Heat sink pasting machine

Abstract

A heat sink pasting machine includes the following components: a feeding mechanism group that provides a film chip packaging tape and guides the film chip packaging tape toward a first conveying path; a first pasting mechanism disposed after the feeding mechanism group and on the first conveying path for pasting a first heat sink to the first side of the film chip packaging tape; a first carrier that carries the film chip packaging tape below the first pasting mechanism; a flipping mechanism disposed after the first pasting mechanism and rotates in a first direction to flip the film chip packaging tape upside down and divert the film chip packaging tape from the first conveying path to the second conveying path; a second pasting mechanism disposed after the flipping mechanism and on the second conveying path for pasting a second heat sink to the second side of the film chip packaging tape; a second carrier that carries the film chip packaging tape below the second pasting mechanism; and a receiving mechanism group disposed after the second pasting mechanism for rewinding the film chip packaging tape.

Description

Technical Field

[0001] The present invention relates to a laminating machine, and in particular to a roll-to-roll conveying laminating machine that can be used for laminating heat sinks on both sides of a chip on film (COF) roll. Background Art

[0002] In the field of driver ICs, especially for liquid crystal displays (LCDs), driver ICs are typically packaged using three packaging methods: tape carrier package (TCP), chip on film (COF), and chip on glass (COG). Among these, COF has almost replaced tape carrier package as the mainstream trend. As driver ICs move toward higher power and higher pin counts, the heat they generate is increasing and becoming increasingly difficult to dissipate. Therefore, heat dissipation structures are added to COF packages to prevent them from being exposed to high temperatures for extended periods, which can lead to reduced performance and indirectly cause thermal deformation and deterioration of nearby structures. Current COF package heat dissipation methods primarily involve attaching a metal heat sink to the film surface. However, this often fails to reduce the chip temperature to the desired level, leading to the development of double-sided heat sinks.

[0003] Currently, if heat sinks need to be attached to both surfaces of a Chip on Film package reel during the production process, the heat sink attaching machine must be operated multiple times to complete the process. For example, the heat sink attaching machine must first be operated once to attach a heat sink to the first side of the Chip on Film package reel. After the entire reel is wound up, the heat sink attaching machine must be reloaded and operated again to attach a heat sink to the second side of the Chip on Film package reel. This is time-consuming and labor-intensive, and is also prone to unexpected engineering risks due to personnel transportation. Therefore, how to improve the attaching efficiency of the heat sink attaching machine has become an important issue. Summary of the Invention

[0004] The present invention provides a heat sink pasting machine, which can improve pasting efficiency, and is particularly a pasting machine used for film chip packaging tape.

[0005] The present invention provides a heat sink laminating machine, comprising a feeding mechanism group, a first laminating mechanism, a first pressing mechanism, a first carrier, a flipping mechanism, a second laminating mechanism, a second pressing mechanism, a second carrier, and a receiving mechanism group. The feeding mechanism group is configured to provide a CFP tape and direct the CFP tape toward a first conveying path. The first laminating mechanism is disposed after the feeding mechanism group and on the first conveying path, wherein the first laminating mechanism is configured to attach a first heat sink to the first surface of the CFP tape. The first pressing mechanism is disposed after the first laminating mechanism and on the first conveying path, for pressing and securing the first heat sink to the first surface. The first carrier is configured to carry the CFP tape located below the first laminating mechanism. The flipping mechanism is disposed after the first laminating mechanism and is configured to rotate in a first direction to flip the CFP tape upside down and direct the CFP tape from the first conveying path to a second conveying path opposite to the first conveying path. A second gluing mechanism is disposed after the flipping mechanism and on the second conveying path, wherein the second gluing mechanism is configured to attach the second heat sink to the second side of the chip-on-film package tape opposite the first side. A second pressing mechanism is disposed after the second gluing mechanism and on the second conveying path, and is configured to press and secure the second heat sink to the second side. A second carrier is configured to support the chip-on-film package tape located below the second gluing mechanism. A rewinding mechanism is disposed after the second gluing mechanism and is configured to rewind the chip-on-film package tape.

[0006] In one embodiment of the present invention, the heat sink laminating machine further includes a steering mechanism located between the feeding mechanism assembly and the flipping mechanism, wherein the steering mechanism is configured to cause the chip-on-film package tape to be diverted from the second conveying path to a third conveying path aligned with the first conveying path.

[0007] In one embodiment of the present invention, the above-mentioned steering mechanism also includes a steering wheel, the wheel surface of the steering wheel is a first hollow portion, the first hollow portion is configured on the surface of the second heat sink on the corresponding film-covered chip package tape, and the steering wheel rotates in a second direction opposite to the first direction.

[0008] In one embodiment of the present invention, the flipping mechanism includes a rotating wheel, the wheel surface of the rotating wheel is the second hollow portion, and the second hollow portion is configured to correspond to the surface of the chip-on-film package tape with the first heat sink.

[0009] In one embodiment of the present invention, the above-mentioned feeding mechanism group also includes a discharge tape wheel and a first spacing tape wheel. The discharge tape wheel is configured to provide a conveying film-covered chip packaging tape, and the first spacing tape wheel is configured to rewind the spacing tape on the film-covered chip packaging tape, and the discharge tape wheel and the first spacing tape wheel simultaneously transmit the film-covered chip packaging tape and rewind the spacing tape.

[0010] In one embodiment of the present invention, the above-mentioned material receiving mechanism group also includes a material receiving tape rotating wheel and a second spacing tape rotating wheel. The film-on-chip package tape with the first heat sink attached to the first side and the second heat sink attached to the second side is received by the material receiving tape rotating wheel, and the second spacing tape rotating wheel provides spacing tape protection for storage.

[0011] In one embodiment of the present invention, the above-mentioned first carrier further includes two lifting movable platforms, which are respectively arranged under the first gluing mechanism and the first pressing mechanism, and the second carrier further includes two lifting movable platforms, which are respectively arranged under the second gluing mechanism and the second pressing mechanism.

[0012] In one embodiment of the present invention, the heat sink laminating machine further includes a first detection mechanism and a second detection mechanism. The first detection mechanism is located after the first pressing mechanism and is configured to obtain a first detection result. The second detection mechanism is located after the second pressing mechanism and is configured to obtain a second detection result.

[0013] In one embodiment of the present invention, the above-mentioned flipping mechanism is located at the end of the first conveying path and at the starting end of the second conveying path, the first conveying path is configured to convey the film flip package tape with the first side facing up, and the second conveying path is configured to convey the film flip package tape with the second side facing up.

[0014] In one embodiment of the present invention, there is a height difference between the first conveying path and the second conveying path.

[0015] Based on the above, the heat sink pasting machine of the present invention first attaches the first heat sink to the first side of the chip-on-film packaging tape through the configuration of the first pasting mechanism, and then, by arranging a flipping mechanism after the first pasting mechanism, the chip-on-film packaging tape is flipped upside down and the chip-on-film packaging tape is turned from the first conveying path to the second conveying path opposite to the first conveying path. Thereafter, by arranging a second pasting mechanism after the flipping mechanism, the second heat sink is attached to the second side of the chip-on-film packaging tape. In this way, double-sided pasting can be performed on the chip-on-film packaging tape in a one-time operation process, thereby effectively improving the pasting efficiency of the heat sink pasting machine.

[0016] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A It is a partial structural diagram of a heat sink pasting machine according to an embodiment of the present invention;

[0018] Figure 1B yes Figure 1AAn enlarged schematic diagram of region A;

[0019] Figure 1C yes Figure 1A An enlarged schematic diagram of region B;

[0020] Figure 1D yes Figure 1A A partial three-dimensional schematic diagram of a steering wheel.

[0021] It should be noted that, for the sake of clarity, Figure 1B and Figure 1C The first stage and the second stage are omitted. DETAILED DESCRIPTION

[0022] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0023] Figure 1A FIG. 1 is a partial schematic diagram of a heat sink laminating machine according to an embodiment of the present invention. Figure 1B yes Figure 1A An enlarged schematic diagram of area A. Figure 1C yes Figure 1A An enlarged schematic diagram of region B. Figure 1D yes Figure 1A A partial three-dimensional schematic diagram of a steering wheel.

[0024] Please refer to Figures 1A to 1D In this embodiment, the heat sink laminating machine 100 includes a feeding mechanism group 110, a first laminating mechanism 120, a flipping mechanism 140, a second laminating mechanism 150, and a receiving mechanism group 170. Specifically, in terms of the conveying order of the heat sink laminating machine 100, the feeding mechanism group 110 is followed by the first laminating mechanism 120, the flipping mechanism 140, the second laminating mechanism 150, and the receiving mechanism group 170, wherein the feeding mechanism group 110 is configured to provide a chip-on-film package tape 10 and convey it toward the first conveying path P1; the first laminating mechanism 120 is located on the first conveying path P1 and is configured to attach the first heat sink 20 to the first surface 10a of the chip-on-film package tape 10; the flipping mechanism 140 is configured to convey the first heat sink 20 toward the first surface 10a of the chip-on-film package tape 10; Rotate toward R1 to turn the film flip package tape 10 from top to bottom, and make the film flip package tape 10 turn from the first conveying path P1 to the second conveying path P2 opposite to the first conveying path P1; the second gluing mechanism 150 is located on the second conveying path P2 and is configured to attach the second heat sink 30 to the second side 10b of the film flip package tape 10 relative to the first side 10a; and the receiving mechanism group 170 is arranged behind the second gluing mechanism 150 and is configured to rewind the film flip package tape 10 that has completed double-sided gluing.

[0025] Accordingly, the heat sink laminating machine 100 of the present embodiment first attaches the first heat sink 20 to the first side 10a of the chip-on-film package tape 10 through the configuration of the first laminating mechanism 120. Then, by providing a flipping mechanism 140 after the first laminating mechanism 120, the chip-on-film package tape 10 is flipped from top to bottom, and the chip-on-film package tape 10 is turned from the first conveying path P1 to the second conveying path P2 opposite to the first conveying path P1. Thereafter, by providing a second laminating mechanism 150 after the flipping mechanism 140, the second heat sink 30 is attached to the second side 10b of the chip-on-film package tape 10. In this way, double-sided laminating can be performed on the chip-on-film package tape 10 in a one-time operation process, thereby effectively improving the laminating efficiency of the heat sink laminating machine 100.

[0026] In this embodiment, the heat sink pasting machine 100 also includes a first carrier 130 and a second carrier 160, which are used in conjunction with the first pasting mechanism 120 and the second pasting mechanism 150, wherein the first carrier 130 is configured to carry the film-on-chip packaging tape 10 located below the first pasting mechanism 120, and the second carrier 160 is configured to carry the film-on-chip packaging tape 10 located below the second pasting mechanism 150. It is worth noting that the first carrier 130 and the second carrier 160 each have at least two vertically movable platforms, namely, movable platforms 1301 and 1302 on the first carrier 130, and movable platforms 1601 and 1602 on the second carrier 160. Therefore, when attaching the heat sink, the movable platforms 1301 and 1601 on the first carrier 130 and the second carrier 160 can be raised and lowered to coordinate with the first attaching mechanism 120 and the second attaching mechanism 150 during the attaching operation. In other feasible embodiments, the first carrier 130 and the second carrier 160 can also be fixed platforms, supporting the transport of the Chip on Film package reel 10 on a flat surface.

[0027] like Figure 1C As shown, the film chip-on-film packaging tape 10 may include at least a flexible substrate 2, a circuit layer 4, a chip 6, and an underfill 8, wherein the circuit layer 4 is disposed on the flexible substrate 2, the chip 6 is flip-chip bonded to the circuit layer 4, and the underfill 8 covers at least the sidewalls of the chip 6. In addition, a solder mask (not shown) may be optionally disposed on the circuit layer 4, and the first heat sink 20 and the second heat sink 30 are respectively attached to the back surface of the chip 6 and the bottom surface of the flexible substrate 2 corresponding to the chip position, forming a double-sided heat sink structure. The main material of the first heat sink 20 and the second heat sink 30 is, for example, metal or other suitable thermally conductive materials. In this embodiment, aluminum sheets are used as an example.

[0028] In some embodiments, the flipping mechanism 140 is located at the end of the first conveying path P1 and at the starting end of the second conveying path P2. The first conveying path P1 is configured to convey the film-on-chip package tape 10 with the first side 10a facing upward, and the second conveying path P2 is configured to convey the film-on-chip package tape 10 with the second side 10b facing upward, but the present invention is not limited to this.

[0029] In some embodiments, there is a height difference between the first conveying path P1 and the second conveying path P2 , for example, the first conveying path P1 is lower than the second conveying path P2 , but the present invention is not limited thereto.

[0030] In some embodiments, the heat sink laminating machine 100 further includes a steering mechanism 180, wherein the steering mechanism 180 is located between the feeding mechanism group 110 and the flipping mechanism 140 and is configured to cause the chip-on-film packaging tape 10 to turn the second conveying path P2 to a third conveying path P3 that is consistent with the direction of the first conveying path P1, that is, the chip-on-film packaging tape 10 of the second conveying path P2 has the second surface 10b facing upward, and after being turned to the third conveying path P3 by the steering mechanism 180, the chip-on-film packaging tape 10 of the third conveying path P3 has the first surface 10a facing upward, but the present invention is not limited to this.

[0031] In some embodiments, as Figure 1D As shown, the steering mechanism 180 further includes steering wheels 182. Specifically, the steering wheels 182 can be two identical wheels spaced a suitable distance apart and arranged on the same axis. The spaced distance forms a hollow portion 184 for transporting the CFP tape 10. With the two sides of the CFP tape 10 resting against the steering wheels 182, the packaged chips 6 or the bonded areas can be accommodated within the hollow portion 184 for transport. This ensures that the packaged chips 6 or bonded areas are not damaged by direct contact. However, the present invention is not limited to this. In other embodiments, the steering wheel 182 can be a single wheel with a hollow portion formed in the wheel surface to transport the CFP tape 10 and protect the function of the packaged chips 6. Furthermore, the steering wheel 182 rotates in a second direction R2 opposite to the first direction R1. Here, the first direction R1 is, for example, counterclockwise, and the second direction R2 is, for example, clockwise, but the present invention is not limited to this.

[0032] In some embodiments, the flipping mechanism 140 or the take-up tape wheel 172, etc., which need to receive the completed packaged or pasted tape, may include a rotating wheel similar to the steering wheel 182, wherein the rotating wheel also has a hollow portion and is configured on the surface of the first heat sink 20 on the corresponding film chip package tape 10, so that the packaged chip or the pasted area can be properly accommodated in the hollow portion, avoiding damage to the product due to direct contact between the tape and the rotating wheel during transportation and winding, but the present invention is not limited to this.

[0033] In some embodiments, the feeding mechanism assembly 110 further includes an outfeed tape reel 112 and a first spacing tape reel 114. The outfeed tape reel 112 is configured to provide the Chip on Film Package tape 10, while the first spacing tape reel 114 is configured to reel the first spacing tape 40a on the Chip on Film Package tape 10. The outfeed tape reel 112 and the first spacing tape reel 114 simultaneously transport the Chip on Film Package tape 10 and reel the first spacing tape 40a, but the present invention is not limited thereto.

[0034] In some embodiments, the rewinding mechanism assembly 170 further includes a rewinding wheel 172 and a second spacer tape wheel 174. The Chip on Film Package (CFP) tape 10, with the first heat sink 20 attached to the first side 10a and the second heat sink 30 attached to the second side 10b, is received by the rewinding wheel 172. The second spacer tape wheel 174 provides a second spacer tape 40b to cover and protect the already bonded Chip on Film Package (CFP) tape 10, and the tape is then rewound onto the rewinding wheel 172. However, the present invention is not limited thereto.

[0035] In some embodiments, the heat sink laminating machine 100 further includes a first pressing mechanism 192 and a second pressing mechanism 194, wherein the first pressing mechanism 192 is arranged on the first transmission path P1 after the first laminating mechanism 120 and is arranged above the movable platform 1302 of the first carrier 130, so as to press the first heat sink 20 laminating by the first laminating mechanism 120 to be flatly attached to the surface of the first surface 10a in cooperation with the movable platform 1302 of the first carrier 130 to rise, and the second pressing mechanism 194 is arranged after the second laminating mechanism 150 and is located on the second transmission path P2, and is also arranged above the movable platform 1602 of the second carrier 160, so as to press the second heat sink 30 laminating by the second laminating mechanism 150 to be flatly attached to the surface of the second surface 10b to increase the attachment strength. In this embodiment, the first pressing mechanism 192 and the second pressing mechanism 194 are used, for example, a roller mechanism, which presses the first heat sink 20 and the second heat sink 30 together with the first carrier 130 and the second carrier 160 to be flatly attached to the surface of the film flip chip packaging tape 10 in a rolling manner, but the present invention is not limited to this.

[0036] In some embodiments, the heat sink laminating machine 100 further includes a first inspection mechanism 196 and a second inspection mechanism 198 . The first inspection mechanism 196 is located after the first pressing mechanism 192 and is configured to obtain a first inspection result, while the second inspection mechanism 198 is located after the second pressing mechanism 194 and is configured to obtain a second inspection result to inspect the heat sink's attachment strength or product reliability, but the present invention is not limited thereto. The first inspection mechanism 196 and the second inspection mechanism 198 may be any device with inspection capabilities, such as a CCD camera lens.

[0037] In some embodiments, the operation of the heat sink laminating machine 100 can be controlled by a controller (not shown) to improve the smoothness of the inspection process of the heat sink laminating machine 100. For example, the controller can be a central processing unit (CPU), other programmable general-purpose or special-purpose microprocessors, digital signal processors (DSPs), programmable controllers, application-specific integrated circuits (ASICs), programmable logic devices (PLDs), other similar processing devices, or a combination of these devices, and can have built-in or external memory, but the present invention is not limited thereto.

[0038] It should be noted that the "afterwards" mentioned in the above embodiments may not be an actual relative positional relationship, but may simply represent the order in which the film chip packaging tape is conveyed. The actual relative positional relationship of the feeding mechanism assembly 110, the first pasting mechanism 120, the flipping mechanism 140, the second pasting mechanism 150, the receiving mechanism assembly 170, the steering mechanism 180, the first pressing mechanism 192, the second pressing mechanism 194, the first inspection mechanism 196, and the second inspection mechanism 198 may be determined based on design requirements. Furthermore, the wheel diameters and proportional relationships of the rotating wheels, steering wheels, or rotating wheels shown in the drawings of the present invention, as well as the size ratios of the packaged chips, are for illustration purposes only and are not limited to the dimensions shown in the drawings.

[0039] In addition, the number of heat sinks attached by the first and second adhesive mechanisms 120 and 150 in one operation can be adjusted according to actual design requirements. For example, the first and second adhesive mechanisms 120 and 150 can attach one or more heat sinks to the chip-on-film package tape 10 in one operation.

[0040] In summary, the heat sink pasting machine of the present invention first attaches the first heat sink to the first side of the chip-on-film packaging tape through the configuration of the first pasting mechanism. Then, by arranging a flipping mechanism after the first pasting mechanism, the chip-on-film packaging tape is flipped upside down and the chip-on-film packaging tape is turned from the first conveying path to the second conveying path opposite to the first conveying path. Thereafter, by arranging a second pasting mechanism after the flipping mechanism, the second heat sink is attached to the second side of the chip-on-film packaging tape opposite to the first side. In this way, double-sided pasting can be performed at one time, and the automated pasting operation reduces the consumption of human resources, further improving the pasting efficiency of the heat sink pasting machine and reducing labor costs.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat sink pasting machine, characterized in that: include: a feeding mechanism group, configured to provide a Chip-on-Film packaging tape and to move the Chip-on-Film packaging tape toward a first conveying path; a first pasting mechanism, disposed behind the feeding mechanism group and located on the first conveying path, wherein the first pasting mechanism is configured to adhere the first heat sink to the first surface of the chip-on-film package tape; a first pressing mechanism, disposed after the first adhering mechanism and located on the first transmission path, for pressing and fixing the first heat sink to the first surface; A first carrier is provided for carrying the chip-on-film packaging tape located below the first pasting mechanism and the first pressing mechanism; a flipping mechanism disposed behind the first pasting mechanism and configured to rotate in a first direction to flip the chip-on-film packaging tape upside down and divert the chip-on-film packaging tape from the first conveying path to a second conveying path opposite to the first conveying path; a second pasting mechanism, disposed behind the flipping mechanism and located on the second conveying path, wherein the second pasting mechanism is configured to adhere the second heat sink to a second surface of the chip-on-film package tape opposite to the first surface; a second pressing mechanism, disposed behind the second adhering mechanism and located on the second transmission path, for pressing and fixing the second heat sink to the second surface; A second carrier is provided for carrying the chip-on-film packaging tape located below the second pasting mechanism and the second pressing mechanism; as well as The material receiving mechanism is arranged behind the second pasting mechanism and is configured to reel up the chip-on-film packaging tape.

2. The heat sink pasting machine according to claim 1, characterized in that: It also includes a steering mechanism located between the feeding mechanism group and the flipping mechanism, wherein the steering mechanism is configured to cause the TFCP tape to turn the second conveying path to a third conveying path that is consistent with the direction of the first conveying path.

3. The heat sink pasting machine according to claim 2, characterized in that: The steering mechanism further includes a steering wheel having a first hollow portion on its wheel surface. The first hollow portion is arranged corresponding to the surface of the chip-on-film package tape having the second heat sink, and the steering wheel rotates in a second direction opposite to the first direction.

4. The heat sink pasting machine according to claim 1, characterized in that: The flipping mechanism includes a rotating wheel. The wheel surface of the rotating wheel has a second hollow portion. The second hollow portion is configured to correspond to the surface of the chip-on-film package tape having the first heat sink.

5. The heat sink pasting machine according to claim 1, characterized in that: The feeding mechanism group also includes a discharge tape wheel and a first spacing tape wheel. The discharge tape wheel is configured to provide the transmission of the thin film chip packaging tape, and the first spacing tape wheel is configured to rewind the first spacing tape on the thin film chip packaging tape. The discharge tape wheel and the first spacing tape wheel simultaneously transmit the thin film chip packaging tape and rewind the first spacing tape.

6. The heat sink pasting machine according to claim 1, characterized in that: The receiving mechanism group also includes a receiving tape wheel and a second spacing tape wheel. The film chip package tape with the first heat sink attached to the first side and the second heat sink attached to the second side is received by the receiving tape wheel, and the second spacing tape wheel provides a second spacing tape for protection and storage.

7. The heat sink pasting machine according to claim 1, characterized in that: The first carrier further includes two lifting movable platforms, which are respectively arranged below the first gluing mechanism and the first pressing mechanism, and the second carrier further includes two lifting movable platforms, which are respectively arranged below the second gluing mechanism and the second pressing mechanism.

8. The heat sink pasting machine according to claim 1, characterized in that: Also includes: a first detection mechanism, located after the first pressing mechanism and configured to obtain a first detection result; as well as The second detection mechanism is located behind the second pressing mechanism and is configured to obtain a second detection result.

9. The heat sink pasting machine according to claim 1, characterized in that: The flipping mechanism is located at the end of the first conveying path and at the starting end of the second conveying path. The first conveying path is configured to convey the FILM COP tape with the first side facing upward, and the second conveying path is configured to convey the FILM COP tape with the second side facing upward.

10. The heat sink pasting machine according to claim 9, characterized in that: There is a height difference between the first conveying path and the second conveying path.

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