Touch Module, Touch Device, and Electronic Device

Abstract

The present invention relates to a touch module, comprising a substrate, a piezoelectric layer, an electrode layer and a colloid layer. The piezoelectric layer is arranged on the first surface of the substrate, and the piezoelectric layer is used to generate an ultrasonic signal. The electrode layer is arranged on the side of the piezoelectric layer away from the substrate. The colloid layer is arranged on the side of the electrode layer away from the piezoelectric layer, and the colloid layer includes a colloid and a plurality of conductive particles, and the plurality of conductive particles are distributed in the colloid. Among them, each conductive particle is in contact with the electrode layer. The touch module provided by the present invention realizes the conduction of ultrasonic waves by the conductive particles in the colloid layer contacting with the electrode layer, replacing the multiple layers of metal layers in the touch module of the related art for ensuring the reliable transmission of ultrasonic signals, and the colloid layer can protect the conductive particles, replacing the protective layer used to protect the electrode layer in the touch module of the related art, thereby realizing the thinning of the touch module and making the preparation process simpler.

Description

Technical Field

[0001] The present invention relates to the field of touch control technology, and in particular to a touch control module, a touch control device and an electronic device. Background Art

[0002] Ultrasonic fingerprint recognition technology uses the ability of ultrasound to penetrate materials to detect the specific shape of fingerprints, thereby realizing fingerprint recognition. Because of its rapid recognition and safe use, ultrasonic fingerprint recognition technology is widely used in touch devices. However, the current production process of touch devices is relatively complex and it is difficult to further reduce the thickness. Summary of the invention

[0003] Based on this, it is necessary to provide a touch module, a touch device and an electronic device with a simple production process and a thinner weight, so as to improve production efficiency and realize the thinning of the touch device.

[0004] One aspect of the present invention provides a touch module, comprising:

[0005] substrate;

[0006] A piezoelectric layer is disposed on the first surface of the substrate, and the piezoelectric layer is used to generate an ultrasonic signal;

[0007] An electrode layer is disposed on a side of the piezoelectric layer facing away from the substrate;

[0008] A colloid layer is arranged on a side of the electrode layer away from the piezoelectric layer, the colloid layer includes a colloid and a plurality of conductive particles, and the plurality of conductive particles are distributed in the colloid;

[0009] Wherein, each conductive particle is in contact with the electrode layer.

[0010] In one embodiment, the conductive particles are made of the same material as the electrode layer.

[0011] In one embodiment, the material of the conductive particles and the electrode layer includes at least one of gold, silver, nickel, copper, tin, and palladium.

[0012] In one embodiment, along a direction perpendicular to the first surface, the thickness of the colloidal layer is equal to the diameter of the conductive particle.

[0013] In one embodiment, the conductive particles have a diameter of 13 microns to 14 microns.

[0014] In one embodiment, the material of the colloid includes at least one of polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ether, and methyl crotonate.

[0015] In one embodiment, the substrate comprises a thin film transistor substrate.

[0016] In one embodiment, the touch module further includes an adhesive layer;

[0017] The adhesive layer is disposed between the substrate and the piezoelectric layer.

[0018] In one embodiment, the colloid layer is coated on the electrode layer by means of a preset process;

[0019] The preset process includes at least one of a coating process and a hot pressing process.

[0020] On the other hand, the present invention further provides a touch device, including the above touch module.

[0021] On another aspect, the present invention further provides an electronic device, including the above touch device.

[0022] The above touch module, touch device and electronic device realize the conduction of ultrasonic waves by the contact between the conductive particles in the colloid layer and the electrode layer, replacing the multi-layer metal layers in the touch module of the related technology for ensuring the reliable transmission of ultrasonic signals. Moreover, the colloid layer can protect the conductive particles, replacing the protective layer in the touch module of the related technology for protecting the electrode layer, realizing the thinning of the touch module and having a simpler preparation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 FIG. 24 is a schematic structural diagram of a touch module in an embodiment of the related technology;

[0024] Figure 2 FIG. 28 is a schematic structural diagram of a touch module in another embodiment of the related technology;

[0025] Figure 3 FIG. 32 is a schematic structural diagram of a touch module according to an embodiment of the present invention;

[0026] Figure 4 FIG. 36 is a schematic structural diagram of a colloid layer according to an embodiment of the present invention;

[0027] Figure 5 FIG. 40 is a schematic diagram of the use of a touch module according to an embodiment of the present invention.

[0028] Brief Description of Element Symbols:

[0029] 10, 20, 100: Touch module 11, 21, 110: Substrate

[0030] 11a, 21a: Surface 110a: First surface

[0031] 12, 22, 120: Piezoelectric layer 13, 23, 130: Electrode layer

[0032] 130a: Bonding area 24: Metal layer

[0033] 25: Protective layer 140: Colloidal layer

[0034] 141: Conductive particles 142: Colloid

[0035] 14, 26, 150: Adhesive layer 15, Encapsulation layer

[0036] 200, Circuit board d1: Thickness of metal layer

[0037] d2: Thickness of protective layer d3: Thickness of piezoelectric layer

[0038] d4: Thickness of electrode layer d5: Thickness of substrate

[0039] d6: Diameter of conductive particles d7: Thickness of colloidal layer

[0040] d8: Thickness of adhesive layer Detailed implementation manners

[0041] To make the above objects, features, and advantages of the present invention more apparent and understandable, the following will describe the detailed implementation manners of the present invention with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0043] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0044] In the present invention, unless otherwise clearly specified or limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed broadly. For example, it may be a fixed connection, a detachable connection, or an integral one; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication between two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0046] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0047] In addition, the drawings are not drawn to a scale of 1:1, and the relative dimensions of the components are only drawn by way of example in the drawings and not necessarily to the actual scale.

[0048] To facilitate the understanding of the technical solutions of the embodiments of the present application, before elaborating on the specific implementation manners of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are first briefly explained.

[0049] COF (Chip On Flex, or, Chip On Film), commonly known as flip chip on flexible film, is a chip soft film packaging technology that fixes an integrated circuit (IC) on a flexible printed circuit board. It uses a flexible additional circuit board as a carrier for packaging the chip to combine the chip with the flexible circuit board, or simply refers to the flexible additional circuit board without packaged chips, including tape automated bonding production (TAB substrate, whose process is called TCP), flexible board connecting chip components, and flexible IC carrier packaging.

[0050] TFT (Thin Film Transistor), that is, a thin film transistor. TFT displays are the mainstream display devices on various laptops and desktop computers. Each liquid crystal pixel on such displays is driven by a thin film transistor integrated behind the pixel.

[0051] To facilitate the understanding of the technical solution of the present invention, before elaborating in detail, the touch module in the related technology will be described first.

[0052] Currently, for the touch module used for ultrasonic fingerprint recognition, ultrasonic waves are emitted to a target object (such as a user's fingerprint), then the echo reflected from the target object is received, and then the distance to the target object is calculated by calculating the time difference between the transmitted wave and the reflected echo, so as to realize the recognition of the target object. To reach the optimal ultrasonic working range and ensure the recognition accuracy of ultrasonic waves, the touch module has certain requirements for the signal conduction distance of ultrasonic waves.

[0053] It should be understood that the touch module of the present application takes the one used for ultrasonic fingerprint recognition as an example for explanation rather than limitation.

[0054] Figure 1 The structural schematic diagram of the touch module 10 in an embodiment of the related technology is shown.

[0055] As Figure 1 shown, the touch module 10 in an embodiment of the related technology includes a substrate 11 and a bonding layer 14, a piezoelectric layer 12, an electrode layer 13, and a packaging layer 15 that are sequentially stacked along the direction perpendicular to the surface 11a of the substrate 11 (that is, the Figure 2 x-axis direction in

[0056] Figure 2 The structural schematic diagram of the touch module 20 in another embodiment of the related technology is shown.

[0057] Based on better conduction of ultrasonic signals to ensure the ultrasonic recognition accuracy, as Figure 2 shown, the touch module 20 in another embodiment of the related technology includes a substrate 21 and a bonding layer 14, a piezoelectric layer 12, an electrode layer 13, and a packaging layer 15 that are sequentially stacked along the direction perpendicular to the surface 21a of the substrate 21 (that is, the Figure 2The piezoelectric layer 22, the electrode layer 23, the multi-layer metal layer 24, and the multi-layer protective layer 25 are sequentially stacked in the x-axis direction in []. Since the layer spacing in the touch module 20 is small, the multi-layer metal layer 24 and the multi-layer protective layer 25 in the touch module 20 need to cooperate. The multi-layer metal layer 24 serves as a medium for the propagation of ultrasonic waves in the direction perpendicular to the surface 21a of the substrate 21, and needs to be stacked to a preset thickness to ensure the conduction distance required for ultrasonic waves, so that the ultrasonic waves reach their optimal working range and have the best signal. The multi-layer protective layer 25 needs to be stacked in multiple layers to a preset thickness to protect the metal layer 24 from external damage or damage, and at the same time, it is necessary to prevent the metal layer 24 from being oxidized due to long-term contact with external air.

[0058] Define along Figure 2 The thickness dimension of the metal layer 24 in the x-axis direction in [] is d1. In some related embodiments, the metal layer 24 is limited by the coating process, and the thickness d1 of each layer of the metal layer 24 is 6.5 μm - 7 μm, and it takes 1 hour of preparation time to coat and cure each layer of the metal layer 24. It can be understood that the thickness d1 of each layer of the metal layer 24 can be but is not limited to 6.5 μm, 6.6 μm, 6.7 μm, 6.8 μm, 6.9 μm or 7 μm. To ensure the performance of ultrasonic wave conduction, the metal layer 24 needs to be stacked in two layers. It should be noted that the thickness d1 of each layer of the metal layer 24 is closely related to the number of stacked layers. If the thickness d1 of each layer of the metal layer 24 is less than 6.5 μm, more layers of the metal layer 24 need to be set, and a more complex preparation process will inevitably be required. If the thickness d1 of each layer of the metal layer 24 is greater than 7 μm, it is difficult to ensure the uniform coating and reliable curing of the metal layer 24. Specifically, in the embodiment shown in Figure 2 The thickness d1 dimensions of the two layers of metal layers 24 sequentially stacked in the x-axis direction are 6.5 μm and 7 μm respectively.

[0059] Define along Figure 2The thickness dimension of the protective layer 25 in the x-axis direction is d2. The protective layer 25 also needs to reach a preset thickness to reliably protect the metal layer 24. Similarly limited by the coating process, the thickness d2 of each protective layer 25 is 6.5 microns - 7 microns, and the preparation process of coating and curing each layer also takes 1 hour. It can be understood that the thickness d2 of each protective layer 25 can be but is not limited to 6.5 microns, 6.6 microns, 6.7 microns, 6.8 microns, 6.9 microns or 7 microns. Based on the thickness d2 of each protective layer 25 above, the protective layer 25 needs to be stacked in three layers to achieve the expected protection effect. It should be noted that if the thickness d2 of each protective layer 25 is less than 6.5 microns, more layers must be stacked to achieve the expected protection effect, the preparation steps increase and the preparation time is longer. If the thickness d2 of each protective layer 25 is greater than 7 microns, it is difficult to ensure uniform coating of the protective layer 25, and its curing process also requires a longer time and a more complex process. Among them, in the embodiments of the related art, the protective layer 25 is an ink layer. Specifically to Figure 2 In the shown embodiment, the thickness d2 dimensions of the three protective layers 25 stacked in sequence along the x-axis direction are 6.5 microns, 6.5 microns and 7 microns respectively.

[0060] The inventors of the present application noticed that if multiple metal layers 24 and multiple protective layers 25 are provided, on the one hand, the coating and curing of each layer require 1 hour of preparation time. Not only are there many preparation steps, but also the time consumption is long, and it is difficult to reduce costs. On the other hand, not only the thickness of the single-layer metal layer 24 and the protective layer 25 is limited by the process and requirements, but also the multi-layer stacking method makes it difficult to thin the touch module 20. And the touch device and the electronic device applying the touch module 20 are also difficult to be further thinned accordingly.

[0061] Based on this, the inventors of the present application conducted in-depth research and simplified the multiple metal layers 24 and the multiple protective layers 25 by improving the structure of the touch module 20 to achieve the simplification of the preparation process of the touch module 20 and the thinning of the touch module 20.

[0062] For ease of description, the drawings only show the structures related to the embodiments of the present invention.

[0063] Figure 3 Shows a schematic structural diagram of a touch module 100 in an embodiment of the present invention; Figure 4 Shows a schematic structural diagram of a colloid layer 140 in an embodiment of the present invention.

[0064] Refer to Figure 3 and Figure 4, an embodiment of the present invention provides a touch module 100, which includes a substrate 110, a piezoelectric layer 120, an electrode layer 130, and a colloid layer 140. The piezoelectric layer 120 is disposed on the first surface 110a of the substrate 110, and the piezoelectric layer 120 is used to generate ultrasonic signals. The electrode layer 130 is disposed on the side of the piezoelectric layer 120 away from the substrate 110. The colloid layer 140 is disposed on the side of the electrode layer 130 away from the piezoelectric layer 120. The colloid layer 140 includes a colloid 142 and a plurality of conductive particles 141, and the plurality of conductive particles 141 are distributed in the colloid 142. Among them, each conductive particle 141 is in contact with the electrode layer 130. That is to say, as Figure 3 shown, along the first direction (i.e., the x-axis direction in Figure 1 ), the substrate 110, the piezoelectric layer 120, the electrode layer 130, and the colloid layer 140 can be stacked in sequence.

[0065] It should be noted that, as Figure 4 shown, the "conductive particle 141" can be a spherical or approximately spherical conductive microparticle, or a conductive microparticle in the shape of a sheet, flat, or needle, or a nanoparticle, etc. Optionally, in the embodiments of the present invention, spherical or approximately spherical complete particles are selected, which can more easily control the size of the conductive particles 141 while ensuring reliable conductivity. The "contact" in "each conductive particle 141 is in contact with the electrode layer 130" means that each conductive particle 141 can achieve electrical connection with the electrode layer 130.

[0066] Please refer to Figure 3 again. The "substrate 110" can be used to support the piezoelectric layer 120, the electrode layer 130, and the colloid layer 140. It can be understood that in order to achieve reliable transmission of ultrasonic waves, the substrate 110 includes various circuits such as transistors and switches, which are used to transmit an electrical signal to the piezoelectric layer 120 and emit an ultrasonic signal. The ultrasonic signal is reflected back by the finger, and the substrate 110 can also receive the electrical signal converted from the ultrasonic signal. The piezoelectric layer 120 can be a layer of piezoelectric polymer layer, which can convert electrical signals and ultrasonic signals with each other, that is, it can emit and receive ultrasonic waves. The electrode layer 130 and the substrate 110 form a voltage applied on the surface of the piezoelectric layer 120, which can enable the piezoelectric layer 120 to start the function of converting electrical signals and ultrasonic signals. The plurality of conductive particles 141 in the colloid layer 140 are distributed in the colloid 142, and the insulation of the colloid 142 can protect the conductive particles 141 and the electrode layer 130.

[0067] Combined with Figure 3 and Figure 4As shown, for the touch module 100 provided by the present invention, the conduction of ultrasonic waves is achieved through the contact between the conductive particles 141 in the colloid layer 140 and the electrode layer 130, replacing the multiple metal layers 24 in the related touch module 20 that are used to ensure the reliable transmission of ultrasonic signals. Moreover, the colloid layer 140 wraps around the outside of the conductive particles 141, thereby insulating the conductive particles 141 from the outside, and the colloid 142 wrapping around the conductive particles 141 can protect the conductive particles 141, replacing the protective layer 25 in the related touch module 20 that is used to protect the electrode layer 23. Thus, the colloid layer 140 can not only achieve the ultrasonic conduction effect of the multiple metal layers 24, but also achieve the protection effect of the protective layer 25, thereby replacing the multiple metal layers 24 and the multiple protective layers 25. This not only realizes the thinning of the corresponding layers, but also eliminates the corresponding preparation processes for the corresponding layers, simplifies the preparation process of the touch module 100, and shortens the preparation time. Therefore, the touch module 100 provided by the present invention realizes the simplification of the preparation process and the thinning of the structure.

[0068] Please continue to refer to Figure 3 , in some embodiments, the colloid layer 140 is covered on the electrode layer 130 by means of a preset process. In this way, by covering the electrode layer 130 with the colloid layer 140, the electrode layer 130 can be fully utilized, resulting in better conductivity. The preset process includes at least one of a coating process and a hot pressing process. The coating process refers to a process of uniformly coating the colloid 142 containing the conductive particles 141 in a liquid state on the electrode layer 130 with a preset thickness, and then drying or curing the coated liquid through an oven to form the colloid layer 140.

[0069] The hot pressing process refers to heating and pressing the colloid layer 140 to form it. Further, the hot pressing process includes a rolling process and a degassing process. Specifically, the device used for the rolling process is a roller. Furthermore, the air bubbles between the adhered colloid layer 140 and the electrode layer 130 are pressurized and broken to achieve the degassing process of the colloid layer 140. For the touch module 100 applied to ultrasonic fingerprint recognition, the smoother the flatness of each layer passed through by the ultrasonic wave propagation path, the more conducive it is to the propagation. The surface roughness of the colloid layer 140 can be improved through the hot pressing process. In the touch module 20 in the related technology as shown in Figure 2 , limited by the preparation process of the protective layer 25, the surface roughness of the protective layer 25 is 3 micrometers. After research by the inventor, it is found that the roughness range of the colloid layer 140 after being processed by the coating process and the hot pressing process is less than 1 micrometer. Thus, by improving the surface roughness of the colloid layer 140 through the preset process, the surface of the colloid layer 140 can be made smoother, thereby improving the conduction performance of ultrasonic waves.

[0070] Refer to Figure 3, in some embodiments, the electrode layer 130 is disposed on the substrate 110 by means of a preset process. Specifically, the preset process includes at least one of a coating process and a hot pressing process. Further, the preset process takes 1 hour.

[0071] Please continue to refer to Figure 3 , in some embodiments, the piezoelectric layer 120 is made of a piezoelectric material, which can emit and receive ultrasonic waves by utilizing the piezoelectric effect. The piezoelectric material is, for example, ferroelectric polymer P(VDF-TrFE). Define the thickness dimension of the piezoelectric layer 120 along the Figure 3 x-axis direction in Figure 3 as d3. Specifically, in the embodiment shown in

[0072] Figure 5 , the thickness d3 of the piezoelectric layer 120 can be 9 microns. It can be selected according to actual usage, and the embodiments of the present application do not make specific limitations on this.

[0073] As Figure 5 shown, in some embodiments, the electrode layer 130 extends to contact the substrate 110. In this way, the extended electrode layer 130 can form a bonding area 130a. Through the COF technology, structures such as the flexible circuit board 200 are bonded to the touch control module 100 by means of this bonding area 130a. Define the thickness dimension of the electrode layer 130 along the Figure 3 x-axis direction in Figure 3 as d4, and define the thickness dimension of the substrate 110 along the

[0074] x-axis direction in Figure 5 as d5. Specifically, in some embodiments, the thickness d4 of the electrode layer 130 can be 6.5 microns, and the thickness d5 of the substrate 110 can be 90 microns. It can be selected according to actual usage, and the embodiments of the present application do not make specific limitations on this.

[0075] Please refer to again Figure 3, in some embodiments, the conductive particles 141 are made of the same material as the electrode layer 130. In this way, reliable electrical conduction between the conductive particles 141 and the electrode layer 130 can be further ensured. Specifically, in some embodiments, the materials of the conductive particles 141 and the electrode layer 130 include at least one of gold, silver, nickel, copper, tin, and palladium. Since the above metals have relatively high electrical conductivities, the electrical conduction performance requirements between the conductive particles 141 and the electrode layer 130 can be met. In the embodiments of the present application, the materials of the conductive particles 141 and the electrode layer 130 are silver. In this way, compared with other metals, silver has the highest electrical conductivity, and the current conduction performance of the silver material conductive particles 141 and the silver material electrode layer 130 is more excellent.

[0076] Define along Figure 3 The diameter dimension of the conductive particles 141 in the x-axis direction in is d6. Through research by the inventor, it is found that if the diameter d6 of the conductive particles 141 is less than 13 microns, the optimal working range of the ultrasonic wave cannot be achieved, and it is difficult to generate the best ultrasonic signal. If the diameter d6 of the conductive particles 141 is greater than 14 microns, the thickness of the touch module 100 will also increase accordingly. Thus, in Figure 3 In some of the illustrated embodiments, the diameter d6 of the conductive particles 141 is 13 microns - 14 microns.

[0077] It can be understood that the diameter d6 of the conductive particles 141 can be, but is not limited to, 13 microns, 13.1 microns, 13.2 microns, 13.3 microns, 13.4 microns, 13.5 microns, 13.6 microns, 13.7 microns, 13.8 microns, 13.9 microns, or 14 microns. In the embodiments of the present application, the diameter d6 of the conductive particles 141 is 13.5 microns. Of course, in some other embodiments, the diameter of the conductive particles 141 can be adjusted according to their actual requirements in different embodiments, and no limitation is made here.

[0078] Please refer to Figure 3 and Figure 4 As shown, in some embodiments, along the direction perpendicular to the first surface 110a (i.e., Figure 3As shown in the x-axis direction, the thickness dimension of the colloid layer 140 is defined as d7, and the thickness d7 of the colloid layer 140 is the same as the diameter d6 of the conductive particles 141. In this way, on the one hand, reliable contact between the conductive particles 141 and the electrode layer 130 can be ensured, so that the electrode layer 130 and the colloid layer 140 can be reliably conducted. On the other hand, the colloid 142 in the colloid layer 140 can wrap around the outside of the conductive particles 141, thereby realizing the protection of the conductive particles 141. Specifically, in some embodiments, the thickness d7 of the colloid layer 140 is the same as the diameter d6 of the conductive particles 141 in the foregoing embodiments, and the thickness d7 of the colloid layer 140 is 13 to 14 micrometers. More specifically, the thickness d7 of the colloid layer 140 is 13.5 micrometers. Of course, in some other embodiments, the thickness of the colloid layer 140 can be adjusted according to its actual requirements in different embodiments, and no limitation is made here.

[0079] It should be noted that the colloid layer 140 is pressed on the electrode layer 130, and the thickness d7 of the pressed colloid layer 140 is 13 to 14 micrometers. Therefore, the thickness of the colloid layer before pressing is greater than 14 micrometers. In the embodiments of the present application, the thickness of the colloid layer before pressing is 20 micrometers. In this way, sufficient overflow can be reserved for pressing, so as to ensure that the thickness d7 of the pressed colloid layer 140 meets the requirements. It can be selected according to the actual use situation, and the embodiments of the present application do not make specific limitations on this.

[0080] In still some other embodiments, the thickness d7 of the colloid layer 140 can be greater than the diameter d6 of the conductive particles 141, and the conductive particles 141 on the side of the colloid layer 140 facing the electrode layer 130 are in contact with the electrode layer 130. That is to say, while the conductive particles 141 in the colloid layer 140 are electrically connected to the electrode layer 130, the side of the colloid layer 140 facing away from the electrode layer 130 protrudes outside the conductive particles 141. In this way, the side of the colloid layer 140 facing away from the electrode layer 130 can provide more comprehensive protection for the conductive particles 141, so as to ensure reliable contact between the conductive particles 141 and the electrode layer 130 while preventing the conductive particles 141 from being damaged or oxidized due to long-term contact with the outside.

[0081] As Figure 3 shown, in some embodiments, the material of the colloid 142 includes at least one of polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ether, and methyl crotonate. In the embodiments of the present application, the material of the colloid 142 is epoxy resin. Epoxy resin has excellent physical and mechanical and electrical insulation properties, and its bonding performance is excellent.

[0082] Please continue to refer to Figure 3, in some embodiments, the substrate 110 includes a thin-film transistor substrate. The TFT (Thin Film Transistor) substrate has the advantages of high responsiveness, high brightness, and high contrast. Of course, in other embodiments, it may also be other substrates, which are not limited herein.

[0083] As Figure 3 shown, in some embodiments, the touch module 100 further includes an adhesive layer 150, and the adhesive layer 150 is disposed between the substrate 110 and the piezoelectric layer 120. Optionally, the adhesive layer 150 may be set as a conductive adhesive layer. In this way, through the adhesive layer 150, the substrate 110 and the piezoelectric layer 120 can be more firmly fixed together, and moreover, the conductive adhesive layer can achieve electrical conduction between the substrate 110 and the piezoelectric layer 120. Define the thickness dimension of the adhesive layer 150 along the Figure 3 x-axis direction in as d8. Specifically, in some embodiments, the thickness d8 of the adhesive layer 150 is less than 1 micron. It is found by the inventor that the reliable fixation between the piezoelectric layer 120 and the substrate 110 can be achieved within this thickness range of the adhesive layer 150. If the thickness of the adhesive layer 150 is too thick, it is not easy to thin the touch module 100.

[0084] Based on the same inventive concept, the present invention also provides a touch device, including the above-mentioned touch module 100. In this way, by using the touch module 100 in the foregoing some embodiments, the thinning of the touch device can be achieved, and moreover, the preparation process of the touch device can also be simplified.

[0085] Based on the same inventive concept, the present invention also provides an electronic device, including the touch device as described above. In this way, by using the touch module 100 and the touch device in the foregoing some embodiments, the thinning of the electronic device can be further achieved, and moreover, the preparation process of the electronic device can also be simplified.

[0086] The above-mentioned electronic device can be applied to fields such as mobile phone terminals, bionic electronics, electronic skin, wearable devices, vehicle-mounted devices, Internet of Things devices, and artificial intelligence devices. For example, the above-mentioned electronic device can be a mobile phone terminal, a tablet, a palm computer, an ipod, a smart watch, a laptop computer, a television, a monitor, etc.

[0087] Next, in combination with the content in the above-mentioned some embodiments and the attached Figure 2 and the attached Figure 3 , the touch device 100 provided by the embodiments of the present application will be further described. Taking a touch module 20 schematically shown in an embodiment of the related art as shown in Figure 2 and the touch module 100 in the present application as shown in Figure 3 as an example, the layer thickness is compared. It should be noted that this experiment is carried out with Figure 2It is carried out under the experimental conditions of the touch module 20 shown.

[0088] Table 1

[0089]

[0090] It should be noted that, in combination with the embodiments in some of the foregoing related technologies, Figure 2 in the touch module 20, the preparation time of the piezoelectric layer 22 is 1 hour, the preparation time of each of the two metal layers 24 is 1 hour, and the preparation time of each of the three protective layers 25 is 1 hour. Figure 3 in the touch module 100, the preparation time of the piezoelectric layer 120 is 1 hour.

[0091] It can be clearly seen from Table 1 that in the touch module 100 of the present application, the two metal layers 24 and the three protective layers 25 are replaced by the colloid layer 140, simplifying the preparation process, thereby shortening the preparation time. Moreover, the thickness of the colloid layer 140 is significantly thinner than that of the multi-layer metal layer 24 and the multi-layer protective layer 25.

[0092] Combined with Figure 1 , Figure 2 and Figure 3 As shown, the touch module 100, the touch device, and the electronic device provided by the embodiments of the present application achieve the conduction of ultrasonic waves through the contact between the conductive particles 141 in the colloid layer 140 and the electrode layer 130, replacing the multi-layer metal layers 24 in the touch module 20 in the related technology for ensuring the reliable transmission of ultrasonic signals. Moreover, the colloid 142 can protect the conductive particles 141, replacing the protective layer 25 in the touch module 20 in the related technology for protecting the electrode layer 23, realizing the thinning of the touch module 100 and a simpler preparation process. The same material of the conductive particles 141 and the electrode layer 130 ensures reliable conduction therebetween. Among other metals, silver has the highest conductivity, so the materials of both the conductive particles 141 and the electrode layer 130 are selected as silver. The diameter d6 of the conductive particles 141 is set between 13 microns and 14 microns, which can reach the optimal working range of ultrasonic waves while thinning the touch module 100 as much as possible, thereby generating the best ultrasonic signals. The bonding layer 150 provided between the substrate 110 and the piezoelectric layer 120 can make the fixation between the substrate 110 and the piezoelectric layer 120 more stable. When preparing the touch module 100, the hot pressing process can improve the surface roughness of the colloid layer 140, making its roughness less than 1 micron. Compared with the protective layer 25 in the related technology, the surface of the touch module 100 in the present application is smoother.

[0093] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0094] The above-described embodiments only express several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A touch module, characterized in that, Comprising: A substrate; A piezoelectric layer provided on a first surface of the substrate, the piezoelectric layer being configured to generate ultrasonic signals; An electrode layer provided on a side of the piezoelectric layer facing away from the substrate; A colloid layer provided on a side of the electrode layer facing away from the piezoelectric layer, the colloid layer including a colloid and a plurality of conductive particles, the plurality of conductive particles being distributed within the colloid; Wherein each of the conductive particles is in contact with the electrode layer; The material of the conductive particles includes at least one of gold, silver, nickel, copper, tin, and palladium; The electrode layer extends to be in contact with the substrate, and the extended electrode layer forms a bonding region.

2. The touch module according to claim 1, wherein The conductive particles are made of the same material as the electrode layer.

3. The touch control module according to claim 2, wherein, The material of the electrode layer includes at least one of gold, silver, nickel, copper, tin, and palladium.

4. The touch control module according to any one of claims 1-3, characterized in that, In a direction perpendicular to the first surface, the thickness of the colloid layer is the same as the diameter of the conductive particles.

5. The touch control module according to any one of claims 1-3, characterized in that, The diameter of the conductive particles is 13 micrometers to 14 micrometers.

6. The touch module according to any one of claims 1-3, characterized in that, The material of the colloid includes at least one of polymethyl methacrylate, linear phenolic resin, epoxy resin, crotonic acid, acrylate, vinyl ether, and methyl butenoate.

7. The touch control module according to any one of claims 1-3, characterized in that, The substrate includes a thin-film transistor substrate.

8. The touch control module according to any one of claims 1-3, characterized in that, The touch control module further includes an adhesive layer; The adhesive layer is provided between the substrate and the piezoelectric layer.

9. The touch control module according to any one of claims 1-3, characterized in that, The colloid layer is coated on the electrode layer by means of a preset process; The preset process includes at least one of a coating process and a hot pressing process.

10. A touch device, characterized in that, Including the touch control module according to any one of claims 1-9.

11. An electronic device, characterized in that, Including the touch control device according to claim 10.

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