Power conversion device

Abstract

A power conversion device (1) includes a capacitor unit (30) connected to a semiconductor module and a busbar module (6) that molds a busbar (7) with an insulating resin. The busbar module (6) includes a first fixed portion (64) and a second fixed portion (65) that are provided integrally with the busbar module (6) and are fixed to a case (10) by a fixing member (8). The first fixed portion (64) and the second fixed portion (65) are in a shape that protrudes more toward a capacitor side than the busbar (7) when the busbar module (6) and the capacitor unit (30) are viewed in a height direction. The first fixed portion (64) and the second fixed portion (65) are located between the busbar (7) and the capacitor unit (30).

Description

[0001] Citation of relevant applications

[0002] This application is based on Japanese Patent Application No. 2020-018238, filed on February 5, 2020, the contents of which are incorporated herein by reference. Technical Field

[0003] The disclosure in this specification relates to an electric power conversion device. Background Technology

[0004] Patent document 1 discloses a power conversion device having a busbar arranged close to a capacitor.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-82646 Summary of the Invention

[0008] The capacitor in Patent Document 1 is capable of receiving heat from the busbar. There is ample room for improvement in the device of Patent Document 1 regarding the suppression of capacitor heating, and improvements are required.

[0009] The purpose of this disclosure is to provide a power conversion device that suppresses the thermal effects of bus heat dissipation on capacitors.

[0010] The various methods disclosed in this specification employ different technical means to achieve their respective objectives. Furthermore, the symbols enclosed in parentheses in the claims and their respective claims are merely examples of how to indicate the correspondence between a method and the specific elements described in the embodiments described below, and do not limit the scope of the technology.

[0011] One of the disclosed power conversion units includes: a power conversion section that performs power conversion and supplies current to a load; a capacitor connected to the power conversion section; a busbar module having a busbar for current flow and molded with an insulating resin; and a housing that houses the power conversion section, the capacitor, and the busbar module.

[0012] The bus module includes a fixed part that is integrally disposed with the bus module and fixed to the housing by a fastener. The fixed part is shaped to protrude further toward the capacitor side than the bus when viewed in the height direction of the bus module and the capacitor, and is located between the bus and the capacitor.

[0013] According to this power conversion device, the busbar module has a fixed portion that protrudes further towards the capacitor than the busbar, which generates more heat due to current. When viewed from a height perspective, the fixed portion is located between the busbar and the capacitor. Therefore, the busbar is positioned at a distance from the capacitor that is at least equivalent to the size of the fixed portion. The power conversion device has a structure that prevents heat dissipation from the busbar from being transferred to the capacitor. This provides a power conversion device that suppresses the thermal effects of busbar heat dissipation on the capacitor. Attached Figure Description

[0014] Figure 1 This is a circuit diagram of the power conversion device according to the first embodiment. Figure 2 This is a diagram showing the schematic structure of the power conversion device according to the first embodiment. Figure 3 It is a diagram showing the positional relationship between the busbar and surrounding equipment. Detailed Implementation

[0015] Hereinafter, various embodiments for implementing this disclosure will be described with reference to the accompanying drawings. In each embodiment, the same reference numerals are sometimes used to denote parts corresponding to matters described in the preceding embodiments, and repeated descriptions are omitted. In cases where only a portion of the structure is described in each embodiment, the previously described other embodiments can be applied to the other parts of the structure. Not only are combinations of combinable parts specifically and explicitly described in each embodiment, but embodiments can also be partially combined even if not explicitly described, as long as they do not hinder combination.

[0016] <First Implementation>

[0017] Reference Figures 1 to 3 A first embodiment of a power conversion device, as disclosed herein, will be described. The power conversion device can be applied to on-board power conversion devices installed in vehicles such as electric vehicles or hybrid vehicles. Power conversion devices capable of achieving the purposes stated in the specification can be applied to inverter devices, converter devices, etc. This converter device includes a power supply device with AC input and DC output, a power supply device with DC input and DC output, and a power supply device with AC input and AC output. In this embodiment, as an example of a power conversion device, a device suitable for an inverter device will be described below.

[0018] The power conversion device 1 includes an inverter circuit 200. For example... Figure 1 As shown, the inverter circuit 200 includes multiple semiconductor modules 2, thereby constituting a power conversion unit. By switching the semiconductor elements 20 (IGBT elements) included in the semiconductor modules 2 on and off, the DC power supplied from the DC power supply 100 is converted into AC power. The vehicle uses the obtained AC power to drive the three-phase AC motor 110 to travel.

[0019] The DC power supply 100 is, for example, a plurality of secondary batteries. The secondary batteries can be lithium-ion batteries, nickel-metal hydride batteries, or organic radical batteries, etc. The power conversion device 1 includes a three-phase bridge connected in parallel between a P bus connected to the positive terminal of the DC power supply 100 and an N bus connected to the negative terminal of the DC power supply 100. Each phase bridge includes a plurality of semiconductor elements 20 connected in series between the P bus and the N bus.

[0020] Alternatively, the inverter circuit 200 can be described as including three upper and lower arm circuits, each with two arms connected in series. The inverter circuit 200 has a smoothing capacitor 3 connected to its input side and a three-phase AC motor 110 connected as a load to its output side. The three upper and lower arm circuits can be designated, for example, as phase U, phase V, and phase W, starting from the side of the smoothing capacitor 3. Alternatively, the arm on the high-potential side of each upper and lower arm circuit can be described as the upper arm, and the arm on the low-potential side as the lower arm.

[0021] Current sensor 5 detects the output current of the arm. Current sensor 5 outputs an electrical signal corresponding to the arm's output current to the control device. This electrical signal is a feedback signal, which is equivalent to the output current signal.

[0022] The power conversion device 1 includes a busbar having an input-side busbar and an output-side busbar. The power conversion device 1 includes a busbar for power input and output. This busbar in the power conversion device 1 includes conductive members connected to terminals on the input side and conductive members connected to terminals on the output side. This busbar is a conductive member connected to at least one of the semiconductor module 2 and the capacitor on either the input or output side. Such a busbar forms a power path and generates heat, thus dissipating heat to surrounding components. The input-side busbar is, for example, a P-bus and an N-bus.

[0023] The output-side bus is, for example, the bus in the power path through which the output current flows from the arm to the three-phase AC motor 110. The current sensor 5 detects the output current flowing through the output-side bus. The output-side bus is located in the power path connecting the upper and lower arm connection 21a in phase U to the windings of the three-phase AC motor 110. The output-side bus is located in the power path connecting the upper and lower arm connection 21b in phase V to the windings of the three-phase AC motor 110. The output-side bus is located in the power path connecting the upper and lower arm connection 21c in phase W to the windings of the three-phase AC motor 110.

[0024] The power conversion device 1 includes a housing 10 that houses multiple electrical components. The power conversion device 1 houses capacitor units 30 within the housing 10. Each capacitor unit 30 includes at least a smoothing capacitor 3 and a Y-capacitor 4. The smoothing capacitor 3 is connected in parallel with a semiconductor module 2. One of the Y-capacitors 4 is connected to the positive terminal wiring and grounded. Another Y-capacitor 4 is connected to the negative terminal wiring and grounded. In a vehicle, the Y-capacitors 4 are electrically connected to the vehicle body ground, such as the chassis, via the housing of the power conversion device 1.

[0025] The housing 10 houses multiple semiconductor modules 2, smoothing capacitors 3, Y capacitors 4, current sensors 5, control circuit boards, etc. The multiple semiconductor modules 2 are an example of a power conversion unit that performs power conversion and supplies current to the load. The smoothing capacitors 3 are connected to the semiconductor modules 2 in a energized manner. The smoothing capacitors 3 and Y capacitors 4 are integrally formed as capacitor units 30 and fixed within the housing 10.

[0026] The internal space of the housing 10 is divided, for example, into a capacitor housing space and a semiconductor module housing space by a partition. In the semiconductor module housing space, in addition to the semiconductor module 2, a control circuit board and the like are also provided.

[0027] Semiconductor module 2 includes a main body housing semiconductor element 20 and power terminals and control terminals protruding from the main body. Semiconductor module 2 is also referred to as a power module. The power terminals include an input terminal to which a DC voltage is applied and an output terminal connected to the output busbar on one side of the three-phase AC motor 110. The input terminal is connected to the terminals of a capacitor and is electrically connected to the output of the DC power supply 100 via the input busbar. The control terminals are connected to a control circuit board. The control circuit board is a circuit board in which electronic components such as arithmetic elements that control the operation of semiconductor element 20 are mounted. The switching on and off operation of semiconductor element 20 is controlled by the control circuit board. Through this control, DC power supplied from DC power supply 100 is converted into AC power. The control circuit board is electrically connected via wiring to a connector protruding from the exterior of housing 10. This connector can be connected to peripheral devices located outside the power conversion device 1.

[0028] The capacitor unit 30 contains a smooth capacitor 3 and a Y capacitor 4, which are resin-sealed with terminals exposed for connection to other electrical components. The sealing resin is made of, for example, a thermosetting resin such as epoxy resin. The sealing resin fills the gaps between each capacitor element and terminal and the housing portion of each capacitor. According to this structure, the sealing resin seals the capacitor elements and terminals. A portion of the terminals protrudes from the sealing resin. The capacitor unit 30 is fixed to, for example, a support platform by fasteners such as bolts, screws, and rivets, or by welding, brazing, or other joining methods. The support platform is integrally provided with the housing 10 or mounted on the housing 10. Hereinafter, the smooth capacitor 3 and the Y capacitor 4 are sometimes collectively referred to as capacitors.

[0029] The housing 10 forms a container. The housing 10 is formed by assembling multiple housing components. The housing 10 is composed of multiple housing components. For example, the housing 10 includes a first housing component and a second housing component. The first housing component and the second housing component are resin molded articles formed containing resin material. For example, the first housing component is a lower housing that surrounds a component, including the busbar module 6, among multiple electrical components. The housing 10 supports the busbar module 6 in a manner that prevents it from moving within the housing 10. The busbar module 6 is fixed in the first housing component. For example, the second housing component is mounted on the upper housing of the lower housing in a manner that covers the internal space of the lower housing.

[0030] The second housing component integrally includes, for example, a top wall, a side wall extending from the periphery of the top wall, and a joint. The top wall of the second housing component corresponds to the top of the housing 10, covering the semiconductor module 2, current sensor 5, control circuit board, etc. The first housing component integrally includes, for example, a bottom wall, a side wall extending from the periphery of the bottom wall, and a joint. The joints of the first and second housing components are joined together to form a frame. The bottom wall of the first housing component corresponds to the bottom of the housing 10 and is provided with a busbar module 6.

[0031] The housing 10 includes a mounting portion, i.e., a component installed on the vehicle side. The mounting component is one of the vehicle's chassis, body, or other components installed on the vehicle, i.e., a vehicle-side component. The mounting component is a functional component such as an electric motor installed on the vehicle, i.e., a vehicle-side component. The mounting portion and the mounting component are connected by fasteners such as bolts and screws.

[0032] like Figure 2As shown, the bus module 6 is positioned lower than the capacitor unit 30, the semiconductor module 2, and the current sensor 5 in the height direction (HD). Furthermore, the bus module 6 is positioned at a height where it does not overlap with the capacitor unit 30 in a direction orthogonal to the height direction. Similarly, the capacitor unit 30 is positioned at a height where it does not overlap with either the semiconductor module 2 or the current sensor 5 in a direction orthogonal to the height direction. The capacitor unit 30 is positioned lower than either the semiconductor module 2 or the current sensor 5 in the height direction.

[0033] The bus module 6 includes a bus 7, which serves as either an output bus or an input bus, and a resin portion in which the bus 7 is housed. The bus module 6 includes a fixed portion integrally formed with the resin portion. The fixed portion is made of the same material as the resin portion. The fixed portion is secured to the housing 10 by the fastening force of fasteners 8 such as bolts and screws. The resin portion contains, for example, an insulating resin. The resin portion encloses the bus 7 except for the electrically connected terminals. Multiple terminals protrude from the resin portion. The bus 7 is inserted into the mold forming the bus module 6 and integrally formed with the resin portion through the curing of the surrounding resin portion, thereby being disposed in the bus module 6.

[0034] The bus module 6 is formed having a first resin molding portion 61, a second resin molding portion 62 intersecting the first resin molding portion 61, and a connecting portion 63. The first resin molding portion 61 extends along the sidewall 30a of the Y capacitor 4 in the capacitor unit 30. For example, as Figure 3 As shown, the current sensor 5 is arranged overlapping the first resin molding portion 61 and the Y capacitor 4 in the height direction. To suppress the effect of heat dissipation, the current sensor 5 is preferably positioned so as not to overlap with the busbar 7 in the height direction. The first resin molding portion 61 molds and incorporates a portion of the busbar 7 in resin such that the first terminal portion 71 of the busbar 7 is exposed to the outside. Figure 2 In the example shown, the first terminal section 71 is connected to the terminal of the current sensor 5 via a busbar 51 extending in the height direction. The first terminal section 71 is the input terminal section for inputting power output from the power conversion unit to the busbar module 6. The first terminal section 71 is the input terminal section that forms the current path for each of the three phases: U phase, V phase, and W phase.

[0035] The second resin molding section 62 is orthogonal to the first resin molding section 61 and extends along the sidewall 30b of the capacitor unit 30 where the Y capacitor 4 and the smooth capacitor 3 are arranged. The second resin molding section 62 molds and houses a portion of the busbar 7 in resin such that the second terminal portion 72 of the busbar 7 is exposed to the outside. The second terminal portion 72 is an output terminal portion in the busbar module 6 that outputs current to the three-phase AC motor 110. The second terminal portion 72 is an output terminal portion that forms the current path for each of the U-phase, V-phase, and W-phase of the three phases. The connecting section 63 houses a busbar that connects the portion of the busbar in the first resin molding section 61 to the portion of the busbar in the second resin molding section 62. The busbar 7 includes three busbars that extend along the resin molding section and are arranged in a direction orthogonal to the extension direction.

[0036] Viewed along the height direction, the busbar module 6 and the capacitor are L-shaped along the outer periphery of the capacitor unit 30. Due to this shape, the center of gravity of the busbar module 6 is located closer to the capacitor than the first resin molding portion 61, the second resin molding portion 62, and the connecting portion 63. Therefore, according to its weight balance, the busbar module 6 is most stably supported at the center of gravity location in the region closer to the capacitor side (CS) than the connecting portion 63.

[0037] Figure 3 This shows the positions of each component, such as bus module 6 and capacitors, as viewed along the height direction (HD). To illustrate their positional relationship with bus module 6, [the text continues with further details about the positional relationship between the components and bus module 6]. Figure 3 In the diagram, capacitor unit 30 and current sensor 5 are represented by double-dotted lines, while smoothing capacitor 3 and Y capacitor 4 are represented by dashed lines. Figure 3 In the diagram, the capacitor side (CS) represents the region located closer to the capacitor than the portion of the busbar 7 embedded in the first resin molding section 61. Figure 3 In the diagram, the capacitor side represents the region located closer to the capacitor than the portion of the busbar 7 embedded in the second resin molding section 62.

[0038] The fixed portion of bus module 6 includes a first fixed portion 64 and a second fixed portion 65. For example... Figure 3 As shown, preferably, the fixed portion is not provided on the opposite side edge 61b, 62b of the busbar side (BS) located on the side opposite to the capacitor side in the outer periphery of the busbar module 6.

[0039] The first fixed portion 64 is shaped to protrude further towards the capacitor than the busbar 7 when viewed in the height direction of the busbar module 6 and the capacitor. The first fixed portion 64 is provided in the capacitor side edge portion 61a located on the capacitor side within the first resin molding portion 61. One or more first fixed portions 64 are provided in the first resin molding portion 61. When viewed in the height direction of the busbar module 6 and the capacitor, the first fixed portion 64 is located between the busbar 7 and the capacitor. According to this structure, the portion of the busbar 7 embedded in the first resin molding portion 61 is moved away from the capacitor by an amount at least equivalent to the size of the first fixed portion 64.

[0040] The second fixed portion 65 is shaped to protrude further towards the capacitor than the busbar 7 when viewed in the height direction of the busbar module 6 and the capacitor. The second fixed portion 65 is provided in the capacitor side edge portion 62a located on the capacitor side of the second resin molding portion 62. One or more second fixed portions 65 are provided in the second resin molding portion 62. When viewed in the height direction of the busbar module 6 and the capacitor, the second fixed portion 65 is located between the busbar 7 and the capacitor. According to this structure, the portion of the busbar 7 embedded in the second resin molding portion 62 is moved away from the capacitor by an amount at least equivalent to the size of the second fixed portion 65.

[0041] In the housing 10, a hole or recess with an inner diameter slightly smaller than the outer diameter of the shaft portion of the fastener 8 is formed at a position corresponding to the first fixed portion 64 and the second fixed portion 65. This hole or recess is the lower hole of the fastener 8. An internal thread is formed in this hole or recess by screwing in the external thread formed on the shaft portion of the fastener 8. Alternatively, the housing 10 may be configured such that an internal thread is formed at a position corresponding to the first fixed portion 64 and the second fixed portion 65. This internal thread is formed to engage with the external thread formed on the shaft portion of the fastener 8. The housing 10 is joined to the first fixed portion 64 or the second fixed portion 65 by screwing in the external thread of the fastener 8, which is inserted into each fixed portion, with the internal thread of the housing 10.

[0042] The effects of the power conversion device 1 according to the first embodiment will be explained. The power conversion device 1 includes: a power conversion section; a capacitor connected to the power conversion section; and a bus module 6, which has a bus 7 molded from an insulating resin. The power conversion device 1 includes a housing 10 that houses the power conversion section, the capacitor, and the bus module 6. The bus module 6 includes a fixed portion integrally formed with the bus module 6 and fixed to the housing 10 by a fastener 8. The fixed portion protrudes further from the bus 7 towards the capacitor when viewed in the height direction. The fixed portion is also located between the bus 7 and the capacitor.

[0043] According to this power conversion device 1, the bus module 6 has a fixed portion that protrudes further towards the capacitor than the bus 7, which generates more heat due to current. When viewed from a height perspective, the fixed portion is located between the bus 7 and the capacitor. Therefore, the bus 7 is positioned at a distance from the capacitor that is at least equivalent to the size of the fixed portion. Thus, the power conversion device 1 has a structure that makes it difficult for heat dissipation from the bus 7 to be transferred to the capacitor. In this way, the power conversion device 1 can suppress the thermal impact of heat dissipation from the bus 7 on the capacitor.

[0044] When viewing the bus module 6 and the capacitor along the height direction, the fixing parts are not provided on the opposite side edges 61b and 62b located on the side opposite to the capacitor side in the outer periphery of the bus module 6. The fixing parts are provided on the capacitor side edges 61a and 62a located on the capacitor side. According to this structure, the bus module 6 can be positioned away from the capacitor with an amount of space equivalent to that required for the fixing parts to be provided on the capacitor side edges 61a and 62a. As a result, the distance between the bus 7 and the capacitor can be further reduced, thus providing a power conversion device 1 in which heat dissipation from the bus 7 is less likely to be transferred to the capacitor.

[0045] The busbar module 6 includes three busbars 7 that connect the windings of each phase of the three-phase AC motor 110, which serves as the load, to the power conversion unit. These three busbars are arranged inside the busbar module 6 in a direction protruding towards the capacitor side from the fixed portion. With this structure, the output-side busbar connecting the three-phase AC motor 110 to the output portion of the power conversion unit can be positioned away from the capacitor. Therefore, a power conversion device 1 can be provided that mitigates heat transfer from the output-side busbar to the capacitor.

[0046] The bus module 6 is formed having: a first resin molded portion 61 with a first terminal portion 71 exposed to the outside; a second resin molded portion 62 with a second terminal portion 72 exposed; and a connecting portion 63 connecting the first resin molded portion 61 and the second resin molded portion 62. The second resin molded portion 62 extends in a direction intersecting the extension direction of the first resin molded portion 61. The center of gravity of the bus module 6 is located closer to the capacitor than the first resin molded portion 61, the second resin molded portion 62, and the connecting portion 63.

[0047] According to this structure, the first resin molding portion 61 and the second resin molding portion 62 extend in an intersecting manner and are connected by the connecting portion 63. Furthermore, since the center of gravity of the bus module 6 is located on the side where the fixed portion is situated and is closer to the capacitor than the bus module 6 itself, the effect of suppressing vibration of the bus module 6 is higher. Therefore, when the power conversion device 1 is installed on a moving body such as a vehicle, a bus module 6 capable of suppressing resonance can be provided.

[0048] The bus module 6 is formed having a first resin molding portion 61, a second resin molding portion 62, and a connecting portion 63. The fixed portion includes a first fixed portion 64 and a second fixed portion 65. When the bus module 6 and the capacitor are viewed in the height direction, the first fixed portion 64 is located between the portion of the bus built into the first resin molding portion 61 and the capacitor. When the bus module 6 and the capacitor are viewed in the height direction, the second fixed portion 65 is located between the portion of the bus built into the second resin molding portion 62 and the capacitor.

[0049] According to this structure, the portion of the busbar built into the first resin molding portion 61 is positioned at a location at least as far away from the capacitor as the size of the first fixed portion 64. Furthermore, the portion of the busbar built into the second resin molding portion 62 is positioned at a location at least as far away from the capacitor as the size of the second fixed portion 65. Therefore, it is possible to provide a busbar module 6 having busbars 7 separate from the capacitor in both the first resin molding portion 61 and the second resin molding portion 62.

[0050] The capacitors include a smoothing capacitor 3 and a Y-capacitor 4. When viewing the bus module 6 and the capacitors along the height direction, the Y-capacitor 4 is positioned closer to the bus module 6 than the smoothing capacitor 3. According to this structure, the Y-capacitor 4, with a temperature rise less than that of the smoothing capacitor 3 and a margin up to its heat resistance temperature, is placed in a thermally demanding environment. Therefore, a power conversion device 1 can be provided that can suppress heat absorption by the smoothing capacitor 3, which has a lower heat resistance than the capacitor 4.

[0051] When viewing the bus module 6 and the capacitor along the height direction, the Y-capacitor 4 is positioned closer to the bus module 6 than the smooth capacitor 3, and adjacent to both the first resin molding portion 61 and the second resin molding portion 62. This allows for a structure that separates the heat-sensitive smooth capacitor 3 from the portion of the built-in bus in both the first and second resin molding portions 61 and 62. Therefore, a power conversion device 1 can be provided that further suppresses heat absorption by the capacitor.

[0052] The capacitor and busbar module 6 are arranged in a manner that does not overlap in a direction orthogonal to the height direction. According to this structure, the capacitor and busbar module 6 are arranged at different heights and do not overlap entirely in a direction orthogonal to the height direction. Therefore, the capacitor can be arranged away from the busbar 7, which is a heat-generating component, in the height direction. The capacitor and busbar 7 are separated in both the protrusion direction of the fixed portion and the height direction; therefore, the thermal impact of heat dissipation from the busbar 7 on the capacitor can be further suppressed.

[0053] <Other Implementation Methods>

[0054] This disclosure is not limited to the illustrated embodiments. This disclosure includes illustrated embodiments and modifications made by those skilled in the art based thereon. For example, the disclosure is not limited to the combinations of components and elements shown in the embodiments, and various modifications can be made to implement it. The disclosure can be implemented in various combinations. This disclosure may have additional portions that can be added to the embodiments. The disclosure includes structures that omit components and elements of the embodiments. The disclosure includes substitutions or combinations of components and elements between one embodiment and another. The scope of the disclosure is not limited to the description of the embodiments. The scope of the disclosure should be understood as being expressed by the description of the claims, and also includes all modifications within the meaning and scope of equivalence to the description of the claims.

[0055] The power conversion device capable of achieving the purpose disclosed in the specification, regarding the positional relationship in the height direction of the bus module 6 and each electrical component, is not limited to... Figure 2 The structure shown is as follows. For example, the bus module 6 can also be configured to be positioned higher in the height direction (HD) than the capacitor unit 30, the semiconductor module 2, and the current sensor 5.

Claims

1. A power conversion device, comprising: A power conversion unit that performs power conversion and supplies current to the load; A capacitor, which is connected to the power conversion unit; A busbar module having a busbar for current flow, and the busbar being molded using an insulating resin; and The housing encloses the power conversion unit, the capacitor, and the bus module. The busbar module includes a fixed portion integrally disposed with the insulating resin of the busbar module. The fixing member secures the fixed part to the housing in such a way that the fixing member does not contact the busbar or penetrate the busbar, thereby fixing the busbar module having the busbar to the housing. The fixed part is a shape that protrudes further towards the capacitor than the busbar when viewed in the height direction of the busbar module and the capacitor, and is located between the busbar and the capacitor.

2. The power conversion device as described in claim 1, characterized in that, When the bus module and the capacitor are viewed along the height direction, the fixed part is not located on the opposite side edge of the outer periphery of the bus module, but on the capacitor side edge located on the capacitor side.

3. The power conversion device as described in claim 1 or 2, characterized in that, The busbars are three busbars that connect the windings of each phase of the three-phase AC motor, which serves as the load, to the power conversion unit. The three busbars are arranged inside the busbar module along the direction in which the fixed part protrudes toward the capacitor side.

4. The power conversion device as described in claim 1 or 2, characterized in that, The busbar module is formed having: a first resin molded portion in which a first terminal portion of the busbar is exposed to the outside; a second resin molded portion in which a second terminal portion of the busbar is exposed and extends in a direction intersecting the extension direction of the first resin molded portion; and a connecting portion connecting the first resin molded portion and the second resin molded portion. The center of gravity of the bus module is located closer to the capacitor than the first resin molding portion, the second resin molding portion, and the connecting portion.

5. The power conversion device as described in claim 1 or 2, characterized in that, The busbar module is formed having: a first resin molded portion in which a first terminal portion of the busbar is exposed to the outside; a second resin molded portion in which a second terminal portion of the busbar is exposed and extends in a direction intersecting the extension direction of the first resin molded portion; and a connecting portion connecting the first resin molded portion and the second resin molded portion. The fixed part includes: The first fixed portion, when viewed along the height direction of the busbar module and the capacitor, is located between the portion of the busbar molded by the first resin molding portion and the capacitor; and The second fixed part, when viewed along the height direction of the busbar module and the capacitor, is located between the portion of the busbar molded by the second resin molding part and the capacitor.

6. The power conversion device as described in claim 1 or 2, characterized in that, The capacitors include smooth capacitors and Y capacitors. When viewing the bus module and the capacitor along the height direction, the Y-capacitor is positioned in a region closer to the bus module than the smooth capacitor.

7. The power conversion device as described in claim 4, characterized in that, The capacitors include smooth capacitors and Y capacitors. When viewing the bus module and the capacitor along the height direction, the Y capacitor is positioned closer to the bus module region than the smooth capacitor and adjacent to both the first resin molding portion and the second resin molding portion.

8. The power conversion device as described in claim 1 or 2, characterized in that, The capacitor and the bus module are arranged in a manner that they do not overlap in a direction orthogonal to the height direction.

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