Detection system

Abstract

The application belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a detection system. The detection system comprises a carrier platform, a lens, a detector, a controller and a feedback device. The carrier platform is used for carrying a detection object. The lens is arranged above the carrier platform and faces the carrier platform. The lens and the carrier platform can move relative to each other in the axial and / or radial directions. The detector is arranged at the end of the lens in the moving direction of the carrier platform. The detector is used for detecting the axial size of particles on the detection object and sending an error detection signal according to the detection result. The controller is electrically connected with the carrier platform, the lens and the detector respectively. The controller is used for controlling the carrier platform, the lens and the detector to operate respectively. The feedback device is used for receiving the error detection signal and sending a feedback signal to the controller. The controller controls the carrier platform and the lens to stop operating according to the feedback signal. According to the detection system, real-time monitoring can be performed, accidents can be prevented, and the accuracy of the detection result can be ensured.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a detection system. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit. Since the wafer has a circular shape, it is called a wafer. Various circuit element structures can be processed and manufactured on the silicon wafer, and the silicon wafer becomes an integrated circuit product with specific electrical properties.

[0003] In a semiconductor process, the cleanliness of the wafer surface is one of important factors affecting the reliability of semiconductor devices. When a wafer is placed in a device with an optical structure for measurement, if large-size particles generated by an accident in a previous process or existing in the environment fall on the wafer, the large-size particles are easily adsorbed by an optical lens during the measurement of the wafer, and the wafer is scratched and contaminated in subsequent wafer measurement. In this way, all the subsequently measured wafers will be reduced in quality due to serious scratches, resulting in wafer scrap. SUMMARY

[0004] The application provides a detection system, which comprises:

[0005] A slide table for carrying a detection object;

[0006] A lens arranged above the slide table and facing the slide table, the lens and the slide table being capable of relative movement in an axial and / or radial direction;

[0007] A detector arranged at an end of the lens moving direction towards the slide table, the detector being used for detecting the axial size of particles on the detection object and sending an error detection signal according to the detection result;

[0008] A controller electrically connected with the slide table, the lens and the detector respectively, the controller being used for controlling the slide table, the lens and the detector to run respectively;

[0009] A feedback device for receiving the error detection signal and sending a feedback signal to the controller, the controller controlling the slide table and the lens to stop running according to the feedback signal.

[0010] According to the detection system of the application, the detector is arranged at the end of the lens moving towards the slide stage, the detector sends an error detection signal according to the detection result of the particles on the detection object, the feedback device sends a feedback signal to the controller according to the received error detection signal, and the controller controls the slide stage and the lens to stop running according to the feedback signal, so that the detection system is monitored in real time, the particles are prevented from being adsorbed on the lens and causing scratches and scratches on the subsequent detection object, the particles on the detection object are detected and removed in time and effectively, accidents are prevented, the safety and reliability of the lens are ensured, and the subsequent detection object can continue to be detected to ensure the accuracy of the detection result of the detection system. BRIEF DESCRIPTION OF DRAWINGS

[0011] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not intended to limit the scope of the application. Moreover, like reference numerals designate like parts throughout the several views of the drawings in which:

[0012] Figure 1 The relative position structure diagram of the lens and the slide stage of the detection system of the embodiment is shown in the figure.

[0013] Figure 2 The detection signal transmission relationship block diagram of the detection system is shown in the figure. Figure 1

[0014] The reference numerals in the drawings represent the following:

[0015] 100: detection system;

[0016] 10: slide stage;

[0017] 20: lens, 21: frame, 22: lens;

[0018] 30: detector;

[0019] 40: controller;

[0020] 50: feedback device;

[0021] 200: wafer. DETAILED DESCRIPTION

[0022] Exemplary embodiments of the application will be described in greater detail below with reference to the accompanying drawings. Although the exemplary embodiments of the application are shown in the drawings, it should be understood that the application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided so that the application can be more thoroughly understood and the scope of the application can be fully conveyed to those skilled in the art. ​

[0023] It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "has" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order in which they are described unless specifically identified as an order dependent step. It is also to be understood that additional or alternative steps can be employed.

[0024] Although the terms first, second, third, and the like can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first", "second", and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0025] Spatially relative terms, such as "inner", "outer", "inward", "outward", "lower", "bottom", "top", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Such spatially relative terms can encompass different orientations of the device in use or operation, depending on the particular context in which it is used. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0026] In conjunction with Figure 1 and Figure 2As shown, the detection system 100 of the present application can be used in the optical detection process of various components, for the convenience of description, only the detection of the surface of the wafer 200 is taken as an example for description. The detection system 100 of the present embodiment comprises a wafer stage 10, a lens 20, a detector 30, a controller 40 and a feedback device 50, the wafer stage 10 is used to carry the wafer 200, the lens 20 is arranged above the wafer stage 10 and faces the wafer stage 10, the lens 20 and the wafer stage 10 can move relative to each other in the axial and / or radial direction, the detector 30 is arranged at the end of the lens 20 moving direction towards the wafer stage 10, the detector 30 is used to detect the axial size of the particles on the wafer 200, and an error detection signal is sent according to the detection result, the controller 40 is electrically connected with the wafer stage 10, the lens 20 and the detector 30 respectively, the controller 40 is used to control the wafer stage 10, the lens 20 and the detector 30 to operate respectively, and the feedback device 50 is used to receive the error detection signal and send a feedback signal to the controller 40, and the controller 40 controls the wafer stage 10 and the lens 20 to stop operating according to the feedback signal.

[0027] According to the detection system 100 of the present application, by arranging the detector 30 at the end of the lens 20 moving direction towards the wafer stage 10, the detector 30 sends an error detection signal according to the detection result of the size of the particles on the wafer 200, the feedback device 50 sends a feedback signal to the controller 40 according to the received error detection signal, and the controller 40 controls the wafer stage 10 and the lens 20 to stop operating according to the feedback signal, so as to monitor the detection system 100 in real time, prevent the particles from being adsorbed on the lens 20 and causing scratches and scratches on the subsequent wafer 200, timely and effectively remove the particles on the wafer 200, prevent accidents from happening, and ensure the safety and reliability of the lens 20, so as to continue to detect the subsequent wafer 200, and ensure the accuracy of the detection result of the wafer 200 by the detection system 100.

[0028] Specifically, as shown, Figure 1 The lens 20 of the present embodiment comprises a frame 21 and a lens 22, the lens 22 is arranged inside the frame 21, and is used to measure the surface quality of the wafer 200 on the wafer stage 10. The detection system 100 of the present embodiment further comprises an image measuring device (not shown in the figure). Among them, the lens 20 is part of the image measuring device, the frame 21 is part of the structure of the rack of the image measuring device, the image measuring device emits light rays towards the wafer 200 through the lens 20, and the light rays act on the surface of the wafer 200 through the lens 22, and the surface quality of the wafer is measured through the light rays reflected by the surface of the wafer 200. In other embodiments of the present application, the lens 20 and the image measuring device are detachably connected, and the lens 20 of the corresponding specification is selected according to the specification of the wafer 200 and connected with the image measuring device. Specifically, the frame 21 and the rack of the image measuring device are detachably connected.

[0029] The image measurement device of this embodiment can be a wafer surface quality measurement device in the prior art, specifically including a light source, a beam splitter, a light receiving mechanism, and a light processing mechanism. The light source can be a laser light source and / or an LED light source. The beam splitter is used to change the light propagation direction of the light source, facilitating the adjustment of the light source's position. The incident light emitted by the light source is split into two parts after passing through the beam splitter. The first part is reflected onto the wafer by the beam splitter, and the other part is refracted and passes through the beam splitter before exiting. The part of the light reflected onto the wafer is reflected by the wafer to form an outgoing light beam, which propagates to the light receiving mechanism. The light receiving mechanism receives the outgoing light beam and processes it through the light processing mechanism. Based on the processing result, it is determined whether there are defects on the wafer.

[0030] For example Figure 1 As shown, in this embodiment, the lens 20 and the stage 10 can move relative to each other along the axial direction. When the axial dimension of the particles on the surface of the wafer 200 detected by the detector 30 is greater than or equal to the minimum axial distance between the lens 20 and the wafer 200 (i.e., the distance between the tip of the lens 20 at its central axis and the wafer 200), the detector 30 issues an error detection signal. The feedback unit 50 sends a feedback signal to the controller 40 based on the received error detection signal. The controller 40 controls the stage 10 and the lens 20 to stop operating based on the feedback signal, thereby preventing particles on the wafer 200 from adhering to the lens 20 and scratching the wafer 200 for subsequent measurements, ensuring the accuracy of the detection results of the wafer 200 surface by the lens 20. At the same time, a corresponding alarm signal can be set in the detection system 100. When the controller 40 receives the feedback signal, it immediately triggers the alarm signal to remind the user to stop the relevant detection operation and clean the surface of the wafer 200 in time. Specifically, the alarm signal can be set as a ringing sound or a corresponding indicator light. The particles on the surface of wafer 200 include large wafer fragments that have fallen off after previous processes, or particulate objects floating in the environment, such as large particles like hair or lines. These particles can adhere to the lens 20 during the inspection of the wafer 200 surface and cause scratches and abrasions to the wafer 200 for subsequent measurements. Therefore, it is necessary to clean the particles in a timely and effective manner during the measurement process to ensure the accuracy of the wafer 200 surface quality measurement.

[0031] Further, to ensure the accuracy of the detection result of the surface of the wafer 200, in the embodiment, the minimum axial distance between the lens 20 and the wafer 200 is 2 mm during the relative movement between the lens 20 and the wafer stage 10 in the axial direction. Specifically, in the embodiment, the axial position of the wafer stage 10 can be kept unchanged, and the lens 20 can move relative to the wafer stage 10 in the axial direction of the lens 20, so as to move close to or away from the wafer stage 10. In other embodiments of the present application, the axial position of the lens 20 can be kept unchanged, and the wafer stage 10 can move relative to the lens 20 in the axial direction of the wafer stage 10, so as to move close to or away from the lens 20, or the lens 20 and the wafer stage 10 can move close to or away from each other in the axial direction at the same time

[0032] In the embodiment, to ensure the reliability of the detection of the particles on the surface of the wafer 200 by the detector 30, the axial distance between the detector 30 and the wafer stage 10 is less than or equal to the axial distance between the lens 20 and the wafer stage 10, that is, the detector 30 is arranged closer to the wafer 200 on the wafer stage 10 than the lens 20, so as to ensure that the particles on the surface of the wafer 200 are detected by the detector 30 before the lens 20 contacts the particles, and prevent the particles on the surface of the wafer 200 from adhering to the lens 20 after contacting the lens 20, and causing scratches and marks on the surface of the wafer 200 for subsequent measurement, so as to ensure the accuracy and reliability of the quality detection of the surface of the wafer 200.

[0033] The detector 30 for detecting the size of the particles on the surface of the wafer 200 in the present application has various forms, wherein the detector 30 in the embodiment is an image acquisition device, which is a camera or a camera head. When the wafer 200 is placed on the wafer stage 10, the lens 20 and the wafer stage 10 are driven to move close to each other in the axial direction, and during the relative close movement of the lens 20 and the wafer stage 10, the image acquisition device is started, which detects the size of the particles on the surface of the wafer 200 in real time, and sends an error detection signal when the distance between the lens 20 and the upper surface of the wafer 200 is equal to the size of the particles on the surface of the wafer 200, or when the detected size of the particles is greater than or equal to the minimum set distance between the wafer 200 and the lens 20, so as to stop the relative close movement between the lens 20 and the wafer 200, and clean the surface of the wafer 200 in time to prevent the particles on the surface of the wafer 200 from adhering to the lens 20.

[0034] When the detector 30 is a camera or a camera head, the detector 30 can also detect during the movement of the lens 20 and the wafer stage 10 close to each other in the radial direction, and send an error detection signal when the detected size of the particles on the surface of the wafer 200 is greater than or equal to the distance between the lens 20 and the upper surface of the wafer 200.

[0035] In other embodiments of the present application, the detector 30 comprises a light emitting part and a light receiving part arranged oppositely, and the light receiving part is electrically connected with the feedback device 50. The light emitting part and the light receiving part are arranged oppositely and span most of the space above the surface of the wafer 200. When there is a particle on the surface of the wafer 200, the particle will block part of the light emitted by the light emitting part, thereby affecting the light receiving effect of the light receiving part, causing the light received by the light receiving part to be weaker or unable to receive signals, and the size of the particle on the surface of the wafer 200 is calculated according to the light received by the light receiving part. During the relative axial approaching movement of the lens 20 and the wafer 200, when the axial spacing size between the lens 20 and the upper surface of the wafer 200 is equal to the size of the particle on the surface of the wafer 200, an error detection signal is emitted, or when the detected particle size is greater than or equal to the minimum set spacing size between the wafer 200 and the lens 20, an error detection signal is emitted, and the controller 40 stops the relative approaching movement between the lens 20 and the wafer 200, and timely cleans the surface of the wafer 200 to prevent the particles on the surface of the wafer 200 from adhering to the lens 20.

[0036] Specifically, the light emitting part of the present embodiment is any one of a lamp, a laser, and a light emitting diode, and the light receiving part is any one of a photodiode, a photomultiplier tube, and a phototransistor.

[0037] In the present embodiment, since the size of the lens 22 in the lens 20 is limited, when detecting a wafer 200 with a large radial size, the full surface of the wafer 200 cannot be detected at the same relative position, so the relative movement between the wafer stage 10 and the lens 20 in the radial direction perpendicular to the axial direction is needed to ensure full coverage detection of the upper surface of the wafer 200. Specifically, in the present embodiment, the radial position of the wafer stage 10 can be kept stationary, and the lens 20 can move relative to the wafer stage 10 in the radial direction to approach or move away from the wafer stage 10. In other embodiments of the present application, the radial position of the lens 20 can be kept stationary, and the wafer stage 10 can move relative to the lens 20 in the radial direction to approach or move away from the lens 20, or the lens 20 and the wafer stage 10 can move relative to each other in the radial direction.

[0038] To ensure that the lens and the wafer stage can move relative to each other in the axial and / or radial directions during the movement, the detector of the present embodiment is arranged in a ring shape, so that the particles on the upper surface of the wafer 200 can be detected comprehensively at various angles.

[0039] In the embodiment, when the detector 30 detects that the axial size of the particle on the upper surface of the wafer 200 is greater than or equal to the minimum axial spacing size between the lens 20 and the wafer 200, the detector 30 sends an error detection signal. The feedback device 50 sends a feedback signal to the controller 40 according to the received error detection signal, and the controller 40 controls the wafer stage 10 and the lens 20 to stop running according to the feedback signal, and timely cleans the surface of the wafer 200, prevents the large-size particles from adhering to the lens 20, and causes scratches and scratches on the wafer 200 for subsequent detection. When the detector 30 does not detect that the axial size of the particle on the upper surface of the wafer 200 is greater than or equal to the minimum axial spacing size between the lens 20 and the wafer 200, the detector 30 sends a correct detection signal or does not send a detection signal. The controller 40 normally controls the relative movement between the lens 20 and the wafer 200, and correspondingly detects the surface quality of the wafer 200, so as to complete the detection work of the surface quality of the wafer 200. In the detection process, the detector 30 effectively detects the particle size on the surface of the wafer 200, prevents the large-size particles from adhering to the lens 20, and ensures the accuracy and reliability of the detection result of the surface quality of the wafer 200.

[0040] The above merely describes the preferred embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A detection system, characterized in that, include: A slide stage, used to hold the specimen to be tested; The lens is positioned above and facing the film stage, and the lens and the film stage are capable of relative movement in the axial and / or radial directions. A detector is located at the end of the lens facing the direction of movement of the slide stage. The detector is arranged in a ring. The axial distance between the detector and the slide stage is less than or equal to the axial distance between the lens and the slide stage. The detector is used to detect the axial dimension of particles on the test piece. When the detector detects that the axial dimension of particles on the test piece is greater than or equal to the minimum axial distance between the lens and the test piece, the detector issues an error detection signal. A controller is electrically connected to the slide stage, the lens, and the detector, respectively, and the controller is used to control the operation of the slide stage, the lens, and the detector respectively; A feedback device is provided to receive the error detection signal and send a feedback signal to the controller, which then controls the film stage and the lens to stop operating based on the feedback signal.

2. The detection system according to claim 1, characterized in that, The lens and the stage can move relative to each other in the axial direction. During the relative axial movement between the lens and the stage, the minimum axial distance between the lens and the test piece is 2mm.

3. The detection system according to claim 1, characterized in that, The detector is an image acquisition device, which is a camera or webcam.

4. The detection system according to claim 1, characterized in that, The detector includes a light-emitting part and a light-receiving part arranged opposite to each other, and the light-receiving part is electrically connected to the feedback device.

5. The detection system according to claim 4, characterized in that, The light-emitting part is any one of a lamp, a laser, and a light-emitting diode, and the light-receiving part is any one of a photodiode, a photomultiplier tube, and a phototransistor.

6. The detection system according to claim 1, characterized in that, The detection system also includes an image measuring device, the lens of which is part of the image measuring device. The image measuring device emits light toward the workpiece under test through the lens and measures the surface quality of the workpiece under test.

7. The detection system according to any one of claims 1 to 6, characterized in that, The detection system is a wafer inspection system, and the wafer stage is used to carry the wafer.

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