A transport steering device, cleaning system and process equipment

Abstract

The present invention discloses a transport steering device, a cleaning system and a process equipment, and belongs to the technical field of semiconductor equipment. The transport steering device includes a mounting body, a driving mechanism, a driven mechanism and a clamping claw, the driving mechanism includes a crank driving rod, a fixed rod, a first follower rod and a second follower rod which are hinged in sequence, the crank driving rod, the fixed rod, the first follower rod and the second follower rod have different lengths, and the fixed rod is fixed to the mounting body; the driven mechanism includes a guide rail, a slider slidably arranged on the guide rail and a driven swing rod, the extension of the second follower rod is hinged to the slider, the first end of the driven swing rod is hinged to the guide rail, and the second end of the driven swing rod is rotatably arranged on the mounting body; one end of the clamping claw is vertically arranged on the guide rail, and the other end is used to clamp the wafer, the transport steering device as a whole does not need to perform a backward action, the conventional process is reduced, the processing time is shortened, and it is conducive to the mass production of wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a transport steering device, a cleaning system and a process equipment. Background Art

[0002] In the semiconductor manufacturing process, the use of additional materials to process the wafers leads to the introduction of dust and organic contamination on the wafer surface. Therefore, the process equipment usually has its own cleaning system.

[0003] In order to clean the chip more thoroughly, a multi-station mode is adopted, but generally the last station is a horizontal rotating cleaning tank, which can be used to clean the chip surface and to dry the liquid on the chip surface.

[0004] If the previous station is a vertical cleaning tank, you need to first grab the wafer vertically from the vertical cleaning tank, then rotate it 90 degrees and place it horizontally in the horizontal rotary cleaning tank. In this process, due to the limited space of the cleaning tank, the distance between the two cleaning tanks is relatively close. And because the cleaning liquid is prone to splashing and fogging when the horizontal rotary cleaning tank is performing horizontal cleaning, there is always a cover above the horizontal rotary cleaning tank, and it is much higher than the top of the previous vertical cleaning tank. This results in a collision between the wafer and the cover if the wafer is rotated 90 degrees directly after being taken out vertically. To transport the wafer from the vertical cleaning tank to the horizontal rotary cleaning tank, the conventional flipping device first moves the wafer back and then rotates it 90 degrees to avoid collision with the cover above the horizontal rotary cleaning tank.

[0005] However, this conventional flipping device has four steps of lifting-backward-flipping-forward placement to correctly place the wafer on the station of the horizontal rotary cleaning tank, resulting in a long process time.

[0006] Therefore, it is urgent to provide a transport steering device, a cleaning system and a process equipment to solve the above problems. Summary of the invention

[0007] The purpose of the present invention is to provide a transport steering device, a cleaning system and a process equipment, which eliminate the backward action, reduce the conventional process steps, shorten the processing time, and facilitate the batch production of wafers.

[0008] In order to achieve the above objectives, the following technical solutions are provided:

[0009] A transport steering device, comprising:

[0010] Mounting body;

[0011] The driving mechanism comprises a crank driving rod, a fixed rod, a first follower rod and a second follower rod which are hinged to each other in sequence, wherein the crank driving rod, the fixed rod, the first follower rod and the second follower rod have different lengths, and the fixed rod is fixed to the mounting body;

[0012] The driven mechanism comprises a guide rail, a slider slidably arranged on the guide rail, and a driven swing rod, wherein the extension portion of the second follower rod is hinged to the slider, the first end of the driven swing rod is hinged to the guide rail, and the second end of the driven swing rod is rotatably arranged on the mounting body;

[0013] A clamping claw has one end vertically arranged on the guide rail and the other end used for clamping the wafer.

[0014] As an optional solution for the transport steering device, the drive mechanism further includes a motor, which is transmission-connected to the crank driving rod.

[0015] As an optional solution for the transport steering device, a sliding groove is provided on one side of the slider, the slider is slidably arranged on the first end face of the guide rail, the hinge between the driven swing arm and the guide rail is located on the second end face of the guide rail, and the first end face and the second end face are arranged opposite to each other on the guide rail.

[0016] As an optional solution for the transport steering device, the length of the crank active rod is 70 mm, the length of the fixed rod is 110 mm, the length of the first follower rod is 85 mm, and the length of the second follower rod is 80 mm.

[0017] A cleaning system comprises a horizontal rotary cleaning tank, a vertical cleaning tank arranged beside the horizontal rotary cleaning tank and a transport steering device as described in any one of the above items, wherein a vertical space is formed between the horizontal rotary cleaning tank and the vertical cleaning tank, and the transport steering device can turn and move within the range of the vertical space.

[0018] As an optional solution for the cleaning system, a cover shell is provided on the top of the horizontal rotary cleaning tank.

[0019] As an optional solution for the cleaning system, a rear access port is provided on a side wall of the housing close to the transport and diverting device.

[0020] As an optional solution for the cleaning system, a front-end access port is provided on the top of the vertical cleaning tank.

[0021] A process equipment comprises the cleaning system as described in any one of the above items.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The transport and steering device provided by the present invention has a crank active rod that rotates counterclockwise around a hinge point between the crank active rod and the fixed rod, driving the first follower rod to swing left and right, and then driving the second follower rod to rotate 90 degrees around a hinge point between the crank active rod and the first follower rod, and the slider is slidably connected to the guide rail. Since the extension portion of the second follower rod is hinged to the slider, the guide rail also rotates 90 degrees. During the flipping of the guide rail, the driven swing rod prevents the slider from sliding out of the guide rail and causing the guide rail to fall off; one end of the clamping claw is arranged perpendicular to the guide rail, so that after the crank active rod rotates counterclockwise around a hinge point between the crank active rod and the fixed rod to a set angle, the second follower rod can be switched from a horizontal state to a vertical state, and then the clamping claw holding the wafer can be switched from a vertical state to a horizontal state, completing the 90-degree flipping of the wafer, and the transport and steering device as a whole does not need to perform a backward action, thereby reducing the conventional process steps, shortening the processing time, and facilitating the mass production of wafers.

[0024] The cleaning system provided by the present invention transfers the wafer from the vertical cleaning tank to the horizontal rotary cleaning tank through the transport steering device, without the need for the transport steering device to move backward to avoid the wafer.

[0025] In the process equipment provided by the present invention, the transport and steering device does not need to move backward to avoid, thereby realizing the rapid transport and transfer of wafers from the vertical cleaning tank to the horizontal rotary cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0027] Figure 1 It is a structural schematic diagram of a transport and steering device in an embodiment of the present invention;

[0028] Figure 2 Schematic diagram of the process of a wafer flipping 90 degrees on a transport and steering device in an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of the structure of a cleaning system in an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the process of flipping a wafer 90 degrees on a cleaning system in an embodiment of the present invention;

[0031] Figure 5 It is a first comparative schematic diagram of a conventional turning device and a transport steering device in an embodiment of the present invention;

[0032] Figure 6 It is a second comparative schematic diagram of a conventional turning device and a transport steering device in an embodiment of the present invention.

[0033] Reference numerals:

[0034] 1. Horizontal rotary cleaning tank; 2. Cover; 3. Back-end access port; 4. Wafer; 5. Clamp; 6. Conventional flip device; 7. Vertical cleaning tank; 8. Front-end access port; 9. Handling and steering device;

[0035] 9-1, driven mechanism; 9-1-1, guide rail; 9-1-2, slider; 9-1-3, driven swing rod;

[0036] 9-2, driving mechanism; 9-2-1, crank active rod; 9-2-2, fixed rod; 9-2-3, first follower rod; 9-2-4, second follower rod. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or are the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0041] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0044] The rapid promotion of advanced packaging technologies such as 3D packaging has made the required thickness of circuit chips thinner, so ultra-precision grinding has been widely used as the main process for wafer back side thinning.

[0045] Generally, the effective thickness of the device layer on the wafer circuit is about 5μm-10μm. However, in order to ensure the strength of the chip processing process, the wafer needs to maintain a certain thickness. The thickness of a 12-inch wafer is about 775μm. Therefore, after the circuit layer is completed, the wafer needs to be thinned on the back (backside grinding) process.

[0046] The mainstream thinning process is currently achieved by grinding the wafer with a bonded diamond wheel. The grinding process will generate a large amount of abrasive particles. If these abrasive particles adhere to the surface of the wafer, it will affect the subsequent process steps and even cause a decrease in chip yield. For this reason, a cleaning mechanism is usually integrated into the thinning equipment. The common cleaning mechanism is a plane rotating cleaning device, which can remove 80% of the surface particles, but still cannot achieve the cleanliness level expected by the wafer process. Subsequent cleaning equipment is also required to further clean the surface.

[0047] However, this process also increases the wafer processing time and cost. Efficient and enhanced cleaning is achieved through the linkage of pre-cleaning-brushing-spin cleaning to ensure that the number of surface particles after the wafer is transferred out of the thinning equipment meets the cleanliness requirements of the process.

[0048] Existing vertical cleaning devices are mainly found in specialized CMP equipment, which are used to clean particles on the surface of wafers, reduce stress damage and improve the hydrophilicity of the wafer surface through chemical mechanical polishing.

[0049] The functions of professional CMP equipment are integrated into the thinning equipment. The new layout plan has a small space, which reduces the distance between the cleaning pools accordingly. At the same time, the new substrate thinning device adds a 90-degree rotation action in the cleaning pool. Due to space limitations, the wafer taken out of one cleaning pool cannot be directly rotated 90 degrees to enter the adjacent cleaning pool. Conventional flipping devices have four steps of lifting-backward-flipping-forward placement to correctly place the wafer on the workstation of the horizontal rotary cleaning pool, resulting in a longer process time.

[0050] In order to cancel the backward movement, reduce the conventional process steps, shorten the processing time, and facilitate the mass production of wafers, this embodiment provides a transport steering device, which is combined with Figures 1 to 6 The specific contents of this embodiment are described in detail.

[0051] like Figure 1 Combination Figure 2As shown, the transport steering device 9 includes a mounting body, a driving mechanism 9-2, a driven mechanism 9-1 and a clamp 5. The driving mechanism 9-2 includes a crank driving rod 9-2-1, a fixed rod 9-2-2, a first follower rod 9-2-3 and a second follower rod 9-2-4 which are hinged in sequence. The crank driving rod 9-2-1, the fixed rod 9-2-2, the first follower rod 9-2-3 and the second follower rod 9-2-4 have different lengths, and the fixed rod 9-2-2 is fixed to the mounting body. The driven mechanism 9-1 includes a guide rail 9-1-1, a slider 9-1-2 slidably mounted on the guide rail 9-1-1 and a driven swing rod 9-1-3. The extension of the second follower rod 9-2-4 is hinged to the slider 9-1-2, the first end of the driven swing rod 9-1-3 is hinged to the guide rail 9-1-1, and the second end of the driven swing rod 9-1-3 is rotatably mounted on the mounting body. One end of the clamping jaw 5 is vertically arranged on the guide rail 9 - 1 - 1 , and the other end is used for clamping the wafer 4 .

[0052] In short, in the transport steering device 9 provided by the present invention, the crank active rod 9-2-1 rotates counterclockwise around the hinge point between it and the fixed rod 9-2-2, driving the first follower rod 9-2-3 to swing left and right, thereby driving the second follower rod 9-2-4 to rotate 90 degrees around the hinge point between it and the first follower rod 9-2-3, and the slider 9-1-2 is slidably connected to the guide rail 9-1-1. Since the extension of the second follower rod 9-2-4 is hinged to the slider 9-1-2, the guide rail 9-1-1 is also rotated 90 degrees. During the flipping of the guide rail, the driven swing rod 9-1-3 prevents the slider 9- 1-2 slides out of the guide rail 9-1-1, causing the guide rail 9-1-1 to fall off; one end of the clamping jaw 5 is arranged perpendicular to the guide rail 9-1-1, so that the crank active rod 9-2-1 can be rotated counterclockwise around the hinge point with the fixed rod 9-2-2 to a set angle, and the second follower rod 9-2-4 can be switched from a horizontal state to a vertical state, and then the clamping jaw 5 holding the wafer 4 can be switched from a vertical state to a horizontal state, completing the flipping of the wafer 4 by 90 degrees, and the overall handling steering device 9 does not need to perform a backward action, which reduces the conventional process steps, shortens the processing time, and is conducive to the mass production of wafer 4.

[0053] The conventional flipping device 6 directly flips by rotating 90 degrees, and the liquid covering the surface of the wafer 4 may not be completely covered by the liquid due to the too fast swinging speed, resulting in the wafer 4 being contaminated again. The transport steering device 9 provided by the present invention changes the process of the wafer 4 rotating 90 degrees, making it more difficult for the liquid to be thrown off the wafer 4, thereby improving the full coverage capability of the liquid.

[0054] Furthermore, the driving mechanism 9-2 also includes a motor, which serves as a power source for the entire transport steering device 9, and the motor is transmission-connected to the crank driving rod 9-2-1. Exemplarily, the motor in this embodiment can be, but is not limited to, a servo motor and a stepper motor.

[0055] For example, a slide groove is provided on one side of the slider 9-1-2, the slider 9-1-2 is slidably disposed on the first end face of the guide rail 9-1-1, the hinge between the driven swing arm 9-1-3 and the guide rail 9-1-1 is located on the second end face of the guide rail 9-1-1, and the first end face and the second end face are disposed opposite to the guide rail 9-1-1. By disposing the hinge between the driven swing arm 9-1-3 and the guide rail 9-1-1 and the slider 9-1-2 respectively on the opposite end faces of the guide rail 9-1-1, it is prevented that the slider 9-1-2 collides with the driven swing arm 9-1-3 when sliding along the guide rail 9-1-1.

[0056] Exemplarily, the length of the crank active rod 9-2-1 is 70 mm, the length of the fixed rod 9-2-2 is 110 mm, the length of the first follower rod 9-2-3 is 85 mm, and the length of the second follower rod 9-2-4 is 80 mm.

[0057] In other embodiments, the length of the crank active rod 9-2-1 may be 70 cm, the length of the fixed rod 9-2-2 may be 110 cm, the length of the first follower rod 9-2-3 may be 85 cm, and the length of the second follower rod 9-2-4 may be 80 cm. As long as the crank active rod 9-2-1 can rotate through the set angle and the second follower rod 9-2-4 can rotate through 90 degrees, the size range belongs to the protection scope of the present invention.

[0058] like Figure 3 Combination Figure 4 As shown, this embodiment also provides a cleaning system, which includes a horizontal rotary cleaning pool 1, a vertical cleaning pool 7 arranged beside the horizontal rotary cleaning pool 1, and the above-mentioned transport steering device 9. The distance between the horizontal rotary cleaning pool 1 and the vertical cleaning pool 7 is reduced, the overall volume of the cleaning system is reduced, and the moving time is shortened. A vertical space is formed between the horizontal rotary cleaning pool 1 and the vertical cleaning pool 7, and the transport steering device 9 can be turned and moved within the vertical space.

[0059] Furthermore, the cleaning system further includes a lifting and forward movement mechanism, on which the transport and steering device 9 is disposed. When the transport and steering device 9 turns the wafer 4 90 degrees, the lifting and forward movement mechanism can drive the transport and steering device 9 to descend and move forward, and place the wafer 4 into the horizontal rotary cleaning tank 1 for cleaning.

[0060] Furthermore, if Figure 3 Combination Figure 5 As shown, since the cleaning liquid of horizontal cleaning is easy to splash and mist, a cover 2 is provided on the top of the horizontal rotary cleaning pool 1 to prevent the cleaning liquid from splashing everywhere. The transport steering device 9 can avoid the interference of the cover 2 throughout the whole process.

[0061] Furthermore, a rear-channel access opening 3 is provided on a side wall of the housing 2 near the transport steering device 9. The transport steering device 9 places the wafer 4 into the horizontal rotary cleaning tank 1 through the rear-channel access opening 3.

[0062] Furthermore, a front-end access opening 8 is provided on the top of the vertical cleaning tank 7 . The gripper 5 of the transport steering device 9 takes the wafer 4 out of the vertical cleaning tank 7 through the front-end access opening 8 .

[0063] like Figure 6 As shown, the effect of the conventional flip device 6 directly rotating 90 degrees is compared with the effect of the transport steering device 9 rotating 90 degrees. After using the transport steering device 9, the final position of the wafer 4 is lower and forward, and closer to the back-end pick-up and placement port 3.

[0064] This embodiment also provides a process equipment, which includes the above-mentioned cleaning system. The transport steering device 9 does not need to move backward to avoid the cover 2, so as to realize the rapid transport transfer of the wafer 4 from the vertical cleaning tank to the horizontal rotary cleaning tank.

[0065] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A transport steering device, characterized in that: include: Mounting body; The driving mechanism (9-2) comprises a crank active rod (9-2-1), a fixed rod (9-2-2), a first follower rod (9-2-3) and a second follower rod (9-2-4) which are hinged in sequence, the crank active rod (9-2-1), the fixed rod (9-2-2), the first follower rod (9-2-3) and the second follower rod (9-2-4) having different lengths, and the fixed rod (9-2-2) is fixedly arranged on the mounting body; A driven mechanism (9-1) comprises a guide rail (9-1-1), a slider (9-1-2) slidably arranged on the guide rail (9-1-1), and a driven swing rod (9-1-3); an extension portion of the second follower rod (9-2-4) is hinged to the slider (9-1-2); a first end of the driven swing rod (9-1-3) is hinged to the guide rail (9-1-1); and a second end of the driven swing rod (9-1-3) is rotatably arranged on the mounting body; A clamping claw (5), one end of which is vertically arranged on the guide rail (9-1-1) and the other end of which is used for clamping a wafer; The crank active rod rotates counterclockwise around the hinge point between it and the fixed rod, driving the first follower rod to swing left and right, and then driving the second follower rod to rotate 90 degrees around the hinge point between it and the first follower rod. The slider is slidably connected to the guide rail. Since the extension of the second follower rod is hinged to the slider, the guide rail also rotates 90 degrees. During the flipping of the guide rail, the driven swing rod prevents the slider from slipping out of the guide rail and causing the guide rail to fall off. One end of the clamping claw is arranged perpendicular to the guide rail, so that after the crank active rod rotates counterclockwise around the hinge point between it and the fixed rod to a set angle, the second follower rod is switched from a horizontal state to a vertical state, and then the clamping claw holding the wafer is switched from a vertical state to a horizontal state, completing the wafer flipping 90 degrees.

2. The transport steering device according to claim 1, characterized in that: The driving mechanism (9-2) also includes a motor, which is drivingly connected to the crank driving rod (9-2-1).

3. The transport steering device according to claim 1, characterized in that: A sliding groove is provided on one side of the slider (9-1-2), the slider (9-1-2) is slidably arranged on the first end face of the guide rail (9-1-1), the hinge between the driven swing rod (9-1-3) and the guide rail (9-1-1) is located on the second end face of the guide rail (9-1-1), and the first end face and the second end face are arranged opposite to each other on the guide rail (9-1-1).

4. The transport steering device according to claim 1, characterized in that: The length of the crank active rod (9-2-1) is 70 mm, the length of the fixed rod (9-2-2) is 110 mm, the length of the first follower rod (9-2-3) is 85 mm, and the length of the second follower rod (9-2-4) is 80 mm.

5. A cleaning system, characterized in that: It comprises a horizontal rotary cleaning tank (1), a vertical cleaning tank (7) arranged beside the horizontal rotary cleaning tank (1) and a transport steering device as described in any one of claims 1 to 4, wherein a vertical space is formed between the horizontal rotary cleaning tank (1) and the vertical cleaning tank (7), and the transport steering device can be turned and moved within the range of the vertical space.

6. The cleaning system according to claim 5, characterized in that: A cover shell (2) is provided on the top of the horizontal rotary cleaning tank (1).

7. The cleaning system according to claim 6, characterized in that: A rear access opening (3) is provided on a side wall of the cover shell (2) close to the transport diverting device (9).

8. The cleaning system according to claim 5, characterized in that: A front-end access opening (8) is provided on the top of the vertical cleaning tank (7).

9. A process equipment, characterized in that: Comprising a cleaning system as described in any one of claims 5-8.

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