Connector for electrical connection

Abstract

A connector for electrical connection is provided between a detection device and a device to be detected. The connector includes a signal conductive portion, a ground conductive portion, and a metal frame portion. The signal conductive portion includes a transmission portion and an insulating portion. The transmission portion is composed of a plurality of first conductive particles that can conductively contact in a vertical direction. The insulating portion is formed integrally with the transmission portion so as to surround the transmission portion in a horizontal direction perpendicular to the vertical direction, and a thickness of the insulating portion in the horizontal direction is greater than a maximum width of the transmission portion in the horizontal direction. The ground conductive portion is separated from the signal conductive portion in the horizontal direction. The metal frame portion separates the signal conductive portion and the ground conductive portion in the vertical direction and the horizontal direction, and electrically connects the ground conductive portion.

Description

TECHNICAL FIELD

[0001] The present application relates to a connector for electrically connecting a detection device to a device under test. BACKGROUND

[0002] In order to detect the operating characteristics of a device under test, a connector for electrically connecting the device under test to a detection device is used in the art. Known connectors are pogo pin sheets and conductive rubber sheets. The conductive rubber sheet has a plurality of conductive portions in which a plurality of metal particles are respectively aggregated in a vertical direction, and a frame that maintains the plurality of conductive portions and is composed of silicone rubber.

[0003] The radio frequency (RF) characteristics of a semiconductor device used in a mobile communication device should be detected. The conductive rubber sheet has better RF characteristics than the pogo pin sheet due to its thin thickness, and thus the conductive rubber sheet is used for RF detection of the semiconductor device. For example, Japanese Laid-Open Patent Publication No. 2004-335450 proposes a conductive connector that can cope with high frequency signals. SUMMARY

[0004] PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] The existing conductive rubber sheet has a limitation that noise of high frequency RF cannot be sufficiently suppressed, and signal loss is large. Therefore, the existing conductive rubber sheet cannot be effectively used for RF detection of high frequencies of 40 GHz or more. In addition, the existing conductive rubber sheet does not have an impedance that matches the impedance of the device under test and the impedance of the detection device. When the conductive rubber sheet used for detection has an impedance that does not match the impedance of the device under test and the detection device, a large signal loss occurs in the conductive rubber sheet due to signal reflection. Since the existing conductive rubber sheet has a mismatched impedance, it inevitably has poor RF characteristics.

[0006] One embodiment of the present application provides a connector for electrical connection that has no signal interference or noise and is suitable for RF detection of high frequencies. One embodiment of the present application provides a connector for electrical connection that has an impedance that matches the impedance of the device under test and the impedance of the detection device, and does not cause signal loss due to impedance mismatch.

[0007] TECHNICAL SOLUTION TO THE PROBLEM

[0008] Embodiments of the present invention relate to a connector provided between a detection device and a device under test to electrically connect the detection device and the device under test. The connector according to an embodiment includes at least one signal conductive portion, at least one ground conductive portion, and a metal frame portion. The signal conductive portion includes a transmission portion and an insulating portion. The transmission portion is composed of a plurality of first conductive particles that are in conductive contact in a vertical direction. The insulating portion is formed integrally with the transmission portion such that the insulating portion surrounds the transmission portion in a horizontal direction perpendicular to the vertical direction, and a thickness of the insulating portion in the horizontal direction is greater than a maximum width of the transmission portion in the horizontal direction. The ground conductive portion is provided apart from the signal conductive portion in the horizontal direction. The metal frame portion maintains the signal conductive portion and the ground conductive portion in the vertical direction, separates the signal conductive portion and the ground conductive portion in the horizontal direction, and is electrically connected to the ground conductive portion.

[0009] In an embodiment, the ground conductive portion includes an upper ground conductive portion and a lower ground conductive portion that are separated in the vertical direction by the metal frame portion.

[0010] In an embodiment, the metal frame portion has a first groove and a second groove that are separated in the vertical direction. The first groove is recessed from an upper surface of the metal frame portion, and the second groove is recessed from a lower surface of the metal frame portion. The upper ground conductive portion is formed in the first groove, and the lower ground conductive portion is formed in the second groove.

[0011] In an embodiment, the upper ground conductive portion and the lower ground conductive portion include a plurality of second conductive particles that are in conductive contact in the vertical direction, and an elastic substance that maintains the plurality of second conductive particles in the vertical direction. An upper end portion of the upper ground conductive portion can protrude from the upper surface of the metal frame portion, and a lower end portion of the lower ground conductive portion can protrude from the lower surface of the metal frame portion.

[0012] In an embodiment, the signal conductive portion has an inner diameter corresponding to the maximum width of the transmission portion in the horizontal direction, and an outer diameter corresponding to a width between both ends of the insulating portion in the horizontal direction and being 3 to 5 times the inner diameter.

[0013] In an embodiment, an upper end portion of the signal conductive portion protrudes from the upper surface of the metal frame portion, and a lower end portion of the signal conductive portion protrudes from the lower surface of the metal frame portion.

[0014] In an embodiment, the signal conductive portion is formed in a through-hole that penetrates through the metal frame portion in the vertical direction. The metal frame portion includes an insulating oxide film formed across an entire area of a wall surface of the through-hole between the wall surface of the through-hole and the insulating portion to prevent short-circuiting between the signal conductive portion and the ground conductive portion.

[0015] In an embodiment, the elastic insulating substance of the insulating portion can include silicone rubber or Teflon.

[0016] In one embodiment, the insulating portion has a plurality of air holes formed due to a lack of an elastic insulating substance.

[0017] In one embodiment, the connector further includes an insulating member formed with a plurality of through holes corresponding to the at least one signal conductive portion and the at least one ground conductive portion, and attached to the metal frame portion.

[0018] In one embodiment, the transmission portion further includes a conductive pin disposed in a vertical direction between the first conductive particle at the upper end portion of the signal conductive portion and the first conductive particle at the lower end portion of the signal conductive portion. The length of the conductive pin in the vertical direction can be greater than the thickness of the metal frame portion in the vertical direction.

[0019] Effects of the Invention

[0020] According to one embodiment of the present invention, the signal conductive portion includes a transmission portion and an insulating portion surrounding the transmission portion and formed integrally with the transmission portion. The signal conductive portion is insulated from the ground conductive portion and the metal frame portion, which are electrically connected to each other. Thus, signal interference or noise in the ground conductive portion and the metal frame portion is significantly reduced, whereby the signal conductive portion is not affected by the signal interference or noise. In addition, according to one embodiment of the present invention, the transmission portion and the insulating portion are disposed in the signal conductive portion in a certain range of proportions to achieve an impedance that matches the impedance of the device under test and the impedance of the detection apparatus. Thus, the connector in this embodiment does not have signal loss due to impedance mismatch, and can be effectively used for RF detection at high frequencies. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A cross-sectional view to schematically show an example of applying the connector according to one embodiment.

[0022] Figure 2 A cross-sectional view to show a portion of the connector of one embodiment.

[0023] Figure 3 A plan view to show a portion of the connector of one embodiment.

[0024] Figure 4 A cross-sectional perspective view to show a portion of the connector of one embodiment.

[0025] Figure 5 A cross-sectional view to show a modification of the connector of one embodiment.

[0026] Figure 6 A graph to show the results of simulation of the connector of one embodiment and the connector of a comparative example.

[0027] Figure 7A graph showing another result of simulation of the connector of one embodiment and the connector of the comparative example.

[0028] Figure 8 A cross-sectional view schematically showing an example of manufacturing the connector of one embodiment.

[0029] Figure 9 A cross-sectional view schematically showing an example of manufacturing the connector of one embodiment.

[0030] Figure 10 A cross-sectional view schematically showing an example of manufacturing the connector of one embodiment.

[0031] Figure 11 A cross-sectional view schematically showing an example of manufacturing the connector of one embodiment.

[0032] Figure 12 A cross-sectional view showing a part of the connector of another embodiment.

[0033] Figure 13 A cross-sectional view showing a part of the connector of still another embodiment.

[0034] Figure 14 A cross-sectional view showing a part of the connector of yet another embodiment. DETAILED DESCRIPTION

[0035] Embodiments of the present disclosure are shown for the purpose of illustrating the technical idea of the present disclosure. The scope of the rights of the present disclosure is not limited to the embodiments presented below or the specific description of these embodiments.

[0036] Unless otherwise defined, all the technical and scientific terms used in the present disclosure have meanings commonly understood by one of ordinary skill in the art. All the terms used in the present disclosure are for the purpose of more clearly illustrating the present disclosure, and are not intended to limit the scope of the rights of the present disclosure.

[0037] The expressions such as "include", "have" and "possess" used in the present specification are to be understood as open-ended terms that include the possibility of other embodiments, unless otherwise specified in the sentence or article in which the expression is used.

[0038] Unless otherwise specified, the terms written in the singular form in the present disclosure can include the meaning of the plural form, and the same applies to the terms written in the singular form in the claims.

[0039] The terms such as "first", "second", etc. used in the present disclosure are used to distinguish a plurality of components from each other, and do not limit the order or importance of the relative components.

[0040] In the present application, when a certain component is referred to as being "connected" or "coupled" to another component, the particular component can be directly connected or coupled to the other component, and it should be understood that a new other component can be "connected" or "coupled" between them.

[0041] In the present application, the direction-indicating expression of "above" indicates a direction of a connector with respect to a detection device, and the direction-indicating expression of "below" indicates an opposite direction of the above. It should be understood that the direction-indicating expression of "vertical direction" used in the present application includes both the direction toward the above and the direction toward the below, but does not indicate a specific one of the direction toward the above and the direction toward the below.

[0042] Embodiments are explained with reference to examples shown in the accompanying drawings. In the drawings, the same or corresponding components are given the same reference numerals. In addition, in the explanation of the following embodiments, repeated description of the same or corresponding components can be omitted. However, even if the description of the components is omitted, it does not mean that the components are not included in the embodiment.

[0043] The embodiments explained below and the examples shown in the accompanying drawings relate to a connector for electrical connection of two electronic devices. In an application example of the connector of the embodiments, one of the two electronic devices can be a detection device, and the other of the two electronic devices can be a detected device detected by the detection device. Therefore, the connector of this embodiment can be used for electrical connection of the detection device and the detected device at the time of electrical detection of the detected device. As an example, the connector of the embodiments can be used for final and timely detection of a semiconductor device in a post-process of a manufacturing process of the semiconductor device. However, examples of detection in which the connector of the embodiments is applied are not limited to the foregoing detection.

[0044] Figure 1 An example in which the connector according to one embodiment is applied is schematically shown, and in Figure 1 In the drawings, a connector, a detection device, and a detected device are schematically illustrated in order to understand the embodiments.

[0045] The connector 100 according to one embodiment is a sheet-like structure provided between a detection device 10 and a detected device 20. As an example, the connector 100 can be placed on the detection device 10 by a detection socket 30. The detection socket 30 can be detachably mounted to the detection device 10. The detection socket 30 receives the detected device 20 carried to the detection device 10 by a manual method or a carrying device, and aligns the detected device 20 with the connector 100. When the detected device 20 is detected, the connector 100 is in contact with the detection device 10 and the detected device 20 in a vertical direction VD, and electrically connects the detection device 10 and the detected device 20 to each other.

[0046] The device under test 20 can be a semiconductor device in a hexahedral shape formed by encapsulating a semiconductor IC chip and a plurality of terminals with a resin material. As an example, the device under test 20 can be a semiconductor device used in a mobile communication device, but is not limited thereto. The device under test 20 has a plurality of terminals in a semispherical shape at a lower portion thereof. The plurality of terminals of the device under test 20 can include a signal terminal 21 and a ground terminal 22.

[0047] The detection apparatus 10 can detect various operational characteristics of the device under test 20. The detection apparatus 10 can have a circuit board on which a detection circuit 11 for detecting the device under test is disposed, which performs detection. Further, the detection circuit 11 has a plurality of terminals electrically connected to the terminals 21, 22 of the device under test through the connector 100. The plurality of terminals of the detection apparatus 10 can include a signal terminal 12 for transmitting a test signal and receiving a response signal, and a ground terminal 13 positioned around the signal terminal 12.

[0048] The signal terminal 21 of the device under test 20 is electrically connected to the signal terminal 12 of the detection apparatus 10 through the connector 100, and the ground terminal 22 of the device under test 20 is electrically connected to the ground terminal 13 of the detection apparatus 10 through the connector 100. In detecting the device under test, the connector 100 electrically connects each terminal 21, 22 of the device under test 20 and each terminal 12, 13 of the detection apparatus 10 corresponding thereto in the vertical direction VD, and the detection apparatus 10 detects the device under test 20 through the connector 100. As an example, the connector 100 can be disposed between the device under test 20 and the detection apparatus 10 to perform high-frequency RF detection of the device under test 20.

[0049] Referring to Figure 1 , the connector 100 includes at least one signal conductive portion 110, at least one ground conductive portion 120, and a metal frame portion 130. The signal conductive portion 110 extends in the vertical direction VD and is configured to be electrically conductive in the vertical direction VD. The ground conductive portion 120 is disposed to be spaced apart from the signal conductive portion 110 in a horizontal direction HD perpendicular to the vertical direction VD. The metal frame portion 130 holds the signal conductive portion 110 and the ground conductive portion 120 in the vertical direction VD and spaces the signal conductive portion 110 and the ground conductive portion 120 in the horizontal direction HD.

[0050] The signal conductive portion 110 contacts the signal terminal 21 of the device under test 20 at its upper end and contacts the signal terminal 12 of the testing device 10 at its lower end. Accordingly, a vertically conductive path is formed between the signal terminal 12 and the signal terminal 21 with the signal conductive portion 110 as a medium. A test signal of the testing device 10 can be transmitted from the signal terminal 12 to the signal terminal 21 of the device under test 20 through the signal conductive portion 110, and a response signal of the device under test 20 can be transmitted from the signal terminal 21 to the signal terminal 12 of the testing device 10 through the signal conductive portion 110. The upper end of the signal conductive portion 110 protrudes upward from the upper surface 131 of the metal frame portion 130, and the lower end of the signal conductive portion 110 protrudes downward from the lower surface 132 of the metal frame portion 130. The signal conductive portion 110 is insulated from the metal frame portion 130 and is not electrically connected to the ground conductive portion 120 and the metal frame portion 130. The upper end of the ground conductive portion 120 protrudes upward from the upper surface 131 of the metal frame portion 130, and the lower end of the ground conductive portion 120 protrudes downward from the lower surface 132 of the metal frame portion 130. The ground conductive portion 120 is electrically connected to the metal frame portion 130.

[0051] To illustrate the connector of an embodiment, reference will be made to Figures 2 to 4 the example shown in the drawings. Figures 2 to 4 The shapes, arrangements and placements of the elements in the connector are shown schematically and are merely examples for understanding the embodiments. Figure 2 To show a cross-sectional view of a portion of the connector of an embodiment. Figure 3 To show a plan view of a portion of the connector of an embodiment. Figure 4 To show a cross-sectional perspective view of a portion of the connector of an embodiment.

[0052] In the connector 100, the signal conductive portion 110 performs signal transmission in the vertical direction VD between the testing device 10 and the device under test 20. The signal conductive portion 110 can have a cylindrical shape extending in the vertical direction VD. The signal conductive portion 110 includes a transmission portion 111 that performs signal transmission and an insulating portion 112 that insulates the transmission portion 111 from the metal frame portion 130 in the horizontal direction HD.

[0053] The transmission portion 111 is composed of a plurality of first conductive particles 113 that are gathered in the vertical direction VD and that are electrically conductive in contact in the vertical direction VD. The plurality of first conductive particles 113 that are electrically conductive in contact in the vertical direction VD perform signal transmission in the vertical direction VD within the signal conductive portion 110. The transmission portion 111 can have a cylindrical shape that extends in the vertical direction VD, and in this cylindrical shape, the diameter of the middle can be smaller than the diameters of the upper end and the lower end. The first conductive particles 113 can be particles composed of a metal material having high electrical conductivity. For example, the metal material having high electrical conductivity can be gold, but is not limited thereto. Alternatively, the first conductive particles 113 can have a form in which a core particle composed of a resin material or a metal material having elasticity is coated with the metal material having high electrical conductivity described above.

[0054] The insulation portion 112 is composed of an elastic insulating substance and has a cylindrical shape that extends in the vertical direction VD. The insulation portion 112 can have a height that is the same as the height of the transmission portion 111. The elastic insulating substance that constitutes the insulation portion 112 includes an insulating substance having a relatively low dielectric constant. For example, the elastic insulating substance that constitutes the insulation portion 112 can be silicone rubber, an insulating substance such as Teflon, but is not limited thereto. The insulation portion 112 is formed integrally with the transmission portion 111 to constitute the signal conductive portion 110. The insulation portion 112 surrounds the transmission portion 111 in the horizontal direction HD.

[0055] Since the transmission portion 111 is formed integrally with the insulation portion 112, the elastic insulating substance that forms the insulation portion 112 can be filled between the plurality of first conductive particles 113. That is, the insulation portion 112 maintains the first conductive particles 113 in the shape of the transmission portion 111, and the insulation portion 112 is integrally formed with the insulating substance that is filled between the first conductive particles 113. Therefore, the insulation portion 112 imparts elasticity to the signal conductive portion 110 in the vertical direction VD and the horizontal direction HD. The portion of the signal conductive portion 110 that is in contact with the metal frame portion 130 is difficult to elastically deform due to the presence of the metal frame portion 130. However, the signal conductive portion 110 has an upper end portion 114 that protrudes upward from the upper surface 131 of the metal frame portion 130 and a lower end portion 115 that protrudes downward from the lower surface 132 of the metal frame portion 130. The upper end portion 114 and the lower end portion 115 are portions of the signal conductive portion 110. The upper end of the upper end portion 114 includes the upper end of the transmission portion 111 and the upper end of the insulation portion 112, and the lower end of the lower end portion 115 includes the lower end of the transmission portion 111 and the lower end of the insulation portion 112. The upper end portion 114 and the lower end portion 115 of the signal conductive portion 110 can elastically deform in the vertical direction VD and the horizontal direction HD by the elastic insulating substance included in the upper end portion 114 and the lower end portion 115. For example, when the signal terminal 21 of the detected device 20 (refer to FIG. 1) is pressed against the signal conductive portion 110, the upper end portion 114 and the lower end portion 115 of the signal conductive portion 110 elastically deform in the vertical direction VD and the horizontal direction HD, and the signal terminal 21 of the detected device 20 can be pressed against the signal conductive portion 110. Figure 1When the signal conductive portion 110 is pressed downward, the upper end portion 114 and the lower end portion 115 can be elastically deformed in the horizontal direction HD. When the detected device 20 is removed from the connector, the upper end portion 114 and the lower end portion 115 can be elastically restored.

[0056] The insulating portion 112 surrounding the transmission portion 111 has a predetermined thickness to effectively insulate the transmission portion 111 from the metal frame unit 130, making it possible to have no signal loss when signal transmission is performed. The maximum distance between both ends of the transmission portion 111 in the horizontal direction HD can be defined as the maximum width W of the transmission portion 111. For example, the maximum distance between both ends can represent the distance between the first conductive particles 113 farthest apart in the horizontal direction HD perpendicular to the central axis C of the transmission portion 111. The insulating portion 112 has a thickness T in the radial direction with respect to the central axis C of the transmission portion 111, i.e., in the horizontal direction HD. The insulating portion 112 is formed integrally with the transmission portion 111 such that the thickness T of the insulating portion 112 is greater than the maximum width W of the transmission portion 111. Accordingly, the signal conductive portion 110 has a coaxial structure, and the central axis of the insulating portion 112 can coincide with the central axis C of the transmission portion 111.

[0057] The ground conductive portion 120 is located around the signal conductive portion 110 and can be spaced apart from the signal conductive portion 110 in the horizontal direction HD by the metal frame portion 130. The transmission portion 111 does not short-circuit with the ground conductive portion 120 and the metal frame portion 130 due to the insulating portion 112 of the signal conductive portion 110.

[0058] Only one ground conductive portion 120 can be provided spaced apart from the signal conductive portion 110 in the horizontal direction HD. Alternatively, as shown in FIG. 2B, a plurality of ground conductive portions 120 can be provided spaced apart from one signal conductive portion 110 in the horizontal direction HD. Figures 2 to 4 As shown in FIG. 2B, in a state in which the plurality of ground conductive portions 120 are spaced apart from one signal conductive portion 110 in the horizontal direction HD by the metal frame portion 130, the plurality of ground conductive portions 120 can be disposed around one signal conductive portion 110. Figure 3 As shown in FIG. 2B, in a state in which the plurality of ground conductive portions 120 are spaced apart from one signal conductive portion 110 in the horizontal direction HD by the metal frame portion 130, the plurality of ground conductive portions 120 can be disposed around one signal conductive portion 110.

[0059] Figure 3 The planar configuration of the signal conductive portion 110 and the ground conductive portion 120 shown in FIGS. 2A and 2B is merely exemplary and is not limited to Figure 3The planar configuration of the signal conductive portions 110 and the ground conductive portions 120 can vary depending on the planar configuration of the terminals of the device under test 20. For example, at least one or a plurality of the ground conductive portions 120 can be disposed apart from the signal conductive portions 110 in the horizontal direction, and the intervals between the plurality of ground conductive portions 120 can not be fixed. In addition, a plurality of groups each composed of a plurality of the ground conductive portions 120 can be disposed apart from one signal conductive portion 110 or a plurality of signal conductive portions 110 in the horizontal direction. In addition, a plurality of signal conductive portions 110 can form one group, and a plurality of ground conductive portions 120 can be disposed apart from the group in the horizontal direction and around the group.

[0060] The ground conductive portions 120 are configured to be electrically conductive. In addition, the ground conductive portions 120 are electrically connected to the metal frame portion 130. Thereby, the ground conductive portions 120 and the metal frame portion 130 are short-circuited to each other, and can function as a single short-circuit body.

[0061] According to an embodiment, each of the ground conductive portions 120 includes an upper ground conductive portion 121 and a lower ground conductive portion 122. The upper ground conductive portion 121 and the lower ground conductive portion 122 are aligned in the vertical direction VD and are separated in the vertical direction VD by the metal frame portion 130. The upper ground conductive portion 121 and the lower ground conductive portion 122 are electrically connected to the metal frame portion 130.

[0062] The upper ground conductive portion 121 and the lower ground conductive portion 122 include a plurality of second conductive particles 123 that are electrically conductive and gathered and in contact in the vertical direction VD, and an elastic substance 124 that maintains the plurality of second conductive particles 123 in the vertical direction VD. The second conductive particles 123 that constitute the upper ground conductive portion 121 and the lower ground conductive portion 122 can be the same as or different from the aforementioned first conductive particles 113. The assembly made of the second conductive particles 123 that are in contact in the vertical direction VD is in contact with the metal frame portion 130 at its upper end or lower end, and electrically connects the upper ground conductive portion 121 and the lower ground conductive portion 122 to the metal frame portion 130. Thus, the upper ground conductive portion 121 and the lower ground conductive portion 122 are short-circuited by the metal frame portion 130. The elastic substance 124 maintains the second conductive particles 123 in a fixed state. The elastic substance 124 can have insulating properties or conductive properties. For example, the elastic substance 124 can include an elastic insulating substance that forms the insulating portion 112 of the signal conductive portion 110, but is not limited thereto.

[0063] The upper side ground conductive part 121 has an upper end part 125 protruding upward from the upper surface of the metal frame part 130, and the lower side ground conductive part 122 has a lower end part 126 protruding downward from the lower surface of the metal frame part 130. The height of the protrusion of the upper end part 125 can be the same as the height of the protrusion of the upper end part 114 of the signal conductive part, and the height of the protrusion of the lower end part 126 can be the same as the height of the protrusion of the lower end part 115 of the signal conductive part. Due to the upper end part 125 of the upper side ground conductive part 121 and the lower end part 126 of the lower side ground conductive part 122, the ground conductive part 120 can be elastically deformed and elastically recovered during detection of the detected device 20.

[0064] The metal frame part 130 can be formed of a flat plate, which can be made of a metal material such as stainless steel, aluminum, etc. The metal frame part 130 separates the signal conductive part 110 from the ground conductive part 120. The metal frame part 130 is electrically connected to the ground conductive part 120 and is short-circuited with the ground conductive part 120. The metal frame part 130 is connected to a detection socket guide mounted on a circuit board of a detection device, and can be externally grounded. When the metal frame part 130 is externally grounded through the detection socket guide, the ground range is expanded from the connector 100 to the detection socket guide, thereby further improving the RF characteristics.

[0065] Referring to Figure 2 The metal frame part 130 has a through-hole 133 passing through the metal frame part 130 in the vertical direction VD. The signal conductive part 110 is formed in the through-hole 133. According to an embodiment, the metal frame part 130 includes an insulating oxide film 134 formed on the entire wall surface of the through-hole 133. The insulating oxide film 134 is provided between the wall surface of the through-hole 133 and the insulating part 112 of the signal conductive part 110 to prevent short-circuiting between the signal conductive part 110 and the ground conductive part 120 and between the signal conductive part 110 and the metal frame part 130. The insulating oxide film 134 can be formed on the wall surface of the through-hole 133 by anodizing the metal frame part 130 having the through-hole 133 passing therethrough. By anodizing, the insulating oxide film can be formed on the wall surface of the through-hole 133, which can enhance the insulation between the signal conductive part 110 and the metal frame part 130. As another embodiment, the insulating oxide film 134 can be formed on the upper surface 131 of the metal frame part 130, or the lower surface 132, or both the upper surface 131 and the lower surface 132. The insulating oxide film 134 formed on the upper surface 131 and the lower surface 132 of the metal frame part 130 can prevent short-circuiting between the metal frame part and the detected device, or between the metal frame part and the detection device, when detecting the detected device.

[0066] In addition, the metal frame portion 130 has a first groove 135 recessed downward from the upper surface 131 and a second groove 136 recessed upward from the lower surface 132. The upper side ground conductive portion 121 is formed in the first groove 135, and the lower side ground conductive portion 122 is formed in the second groove 136. The first groove 135 and the second groove 136 are spaced apart in the vertical direction VD. The upper side ground conductive portion 121 formed in the first groove 135 is electrically connected to the metal frame portion 130 through the first groove 135, and the lower side ground conductive portion 122 formed in the second groove 136 is electrically connected to the metal frame portion 130 through the second groove 136. The first groove 135 and the second groove 136 do not have the aforementioned insulating oxide film 134. Accordingly, the upper side ground conductive portion 121 and the lower side ground conductive portion 122 can be short-circuited through the metal frame portion 130. However, the signal conductive portion 110 will not be short-circuited with the upper side ground conductive portion 121, the lower side ground conductive portion 122, and the metal frame portion 130 through the insulating portion 112 of the signal conductive portion 110.

[0067] Figure 5 A modification of the connector of one embodiment is shown. As shown in Figure 5 , the signal conductive portion 110, the upper side ground conductive portion 121, and the lower side ground conductive portion 122 are configured not to protrude from the upper surface 131 and the lower surface 132 of the metal frame portion 130.

[0068] The connector in one embodiment is configured to have an impedance matching that of a detection circuit of a detection device and that of a device under test. Since the ground conductive portion 120 and the metal frame portion 130 can function as one short-circuiting body, the distance between the metal frame portion 130 and the transmission portion 111 of the signal conductive portion 110 can affect the impedance of the connector. In order to have an impedance matching that of the detection device and that of the device under test, the size of the transmission portion 111 and the size of the insulating portion 112 can be set within a range of a certain ratio. The transmission portion 111 and the insulating portion 112 constituting the coaxial structure are formed to have sizes of a certain ratio to eliminate signal loss due to impedance mismatching and to cause the connector 100 to have an impedance matching that of the device under test and that of the detection device.

[0069] Referring to Figure 2 and Figure 3 , the signal conductive portion 110 can have an inner diameter D1 and an outer diameter D2. The inner diameter D1 of the signal conductive portion 110 can correspond to the maximum width W of the transmission portion 111 in the horizontal direction HD, and the outer diameter D2 of the signal conductive portion 110 can correspond to the width between both ends of the insulating portion 112 in the horizontal direction HD (or the diameter of the through-hole 133 of the metal frame portion 130). The impedance of the signal conductive portion 110 can be determined by the diameter of the transmission portion (i.e., the inner diameter D1) and the diameter of the insulating portion (i.e., the outer diameter D2).

[0070] The ratio of the inner diameter D1 to the outer diameter D2 can be set so that the impedance of the connector of an embodiment matches the impedance of the detection circuit of the detection device and the impedance of the device under test detected by the detection device. The impedance value of the signal conductive portion can be determined by the ratio of the inner diameter D1 to the outer diameter D2.

[0071] For example, the device under test can have an impedance of about 50 ohms, and in order to detect such a device under test, the detection circuit of the detection device can have an impedance of about 50 ohms. The impedance of about 50 ohms of the device under test and the impedance of about 50 ohms of the detection circuit can be impedances set in consideration of no signal loss at the time of signal transmission. By adjusting the ratio of the inner diameter D1 to the outer diameter D2, the connector of an embodiment can have an impedance of about 50 ohms. Accordingly, when the connector 100 of an embodiment is disposed between the device under test and the detection device, the impedance of the device under test, the impedance of the detection device, and the impedance of the connector match each other. Therefore, the connector of an embodiment is capable of performing high-frequency RF detection of the device under test 10 with high reliability without signal loss such as signal reflection.

[0072] According to an embodiment, the outer diameter D2 in the signal conductive portion 110 can be 3 to 5 times the inner diameter D1 to be suitable for various devices under test and detection devices for detecting the same. That is, the ratio of the inner diameter D1 to the outer diameter D2 can be set in the range of 1:3 to 1:5. As a specific example, when the outer diameter D2 is 4 times the inner diameter D1, that is, when the ratio of the inner diameter D1 to the outer diameter D2 is 1:4, the connector of an embodiment can have an impedance of about 50 ohms.

[0073] For example, the impedance when the outer diameter D2 is 4 times the inner diameter D1 can be confirmed by software capable of calculating the impedance in a coaxial structure (for example, a coaxial line calculator). Using the software, the impedance is calculated under the condition that the dielectric constant of the insulating portion 112 is 2.95, the inner diameter D1 is 0.1 mm, and the outer diameter D2 is 0.4 mm. According to the calculation result of the above-described condition, it can be confirmed that the impedance is about 50 ohms. In addition, by the above-described calculation, it can be calculated that the parasitic capacitance is 118.222 pF / m, the inductance is 277.259 nH / m, the phase velocity is 174667 km / s, and the time delay is 5.719 ns / m.

[0074] The connector of one embodiment can achieve high frequency RF detection of 40 GHz or more while achieving impedance matching without signal interference or noise or signal loss. For example, a connector having a signal conductive part with an impedance of about 50 ohms can cover a high frequency band and can be effectively applied to detect semiconductor devices of a mobile communication device operating in a high frequency band. The connector according to one embodiment, in which the inner diameter Dl and the outer diameter D2 are adjusted in the coaxial structure of the signal conductive part, the signal conductive part is not short-circuited with the ground conductive part and the metal frame part, and thus the connector of one embodiment can have improved RF characteristics.

[0075] The improved performance of the connector of one embodiment can be confirmed using software for simulating a high frequency electromagnetic field. Figure 6 and Figure 7 A graph showing the results of simulation performed using software for simulating a high frequency electromagnetic field is shown. The above simulation was performed on the connector according to one embodiment and the connector according to the comparative example. In the graph shown in Figure 6 and Figure 7 In the graph shown in Figure 6 and Figure 7 In the graph shown in

[0076] Figure 6 Simulation results showing insertion loss indicating the degree of signal loss at the time of signal transmission are shown. In the graph shown in Figure 6 In the graph shown in Figure 6 It can be confirmed that the connector of one embodiment has less signal loss in a high frequency range of 40 GHz or more than the connector of the comparative example. Figure 7 Simulation results showing return loss indicating the degree of signal reflection at the time of signal transmission are shown. In the graph shown in Figure 7 In the graph shown in Figure 7 It can be confirmed that the connector of one embodiment has less signal reflection in a high frequency range of 40 GHz or more than the connector of the comparative example. In addition, since the curve of the connector of one embodiment is below -30 dB in a range of 40 GHz or less, it can be confirmed that the connector 100 of one embodiment has excellent RF characteristics at a high frequency of 40 GHz or more.

[0077] An example of manufacturing a connector according to an embodiment will be described with reference to the drawings. Figures 8 to 11 An example of manufacturing a connector according to an embodiment will be described with reference to the drawings. Figures 8 to 11 An example of manufacturing a connector according to an embodiment will be described with reference to the drawings, Figures 8 to 11 The illustrated elements are only for understanding the embodiments.

[0078] Referring to Figure 8 A metal plate 41 that can be manufactured as the above-described metal frame portion is prepared, and a through-hole 133 is formed in the metal plate 41 at a position at which the above-described signal conductive portion is to be formed. The through-hole 133 can be formed by, for example, drilling.

[0079] Referring to Figure 9 An insulating oxide film 134 is formed on the surfaces of the metal plate 41 (the upper surface 42 and the lower surface 43 of the metal plate 41, and the wall surface 44 of the through-hole 133). The insulating oxide film 134 can be formed by anodizing the metal plate 41. The surfaces of the metal plate 41 are oxidized by anodizing to form the insulating oxide film 134 as an insulator on the surfaces of the metal plate 41. In the case where the metal plate 41 is composed of aluminum, the insulating oxide film 134 of Al2O3 as an insulator can be formed by anodizing.

[0080] Referring to Figure 10 A first groove 135 and a second groove 136 are formed in the metal plate 41 so as to be aligned in the vertical direction VD and spaced apart from each other. The first groove 135 and the second groove 136 are provided so as to be spaced apart from the through-hole 133 in the horizontal direction HD, and form the above-described upper-side ground conductive portion 121 and the above-described lower-side ground conductive portion 122, respectively. The first groove 135 and the second groove 136 can be formed by, for example, drilling or laser. The first groove 135 and the second groove 136 are formed in the metal plate 41, and the insulating oxide film 134 is not present in the first groove 135 and the second groove 136. The metal plate 41 in which the through-hole 133, the first groove 135, and the second groove 136 are formed becomes the above-described metal frame portion. After the first groove 135 and the second groove 136 are formed, the insulating oxide film 134 present on the upper surface 42 and the lower surface 43 of the metal plate 41 can be removed or not removed from the upper surface 42 and the lower surface 43.

[0081] Referring to Figure 11On the upper surface and the lower surface of the metal frame portion 130, a spacer 45 is provided, a first liquid material 46 is injected into the through-hole 133, and a second liquid material 47 is injected into the first groove 135 and the second groove 136. The first liquid material 46 constitutes an insulating portion of the aforementioned signal conductive portion, and includes a liquid elastic insulating substance and first conductive particles 113 dispersed in the liquid elastic insulating substance. The second liquid material 47 constitutes an elastic substance of the aforementioned ground conductive portion, and includes a liquid elastic substance and second conductive particles 123 dispersed therein. The elastic insulating substance of the first liquid material 46 and the elastic substance of the second liquid material 47 can be the same. The first conductive particles 113 and the second conductive particles 123 can be the same.

[0082] Next, a magnetic field in the vertical direction VD is applied to the first liquid material 46 injected into the through-hole 133 and the second liquid material 47 injected into the first groove 135 and the second groove 136. By applying the magnetic field, a plurality of the first conductive particles 113 within the first liquid material 46 are densely gathered in the vertical direction VD within the magnetic field and are in conductive contact, and a plurality of the second conductive particles 123 within the second liquid material 47 are densely gathered in the vertical direction VD within the magnetic field and are in conductive contact. Thus, the plurality of the first conductive particles 113 densely gathered and in contact in the vertical direction VD can form a transmission portion of the aforementioned signal conductive portion, and the plurality of the second conductive particles 123 densely gathered and in contact in the vertical direction VD can form the upper side ground conductive portion and the lower side ground conductive portion. After the magnetic field is applied, by performing a curing process, the liquid elastic insulating substance other than the first conductive particles 113 in the first liquid material 46 is cured to form the insulating portion of the aforementioned signal conductive portion. In addition, by this curing process, as the liquid elastic substance other than the second conductive particles 123 in the second liquid material 47 is cured, it is possible to maintain the second conductive particles 123 in the vertical direction. With respect to the application of the magnetic field to the first liquid material 46, the magnet for applying the magnetic field can be configured to apply a magnetic field that makes the maximum width of the plurality of the first conductive particles 113 gathered and in contact in the vertical direction VD in the horizontal direction HD be 1 / 3 to 1 / 5 of the diameter of the through-hole 133.

[0083] Due to the spacer 45 having a predetermined thickness, the protruding upper end portion and the lower end portion of the aforementioned signal conductive portion and the protruding upper end portion and the lower end portion of the aforementioned ground conductive portion can be formed. As another embodiment, the aforementioned signal conductive portion and the aforementioned ground conductive portion can not have portions protruding from the upper surface and the lower surface of the metal frame portion 130 without using the spacer 45.

[0084] Figures 12 to 14 An embodiment of a connector is shown. Reference is made to Figures 12 to 14 The constituent elements of the connector described can be selectively used in the connector of the aforementioned embodiment.

[0085] Figure 12 A connector 100 according to another embodiment is shown. In the connector shown, the insulating portion 112 has a plurality of air holes 116, which can be distributed throughout the insulating portion 112. The air holes 116 are formed within the insulating portion 112 due to a partial lack of the above-mentioned elastic insulating substance that constitutes the insulating portion 112. Since the dielectric constant of the insulating portion 112 having the air holes 116 is lower than that of the insulating portion without the air holes, signal loss to the signal conductive portion 110 can be further reduced. Figure 12

[0086] During molding of the connector 100, the air holes 116 can be formed within the insulating portion 112. To this end, the above-mentioned first liquid material used to form the signal conductive portion 110 includes an elastic insulating substance that constitutes the insulating portion 112 and is in a liquid state, first conductive particles dispersed in the liquid state of the elastic insulating substance, and a foaming agent included in the liquid state of the elastic insulating substance. The foaming agent generates gas by reacting with the liquid state of the elastic insulating substance. The generated gas pushes away the liquid state of the elastic insulating material. Thereby, the generated gas causes a partial lack of the liquid state of the elastic insulating substance within the insulating portion 112, so that a plurality of air holes 116 can be formed throughout the insulating portion 112.

[0087] Figure 13 A connector 100 according to still another embodiment is shown. Figure 13 The connector 100 shown includes an insulating member 140 attached to the lower surface 132 of the metal frame portion 130. The insulating member 140 can include an insulating polyimide film or a film composed of an insulating polymer. A through hole 141 corresponding to the signal conductive portion 110 and a through hole 142 corresponding to the ground conductive portion 120 (lower side ground conductive portion 122) are formed in the insulating member 140. The lower end portion 115 of the signal conductive portion 110 protrudes through the through hole 141, and the lower end portion 126 of the lower side ground conductive portion 122 protrudes through the through hole 142. The insulating member 140 can prevent short-circuiting between the signal conductive portion 110 and the ground conductive portion 120. In addition, the insulating member 140 can prevent short-circuiting between the metal frame portion 130 and the detection device. As another embodiment, the insulating member 140 can be attached to the upper surface 131 of the metal frame portion 130, or both the upper surface 131 and the lower surface 132.

[0088] Figure 14 A connector according to still another embodiment is shown. In the connector shown, Figure 14 ​In the connector 100 shown, the transmission portion 111 of the signal conductive portion 110 further includes a conductive pin 117 in addition to the first conductive particles 113. The conductive pin 117 is made of a metal material having high conductivity. The metal material constituting the conductive pin 117 can include gold, but is not limited to gold.

[0089] The conductive pin 117 is positioned between the first conductive particles 113 in the upper end portion 114 and the first conductive particles 113 in the lower end portion 115 in the vertical direction VD. That is, the conductive pin 117 is supported by the insulating portion 112 in the vertical direction VD in a state of being in contact with the first conductive particles 113 on the upper side and the first conductive particles 113 on the lower side. In addition, the conductive pin 117 is positioned in the vertical direction VD so as to correspond to the thickness of the metal frame portion 130, and constitutes the transmission portion 111 together with the first conductive particles 113 on the upper side and the first conductive particles 113 on the lower side. The portion of the signal conductive portion 110 corresponding to the thickness of the metal frame portion 130 does not have an elastic restoring force due to the metal frame portion 130. By providing the conductive pin 117 in the portion of the signal conductive portion 110 corresponding to the thickness of the metal frame portion 130, it is possible to improve the signal transmission efficiency in the portion of the signal conductive portion 110 having no elastic restoring force. The diameter of the conductive pin 117 can correspond to the inner diameter of the signal conductive portion described above. The length of the conductive pin 117 in the vertical direction VD can be greater than the thickness of the metal frame portion 130 in the vertical direction VD.

[0090] Although the technical idea of the present application has been described through the examples shown in some embodiments and drawings above, it should be understood that various substitutions, modifications and changes can be made within the scope of the technical idea and range of the present application that can be understood by those skilled in the art to which the present application pertains. In addition, such substitutions, modifications and changes should be considered to be within the scope of the claims.

Claims

1. An electrical connection connector comprising: at least one signal conductive portion including: a transmission portion composed of a plurality of first conductive particles that are in electrically conductive contact in a vertical direction; and an insulating portion composed of an elastic insulating substance and formed integrally with the transmission portion so as to surround the transmission portion in a horizontal direction perpendicular to the vertical direction, wherein a thickness of the insulating portion in the horizontal direction is greater than a maximum width of the transmission portion in the horizontal direction; at least one ground conductive portion disposed apart from the signal conductive portion in the horizontal direction; and a metal frame portion that maintains the signal conductive portion and the ground conductive portion in the vertical direction and separates the signal conductive portion and the ground conductive portion in the horizontal direction, and that is electrically connected to the ground conductive portion, wherein the signal conductive portion has an inner diameter corresponding to the maximum width of the transmission portion in the horizontal direction and an outer diameter corresponding to a width between both ends of the insulating portion in the horizontal direction and is 3 to 5 times the inner diameter.

2. The connector according to claim 1, wherein the ground conductive portion includes an upper side ground conductive portion and a lower side ground conductive portion that are separated in the vertical direction by the metal frame portion.

3. The connector according to claim 2, wherein the metal frame portion has a first groove recessed from an upper surface of the metal frame portion and a second groove recessed from a lower surface of the metal frame portion, the upper side ground conductive portion is formed in the first groove, and the lower side ground conductive portion is formed in the second groove.

4. The connector according to claim 2, wherein the upper side ground conductive portion and the lower side ground conductive portion include a plurality of second conductive particles that are in electrically conductive contact in the vertical direction and an elastic substance that maintains the plurality of second conductive particles in the vertical direction.

5. The connector according to claim 4, wherein an upper end portion of the upper side ground conductive portion protrudes from the upper surface of the metal frame portion, and a lower end portion of the lower side ground conductive portion protrudes from the lower surface of the metal frame portion.

6. The connector according to claim 1, wherein an upper end portion of the signal conductive portion protrudes from an upper surface of the metal frame portion, and a lower end portion of the signal conductive portion protrudes from a lower surface of the metal frame portion.

7. The connector according to claim 1, wherein the signal conductive portion is formed in a through-hole that penetrates the metal frame portion in the vertical direction, and the metal frame portion includes an insulating oxide film that is formed across an entire area of a wall surface of the through-hole between the wall surface of the through-hole and the insulating portion, and prevents short-circuiting between the signal conductive portion and the ground conductive portion.

8. The connector according to claim 1, wherein the elastic insulating substance of the insulating portion includes silicone rubber or Teflon.

9. The connector according to claim 1, wherein the insulating portion has a plurality of air holes formed by a lack of the elastic insulating substance.

10. The connector according to claim 1, further comprising an insulating member formed with a plurality of through holes corresponding to the at least one signal conductive portion and the at least one ground conductive portion, and attached to the metal frame portion.

11. The connector according to claim 1, wherein the transmission portion further comprises a conductive pin disposed in a vertical direction between the first conductive particles at an upper end portion of the signal conductive portion and the first conductive particles at a lower end portion of the signal conductive portion.

12. The connector according to claim 11, wherein a length of the conductive pin in the vertical direction is greater than a thickness of the metal frame portion in the vertical direction.

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