Touch display modules and electronic devices

Abstract

This application discloses a touch display module and electronic device, belonging to the field of communication technology. The touch display module of this application includes: a touch display panel, the touch display panel including a touch capacitor layer; a flexible circuit board, the flexible circuit board being provided with a pressure sensing module and a driver chip, and the pressure sensing module being located between the flexible circuit board and the touch display panel; wherein the driver chip is respectively connected to the pressure sensing module and the touch capacitor layer, and is used to detect the pressed position on the touch display panel through the touch capacitor layer, and to detect the pressed force on the touch display panel through the pressure sensing module.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a touch display module and an electronic device. Background Art

[0002] In current electronic devices, pressure sensing functions are increasingly used in order to achieve a more convenient, quick and flexible touch and press operation experience.

[0003] However, existing solutions for implementing pressure sensing are designed and deployed independently. Electronic devices often require diverse functionality, requiring the internal deployment of various functional components such as cameras, antennas, and speakers. This independent design and deployment of pressure sensing consumes internal device space and increases manufacturing costs. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a touch display module and an electronic device that can solve the problem of space occupation of existing pressure sensing function implementation solutions.

[0005] In a first aspect, an embodiment of the present application provides a touch display module, comprising:

[0006] A touch display panel, the touch display panel comprising a touch capacitor layer;

[0007] A flexible circuit board, wherein a pressure sensing module and a driver chip are provided on the flexible circuit board, and the pressure sensing module is located between the flexible circuit board and the touch display panel;

[0008] The driving chip is connected to the pressure sensing module and the touch capacitor layer respectively, and is used to detect the pressed position on the touch display panel through the touch capacitor layer, and to detect the pressed force on the touch display panel through the pressure sensing module.

[0009] In a second aspect, an embodiment of the present application provides an electronic device, comprising: a central processing unit, and the touch display module described in the first aspect; wherein,

[0010] The central processing unit is connected to the touch display module.

[0011] In an embodiment of the present application, the touch display module can be equipped with a driver chip on a flexible circuit board. On the one hand, it detects the pressing force on the touch display panel through the pressure sensing module, and on the other hand, it detects the pressing position on the touch display panel through the touch capacitor layer. There is no need to independently set up pressure sensing drive and capacitive touch drive, which reduces space occupation and allows the electronic device equipped with the touch display module to have sufficient space to set up other devices, thereby reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic structural diagram of a touch display module according to an embodiment of the present application;

[0013] Figure 2 is a schematic diagram of a pressure sensing module;

[0014] Figure 3 This is a schematic diagram of the wiring of the touch display module according to an embodiment of the present application;

[0015] Figure 4 The following is a schematic diagram of the design of two sets of Wheatstone bridges;

[0016] Figure 5 This is one of the schematic diagrams of the position of the pressure-sensitive resistor;

[0017] Figure 6 This is the second schematic diagram of the position of the pressure-sensitive resistor;

[0018] Figure 7 This is the third schematic diagram of the position of the pressure-sensing resistor;

[0019] Figure 8 This is a schematic diagram of the pressure sensing module position before the flexible circuit board is attached;

[0020] Figure 9 This is a schematic diagram of the position of the pressure sensing module after the flexible circuit board is attached;

[0021] Figure 10 This is the fourth schematic diagram of the position of the pressure-sensitive resistor;

[0022] Figure 11 This is the second schematic diagram of the pressure sensing module position before the flexible circuit board is attached;

[0023] Figure 12 A schematic structural diagram of an electronic device according to an embodiment of the present application;

[0024] Figure 13 This is a wiring diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0026] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0027] The touch display module and electronic device provided by the present application are described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios. The shapes and sizes of the printed resistors in the drawings are for illustration only.

[0028] like Figure 1 As shown, a touch display module according to an embodiment of the present application includes:

[0029] A touch display panel 1, wherein the touch display panel 1 includes a touch capacitor layer;

[0030] A flexible circuit board 2 , on which a pressure sensing module 4 and a driver chip 3 are provided, and the pressure sensing module 4 is located between the flexible circuit board 2 and the touch display panel 1 ;

[0031] The driving chip is connected to the pressure sensing module and the touch capacitor layer respectively, and is used to detect the pressed position on the touch display panel through the touch capacitor layer, and to detect the pressed force on the touch display panel through the pressure sensing module.

[0032] In this way, the touch display module of the embodiment of the present application can detect the pressing force on the touch display panel 1 through a pressure sensing module on the one hand, and detect the pressing position on the touch display panel 1 through the touch capacitor layer on the other hand, through a driving chip set on the flexible circuit board 2. There is no need to independently set up pressure sensing drive and capacitive touch drive, which reduces space occupancy and allows the electronic device installed with the touch display module to have sufficient space to set up other devices, thereby reducing costs.

[0033] The driving chip 3 is connected to the pressure sensing module 4 and the touch capacitor layer respectively through the wiring 11 on the flexible circuit board 2 .

[0034] In this embodiment, Figure 1 As shown, the driver chip 3 can also be arranged between the flexible circuit board 2 and the touch display panel 1. Of course, the driver chip can also be arranged on the side of the flexible circuit board away from the touch display panel.

[0035] It should be noted that, in this embodiment, the touch capacitor layer includes a driving electrode, an insulating dielectric layer and a receiving electrode. Among them, the driving electrode and the receiving electrode are on the upper and lower surfaces of the insulating dielectric layer (the driving electrode and the receiving electrode can achieve the same function by exchanging the upper and lower positions), the electrical connection direction of the driving electrode and the receiving electrode is vertical, and the driving electrode and the receiving electrode do not overlap up and down. The capacitance between the driving electrode and the receiving electrode will change when the user touches it, and the driver chip recognizes the pressing position (also known as the touch position) by detecting the change in the capacitance. That is, when a touch occurs, the capacitance of the receiving electrode at the corresponding position will change, and the detected voltage will also change accordingly, so that the touch position can be identified.

[0036] Optionally, in this embodiment, the pressure sensing module includes a pressure sensing resistor and a temperature compensation resistor; wherein,

[0037] The pressure-sensitive resistor includes a first resistor and a second resistor, and the temperature-compensating resistor includes a third resistor and a fourth resistor;

[0038] The first resistor, the second resistor, the third resistor, and the fourth resistor form a first Wheatstone bridge.

[0039] Therefore, if the pressure-sensitive resistor includes a first resistor R2 and a second resistor R3, and the temperature-compensated resistor includes a third resistor R1 and a fourth resistor R4, then R1, R2, R3 and R4 form a Wheatstone bridge, namely a first Wheatstone bridge, as shown in FIG. Figure 2 As shown. Among them, R1, R2, R3 and R4 have the same original resistance value and are made of the same material. When R2 and R3 are deformed by pressure, the resistors will also deform and the resistance value will change significantly, thus causing a significant difference in voltage Vp and Vn. Because R1, R2, R3 and R4 are resistors of the same resistance value and made of the same material, their temperature-dependent systems are the same. Under different temperature conditions, the voltages obtained by Vp and Vn are the same, and the difference is 0. Figure 2 The circuit shown can accurately obtain the corresponding relationship between pressure and voltage at different temperatures.

[0040] Optionally, the pressure-sensing resistor and the temperature-compensating resistor of the pressure-sensing module can be directly printed on the flexible circuit board.

[0041] When the flexible printed circuit (FPC) is directly attached to the back of the screen of the electronic device, the FPC design of the additional pressure sensing module can be omitted.

[0042] In this embodiment, the driver chip periodically sends voltage drive pulses to drive the pressure sensing module and the touch capacitor layer. Specifically, based on the number N of drive electrodes in the touch capacitor layer, the driver chip sends N+1 voltage drive pulses in one cycle, where N voltage drive pulses reach each of the N drive electrodes and one voltage drive pulse reaches the pressure sensing module. The driver chip can send voltage drive pulses at a frequency ranging from tens of hertz (Hz) to over a hundred Hz, and the voltage of the sent voltage drive pulses is generally between a few volts and more than ten volts.

[0043] In the embodiment of this application, Figure 3 As shown, the driver chip includes an I2C interface module, a microprocessor and an on-chip processor, an analog detection receiving (RX) module, a detection driving (TX) module, and a boost (Charge Pump) module. Among them, the microprocessor and the on-chip processor can perform preliminary processing on the collected data; the detection TX module can drive the pressure sensing module and the touch capacitor layer; the analog detection RX module can not only periodically detect the differential voltage of the pressure sensing module and obtain the digitized voltage difference through the ADC, but also periodically detect the voltage change of the touch capacitor layer and obtain the digitized voltage through the ADC; the I2C interface module can communicate with the electronic device's central processing unit (CPU) when installed on the electronic device to transmit information and perform chip settings; the Charge Pump module can generate high voltage to ensure that the pulse voltage amplitude output by the detection TX module is high enough, so that the capacitance change caused by the touch can generate a large enough voltage change, which facilitates the analog detection RX module's ADC to have a sufficient signal-to-noise ratio and accuracy.

[0044] Specifically, the first output terminal of the detection TX module is connected to the driving electrode of the touch capacitor layer, and the second output terminal is connected to R1 and R3 of the pressure sensing module. The first input terminal of the analog detection RX module is connected to the receiving electrode of the touch capacitor layer, the second input terminal is connected to R2 and R3 of the pressure sensing module, and the third input terminal is connected to R3 and R4 of the pressure sensing module.

[0045] In addition, optionally, in this embodiment, the pressure-sensing resistor further includes a fifth resistor and a sixth resistor, and the temperature-compensating resistor further includes a seventh resistor and an eighth resistor;

[0046] The fifth resistor, the sixth resistor, the seventh resistor, and the eighth resistor form a second Wheatstone bridge, and an angle between a central axis of the first Wheatstone bridge and a midline axis of the second Wheatstone bridge is a preset threshold.

[0047] In this way, the impact of the pressing force and deformation on the resistance of the two sets of Wheatstone bridges cannot be exactly the same. This can avoid the problem that when the deformation caused by the pressing force is the same on R1 and R3, or R2 and R4, and the change in their resistance is also the same, the difference in the Wheatstone bridge is 0 and the voltage difference cannot be obtained. The preset threshold is pre-set and can be 45 degrees. For example, Figure 4 As shown, a driving chip 3 and a pressure sensing module 4 are provided on the flexible circuit board (the circuit routing from the pressure sensing module to the driving chip is not drawn in the figure). The pressure sensing module 4 is composed of two groups of Wheatstone bridges, and the angle between the centerline axes of the two groups of Wheatstone bridges is 45 degrees.

[0048] In addition, optionally, in this embodiment, the touch display module further includes:

[0049] Foam is arranged between the touch display panel and the flexible circuit board.

[0050] Optionally, the foam is provided with a first opening at a position corresponding to the pressure sensing module, and a pressure transmission component is provided in the first opening.

[0051] In this way, the pressure-transmitting element greatly increases the deformation generated on the pressure-sensitive resistor when pressed, which helps to improve the sensitivity of the pressure sense.

[0052] Optionally, the pressure transmission member is provided with a groove opening toward the flexible circuit board;

[0053] The pressure-sensing resistor of the pressure-sensing module spans the groove;

[0054] The temperature compensation resistor of the pressure sensing module is located within the range of the vertical projection of the pressure conductive component on the flexible circuit board.

[0055] like Figure 5-9 As shown, after the foam 5 on the back of the touch display panel 1 is opened, a pressure conductive member 6 with a groove 8 etched therein is embedded in the opening of the foam 5. A pressure sensitive resistor 7 is printed on the flexible circuit board 2 at the position corresponding to the groove 8, and the pressure sensitive resistor 7 spans the groove. A temperature compensation resistor 9 is also printed on the flexible circuit board 2 at the corresponding position of the pressure conductive member 6 around the groove, which is equivalent to reusing the flexible circuit board as an FPC of a pressure sensitive module.

[0056] Glue 10 is provided between the touch display panel 1 and the foam 5, and between the flexible circuit board 2 and the foam 5. The flexible circuit board 2 includes a wiring layer 21 and a flexible substrate 22. Wiring 11 is provided on the wiring layer 21. The pressure-sensitive resistor 7 spans the groove 8 of the pressure-transmitting element 6. This means that the length of the pressure-sensitive resistor 7 is greater than the length of the groove 8 in the first direction (i.e., the axial direction of the pressure-sensitive resistor 7).

[0057] It should also be noted that, not shown in the figure, the driver chip is disposed on the flexible circuit board 2 and is connected to the pressure-sensing resistor 7 and the temperature-compensating resistor 9 via the traces 11 on the trace layer 21. The touch capacitor layer within the touch display panel 1 is also connected to the driver chip via the traces 11 on the trace layer 21. In this way, the driver chip is implemented for both the touch capacitor layer and the pressure-sensing module.

[0058] In this embodiment, the pressure transmission member may be a steel sheet.

[0059] It should be noted that in this embodiment, if a pressure transmission element is provided, preferably, only one set of Wheatstone bridges is required. Of course, for a pressure sensing module with two sets of Wheatstone bridges, two pressure transmission elements can also be provided accordingly, which will not be described in detail here.

[0060] Optionally, in this embodiment, the flexible circuit board includes a flexible substrate and a rigid substrate, the rigid substrate is provided with a second opening at a position corresponding to the pressure-sensing resistor of the pressure-sensing module, and the pressure-sensing resistor spans the second opening.

[0061] like Figure 10 As shown, the flexible circuit board 2 includes a wiring layer 21, a flexible substrate 22, and a rigid substrate 23. By providing a second opening 12 on the rigid substrate 23, the position of which corresponds to the position of the pressure-sensing resistor of the pressure-sensing module. This allows the flexible substrate 22 to produce a greater deformation when pressed, thereby causing a greater change in the pressure-sensing resistor 7 and improving the sensitivity of the press.

[0062] Of course, corresponding to the case where the second opening is provided on the rigid substrate, such as Figure 11 As shown, the foam 5 on the back of the screen at the corresponding position of the flexible circuit board 2 is provided with a third opening 13.

[0063] Optionally, in this embodiment, the rigid substrate is located on a side close to the foam, and the flexible substrate is located on a side away from the foam.

[0064] Of course, you can also Figure 10 As described above, the rigid substrate 23 is located on the side away from the foam, while the flexible substrate 22 is located on the side close to the foam.

[0065] It should also be noted that, in this embodiment, the touch display panel may be connected to a display driver chip; the touch display panel may be an OLED panel, which may also be called an OLED screen.

[0066] In summary, the touch display module of the embodiment of the present application can be configured with a driver chip on a flexible circuit board. On the one hand, it can detect the pressing force on the touch display panel through the pressure sensing module, and on the other hand, it can detect the pressing position on the touch display panel through the touch capacitor layer. There is no need to independently configure the pressure sensing drive and the capacitive touch drive, which reduces space occupation and enables the electronic device on which the touch display module is installed to have sufficient space to configure other devices, thereby reducing costs.

[0067] The embodiment of the present application provides an electronic device, comprising: a central processing unit, and the touch display module as described above; wherein,

[0068] The central processing unit is connected to the touch display module.

[0069] In this way, the touch display module of the electronic device can be equipped with a driver chip on the flexible circuit board. On the one hand, it detects the pressing force on the touch display panel through the pressure sensing module, and on the other hand, it detects the pressing position on the touch display panel through the touch capacitor layer. There is no need to independently set up pressure sensing drive and capacitive touch drive, which reduces space occupancy, allows sufficient space inside to set up other devices, and reduces costs.

[0070] like Figure 12 、 13 As shown, the PMIC provides power for the touch display module; the display driver chip connected to the touch display panel, and the driver chip (also called touch driver chip) connected to the touch capacitor layer and the pressure sensing module respectively, can communicate with the CPU to transmit information and perform chip settings.

[0071] The CPU and display driver chip transmit display data and register data via the MIPI interface, along with other control signals such as reset and power control. The CPU and driver chip transmit data via I2C, along with other control signals such as interrupts and reset. These communication interfaces are not limited to the I2C and MIPI interfaces shown; interfaces such as SPI and I3C can also achieve the same functionality.

[0072] The electronic device in the embodiments of the present application may be a terminal or other device other than a terminal. For example, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a mobile internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), an ATM, or an kiosks, etc., and the embodiments of the present application do not specifically limit the above.

[0073] The electronic device in the embodiment of the present application may have an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems.

[0074] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0075] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), including a number of instructions for enabling a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0076] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A touch display module, characterized in that: include: A touch display panel, the touch display panel comprising a touch capacitor layer; A flexible circuit board, wherein a pressure sensing module and a driver chip are provided on the flexible circuit board, and the pressure sensing module is located between the flexible circuit board and the touch display panel; The driver chip is connected to the pressure sensing module and the touch capacitor layer respectively, and is used to detect the pressed position on the touch display panel through the touch capacitor layer, and detect the pressed force on the touch display panel through the pressure sensing module; The flexible circuit board is connected to the touch display panel; Foam, the foam being arranged between the touch display panel and the flexible circuit board; The foam is provided with a first opening at a position corresponding to the pressure sensing module, and a vertical projection of the pressure sensing module toward the touch display panel falls within the first opening.

2. The touch display module according to claim 1, wherein: A pressure transmission component is disposed in the first opening.

3. The touch display module according to claim 2, wherein: The pressure transmission member is provided with a groove opening toward the flexible circuit board; The pressure-sensing resistor of the pressure-sensing module spans the groove; The temperature compensation resistor of the pressure sensing module is located within the vertical projection range of the pressure conductive component on the flexible circuit board.

4. The touch display module according to claim 1, wherein: The flexible circuit board includes a flexible substrate and a rigid substrate. The rigid substrate is provided with a second opening at a position corresponding to the pressure-sensing resistor of the pressure-sensing module, and the pressure-sensing resistor spans the second opening.

5. The touch display module according to claim 4, wherein: The rigid substrate is located on a side close to the foam, and the flexible substrate is located on a side away from the foam.

6. The touch display module according to claim 1, wherein: The pressure sensing module includes a pressure sensing resistor and a temperature compensation resistor; wherein, The pressure-sensitive resistor includes a first resistor and a second resistor, and the temperature-compensating resistor includes a third resistor and a fourth resistor; The first resistor, the second resistor, the third resistor, and the fourth resistor form a first Wheatstone bridge.

7. The touch display module according to claim 6, wherein: The pressure-sensing resistor further includes a fifth resistor and a sixth resistor, and the temperature-compensating resistor further includes a seventh resistor and an eighth resistor; The fifth resistor, the sixth resistor, the seventh resistor, and the eighth resistor form a second Wheatstone bridge, and an angle between a central axis of the first Wheatstone bridge and a midline axis of the second Wheatstone bridge is a preset threshold.

8. An electronic device, characterized in that: include: A central processing unit, and a touch display module according to any one of claims 1 to 7; wherein, The central processing unit is connected to the touch display module.

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