A wire bonding point reliability inspection device and method

Abstract

The application provides a lead bonding point reliability inspection device and method. The device comprises a workbench, a fixing frame, a substrate fastening and moving mechanism, and a pulling mechanism. The substrate fastening and moving mechanism comprises a substrate clamping piece, a vacuum chuck, a supporting slide rod, a first arc-shaped slide, a second arc-shaped slide, and a seat body. The pulling mechanism comprises a fixed arm fixedly connected to one side of the first part of the fixing frame, a lead clamp with a limiting plate, a stretching rod, a fastener, a stretching moving assembly, and a reset piece. The method is based on the wire diameter, pulling force parameter, first and second angles, lead length, and swing times of the L-shaped lead to judge and give the bonding point reliability detection result. The application can detect single bonding points in the ultrasonic bonding area of different materials; can effectively reduce failure forms such as lead falling off and lead root breaking; can be suitable for swing inspection mode and also suitable for single bonding point limit pulling force test mode; and can also conduct fatigue aging inspection in the swing motion mode.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of power device package detection, and particularly relates to a wire bonding reliability inspection device and a detection method. BACKGROUND

[0002] Wire bonding technology is to use a metal wire to interconnect a chip electrode and a corresponding circuit welding area on a substrate, and to lead the electrode out to an external circuit to realize the connection of the chip and the circuit. Ultrasonic bonding is one of the most common technologies of wire bonding, and a wedge-shaped wedge is generally used. After the bonding is completed, the bonding point is a wedge-shaped bonding point.

[0003] Wire bonding failure is one of the common forms of power device package failure. The wire bonding failure modes mainly include wire falling off and wire root fracture, both of which are located at the bonding point position. During the ultrasonic bonding process, the metal wire (gold wire, silver wire, copper wire, aluminum wire, etc.) to be bonded needs to be interconnected with bonding areas of different materials. Since the thermal expansion coefficients of different materials are different, wire falling off becomes the most common failure form. The existing bonding strength evaluation method is to pull off the wire by a tensile test to comprehensively judge whether the overall strength of the first bonding point and the second bonding point meets the requirements. When the bonding area materials or plating materials of the first bonding point and the second bonding point are different, different materials cannot be respectively tested and judged for a single bonding point.

[0004] In addition, the existing bonding wire aging test, such as power cycle aging test, simulates the actual working state of the chip and the bonding wire, so this test method is the most strict and reliable, but it also has some problems: (1) The tested sample of the power cycle test is generally a finished product, and the test is destructive. Since the chip is included, the cost is relatively high; (2) The power cycle aging test can to some extent conduct an aging test on the bonding wire itself, but the tested sample often has other defects, such as chip solder layer aging failure and chip damage, which leads to the failure of the tested sample, thereby covering the problem that the bonding wire itself may not fail, and the reliability of the bonding wire cannot be accurately evaluated; (3) This test method has the disadvantages of high equipment cost and long aging time. SUMMARY

[0005] In view of the defects in the prior art, the purpose of the present application is to provide a wire bonding point reliability inspection device and a detection method, which can also realize the test of bonding wire fatigue aging. The device or method has the advantages of reasonable design, simplicity, practicality, easy operation, controllable and adjustable angle and number, and small environmental interference.

[0006] One aspect of the present application provides a wire bonding point reliability inspection device, which comprises:

[0007] a workbench configured to be connected with an external structure to fix the wire bonding point reliability inspection device;

[0008] a fixing frame including a first part and a second part fixedly arranged on the workbench along a first direction and opposite to each other along a second direction perpendicular to the first direction;

[0009] a substrate fastening and moving mechanism including a substrate clamping piece, a vacuum chuck, a support slide rod, a first arc-shaped slide rail, a second arc-shaped slide rail and a seat body, wherein the first arc-shaped slide rail and the second arc-shaped slide rail are respectively arranged in the first part and the second part, the support slide rod has a body part fixedly connected with the seat body and two shaft-shaped end parts respectively matched with the first arc-shaped slide rail and the second arc-shaped slide rail, the vacuum chuck is arranged in the seat body and can adsorb a second surface of a substrate to be tested on the seat body, the substrate clamping piece has a first surface capable of fastening a first surface of the substrate to be tested and a second surface fixedly linked with the seat body, the first surface can swing within a first angle through the cooperation of the first arc-shaped slide rail, the second arc-shaped slide rail and the support slide rod, and when the first angle is 0°, the first surface is perpendicular to the first direction and parallel to the second direction;

[0010] a pulling mechanism including a fixed arm fixedly connected with one side of the first part of the fixing frame, a lead clamp with a limiting plate, a stretching rod, a fastener, a stretching moving assembly and a reset piece, wherein the lead clamp and the stretching rod can be designed and replaced according to actual needs, for example, for a 5mil wire diameter bonding wire, the lead clamp cannot perfectly fix the tail part of the L-shaped bonding wire, and a lead fixing device such as a hook type or a vacuum hole type needs to be replaced and designed, one end of the stretching rod is connected with the fixed arm at an adjustable second angle in a plane formed by the first direction and the second direction, the other end of the stretching rod is fixedly connected with the lead clamp, the lead clamp makes the L-shaped lead on the substrate to be tested parallel to the central axis direction of the stretching rod through the limiting plate, the fastener can limit and fasten the stretching rod, the stretching moving assembly is configured to make the stretching rod do stretching movement along the central axis direction at a preset pulling force parameter, and the reset piece can restore the stretching rod to an initial position, wherein the second angle is an angle between the central axis of the stretching rod and the second direction; and

[0011] a slide rod movable mechanism including a driving element, a control element and a display element, wherein the driving element is arranged in the second part to drive the support slide rod to swing along the arc-shaped slide rail, the control element is connected with the driving element to adjust the swinging times of the support slide rod, and the display element is arranged on the surface of the workbench along the second direction to display the movement times.

[0012] The wire bonding point reliability inspection device further comprises a height adjusting mechanism arranged in the fixing arm, arranged in the first part and the second part, or arranged in the seat body of the substrate fastening and moving mechanism, and capable of adjusting the distance between the stretching rod and the substrate clamping piece.

[0013] The first angle is selected in the range of -10°-10°; preferably, the first angle is selected in the range of 1°-3° or -3°-1°.

[0014] The second angle is selected in the range of -60°-60°; preferably, the second angle is selected in the range of -30°-30°.

[0015] The L-shaped wire is a gold wire, a silver wire, a copper wire or an aluminum wire.

[0016] The supporting slide rod is integrally formed with the seat body.

[0017] The first direction is a vertical direction, and the second direction is a horizontal direction.

[0018] The one end of the stretching rod connected with the fixing arm is located directly above the substrate clamping piece.

[0019] Another aspect of the present application provides a wire bonding point reliability detection method, which comprises the following steps:

[0020] S1, placing a to-be-tested sample substrate bonded with an L-shaped wire in a second direction on the vacuum chuck, clamping the to-be-tested sample substrate by using the substrate clamping piece, and opening the vacuum chuck to adsorb and fix the to-be-tested sample substrate;

[0021] S2, adjusting the second angle, and clamping the L-shaped wire in a direction parallel to the central axis direction of the stretching rod by using the wire clamp and the limiting plate thereof;

[0022] S3, setting the tension parameter and / or the first angle, and driving the swing by using the driving element;

[0023] S4, judging and giving a bonding point reliability detection result based on one or more of the following: the wire diameter of the L-shaped wire, the set tension parameter, the first angle, the second angle, the length of the unbonded part of the L-shaped wire, and the number of swings corresponding to the time from the start of the test to the time when the L-shaped wire falls off the to-be-tested sample substrate or the L-shaped wire is broken.

[0024] Another aspect of the present application provides a wire bonding point reliability detection method, which comprises the following steps:

[0025] S1, place the to-be-tested sample substrate bonded with the L-shaped lead wire in the second direction on the vacuum chuck, clamp the to-be-tested sample substrate using the substrate clamping piece, open the vacuum chuck to adsorb and fix the to-be-tested sample substrate;

[0026] S2, adjust the second angle, and clamp the L-shaped lead wire in a direction parallel to the direction of the central axis of the stretching rod through the lead wire clamp and the limiting plate thereof;

[0027] S3, set the first angle to 0°, apply a gradually increasing pulling force parameter through the stretching motion assembly, and record the corresponding pulling force parameter when the L-shaped lead wire is detached from the to-be-tested sample substrate or the L-shaped lead wire is broken;

[0028] S4, based on one or more of the wire diameter of the L-shaped lead wire, the corresponding pulling force parameter, the second angle and the length of the unbonded part of the L-shaped lead wire, judge and give the bonding point reliability detection result.

[0029] The beneficial effects of the present application include at least one of the following:

[0030] 1. The present application can test and judge the strength of individual bonding points in the ultrasonic bonding area of different materials;

[0031] 2. The detection method of the present application is strict and reliable, and can effectively screen out unqualified bonding points. The lead wire bonding parameters adjusted through the strength test of the present application can effectively reduce the failure forms such as lead wire detachment and lead wire root breakage;

[0032] 3. The lead wire bonding point reliability test device of the present application can be applied to both swing test mode and single bonding point limit pulling force test mode;

[0033] 4. The lead wire bonding point reliability test device of the present application can fix the bonding wire in complex conditions by replacing the lead wire clamp, stretching rod with a hook type, vacuum hole type and other lead wire fixing devices;

[0034] 5. The lead wire bonding point reliability test device of the present application can also provide the function of fatigue aging test, and has the advantages of low sample manufacturing cost, short aging time, high efficiency, simple operation, strong bonding point pertinence, low equipment cost and the like. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 The overall structure schematic diagram of one exemplary embodiment of the lead wire bonding point reliability test device of the present application is shown;

[0036] Figure 2 The front view schematic diagram of Figure 1 is shown;

[0037] Figure 3AFig. 1 shows a schematic view of a substrate fastening and moving mechanism according to the present application; Figure 1 Fig. 2 shows a schematic view of an assembly of the substrate fastening and moving mechanism and a sample substrate to be tested with L-shaped leads bonded thereon;

[0038] Figure 3B Fig. 3 shows a schematic view of a swing state of the substrate fastening and moving mechanism according to the present application; Figure 3A Fig. 4 shows a schematic view of a swing state of the substrate fastening and moving mechanism according to the present application;

[0039] Figure 4A Fig. 5 shows a schematic view of a pulling mechanism according to the present application;

[0040] Figure 4B Fig. 6 shows a schematic view of a sample substrate to be tested with L-shaped leads bonded thereon according to the present application; Figure 4A Fig. 7 shows a schematic view of a sample substrate to be tested with L-shaped leads bonded thereon according to the present application;

[0041] Figure 5A Fig. 8 shows a schematic view of a sample substrate to be tested with L-shaped leads bonded thereon according to the present application;

[0042] Figure 5B Fig. 9 shows a schematic view of a sample substrate to be tested with L-shaped leads bonded thereon according to the present application; Figure 5A Fig. 10 shows a schematic view of a sample substrate to be tested with L-shaped leads bonded thereon according to the present application;

[0043] Figure 6 Fig. 11 shows a schematic view of a flow of a lead bonding point reliability detection method according to the present application;

[0044] Figure 7 Fig. 12 shows a schematic view of a flow of another lead bonding point reliability detection method according to the present application.

[0045] Reference signs are explained as follows:

[0046] 10 - worktable

[0047] 20 - fixed frame, 21 - first part, 22 - second part 30 - substrate fastening and moving mechanism, 31 - substrate clamping member, 32 - support slide rod, 33 - first arc-shaped slide, 34 - seat body, β - first angle

[0048] 40 - pulling mechanism, 41 - fixed arm, 42 - lead clamp, 43 - stretching rod, α - second angle

[0049] 50 - sample substrate to be tested, 51 - lead DETAILED DESCRIPTION

[0050] In order to more clearly illustrate the overall concept of the present application, the following detailed description is given in conjunction with the accompanying drawings.

[0051] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein, and the scope of the present application is not limited to the specific embodiments disclosed in the following description.

[0052] In addition, in the description of the application, it needs to be understood that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the application.

[0053] In the application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection, or communication; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0054] In the application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be direct contact of the first and second features, or indirect contact of the first and second features through intermediate medium. In the description of the specification, the description referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0055] Embodiment 1, a wire bonding point reliability inspection device

[0056] In this embodiment, the wire bonding point reliability inspection device is composed of a workbench, a fixing frame, a substrate fastening and moving mechanism, a pulling mechanism, and a sliding rod active mechanism.

[0057] The workbench can be connected with an external structure not belonging to the application to fix the wire bonding point reliability inspection device. The connection mode of the workbench and the external structure can be welding, clamping, bolt fastening and the like, so as to facilitate the fixation of the workbench. Of course, the workbench can also have a proper counterweight, so that the entire wire bonding point reliability inspection device can be directly placed on a plane such as a desktop.

[0058] The fixing frame can include a first part and a second part fixedly arranged on the workbench along a first direction and opposite to each other along a second direction perpendicular to the first direction. For example, the first direction can be a vertical direction, and the second direction can be a horizontal direction. The workbench can also be arranged along the horizontal direction. The first part and the second part of the fixing frame can be separately formed or integrally formed with the workbench.

[0059] The substrate fastening and moving mechanism can include a substrate clamping member, a vacuum chuck, a support slide rod, a first arc-shaped slide rail, a second arc-shaped slide rail, and a seat body.

[0060] Specifically, the first arc-shaped slide rail can be arranged in the first part of the fixing frame, and the second arc-shaped slide rail can be arranged in the second part of the fixing frame. For example, the first and second arc-shaped slide rails can be opposite to each other along the second direction and arranged in the first and second parts of the fixing frame, respectively. The support slide rod can have a body fixedly connected with the seat body, and two shaft-shaped end portions respectively matched with the first and second arc-shaped slide rails. The number of support slide rods can be two arranged in parallel along the second direction. For example, the body and the two shaft-shaped end portions can be integrally formed along the second direction. In addition, the support slide rod can also be integrally formed with the seat body. The length of the arc-shaped segment of the first and second arc-shaped slide rails can be set to limit the moving path and amplitude of the support slide rod.

[0061] The vacuum chuck can be arranged in the seat body and capable of adsorbing the second surface of the substrate to be tested on the seat body. The second surface of the substrate clamping member corresponds to the surface away from the workbench. The substrate clamping member can have a first surface capable of fastening the substrate to be tested. For example, the first surface of the substrate clamping member can be formed with clamping grooves, limiting grooves, etc. so as to be capable of placing and limiting the substrate to be tested on the substrate clamping member.

[0062] The substrate fastening and moving mechanism can enable the first surface to swing within a first angle through the cooperation of the first and second arc-shaped slide rails and the support slide rod. When the first angle is 0°, the first surface is perpendicular to the first direction and parallel to the second direction. The first angle corresponds to the included angle between the perpendicular line of the first surface and the first direction. For example, the first angle can be selected within the range of -10° to 10°. Preferably, the first angle is selected within the range of -3° to 3°.

[0063] The pulling mechanism can include a fixed arm fixedly connected with one side of the first part of the fixing frame, a lead wire clamp with a limiting plate, a stretching rod, a fastener, a stretching moving assembly, and a reset member.

[0064] One end of the stretching rod is connected with the fixed arm at an adjustable second angle in the plane formed by the first direction and the second direction, and the other end of the stretching rod is fixedly connected with the lead wire clamp. That is, the one end of the stretching rod is connected with the fixed arm, and the stretching rod and the lead wire clamp fixedly connected with the other end of the stretching rod can be adjusted at an adjustable second angle in the plane formed by the first direction and the second direction (for example, it can be a vertical plane perpendicular to the horizontal plane where the workbench is located and facing the operator). The fastener can position and fasten the adjusted stretching rod, so that the stretching rod is fixed at a second angle with a certain degree value. The second angle can be the included angle between the central axis of the stretching rod and the second direction. For example, the second angle can be selected within the range of -60°-60°. Further, the second angle can be selected within the range of -30°-30°. In addition, preferably, the one end of the stretching rod connected with the fixed arm can be located directly above the substrate clamping piece.

[0065] The lead wire clamp can clamp the L-shaped lead wire on the sample substrate to be tested, and can make the L-shaped lead wire parallel to the central axis direction of the stretching rod through the limiting plate. The L-shaped lead wire is composed of a free section and a bonding section bonded to the sample substrate to be tested along the second direction, and the free section is not bonded to the sample substrate to be tested and is usually at an obtuse angle with the bonding section. The length of the free section can be appropriately adjusted according to lead wires of different diameters. In addition, the L-shaped lead wire can be a gold wire, a silver wire, a copper wire or an aluminum wire, but the present application is not limited thereto.

[0066] The stretching motion assembly is configured to enable the stretching rod to make a stretching motion along the central axis direction at a preset tension parameter. The reset member can restore the stretching rod to the initial position. For example, the reset member can be an elastic reset member or the like.

[0067] The slide rod driving mechanism can include a driving element arranged in the second part to drive the support slide rod to provide power for the swing. For example, the driving element can be a motor capable of providing a reciprocating motion stroke. In addition, further, the slide rod driving mechanism can also contain a control element and / or a display element. The control element can be configured to be connected with the driving element to set an upper limit of the number of swings. The display element can be configured to count and display the number of swings corresponding to the time when the L-shaped lead wire is detached from the sample substrate to be tested or the L-shaped lead wire is broken from the time when the test starts. The counted number of swings can be used as an important parameter for subsequent reliability judgment.

[0068] Embodiment 2

[0069] In another exemplary embodiment of the present application, the wire bonding point reliability inspection device can further comprise a height adjustment mechanism on the basis of the above exemplary embodiment. The height adjustment mechanism can be arranged in the fixed arm and connected with the stretching rod in a manner of adjusting the stretching rod extension length, so as to adjust the distance between the stretching rod and the substrate clamping member. This is more conducive to the L-shaped lead with different diameters and lengths. In addition, through the swinging function of the substrate fastening and moving mechanism in the first angle and the distance adjustment function of the height adjustment mechanism, the basic swing axis (or rotation axis) of the L-shaped lead of the sample substrate to be tested can be better realized, so as to improve the accuracy, precision and stability of the sample detection.

[0070] In addition, the height adjustment mechanism can also be arranged in the first part and the second part of the fixed frame, and connected with the seat, the supporting slide rod or the substrate clamping member in a manner of adjusting the height of the substrate clamping member along the second direction, so as to adjust the distance between the stretching rod and the substrate clamping member.

[0071] In addition, the height adjustment mechanism can also be arranged in the first part and the second part of the fixed frame, and connected with the seat, the supporting slide rod or the substrate clamping member in a manner of adjusting the height of the substrate clamping member along the second direction, so as to adjust the distance between the stretching rod and the substrate clamping member.

[0072] Embodiment 3

[0073] Figure 1 The overall structure schematic diagram of an exemplary embodiment of the wire bonding point reliability inspection device of the present application is shown; Figure 2 The front view schematic diagram of Figure 1 is shown.

[0074] In this embodiment, as shown in Figure 1 and Figure 2 , the wire bonding point reliability inspection device comprises a workbench 10, a fixed frame 20, a substrate fastening and moving mechanism 30, and a pulling mechanism 40.

[0075] The workbench 10 can be used to support the entire wire bonding point reliability inspection device. The workbench 10 can make the entire wire bonding point reliability inspection device be directly placed on a plane such as a desktop.

[0076] The fixed frame 20 can comprise a first part 21 and a second part 22 which are fixedly arranged on the workbench in the vertical direction and opposite to each other in the horizontal direction. The first part and the second part of the fixed frame can be connected with the workbench by welding or the like.

[0077] The substrate fastening and moving mechanism 30 can comprise a substrate clamping member 31, a vacuum chuck (not shown), a supporting slide rod 32, a first arc-shaped slide 33, a second arc-shaped slide (not shown) and a seat 34.

[0078] The first and second arc-shaped slides are opposite to each other along the horizontal direction and are respectively arranged in the first and second portions of the fixed frame. The support slide rod can have a body fixedly connected with the seat body and two shaft-shaped end portions respectively matched with the first and second arc-shaped slides. The number of the support slide rods is two arranged in parallel along the horizontal direction.

[0079] The pulling mechanism includes a fixed arm 41 fixedly connected with one side of the first portion of the fixed frame, a lead wire clamp 42 with a limiting plate, a stretching rod 43, a fastener (not shown), a stretching motion assembly and a reset member (not shown).

[0080] One end of the stretching rod is connected with the fixed arm and is perpendicular to the horizontal plane of the workbench and opposite to the vertical plane of the operator. The end of the stretching rod connected with the fixed arm is located directly above the substrate clamping member.

[0081] Figure 3A The assembly of the substrate fastening and motion mechanism of Figure 1 and the to-be-tested sample substrate bonded with an L-shaped lead wire is shown; Figure 3B The right view schematic diagram of the swinging state of Figure 3A is shown.

[0082] As shown in Figure 3A and Figure 3B , the vacuum chuck is arranged in the seat body and can adsorb the second surface of the to-be-tested sample substrate on the seat body, the substrate clamping member has a first surface capable of fastening the first surface of the to-be-tested sample substrate and a second surface fixedly connected with the seat body, the first surface can swing within an angle β range through the cooperation of the first and second arc-shaped slides and the support slide rod, and in the case that β is 0°, the first surface of the substrate clamping member is parallel to the horizontal direction, and the range of the angle β is -3°-3°.

[0083] Figure 4A The schematic diagram of the pulling mechanism is shown; Figure 4B The front view schematic diagram of Figure 4A is shown.

[0084] As shown in Figure 4A and Figure 4B , the fastener can limit and fasten the adjusted stretching rod, so that the stretching rod is fixed at an angle α with a certain degree value. The angle α is selected within the range of -30°-30°.

[0085] Figure 5A The schematic diagram of the to-be-tested sample substrate bonded with an L-shaped lead wire is shown; Figure 5B The front view schematic diagram of Figure 5A is shown.

[0086] As shown in Figure 5A andFigure 5B As shown, the lead wire clamp can clamp the L-shaped lead wire on the test sample substrate, and the L-shaped lead wire can be parallel to the central axis of the stretching rod by the limiting plate. The L-shaped lead wire is composed of a free section and a bonding section bonded to the test sample substrate in the horizontal direction. The free section is not bonded to the test sample substrate and is usually at an obtuse angle with the bonding section. The length of the free section can be appropriately adjusted according to the lead wire of different diameters. The L-shaped lead wire is made of all materials that can be used for power semiconductors, such as gold wire, silver wire, copper wire, or aluminum wire, and the diameter is greater than or equal to 5 mils.

[0087] The stretching motion assembly is configured to enable the stretching rod to make a stretching motion along the central axis direction with preset tension parameters. The elastic return member can restore the stretching rod to the initial position.

[0088] The test sample substrate is a square symmetric structure, and the material is the bonding area material to be detected for bonding strength. The lead wire should be bonded on the central axis of the test sample substrate, and the substrate thickness is 0.3-3mm.

[0089] Embodiment 4, a lead wire bonding point reliability detection method

[0090] Figure 6 The flowchart shows an exemplary embodiment of the lead wire bonding point reliability detection method of the present application.

[0091] In this embodiment, as shown in Figure 6 The lead wire bonding point reliability detection method is realized by the following steps:

[0092] S1, place the test sample substrate bonded with the L-shaped lead wire in the second direction on the vacuum chuck, clamp the test sample substrate using the substrate clamping member, and open the vacuum chuck to adsorb and fix the test sample substrate.

[0093] Specifically, the test sample substrate is first prepared. The test sample substrate can be a square symmetric structure, and the material is the bonding area material to be detected for bonding strength. The lead wire should be bonded on the symmetric axis of the test sample substrate, and the substrate thickness is 0.3-3mm. The test lead wire should have a certain length L (i.e. the length of the un-bonded part of the L-shaped lead wire) except the bonding part, and the specific length L can be determined by the lead wire diameter to facilitate stable clamping and tension application of the lead wire clamp.

[0094] Place the test sample substrate on the vacuum chuck, clamp the substrate using the clamping mechanism, open the vacuum valve, fix the test sample substrate, adjust the test sample substrate to the appropriate height, and try to make the test sample substrate rotate around the lead wire central axis on the upper surface of the substrate.

[0095] S2, adjust the second angle, and clamp the L-shaped lead wire along a direction parallel to the central axis of the stretching rod by the lead wire clamp and the limiting plate thereof.

[0096] Specifically, the angle a between the stretching rod of the pull-out detection mechanism and the vertical direction is adjusted, and the angle a can range from -30° to 30°. Then, the lead wire clamp fixed on the stretching rod clamps the lead wire tail, the lead wire is in close contact with the limiting plate of the lead wire clamp, and the direction of the metal wire lead wire is parallel to the direction of the stretching rod body, so as to ensure that the applied pulling force is parallel to the tail of the metal wire lead wire.

[0097] S3, set the pulling force parameter and / or the first angle, and drive the swing by the driving element.

[0098] Specifically, the pulling force parameter F and the rotation amplitude angle β (i.e., the first angle) of the pull-out detection mechanism are set, and after the operation is started, the pull-out detection mechanism applies a pulling force to the tail of the metal wire lead wire, and the sample substrate performs a rotation movement (i.e., the swing) within a certain range with the central axis of the lead wire on the upper surface of the substrate as the rotation axis.

[0099] S4, based on one or more of the wire diameter of the L-shaped lead wire, the set pulling force parameter, the first angle, the second angle, the length of the unbonded part of the L-shaped lead wire, and the number of swings corresponding to the time from the start of the test to the time when the L-shaped lead wire falls off from the sample substrate to be tested or the L-shaped lead wire is broken, the bonding point reliability detection result is judged and given.

[0100] For example, Table 1 below shows an example of judging and giving the bonding point reliability detection result based on the wire diameter of the L-shaped lead wire, the set pulling force parameter F, the first angle β, the second angle a, the length L of the unbonded part of the L-shaped lead wire, and the number N of swings corresponding to the time from the start of the test to the time when the L-shaped lead wire falls off from the sample substrate to be tested or the L-shaped lead wire is broken. Specifically, the number N of rotation movements can be recorded, the wire diameter and the metal wire of the same material corresponding to the number N can be found in the bonding point strength test qualified table, and whether the number of rotation movements meets the standard can be compared. If the number does not meet the standard, it means that the bonding strength is not enough, and the bonding point strength test is completed. When other influencing factors remain the same, it indicates that the ultrasonic bonding parameters are unqualified, and the ultrasonic bonding parameters are adjusted until the number of movements meets the standard, and the ultrasonic bonding parameter optimization is completed. The qualified standard corresponding to the bonding point strength test qualified table can be obtained by statistical analysis of multiple detection results by using the method of the present application.

[0101] Table 1

[0102]

[0103]

[0104] Example 5

[0105] Figure 7 A flowchart showing still another exemplary embodiment of the wire bonding point reliability detection method of the present application is shown.

[0106] In this embodiment, as shown in Figure 7 the wire bonding point reliability detection method is implemented through similar steps as in Embodiment 4, with the difference being that:

[0107] S3, set the first angle to 0°, and apply gradually increasing tension parameters through the stretching motion assembly until the L-shaped wire falls off the substrate to be tested or the L-shaped wire breaks, at which time the corresponding tension parameter is recorded;

[0108] S4, based on one or more of the wire diameter of the L-shaped wire, the corresponding tension parameter, the second angle, and the length of the unbonded portion of the L-shaped wire, judge and give the bonding point reliability detection result.

[0109] The above only describes the embodiments of the present application and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

Claims

1. A wire bond reliability inspection apparatus, characterized by, The lead bonding point reliability inspection device comprises: a workbench configured to be connected with an external structure to fix the lead bonding point reliability inspection device; a fixing frame comprising a first part and a second part fixedly arranged on the workbench along a first direction and opposite to each other along a second direction perpendicular to the first direction; a substrate fastening and movement mechanism comprising a substrate clamping piece, a vacuum chuck, a support slide rod, a first arc-shaped slide rail, a second arc-shaped slide rail and a seat body; a pulling mechanism comprising a fixed arm fixedly connected with one side of the first part of the fixing frame, a lead clamp with a limiting plate, a stretching rod, a fastener, a stretching movement assembly and a reset piece; and a slide rod active mechanism comprising a driving element arranged in the second part to drive the support slide rod to provide power for swinging; the first arc-shaped slide rail and the second arc-shaped slide rail are respectively arranged in the first part and the second part, the support slide rod has a body part fixedly connected with the seat body and two shaft-shaped end parts respectively matched with the first arc-shaped slide rail and the second arc-shaped slide rail, the vacuum chuck is arranged in the seat body and can adsorb a second surface of a substrate to be tested on the seat body, the substrate clamping piece has a first surface capable of fastening a first surface of the substrate to be tested and a second surface fixedly connected with the seat body, the first surface can swing within a first angle through the cooperation of the first arc-shaped slide rail, the second arc-shaped slide rail and the support slide rod, and in the case that the first angle is 0°, the first surface of the substrate clamping piece is perpendicular to the first direction and parallel to the second direction; one end of the stretching rod is connected with the fixed arm at an adjustable second angle in a plane formed by the first direction and the second direction, the other end of the stretching rod is fixedly connected with the lead clamp, the lead clamp makes an L-shaped lead on the first surface of the substrate to be tested parallel to the central axis direction of the stretching rod through the limiting plate, the fastener can limit and fasten the stretching rod, the stretching movement assembly is configured to make the stretching rod do stretching movement along the central axis direction at a preset pulling force parameter, and the reset piece can restore the stretching rod to an initial position, wherein the second angle is the included angle between the central axis of the stretching rod and the second direction; the first angle is selected within a range of -10°~10°, and the second angle is selected within a range of -60°~60°; the lead bonding point reliability inspection device further comprises a height adjusting mechanism.

2. The wire bond reliability verification apparatus of claim 1, wherein the slide rod active mechanism further comprises a control element and / or a display element, the control element is configured to be connected with the driving element to set the upper limit of the number of swings, and the display element is configured to count and display the number of swings corresponding to the time when the L-shaped lead falls off from the substrate to be tested or the L-shaped lead is broken from the time when the test starts.

3. The wire bond reliability verification apparatus of claim 1, wherein the height adjusting mechanism is arranged in the fixed arm, arranged in the first part and the second part, or arranged in the seat body of the substrate fastening and movement mechanism, and can adjust the distance between the stretching rod and the substrate clamping piece.

4. The wire bond reliability inspection apparatus according to any one of claims 1 to 2, characterized by the first angle is selected within a range of 1°~3° or -3°~-1°, and the second angle is selected within a range of -30°~30°.

5. The wire bond reliability verification apparatus of any one of claims 1-2, wherein, The first direction is a vertical direction, and the second direction is a horizontal direction.

6. The wire bond reliability verification apparatus of claim 5, wherein, The one end of the stretching rod connected with the fixed arm is located directly above the substrate clamping member.

7. The wire bond reliability testing method of the wire bond reliability testing apparatus according to any one of claims 1 to 4, characterized by, The method comprises the following steps: S1, placing a to-be-tested sample substrate bonded with an L-shaped lead wire in a second direction on the vacuum chuck, clamping the to-be-tested sample substrate using the substrate clamping member, and opening the vacuum chuck to adsorb and fix the to-be-tested sample substrate; S2, adjusting the second angle, and clamping the L-shaped lead wire in a direction parallel to the central axis direction of the stretching rod through the lead wire clamp and the limiting plate thereof; S3, setting the tension parameter and / or the first angle, and driving the swing through the driving element; S4, judging and giving a bonding point reliability detection result based on one or more of the following: the wire diameter of the L-shaped lead wire, the set tension parameter, the first angle, the second angle, the length of the unbonded part of the L-shaped lead wire, and the number of swings corresponding to the time from the start of the test to the time when the L-shaped lead wire falls off the to-be-tested sample substrate or the L-shaped lead wire is broken.

8. The method of claim 7, wherein, The method comprises the following steps: S1, placing a to-be-tested sample substrate bonded with an L-shaped lead wire in a second direction on the vacuum chuck, clamping the to-be-tested sample substrate using the substrate clamping member, and opening the vacuum chuck to adsorb and fix the to-be-tested sample substrate; S2, adjusting the second angle, and clamping the L-shaped lead wire in a direction parallel to the central axis direction of the stretching rod through the lead wire clamp and the limiting plate thereof; S3, setting the first angle to 0°, applying a gradually increasing tension parameter through the stretching motion assembly until the time when the L-shaped lead wire falls off the to-be-tested sample substrate or the L-shaped lead wire is broken, and recording the corresponding tension parameter; S4, judging and giving a bonding point reliability detection result based on one or more of the following: the wire diameter of the L-shaped lead wire, the corresponding tension parameter, the second angle, and the length of the unbonded part of the L-shaped lead wire; The S1 step further comprises adjusting the distance between the stretching rod and the substrate clamping member through the height adjusting mechanism before opening the vacuum chuck.

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