Circuit board, manufacturing method thereof, and electronic device

Abstract

The application discloses a circuit board and a manufacturing method thereof and an electronic device, and relates to the technical field of display, which comprises a first substrate layer, the first substrate layer comprises at least one first via, the first via penetrates the first substrate layer in the direction perpendicular to the plane where the first substrate layer is located; a first conductive layer, the first conductive layer is located on one side of the first substrate layer, the first conductive layer comprises a plurality of gold fingers, and the plurality of gold fingers comprise at least one first gold finger; a second conductive layer, the second conductive layer is located on the side of the first substrate layer away from the first conductive layer, and the second conductive layer comprises at least one conductive part; and a connecting part, the connecting part is arranged in the first via and is located on at least the side wall of the first via, and the first gold finger is electrically connected with the conductive part through the connecting part. The application is beneficial to reducing the difficulty of arranging wires on the circuit board, so that the circuit board can be miniaturized and shaped.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more specifically, to a circuit board and its manufacturing method, and an electronic device. Background Technology

[0002] Currently, display products are increasingly demanding features such as full-screen displays, long battery life, and 5G communication. These demands require display modules to have increasingly compact structures to allow for larger battery capacities, smaller bezels, and larger antenna clearance areas. The size of the flexible printed circuit board (FPC) has a significant impact on the compactness of the display module structure.

[0003] In flexible printed circuit boards (FPCBs), gold fingers are connected to traces to transmit signals to the gold fingers. However, the size and shape of existing FPCBs make it difficult to route the traces connected to some of the gold fingers. Summary of the Invention

[0004] In view of this, the present invention provides a circuit board and its manufacturing method, as well as an electronic device, which helps to reduce the difficulty of wiring on the circuit board, so as to realize the miniaturization and multi-shape of the circuit board.

[0005] The present invention provides a circuit board, comprising: a first substrate layer, the first substrate layer including at least one first via, the first via penetrating the first substrate layer along a direction perpendicular to the plane of the first substrate layer; a first conductive layer, the first conductive layer located on one side of the first substrate layer, the first conductive layer including a plurality of gold fingers, the plurality of gold fingers including at least one first gold finger; a second conductive layer, the second conductive layer located on the side of the first substrate layer away from the first conductive layer, the second conductive layer including at least one conductive portion; and a connecting portion, the first via being provided with a connecting portion, the connecting portion being at least located on the sidewall of the first via, the first gold finger being electrically connected to the conductive portion through the connecting portion.

[0006] Based on the same idea, the present invention also provides a method for manufacturing a circuit board, comprising: providing a first substrate layer; forming a first conductive layer on one side of the first substrate layer, the first conductive layer including a plurality of gold fingers, the plurality of gold fingers including at least one first gold finger; forming a second conductive layer on the side of the first substrate layer away from the first conductive layer, the second conductive layer including at least one conductive portion; forming a second via on the conductive portion, the second via penetrating the conductive portion along a direction perpendicular to the plane of the first substrate layer, and simultaneously forming a first via on the first substrate layer, the first via penetrating the first substrate layer along a direction perpendicular to the plane of the first substrate layer, the first via and the second via at least partially overlapping along a direction perpendicular to the plane of the first substrate layer; forming a connecting portion in the first via and the second via, the connecting portion being at least located on the sidewall of the first via and the sidewall of the second via, the first gold finger being electrically connected to the conductive portion through the connecting portion.

[0007] Based on the same idea, the present invention also provides an electronic device, including the circuit board provided by the present invention.

[0008] Compared with the prior art, the circuit board and its manufacturing method, as well as the electronic device provided by the present invention, achieve at least the following beneficial effects:

[0009] In the circuit board provided by this invention, a first via is provided on a first substrate layer, and a conductive portion is provided on the opposite side of the first substrate layer. A connecting portion is provided within the first via. A first gold finger corresponds to at least one first via and at least one conductive portion, thereby electrically connecting the first gold finger to its corresponding conductive portion through the connecting portion within the corresponding first via. Optionally, the second conductive layer further includes a second trace, and the conductive portion is connected to the second trace, transmitting signals to the connected conductive portion through the second trace. Signals can be transmitted to the electrically connected conductive portion through the second trace, thereby transmitting signals to the electrically connected first gold finger through the conductive portion. That is, the second trace for transmitting signals to the first gold finger can be provided on the opposite side of the first substrate layer, eliminating the need for the second trace to be provided on the first conductive layer. This reduces the difficulty of wiring on the circuit board, enabling miniaturization and multi-shape design of the circuit board. Furthermore, the first gold finger is electrically connected to the conductive part through the connecting part provided in the first via, thus eliminating the need to drill holes in the first gold finger. This helps to improve the flatness of the first gold finger, thereby improving the stability of the electrical connection between the first gold finger and the pins of electronic components.

[0010] Of course, any product implementing this invention need not necessarily achieve all of the technical effects described above at the same time.

[0011] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0012] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0013] Figure 1 This is a top view of a circuit board provided by the present invention;

[0014] Figure 2 yes Figure 1 A bottom view of the circuit board described above;

[0015] Figure 3 yes Figure 1 A cross-sectional view of the circuit board along line A-A';

[0016] Figure 4 yes Figure 1 Another cross-sectional view of the circuit board along A-A';

[0017] Figure 5 This is a top view of another circuit board provided by the present invention;

[0018] Figure 6 yes Figure 5 A cross-sectional view of the circuit board along B-B';

[0019] Figure 7 yes Figure 1 Another cross-sectional view of the circuit board along A-A';

[0020] Figure 8 This is a flowchart of a circuit board manufacturing method provided by the present invention;

[0021] Figure 9 and Figure 10 This is a schematic diagram of the manufacturing process of the circuit board provided by the present invention;

[0022] Figure 11 A schematic diagram of the structure of the electronic device provided by the present invention;

[0023] Figure 12 This is a top view of the electronic device provided by the present invention. Detailed Implementation

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0025] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0026] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0027] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0029] Figure 1 This is a top view of a circuit board provided by the present invention. Figure 2 yes Figure 1 A bottom view of the circuit board. Figure 3 yes Figure 1 A cross-sectional view of the circuit board along A-A', see reference. Figures 1-3 This embodiment provides a circuit board, which includes a first substrate layer 10 and a first conductive layer 20, wherein the first conductive layer 20 is located on one side of the first substrate layer 10.

[0030] The first conductive layer 20 includes a plurality of gold fingers 21, which are used for electrical connection with the pins of electronic components, thereby realizing electrical connection between the circuit board and the electronic components. The plurality of gold fingers 21 includes at least one first gold finger 211.

[0031] Optionally, the plurality of gold fingers 21 include at least one second gold finger 212, and the first conductive layer 20 further includes a first trace 22, wherein the second gold finger 212 is connected to the first trace 22, and signals are transmitted to the second gold finger 212 connected thereto through the first trace 22.

[0032] The first substrate layer 10 includes at least one first via 11, which penetrates the first substrate layer 10 along a direction perpendicular to the plane of the first substrate layer 10.

[0033] The circuit board also includes a second conductive layer 30, which is located on the side of the first substrate layer 10 away from the first conductive layer 20. That is, the second conductive layer 30 is provided on the opposite side of the first substrate layer 10. The second conductive layer 30 includes at least one conductive portion 31.

[0034] The circuit board also includes a connection part 40. The connection part 40 is provided in the first via 11. The connection part 40 is located at least on the side wall of the first via 11. The first gold finger 211 is electrically connected to the conductive part 31 through the connection part 40.

[0035] In the circuit board provided in this embodiment, a first via 11 penetrating the first substrate layer 10 is provided on the first substrate layer 10. A conductive portion 31 is provided on the opposite side of the first substrate layer 10, and a connecting portion 40 is provided within the first via 11. The first gold finger 211 corresponds to at least one first via 11 and at least one conductive portion 31, thereby the first gold finger 211 is electrically connected to the corresponding conductive portion 31 through the connecting portion 40 within the corresponding first via 11. Optionally, the second conductive layer 30 further includes a second trace 32, and the conductive portion 31 is connected to the second trace 32. Signals are transmitted to the connected conductive portion 31 through the second trace 32. Signals can be transmitted to the electrically connected conductive portion 31 through the second trace 32, thereby transmitting signals to the electrically connected first gold finger 211 through the conductive portion 31. That is, the second trace 32 used to transmit signals to the first gold finger 211 can be set on the opposite side of the first substrate layer 10. The second trace 32 for transmitting signals to the first gold finger 211 does not need to be set on the first conductive layer 20, which helps to reduce the difficulty of wiring on the circuit board and realize the miniaturization and multi-shape of the circuit board.

[0036] Furthermore, the first gold finger 211 is electrically connected to the conductive part 31 through the connecting part 40 provided in the first through hole 11, thus eliminating the need to drill holes in the first gold finger 211, which helps to improve the flatness of the first gold finger 211, thereby improving the stability of the electrical connection between the first gold finger 211 and the pins of electronic components.

[0037] It should be noted that, Figure 1 and Figure 2 An exemplary shape of the circuit board is shown. In some other embodiments of the present invention, the shape of the circuit board may also be other, and the present invention does not specifically limit it. Figure 3 This illustration only shows the film structure of a portion of the circuit board and does not represent the actual dimensions of each film layer. In other embodiments of the present invention, the circuit board includes, in addition to, a portion of the film structure. Figure 3 In addition to the membrane structure shown, other membrane structures may also be included, but the present invention does not specifically limit them.

[0038] Optionally, the material of the first substrate layer 10 can be polyimide, and the materials of the first conductive layer 20 and the second conductive layer 30 can be copper. Of course, in other embodiments of the present invention, the materials of the first substrate layer 10, the first conductive layer 20 and the second conductive layer 30 can also be other materials, which will not be described in detail here.

[0039] Optionally, the circuit board provided in the embodiments of the present invention may be embodied as a flexible printed circuit board (FPC) or a rigid printed circuit board (PCB).

[0040] In some alternative embodiments, the connecting part 40 is made of a metallic material, thereby making the connecting part 40 conductive. The first gold finger 211 and the conductive part 31 can be connected through the connecting part 40, thereby realizing the transmission of signals between the first gold finger 211 and the conductive part 31.

[0041] It should be noted that, in this embodiment, the material of the connecting part 40 is exemplarily shown to be a metal material. In other embodiments of the present invention, the material of the connecting part 40 may also be other conductive materials, which will not be described in detail here.

[0042] Continue to refer to Figures 1-3 In some alternative embodiments, the conductive portion 31 includes at least one second via 33, which penetrates the conductive portion 31 along a direction perpendicular to the plane of the first substrate layer 10.

[0043] Along a direction perpendicular to the plane of the first substrate layer 10, the first via 11 and the second via 33 at least partially overlap. Optionally, the vertical projection of the first via 11 onto the plane of the first substrate layer 10 coincides with the vertical projection of the second via 33 onto the plane of the first substrate layer 10.

[0044] The connecting portion 40 is at least partially located on the side wall of the first via 11, and the connecting portion 40 is partially located on the side wall of the second via 33. The connecting portion 40 is in contact with both the first gold finger 211 and the conductive portion 31, thereby realizing the connection between the first gold finger 211 and the conductive portion 31 through the connecting portion 40.

[0045] Furthermore, the conductive portion 31 and the first substrate layer 10 can be etched from the side of the conductive portion 31 away from the first substrate layer 10, thereby forming a second via 33 on the conductive portion 31 and a first via 11 on the first substrate layer 10. Then, a connecting portion 40 is formed in the first via 11 and the second via 33, thus eliminating the need to drill holes on the first gold finger 211, which helps to improve the flatness of the first gold finger 211, thereby helping to improve the stability of the electrical connection between the first gold finger 211 and the pins of electronic components.

[0046] Figure 4 yes Figure 1 Another cross-sectional view of the circuit board along A-A', see reference. Figure 1 and Figure 4 In some alternative embodiments, the connecting portion 40 is filled in the first through hole 11, and the connecting portion 40 is in contact with the first gold finger 211 and the conductive portion 31, thereby realizing the connection between the first gold finger 211 and the conductive portion 31 through the connecting portion 40.

[0047] Furthermore, the connecting part 40 fills the first through hole 11, and the connecting part 40 can support the first gold finger 211, which is beneficial to improving the flatness of the first gold finger 211, thereby improving the stability of the electrical connection between the first gold finger 211 and the pin of the electronic component.

[0048] Figure 5 This is a top view of another circuit board provided by the present invention. Figure 6 yes Figure 5 A cross-sectional view of the circuit board along B-B', see reference. Figure 5 and Figure 6 In some optional embodiments, at least one first gold finger 21 and one conductive part 31 are electrically connected through at least two connecting parts 40 within the first vias 11. The first gold finger 21 and the conductive part 31 are electrically connected through the connecting parts 40 within the first vias 11. The more connecting parts 40 there are between the first gold finger 21 and the conductive part 31, the greater the signal transmission capability between the first gold finger 21 and the conductive part 31. The first gold finger 21 and the conductive part 31 are electrically connected through two or more connecting parts 40 within the first vias 11, which effectively improves the signal transmission capability between the first gold finger 21 and the conductive part 31.

[0049] It should be noted that, Figure 5 The example shows that the first gold finger 21 and the conductive part 31 are electrically connected through the connecting part 40 in the three first vias 11. In other embodiments of the present invention, the first gold finger 21 and the conductive part 31 may also be electrically connected through the connecting part 40 in the other number of first vias 11. These will not be described in detail here.

[0050] Continue to refer to Figures 1-3 In some optional embodiments, the first gold finger 31 includes a grounding gold finger, and the conductive part 31 electrically connected to the grounding gold finger is used to connect a grounding signal. That is, the second trace 32 for transmitting signals to the grounding gold finger can be disposed on the opposite side of the first substrate layer 10. The second trace 32 for transmitting signals to the grounding gold finger does not need to be disposed on the first conductive layer 20, which helps to reduce the difficulty of wiring on the circuit board, so as to realize the miniaturization and multi-shape of the circuit board.

[0051] It should be noted that this embodiment exemplarily shows that the first gold finger 31 includes a grounding gold finger, and the conductive part 31 electrically connected to the grounding gold finger is used to connect the grounding signal. In other embodiments of the present invention, the first gold finger 31 may also include a power signal gold finger, and the conductive part 31 electrically connected to the power signal gold finger is used to connect the power signal. Of course, in other embodiments of the present invention, the gold finger for transmitting other signals may also adopt the setting of the first gold finger 31 according to actual production needs. The present invention will not elaborate further here.

[0052] Figure 7 yes Figure 1 Another cross-sectional view of the circuit board along A-A', see reference. Figure 1 and Figure 7 In some optional embodiments, the circuit board further includes a first cover film 51, which is located on the side of the first conductive layer 20 away from the first substrate layer 10. The first cover film 51 can protect the first conductive layer 20. Optionally, after the first gold finger 211 is bonded to the pin of the electronic component, the first cover film 51 can be used to cover the part of the first gold finger 211 that does not need to be bonded to the pin of the electronic component. The first cover film 51 can also cover the first trace 22, thereby providing protection. At the same time, it can also provide insulation between the first gold fingers 211 and between the first traces 22.

[0053] The circuit board also includes a second cover film 52, which is located on the side of the second conductive layer 30 away from the first substrate layer 10. The second cover film 52 can protect the second conductive layer 30.

[0054] In this embodiment, the gold fingers 21 in the circuit board are pluggable gold fingers. At this time, the circuit board also includes a reinforcing layer 60. The reinforcing layer 60 is located on the side of the second cover film 52 away from the first substrate layer 10. The reinforcing layer 60 is beneficial to improving the strength and flatness of the circuit board and to improving the ease of plugging and unplugging the gold fingers 21.

[0055] Optionally, the reinforcing layer 60 can be made of polyimide or plastic. Of course, in other embodiments of the present invention, the reinforcing layer 60 can also be made of other materials, which will not be described in detail here.

[0056] Figure 8 This is a flowchart of a circuit board manufacturing method provided by the present invention. Figure 9 and Figure 10 This is a schematic diagram of the manufacturing process of the circuit board provided by the present invention, for reference. Figures 8-10 This embodiment provides a method for manufacturing a circuit board. The method for manufacturing a circuit board provided by this invention includes:

[0057] S11, Provide a first substrate layer.

[0058] S12. A first conductive layer is formed on one side of the first substrate layer. The first conductive layer includes a plurality of gold fingers, and the plurality of gold fingers includes at least one first gold finger.

[0059] S13. A second conductive layer is formed on the side of the first substrate layer away from the first conductive layer, and the second conductive layer includes at least one conductive portion.

[0060] refer to Figure 9 A first conductive layer 20 is formed on one side of the first substrate layer 10. The first conductive layer 20 includes a plurality of gold fingers 21, and the plurality of gold fingers 21 includes at least one first gold finger 211. A second conductive layer 30 is formed on the side of the first substrate layer 10 away from the first conductive layer 20. The second conductive layer 30 includes at least one conductive portion 31. Optionally, the material of the first substrate layer 10 may be polyimide, and the materials of the first conductive layer 20 and the second conductive layer 30 may be copper. Of course, in other embodiments of the present invention, the materials of the first substrate layer 10, the first conductive layer 20 and the second conductive layer 30 may also be other materials, which will not be described in detail here.

[0061] S14. A second via is formed on the conductive portion, and the second via penetrates the conductive portion along a direction perpendicular to the plane of the first substrate layer. At the same time, a first via is formed on the first substrate layer, and the first via penetrates the first substrate layer along a direction perpendicular to the plane of the first substrate layer. The first via and the second via at least partially overlap along a direction perpendicular to the plane of the first substrate layer.

[0062] refer to Figure 10 A second via 33 is formed on the conductive portion 31, and a first via 11 is formed on the first substrate layer 10. The first via 11 and the second via 33 at least partially overlap in a direction perpendicular to the plane of the first substrate layer 10, and the second via 33 penetrates the conductive portion 31, while the first via 11 penetrates the first substrate layer 10.

[0063] S15. A connecting portion is formed in the first via and the second via. The connecting portion is located at least on the sidewall of the first via and the sidewall of the second via. The first gold finger is electrically connected to the conductive portion through the connecting portion.

[0064] Continue to refer to Figures 1-3 The circuit board also includes a connection portion 40, which is disposed in the first via 11 and the second via 33. The connection portion 40 is located at least on the side wall of the first via 11 and the side wall of the second via 33. The connection portion 40 is in contact with both the first gold finger 211 and the conductive portion 31, so that the first gold finger 211 is electrically connected to the conductive portion 31 through the connection portion 40.

[0065] In the circuit board provided in this embodiment, a first via 11 penetrating the first substrate layer 10 is provided on the first substrate layer 10. A conductive portion 31 is provided on the opposite side of the first substrate layer 10, and a connecting portion 40 is provided within the first via 11. The first gold finger 211 corresponds to at least one first via 11 and at least one conductive portion 31, thereby the first gold finger 211 is electrically connected to the corresponding conductive portion 31 through the connecting portion 40 within the corresponding first via 11. Optionally, the second conductive layer 30 further includes a second trace 32, and the conductive portion 31 is connected to the second trace 32. Signals are transmitted to the connected conductive portion 31 through the second trace 32. Signals can be transmitted to the electrically connected conductive portion 31 through the second trace 32, thereby transmitting signals to the electrically connected first gold finger 211 through the conductive portion 31. That is, the second trace 32 used to transmit signals to the first gold finger 211 can be set on the opposite side of the first substrate layer 10. The second trace 32 for transmitting signals to the first gold finger 211 does not need to be set on the first conductive layer 20, which helps to reduce the difficulty of wiring on the circuit board and realize the miniaturization and multi-shape of the circuit board.

[0066] Furthermore, the first gold finger 211 is electrically connected to the conductive part 31 through the connecting part 40 provided in the first via 11 and the second via 33. Only the second via 33 needs to be formed on the conductive part 31 and the first via 11 needs to be formed on the first substrate layer 10. Therefore, it is not necessary to drill holes in the first gold finger 211, which helps to improve the flatness of the first gold finger 211 and thus helps to improve the stability of the electrical connection between the first gold finger 211 and the pins of electronic components.

[0067] Continue to refer to Figure 1 and Figure 4 In some alternative embodiments, the connecting portion 40 fills the first through hole 11 and the second through hole 33, and the connecting portion 40 is in contact with both the first gold finger 211 and the conductive portion 31, thereby realizing the connection between the first gold finger 211 and the conductive portion 31 through the connecting portion 40.

[0068] Furthermore, the connecting portion 40 fills the first via 11 and the second via 33. The connecting portion 40 can support the first gold finger 211, which helps to improve the flatness of the first gold finger 211, thereby improving the stability of the electrical connection between the first gold finger 211 and the pins of electronic components.

[0069] Optionally, the connecting part 40 and the conductive part 31 can be made of the same material. In this case, after the connecting part 40 is filled in the first via 11 and the second via 33, structurally, only the first via 11 can be seen from the circuit board.

[0070] Continue to refer to Figure 10In some optional embodiments, laser etching is performed on the conductive portion 31 and the first substrate layer 10 from the side of the conductive portion 31 away from the first substrate layer 10, thereby forming a second via 33 on the conductive portion 31 and a first via 11 on the first substrate layer 10. Laser etching of the conductive portion 31 and the first substrate layer 10 from the side of the conductive portion 31 away from the first substrate layer 10 effectively reduces the impact on the first gold finger 211, thereby improving the flatness of the first gold finger 211 and thus improving the stability of the electrical connection between the first gold finger 211 and the pins of electronic components.

[0071] This embodiment provides an electronic device, referenced... Figure 11 , Figure 11 This is a schematic diagram of a structure of an electronic device provided by the present invention. The electronic device 1000 includes a circuit board 100 as provided in the embodiments of the present invention. In addition, the electronic device 1000 also includes a display panel 200, on which a bonding area is provided. The circuit board 100 is used to bond to the bonding area of ​​the display panel 200. Optionally, a control chip IC may be bonded to the circuit board. The circuit board provided in the embodiments of the present invention helps to reduce the difficulty of wiring on the circuit board, thereby achieving miniaturization and multi-shape design of the circuit board. Simultaneously, it helps to improve the flatness of the first gold finger, thereby improving the stability of the electrical connection between the first gold finger and the pins of the display panel.

[0072] Optionally, the circuit board included in the electronic device is a flexible circuit board. In practical applications, the flexible circuit board can be folded back onto the non-display side of the display panel to effectively reduce the bezel width of the electronic device and achieve a narrow bezel design. For example, please refer to... Figure 12 , Figure 12 This is a top view of the electronic device provided by the present invention, in which the flexible circuit board has been folded back to the non-display surface of the display panel.

[0073] It should be noted that the embodiments of the display panel provided by the present invention can refer to the embodiments of the circuit board in the present invention, and the repeated parts will not be described again. The electronic devices provided by the embodiments of the present invention can be embodied in any product or component with display function, such as mobile phones, tablet computers, televisions, monitors, laptops, digital photo frames, and navigators.

[0074] As can be seen from the above embodiments, the circuit board and its manufacturing method, as well as the electronic device provided by the present invention, achieve at least the following beneficial effects:

[0075] In the circuit board provided by this invention, a first via is provided on a first substrate layer, and a conductive portion is provided on the opposite side of the first substrate layer. A connecting portion is provided within the first via. A first gold finger corresponds to at least one first via and at least one conductive portion, thereby electrically connecting the first gold finger to its corresponding conductive portion through the connecting portion within the corresponding first via. Optionally, the second conductive layer further includes a second trace, and the conductive portion is connected to the second trace, transmitting signals to the connected conductive portion through the second trace. Signals can be transmitted to the electrically connected conductive portion through the second trace, thereby transmitting signals to the electrically connected first gold finger through the conductive portion. That is, the second trace for transmitting signals to the first gold finger can be provided on the opposite side of the first substrate layer, eliminating the need for the second trace to be provided on the first conductive layer. This reduces the difficulty of wiring on the circuit board, enabling miniaturization and multi-shape design of the circuit board. Furthermore, the first gold finger is electrically connected to the conductive part through the connecting part provided in the first via, thus eliminating the need to drill holes in the first gold finger. This helps to improve the flatness of the first gold finger, thereby improving the stability of the electrical connection between the first gold finger and the pins of electronic components.

[0076] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A circuit board, characterized in that, include: A first substrate layer, the first substrate layer including at least one first via, the first via penetrating the first substrate layer along a direction perpendicular to the plane where the first substrate layer is located; A first conductive layer is located on one side of the first substrate layer. The first conductive layer includes a plurality of gold fingers, and the plurality of gold fingers includes at least one first gold finger. The orthographic projection of the first via onto the first substrate layer is located within the orthographic projection range of the first gold finger onto the first substrate layer; A second conductive layer is located on the side of the first substrate layer away from the first conductive layer. The second conductive layer includes at least one conductive portion. The conductive portion includes at least one second via. The second via penetrates the conductive portion along a direction perpendicular to the plane of the first substrate layer. The first via and the second via at least partially overlap along a direction perpendicular to the plane of the first substrate layer. The connecting portion is provided in the first via, and the connecting portion fills the first via and the second via. The side of the connecting portion away from the first gold finger is flush with the side of the conductive portion away from the first substrate layer. The first gold finger is electrically connected to the conductive portion through the connecting portion.

2. The circuit board according to claim 1, characterized in that, At least one of the first gold fingers and one of the conductive parts are electrically connected through the connecting parts in at least two first vias.

3. The circuit board according to claim 1, characterized in that, The first gold finger includes a grounding gold finger, and the conductive part electrically connected to the grounding gold finger is used to connect a grounding signal.

4. The circuit board according to claim 1, characterized in that, The connecting part is made of metal.

5. The circuit board according to claim 1, characterized in that, Also includes: A first cover film is located on the side of the first conductive layer away from the first substrate layer; A second cover film is located on the side of the second conductive layer away from the first substrate layer; A reinforcing layer is located on the side of the second cover film away from the first substrate layer.

6. A method for manufacturing a circuit board, characterized in that, include: Provide a first substrate layer; A first conductive layer is formed on one side of the first substrate layer, the first conductive layer including a plurality of gold fingers, the plurality of gold fingers including at least one first gold finger; A second conductive layer is formed on the side of the first substrate layer away from the first conductive layer, and the second conductive layer includes at least one conductive portion; A second via is formed on the conductive portion, and the second via penetrates the conductive portion in a direction perpendicular to the plane of the first substrate layer. At the same time, a first via is formed on the first substrate layer, and the first via penetrates the first substrate layer in a direction perpendicular to the plane of the first substrate layer. The first via and the second via at least partially overlap in a direction perpendicular to the plane of the first substrate layer. The orthographic projection of the first via onto the first substrate layer is located within the orthographic projection range of the first gold finger onto the first substrate layer; A connecting portion is formed in the first via and the second via, the connecting portion filling the first via and the second via, the side of the connecting portion away from the first gold finger is flush with the side of the conductive portion away from the first substrate layer, and the first gold finger is electrically connected to the conductive portion through the connecting portion.

7. The method for manufacturing a circuit board according to claim 6, characterized in that, Laser etching is performed on the conductive portion and the first substrate layer from the side of the conductive portion away from the first substrate layer to form the second via on the conductive portion and the first via on the first substrate layer.

8. An electronic device, characterized in that, The electronic device includes the circuit board according to any one of claims 1-5.

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