Power conversion device and method for manufacturing a power conversion device

Abstract

A power conversion device includes an input terminal block (70), a first capacitor unit (40), a second capacitor unit (50), and a case (10) that houses the above components. The case has a first case (11) and a second case (12). The first capacitor unit is fixed in the first case, and the second capacitor unit is fixed in the second case in a state connected to the input terminal block. An opening portion (11c) for a connector is formed in the first case to allow an input connector portion (73) provided to the input terminal block to be inserted therein. The first capacitor unit and the second capacitor unit have first and second opposing portions (43a, 51a) that are arranged opposite each other in an insertion direction of the input connector portion. A shortest separation distance (L1) in the insertion direction of the two opposing portions is greater than an insertion amount (L2) by which the input connector portion is inserted into the opening portion for the connector.

Description

[0001] Reference to Related Applications

[0002] This application is based on Patent Application No. 2020-032066 filed in Japan on February 27, 2020, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The disclosure in this specification relates to a power conversion device that converts from direct current to alternating current or converts the magnitude of voltage, and a manufacturing method of the power conversion device. BACKGROUND

[0004] In Patent Literature 1, a power conversion device including an input terminal block, a capacitor, a semiconductor module, and a housing, etc. is described.

[0005] The input terminal block has a connector portion connected to an external battery connector, and is electrically connected to the capacitor. The semiconductor module converts power input through the input terminal block from direct current to alternating current. The capacitor smoothes the voltage pulsation of the power. The housing houses the input terminal block, the capacitor, and the semiconductor module, and has an opening portion into which the connector portion is inserted. Further, the housing is configured to be divided into a first housing in which the opening portion is formed and a second housing that is fastened to the first housing.

[0006] Prior Art Documents

[0007] Patent Literature

[0008] Patent Literature 1: Japanese Patent No. 6308091 SUMMARY

[0009] In a structure in which the semiconductor module is fixed to the first housing, the capacitor is fixed to the second housing, and then the two housings are fastened and combined, if the input terminal block is mounted to the capacitor and unitized, the following technical problem can occur. That is, with the unitization, the input terminal block is held in the second housing together with the capacitor. In this case, it is necessary to insert the connector portion in the state of being held in the second housing into the opening portion of the first housing.

[0010] However, the semiconductor module is fixed in the first housing, and the capacitor is fixed in the second housing. Therefore, at the point in time when the connector portion is disposed in the opening portion and is to be inserted, the semiconductor module and the capacitor can interfere with each other, so that the above-described disposition cannot be performed.

[0011] In addition, if such an input terminal block is configured by two components, a first component having a connector portion and a second component electrically connected to the capacitor, the first component can be held in the first housing and the second component can be held in the second housing. As a result, the first connector portion can be disposed at the opening portion without causing the above-described interference. However, in this case, the number of components of the input terminal block increases.

[0012] An object of the disclosure is to provide a power conversion device and a manufacturing method of a power conversion device that can reduce the number of components of a terminal block.

[0013] A power conversion device of one embodiment of the disclosure includes:

[0014] a terminal block electrically connected to an external battery or motor;

[0015] a first electrical component and a second electrical component for converting supplied power from the battery from direct current to alternating current or converting the magnitude of the voltage of the supplied power; and

[0016] a housing that houses the first electrical component, the second electrical component, and the terminal block,

[0017] the housing has a first housing and a second housing,

[0018] the first housing has an opening portion into which a part of the terminal block is inserted, and the first electrical component is fixed to the first housing,

[0019] the second housing is combined with the first housing, and the second electrical component in a state where the terminal block is electrically connected is fixed to the second housing,

[0020] the first electrical component and the second electrical component have opposing portions that are arranged opposite to each other in an insertion direction in which a part of the terminal block is inserted into the opening portion,

[0021] the opposing portion of the first electrical component is a first opposing portion, and the opposing portion of the second electrical component is a second opposing portion,

[0022] a shortest separation distance of the first opposing portion and the second opposing portion in the insertion direction is greater than an insertion amount of the terminal block into the opening portion from the inside of the housing.

[0023] According to the above-described power conversion device, the shortest separation distance of the two electrical components in the insertion direction is greater than the insertion amount of the terminal block into the opening portion. Therefore, at the time point when a part of the terminal block is disposed in the opening portion and is about to be inserted, interference of the two electrical components with each other can be avoided. Therefore, a part of the terminal block can be inserted into the opening portion without the need to divide the terminal block and hold the terminal block in the two housings, respectively. That is, the number of components of the terminal block can be reduced.

[0024] The manufacturing method of the power conversion device according to one embodiment of the present disclosure includes:

[0025] a terminal block electrically connected to an external battery or motor;

[0026] a first electrical component and a second electrical component for converting supplied power from the battery from direct current to alternating current or converting the magnitude of the voltage of the supplied power; and

[0027] a housing that accommodates the first electrical component, the second electrical component, and the terminal block,

[0028] the housing has a first housing and a second housing,

[0029] the first housing has an opening portion into which a part of the terminal block is inserted, and the first electrical component is fixed to the first housing,

[0030] the second housing is fastened to the first housing, and the second electrical component in a state of being electrically connected to the terminal block is fixed to the second housing,

[0031] the first electrical component and the second electrical component have opposing portions that are arranged opposite each other in an insertion direction in which a part of the terminal block is inserted into the opening portion,

[0032] the opposing portion of the first electrical component is a first opposing portion, and the opposing portion of the second electrical component is a second opposing portion,

[0033] the shortest separation distance of the first opposing portion and the second opposing portion in the insertion direction is greater than the insertion amount of the terminal block into the opening portion from the inside of the housing,

[0034] the manufacturing method of the power conversion device includes:

[0035] a first fixing process in which the first electrical component is fixed to the first housing,

[0036] a second fixing process in which the second electrical component is electrically connected to the terminal block, and the second electrical component is fixed to the second housing,

[0037] a pre-arrangement step in which, after the first and second fixing steps, the first and second housings are arranged so as to exist outside the opening portion as a whole of the terminal block, in a manner in which the first and second housings are relatively misaligned in the insertion direction from the position at which they can be fastened;

[0038] an insertion step in which, after the pre-arrangement step, a portion of the terminal block is inserted into the opening portion by relatively moving the first and second housings in the insertion direction; and

[0039] a housing fastening step in which, after the insertion step, the first and second housings are fastened to each other.

[0040] In the power conversion device that is the object of the manufacturing method, the shortest separation distance of the two electrical components in the insertion direction is greater than the insertion amount of the terminal block into the opening portion. Therefore, when the pre-arrangement step is performed, the first and second electrical components can be prevented from interfering with each other. Therefore, a portion of the terminal block can be inserted into the opening portion without the need to divide the terminal block and hold each portion in the two housings. That is, the number of components of the terminal block can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 is a diagram showing the circuit structure of the power conversion device of the first embodiment.

[0042] Figure 2 is a cross-sectional view of the power conversion device of the first embodiment.

[0043] Figure 3 is a perspective view showing the state in which the first capacitor unit, the second capacitor unit, and the input terminal block are connected to each other in the first embodiment.

[0044] Figure 4 is an exploded view of the power conversion device shown in Figure 2

[0045] Figure 5 is a flowchart showing the manufacturing process steps of the manufacturing method of the power conversion device of the first embodiment.

[0046] Figure 6 is a diagram showing the state in the pre-arrangement step of the power conversion device of the first embodiment.

[0047] Figure 7 is a diagram showing the state in the insertion step of the power conversion device of the first embodiment. DETAILED DESCRIPTION

[0048] ​Hereinafter, with reference to the accompanying drawings, various methods for implementing this disclosure will be described. In each method, functionally and / or structurally corresponding parts are sometimes labeled with the same reference numerals, and repeated descriptions are omitted. Where only a portion of the structure is described in each method, the previously described methods can be applied to the other parts of the structure.

[0049] The parts that are explicitly stated to be specifically combinable in each embodiment can be combined with each other. Furthermore, as long as the combination does not cause any obstacles, the embodiments can be partially combined with each other, the embodiments and their variations, and the variations with each other, even if they are not explicitly stated to be combinable.

[0050] In the following, the vertical direction of the power conversion device when it is installed in the vehicle is represented by the z-direction, and the direction orthogonal to the z-direction is represented by the x-direction. Furthermore, the direction orthogonal to both the z-direction and the x-direction is represented by the y-direction. Additionally, the arrow representing the z-direction in the diagram points upwards when the device is installed in the vehicle.

[0051] (First Implementation)

[0052] First, based on Figure 1 A summary of the circuit formed by the power conversion device 1 will be provided.

[0053] The power conversion device 1 of this embodiment is installed in a vehicle, such as an electric vehicle or a hybrid vehicle. The power conversion device 1 converts the DC voltage supplied from the battery 2 (DC power source) installed in the vehicle into three-phase AC voltage and outputs it to the three-phase AC motor 3 (on-board motor). The motor 3 functions as the driving source for the vehicle. The power conversion device 1 can also convert the electricity generated by the motor 3 into DC voltage and charge the battery 2. The power conversion device 1 is capable of bidirectional power conversion.

[0054] like Figure 1 As shown, the power conversion device 1 includes a control board 30, a semiconductor module 21, a capacitor 40C, a capacitor 50C, a reactor 60L, an input terminal block 70, and an output terminal block 80.

[0055] The semiconductor module 21 includes a switching element 21i, terminals connected to the switching element 21i, and a molding material. The molding material is made of resin used to mold the switching element 21i. The terminals include P terminals, N terminals, and signal terminals 21s, which will be described later. Figure 1 In the example shown, a semiconductor module 21 has two switching elements 21i and forms an upper and lower arm circuit.

[0056] The power conversion device 1 includes a plurality of semiconductor modules 21. One of the plurality of semiconductor modules 21 is connected to the reactor 60L. The semiconductor module 21 connected to the reactor 60L is a DC-DC conversion section, and functions as a converter circuit that steps up a direct-current voltage. The other plurality of semiconductor modules 21 are DC-AC conversion sections, and function as inverter circuits that convert input direct-current electric power into three-phase alternating-current electric power of a prescribed frequency and output to the motor 3. The inverter circuits also have a function of converting alternating-current electric power generated by the motor 3 into direct-current electric power.

[0057] The semiconductor modules 21 that are the inverter circuits are provided for the three phases of the motor 3, respectively.

[0058] As the switching elements 21i, insulated gate bipolar transistors (IGBTs) of n-channel type are used. The collectors of the IGBTs of the upper arms are connected to the high-potential power line Hi. The emitters of the IGBTs of the lower arms are connected to the low-potential power line Lo. Further, the emitters of the IGBTs of the upper arms and the collectors of the IGBTs of the lower arms are connected to each other.

[0059] The capacitor 40C is connected between a wiring that connects the reactor 60L and the battery 2 and the low-potential power line Lo. The capacitor 40C is included in the converter circuit. The capacitor 40C functions to accumulate electric charge for stepping up. The capacitor 40C is housed in at least one of a first capacitor unit 40 and a second capacitor unit 50 described later.

[0060] The reactor 60L steps up the voltage of the battery 2 in conjunction with the switching operation of the semiconductor module 21 that functions as the converter circuit.

[0061] The capacitor 50C is connected between the high-potential power line Hi and the low-potential power line Lo. The capacitor 50C is connected in parallel to the semiconductor module 21. The capacitor 50C smoothes direct-current electric power stepped up by the converter circuit. The capacitor 50C accumulates electric charge of the stepped-up direct-current voltage.

[0062] The control substrate 30 has a control section and a drive circuit section (driver). The control section generates a drive command for causing the switching elements 21i to operate, based on a torque request input from a higher-level ECU and signals detected by various sensors. The control section is configured to include a microcomputer, and outputs a PWM signal as the drive command. The driver controls the on-off operation of the switching elements 21i in accordance with the drive command output from the control section.

[0063] As specific examples of the above-described various sensors, a current sensor 81, a voltage sensor, a rotation angle sensor, and the like can be listed. The current sensor 81 detects phase currents that flow through the windings of each phase of the motor 3. The rotation angle sensor detects a rotation angle of a rotor of the motor 3.

[0064] Next, based on the above-described various sensors, the control unit 31 performs various kinds of control. Figures 2-4 The various units and components that constitute the power conversion device 1 will be described.

[0065] The power conversion device 1 includes a housing 10, a semiconductor unit 20, a control substrate 30, a first capacitor unit 40, a second capacitor unit 50, a reactor unit 60, an input terminal block 70, and an output terminal block 80. In addition, in the following description, the illustration of the output terminal block 80 is omitted. Figures 2-4

[0066] The housing 10 is made of metal, and is formed using, for example, an aluminum-based material by a die casting method. The housing 10 houses the semiconductor unit 20, the control substrate 30, the first capacitor unit 40, the second capacitor unit 50, the reactor unit 60, the input terminal block 70, and the output terminal block 80 inside.

[0067] The housing 10 is divided into two, a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 are fastened by a bolt B1. The division surface of the first housing 11 and the second housing 12 is a surface that is perpendicular with respect to the z direction. A first flange surface 11f is formed in the first housing 11, and a second flange surface 12f is formed in the second housing 12. The first flange surface 11f and the second flange surface 12f abut against each other. The above-described first flange surface 11f and second flange surface 12f correspond to the above-described division surface. The first flange surface 11f and the second flange surface 12f are each a flat shape that is spread open perpendicularly with respect to the z direction, and the fastening direction of the bolt B1 is the z direction.

[0068] An opening portion 11b formed on the lower side of the first housing 11 and an opening portion 12b formed on the upper side of the second housing 12 are communicated by the above-described fastening. The first flange surface 11f and the second flange surface 12f are in a shape that extends annularly around the z direction in a manner of surrounding the above-described opening portion 11b and opening portion 12b.

[0069] An opening portion 11a that opens toward the upper side is formed in the first housing 11. The above-described opening portion 11a is covered by a first cover 13 that is fastened to the first housing 11 with a bolt B2. An opening portion 12a that opens toward the lower side is formed in the second housing 12. This opening portion 12a is covered by a second cover 14 that is fastened to the second housing 12 with a bolt B3.

[0070] ​Further, in the first housing 11, a connector opening portion 11c and a pipe opening portion 11d are formed. The input connector portion 73 described later is inserted and arranged in the connector opening portion 11c, and the refrigerant pipe 23 described later is inserted and arranged in the pipe opening portion 11d. The connector opening portion 11c is open toward one side in the x direction. The pipe opening portion 11d is open toward the other side in the x direction. The cylindrical portion 110 of the first housing 11 in which the connector opening portion 11c is formed is a cylindrical shape extending in the x direction.

[0071] The semiconductor unit 20 has Figure 1 the semiconductor module 21 described above, the cooler, the elastic member 24, and the base member 25.

[0072] The cooler cools the semiconductor module 21, has the heat exchange portion 22 and the refrigerant pipe 23, and forms a part of a circulation path through which liquid refrigerant circulates. With respect to the refrigerant pipe 23, there are a refrigerant pipe for inflow through which refrigerant flows in from the outside of the semiconductor unit 20 and a refrigerant pipe for outflow through which refrigerant flows out to the outside of the semiconductor unit 20.

[0073] The heat exchange portion 22 communicates with the refrigerant pipes for inflow and outflow 23. The heat exchange portion 22 is in contact with the semiconductor module 21 via an insulator having good thermal conductivity, and cools the semiconductor module 21 whose temperature rises due to heat generated by the switching elements 21i.

[0074] The plurality of semiconductor modules 21 are arranged and stacked in the x direction. The heat exchange portions 22 are arranged between adjacent semiconductor modules 21. That is, the plurality of heat exchange portions 22 are alternately stacked with the semiconductor modules 21. The elastic force generated by the elastic deformation of the elastic member 24 is applied to the stack composed of the plurality of semiconductor modules 21 and the heat exchange portions 22 with the base member 25 interposed therebetween. By this elastic force, the semiconductor modules 21 and the heat exchange portions 22 are pressed against each other.

[0075] As described above, the terminal of the semiconductor module 21 includes a P terminal, an N terminal, and a signal terminal 21s, which are not shown. The P terminal is connected to the emitter of the switching element 21i constituting the upper arm. The P terminal is connected to one end of a first P bus bar 42P described later, and the other end of the first P bus bar 42P is connected to an electrode on the high potential side of a capacitor 50C. That is, the P terminal has the same potential as the high potential power line Hi.

[0076] The N terminal is connected to the collector of the switching element 21i constituting the lower arm. The N terminal is connected to one end of a first N bus bar 42N described later, and the other end of the first N bus bar 42N is connected to an electrode on the low potential side of the capacitor 50C. That is, the N terminal has the same potential as the low potential power line Lo.

[0077] The signal terminal 21s is connected to the gate of the switching element 21i. The signal terminal 21s is mounted (for example, inserted) to the control substrate 30. The signal terminal 21s extends from the molding material toward the upper side. In addition, the P terminal and the N terminal extend from the molding material toward the lower side.

[0078] The control substrate 30 is disposed on the upper side in the z direction with respect to the semiconductor unit 20, and is disposed at a position opposite the opening portion 11a of the first housing 11. The control substrate 30 has a connector 31 that is connected to an external ECU. A part of the connector 31 is exposed from an unillustrated opening portion formed in the first cover 13. The control substrate 30 acquires various vehicle information, vehicle exterior information from the external ECU through the connector 31.

[0079] Further, the control substrate 30 has a processor that performs an arithmetic process according to a prescribed program, a memory in which the above program and the like are stored. For example, the above processor and memory are packaged as a microcomputer (micro). The control substrate 30 has a drive circuit that outputs a drive signal to the switching element 21i. Based on the various information acquired through the connector 31, the microcomputer instructs the operation of the semiconductor module 21. Based on the instruction, the drive circuit outputs the drive signal.

[0080] Here, Figure 1 The required electrostatic capacity of the capacitor 50C illustrated is extremely large. Therefore, in practice, the required electrostatic capacity is satisfied by connecting a plurality of capacitors 50C in parallel.

[0081] The plurality of capacitors 50C are disposed in a manner that distinguishes between the first capacitor unit 40 and the second capacitor unit 50. Further, the number of capacitors 50C included in the first capacitor unit 40 is set to be larger than the number of capacitors 50C included in the second capacitor unit 50.

[0082] The first capacitor unit 40 has a first capacitor housing 41, a plurality of capacitors 50C, a first P bus bar 42P, a first N bus bar 42N, and an electric insulator 43. The plurality of capacitors 50C are housed inside the first capacitor housing 41. Inside the first capacitor housing 41, a resin material (not illustrated) that covers the entire capacitors 50C is filled.

[0083] The high-potential side electrode of the capacitor 50C and the emitter of the switching element 21i are connected on the first P bus bar 42P. The low-potential side electrode of the capacitor 50C and the collector of the switching element 21i are connected on the first N bus bar 42N.

[0084] The first P bus bar 42P and the first N bus bar 42N are plate-shaped, and have plate faces (opposite plate faces) that face each other. The electric insulator 43, which is plate-shaped, is disposed between the above opposite plate faces. The electric insulator 43 is made of a resin that has electric insulating properties.

[0085] The second capacitor unit 50 has a second capacitor case 51, a plurality of capacitors 50C, a second P bus 52P, and a second N bus 52N. The plurality of capacitors 50C are housed inside the second capacitor case 51. Inside the second capacitor case 51 is filled with a resin material (not shown) that covers the capacitors 50C as a whole. One end of the second P bus 52P and the second N bus 52N is connected to the first P bus 42P and the first N bus 42N that the first capacitor unit 40 has.

[0086] The capacitors 50C use a film capacitor of a shape in which a film is wound. The size and the number of the capacitors 50C are adjusted by adjusting the width of the film, the number of turns, and the number of the film capacitors used. Further, by adjusting the arrangement of the plurality of capacitors 50C, the first capacitor case 41 and the second capacitor case 51 are formed into a desired shape. Also, as with the capacitors 50C, the capacitors 40C use a film capacitor of a shape in which a film is wound.

[0087] All of the film capacitors that the first capacitor unit 40 has are arranged with the winding center lines oriented in the y direction. All of the film capacitors that the second capacitor unit 50 has are arranged with the winding center lines oriented in the z direction. In summary, the winding center lines of the first capacitor unit 40 and the winding center lines of the second capacitor unit 50 are orthogonal.

[0088] The reactor unit 60 has a reactor case 61 and a reactor 60L. The reactor 60L is housed inside the reactor case 61. The reactor unit 60 is arranged on the lower side in the z direction with respect to the semiconductor unit 20, and is arranged at a position opposite the opening portion 12a of the second case 12. Also, the reactor unit 60 is arranged on the lower side in the z direction with respect to the first capacitor unit 40 and the second capacitor unit 50. One end of the reactor 60L is connected to the semiconductor module 21 via a bus not shown. The other end of the reactor 60L is connected to the high potential side of the battery 2 via the input terminal block 70.

[0089] The input terminal block 70 has a main case 71, an input P bus 72P, an input N bus 72N, and an input connector portion 73. The main case 71 is made of a resin having electrical insulation, and holds the input P bus 72P, the input N bus 72N, and the input connector portion 73.

[0090] The input connector section 73 has a connector fitting section and a connector terminal. The connector fitting section is integrally formed with the main body case 71 and is made of resin, and fits with a fitting section of an external connector. The external connector is attached to a front end of a cable connected to the battery 2. The connector terminal is disposed in the connector fitting section, and is electrically connected to a terminal of the external connector in conjunction with the fitting.

[0091] The input P bus bar 72P is connected to the reactor 60L, and the input N bus bar 72N is connected to the second N bus bar 52N. In addition, the power conversion device 1 of the present embodiment includes the reactor unit 60, but the reactor unit 60 can be removed. In this case, the input P bus bar 72P is connected to the second P bus bar 52P.

[0092] The output terminal block 80 has a current sensor 81, a main body case not shown, output bus bars, and an output connector section. The main body case is made of resin having electrical insulation, and holds the output bus bars and the output connector section. The output connector section is connected to a cable connector connected to the motor 3.

[0093] The above-described x direction, y direction, and z direction are defined in the following manner. The z direction is a direction perpendicular to a board surface of the control board 30. The x direction is a direction in which the semiconductor unit 20 and the second capacitor unit 50 are arranged along the above-described board surface. The y direction is a direction perpendicular to the z direction and the x direction.

[0094] The first capacitor unit 40 corresponds to a "first electrical component" fixed to the first case 11. The second capacitor unit 50 corresponds to a "second electrical component" fixed to the second case 12 in a state in which the input terminal block 70 is electrically connected. Therefore, in order to prevent the first capacitor unit 40 and the second capacitor unit 50 from interfering with each other at a time point at which the connector section of the input connector section 73 is disposed at a position opposite the connector opening section 11c and is about to be inserted, the following structure is employed in the present embodiment.

[0095] In the following description, a direction (x direction) in which the input connector section 73, which is a part of the input terminal block 70, is inserted into the connector opening section 11c is referred to as an insertion direction. The first capacitor unit 40 and the second capacitor unit 50 have a first opposing section 43a and a second opposing section 51a that are arranged along the insertion direction and oppose each other.

[0096] Specifically, the first opposing section 43a, which is an opposing section of the first capacitor unit 40, is a portion of the electrical insulator 43 that opposes the second capacitor case 51. The second opposing section 51a, which is an opposing section of the second capacitor unit 50, is a portion of the second capacitor case 51 that opposes the electrical insulator 43. The first opposing section 43a and the second opposing section 51a are flat shapes that extend perpendicularly with respect to the insertion direction.

[0097] The shortest separation distance Ll (refer to Figure 2 ) in the insertion direction of the first opposing portion 43a and the second opposing portion 51a is larger than the insertion amount L2 (refer to Figure 2 ) of the input connector portion 73 inserted into the connector opening portion 11c.

[0098] Next, a manufacturing method of the power conversion device 1 will be described with reference to Figure 5 and Figure 6 . In the following description, S indicates the start and E indicates the end. Figure 5

[0099] First, the operations of steps S11, S12 and the operations of steps S21, S22 are performed respectively. Figure 5 In the first assembly process of step S11, the semiconductor unit 20, the control substrate 30, and the first capacitor unit 40 are manufactured. Thereafter, in step S11, the semiconductor unit 20, the control substrate 30, and the first capacitor unit 40 are connected to each other. Thus, the first assembly body U1 shown in

[0100] is manufactured. Figure 6

[0101] Specifically, the semiconductor module 21, the heat exchange portion 22, and the refrigerant pipe 23 are assembled with each other to manufacture the semiconductor unit 20. In addition, the connector 31, the microcomputer, and the like are mounted to the substrate to manufacture the control substrate 30. In addition, the capacitor 50C in a state where the first P bus bar 42P and the first N bus bar 42N are connected is disposed in the first capacitor housing 41. Thereafter, a resin material is filled in the first capacitor housing 41, and the electric insulator 43 is disposed between the two bus bars, thereby manufacturing the first capacitor unit 40.

[0102] Thereafter, the first P bus bar 42P and the first N bus bar 42N are connected to the P terminal and the N terminal of the semiconductor unit 20. As the connection method, for example, soldering can be employed. In addition, the signal terminal 21s of the semiconductor unit 20 is connected to the control substrate 30. As the connection method, for example, insertion mounting can be employed. Thus, the above-described first assembly body U1 is manufactured.

[0103] Next, in the first fixing process of step S12, the first assembly body U1 manufactured in step S11 is fixed to the first housing 11. Specifically, the bracket 41a provided to the first capacitor unit 40 shown in Figure 3 is bolted to the first housing 11. In this way, the first capacitor unit 40 is fixed to the first housing 11.

[0104] ​​In the second assembly process of step S21, the second capacitor unit 50 and the input terminal base 70 are manufactured. Thereafter, in step S21, the second capacitor unit 50 and the input terminal base 70 are connected to each other. Thus, the second assembly U2 shown in Figure 6

[0105] Specifically, the capacitor 50C in the state that the second P bus 52P and the second N bus 52N are connected is disposed in the second capacitor case 51. Thereafter, the second capacitor unit 50 is manufactured by filling a resin material in the second capacitor case 51. Further, the input P bus 72P, the input N bus 72N, and the input connector portion 73 are provided in the main body case 71, thereby manufacturing the input terminal base 70.

[0106] Thereafter, the second N bus 52N and the input N bus 72N are connected to each other. The connection can be bolt fastening or welding. Thus, the above-described second assembly U2 is manufactured.

[0107] Next, in the second fixing process of step S22, the second assembly U2 manufactured in step S21 is fixed to the second case 12. Specifically, a bracket not shown provided to the second capacitor unit 50 is bolted to the second case 12. In this way, the second capacitor unit 50 is fixed to the second case 12.

[0108] In the pre-arrangement process of step S30 performed after steps S12, S22, as shown in Figure 7 the first case 11 is temporarily placed on the second case 12 so that the input connector portion 73 (the input terminal base 70) as a whole exists outside the connector opening portion 11c. The first case 11 in the temporarily placed state is located at a position relatively deviated in the insertion direction from a position at which the first case 11 can be fastened to the second case 12. For example, the above-described deviated position is maintained, the first assembly U1 is brought close to the second assembly U2 in the z direction as shown in Figure 6 and is temporarily placed on the second assembly U2 as shown in Figure 7

[0109] In the process of being thus temporarily placed, the cylindrical portion 110 of the first case 11 separates the cylindrical portion 110 and the input connector portion 73 in the x direction in a manner not to interfere with the input connector portion 73. However, if the separation distance is too large, the first opposing portion 43a interferes with the second opposing portion 51a. Therefore, the cylindrical portion 110 and the input connector portion 73 are separated in the x direction to such an extent that the first opposing portion 43a does not interfere with the second opposing portion 51a. As described above, since the shortest separation distance LI is set larger than the insertion amount L2, the above-described non-interference positional relationship can be achieved.

[0110] ​​In the insertion process of step S40 performed thereafter, the first housing 11 and the second housing 12 are relatively moved in the insertion direction. That is, the input connector portion 73 is inserted into the connector opening portion 11c by an insertion amount L2. Then, the first housing 11 is moved to a regular position where it can be fastened to the second housing 12. In this movement, the first flange surface 11f of the first housing 11 is caused to slide while being in contact with the second flange surface 12f of the second housing 12. At the regular position, the shortest separation distance L1 is larger than the insertion amount L2.

[0111] In the housing fastening process of step S50 performed thereafter, the first housing 11 and the second housing 12, which are in the regular position, are fastened to each other with the bolt B1.

[0112] In the busbar fastening process of step S60 performed thereafter, the first assembly U1 and the second assembly U2 are electrically connected. Specifically, the first P busbar 42P is connected to the second P busbar 52P. Also, the first N busbar 42N is connected to the second N busbar 52N. The above connection can be bolt fastening or welding. Also, as explained in step S30, the first assembly U1 is temporarily placed from above the second assembly U2. Therefore, the first P busbar 42P is disposed so as to overlap the upper side of the second P busbar 52P. Also, the first N busbar 42N is disposed so as to overlap the upper side of the second N busbar 52N.

[0113] In the cover fastening process of step S70 performed thereafter, the first cover 13 is fastened to the first housing 11 with the bolt B2. Also, the second cover 14 is fastened to the second housing 12 with the bolt B3. Also, the process of step S70 can be performed in steps S12 and S22.

[0114] Hereinafter, the effects of the above-described structure will be explained.

[0115] As explained above, in the above-described power conversion device 1, the first capacitor unit 40 is fixed to the first housing 11. Also, the second capacitor unit 50 is fixed to the second housing 12 in a state where the input terminal block 70 is electrically connected. Also, the shortest separation distance L1 in the insertion direction of the first capacitor unit 40 and the second capacitor unit 50 is larger than the insertion amount L2 by which the input connector portion 73 is inserted into the connector opening portion 11c.

[0116] Therefore, at the time point when the input connector portion 73 is set to the opposite position of the connector opening portion 11c and is about to be inserted, the first capacitor unit 40 and the second capacitor unit 50 can be prevented from interfering with each other. Therefore, according to the present embodiment, a structure in which the input connector portion 73 can be inserted into the connector opening portion 11c without dividing the input terminal block 70 and separately holding the first housing 11 and the second housing 12 can be formed. That is, the number of components of the input terminal block 70 can be reduced.

[0117] Further, in the present embodiment, the power conversion device 1 in which the shortest separation distance L1 is set to be larger than the insertion amount L2 is manufactured by the following manufacturing method. In the manufacturing method, first, the first capacitor unit 40 and the second capacitor unit 50 are fixed to the first housing 11 and the second housing 12, respectively. Thereafter, the first housing 11 and the second housing 12 are temporarily placed (pre-arrangement step) in the insertion direction with a relative misalignment from the normal position. Thereafter, the input connector portion 73 is inserted into the connector opening portion 11c by relatively moving the first housing 11 and the second housing 12 in the insertion direction. Thereafter, the first housing 11 and the second housing 12 are fastened to each other.

[0118] Thus, when the pre-arrangement step is performed, the first capacitor unit 40 and the second capacitor unit 50 can be prevented from interfering with each other. Therefore, a part of the terminal block of the input terminal block 70 (the input connector portion 73) can be inserted into the connector opening portion 11c without dividing the input terminal block 70 and separately holding the first housing 11 and the second housing 12.

[0119] Further, in the present embodiment, the first capacitor unit 40 as the first electrical component has the first P bus bar 42P and the first N bus bar 42N. The bus bars generate heat due to energization. In addition, the second capacitor unit 50 as the second electrical component has the capacitor 50C. Generally, the capacitor 50C is an electrical component that is easily thermally damaged. That is, the first electrical component has a heat generating portion, and the second electrical component has an electrical component that is easily thermally damaged.

[0120] In view of this, in the present embodiment, the first opposing portion 43a that determines the shortest separation distance L1 is an electrical insulator 43 that is held by the bus bars as the heat generating portion. In addition, the second opposing portion 51a that determines the shortest separation distance L1 is the electrical component that is easily thermally damaged. Therefore, by making the shortest separation distance L1 larger than the insertion amount L2, the separation distance of the heat generating portion from the electrical component is made large. Therefore, the heat dissipation property of the electrical component can be improved. That is, in addition to the shortest separation distance L1 functioning as a gap for misalignment assembly, the shortest separation distance L1 can also function as a heat dissipation gap for the heat generating portion, and the power conversion device 1 can be downsized.

[0121] (Other Embodiments)

[0122] The disclosure in this specification and drawings is not limited to the illustrated embodiments. The disclosure includes the illustrated embodiments and variations made by those skilled in the art based on them. For example, the combination of components and / or elements shown in the embodiments is not limited. The disclosure can be implemented in various combinations. The disclosure can have an additional part that can be added to the embodiments. The disclosure includes embodiments in which components and / or elements of the embodiments are omitted. The disclosure includes replacement or combination of components and / or elements between one embodiment and another.

[0123] In the above-described first embodiment, the first opposing portion 43a is a portion of the electric insulator 43, but can also be a portion of the first P bus bar 42P, the first N bus bar 42N. In addition, the first opposing portion 43a is not limited to a heat generating site that generates heat due to energization, and can be a portion of the first capacitor housing 41, for example.

[0124] In the above-described first embodiment, the second opposing portion 51a is a portion of the second capacitor housing 51, but can also be a heat generating site that generates heat due to energization. As a specific example of the heat generating site, a portion of the second P bus bar 52P, the second N bus bar 52N can be cited.

[0125] In the above-described first embodiment, the first capacitor unit 40 having the capacitor 50C is the first electrical component. In contrast, the semiconductor unit 20, the reactor unit 60 can also be the first electrical component, for example. Likewise, the semiconductor unit 20, the reactor unit 60 can also be the second electrical component. In addition, the power conversion device 1 can include a DCDC converter that converts the voltage size of direct current. In this case, the first electrical component or the second electrical component can also be the DCDC converter.

[0126] In the above-described first embodiment, the terminal block that is kept connected with the second electrical component is provided as the input terminal block 70, but can also be the output terminal block 80.

[0127] In the above-described first embodiment, the plurality of semiconductor modules 21 are arranged and stacked in the y direction. In contrast, the plurality of semiconductor modules 21 can also be arranged and stacked in the x direction. In any case, the stacking direction of the semiconductor modules 21 can be orthogonal to the arrangement direction of the capacitor units and the terminal units, or can be parallel thereto.

[0128] The power conversion device 1 of the above-described first embodiment includes an inverter circuit for converting the supply power from the battery 2 from direct current to alternating current, and a converter circuit that converts the voltage size of the supply power. In contrast, the power conversion device can also be a structure in which either one of the inverter circuit and the converter circuit is removed and the other is included.

Claims

1. A power conversion device comprising: a terminal block electrically connected to an external battery or motor; first and second electrical components for converting supply power from the battery from direct current to alternating current or converting the magnitude of the voltage of the supply power; and a housing that houses the first and second electrical components and the terminal block, the housing having a first housing and a second housing, the first housing having an opening portion into which a portion of the terminal block is inserted, and the first electrical component being fixed, the second housing being combined with the first housing, and the second electrical component in a state of being electrically connected to the terminal block being fixed, the first and second electrical components having opposing portions that are aligned with each other in an insertion direction in which a portion of the terminal block is inserted into the opening portion, the opposing portion of the first electrical component being a first opposing portion, and the opposing portion of the second electrical component being a second opposing portion, the shortest separation distance of the first opposing portion and the second opposing portion in the insertion direction being greater than the amount of insertion of the terminal block into the opening portion from the inside of the housing.

2. The power conversion device according to claim 1, wherein one of the first opposing portion and the second opposing portion is a heat generating portion that generates heat due to electrical conduction.

3. The power conversion device according to claim 2, wherein the electrical component of the first and second electrical components that has the other of the first opposing portion and the second opposing portion includes a capacitor.

4. The power conversion device according to claim 1, wherein the second electrical component includes a capacitor, and the first electrical component has: a P bus line electrically connected to the high potential side of the capacitor, and an N bus line electrically connected to the low potential side of the capacitor; and an electrical insulator disposed between the P bus line and the N bus line, the first opposing portion being any one of the P bus line, the N bus line, and the electrical insulator.

5. A manufacturing method of a power conversion device comprising: a terminal block electrically connected to an external battery or motor; first and second electrical components for converting supply power from the battery from direct current to alternating current or converting the magnitude of the voltage of the supply power; and a housing that houses the first and second electrical components and the terminal block, the housing having a first housing and a second housing, the first housing having an opening portion into which a portion of the terminal block is inserted, and the first electrical component being fixed, the second housing being fastened to the first housing, and the second electrical component in a state of being electrically connected to the terminal block being fixed, ​ The first electrical component and the second electrical component have opposing portions that are aligned with each other and oppose each other in an insertion direction in which a portion of the terminal block is inserted into the opening portion, the opposing portion of the first electrical component is a first opposing portion, and the opposing portion of the second electrical component is a second opposing portion, a shortest separation distance of the first opposing portion and the second opposing portion in the insertion direction is greater than an insertion amount of the terminal block into the opening portion from an inside of the housing, A manufacturing method of the power conversion device includes: a first fixing process in which the first electrical component is fixed to the first housing; a second fixing process in which the second electrical component is electrically connected to the terminal block and the second electrical component is fixed to the second housing; a pre-arrangement process in which, after the first fixing process and the second fixing process, the first housing and the second housing are arranged so as to be relatively misaligned in the insertion direction from a position at which the first housing and the second housing can be fastened, with the terminal block as a whole existing outside the opening portion; an insertion process in which, after the pre-arrangement process, a portion of the terminal block is inserted into the opening portion by relatively moving the first housing and the second housing in the insertion direction; and a housing fastening process in which, after the insertion process, the first housing and the second housing are fastened to each other.

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