Inspection apparatus and method for inspecting and repairing display panels using the inspection apparatus

Abstract

An inspection apparatus and a method for inspecting and repairing a display panel using the inspection apparatus are provided. The method for inspecting the display panel includes: an "image acquisition step" for acquiring an image of the display panel using the inspection apparatus for inspecting a display panel including light-emitting diodes; and an "alignment determination step" for determining the alignment of the light-emitting elements in the display panel.

Description

Technical Field

[0001] This disclosure relates to an inspection apparatus and a method for inspecting and repairing a display panel using the inspection apparatus. Background Technology

[0002] The importance of display devices has been increasing with the development of multimedia. In response, various types of display devices are being used, such as organic light-emitting displays (OLEDs) and liquid crystal displays (LCDs).

[0003] Devices for displaying images include various display panels, such as organic light-emitting display panels or liquid crystal display panels. Among them, display panels may include light-emitting elements, and for example, in the case of light-emitting diodes (LEDs), there are organic light-emitting diodes (OLEDs) that use organic materials as fluorescent materials, inorganic light-emitting diodes that use inorganic materials as fluorescent materials, and so on.

[0004] Inorganic light-emitting diodes (LEDs) using inorganic semiconductors as fluorescent materials have the following advantages: they exhibit durability even at high temperatures, and their blue light efficiency is higher than that of organic light-emitting diodes (OLEDs). Furthermore, a transfer method using dielectric electrophoresis (DEP) has been developed for manufacturing processes that have been identified as limiting factors in existing inorganic LED devices. Therefore, research on inorganic LEDs with superior durability and efficiency compared to organic LEDs continues.

[0005] Since the aforementioned display devices have already been studied, an inspection device for checking defects in display devices is being studied together. Summary of the Invention

[0006] Technical issues

[0007] The purpose of this disclosure is to provide a method for inspecting and repairing a display device that can improve the alignment of the light-emitting elements in the display device.

[0008] Another objective of this disclosure is to provide a method for inspecting and repairing a display device that can improve the density of light-emitting elements in the display device.

[0009] Another objective of this disclosure is to provide a method for inspecting and repairing a display device that can simultaneously improve the alignment and density of the light-emitting elements in the display device.

[0010] The purpose of this disclosure is not limited to the above-described purposes, and other technical purposes not described will be clearly understood by those skilled in the art through the following description.

[0011] Technical solution

[0012] According to embodiments of the present disclosure for solving the above-mentioned objectives, a method for inspecting a display panel in an inspection apparatus for inspecting a display panel provided with light-emitting elements includes: an "image acquisition step" for acquiring an image of the display panel; and an "alignment determination step" for determining the alignment of the light-emitting elements in the display panel.

[0013] The method for inspecting a display panel may further include: "an electric field formation and light irradiation step on the panel", in which an electric field is formed in the display panel and light formed by a first light source included in the first light-emitting unit is irradiated onto a predetermined inspection area in the display panel.

[0014] The light-emitting element can be input into the display panel by an inkjet method that inputs ink including the light-emitting element of a first concentration, and the "electric field formation and light irradiation step on the panel" can be performed while the ink input into the display panel is not dry.

[0015] The light generated by the first light source can be ultraviolet (UV).

[0016] The first light-emitting unit may include a first light source and a second light source that generates infrared (IR) radiation.

[0017] The "Image Acquisition Step" can be performed after the "Electric Field Formation and Light Illumination Step on the Panel".

[0018] The "image acquisition step" can be a step of acquiring an image by collecting fluorescence and excitation light emitted through a light-emitting element and imaging the collected information.

[0019] According to another embodiment of the present disclosure for solving the above-mentioned objective, the method for repairing a display panel includes: an "electric field formation and light irradiation step" in which an electric field is formed in a display panel provided with light-emitting elements, and light formed by a light source included in a first light-emitting unit is irradiated onto a predetermined inspection area in the display panel; an "image acquisition step" in which an image of the display panel is acquired; and a "rearrangement step" in which the light-emitting elements are rearranged.

[0020] The "rearrangement step" can be a step in which light generated by a third light source, including in the second light-emitting unit, is irradiated onto a predetermined repair area in the display panel while an electric field has been formed in the display panel.

[0021] The light generated by the third light source can be ultraviolet (UV).

[0022] The method for repairing a display panel may also include: "alignment determination step", which determines the alignment of the light-emitting elements in the display panel through an image.

[0023] The "rearrangement step" can be performed based on the result of comparing the alignment with the predetermined reference value in the "alignment determination step".

[0024] The "Alignment Determination Step" can be executed again after the "Rearrangement Step".

[0025] The method for repairing a display panel may also include: "light-emitting element density determination step", which determines the density of light-emitting elements in the display panel through images.

[0026] The method for repairing the display panel may also include a "light-emitting element input step", in which the light-emitting element is input into the display panel separately based on the result of comparing the density of the light-emitting element with a predetermined reference value in the "light-emitting element density determination step".

[0027] The method for repairing a display panel may also include: a "position information storage step", which stores position information about a corresponding area based on the result of comparing the density of the light-emitting elements with a predetermined reference value in the "light-emitting element density determination step"; and a "drying step", which dries the ink, including the light-emitting elements input at a first concentration during the manufacturing of the display panel.

[0028] The “light-emitting element input step” can be a step of inputting ink from a light-emitting element, including a second concentration that is lower than the first concentration, into the display panel.

[0029] According to another embodiment of the present disclosure for solving the above-mentioned objective, an inspection apparatus for inspecting and repairing a display panel provided with light-emitting elements includes: a panel loading unit configured to accommodate the display panel; a measuring unit configured to inspect the display panel; a repair unit configured to repair the display panel; a position adjustment unit configured to move the panel loading unit, the measuring unit, and the repair unit; and a control unit configured to control the panel loading unit, the measuring unit, the repair unit, and the position adjustment unit.

[0030] The measuring unit may include: a first light-emitting unit, including a first light source for generating ultraviolet to visible light; and a light-receiving unit configured to collect fluorescence and excitation light emitted by the light-emitting element irradiated by the light generated by the first light source.

[0031] The measurement unit may further include: a first filter unit through which light generated from the first light source passes; and a second filter unit through which fluorescence and excitation light pass.

[0032] The first light-emitting unit may also include a second light source for generating infrared (IR) radiation.

[0033] The repair unit may include: a second light-emitting unit, including a third light source for generating ultraviolet to visible light.

[0034] The repair unit may also include an inkjet unit configured to supply ink, including light-emitting elements, to the display panel.

[0035] Each light-emitting element may include: a first semiconductor layer comprising an n-type semiconductor material; a second semiconductor layer comprising a p-type semiconductor material; and an active layer disposed between the first semiconductor layer and the second semiconductor layer, and formed in a quantum well structure.

[0036] The length of the first semiconductor layer can be longer than the length of the second semiconductor layer, and the amount of fluorescence and excitation light emitted from the active layer can be greater than the amount of fluorescence and excitation light formed in the first and second semiconductor layers, respectively.

[0037] The panel loading unit may include: a panel moving unit configured to move a display panel; and an electric field forming unit configured to form an electric field in the display panel.

[0038] Details of other embodiments are included in the detailed description and accompanying drawings.

[0039] Beneficial effects

[0040] According to embodiments of this disclosure, the alignment and / or density of light-emitting elements in a display device can be increased.

[0041] The effects of the embodiments are not limited to the examples above, and many more effects are included in this specification. Attached Figure Description

[0042] Figure 1 and Figure 2 These are perspective and cross-sectional views showing a light-emitting element according to an embodiment of the present disclosure.

[0043] Figure 3 and Figure 4 These are perspective and cross-sectional views showing a light-emitting element according to another embodiment of the present disclosure.

[0044] Figure 5 This is a schematic perspective view showing a light-emitting element according to yet another embodiment of the present disclosure.

[0045] Figure 6 This is a cross-sectional view showing a light-emitting element according to yet another embodiment of the present disclosure.

[0046] Figure 7 This is a schematic perspective view showing a light-emitting element according to yet another embodiment.

[0047] Figure 8 This is a conceptual diagram illustrating a display panel according to an embodiment of the present disclosure.

[0048] Figure 9 It is shown that it includes Figure 8 The planar layout diagram of a portion of a subpixel in the display panel.

[0049] Figure 10 Is along with Figure 9 The section view of the display panel corresponding to line I-I' is taken.

[0050] Figure 11 This is a block diagram schematically illustrating an inspection apparatus according to an embodiment of the present disclosure.

[0051] Figure 12 This is a schematic diagram illustrating an inspection apparatus according to an embodiment of the present disclosure.

[0052] Figure 13 This is a block diagram schematically illustrating a panel loading unit according to an embodiment of the present disclosure.

[0053] Figure 14 This is a block diagram schematically illustrating the measurement unit and the repair unit according to an embodiment of the present disclosure.

[0054] Figure 15 This is a schematic diagram illustrating the measurement unit and the repair unit according to an embodiment of the present disclosure.

[0055] Figure 16 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to an embodiment of the present disclosure. Figure 17 It shows the description Figure 16 A concept diagram of the display panel for some of the steps.

[0056] Figure 18 It is shown Figure 16 A cross-sectional view of the display panel showing some of the steps.

[0057] Figure 19 It shows the description Figure 16 A conceptual diagram of the inspection area for some steps.

[0058] Figure 20 It shows the description Figure 16 A conceptual diagram of the light-emitting element for some of the steps.

[0059] Figure 21 It shows the description Figure 16 Image of the inspection area for some steps.

[0060] Figure 22 It shows the description Figure 16 A concept diagram of the display panel for some of the steps.

[0061] Figure 23 It is shown Figure 16 A cross-sectional view of the display panel showing some of the steps.

[0062] Figure 24 It shows the description Figure 16 A conceptual diagram of the light-emitting element for some of the steps.

[0063] Figure 25 and Figure 26 This is a conceptual diagram of a display panel illustrating some steps of a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0064] Figure 27 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0065] Figure 28 It shows the description Figure 27 A conceptual diagram of the inspection area for some steps.

[0066] Figure 29 It is used to describe Figure 27 A cross-sectional view of the display panel showing some of the steps.

[0067] Figure 30 It shows the description Figure 27 A conceptual diagram of the inspection area for some steps.

[0068] Figure 31 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0069] Figure 32 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0070] Figure 33 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0071] Figure 34 Is along with Figure 9 The section view of the display panel corresponding to line I-I' is taken. Detailed Implementation

[0072] The advantages and features of this disclosure, as well as methods of implementing them, will become apparent from the following detailed description of the embodiments and the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, and can be implemented in various different forms. The embodiments given are provided so that this disclosure will be thorough and complete, and the scope of this disclosure will be fully understood by those skilled in the art to which this disclosure pertains. This disclosure is limited only by the scope of the claims.

[0073] The terminology used in this specification is for describing embodiments and is not intended to limit this disclosure. In this specification, the singular form includes the plural form as well as the singular form, unless otherwise specified in the phrase. The term "comprising" and / or variations thereof do not exclude the presence or addition of one or more other components, steps, operations, and / or elements for the described components, steps, operations, and / or elements.

[0074] When a component is described as being “connected” or “combined” to another component, that component may be directly connected to or directly combined with said other component. However, it will be understood that another component may be “placed” between them, or they may be “connected” or “combined” through another component.

[0075] The use of "on" another element or layer to refer to an element or layer includes situations where the element or layer is directly disposed on the other element or layer or where other elements or layers exist in between.

[0076] Although terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, within the technical spirit of this disclosure, the first component described below can be the second component.

[0077] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The same or similar reference numerals are used for the same constructions in the drawings.

[0078] Figure 1 and Figure 2 These are perspective and cross-sectional views illustrating a light-emitting element according to an embodiment of the present disclosure. Although in Figure 1 and Figure 2 The diagram shows a cylindrical rod-shaped light-emitting element (LD), but the types and / or shapes of light-emitting elements (LDs) according to this disclosure are not limited thereto.

[0079] Reference Figure 1 and Figure 2 The light-emitting element (LD) may include a first semiconductor layer 11 and a second semiconductor layer 13, and an active layer 12 disposed between the first semiconductor layer 11 and the second semiconductor layer 13. For example, the light-emitting element (LD) may be constructed as a stack in which the first semiconductor layer 11, the active layer 12 and the second semiconductor layer 13 are stacked sequentially in one direction.

[0080] According to an embodiment, the light-emitting element (LD) can be configured as a rod shape extending along one direction. The light-emitting element (LD) can have one side end and another side end along said one direction.

[0081] According to an embodiment, one of the first semiconductor layer 11 and the second semiconductor layer 13 may be disposed at one side of the light-emitting element LD, and the other of the first semiconductor layer 11 and the second semiconductor layer 13 may be disposed at the other side of the light-emitting element LD.

[0082] According to an embodiment, the light-emitting element LD can be a rod-shaped light-emitting diode manufactured in a rod shape. Here, rod shape includes rod-shaped or strip-shaped (such as a cylinder or polygonal prism) shapes that are longer in the length direction than in the width direction (i.e., have an aspect ratio greater than 1), and the shape of its cross-section is not particularly limited. For example, the length L of the light-emitting element LD can be greater than its diameter D (or the width of its cross-section).

[0083] According to embodiments, the light-emitting element (LD) can have dimensions ranging from nanometer to micrometer scales (nanometer to micrometer scale), for example, a diameter D and / or length L ranging from about 100 nm to about 10 μm. However, the size of the light-emitting element (LD) is not limited to this. For example, the size of the light-emitting element (LD) can vary depending on the design conditions of various devices (e.g., display devices, etc.) that use the light-emitting element (LD) as a light source.

[0084] The first semiconductor layer 11 may include at least one n-type semiconductor material. For example, the first semiconductor layer 11 may include one of the semiconductor materials selected from InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include an n-type semiconductor material doped with a first conductive dopant (such as Si, Ge, or Sn). However, the materials constituting the first semiconductor layer 11 are not limited to these, and various materials other than those described above may also constitute the first semiconductor layer 11.

[0085] The active layer 12 can be disposed on the first semiconductor layer 11 and can be formed in a single quantum well structure or a multiple quantum well structure. In embodiments, a cladding layer (not shown) doped with a conductive dopant can be formed on and / or below the active layer 12. For example, the cladding layer can be formed of an AlGaN layer or an InAlGaN layer. According to embodiments, materials such as AlGaN and AlInGaN can be used to form the active layer 12, and various materials other than those described above can constitute the active layer 12. In other words, the active layer 12 can be disposed between the first semiconductor layer 11 and the second semiconductor layer 13, which will be described later.

[0086] When a voltage greater than or equal to the threshold voltage is applied across the light-emitting element (LD), the LD emits light while electron-hole pairs combine in the active layer 12. By controlling the light emission of the LD using this principle, the LD can be used as a light source for various light-emitting devices, including pixels of a display device.

[0087] The second semiconductor layer 13 may be disposed on the active layer 12 and may comprise a type of semiconductor material different from that of the first semiconductor layer 11. For example, the second semiconductor layer 13 may comprise at least one p-type semiconductor material. For example, the second semiconductor layer 13 may comprise at least one semiconductor material selected from InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may comprise a p-type semiconductor material doped with a second conductive dopant (such as Mg). However, the materials constituting the second semiconductor layer 13 are not limited to these, and various materials other than those described above may constitute the second semiconductor layer 13.

[0088] According to an embodiment, the first length L1 of the first semiconductor layer 11 may be longer than the second length L2 of the second semiconductor layer 13.

[0089] According to an embodiment, the light-emitting element LD may further include an insulating film INF disposed on its surface. The insulating film INF may be formed on the surface of the light-emitting element LD to at least surround the outer peripheral surface of the active layer 12, and may also surround a region of the first semiconductor layer 11 and the second semiconductor layer 13.

[0090] However, according to embodiments, the insulating film INF can expose the two ends of the light-emitting element LD with different polarities. For example, the insulating film INF may not cover one end of each of the first semiconductor layer 11 and the second semiconductor layer 13 (e.g., the two planes of a cylinder (i.e., the upper and lower surfaces)) located at both ends of the light-emitting element LD in the longitudinal direction, and may expose them. In some other embodiments, the insulating film INF can expose the two ends of the light-emitting element LD with different polarities as well as the sides of the semiconductor layers 11 and 13 adjacent to said ends.

[0091] According to embodiments, the insulating film INF may include at least one insulating material selected from silicon dioxide (SiO2), silicon nitride (Si3N4), aluminum oxide (Al2O3), and titanium dioxide (TiO2), but is not limited thereto. That is, the constituent materials of the insulating film INF are not particularly limited, and the insulating film INF may be composed of various currently known insulating materials.

[0092] In embodiments, in addition to the first semiconductor layer 11, the active layer 12, the second semiconductor layer 13, and the insulating film INF, the light-emitting element LD may also include additional components. For example, the light-emitting element LD may additionally include one or more phosphor layers, active layers, semiconductor material layers, and / or electrode layers disposed on one end side of the first semiconductor layer 11, the active layer 12, and / or the second semiconductor layer 13.

[0093] When a voltage greater than or equal to the threshold voltage is applied across the light-emitting element (LD), the LD emits light while electron-hole pairs combine in the active layer 12. By controlling the light emission of the LD using this principle, the LD can be used as a light source for various light-emitting devices, including pixels of a display device.

[0094] Figure 3 and Figure 4 These are perspective and cross-sectional views showing a light-emitting element according to another embodiment of the present disclosure.

[0095] Reference Figure 3 and Figure 4 According to an embodiment, the light-emitting element (LD) may include a first semiconductor layer 11, a second semiconductor layer 13, and an active layer 12 disposed between the first semiconductor layer 11 and the second semiconductor layer 13. According to an embodiment, the first semiconductor layer 11 may be disposed in the central region of the light-emitting element LD, and the active layer 12 may be disposed on the surface of the first semiconductor layer 11 to surround at least one region of the first semiconductor layer 11. Additionally, the second semiconductor layer 13 may be disposed on the surface of the active layer 12 to surround at least one region of the active layer 12.

[0096] Additionally, the light-emitting element LD may also include an electrode layer 14 and / or an insulating film INF surrounding at least one region of the second semiconductor layer 13. For example, the light-emitting element LD may include an electrode layer 14 disposed on the surface of the second semiconductor layer 13 to surround a region of the second semiconductor layer 13 and an insulating film INF disposed on the surface of the electrode layer 14 to surround at least one region of the electrode layer 14. That is, the light-emitting element LD according to the above embodiment can be implemented as a core-shell structure including a first semiconductor layer 11, an active layer 12, a second semiconductor layer 13, an electrode layer 14, and an insulating film INF sequentially disposed from the center outwards, and the electrode layer 14 and / or the insulating film INF may be omitted according to the embodiment.

[0097] In an embodiment, the light-emitting element (LD) can be configured as a polygonal horn shape extending in any direction. For example, at least one region of the LD can have a hexagonal horn shape. However, the shape of the LD is not limited to this and can be varied.

[0098] When the extension direction of the light-emitting element LD is referred to as the length L direction, the light-emitting element LD may have one side end and another side end along the length L direction. According to an embodiment, one of the first semiconductor layer 11 and the second semiconductor layer 13 may be disposed at one side end of the light-emitting element LD, and the other of the first semiconductor layer 11 and the second semiconductor layer 13 may be disposed at the other side end of the light-emitting element LD.

[0099] In embodiments of this disclosure, the light-emitting element (LD) can be an ultra-small light-emitting diode with a core-shell structure fabricated in a polygonal prism shape (e.g., a hexagonal horn shape with protruding ends). For example, the LD can have dimensions ranging from nanometers to micrometers, such as a width and / or length L in the nanometer or micrometer range, respectively. However, the size, shape, etc., of the LD can vary depending on the design conditions of various devices (e.g., display devices, etc.) that use the LD as a light source.

[0100] In an embodiment, the two ends of the first semiconductor layer 11 may have a protruding shape along the length L of the light-emitting element LD. The shapes of the two ends of the first semiconductor layer 11 may differ from each other. For example, as the width narrows towards the top, one end of the first semiconductor layer 11 disposed on the upper side may have a horn shape that contacts a vertex. Additionally, the other end of the first semiconductor layer 11 disposed on the lower side may have a polygonal prism shape with a constant width, but is not limited thereto. For example, in another embodiment of this disclosure, the first semiconductor layer 11 may have a cross-section with a polygonal shape, a stepped shape, etc., in which the width gradually narrows towards the bottom. The shapes of the two ends of the first semiconductor layer 11 may be varied according to the embodiments and are not limited to the embodiments described above.

[0101] According to an embodiment, the first semiconductor layer 11 can be positioned at the core (i.e., the center (or central region) of the light-emitting element LD). Furthermore, the light-emitting element LD can be configured in a shape corresponding to the shape of the first semiconductor layer 11. For example, when the first semiconductor layer 11 has a hexagonal horn shape, the light-emitting element LD can also have a hexagonal horn shape.

[0102] Figure 5 This is a schematic perspective view illustrating a light-emitting element according to yet another embodiment of the present disclosure. Figure 5 For ease of description, part of the insulating film INF has been omitted.

[0103] Reference Figure 5 The light-emitting element LD may also include an electrode layer 14 disposed on the second semiconductor layer 13.

[0104] Electrode layer 14 may be an ohmic contact electrode electrically connected to the second semiconductor layer 13, but is not limited thereto. According to an embodiment, electrode layer 14 may be a Schottky contact electrode. Electrode layer 14 may include a metal or metal oxide, for example, Cr, Ti, Al, Au, Ni, their oxides or alloys, ITO, IZO, and ITZO may be used alone or in combination. Additionally, electrode layer 14 may be substantially transparent or translucent. Therefore, light generated in the active layer 12 of the light-emitting element LD can pass through electrode layer 14 and can be emitted to the outside of the light-emitting element LD.

[0105] Although not shown separately, in another embodiment, the light-emitting element LD may include an electrode layer 14 disposed on the second semiconductor layer 13, and may also include an electrode layer disposed on the first semiconductor layer 11.

[0106] Figure 6 This is a cross-sectional view showing a light-emitting element according to yet another embodiment of the disclosure.

[0107] Reference Figure 6 The insulating film INF' can have a curved shape in the corner region adjacent to the electrode layer 14. According to an embodiment, the curved surface can be formed by etching when manufacturing the light-emitting element LD.

[0108] Although not shown separately, in another embodiment of the light-emitting element having a structure that also includes an electrode layer disposed on the first semiconductor layer 11 described above, the insulating film INF' may have a curved shape in the region adjacent to the electrode layer.

[0109] Figure 7 This is a schematic perspective view showing a light-emitting element according to yet another embodiment. Figure 7 For ease of description, part of the insulating film INF is omitted.

[0110] First, refer to Figure 7 The light-emitting element LD may further include a third semiconductor layer 15 disposed between the first semiconductor layer 11 and the active layer 12, and a fourth semiconductor layer 16 and a fifth semiconductor layer 17 disposed between the active layer 12 and the second semiconductor layer 13. Figure 7 LEDs and Figure 1 The difference in this embodiment is that multiple semiconductor layers 15, 16, and 17, as well as electrode layers 14a and 14b, are also provided, and the active layer 12 includes another element. Furthermore, the arrangement and structure of the insulating film INF are similar to... Figure 1 The setup and structure of the insulating film INF are basically the same. Figure 7 In the middle, some components and Figure 1 The components are the same, but new reference numerals are given for ease of description. In the following text, repeated descriptions are omitted, and the differences are mainly described.

[0111] As mentioned above, in Figure 1 In a light-emitting element (LD), the active layer 12 can emit blue or green light by including nitrogen (N). On the other hand, in Figure 7In the light-emitting element LD, each of the active layer 12 and other semiconductor layers 11, 13, 15, 16, and 17 can be a semiconductor comprising at least phosphorus (P). That is, the light-emitting element LD according to the embodiment can emit red light in the range of 620 nm to 750 nm in the center band. However, it should be understood that the center band of red light is not limited to the above range and includes all wavelengths that can be identified as red in this art.

[0112] Specifically, according to Figure 7 In the embodiment of the light-emitting element LD, the first semiconductor layer 11 may be an n-type semiconductor layer, and when the light-emitting element LD emits red light, the first semiconductor layer 11 may include a material with the chemical formula In. x Al y Ga 1-x-y A semiconductor material with P (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the first semiconductor layer 11 can be any one or more of n-type doped InAlGaP, GaP, AlGaP, InGaP, AlP, and InP. The first semiconductor layer 11 can be doped with an n-type dopant, such as Si, Ge, Sn, etc. In an exemplary embodiment, the first semiconductor layer 11 can be n-AlGaInP doped with n-type Si. The length of the first semiconductor layer 11 can be in the range of 1.5 μm to 5 μm, but is not limited thereto.

[0113] The second semiconductor layer 13 may be a p-type semiconductor layer, and when the light-emitting element LD emits red light, the second semiconductor layer 13 may include a material with the chemical formula In. x Al y Ga 1-x-y A semiconductor material of type P (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the second semiconductor layer 13 can be any one or more of p-type doped InAlGaP, GaP, AlGaP, InGaP, AlP, and InP. The second semiconductor layer 13 can be doped with a p-type dopant, such as Mg, Zn, Ca, Ba, etc. In an exemplary embodiment, the second semiconductor layer 13 can be p-GaP doped with p-type Mg. The length of the second semiconductor layer 13 can be in the range of 0.08 μm to 0.25 μm, but is not limited thereto.

[0114] The active layer 12 can be disposed between the first semiconductor layer 11 and the second semiconductor layer 13. Figure 1 The active layer 12 is the same. Figure 7The active layer 12 can also emit light in a specific wavelength band by including a single quantum well structure material or a multi-quantum well structure material. For example, when the active layer 12 emits red light, it can include materials such as AlGaP, AlInGaP, etc. In particular, when the active layer 12 has a structure in which quantum layers and well layers are alternately stacked in a multi-quantum well structure, the quantum layers can include materials such as AlGaP or AlInGaP, and the well layers can include materials such as GaP or AlInP. In an exemplary embodiment, the active layer 12 can emit red light with a center wavelength band of 620 nm to 750 nm by including AlGaInP as a quantum layer and AlInP as a well layer.

[0115] Figure 7 The light-emitting element (LD) may include a cladding layer disposed adjacent to the active layer 12. As shown in the figures, a third semiconductor layer 15 and a fourth semiconductor layer 16 disposed on and below the active layer 12 between the first semiconductor layer 11 and the second semiconductor layer 13 may be cladding layers.

[0116] The third semiconductor layer 15 may be disposed between the first semiconductor layer 11 and the active layer 12. The third semiconductor layer 15 may be the same n-type semiconductor as the first semiconductor layer 11. For example, the third semiconductor layer 15 may include a semiconductor with the chemical formula In. x Al y Ga 1-x-y A semiconductor material of type P (0≤x≤1, 0≤y≤1, 0≤x+y≤1). In an exemplary embodiment, the first semiconductor layer 11 may be n-AlGaInP, and the third semiconductor layer 15 may be n-AlInP. However, the disclosure is not limited thereto.

[0117] A fourth semiconductor layer 16 may be disposed between the active layer 12 and the second semiconductor layer 13. The fourth semiconductor layer 16 may be the same p-type semiconductor as the second semiconductor layer 13; for example, the fourth semiconductor layer 16 may include semiconductors with the chemical formula In. x Al y Ga 1-x-y A semiconductor material of type P (0≤x≤1, 0≤y≤1, 0≤x+y≤1). In an exemplary embodiment, the second semiconductor layer 13 may be p-GaP, and the fourth semiconductor layer 16 may be p-AlInP.

[0118] A fifth semiconductor layer 17 may be disposed between the fourth semiconductor layer 16 and the second semiconductor layer 13. The fifth semiconductor layer 17 may be the same p-doped semiconductor as the second semiconductor layer 13 and the fourth semiconductor layer 16. In some embodiments, the fifth semiconductor layer 17 may function to reduce the lattice constant difference between the fourth semiconductor layer 16 and the second semiconductor layer 13. That is, the fifth semiconductor layer 17 may be a tensile strain barrier reduction (TSBR) layer. For example, the fifth semiconductor layer 17 may include p-GaInP, p-AlInP, p-AlGaInP, etc., but is not limited thereto. Furthermore, the lengths of the third semiconductor layer 15, the fourth semiconductor layer 16, and the fifth semiconductor layer 17 may range from 0.08 μm to 0.25 μm, but are not limited thereto.

[0119] The first electrode layer 14a and the second electrode layer 14b may be disposed on the first semiconductor layer 11 and the second semiconductor layer 13, respectively. The first electrode layer 14a may be disposed on the lower surface of the first semiconductor layer 11, and the second electrode layer 14b may be disposed on the upper surface of the second semiconductor layer 13. However, this disclosure is not limited thereto, and at least one of the first electrode layer 14a and the second electrode layer 14b may be omitted. For example, in a light-emitting element (LD), the first electrode layer 14a may not be disposed on the lower surface of the first semiconductor layer 11, and only one second electrode layer 14b may be disposed on the upper surface of the second semiconductor layer 13. Each of the first electrode layer 14a and the second electrode layer 14b may include Figure 5 At least one of the materials exemplified in the electrode layer 14.

[0120] The following examples are described as applications. Figure 1 and Figure 2 The example shown is a light-emitting element LD, but those skilled in the art can use other light-emitting elements... Figures 3 to 7 The light-emitting elements LD shown are applied to various shapes of light-emitting elements in the embodiments.

[0121] Figure 8 This is a conceptual diagram illustrating a display panel according to an embodiment of the present disclosure.

[0122] Display panel 1 can be used as a display panel for large display devices (such as televisions and monitors) as well as small and medium-sized display devices (such as mobile phones, tablets, car navigation systems, game consoles and smartwatches).

[0123] Reference Figure 8As an embodiment, the display panel 1 may have a rectangular shape that is longer in the second direction DR2 than in the first direction DR1. The thickness direction of the display panel 1 is indicated by the third direction DR3. However, the directions indicated by the first direction to the third directions DR1, DR2, and DR3 may be converted to other directions as relative concepts. In the following, the first direction to the third directions DR1, DR2, and DR3 refer to the same reference numerals as those used for the directions indicated by the first direction to the third directions DR1, DR2, and DR3, respectively. Furthermore, the shape of the display panel 1 is not limited to the shape shown and may have various shapes.

[0124] Display panel 1 may include a substrate (or base) SUB1 and pixels PXL disposed on the substrate SUB1. Specifically, display panel 1 and substrate SUB1 may include a display area DA in which an image is displayed and a non-display area NDA other than the display area DA.

[0125] The display area DA and the non-display area NDA can be defined within the substrate layer SUB1. According to an embodiment, the display area DA can be located in the central region of the display panel 1, and the non-display area NDA can be positioned along the edge of the display panel 1 surrounding the display area DA. However, the positions of the display area DA and the non-display area NDA are not limited to this, and their positions can be changed.

[0126] The substrate layer SUB1 can form the substrate component of the display panel 1. For example, the substrate layer SUB1 can form the substrate component of the lower panel (e.g., the lower plate of the display panel 1).

[0127] According to embodiments, the substrate SUB1 can be a rigid substrate or a flexible substrate, and its material or physical properties are not particularly limited. For example, the substrate SUB1 can be a rigid substrate made of glass or tempered glass, or a flexible substrate made of a thin film of plastic or metal material. Additionally, the substrate SUB1 can be a transparent substrate, but is not limited thereto. For example, the substrate SUB1 can be a translucent substrate, an opaque substrate, or a reflective substrate.

[0128] One area on the substrate layer SUB1 is defined as the display area DA, where the pixel PXL is located, while the remaining area is defined as the non-display area NDA. For example, the substrate layer SUB1 may include the display area DA, in which multiple light-emitting areas of the pixel PXL are formed, and the non-display area NDA located outside the display area DA. In the non-display area NDA, various lines and / or internal circuit units connected to the pixel PXL in the display area DA may be provided.

[0129] Pixel PXL may include at least one light-emitting element (LD) driven by corresponding scan signals and data signals, for example, at least Figures 1 to 7 The light-emitting diodes in any of the embodiments described herein. Multiple rod-shaped light-emitting diodes can constitute the light source for pixel PXL.

[0130] Furthermore, a pixel PXL may include multiple pixels. For example, a pixel PXL may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. According to an embodiment, the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may emit light of different colors. For example, the first sub-pixel SPX1 may be a red sub-pixel emitting red light, the second sub-pixel SPX2 may be a green sub-pixel emitting green light, and the third sub-pixel SPX3 may be a blue sub-pixel emitting blue light. However, the color, type, number, etc., of the sub-pixels constituting the pixel PXL are not particularly limited; for example, the color of light emitted by each of the sub-pixels may be different.

[0131] Furthermore, according to the embodiment, the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 can emit light of the same color. For example, all of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 can be sub-pixels that emit red, green, or blue light. In this case, to construct a full-color pixel PXL, the first unit pixel SSPX1 to the third unit pixel SSPX3 (see reference) can be used. Figure 9 At least a portion of the light is provided with a light conversion layer and / or a color filter for converting light emitted from the corresponding unit pixel.

[0132] In addition, although Figure 8 An embodiment in which subpixels SPX1, SPX2, and SPX3 are arranged in a stripe shape in the display area DA is shown, but this disclosure is not limited thereto. For example, pixel PXL can be arranged in various currently known pixel arrangement types.

[0133] As an example, each of the sub-pixels SPX1, SPX2, and SPX3 may include multiple unit pixels SSPX1, SSPX2, and SSPX3 (see reference). Figure 9 Each of the unit pixels can be connected to a scan line and a data line, and can also be connected to a high-potential power line and a low-potential power line. Each of the unit pixels can emit light with a brightness corresponding to the data signal transmitted via the data line in response to a scan signal transmitted via the scan line. Unit pixels can include substantially the same pixel structure or pixel circuitry. That is, the first sub-pixel SPX1 can include unit pixels that emit light independently in response to a scan signal and a data signal.

[0134] Although not shown, multiple pads (or "solder pads") can be placed in the non-display area NDA. Lines in display panel 1 can be electrically connected to driver ICs located outside display panel 1 via the pads.

[0135] Figure 9 It is shown that it includes Figure 8 The planar layout diagram of a portion of a subpixel in the display panel.

[0136] Reference Figure 9 The first sub-pixel SPX1 may include a first electrode ETL1 and second electrodes ETL21, ETL22 and ETL23 spaced apart from each other, and at least one light-emitting element LD connected between the first electrode ETL1 and the second electrodes ETL21, ETL22 and ETL23.

[0137] As an example, the first electrode ETL1 can be an electrode shared by the first unit pixel SSPX1 to the third unit pixel SSPX3. In this case, the first unit pixel to the third unit pixel can be arranged along the first direction DR1.

[0138] The second electrodes ETL21, ETL22, and ETL23 can be positioned on one side of the second direction DR2, spaced apart from the first electrode ETL1. The second electrodes ETL21, ETL22, and ETL23 in the first unit pixel SSPX1 to the third unit pixel SSPX3 can be arranged on the first direction DR1.

[0139] The first electrode ETL1 and the second electrodes ETL21, ETL22 and ETL23 can be spaced apart from each other by a predetermined distance and arranged side by side (parallel).

[0140] As an example, the first electrode ETL1 can be a cathode electrode electrically connected to a low-potential power source. The second electrodes ETL21, ETL22, and ETL23 can be anode electrodes electrically connected to a high-potential power source. When a light-emitting element LD is provided having one end electrically connected to the first electrode ETL1 and the other end of the second electrodes ETL21, ETL22, and ETL23 respectively, each of the first electrode ETL1 and the second electrodes ETL21, ETL22, and ETL23 can be electrically connected.

[0141] As an example, each unit pixel (e.g., SSPX1) may define an emission region. The emission region may be divided into non-emission regions. Although not clearly shown, pixel-defining layers (dams or light-blocking patterns) that block light emitted from the light-emitting element LD from transmitting to another region may be configured to be stacked in the non-emission region. In this specification, when referred to as "stacked," unless otherwise defined, "stacked" means two structures stacked in the thickness direction of the display panel 1 (a direction perpendicular to the surface of the substrate layer SUB1 (e.g., third direction DR3)).

[0142] Figure 10 Is along with Figure 9 The section view of the display panel corresponding to line I-I' is taken.

[0143] Figure 10 The cross-section of the display panel 1 shown can be a cross-section of the display panel 1 before manufacturing is completed. That is, the cross-section of the display panel 1 shown can be the object of inspection, and subsequent processes can be performed on the display panel 1 shown after the inspection steps of the inspection apparatus according to this embodiment.

[0144] Reference Figure 10 The display panel 1 may include a substrate layer SUB1 disposed beneath it. Since the substrate layer SUB1 has been described above, a repeating description is omitted.

[0145] A first buffer layer 111 is disposed on the substrate layer SUB1. The first buffer layer 111 performs the function of smoothing the surface of the substrate layer SUB1 and preventing moisture or external air from penetrating. The first buffer layer 111 may be an inorganic layer. The first buffer layer 111 may be a single layer or multiple layers.

[0146] Multiple transistors Tdr and Tsw are disposed on the first buffer layer 111. Here, transistors Tdr and Tsw can be thin-film transistors. The two transistors Tdr and Tsw shown in the attached figure correspond to the driving transistor and the switching transistor, respectively.

[0147] Each transistor Tdr and Tsw can include semiconductor patterns ACT1 and ACT2, gate electrodes GE1 and GE2, source electrodes SDE2 and SDE4, and drain electrodes SDE1 and SDE3, respectively. For example, the first transistor Tdr, as a driving transistor, can include a first semiconductor pattern ACT1, a first gate electrode GE1, a first source electrode SDE2, and a first drain electrode SDE1. The second transistor Tsw, as a switching transistor, can include a second semiconductor pattern ACT2, a second gate electrode GE2, a second source electrode SDE4, and a second drain electrode SDE3.

[0148] Specifically, a panel semiconductor layer is disposed on the first buffer layer 111. The panel semiconductor layer may include the first semiconductor pattern ACT1 and the second semiconductor pattern ACT2 described above. In addition, the panel semiconductor layer may also include a third semiconductor pattern ACT3.

[0149] According to an embodiment, at least a portion of the first semiconductor pattern ACT1, the second semiconductor pattern ACT2, and the third semiconductor pattern ACT3 may be formed as patterns separated from each other. Additionally, according to an embodiment, the first semiconductor pattern ACT1, the second semiconductor pattern ACT2, and the third semiconductor pattern ACT3 may be patterns located in different regions extending from a single pattern.

[0150] The panel semiconductor layer may include amorphous silicon, polycrystalline silicon, low-temperature polycrystalline silicon, and organic semiconductors. In another embodiment, the panel semiconductor layer may be an oxide semiconductor. Although not clearly shown, the panel semiconductor layer may include a channel region and source and drain regions disposed on both sides of the channel region and doped with impurities.

[0151] The first gate insulating layer 112 is disposed on the semiconductor layer of the panel. The first gate insulating layer 112 may be an inorganic layer. The first gate insulating layer 112 may be a single layer or multiple layers.

[0152] A first conductive layer is disposed on the first gate insulating layer 112. The first conductive layer may include the first gate electrode GE1 and the second gate electrode GE2 described above. Additionally, the first conductive layer may also include a first low-power pattern VSSL1. The first conductive layer may be formed of a conductive metallic material. For example, the first conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). The first conductive layer may be a single layer or multiple layers.

[0153] The first low-power pattern VSSL1 can be electrically connected to the second power line. The first low-power pattern VSSL1 can be set in the display area DA and can be superimposed on the third semiconductor pattern ACT3.

[0154] The second gate insulating layer 113 is disposed on the first conductive layer. The second gate insulating layer 113 may be an inorganic layer. The second gate insulating layer 113 may be a single layer or multiple layers.

[0155] A second conductive layer is disposed on the second gate insulating layer 113. The second conductive layer may include a third gate electrode GE3. The third gate electrode GE3 may be the gate electrode of another transistor (not shown), but is not limited thereto. The second conductive layer may be formed of a conductive metallic material. For example, the second conductive layer may include molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). The second conductive layer may be a single layer or multiple layers.

[0156] An interlayer insulating layer 114 is disposed on the second conductive layer. The interlayer insulating layer 114 can be an organic layer or an inorganic layer. The interlayer insulating layer 114 can be a single layer or multiple layers.

[0157] A third conductive layer is disposed on the interlayer insulating layer 114. The third conductive layer may include the aforementioned source electrodes SDE2 and SDE4, and drain electrodes SDE1 and SDE3. Additionally, the third conductive layer may also include a second low-power pattern VSSL2. The third conductive layer is formed of a conductive metallic material. For example, the source electrodes SDE2 and SDE4, the drain electrodes SDE1 and SDE3, and the second low-power pattern VSSL2 may comprise aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo).

[0158] The second low-power pattern VSSL2 can be electrically connected to the second power line. The second low-power pattern VSSL2 can contact the first low-power pattern VSSL1 through contact holes passing through the second gate insulating layer 113 and the interlayer insulating layer 114. The second low-power pattern VSSL2 can be disposed in the display area DA and can be stacked with the first low-power pattern VSSL1 and the third semiconductor pattern ACT3.

[0159] The source electrodes SDE2 and SDE4, and the drain electrodes SDE1 and SDE3, are not limited to these names. In another embodiment, Figure 10 The source electrodes SDE2 and SDE4 shown can perform the function of drain electrodes, and Figure 10 The drain electrodes SDE1 and SDE3 shown can perform the functions of the source electrodes.

[0160] The source electrodes SDE2 and SDE4 and the drain electrodes SDE1 and SDE3 can be connected to the source and drain regions of each of the corresponding semiconductor patterns ACT1 and ACT2 through contact holes passing through the interlayer insulating layer 114, the second gate insulating layer 113 and the first gate insulating layer 112, respectively.

[0161] Although not shown separately, the display panel 1 may also include a storage capacitor disposed on the substrate layer SUB1.

[0162] The first protective layer 121 is disposed on the third conductive layer. Here, the first protective layer 121 is configured to cover the circuit unit including transistors Tdr and Tsw. The first protective layer 121 may also be disposed in at least a portion of the non-display area NDA. The first protective layer 121 may be a passivation layer or a planarization layer. The passivation layer may include SiO2, SiN xThe planarization layer may include materials such as acrylic or polyimide. The first protective layer 121 may include both a passivation layer and a planarization layer. In this case, the passivation layer may be disposed on the third conductive layer and the interlayer insulating layer 114, and the planarization layer may be disposed on the passivation layer. The upper surface of the first protective layer 121 may be planar.

[0163] A fourth conductive layer may be disposed on the first protective layer 121. The fourth conductive layer may include various conductive patterns, such as power lines, signal lines, and connection electrodes. In the accompanying drawings, a first connection pattern CE1 disposed in the display area DA is illustrated as part of the fourth conductive layer. The fourth conductive layer is formed of a conductive metallic material. For example, the fourth conductive layer may include aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo).

[0164] The first connection pattern CE1 can contact either the source electrode SDE2 or the drain electrode SDE1 of the first transistor Tdr through a contact hole passing through the first protective layer 121.

[0165] The second protective layer 122 is disposed on the fourth conductive layer. The second protective layer 122 can be a passivation layer or a planarization layer. The passivation layer can include SiO2 or SiN. x The planarization layer may include materials such as acrylic or polyimide. The second protective layer 122 may include both a passivation layer and a planarization layer.

[0166] Additionally, the second protective layer 122 may include an opening that exposes the upper portion of a portion of a component of the fourth conductive layer included in the fourth conductive layer. For example, the second protective layer 122 may include an opening that exposes at least a portion of the first connection pattern CE1.

[0167] In this specification, the substrate layer SUB1 to the second protective layer 122 are referred to as the pixel circuit layer.

[0168] Based on the display area DA, the display panel 1 may include a first partition wall PW1 and a second partition wall PW21, a first electrode ETL1 and a second electrode ETL21, a first insulating layer 131, a BNK, and a light-emitting element LD, sequentially disposed on the pixel circuit layer. Through subsequent processes following the inspection steps of the inspection apparatus according to this embodiment, the display panel 1a may further include a first contact electrode CNE1 and a second contact electrode CNE21, a second insulating layer 132, a third insulating layer 133, a fourth insulating layer 141, and a thin-film encapsulation layer 152 (see reference). Figure 34 ), and will be later Figure 34 The description is in the text.

[0169] Although the above-mentioned elements are shown in the accompanying drawings as being arranged directly and sequentially on the second protective layer 122, some elements may be omitted, or another element may be arranged between some elements.

[0170] The first separator wall PW1 and the second separator wall PW21 can be disposed on the pixel circuit layer (i.e., disposed on the second protective layer 122). The first separator wall PW1 and the second separator wall PW21 can protrude on the pixel circuit layer in the thickness direction (e.g., the third direction DR3). According to an embodiment, the first separator wall PW1 and the second separator wall PW21 can have substantially the same height, but are not limited thereto. For example, the protrusion height of the first separator wall PW1 and the second separator wall PW21 can be about 1.0 μm to 1.5 μm, respectively.

[0171] As an example, the first partition wall PW1 can be disposed between the pixel circuit layer and the first electrode ETL1. The second partition wall PW21 can be disposed between the pixel circuit layer and the second electrodes ETL21, ETL22 and ETL23.

[0172] According to embodiments, the first partition wall PW1 and the second partition wall PW21 can have various shapes. As an example, the first partition wall PW1 and the second partition wall PW21 can have a trapezoidal cross-sectional shape in which the width narrows towards the top, as shown in the figures. In this case, each of the first partition wall PW1 and the second partition wall PW21 can have an inclined surface on at least one side surface.

[0173] Although not shown, as another example, the first partition wall PW1 and the second partition wall PW21 may have a semi-circular or semi-elliptical cross-section in which the width narrows towards the top. In this case, each of the first partition wall PW1 and the second partition wall PW21 may have a curved surface on at least one side surface. That is, in this disclosure, the shape of the first partition wall PW1 and the second partition wall PW21 is not particularly limited and can be varied. In addition, according to embodiments, at least one of the first partition wall PW1 and the second partition wall PW21 may be omitted, or its position may be changed.

[0174] The first separator PW1 and the second separator PW21 may comprise an insulating material containing inorganic and / or organic materials. For example, the first separator PW1 and the second separator PW21 may comprise at least one inorganic layer, said at least one inorganic layer comprising various currently known SiN-containing materials. x SiO xInorganic insulating materials, etc. Optionally, the first separator PW1 and the second separator PW21 may include at least one organic layer, which includes various currently known organic insulating materials, photoresist layers, etc., or may be composed of a single layer or multiple layers of insulator comprising a combination of organic / inorganic materials. That is, the constituent materials of the first separator PW1 and the second separator PW21 can be varied.

[0175] In an embodiment, the first partition wall PW1 and the second partition wall PW21 can be used as reflective members. As an example, the first partition wall PW1 and the second partition wall PW21, together with the first electrode ETL1 and the second electrode ETL21 disposed thereon, can be used as reflective members to guide the light emitted from each light-emitting element LD in a desired direction to improve the light efficiency of the pixel PXL.

[0176] The first electrode ETL1 and the second electrode ETL21 can be respectively disposed on the first partition wall PW1 and the second partition wall PW21. The first electrode ETL1 and the second electrode ETL21 can be spaced apart from each other. The first electrode ETL1 and the second electrode ETL21 can be formed in the same layer.

[0177] As an example, the first electrode ETL1 and the second electrode ETL21, respectively disposed on the first partition wall PW1 and the second partition wall PW2, can have a shape corresponding to the shape of each of the first partition wall PW1 and the second partition wall PW21. For example, each of the first electrode ETL1 and the second electrode ETL21 can have an inclined surface or a curved surface corresponding to the first partition wall PW1 and the second partition wall PW21, and can protrude in the thickness direction of the display panel 1.

[0178] Each of the first electrode ETL1 and the second electrode ETL21 may include at least one conductive material. For example, each of the first electrode ETL1 and the second electrode ETL21 may include metals such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Ti and their alloys, conductive oxides such as ITO, IZO, ZnO and ITZO, and conductive polymers such as PEDOT, but is not limited thereto.

[0179] Furthermore, each of the first electrode ETL1 and the second electrode ETL21 can be constructed as a single layer or multiple layers. For example, each of the first electrode ETL1 and the second electrode ETL21 may include at least one reflective electrode layer. Additionally, each of the first electrode ETL1 and the second electrode ETL21 may selectively include at least one of at least one transparent electrode layer disposed on and / or below the reflective electrode layer and at least one conductive capping layer covering the upper portion of the reflective electrode layer and / or the transparent electrode layer.

[0180] According to an embodiment, the reflective electrode layer of each of the first electrode ETL1 and the second electrode ETL21 can be formed of an electrode material having a uniform reflectivity. As an example, the reflective electrode layer may include at least one metal such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and alloys thereof, but is not limited thereto. That is, the reflective electrode layer can be formed of various reflective electrode materials. When each of the first electrode ETL1 and the second electrode ETL21 includes a reflective electrode layer, light emitted from both ends (i.e., one end and the other end) of each of the light-emitting elements LD can be allowed to travel further in the direction of displaying the image (e.g., third-party DR3, front direction). Specifically, when the first electrode ETL1 and the second electrode ETL21 have inclined or curved surfaces corresponding to the shapes of the first partition wall PW1 and the second partition wall PW21 and are configured to face one end and the other end of each of the light-emitting elements LD, light emitted from one end and the other end of each of the light-emitting elements LD can be reflected by the first electrode ETL1 and the second electrode ETL21 and can travel further in the front direction of the display panel 1 (e.g., the third direction DR3 above the substrate layer SUB1). Therefore, the efficiency of light emitted from the light-emitting elements LD can be improved.

[0181] Furthermore, the transparent electrode layer of each of the first electrode ETL1 and the second electrode ETL21 can be formed from various transparent electrode materials. As an example, the transparent electrode layer may include ITO, IZO, or ITZO, but is not limited to these. In an embodiment, each of the first electrode ETL1 and the second electrode ETL21 can be configured as a three-layer structure with an ITO / Ag / ITO stack. As described above, when the first electrode ETL1 and the second electrode ETL21 are configured as at least two or more multilayers, the voltage drop due to signal delay (RC delay) can be minimized. Therefore, the desired voltage can be efficiently transmitted to the light-emitting element LD.

[0182] Furthermore, when each of the first electrode ETL1 and the second electrode ETL21 includes a conductive capping layer covering the reflective electrode layer and / or the transparent electrode layer, damage to the reflective electrode layers of the first electrode ETL1 and the second electrode ETL21 due to defects occurring in the manufacturing process of the pixel PXL can be prevented. However, according to an embodiment, the conductive capping layer may be selectively included in the first electrode ETL1 and the second electrode ETL21, and may be omitted. Additionally, the conductive capping layer may be considered as a component of each of the first electrode ETL1 and the second electrode ETL21, or as a separate component disposed on the first electrode ETL1 and the second electrode ETL21.

[0183] As an example, the second electrodes ETL21, ETL22, and ETL23 may be superimposed on the first connection pattern CE1 in at least a portion of the region. The second electrodes ETL21, ETL22, and ETL23 may contact the first connection pattern CE1 through the first contact hole CH passing through the second protective layer 122.

[0184] The first insulating layer 131 may be disposed in the display area DA on one region of the first electrode ETL1 and the second electrode ETL21. For example, the first insulating layer 131 may include an opening formed to cover one region of the first electrode ETL1 and the second electrode ETL21 and expose another region of the first electrode ETL1 and the second electrode ETL21.

[0185] In other words, the first insulating layer 131 can be placed between the first electrode ETL1 and the second electrode ETL21 and the light-emitting element LD, and at least one area of ​​each of the first electrode ETL1 and the second electrode ETL21 can be exposed. After the first electrode ETL1 and the second electrode ETL21 are formed, the first insulating layer 131 can be formed to cover the first electrode ETL1 and the second electrode ETL21 to prevent damage to the first electrode ETL1 and the second electrode ETL21 or metal deposition. In addition, the first insulating layer 131 can stably support each light-emitting element LD. According to an embodiment, the first insulating layer 131 can be omitted.

[0186] The light-emitting element LD can be supplied and aligned in the region between the first electrode ETL1 and the second electrode ETL21, where the first insulating layer 131 is disposed. For example, the light-emitting element LD can be supplied by an inkjet method, and the light-emitting element LD can be aligned between the first electrode ETL1 and the second electrode ETL21 by applying a predetermined alignment voltage (or alignment signal) to the first electrode ETL1 and the second electrode ETL21. Here, the ink used in the inkjet method may include a solvent and the light-emitting element LD, and the concentration of the light-emitting element LD in the ink may be a first concentration.

[0187] A dam BNK can be disposed on the first insulating layer 131. For example, a dam BNK can be formed between other sub-pixels to surround the sub-pixels. Figure 8 SPX1 to SPX3), and can form a pixel-defining layer that divides the emission area. The height of the embankment BNK can be higher than the height of the separator walls PW1 and PW21.

[0188] According to an embodiment, the dam BNK may not be located between unit pixels SSPX1 to SSPX3 in the same sub-pixels SPX1 to SPX3, but it is not limited thereto. Additionally, according to an embodiment, the dam BNK may be omitted.

[0189] Figure 11This is a block diagram schematically illustrating an inspection apparatus according to an embodiment of the present disclosure. Figure 12 This is a schematic diagram illustrating an inspection apparatus according to an embodiment of the present disclosure. Figure 13 This is a block diagram schematically illustrating a panel loading unit according to an embodiment of the present disclosure. Figure 14 This is a block diagram schematically illustrating the measurement unit and the repair unit according to an embodiment of the present disclosure. Figure 15 This is a schematic diagram illustrating the measurement unit and the repair unit according to an embodiment of the present disclosure.

[0190] Figure 12 The shape of the inspection device 2 shown is merely exemplary.

[0191] The inspection device 2 can inspect and repair the aforementioned display panel 1. Specifically, the inspection device 2 may include the function of measuring the alignment of the light-emitting elements LD in the display panel 1 and the function of increasing the alignment of the light-emitting elements LD in the display panel 1 by resetting the light-emitting elements LD.

[0192] Reference Figure 11 and Figure 12 The inspection device 2 includes a control unit 21 and a panel loading unit 22, a measuring unit 23, a repair unit 24, and a position adjustment unit 25, the operation of which is controlled by the control unit 21. In other words, the control unit 21 can control the overall operation of the panel loading unit 22, the measuring unit 23, the repair unit 24, and the position adjustment unit 25.

[0193] The control unit 21 can determine the alignment of the light-emitting element LD in the display panel 1 and determine whether the alignment is greater than or equal to a predetermined reference value. Additionally, the control unit 21 can move the positions of the panel loading unit 22, the measuring unit 23, and the repair unit 24 via the position adjustment unit 25. To measure the front surface of the display panel 1 securely placed on the panel loading unit 22, the panel loading unit 22 and / or the measuring unit 23 can be moved so that the measuring unit 23 directly faces the front surface of the display panel 1.

[0194] Will Figure 13 Together with reference, the panel loading unit 22 may include a panel moving unit 221 and an electric field forming unit 222.

[0195] The panel loading unit 22 can receive the display panel 1 as the object of inspection. As an embodiment, the panel loading unit 22 can be mounted on a table. The panel loading unit 22 can move the display panel 1 via the panel moving unit 221 while accommodating it, thereby repairing the entire area of ​​the display panel 1. The panel loading unit 22 can move in the X, Y, and Z axis directions. As an embodiment, the display panel 1 can be cut into individual units, which can be configured as a display device and accommodated in the panel loading unit 22.

[0196] The panel mounting unit 22 can generate an electric field through the electric field forming unit 222. The panel mounting unit 22 can generate an electric field EF (refer to) for measuring or rearranging the alignment of the light-emitting elements LD in the housed display panel 1. Figure 18 As an example, the electric field formed by the electric field forming unit 222 can be formed between the first electrode ETL1 and the second electrode ETL21.

[0197] As an example, the electric field forming unit 222 may include a generator for forming an electric field, an amplifier, and an oscilloscope for checking the electric field forming state.

[0198] Will Figure 14 and Figure 15 Referring to the above, the measuring unit 23 may be equipped with a moving tool (such as a guide frame) that can move along the X, Y, and Z axes on the panel loading unit 22, and may be formed into a frame structure that is approximately ruler-shaped, with the lower part of the frame structure being hollow, so that the display panel 1 housed in the panel loading unit 22 is positioned. Therefore, the measuring unit 23 can move left and right on the display panel 1 placed on the panel loading unit 22, and locate and move the predetermined inspection area ISA (refer to the above). Figure 17 ).

[0199] The measurement unit 23 may include a first light-emitting unit 231, a first filter unit 232a, a second filter unit 232b, and a light-receiving unit 233.

[0200] The first light-emitting unit 231 can generate and emit light. The first light-emitting unit 231 may include a first light source (not shown) that generates ultraviolet (UV) to visible light with wavelengths of about 10 nm to about 700 nm and a second light source (not shown) that generates infrared (IR) light with wavelengths of about 700 nm or greater. The control unit 21 can control the direction and intensity of the light generated from the first light source and the second light source.

[0201] According to an embodiment, the light generated from the first light source can have wavelengths in different regions depending on the type of color of the light emitted by the light-emitting element LD. For example, first light with a first wavelength range can be irradiated onto a first unit pixel SSPX1, which includes a light-emitting element LD emitting red light from the first light source; second light with a second wavelength range can be irradiated onto a second unit pixel SSPX2, which includes a light-emitting element LD emitting green light; and third light with a third wavelength range can be irradiated onto a third unit pixel SSPX3, which includes a light-emitting element LD emitting blue light.

[0202] As an example, each of the first light source and the second light source in the first light-emitting unit 231 may be selected from a mercury light source, a Fe-based metal halide light source, a Ga-based metal halide light source, and a semiconductor light source (laser, LED, etc.).

[0203] Light generated from the first light source and the second light source can pass through the first filter unit 232a and illuminate the predetermined inspection area ISA in the display panel 1.

[0204] When light with an energy band greater than or equal to the band gap of the active layer 12 is applied to each light-emitting element (LD), each LD can emit fluorescence (FL). That is, each LD can emit fluorescence by being illuminated by a first light source or a second light source. Additionally, each LD can emit excitation light after the application of light with an energy band greater than or equal to the band gap.

[0205] The fluorescence and excitation light emitted from each light-emitting element (LD) can pass through the second filter unit 232b and be collected by the light-receiving unit 233. Here, the second filter unit 232b may be a filter that blocks at least a portion of visible light in the wavelength range of about 400 nm to about 700 nm. As an example, the second filter unit 232b may transmit light of a specific color (specific wavelength band) from the fluorescence and excitation light emitted from each light-emitting element (LD).

[0206] The light receiving unit 233 can receive visual information about the fluorescence and excitation light emitted from each light-emitting element (LD). As an example, the light receiving unit 233 can be constructed in the form of a CCD camera, a pyrometer, or an infrared camera, but the embodiments are not limited thereto.

[0207] The repair unit 24 may include a second light-emitting unit 241 and an inkjet device unit 242.

[0208] The second light-emitting unit 241 can be a light source and can generate light. The second light-emitting unit 241 may include a third light source (not shown) that generates ultraviolet (UV) to visible light with wavelengths of about 10 nm to about 700 nm. As an embodiment, the third light source of the second light-emitting unit 241 may be selected from mercury light sources, Fe-based metal halide-based light sources, Ga-based metal halide-based light sources, and semiconductor light sources (lasers, LEDs, etc.).

[0209] Light generated from a third light source can cause the light-emitting element (LD) to deflect and rearrange.

[0210] In this embodiment, the first light source and the third light source are described as separate components included in different first light-emitting units 231 and second light-emitting units 241, but are not limited thereto. In another embodiment, the first light source of the first light-emitting unit 231 may be a single light source that simultaneously performs the function of the third light source. In this case, the measurement unit 23 may include some of the functions of the repair unit 24, and the repair unit 24 may include inkjet facility unit 242 in addition to the second light-emitting unit 241.

[0211] The inkjet facility unit 242 can provide ink including a light-emitting element (LD). As an example, the ink included in the inkjet facility unit 242 may include a solvent and a light-emitting element (LD), and the concentration of the light-emitting element (LD) in the ink may be a second concentration lower than the first concentration described above.

[0212] Next, a method for the inspection device 2 to inspect and repair the display device will be described. Specifically, the following method relates to a method by which the inspection device 2 inspects and repairs the display panel 1 included in the display device.

[0213] Figure 16 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to an embodiment of the present disclosure. Figure 17 It shows the description Figure 16 A concept diagram of the display panel for some of the steps. Figure 18 It is shown Figure 16 A cross-sectional view of the display panel showing some of the steps. Figure 19 It shows the description Figure 16 A conceptual diagram of the inspection area for some steps. Figure 20 It shows the description Figure 16 A conceptual diagram of the light-emitting element for some of the steps. Figure 21 It shows the description Figure 16 Image of the inspection area for some steps. Figure 22 It shows the description Figure 16 A concept diagram of the display panel for some of the steps.

[0214] Figure 23It is shown Figure 16 A cross-sectional view of the display panel showing some of the steps. Figure 24 It shows the description Figure 16 A conceptual diagram of the light-emitting element for some of the steps.

[0215] Reference Figure 16 As an example, the method of the inspection device 2 to inspect and repair the display device includes the steps of inputting the display panel 1 to the inspection device 2 (S110), the inspection area designation step (S120), the measurement position control step (S130), the electric field formation and light illumination step on the panel (S140), the image acquisition step (S150), the image analysis step (S160), the alignment determination step (S170), and the rearrangement step (S200).

[0216] In this specification, although the steps are described as being performed sequentially according to the flowchart, it is apparent that, unless the spirit of the disclosure is altered, some steps shown as being performed sequentially may be performed simultaneously, the order of the steps may be changed, some steps may be omitted, or another step may be included between the steps.

[0217] First, the step of inputting display panel 1 into inspection device 2 (S110) can be performed. This step (S110) corresponds to the step of housing display panel 1 in panel loading unit 22. Control unit 21 can control loading unit 22 via position adjustment unit 25 to move panel loading unit 22. Panel loading unit 22 can be moved to facilitate inspection and repair while housing inspection device 2.

[0218] Next, the inspection area designation step (S120) can be performed. The inspection area designation step (S120) corresponds to the step of pre-designating the inspection area ISA for checking the alignment of the light-emitting elements LD in the display panel 1. Figure 17 Referring together, at least a portion of the display area can be set as an inspection area ISA. As an example, the inspection area ISA can be set to include at least one unit pixel. For example, the inspection area ISA can be set to include unit pixels SSPX1, SSPX2, and SSPX3 (see reference). Figure 9 Each unit pixel SSPX1, SSPX2, and SSPX3 includes a light-emitting element LD that emits light of the same color. Although the inspection area ISA is shown as a quadrilateral shape in the accompanying drawings, the inspection area is not limited to this, and the shape of the inspection area ISA can be various.

[0219] Next, the measurement position control step (S130) can be executed. The measurement position control step (S130) corresponds to the step of controlling the measurement unit 23 to measure the set inspection area ISA. As an example, the control unit 21 can control the measurement unit 23 to move the measurement unit 23 via the position adjustment unit 25. The measurement unit 23 can be moved to be positioned on the inspection area ISA to facilitate measurement of the inspection area ISA in the display panel 1. According to an embodiment, the repair unit 24 can move together with the measurement unit 23.

[0220] Next, the electric field formation and light illumination step on the panel can be performed (S140). The electric field formation and light illumination step on the panel (S140) corresponds to the following steps: the control unit 21 forms an electric field in the display panel 1 through the panel loading unit 22, and the first light-emitting unit 231 in the measurement unit 23 illuminates the inspection area ISA in the display panel 1 with light formed by the first light source.

[0221] Will Figure 18 Referring to the above, in this step, an electric field EF can be formed in the inspection area ISA of the display panel 1. Additionally, light generated by the first light source can illuminate the inspection area ISA of the display panel 1. In some embodiments, when an electric field EF is formed in the inspection area ISA of the display panel 1 and light generated by the first light source is illuminating it, the mobility of the light-emitting element LD can be increased.

[0222] As an example, the electric field formation and light irradiation steps on the display panel 1 can be performed while the surface of the display panel 1 is not dry (S140). That is, after performing the inkjet method to manufacture the display panel 1, the electric field formation and light irradiation steps on the panel can be performed while the ink is not dry (S140).

[0223] Next, the image acquisition step (S150) can be performed. The image acquisition step (S150) corresponds to the following steps: the measurement unit 23 measures the light reflected from the inspection area ISA in the display panel 1 (fluorescence and excitation light emitted by the light-emitting element LD) by the light receiving unit 233, and the control unit 21 acquires an image by imaging the information about the collected reflected light (fluorescence and excitation light emitted by the light-emitting element LD).

[0224] Next, the image analysis step (S160) can be performed. The image analysis step (S160) corresponds to the step in which the control unit 21 checks the alignment of the light-emitting element LD in the region ISA through the acquired image analysis.

[0225] Will Figure 19Together, when light generated by the first light source is shone onto the light-emitting elements (LDs), each LD can emit fluorescence and excitation light. For ease of description, the term "fluorescence" in the following text includes both fluorescence and excitation light.

[0226] At this time, in the light-emitting element LD, a first fluorescence LT1 can be emitted from the first semiconductor layer 11, a second fluorescence LT2 can be emitted from the active layer 12, and a third fluorescence LT3 can be emitted from the second semiconductor layer 13. As an example, the intensity of the second fluorescence LT2 is greater than that of the first fluorescence LT1 and the third fluorescence LT3. Therefore, an image of the actual inspection area ISA (refer to...) is measured therein. Figure 21 In the first semiconductor layer 11, the second fluorescence LT2 emitted from the active layer 12 can be observed relatively brightly, while the first fluorescence LT1 emitted from the first semiconductor layer 11 and the third fluorescence LT3 emitted from the second semiconductor layer 13 can be observed or not observed in a relatively dark environment.

[0227] Will Figure 20 and Figure 21 By referring to the same point, it can be determined whether the light-emitting element LD is disposed between the first electrode ETL1 and the second electrode ETL21 in the forward or reverse direction, with the first semiconductor layer 11 and the second semiconductor layer 13 being disposed therebetween, by observing the second fluorescence LT2 emitted from the active layer 12 in a relatively bright manner and by the point where the first length L1 of the first semiconductor layer 11 and the second length L2 of the second semiconductor layer 13 are different.

[0228] As an example in the accompanying drawings, the control unit 21 can determine that some of the first light-emitting elements LD1, second light-emitting element LD2, third light-emitting element LD3, and fifth light-emitting element LD5, which are arranged sequentially, are arranged in the positive direction, and the remaining fourth light-emitting element LD4 is arranged in the opposite direction. Furthermore, the control unit 21 can measure the alignment based on the ratio of the number of light-emitting elements LDs arranged in the positive direction to the number of light-emitting elements LDs arranged in the inspection area ISA. For example, in Figure 20 and Figure 21 In the example, the alignment is 80%.

[0229] Next, the alignment determination step (S170) can be performed. The alignment determination step (S170) corresponds to the following steps: when the measured alignment is greater than or equal to the predetermined reference value, the control unit 21 determines that the inspection is over, and when the alignment is less than the predetermined reference value, the control unit 21 performs repair.

[0230] When the control unit 21 determines in the alignment determination step (S170) that the measured alignment is less than a predetermined reference value, it may execute the rearrangement step (S200). The rearrangement step (S200) is a step to repair the display panel 1, and corresponds to the step of rearranging the light-emitting elements LD, which are arranged in opposite directions in the predetermined repair area LA, in the forward direction. Figure 22 Referring to this example, at least a portion of the repair area LA can be pre-defined to include the inspection area ISA.

[0231] Will Figure 23 and Figure 24 Referring to the same reference, the second light-emitting unit 241 of the repair unit 24 can illuminate the inspection area ISA with light generated from the third light source. Additionally, the panel mounting unit 22 can form an electric field EF in the display panel 1 via the electric field forming unit 222. That is, while the panel mounting unit 22 forms an electric field in the display panel 1 to rearrange the light-emitting elements LD, the repair unit 24 can illuminate the inspection area ISA with light generated from the third light source. For example, in Figure 23 In the middle, the sectional view shows Figure 20 The fourth light-emitting element LD4 is set in the opposite direction.

[0232] When an electric field EF is formed in the fourth light-emitting element LD4 arranged in opposite directions, and light generated by the third light source is irradiated, the fourth light-emitting element LD4 arranged in opposite directions can interact with... Figure 24 The fourth light-emitting element, LD4_1, is oriented in the same positive direction.

[0233] After performing the rearrangement step (S200), the electric field formation and light illumination step, image acquisition step (S150) and image analysis step (S160) can be performed on the display panel 1 again, and the check and repair can be repeated so that the alignment is greater than or equal to the reference value.

[0234] Additionally, after completing the inspection and repair of the corresponding inspection area ISA, the above steps can be repeated by setting a new inspection area ISA for a region in the display area that differs from the inspection area ISA. Therefore, the inspection and repair of the entire display area DA can be completed.

[0235] Next, an inspection apparatus according to another embodiment, a method for inspecting a display device using the inspection apparatus, and a method for repairing a display device will be described. In the following text, terms such as... Figures 1 to 24 The same components are described in the accompanying drawings, and the same or similar reference numerals are used.

[0236] Figure 25 and Figure 26This is a conceptual diagram of a display panel illustrating some steps of a method for inspecting and repairing a display device according to another embodiment of the present disclosure. Figure 25 and Figure 26 Each embodiment in Figure 22 The corresponding modification example.

[0237] Reference Figure 25 According to the embodiment, the inspection area ISA and the repair area LA can be the same area. That is, the area of ​​the display panel 1 inspected by the measurement unit 23 and the area of ​​the display panel 1 repaired by the repair unit 24 can be the same.

[0238] Reference Figure 26 According to an embodiment, the display area DA, the inspection area ISA, and the repair area LA can be the same area. For example, the measurement unit 23 can inspect the entire display area DA in the display panel 1, and the repair unit 24 can repair the entire display area DA in the display panel 1.

[0239] Figure 27 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure. Figure 28 It shows the description Figure 27 A conceptual diagram of the inspection area for some steps. Figure 29 It is used to describe Figure 27 A cross-sectional view of the display panel showing some of the steps. Figure 30 It shows the description Figure 27 A conceptual diagram of the inspection area for some steps.

[0240] Reference Figure 27 According to the embodiment, in addition to the steps of inputting the display panel 1 to the inspection device 2 (S110), the inspection area designation step (S120), the measurement position control step (S130), the electric field formation and light illumination step on the panel (S140), the image acquisition step (S150), the image analysis step (S160), the alignment determination step (S170), and the rearrangement step (S200), the method of the inspection device 2 for inspecting and repairing the display device may also include the light-emitting element density determination step (S310) and the light-emitting element input step (S320).

[0241] In the image analysis step (S160), the light-emitting element density, defined by the number of light-emitting elements (LDs) per predetermined unit area, can be further analyzed using the image obtained by the control unit 21. As an example, the unit area may be the same as the inspection area ISA.

[0242] As an example, the light-emitting element density determination step (S310) can be performed after the image analysis step (S160) and before the alignment determination step (S170). In the light-emitting element density determination step (S310), it can be determined whether the analyzed light-emitting element density is greater than or equal to a predetermined reference value.

[0243] In the light-emitting element density determination step (S310), when the control unit 21 determines that the light-emitting element density is greater than or equal to a predetermined reference value, the control unit 21 may determine to execute the alignment determination step (S170), and when the control unit 21 determines that the light-emitting element density is less than the predetermined reference value, the control unit 21 may determine to execute the light-emitting element input step (S320).

[0244] Reference Figures 28 to 30 ,like Figure 28 As shown, when the control unit 21 determines that the light-emitting element density is less than a predetermined reference value, the control unit 21 may determine to execute the light-emitting element input step (S320). In the light-emitting element input step (S320), as... Figure 29 As shown, the control unit 21 can form an electric field EF in the display panel 1 via the panel loading unit 22, and can input ink including a light-emitting element LD with a second concentration into the display panel 1 via the inkjet device unit 242 using an inkjet method. Figure 30 As shown, the light-emitting element density can be increased by inputting the light-emitting element LD to the display panel 1.

[0245] After performing the light-emitting element input step (S320), the electric field formation and light illumination steps (S140), image acquisition step (S150), and image analysis step (S160) on the panel can be performed again, and the checks and repairs can be repeated to ensure that the light-emitting element density is greater than or equal to the reference value.

[0246] Figure 31 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0247] Reference Figure 31 The method for inspecting and repairing a display device according to this embodiment is similar to... Figure 27 The difference in this embodiment is that the light-emitting element density determination step (S310) and the light-emitting element input step (S320) are performed after the alignment determination step (S170) and the rearrangement step (S200). Because this embodiment differs from... Figure 27 The only difference in the embodiments is the change in the order of some steps, so other repeated descriptions are omitted.

[0248] Figure 32This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0249] Reference Figure 32 The method for inspecting and repairing a display device according to this embodiment is similar to... Figure 31 The difference in the embodiments is that the method for inspecting and repairing the display device according to this embodiment further includes a position information storage step (S410) and a drying step (S420) between the light-emitting element density determination step (S310) and the light-emitting element input step (S320).

[0250] When the light-emitting element density in the inspection area ISA is determined to be less than the reference value in the light-emitting element density determination step S310, the control unit 21 may not immediately perform the light-emitting element LD input step, but may instead control the execution of the position information storage step (S410). The position information storage step (S410) corresponds to the step in which the control unit 21 stores the position information of the corresponding inspection area ISA.

[0251] After the location information storage step (S410), a drying step (S420) can be performed. The drying step (S420) corresponds to the step of drying the ink with a first concentration that was input during the manufacturing of the display panel 1.

[0252] After the drying step (S420), the light-emitting element input step (S320) can be performed. In some embodiments, the display device may perform the light-emitting element input step (S320) after the alignment check and repair for the entire display area DA is completed.

[0253] Figure 33 This is an algorithm flowchart illustrating a method for inspecting and repairing a display device according to another embodiment of the present disclosure.

[0254] Reference Figure 33 The method for inspecting and repairing a display device according to this embodiment is similar to... Figure 32 The difference in the embodiment is that after the light-emitting element input step (S320), the electric field formation and light irradiation step (S140), the image acquisition step (S150), and the image analysis step (S160) are performed on the display panel 1 again.

[0255] After the light-emitting element input step (S320), the electric field formation and light illumination steps (S140), image acquisition step (S150), and image analysis step (S160) are performed on the display panel 1 again, so that the alignment and light-emitting element density are greater than or equal to the reference value.

[0256] Next, a display panel manufactured according to a subsequent process following the inspection method and repair method performed by the inspection apparatus according to the above embodiments will be described.

[0257] Figure 34 Is along with Figure 9 A cross-sectional view of the display panel, taken from the portion corresponding to line I-I'. Figure 34 The cross-section of the display panel 1a shown in the image illustrates the shape manufactured by subsequent processes after performing the inspection method and repair method of the inspection apparatus according to the foregoing embodiment.

[0258] Reference Figure 34 ,and Figure 10 Compared to the display panel 1, the display panel 1a to which subsequent processes are performed may further include a first contact electrode CNE1 and a second contact electrode CNE21, a second insulating layer 132, a third insulating layer 133, a fourth insulating layer 141, and a thin film encapsulation layer 152.

[0259] Each of the light-emitting elements (LDs) can be electrically connected between a first electrode ETL1 and a second electrode ETL21. For example, the first end of each of the light-emitting elements (LDs) can be electrically connected to the first electrode ETL1, and the second end of each of the light-emitting elements (LDs) can be electrically connected to the second electrode ETL21.

[0260] In one embodiment, the first end of each of the light-emitting elements (LDs) may not be directly disposed on the first electrode ETL1, and may be electrically connected to the first electrode ETL1 via at least one contact electrode (e.g., the first contact electrode CNE1). However, this disclosure is not limited thereto. For example, in another embodiment of this disclosure, the first end of the light-emitting element (LD) may be in direct contact with the first electrode ETL1 to be electrically connected to the first electrode ETL1.

[0261] Similarly, the second end of each of the light-emitting elements LD may not be directly disposed on the second electrode ETL21, and may be electrically connected to the second electrode ETL21 through at least one contact electrode (e.g., the second contact electrode CNE21). However, this disclosure is not limited thereto. For example, in another embodiment of this disclosure, the second end of each of the light-emitting elements LD may be in direct contact with the second electrode ETL21 to be electrically connected to the second electrode ETL21.

[0262] The second insulating layer 132 can be disposed on the light-emitting element LD (particularly, the light-emitting element LD aligned between the first electrode ETL1 and the second electrode ETL21), and can expose the first and second ends of the light-emitting element LD. For example, the second insulating layer 132 may not cover the first and second ends of the light-emitting element LD, and may be partially disposed on only one region of the light-emitting element LD. The second insulating layer 132 can be formed in an independent pattern in each emitting region, but is not limited thereto. Additionally, as... Figure 34 As shown, when there is a separation space between the first insulating layer 131 and the light-emitting element LD before the second insulating layer 132 is formed, this space can be filled by the second insulating layer 132. Therefore, the light-emitting element LD can be supported more stably.

[0263] The third insulating layer 133 may be formed to cover a portion of one of the first contact electrode CNE1 and the second contact electrode CNE21. As an embodiment, the first contact electrode CNE1 and the second contact electrode CNE21 may be formed on different layers. For example, the third insulating layer 133 may be configured to cover the second contact electrode CNE21, and the first contact electrode CNE1 may be disposed on the third insulating layer 133. However, the embodiment is not limited to this; the third insulating layer 133 may be configured to cover the first contact electrode CNE1, and the second contact electrode CNE21 may be disposed on the third insulating layer 133. Additionally, in another embodiment, the third insulating layer 133 may be omitted, and the first contact electrode CNE1 and the second contact electrode CNE21 may be formed on the same layer.

[0264] The fourth insulating layer 141 may be formed and / or disposed on a surface of the substrate layer SUB1 on which the first partition wall PW1 and the second partition wall PW21, the first electrode ETL1 and the second electrode ETL2, the light-emitting element LD, the first contact electrode CNE1 and the second contact electrode CNE21 and the embankment BNK are disposed, so as to cover the first partition wall PW1 and the second partition wall PW21, the first electrode ETL1 and the second electrode ETL2, the light-emitting element LD, the first contact electrode CNE1 and the second contact electrode CNE21 and the embankment BNK.

[0265] A thin-film encapsulation layer 152, comprising at least one inorganic and / or organic layer, may be disposed on the fourth insulating layer 141. Additionally, according to an embodiment, at least one outer coating layer (not shown) may also be disposed on the fourth insulating layer 141.

[0266] Although embodiments of the present disclosure have been described with reference to the accompanying drawings, those skilled in the art will understand that embodiments may be implemented in other specific forms without altering the technical spirit and essential characteristics of the present disclosure. Therefore, it should be understood that the above embodiments are illustrative and not restrictive in all respects.

Claims

1. A method for inspecting a display panel in an inspection apparatus, the inspection apparatus being used to inspect the display panel having light-emitting elements, the method comprising: "Electric field formation and light irradiation steps on the panel" involve forming an electric field in the display panel and irradiating a predetermined inspection area in the display panel with light formed by a first light source included in the first light-emitting unit. "Image acquisition step" refers to acquiring an image of the display panel; as well as "Alignment determination step" determines the alignment of the light-emitting element in the display panel.

2. The method according to claim 1, wherein, The light-emitting element is input into the display panel by an inkjet method that inputs ink of a first concentration into the light-emitting element, and The "electric field formation and light irradiation step on the panel" is performed while the ink input to the display panel is still wet.

3. The method according to claim 1, wherein, The light generated by the first light source is ultraviolet light.

4. The method according to claim 3, wherein, The first light-emitting unit includes the first light source and the second light source that generates infrared radiation.

5. The method according to claim 1, wherein, The "image acquisition step" is performed after the "electric field formation and light illumination step on the panel".

6. The method according to claim 5, wherein, The "image acquisition step" is a step of acquiring an image by collecting the fluorescence and excitation light emitted through the light-emitting element and imaging the collected information.

7. A method for repairing a display panel, the method comprising: "Electric field formation and light irradiation steps on the panel" involve forming an electric field in a display panel equipped with light-emitting elements and irradiating a predetermined inspection area in the display panel with light generated by a light source included in the first light-emitting unit. "Image acquisition step" refers to acquiring an image of the display panel; as well as "Rearrangement Step" refers to rearranging the light-emitting element.

8. The method according to claim 7, wherein, The "rearrangement step" is a step in which light generated by a third light source included in the second light-emitting unit is irradiated onto a predetermined repair area in the display panel while the electric field is formed in the display panel.

9. The method according to claim 8, wherein, The light generated by the third light source is ultraviolet light.

10. The method according to claim 7, further comprising: "Alignment determination step" determines the alignment of the light-emitting element in the display panel using the image.

11. The method according to claim 10, wherein, The "rearrangement step" is performed based on the result of comparing the alignment with a predetermined reference value in the "alignment determination step".

12. The method according to claim 10, wherein, The alignment determination step is performed again after the rearrangement step.

13. The method according to claim 10, further comprising: "Light-emitting element density determination step" involves determining the density of the light-emitting elements in the display panel using the image.

14. The method according to claim 13, further comprising: In the "Light Emitting Element Input Step", the light emitting element is further input into the display panel based on the result of comparing the density of the light emitting element with a predetermined reference value in the "Light Emitting Element Density Determination Step".

15. The method according to claim 14, further comprising: The "location information storage step" stores location information about the corresponding area based on the result of comparing the density of the light-emitting element with the predetermined reference value in the "light-emitting element density determination step". as well as The "drying step" involves drying the ink, which is incorporated into the light-emitting element at a first concentration during the manufacture of the display panel.

16. The method according to claim 15, wherein, The "light-emitting element input step" is the step of inputting ink, including a second concentration of light-emitting element with a lower concentration than the first concentration, into the display panel.

17. An inspection apparatus for inspecting and repairing a display panel provided with light-emitting elements, the inspection apparatus comprising: A panel loading unit is configured to accommodate the display panel, the panel loading unit including: an electric field forming unit configured to form an electric field in the display panel; The measuring unit is configured to inspect the display panel; The repair unit is configured to repair the display panel; The position adjustment unit is configured to move the panel loading unit, the measuring unit, and the repair unit; and The control unit is configured to control the panel loading unit, the measuring unit, the repair unit, and the position adjustment unit.

18. The inspection apparatus according to claim 17, wherein, The measurement unit includes: The first light-emitting unit includes a first light source for generating ultraviolet to visible light; and The light receiving unit is configured to collect fluorescence and excitation light emitted by the light-emitting element when illuminated by light generated by the first light source.

19. The inspection apparatus according to claim 18, wherein, The measurement unit also includes: A first filter unit, through which the light generated by the first light source passes; and The second filter unit through which the fluorescence and the excitation light pass.

20. The inspection apparatus according to claim 18, wherein, The first light-emitting unit also includes a second light source for generating infrared light.

21. The inspection apparatus according to claim 18, wherein, The repair unit includes a second light-emitting unit, which includes a third light source for generating ultraviolet to visible light.

22. The inspection apparatus according to claim 21, wherein, The repair unit further includes an inkjet facility unit configured to supply ink, including light-emitting elements, to the display panel.

23. The inspection apparatus according to claim 18, wherein, Each light-emitting element includes: The first semiconductor layer comprises an n-type semiconductor material; The second semiconductor layer includes a p-type semiconductor material; and An active layer is disposed between the first semiconductor layer and the second semiconductor layer and is formed in the form of a quantum well structure.

24. The inspection apparatus according to claim 23, wherein, The length of the first semiconductor layer is longer than the length of the second semiconductor layer, and The amount of fluorescence and excitation light emitted from the active layer is greater than the amount of fluorescence and excitation light formed in the first semiconductor layer and the second semiconductor layer, respectively.

25. The inspection apparatus according to claim 17, wherein, The panel loading unit also includes: A panel moving unit is configured to move the display panel.

Images