Heat recovery system, method and device

Abstract

The present application discloses a heat recovery system, method and device, which relates to the field of energy-saving technology. The heat recovery system is applied to the cooling system of the server. The cooling system includes a liquid cooling device and an air cooling device. Both the liquid cooling device and the air cooling device are used to cool the server. The heat recovery system includes: a first heating module and a second heating module; the first heating module is used to use the heat of the first cooling liquid of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module; the second heating module is used to use the air cooling device to reheat the preheated specified water flow. Therefore, the embodiment of the present application can heat the specified water flow by using the waste heat of the first cooling water used to cool the server while cooling the server, and then reheat it by the air cooling device, and output the heated water flow so that the heated water flow can be used for other purposes, thereby improving the utilization rate of thermal energy and reducing energy waste.

Description

Technical Field

[0001] The present application relates to the field of energy-saving technology, and more specifically, to a heat recovery system, method and device. Background Art

[0002] With the rapid development of the Internet and communication technology, the term "cloud computing data center" has gradually become well-known. As the scale and capacity of data center construction continue to expand, the energy consumption of data centers has become increasingly prominent. As a result, the energy consumption of data centers has also increased rapidly. The energy consumption of data centers involves many aspects. According to statistics, the energy consumption of air conditioning systems accounts for about one-third of the total energy consumption. However, a large amount of heat energy resources generated by data centers are wasted, resulting in a waste of resources. Summary of the invention

[0003] The present application proposes a heat recovery system, method and device to improve the above-mentioned defects.

[0004] In a first aspect, an embodiment of the present application provides a heat recovery system, which is applied to a cooling system of a server, wherein the cooling system includes a liquid cooling device and an air cooling device, both of which are used to cool the server, and the heat recovery system includes: a first heating module and a second heating module; the first heating module is used to use the heat of the first coolant of the liquid cooling device to preheat a specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module; the second heating module is used to use the air cooling device to secondary heat the preheated specified water flow.

[0005] In the second aspect, an embodiment of the present application also provides a heat recovery method, which is applied to the above-mentioned heat recovery system, and the method includes: controlling the first heating module to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and inputting the preheated specified water flow into the second heating module; controlling the second heating module to use the air cooling device to reheat the preheated specified water flow.

[0006] In a third aspect, the embodiment of the present application further provides a heat recovery device, which is applied to the above-mentioned heat recovery system, and the heat recovery device includes: a first heating unit and a second heating unit. The first heating unit is used to control the first heating module to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module. The second heating unit is used to control the second heating module to use the air cooling device to reheat the preheated specified water flow.

[0007] The heat recovery system, method and device provided by the present application are applied to the cooling system of the server, the cooling system includes a liquid cooling device and an air cooling device, the liquid cooling device and the air cooling device are both used to cool the server, the heat recovery system includes: a first heating module and a second heating module; the first heating module uses the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and inputs the preheated specified water flow into the second heating module, the second heating module uses the evaporator in the air cooling device to reheat the preheated specified water flow, and the reheated specified water flow is used as the output water flow after being heated by the heat recovery system. Therefore, the embodiment of the present application can simultaneously use the waste heat of the first coolant of the liquid cooling device and the waste heat of the second coolant of the air cooling device to heat the specified water flow, so that when cooling the server, the waste heat of the first cooling water used to cool the server is used to heat the specified water flow, and then the air cooling device reheats it again, and outputs the heated water flow, so that the heated water flow can be used for other purposes, thereby improving the utilization rate of thermal energy and reducing energy waste.

[0008] Other features and advantages of the embodiments of the present application will be described in the subsequent description, and partly become apparent from the description, or can be understood by practicing the embodiments of the present application. The purposes and other advantages of the embodiments of the present application can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0010] Figure 1 A schematic diagram of a cooling system provided in an embodiment of the present application is shown;

[0011] Figure 2 A schematic diagram of an air cooling device provided in an embodiment of the present application is shown;

[0012] Figure 3 A schematic diagram of a heat recovery system provided by an embodiment of the present application is shown;

[0013] Figure 4 A schematic diagram of a heat recovery system provided by another embodiment of the present application is shown;

[0014] Figure 5 A schematic diagram of a heat recovery system provided by another embodiment of the present application is shown;

[0015] Figure 6 A schematic diagram of a heat recovery system provided in yet another embodiment of the present application is shown;

[0016] Figure 7 A method flow chart of a heat recovery method provided by an embodiment of the present application is shown;

[0017] Figure 8 A module block diagram of a heat recovery device provided in an embodiment of the present application is shown;

[0018] Fig. 9 A structural block diagram of a computer-readable storage medium provided in an embodiment of the present application is shown;

[0019] Fig.10 A structural block diagram of a computer program product provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0020] In order to make those skilled in the art better understand the present application scheme, the technical scheme in the present application embodiment will be clearly and completely described below in conjunction with the drawings in the present application embodiment. Obviously, the described embodiment is only a part of the present application embodiment, rather than all the embodiments. The components of the present application embodiment usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application for protection, but merely represents the selected embodiment of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0021] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0022] With the rapid development of the Internet and communication technology, the term "cloud computing data center" has gradually become well-known. As the scale and capacity of data center construction continue to expand, the energy consumption of data centers has become increasingly prominent. As a result, the energy consumption of data centers has also increased rapidly. The energy consumption of data centers involves many aspects. According to statistics, the energy consumption of air conditioning systems accounts for about one-third of the total energy consumption. However, a large amount of heat energy resources generated by data centers are wasted, resulting in a waste of resources.

[0023] At present, the relevant regulations have put forward new requirements that the power utilization rate (Power Usage Effectiveness, PUE) of newly built large data centers shall not exceed 1.3, which further regulates the power consumption of data centers. In order to cope with the new market and policy environment, and in order to further reduce PUE, some data centers use immersion liquid cooling to cool down. Among them, the cooling method of immersion liquid cooling is to immerse the server (that is, the data center) as a whole in a special liquid with a low boiling point (about 35°C), insulation, and non-corrosiveness (for example, special oil or fluorinated liquid), and use liquid as a medium to remove the heat generated by electronic devices such as CPU, memory stick, chipset, expansion card, etc. in the server during operation through the design of cold and heat exchange engineering, thereby playing a way to cool down the data center. Therefore, in the environment of immersion liquid cooling, relying on the high heat removal efficiency of the liquid cooling system, the cooling water in the loop of the entire system can reach a relatively high temperature. Therefore, the cooling water temperature on the primary side of the liquid cooling system (used to cool the fluorinated liquid loop) is relatively high, which is more suitable for waste heat recovery for domestic hot water. Therefore, in order to improve equipment utilization and further reduce PUE, some heat recovery technologies for data centers have emerged.

[0024] Specifically, the heat in the low-level cooling water is moved to the high-level domestic hot water, which not only completes the heat dissipation on the cooling side but also completes the temperature increase on the domestic hot water side. This technology is a technology that realizes the transfer of low-level heat energy to high-level heat energy through a small amount of high-level electrical energy input. High-temperature and high-pressure refrigerant comes out of other compressors and enters the condenser. The condensing agent releases heat to the water flow to be heated and cools into a high-pressure liquid, which increases the water temperature. The refrigerant then expands into a low-temperature and low-pressure liquid through the expansion valve, enters the evaporator to absorb the waste heat in the cooling water of the liquid cooling or air cooling system, evaporates into low-pressure steam, and reduces the cooling water temperature. The low-pressure refrigeration steam enters the compressor again and is compressed into a high-temperature and high-pressure gas, and circulates to the condenser in this way.

[0025] However, the inventors found in their research that the above scheme only increases the energy efficiency of the heat pump system by utilizing the high water supply temperature on the condensing side of the heat pump, but the total amount of heat transported by the water source heat pump does not decrease, heat recovery is insufficient, and the energy cost is high.

[0026] Therefore, in order to overcome the above defects, the embodiments of the present application provide a heat recovery system, method and device, which can use liquid cooling and air cooling to cool down the servers in the data center, for example, waste heat can be used to heat the water source, and the heated water can be directly used for other purposes. Figure 1 , Figure 1 The application scenario of the embodiment of the present application is shown, namely, a cooling system of a server. Figure 1 As shown, the cooling system includes a liquid cooling device and an air cooling device, wherein the air cooling device is not Figure 1As shown in the figure, the liquid cooling device includes a liquid cooling host 102, a cooling tower 103, a first pipe 104 and a second pipe 105. The liquid cooling host 102 is used to inject the liquid cooling coolant (which can be named as the first coolant) into the server 101 through the first pipe 104, and the server 101 is immersed in the first coolant as a whole. The first coolant can be the above-mentioned special liquid with low boiling point, insulation and non-corrosiveness. The chassis of the server 101 is provided with a liquid pump, which can recycle the first coolant that absorbs the heat of the server to the cooling tower 103 through the second pipe 105. Among them, the function of the cooling tower 103 is to dissipate heat and replenish water. Specifically, the heat in the entire liquid cycle is dissipated into the air, and the lost water is replenished in time, that is, the first coolant that absorbs the heat of the server is dissipated into the air by the cooling tower 103.

[0027] like Figure 2 As shown, Figure 2 The schematic diagram of the air cooling device in the cooling system of the server is shown. The air cooling device includes: a condenser 201, an expansion valve 202, an evaporator 203 and a compressor 204. The condenser 201, the expansion valve 202, the evaporator 203 and the compressor 204 are connected in sequence. The function of the condenser 201 is to cool the high-pressure and high-temperature gas delivered by the compressor 204 into a high-pressure and high-temperature liquid, and then deliver the cooled liquid to the expansion valve 202. After expansion by the expansion valve 202, it is input into the evaporator 203. The evaporator 203 changes the liquid into gas. The process of liquid vaporization (evaporation) is an endothermic process, that is, the surface of the evaporator is cooled, so the gas flowing through the surface of the evaporator is cold air, which can cool the environment of the server, thereby cooling the server. The running compressor continuously absorbs heat from the evaporator like a water pump. Therefore, after the gas evaporated by the evaporator is compressed by the compressor, it encounters the condenser and becomes liquid again. The heat is dissipated through the condenser, so the temperature near the condenser is higher. Usually, the condenser is outdoors and will not bring heat to the server.

[0028] Therefore, the server can be cooled by the liquid cooling device and the air cooling device of the cooling system to prevent the server from being unable to operate normally due to excessive temperature. The embodiment of the present application utilizes the heat absorbed by the liquid cooling device and the air cooling device when cooling the server to heat water such as municipal water. The heated water can be used for other purposes, for example, as domestic water.

[0029] like Figure 3As shown, an embodiment of the present application provides a heat recovery system, which includes a first heating module 301 and a second heating module 302. The liquid cooling device and the air cooling device are both used to cool the server. The first heating module 301 uses the liquid cooling device to heat the specified water flow, and the second heating module uses the air cooling device to heat the specified water flow, that is, the heat recovery system can use the liquid cooling device and the air cooling device to heat the water flow at the same time, wherein the heating order of the first heating module and the second heating module may not be limited. In the embodiment of the present application, the liquid cooling device is an immersion liquid cooling device. Considering that the server is directly immersed in the first coolant of the liquid cooling device, the first coolant absorbs more heat dissipated by the server. Therefore, the temperature of the first coolant is relatively high, then the first heating module can be used to heat the specified water flow first, and then the second heating module can be used to heat the specified water flow, that is, the liquid cooling device is used to heat the specified water flow first, and then the air cooling device is used to heat the specified water flow. Specifically, refer to the aforementioned Figure 2 It can be known from the air-cooling device shown that when the evaporator of the air-cooling device vaporizes the liquid, the gas transmitted in the pipe of the air-cooling device will absorb the surrounding heat to increase the temperature. Therefore, the evaporator of the air-cooling device can be used to heat the specified water flow. Of course, the condenser of the air-cooling device will also release heat to the outside when condensing the gas, and the dissipated heat can also be used to heat the specified water flow. Specifically, in the subsequent embodiments, they will be explained separately.

[0030] As an implementation mode, a liquid cooling device may be used to heat a designated water flow first and then an air cooling device may be used to heat the designated water flow. The first heating module is used to use the heat of the first coolant of the liquid cooling device to preheat the designated water flow flowing into the first heating module, and the preheated designated water flow is input into the second heating module; the second heating module is used to use the air cooling device to reheat the preheated designated water flow.

[0031] The principle of the first heating module heating the designated water flow is that the first coolant of the liquid cooling device absorbs the heat emitted by the server and the temperature rises. During the recovery of the first coolant, the waste heat of the first coolant can be used to heat the designated water flow. As an implementation method, Figure 4As shown, the first heating module includes a first channel 311 and a second channel 312, and the liquid cooling device is used to input the first coolant that has absorbed the heat emitted by the server into the first channel 311. For example, as mentioned above, the pipeline used by the liquid cooling device to transport the first coolant is the second pipeline 105, and the second pipeline 105 is connected to the first channel 311. The first coolant in the second pipeline 105 that has absorbed the heat emitted by the server flows into the first pipeline 311, and the designated water flow flows into the second channel 312 and flows in the second channel 312. When the designated water flow is in the second channel, it is heated by the heat emitted by the first coolant in the first channel, that is, the heat of the first coolant in the first channel 311 is emitted into the air through the first channel 311 and is absorbed by the designated water flow in the second channel 312, so that the temperature of the designated water flow is increased.

[0032] As an embodiment, the second channel 312 can be a hose, and the second channel 312 is wound around the first channel 311, which can increase the heat exchange between the second channel 312 and the first channel 311. As another embodiment, the first heating module is a plate heat exchanger, and the plate heat exchanger includes a first plate body and a second plate body, and the first plate body and the second plate body are both hollow inside, and the first plate body serves as the first channel, and the second plate body serves as the second channel. The working principle of the plate heat exchanger is through the heat transfer mechanism. According to the laws of thermodynamics, heat is always spontaneously transferred from a high-temperature object to a low-temperature object. Two fluids with different temperatures flow in a space separated by a wall, and heat exchange between the two fluids is promoted through heat conduction of the wall and convection of the fluid on the wall surface.

[0033] As an implementation mode, the number of the first plate body and the second plate body are both multiple, the first plate body and the second plate body are alternately arranged at intervals, the designated fluid flows in the second plate body, the first coolant that has absorbed the heat emitted by the server flows in the first plate body, and the first plate body and the second plate body can both be made of metal. Therefore, when there is a temperature difference between the two fluids, heat must be transferred. During the forced convection heat transfer process of the two fluids with a temperature difference, since the heat exchange plates of the plate heat exchanger are metal plates with a certain corrugated shape, the surface adopts a corrugated wave structure optimization design, so that the heat exchange rate reaches more than 92%, and thin rectangular channels are formed between the plates. Even if the fluid flow rate is below the Reynolds value, the movement of the fluid between the plates is also three-dimensional, which prompts the fluid to form violent turbulence, reduces the boundary layer thermal resistance, and enhances the heat transfer efficiency. It should be noted that multiple first plates can be connected in series, that is, the multiple first plates constitute a first plate combination, the first plate combination includes the first first plate and the last first plate, the plate between the first first plate and the last first plate is used as the middle first plate, the first cooling liquid that has absorbed the heat emitted by the server is input into the first first plate through the second pipe 105, and then passes through the middle first plate in sequence, and is output from the last first plate. Similarly, multiple second plates are also connected in series, the multiple second plates constitute a second plate combination, the second plate combination includes the first second plate and the last second plate, the plate between the first second plate and the last second plate is used as the middle second plate, the designated water flow is input into the first second plate, and then passes through the middle second plate in sequence, and is output from the last second plate. The first cooling liquid dissipates heat to the outside during the flow of the first plate combination, and is absorbed by the designated fluid flowing in the second plate group, and the designated fluid absorbs the heat of the first cooling liquid and is heated. In addition, after the heat of the first cooling liquid is absorbed by the designated water flow, the first cooling liquid can also be recycled to continue cooling the server.

[0034] For example, in order to increase the heat of the first coolant absorbed by the designated fluid, the first flow direction of the first coolant in the first channel can be set opposite to the second flow direction of the designated water flow in the second channel, such as Figure 4 As shown, the first coolant flows from position a to position b, that is, the first coolant is a high-temperature and high-position liquid, and the designated water flow flows from position c to position d, then the designated water flow is a low-position and low-temperature liquid. It can be seen that the flow direction of the first coolant is opposite to the flow direction of the designated water flow, which can increase the heat exchange area between the designated water flow and the first coolant and increase the temperature at which the designated water flow is heated.

[0035] The principle of the second heating module heating the specified water flow is to use the heat absorption or heat release process of the air cooling device to heat the specified water flow. In one embodiment, the heat release process of the air cooling device can be used to heat the specified water flow. Specifically, in combination with the aforementioned Figure 2 The principle of the air cooling device shown is that when the air cooling device cools down the server, the condenser of the air cooling device dissipates heat to the outside, that is, the temperature of the air near the condenser is higher, so a designated water flow can flow through the vicinity of the condenser of the air cooling device, and the heat dissipated by the condenser of the air cooling device is used to heat the designated water flow. For example, a pipeline is built at the condenser of the air cooling device, and the designated water flow flows in the pipeline to absorb the heat dissipated by the condenser of the air cooling device.

[0036] As another embodiment, the designated water flow can be heated by utilizing the heat absorption process of the air cooling device, that is, the second heating module is used to utilize the evaporator of the air cooling device to reheat the designated water flow. Specifically, the second heating module includes a designated condenser. It should be noted that the designated condenser can be the condenser of the aforementioned air cooling device, or a condenser different from the air cooling device. If the condenser of the air cooling device is used, it can save costs. However, considering that there is a cooling liquid such as Freon flowing in the condenser of the air cooling device, which may cause pollution to the designated water flow, the designated condenser of the second heating module may not belong to the air cooling device. Specifically, the second heating module is also used to input the preheated designated water flow output by the first heating module into the designated condenser as the second cooling liquid of the air cooling device; the designated condenser is used to input the second cooling liquid into the evaporator; the evaporator is used to evaporate the second cooling liquid into gas, and input the gas into the designated condenser, and the designated condenser condenses the gas into the designated water flow after reheating, wherein the gas absorbs ambient heat during the transmission to the designated condenser.

[0037] Specifically, combined Figure 2 and Figure 4, the preheated designated water flow output from the d position can flow into the designated condenser 322, and the designated condenser 322 transports the preheated designated water flow to the evaporator 323 through the third pipe 325. The evaporator 323 vaporizes the preheated designated water flow into a designated gas, and the designated gas is transported to the designated condenser 322 through the fourth pipe 325. The designated condenser condenses the gas into a liquid. Since the designated gas absorbs the heat in the air around the fourth pipe 325 during the transportation process of the fourth pipe 325, the water flow obtained after the gas is heated and condensed will be higher in temperature than the preheated designated water flow, which is equivalent to secondary heating of the preheated designated water flow. In addition, the preheated designated water flow can be used as a coolant for the air cooling device when it is heated for the second time, so it can also cool the server. That is to say, the preheated designated water flow is used as a heat absorbing medium for the air cooling device, and the heat that the second heating module needs to carry is greatly reduced, the efficiency of the second heating module is improved, and its power consumption is also reduced accordingly.

[0038] It should be noted that, since the first coolant of the liquid cooling device is in direct contact with the server, the first coolant absorbs more heat emitted by the server, and the temperature of the first coolant is higher. Therefore, the temperature difference of the first heating module is greater than the temperature difference of the second heating module, that is, the temperature difference of the liquid cooling device for the specified water flow is greater than the temperature difference of the air cooling device for the specified water flow. For example, the first heating module can raise the specified water flow from room temperature to the first degree Celsius, and the second heating module can raise the specified water flow to the second degree Celsius, wherein the first degree Celsius can be a temperature value between 38-42, for example, the first degree Celsius is 40 degrees Celsius, and the second degree Celsius is 55 degrees Celsius. Therefore, in some cases, the preheated specified water flow can be used directly, for example, the preheated specified water flow can be directly used as domestic water. Exemplarily, whether the preheated specified water flow is heated twice can be controlled by a through valve.

[0039] As an implementation method, Figure 4 As shown, the second heating module includes a through valve 321, and the second heating module is also used for: when the through valve is in the first conduction state, using the air cooling device to reheat the preheated designated water flow, and the reheated designated water flow is used as the output water flow heated by the heat recovery system; when the through valve is in the second conduction state, outputting the preheated designated water flow as the output water flow heated by the heat recovery system. Specifically, Figure 4As shown, the valve 321 includes a first conduction state and a second conduction state. In the first conduction state, the first water outlet d of the second channel is disconnected from the second water outlet g of the heat recovery system, the first water outlet d of the second channel is connected to the water inlet f of the designated condenser 322, and the third water outlet e of the designated condenser 322 is connected to the second water outlet g of the heat recovery system. Then, in the first conduction state, the preheated designated water flow flowing out from the first water outlet d of the second channel flows into the designated condenser 322 from the water inlet f of the designated condenser 322, and after the preheated designated water flow is heated by the designated condenser 322 and the evaporator 323, it flows out from the third water outlet e of the designated condenser 322, and outputs the final output water flow heated by the heat recovery system through the second water outlet g of the heat recovery system. Furthermore, in order to increase the smoothness of water outlet, the heat recovery system includes a water pump 330, and the outlet of the valve is connected to the second water outlet g of the heat recovery system through the water pump 330, so that the secondary heated designated water flow flowing out of the third water outlet e of the designated condenser 322 is output from the second water outlet g of the heat recovery system under the action of the water pump 330.

[0040] In addition, when the through valve 321 is in the second conduction state, the first water outlet d of the second channel is directly connected to the second water outlet g of the heat recovery system, the first water outlet d of the second channel is disconnected from the water inlet f of the designated condenser 322, and the third water outlet e of the designated condenser 322 is disconnected from the second water outlet g of the heat recovery system. In the second conduction state, the preheated designated water flow flowing out of the first water outlet d of the second channel directly passes through the second water outlet g of the heat recovery system to output the final output water flow heated by the heat recovery system. Therefore, when the through valve 321 is in the second conduction state, the heat recovery system can directly use the water heated by the first heating module as the final output water flow.

[0041] As an embodiment, the conduction state of the through valve 321 can be manually adjusted to the first conduction state or the second conduction state. As another embodiment, the through valve can be controlled by a controller, specifically, as Figure 5 As shown, the heat recovery system also includes a controller, which can be a processor. In addition, the heat recovery system can also include a memory, and one or more applications, wherein the one or more applications can be stored in the memory and configured to be executed by the controller, and the one or more programs are configured to perform control on the conduction state of the through valve.

[0042] The processor 110 may include one or more processing cores. The processor 110 uses various interfaces and lines to connect various parts of the entire electronic device 100, and executes various functions and processes data of the electronic device 100 by running or executing instructions, programs, code sets or instruction sets stored in the memory 120, and calling data stored in the memory 120. Optionally, the processor 110 can be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). The processor 110 can integrate one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), and a modem. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing display content; and the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 110, but may be implemented separately through a communication chip.

[0043] The memory 120 may include a random access memory (RAM) or a read-only memory (ROM). The memory 120 may be used to store instructions, programs, codes, code sets or instruction sets. The memory 120 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as device control, touch function, sound playback function, image playback function, etc.), instructions for implementing the following various method embodiments, etc.

[0044] As an implementation mode, the controller can obtain the climate temperature of the target location, and when the climate temperature of the target location is greater than the specified temperature, the control valve is controlled to be in the second conduction state, and when the climate temperature of the target location is less than the specified temperature, the control valve is controlled to be in the first conduction state. The specified temperature can be set according to actual use requirements. Specifically, when the climate temperature is greater than the specified temperature, the ambient temperature of the surface target location is high, and the temperature of the preheated specified water flow can meet the use requirements of the target location at the climate temperature. Exemplarily, the specified temperature can be a value in the range of 23 to 30 degrees Celsius, for example, the specified temperature can be 25 degrees Celsius. For example, in summer, since users do not need very high temperature domestic hot water, the controller can open the second conduction state of the valve, and directly use preheated 40 degrees Celsius hot water (i.e., preheated specified water flow) to supply water, so as to achieve free heating in summer.

[0045] As another embodiment, the controller can also control the valve to be in the second conduction state according to the target task or data processing volume currently specified by the server. Specifically, the controller obtains the current data processing volume of the server, which can be the size of data processed per unit time. If the data processing volume is greater than the specified amount, the valve is controlled to be in the second conduction state, otherwise, the valve is controlled to be in the first conduction state. The heat generation of the server is positively correlated with the amount of data it processes, that is, the larger the data processing volume, the higher the heat generation of the server. The specified number can be set according to actual experience. Therefore, when the data processing volume is greater than the specified amount, that is, when the data processing volume of the server is large, the heat generation of the server is relatively large, then the temperature of the first coolant of the liquid cooling device is relatively high, that is, the temperature of the preheated specified water flow is relatively high, and it can be used directly without secondary heating by the air cooling device.

[0046] As another embodiment, the controller can obtain the task type of the target task currently running on the server, and when the task type is a specified type, control the valve to be in the second conduction state, otherwise, control the valve to be in the first conduction state. It should be noted that the heat generated by the server when running tasks of different task types is different. For example, when the server is running high-intensity and high-density services such as GPU AI training, the heat generated is higher, while if it is data storage, the heat generated by the server is lower. The specified type can be a task type with a higher heat value that has been pre-counted. Therefore, when the server is running a task of a specified type, considering the high heat value of the server, the temperature of the first coolant of the liquid cooling device is relatively high, that is, the temperature of the preheated specified water flow is relatively high, and can be used directly without secondary heating by the air cooling device.

[0047] It should be noted that the above three methods (ie, the climate temperature of the target location, the task type of the target task, and the data processing volume) can be used alone or in any combination, and the details will not be repeated here.

[0048] As an implementation method, Figure 6 As shown, the heat recovery system may further include a filter module 340, which is connected to the first heating module. The filter module is used to filter the water flowing into the filter module, and use the filtered water as the designated water flow and introduce it into the first heating module. The filter module is specifically used to filter out impurities in the designated water flow and desalinate the designated water flow to meet the user's use of the designated water flow.

[0049] It should be noted that, according to simple economic calculations, the energy cost of the heat recovery system provided in the embodiment of the present application is only 40% to 50% of the energy cost of the traditional heat recovery solution, and only 10% to 20% of the energy cost of the traditional boiler solution (without heat recovery). Specifically, as shown in Table 1:

[0050] Table 1

[0051]

[0052] Therefore, the heat recovery system provided in the embodiment of the present application fully recovers heat from the air-cooled and liquid-cooled cooling water loops, integrates the two systems of air-cooled and liquid-cooled, and uses the high-temperature liquid-cooled waste heat for preheating the designated water flow, and the low-temperature air-cooled waste heat provides a heat source for secondary heating of the designated water flow. The power consumption of the waste heat recovery system is significantly saved, and the energy cost is saved by 60% compared with the traditional water source heat pump heat recovery solution, and the energy cost is saved by 80% compared with the traditional gas boiler system (refer to Table 1). The compact and modular design allows the product to be used as it arrives, with a small footprint and without the need for a lot of construction and modification. The existing water-cooled system pipes / cooling towers / water pumps, etc. can be directly used, with a small amount of engineering, low modification costs, and low modification resistance. All systems are independent closed systems with clear hydraulic balance and stable operation. The entire system is equivalent to having one more cooling tower as a backup, which improves system availability. Adding a bypass achieves free heating in summer.

[0053] See also Figure 7 , Figure 7 A control method provided by an embodiment of the present application is shown, which is applied to the above-mentioned heat recovery system. Specifically, the heat recovery system may include a controller, and the controller is connected to the first heating module, the through valve and the second heating module. The execution subject of the method may be the controller, and the method includes: S701 to S702.

[0054] S701: Control the first heating module to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module.

[0055] As an embodiment, the controller can control a specified water flow to flow into the first heating module, for example, by controlling the specified water flow to flow into the first heating module through a valve. The controller can also control the first coolant to flow into the first heating module.

[0056] S702: Utilize the air cooling device to reheat the preheated designated water flow.

[0057] As an embodiment, the controller may control the preheated designated water flow to flow into the second heating module, for example, by controlling the designated water flow to flow into the second heating module through a valve.

[0058] Specifically, the control device controls the conduction state of the through valve; when the through valve is in the first conduction state, the air cooling device is used to secondary heat the preheated designated water flow, and the secondary heated designated water flow serves as the output water flow heated by the heat recovery system; when the through valve is in the second conduction state, the preheated designated water flow is output as the output water flow heated by the heat recovery system.

[0059] See also Figure 8 , which shows a structural block diagram of a heat recovery device 800 provided in an embodiment of the present application, the heat recovery device 800 is applied to the above-mentioned heat recovery system, specifically, the heat recovery system may include a control device, the control device is connected to the first heating module, the through valve and the second heating module. The heat recovery device may be a program module in the controller, and the heat recovery device 800 may include: a first heating unit 801 and a second heating unit 802.

[0060] The first heating unit 801 is used to control the first heating module to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module.

[0061] The second heating unit 802 is used to control the second heating module to use the air cooling device to reheat the preheated specified water flow.

[0062] The heat recovery device 800 further includes a control unit for controlling the conduction state of the control valve of the device.

[0063] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and modules can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here.

[0064] In several embodiments provided in the present application, the coupling between modules may be electrical, mechanical or other forms of coupling.

[0065] In addition, each functional module in each embodiment of the present application can be integrated into a processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or software functional modules.

[0066] Please refer to Fig. 9 , which shows a structural block diagram of a computer-readable storage medium provided in an embodiment of the present application. The computer-readable medium 900 stores program codes, which can be called by a processor to execute the method described in the above method embodiment.

[0067] The computer-readable storage medium 900 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read-only memory), an EPROM, a hard disk, or a ROM. Optionally, the computer-readable storage medium 900 includes a non-transitory computer-readable storage medium. The computer-readable storage medium 900 has storage space for program code 910 that performs any method step in the above method. These program codes can be read from or written to one or more computer program products. The program code 910 can be compressed, for example, in an appropriate form.

[0068] Please refer to Fig.10 , which shows a structural block diagram of a computer program product 1000 provided in an embodiment of the present application. The computer program product 1000 includes a computer program / instruction 1010, and when the computer program / instruction 1010 is executed by a processor, the steps of the above method are implemented.

[0069] In summary, the heat recovery system, method and device provided by the present application meet the actual needs of the new large data center, and utilize the waste heat of air-cooled servers and liquid-cooled servers at the same time. The waste heat of the liquid cooling system and the air cooling system is recycled and utilized to the maximum extent according to the economic calculation, which is more energy-saving and produces greater economic benefits than the original solution. At the same time, the highly integrated and modular product design makes the equipment occupy a very small area, which is conducive to rapid deployment and production in the data center.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat recovery system, characterized in that: A cooling system applied to a server, the cooling system comprising a liquid cooling device and an air cooling device, both of which are used to cool the server, the liquid cooling device is an immersion liquid cooling device, the server is immersed in a first cooling liquid of the liquid cooling device, the heat recovery system comprises: a first heating module, a second heating module and a control device, the second heating module comprises a through valve, and the control device is connected to the through valve; The first heating module is used to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module; The second heating module is used to reheat the preheated designated water flow by using the air cooling device; The second heating module comprises a through valve, and the second heating module is further used for: When the through valve is in the first conducting state, the air cooling device is used to reheat the preheated designated water flow, and the reheated designated water flow is used as the output water flow after being heated by the heat recovery system; When the through valve is in the second conducting state, the preheated designated water flow is output as the output water flow heated by the heat recovery system; The control device is used to control the through valve to be in the second conduction state when the target condition is met, otherwise, control the through valve to be in the first conduction state; The target conditions include at least one of the following: the climate temperature of the target location is greater than a specified temperature, the current data processing volume of the server is greater than a specified amount, and the task type of the target task currently running on the server is a specified type.

2. The heat recovery system according to claim 1, characterized in that: The first heating module includes a first channel and a second channel. The liquid cooling device is used to input the first coolant that has absorbed the heat emitted by the server into the first channel. When the designated water flow is in the second channel, it is heated by the heat emitted by the first coolant in the first channel.

3. The heat recovery system according to claim 2, characterized in that: A first flow direction of the first coolant in the first channel is opposite to a second flow direction of the designated water flow in the second channel.

4. The heat recovery system according to claim 2, characterized in that: The first heating module is a plate heat exchanger, which includes a first plate body and a second plate body. The first plate body and the second plate body are both hollow inside. The first plate body serves as a first channel, and the second plate body serves as a second channel.

5. The heat recovery system according to claim 1, characterized in that: The air cooling device includes an evaporator, and the second heating module includes a designated condenser; The second heating module is also used to input the preheated designated water flow output by the first heating module into the designated condenser as the second coolant of the air cooling device; The designated condenser is used to input the second coolant into the evaporator; The evaporator is used to evaporate the second coolant into gas, and input the gas into the designated condenser, which condenses the gas into a designated water flow after secondary heating, wherein the gas absorbs ambient heat during the process of being transmitted to the designated condenser.

6. The heat recovery system according to claim 1, characterized in that: It also includes a filtering module, which is connected to the first heating module. The filtering module is used to filter the water flowing into the filtering module and use the filtered water as the designated water flow and introduce it into the first heating module.

7. A heat recovery method, characterized in that: Applied to the heat recovery system according to any one of claims 1 to 6, the method comprises: Controlling the first heating module to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and inputting the preheated specified water flow into the second heating module; The air cooling device is used to reheat the preheated designated water flow.

8. The method according to claim 7, characterized in that Also includes: Control the conduction state of the through valve; When the through valve is in the first conducting state, the air cooling device is used to reheat the preheated designated water flow, and the reheated designated water flow is used as the output water flow after being heated by the heat recovery system; When the through valve is in the second on state, the preheated designated water flow is output as the output water flow heated by the heat recovery system.

9. A heat recovery device, characterized in that: Applicable to the heat recovery system according to any one of claims 1 to 6, the heat recovery device comprises: a first heating unit, used to control the first heating module to use the heat of the first coolant of the liquid cooling device to preheat the specified water flow flowing into the first heating module, and input the preheated specified water flow into the second heating module; A second heating unit, used for controlling the second heating module to use the air cooling device to reheat the preheated designated water flow; The second heating module includes a through valve, and the second heating unit is further used for: When the through valve is in the first on state, the second heating module is controlled to use the air cooling device to reheat the preheated designated water flow, and the reheated designated water flow serves as the output water flow heated by the heat recovery system; When the through valve is in the second on state, the preheated designated water flow is output as the output water flow heated by the heat recovery system.

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