A patch type high-power common mode inductor

Abstract

The application discloses a patch type high-power common mode inductor, which comprises a ring-shaped magnetic core and a wire winding wrapped around the magnetic core; the bottom surface of the magnetic core is symmetrically provided with a magnetic core boss, and the height of the magnetic core boss is greater than or equal to the outer diameter of the wire; a notch is arranged on the magnetic core boss in a spaced manner, and an electroplated layer is arranged on the inner wall of the notch; the wire winding comprises wire groups one and two with different models and insulating layers; the incoming and outgoing wires of the wire groups one and two are led out and placed in the notch, and the wire winding, the electroplated layer in the notch and the electroplated layer of a PCB are conductive through tinning welding. The magnetic core boss is arranged, the structure of the inductor shell, the wiring terminal and the partition plate can be cancelled, the volume of the common mode inductor is greatly reduced, and the volume of the finished product power supply is reduced; and the wire groups one and two with different models are selected, so that the overall voltage resistance of the common mode inductor is improved, and the safety requirement is better met.

Description

Technical Field

[0001] This invention relates to the field of electronic component technology, and specifically to a surface-mount high-power common-mode inductor. Background Technology

[0002] Common-mode inductors, also known as common-mode chokes, are commonly used in computer switching power supplies to filter common-mode electromagnetic interference signals. In circuit board design, common-mode inductors are mounted on the board to filter EMI (electromagnetic interference). Common-mode inductors can effectively suppress the outward radiation of electromagnetic waves generated by high-speed signal lines and are widely used in various electronic fields.

[0003] A common-mode inductor is a common-mode interference suppression device with a ferrite core. It consists of two coils of the same wire diameter and number of turns symmetrically wound on the same ferrite toroidal core, forming a four-terminal device. The toroidal core is the most widely used in common-mode inductors because of its high permeability and the fact that it usually requires fewer turns.

[0004] Currently, existing common-mode inductors have the following disadvantages: (1) Existing common-mode inductors have a casing for easy production organization, but the casing also reduces the device's heat dissipation effect. (2) Before high-temperature soldering, existing common-mode chip inductors require the copper wire leads to extend outside the magnetic core and then be wound around the pins. However, since the copper wire leads need to be bent before being wound around the pins, the winding process requires manual arrangement of the leads and manual winding of the leads around the pins, which takes a long time and results in low production efficiency. Summary of the Invention

[0005] To address the aforementioned technical problems, this technical solution provides a surface-mount high-power common-mode inductor. By incorporating a core boss integrally formed with the core at the bottom, along with grooves and electroplating layers on the core boss, the inductor casing can be eliminated, increasing the inductor's heat dissipation. Simultaneously, the lead and lead wires of the conductor winding are directly soldered into the grooves, eliminating the need for lead winding, saving the lead winding process, and increasing production efficiency. This effectively solves the aforementioned problems.

[0006] This invention is achieved through the following technical solution:

[0007] A surface-mount high-power common-mode inductor includes a toroidal magnetic core and a wire winding wrapped around the magnetic core. The bottom surface of the magnetic core has symmetrically arranged core bosses, the height of which is greater than or equal to the outer diameter of the wire. The core bosses have spaced slots, and the inner walls of the slots are plated with an electroplated layer. The wire winding includes two wire groups of different types, each with an insulating layer. The lead-in and lead-out wires of wire groups one and two are placed inside the slots. Through tin plating and soldering, the wire windings, the electroplated layer inside the slots, and the electroplated layer on the PCB board are made conductive.

[0008] Furthermore, the magnetic core boss and the ring-shaped magnetic core are an integrated structure, and the magnetic core boss and the magnetic core are integrally ground and formed.

[0009] Furthermore, the depth of the slot is greater than or equal to the outer diameter of the wire. When the wire's inlet and outlet are placed inside the slot, the slot can cover the wire inside the slot, or the wire can fill the slot.

[0010] Furthermore, after the wire winding is wrapped around the magnetic core, a flat top cover is fixedly connected to its top by adhesive, and the top cover is made of insulating material.

[0011] Furthermore, in either group one or group two, the conductors are enameled wire, and the other group of conductors is triple-insulated wire; the enameled wire and the triple-insulated wire are wound around the magnetic core in a double-wound or double-wound manner.

[0012] Furthermore, the enameled wire is wound around any side of the core boss in the magnetic core, and there is a certain gap between the enameled wires after they are wound and fixed; the inlet and outlet wires of the enameled wire are respectively placed in the slots near the side of the enameled wire winding, and are fixed with solder and connected to the electroplating layer; the triple-insulated wire is wound around the other side of the magnetic core, and the inlet and outlet wires of the triple-insulated wire are respectively placed in the slots near the side of the triple-insulated wire winding, and are fixed with solder and connected to the electroplating layer.

[0013] Furthermore, the enameled wire and the triple-insulated wire are wound in a single layer with two wires in parallel on the magnetic core. When the enameled wire and the triple-insulated wire encounter a magnetic core boss during winding, they pass over the magnetic core boss and wrap around the other side of the magnetic core boss. The entry and exit wires of the enameled wire are respectively welded into the slots on the left or right side of the two magnetic core bosses, and the entry and exit wires of the triple-insulated wire are respectively welded into the slots on the other side of the two magnetic core bosses.

[0014] Beneficial effects

[0015] The surface-mount high-power common-mode inductor proposed in this invention has the following advantages compared with the prior art:

[0016] (1) This technical solution eliminates the structure of the inductor shell, terminals and partitions by setting a core boss at the bottom of the core and forming it integrally with the core, and by using the groove and electroplating layer on the core boss. This simplifies the structure of the common mode inductor, greatly reduces the volume of the common mode inductor and the volume of the finished power supply. At the same time, the absence of a shell increases the heat dissipation of the common mode inductor. Meanwhile, the lead and lead wires of the conductor winding are directly soldered into the slot, eliminating the need to wind the leads and saving the lead winding process, thus increasing the production efficiency of the common mode inductor. In addition, by selecting different types of wire group one and wire group two, the overall withstand voltage of the common mode inductor can be improved, better meeting the safety requirements.

[0017] (2) In this technical solution, the magnetic core boss and the ring-shaped magnetic core are an integrated structure, and the design of grinding the magnetic core boss and the magnetic core together as a whole makes the magnetic core boss and the magnetic core a single unit, which can increase the integrity of the magnetic core and the magnetic core boss. At the same time, the magnetic core boss and the magnetic core are made of the same ferrite material, which gives the magnetic core boss good insulation; resulting in strong insulation between the grooves spaced apart on the magnetic core boss, which can effectively avoid the possibility of being conductive.

[0018] (3) This technical solution increases the withstand voltage and high temperature resistance of the common mode inductor by selecting different types of wire groups one and two, and by using enameled wire and triple-insulated wire for double winding, with a certain spacing between the enameled wires during winding. Even under high power conditions, when the outer insulation layer of the enameled wire is damaged, the possibility of conduction between the copper wires of the enameled wire can be reduced due to the certain spacing between the enameled wires. The triple-insulated wire has stronger withstand voltage and high temperature resistance. When encountering high power, the heat resistance and withstand voltage of the triple-insulated wire are stronger. The outer insulation layer of the triple-insulated wire is equivalent to a partition, which can insulate and block the triple-insulated wire and the enameled wire, effectively improving the overall withstand voltage of the common mode inductor and better meeting the safety requirements.

[0019] (4) The top cover in this technical solution is flat, which facilitates the automated operation of the manufacturer when soldering the common mode inductor onto the PCB board. The flat top cover also facilitates the adsorption of the suction cup. It can facilitate the automated operation in the chip assembly process and improve the efficiency of the user in the production process. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0021] Figure 2 This is a front view of Embodiment 1 of the present invention.

[0022] Figure 3This is a schematic diagram of the magnetic core and magnetic core boss in this invention.

[0023] Figure 4 This is a schematic diagram of the overall structure of Embodiment 2 of the present invention.

[0024] The markings in the attached diagram are: 1-magnetic core, 2-magnetic core boss, 21-slot, 3-electroplated layer, 4-wire winding, 41-wire group one, 42-wire group two, 5-solder, 6-adhesive, 7-top cover. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. The described embodiments are merely some embodiments of the present invention, and not all embodiments. Various modifications and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the design concept of the present invention should fall within the protection scope of the present invention.

[0026] Example 1:

[0027] like Figures 1 to 3 As shown, a surface-mount high-power common-mode inductor includes a ferrite ring-shaped magnetic core 1 and a wire winding 4 surrounding the magnetic core 1. Magnetic core bosses 2 are symmetrically arranged on the bottom surface of the magnetic core 1; the magnetic core bosses 2 and the ring-shaped magnetic core 1 are an integral structure, and the magnetic core bosses 2 and the magnetic core 1 are integrally ground and formed. Two sets of wire windings 4 are provided, respectively surrounding both sides of the magnetic core bosses 2.

[0028] The height of the magnetic core boss 2 is greater than or equal to the outer diameter of the wire. Generally, the height of the magnetic core boss 2 is slightly greater than the outer diameter of the wire. The magnetic core boss 2 is provided with slots 21 at intervals, and the inner wall of the slot 21 is provided with an electroplated layer 3. The depth of the slot 21 is greater than or equal to the outer diameter of the wire. When the wire is placed in the slot 21, the slot 21 can cover the inside of the slot 21, or the wire can fill the slot 21.

[0029] During production, when the end of the wire is placed in the slot 21, the slot 21 is filled. When performing tin plating and soldering, spot welding is used to ensure that the wire can conduct with the electroplated layer 3 in the slot 21 without any solder overflowing out of the slot.

[0030] When the end of the wire is placed in the slot 21, it cannot fill the slot 21 completely but is covered by the groove. In this case, a soldering method is used to fill the groove during the tinning process. By filling the groove with solder, the wire can be made to conduct with the electroplated layer 3 in the slot 21. At the same time, the top surface of the added solder will be flush with the top surface of the magnetic core boss, so that the wire can conduct with the electroplated layer on the PCB board. When adding solder, the solder in the groove should not overflow out of the groove, but should be flush with the slot 21 for best results.

[0031] The conductor winding 4 includes wire group 1 41 and wire group 2 42 of different models with insulation layers. The lead-in and lead-out wires of wire group 1 41 and wire group 2 42 are placed in slot 21. The conductor winding 4, the electroplated layer 3 in slot 21 and the electroplated layer of PCB board are made to conduct through tin plating and soldering.

[0032] In the aforementioned wire group 41 and wire group 42, either group of conductors is made of enameled wire, and the other group of conductors is made of triple-insulated wire; the enameled wire and the triple-insulated wire are wound around the magnetic core 1 in a double-wound manner.

[0033] The enameled wire is wound on either side of the core boss 2 in the magnetic core 1, and there is a certain gap between the enameled wires after they are wound and fixed. The inlet and outlet wires of the enameled wire are respectively placed in the slot 21 near the side of the enameled wire winding, and are fixed with solder and connected to the electroplated layer 3. The triple-insulated wire is wound on the other side of the magnetic core 1, and the inlet and outlet wires of the triple-insulated wire are respectively placed in the slot 21 near the side of the triple-insulated wire winding, and are fixed with solder and connected to the electroplated layer 3.

[0034] After the conductor winding 4 is wrapped around the magnetic core 1, that is, after the enameled wire and the triple-insulated wire are symmetrically wrapped around the magnetic core 1, a flat top cover 7 is fixedly connected to its top by adhesive 6. The top cover 7 is made of insulating material.

[0035] In this embodiment, the top cover 7 is made of PCB board, and the adhesive 6 is an adhesive such as epoxy resin commonly used in the art.

[0036] In general, wire groups 41 and 42 in Example 1 are used in combination with enameled wire and triple-insulated wire. If the customer's withstand voltage requirement is not very high, wire groups 41 and 42 on the left and right sides of the magnetic core 1 can also be wound with enameled wire; the enameled wires after winding and fixing have a certain spacing. Conversely, if the customer's withstand voltage requirement is higher, wire groups 41 and 42 on the left and right sides of the magnetic core 1 can also be wound with triple-insulated wire; if the size of the magnetic core 1 is not large enough to allow both sets of winding wires to use triple-insulated wire, the size of the magnetic core 1 can be appropriately increased.

[0037] Example 2:

[0038] Generally, products marketed will be manufactured using the structure described in Example 1; however, in special cases (such as special operating environments) or according to specific customer requirements, the enameled wire and triple-insulated wire can also be wound around the magnetic core in a double-wire parallel winding manner. When the enameled wire and triple-insulated wire are wound around the magnetic core in a double-wire parallel winding manner, the specific implementation is as follows: Figure 4 As shown.

[0039] The enameled wire and triple-insulated wire are wound in a single layer with two wires in parallel on the magnetic core 1. When the enameled wire and triple-insulated wire encounter the magnetic core boss 2 during winding, they pass over the magnetic core boss 2 and wrap around the other side of the magnetic core boss 2. The entry and exit wires of the enameled wire are respectively welded into the slots 21 on the right side of the two magnetic core bosses 2, and the entry and exit wires of the triple-insulated wire are respectively welded into the slots 21 on the left side of the two magnetic core bosses 2.

[0040] The other structures in this embodiment, as well as the positional and connection relationships between them, are the same as those in Embodiment 1, and will not be repeated here.

Claims

1. A surface-mount high-power common-mode inductor, comprising a ring-shaped magnetic core (1) and a wire winding (4) surrounding the magnetic core (1); characterized in that: The bottom surface of the magnetic core (1) is symmetrically provided with magnetic core bosses (2). The magnetic core bosses (2) and the ring-shaped magnetic core (1) are an integral structure, and the magnetic core bosses (2) and the magnetic core (1) are integrally ground and formed. The height of the magnetic core bosses (2) is greater than or equal to the outer diameter of the wire. The magnetic core bosses (2) are provided with slots (21) at intervals. The inner wall of the slots (21) is provided with an electroplated layer (3). The depth of the slots (21) is greater than or equal to the outer diameter of the wire. When the wires entering and exiting are placed in the slots (21), the slots (21) can cover the wires. The inside of the wire can fill the slot (21); the wire winding (4) includes wire group one (41) and wire group two (42) with different models of insulating layers. The lead-in and lead-out wires of wire group one (41) and wire group two (42) are placed in the slot (21). By tin-plating welding, the wire winding (4), the electroplating layer (3) in the slot (21) and the electroplating layer of the PCB board are made to conduct; after the wire winding (4) is wrapped around the magnetic core (1), its top is fixedly connected with a flat top cover (7) by adhesive (6). The top cover (7) is made of insulating material.

2. The surface-mount high-power common-mode inductor according to claim 1, characterized in that: In the first group (41) and the second group (42), either group of conductors is made of enameled wire, and the other group of conductors is made of triple-insulated wire. The enameled wire and the triple-insulated wire are wound around the magnetic core (1) in a double-wire split-winding or double-wire parallel-winding manner.

3. A surface-mount high-power common-mode inductor according to claim 2, characterized in that: The enameled wire is wound around any side of the core boss (2) in the magnetic core (1), and there is a certain gap between the enameled wires after they are wound and fixed. The inlet and outlet wires of the enameled wire are respectively placed in the slot (21) near the side of the enameled wire winding, and are fixed with solder (5) and connected to the electroplated layer (3). The three-layer insulated wire is wound around the other side of the magnetic core (1), and the inlet and outlet wires of the three-layer insulated wire are respectively placed in the slot (21) near the side of the three-layer insulated wire winding, and are fixed with solder (5) and connected to the electroplated layer (3).

4. A surface-mount high-power common-mode inductor according to claim 2, characterized in that: The enameled wire and triple-insulated wire are wound in parallel single layer on the magnetic core (1). When the enameled wire and triple-insulated wire encounter the magnetic core boss (2) during winding, they pass over the magnetic core boss (2) and wrap around the other side of the magnetic core boss (2). The entry and exit wires of the enameled wire are respectively welded in the slots (21) on the left or right side of the two magnetic core bosses (2), and the entry and exit wires of the triple-insulated wire are respectively welded in the slots (21) on the other side of the two magnetic core bosses (2).

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