Switch module

Abstract

The present disclosure provides a switch module, comprising a substrate, a switch device, a first control component, a second control component, a first power component and a second power component. The switch device is arranged on the substrate, and the switch device comprises a first control end, a second control end, a first power end and a second power end. The first control component is connected to the first control end of the corresponding switch device, and the second control component is connected to the second control end of the corresponding switch device, wherein a projection of the first control component on a reference plane and a projection of the second control component on the reference plane have an intersection, the first power component is connected to the first power end of the corresponding switch device, and the second power component is connected to the second power end of the corresponding switch device.

Description

Technical Field

[0001] The present disclosure relates to a switch module, in particular to a switch module with small mutual inductance between a power loop and a control loop and small self-inductance of the control loop. Background Art

[0002] Generally, the switch module of the power electronic system uses an increase in operating frequency to achieve high power density. However, increasing the operating frequency will increase the switching loss, thereby reducing the efficiency of the switch module. Therefore, in the case of high frequency, the switching loss is reduced by increasing the switching speed of the control end of the switch module. However, when the switch module has a high switching speed, serious electromagnetic interference (EMI) problems will occur.

[0003] Especially when the switch module is a high power density structure, the distance between the power circuit and the control circuit in the switch module is relatively close. Therefore, when the current in the power circuit changes, an induced magnetic field is generated around the power circuit, and a corresponding induced voltage is generated when the induced magnetic field passes through the control circuit, so that mutual inductance electromagnetic interference is formed between the power circuit and the control circuit, causing the switching process of the switch module to be affected. Since the power circuit and the control circuit of the traditional switch module are independently set and have no contact with each other, the induced magnetic field of the power circuit is in the same direction when passing through the control circuit, further causing the mutual inductance electromagnetic interference between the power circuit and the control circuit to be greatly increased. When the mutual inductance electromagnetic interference is too large and the interference voltage is increased, the voltage at the control end may exceed the safe range, thereby reducing the reliability of the switch module and even causing it to fail to work normally.

[0004] In addition, in addition to the electromagnetic interference caused by mutual inductance between the power circuit and the control circuit, there is also electromagnetic interference caused by self-inductance in the control circuit. When the current in the control circuit changes, an induced magnetic field is generated around the control circuit, thereby forming self-inductance electromagnetic interference. The self-inductance of the control circuit is proportional to the area of ​​the control circuit. When the self-inductance is large, it is easy to cause oscillation in the switching process, resulting in reduced safety performance of the switching module.

[0005] Therefore, how to develop a switch module that overcomes the above disadvantages is an urgent need. Summary of the invention

[0006] An object of the present disclosure is to provide a switch module, which can reduce the mutual inductance between the power loop and the control loop, and can reduce the self-inductance of the control loop.

[0007] To achieve the above-mentioned purpose, an embodiment of the present disclosure provides a switch module, comprising at least one substrate, at least one switch device, at least one first control component, at least one second control component, at least one first power component and at least one second power component. At least one switch device is arranged on the substrate, and each switch device comprises a first control terminal, a second control terminal, a first power terminal and a second power terminal. At least one first control component is connected to the first control terminal of the corresponding switch device. At least one second control component is connected to the second control terminal of the corresponding switch device, wherein there is at least one first intersection between the projection of the first control component on the reference plane and the projection of the second control component on the reference plane. At least one first power component is connected to the first power terminal of the corresponding switch device. At least one second power component is connected to the second power terminal of the corresponding switch device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic structural diagram of a switch module according to the first embodiment of the present disclosure.

[0009] Figure 2 for Figure 1 A side view of a partial structure of a switch module is shown.

[0010] Figure 3 for Figure 1 The schematic diagram of the control loop of the switch module shown cross-cancelling the mutual inductance of the external magnetic field.

[0011] Figure 4 for Figure 1 The circuit structure diagram of the switch module is shown.

[0012] Figure 5 for Figure 1 The switch module shown includes a schematic diagram of a control loop for the direction of magnetic flux to cross-offset the mutual inductance of the external magnetic field.

[0013] Figure 6 for Figure 1 The switch module shown is a schematic diagram of the control loop in the lateral direction to cross-compensate the mutual inductance of the external magnetic field.

[0014] Fig. 7A Schematic diagram of the structure of a switch module according to the second embodiment of the present disclosure.

[0015] Figure 7B for Fig. 7A The circuit structure diagram of the switch module is shown.

[0016] Fig. 8A Schematic diagram of the structure of a switch module according to the third embodiment of the present disclosure.

[0017] Figure 8B for Fig. 8AThe circuit structure diagram of the switch module is shown.

[0018] Fig. 9A Schematic diagram of the structure of a switch module according to the fourth embodiment of the present disclosure.

[0019] Fig. 9B for Fig. 9A The circuit structure diagram of the switch module is shown.

[0020] Fig. 10A Schematic diagram of the structure of a switch module according to the fifth embodiment of the present disclosure.

[0021] Fig. 10B for Fig. 10A The circuit structure diagram of the switch module is shown.

[0022] Fig.11A Schematic diagram of the structure of a switch module according to the sixth embodiment of the present disclosure.

[0023] Fig. 11B for Fig.11A The circuit structure diagram of the switch module is shown.

[0024] Fig. 12A Schematic diagram of the structure of a switch module according to the seventh embodiment of the present disclosure.

[0025] Fig. 12B for Fig. 12A The circuit structure diagram of the switch module is shown.

[0026] Fig.13A Schematic diagram of the structure of a switch module according to an eighth embodiment of the present disclosure.

[0027] Fig. 13B for Fig.13A The circuit structure diagram of the switch module is shown.

[0028] Fig.14 Schematic diagram of the structure of a switch module according to the ninth embodiment of the present disclosure.

[0029] Fig.15A Schematic diagram of the structure of a switch module according to the tenth embodiment of the present disclosure.

[0030] Fig. 15B for Fig.15A The circuit structure diagram of the switch module is shown.

[0031] Fig.16 Schematic diagram of the structure of the switch module of the eleventh embodiment of the present disclosure.

[0032] Fig.17 Schematic diagram of the structure of a switch module according to the twelfth embodiment of the present disclosure.

[0033] Fig.18 Schematic diagram of the structure of the switch module of the thirteenth embodiment of the present disclosure.

[0034] Fig.19 Schematic diagram of the structure of a switch module according to the fourteenth embodiment of the present disclosure.

[0035] The reference numerals are described as follows:

[0036] 1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1l, 1m: switch module

[0037] 11: Connecting materials

[0038] 2: Substrate

[0039] 3: Switching devices

[0040] 31: First control terminal

[0041] 32: The second control terminal and the first power terminal

[0042] 33: Second power terminal

[0043] 34: Side 1

[0044] 35: Side 2

[0045] 4: First control component

[0046] 41: First control pin

[0047] 42: First conductor

[0048] 5: Second control component

[0049] 51: Second control pin

[0050] 52: Second conductor

[0051] 6: First power component

[0052] 61: First power pin

[0053] 62: Third conductor

[0054] 7: Second power component

[0055] 71: Second power pin

[0056] 72: The fourth conductor

[0057] O, P: intersection

[0058] I: Current

[0059] Φ1, Φ2, Φ3: Magnetic flux

[0060] M1, M2: Mutual inductance

[0061] 2′: First substrate

[0062] 2″: Second substrate

[0063] 3′: First switch device

[0064] 3″: Second switch device

[0065] 411: First pin component

[0066] 412: Second pin component

[0067] 511: Third pin component

[0068] 512: Fourth pin component

[0069] 8: Common components

[0070] 81: Fifth pin

[0071] 82: The Fifth Conductor

[0072] 91: The Sixth Conductor

[0073] 92: The Seventh Conductor

[0074] 93: The Eighth Conductor DETAILED DESCRIPTION

[0075] Some typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes in different implementations without departing from the scope of the present disclosure, and the descriptions and drawings therein are essentially used for illustrative purposes rather than for limiting the present disclosure.

[0076] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in Figure 1 is a schematic structural diagram of a switch module according to a first embodiment of the present disclosure, Figure 2 for Figure 1 A side view of a partial structure of a switch module is shown, Figure 3 for Figure 1 The schematic diagram of the control loop of the switch module shown in the figure cross-cancels the mutual inductance of the external magnetic field. Figure 4 for Figure 1 The switch module 1 of the present disclosure is arranged on a main circuit board (not shown) and is electrically connected to the main circuit board, and the switch module 1 includes a substrate 2, a switch device 3, a first control component 4, a second control component 5, a first power component 6 and a second power component 7.

[0077] In one embodiment, the switch device 3 is a vertical device, and may be, but is not limited to, an insulated gate bipolar transistor (IGBT), a bipolar junction transistor (BJT), a metal-oxide-semiconductor field-effect transistor (MOSFET), a junction field effect transistor (JFET), or a gallium nitride high electron mobility transistor (GaN-HEMT). The switch device 3 is welded via the connection material 11 to be disposed on the substrate 2, and the switch device 3 includes a first control terminal 31, a second control terminal, a first power terminal 32, and a second power terminal 33, wherein the first control terminal 31, the second control terminal, and the first power terminal 32 are disposed on the first surface 34 of the switch device 3, the second control terminal and the first power terminal are located in the same area of ​​the switch device 3, and are both indicated by reference numeral 32, the second power terminal 33 is disposed on the second surface 35 of the switch device 3, and the second power terminal 33 is connected to the substrate 2 via the connection material 11. In some embodiments, when the switch device 3 is an IGBT, the first control terminal 31 constitutes the gate of the switch device 3, the second control terminal and the first power terminal 32 together constitute the emitter of the switch device 3, and the second power terminal 33 constitutes the collector of the switch device 3. In other embodiments, when the switch device 3 is a BJT, the first control terminal 31 constitutes the base of the switch device 3, the second control terminal and the first power terminal 32 together constitute the emitter of the switch device 3, and the second power terminal 33 constitutes the collector of the switch device 3. In other embodiments, when the switch device 3 is a MOSFET, a JFET or a GaN-HEMT, the first control terminal 31 constitutes the gate of the switch device 3, the second control terminal and the first power terminal 32 together constitute the source of the switch device 3, and the second power terminal 33 constitutes the drain of the switch device 3. In this embodiment, the switch device 3 is a MOSFET, and Figure 1 The circuit connection relationship of the switch module 1 shown can be represented by Figure 4 Indicated.

[0078] The first control component 4 is connected to the first control terminal 31 of the switch device 3, and the first control component 4 includes a first control pin 41 and a first conductor 42, and the first conductor 42 is connected to the first control pin 41 and the corresponding first control terminal 31 of the switch device 3. The second control component 5 is connected to the second control terminal 32 of the switch device 3, and the second control component 5 includes a second control pin 51 and a second conductor 52, and the second conductor 52 is connected to the second control pin 51 and the corresponding second control terminal 32 of the switch device 3. The second control terminal 32, the second conductor 52, the second control pin 51, the main circuit board, the first control pin 41, the first conductor 42 and the first control terminal 31 constitute a control loop of the switch module 1.

[0079] There is at least one intersection O between the projection of the first control component 4 on a reference plane, for example, on the plane where the substrate 2 is located, and the projection of the second control component 5 on the reference plane. In this embodiment, there is an intersection O between the projection of the first conductor 42 of the first control component 4 on the reference plane, for example, on the plane where the substrate 2 is located, and the projection of the second conductor 52 of the second control component 5 on the reference plane.

[0080] The first power component 6 is connected to the first power terminal 32 of the corresponding switch device 3. The first power component 6 includes a first power pin 61 and a third conductor 62. The third conductor 62 is connected to the first power pin 61 and the first power terminal 32 of the corresponding switch device 3. The second power component 7 is connected to the substrate 2 to be connected to the second power terminal 33 of the corresponding switch device 3 via the substrate 2. The second power component 7 includes a second power pin 71 and a fourth conductor 72. The fourth conductor 72 is connected between the substrate 2 and the second power pin 71, and the fourth conductor 72 is connected to the second power terminal 33 of the corresponding switch device 3 via the substrate 2. The second power terminal 33, the substrate 2, the fourth conductor 72, the second power pin 71, the main circuit board, the first power pin 61, the third conductor 62 and the first power terminal 32 constitute a power circuit of the switch module 1. In this embodiment, the first control pin 41, the second control pin 51, the first power pin 61 and the second power pin 71 are arranged in sequence.

[0081] See also Figure 3 , Figure 3 Point A and point D in the figure represent the two ends of the first control component 4, respectively. Figure 3 Points B and C in the figure represent the two ends of the second control component 5, respectively. Figure 3 Point P in FIG. 1 represents a contact point formed by the first control terminal 31 and the second control terminal 32 of the switch device 3. Figure 3 The Q point in the diagram represents the contact point formed by the main circuit board. Figure 3The I in represents the current of the power circuit. In this embodiment, according to the intersection O formed between the first conductor 42 and the second conductor 52, the control circuit of the switch module 1 is divided into two sub-control circuits, the first sub-control circuit is composed of the intersection O, point B, point P and point A, and the second sub-control circuit is composed of the intersection O, point C, point Q and point D. When the integration of the control circuit is high, the area of ​​the first sub-control circuit is equal to or similar to the area of ​​the second sub-control circuit, so that the magnetic flux generated by the current I of the power circuit through the two sub-control circuits is equal or similar, that is, the size of the magnetic flux Φ1 of the first sub-control circuit is equal to or approximately equal to the size of the magnetic flux Φ2 of the second sub-control circuit, so the size of the mutual inductance M1 of the current I of the power circuit to the first sub-control circuit is equal to or approximately equal to the size of the mutual inductance M2 of the current I of the power circuit to the second sub-control circuit. In addition, since the current direction of the first sub-control loop is opposite to the current direction of the second sub-control loop, the mutual inductance M1 of the current I of the power loop to the first sub-control loop and the mutual inductance M2 of the current I of the power loop to the second sub-control loop have opposite signs. Preferably, taking the magnitude of the mutual inductance M1 being equal to the magnitude of the mutual inductance M2 as an example, the mutual inductance M1 of the current I of the power loop to the first sub-control loop plus the mutual inductance M2 of the current I to the second sub-control loop is 0, that is, the mutual inductance of the current I of the power loop to the overall control loop is 0. Therefore, the mutual inductance of the current I of the power loop to the control loop in this embodiment is significantly reduced.

[0082] In addition, since there is a cross point O between the first conductor 42 and the second conductor 52, the area of ​​the control loop of the present embodiment is the area of ​​the first sub-control loop plus the area of ​​the second sub-control loop, that is, the area formed by the lines connecting the cross points O, B, P and A plus the area formed by the lines connecting the cross points O, C, Q and D. Therefore, compared with the conventional control loops that have no contact and no cross points, the area of ​​the control loop of the present embodiment can reduce the first area formed by the lines connecting the points A, O and C, and reduce the second area formed by the lines connecting the points B, O and D. Therefore, the area of ​​the control loop of the present embodiment is smaller, so that the self-inductance of the control loop is also smaller.

[0083] As can be seen from the above, there is an intersection O between the projection of the first conductor 42 of the first control component 4 of the switch module 1 disclosed in the present invention on the reference plane and the projection of the second conductor 52 of the second control component 5 on the reference plane. Therefore, compared with the traditional switch module, the control loop of the switch module 1 disclosed in the present invention has a smaller mutual inductance and a smaller self-inductance, so the safety performance of the switch module 1 can be improved.

[0084] Figure 3The positional relationship between the control circuit and the power circuit shown in the figure is a projection diagram, for example, a projection on the plane where the substrate 2 is located. It can be understood that Figure 1 The first control component 4 and the second control component 5 may not be completely on the same plane, especially the first conductor 42 and the second conductor 52 may not be completely coplanar, that is, the first conductor 42 of the first control component 4 and the second conductor 52 of the second control component 5 are not coplanar. Figure 1 From the side direction of the structure shown, for example, in the projection on a plane perpendicular to the plane where the substrate 2 is located, another area surrounded by the first control component 4 and the second control component 5 can be seen, for example Figure 6 The area enclosed by PAOCQDOB shown in . Figure 5 exist Figure 3 On the basis of further marking the direction of the magnetic flux Φ1 and Φ2 passing through the two sub-control loops when the current I of the power loop is greater than zero. Among them, the directions of the magnetic fluxes Φ1 and Φ2 of the two sub-control loops are the same, but because the current directions of the two sub-control loops are opposite, the directions of the mutual inductances M1 and M2 of the two sub-control loops corresponding to the magnetic fluxes Φ1 and Φ2 of the two sub-control loops are opposite, and the total mutual inductance of the current I of the power loop to the two sub-control loops is M1+M2. When Φ1 and Φ2 are similar or equal, the magnitudes of M1 and M2 are also similar or equal, and the value of the total mutual inductance M1+M2 is close to or equal to 0, and the effect is as described above. However, when the values ​​of the magnetic fluxes Φ1 and Φ2 differ greatly, that is, Φ1>Φ2 or Φ1<Φ2, the value of M1+M2 will also differ greatly from 0, then a third magnetic flux Φ3 can be introduced for further offset compensation. Figure 6The projection of the current I of the power circuit and the control circuit in the lateral direction is shown, wherein the projection of the current I of the power circuit in the lateral direction is located above the lateral projection of the control circuit, and accordingly, the magnetic flux of the magnetic field generated by the current I of the power circuit in the lateral projection of the control circuit (i.e., the PAOCQDOB region) is Φ3, and the direction of the magnetic flux Φ3 is shown, and the mutual inductance of the magnetic flux Φ3 in the entire control circuit is defined as M3. Taking Φ1<Φ2 as an example, M1+M2<0, but the corresponding total mutual inductance M1+M2+M3=0 can be made by compensating Φ3, and the magnetic flux in the region formed by the projection of the first control component 4 and the second control component 5 on the lateral side is used to compensate the magnetic flux in the region formed by the projection of the first control component 4 and the second control component 5 on the reference plane, so that the total magnetic flux in the control circuit formed by the first control component 4 and the second control component 5 is reduced, preferably, the total magnetic flux is reduced to zero, thereby achieving the reduction of the mutual inductance of the current I of the power circuit to the entire control circuit. For example, at this time, it can be obtained by the projection of the first control component 4 on the side being located between the projection of the second control component 5 on the side and the projection of the current I of the power circuit on the side. In other words, it can be obtained by the projection of the first control component 4 on the side being located between the projection of the second control component 5 on the side and the projection of the first power component 6 on the side, or it can be obtained by the projection of the first control component 4 on the side being located between the projection of the second control component 5 on the side and the projection of the second power component 7 on the side. In other cases, M1+M2+M3=0 can also be achieved by introducing the magnetic flux Φ3 of the side projection, that is, the mutual inductance is further reduced. For example, in the case of Φ1>Φ2, the compensation effect is also achieved by the magnetic flux Φ3 of the first control component 4 and the second control component 5 in the side projection. For example, it can be obtained by the projection of the second control component 5 on the side being located between the projection of the first control component 4 on the side and the projection of the current I of the power circuit, in other words, it can be obtained by the projection of the second control component 5 on the side being located between the projection of the first control component 4 on the side and the projection of the first power component 6 on the side, or it can be obtained by the projection of the second control component 5 on the side being located between the projection of the first control component 4 on the side and the projection of the second power component 7 on the side. In this embodiment, the side surface intersects with the reference plane, and preferably, the side surface is perpendicular to the reference plane.

[0085] See also Fig. 7A and Figure 7B ,in Fig. 7A is a schematic structural diagram of a switch module according to a second embodiment of the present disclosure, Figure 7B for Fig. 7A The circuit structure diagram of the switch module is shown in FIG. Fig. 7A and Figure 7B As shown, the structure and function of the switch module 1a of this embodiment are partially similar to Figure 1The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The embodiment shown differs in that Figure 1 The second power pin 71 of the switch module 1 shown in the switch module 1a of the present embodiment is instead formed by a part of the substrate 2. Since the substrate 2 of the switch module 1a can be directly connected to the second power terminal 33 of the switch device 3, the second power component of the switch module 1a does not need to be additionally provided with a fourth conductor to connect to the second power terminal 33 of the switch device 3. In the present embodiment, the power circuit of the switch module 1a is formed by the second power terminal 33, the substrate 2, the main circuit board, the first power pin 61, the third conductor 62 and the first power terminal 32. In addition, the first control pin 41, the second control pin 51 and the first power pin 61 are arranged in sequence.

[0086] See also Fig. 8A and Figure 8B ,in Fig. 8A is a schematic structural diagram of a switch module according to a third embodiment of the present disclosure, Figure 8B for Fig. 8A The circuit structure diagram of the switch module is shown in FIG. Fig. 8A and Figure 8B As shown, the structure and function of the switch module 1b of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference between the illustrated embodiments is that the arrangement positions of the first control pin 41, the second control pin 51, the first power pin 61 and the second power pin 71 are changed, that is, the first control pin 41, the second power pin 71, the second control pin 51 and the first power pin 61 of the switch module 1b of the present embodiment are arranged in sequence.

[0087] In some embodiments, the second control component and the first power component share the same component. Fig. 9A and Fig. 9B ,in Fig. 9A is a schematic structural diagram of a switch module according to a fourth embodiment of the present disclosure, Fig. 9B for Fig. 9A The circuit structure diagram of the switch module is shown in FIG. Fig. 9A and Fig. 9B As shown, the structure and function of the switch module 1c of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The embodiment shown differs in that Figure 1The second control component 5 and the first power component 6 of the switch module 1 shown are independently arranged, while the switch module 1c of this embodiment is changed to a second control component and a first power component composed of a common component 8, wherein the common component 8 is connected to the second control terminal and the first power terminal 32 of the corresponding switch device 3, and the common component 8 includes a fifth pin 81 and a fifth conductor 82. The fifth pin 81 can be used as the second control pin of the second control component and the first power pin of the first power component at the same time. The fifth conductor 82 is connected between the second control terminal and the first power terminal 32 of the corresponding switch device 3 and the fifth pin 81, and can be used as the second conductor of the second control component and the third conductor of the first power component at the same time. In this embodiment, the projection of the first conductor 42 of the first control component 4 on the reference plane, for example, on the plane where the substrate 2 is located, and the projection of the fifth conductor 82 of the common component 8 on the reference plane have an intersection O. In this embodiment, the first control pin 41, the fifth pin 81 and the second power pin 71 are arranged in sequence.

[0088] See also Fig. 10A and Fig. 10B ,in Fig. 10A is a schematic structural diagram of a switch module according to a fifth embodiment of the present disclosure, Fig. 10B for Fig. 10A The circuit structure diagram of the switch module is shown in FIG. Fig. 10A and Fig. 10B As shown, the structure and function of the switch module 1d of this embodiment are partially similar to Fig. 9A and Fig. 9B The structure and function of the switch module 1c shown in the figure are similar, so the same reference numerals are used here to represent the similar structure and function and no further description is given. Fig. 9A and Fig. 9B The difference of the embodiment is that the arrangement positions of the pins are changed, that is, the fifth pin 81, the first control pin 41 and the second power pin 71 are arranged in sequence.

[0089] See also Fig.11A and Fig. 11B ,in Fig.11A is a schematic structural diagram of a switch module according to a sixth embodiment of the present disclosure, Fig. 11B for Fig.11A The circuit structure diagram of the switch module is shown in FIG. Fig.11A and Fig. 11B As shown, the structure and function of the switch module 1e of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference of the embodiments is that Figure 1The second power terminal 33 of the switch module 1 shown is arranged on the second surface 35 of the switch device 3, and the first control terminal 31, the second control terminal and the first power terminal 32 and the second power terminal 33 of the switch device 3 of the switch module 1e of this embodiment are all arranged on the first surface 34 of the switch device 3 to form a planar switch device, such as gallium nitride or low-voltage metal oxide semiconductor field effect transistor, and the second power component 7 does not need to be connected to the second power terminal 33 of the switch device 3 through the substrate 2.

[0090] See also Fig. 12A and Fig. 12B ,in Fig. 12A is a schematic structural diagram of a switch module according to a seventh embodiment of the present disclosure, Fig. 12B for Fig. 12A The circuit structure diagram of the switch module is shown in FIG. Fig. 12A and Fig. 12B As shown, the structure and function of the switch module 1f of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference between the embodiment of the present invention is that the switch module 1f of the present embodiment includes two switch devices (hereinafter referred to as Fig. 12A The switch device on the left is called the first switch device 3' and is located at Fig. 12A The switch device on the right is called the second switch device 3″), two first control components 4, two second control components 5, two first power components 6 and one second power component 7, the first switch device 3′ and the second switch device 3″ are connected in parallel. In this embodiment, the first control component 4 corresponding to the first switch device 3′ (i.e., located at Fig. 12A The projection of the first conductor 42 of the first control component 4 on the left side on the reference plane is the same as that of the second control component 5 (i.e., located at Fig. 12A The projections of the second conductor 52 of the second control component 5 on the left side onto the reference plane have a crossover point O between them. Another first control component 4 corresponding to the second switch device 3″ (i.e., located at Fig. 12A The projection of the first conductor 42 of the first control component 4 on the right side on the reference plane is the projection of the second control component 5 (i.e., located at Fig. 12A The projections of the second conductor 52 of the second control component 5 on the right side on the reference plane have another intersection point O between them. It is worth noting that in this embodiment, it is sufficient that the projections of the first control component 4 and the second control component 5 corresponding to at least one switch device on a reference plane (such as the plane where the substrate 2 is located) have an intersection point O between them.

[0091] In this embodiment, a first control component 4 (i.e., located at Fig. 12AThe first control pin 41 of the first control component 4 on the left side, a second control component 5 (i.e., located at Fig. 12A The second control pin 51 of the second control component 5 on the left side, a first power component 6 (i.e., located at Fig. 12A The first power pin 61 of the first power component 6 on the left side, the other first power component 6 (i.e., located at Fig. 12A The first power pin 61 of the first power component 6 on the right side, another second control component 5 (i.e., located at Fig. 12A The second control pin 51 of the second control component 5 on the right side and another first control component 4 (i.e., located at Fig. 12A The first control pins 41 of the first control component 4) on the right are arranged in sequence. It is worth noting that the arrangement of the two first control pins 41, the two second control pins 51, the two first power pins 61 and the one second power pin 71 is not unique, and the present invention is not limited thereto. Of course, in some other embodiments, only one first power pin 61 may be retained, that is, the first switch device 3' and the second switch device 3" share the same first power pin 61.

[0092] See also Fig.13A and Fig. 13B ,in Fig.13A is a schematic structural diagram of a switch module according to an eighth embodiment of the present disclosure, Fig. 13B for Fig.13A The circuit structure diagram of the switch module is shown in FIG. Fig.13A and Fig. 13B As shown, the structure and function of the switch module 1g of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference between the embodiment of the present invention and the present invention is that the switch module 1g of the present embodiment includes two switch devices (hereinafter referred to as Fig.13A The switch device on the left is called the first switch device 3' and is located at Fig.13A The switch device on the right is called the second switch device 3″), a single first control component 4, a single second control component 5, two first power components 6 and a single second power component 7, wherein the first switch device 3′ and the second switch device 3″ are connected in parallel. Fig. 12A and 12BThe embodiments are all for the parallel connection of two switch devices, the difference is that the second switch device 3″ and the first switch device 3′ in this embodiment share the same first control pin 41 and the same second control pin 51, and the switch module 1g of this embodiment further includes a sixth conductor 91 and a seventh conductor 92, the sixth conductor 91 is connected between the second control terminal 32 of the first switch device 3′ and the second control terminal 32 of the second switch device 3″, and the seventh conductor 92 is connected between the first control terminal 31 of the first switch device 3′ and the first control terminal 31 of the second switch device 3″. Of course, in some other embodiments, only one first power pin 61 can be retained, that is, the first switch device 3′ and the second switch device 3″ share the same first power pin 61.

[0093] In this embodiment, a first power component 6 (ie, located at Fig.13A The first power pin 61, the first control pin 41, the second control pin 51 and another first power component 6 (i.e., located at the left side of the first power component 6) Fig.13A The first power pin 61 of the first power component 6) on the right side and the second power pin 71 of the second power component 7 can be arranged in any order.

[0094] In other embodiments, Fig.14 As shown, it is a schematic diagram of the structure of the switch module of the ninth embodiment of the present disclosure. Fig.13A The difference between the embodiments shown is that the placement directions of the two switch devices are inconsistent. The projection of the sixth conductor 91 of the switch module 1h of this embodiment on the reference plane and the projection of the seventh conductor 92 on the reference plane have a cross point P, for example, the projection of the sixth conductor 91 on the plane where the substrate 2 is located and the projection of the seventh conductor 92 on the plane where the substrate 2 is located have a cross point P, which is the same as the cross point O formed between the first conductor and the second conductor of the first embodiment, so that the magnetic flux generated by the current of the power circuit passing through the two sub-control circuits is equal or similar, thereby reducing the mutual inductance and self-inductance principle. In this embodiment, there is a cross point P between the projection of the sixth conductor 91 on the reference plane and the projection of the seventh conductor 92 on the reference plane, which will further reduce the mutual inductance of the current of the second power circuit to the second control circuit, and the self-inductance of the second control circuit is also further reduced.

[0095] See also Fig.15A and Fig. 15B ,in Fig.15A is a schematic structural diagram of a switch module according to a tenth embodiment of the present disclosure, Fig. 15B for Fig.15A The circuit structure diagram of the switch module is shown in FIG. Fig.15A and Fig. 15BAs shown, the structure and function of the switch module 1i of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference between the embodiment of the present invention is that the switch module 1i of the present embodiment comprises two substrates (hereinafter referred to as Fig.15A The substrate on the left is called the first substrate 2' and is located at Fig.15A The substrate on the right is called the second substrate 2″), two switch devices (hereinafter referred to as Fig.15A The switch device on the left is called the first switch device 3' and is located at Fig.15A The switch device on the right is called the second switch device 3″), two first control components 4, two second control components 5, a single first power component 6 and two second power components 7. The first switch device 3′ and the second switch device 3″ are connected in series, wherein the first switch device 3′ is disposed on the first substrate 2′, and the second switch device 3″ is disposed on the second substrate 2″. In this embodiment, the first control component 4 corresponding to the first switch device 3′ (i.e., located at Fig.15A The projection of the first conductor 42 of the first control component 4 on the left side on the reference plane (for example, the plane where the first substrate 2' and the second substrate 2" are located) and the projection of the first conductor 42 of the first control component 4 on the reference plane (for example, the plane where the first substrate 2' and the second substrate 2" are located) on the reference plane and the projection of the first conductor 42 of the first control component 4 on the left side on the reference plane (for example, the plane where Fig.15A The projections of the second conductor 52 of the second control component 5 on the left side on the reference plane have a crossover point O between them. And the other first control component 4 corresponding to the second switch device 3″ (i.e. located at Fig.15A The projection of the first conductor 42 of the first control component 4 on the right side on the reference plane is the projection of the second control component 5 (i.e., located at Fig.15A The projections of the second conductor 52 of the second control component 5) on the right side onto the reference plane have another intersection point O between the two.

[0096] The switch module 1i of this embodiment further includes an eighth conductor 93, which is connected between the substrate 2' of the first switch device 3' and the first power terminal 32 of the second switch device 3".

[0097] See also Fig.16 , which is a schematic diagram of the structure of the switch module of the eleventh embodiment of the present disclosure. The structure and function of the switch module 1j of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference between the embodiment of the present invention is that there are a plurality of intersection points O between the projection of the first conductor 42 of the switch module 1j of the present embodiment and the projection of the second conductor 52 of the switch module 1j on the reference plane, for example Fig.16The three cross points O are shown, and the number of the cross points O is not limited thereto. By designing a plurality of cross points O, the area of ​​the control loop of the switch module 1j of this embodiment can be further reduced, and the self-inductance of the control loop can be reduced.

[0098] See also Fig.17 , which is a schematic diagram of the structure of the switch module of the twelfth embodiment of the present disclosure. The structure and function of the switch module 1k of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference between the embodiment of the present invention and the embodiment of the present invention is that the first control pin 41 of the first control component 4 further has a first pin element 411 and a second pin element 412, wherein one end of the first pin element 411 is connected to one end of the second pin element 412 in a vertical manner, and preferably, the first pin element 411 and the second pin element 412 are integrally formed structures, and the other end of the first pin element 411 is connected to the first conductor 42. In this embodiment, there is an intersection O between the projection of the first pin element 411 of the first control pin 41 of the first control component 4 on the reference plane and the projection of the second conductor 52 of the second control component 5 on the reference plane, for example, there is an intersection O between the projection of the first pin element 411 of the first control pin 41 of the first control component 4 on the plane where the substrate 2 is located and the projection of the second conductor 52 of the second control component 5 on the plane where the substrate 2 is located. It is worth noting that in other embodiments, one end of the first pin element 411 and one end of the second pin element 412 can be connected at any angle, and the present invention is not limited thereto. In addition, there may be more than one intersection O between the projection of the first control pin 41 on a reference plane and the projection of the second conductor 52 on the reference plane. The number of the intersections O is determined by specific design requirements, and the present invention is not limited thereto.

[0099] See also Fig.18 , which is a schematic diagram of the structure of the switch module of the thirteenth embodiment of the present disclosure. The structure and function of the switch module 11 of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1The difference of the embodiment is that the second control pin 51 of the second control component 5 further has a third pin element 511 and a fourth pin element 512, wherein one end of the third pin element 511 is connected to one end of the fourth pin element 512, and the third pin element 511 and the fourth pin element 512 are arranged vertically, and the other end of the third pin element 511 is connected to the second conductor 52. In this embodiment, there is an intersection O between the projection of the first conductor 42 of the first control component 4 on the reference plane and the projection of the second conductor 52 of the second control component 5 on the reference plane, and there is another intersection O between the projection of the first conductor 42 of the first control component 4 on the reference plane and the projection of the third pin element 511 of the second control pin 51 of the second control component 5 on the reference plane.

[0100] See also Fig.19 , which is a schematic diagram of the structure of the switch module of the fourteenth embodiment of the present disclosure. The structure and function of the switch module 1m of this embodiment are partially similar to Figure 1 The structure and function of the switch module 1 shown in the figure are similar, so the same reference numerals are used here to represent similar structures and functions and no further description is given. Figure 1 The difference of the embodiments is that Figure 1 The second power pin of the second power component of the switch module 1 shown in the switch module 1m of the present embodiment is instead formed by a part of the substrate 2, or the switch module 1m uses the surface bonding technology to directly set the second power pin of the second power component on the substrate 2, and because the substrate 2 of the switch module 1m can be directly connected to the second power end 33 of the switch device 3, the second power component of the switch module 1m does not need to be additionally provided with a fourth conductor to connect to the second power end 33 of the switch device 3. In addition, the first control pin 41 of the first control component 4 of the switch module 1m of the present embodiment further has a first pin element 411 and a second pin element 412, wherein one end of the first pin element 411 is connected to one end of the second pin element 412, and the first pin element 411 and the second pin element 412 are arranged at an angle, for example, vertically, and the other end of the first pin element 411 is connected to the first conductor 42.

[0101] The first control terminal 31 of the switch device 3 of this embodiment is located on one side of the substrate 2, and the first control pin 41, the second control pin 51, and the first power pin 61 are located on the other side of the substrate 2. The projection of the first pin element 411 of the first control component 4 on the reference plane and the projection of the second conductor 52 of the second control component 5 on the reference plane have an intersection O. It is worth noting that for Figure 17-Figure 19 The embodiment in which the projection of the conductor and the control pin intersect each other can also be applied to Figures 11A-15B In the embodiment shown, no further details will be given here.

[0102] In summary, the present disclosure provides a switch module, wherein a projection of a first control component of the switch module on a reference plane and a projection of a second control component on the reference plane have an intersection. Therefore, the current of a power circuit of the switch module of the present disclosure has a smaller mutual inductance with respect to the overall control circuit, and the self-inductance of the control circuit of the switch module is smaller, thereby improving the safety performance of the switch module.

Claims

1. A switch module, comprising: at least one substrate; At least one switch device is disposed on the substrate, and each of the switch devices includes a first control terminal, a second control terminal, a first power terminal, and a second power terminal; At least one first control component connected to the first control end of the corresponding switch device; At least one second control component is connected to the second control end of the corresponding switch device, wherein a projection of the first control component on a reference plane and a projection of the second control component on the reference plane have at least one first intersection point, wherein, The magnetic flux in the area formed by the projections of the first control component and the second control component on a side surface is used to compensate the magnetic flux in the area formed by the projections of the first control component and the second control component on the reference plane, so that the total magnetic flux formed by the first control component and the second control component is reduced, wherein the side surface intersects the reference plane; at least one first power component connected to the first power terminal of the corresponding switching device; and At least one second power component is connected to the second power end of the corresponding switching device.

2. The switch module according to claim 1, wherein: The first control component includes a first control pin and a first conductor, and the first conductor is connected between the first control pin and the first control end of the corresponding switching device; the second control component includes a second control pin and a second conductor, and the second conductor is connected between the second control pin and the second control end of the corresponding switching device.

3. The switch module according to claim 2, wherein: The projection of the first conductor on the reference plane and the projection of the second conductor on the reference plane have at least one first intersection point between them.

4. The switch module according to claim 2, wherein: The at least one first intersection point is located between a projection of the first control pin on the reference plane and a projection of the second conductor on the reference plane.

5. The switch module according to claim 2, wherein: The first power component includes a first power pin and a third conductor, wherein the third conductor is connected between the first power pin and the first power end of the corresponding switching device; the second power component includes a second power pin and a fourth conductor, wherein the fourth conductor is connected between the second power pin and the second power end of the corresponding switching device.

6. The switch module according to claim 5, wherein: The first control pin, the second control pin, the first power pin and the second power pin are arranged in sequence.

7. The switch module according to claim 5, wherein: The second control component and the first power component are formed by the same component.

8. The switch module according to claim 2, wherein: The first control pin also has a first pin element and a second pin element, wherein one end of the first pin element is connected to one end of the second pin element, and the first pin element and the second pin element are arranged at an angle, and the other end of the first pin element is connected to the first conductor.

9. The switch module according to claim 8, wherein: The first pin element and the second pin element are an integrally formed structure.

10. The switch module according to claim 2, wherein: The switch module comprises a plurality of switch devices, a plurality of first control components and a plurality of second control components, the first control end of each switch device is connected to the corresponding first control pin via the corresponding first conductor, and the second control end of each switch device is connected to the corresponding second control pin via the corresponding second conductor; There is at least one first intersection point between the projections of the first control component and the second control component corresponding to at least one of the switch devices on the reference plane.

11. The switch module according to claim 2, wherein: The switch module comprises a plurality of switch devices, a plurality of first control components and a plurality of second control components, the first control end of each switch device is connected to the corresponding first control pin via the corresponding first conductor, and the second control end of each switch device is connected to the corresponding second control pin via the corresponding second conductor; There is at least one first intersection point between the projections of the first control component and the second control component corresponding to each of the switch devices on the reference plane.

12. The switch module according to claim 10, wherein: The switch module includes a plurality of substrates, and the plurality of switch devices are respectively arranged on different plurality of substrates.

13. The switch module according to claim 2, wherein: The switch module comprises a first switch device and a second switch device, wherein the first control end of the first switch device is connected to the first control end of the second switch device via a seventh conductor, and the first control end of the first switch device is also connected to the first control pin via the first conductor; The second control end of the first switch device is connected to the second control end of the second switch device via a sixth conductor, and the second control end of the first switch device is also connected to the second control pin via the second conductor.

14. The switch module according to claim 13, wherein: There is at least one second intersection point between a projection of the sixth conductor on the reference plane and a projection of the seventh conductor on the reference plane.

15. The switch module according to claim 13, wherein: The second power terminal of the first switching device is connected to the first power terminal of the second switching device; or, The first power terminal of the first switching device is connected to the first power terminal of the second switching device, and the second power terminal of the first switching device is connected to the second power terminal of the second switching device.

16. The switch module according to claim 1, wherein: The switching device is an insulated gate bipolar transistor or a bipolar junction transistor, the first control terminal constitutes the gate or base of the switching device, the second control terminal and the first power terminal together constitute the emitter of the switching device, and the second power terminal constitutes the collector of the switching device.

17. The switch module according to claim 1, wherein: The switching device is a metal oxide semiconductor field effect transistor, a junction field effect transistor or a gallium nitride high electron mobility transistor, the first control terminal constitutes a gate of the switching device, the second control terminal and the first power terminal together constitute a source of the switching device, and the second power terminal constitutes a drain of the switching device.

18. The switch module according to claim 1, wherein: The first control component and the second control component are arranged in a non-coplanar manner, and, The projection of the first control component on the side surface is located between the projection of the second control component on the side surface and the projection of the first power component on the side surface, or A projection of the first control component on the side surface is located between a projection of the second control component on the side surface and a projection of the second power component on the side surface.

19. The switch module according to claim 1, wherein: The first control component and the second control component are arranged in a non-coplanar manner, and, The projection of the second control component on the side surface is located between the projection of the first control component on the side surface and the projection of the first power component on the side surface, or A projection of the second control component on the side surface is located between a projection of the first control component on the side surface and a projection of the second power component on the side surface.

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