A novel BH composite sensing structure based on monolithic measurement

Abstract

A novel B-H composite sensing structure based on single-chip measurement includes a clamping device, a tangential coil composite sensor, a Hall element composite sensor, an excitation device, and a magnetic yoke. The tangential coil composite sensor and the Hall element composite sensor are respectively fixed to two clamping plates of the clamping device. A sample to be tested is placed centrally between the tangential coil composite sensor and the Hall element composite sensor, with the measurement area being the middle of the sample. The clamping plates bring the tangential coil composite sensor and the Hall element composite sensor into close proximity and clamp the sample to be tested. The excitation device is a hollow rectangular cylinder made of insulating material with an excitation coil evenly wound on its surface. The magnetic yoke is placed horizontally in the center of the excitation device, and the sample to be tested passes horizontally through the excitation device, with the edge of the sample clamped at the contact point of the magnetic yoke. This material-saving device is simple and easy to disassemble. It can measure a variety of materials and can detect temperature and pressure while measuring the magnetic properties of the sample. The device has high feasibility.

Description

Technical Field

[0001] The present invention relates to the field of magnetic property measurement, in particular to a new BH complex sensing structure based on single sheet tester (Design of a New BH Complex Sensing Structure Based on Single Sheet Tester). Background Art

[0002] Currently, the more common method for measuring magnetic properties is to wind the acquisition coil directly on the surface of the sample and measure the magnetic properties by obtaining the voltage signal.

[0003] The principle of traditional BH sensors is to apply electromagnetic induction. It is not easy to wind multiple turns of measurement coils evenly on the sample, and there is no guarantee that all the coils will fit the sample. The device is complex to manufacture and difficult to disassemble. Measurements of different materials require uniformly wound coils, which greatly increases the workload. During the measurement process, the sample is subject to changes in temperature and stress, which traditional sensors cannot detect. The resulting errors in the measurement data cannot be ignored. Summary of the Invention

[0004] The purpose of the present invention is to provide a novel BH composite sensing structure based on monolithic measurement, which can overcome the shortcomings of the prior art and is a composite sensing structure with a simple structure and easy implementation.

[0005] The technical solution of the present invention is: a new BH composite sensing structure based on single-chip measurement, characterized in that it includes a clamping device, a tangential coil composite sensor, a Hall element composite sensor, an excitation device and a magnetic yoke; wherein the clamping device includes two clamping plates; the tangential coil composite sensor and the Hall element composite sensor are respectively fixed to the two clamping plates of the clamping device; a sample to be tested is placed centrally between the tangential coil composite sensor and the Hall element composite sensor, and the measurement area is the middle position of the sample; the clamping plates make the tangential coil composite sensor and the Hall element composite sensor close to and clamp the sample to be tested; the excitation device is a hollow rectangular cylinder made of insulating material, the surface of which is evenly wound with an excitation coil, and the sample to be tested is horizontally placed in the center thereof; the magnetic yoke is placed horizontally in the center of the excitation device, the sample to be tested passes horizontally through the excitation device, and the edge of the sample is clamped at the joint of the magnetic yoke.

[0006] The clamping device consists of a movable clamping plate and a fixed clamping plate.

[0007] The movable splint is driven to move relative to the fixed splint through the meshing gear and the rack; the gear is connected to the knob passing through the mounting hole of the fixed plate, and the rack is connected to the movable splint. When the knob is turned, the knob controls the gear to drive the movable splint to move through the rack, cooperating with the fixed splint to play a clamping role; the fixed splint is connected to the fixed plate.

[0008] The fixed plate and the movable clamping plate are respectively provided with sliding blocks and guide rails that are in sliding fit.

[0009] Two guide rails are symmetrically fixedly installed on one side of the fixed plate installation clamping plate; the two guide rails are respectively slidably fitted with two sliders installed on the movable clamping plate, and the two sliders maintain mutually horizontal positions.

[0010] The pin fixing block is installed on the fixing plate. After the knob is rotated to a suitable position, a fixing pin is used to pass through the through hole of the pin fixing block to hold the knob so that the knob part does not loosen.

[0011] The movable clamping plate and the fixed clamping plate are both provided with openings at corresponding positions, and the upper and lower magnetic yokes pass through the clamping plates to form a fit.

[0012] The Hall element composite sensor is composed of a double-layer insulating plate I, a Hall element sensor, a temperature sensor, and a pressure sensor; an interlayer I is provided between the upper and lower insulating plates of the double-layer insulating plate I; the Hall element, temperature sensor, and pressure sensor are fixed in the interlayer I of the double-layer insulating plate I and installed in the slots on the layer plate on the side of the double-layer insulating plate I corresponding to the test sample, close to the sample to be tested.

[0013] A gasket is placed in the slot, and the positions of the Hall element sensor, temperature sensor and pressure sensor are adjusted by the gasket so that they are parallel to the outer surface of the layer of the double-layer insulation board and as close to the sample to be tested as possible; the interlayer I of the double-layer insulation board I has an interlayer gap and an outlet for leading out signal lines; the double-layer insulation board I is fixedly installed on the clamping device.

[0014] The Hall element composite sensor includes one Hall sensor, two temperature sensors and two pressure sensors; the Hall element sensor is a Hall element sensor with model SS496A1, whose power pin VDD is connected to an external power supply, the ground pin GND signal line is grounded, and the output pin OUT is connected to an external data acquisition card through a signal line; the two temperature sensors and the two pressure sensors are fixed in a symmetrical relationship at the four corners of the interlayer I of the double-layer insulation board I, and the temperature sensors and the pressure sensors are diagonally distributed.

[0015] The tangential coil composite sensor consists of a double-layer insulation board II, a tangential coil sensor, a temperature sensor, and a pressure sensor; there is an interlayer II between the upper and lower insulation boards of the double-layer insulation board II; the tangential coil sensor, temperature sensor, and pressure sensor are fixed in the interlayer II of the double-layer insulation board II and installed in the slot on the layer board on the side of the double-layer insulation board II corresponding to the test sample, close to the sample to be tested.

[0016] A gasket is placed in the slot, and the position of the tangential coil sensor, temperature sensor and pressure sensor is adjusted by the gasket so that they are parallel to the outer surface of the layer of the double-layer insulation board and as close to the sample to be tested as possible; the interlayer II of the double-layer insulation board II has an interlayer gap and an outlet for leading out signal lines; the double-layer insulation board II is fixedly installed on the clamping device.

[0017] The tangential coil composite sensor includes one tangential coil sensor, two temperature sensors, two pressure sensors and a gasket; the tangential coil sensor is fixedly installed in the middle position of the interlayer II of the double-layer insulation board II; the tangential coil sensor is a thin sheet structure, its material is the same as the sample to be tested, and a signal coil is evenly wound on its surface, and its signal line is connected to an external data acquisition card; the two temperature sensors and two pressure sensors are symmetrically fixed at the four corners of the interlayer II of the double-layer insulation board II, and the temperature sensors and pressure sensors are diagonally distributed.

[0018] The temperature sensors are all K-type patch temperature sensors, and the signal lines of their two pins are connected to the external temperature controller; the pressure sensors are IMS-540A resistive thin film voltage sensors, and the signal lines of their two pins are connected to the external pressure conversion module, and then connected to the data acquisition card through the conversion module.

[0019] The sample to be tested is horizontally placed in the middle of the tangential coil composite sensor and the Hall element composite sensor, and the tangential coil composite sensor and the Hall element composite sensor are brought close to the sample and clamped by adjusting the knob.

[0020] The excitation device is a hollow rectangular cylindrical structure made of insulating material, with an excitation coil evenly wound on its surface. The sample to be tested is placed horizontally and centered in the hollow rectangular cylindrical structure; the magnetic yoke is made of a pair of U-shaped magnetic yoke openings that are matched with each other; the excitation structure is placed horizontally and centered in the magnetic yoke matching opening; the sample to be tested passes horizontally through the excitation structure, and its edge is clamped at the fitting point of the pair of U-shaped magnetic yokes.

[0021] Working principle of the present invention: The present invention includes a magnetic yoke, an excitation system, a sensing system, a data processing system and a temperature and pressure measurement system. The excitation device is a hollow rectangular cylinder made of insulating material, with 400 turns of excitation coil evenly wound on its surface. The sample to be tested is placed horizontally and centered inside it. The magnetic yoke is a pair of U-shaped yokes made of oriented silicon steel, with the openings aligned with each other. The excitation device is placed horizontally and centered at the yoke's joint. The sample to be tested passes horizontally through the excitation device, with the edge of the sample clamped at the joint of the U-shaped yoke to prevent magnetic leakage and magnetic shielding, and the magnetic field is controlled to be a one-dimensional uniform magnetic field. The sensing system uses a self-made new BH composite sensing structure that controls the upper and lower clamping plates of the clamping device to adhere tightly to the surface of the sample to collect voltage, temperature, and pressure signals. The data processing system consists of a data acquisition card, a data acquisition program written in LabVIEW software, and a temperature and pressure measurement system. The voltage signals collected by the tangential coil composite sensor and the Hall element composite sensor are subjected to a series of calculations to generate a hysteresis loop, thereby obtaining the coercive force, remanence, and magnetic loss of the sample. The temperature and pressure measurement system is connected to an external temperature controller and a pressure conversion module via leads.

[0022] Advantages of the present invention:

[0023] (1) A Hall element sensor is used to measure the magnetic field intensity H, and a tangential coil sensor is used to measure the magnetic induction intensity B. The Hall element sensor has high precision, good linearity, wide bandwidth, fast response, and is resistant to high temperature and high pressure. At the same time, the use of the Hall element sensor reduces the impact of the inaccurate ampere-turns of the H coil caused by extrusion on the final experimental results.

[0024] (2) There are gaps around the double-layer composite insulation board, which facilitates the smooth lead-out of the sensor's signal line and power line. There will be no problem of inaccurate measurement caused by components pressing the line, which solves the current difficulty of lead-in and can separate the 220V, 50Hz AC power supply line from the sensor line, reducing the influence of the power signal on the measurement.

[0025] (3) It can ensure that the tangential coil sensor and the Hall element sensor are completely close to the sample surface, and meet the H 1t =H 2t and B 1n =B 2n The boundary conditions make the measurement data more accurate. In addition, the measurement area of ​​the tangential coil sensor and the Hall element sensor is still the center area of ​​the sample surface, which makes the measurement data more accurate.

[0026] (4) By controlling the knob of the clamping device to apply different degrees of clamping force, a pressure sensor is used to control the clamping force on the sample to create different pressure environments. The temperature sensor can be used to measure the temperature distribution of the sample under different pressures, solving the problem that traditional sensors cannot measure the temperature of the sample.

[0027] (5) The device is simple and easy to disassemble, and can measure a variety of materials. It can detect temperature and pressure while measuring the magnetic properties of the sample. The device has high feasibility. Currently, based on the design idea of ​​this device, the magnetic property measurement method is gradually being extended to two dimensions. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the position structure of a new BH composite sensing structure based on monolithic measurement and a monolithic excitation device involved in the present invention.

[0029] Figure 2 This is a schematic diagram of the overall structure of a new BH composite sensing structure based on single-chip measurement involved in the present invention.

[0030] Figure 3 This is a side schematic diagram (right view) of a novel BH composite sensing structure based on single-chip measurement involved in the present invention.

[0031] Figure 4 This is a schematic diagram of the structural coordination between the Hall element composite sensor and the lower clamping plate of the clamping device in a new BH composite sensing structure based on monolithic measurement according to the present invention.

[0032] Figure 5 This is a schematic diagram of the cooperation between the tangential coil composite sensor and the upper clamping plate of the clamping device in a new BH composite sensing structure based on monolithic measurement involved in the present invention (the actual situation is that the schematic diagram is flipped 180°, the notch is horizontally downward, and the cavity of the clamping plate is aligned with the cavity of the lower clamping plate).

[0033] Figure 6 The figure is a structural schematic diagram of a monolithic measurement device in a novel BH composite sensing structure based on monolithic measurement according to the present invention.

[0034] Figure 7 This is a structural schematic diagram of a novel BH composite sensing structure based on single-chip measurement and a sample to be measured involved in the present invention.

[0035] Figure 8 This is a structural schematic diagram (left view) of a clamping device and double-layer insulating plates I and II of a new BH composite sensing structure based on single-chip measurement involved in the present invention.

[0036] Figure 9 This is a schematic diagram (top view) of the knob controlling the movement of the upper clamping plate of a clamping device with a novel BH composite sensing structure based on single-chip measurement according to the present invention.

[0037] Figure 10 This is a schematic diagram of a knob control device of a clamping device with a novel BH composite sensing structure based on single-chip measurement according to the present invention.

[0038] Figure 11 This is a schematic diagram of the upper and lower clamping plates of a novel BH composite sensing structure based on single-chip measurement involved in the present invention, the sample to be measured, the hollow insulating column and the single U-shaped magnetic yoke.

[0039] Figure 12 This is a schematic diagram (top view) of the upper and lower clamping plates, the sample to be measured and the hollow insulating column of a new BH composite sensing structure based on single-chip measurement involved in the present invention.

[0040] In the figure: 1. Monolithic excitation device; 2. Composite sensing structure; 3. Hall element composite sensor; 4. Tangential coil composite sensor; 5. Temperature sensor (four identical ones); 6. Pressure sensor (four identical ones); 7. Tangential coil sensor; 8. Upper clamping plate; 9. Lower clamping plate; 10. Gear; 11. Rack; 12. Fixed plate; 13. Slider; 14. Guide rail; 15. Knob; 16. Fixed pin; 17. Pin fixing block; 18. Hollow; 19. Hollow insulating column; 20. Sample to be tested; 21. U-shaped magnetic yoke; 22. Gap in the insulating plate interlayer; 23. Hall element sensor; 24. Clamping device; 25. Double-layer insulating plate I; 26. Interlayer I; 27. Double-layer insulating plate II; 28. Interlayer II. DETAILED DESCRIPTION

[0041] Example: Figures 1 to 12 As shown, the present invention provides a novel BH composite sensing structure device 2 (referred to as the composite sensing structure) based on monolithic measurement. The composite sensing structure comprises a tangential coil composite sensor, a Hall element composite sensor, a knob-controlled clamping device, and a standard monolithic excitation device 1. The tangential coil composite sensor includes a double-layered insulating plate II 27, a tangential coil sensor 7, two temperature sensors 5, and two pressure sensors 6; the Hall element composite sensor includes a double-layered insulating plate I 25, a Hall element sensor 23, two temperature sensors 5, and two pressure sensors 6.

[0042] like Figure 2 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10As shown, the knob-controlled clamping device 24 consists of an upper clamping plate 8, a lower clamping plate 9, a gear 10, a rack 11, a fixed plate 12, a slider 13, a guide rail 14, a knob 15, a fixing pin 16 and a pin fixing block 17; wherein the fixed plate 12 has a through hole in the middle, and the knob 15 with a limit hole passes through the through hole and is connected to the gear 10; two guide rails 14 are fixed to the edge of one side of the fixed plate 12 with the gear 10, and the two guide rails 14 are respectively equipped with sliding-fitting sliders 13 and kept horizontally corresponding to each other; the upper clamping plate 8 is fixedly connected to the two sliders 13, and the lower clamping plate 9 is fixed to the fixed plate 12; the rack 11 is fixed to the upper clamping plate 8 and meshes with the gear 10; as shown Figure 10 As shown, pin-fixing block 17 is mounted on fixed plate 12. After knob 15 is rotated to the appropriate position, fixing pin 16 is inserted through the through-hole of pin-fixing block 17 to hold knob 15 in place, preventing the knob from loosening. Rotating knob 15 drives gear 10 meshing with rack 11, which in turn drives upper clamping plate 8 to move on guide rail 14 via a slider, clamping it against fixed lower clamping plate 9. A pair of holes 18 are located in corresponding positions on the upper and lower clamping plates, through which upper and lower U-shaped yokes 21 pass to form a tight fit.

[0043] The excitation device is a hollow insulating column 19 with 400 turns of excitation coil evenly wound on its surface. The sample 20 to be tested is 500mm*300mm*1mm and is placed horizontally and centered in it. The U-shaped yoke 21 is a pair made of oriented silicon steel. The openings of the pair of U-shaped yokes 21 are aligned with each other. The excitation device is placed horizontally and centered in the yoke alignment opening. The sample 20 to be tested passes horizontally through the excitation device, and the edge of the sample is clamped at the joint of the U-shaped yoke 21. Figure 6 shown.

[0044] The structure of the Hall element composite sensor 3 is as follows: a Hall element sensor 23 is fixedly mounted in the middle position of the interlayer Ⅰ 26 of the double-layer insulating plate Ⅰ 25, and two temperature sensors 5 and two pressure sensors 6 are fixedly mounted at the four corners. The temperature sensors 5 and the pressure sensors 6 are diagonally distributed. At the same time, grooves are opened at the corresponding positions of the three sensors on the upper insulating plate, and the gaskets are used to properly raise them parallel to the outer surface of the upper insulating plate. The signal line is led out through the gap 22 of the insulating plate interlayer and the interlayer Ⅰ 26 without contact. The double-layer insulating plate Ⅰ 25 is fixed on the upper surface of the lower clamping plate 9 of the clamping device to contact the sample 20 to be tested, with the groove opening facing upward, as shown in FIG. Figure 4 shown.

[0045] The structure of the tangential coil composite sensor 4 is to fix a tangential coil sensor 7 in the middle position of the interlayer II 28 of the double-layer insulating plate II 27, and fix two temperature sensors 5 and two pressure sensors 6 at the four corners. The temperature sensors 5 and pressure sensors 6 are diagonally distributed, and the distribution positions are the same as those of the temperature sensors 5 and pressure sensors 6 on the lower clamping plate 9. At the same time, grooves are cut at the corresponding positions of the three sensors on the insulating plate, and gaskets are used to properly raise them parallel to the outer surface of the upper insulating plate. The signal line is led out through the gap 22 of the insulating plate interlayer and the interlayer II 28 without contact. The double-layer insulating plate II 27 is fixed to the lower surface of the upper clamping plate 8 of the clamping device and contacts the sample 20, with the groove opening facing downward, as shown in FIG. Figure 5 shown.

[0046] The spatial positions of the temperature sensor 5 and the pressure sensor 6 located on the upper clamping plate 8 correspond to the pressure sensor 6 and the temperature sensor 5 of the lower clamping plate 9 respectively. The tangential coil sensor 7 of the upper clamping plate 8 corresponds to the Hall element sensor 4 of the lower clamping plate 9. The measurement position is the central area of ​​the sample.

[0047] The model of the Hall element sensor 23 is SS496A1, a power pin VDD thereof is connected to an external power supply, a ground pin GND signal line is grounded, and an output pin OUT is connected to an external data acquisition card through a signal line.

[0048] The temperature sensor 5 is a K-type patch temperature sensor, and the signal wires of the two pins are connected to the external temperature controller close to the clamping plate.

[0049] The pressure sensor 6 is an IMS-540A resistive thin film voltage sensor. The signal lines of the two pins are connected to the external pressure conversion module close to the clamping plate, and then connected to the data acquisition card through the conversion module.

[0050] The tangential coil sensor 7 is made of the same magnetic material as the sample 20 to be tested. The sheet is 100mm*50mm*0.5mm, and 150 turns of 0.4mm signal coil are evenly wound on the surface of the sheet.

[0051] The size of the Hall element sensor 23 is 7mm*5mm*1.5mm; the size of the temperature sensor 5 is 18mm*11mm*1mm; the size of the pressure sensor 6 is 40mm*40mm*1mm; the size of the double-layer insulation board I 25 and the double-layer insulation board II 27 are 200mm*200mm*5mm, with a wall thickness of 1mm, and there are rectangular interlayer gaps 22 of 20mm*10mm on all four sides. The openings of the two small rectangles inside for placing the temperature sensor 5 are 20mm*15mm, and the opening of the slightly larger rectangle inside for placing the pressure sensor 6 is 50mm*50mm; the middle opening of the double-layer insulation board I 25 for placing the Hall element sensor 23 is a circle with a diameter of 50mm, and the middle opening of the double-layer insulation board II 27 for placing the tangential coil sensor 7 is a rectangular opening of 110mm*60mm.

[0052] The Hall element sensor 23 measures the magnetic flux density in the air on the surface of the sample, and then H air =B air / μ0, the magnetic field strength value at that position can be obtained. According to the continuity condition of the tangential component of the magnetic field strength at the interface of different media, the magnetic field strength on the surface of the sample 20 to be tested is equal to H air ; The tangential coil sensor 7 integrates the collected voltage signal to obtain the magnetic flux density of the air on the surface of the sample. According to the boundary conditions, the magnetic flux density on the surface of the iron core is equal to the measured value; the temperature sensor 5 is directly connected to the external temperature controller through a signal line to read real-time temperature changes; the signal line of the pressure sensor 6 is connected to the external pressure signal conversion module, and then the pressure value is read in real time through the conversion module.

[0053] The composite sensing structure 2 applies different degrees of clamping force by controlling the knob 15 of the clamping device, uses the pressure sensor 6 to control the clamping force on the sample 20 to create different pressure environments, and uses the temperature sensor 5 to measure the temperature distribution of the sample under different pressures.

Claims

1. A novel BH composite sensing structure based on monolithic measurement, characterized by It includes a clamping device, a tangential coil composite sensor, a Hall element composite sensor, an excitation device and a magnetic yoke; wherein the clamping device includes two clamping plates; the tangential coil composite sensor and the Hall element composite sensor are respectively fixed to the two clamping plates of the clamping device; a sample to be tested is placed centrally between the tangential coil composite sensor and the Hall element composite sensor, and the measurement area is the middle position of the sample; the clamping plates make the tangential coil composite sensor and the Hall element composite sensor close to and clamp the sample to be tested; the excitation device is a hollow rectangular cylinder made of insulating material, with an excitation coil evenly wound on its surface, and the sample to be tested is horizontally placed in the center thereof; the magnetic yoke is placed horizontally in the center of the excitation device, and the sample to be tested passes horizontally through the excitation device, with the edge of the sample clamped at the joint of the magnetic yoke; The Hall element composite sensor is composed of a double-layer insulating plate I, a Hall element sensor, a temperature sensor, and a pressure sensor; an interlayer I is provided between the upper and lower insulating plates of the double-layer insulating plate I; the Hall element, temperature sensor, and pressure sensor are fixed in the interlayer I of the double-layer insulating plate I and mounted in the slot on the layer of the double-layer insulating plate I on the side corresponding to the test sample, close to the sample to be tested; The tangential coil composite sensor consists of a double-layer insulation board II, a tangential coil sensor, a temperature sensor, and a pressure sensor; there is an interlayer II between the upper and lower insulation boards of the double-layer insulation board II; the tangential coil sensor, temperature sensor, and pressure sensor are fixed in the interlayer II of the double-layer insulation board II and installed in the slot on the layer board on the side of the double-layer insulation board II corresponding to the test sample, close to the sample to be tested.

2. A novel BH composite sensing structure based on monolithic measurement according to claim 1, characterized in that The clamping device consists of a movable clamping plate and a fixed clamping plate.

3. A novel BH composite sensing structure based on monolithic measurement according to claim 2, characterized in that The movable splint is driven to move relative to the fixed splint through the meshing gear and the rack; the gear is connected to the knob passing through the mounting hole of the fixed plate, and the rack is connected to the movable splint. When the knob is turned, the knob controls the gear to drive the movable splint to move through the rack, cooperating with the fixed splint to play a clamping role; the fixed splint is connected to the fixed plate.

4. The novel BH composite sensing structure based on monolithic measurement according to claim 2, characterized in that Sliding blocks and guide rails are respectively installed on the fixed plate and the movable splint; two guide rails are symmetrically fixedly installed on one side of the fixed plate installation splint; the two guide rails are respectively installed with sliding blocks installed on the movable splint, and the two slides maintain a horizontal position with each other.

5. The novel BH composite sensing structure based on monolithic measurement according to claim 3 is characterized in that A pin fixing block is installed on the fixing plate. After the knob is rotated to a suitable position, a fixing pin is used to pass through the through hole of the pin fixing block to hold the knob so that the knob part does not loosen.

6. The novel BH composite sensing structure based on monolithic measurement according to claim 2, characterized in that The movable clamping plate and the fixed clamping plate are both provided with openings at corresponding positions, and the upper and lower magnetic yokes pass through the clamping plates to form a fit.

7. The novel BH composite sensing structure based on monolithic measurement according to claim 1, characterized in that A gasket is placed in the slot, and the position of the Hall element sensor, temperature sensor and pressure sensor is adjusted by the gasket so that they are parallel to the outer surface of the layer of the double-layer insulation board and as close to the sample to be tested as possible; the interlayer I of the double-layer insulation board I has an interlayer gap and an outlet for leading out signal lines; the double-layer insulation board I is fixedly installed on the clamping device; the Hall element composite sensor includes 1 Hall sensor, 2 temperature sensors and 2 pressure sensors; the Hall element sensor is a Hall element sensor with model SS496A1, its power pin VDD is connected to the external power supply, the ground pin GND signal line is grounded, and the output pin OUT is connected to the external data acquisition card through the signal line; the 2 temperature sensors and 2 pressure sensors are fixed in a symmetrical relationship at the four corners of the interlayer I of the double-layer insulation board I, and the temperature sensors and pressure sensors are diagonally distributed.

8. The novel BH composite sensing structure based on monolithic measurement according to claim 1, characterized in that A gasket is placed in the slot, and the position of the tangential coil sensor, temperature sensor and pressure sensor is adjusted by the gasket so that they are parallel to the outer surface of the layer of the double-layer insulation board and as close to the sample to be tested as possible; the interlayer II of the double-layer insulation board II has an interlayer gap and a wire outlet for leading out the signal line; the double-layer insulation board II is fixedly installed on the clamping device; the tangential coil composite sensor includes 1 tangential coil sensor, 2 temperature sensors, 2 pressure sensors and a gasket; the tangential coil sensor is fixedly installed in the middle position of the interlayer II of the double-layer insulation board II; the tangential coil sensor is a thin sheet structure, its material is the same as that of the sample to be tested, and the signal coil is evenly wound on its surface, and its signal line is connected to the external data acquisition card; the 2 temperature sensors and 2 pressure sensors are symmetrically fixed at the four corners of the interlayer II of the double-layer insulation board II, and the temperature sensor and the pressure sensor are diagonally distributed.

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