Molding device

Abstract

The present invention relates to a molding device. The molding device has at least two mold parts. The mold parts together enclose a cavity in which a circuit carrier and electronic components arranged on the circuit carrier can be encapsulated. One of the mold parts has a spacer, which is arranged and configured to be placed on the circuit carrier and divides the cavity between the circuit carrier and the mold part into at least two or only two sub-cavities, that is, at least one low-pressure sub-cavity and at least one high-pressure sub-cavity. The molding device is also preferably configured to fill at least one high-pressure sub-cavity with molding material, and to fill at least one low-pressure sub-cavity with molding material at a smaller filling pressure than the high-pressure sub-cavity. The molding device preferably has an injection opening for the low-pressure sub-cavity and an injection opening for the high-pressure sub-cavity. The molding device preferably has a shut-off valve in the injection opening for the low-pressure sub-cavity, and is configured to close the shut-off valve according to a predetermined molding pressure, especially an injection pressure, for the molding material.

Description

Technical Field

[0001] The invention relates to a molding device for producing a molding module. Background Art

[0002] The invention relates to a molding device for producing a molding module. Summary of the invention

[0003] The molding device has at least two mold parts, in particular mold halves, which together enclose a cavity in which the circuit carrier and the electronic components arranged on the circuit carrier can be encapsulated.

[0004] One of the mold parts has a spacer, which is arranged and configured to be placed on the circuit carrier and divides the cavity between the circuit carrier and the mold part into at least two or only two sub-cavities, namely, at least one low-pressure sub-cavity and at least one high-pressure sub-cavity. The molding device is also preferably configured to fill the molding material into the at least one high-pressure sub-cavity and to fill the molding material into the at least one low-pressure sub-cavity with a smaller filling pressure than the high-pressure sub-cavity. The molding device preferably has an injection opening for the low-pressure sub-cavity and an injection opening for the high-pressure sub-cavity. The molding device preferably has a shut-off valve in the area of ​​the injection opening for the low-pressure sub-cavity and is configured so that the shut-off valve is closed according to a predetermined molding pressure, in particular an injection pressure, for the molding material. Therefore, for a molding pressure greater than the predetermined molding pressure, the low-pressure sub-cavity can be advantageously closed. Advantageously, the low-pressure sub-cavity can thus be separated from the pressure device, which is configured to pressurize the molding material in the cavity. Then, after separation, the pressure still acts only on the high-pressure sub-cavity. The molding device is preferably designed to further increase the molding pressure for the high-pressure subchamber, in particular up to 200 bar, after closing the low-pressure subchamber or isolating the low-pressure subchamber from the pressure system. Advantageously, pressure-sensitive electronic components encapsulated in the low-pressure subchamber, such as electrolytic capacitors, quartz oscillators or sensors, can thus not be damaged by the high pressure during molding.

[0005] In a preferred embodiment, the molding device is designed to fill the partial chambers with molding compound simultaneously. Advantageously, the molding process can thus be carried out cost-effectively by only one mold and more preferably by only one pressure cylinder (which is also called a plunger).

[0006] In a preferred embodiment, the molding device is configured to fill the high-pressure subchamber with molding material at a filling pressure between 50 bar and 200 bar, preferably between 80 bar and 150 bar, particularly preferably 100 bar. The molding device is preferably configured to fill the low-pressure subchamber with molding material at a filling pressure of less than or equal to 20 bar. The molding device can advantageously be configured to gradually increase the filling pressure for both subchambers by means of a pressure piston until a filling pressure of 20 bar is reached.

[0007] The molding device is also preferably configured to separate the low-pressure subchamber from the pressure cylinder depending on the filling pressure, in particular when the filling pressure reaches 20 bar, and to close the low-pressure subchamber, in particular the filling opening, for this purpose. For this purpose, the molding device preferably has a valve. The molding device is also preferably configured to further increase the process pressure for the high-pressure subchamber after closing the low-pressure subchamber to a predetermined pressure value, in particular between 50 bar and 200 bar, preferably between 80 bar and 150 bar, more preferably 100 bar, and to maintain the pressure value there.

[0008] In a preferred embodiment, the spacer is supported in a manner that it can move along the axis of movement. Further preferably, the spacer is supported in a spring-loaded manner. For this purpose, the spacer can preferably be supported on the mold part by means of a spring. Advantageously, the molding device can thus extend the encapsulated circuit carrier with different thicknesses. Therefore, if the molding device, in particular the mold parts, are closed to each other, the spacer can be moved in a spring-loaded manner when placed on the circuit carrier.

[0009] In a preferred embodiment, the shut-off valve is configured to close the injection channel or injection opening or injection channel to the low-pressure subchamber as a function of the molding pressure acting on the shut-off valve. Advantageously, the shut-off valve can thus be closed mechanically by applying pressure to the valve itself, in particular without other electrical components that move the shut-off valve.

[0010] In a preferred embodiment, the shutoff valve is formed by a swingably and preferably spring-loaded mounted door. The door is arranged in the region of the injection opening of the low-pressure subchamber and is designed to close the injection opening as a function of the molding pressure acting on the door, in particular when a predetermined molding pressure is exceeded. Advantageously, the shutoff valve can thus be provided cost-effectively and in a mechanically simple manner by a swingable door or flap.

[0011] In a preferred embodiment, the shut-off valve is formed by a shut-off diaphragm arranged transversely to the injection opening or the injection line. The molding device is preferably configured to move the shut-off diaphragm into the injection channel or in front of the injection opening according to the molding pressure, especially when a predetermined molding pressure is exceeded, and close the injection channel or the injection opening. For this purpose, the molding device preferably has a pressure sensor, which is configured to detect the molding pressure in the pressure piston or in the low-pressure subchamber and generate a control signal for closing the shut-off diaphragm. The molding device is configured to move the shut-off diaphragm according to the control signal and thus close the injection opening.

[0012] In a preferred embodiment, the molding device has an electric drive which is operatively connected to the shutoff diaphragm and is configured to move, in particular close, the shutoff diaphragm in response to a received shutoff signal. Advantageously, the shutoff diaphragm can thus be reliably moved in front of the injection opening.

[0013] In a preferred embodiment, the molding device has a coupling mechanism. The coupling mechanism is operatively connected to a pressure piston of the molding device that generates the molding pressure and to the shutoff partition. The coupling mechanism is configured to transmit the movement of the pressure piston to the shutoff partition and thus close the shutoff partition. Advantageously, the shutoff partition can be closed mechanically by the pressure piston or the pressure piston movement mechanically controlled.

[0014] The invention also relates to a method for producing a molding module. In this method, molding material is filled into different subcavities in a molding die. In this method, the low-pressure subcavity is also filled with molding material with a lower molding pressure than the high-pressure subcavity adjacent thereto. The subcavities are preferably separated from each other by means of partition walls that are supported movably, in particular in a spring-loaded manner. The subcavities are preferably filled with molding material simultaneously, wherein the molding pressure acts on both subcavities and, according to a predetermined molding pressure, the low-pressure subcavity is closed in the area of ​​the injection opening so that the molding pressure can only continue to act on the high-pressure subcavity.

[0015] In a preferred embodiment, the partial chambers are formed before the molding compound is filled in by a movement, in particular a pivoting or translational movement, of the partition wall into the cavity enclosed by the molding tool.

[0016] The molding device can be designed for transfer molding or direct injection molding (DIM). The molding method can be performed by means of transfer molding or by means of DIM. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The invention is explained below with reference to the drawings and other exemplary embodiments. Further advantageous embodiment variants result from the combination of the features described in the drawings and below.

[0018] Figure 1 An embodiment of a molding device is shown, in which a sub-cavity surrounded by a molding die can be closed by a shut-off valve depending on the pressure;

[0019] Figure 2 An embodiment of the pressure profile during molding with two sub-cavities is shown, wherein the low-pressure sub-cavity in the sub-cavity is closed when a predetermined molding pressure is exceeded according to the pressure;

[0020] Figure 3An exemplary embodiment of a molding device is shown, in which a sub-chamber enclosed by the molding tool can be closed off pressure-dependently by a shut-off valve, wherein the shut-off valve can be closed pressure-dependently and electrically controlled. DETAILED DESCRIPTION

[0021] Figure 1 An embodiment of a molding device 1 is schematically shown. In this embodiment, the molding device 1 comprises a mold part 2 and a further mold part 3, which are each configured as a mold half, for example. The mold parts 2 and 3 together enclose a cavity, in which a circuit carrier 15 can be placed. In this embodiment, the circuit carrier 15 comprises a surface area 18, on which low-voltage components, in particular electrolytic capacitors 12 and quartz oscillators 13, are arranged and connected to the circuit carrier 15 by welding. The circuit carrier 15 also comprises another surface area 19, on which electronic components, in particular integrated circuits 14, are arranged, or other pressure-insensitive components, such as film capacitors, resistors, diodes or other components that are not so sensitive to pressure, are additionally arranged.

[0022] In this embodiment, the mold part 2 further comprises a partition wall 4 which is arranged movably along the displacement axis 20. The partition wall 4, which is also referred to above as a spacer, is supported in a spring-loaded manner along the displacement axis 20 by means of a first spring 5. Thus, the partition wall 4 can be placed in a spring-loaded manner on the circuit carrier 15 when the mold part 2 is closed and thus divides the cavity surrounded by the mold parts 2 and 3 into two sub-cavities, namely a low-voltage sub-cavity 6 and a high-voltage sub-cavity 7. Thus, low-voltage components, in particular electrolytic capacitors 12 and quartz oscillators 13, are arranged in the low-voltage sub-cavity 6, wherein high-voltage components, in particular integrated circuits 14, are arranged in the high-voltage sub-cavity 7. Thus, the partition wall 4 is placed on a surface area 21, which extends between the surface area 18 for low-voltage components and the surface area 19 for high-voltage components.

[0023] In this embodiment, the molding device 1, in particular the mold part 2 with the partition wall 4, comprises a swing flap 8. The swing flap 8 is supported so as to be swingable about a swing axis and is supported on a second spring 16. The swing flap 8 is at least partially arranged in a cavity 17 of the mold part 2 and is configured to swing into the cavity 17 and here together with the flap section close the injection channel 11 (also referred to as the flow channel) and thus separate the injection opening 9 extending between the mold parts 2 and 3 from the low-pressure subchamber 6.

[0024] The swing flap 8 is shown in the swing position 8'. The second spring 16 is shown in the stressed position 16'. The swing flap 8 is designed to swing into the cavity 17 in a spring-loaded manner as a function of the molding pressure acting on the injection opening 9, for example, by the pressure piston, and to close the injection channel 11 there. Therefore, after the low-pressure subchamber 6 is closed by means of the swing flap 8, the molding pressure can no longer be subjected to the molding pressure, in particular a further increased molding pressure. The swing flap is designed, for example, to close the injection channel 11 when the molding pressure 60 is above 20 bar.

[0025] The injection openings 9 and 10 are provided, for example, by means of Figure 1 The molding material connection line (also referred to as flow channel) not shown in the figure is connected to a molding material press. The molding material press has the above-mentioned pressure piston, which is designed to press the molding material 58, in particular the molding tablet, through the flow channel in a softened or molten form and to press the soft molding material 58 through the injection openings 9 and 10 into the low-pressure subchamber 6 and the high-pressure subchamber 7. After the low-pressure subchamber 6 is closed by the swing valve 8 in the swing position 8', the high-pressure subchamber 7 can be subjected to a further increased molding pressure 59 of more than 20 bar up to 100 bar. Therefore, the high-voltage components arranged on the surface area 19 of the circuit carrier 15 can be embedded in the molded protuberance produced in the high-pressure subchamber 7 after the molded module produced by the molding device 1 is ejected, wherein the low-voltage components, in particular the electrolytic capacitor 12 and the quartz oscillator 13, are embedded in the molded protuberance produced in the low-pressure subchamber 6 of the molded module thus produced. Between the shaped elevations thus produced there extends a groove produced by the partition walls 4 which extends as far as the circuit carrier 15 on which the partition walls 4 are placed during the production of the shaped module.

[0026] The molding device 1 may be configured for transfer molding or direct injection molding.

[0027] Figure 2 An embodiment of a schematic diagram is shown, which has an abscissa 22 and an ordinate 23. In this embodiment, the abscissa 22 represents the time axis, wherein the ordinate 23 represents the time axis through Figure 1 The molding die 1 shown in FIG. 1 is a pressure axis of molding pressure acting on the low-pressure sub-cavity 6 and the high-pressure sub-cavity 7 during molding.

[0028] Figure 2 Also shown is a pressure curve 29, which represents the pressure for Figure 1 The pressure trend of the molding pressure over time when the molding device 1 is used to produce the molding module. During the period 24, in the first step of producing the molding module by increasing the molding pressure, the low-pressure sub-cavity 6 can be filled with molding material through the injection opening 9, and the high-pressure sub-cavity 7 can be filled with molding material through the injection opening 10.

[0029] During the subsequent time period 25 , the molding pressure can be built up further until a predetermined pressure value is reached, for example 20 bar, which forms the maximum pressure for the low-pressure subchamber 6 .

[0030] When a predetermined pressure value is reached, which is 20 bar in this embodiment, the valve 8 can be closed by the swing valve 8. Figure 1 8 is a block diagram of the injection channel 11 shown in FIG. 29 . Thus, the swing valve 8 forms the shut-off valve already mentioned, which is configured to close the low-pressure sub-chamber 6 according to a predetermined molding pressure. During the period 26 immediately following the period 25, and therefore during the period 26 after the pressure is built up, the predetermined molding pressure can be maintained for the two sub-chambers, namely the low-pressure sub-chamber 6 and the high-pressure sub-chamber 7, by the molding press. During the period 27 immediately following the period 26, the molding pressure can be further increased until the final pressure for the high-pressure sub-chamber 7 is reached. In this embodiment, the value of the final pressure for the molding pressure of the high-pressure sub-chamber 7 is 100 bar. Therefore, the curve 29 has five different sections. The filling section extends during the period 24, during which the sub-chambers of the molding device are filled with molding material. The subsequent pressure buildup section extends during period 25, a pressure holding section with a limited pressure value, in particular 20 bar, for the low-pressure subchamber extends during period 26, another pressure buildup section for loading the high-pressure subchamber 7 with high pressure extends during period 27, and a final pressure section for maintaining the final pressure for the high-pressure subchamber 7 extends during period 28.

[0031] Figure 3 An embodiment for a molding device 30 is shown. The molding device 30 comprises a mold part 32 and a mold part 33, which are jointly configured to enclose a cavity. In this embodiment, the cavity is divided into two sub-chambers, namely a low-pressure sub-chamber 36 and a high-pressure sub-chamber 37, by means of a partition wall 34 connected to the mold part 32 and supported movably in a spring-loaded manner by means of a third spring 35. The low-pressure sub-chamber 36 and the high-pressure sub-chamber 37 are separated from each other in a pressure-resistant manner by means of the partition wall 34. The partition wall is configured to separate the sub-chambers from each other, in particular in a pressure-resistant manner.

[0032] The low-pressure sub-chamber 36 can receive a fluid, especially viscous, molding compound 58 from the first molding line 47 through the injection opening 38 via the injection channel 40, and is filled with the molding compound 58. In this embodiment, the circuit carrier 15 is accommodated in the cavity, wherein low-voltage components, especially electrolytic capacitors 12 and quartz oscillators 13 are arranged in the low-pressure sub-chamber 36. Other electronic components are arranged in the high-voltage sub-chamber 37, for example, the integrated circuit 14 is drawn therein by way of example. The partition wall 34 is placed on the circuit carrier 15 in a sealing manner, so that the low-pressure sub-chamber is adjacent to the surface area of ​​the circuit carrier 15 to which the low-pressure components are soldered, and the high-pressure sub-chamber 37 is adjacent to the surface area of ​​the circuit carrier 15 to which the high-pressure components are soldered.

[0033] In this embodiment, the molding device 30 further comprises a shut-off element, in particular a shut-off partition 41, which in this embodiment is supported in a manner movable along a translation axis 50 and is configured to close the injection channel 40, so that the low-pressure subchamber 36 is separated from the injection opening 38. Therefore, the pressure present at the injection opening 38, in particular the molding pressure 60, can no longer act on the low-pressure subchamber 36 when the shut-off element is closed.

[0034] The shaping device 30 has an injection opening 39 which is coupled to the high-pressure subchamber 37 . The second shaping line 48 is operatively connected to the injection opening 39 .

[0035] In this embodiment, the molding device 30 also includes a pressure device 49, which is connected to the coupling mechanism 42. In this embodiment, the coupling mechanism 42 is formed by a rigid element. The coupling mechanism 42 is effectively connected to the shutoff element by means of a first spring element 43 that limits force. The coupling mechanism 42 is also effectively connected to the pressure piston 31 by means of a second spring element 44 that limits force. The pressure device 49 is configured to move the coupling mechanism 42, in particular along the translation axis, so that the movement of the coupling mechanism 42 can act on the shutoff element and the pressure piston 31 in a buffered manner through the first spring element 43 and the second spring element 44 that limit force. Therefore, the shutoff element that forms the shutoff partition for closing the low-pressure sub-chamber 36 in this embodiment can be pressed against the mold part 32 in a spring-loaded manner by the coupling mechanism 42, and the injection channel 40 extending between the mold part 32 and the mold part 33 is sealed.

[0036] To produce a molded module, the circuit carrier 15 can be placed on the mold part 33. To close the mold, the mold part 32 can be moved toward the mold part 33. In this case, the partition wall 34 forming the web is placed on the surface of the circuit carrier 15 and seals it. The pressure device 49 can then load the pressure piston 31 with force via the second spring element 44 and the blocking element with force by means of the coupling mechanism 42, thereby moving the pressure piston 31.

[0037] The pressure piston 31 can move a tablet 45 made of molding material into the mold cavity 46, and the tablet is softened or melted by the exemplary heating element 52. Molten molding material 58 can flow from the mold cavity 46 coupled to the first molding line 47 and the second molding line 48 through the second molding line 48 via the injection opening 39 into the high-pressure sub-chamber 37. The molten molding material can enter the low-pressure sub-chamber 36 through the first molding line 47 and further through the injection opening 38 and the injection channel 40.

[0038] The first force-limiting spring element 43 is designed to move the shutoff element into the injection channel 40 and close it according to a predetermined molding pressure, in particular by appropriately designing the first spring element 43. When the injection channel 40 is closed, the molding pressure 60 can be, for example, 20 bar.

[0039] In another embodiment, the molding device 30 has an electric drive 51 operatively connected to the shutoff element. The electric drive 51 is configured to move the shutoff element into the injection channel 40, in particular via a toothed portion configured at the shutoff element and a gear meshing with the toothed portion and driven by the electric drive 51, to close the injection channel 40. To this end, the molding device 30 may have a pressure sensor 53, which is configured and arranged to detect a molding pressure 60 acting in the injection channel 40 or in the low-pressure subchamber 36 and to generate a pressure signal representing the molding pressure 60. In this embodiment with the electric drive 51, the molding device 30 may also have a processing unit 54, such as a microprocessor or a microcontroller, which is connected to the pressure sensor 53 on the input side via a connecting line 55.

[0040] The processing unit 54 is configured to generate a control signal for moving the electric drive 51 according to the pressure signal received from the pressure sensor 53, and transmit the control signal to the electric drive 51 on the output side through the connecting line 56. Therefore, the injection channel 40 can be reliably closed according to the molding pressure 60 existing in the injection channel 40 or the low-pressure subchamber 36 by the electrically movable shut-off element, in particular the shut-off diaphragm 41 according to a predetermined pressure.

[0041] The forming device 30 can then be operated in accordance with the control signal generated by the processing unit 54, in particular by means of the control signal generated by the processing unit 54. Figure 2 The curve 29 and the pressure build-up period 27 shown in FIG. 2 further increase the pressure applying device 49, which control signal can be received by the pressure applying device 49 via the connecting line 57. The molding pressure 59 thus generated can act on the high-pressure subchamber 37 via the second molding line 48, and thus also on the electronic components arranged in the region of the high-pressure subchamber 37, in particular the integrated circuit 14. The electronic components arranged in the high-pressure subchamber are advantageously insensitive to pressure and can therefore withstand the increased molding pressure 59 without problems, in particular up to 100 bar or above. The electronic components arranged in the low-pressure subchamber 36, in particular the electrolytic capacitor 12 and the quartz oscillator 13, are advantageously protected by the cut-off diaphragm and the injection channel 40, which is thus sealed off by means of the cut-off diaphragm 41, to prevent a further increase in pressure of more than 20 bar.

Claims

1. A molding device (1, 30) for producing a molding module, It is characterized in that The molding device (1, 30) has at least two mold parts, wherein the mold parts together enclose a cavity in which a circuit carrier (15) and electronic components (12, 13, 14) arranged on the circuit carrier can be encapsulated. The mold part has a spacer (4, 34) which is arranged and configured to be placed on the circuit carrier (15) and to divide the cavity between the circuit carrier (15) and the mold part into at least two or only two sub-cavities, namely, at least one low-pressure sub-cavity (6, 36) and at least one high-pressure sub-cavity (7, 37), and the molding device (1, 30) is configured to fill at least one high-pressure sub-cavity (7, 37) with molding material (58) and to fill at least one low-pressure sub-cavity (6, 36) with molding material at a lower first molding pressure (60) than the high-pressure sub-cavity (7, 37). ), wherein the molding device (1, 30) has an injection opening (9, 38) for the low-pressure sub-chamber (6, 36) and an injection opening (10, 39) for the high-pressure sub-chamber (7, 37), and the molding device (1, 30) has a shut-off valve in the area of ​​the injection opening (9, 38) for the low-pressure sub-chamber (6, 36), and is configured to close the shut-off valve according to a predetermined first molding pressure (60) for the molding material (58), so that the low-pressure sub-chamber (6, 36) is closed for a second molding pressure (59) that is greater than the predetermined first molding pressure (60).

2. The forming device (1, 30) according to claim 1, It is characterized in that The molding device (1, 30) is designed to simultaneously fill the subcavities with molding compound (58).

3. The forming device (1, 30) according to claim 1, It is characterized in that The molding device (1, 30) is configured to fill the high-pressure sub-chamber (7, 37) with molding material (58) at a second molding pressure (59) between 20 bar and 200 bar, and to fill the low-pressure sub-chamber (6, 36) with molding material (58) at a first molding pressure (60) less than or equal to 20 bar.

4. The forming device (1, 30) according to claim 2, It is characterized in that The molding device (1, 30) is configured to fill the high-pressure sub-chamber (7, 37) with molding material (58) at a second molding pressure (59) between 20 bar and 200 bar, and to fill the low-pressure sub-chamber (6, 36) with molding material (58) at a first molding pressure (60) less than or equal to 20 bar.

5. The forming device (1, 30) according to any one of claims 1 to 4, It is characterized in that The spacers (4, 34) are supported in a manner that allows them to move along an axis (20).

6. The forming device (1, 30) according to any one of claims 1 to 4, It is characterized in that The shut-off valve is configured to close an injection opening (9, 38) or an injection channel (11, 40) leading to the low-pressure sub-chamber (6, 36) according to a first molding pressure (60) acting on the shut-off valve.

7. The forming device (1, 30) according to claim 6, It is characterized in that The shut-off valve is formed by a swingably and spring-loaded supported door, which is arranged and constructed in the area of ​​the injection opening of the low-pressure subchamber and closes the injection opening (9, 38) of the low-pressure subchamber according to a first molding pressure (60) acting on the door.

8. The forming device (1, 30) according to claim 7, It is characterized in that The door is configured to close the injection opening (9, 38) of the low-pressure sub-chamber when a predetermined first molding pressure is exceeded.

9. The forming device (1, 30) according to claim 6, It is characterized in that The shut-off valve is formed by a shut-off partition (41) arranged transversely to the injection channel (11, 40), and the molding device (1, 30) is configured to move the shut-off partition (41) into the injection channel (11, 40) and close the injection channel (11, 40) according to the first molding pressure (60).

10. The forming device (1, 30) according to claim 9, It is characterized in that The molding device (1, 30) is configured to move the shut-off partition (41) into the injection channel (11, 40) and close the injection channel (11, 40) when a predetermined first molding pressure (60) is exceeded.

11. The forming device (1, 30) according to claim 9, It is characterized in that The forming device (1, 30) has an electric drive (51), which is operatively connected to the cut-off partition (41) and is configured to move the cut-off partition (41) according to a received cut-off signal.

12. The forming device (1, 30) according to claim 11, It is characterized in that The forming device (1, 30) has an electric drive (51) which is operatively connected to the shut-off partition (41) and is configured to close the shut-off partition in response to a received shut-off signal.

13. The forming device (1, 30) according to claim 9, It is characterized in that The molding device (1, 30) has a coupling mechanism (42), which is operatively connected to a pressure piston (31) of the molding device (1, 30) for generating molding pressure and to the shut-off diaphragm (41), and is configured to transmit the movement of the pressure piston (31) to the shut-off diaphragm (41), thereby closing the shut-off diaphragm (41).

14. The forming device (1, 30) according to any one of claims 1 to 4, It is characterized in that The mold parts are mold halves.

15. The forming device (1, 30) according to any one of claims 1 to 4, It is characterized in that The molding device (1, 30) is designed to close the shut-off valve in response to an injection pressure for the molding compound (58).

16. A method for producing a profiled module by means of a profiled device (1, 30) according to any one of the preceding claims 1 to 15, in, The mold parts have spacers (4, 34) placed on the circuit carrier (15), and mutually different subcavities formed between the circuit carrier (15) and the mold parts are filled with molding compound (58), the circuit carrier (15) in the two mold parts and the electronic components (12, 13, 14) arranged on the circuit carrier are encapsulated with the molding compound, and the low-pressure subcavity (6, 36) is filled with molding compound (58) at a smaller first molding pressure (60) than the high-pressure subcavity adjacent to the low-pressure subcavity, The sub-cavities are filled with molding material (58) at the same time, and molding pressure acts on the two sub-cavities, and according to a predetermined first molding pressure (60), the low-pressure sub-cavity (6, 36) is closed by the stop valve in the area of ​​the injection opening (9, 38) of the low-pressure sub-cavity, so that the second molding pressure (59) can only continue to act on the high-pressure sub-cavity (7, 37).

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