Transmission source and detection system based on transmission imaging

Abstract

The application discloses a transmission ray source and a detection system based on transmission imaging. According to the application, a temperature sensing element and a ceramic heating assembly can be arranged in a device cavity where a ray generating module and a liquid insulation medium are located. Based on the medium temperature of the liquid insulation medium sensed by the temperature sensing element, the ceramic heating assembly is started when the medium temperature is lower than a preset low temperature threshold until the medium temperature rises to or above the preset low temperature threshold. Therefore, the insulation performance of the liquid insulation medium can be prevented from being reduced, and the abnormal operation of the transmission ray source in an excessively low temperature environment can be avoided. Moreover, based on the same-cavity arrangement of the temperature sensing element, the ceramic heating assembly and the ray generating module and the inert material characteristics of the ceramic heating assembly, the timeliness of the medium temperature heating and recovery, the power consumption required for the heating and recovery and the medium quality of the liquid insulation medium can be considered, and the control precision of the heating and recovery can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of detection, in particular to a transmission ray source and a detection system based on transmission imaging. BACKGROUND

[0002] The detection system can use a transmission ray such as X-ray to perform transmission imaging on a to-be-detected object, so as to obtain internal structure information of the to-be-detected object, and thus a corresponding detection result can be obtained based on the internal structure information of the to-be-detected object. For example, in the field of security inspection, the to-be-detected object can be a package or a portable bag, and dangerous or harmful articles inside the package or the portable bag can be detected by transmission imaging. For another example, in the field of industrial detection, the to-be-detected object can be food or an industrial part, and foreign matter inside the food or a structural defect of the industrial part can be detected by transmission imaging.

[0003] Correspondingly, the detection system can be equipped with a transmission ray source, wherein the transmission ray source includes a ray generating module such as a ray tube, the ray generating module is arranged in a device cavity of the transmission ray source, and a liquid insulation medium such as insulation oil is filled in the device cavity to realize insulation isolation between the ray generating module and other devices.

[0004] However, if the ambient temperature of the detection system is too low, for example, the ambient temperature is lower than 10℃, the liquid insulation medium can be crystallized due to low temperature, which can cause the insulation performance to decrease. For example, the detection system applied in the field of security inspection can be deployed outdoors in high-latitude areas, and the outdoor temperature in winter in high-latitude areas can be very low. For another example, when the to-be-detected object detected by the detection system applied in the field of industrial detection belongs to temperature-sensitive articles, the ambient temperature of the detection system needs to be set to a low temperature.

[0005] No matter what causes the ambient temperature to be too low, the decrease of the insulation performance of the liquid insulation medium can cause the transmission ray generated by the ray generating module to break through the liquid insulation medium and cause a creeping phenomenon between the devices of the transmission ray source, which can at least affect the working performance of the transmission ray source, and at most cause the devices of the transmission ray source to be damaged, and further cause the transmission ray source to work abnormally. It can be seen that how to avoid the working abnormality of the transmission ray source in a too-low-temperature environment becomes a technical problem to be solved in the prior art. SUMMARY

[0006] In the embodiments of the present application, a transmission ray source and a detection system based on transmission imaging are provided, which can help to avoid the working abnormality of the transmission ray source in a too-low-temperature environment.

[0007] One embodiment of the present application provides a transmission ray source, comprising:

[0008] a ray generation module fixedly installed in a device cavity filled with a liquid insulation medium;

[0009] a temperature sensing element fixedly installed in the device cavity;

[0010] a ceramic heating assembly fixedly installed in the device cavity;

[0011] an external control module electrically connected with the temperature sensing element and the ceramic heating assembly outside the device cavity;

[0012] wherein the external control module is configured to:

[0013] obtain a medium temperature of the liquid insulation medium sensed by the temperature sensing element in the device cavity;

[0014] based on the medium temperature, control starting and stopping of the ceramic heating assembly, so that the ceramic heating assembly is started during a period when the medium temperature is lower than a preset low temperature threshold, and is stopped during a period when the medium temperature is equal to or higher than the preset low temperature threshold.

[0015] In some examples, optionally, the external control module is further configured to, based on the medium temperature, generate announcement information for characterizing an available state of the transmission ray source; wherein during a period when the medium temperature is lower than a preset low temperature threshold, the available state announcement information indicates that the transmission ray source is unavailable; and during a period when the medium temperature is equal to or higher than the preset low temperature threshold, the available state announcement information indicates that the transmission ray source is available.

[0016] In some examples, optionally, the ceramic heating assembly comprises a first heating member; wherein the first heating member is arranged adjacent to the ray generation module.

[0017] In some examples, optionally, the first heating member supports the ray generation module, so that the ray generation module is fixedly suspended in the device cavity.

[0018] In some examples, optionally, the first heating member has an arc-shaped support surface which is complementary in shape to an outer peripheral surface of the ray generation module, and the ray generation module is sandwiched in the arc-shaped support surface.

[0019] In some examples, optionally, further comprising: an internal drive control module fixedly installed in the device cavity; wherein the temperature sensing element is fixedly installed in the device cavity through physical connection with the internal drive control module.

[0020] In some examples, optionally, the built-in control module is configured to drive the ray generation module to operate at a first operating voltage; the temperature sensing element, the ceramic heating assembly, and the external control module are configured to operate at a second operating voltage lower than the first operating voltage.

[0021] In some examples, optionally, the ceramic heating assembly comprises a second heating member; and the second heating member is arranged adjacent to the built-in control module.

[0022] In some examples, optionally, the built-in control module comprises a circuit board; and the temperature sensing element is physically connected to the circuit board.

[0023] In some examples, optionally, the temperature sensing element is physically connected to a board edge of the circuit board close to the ray generation module.

[0024] Another embodiment of the present disclosure provides a detection system based on transmission imaging, comprising:

[0025] An object carrying mechanism configured to carry an object to be detected;

[0026] A transmission ray source as described in the foregoing embodiments, arranged at a designated position in a carrying path of the object to be detected;

[0027] A transmission imaging mechanism configured to image the object to be detected based on transmission rays generated by the ray generation module;

[0028] A processing assembly configured to determine a detection result of the object to be detected based on imaging information obtained by the transmission imaging mechanism.

[0029] Based on the foregoing embodiments, in a device cavity where the ray generation module and the liquid insulation medium are located, a temperature sensing element and a ceramic heating assembly can be arranged, and an external control module can control the ceramic heating assembly to start up when the medium temperature of the liquid insulation medium sensed by the temperature sensing element is lower than a preset low temperature threshold, until the medium temperature rises to equal to or higher than the preset low temperature threshold. Thus, by heating the liquid insulation medium, the insulation performance of the liquid insulation medium can be prevented from decreasing, thereby helping to avoid abnormal operation of the transmission ray source in an excessively low temperature environment. Moreover, based on the same-cavity deployment of the temperature sensing element and the ceramic heating assembly with the ray generation module, and the inert material characteristics of the ceramic heating assembly, the timeliness of heating and warming up the medium temperature, the power consumption required for heating and warming up, and the medium quality of the liquid insulation medium can be considered, and the control accuracy of heating and warming up can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] The following drawings are only illustrative and explanatory of the present application and do not limit the scope of the present application:

[0031] Figure 1 An exemplary structure diagram of a transmission ray source in one test example of the present application;

[0032] Figure 2 An exemplary structure diagram of a transmission ray source in one embodiment of the present application;

[0033] Figure 3 An encapsulation manner diagram of a first example structure of a transmission ray source as shown in Figure 2

[0034] An internal structure diagram of the first example structure as shown in Figure 4 Figure 3 An internal structure diagram of the second example structure as shown in

[0035] Figure 5 Figure 2 An encapsulation manner diagram of a second example structure of a transmission ray source as shown in

[0036] Figure 6 An internal structure diagram of the second example structure as shown in Figure 5

[0037] Explanation of reference signs

[0038] 10 ray generating module

[0039] 20 temperature sensing element

[0040] 30 ceramic heating assembly

[0041] 31, 31' first heating member

[0042] 311 heating support plate

[0043] 312 support frame

[0044] 313 insulating screw

[0045] 32, 32' second heating member

[0046] 40 external control module

[0047] 50 internal drive control module

[0048] 500 circuit board

[0049] 60 encapsulation module

[0050] 600 device cavity

[0051] 61 metal shell ​​​

[0052] 62 Flow guiding components

[0053] 621 pump

[0054] 622 drive control module

[0055] 63 Metal base plate

[0056] 70' Insulating Liner

[0057] 71 Shielding uprights

[0058] 72 Horizontal support plate

[0059] 73 Insulating Posts

[0060] 75 Horizontal support plate

[0061] 76 Side-standing flange

[0062] 80 Cooling Module

[0063] 800 cooling chamber

[0064] 81 External casing

[0065] 82 Heat dissipation components

[0066] 90 Metal heating components Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided with reference to the accompanying drawings and embodiments.

[0068] In the embodiments of this application, temperature detection and heating / reheating of the liquid insulating medium are implemented to prevent a decrease in its insulation performance, thereby helping to avoid malfunctions of the transmission radiation source in excessively low temperature environments. Accordingly, appropriate components need to be deployed to detect the temperature of the liquid insulating medium and to heat it; therefore, how to deploy these components becomes a problem that needs further consideration.

[0069] Figure 1 This is an exemplary structural diagram of a transmitted radiation source in a test example of this application. Please refer to [link / reference]. Figure 1In this test example, the transmission ray source can include a ray generating module 10 which can be fixedly installed in the device cavity 600 filled with the liquid insulation medium; and since the ray generating module 10 will generate heat in the working state of generating transmission rays, in this test example, a cooling cavity 800 which communicates with the device cavity 600 is also arranged, and in this test example, a temperature sensing element 20 (for example, a temperature sensor) and a metal heating assembly 90 (for example, a metal heating wire) are arranged in the cooling cavity 800, so that:

[0070] During the period when the detection system is in an excessively high ambient temperature, the temperature sensing element 20 in the cooling cavity 800 can sense that the liquid insulation medium in the cooling cavity 800 is higher than the target temperature range, and the heat dissipation member 82 (for example, a heat dissipation fan) arranged adjacent to the cooling cavity 800 can be started to operate, and the cooling cavity 800 and the liquid insulation medium in the device cavity 600 flow exchange to cool the liquid insulation medium in the device cavity 600, at this time, the metal heating assembly 90 is not started;

[0071] During the period when the detection system is in an excessively low ambient temperature, the temperature sensing element 20 can sense that the liquid insulation medium in the cooling cavity 800 is lower than the target temperature range, the metal heating assembly 90 in the cooling cavity 800 can be started to operate, and the cooling cavity 800 and the liquid insulation medium in the device cavity 600 flow exchange to warm up the liquid insulation medium in the device cavity 600, at this time, the heat dissipation member 82 is not started;

[0072] When the ambient temperature of the detection system is appropriate, the temperature sensing element 20 can sense that the liquid insulation medium in the cooling cavity 800 is in the target temperature range, so the metal heating assembly 90 and the heat dissipation member 82 are not started.

[0073] As can be seen from the above, this test example can take into account the cooling of the liquid insulation medium under excessively high ambient temperature and the heating of the liquid insulation medium under excessively low ambient temperature.

[0074] However, it is found through tests that:

[0075] 1. Since the metal heating assembly 90 in the test example is arranged in the cooling cavity 800, and the warming up of the liquid insulation medium is slow, for example, if the liquid insulation medium selects insulation oil, the thermal conductivity coefficient is only 0.144 W / mK, and the heating of the liquid insulation medium in the device cavity 600 relies on the flow exchange from the cooling cavity 800 to the device cavity 600, thereby causing the heating of the liquid insulation medium in the device cavity 600 to have “hysteresis”.

[0076] 2. Since there is heat loss in the flow exchange process from the cooling chamber 800 to the device chamber 600 in the test example, the heating and rewarming of the liquid insulation medium in the device chamber 600 has a high "heat loss". The existence of the "heat loss" further amplifies the adverse effects of "hysteresis".

[0077] 3. If the power of the metal heating assembly 90 is increased to weaken the adverse effects of "hysteresis", the liquid insulation medium in the area adjacent to the metal heating assembly 90 is prone to medium carbonization. For example, if the liquid insulation medium is insulation oil, the critical temperature (which can be referred to as "flash point") of medium carbonization is 135°C. In this case, if the temperature of the metal heating assembly 90 reaches or exceeds 135°C, the insulation oil will be carbonized. That is, if the effects of "hysteresis" are to be weakened, the quality of the liquid insulation medium must be sacrificed.

[0078] 4. Since the temperature sensing element 20 in the test example is arranged in the cooling chamber 800, and the medium temperatures in the cooling chamber 800 and the device chamber 600 can be different, for example, the heat preservation performance of the device chamber 600 is usually better than that of the cooling chamber 800. Therefore, the influence of ambient temperature on the liquid insulation medium in the cooling chamber 800 is more sensitive than that in the device chamber 600. When the medium temperature in the cooling chamber 800 is too low due to the detection system being in an excessively low temperature environment, the medium temperature in the device chamber 600 can not have fallen below the target temperature range. If the metal heating assembly 90 is started immediately when the medium temperature in the cooling chamber 800 is below the target temperature range, and the flow exchange of the liquid insulation medium in the cooling chamber 800 and the device chamber 600 is started, it is a false start of the heating and rewarming. Moreover, due to the slow heating of the liquid insulation medium, the medium temperature in the cooling chamber 800 can still be lower than that in the device chamber 600 after rewarming in the early stage of the flow exchange. At this time, the low-temperature liquid insulation medium in the cooling chamber 800 flows into the device chamber 600, which not only cannot heat and rewarm the liquid insulation medium in the device chamber 600, but also causes a "cooling effect" of reducing the medium temperature in the device chamber 600. Moreover, since the medium temperatures in the cooling chamber 800 and the device chamber 600 can be different, and the heating and rewarming of the medium temperature in the device chamber 600 has the "hysteresis" mentioned above, when the temperature sensing element 20 senses that the liquid insulation medium in the cooling chamber 800 is rewarming to the target temperature range, the medium temperature in the device chamber 600 can not have been rewarming to the target temperature range. If the metal heating assembly 90 is turned off at this time, the effective heating and rewarming of the liquid insulation medium under an excessively low temperature environment cannot be achieved.

[0079] That is, for the test example as shown in FIG. 1, the temperature sensing element 20 is arranged in the cooling chamber 800, and the medium temperature in the cooling chamber 800 is prone to being lower than that in the device chamber 600. Therefore, the temperature sensing element 20 cannot accurately reflect the medium temperature in the device chamber 600, and the heating and rewarming of the liquid insulation medium in the device chamber 600 cannot be accurately controlled. Figure 1The test example shown cannot balance the time effectiveness of heating and returning the temperature of the medium in the device cavity 600, the power consumption required for heating and returning the temperature, and the medium quality of the liquid insulation medium, and the control accuracy of the heating and returning is poor.

[0080] Based on the analysis result of the test example, in the embodiment of the present application, the deployment position of the temperature sensing element and the metal heating assembly is arranged in the device cavity 600, that is, the temperature sensing element and the metal heating assembly are deployed in the same cavity as the ray generating module 10 in the device cavity 600.

[0081] Moreover, since there is a need for insulation isolation for the ray generating module 10 in the device cavity 600, for the scheme that the metal heating assembly is deployed in the same cavity as the ray generating module 10 in the device cavity 600, the ceramic heating assembly is selected in the embodiment of the present application to replace the metal heating assembly 90 selected in the test example.

[0082] Figure 2 An exemplary schematic diagram of the structure of the transmission ray source in one embodiment of the present application. Please refer to Figure 2 In the embodiment of the present application, the transmission ray source can include:

[0083] The ray generating module 10 is fixedly installed in the device cavity 600 filled with a liquid insulation medium (such as insulation oil), that is, the ray generating module 10 is surrounded by the liquid insulation medium in the device cavity 600;

[0084] The temperature sensing element 20 is fixedly installed in the device cavity 600 where the ray generating module 10 is located, that is, the temperature sensing element 20 is in physical contact with the liquid insulation medium in the device cavity 600;

[0085] The ceramic heating assembly 30 is fixedly installed in the device cavity 600 where the ray generating module 10 is located, that is, the ceramic heating assembly 30 is in physical contact with the liquid insulation medium in the device cavity 600;

[0086] The external control module 40 is electrically connected with the temperature sensing element 20 and the ceramic heating assembly 30 outside the device cavity 600 where the ray generating module 10 is located. It can be understood that the signal wiring required for the electrical connection between the external control module 40 and the temperature sensing element 20 and the ceramic heating assembly 30 does not affect the sealing of the device cavity, and the electrical connection between the external control module 40 and the temperature sensing element 20 and the ceramic heating assembly 30 can include data transmission and power supply;

[0087] The external control module 40 is configured to:

[0088] acquire a medium temperature of the liquid insulation medium sensed by the temperature sensing element 20 in the device cavity 600 where the ray generating module 10 is located;

[0089] based on the medium temperature in the device cavity 600 where the ray generating module 10 is located, control the start and stop of the ceramic heating assembly 30 in the device cavity 600 where the ray generating module 10 is located, so that:

[0090] the ceramic heating assembly 30 is started during the period when the medium temperature in the device cavity 600 where the ray generating module 10 is located is lower than a preset low temperature threshold, and

[0091] the ceramic heating assembly 30 is stopped during the period when the medium temperature in the device cavity 600 where the ray generating module 10 is located is equal to or higher than the preset low temperature threshold.

[0092] wherein the preset low temperature threshold can correspond to the lower limit of the target temperature range mentioned in the foregoing test example, and the preset low temperature threshold can be set according to the critical temperature (for example, -10℃) corresponding to the insulation performance of the liquid insulation medium. For example, the preset low temperature threshold can be the critical temperature corresponding to the insulation performance of the liquid insulation medium. For another example, the preset low temperature threshold can also be higher than the critical temperature corresponding to the insulation performance of the liquid insulation medium, and the difference between the preset low temperature threshold and the critical temperature can be determined according to the rewarming speed of the ceramic heating assembly 30 to the liquid insulation medium, so that the medium temperature in the device cavity 600 where the ray generating module 10 is located starts to be heated and rewarming when it is close to the critical temperature, thereby avoiding the medium temperature in the device cavity 600 where the ray generating module 10 is located from being lower than the critical temperature. In addition, the perceptible temperature range of the temperature sensing element 20 can be selected within the temperature interval of -45-155℃.

[0093] Based on the above embodiment, in the device cavity 600 where the ray generating module 10 and the liquid insulation medium are located, the temperature sensing element 20 and the ceramic heating assembly 30 can be arranged, and based on the medium temperature of the liquid insulation medium sensed by the temperature sensing element 20, the external control module 50 can control the ceramic heating assembly 30 to be started during the period when the medium temperature in the device cavity 600 where the ray generating module 10 is located is lower than the preset low temperature threshold, until the medium temperature in the device cavity 600 where the ray generating module 10 is located is raised to equal to or higher than the preset low temperature threshold, so that through the heating and rewarming of the liquid insulation medium, the insulation performance of the liquid insulation medium is prevented from being reduced, thereby helping to avoid the abnormal work of the transmission ray source in an excessively low temperature environment.

[0094] Moreover, compared with the test example shown in Figure 1 , in the embodiment shown in Figure 2 , the ceramic heating assembly 30 is started during the period when the medium temperature in the device cavity 600 where the ray generating module 10 is located is lower than the preset low temperature threshold, and

[0095] 1. The ceramic heating component 30 is arranged inside the device cavity 600 where the X-ray generating module 10 is located. Therefore, even if the temperature rise of the liquid insulating medium is slow, the "in-cavity heating" method can minimize the "hysteresis" of heating and temperature recovery.

[0096] 2. The ceramic heating component 30 is arranged in the device cavity 600 where the radiation generating module 10 is located. Therefore, the heating and warming process does not depend on the flow and exchange of liquid insulating medium, thus minimizing the "heat loss".

[0097] 3. Since the "hysteresis" of heating and reheating is minimized, the power of the ceramic heating element 30 does not need to be excessively increased. That is, the ceramic heating element 30 can use a lower power than the metal heating element 90 in the test example. Moreover, even if the power of the ceramic heating element 30 is increased to further improve the heating and reheating speed and cause the temperature of the ceramic heating element 30 to reach the critical temperature for carbonization of the liquid insulating medium, since the material of the ceramic heating element 30 is an inert material, it is difficult for the ceramic heating element 30 at high temperature to undergo a chemical reaction with the liquid insulating medium that would cause it to carbonize. In other words, the power cost of the ceramic heating element 30 under the same heating and reheating requirements can be lower, and even if the power is increased, the quality of the liquid insulating medium will not be damaged.

[0098] 4. The temperature sensing element 20 is arranged inside the device cavity 600 where the X-ray generating module 10 is located. Therefore, the medium temperature sensed by the temperature sensing element 20 is the "cavity temperature" of the X-ray generating module 10. As a result, better heating and reheating control accuracy can be achieved than in the test case.

[0099] That is, this application is as follows Figure 2 The illustrated embodiment can balance the timeliness of heating and reheating of the medium temperature, the power consumption required for heating and reheating, and the medium quality of the liquid insulating medium, and can improve the control accuracy of heating and reheating. Moreover, since the ceramic heating component 30 is made of an inert material, the ceramic heating component 30 deployed in the same cavity as the ray generating module 10 will not cause unnecessary discharge in the device cavity 600.

[0100] In addition, in the embodiments of this application, the external control module 40 can be further configured as follows:

[0101] Based on the medium temperature inside the device cavity 600 where the X-ray generating module 10 is located, availability status notification information is generated to characterize whether the transmitted X-ray source is available.

[0102] During the period when the medium temperature in the device cavity 600 where the radiation generation module 10 is located is lower than a preset low temperature threshold, the availability status notification information generated by the external control module 40 indicates that the transmitted radiation source is unavailable.

[0103] And, during the period when the medium temperature in the device cavity 600 where the ray generating module 10 is located is equal to or higher than the preset low temperature threshold, the available state notification information generated by the external control module 40 indicates that the transmission ray source is available.

[0104] For example, the available state notification information generated by the external control module 40 can be sent to a terminal device such as a mobile terminal or a desktop computer through a communication module of the transmission ray source or an external communication module, to prompt the user to start the ray generating module 10 only when the medium temperature of the liquid insulation medium in the device cavity 600 is higher than the preset low temperature threshold, so as to avoid the liquid insulation medium being broken down by the transmission ray generated by the ray generating module 10 when the medium temperature is too low (i.e. the insulation performance is insufficient), thereby avoiding the working abnormality of the transmission ray source in the too low temperature environment.

[0105] In order to better understand the internal deployment mode of the transmission ray source, the following will be illustrated by an example structure.

[0106] Figure 3 The packaging mode schematic diagram of the first example structure of the transmission ray source is shown in Figure 2 The internal structure schematic diagram of the first example structure is shown in Figure 4 The internal structure schematic diagram of the first example structure is shown in Figure 3 Please refer to

[0107] In the first example structure of the transmission ray source, the transmission ray source can include a packaging module 60, which can form the aforementioned device cavity 600. In order to clearly show the internal structure of the transmission ray source, the packaging module 60 is shown in Figure 3 with a perspective effect. Specifically, the packaging module 60 can include a metal shell 61, and the shell cavity of the metal shell 61 can be configured as the device cavity 600. The shell cavity of the metal shell 61 configured as the device cavity 600 can be covered by a metal cover plate not shown in Figure 3 The material of the metal shell 61 and the metal cover plate can include lead. Figure 3

[0108] And, still referring to Figure 3 The packaging module 60 (for example, the metal shell 61) can also have a flow guide assembly 62 for injecting liquid insulation medium into the device cavity 600 or discharging liquid insulation medium from the device cavity 600. For example, the flow guide assembly 62 can include a pump 621 connected to the device cavity 600, and a driving module 622 electrically connected to the pump 621, so that the liquid insulation medium in the device cavity 600 is replaceable.

[0109] In addition, please continue to refer to Figure 3 ​The outer side of the packaging module 60 (for example, the metal shell 61) is also circumscribed by a cooling module 80. In order to clearly show the docking position relationship between the cooling module 80 and the packaging module 60 (for example, the metal shell 61), the cooling module 80 is shown in a perspective effect in the following. Figure 3

[0110] Specifically, the cooling module 80 can include an external shell 81 forming the aforementioned cooling cavity 800, and a heat dissipation member 82 arranged outside the external shell 81, so that when the liquid insulation medium in the device cavity 600 needs to be cooled, the liquid insulation medium can be cooled by the heat dissipation member 82 and the external heat exchange based on the flow exchange of the liquid insulation medium between the device cavity 600 and the cooling cavity 800 in the manner mentioned in the foregoing test example.

[0111] That is, in the embodiment of the present application, the heating and rewarming of the liquid insulation medium adopts the cavity detection and heating mode, and the cooling of the liquid insulation medium is realized by the additional cooling circuit based on the cooling cavity 800, so that the heating and cooling of the liquid insulation medium are independent of each other:

[0112] For application scenarios that only have heating and rewarming requirements, the cooling module 80 circumscribed by the packaging module 60 (for example, the metal shell 61) can be removed to save equipment costs.

[0113] For application scenarios that have both heating and rewarming requirements and cooling requirements, the cooling module 80 circumscribed by the packaging module 60 (for example, the metal shell 61) can be retained to support the compatibility and adaptation ability of the transmission ray source to different application scenarios.

[0114] Moreover, since the temperature sensing element 20 is arranged in the device cavity 600 where the ray generating module 10 is located, when the liquid insulation medium is cooled, the control precision can also be improved compared to the test example mentioned above.

[0115] Please refer to Figure 4 In the first example structure, the transmission ray source can also include a built-in driving control module 50, which can be used to drive the ray generating module 10 to operate at a first working voltage (for example, 220v), and the temperature sensing element 20, the ceramic heating assembly 30 and the external driving control module 40 can all operate at a second working voltage lower than the first working voltage. Therefore, the built-in driving control module 50 can be referred to as a high-voltage driving control module, and the external driving control module 40 can be referred to as a low-voltage driving control module.

[0116] ​The built-in drive control module 50 can be fixedly installed in the device cavity 600, and in order to avoid high-voltage discharge of the built-in drive control module 50, the built-in drive control module 50 can be fixedly installed inside the packaging module 60 (for example, the metal shell 61) through the insulating lining 70. For example, the insulating lining 70 can include a shielding vertical plate 71 and a horizontal support plate 72 connected to each other, the shielding vertical plate 71 can be attached to the inner side wall of the metal shell 61 (that is, the side cavity wall of the device cavity 600), the horizontal support plate 72 can intersect the shielding vertical plate 71, and the built-in drive control module 50 is fixed above the horizontal support plate 72 (for example, is fixedly suspended and supported above the horizontal support plate 72 by an insulating member such as an insulating vertical column 73).

[0117] In this case, the built-in drive control module 50 can be selected as the installation carrier of the temperature sensing element 20 in the embodiments of the present application, that is, the temperature sensing element 20 can be fixedly installed in the device cavity 600 through physical connection with the built-in drive control module 50. For example, the built-in drive control module 50 can include a circuit board 500, and the temperature sensing element 20 can be physically connected to the circuit board 500 of the built-in drive control module 50, and preferably, the temperature sensing element 20 can be physically connected to the edge of the circuit board 500 close to the ray generating module 10.

[0118] For the ceramic heating assembly 30, its deployment position can be selected close to the ray generating module 10 and / or close to the built-in drive control module 50, so as to improve the timeliness of the heating recovery of the liquid insulation medium near the ray generating module 10 and / or the built-in drive control module 50.

[0119] As described above, since the material of the ceramic heating assembly 30 is an inert material, in addition to being not easy to chemically react with the liquid insulation medium at high temperature, its high voltage insulation strength (for example, greater than 5KV / mm) also ensures that it has an insulation effect of preventing the device discharge phenomenon in the device cavity 600.

[0120] Specifically, in the first example structure, the ceramic heating assembly 30 can include a first heating member 31, which can be arranged adjacent to the ray generating module 10 to avoid low-temperature crystallization of the liquid insulation medium in the area adjacent to the ray generating module 10, breakdown of the liquid insulation medium by the transmitted rays generated by the ray generating module 10, and influence on other devices in the device cavity 600. For example, the first heating member 31 can be fixed to the bottom surface of the device cavity 600, and the first heating member 31 can support the ray generating module 10 so that the ray generating module 10 is fixedly suspended in the device cavity 600. For the case where the ray generating module 10 includes a glass ray tube, the first heating member 31 and the glass ray tube can not be in direct physical contact, for example, separated by other medium materials, to avoid deformation and embrittlement, or even damage, of the glass ray tube due to overheating.

[0121] From Figure 3 and Figure 4 it can be seen that the first heating member 31 can include a heating base plate 311 and a support frame 312, wherein:

[0122] The support frame 312 can be supported below the heating base plate 311, and the support frame 312 can be fixed to the bottom surface of the metal shell 61 by an insulating screw 313 or other insulating member;

[0123] The ray generating module 10 can be held on the heating base plate 311. As a preferred design, the heating base plate 311 can be in the shape of a curved grid, and the heating base plate 311 can enclose the lower arc-shaped peripheral surface of the ray generating module 10, i.e., the first heating member 31 can have an arc-shaped support surface provided by the curved heating base plate 311, which can be complementary to the shape of the outer peripheral surface of the ray generating module 10, and the ray generating module 10 can be enclosed in the arc-shaped support surface of the first heating member 31.

[0124] Moreover, in the first example structure, the ceramic heating assembly 30 can further include a second heating member 32, which can be arranged adjacent to the built-in control module 50 to prevent the devices of the built-in control module 50 from suffering from low-temperature parameter loss, resulting in problems such as failure to work or performance degradation. In Figure 3 and 4In the first instance structure, the first surface of the circuit board 500 (i.e. the surface of the circuit board 500 facing the bottom surface of the metal shell 61) can be configured to house the components of the drive module 50 and the temperature sensing element 20, and the second surface of the circuit board 500 (i.e. the surface of the circuit board 500 facing away from the bottom surface of the metal shell 61) can be configured as a bare surface. The second heating member 32 can be configured to cover the second surface of the circuit board 500 configured as a bare surface. As a preferred design, the second heating member 32 can be configured as a flat grid and supported by an insulating member to be spaced apart from the second surface of the circuit board 500.

[0125] That is, in the first instance structure, the first heating member 31 can be configured to wrap around the radiation generation module 10 for heating, and the second heating member 32 can be configured to be adjacent to the drive module 50 for heating. In this way, the liquid insulating medium in the device cavity 600 can be uniformly heated in the key area where various devices are arranged.

[0126] Figure 5 As shown in FIG. 6, the second instance structure of the transmission radiation source is shown in a perspective view. Figure 2 As shown in FIG. 7, the second instance structure of the transmission radiation source is shown in a perspective view. Figure 6 As shown in FIG. 8, the internal structure of the second instance structure is shown in a perspective view. Figure 5 As shown in FIG. 8, the internal structure of the second instance structure is shown in a perspective view.

[0127] In the second instance structure, the packaging module can include a metal shell not shown in Figure 5 . The shell cavity of the metal shell can be configured as the device cavity 600. Please refer to Figure 5 , the packaging module in the second instance structure can further include a metal bottom plate 63 for covering the device cavity 600. The material of the metal shell and the metal bottom plate 63 can include lead. In combination with the first instance structure and the second instance structure, it can be known that the form of the packaging module for forming the device cavity 600 can not be limited in the embodiments of the present application.

[0128] Please continue to refer to Figure 5 , although the form of the packaging module in the second instance structure is different from that of the first instance structure, the first heating member 31' can still be arranged adjacent to the radiation generation module 10. As a further optimization, the first heating member 31' can also support the radiation generation module 10. In this case, the first heating member 31' in the second instance structure can be fixed to the metal cover plate 63. In combination with the first instance structure and the second instance structure, it can be known that the adjacent arrangement of the ceramic heating assembly 30 and the radiation generation module 10 can not be limited by the form of the packaging module.

[0129] Please refer to Figure 5 and Figure 6, the first heating member 31' in the second example structure can still support the ray generating module 10, and can further have an arc-shaped support surface clamping the ray generating module 10, but different from the first example structure, the first heating member 31' in the second example structure can be in the form of a concave block, and the arc-shaped support surface is formed in the side surface facing away from the metal base plate 63. In combination with the first example structure and the second example structure, it can be known that the first heating member 31 or 31' supports the ray generating module 10 and further forms a clamping form, which can not be limited to one.

[0130] Moreover, in the second example structure, the ceramic heating assembly 30 can still include a second heating member 32', and the second heating member 32' can still be arranged adjacent to the built-in control module 50. Different from the first example structure, the second heating member 32' in the second example structure can cover the built-in control module 50 and the ray generating module 10 (i.e. the part of the ray generating module 10 not clamped by the first heating member 31') at the same time. That is, the coverage of the second heating member 32' to the built-in control module 50 is not limited to the case that the second heating member 32' only covers the built-in control module 50. Moreover, it can be known from Figure 5 and Figure 6 that the second heating member 32' can also not be formed in the form of a flat grid as in the first example structure, but can also be in the form of a plate.

[0131] It can also be known from Figure 5 and Figure 6 that the first surface of the circuit board 500 of the built-in control module 50 on which the components and the temperature sensing element 20 are disposed faces away from the metal base plate 63, the second surface of the circuit board 500 configured as a bare board surface faces away from the metal base plate 63, and the second heating member 32' can cover the first surface of the circuit board 500. That is, the coverage of the second heating member 32' to the built-in control module 50 can allow the surfaces of the circuit board 500 of the built-in control module 50 to be arranged in different orientations.

[0132] The built-in control module 50 can be held in the insulating lining 70', which can be fixedly suspended and supported above the metal base plate 63 by the insulating member, and the form of the insulating lining 70' in the second example structure can be different from that in the first example structure. For example, the insulating lining 70' in the second example structure can only include a horizontal holding plate 75 holding the built-in control module 50, and a side standing edge 76 fixed to the edge of the horizontal holding plate 75 and surrounding the side of the built-in control module 50, and the horizontal holding plate 75 can be suspended and supported above the metal base plate 63 by the insulating member. In combination with the first example structure and the second example structure, it can be known that the fixing and installation of the built-in control module 50 in the device cavity 600 can adapt to different forms of the insulating lining 70 or 70'.

[0133] The second heating member 32' can be fixed on the top surface of the metal shell to achieve separation from the built-in control module 50 and the ray generating module 10. That is, in the embodiment of the present application, the fixing manner of the built-in control module 50 in the packaging module and the spacing arrangement manner of the second heating member 32 or 32' and the built-in control module 50 are not limited.

[0134] Although the flow guide assembly 62 in the first example structure is not shown in the second example structure, it can be understood that the liquid insulation medium in the device cavity 600 in the second example structure can also be replaced, and the second example structure also does not exclude the docking with the cooling module 80 in the first example structure.

[0135] In addition, the insulation members such as the insulation column 73 or the insulation screw 313 mentioned in the first example structure and the second example structure can be made of a plastic material with relatively high voltage insulation strength, and the heat-resistant temperature of the plastic material needs to be not lower than the maximum heating temperature of the ceramic heating assembly 30.

[0136] In another embodiment of the present application, a transmission imaging based detection system is also provided, which comprises:

[0137] An object carrying mechanism for conveying a to-be-detected object;

[0138] The transmission ray source in the foregoing embodiment is arranged at a specified position in a conveying path of the to-be-detected object conveyed by the object carrying mechanism;

[0139] A transmission imaging mechanism for imaging the to-be-detected object based on the transmission ray generated by the ray generating module 10;

[0140] A processing assembly for determining a detection result of the to-be-detected object based on the imaging information obtained by the transmission imaging mechanism.

[0141] The external control module 40 of the transmission ray source in the foregoing embodiment can also be in communication connection with the processing assembly in the detection system, and the processing assembly forwards the available state notification information generated by the external control module 40 to a terminal device through the communication module of the detection system.

[0142] The above only describes the preferred embodiments of the present application and should not be used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A transmission radiation source, characterized in that, include: A radiation generating module (10) is fixedly installed in a device cavity (600) filled with a liquid insulating medium; An internal drive control module (50) is fixedly installed in the device cavity (600), and the internal drive control module (50) is used to drive the ray generating module (10) to operate at a first operating voltage. Temperature sensing element (20), the temperature sensing element (20) is fixedly installed in the device cavity (600) by physical connection with the built-in drive control module (50); A ceramic heating assembly (30) is fixedly installed in the device cavity (600). The ceramic heating assembly (30) includes a first heating member, and the first heating member supports the ray generating module (10) so that the ray generating module (10) is fixedly suspended in the device cavity (600). An external control module (40) is electrically connected to the temperature sensing element (20) and the ceramic heating assembly (30) outside the device cavity (600); The external control module (40) is configured as follows: The temperature of the liquid insulating medium sensed by the temperature sensing element (20) within the device cavity (600) is obtained. Based on the medium temperature, the ceramic heating component (30) is controlled to start and stop, such that the ceramic heating component (30) is started during the period when the medium temperature is below a preset low temperature threshold and is stopped during the period when the medium temperature is equal to or above the preset low temperature threshold.

2. The transmission radiation source according to claim 1, characterized in that, The external control module (40) is also configured to: Based on the medium temperature, availability status notification information is generated to characterize whether the transmitted radiation source is available. Specifically, during the period when the medium temperature is below a preset low temperature threshold, the availability status notification information indicates that the transmitted radiation source is unavailable; and during the period when the medium temperature is equal to or higher than the preset low temperature threshold, the availability status notification information indicates that the transmitted radiation source is available.

3. The transmission radiation source according to claim 1, characterized in that, The first heating component has an arc-shaped support surface, which is complementary to the shape of the outer peripheral surface of the ray generating module (10), and the ray generating module (10) is enclosed in the arc-shaped support surface.

4. The transmission radiation source according to claim 1, characterized in that, The temperature sensing element (20), the ceramic heating assembly (30), and the external drive control module (40) all operate at a second operating voltage lower than the first operating voltage.

5. The transmission radiation source according to claim 1, characterized in that, The ceramic heating assembly (30) further includes a second heating element; The second heating component is arranged adjacent to the built-in drive control module (50).

6. The transmission radiation source according to claim 1, characterized in that, The built-in drive control module (50) includes a circuit board (500); The temperature sensing element (20) is physically connected to the circuit board (500).

7. The transmission radiation source according to claim 6, characterized in that, The temperature sensing element (20) is physically connected to the edge of the circuit board (500) near the ray generating module (10).

8. A detection system based on transmission imaging, characterized in that, The detection system includes: An object carrier mechanism is used to transfer the object to be inspected. The transmitted X-ray source as described in any one of claims 1 to 7 is arranged at a designated position in the transmission path of the object to be inspected; A transmission imaging mechanism for imaging the object under inspection based on the transmission rays generated by the ray generating module (10); A processing component is used to determine the detection result of the object to be inspected based on the imaging information obtained by the transmission imaging mechanism.

Images