Substrate processing apparatus and supply valve

Abstract

The present invention relates to a substrate processing apparatus and a supply valve. The supply valve (21) has a configuration (an on-off valve chamber (65), a valve seat (71), a diaphragm (73), and an on-off drive section (75)) that functions as an on-off valve (55). An exhaust flow path (103) that discharges bubbles in the on-off valve chamber (65) is connected to the on-off valve chamber (65). Thus, even if bubbles are generated when the on-off valve (55) is opened and closed, the bubbles in the on-off valve chamber (65) can be discharged through the exhaust flow path (103). Therefore, product defects caused by bubbles being supplied to a substrate or the like can be prevented.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus that processes a substrate and a supply valve provided in the substrate processing apparatus. The substrate can be exemplified by a semiconductor substrate, a substrate for FPD (Flat Panel Display), a glass substrate for a reticle, a substrate for an optical disc, a substrate for a magnetic disc, a ceramic substrate, a substrate for a solar cell, and the like. The FPD can be exemplified by a liquid crystal display device, an organic EL (electroluminescence) display device, and the like. BACKGROUND

[0002] Conventionally, a substrate processing apparatus is provided with a nozzle, a pipe, and a processing liquid supply source. The nozzle sprays, for example, resist liquid as a processing liquid onto a substrate. The pipe links the nozzle with the processing liquid supply source. A pump and an on-off valve are provided in the pipe in order from the upstream to the downstream of the nozzle. By keeping the on-off valve in an open state, the pump transports the resist liquid through the pipe, and the resist liquid is sprayed from the nozzle (for example, refer to Patent Documents 1 and 2).

[0003] In Patent Document 1, a collection tank is provided in the pipe between a buffer tank and the nozzle. By pressurizing the buffer tank, the processing liquid in the buffer tank is supplied to the collection tank. Further, by pressurizing the collection tank, the processing liquid in the collection tank is supplied to the nozzle.

[0004] In Patent Document 2, a distribution mechanism that distributes and supplies processing liquid to a plurality of coating modules provided in a multistage stack is disclosed. The distribution mechanism is provided with a processing liquid supply source, a pressurizing device, and a plurality of distribution units corresponding to the plurality of coating modules. The plurality of distribution units are each provided with a pump and a nozzle. The nozzle sprays the processing liquid to the corresponding coating module. The pump is disposed laterally (obliquely downward) to the corresponding coating module. The pump stores the processing liquid transported from the processing liquid supply source by the pressurizing device in the inside.

[0005] [BACKGROUND ART DOCUMENTS]

[0006] [Patent Documents]

[0007] [Patent Document 1]

[0008] Japanese Patent Laid-Open No. 2000-173902

[0009] [Patent Document 2]

[0010] Japanese Patent Laid-Open No. 2007-005576 SUMMARY

[0011] [PROBLEMS TO BE SOLVED BY THE INVENTION]

[0012] However, the conventional substrate processing apparatus has the following problems. The on-off valve sometimes generates bubbles in a processing liquid (e.g., resist) when the on-off valve is opened and closed. The generated bubbles remain in the on-off valve chamber and grow to a certain size. Moreover, there is a concern that the bubbles grown to a certain size are transported to the nozzle when the on-off valve is in the open state, and the bubbles are supplied together with the processing liquid from the nozzle to the substrate. In addition, there is a concern that the bubbles become a source of particles. These situations can cause product defects.

[0013] The present application has been achieved in view of such circumstances, and has an object to provide a substrate processing apparatus and a supply valve capable of removing bubbles generated by an on-off valve.

[0014] [Means of Solving the Problem]

[0015] The present application has the following configuration in order to achieve the object. That is, the substrate processing apparatus of the present application is characterized by including: a nozzle that ejects a processing liquid to a substrate; a supply valve that supplies the processing liquid to the nozzle; and a nozzle-side pipe that connects the nozzle and an outlet of the supply valve, and the supply valve includes: a flow path block; an on-off valve chamber formed in the flow path block; an inlet-side flow path formed in the flow path block and configured to flow a liquid between an inlet and the on-off valve chamber; an outlet-side flow path formed in the flow path block and configured to flow a liquid between the on-off valve chamber and the outlet; an on-off valve body disposed in the on-off valve chamber; a valve seat provided at an interface between the on-off valve chamber and the outlet-side flow path and configured to support the on-off valve body in the on-off valve chamber; an on-off driving section that stops the flow of the processing liquid from the on-off valve chamber to the outlet-side flow path by pressing the on-off valve body against the valve seat, and that causes the processing liquid to flow from the on-off valve chamber to the outlet-side flow path by separating the pressed on-off valve body from the valve seat; and an exhaust flow path formed in the flow path block and connected to the on-off valve chamber to exhaust bubbles in the on-off valve chamber.

[0016] According to the substrate processing apparatus of the present application, the supply valve includes an on-off valve (on-off valve chamber, valve seat, on-off valve body, and on-off driving section). The on-off valve chamber is connected to an exhaust flow path that exhausts bubbles in the on-off valve chamber. Thus, even if bubbles are generated when the on-off valve is opened and closed, the bubbles in the on-off valve chamber can be exhausted through the exhaust flow path. That is, the bubbles generated by the on-off valve can be removed. Therefore, product defects caused by the bubbles being supplied to the substrate or the like can be prevented.

[0017] In addition, in the substrate processing apparatus, it is preferable that the exhaust flow path extend in a downward direction and be connected to the on-off valve chamber. Since the exhaust flow path extends in a direction in which the bubbles move due to buoyancy, the bubbles in the on-off valve chamber can be easily removed.

[0018] Further, in the substrate processing apparatus, preferably, the inlet-side flow path has a common flow path extending in a downward direction and connected to the on-off valve chamber, and the exhaust flow path is connected to the on-off valve chamber via the common flow path to exhaust the bubbles in the on-off valve chamber. The exhaust flow path is connected to the on-off valve chamber via the common flow path connected to the inlet-side flow path. Therefore, the flow path block can be formed small. Further, since the common flow path extends in the downward direction, each of the exhaust flow path and the common flow path extends in the downward direction. Therefore, the bubbles in the on-off valve chamber can be more easily removed.

[0019] Further, in the substrate processing apparatus, preferably, a top surface of the on-off valve chamber has an inclined surface to guide the bubbles to the exhaust flow path. The inclined surface can easily cause the bubbles to be gathered in the exhaust flow path without remaining in the on-off valve chamber.

[0020] Further, in the substrate processing apparatus, preferably, the supply valve further includes a first pump chamber formed in the inlet-side flow path of the flow path block to accommodate the processing liquid, a volume change member to change a volume in the first pump chamber, and a pump drive section to drive the volume change member to perform a pump operation.

[0021] Thus, the supply valve includes a pump (the first pump chamber, the volume change member, and the pump drive section). The pump is provided in the flow path block in which the on-off valve is provided. Therefore, the distance between the pump and the on-off valve is shortened. Thus, the pressure loss due to the length of the flow path between the pump and the on-off valve can be suppressed small, and the pressure loss due to the difference in height between the pump and the on-off valve can be suppressed small. Further, in a case where the substrate processing apparatus includes a plurality of supply valves, the distance and the difference in height between the pump and the on-off valve are necessarily constant. Therefore, the pressure loss due to the length of the flow path can be easily made uniform among the plurality of supply valves.

[0022] Further, in the substrate processing apparatus, preferably, the supply valve is disposed in the liquid processing unit together with the nozzle and the nozzle-side pipe. The pump (the first pump chamber, the volume change member, and the pump drive section) of the supply valve can be disposed closer to the nozzle. The pressure loss due to the length of the flow path and the pipe from the pump of the supply valve to the nozzle can be suppressed smaller.

[0023] Further, in the substrate processing apparatus, preferably, a plurality of liquid processing units each processing a substrate are arranged in the vertical direction, and an upstream pump for delivering a processing liquid to each of the plurality of liquid processing units is provided, and each of the plurality of liquid processing units is provided with the nozzle, the supply valve provided with the first pressure sensor disposed so as to communicate with the first pump chamber in which the pressure of the processing liquid is measured, and the nozzle-side pipe, and the upstream pump is provided with a second pump chamber in which the processing liquid is accommodated, and a second pressure sensor disposed so as to communicate with the second pump chamber in which the pressure of the processing liquid is measured, and in the case where the upstream pump selectively delivers the processing liquid to any one of the plurality of liquid processing units, the pump drive portion of the supply valve of the liquid processing unit to which the processing liquid is delivered cooperates so that the first pressure value measured by the first pressure sensor of the liquid processing unit to which the processing liquid is delivered becomes a predetermined pressure value, and the second pressure value measured by the second pressure sensor is adjusted.

[0024] The height difference between the upstream pump and each liquid processing unit makes the state (ejection pressure, ejection amount, ejection flow rate, etc.) of the processing liquid ejected from the nozzle uneven. Therefore, the supply valve of each liquid processing unit is provided with a pump (first pump chamber, volume changing member, pump drive portion, etc.). Thus, the ejection state in each liquid processing unit can be made uniform. Further, if the pressure of the processing liquid delivered to the pump of each supply valve is not uniform, the load of pressure adjustment in the pump of each supply valve increases. In this regard, the present application can make the pressure of the processing liquid delivered to the pump of each supply valve uniform. Therefore, the load of pressure adjustment in the pump of each supply valve can be reduced.

[0025] Further, the supply valve of the present application is characterized by comprising: a flow passage block; a switching valve chamber formed in the flow passage block; an inlet-side flow passage formed in the flow passage block and configured to allow a liquid to flow between an inlet and the switching valve chamber; an outlet-side flow passage formed in the flow passage block and configured to allow the liquid to flow between the switching valve chamber and an outlet; a switching valve body arranged in the switching valve chamber; a valve seat arranged at the interface between the switching valve chamber and the outlet-side flow passage and configured to support the switching valve body in the switching valve chamber; a switching drive portion configured to stop the flow of the liquid from the switching valve chamber to the outlet-side flow passage by pressing the switching valve body against the valve seat, and configured to allow the liquid to flow from the switching valve chamber to the outlet-side flow passage by separating the pressed switching valve body from the valve seat; and a vent flow passage formed in the flow passage block and connected to the switching valve chamber to vent a bubble in the switching valve chamber.

[0026] The supply valve of the present invention includes a switching valve (switching valve chamber, valve seat, switching valve body, and switching drive unit). An exhaust flow path for discharging air bubbles from the switching valve chamber is connected to the switching valve chamber. Therefore, even if air bubbles are generated when the switching valve is opened and closed, the air bubbles in the switching valve chamber can be discharged through the exhaust flow path. In other words, air bubbles generated by the switching valve can be removed. Therefore, product defects caused by air bubbles being supplied onto the substrate can be prevented.

[0027] In addition, this specification also discloses the invention of the following substrate processing apparatus.

[0028] (1) The substrate processing apparatus of the present invention is characterized by comprising: a plurality of liquid processing units arranged vertically, each processing a substrate; and an upstream pump for supplying processing liquid to each of the plurality of liquid processing units; and each of the plurality of liquid processing units comprising: a nozzle for spraying processing liquid onto the substrate; a supply valve for supplying processing liquid to the nozzle; and a nozzle-side piping connecting the nozzle to the outlet of the supply valve; and the supply valve further comprising: a first pump chamber for containing processing liquid; a first pressure sensor disposed in connection with the first pump chamber for measuring the pressure of the processing liquid in the first pump chamber; a volume changing component for changing the volume in the first pump chamber; and a pump drive. The upstream pump is configured to drive the volume change component to perform pump operation; and the upstream pump includes: a second pump chamber for containing the processing liquid; and a second pressure sensor connected to the second pump chamber for measuring the pressure of the processing liquid in the second pump chamber; and when the upstream pump selectively delivers the processing liquid to any one of the plurality of liquid processing units, it cooperates with the pump drive unit of the supply valve of the liquid processing unit to which the processing liquid is delivered to adjust the second pressure value measured by the second pressure sensor in such a way that the first pressure value measured by the first pressure sensor of the liquid processing unit to which the processing liquid is delivered becomes a preset pressure value.

[0029] According to the invention described in (1), the following effects are achieved. The height difference between the upstream pump and each liquid processing unit causes the state of the processed liquid ejected from the nozzle (ejection pressure, ejection volume, ejection flow rate, etc.) to be uneven. Therefore, each liquid processing unit's supply valve is equipped with a pump (first pump chamber, volume change component, and pump drive unit, etc.). As a result, the ejection state in each liquid processing unit can be made consistent. In addition, if the pressure of the processed liquid supplied to the pumps of each supply valve (each liquid processing unit) is inconsistent, the pressure adjustment load in the pumps of each supply valve increases. In this respect, the present invention can make the pressure of the processed liquid supplied to the pumps of each supply valve consistent. Therefore, the pressure adjustment load in the pumps of each supply valve can be reduced.

[0030] [Invention Effects]

[0031] The substrate processing apparatus and supply valve according to the present invention can remove air bubbles generated by switching the valve. Attached Figure Description

[0032] Figure 1 (a) is a longitudinal cross-sectional view showing the general configuration of the substrate processing apparatus, and (b) is a cross-sectional view showing the general configuration of the substrate processing apparatus.

[0033] Figure 2 This is a piping diagram of the substrate processing device.

[0034] Figure 3 This is a longitudinal cross-sectional view showing the structure of the upstream pump.

[0035] Figure 4 This is a longitudinal cross-sectional view showing the configuration of the supply valve.

[0036] Figure 5 It will be from Figure 4 The diagram shows a partial view of the flow path block observed by arrow AA.

[0037] Figure 6 This is a diagram used to illustrate the operation of a switching valve.

[0038] Figure 7 This is a longitudinal cross-sectional view showing the installation posture of the supply valve in Embodiment 2.

[0039] Figure 8 This is an enlarged longitudinal cross-sectional view of a portion of the supply valve in Example 2.

[0040] Figure 9 This is a piping diagram showing the configuration of the coating liquid supplied to two of the four coating units in the substrate processing apparatus used for the variation example, which are used to form an antireflective film.

[0041] Figure 10 This is a piping diagram showing the configuration of the coating liquid supplied to two of the four coating units in the substrate processing apparatus used for the variation example, which are used to form a resist film.

[0042] Figure 11 It is a longitudinal cross-sectional view showing the on / off valve of the supply valve and the exhaust flow path of the variation example. Detailed Implementation

[0043] [Example 1]

[0044] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 (a) is a longitudinal cross-sectional view showing the general configuration of the substrate processing apparatus. Figure 1 (b) is a cross-sectional view showing the general configuration of the substrate processing apparatus.

[0045] <1. Configuration of Substrate Processing Apparatus 1>

[0046] Reference Figure 1 (a) and Figure 1 (b). The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 includes a loading block 2 and a processing block 3.

[0047] Loading block 2 includes multiple (e.g., 2 or 4) carrier platforms 5 and, for example, 2 first substrate transfer mechanisms 6 (robots). Carriers C that house substrates W are placed on the carrier platforms 5. The 2 first substrate transfer mechanisms 6 can transfer substrates W between the carriers C placed on each carrier platform 5 and the 2 substrate placement units PS1 and PS2. Furthermore, the 2 substrate placement units PS1 and PS2 are located at and near the boundary between loading block 2 and processing block 3. The 2 substrate placement units PS1 and PS2 are arranged vertically.

[0048] Processing block 3 includes multiple processing units 7 and a second substrate transfer mechanism 8 (robot). The second substrate transfer mechanism 8 is configured in a longer transfer space 9 in the X direction (see reference). Figure 1 (b)). The second substrate transport mechanism 8 is capable of transporting substrate W between the two substrate mounting sections PS1, PS2 and the multiple processing units 7. The first substrate transport mechanism 6 and the second substrate transport mechanism 8 are each equipped with an electric motor and are driven by the electric motor.

[0049] like Figure 1 As shown in (b), multiple processing units 7 are arranged with a transfer space 9 between them. The multiple processing units 7 are divided into four liquid processing units 11A, 11B, 11C, 11D and other processing units 12 (e.g., heat treatment units). Figure 1 In (b), as indicated by arrow RT, four liquid processing units 11A to 11D are arranged on the first side of the transport space 9. Additionally, as indicated by arrow LT, other processing units 12 are arranged on the second side of the transport space 9.

[0050] like Figure 1 As shown in (a), four liquid processing units 11A to 11D (also referred to as modules) are arranged vertically in a stacked manner. Each liquid processing unit 11A to 11D processes the substrate W by supplying processing liquid onto the substrate W. Each liquid processing unit 11A to 11D includes two holding and rotating parts 14, a nozzle 16, and a nozzle moving mechanism 18. Furthermore, as... Figure 2 As shown, each of the liquid handling units 11A to 11D has a supply valve 21 and a nozzle-side piping 22. The nozzle-side piping 22 connects the nozzle 16 to the outlet component 64 of the supply valve 21.

[0051] Furthermore, when distinguishing supply valve 21, it is referred to as supply valve 21A, 21B, 21C, and 21D, corresponding to liquid handling units 11A to 11D. Similarly, when distinguishing nozzle 16, it is referred to as nozzle 16A, 16B, 16C, and 16D. When distinguishing nozzle-side piping 22, it is referred to as nozzle-side piping 22A, 22B, 22C, and 22D.

[0052] Two retaining rotating parts 14 each hold the substrate W in a horizontal position, causing the held substrate W to rotate. Each retaining rotating part 14 includes a rotating chuck 23 and a rotating drive part 24. The rotating chuck 23 holds the back side of the substrate W, for example, by drawing air from a suction port provided on the mounting surface of the substrate W. The rotating drive part 24 includes an electric motor that rotates the rotating chuck 23 about a vertical axis. A nozzle 16 sprays processing liquid onto the substrate W held by the retaining rotating parts 14. A nozzle moving mechanism 18 includes an electric motor that moves the nozzle 16 to any position.

[0053] Reference Figure 2 . Figure 2 This is a piping diagram of the substrate processing apparatus 1. Furthermore, for clarity, a retaining and rotating part 14 is shown in each liquid processing unit 11A-11D. The substrate processing apparatus 1 includes a delivery piping 25, a processing liquid bottle 27 (processing liquid supply source), a gas supply unit 28, a collection tank 29, an upstream pump 31, a filter 33, branch units 34, 35, 36, and four delivery control pipes 37A, 37B, 37C, and 37D. Without distinguishing between the four delivery control pipes 37A, 37B, 37C, and 37D, they are referred to as delivery control pipe 37.

[0054] The first end of the delivery pipe 25 is inserted into the processing solution bottle 27. The second end of the delivery pipe 25 is connected to the first branch 34. The processing solution bottle 27 contains the processing solution. The processing solution may be, for example, a photoresist, a coating solution for forming an antireflective film, a coating solution for forming a resist overlay film, a solvent (e.g., a diluent), a rinsing solution (e.g., DIW (Deionized Water)), a developer, or an etchant.

[0055] The gas supply unit 28 is equipped with piping and valves to supply gas to the processed liquid bottle 27. This allows the processed liquid contained in the processed liquid bottle 27 to be delivered to the delivery piping 25. The gas is, for example, an inert gas such as nitrogen. A collection tank 29 is provided on the delivery piping 25. The collection tank 29 is configured to accumulate processed liquid, and the remaining amount in the collection tank 29 is detected by a liquid level sensor (not shown).

[0056] Additionally, an exhaust pipe 30 is connected to the collection tank 29. An on / off valve V21 is installed on the exhaust pipe 30. The on / off valve V21 is normally closed. When the on / off valve V21 is open, and the following on / off valves V1, V7 to V10 are closed, the gas supply unit 28 is activated, supplying the treated liquid from the treated liquid bottle 27 to the collection tank 29. As a result, the treated liquid containing air bubbles is forced out through the exhaust pipe 30 for discharge or reuse.

[0057] Upstream pump 31 selectively delivers the processed liquid to each of the four liquid processing units 11A to 11D. Upstream pump 31 is installed in the delivery piping 25 between collection tank 29 and the first branch 34. For example... Figure 3 As shown, the upstream pump 31 includes a pump chamber 41, a diaphragm 43, a pump drive unit 44, and a pressure sensor 50. The pump drive unit 44 includes a first connecting rod 45, a switching mechanism 47, and an electric motor 48, and performs pumping operations.

[0058] Pump chamber 41 contains the processing fluid. The periphery of diaphragm 43 is fixed to the inner wall of pump chamber 41. The first end of the first connecting rod 45 is connected to the center of diaphragm 43. The second end of the first connecting rod 45 is connected to the output shaft 48A (rotor) of electric motor 48 via a conversion mechanism 47. The conversion mechanism 47 has two or more gears, converting the rotation of the output shaft 48A of electric motor 48 into linear movement of the first connecting rod 45 along the axial direction AD1. In other words, electric motor 48 causes the center of diaphragm 43 to move forward and backward along the axial direction AD1. As a result, diaphragm 43 deforms, and the volume of pump chamber 41 changes. Pressure sensor 50 is installed in connection with pump chamber 41. Pressure sensor 50 is arranged facing diaphragm 43. Pressure sensor 50 measures the pressure of the processing fluid within pump chamber 41.

[0059] The diaphragm 43 may be a rolling diaphragm, for example. Furthermore, the pump chamber 41 corresponds to the second pump chamber of the present invention. The pressure sensor 50 corresponds to the second pressure sensor of the present invention.

[0060] Reference Figure 2 A filter 33 is installed on the delivery pipe 25 between the upstream pump 31 and the first branch 34. The filter 33 has a filter body (not shown). When the treatment liquid passes through the filter body, foreign matter (dirt) and air bubbles contained in the treatment liquid are removed by the filter body. An exhaust pipe 51 is connected to the filter 33. A switch valve V22 is installed on the exhaust pipe 51. The switch valve V22 is normally closed. When the switch valve V22 and the following switch valve V2 are in the open state, and the following switch valves V1, V3 to V6 are in the closed state, the upstream pump 31 is activated to deliver the treatment liquid from the upstream pump 31 to the filter 33. As a result, the treatment liquid containing air bubbles that cannot pass through the filter body is discharged or reused through the exhaust pipe 51.

[0061] The second end of the delivery pipe 25 is connected to the first branch 34. Furthermore, the first ends of two delivery control pipes 37A and 37D are connected to the first branch 34. Additionally, delivery control pipe 37B is connected to delivery control pipe 37D via the second branch 35. Delivery control pipe 37C is connected to delivery control pipe 37D via the third branch 36. Thus, the processed liquid delivered to the first branch 34 via the delivery pipe 25 can be delivered to each of the four delivery control pipes 37A to 37D. Moreover, the second ends of the four delivery control pipes 37A to 37D are respectively connected to the four supply valves 21A to 21D of the four liquid processing units 11A to 11D. For example, the second end of delivery control pipe 37A is connected to the supply valve 21A of the lowest-level liquid processing unit 11A. Additionally, the second end of delivery control pipe 37D is connected to the supply valve 21D of the highest-level liquid processing unit 11D.

[0062] In addition, Figure 2 In this configuration, the conveying control pipe 37B is connected to the conveying control pipe 37D via the second branch 35, and the conveying control pipe 37C is connected to the conveying control pipe 37D via the third branch 36. In this regard, each of the four conveying control pipes 37A to 37D may also be directly connected to the first branch 34 connected to the conveying pipe 25.

[0063] A flow meter 53A is installed on nozzle-side piping 22A. Similarly, a flow meter 53B is installed on nozzle-side piping 22B. A flow meter 53C is installed on nozzle-side piping 22C. A flow meter 53D is installed on nozzle-side piping 22D. For example, flow meter 53A measures the flow rate of the processed liquid in nozzle-side piping 22A. Similarly, three flow meters 53B to 53D measure the flow rate of the processed liquid in nozzle-side piping 22B to 22D, respectively.

[0064] <1-1. Composition of supply valves 21 (21A, 21B, 21C, 21D)>

[0065] like Figure 2 As shown, supply valve 21A, along with nozzle 16A and nozzle-side piping 22A, is disposed within the processing space of liquid processing unit 11A. Similarly, supply valve 21B, along with nozzle 16B and nozzle-side piping 22B, is disposed within the processing space of liquid processing unit 11B. Supply valves 21C and 21D are disposed similarly. Furthermore, as... Figure 1 As shown in (b), the supply valve 21 is positioned between the two retaining rotating parts 14.

[0066] Reference Figure 4 , Figure 5 . Figure 4 This is a longitudinal cross-sectional view showing the configuration of the supply valve 21. Figure 5 It will be from Figure 4The diagram shows a partial view of flow path block 61 when viewed through arrow AA. Supply valve 21 supplies treatment fluid to nozzle 16. Supply valve 21 includes a switching valve 55 (distribution valve), a pump 57, and a backflow valve 59. Supply valve 21 includes flow path block 61, inlet component 63, and outlet component 64. Treatment fluid flows into the interior of supply valve 21 from the tubular inlet component 63. Treatment fluid inside supply valve 21 flows out from the tubular outlet component 64.

[0067] The flow path block 61 is shared by the on / off valve 55, the pump 57, and the back suction valve 59. The flow path block 61 may be formed, for example, of a thermoplastic and melt-flowing fluoropolymer such as PFA (perfluoroalkoxyalkane) or other resins. The flow path block 61 may also be formed of a fluoropolymer such as PTFE (polytetrafluoroethylene).

[0068] The flow path block 61 has an upper surface 61T, a lower surface 61B, a left side surface 61L, and a right side surface 61R. A switch valve chamber 65, an inlet-side flow path 67, and an outlet-side flow path 69 are formed in the flow path block 61.

[0069] An inlet 67A is formed at the first end of the inlet-side flow path 67, opening onto the left side face 61L. The second end of the inlet-side flow path 67 is connected to the switching valve chamber 65. That is, the inlet-side flow path 67 is configured to allow the processing liquid (liquid) to flow between the inlet 67A and the switching valve chamber 65. An inlet component 63 is installed at the inlet 67A of the flow path block 61 in communication with the inlet-side flow path 67.

[0070] The first end of the outlet-side flow path 69 is connected to the switch valve chamber 65. An outlet 69A is formed at the second end of the outlet-side flow path 69, opening on the right side face 61R. In other words, the outlet-side flow path 69 is configured to allow the processing fluid to flow between the switch valve chamber 65 and the outlet 69A. An outlet component 64 is installed at the outlet 69A of the flow path block 61 in communication with the outlet-side flow path 69.

[0071] The supply valve 21 also includes a valve seat 71, a diaphragm 73 (switch valve body), and a switch drive unit 75. The valve seat 71 is formed in the flow path block 61. The valve seat 71 is located at the junction (including the vicinity of the junction) between the switch valve chamber 65 and the outlet side flow path 69. The valve seat 71 is configured to support the diaphragm 73, which serves as the switch valve body, within the switch valve chamber 65.

[0072] A diaphragm 73 is disposed within a valve chamber 65. The diaphragm 73 has a thick-walled portion 73A and a thin-walled portion 73B. The thick-walled portion 73A is pressed against the valve seat 71. The thin-walled portion 73B is formed at the outer edge of the thick-walled portion 73A. The outer edge of the thin-walled portion 73B is fixed to the inner wall of the valve chamber 65. The diaphragm 73 connects the valve chamber 65 and...Figure 4 The space 76 shown is separated. The diaphragm 73 is configured to prevent the processing fluid in the switch valve chamber 65 from leaking into the space 76.

[0073] The switch drive unit 75 is configured to stop the flow of the processing fluid from the switch valve chamber 65 to the outlet flow path 69 by pressing the diaphragm 73 against the valve seat 71, and to allow the processing fluid to flow from the switch valve chamber 65 to the outlet flow path 69 by moving the pressed diaphragm 73 away from the valve seat 71. The switch drive unit 75 includes a second link 78, a switching mechanism 79, and an electric motor 80. The first end of the second link 78 is connected to the thick-walled portion 73A of the diaphragm 73. The second end of the second link 78 is connected to the output shaft 80A (rotor) of the electric motor 80 via the switching mechanism 79. The switching mechanism 79 has two or more gears, which convert the rotation of the output shaft 80A of the electric motor 80 into linear movement of the second link 78 along the axial direction AD2. In other words, the electric motor 80 causes the thick-walled portion 73A of the diaphragm 73 to move forward and backward along the axial direction AD2. As a result, the thick-walled portion 73A presses against the valve seat 71, while the thick-walled portion 73A moves away from the valve seat 71.

[0074] The switching valve chamber 65 is formed with an opening in the lower surface 61B of the flow path block 61. The diaphragm 73 and the switching drive unit 75 are installed in the flow path block 61 to block the opening of the switching valve chamber 65.

[0075] A pump 57 is provided upstream of the supply valve 21 and the switching valve 55. The pump 57 includes a pump chamber 82, a diaphragm 83 (volume changing component), a pump drive unit 85, and a pressure sensor 86. The pump chamber 82 contains the processing fluid. The pump chamber 82 is formed in the inlet-side flow path 67 of the flow path block 61. That is, the pump chamber 82 is formed in a manner that it is contained within the inlet-side flow path 67. The diaphragm 83 changes the volume of the pump chamber 82. The periphery of the diaphragm 83 is fixed to the inner wall of the pump chamber 82. For example, a rolling diaphragm is used for the diaphragm 83.

[0076] Furthermore, pump chamber 82 corresponds to the first pump chamber of the present invention. Pressure sensor 86 corresponds to the first pressure sensor of the present invention.

[0077] The pump drive unit 85 drives the diaphragm 83 to perform pumping operation. The pump drive unit 85 includes a third link 88, a conversion mechanism 89, and an electric motor 90. The first end of the third link 88 is connected to the center of the diaphragm 83. The second end of the third link 88 is connected to the output shaft 90A (rotor) of the electric motor 90 via the conversion mechanism 89. The conversion mechanism 89 has two or more gears, which convert the rotation of the output shaft 90A of the electric motor 90 into linear movement of the third link 88 along the axial direction AD3. Therefore, the center of the diaphragm 83 moves forward and backward along the axial direction AD3. As a result, the diaphragm 83 deforms, and the volume inside the pump chamber 82 changes. A pressure sensor 86 is provided in connection with the pump chamber 82. The pressure sensor 86 is arranged opposite to the diaphragm 83. The pressure sensor 86 measures the pressure of the processed fluid inside the pump chamber 82.

[0078] Additionally, the supply valve 21 has a backflow valve 59 downstream of the switching valve 55. The backflow valve 59 includes a backflow valve chamber 92, a diaphragm 93, and a backflow drive unit 95. The backflow valve chamber 92 is formed in the outlet-side flow path 69 of the flow path block 61. That is, the backflow valve chamber 92 is formed in a manner that it is disposed in the outlet-side flow path 69. The periphery of the diaphragm 93 is fixed to the inner wall of the backflow valve chamber 92.

[0079] The backflow drive unit 95 includes a fourth link 98, a conversion mechanism 100, and an electric motor 101. The first end of the fourth link 98 is connected to the center of the diaphragm 93. The second end of the fourth link 98 is connected to the output shaft 101A (rotor) of the electric motor 101 via the conversion mechanism 100. The conversion mechanism 100 has two or more gears, converting the rotation of the output shaft 101A of the electric motor 101 into linear movement of the fourth link 98 along the axial direction AD4. Therefore, the center of the diaphragm 93 moves forward and backward along the axial direction AD4. This causes a change in the volume of the backflow valve chamber 92.

[0080] In addition, such as Figure 4 As shown, the supply valve 21 includes an exhaust flow path 103 and a bubble discharge component 105. The exhaust flow path 103 is connected to the switch valve chamber 65 and is used to discharge bubbles within the switch valve chamber 65. The exhaust flow path 103 is formed in the flow path block 61. An outlet 103A, opening onto the upper surface 61T of the flow path block 61, is formed at the first end of the exhaust flow path 103. The tubular bubble discharge component 105 is installed at the outlet 103A of the flow path block 61 in communication with the exhaust flow path 103. The second end of the exhaust flow path 103 is connected to the inlet-side flow path 67 (hereinafter, common flow path 67B). That is, the exhaust flow path 103 extends downward and is connected to the switch valve chamber 65 via the inlet-side flow path 67 (hereinafter, common flow path 67B). More specifically, this will be explained.

[0081] The inlet-side flow path 67 extends horizontally from the inlet component 63, then changes direction downwards above the switch valve chamber 65 and connects to it. The portion of the inlet-side flow path 67 between the exhaust flow path 103 and the switch valve chamber 65 is referred to as the common flow path 67B. The common flow path 67B extends downwards and connects to the switch valve chamber 65. Furthermore, the exhaust flow path 103 extends downwards and connects to the common flow path 67B. Figure 4 In this configuration, the inlet-side flow path 67 is L-shaped. Therefore, the inlet-side flow path 67 and the exhaust flow path 103 form a T-shaped flow path. Thus, the exhaust flow path 103 is connected to the switching valve chamber 65 via a common flow path 67B, discharging air bubbles from the switching valve chamber 65. With this configuration, the common flow path 67B and the exhaust flow path 103 extend in a straight line upwards from the switching valve chamber 65, thereby enabling the smooth discharge of air bubbles from the switching valve chamber 65. Furthermore, in Figure 4 In the middle, the outlet side flow path 69 is also formed into an L shape.

[0082] Reference Figure 2 The remaining configuration of the substrate processing apparatus 1 will be described. The substrate processing apparatus 1 includes four return control pipes 107A, 107B, 107C, 107D, a first confluence section 109, a second confluence section 110, a third confluence section 111, a return pipe 112, and a fourth confluence section 114.

[0083] The first ends of the four return control pipes 107A to 107D are respectively connected to the four supply valves 21A to 21D. For example, the bubble discharge component 105 of the supply valve 21A in the lowest-level liquid processing unit 11A is connected to the return control pipe 107A. Similarly, the three bubble discharge components 105 of the three supply valves 21B to 21D are respectively connected to the return control pipes 107B to 107D.

[0084] The second end of the return control pipe 107B is connected to the return control pipe 107A via the first confluence 109. Similarly, the second end of the return control pipe 107C is connected to the return control pipe 107A via the second confluence 110. Furthermore, the second ends of the two return control pipes 107A and 107D are connected to the third confluence 111. The first end of the return pipe 112 is then connected to the third confluence 111. In addition, the second end of the return pipe 112 is connected to the delivery pipe 25 via the fourth confluence 114. The fourth confluence 114 is disposed between the processing liquid bottle 27 and the collection tank 29. Furthermore, when the supply valve 21A is upstream and the fourth confluence 114 is downstream, the first confluence 109, the second confluence 110, the third confluence 111, and the fourth confluence 114 are arranged sequentially from the upstream side. This configuration allows the treatment liquid or bubbles to return from the supply valve 21 to the upstream of the collection tank 29.

[0085] Furthermore, branch sections 34, 35, and 36, and confluence sections 109, 110, and 111 are each, for example, constructed from T-shaped pipes. The fourth confluence section 114 is constructed from a three-way valve. Additionally, the four return control pipes 107A to 107D can each be directly connected to the third confluence section 111, which is connected to the return pipe 112.

[0086] In addition, such as Figure 2 As shown, the substrate processing apparatus 1 includes 10 switching valves V1 to V10. The switching valves V1 to V10 and the switching valves V21 and V22 are driven by, for example, gas, solenoids or electric motors.

[0087] Switch valve V1 is installed on the delivery pipe 25 between the collection tank 29 and the upstream pump 31. Switch valve V2 is installed on the delivery pipe 25 between the upstream pump 31 and the filter 33. Switch valve V3 is installed on the delivery control pipe 37A between the first branch 34 and the supply valve 21A. Switch valve V4 is installed on the delivery control pipe 37B between the second branch 35 and the supply valve 21B. Switch valve V5 is installed on the delivery control pipe 37C between the third branch 36 and the supply valve 21C. Switch valve V6 is installed on the delivery control pipe 37D between the third branch 36 and the supply valve 21D.

[0088] Switch valve V7 is installed in the return flow control pipe 107A between supply valve 21A and the first confluence section 109. Switch valve V8 is installed in the return flow control pipe 107B between supply valve 21B and the first confluence section 109. Switch valve V9 is installed in the return flow control pipe 107C between supply valve 21C and the second confluence section 110. Switch valve V10 is installed in the return flow control pipe 107D between supply valve 21D and the third confluence section 111.

[0089] Upstream pump 31 selectively delivers processed liquid to any one of the four supply valves 21A to 21D based on the on / off states of the four switching valves V3 to V6. Specifically: Supply valve 21A cooperates with upstream pump 31 and switching valves V1, V2, V3, V7, and V22 to perform liquid delivery. Supply valve 21B cooperates with upstream pump 31 and switching valves V1, V2, V4, V8, and V22 to perform liquid delivery. Supply valve 21C cooperates with upstream pump 31 and switching valves V1, V2, V5, V9, and V22 to perform liquid delivery. Supply valve 21D cooperates with upstream pump 31 and switching valves V1, V2, V6, V10, and V22 to perform liquid delivery.

[0090] Furthermore, when the treatment liquid is ejected from the nozzle 16, it is not coordinated with the upstream pump 31, but the treatment liquid is delivered only by the pump 57 of the supply valve 21.

[0091] Furthermore, when the upstream pump 31 selectively supplies processing liquid to any one of the four liquid processing units 11A to 11D, such as liquid processing unit 11D, it cooperates with the pump drive unit 85 (i.e., pump 57) of the supply valve 21D of the liquid processing unit 11D to adjust the second pressure value P2 measured by the pressure sensor 50 of the upstream pump 31 so that the first pressure value P1 measured by the pressure sensor 86 of the liquid processing unit 11D is a preset positive pressure value PP. The preset positive pressure value PP is the same for all four supply valves 21A to 21D. This pressure adjustment is performed simultaneously with opening the switching valves V2 and V6 to supply processing liquid to the liquid processing unit 11D. This pressure adjustment is also performed simultaneously with managing the differential pressure value DP between the first pressure value P1 and the second pressure value P2.

[0092] Here, the preset positive pressure value PP is assumed to be, for example, 5 kPa. Using pressure sensor 86 (refer to...) Figure 4 The measured first pressure value P1 is assumed to be 5 kPa, for example, and the theoretical differential pressure value DP (second pressure value P2 - first pressure value P1) determined by the height difference is assumed to be 9 kPa, for example. In this case, the upstream pump 31 pressurizes the system so that the second pressure value P2 becomes 14 kPa. The differential pressure value DP is determined by the height difference between the upstream pump 31 and the supply valves 21A to 21D. Therefore, the higher the position of the supply valve 21, the greater the differential pressure value DP. For example, if the second pressure value P2 is 14 kPa, but the first pressure value P1 is as low as 4 kPa, the upstream pump 31 adjusts the second pressure value P2 measured by the pressure sensor 50 of the upstream pump 31 so that the first pressure value P1 measured by the pressure sensor 86 of the pump 57 becomes 5 kPa. That is, the processed fluid is further pressurized by increasing the forward speed of the diaphragm 43 and the first connecting rod 45. The upstream pump 31 delivers the further pressurized processed fluid to the pump 57. In addition, the pressure of the treatment fluid is reduced by decreasing the forward speed of the diaphragm 43 and the first connecting rod 45.

[0093] Furthermore, the second pressure value P2 can be adjusted using pump 57 of the liquid processing unit 11D that supplies the processed liquid, or it can be adjusted using both the upstream pump 31 and pump 57 of the liquid processing unit 11D that supplies the processed liquid. In this case, when the upstream pump 31 delivers the processed liquid, pump 57 pressurizes the processed liquid by reducing the retraction speed of diaphragm 83 and third connecting rod 88. Conversely, pump 57 depressurizes the processed liquid by increasing the retraction speed of diaphragm 83 and third connecting rod 88.

[0094] exist Figure 1In (a), a receiving area PA1 is provided below the four liquid handling units 11A to 11D. Within the receiving area PA1, a structure is arranged upstream of the supply valves 21A to 21D. For example, a structure such as... Figure 2 The shown components include the delivery piping 25, the processing liquid bottle 27, the collection tank 29, the upstream pump 31, the filter 33, three branch sections 34-36, and six on / off valves V1-V6. Additionally, in... Figure 1 In (a), a piping area PA2 is provided on the side of the four liquid handling units 11A to 11D. For example, four delivery control pipes 37A to 37D (partially) and four return control pipes 107A to 107D (partially) are arranged in the piping area PA2.

[0095] Substrate processing apparatus 1 includes Figure 1 (b) shows the controller 115 and a storage unit (e.g., a memory) not shown. The controller 115 includes one or more central processing units (CPUs). The controller 115 controls various components of the substrate processing apparatus 1 (e.g., the rotating unit 14, the supply valve 21, the gas supply unit 28, the upstream pump 31, and the switching valves V1 to V10, V21 to V22). The storage unit stores the computer program required for the operation of the substrate processing apparatus 1.

[0096] <2. Operation of substrate processing apparatus 1>

[0097] The operation of the substrate processing apparatus 1 will be explained. The substrate W is liquid processed using, for example, the uppermost liquid processing unit 11D among the four liquid processing units 11A to 11D. First, the substrate W is transferred to the holding and rotating part 14 of the liquid processing unit 11D.

[0098] exist Figure 1 (a) Figure 1 In (b), the carrier C is moved to the carrier placement stage 5. The first substrate transfer mechanism 6 removes the substrate W from the carrier C placed on the carrier placement stage 5 and transfers the removed substrate W to one of the two substrate placement sections PS1 and PS2. In this description, the removed substrate W is transferred to the substrate placement section PS2 located at the upper level.

[0099] The second substrate transport mechanism 8 receives the substrate W from the substrate placement unit PS2 and transports the received substrate W to any processing unit 7 (11A-11B, 12). The substrate W is transported to the uppermost liquid processing unit 11D, for example, after undergoing heat treatment or cooling treatment using other processing units 12. Furthermore, the substrate W is placed on the rotating chuck 23 of one of the two holding rotating units 14 of the liquid processing unit 11D. The holding rotating unit 14 holds the placed substrate W.

[0100] Next, refer to Figure 2 , Figure 4 , Figure 6 The liquid transport operation using upstream pump 31 and supply valve 21D is explained. Figure 6 This diagram illustrates the operation of the switching valve 55 of the switching valves V1 to V10, V22, and supply valve 21. Furthermore, in Figure 6 In the section "V3 / V4 / V5 / V6" related to the four switching valves V3 to V6, "Open" indicates that any one of the four switching valves V3 to V6 is selectively in the open state. Conversely, "Closed" indicates that all four switching valves V3 to V6 are in the closed state. This is also true for the section "V7 / V8 / V9 / V10" related to the four switching valves V7 to V10, and for the section "55" related to the four switching valves 55 of the four supply valves 21A to 21D.

[0101] [Step S01] Suction process of upstream pump 31

[0102] exist Figure 2 In this configuration, the switching valve V1 is in the open (ON state), while the switching valves V2-V10, V22, and the four supply valves 21A-21D are in the closed (OFF state). In this state, the upstream pump 31 retracts its diaphragm 43 and first connecting rod 45 away from the pressure sensor 50. This increases the capacity of the pump chamber 41, drawing the treated fluid into the pump chamber 41 of the upstream pump 31.

[0103] [Step S02] Filtration process using filter 33

[0104] The treatment fluid drawn into the pump chamber 41 of the upstream pump 31 is transported through the delivery pipe 25 and the filter 33 to the pump chamber 82 of the pump 57 of the supply valve 21D. As the treatment fluid is transported from the upstream pump 31 to the pump 57 of the supply valve 21D, foreign matter and air bubbles in the treatment fluid are removed by the filter 33.

[0105] The specific explanation is as follows. First, the switching valves 55 of the switching valves V1 to V10, V22, and the four supply valves 21A to 21D are closed. In this state, the upstream pump 31 changes the volume of the pump chamber 41 so that the second pressure value P2 measured by the pressure sensor 50 becomes the preset ejection pressure.

[0106] Then, switch valves V2 and V6 are opened, while switch valves V1, V3-V5, V7-V10, V22, and switch valve 55 of supply valves 21A-21D are closed. In this state, upstream pump 31 moves diaphragm 43 and first connecting rod 45 closer to pressure sensor 50. As a result, the volume of pump chamber 41 of upstream pump 31 decreases, and processed liquid is discharged from pump chamber 41 to filter 33. Simultaneously with the operation of upstream pump 31, pump 57 of supply valve 21D of liquid processing unit 11D moves diaphragm 83 and third connecting rod 88 backward away from pressure sensor 86. As a result, the volume of pump chamber 82 of pump 57 increases, and processed liquid is drawn into pump chamber 82 of pump 57 of supply valve 21D.

[0107] Here, when the upstream pump 31 selectively supplies processing liquid to any one of the four liquid processing units 11A to 11D, such as liquid processing unit 11D, it cooperates with the pump drive unit 85 (pump 57) of the supply valve 21D of the liquid processing unit 11D to supply the processing liquid, so that the pressure sensor 86 of the liquid processing unit 11D (see reference) is utilized. Figure 4 The first pressure value P1 measured is used as the preset positive pressure value PP, and the second pressure value P2 measured by the pressure sensor 50 of the upstream pump 31 is adjusted.

[0108] [Step S03] Exhaust process of pump 57

[0109] Switch valve V10 is in the open state, while switch valves V1-V9, V22, and supply valves 21A-21D's switch valve 55 are in the closed state. In this state, pump 57 of supply valve 21D causes diaphragm 83 and third connecting rod 88 to move slightly closer to pressure sensor 86. This movement is preset. Thus, in Figure 4 In this process, the volume of pump chamber 82 is slightly reduced, and the processing liquid in pump chamber 82 is not sent to the switch valve chamber 65 side, but to the exhaust flow path 103 and the bubble discharge component 105 side. In addition, the processing liquid sent from pump chamber 82 flows sequentially to inlet flow path 67, exhaust flow path 103, bubble discharge component 105 and return control pipe 107D.

[0110] Here, the valve chamber 65 of the switching valve 55 is connected to the exhaust flow path 103 via a common flow path 67B (inlet-side flow path 67). Air bubbles within the valve chamber 65 can move to the exhaust flow path 103. These air bubbles, having moved to the exhaust flow path 103, are then transported to the air bubble discharge component 105 or the return flow control pipe 107D by the flow of the processing liquid caused by the pump 57. Additionally, in this process, air bubbles generated in the pump 57 or upstream of the pump 57 can also be transported to the return flow control pipe 107D, etc.

[0111] Furthermore, the bubbles and treatment fluid transported to the return control pipe 107D are sequentially returned to the third confluence section 111, the return pipe 112, and the fourth confluence section 114. The treatment fluid returned to the fourth confluence section 114 is transported to the treatment fluid bottle 27. Thus, the relatively expensive treatment fluid can be effectively utilized without being wasted.

[0112] [Step S04] Spraying process using pump 57

[0113] First, the switching valves 55 of the switching valves V1 to V10, V22, and the four supply valves 21A to 21D are closed. In this state, the pump 57 of the supply valve 21D changes the volume of the pump chamber 82 so that the first pressure value P1 measured by the pressure sensor 86 of the supply valve 21D becomes the preset ejection pressure.

[0114] Then, the switch valve 55 of supply valve 21D is opened, while the switch valves V1-V10, V22, and the switch valves 55 of the three supply valves 21A-21C are closed. In this state, the pump 57 of supply valve 21D advances the diaphragm 83 and the third connecting rod 88. As a result, the volume of pump chamber 82 decreases correspondingly with the amount of movement of diaphragm 83 and the third connecting rod 88. Therefore, the treatment fluid in pump chamber 82 of supply valve 21D is conveyed to switch valve chamber 65 and outlet flow path 69, and is ejected from nozzle 16. Furthermore, the treatment fluid in pump chamber 82 is sequentially conveyed to switch valve chamber 65, back suction valve chamber 92, and outlet component 64 through inlet flow path 67 and outlet flow path 69. The treatment fluid conveyed to outlet component 64 is sequentially conveyed to nozzle side piping 22D and nozzle 16D (see reference). Figure 2 ).

[0115] In addition, during the discharge of the treatment fluid from the pump chamber 82, the pump 57 of the supply valve 21D increases or decreases the forward speed of the diaphragm 83 and the third link 88 in such a way that the first pressure value P1 measured by the pressure sensor 86 of the supply valve 21D is maintained at a preset discharge pressure.

[0116] During the ejection of the treatment liquid, the rotating part 14 can either rotate the held substrate W or keep it stationary. When a preset amount of treatment liquid is ejected from the nozzle 16D, the switching valve 55 of the supply valve 21D is closed, and the movement of the diaphragm 83 and the third link 88 of the pump 57 of the supply valve 21D is stopped.

[0117] Furthermore, when the diaphragm 73 is disengaged from the valve seat 71 and the on / off valve 55 of the supply valve 21D is in the open state (i.e., when the processing liquid is being ejected from the nozzle 16D), the back suction valve 59 of the supply valve 21D reduces the volume of the back suction valve chamber 92 by advancing the diaphragm 93 and the fourth connecting rod 98. Conversely, when the diaphragm 73 is pressed against the valve seat 71 and the on / off valve 55 of the supply valve 21D is in the closed state (i.e., when the processing liquid is no longer being ejected from the nozzle 16D), the back suction valve 59 of the supply valve 21D increases the volume of the back suction valve chamber 92 by retracting the diaphragm 93 and the fourth connecting rod 98. When the volume increases, the processing liquid in the nozzle 16D is drawn towards the supply valve 21D side, preventing droplets of processing liquid from dripping from the nozzle 16A.

[0118] Alternatively, the suction and ejection processes can be performed simultaneously. In this case, for example, the suction and ejection processes (steps S01+S04), the filtration process (step S02), and the rinsing process (step S03) can be repeated sequentially.

[0119] Additionally, assuming that in step S02, for example, 5 ml of treatment solution is delivered to the pump chamber 82 of pump 57, after the ejection process in step S04, for example, 1 ml of treatment solution remains in the pump chamber 82. In this case, it is also possible to... Figure 6 Step S21 is performed to return the remaining treatment liquid to the fourth confluence section 114.

[0120] Specifically, the switching valve V10 is in the open state, while the switching valves V1-V9, V22, and the switching valve 55 of the supply valves 21A-21D are in the closed state. In this state, the pump 57 of the supply valve 21D propels the diaphragm 83 and the third connecting rod 88 toward the pressure sensor 86. As a result, the remaining processing fluid returns to the fourth confluence section 114 via the return pipe 112. By keeping the processing fluid flowing, it is possible to prevent the processing fluid (e.g., corrosion inhibitor) from solidifying and generating foreign matter. In this case, the operation is performed in the order of steps S01, S02, S03, S04, and S21. Furthermore, step S01 may be performed in parallel with step S04 or step S21.

[0121] In addition, after the upstream pump 31 delivers the treatment fluid to the supply valve 21D, it can deliver the treatment fluid to the supply valve 21D again, or selectively deliver the treatment fluid to any of the other three supply valves 21A to 21C (e.g., supply valve 21A).

[0122] After the substrate W is treated with the sprayed processing liquid, the holding rotating part 14 releases the substrate W from the state where the rotation of the substrate W has stopped. The second substrate transport mechanism 8 receives the substrate W from the holding rotating part 14 of the liquid processing unit 11D. After the second substrate transport mechanism 8 delivers the received substrate W to other processing units 12 as needed, it transports the substrate W to the substrate placement part PS2. The first substrate transport mechanism 6 receives the substrate W that has been transported to the substrate placement part PS2 and returns the received substrate W to the carrier C placed on the carrier placement stage 5.

[0123] According to this embodiment, the supply valve 21 includes a switching valve 55 (switching valve chamber 65, valve seat 71, diaphragm 73, and switching drive unit 75). An exhaust flow path 103 for discharging air bubbles from the switching valve chamber 65 is connected to the switching valve chamber 65. Therefore, even if air bubbles are generated when the switching valve 55 is opened and closed, the air bubbles in the switching valve chamber 65 can be discharged through the exhaust flow path 103. In other words, air bubbles generated by the switching valve 55 can be removed. Therefore, product defects caused by air bubbles being supplied to the substrate W can be prevented.

[0124] Furthermore, the exhaust flow path 103 extends downward and connects to the switch valve chamber 65. Because the exhaust flow path 103 extends in the direction in which the air bubbles move due to buoyancy, air bubbles in the switch valve chamber 65 can be easily removed.

[0125] Furthermore, the inlet-side flow path 67 has a common flow path 67B extending downwards and connected to the switch valve chamber 65. Moreover, the exhaust flow path 103 is connected to the switch valve chamber 65 via the common flow path 67B, discharging air bubbles from within the switch valve chamber 65. The exhaust flow path 103 is connected to the switch valve chamber 65 via the common flow path 67B connected to the inlet-side flow path 67. Therefore, the flow path block 61 can be made smaller. Furthermore, because the common flow path 67B extends downwards, both the exhaust flow path 103 and the common flow path 67B extend downwards. Therefore, it is easier to remove air bubbles from the switch valve chamber 65.

[0126] Furthermore, the supply valve 21 includes a pump 57 (pump chamber 82, diaphragm 83, and pump drive unit 85). The pump 57 is installed in the flow path block 61 where the switching valve 55 is located. Therefore, the distance between the pump 57 and the switching valve 55 is shortened. As a result, pressure loss caused by the flow path length between the pump 57 and the switching valve 55 can be minimized, and pressure loss caused by the height difference between the pump 57 and the switching valve 55 can also be minimized. In addition, when the substrate processing apparatus 1 has multiple supply valves 21, the distance and height difference between the pump 57 and the switching valve 55 must remain constant. Therefore, pressure loss caused by the flow path length can be made consistent among the multiple supply valves 21.

[0127] Furthermore, for example, supply valve 21A is arranged together with nozzle 16A and nozzle-side piping 22D within the processing space of liquid processing unit 11A. This allows the pump 57 (pump chamber 82, diaphragm 83, and pump drive unit 85) of supply valve 21A to be closer to nozzle 16A. This reduces pressure loss caused by the flow path and piping length from pump 57 of supply valve 21A to nozzle 16A. Additionally, the electric motor 90 of supply valve 21A can be, for example, an electric motor with a smaller torque than the electric motor 48 of upstream pump 31. The same applies to the other three supply valves 21B to 21D.

[0128] [Example 2]

[0129] Next, Embodiment 2 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions that are repeated in Embodiment 1 will be omitted.

[0130] In Example 1 Figure 4 , Figure 5 In the middle, the top surface 65A of the switch valve chamber 65 is horizontal. The top surface 65A is... Figure 5 The portion is indicated by dotted shading. In this respect, in embodiment 2, the top surface 65A of the switching valve chamber 65 has an inclined surface 65A to guide bubbles to the exhaust flow path 103. The inclined surface 65A allows bubbles to easily accumulate in the exhaust flow path 103 without remaining in the switching valve chamber 65.

[0131] Figure 7 This diagram shows the installation position of the supply valve 21 in Embodiment 2. Figure 7 and the following Figure 8 In the diagram, the arrow represented by the symbol Z indicates the vertical direction. Figure 7 The supply valve 21 of Embodiment 2 shown is used to... Figure 4 The supply valve 21 is shown tilted. That is to say, Figure 7 The supply valve 21 shown is installed in the liquid handling units 11A to 11D in an inclined position.

[0132] The direction of inclination will be explained. The connection between the common flow path 67B and the switching valve chamber 65 is disposed within the switching valve chamber 65 on the inlet member 63 side. Therefore, the supply valve 21 is disposed with the outlet member 64 lower than the inlet member 63. As a result, approximately the entire surface of the top surface 65A is inclined, thus, air bubbles within the switching valve chamber 65 are easily guided to the common flow path 67B and the exhaust flow path 103.

[0133] Furthermore, the top surface 65A needs to be inclined, and the exhaust flow path 103 and the common flow path 67B need to extend upward (including the inclined upward) from the switch valve chamber 65. This is to facilitate the discharge of air bubbles from the switch valve chamber 65 from the air bubble discharge component 105.

[0134] Figure 8This is an enlarged longitudinal cross-sectional view of a portion of the supply valve 21 in a variation of Example 2. Figure 8 The top surface 65A shown is inclined relative to the horizontal upper surface 61T and lower surface 61B. That is, approximately the entire surface of the top surface 65A is an inclined surface 65A. Figure 5 The dotted shading represents the top surface 65A, which is formed in a ring shape surrounding the valve seat 71. Therefore, Figure 8 The bubble BB shown is guided along the top surface (inclined surface) 65A while passing around the valve seat 71. Thus, the bubble BB within the switching valve chamber 65 is easily guided to the common flow path 67B and the exhaust flow path 103. Furthermore, in Figure 7 , Figure 8 In the middle, the top surface (inclined surface) 65A can also be a curved surface.

[0135] The present invention is not limited to the described embodiments, and can be implemented in different ways as described below.

[0136] (1) In the various embodiments described, such as Figure 1 (a) Figure 2 As shown, the substrate processing apparatus 1 includes four stages (four layers) of liquid processing units 11A to 11D. In this respect, the substrate processing apparatus 1 may also include one or more stages of liquid processing units. Furthermore, the two or more stages of liquid processing units are arranged in the vertical direction.

[0137] (2) In the various embodiments and variations described above, the substrate processing apparatus 1 is configured to deliver processing liquid from one processing liquid bottle 27 to four liquid processing units 11A to 11D. In this respect, the substrate processing apparatus 1 may also be configured to deliver processing liquid from multiple (e.g., two) processing liquid bottles 27 to one or more liquid processing units. Figure 9 , Figure 10 As shown, for example, the substrate processing apparatus 1 includes two coating units RESIST and two coating units BARC. The four coating units RESIST and BARC (liquid processing units 11A to 11D) are arranged in a stacked manner along the vertical direction.

[0138] Figure 9 This is a piping diagram showing the configuration for supplying coating liquid to two coating units (BARC). Each of the two coating units (BARC) forms an antireflective film on the substrate W. The coating liquid used to form the antireflective film is contained in the processing liquid bottle 120. The first end of the delivery pipe 25P is inserted into the processing liquid bottle 120. The second end of the delivery pipe 25P is connected to the branch 121. In addition, two delivery control pipes 37A and 37C are connected to the branch 121.

[0139] Additionally, the two first ends of the return flow control pipes 107A and 107C are respectively connected to the two bubble discharge components 105 of the supply valves 21A and 21C. The two second ends of the return flow control pipes 107A and 107C are connected to the confluence section 122. A return flow pipe 112P is connected to the confluence section 122. Furthermore, in... Figure 9 In this context, components related to the coating unit BARC, such as the symbol 25P, are marked with a "P". Components with a "P", such as the delivery piping 25P, have functions similar to... Figure 2 The conveying piping 25 shown has the same function.

[0140] Figure 10 This is a piping diagram showing the configuration for supplying coating liquid to two coating units (RESIST). Each of the two coating units (RESIST) forms a resist film on the antireflective film of the substrate W. The resist (coating liquid) is contained in the processing liquid bottle 124. The first end of the delivery pipe 25Q is inserted into the processing liquid bottle 124. The second end of the delivery pipe 25Q is connected to the branch 125. In addition, two delivery control pipes 37B and 37D are connected to the branch 125.

[0141] Additionally, the two first ends of the return flow control pipes 107B and 107D are respectively connected to the two bubble discharge components 105 of the supply valves 21B and 21D. The two second ends of the return flow control pipes 107B and 107D are connected to the confluence section 126. A return flow pipe 112Q is connected to the confluence section 126. Furthermore, in... Figure 10 In this context, components related to the coating unit RESIST, such as the symbol 25Q, are numerically marked with a "Q". For example, the function of the delivery piping 25Q, which also contains a "Q", is related to... Figure 2 The conveying piping 25 shown has the same function. Additionally, for example, conveying piping 25Q is similar to... Figure 9 The conveying piping shown is set up separately for 25P.

[0142] (3) In the various embodiments and variations described above Figure 4 The exhaust flow path 103 shown extends vertically downward and connects to the common flow path 67B. The common flow path 67B also extends vertically downward and connects to the switching valve chamber 65. Alternatively, the exhaust flow path 103 may extend obliquely downward and connect to the common flow path 67B, and the common flow path 67B may also extend obliquely downward and connect to the switching valve chamber 65. Furthermore, in this specification, "downward" includes "obliquely downward," and "upward" includes "obliquely upward."

[0143] In addition, the exhaust flow path 103 and the common flow path 67B extend from the switching valve chamber 65 in a straight line. Alternatively, the exhaust flow path 103 and the common flow path 67B may extend from the switching valve chamber 65 in a curved shape including an arc.

[0144] (4) In the various embodiments and variations described above Figure 4 The on / off valve 55 and pump 57 of the supply valve 21 shown are located in one flow path block 61. Alternatively, the on / off valve 55 and pump 57 can be located in two flow path blocks respectively, as needed. In this case, the two flow path blocks are connected by a hollow cylindrical (tubular) intermediate piping. Furthermore, the treatment fluid is transported from the first flow path block where the pump 57 is located to the second flow path block where the on / off valve 55 is located via this intermediate piping. In addition, Figure 4 The flow path block 61 shown is not configured as two flow path blocks 61 connected by intermediate piping.

[0145] Alternatively, the switching valve 55 and the suction valve 59 can each be installed in two separate flow path blocks. In this case, the two flow path blocks are connected by a hollow cylindrical (tubular) intermediate piping. Alternatively, the switching valve 55, pump 57, and suction valve 59 can each be installed in three separate flow path blocks.

[0146] (5) In the various embodiments and variations described above, such as Figure 4 As shown, the exhaust flow path 103 is connected to the switch valve chamber 65 via the common flow path 67B of the inlet-side flow path 67. In this respect, as Figure 11 As shown, the exhaust flow path 103 can also be directly connected to the switch valve chamber 65 without passing through the inlet-side flow path 67 (common flow path 67B). In this case, Figure 11 The valve chamber 65 is greater than Figure 4 The switch valve chamber 65. Therefore, the flow path block 61, i.e., the supply valve 21, becomes larger. In addition, when the processed liquid is returned to the fourth confluence section 114 side through the exhaust flow path 103, the processed liquid is sequentially delivered to the inlet side flow path 67, the switch valve chamber 65, and the exhaust flow path 103.

[0147] Additionally, when the exhaust flow path 103 is set separately from the inlet-side flow path 67, Figure 5 When the arrow VNT points to a position, the flow path block 61 may have to be made thicker in the direction indicated by the arrow WD. In the same case, the flow path block 61, i.e., the supply valve 21, becomes larger.

[0148] [Explanation of Symbols]

[0149] 1: Substrate processing device

[0150] 11A~11D: Liquid handling unit

[0151] 16 (16A~16D): Nozzle

[0152] 21(21A~21D): Supply valve

[0153] 22: Nozzle-side piping

[0154] 31: Upstream pump

[0155] 41: Pump Room

[0156] 50: Pressure sensor

[0157] 55: Switch valve

[0158] 57: Pump

[0159] 61: Flow path block

[0160] 65: Switch valve chamber

[0161] 65A: Top surface (sloping surface)

[0162] 67: Inlet side flow path

[0163] 67A: Entrance

[0164] 67B: Common Flow Path

[0165] 69: Outlet side flow path

[0166] 69A: Export

[0167] 71: Valve seat

[0168] 73: Diaphragm

[0169] 75: Switching Driver Unit

[0170] 82: Pump Room

[0171] 83: Diaphragm

[0172] 85: Pump drive unit

[0173] 86: Pressure sensor

[0174] 103: Exhaust Flow Path

[0175] 105: Bubble Expulsion Section

[0176] 115: Controller.

Claims

1. A substrate processing apparatus, characterized in that... have: The nozzle sprays the treatment solution onto the substrate. A supply valve for supplying treatment fluid to the nozzle; and A nozzle-side piping connects the nozzle to the outlet of the supply valve; and The supply valve includes: Flow path block; A switching valve chamber is formed in the flow path block; An inlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the inlet and the switch valve chamber; An outlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the switch valve chamber and the outlet. A switching valve body is disposed within the switching valve chamber; A valve seat is disposed at the junction of the switch valve chamber and the outlet flow path, and is configured to receive the switch valve body in the switch valve chamber; The switch drive unit stops the flow of the processing fluid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat. In addition, it allows the processing fluid to flow from the switch valve chamber to the outlet side flow path by moving the pressed switch valve body away from the valve seat. and An exhaust flow path, formed in the flow path block, is connected to the switching valve chamber to discharge air bubbles from the switching valve chamber; and The exhaust flow path extends downward and connects to the switch valve chamber.

2. The substrate processing apparatus according to claim 1, characterized in that: The inlet-side flow path has a common flow path extending downwards and connected to the switch valve chamber. The exhaust flow path is connected to the switch valve chamber via the common flow path, thereby discharging air bubbles from the switch valve chamber.

3. The substrate processing apparatus according to claim 1 or 2, characterized in that: The top surface of the switching valve chamber has an inclined surface to guide air bubbles into the exhaust flow path.

4. The substrate processing apparatus according to claim 1 or 2, characterized in that: The supply valve also includes: The first pump chamber, formed in the inlet-side flow path of the flow path block, contains the treatment liquid; A volume-changing component causes a change in the volume of the first pump chamber; and The pump drive unit drives the volume change component to perform pump operation.

5. The substrate processing apparatus according to claim 4, characterized in that: The supply valve, along with the nozzle and the nozzle-side piping, is located within the liquid processing unit.

6. The substrate processing apparatus according to claim 4, characterized in that... It also has: Multiple liquid processing units are arranged vertically, each processing the substrate; and An upstream pump is used to deliver the processing liquid to each of the plurality of liquid processing units; and Each of the plurality of liquid processing units includes the nozzle, the supply valve, and the nozzle-side piping. The supply valve includes a first pressure sensor, which is connected to the first pump chamber to measure the pressure of the processed liquid. The upstream pump has: The second pump chamber contains the treatment fluid; and A second pressure sensor is installed in connection with the second pump chamber to measure the pressure of the processed liquid within the second pump chamber; and When the upstream pump selectively delivers processing liquid to any one of the plurality of liquid processing units, it cooperates with the pump drive unit of the supply valve of the liquid processing unit to which the processing liquid is delivered to adjust the second pressure value measured by the second pressure sensor in such a way that the first pressure value measured by the first pressure sensor of the liquid processing unit to which the processing liquid is delivered becomes a preset pressure value.

7. A substrate processing apparatus, characterized in that... have: The nozzle sprays the treatment solution onto the substrate. A supply valve for supplying treatment fluid to the nozzle; and A nozzle-side piping connects the nozzle to the outlet of the supply valve; and The supply valve includes: Flow path block; A switching valve chamber is formed in the flow path block; An inlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the inlet and the switch valve chamber; An outlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the switch valve chamber and the outlet. A switching valve body is disposed within the switching valve chamber; A valve seat is disposed at the junction of the switch valve chamber and the outlet flow path, and is configured to receive the switch valve body in the switch valve chamber; The switch drive unit stops the flow of the processing fluid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat; conversely, it allows the processing fluid to flow from the switch valve chamber to the outlet side flow path by moving the pressed switch valve body away from the valve seat. An exhaust flow path, formed in the flow path block, is connected to the switching valve chamber to discharge air bubbles from the switching valve chamber; and The supply valve also includes: The first pump chamber, formed in the inlet-side flow path of the flow path block, contains the treatment liquid; A volume-changing component causes a change in the volume of the first pump chamber; and The pump drive unit drives the volume change component to perform pump operation.

8. A supply valve, characterized in that... have: Flow path block; A switching valve chamber is formed in the flow path block; An inlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the inlet and the switch valve chamber; An outlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the switch valve chamber and the outlet. A switching valve body is disposed within the switching valve chamber; A valve seat is disposed at the junction of the switch valve chamber and the outlet flow path, and is configured to receive the switch valve body in the switch valve chamber; The switch drive unit stops the flow of liquid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat, and allows the liquid to flow from the switch valve chamber to the outlet side flow path by moving the pressed switch valve body away from the valve seat. and An exhaust flow path, formed in the flow path block, is connected to the switching valve chamber to discharge air bubbles from the switching valve chamber; and The exhaust flow path extends downward and connects to the switch valve chamber.

9. A supply valve, characterized in that... have: Flow path block; A switching valve chamber is formed in the flow path block; An inlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the inlet and the switch valve chamber; An outlet-side flow path is formed in the flow path block and is configured to allow liquid to flow between the switch valve chamber and the outlet. A switching valve body is disposed within the switching valve chamber; A valve seat is disposed at the junction of the switch valve chamber and the outlet flow path, and is configured to receive the switch valve body in the switch valve chamber; The switch drive unit stops the flow of liquid from the switch valve chamber to the outlet side flow path by pressing the switch valve body against the valve seat, and allows the liquid to flow from the switch valve chamber to the outlet side flow path by moving the pressed switch valve body away from the valve seat. An exhaust flow path is formed in the flow path block and connected to the switch valve chamber to discharge air bubbles from the switch valve chamber; The first pump chamber, formed in the inlet-side flow path of the flow path block, contains the treatment liquid; A volume-changing component causes a change in the volume of the first pump chamber; and The pump drive unit drives the volume change component to perform pump operation.

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