An adsorption lifting device for a dry etching machine

Abstract

This invention discloses an adsorption lifting device for a dry etching machine. The lower chamber is equipped with a silicon wafer support device and a silicon wafer positioning device. The silicon wafer support device includes a support rod, and the silicon wafer positioning device includes a positioning rod. The support rod is driven by a first power device to reciprocate between a support station and a first standby station. The positioning rod is driven by a second power device to reciprocate between a positioning station and a second standby station. A placement platform has support holes and positioning holes. A cooling groove for cooling the silicon wafer is provided on the placement platform within the silicon wafer placement area. An air inlet for connecting cooling gas into the cooling groove is provided on the worktable. An adsorption device for adsorbing the silicon wafer on the placement platform is also provided on the worktable. This device can accurately place the silicon wafer in the silicon wafer placement area using the positioning rod and effectively fix the silicon wafer, preventing cooling gas leakage and ensuring accurate etching of the silicon wafer, thus guaranteeing production efficiency and quality.

Description

TECHNICAL FIELD

[0001] The application relates to an adsorption jacking device of a dry etching machine, and relates to the field of semiconductor production and manufacturing. BACKGROUND

[0002] Dry etching is a technology for thin film etching by using plasma. When the gas exists in the form of plasma, the gas has two characteristics: on the one hand, the chemical activity of the gas in the plasma is much stronger than that in the normal state. According to the different etching materials, a suitable gas can be selected to react with the material faster, so as to achieve the purpose of etching removal; on the other hand, the electric field can be used to guide and accelerate the plasma, so that the plasma has a certain energy. When the plasma bombards the surface of the etched material, the atoms of the etched material are knocked out, so as to achieve the purpose of etching by using physical energy transfer. The etched material becomes a volatile gas, which is removed by an exhaust system. Finally, the required depth is etched according to the design pattern. At present, the dry etching device comprises a workbench, a lower bin body for dry etching of a silicon wafer is installed on the workbench, a feeding port is arranged on the lower bin body, a feeding port opening and closing mechanism is installed at the feeding port, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a lifting and sliding support rod is arranged on the placing platform to support the silicon wafer sent in from the feeding port, a cooling groove for back cooling is arranged on the placing platform, the silicon wafer is placed on the placing area to cover the cooling groove, and cooling gas is introduced into the cooling groove to cool the silicon wafer during etching. However, since there is an error in the process of feeding the silicon wafer by the feeding manipulator, and an error may also be generated when the support rod supports the silicon wafer, the silicon wafer cannot be accurately placed on the placing area to cover the cooling gas, so that the gas in the cooling groove leaks into the vacuum reaction bin, the leaked gas affects the vacuum degree and the etching of the plasma gas, thereby causing the etching quality to decrease, and the leakage of the cooling gas causes poor heat dissipation during etching, so that the processed silicon wafer is deformed to cause a low yield. SUMMARY

[0003] The technical problem to be solved by the application is to provide an adsorption jacking device of a dry etching machine, which can accurately place the silicon wafer on the silicon wafer placing area through the positioning rod when the silicon wafer is placed on the silicon wafer placing area, effectively fix the silicon wafer, avoid the leakage of the cooling gas, accurately etch the silicon wafer, and ensure the production efficiency and production quality.

[0004] In order to solve the above technical problems, the technical scheme of the present application is: an adsorption jacking device of a dry etching machine, comprising a workbench, a lower bin body for dry etching of a silicon wafer is installed on the workbench, a feeding port is arranged on the lower bin body, a feeding port opening and closing mechanism is installed at the feeding port, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body, the silicon wafer supporting device comprises a plurality of supporting rods which are axially telescopic and extend from the silicon wafer placing area for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods which are axially telescopic and extend around the silicon wafer placing area for positioning the silicon wafer, the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rods are driven by a second power device to reciprocate between a positioning station and a second standby station, the placing platform is provided with a supporting hole and a positioning hole corresponding to the supporting rods and the positioning rods, the placing platform is provided with a cooling groove for cooling the silicon wafer in the silicon wafer placing area, and a gas inlet is arranged on the workbench for connecting the cooling gas into the cooling groove; the workbench is further provided with an adsorption device for adsorbing the silicon wafer on the placing platform.

[0005] As a preferred scheme, the supporting rods are fixedly installed on a supporting seat, the positioning rods are fixedly installed on a positioning seat, two or more sliding rods are uniformly arranged on the supporting seat in the radial direction, strip-shaped through holes extending in the axial direction corresponding to the sliding rods are formed in the positioning seat, the positioning seat is sleeved on the supporting seat, the sliding rods are constrained in the strip-shaped through holes, the supporting rods in the first standby station are lower than the positioning rods in the second standby station, the supporting rods in the supporting station are higher than the positioning rods in the positioning station, a positioning force applying structure is arranged between the positioning seat and the workbench to keep the positioning rods in the positioning station, the first power device and the second power device adopt a set of supporting and positioning linear power device, and the supporting and positioning linear power device is connected with the supporting seat.

[0006] As a preferred scheme, the positioning force applying structure comprises a force applying spring arranged between the positioning seat and the workbench, the force of the force applying spring forces the positioning seat to move from the second standby station to the positioning station, and when the positioning seat is in the positioning station, the force applying spring is in a free state.

[0007] As a preferred scheme, the positioning force applying structure comprises a plurality of damping rings arranged in the positioning holes or sleeved and fixed on the positioning rods.

[0008] As a preferred scheme, the top of the positioning rod is provided with a positioning guide inclined surface for guiding the silicon wafer to fall into the silicon wafer placing area when the supporting rod falls.

[0009] As a preferred scheme, the feeding port opening and closing mechanism comprises a door frame arranged on the edge of the feeding port, a sliding groove arranged on the door frame, and a door sealing plate installed in the sliding groove and driven to open or close the feeding port by a door sealing plate linear power device.

[0010] As a preferred scheme, the placing platform is provided with an opening and closing device cooperating with the positioning rod to block the positioning hole.

[0011] As a preferred scheme, the opening and closing device comprises a plurality of blocking blocks slidingly installed in the placing platform to block the positioning hole, the placing platform is provided with a sliding area corresponding to each blocking block, the tail of the blocking block is provided with a rebound device connected with the sliding area, the blocking block is provided with a friction inclined surface cooperating with the positioning rod, and the upper end of the positioning rod is provided with a force applying inclined surface in contact with the friction inclined surface.

[0012] As a preferred scheme, the adsorption device is an electrostatic adsorption device.

[0013] The technical scheme is adopted, and the effect of the application is that: the adsorption jacking device of the dry etching machine comprises a workbench, a lower bin body for dry etching of a silicon wafer is installed on the workbench, a feeding port is arranged on the lower bin body, a feeding port opening and closing mechanism is installed at the feeding port, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body, the silicon wafer supporting device comprises a plurality of supporting rods which are axially telescopic and extend from the silicon wafer placing area to support the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods which are axially telescopic and extend around the silicon wafer placing area to position the silicon wafer, the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rods are driven by a second power device to reciprocate between a positioning station and a second standby station, the placing platform is provided with a supporting hole and a positioning hole corresponding to the supporting rods and the positioning rods, the placing platform is provided with a cooling groove for cooling the silicon wafer in the silicon wafer placing area, and a gas inlet is arranged on the workbench to connect the cooling gas into the cooling groove; the workbench is further provided with an adsorption device for adsorbing the silicon wafer on the placing platform; therefore, the opening and closing mechanism of the feeding port is first opened, the first power device drives the supporting rods to rise to the supporting station, a manipulator places the silicon wafer on the supporting rods, the feeding port is closed, the second power device drives the positioning rods to rise to the positioning station, then the supporting rods gradually descend, the silicon wafer is positioned by the positioning rods, until the supporting rods return to the first standby station, the silicon wafer falls into the silicon wafer placing area, the positioning rods also descend to the second standby station, at this time, the adsorption device adsorbs the silicon wafer in the silicon wafer placing area, ensures that the silicon wafer is attached to the cooling groove and accurately covers the cooling groove, and at the same time, the cooling gas is connected from the gas inlet, so that the next etching operation can be performed; after completion, the supporting rods lift the silicon wafer, the feeding port is opened, and the silicon wafer is replaced by the manipulator; the device can accurately place the silicon wafer by the positioning rods when the silicon wafer is placed in the silicon wafer placing area, effectively fixes the silicon wafer, avoids leakage of the cooling gas, enables the silicon wafer to accurately etch, and ensures production efficiency and production quality.

[0014] The support rod is fixedly installed on the support base, the positioning rod is fixedly installed on the positioning base, two or more sliding rods are uniformly arranged on the support base in the radial direction, strip-shaped through holes extending in the axial direction are formed in the positioning base in one-to-one correspondence with the sliding rods, the positioning base is sleeved on the support base, the sliding rods are constrained in the strip-shaped through holes, the support rod in the first standby station is lower than the positioning rod in the second standby station, the support rod in the support station is higher than the positioning rod in the positioning station, the positioning base and the workbench are provided with a positioning force applying structure for keeping the positioning rod in the positioning station, the first power device and the second power device adopt a set of support and positioning linear power device, and the support and positioning linear power device is connected with the support base; one set of power device is used for controlling the support and positioning of the silicon wafer, cost is effectively saved, when the support and positioning linear power device drives the support rod on the support base to move to the support station, the sliding rod slides upward in the strip-shaped through hole, when the sliding rod contacts the upper portion of the strip-shaped through hole, the positioning base is driven to move upward, then the support rod continuously moves upward to the support station, the positioning rod continuously moves upward to the positioning station, and the support rod is higher than the positioning rod, thereby facilitating the feeding of the silicon wafer; when the support rod on the support base moves to the first standby station, the sliding rod slides downward, the positioning base is kept in the positioning station due to the positioning force applying structure, at this time, the support rod is gradually lower than the positioning rod, and the silicon wafer can be positioned; when the sliding rod contacts the lower portion of the strip-shaped through hole, the positioning base is driven to move downward, so that the silicon wafer falls into the silicon wafer placing area accurately, and the positioning base is driven to move to the second standby station downward, so that the structure is simplified, cost is reduced, and production quality is improved.

[0015] The positioning force applying structure comprises a force applying spring arranged between the positioning base and the workbench, the force of the force applying spring forces the positioning base to move from the second standby station to the positioning station, when the positioning base is in the positioning station, the force applying spring is in a free state, when the support rod moves from the first standby station to the support station, the positioning base also rises due to the force applying spring, and when the positioning base reaches the positioning station, the force applying spring is in the free state and does not rise, so that the support rod is higher than the positioning rod is ensured, when the support rod moves from the support station to the first standby station, the force applying spring has a certain force to place the positioning base to descend, until the sliding rod contacts the lower portion of the strip-shaped through hole, the positioning base is driven to descend to the second standby station, at this time, the force applying spring is compressed, after rebound, the positioning base can reach the positioning station next time, so that the positioning of the silicon wafer is accurate.

[0016] Furthermore, since the positioning force-applying structure includes several damping rings, which are disposed within the positioning hole or fitted onto the positioning rod, the positioning rod remains in the positioning position due to the damping effect of the damping rings during the downward movement of the support rod. In this way, the silicon wafer descends with the support rod and is positioned by the positioning rod. Then, the sliding rod contacts the lower part of the strip-shaped through hole, which drives the positioning seat to move downward. Finally, the silicon wafer falls into the silicon wafer placement area. At the same time, the positioning rod and the support rod are in the second standby position and the first standby position, respectively, which can also achieve the simultaneous driving of the positioning rod and the support rod by a single power source.

[0017] Furthermore, the top of the positioning rod is provided with a positioning guide slope that facilitates the falling of the silicon wafer into the silicon wafer placement area when the support rod falls. The positioning guide slope can guide the silicon wafer into the silicon wafer placement area during the falling process of the support rod, thereby improving accuracy.

[0018] Furthermore, the feed port opening and closing mechanism includes a door frame disposed on the edge of the feed port, the door frame is provided with a sliding groove, and a door sealing plate is installed in the sliding groove. The door sealing plate is driven by a door sealing plate linear power device to open or close the feed port. Since the silicon wafer needs to undergo etching reaction in a closed environment, but requires a robotic arm for feeding, opening the door sealing plate can facilitate the feeding of the silicon wafer. After closing the door sealing plate, a closed chamber is formed, which can carry out the etching reaction.

[0019] Furthermore, the placement platform is equipped with a switch device that cooperates with the positioning rod to seal the positioning hole. During the etching process, the sealing of the positioning hole is not always satisfactory. Therefore, the switch device controls the opening and closing of the positioning hole to ensure good sealing. This ensures that the vacuum level within the vacuum reaction chamber meets the etching requirements and also prevents gas from entering through the positioning hole, causing irregular flow of etching gas within the vacuum reaction chamber and resulting in a decrease in etching quality.

[0020] Furthermore, the switching device includes several sealing blocks slidably installed in the placement platform for sealing the positioning holes. The placement platform has sliding areas corresponding to the sealing blocks one by one. The tail of each sealing block is provided with a spring-loaded device connected to the sliding area. Each sealing block has a friction inclined surface that cooperates with the positioning rod. The upper end of the positioning rod is provided with a force-applying inclined surface that contacts the friction inclined surface. When the positioning rod moves towards the positioning position, it contacts the sealing block. The contact between the force-applying inclined surface and the friction inclined surface can push the sealing block open, allowing the positioning rod to reach the positioning position. When the positioning rod returns to the second standby position, the spring-loaded device can push the sealing block back to reseal the positioning hole. In this way, the positioning rod and the sealing block are linked, improving the flexibility of the device and ensuring good sealing performance.

[0021] Furthermore, since the adsorption device is an electrostatic adsorption device, the static electricity generated by the electrostatic adsorption device is applied to the silicon wafer that needs to be adsorbed. In this way, the silicon wafer with static electricity can be firmly adsorbed in the silicon wafer placement area, effectively covering the cooling groove and ensuring cooling efficiency. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Figure 1 This is a perspective view of an embodiment of the present invention;

[0024] Figure 2 This is a top view of an embodiment of the present invention;

[0025] Figure 3 yes Figure 2 Sectional view at AA;

[0026] Figure 4 This is a schematic diagram of the support rod and positioning rod according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the cooling groove structure according to an embodiment of the present invention;

[0028] In the attached diagram: 1. Lower chamber; 2. Upper working platform; 3. Middle working platform; 4. Lower working platform; 5. First cylinder; 6. Support base; 61. Sliding rod; 7. Positioning base; 71. Strip-shaped through hole; 8. Support rod; 9. Positioning rod; 91. Damping ring; 10. Placement platform; 101. Silicon wafer placement area; 102. Support hole; 103. Positioning hole; 11. Cooling groove; 111. Strip-shaped groove; 12. Feed inlet; 13. Door sealing plate; 14. Door frame; 141. Slide groove; 15. Second cylinder; 16. Air inlet; 17. Sealing block; 18. Sliding area; 19. Return spring. Detailed Implementation

[0029] The present invention will be further described in detail below through specific embodiments.

[0030] like Figures 1 to 5As shown, an adsorption lifting device for a dry etching machine includes a worktable. A lower chamber 1 for dry etching silicon wafers is mounted on the worktable. A feed inlet 12 is provided on the lower chamber 1, and a feed inlet 12 opening and closing mechanism is installed at the feed inlet 12. A placement platform 10 is provided inside the lower chamber 1, and a silicon wafer placement area 101 is provided on the placement platform 10. The device is characterized in that: a silicon wafer support device and a silicon wafer positioning device are provided on the lower chamber 1. The silicon wafer support device includes several axially telescopic support rods 8 extending from the silicon wafer placement area 101 to support the silicon wafers. The silicon wafer positioning device includes several axially telescopic support rods surrounding the silicon wafer placement area 101. A positioning rod 9 extends to position the silicon wafer. The support rod 8 is driven by a first power device to reciprocate between a support station and a first standby station. The positioning rod 9 is driven by a second power device to reciprocate between a positioning station and a second standby station. The placement platform 10 is provided with support holes 102 and positioning holes 103 corresponding to the support rod 8 and the positioning rod 9. A cooling groove 11 for cooling the silicon wafer is provided in the silicon wafer placement area 101 on the placement platform 10. An air inlet 16 for connecting cooling gas into the cooling groove 11 is provided on the worktable. An adsorption device for adsorbing the silicon wafer on the placement platform 10 is also provided on the worktable.

[0031] like Figure 2 and Figure 5 As shown, the cooling groove 11 is annular and also includes a strip groove 111 extending from the center and communicating with the cooling groove 11. The strip groove 111 corresponds one-to-one with the support rod 8, and the support rod 8 extends from the inside of the strip groove 111. Since the silicon wafer will generate heat during the etching process, overheating will cause the silicon wafer to deform and the etching will be inaccurate. The cooling gas is helium. When the silicon wafer is in the silicon wafer placement area 101, helium is introduced into the cooling groove 11 through the air inlet 16, and then the helium is evenly distributed through the strip groove to cool the back of the silicon wafer, so that the back temperature is controlled at about 20°C, effectively reducing heat generation and improving production quality.

[0032] like Figure 1 and Figure 4As shown, the support rod 8 is fixedly installed on the support base 6, and the positioning rod 9 is fixedly installed on the positioning base 7. Two or more sliding rods 61 are radially and evenly arranged on the support base 6. The positioning base 7 has axially extending slotted holes 71 corresponding to the sliding rods 61. The positioning base 7 is fitted onto the support base 6, and the sliding rods 61 are constrained within the slotted holes 71. The support rod 8 in the first standby position is lower than the positioning rod 9 in the second standby position, and the support rod 8 in the support position is higher than the positioning rod 9 in the positioning position. The positioning base 7 and the worktable... A positioning force-applying structure is provided to keep the positioning rod 9 in the positioning position. The first power device and the second power device adopt a set of supporting positioning linear power devices, which are connected to the support base 6. The supporting positioning linear power device adopts a first cylinder 5. The worktable includes a three-layer work platform, including an upper work platform 2, a middle work platform 3, and a lower work platform 4. The placement platform 10 is fixedly installed on the upper work platform 2, and the first cylinder 5 is fixedly installed on the lower work platform 4. The guide rod of the first cylinder 5 passes through the middle work platform 3 and connects to the support base 6 for positioning. The positioning seat 7 is fitted onto the support seat 6. The bottoms of the positioning seat 7 and the support seat 6 are flush, and the sliding rod 61 is located below the strip-shaped through hole 71. The positioning seat 7 and the support seat 6 are installed on the central working platform 3. The support rod 8, fixed on the support seat 6, is driven upward by the first cylinder 5. At this time, the sliding rod 61 slides upward in the strip-shaped through hole 71 until it contacts the upper part of the strip-shaped through hole 71, driving the positioning seat 7 to move upward. At this time, the support rod 8 is higher than the positioning rod 9 and moves upward synchronously, ensuring that the placement of the silicon wafer is not affected. The support rod 8 forms a support area for placing the silicon wafer. After the silicon wafer is placed, the support rod 8 is driven upward by the first cylinder 5. At this point, the sliding rod 61 slides to the lower part within the strip-shaped through hole 71, and the support rod 8 is lower than the positioning rod 9. The silicon wafer on the support rod 8 falls into the positioning area formed by the positioning rod 9. Then, the support seat 6 drives the positioning seat 7 to move downwards synchronously until the silicon wafer falls into the silicon wafer placement area 101, completing the accurate placement of the silicon wafer and improving production quality. The first standby station is when the support rod 8 and the support seat 6 are in the state of the middle working platform 3, the second standby station is when the positioning rod 9 and the positioning seat 7 are in the state of the middle working platform 3, and the support station is when the support rod 8 and the support seat 6 are in the state of being level with the feed port 12.

[0033] In this embodiment, the positioning force structure includes a force-applying spring disposed between the positioning seat 7 and the worktable. The elastic force of the force-applying spring forces the positioning seat 7 to move from the second standby position to the positioning position. When the positioning seat 7 is in the positioning position, the force-applying spring is in a free state and generates a force that lifts the positioning seat 7 upward. When the support seat 6 and the positioning seat 7 are in the first standby position and the second standby position, the sliding rod 61 is located at the lower part of the strip-shaped through hole 71, and the support seat 6 presses against the positioning seat 7. When the support seat 6 moves to the support position, the support seat 6 also moves along with it due to the force-applying spring until the positioning seat 7 reaches the positioning position. After that, the force-applying spring is in a free state and will not continue to rise. The support seat 6 continues to rise to the support position. When the support seat 6 moves from the support position to the first standby position, the support seat 6 first descends, and the positioning seat 7 remains stationary due to the force-applying spring until the sliding rod 61 contacts the lower part of the strip-shaped through hole 71, and then descends.

[0034] Furthermore, another approach can be used to position the force-applying structure, such as... Figure 4 As shown, the positioning force-applying structure includes several damping rings 91. The damping rings 91 are disposed in the positioning hole 103 or fitted and fixed on the positioning rod 9. Therefore, during the downward movement of the support rod 8, the positioning rod 9 is held in the positioning position due to the damping effect of the damping rings 91. In this way, the silicon wafer descends with the support rod 8 and is positioned by the positioning rod 9. Then, the sliding rod 61 contacts the lower part of the strip-shaped through hole 71, which will drive the positioning seat 7 to move downward. Finally, the silicon wafer falls into the silicon wafer placement area 101. In both schemes, when the support seat 6 moves upward or downward, there will be no problems such as the support rod 8 being lower than the positioning rod 9 when it is in the support position or the support rod 8 being unable to descend independently when positioning is required, thus ensuring the accuracy of positioning.

[0035] like Figure 4 As shown, the top of the positioning rod 9 is provided with a positioning guide slope to facilitate the silicon wafer to fall into the silicon wafer placement area 101 when the support rod 8 falls. The positioning guide slope has a certain slope, so when the support rod 8 descends, the silicon wafer falls into the positioning area, and the edge of the silicon wafer descends along the positioning guide slope for accurate positioning, effectively ensuring the placement accuracy.

[0036] In this embodiment, the opening and closing mechanism of the feed port 12 includes a door frame 14 disposed on the edge of the feed port 12. The door frame 14 is provided with a sliding groove 141, and a door sealing plate 13 is installed in the sliding groove 141. The door sealing plate 13 is driven by a linear power device to open or close the feed port 12. The linear power device of the door sealing plate 13 includes a second cylinder 15, which is fixedly installed on the lower chamber 1. The opening and closing of the door sealing plate 13 is controlled by the extension and retraction of the guide rod of the second cylinder 15, which facilitates the feeding of silicon wafers and can seal the feed port 12 to ensure a closed environment during etching.

[0037] like Figure 3 As shown, the placement platform 10 is equipped with a switching device that cooperates with the positioning rod 9 to seal the positioning hole 103. The switching device includes a plurality of sealing blocks 17 slidably installed in the placement platform 10 for sealing the positioning hole 103. The placement platform 10 is provided with sliding areas 18 corresponding to the sealing blocks 17 one by one. The tail of the sealing block 17 is provided with a spring-loaded device connected to the sliding area 18. The sealing block 17 is provided with a friction inclined surface that cooperates with the positioning rod 9. The upper end of the positioning rod 9 is provided with a friction inclined surface that cooperates with the friction inclined surface. The inclined surfaces of the sealing block 17 and the positioning rod 9 are in contact. When the sealing block 17 contacts the positioning rod 9, the friction inclined surface and the force-applying inclined surface form a certain angle. When the positioning rod 9 is continuously pushed up, the sealing block 17 is gradually pushed open. The return spring 19 in the sliding area 18 is compressed. When the positioning rod 9 returns to the second standby position, the return spring 19 releases the pressure and pushes the sealing block 17 back to reseal the positioning hole 103. In this way, the sealing block 17 and the positioning rod 9 are linked, which facilitates the sealing of the positioning hole 103 and achieves effective sealing.

[0038] In this embodiment, the adsorption device is an electrostatic adsorption device, which uses an electrostatic generator. The electrostatic generator is fixedly installed on one side of the upper working platform 2. The static electricity generated by the electrostatic generator is applied to the silicon wafer to be adsorbed, so that the silicon wafer with static electricity can be firmly adsorbed in the silicon wafer placement area 101, effectively covering the cooling groove 11, preventing leakage, and ensuring cooling efficiency. The electrostatic generator is an existing structure, so it is not shown in the figure.

[0039] The working principle of this invention is as follows: First, the first cylinder 5 drives the support base 6 to rise. After the sliding rod 61 on the support base 6 contacts the upper part of the strip-shaped through hole 71, it drives the positioning base 7 to rise. When the positioning rod 9 rises, it pushes open the sealing block 17 until the support rod 8 reaches the support position and the positioning rod 9 reaches the positioning position. Then, the second cylinder 15 retracts the guide rod, drives the door sealing plate 13 to rise, opens the feed port 12, and places the silicon wafer to be etched on the support rod 8 by the robot arm. The feed port 12 is then closed, and the first cylinder 5 starts to drive the support rod 8 to move towards the first standby position. The silicon wafer enters the positioning area and contacts the positioning guide slope of the positioning rod 9. The sliding rod 61 moves from the position... After the upper part of the strip-shaped through hole 71 slides to the lower part, it drives the positioning rod 9 to descend synchronously until the support rod 8 reaches the first standby position. The positioning rod 9 returns to the second standby position, and the reset spring 19 pushes the sealing block 17 back into the positioning hole 103. The silicon wafer then falls accurately into the silicon wafer placement area 101. At this time, the electrostatic generator generates static electricity, causing the silicon wafer to be attracted to the silicon wafer placement area 101. At the same time, helium gas is introduced into the air inlet 16 to cool the silicon wafer backplate. After the etching is completed, the support rod 8 and the positioning rod 9 repeat the above steps to reach the support position and the positioning position, open the feed port 12, take out the etched silicon wafer and place a new silicon wafer, and then repeat the above etching steps.

[0040] The above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications and alterations made to the technical solutions of the present invention without departing from the spirit of the present invention shall fall within the protection scope defined by the claims of the present invention.

Claims

1. A suction lifting device of a dry etching machine, comprising a workbench, a lower chamber body for dry etching of a silicon wafer is installed on the workbench, a feeding port is arranged on the lower chamber body, a feeding port opening and closing mechanism is installed at the feeding port, a placing platform is arranged in the lower chamber body, and a silicon wafer placing area is arranged on the placing platform, characterized in that: The lower warehouse body is provided with a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of supporting rods which are axially telescopic and extend from a silicon wafer placing area for supporting silicon wafers, the silicon wafer positioning device comprises a plurality of positioning rods which are axially telescopic and extend around the silicon wafer placing area for positioning silicon wafers, the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rods are driven by a second power device to reciprocate between a positioning station and a second standby station, the placing platform is provided with a supporting hole and a positioning hole corresponding to the supporting rods and the positioning rods, the placing platform is provided with a cooling groove in the silicon wafer placing area for cooling silicon wafers, and the workbench is provided with an air inlet interface for connecting cooling gas into the cooling groove. ​ The supporting rods are fixedly installed on supporting seats, the positioning rods are fixedly installed on positioning seats, the supporting seats are radially and uniformly provided with two or more sliding rods, the positioning seats are provided with strip-shaped through holes which axially extend and correspond to the sliding rods, the positioning seats are sleeved on the supporting seats, the sliding rods are constrained in the strip-shaped through holes, the supporting rods in the first standby station are lower than the positioning rods in the second standby station, and the supporting rods in the supporting station are higher than the positioning rods in the positioning station.

2. The adsorption lifting device for a dry etching machine as described in claim 1, characterized in that: The positioning force structure comprises a force spring arranged between the positioning seat and the workbench, and the force of the force spring forces the positioning seat to move from the second standby station to the positioning station.

3. The lifting device as claimed in claim 1, wherein: the lifting device is a dry etching machine. The positioning force structure comprises a plurality of damping rings which are arranged in the positioning holes or fixedly sleeved on the positioning rods.

4. The lifting device according to claim 2 or 3, wherein: The top of the positioning rod is provided with a positioning guide slope for guiding the silicon wafer to fall into the silicon wafer placing area when the supporting rod falls.

5. The adsorption lifting device for a dry etching machine as described in claim 4, characterized in that: The feeding port opening and closing mechanism comprises a door frame arranged on the rim of the feeding port, the door frame is provided with a sliding groove, and a door sealing plate is installed in the sliding groove and driven by a door sealing plate linear power device to open or close the feeding port.

6. The lifting device as claimed in claim 5, wherein: The placing platform is provided with an opening and closing device which cooperates with the positioning rods to block the positioning holes.

7. The lifting device as claimed in claim 6, wherein: the lifting device is a dry etching machine. The opening and closing device comprises a plurality of blocking blocks which are slidingly installed in the placing platform to block the positioning holes, the placing platform is provided with a sliding area corresponding to the blocking blocks, the tail of the blocking block is provided with a rebound device connected with the sliding area, the blocking block is provided with a friction slope which cooperates with the positioning rod, and the upper end of the positioning rod is provided with a force applying slope which contacts the friction slope.

8. The lifting device according to claim 7, wherein: The adsorption device is an electrostatic adsorption device.

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