Ear wearable devices

Abstract

A wearable ear device includes a housing, a speaker, a structure, a non-conductive support member, and an integrated circuit (IC). The housing includes a non-conductive cover. The speaker is located within the housing. The structure is located within the housing and includes a non-conductive support member facing the non-conductive cover and located within the housing, and a first conductive pattern located on the non-conductive support member. A non-conductive bonding member is located between the structure and the non-conductive cover. A touch sensor IC is located within the housing and is electrically connected to the first conductive pattern.

Description

Technical Field

[0001] Various implementations involve wearable devices for the ear. Background Technology

[0002] With the development of digital technology, various types of electronic devices have become available, such as smartphones, tablet PCs, or personal digital assistants (PDAs). Electronic devices have even been developed to be wearable to improve portability and accessibility. For example, an electronic device could be an ear-worn device that can be worn in the user's ear.

[0003] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content is applicable to prior art relating to this disclosure. Summary of the Invention

[0004] Technical issues

[0005] Ear-worn devices may include touch detection circuitry for detecting touch input. For example, the touch detection circuitry may be positioned close to the housing that forms the appearance of the ear-worn device. However, gaps (e.g., air gaps) may exist between the housing and the touch detection circuitry, which may degrade the performance of the touch detection circuitry for detecting user input.

[0006] Ear-worn devices may include antennas for wireless communication with external electronic devices. Because ear-worn devices are meant to be worn in a user's ear, they can be manufactured in a small size; however, this can make it difficult to fit an antenna within limited installation space while ensuring radio performance. Furthermore, radio performance may degrade due to the user's body when the ear-worn device is worn in the ear.

[0007] One embodiment can provide an ear-worn device that can improve the performance of touch detection circuitry for detecting user input.

[0008] One embodiment may provide an ear-wearable device in which the antenna is configured to ensure radio performance and reduce the impact caused by the user's body.

[0009] Solution to the problem

[0010] According to one embodiment, an ear-wearable device includes: a housing including a non-conductive cover; a speaker located within the housing; a structure located within the housing and including a non-conductive support member facing the non-conductive cover and located within the housing, and a first conductive pattern located on the non-conductive support member; a non-conductive bonding member located between the structure and the non-conductive cover; and a touch sensor integrated circuit (IC) located within the housing and electrically connected to the first conductive pattern.

[0011] According to one embodiment, an electronic device includes: a housing having a non-conductive region exposed to the outside; a structure located within the housing and including a non-conductive support member facing the non-conductive region and located within the housing, and a first conductive pattern located on the non-conductive support member; a non-conductive bonding member located between the structure and the non-conductive region; and a touch sensor integrated circuit (IC) located within the housing and electrically connected to the first conductive pattern.

[0012] Beneficial effects of the invention

[0013] According to one embodiment, a non-conductive bonding member located in an electronic device fills the gap (e.g., an air gap) between a structure including a touch detection circuit and a non-conductive cover forming the appearance of an ear wearable device, thereby improving the detection performance of the touch detection circuit.

[0014] According to one embodiment, a non-conductive bonding member located in an electronic device not only facilitates the connection between the structure including the touch detection circuit and the non-conductive cover forming the appearance of the ear wearable device, but also increases the dielectric constant of the touch detection circuit.

[0015] According to one embodiment, the antenna is disposed in a structure including touch detection circuitry, thereby not only overcoming the limited antenna design space of ear wearable devices, but also ensuring radiation performance and reducing the impact on the user's body.

[0016] Effects that may be obtained or anticipated from other various embodiments will be disclosed, directly or implicitly, in the detailed description of the embodiments. For example, various effects anticipated from various embodiments will be described in the following detailed description.

[0017] Before proceeding with the following “Detailed Description,” it may be advantageous to define certain words and phrases used throughout this patent document: the terms “comprising” and “including” and their derivatives mean unrestricted inclusion; the term “or” is inclusive, meaning and / or; the phrases “associated with” and “associated with” and their derivatives may mean including, being included in, interconnected with, containing, contained within, connected to or connected to, linked to or connected to, able to communicate with, cooperate with, interleaved, juxtaposed, proximate, engaged to or engaged with, having, having the characteristics of, etc.; the term “controller” means any means, system or part thereof, that controls at least one operation, such means may be implemented in hardware, firmware or software, or a combination of at least two of these. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether local or remote.

[0018] Furthermore, the various functions described below can be implemented or supported by one or more computer programs, each computer program being formed from computer-readable program code and embodied in a computer-readable medium. The terms "application" and "program" refer to one or more computer programs, software components, instruction sets, procedures, functions, objects, classes, instances, associated data, or portions thereof suitable for implementation in appropriate computer-readable program code. The phrase "computer-readable program code" includes any type of computer code, including source code, object code, and executable code. The phrase "computer-readable medium" includes any type of medium accessible by a computer, such as read-only memory (ROM), random access memory (RAM), hard disk drive, compact disc (CD), digital video disc (DVD), or any other type of storage. "Non-transitory" computer-readable media does not include wired links, wireless links, optical links, or other communication links that transmit transient electrical or other signals. Non-transitory computer-readable media includes media in which data can be permanently stored and media in which data can be stored and subsequently rewritten, such as rewritable optical discs or erasable memory devices.

[0019] Definitions for certain words and phrases are provided throughout this patent document, and those skilled in the art will understand that, in many (if not most) cases, such definitions apply to the previous and future use of the words and phrases defined in this way. Attached Figure Description

[0020] To gain a more complete understanding of this disclosure and its advantages, the following description is now taken in conjunction with the accompanying drawings, in which the same reference numerals denote the same parts:

[0021] Figure 1 A perspective view of an ear-wearable device according to one embodiment is shown;

[0022] Figure 2 The image shows a wearable ear device according to one embodiment being inserted into a user's ear;

[0023] Figure 3 An embodiment is shown. Figure 1 A block diagram of a wearable ear device;

[0024] Figure 4 An embodiment is shown. Figure 1 A cross-sectional view of the wearable ear device shown, taken along line A-A';

[0025] Figure 5 An embodiment is shown. Figure 1 A cross-sectional view of the wearable ear device shown, taken along line B-B';

[0026] Figure 6 An embodiment is shown. Figure 1 An exploded perspective view of a portion of the wearable ear device shown;

[0027] Figure 7 A non-conductive cover and a cover according to one embodiment are shown. Figure 1 The ear-wearable device is shown in its detached state;

[0028] Figure 8 A perspective view of a structure according to one embodiment is shown;

[0029] Figure 9 An embodiment is shown. Figure 1 An exploded perspective view of a portion of the wearable ear device shown; and

[0030] Figure 10 An embodiment is shown. Figure 1 The image shows a cross-sectional view of the wearable ear device. Detailed Implementation

[0031] The following discussion Figures 1 to 10 The various embodiments used to describe the principles of this disclosure in this patent document are for illustrative purposes only and should not be construed as limiting the scope of this disclosure in any way. Those skilled in the art will understand that the principles of this disclosure can be implemented in any suitably arranged system or apparatus.

[0032] In the following description, various embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0033] It should be understood that the embodiments and terminology used herein are not intended to limit the technical features set forth herein to a particular embodiment, but rather to include various variations, equivalents, and / or alternatives to the corresponding embodiments. Regarding the description of the drawings, similar reference numerals may be used to denote similar or related elements. It will be understood that a singular noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, phrases such as “A or B” and “at least one of A and / or B” may include all possible combinations of items listed together in the corresponding phrase. As used herein, terms such as “first,” “second,” “first,” and “second” may modify corresponding elements regardless of their order and / or importance. These terms may be used simply to distinguish one corresponding element from another element without limiting the element. It should be understood that when an element (e.g., a first element) is referred to as being (operationally or communicatively) “connected” or “coupled” to another element (e.g., a second element), it means that the element may be coupled directly or via another element (e.g., a third element) to that other element.

[0034] The expression “configured as” as used in this disclosure may be used interchangeably with, in hardware or software terms, "suitable for," "capable of," "adapted to," "made of," "capable of," or "designed to." Alternatively, in some cases, the expression “a device configured as…” may mean that the device, together with other devices or components, is “capable of…”.

[0035] Figure 1 A perspective view of an ear wearable device 100 according to one embodiment is shown. Figure 2 The image shows an ear wearable device 100 inserted into a user's ear according to one embodiment.

[0036] Reference Figure 1 and Figure 2 In one embodiment, the ear wearable device 100 may include a housing 110 or an ear tip 120.

[0037] For example, the housing 110 may be shaped to be detachably inserted into the user's ear 200. According to one embodiment, the housing 110 may have a first segment 111 and a second segment 112, the first segment 111 being at least partially inserted into the external auditory canal (not shown) of the ear 200, and the second segment 112 being disposed in a groove 202 of the auricle that connects to the external auditory canal. The ear wearable device 100 may include a speaker (e.g., [missing information]) disposed in the housing 110. Figure 3 The speaker 341 shown. Sound output from the speaker can be released through a first segment 111 inserted into the external auditory canal of the ear 200 and then transmitted to the eardrum of the ear 200. At least a portion of the housing 110 can be made of various materials such as polymers or metals.

[0038] For example, the earphone end member 120 can be coupled to the first segment 111 of the housing 110. The earphone end member 120 can be a hollow, flexible member, and the first segment 111 of the housing 110 can be inserted into a channel of the earphone end member 120. For example, the earphone end member 120 can be disposed in a groove formed in the first segment 111 of the housing 110 and coupled to the first segment 111. When the first segment 111 of the housing 110 is inserted into the external auditory canal of the ear 200, the earphone end member 120 can be resiliently positioned between the external auditory canal of the ear and the first segment 111 of the housing 110. The earphone end member 120 can be detachably coupled to the first segment 111 of the housing 110 and can have various sizes and shapes.

[0039] According to one embodiment, the housing 110 may include a non-conductive cover 530 coupled to the second segment 112. When the housing 110 is inserted into the user's ear 200, the non-conductive cover 530 may be exposed to the outside of the ear 200. The surface 531 formed by the non-conductive cover 530 may be a curved surface smoothly connected to the outer surface of the second segment 112. The surface 531 formed by the non-conductive cover 530 may also be a flat surface.

[0040] According to one embodiment, the surface 531 of the non-conductive cover 530 can be used as an input area (or key area) for receiving or detecting user input. When the ear-worn device 100 is worn in the user's ear 200, touch input, hover input, or gesture input can be performed via the surface 531. For example, hover input can be user input that can be generated without the finger touching the surface 531. For example, gesture input can be input related to finger movement (or finger movement pattern).

[0041] According to one embodiment, a microphone hole 1121 may be formed in the second segment 112 of the housing 110. When the ear wearable device 100 is worn in the user's ear 200, the microphone hole 1121 may be exposed to the outside. The number or position of the microphone holes 1121 may vary and is not limited to this embodiment. Figure 1 The implementation method.

[0042] Figure 3 An embodiment is shown. Figure 1 A block diagram of the ear wearable device 100.

[0043] Reference Figure 3 In one embodiment, the ear wearable device 100 may include a processor 310, a memory 320, a touchpad 330, an audio module 340, a speaker 341, a microphone 342, a sensor module 350, a connection terminal 360, a power management module 370, a battery 380, a communication module 390, or at least one antenna 391. According to one embodiment, the ear wearable device 100 may not include... Figure 3 At least one of the components shown, or one or more other components may be added. According to one embodiment, some components may be implemented in a unified circuit.

[0044] For example, processor 310 can control at least one other component (e.g., hardware or software) connected to the ear wearable device 100, and can process or calculate various data by running software. According to one embodiment, as at least part of data processing or calculation, processor 310 can load commands or data received from another component (e.g., sensor module 350 or communication module 390) into volatile memory of memory 320, process the commands or data stored in volatile memory, and store the result data in non-volatile memory.

[0045] For example, memory 320 may store various data used by at least one component of the ear-worn device 100 (e.g., processor 310 or sensor module 350). For example, the data may include software (e.g., a program) and input or output data regarding commands associated with the software. Memory 320 may include volatile or non-volatile memory. The program may be stored in memory 320 as software and may include, for example, an operating system, middleware, or an application. For example, memory 320 may store instructions related to various operations performed by processor 310.

[0046] Reference Figures 1 to 3The touchpad 330 is, for example, a pointing device using the surface 531 of the non-conductive cover 530 of the housing 110, and may include a touch detection circuit 331 and a touch sensor integrated circuit (IC) (or touch sensor) 332. According to one embodiment, the touch detection circuit 331 may include a conductive pattern disposed in the housing 110. The non-conductive cover 530 may be configured to overlap at least a portion of the touch detection circuit 331. The surface 531 of the non-conductive cover 530 may serve as an input area (or key area) for receiving or detecting user input. According to one embodiment, the touchpad 330 may be implemented based on capacitance type. The touch sensor IC 332 (e.g., a touch control IC (integrated circuit)) may apply a voltage to the touch detection circuit 331, and the touch detection circuit 331 may generate an electromagnetic field. For example, when a finger touches the surface 531 of the non-conductive cover 530 and reaches a critical distance from the surface 531, the capacitance change based on the change in the electromagnetic field may be a critical value or higher. When the capacitance change is at or above a critical value, the touch sensor IC 332 can generate a coordinate-related electrical signal and send this signal as valid user input to the processor 310. The processor 310 can identify the coordinates based on the electrical signal received from the touch sensor IC 332. The touch detection circuit 331 and the touch sensor IC 332 can be collectively referred to as a sensor circuit for detecting touch. According to various embodiments, the key area included in the surface 531 of the non-conductive cover 530 and the touch detection circuit 331 corresponding to the key area can be collectively referred to as a touch key. The touchpad 330 can contribute to a smooth and integrated appearance of the ear wearable device 100 by forming the touch detection circuit to fit the shape of the housing.

[0047] According to various embodiments, the touch sensor IC 332 can convert analog signals obtained by the touch detection circuit 331 into digital signals. According to various embodiments, the touch sensor IC 332 can perform various functions, such as noise filtering, noise removal, or extracting sensing data associated with the touch detection circuit 331. According to various embodiments, the touch sensor IC 332 may include various circuits, such as analog-to-digital converters (ADCs), digital signal processors (DSPs), and / or microcontroller units (MCUs).

[0048] According to one embodiment, user input related to audio data (or audio content) can be generated via the touchpad 330. For example, based on user input via the touchpad 330, functions such as playing audio data, temporarily pausing playback, stopping playback, controlling playback speed, controlling volume, or muting can be performed. (See also...) Figure 1In various embodiments, various gestures can be input using a finger via a key area included in the surface 531 of the non-conductive cover 530, and various functions related to audio data can be performed based on the gesture input. For example, when the key area of ​​the non-conductive cover 530 is tapped once, the processor 310 can play or stop the playback of audio data. For example, when the key area of ​​the non-conductive cover 530 is tapped twice, the processor 310 can play the next audio data. For example, when the key area of ​​the non-conductive cover 530 is tapped three times, the processor 310 can play the previous audio data. For example, when the key area of ​​the non-conductive cover 530 is swiped, the processor 310 can adjust the volume of the audio data playback. Gesture input can be used not only for functions related to audio data but also for various other functions. For example, when a telephone call is received, the processor 310 can receive the call when the key area of ​​the non-conductive cover 530 is tapped twice.

[0049] According to various embodiments, the touchpad 330 may further include a tactile layer (not shown). The touchpad 330 including the tactile layer can provide tactile feedback to the user.

[0050] According to one embodiment, a click button (not shown) may be present aligned with the touchpad 330, and when the non-conductive cover 530 is pressed, an input similar to clicking a mouse button can be generated. According to one embodiment, the touchpad 330 may include sensor circuitry (e.g., a pressure sensor) (not shown) configured to measure the magnitude of the force generated by the user input.

[0051] According to various embodiments, in addition to the touchpad 330, the ear wearable device 100 may further include various other input devices configured to receive commands or data from outside the ear wearable device 100 (e.g., a user) for use with components of the ear wearable device 100 (e.g., processor 310). The input devices may be implemented in various ways, such as physical buttons or optical keys.

[0052] For example, speaker 341 can output audio signals to the outside of the ear-worn device 100. Sound waves, such as sound or speech, can be transmitted through microphone hole 1121 (see...). Figure 1 The sound is transmitted to microphone 342, and microphone 342 can generate an electrical signal corresponding to the sound wave. Audio module 340 can convert sound into an electrical signal or an electrical signal into sound. Audio module 340 can obtain sound through microphone 342 or output sound through speaker 341.

[0053] According to one embodiment, the audio module 340 can support audio data collection functionality. The audio module 340 can play the collected audio data. The audio module 340 may include an audio decoder, a digital-to-analog (D / A) converter, or an analog-to-digital (A / D) converter. The audio decoder can convert audio data stored in the memory 320 into digital audio signals. The D / A converter can convert the digital audio signals converted by the audio decoder into analog audio signals. The speaker 341 can output the analog audio signals converted by the D / A converter. The A / D converter can convert the analog audio signals obtained through the microphone 342 into digital audio signals.

[0054] For example, sensor module 350 can detect the operating state of ear wearable device 100 (e.g., power or temperature) or external environmental state (e.g., user state), and can generate electrical signals or data values ​​corresponding to the detected state. According to one embodiment, sensor module 350 may include an accelerometer, gyroscope, geomagnetic field sensor, magnetic sensor, proximity sensor, temperature sensor, gesture sensor, grip sensor, or biosensor.

[0055] For example, refer to Figure 1 The ear-wearable device 100 may include an optical sensor at least partially disposed within or on the surface of a housing 110. When the optical sensor is disposed within the housing 110, the area of ​​the housing 110 facing the optical sensor may be configured to transmit light or may have an opening. The optical sensor may include a light emitter (e.g., a light-emitting diode (LED)) that outputs light in at least one wavelength band or a light receiver (e.g., a photodiode) that generates an electrical signal by receiving light in one or more wavelength bands. According to one embodiment, the optical sensor may be a sensor configured to detect wear. According to one embodiment, the optical sensor may be a biosensor. When the ear-wearable device 100 is worn in a user's ear, light emitted from the light emitter of the optical sensor may be reflected by the user's skin and may enter the light receiver of the optical sensor. The light receiver of the optical sensor may provide an electrical signal based on the incident light to a processor 310. The processor 310 may transmit the electrical signal obtained from the optical sensor to an external electronic device (e.g., a smartphone) via a communication module 390. The external electronic device may obtain various biometric information, such as heart rate or skin temperature, based on the electrical signal obtained from the ear-wearable device 100. According to one embodiment, the processor 310 can acquire biological information based on electrical signals obtained from an optical sensor, and can send the acquired biological information to an external electronic device via a communication module 390, or output the acquired biological information via a speaker 341.

[0056] According to various embodiments, the sensor module 350 can obtain information or signals regarding whether the ear wearable device 100 is worn in the user's ear. According to various embodiments, the sensor module 350 can obtain information or signals regarding whether the ear wearable device 100 is combined with an external device (e.g., a charger).

[0057] According to various embodiments (not shown), the ear wearable device 100 may include a detected component corresponding to a sensor of an external electronic device (e.g., a charger). For example, the external electronic device may include a Hall IC disposed on a base, and the ear wearable device 100 may include a magnet (or magnetic material). When the ear wearable device 100 is attached to the base of the external electronic device, the Hall IC of the external electronic device may detect the magnet disposed in the ear wearable device 100 and may send an electronic signal regarding the combination of the external electronic device and the ear wearable device 100 to the processor 310.

[0058] For example, connection terminal 360 may include a connector through which the ear wearable device 100 can be electrically connected to an external electronic device (e.g., a smartphone or charger). According to one embodiment, connection terminal 360 may include, for example, a USB connector or an SD card connector.

[0059] According to various embodiments, the connection terminal 360 may include a portion disposed in the housing 110 (see...). Figure 1 At least one contact (or terminal) on the outer surface of the external electronic device. For example, when the ear wearable device 100 is mounted on the base (not shown) of an external electronic device, the at least one contact of the ear wearable device 100 can be electrically connected to at least one contact (e.g., a flexible terminal, such as a spring pin) disposed on the base of the external electronic device. According to one embodiment, the connection terminal 360 can receive power from the external electronic device for charging the battery 380 and transmit the power to the power management module 370. According to one embodiment, the ear wearable device 100 can communicate with an external electronic device (e.g., a charger) via the connection terminal 360 through power line communication (PLC).

[0060] For example, the power management module 370 can manage the power supplied to the ear wearable device 100. According to one embodiment, the power management module 370 can be implemented as at least part of a power management integrated circuit (PMIC).

[0061] For example, battery 380 can power at least one component of the ear wearable device 100. According to one embodiment, battery 380 may include a rechargeable secondary battery.

[0062] For example, communication module 390 can support the establishment of a direct (e.g., wired) or wireless communication channel between the ear-worn wearable device 100 and an external electronic device (e.g., a server, smartphone, personal computer (PC), personal digital assistant (PDA), or access point), as well as communication through the established communication channel. According to various embodiments, communication module 390 can operate independently of processor 310 and can include one or more communication processors that support direct (e.g., wired) or wireless communication.

[0063] For example, the communication module 390 can transmit or receive signals or power from an external electronic device via at least one antenna (or antenna radiator) 391. According to one embodiment, the communication module 390 may include a wireless communication module (e.g., a near-field wireless communication module or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module (e.g., a local area network (LAN) communication module or a power line communication module). Corresponding communication modules among these can communicate with external electronic devices via a first network (e.g., a near-field communication network, such as Bluetooth, Bluetooth Low Energy (BLE), Near Field Communication (NFC), Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network (e.g., a long-range communication network, such as the Internet or a computer network (e.g., a LAN or a wide area network (WAN))). These types of communication modules can be integrated into a single component (a single chip) or can consist of multiple separate components (e.g., multiple chips). According to various embodiments, the ear-worn device 100 may include multiple antennas, and the communication module 390 can select at least one antenna suitable for the type of communication used in the communication network. Signals or power can be transmitted or received between the communication module 390 and external electronic devices via at least one selected antenna.

[0064] According to one embodiment, all or some of the operations performed in the ear-worn wearable device 100 can be performed in one or more external electronic devices (e.g., smartphones). For example, when the ear-worn wearable device 100 needs to automatically perform a predetermined function or service, or to perform a predetermined function or service in response to a request from a user or another device, the ear-worn wearable device 100 may additionally request at least one external electronic device to perform at least a portion of the function or service, or request at least one external electronic device to perform at least a portion of the function or service instead of performing the function or service itself. The at least one external electronic device receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and may send the result of the performance to the ear-worn wearable device 100. The ear-worn wearable device 100 may process the result unchanged or additionally, and then provide the result as at least a partial response to the request.

[0065] According to various implementations, commands or data received by the processor 310 can be sent or received between the ear-worn device 100 and an external electronic device (e.g., a smartphone) via a server connected to a second network (e.g., a long-distance communication network, such as the Internet or a computer network (e.g., a LAN or WAN)).

[0066] According to one embodiment, processor 310 can be configured to control the flow of various signals associated with audio data and to control information collection and output. Processor 310 can be configured to receive audio data from an external electronic device (e.g., a server, smartphone, PC, PDA, or access point) via communication module 390 and store the received audio data in memory 320. Processor 310 can be configured to receive non-volatile audio data (or download audio data) from an external electronic device and store the received non-volatile audio data in non-volatile memory. Processor 310 can be configured to receive volatile audio data (or streaming audio data) from an external electronic device and store the received volatile audio data in volatile memory.

[0067] According to one embodiment, processor 310 can be configured to play audio data (e.g., non-volatile or volatile audio data) stored in memory 320, such that the audio data is output through speaker 341. For example, audio module 340 can generate an audio signal that can be output through speaker 341 by decoding the audio data (e.g., playing the audio data), and the generated audio signal can be output through speaker 341.

[0068] According to various embodiments, the processor 310 can be configured to receive audio signals from an external electronic device and output the received audio signals through a speaker 341. For example, the external electronic device (e.g., an audio playback device) can generate audio signals by decoding audio data and can send the generated audio signals to the ear-wearable device 100.

[0069] According to various embodiments, when the sensor module 350 determines that the ear wearable device 100 is not inserted into the user's ear, the mode of the ear wearable device 100 playing and outputting volatile or non-volatile audio data stored in the memory 320 through the speaker 341 can be temporarily stopped. When the sensor module 350 determines that the ear wearable device 100 is inserted into the user's ear, the mode can be restarted.

[0070] According to various embodiments, when the sensor module 350 determines that the ear wearable device 100 is not inserted into the user's ear, the mode of providing audio signals from external electronic devices and outputting those audio signals through the speaker 341 can be temporarily stopped. When the sensor module 350 determines that the ear wearable device 100 is inserted into the user's ear, the mode can be restarted.

[0071] According to various embodiments, when the ear wearable device 100 is connected to another ear wearable device (not shown) for communication, one ear wearable device can be a master device, and the other ear wearable device can be a slave device. For example, the ear wearable device 100, as the master device, can not only output audio signals received from an external electronic device (e.g., a smartphone) to a speaker 341, but also send the audio signals to another ear wearable device. The other ear wearable device can be implemented substantially the same as the ear wearable device 100, and can output the audio signals received from the ear wearable device 100 through a speaker.

[0072] According to various embodiments, the ear-worn device 100 can provide voice recognition functionality, generating voice commands from analog audio signals received via microphone 342. The voice commands can be used for various functions related to the audio data.

[0073] According to various embodiments, the ear-wearable device 100 may include multiple microphones (e.g., microphone 342) to detect the direction of sound. At least some of the microphones may be used for noise cancellation.

[0074] According to various embodiments, depending on the type provided, the ear wearable device 100 may further include various modules. Although it is difficult to describe all kinds of modules due to the various changes depending on the convergence trend of digital devices, components of the same level as the components described above may be further included in the ear wearable device 100. Furthermore, it is apparent that, depending on the type provided, certain components among the above-described components may not be provided, or may be replaced by other components in the ear wearable device 100. This will be readily understood by those skilled in the art.

[0075] Figure 4 An embodiment is shown. Figure 1 A cross-sectional view of the ear wearable device 100 taken along line A-A'. Figure 5 An embodiment is shown. Figure 1 A cross-sectional view of the ear wearable device 100 taken along line B-B'.

[0076] Reference Figure 4 and Figure 5 In one embodiment, the ear wearable device 100 may include a housing 110, an earphone end component 120, a first support member 410, a second support member 420, a first printed circuit board 430, a second printed circuit board 440, and a battery 450 (e.g., Figure 3 The battery 380 and microphone 460 shown are shown, for example. Figure 3 The microphone 342 and speaker 470 shown are illustrated. Figure 3 The speaker shown is 341) or the flexible printed circuit board (FPCB) is 480.

[0077] According to one embodiment, the housing 110 may have a first housing section (e.g., Figure 1 The first section 111 and the second shell section 520 shown (e.g., Figure 1The second housing section 510 (shown as second section 112), non-conductive cover 530, and rim 540 are shown. The first housing section 510 may be an external component to which the earphone end member 120 is attached, and the second housing section 520 may be an external component to which the non-conductive cover 530 is attached. A first printed circuit board 430, a second printed circuit board 440, a battery 450, a microphone 460, a speaker 470, and an FPCB 480 may be disposed within an internal space defined by the combination of the first housing section 510 and the second housing section 520. The rim 540 may be disposed at a connection portion (not shown) between the first housing section 510 and the second housing section 520. For example, the connection portion between the first housing section 510 and the second housing section 520 may have a snap-fit ​​connection structure, and the edges of the first housing section 510 and the second housing section 520 may partially overlap each other. The connection portion between the first housing section 510 and the second housing section 520 may have an annular recess 501. The edge portion 540 may be disposed in the annular recess 501 and may form at least a portion of the outer surface of the housing 110, while covering the connection portion between the first housing segment 510 and the second housing segment 520. The edge portion 540 is removable and may have various shapes corresponding to the grooves within the auricle. According to various embodiments, the edge portion 540 may be made of a flexible material and may elastically press against the grooves within the auricle when the housing 110 is inserted into the user's ear.

[0078] According to one embodiment, a second support member 420 is disposed in the housing 110 and may be connected to or integrated with a second housing segment 520. The second support member 420 may extend at least partially between the non-conductive cover 530 and the first printed circuit board 430. At least a portion of the second support member 420 may be made of a non-metallic material (e.g., a polymer) or a metallic material.

[0079] According to one embodiment, a first support member 410 may be disposed within the housing 110 and may be located between the non-conductive cover 530 and the second support member 420. The first support member 410 may be coupled to the second support member 420 and / or the non-conductive cover 530. The first support member 410 may be made of a non-conductive material such as a polymer.

[0080] According to one implementation method, Figure 3 The touch detection circuit 331 shown can be located at the first support member 410. For example, Figure 3 The touch detection circuit 331 shown may have a first conductive pattern disposed at the first support member 410 (e.g., Figure 7The first conductive pattern 610 is shown. The first conductive pattern may extend at least partially between the non-conductive cover 530 and the first support member 410. The portion of the first conductive pattern that serves as a terminal may extend between the first support member 410 and the first printed circuit board 430, and may be electrically connected to the first printed circuit board 430 via a flexible conductive member (such as a C-clamp (e.g., a C-spring), spring pin, spring, conductive PORON, conductive rubber, conductive strip, or copper connector). Figure 3 The touch sensor IC 332, shown and disposed on a first printed circuit board 430 or a second printed circuit board 440, can apply a voltage to a first conductive pattern, and the first conductive pattern can generate an electromagnetic field for detecting and receiving user input. According to one embodiment, the processor 310 can detect when a user is wearing an ear-worn device 100 and can control the touch sensor IC 332 to apply a voltage to the first conductive pattern based on the detection result.

[0081] According to one implementation method, Figure 3 At least one antenna 391 shown may be located at the first support member 410. For example, Figure 3 At least one antenna 391 shown may have a second conductive pattern disposed at the first support member 410. The second conductive pattern may be implemented for... Figure 3 The first conductive pattern of the touch detection circuit 331 shown is physically (or electrically) separated. A second conductive pattern may extend at least partially between the non-conductive cover 530 and the first support member 410. The portion of the second conductive pattern that serves as a terminal may extend between the first support member 410 and the first printed circuit board 430, and may be electrically connected to the first printed circuit board 430 via a flexible conductive member (such as a C-clamp, spring pin, spring, conductive PORON, conductive rubber, conductive strip, or copper connector). Figure 3 The communication module 390 shown and disposed on the first printed circuit board 430 or the second printed circuit board 440 can send signals to or receive signals from external electronic devices through the second conductive pattern.

[0082] According to one embodiment, a first printed circuit board 430 may be located between a second support member 420 and a battery 450. A microphone 460 may be disposed on the first printed circuit board 430 between the first printed circuit board 430 and the battery 450. The ear wearable device 100 may have a sound transmission path (or channel) (not shown) which will pass through at least one microphone hole formed in the second housing section 520 (e.g., Figure 1Sound propagating into the interior through the microphone hole 1121 is transmitted to the microphone 460. For example, the first printed circuit board 430 may have at least one through-hole (or opening) overlapping with the microphone 460, and sound propagating into the interior through the microphone hole 1121 may be transmitted to the microphone 460 through said at least one through-hole.

[0083] According to one embodiment, a second printed circuit board 440 may be positioned opposite a first printed circuit board 430, with a battery 450 located between them. The second printed circuit board 440 may be at least partially located between the battery 450 and the speaker 470. The speaker 470 may be located within the housing 110 to output sound toward the user's eardrum when the housing 110 is worn in the user's ear. The speaker 470 may be electrically connected to the second printed circuit board 440. The ear wearable device 100 may have a sound transmission path (or channel) (not shown) that releases sound output from the speaker 470 to the outside through an opening (e.g., a sound outlet) 511 in a first housing section 510 coupled to the earphone end member 120.

[0084] According to one embodiment, the first printed circuit board 430 and the second printed circuit board 440 can be electrically connected via various electrical paths, such as FPCB 480. FPCB 480 can extend between the battery 450 and the housing 110. Figure 3 The processor 310, memory 320, touch sensor IC 332, audio module 340, sensor module 350, communication module 390, power management module 370 or connection terminal 360 shown can be disposed on the first printed circuit board 430 or the second printed circuit board 440.

[0085] According to various embodiments, the first printed circuit board 430, the second printed circuit board 440, and the FPCB 480 can be implemented as an integrated rigid-flex printed circuit board. According to one embodiment, the first printed circuit board 430 and the FPCB 480, or the second printed circuit board 440 and the FPCB 480, can be implemented as an integrated rigid-flex printed circuit board.

[0086] According to one embodiment, the ear-wearable device 100 may include a non-conductive bonding member (not shown) located between a non-conductive cover 530 and a first support member 410. The non-conductive bonding member may fill the gap between the first support member 410 and the non-conductive cover 530 and / or the touch detection circuitry 331 (see [link to relevant documentation]). Figure 3The gap between the first support member 410 and the non-conductive cover 530 can affect the electromagnetic field generated by the touch detection circuit 331. According to one embodiment, the non-conductive bonding member can reduce the air gap between the first support member 410 and the non-conductive cover 530 and / or the air gap between the touch detection circuit 331 and the non-conductive cover 530. The non-conductive bonding member not only facilitates the physical connection between the non-conductive cover 530 and the first support member 410, but also increases the dielectric constant associated with the electromagnetic field, thereby improving the performance of the touch detection circuit 331 in detecting user input (e.g., touch input, hover input, or gesture input).

[0087] According to one embodiment, the non-conductive cover 530 and the second housing segment 520 can be integrated and may comprise the same polymer. In this case, a portion of the second housing segment 520 may be positioned as a non-conductive region facing the first support member 410. According to one embodiment, the non-conductive cover 530 and the first support member 410 can be integrated, and a first conductive pattern may be provided at the integrated non-conductive cover 530 and / or the first support member 410.

[0088] According to one embodiment, a portion of the second housing section 520 may be made of a metallic material.

[0089] Figure 6 An embodiment is shown. Figure 1 An exploded perspective view of a portion of the ear wearable device 100 shown. Figure 7 The non-conductive cover 530 and according to one embodiment are shown. Figure 1 The ear wearable device 100 shown is in a detached state.

[0090] Reference Figure 6 and Figure 7 In one embodiment, the ear wearable device 100 may include a first housing section 510, a second housing section 520, a non-conductive cover 530, an edge portion 540, a second support member 420, a structure 800, or an earphone end component 120.

[0091] According to one embodiment, the structure (or conductive pattern structure) 800 may include a non-conductive first support member 410 and a first conductive pattern 610 or a second conductive pattern 620 disposed on the first support member 410. According to one embodiment, the first conductive pattern 610 or the second conductive pattern 620 may be implemented by laser direct forming (LDS). For example, the first conductive pattern 610 or the second conductive pattern 620 may be formed by designing a pattern on the first support member using a laser and then plating a conductive material such as copper or nickel thereon. The first conductive pattern 610 or the second conductive pattern 620 may be disposed on the first support member 410 by printing or various other methods such as FPCB.

[0092] Figure 8 A perspective view of a structure 800 according to one embodiment is shown.

[0093] Reference Figure 6 , Figure 7 and Figure 8 In one embodiment, the first support member 410 may have a first surface 410a facing the non-conductive cover 530 and a second surface 410b facing in the opposite direction to the first surface 410a. The first conductive pattern 610 may have a first conductive portion 611 disposed on the first surface 410a and a second conductive portion 612 extending from the first conductive portion 611 and disposed on the second surface 410b. The first support member 410 may have a first through hole 601, and the first conductive pattern 610 may have a third conductive portion 613 disposed in the first through hole 601 and connecting the first conductive portion 611 and the second conductive portion 612 (see...). Figure 8 The second conductive pattern 620 may have a fourth conductive portion 621 disposed on the first surface 410a and a fifth conductive portion 622 extending from the fourth conductive portion 621 and disposed on the second surface 410b. The second conductive pattern 620 may also have a sixth conductive portion 623 disposed on the side surface of the second support member 420 and connecting the fourth conductive portion 621 and the fifth conductive portion 622 (see...). Figure 7 The second conductive portion 612 of the first conductive pattern 610 can be set in a way that... Figure 4 or Figure 5 A first flexible conductive member (not shown) on the first printed circuit board 430 is electrically connected to the first printed circuit board 430. The fifth conductive portion 622 of the second conductive pattern 620 can be disposed on... Figure 4 or Figure 5 A second flexible conductive member (not shown) on the first printed circuit board 430 is electrically connected to the first printed circuit board 430.

[0094] According to one embodiment, the first conductive pattern 610 can be coupled with... Figure 3 Shown and set in Figure 4 or Figure 5 The touch sensor IC 332 is electrically connected on the first printed circuit board 430 or the second printed circuit board 440 shown. The touch detection circuit 331 may have a first conductive pattern 610. The first conductive portion 611 of the first conductive pattern 610 may be a sensing panel for detecting and receiving user input.

[0095] According to one embodiment, the second conductive pattern 620 can be coupled with... Figure 3 Shown and set in Figure 4 or Figure 5 The communication module 390 is electrically connected on the first printed circuit board 430 or the second printed circuit board 440 shown. Figure 3 At least one antenna 391 shown may have a second conductive pattern 620. According to one embodiment, the communication module 390 may support wireless communication (e.g., Bluetooth communication) via the second conductive pattern 620. At least a portion of the non-conductive cover 530 may be made of a non-conductive material to prevent degradation of the radiation performance of the second conductive pattern 620.

[0096] According to one embodiment, the second conductive pattern 620 may not be provided, or it may be provided in another shape. In this case, the first conductive pattern 610 may be further extended, and is not limited to the embodiment shown in the figures.

[0097] According to one embodiment, when viewed from above the first surface 410a, the fourth conductive portion 621 of the second conductive pattern 620 can be formed in a shape that surrounds at least a portion of the first conductive portion 611 of the first conductive pattern 610.

[0098] In one embodiment, refer to Figure 6 The second support member 420 may have a first recess 421 in which the first support member 410 may be disposed. The first support member 410 may fit into the first recess 421, thereby improving the connection between the first support member 410 (or structure 800) and the second support member 420. The first recess 421 may have a first opening 701 corresponding to the second conductive portion 612 of the first conductive pattern 610. (Refer to...) Figure 6 and Figure 8 The second conductive portion 612 of the first conductive pattern 610 can pass through the first opening 701 and... Figure 4 or Figure 5 The first printed circuit board 430 shown is electrically connected. For example, the second conductive portion 612 of the first conductive pattern 610 can be positioned close to the first opening 701. Figure 4 or Figure 5The first printed circuit board 430 is shown, and can be electrically connected to the first printed circuit board 430 via a first flexible conductive member. The first recess 421 may have a second opening 702 corresponding to the fourth conductive portion 621 of the second conductive pattern 620. (Refer to...) Figure 6 and Figure 8 The fourth conductive portion 621 of the second conductive pattern 620 can be positioned close to the second opening 702. Figure 4 or Figure 5 The first printed circuit board 430 is shown, and can be electrically connected to the first printed circuit board 430 via a second flexible conductive member. (See reference...) Figure 8 The portion of the second conductive portion 612 of the first support member 410 on which the first conductive pattern 610 is disposed can (e.g., in the direction facing the second surface 410b of the first support member 410) face... Figure 4 or Figure 5 The first printed circuit board 430 shown protrudes, thereby reducing the distance between the second conductive portion 612 and the first printed circuit board 430. (Refer to...) Figure 8 The portion of the fourth conductive portion 621 of the second conductive pattern 620 disposed thereon on the first support member 410 can (e.g., in the direction facing the second surface 410b of the first support member 410) face... Figure 4 or Figure 5 The first printed circuit board 430 shown protrudes, thereby reducing the distance between the fourth conductive portion 621 and the first printed circuit board 430.

[0099] In one embodiment, refer to Figure 8 The first support member 410 may have a plurality of protrusions 801 and 802 projecting from the second surface 410b. (Refer to...) Figure 6 and Figure 8 The first recess 421 of the second support member 420 may have a plurality of first through holes 711 and 712 into which the first protrusions 801 and 802 can be inserted. The arrangement of the first protrusions 801 and 802 inserting into the first through holes 711 and 712 can improve the connection force between the first support member 410 (or structure 800) and the second support member 420. The number or position of the first protrusions and the first through holes corresponding to the first protrusions can vary and is not limited to this. Figure 6 and Figure 8 The implementation method shown.

[0100] In one embodiment, refer to Figure 6The second support member 420 may have an annular second recess 422 surrounding the first recess 421. The first recess 421 is surrounded by the second recess 422, and when viewed from above the non-conductive cover 530, the first recess 421 may be formed deeper than the second recess 422. The edge of the non-conductive cover 530 may be located on the second recess 422.

[0101] Reference Figure 6 and Figure 7 According to one embodiment, the first surface 410a of the first support member 410 may have a third recess 602. The first conductive portion 611 of the first conductive pattern 610 may be at least partially disposed in the third recess 602.

[0102] Figure 9 An embodiment is shown. Figure 1 An exploded perspective view of a portion of the ear wearable device 100 shown.

[0103] Reference Figure 9 For example, the non-conductive cover 530 may have a third surface 530a facing the first support member 410. According to one embodiment, the third surface 530a may have an insertable... Figure 6 The protrusion 910 in the third recess 602 shown. The protrusion 910 can reduce the air gap between the non-conductive cover 530 and the structure 800. The protrusion 910 can improve the physical connection between the non-conductive cover 530 and the structure 800.

[0104] In one embodiment, refer to Figure 6 , Figure 7 and Figure 9 The first support member 410 of structure 800 may have a plurality of second through holes 941 and 942 around the third recess 602. The non-conductive cover 530 may have a plurality of second protrusions 921 and 922 protruding from the third surface 530a and insertable into the second through holes 941 and 942. The insertion of the second protrusions 921 and 922 into the second through holes 941 and 942 can improve the connection force between the non-conductive cover 530 and the first support member 410 (or structure 800). In one embodiment, refer to... Figure 6 The first recess 421 of the second support member 420 may have a plurality of third through holes 961 and 962 into which the second protrusions 921 and 922 can be inserted. According to one embodiment, the second protrusions 921 and 922 can be inserted into the third through holes 961 and 962 of the second support member 420 through the second through holes 941 and 942 of the first support member 410. The second protrusions 921 and 922 can improve the connection force between the non-conductive cover 530, the first support member 410 (or structure 800), and the second support member 420. The number or position of the second protrusions and the corresponding second through holes can vary and are not limited to these specifications. Figure 6 , Figure 7 and Figure 9 The implementation method shown.

[0105] According to one embodiment, a non-conductive bonding member (not shown) may be at least partially disposed between the structure 800 and the non-conductive cover 530. The non-conductive bonding member may fill the gap between the first support member 410 and the non-conductive cover 530 and / or the first conductive pattern 610 (e.g., Figure 3 The gap between the touch detection circuit 331 (shown) and the non-conductive cover 530 can affect the electromagnetic field generated by the first conductive pattern 610. According to one embodiment, the non-conductive bonding member can reduce the air gap between the first support member 410 and the non-conductive cover 530 and / or the air gap between the first conductive pattern 610 and the non-conductive cover 530. The non-conductive bonding member not only facilitates the physical connection between the non-conductive cover 530 and the structure 800, but also increases the dielectric constant associated with the electromagnetic field, thereby improving the performance of detecting user input via the first conductive pattern 610.

[0106] According to one embodiment, refer to Figure 6 and Figure 7 The first support member 410 of structure 800 may have a plurality of fourth recesses 951 and 952 surrounding the third recess 602. (Refer to...) Figure 6 , Figure 7 and Figure 9 The non-conductive cover 530 may have a plurality of third protrusions 931 and 932 protruding from the third surface 530a and insertable into the fourth recesses 951 and 952. According to one embodiment, a non-conductive engagement member disposed between the non-conductive cover 530 and the structure 800 may extend between the protrusion 910 and the first conductive pattern 610, between the third protrusions 931 and 932 and the fourth recesses 951 and 952. According to one embodiment, the fourth recesses 951 and 952 may be aligned with the first protrusions 801 and 802. The fourth recesses 951 and 952 may be formed in various other locations.

[0107] Figure 10 An embodiment is shown. Figure 1 The cross-sectional view of the ear wearable device 100 shown.

[0108] Reference Figure 10 In one embodiment, the ear wearable device 100 may include a second housing section 520, a second support member 420, a non-conductive cover 530, a structure 800, or a non-conductive bonding member 1000.

[0109] According to one embodiment, structure 800 may be located between the second support member 420 and the non-conductive cover 530. Structure 800 may include a first support member 410 and a first conductive pattern 610 or a second conductive pattern 620 disposed on the first support member 410. First protrusions 801 and 802 of the first support member 410 may be inserted into first through holes 711 and 712 of the second support member 420.

[0110] According to one embodiment, a non-conductive bonding member 1000 may be disposed between the non-conductive cover 530 and the structure 800. For example, the non-conductive bonding member 1000 may be disposed between the non-conductive cover 530 and the first support member 410. A portion of the non-conductive bonding member 1000 may be disposed between the non-conductive cover 530 and the first conductive pattern 610. The non-conductive bonding member 1000 may fill the gap between the first support member 410 and the non-conductive cover 530 and / or the first conductive pattern 610 (e.g., Figure 3 The gap between the touch detection circuit 331 (shown) and the non-conductive cover 530 can affect the electromagnetic field generated by the first conductive pattern 610. According to one embodiment, the non-conductive bonding member 1000 can reduce the air gap between the first support member 410 and the non-conductive cover 530 and / or the air gap between the first conductive pattern 610 and the non-conductive cover 530. The non-conductive bonding member 1000 not only facilitates the physical connection between the non-conductive cover 530 and the structure 800, but also increases the dielectric constant associated with the electromagnetic field, thereby improving the performance of detecting user input via the first conductive pattern 610. According to one embodiment, the non-conductive bonding member 1000 can maintain the spatial position (e.g., gap) of the non-conductive cover 530 relative to the structure including the first conductive pattern 610 and the second conductive pattern 620.

[0111] According to one embodiment, the non-conductive bonding member 1000 can extend between the non-conductive cover 530 (e.g., protrusion 910) and the first conductive pattern 610, and between the third protrusions 931 and 932 and the fourth recesses 951 and 952. For example, in a first operation, liquid non-conductive bonding material can be disposed in the fourth recesses 951 and 952. In a second operation, the non-conductive cover 530 can be moved closer to the structure 800. Through the second operation, a portion of the non-conductive bonding material can flow between the first conductive pattern 610 and the protrusions 910. In a third operation, the non-conductive bonding material is hardened, thereby forming the non-conductive bonding member 1000. The non-conductive bonding member 1000 can be disposed at various locations between the first conductive pattern 610 and the non-conductive cover 530, and is not limited to these locations. Figure 10 The embodiment shown. The number and position of the third protrusions 931 and 932 and the corresponding fourth recesses 951 and 952 can vary, and are not limited to. Figure 10The embodiments shown are illustrated. According to one embodiment (not shown), fourth recesses 951 and 952 corresponding to the third protrusions 931 and 932 may be formed at the first conductive pattern 610. According to one embodiment (not shown), the fourth recesses 951 and 952 corresponding to the third protrusions 931 and 932 may have openings formed at the first conductive pattern 610. According to one embodiment (not shown), the fourth recesses 951 and 952 corresponding to the third protrusions 931 and 932 may have openings formed at the first conductive pattern 610 and recesses formed at the second support member 420 and aligned with these openings. The method of forming the third protrusions 931 and 932, the fourth recesses 951 and 952, and the non-conductive joining member 1000 between the structure 800 and the non-conductive cover 530 based on the protrusions and recesses ensures both the connection force between the structure 800 and the non-conductive cover 530 and the performance of detecting user input through the first conductive pattern 610.

[0112] According to one embodiment, the non-conductive bonding member 1000 may include epoxy resin. The non-conductive bonding member 1000 may also include bonding materials of various other polymers.

[0113] According to one embodiment (not shown), the third protrusions 931 and 932 and the fourth recesses 951 and 952 corresponding to the third protrusions may not be provided.

[0114] According to one embodiment, the non-conductive bonding member 1000 may not extend between the second conductive pattern 620 and the non-conductive cover 530. According to another embodiment (not shown), the non-conductive bonding member 1000 may extend between the second conductive pattern 620 and the non-conductive cover 530.

[0115] According to various embodiments (not shown), the structure including the non-conductive cover 530, the structure 800 and the non-conductive bonding member 1000 therebetween can be applied to various other types of electronic devices.

[0116] According to one embodiment, an ear-wearable device (e.g., Figure 1 The ear wearable device 100 shown may include a housing (e.g., Figure 1 or Figure 2 The housing 110 shown includes a non-conductive cover (e.g., Figure 1 or Figure 2 The non-conductive cover 530 shown. Ear-wearable devices may include a speaker (e.g., [missing information]) located within the housing. Figure 5 The speaker 470 shown. Ear-wearable devices may include structures located within the housing (e.g., Figure 6 or Figure 7The structure shown is 800. The structure may include a non-conductive support member (e.g., facing the non-conductive cover and located within the housing) Figure 6 The first support member 410 shown. The structure may include a first conductive pattern (e.g., on a non-conductive support member). Figure 6 The first conductive pattern 610 shown. The ear wearable device may include a non-conductive bonding member located between the structure and the non-conductive cover (e.g., Figure 10 The non-conductive bonding member 1000 shown. The ear-wearable device may include a touch sensor integrated circuit (IC) located within the housing and electrically connected to a first conductive pattern (e.g., Figure 3 The touch sensor IC 332 shown is shown.

[0117] According to one embodiment, the first conductive pattern (e.g., Figure 6 The first conductive pattern 610 shown can be formed on a non-conductive support member (e.g., by laser direct forming (LDS)). Figure 6 On the first support member 410 shown.

[0118] According to one embodiment, a non-conductive bonding member (e.g., Figure 10 At least a portion of the non-conductive bonding member 1000 shown can be coupled to the first conductive pattern (e.g., Figure 10 The first conductive pattern 610 shown overlaps.

[0119] According to one embodiment, a non-conductive cover (e.g., Figure 10 The non-conductive cover 530 shown may have a non-conductive support member (e.g., Figure 10 At least one protrusion (e.g., the first support member 410 shown) protrudes from the first support member 410. Figure 10 The third protrusions 931 and 932 are shown. The non-conductive support member may have at least one recess (e.g., Figure 10 As shown in the fourth recesses 951 and 952), the at least one protrusion is inserted into the at least one recess. Non-conductive bonding members (e.g., Figure 10 The non-conductive bonding member 1000 shown may extend between the at least one protrusion and the at least one recess.

[0120] According to one embodiment, a non-conductive support member (e.g., Figure 6 or Figure 7 The first support member 410 shown may have a face facing the non-conductive cover (e.g., Figure 6 or Figure 7 The recess of the non-conductive cover 530 shown (e.g., Figure 6 or Figure 7 The third recess 602 shown). First conductive pattern (e.g., Figure 6or Figure 7 The first conductive pattern 610 shown can be located in the recess.

[0121] According to one embodiment, a non-conductive cover (e.g., Figure 9 The non-conductive cover 530 shown may have at least a partially inserted recess (e.g., Figure 6 or Figure 7 The protrusions in the third recess 602 shown (e.g., Figure 9 (Protrusion 910 shown).

[0122] According to one embodiment, a non-conductive support member (e.g., Figure 6 The first support member 410 shown may have a face facing the non-conductive cover (e.g., Figure 6 The first surface of the non-conductive cover 530 shown (e.g., Figure 6 The first surface 410a shown and the second surface facing the opposite direction to the first surface (e.g., Figure 8 The second surface 410b shown). First conductive pattern (e.g., Figure 6 or Figure 8 The first conductive pattern 610 shown may have a first conductive portion located on the first surface (e.g., Figure 6 The first conductive portion 611 shown and the second conductive portion extending from the first conductive portion and located on the second surface (e.g., Figure 8 The second conductive portion 612 shown. The second conductive portion can be connected to a touch sensor IC (e.g., Figure 3 The touch sensor IC 332 shown is electrically connected.

[0123] According to one embodiment, an ear-wearable device (e.g., Figure 4 or Figure 5 The ear wearable device 100 shown may further include a housing (e.g., Figure 4 or Figure 5 The first printed circuit board (e.g., in the housing 110 shown) in the housing 110 Figure 4 or Figure 5 The first printed circuit board 430 shown). The second conductive portion (e.g., Figure 8 The second conductive portion 612 shown can be electrically connected to the first printed circuit board via a flexible conductive member located between the second conductive portion and the first printed circuit board.

[0124] According to one embodiment, an ear-wearable device (e.g., Figure 4 or Figure 5 The ear-wearable device 100 shown may further include a second support member (e.g., Figure 4 or Figure 5The second support member shown is located on a non-conductive support member (e.g., Figure 4 or Figure 5 The first support member 410 shown) and the first printed circuit board (e.g., Figure 4 or Figure 5 The first printed circuit board 430 shown is between and with the housing (e.g., Figure 4 The housing 110 shown is connected. The second conductive part (e.g., Figure 8 The second conductive portion 612 shown can pass through the opening formed at the second support member (e.g., Figure 6 The first opening 701 shown is electrically connected to the first printed circuit board.

[0125] According to one embodiment, an ear-wearable device (e.g., Figure 4 or Figure 5 The ear wearable device 100 shown may further include a housing (e.g., Figure 4 or Figure 5 The battery (e.g., in the casing 110 shown) is located in the casing 110. Figure 4 or Figure 5 The battery 450 shown). First printed circuit board (e.g., Figure 4 Or the first printed circuit board 430 shown in Figure 5) can be located on a non-conductive support member (e.g., Figure 4 Between the first support member 410 (as shown in Figure 5) and the battery.

[0126] According to one embodiment, an ear-wearable device (e.g., Figure 4 or Figure 5 The ear-wearable device 100 shown may further include a portion located on a first printed circuit board (e.g., Figure 4 or Figure 5 The microphone (e.g., on the first printed circuit board 430 shown) is located on the first printed circuit board 430. Figure 4 or Figure 5 The microphone shown is 460.

[0127] According to one embodiment, an ear-wearable device (e.g., Figure 4 or Figure 5 The ear-wearable device 100 shown may further include a second printed circuit board (e.g., Figure 4 or Figure 5 The second printed circuit board 440 shown is located in the speaker (e.g., Figure 5 The speaker 470 shown) and the battery (e.g., Figure 4 or Figure 5 The battery 450 shown is between and with the first printed circuit board (e.g., Figure 4 or Figure 5The first printed circuit board shown is electrically connected. The speaker can be electrically connected to the second printed circuit board.

[0128] According to one embodiment, a touch sensor IC (e.g., Figure 3 The touch sensor IC 332 shown can be located on the first printed circuit board (e.g., Figure 4 or Figure 5 The first printed circuit board 430 shown) or the second printed circuit board (e.g., Figure 4 or Figure 5 On the second printed circuit board 440 shown.

[0129] According to one embodiment, an ear-wearable device (e.g., Figure 4 or Figure 5 The ear wearable device 100 shown may further include a housing (e.g., Figure 4 or Figure 5 The communication module (e.g., in the housing 110 shown) is located in the housing 110. Figure 3 The communication module 390 shown). The structure (for example, Figure 6 or Figure 7 The structure 800 shown may further include a non-conductive support member (e.g., Figure 6 or Figure 7 The second conductive pattern (e.g., on the first support member 410) shown Figure 6 or Figure 7 The second conductive pattern 620 shown. The second conductive pattern can be combined with the first conductive pattern (e.g., Figure 6 or Figure 7 The first conductive pattern 610 shown is physically separated and can be electrically connected to the communication module.

[0130] According to one embodiment, the first conductive pattern (e.g., Figure 6 or Figure 7 The first conductive pattern 610 shown can be at least partially replaced by the second conductive pattern (e.g., Figure 6 or Figure 7 The second conductive pattern 620 shown is surrounded.

[0131] According to one embodiment, an electronic device (e.g., Figure 4 The ear wearable device 100 shown may include a housing (e.g., Figure 4 or Figure 5 The housing 110 shown has a non-conductive area exposed to the outside (e.g., Figure 4 or Figure 5 The non-conductive cover 530 shown. Electronic devices may include structures located within the housing (e.g., Figure 6 or Figure 7The structure shown is 800. The structure may include non-conductive support members (e.g., facing the non-conductive region and located within the housing) Figure 6 or Figure 7 The first support member 410 shown. The structure may include a first conductive pattern (e.g., on a non-conductive support member). Figure 6 or Figure 7 The first conductive pattern 610 shown. The electronic device may include a non-conductive bonding member located between the structure and the non-conductive cover (e.g., Figure 10 The non-conductive bonding member 1000 shown. The electronic device may include a touch sensor IC (e.g., located within a housing and electrically connected to a first conductive pattern). Figure 3 The touch sensor IC 332 shown is shown.

[0132] According to various embodiments, the first conductive pattern (e.g., Figure 6 or Figure 7 The first conductive pattern 610 shown can be formed on a non-conductive support member (e.g., by LDS) Figure 6 or Figure 7 On the first support member 410 shown.

[0133] According to various embodiments, non-conductive bonding members (e.g., Figure 10 At least a portion of the non-conductive bonding member 1000 shown can be coupled to the first conductive pattern (e.g., Figure 10 The first conductive pattern 610 shown overlaps.

[0134] According to one embodiment, the non-conductive region (e.g., Figure 10 The non-conductive cover 530 shown may have a non-conductive support member (e.g., Figure 10 At least one protrusion (e.g., the first support member 410 shown) protrudes from the first support member 410. Figure 10 The third protrusions 931 and 932 are shown. The non-conductive support member may have at least one recess (e.g., Figure 10 As shown in the fourth recesses 951 and 952), the at least one protrusion is inserted into the at least one recess. Non-conductive bonding members (e.g., Figure 10 The non-conductive bonding member 1000 shown may extend between the at least one protrusion and the at least one recess.

[0135] According to one embodiment, an electronic device (e.g., Figure 4 or Figure 5 The ear wearable device 100 shown may further include a housing (e.g., Figure 4 or Figure 5 The communication module (e.g., in the housing 110 shown) is located in the housing 110. Figure 3The communication module 390 shown). The structure (for example, Figure 6 or Figure 7 The structure 800 shown may further include a non-conductive support member (e.g., Figure 6 or Figure 7 The second conductive pattern (e.g., on the first support member 410) shown Figure 6 or Figure 7 The second conductive pattern 620 shown. The second conductive pattern can be combined with the first conductive pattern (e.g., Figure 6 or Figure 7 The first conductive pattern 610 shown is physically separated and can be electrically connected to the communication module.

[0136] Although this disclosure has been described with reference to various embodiments, various changes and modifications will be apparent to those skilled in the art. This disclosure is intended to cover such changes and modifications that fall within the scope of the appended claims.

Claims

1. An ear-wearable device comprising: a housing including a non-conductive cover; a speaker located in the housing; a structure located in the housing and including a non-conductive support member facing the non-conductive cover and a first conductive pattern for detecting a touch input; a non-conductive joining member disposed between the structure and the non-conductive cover, wherein the structure and the non-conductive cover are coupled by the non-conductive joining member; and a touch sensor integrated circuit disposed on a printed circuit board in the housing and electrically connected with the first conductive pattern, wherein the non-conductive joining member fills a gap between the structure and the non-conductive cover to reduce an air gap between the structure and the non-conductive cover and increase a dielectric constant related to an electromagnetic field generated with the first conductive pattern. 2.The ear-wearable device of claim 1, wherein the first conductive pattern is formed on the non-conductive support member by laser direct structuring. 3.The ear-wearable device of claim 1, wherein at least a portion of the non-conductive joining member overlaps the first conductive pattern. 4.The ear-wearable device of claim 3, wherein: the non-conductive cover includes at least one protrusion protruding toward the non-conductive support member, the non-conductive support member includes at least one recess into which the at least one protrusion is inserted, and the non-conductive joining member extends between the at least one protrusion and the at least one recess. 5.The ear-wearable device of claim 1, wherein: the non-conductive support member includes a recess facing the non-conductive cover, and the first conductive pattern is located in the recess. 6.The ear-wearable device of claim 5, wherein the non-conductive cover includes a protrusion at least partially inserted into the recess. 7.The ear-wearable device of claim 1, wherein: the non-conductive support member includes a first surface facing the non-conductive cover and a second surface facing a direction opposite to the first surface, the first conductive pattern includes a first conductive portion located on the first surface and a second conductive portion extending from the first conductive portion and located on the second surface, and the second conductive portion is electrically connected with the touch sensor integrated circuit. 8.The ear-wearable device of claim 7, wherein the second conductive portion is electrically connected with the printed circuit board through a flexible conductive member located between the second conductive portion and the printed circuit board. 9.The ear-wearable device of claim 8, further comprising a second support member located between the non-conductive support member and the printed circuit board and connected with the housing, wherein the second conductive portion is electrically connected with the printed circuit board through an opening formed at the second support member. 10.The ear-wearable device of claim 8, further comprising a battery located in the housing, ​ wherein the printed circuit board is positioned between the non-conductive support member and the battery.

11. The ear-wearable device of claim 8, further comprising a microphone positioned on the printed circuit board.

12. The ear-wearable device of claim 8, further comprising another printed circuit board positioned between the speaker and battery and electrically connected to the printed circuit board, wherein the speaker is electrically connected to the other printed circuit board.

13. The ear-wearable device of claim 1, further comprising a battery positioned in the housing, wherein the battery is positioned between the speaker and the printed circuit board.

14. The ear-wearable device of claim 1, further comprising a communication module disposed on the printed circuit board, wherein the structure further comprises a second conductive pattern positioned on the non-conductive support member, and wherein the second conductive pattern is physically separated from the first conductive pattern and electrically connected to the communication module.

15. The ear-wearable device of claim 14, wherein the first conductive pattern is at least partially surrounded by the second conductive pattern.

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