip has k-bit precision. When N chips are combined and used as a larger chip to play an audio signal, the pixels can be divided into k+log2(N) groups. That is, combining these N chips increases the precision by log2(N) bits, improving the sound quality and sound pressure level of the flat panel speaker.

[0057] Regarding the consistency of flat panel speakers based on digital sound chip arrays: Digital sound chips have a simple structure, and MEMS technology ensures that multiple chips are on a single wafer, with consistency in size and performance, enabling simultaneous etching and other processing steps; this synchronous process in semiconductors makes it easier to achieve consistency in size and performance between pixel units and sound chips on the same wafer, and the cascading of multiple sound chips has greater advantages.

[0058] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0059] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.

Claims

1. A flat panel loudspeaker based on a digital sound chip, characterized in that, The flat panel loudspeaker comprises at least: a substrate; a microprocessor and a plurality of digital sound generating chips are arranged on the substrate, the digital sound generating chips are arranged in a line or an array; a plurality of the flat panel loudspeakers are cascaded to generate sound together; the flat panel loudspeaker has a flat panel rectangular shape formed by arranging a layer of chips on a plane, or an arbitrary shape formed by arranging chips on a two-dimensional plane or a three-dimensional plane; when the flat panel loudspeaker has an arbitrary shape on a three-dimensional plane, the sound pointing range is greater than 180°; each digital sound generating chip comprises a plurality of sound pixel unit arrays and an ASIC module; an outer shell is attached to the outside of the digital sound generating chip, the outer shell is provided with a sound permeable film, and the outer shell is provided with a sound outlet hole penetrating the outer shell in a direction perpendicular to the substrate; the sound pixel units are divided into groups; the ASIC module uses a digital sound reconstruction algorithm to split an audio into a plurality of digital switch signals and distribute the signals to each group of sound pixel units; the sound pixel units are used to emit pulse sound waves; the sound pixel units comprise a diaphragm, an electrode, a substrate, a support structure and a dielectric structure; the substrate forms a cavity, the electrode is provided with a through hole for air in the cavity to circulate with the outside; the support structure is used to connect the diaphragm, and the dielectric structure is arranged between the diaphragm and the electrode to separate the diaphragm and the electrode and form a gap; the mass of the diaphragm is less than a preset threshold to control the transient response time of the pixel sound generating unit to be in the order of microseconds; the digital sound generating chips are divided into groups, and each group generates a designated directional sound wave; alternatively, the ASIC module processes the same target audio signal to make each group of digital sound generating chips generate sound respectively to form a virtual stereo surround sound; each digital sound generating chip plays the same target audio respectively; alternatively, a plurality of digital sound generating chips are combined into a digital sound generating system to play a target audio.

2. The flat panel loudspeaker based on digital sound chip of claim 1, wherein, The thickness of one digital sound generating chip is less than or equal to 2mm, and the length is less than 20mm, and the size of the flat panel loudspeaker covers up to 5000mm.

3. The flat panel loudspeaker based on digital sound chip of claim 1, wherein, MEMS technology is used to ensure that a plurality of digital sound generating chips are on the same wafer.

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