Display module, method for preparing display module, and display device

Abstract

The present disclosure provides a display module, a preparation method and a display device, comprising: a display panel, wherein the display panel has a protective film layer on a backlight side; an ultra-clean foam buffer layer, located on the backlight side of the protective film layer; a metal layer, located on the side of the buffer layer away from the protective film layer; and a conductive part, wherein a first end of the conductive part is bonded to the backlight side of the protective film layer and a second end is bonded to a side of the metal layer close to the protective film layer.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module, a method for preparing the display module, and a display device. Background Art

[0002] With the development of OLED (organic light-emitting diode) display technology, consumers have put forward more stringent requirements for AMOLED display products, and more and more customers have begun to pay attention to the display effect of the screen under the copper rod test. Specifically, the reasons why the display panel has the problem of copper rod shining are as follows:

[0003] like Figure 1 As shown, the display panel includes a glass substrate CG, OCA, POL, PNL and a protective film layer, wherein the glass substrate CG of the display panel will accumulate a large amount of static electricity after being rubbed by a copper rod for many times, and the static electricity will gather in the protective film layer along the path of OCA overflow → POL carbonized edge → PNL carbonized edge, thereby forming an electric field between the inner surface of the glass substrate CG and the protective film layer, resulting in the displacement of Vth (threshold voltage) and Vss (source power supply voltage) of the TFT circuit inside the display panel (mainly inside the PNL), thereby causing the copper rod to shine in the display area, resulting in poor display effect. Summary of the invention

[0004] The present disclosure provides a display module, comprising:

[0005] A display panel, wherein the display panel has a protective film layer on a backlight side;

[0006] A buffer layer, located on the backlight side of the protective film layer;

[0007] A metal layer, located on a side of the buffer layer away from the protective film layer;

[0008] A conductive part, wherein a first end of the conductive part is bonded to a side of the backlight surface of the protective film layer, and a second end of the conductive part is bonded to a side of the metal layer close to the protective film layer.

[0009] In an optional example, the buffer layer is provided with a through hole for the conductive part to pass through, and the second end of the conductive part is bonded to a side of the metal layer close to the protective film layer after passing through the through hole.

[0010] In an optional example, the protective film layer includes a central display area covering the buffer layer, and an edge display area located at the edge of the central display area;

[0011] Wherein, the conductive portion is located in the edge display area or in the central display area;

[0012] Wherein, when the conductive part is located in the central display area, the second end of the conductive part penetrates through the buffer layer and then adheres to the side of the metal layer close to the protective film layer.

[0013] In an optional example, when the conductive part is located in the edge display area, the orthographic projection of the conductive part on the protective film layer and the orthographic projection of the metal layer on the protective film layer are both within the range of the protective film layer, and the distance between them and the edge of the protective film layer is greater than or equal to 0.1 mm.

[0014] In an optional example, the metal layer has a connecting portion recessed into the through hole, and the second end of the conductive portion is connected to a side of the connecting portion close to the protective film layer in the through hole;

[0015] The orthographic projection of the through hole on the protective film layer covers the orthographic projection of the connecting portion on the protective film layer.

[0016] In an optional example, the shape of the orthographic projection of the through hole on the protective film layer and the orthographic projection of the connecting portion on the protective film layer have the same shape type, or have different shape types.

[0017] In an optional example, the conductive part is a conductive glue, and the conductive glue in the through hole tightly fills the space of the through hole, or the conductive glue fills part of the space of the through hole.

[0018] The present disclosure also provides a method for preparing a display module, the method comprising:

[0019] A display panel, a buffer layer and a metal layer are provided, wherein the display panel has a protective film layer on a backlight side;

[0020] Attaching the buffer layer to the backlight side of the protective film layer;

[0021] The metal layer is attached to a side of the buffer layer away from the protective film layer, and a conductive portion is embedded between the protective film layer and the metal layer;

[0022] The first end of the conductive part is bonded to the backlight side of the protective film layer, and the second end is bonded to the side of the metal layer close to the protective film layer.

[0023] In an optional example, the buffer layer is provided with a through hole for the conductive part to pass through, the metal layer is attached to a side of the buffer layer away from the display panel, and the conductive part is embedded between the protective film layer and the metal layer, comprising:

[0024] The conductive part is embedded in the through hole, the first end of the conductive part is bonded to the backlight side of the protective film layer, and the second end of the conductive part is retracted into the through hole;

[0025] The metal layer is punched at the through hole of the buffer layer, so that the second end of the conductive portion is bonded to a side of the connection portion of the metal layer punched into the through hole close to the buffer layer.

[0026] The present disclosure also provides a display device, including the display module, or including a display module prepared by the method for preparing the display module.

[0027] With the display module provided by the embodiment of the present disclosure, a conductive portion is provided between the protective film layer and the metal layer, so that the charges accumulated in the protective film layer can be conducted out and grounded through the conductive portion, thereby conducting away the charges in the protective film layer, thereby preventing an electric field from being formed between the inner surface of the glass substrate CG and the protective film layer, thereby not causing a shift in the Vth (threshold voltage) and Vss (source power supply voltage) of the TFT circuit.

[0028] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. It should be noted that the size and shape of each figure in the drawings do not reflect the actual proportion, and the purpose is only to illustrate the content of the present invention. The same or similar numbers in the drawings represent the same or similar elements or elements with the same or similar functions.

[0030] Figure 1 A schematic diagram schematically shows the phenomenon of a copper bar in a display panel glowing in the related art;

[0031] Figure 2 The structure diagram of a display module provided by the present disclosure is schematically shown;

[0032] Figure 3 The schematic diagram of the structure of a buffer layer provided by the present disclosure is schematically shown;

[0033] Figure 4The schematic diagram schematically shows the position setting of the conductive part provided by the present disclosure on the protective film layer;

[0034] Figure 5 Schematically showing two positions of the through holes of the conductive part and the buffer layer provided by the present disclosure;

[0035] Figure 6 A partial schematic diagram of a display module in which a through hole is provided in a film edge region of a buffer layer is schematically shown;

[0036] Figure 7 The schematic diagram schematically shows the moving route of the charge generated by the display module provided by the present disclosure when the copper rod rubs the glass substrate CG;

[0037] Figure 8 A partial schematic diagram of a display module provided by the present disclosure is schematically shown in which the conductive portion is located in the central display area and the through hole is arranged in the central area of ​​the film of the buffer layer;

[0038] Fig. 9 The flowchart schematically shows the steps of the method for preparing the mold set provided by the present disclosure. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0040] like Figure 1 As shown, a schematic diagram of the principle of the shining copper rod in the related art is shown. In order to solve the phenomenon of the shining copper rod in the related art, the present application proposes the following solution. The main idea is to conduct the charges accumulated in the protective film layer and ground them, thereby conducting away the charges of the protective film layer, so that an electric field cannot be formed between the inner surface of the glass substrate CG and the protective film layer, thereby not causing the Vth (threshold voltage) and Vss (source power supply voltage) of the TFT circuit to shift.

[0041] In view of this, this application proposes a specific implementation plan, referring to Figure 2 As shown, a schematic diagram of the solution of the present application is shown, such as Figure 2As shown, a buffer layer 202 is generally attached to the backlight side of the display panel 201, a metal layer 203 is attached to the backlight side of the buffer layer 202, and a conductive part 205 is embedded between the protective film layer 204 and the metal layer 203 of the display panel 201, so that the conductive part 205 forms a charge flow path between the protective film layer 204 and the metal layer 203, wherein the metal layer 203 is grounded, so that the charges accumulated in the protective film layer 204 are conducted to the ground, thereby solving the problem of forming an electric field between the inner surface of the glass substrate CG and the protective film layer.

[0042] Among them, the display module provided in one embodiment of the present application is described, referring to Figure 2 As shown, a schematic diagram of the structure of the display module of the present application is shown, such as Figure 2 As shown, it may specifically include:

[0043] Display panel 201, the display panel has a protective film layer 204 on the backlight side;

[0044] The buffer layer 202 is located on the backlight side of the protective film layer 204;

[0045] The metal layer 203 is located on a side of the buffer layer 202 away from the protective film layer 204;

[0046] The conductive part 205 has a first end 2051 bonded to the backlight side of the protective film layer 204 , and a second end 2052 bonded to the side of the metal layer 203 close to the protective film layer 204 .

[0047] The display panel 201 may include: Figure 1 The glass substrate CG shown, the OCA (Optically Clear Adhesive) layer located on the backlight side of the glass substrate CG, the polarizer POL located on the side of the OCA layer away from the glass substrate CG, and the panel PNL located on the POL away from the OCA layer, wherein the protective film layer 204 is located on the side of the PNL away from the POL. Of course, the specific structure of the display panel 201 may not be limited to the above structure. In practice, the display panel can be assembled according to actual needs. Among them, the protective film layer 204 can be a paint surface protective film layer U-film.

[0048] The buffer layer 202 may be an ultra-clean foam SCF composite membrane, and its specific structure is as shown in Figure 3 As shown, Figure 3 As shown, several structures of the buffer layer 202 are shown, including Figure 3 The structure described in 3-1 includes an EMBO layer, a foam FOAM layer located on one side of the EMBO layer, and a PET layer located on a side of the FOAM layer away from the EMBO layer.

[0049] Or, if Figure 3 The structure described in 3-2 may include an EMBO layer and a PET layer located on one side of the EMBO layer; or Figure 3 The structure described in 3-3 specifically includes: an EMBO layer and a FOAM layer located on one side of the EMBO layer.

[0050] Of course, in practice, the structure of the buffer layer is not limited to the above structure, and can be adjusted according to needs. In this embodiment, the buffer layer and the metal layer can be generally referred to as a heat dissipation buffer layer in the display module, which can play a role in heat dissipation to alleviate the heating problem of the display module during operation of the display module; wherein the metal layer 203 needs to have a grounding lead to achieve grounding of the entire display module.

[0051] In this embodiment, Figure 2 As shown, the conductive part 205 is embedded between the metal layer 203 and the protective film layer 204, and is directly connected to the metal layer 203 and the protective film layer 204. In one example, the conductive part can pass through the buffer layer 202, or can be set in an area outside the buffer layer 202. The specific setting can be based on actual conditions, and it only needs to ensure that the conductive part can be directly connected to the metal layer 203 and the protective film layer 204.

[0052] In one optional embodiment, the metal layer may be a copper layer. Of course, in some other cases, the metal layer may also be a metal of other materials.

[0053] The conductive part may be made of a material with conductive properties. In an optional example, in order to ensure good contact between the protective film layer and the metal layer and optimize the manufacturing process, the conductive part may be a conductive adhesive. Of course, in some other optional examples, the conductive part may also be a columnar structure made of other conductive materials in advance, so that when the conductive part is embedded, the two ends of the conductive part can be bonded to the protective film layer and the metal layer respectively through the conductive adhesive.

[0054] When conductive adhesive is used, the conductive adhesive is softer and is less likely to cause damage such as mold printing to the panel in the display panel.

[0055] The conductive part has a first end and a second end. It can be understood that the first end and the second end refer to two opposite ends of the conductive part, that is, two ends of the conductive part.

[0056] In the display module of the embodiment of the present application, a conductive part is embedded between the protective film layer 204 and the metal layer 203 of the display panel 201, so that the conductive part forms a charge flow path between the protective film layer 204 and the metal layer 203, so that the charges accumulated in the protective film layer 204 can be conducted to the ground, thereby solving the problem of forming an electric field between the inner surface of the glass substrate CG and the protective film layer.

[0057] As described in the above embodiment, the conductive part 205 needs to be embedded between the metal layer 203 and the protective film layer 204 and be in close contact with the metal layer 203 and the protective film layer 204. In this way, in one case, the conductive part can pass through the buffer layer 202 and contact the metal layer 203; in another case, it is also possible not to pass through the buffer layer 202, but to be set in an area outside the buffer layer 202, that is, the conductive part 205 realizes the connection between the metal layer 203 and the protective film layer 204 in the area outside the buffer layer 202.

[0058] In view of this, in an optional embodiment, the protective film layer can be divided into a central display area covering the buffer layer and an edge display area located at the edge of the central display area; wherein the conductive part is located in the edge display area or in the central display area.

[0059] Wherein, when the conductive part is located in the central display area, the second end of the conductive part penetrates through the buffer layer and then adheres to the side of the metal layer close to the protective film layer.

[0060] In the present embodiment, since the buffer layer is disposed on the backlight side of the protective film layer, when the protective film layer has a central display area covering the buffer layer and an edge display area located at the edge of the central display area, the area of ​​the protective film layer is greater than the area of ​​the buffer layer, that is, the orthographic projection of the buffer layer on the protective film layer occupies a partial area of ​​the protective film layer.

[0061] Therefore, the conductive part can be arranged in the central display area of ​​the protective film layer, or in the edge display area of ​​the protective film layer. Figure 4 , which is a schematic diagram showing the position setting of the conductive part on the protective film layer, wherein the central display area 2041 is the area covered by the buffer layer 202 , and the edge display area 2042 is the area not covered by the buffer layer 202 . Figure 4 The left image in the middle is a schematic diagram of the conductive portion 205 being arranged in the edge display area. Figure 4 The middle right image is a schematic diagram of the conductive portion 205 being disposed in the central display area.

[0062] like Figure 4 As shown in the image on the right, when the conductive part 205 is set in the central display area 2041, the first end of the conductive part 205 is connected to the area of ​​the central display area 2041 of the protective film layer 204, and the second end needs to pass through the buffer layer 202 (SCF composite film) and then contact the metal layer 203.

[0063] Of course, it can be understood that, when the conductive part 205 is arranged in the edge display area 2042, the orthographic projection of the metal layer 203 on the glass substrate CG at least covers the orthographic projection of the protective film layer 204 on the glass substrate CG, that is, it is necessary to ensure that the metal layer 203 at least covers the protective film layer 204 to ensure that the conductive part 205 can have good contact with the metal layer 203 and the protective film layer 204.

[0064] In an optional example, when the conductive part is located in the edge display area, the distance between the orthographic projection of the conductive part on the protective film layer and the orthographic projection of the metal layer on the protective film layer and the edge of the protective film layer is greater than or equal to 0.1 mm.

[0065] In this optional example, both the conductive part and the metal layer can be at a certain distance from the edge of the protective film layer so as not to affect the installation of the frame of the display panel, thereby not occupying too much frame space. In the case where the conductive part is located in the edge display area, the structural diagram of the display module can refer to the diagram described in the subsequent embodiments. Figure 6 That's it, with Figure 6 The only difference is that the conductive part is located in the edge display area and does not penetrate the buffer layer, and the rest of the structure can be the same as Figure 7 Similar, no further elaboration is required here.

[0066] Next, the structure of the display module in which the conductive part of the present application passes through the buffer layer to achieve connection with the metal layer and the protective film layer is described.

[0067] In this case, the conductive part can penetrate the edge of the buffer layer or the inside of the buffer layer. Specifically, the buffer layer also has an edge region and a central region, and the conductive part can pass through the edge region or the central region. In actual implementation, a through hole can be opened in the edge region or the central region of the buffer layer for the conductive part to pass through.

[0068] Reference Figure 5 As shown in FIG. 1 , two schematic diagrams of the positions of the through holes of the conductive part and the buffer layer are shown, wherein the schematic diagram on the left is the conductive part at Figure 4 The schematic diagram of the central display area and the through hole located in the edge area of ​​the buffer layer, the schematic diagram on the right is the conductive part in Figure 4 The central display area is a schematic diagram in which the through hole is located in the central area of ​​the buffer layer.

[0069] The edge region can be Figure 4 The upper boundary shown may be the lower boundary, the left boundary, or the right boundary in practice. No matter where the conductive part is opened, the purpose of extracting the charge of the protective film layer 204 of the present application can be achieved without affecting other structures of the display module or increasing the size of the display module.

[0070] Specifically, Figure 5 As shown, the buffer layer 202 includes a film center area 2021, and a film edge area 2022 located at the edge of the film center area 2021; when the conductive part 205 is located in the central display area 2041, the second end of the conductive part 205 penetrates the film edge area 2022 or penetrates the film center area 2021, and then adheres to the side of the metal layer 203 close to the protective film layer 204.

[0071] Among them, no matter whether the through hole is opened in the membrane edge area 2022 or the membrane center area 2021, in an optional embodiment, the conductive part 205 can be a conductive glue, and the conductive glue tightly fills the space of the through hole in the through hole, or the conductive glue fills part of the space of the through hole.

[0072] The conductive adhesive filling the entire space of the through hole may be used to guide the conductive adhesive to be in close contact with the buffer layer and then connected to the metal layer, and the conductive adhesive filling a portion of the space of the through hole may be used to guide a gap between the conductive adhesive and the buffer layer.

[0073] Reference Figure 6 FIG. 1 is a partial schematic diagram of a display module in which a through hole is arranged in the film edge region of the buffer layer. Figure 6 As shown, the display model of this embodiment is explained.

[0074] The buffer layer 202 is provided with a through hole 2023 for the conductive part 205 to pass through, and the second end 2052 of the conductive part 205 is bonded to the side of the metal layer 203 close to the protective film layer 202 after passing through the through hole 2023 .

[0075] Among them, Figure 6 As shown, the conductive part has a certain gap with the buffer layer 202 in the through hole 2023 so that it does not contact the buffer layer 202. In this case, the charge transfer efficiency problem that may be caused by the contact between the conductive part and the buffer layer can be reduced, so that all the charges of the protective film layer are transferred to the metal layer and then conducted to the ground.

[0076] Among them, Figure 6 As shown, when the through hole is opened in the edge area of ​​the buffer layer, since the buffer layer is located on the backlight side of the protective film layer and has a certain distance from the edge of the display panel, the conductive part and the metal layer can also have a certain distance from the edge of the display panel.

[0077] In an optional example, when the conductive part is located in the edge display area, the orthographic projection of the conductive part on the protective film layer and the orthographic projection of the metal layer on the protective film layer are both within the range of the protective film layer, and the distance between them and the edge of the protective film layer is greater than or equal to 0.1 mm.

[0078] like Figure 6 As shown, Figure 6 The "c" in the figure means the distance between the orthographic projection of the conductive part on the protective film layer, the orthographic projection of the metal layer on the protective film layer and the edge of the protective film layer. The value of c can be 0.1 mm. Figure 6 As shown, the c value can also be understood as the shrinkage value of the buffer layer compared to the PNL. Because the through hole is opened in the membrane edge area of ​​the buffer layer, and the conductive part is arranged in the through hole, in practice, the distance between the orthographic projection of the conductive part and the metal layer on the protective film layer and the edge of the protective film layer can be approximated as the shrinkage value of the buffer layer compared to the PNL.

[0079] The c value may have different values ​​according to design requirements. For example, for a 2D display module, the c value needs to be greater than or equal to 0.3 mm, and for a 3D display module, the c value needs to be greater than or equal to 0.6 mm.

[0080] Reference Figure 7 FIG. 1 is a schematic diagram showing the movement path of the charge generated by the display module of the embodiment of the present application when the copper rod rubs the glass substrate CG, as shown in FIG. Figure 7 As shown, the charges enter the backlight side of the glass substrate CG, and enter the backlight side of the protective film layer through the frame between OCA, POL, and PNL, and are then transferred to the metal layer 203 by the conductive portion 205 electrically connected to the protective film layer. The metal layer 203 then introduces the charges into the ground terminal of the entire device (the display device where the display module is located) to prevent the charges from accumulating near the PNL and causing a Vth shift in the TFT circuit in the PNL.

[0081] In this embodiment, the distance between the orthographic projection of the conductive part on the protective film layer, the orthographic projection of the metal layer on the protective film layer and the edge of the protective film layer is more than 0.1 mm, which ensures the stability of the attachment and ensures that the overflow of the conductive part does not exceed the outer boundary of the buffer layer when it is bonded in the factory, without affecting the space of the entire machine and avoiding contact with other structures in the space of the entire machine.

[0082] like Figure 6As shown, in an optional example, the metal layer has a connecting portion 2031 recessed into the through hole 2023, and the second end of the conductive portion 205 is connected to the side of the connecting portion 2031 close to the protective film layer 204 in the through hole 2031; wherein the orthographic projection of the through hole 2023 on the protective film layer 204 covers the orthographic projection of the connecting portion 2031 on the protective film layer 204.

[0083] like Figure 6 As shown, the metal layer 203 can be punched at the through hole 2023, so that the metal layer 203 has a protrusion at the through hole 2023 that is recessed toward the through hole 2023, and the protrusion is the connecting portion 2031. Thus, the conductive portion 205 is in the through hole 2023, with its first end connected to the protective film layer 204, and the second end is connected to the side of the connecting portion 2031 close to the protective film layer 204.

[0084] When this embodiment is adopted, the contact difficulty between the conductive part and the metal layer can be reduced. For example, when the conductive part is a conductive glue, the coating difficulty of the conductive glue can be further reduced, so that a thin layer can achieve good contact with the metal layer.

[0085] Reference Figure 8 FIG. 1 is a partial schematic diagram of a display module in which the conductive portion is located in the central display area and the through hole is arranged in the central area of ​​the buffer layer. Figure 8 As shown, the display module of this embodiment is described.

[0086] In this case, the buffer layer 202 has a through hole 2023 in the center of the film for the conductive part 205 to pass through, and the second end 2052 of the conductive part 205 is bonded to the side of the metal layer 203 close to the protective film layer 202 after passing through the through hole 2023 .

[0087] In this optional embodiment, the metal layer 203 also has a connecting portion 2031 recessed into the through hole 2023, and the conductive portion 205 is in the through hole 2023, with its first end in contact with the protective film layer 204 and its second end in contact with the side of the connecting portion 2031 close to the protective film layer 204.

[0088] It should be noted that in this case, since the through hole 2023 is opened in the central area of ​​the membrane, the connecting portion 2031 can have a gap with the wall of the through hole 2023 inside the through hole 2023, that is, the orthographic projection of the through hole on the protective film layer covers the orthographic projection of the connecting portion on the protective film layer.

[0089] Specifically, if Figure 8As shown, the distance between the boundary of the orthographic projection of the connecting portion 2031 on the protective film layer 204 and the boundary of the orthographic projection of the through hole 2023 on the protective film layer 204 needs to be greater than or equal to 0.15 mm. Figure 6 and Figure 8 As shown in b in FIG. 2 , in this way, the manufacturing tolerance when punching the metal layer 203 at the through hole 2023 can be met, thereby reducing the process error.

[0090] In another optional embodiment, the distance between the boundary of the orthographic projection of the conductive portion 205 on the protective film layer 204 and the boundary of the orthographic projection of the connecting portion 2031 on the protective film layer 204 is greater than or equal to 0.1 mm. Figure 6 and Figure 8 As shown in a in the figure, a certain distance can be provided between the edge of the conductive portion 205 and the connecting portion 2031, and a certain gap can be provided between the connecting portion 2031 and the hole wall of the through hole 2023, so that a gap can be provided between the protective film layer 204 and the metal layer 203, thereby reducing the weight of the entire display module, and leaving enough room for error tolerance for manufacturing errors when manufacturing the display module, thereby reducing process errors.

[0091] In one case, no matter the through hole is arranged in the edge area or the center area of ​​the film, the shape of the orthographic projection of the through hole on the protective film layer and the orthographic projection of the connecting portion on the protective film layer may have the same shape type.

[0092] The shape type is used to characterize the category of the shape, including the category of circle, the category of rectangle, the category of triangle or the category of other polygonal shapes. In this case, the shape of the connecting portion can be the same as the shape of the through hole, for example, both are circle or both are rectangle. Of course, since the connecting portion needs to penetrate into the through hole, the connecting portion should be smaller than the through hole so as to extend into the through hole.

[0093] In yet another case, the shape of the orthographic projection of the through hole on the protective film layer and the orthographic projection of the connecting portion on the protective film layer have different shape types.

[0094] In this case, the shape of the connecting portion can be different from the shape of the through hole, for example, the through hole is circular and the connecting portion is rectangular, or the through hole is rectangular and the connecting portion is circular. Of course, since the connecting portion needs to penetrate into the through hole, the connecting portion should be smaller than the through hole so as to extend into the through hole.

[0095] By adopting this optional example, the shape of the through hole and the shape of the connecting part of the metal layer can be flexibly set. In this way, when the metal layer is stamped at the through hole, the stamping shape of the metal layer may not be limited to the shape of the through hole, and the opening shape of the through hole may also not be limited to the stamping shape of the metal layer, thereby ensuring the flexibility of preparing the display module of this embodiment.

[0096] The technical solution of the embodiment of the present application has the following advantages:

[0097] First, since a conductive part is embedded between the metal layer and the protective film layer of the display panel, the charges accumulated on the protective film layer can be introduced into the metal layer through the conductive part, and then directly conducted to the ground by the metal layer, thereby avoiding the formation of an electric field between the inner surface of the glass substrate and the protective film layer, thereby ensuring that the Vth (threshold voltage) and Vss (source power supply voltage) of the TFT circuit of the display panel are not offset.

[0098] Secondly, since a through hole can be provided on the buffer layer for the conductive part to pass through, the overall weight of the display module is reduced on the one hand, and on the other hand, the frame configuration space of the display module does not need to be occupied. On the other hand, since a through hole is provided, the metal layer can be punched at the through hole to form a connecting part that is recessed into the through hole, thereby simplifying the embedding process of the conductive part (especially when the conductive part is a conductive glue) compared to the method without punching, so that the conductive part and the metal layer can be in close contact.

[0099] Third, since the orthographic projection of the through hole on the protective film layer covers the orthographic projection of the connecting portion on the protective film layer, sufficient process tolerance is provided when the connecting portion is formed by stamping the metal layer, thereby reducing the manufacturing tolerance and improving the process accuracy of the display module.

[0100] Based on the same inventive concept, the present application also provides a method for preparing a display module, wherein, in order to prepare the display module in the above embodiment, referring to Fig. 9 As shown, a flowchart of the steps of the method for preparing the display module of the embodiment of the present application is shown. Fig. 9 As shown, the following steps may be specifically included:

[0101] Step S1: providing a display panel, a buffer layer and a metal layer, wherein the display panel has a protective film layer on a backlight side.

[0102] In this embodiment, the SCF manufacturer can provide an SCF composite film as a buffer layer, wherein the size of the provided buffer layer is adapted to the size of the display panel, wherein the display panel, the buffer layer and the metal layer can be three independent components that can be prepared separately and can be prepared by different manufacturers or by the same manufacturer.

[0103] Among them, a protective film layer is attached to the backlight side of the display panel. The protective film layer, as described in the above embodiment, can be a paint surface protective film, such as a U-film film layer.

[0104] Step S2: attaching the buffer layer to the backlight side of the protective film layer.

[0105] In this embodiment, a buffer layer can be attached to the backlight side of the protective film layer of the display panel, wherein, as described in the above embodiment, the orthographic projection of the buffer layer on the protective film layer can be covered by the protective film layer, that is, the size of the buffer layer is smaller than the size of the protective film layer. When attached, the boundary of the buffer layer can be kept indented from the display panel, and the boundary of the orthographic projection of the buffer layer on the protective film layer is more than 0.3 mm away from the edge of the protective film layer. Specifically, for 2D type display modules, the distance needs to be kept at 0.3 mm or more, and for 3D type display modules, the distance needs to be kept at 0.6 mm or more.

[0106] Step S3: attaching the metal layer to a side of the buffer layer away from the protective film layer, and embedding a conductive portion between the protective film layer and the metal layer.

[0107] In this embodiment, a metal layer can be attached to the side of the buffer layer away from the protective film layer, and a conductive part can be embedded between the protective film layer and the metal layer. In specific implementation, during actual production, the conductive part can be first bonded to the protective film layer. When the conductive part needs to pass through the buffer layer, the conductive part can be bonded in the through hole opened in the buffer layer, and then the metal layer can be attached to the side of the buffer layer away from the protective film layer. In this case, it is necessary to ensure effective contact between the conductive part and the side of the metal layer close to the protective film layer.

[0108] Specifically, the first end of the conductive part is bonded to the backlight side of the protective film layer, and the second end is bonded to the side of the metal layer close to the protective film layer.

[0109] Among them, the present application also provides an improved solution for saving more manufacturing equipment and reducing manufacturing tolerances. Specifically, a through hole can be pre-opened in the provided buffer layer; as described in the above embodiments, the through hole can be opened in the membrane edge area of ​​the buffer layer or in the membrane center area of ​​the buffer layer. No matter where the through hole is opened in the buffer layer, in step S803, the metal layer can be punched by stamping to make it contact with the conductive part in the through hole.

[0110] In specific implementation, a conductive part can be embedded in the through hole, with the first end of the conductive part bonded to the backlight side of the protective film layer, and the second end of the conductive part retracted into the through hole; and a metal layer is punched at the through hole of the buffer layer so that the second end of the conductive part is bonded to the side of the connection part of the metal layer punched into the through hole close to the buffer layer.

[0111] In this embodiment, the conductive part can be a conductive adhesive. After the buffer layer is attached, a certain thickness of the conductive adhesive can be coated in the through hole. The specific thickness of the conductive adhesive can be determined according to the punching strength of the stamped metal layer to ensure that the connecting part formed after stamping can be in close contact with the conductive adhesive in the through hole.

[0112] After the conductive adhesive is applied, the metal layer can be punched at the through hole, so that the part of the metal layer at the through hole is recessed into the through hole to form a Figures 6 to 8 The connecting portion shown in FIG. 1 is then bonded to the conductive adhesive on one side of the connecting portion close to the protective film layer, thereby forming a Figure 7 The charge transfer path shown is from the protective film layer to the metal layer via the conductive adhesive.

[0113] Of course, in another actual production, the production process may also be as follows:

[0114] After punching the metal layer at the through hole of the buffer layer, a punched metal layer is formed;

[0115] The buffer layer is attached to the backlight side of the protective film layer, and then a conductive glue of a certain thickness is coated in the through hole;

[0116] Next, after the connection portion of the stamped metal layer is aligned with the through hole, the metal layer is attached to the side of the buffer layer away from the protective film layer, thereby realizing the preparation of the display module of the present application.

[0117] By adopting this preparation method, when the buffer layer is produced by a third party, there is no need to introduce equipment specifically used to drill holes in the buffer layer, and the metal layer can be directly punched at the through hole. Compared with independently punching out the metal layer, that is, not punching at the through hole, but pre-punching the metal layer, the secondary production tolerance generated when stamping the metal layer separately can be reduced, thereby reducing the manufacturing error of the display module and improving the process accuracy of the manufactured display module.

[0118] Based on the same inventive concept, the present application also provides a display device, including the display module in the above embodiment, or including a display module prepared by the above display module preparation method.

[0119] As for the embodiment of the method for preparing the display module, since it is basically similar to the embodiment of the display module, the description is relatively simple, and the relevant parts may refer to the partial description of the embodiment of the display module.

[0120] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0121] Finally, it should be noted that, unless otherwise defined, the words "first", "second" and similar terms used in this article do not indicate any order, quantity or importance, but are only used to distinguish different components. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0122] The display module, the method for preparing the display module and the display device provided by the present disclosure are introduced in detail above. The principles and implementation methods of the present disclosure are explained in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present disclosure. At the same time, for those skilled in the art, according to the idea of ​​the present disclosure, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present disclosure.

[0123] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0124] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

[0125] References herein to "one embodiment," "embodiment," or "one or more embodiments" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present disclosure. In addition, please note that examples of the term "in one embodiment" do not necessarily all refer to the same embodiment.

[0126] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present disclosure can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0127] In the claims, any reference signs placed between brackets shall not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present disclosure may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names.

[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A display module, characterized in that: include: A display panel, wherein the display panel has a protective film layer on a backlight side; A buffer layer, located on the backlight side of the protective film layer; A metal layer, located on a side of the buffer layer away from the protective film layer; A conductive part, wherein a first end of the conductive part is bonded to a side of the backlight surface of the protective film layer, and a second end of the conductive part is bonded to a side of the metal layer close to the protective film layer.

2. The display module according to claim 1, characterized in that: The buffer layer is provided with a through hole for the conductive part to pass through, and the second end of the conductive part is bonded to a side of the metal layer close to the protective film layer after passing through the through hole.

3. The display module according to claim 1 or 2, characterized in that: The protective film layer comprises a central display area covering the buffer layer, and an edge display area located at the edge of the central display area; Wherein, the conductive portion is located in the edge display area or in the central display area; Wherein, when the conductive part is located in the central display area, the second end of the conductive part penetrates through the buffer layer and then adheres to the side of the metal layer close to the protective film layer.

4. The display module according to claim 3, characterized in that: When the conductive part is located in the edge display area, the orthographic projection of the conductive part on the protective film layer and the orthographic projection of the metal layer on the protective film layer are both within the range of the protective film layer, and the distance between them and the edge of the protective film layer is greater than or equal to 0.1 mm.

5. The display module according to claim 2, characterized in that: The metal layer has a connecting portion recessed into the through hole, and the second end of the conductive portion is connected to a side of the connecting portion close to the protective film layer in the through hole; The orthographic projection of the through hole on the protective film layer covers the orthographic projection of the connecting portion on the protective film layer.

6. The display module according to claim 5, characterized in that: The shape of the orthographic projection of the through hole on the protective film layer and the orthographic projection of the connecting portion on the protective film layer have the same shape type, or have different shape types.

7. The display module according to claim 2, characterized in that: The conductive part is a conductive glue, and the conductive glue in the through hole tightly fills the space of the through hole, or the conductive glue fills part of the space of the through hole.

8. A method for preparing a display module, characterized in that: The method comprises: A display panel, a buffer layer and a metal layer are provided, wherein the display panel has a protective film layer on a backlight side; Attaching the buffer layer to the backlight side of the protective film layer; The metal layer is attached to a side of the buffer layer away from the protective film layer, and a conductive portion is embedded between the protective film layer and the metal layer; The first end of the conductive part is bonded to the backlight side of the protective film layer, and the second end is bonded to the side of the metal layer close to the protective film layer.

9. The preparation method according to claim 8, characterized in that: The buffer layer is provided with a through hole for the conductive part to pass through, the metal layer is attached to a side of the buffer layer away from the display panel, and the conductive part is embedded between the protective film layer and the metal layer, comprising: The conductive part is embedded in the through hole, the first end of the conductive part is bonded to the backlight side of the protective film layer, and the second end of the conductive part is retracted into the through hole; The metal layer is punched at the through hole of the buffer layer, so that the second end of the conductive portion is bonded to a side of the connection portion of the metal layer punched into the through hole close to the buffer layer.

10. A display device, characterized in that: A display module comprising any one of claims 1-7, or a display module prepared by the method for preparing a display module according to any one of claims 8-9.

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