Exposure apparatus, exposure method, and method of manufacturing the article

Abstract

This invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article. An exposure apparatus is provided that illuminates a master plate with light from a light source and performs scanning exposure by exposing a pattern of the master plate onto the substrate while moving the substrate in a scanning direction. The exposure apparatus performs linked exposures such that areas exposed by a first exposure and areas exposed by a second exposure partially overlap. The exposure apparatus includes: a projection optical system that projects the pattern of the master plate onto the substrate; a light shield that blocks a portion of the light exposed in at least one of the first and second exposures; and a plurality of adjustment units that apply force to the light shield to adjust the amount of light blocked by the light shield. The plurality of adjustment units are configured to be asymmetrical relative to the optical axis of the projection optical system and along a straight line in the scanning direction when no force is applied to the light shield.

Description

Technical Field

[0001] This invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article. Background Technology

[0002] In the manufacture of liquid crystal panels, organic EL displays, or semiconductor devices, scanning exposure apparatuses are used that simultaneously move a substrate and a master image while exposing the pattern of the master image onto a substrate coated with resist via a projection optical system. In recent years, to address the increasing exposure area associated with the enlargement of substrates, there is a demand for forming a pattern over an area (partial area) larger than the area of ​​the pattern on the master image using a single scan exposure. As a method for this, Japanese Patent Application Publication No. 11-317366 proposes an exposure method based on linked exposure, which involves repeatedly exposing multiple partial areas in a non-scanning direction orthogonal to the scanning direction.

[0003] When performing linked exposures, it is important to reduce the deviation in the cumulative exposure within the linked areas that overlap in adjacent regions. Japanese Patent Application Publication No. 2017-053888 discloses the following: a variable slit capable of adjusting the illumination shape is disposed between the projection optical system and the original image; by adjusting the amount of light passing through the variable slit, the cumulative exposure within the linked areas can be made uniform. Summary of the Invention

[0004] However, even when using the variable slit disclosed in Japanese Patent Application Publication No. 2017-053888, it is still impossible to completely uniformize the deviation in the cumulative exposure within the connecting area when the adjustment unit for adjusting the variable slit is not correspondingly positioned at the center of the non-scanning direction of the connecting area. Furthermore, the connecting area is determined according to the layout of the panel to be produced, so it is impossible to position the adjustment unit in a way that is optimal for all layouts. Increasing the number of adjustment units can, to some extent, accommodate various layouts, but there are limitations such as placement space. Therefore, even when using a variable slit, deviations may occur in the cumulative exposure within the connecting area, resulting in decreased exposure accuracy.

[0005] Therefore, the object of the present invention is to provide an exposure apparatus that is advantageous in terms of the accuracy of the linked exposure.

[0006] To achieve the above objectives, an exposure apparatus according to one aspect of the present invention is an exposure apparatus that illuminates a master plate with light from a light source and performs scanning exposure by exposing the pattern of the master plate to the substrate while moving the substrate in a scanning direction. The exposure apparatus performs linked exposures such that the area exposed by a first exposure and the area exposed by a second exposure partially overlap. The exposure apparatus is characterized by having: a projection optical system that projects the pattern of the master plate onto the substrate; a light shield that blocks a portion of the light exposed by at least one of the first and second exposures; and a plurality of adjustment units that apply force to the light shield to adjust the amount of light blocked by the light shield. The plurality of adjustment units are configured to be asymmetrical relative to the optical axis of the projection optical system and along a straight line in the scanning direction when no force is applied to the light shield.

[0007] Further features of the invention will become apparent from the following description of exemplary embodiments (with reference to the accompanying drawings). Attached Figure Description

[0008] Figure 1 This is a schematic diagram showing the structure of the exposure apparatus.

[0009] Figure 2 This is a diagram used to illustrate the connection and exposure.

[0010] Figure 3 This is a diagram showing the structure of the slit in the first embodiment.

[0011] Figure 4 This is a diagram showing the connection exposure in the first embodiment.

[0012] Figure 5 This is a flowchart illustrating the sequence of connection exposures in the first embodiment.

[0013] Figure 6 This is a diagram showing the structure of the exposure adjustment plate in the second embodiment.

[0014] Symbol Explanation

[0015] 3: Original; 4: Projection optical system; 5: Light source; 9: Slit; 16: Substrate; 19: Exposure adjustment plate; 21c: Adjustment part; 22a: First exposure area; 22b: Second exposure area; 100: Exposure device. Detailed Implementation

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the drawings, the same reference numerals are used for the same components, and repeated descriptions are omitted.

[0017] <First Implementation>

[0018] The structure of the exposure apparatus in this embodiment will be explained. The exposure apparatus in this embodiment is a photolithography apparatus used in the photolithography process of manufacturing devices such as semiconductor devices and FPDs. The exposure apparatus in this embodiment performs an exposure process that transfers the pattern of the original plate to the substrate by exposing the original plate to the substrate through the original plate having a patterned surface.

[0019] Figure 1 This is a schematic diagram of the exposure apparatus 100 in this embodiment. In this embodiment, the direction parallel to the optical axis of the projection optical system 4 is defined as the Z direction, and any plane perpendicular to the Z-axis direction is defined as the XY plane to define the coordinate system. In addition, the scanning direction that moves the substrate 16 during scanning exposure using the exposure apparatus 100 is defined as the Y direction, and the non-scanning direction orthogonal to the scanning direction is defined as the X direction.

[0020] The exposure apparatus 100 includes an illumination optical system 1, an alignment observation instrument 2 for detecting alignment marks between the original plate 3 and the substrate 16, an original plate stage 27, a projection optical system 4, an exposure adjustment plate 19, a substrate stage 17, a control unit 20, and an acquisition unit 26. The illumination optical system 1 may include, for example, a light source 5, condenser lenses 6 and 8, a compound eye lens 7, a slit 9 (light-shielding plate), an imaging optical system 10, and a plane mirror 11. The light source 5 may include, for example, a mercury lamp or an elliptical mirror. The slit 9 is disposed between the light source 5 and the original plate 3, allowing only light incident on the opening of the slit from the light emitted from the light source 5 to pass through, thus defining the illumination range. The imaging optical system 10 includes multiple mirrors arranged such that the light passing through the slit 9 is imaged onto the original plate 3. The plane mirror 11 bends the light path in the illumination optical system 1.

[0021] The projection optical system 4 uses the illumination optical system 1 to project the pattern of the original plate 3, held on the original plate stage 27, onto the substrate 16, held on the substrate stage 17. The original plate 3 is positioned at the object plane of the projection optical system 4, and the substrate 16 is positioned at the image plane of the projection optical system 4. In this embodiment, the projection optical system 4 can be either an equal-magnification imaging optical system that projects the pattern of the original plate 3 onto the substrate 16 at an equal scale, or it can be a magnification imaging optical system or a reduction imaging optical system.

[0022] The pattern of the original plate 3, illuminated by the illumination optical system 1, is imaged onto the substrate 16 via the first parallel plate 13a, plane mirror 14, concave mirror 12, convex mirror 15, concave mirror 12, plane mirror 14, and second parallel plate 13b of the projection optical system 4. A light intensity sensor 18 (detection unit) for measuring exposure is disposed on the substrate stage 17 used to drive the substrate 16.

[0023] An exposure adjustment plate 19 is disposed between the projection optical system 4 and the substrate 16, and is configured to block a portion of the light emitted from the projection optical system 4. The exposure adjustment plate 19 may be made of metal, for example. The exposure adjustment plate 19 has a mechanism movable in the non-scanning direction (X direction) and is capable of controlling the exposure amount. The control unit 20 includes a CPU and a memory, and performs overall control of the exposure apparatus 100.

[0024] In the exposure apparatus 100 of this embodiment, it is envisioned that the substrate 16 is exposed using an exposure mode called linked exposure. Figure 2 This diagram illustrates the process of connecting exposures.

[0025] Figure 2 (a) is a diagram showing the process (first exposure) in which the first exposure region 22a in the substrate 16 is exposed. Figure 2 In (a), the original 3 and the substrate 16 are moved synchronously in the scanning direction (Y direction) while the first exposure area 22a is exposed using the exposed light 23.

[0026] Figure 2 (b) is a diagram showing the process (second exposure) after the first exposure area 22a has been exposed. Figure 2 In (b), the original image 3 and the substrate 16 are moved synchronously in the non-scanning direction (X direction). At this time, no exposure is performed. The amount of movement of the original image 3 and the substrate 16 in the non-scanning direction is determined in a way that partially overlaps the first exposure area 22a and the second exposure area that will be exposed in the next exposure.

[0027] Figure 2 (c) is a diagram illustrating the process of exposing the second exposure region 22b in substrate 16. Figure 2 In step (c), while the original image 3 and the substrate 16 are moved synchronously in the scanning direction (Y direction), the second exposure area 22b is exposed using the exposed light 23. Here, the second exposure area 22b is exposed such that a portion overlaps with the first exposure area 22a, thus forming a connecting area 24 (the area repeatedly exposed in the connecting exposure) where the first exposure area 22a and the second exposure area 22b partially overlap. Furthermore, in this embodiment, multiple scan exposures are sufficient, so it is not limited to two scan exposures; exposure can also be performed by three or more scan exposures.

[0028] Figure 2 (d) is a graph showing the cumulative exposure amount through the connection exposure. Cumulative exposure amount refers to the cumulative value of the exposure amount applied to the substrate. Figure 2(d) shows the cumulative exposure in the non-scanning direction (X direction) at a location in the Y direction of the first exposure region 22a and the second exposure region 22b. The vertical axis of the graph represents the cumulative exposure, and the horizontal axis represents the position in the X direction. Since exposure is repeatedly performed in the connecting region 24 during the first and second exposures, it is necessary to reduce the exposure in the connecting region 24 to make the cumulative exposure of the exposed area more uniform. For example, by inserting the exposure adjustment plate 19 along the non-scanning direction (X direction) into the optical path between the projection optical system 4 and the substrate 16, the exposure in the connecting region 24 can be reduced. The control unit 20 controls the driving of the exposure adjustment plate 19. The exposure in the connecting region 24 can be adjusted according to the magnitude of the driving of the exposure adjustment plate 19. The exposure adjustment plate 19 can utilize its edge extending in a direction intersecting the scanning direction (Y direction) to make the cumulative exposure of the connecting region 24 exposed in the first and second exposures the same as that of the areas outside the connecting region 24.

[0029] However, in adjustments made by the exposure adjustment plate 19, when the cumulative exposure in the connection region 24 includes a secondary component, it is impossible to correct to a uniform value across the entire area of ​​the connection region 24. For example, it is impossible to correct uniformly as... Figure 2 (d) shows the distribution of cumulative exposure. In this embodiment, a method is described that, in order to uniformly adjust the distribution of cumulative exposure, a structure capable of deforming the shape of the slit 9 is provided, thereby uniformly adjusting the cumulative exposure in the connecting region 24.

[0030] In the process of connecting the layers, it is possible to expose a wide range of areas that can be exposed in a single scan. Therefore, this can be an advantageous technique, for example, when producing large-screen LCD panels or OLED panels. However, since the connecting region 24 is formed, it is necessary to suppress the deviation of the cumulative exposure amount between the connecting region 24 and other areas, or the deviation of the cumulative exposure amount within the connecting region 24.

[0031] Figure 3 This is a diagram showing the variable slit 21 that can locally adjust the exposure. Figure 3 (a) is a diagram showing a comparative example of this embodiment, in which multiple adjustment parts 21c of the variable slit 21 are arranged symmetrically on the left and right. Figure 3 (b) is a diagram showing the structure of the variable slit 21 of this embodiment, with multiple adjustment parts 21c arranged asymmetrically on the left and right sides.

[0032] A variable slit 21 is applied to slit 9 (light-shielding plate). The variable slit 21 includes a variable plate 21a and a fixed plate 21b. The variable plate 21a has multiple adjustment portions 21c (L1-5, X0, R1-5) arranged in the X direction. Each adjustment portion 21c pushes or pulls the variable plate 21a, thereby adjusting the slit width (the width between the variable plate 21a and the fixed plate 21b) at each position. That is, by applying force to the variable slit 21, the variable slit 21 is deformed, thereby adjusting the shape of the opening 21d. The opening 21d is the space between the variable plate 21a and the fixed plate 21b. Light passes through the opening 21d, thereby defining the illumination area to be illuminated onto the original image 3 into the shape of the opening 21d. In this embodiment, the adjustment portions 21c (L1-5 and R1-5) are asymmetrically arranged relative to a straight line passing through the center of the slit and along the scanning direction (Y direction) when no force is applied to the variable slit 21. Here, the slit center refers, for example, to the optical axis of the projection optical system 4.

[0033] exist Figure 3 In (a), the interval between two adjacent adjustment sections 21c (L1~L5 or R1~R5) is set to A. The difference from the center position of the connecting region is the same whether adjustment section 21c (L1~L5) or adjustment section 21c (R1~R5) is selected. For example, the center position of the connecting region is... Figure 3 In the case of the four squares represented in (a), regardless of whether adjustment unit 21c (L4) or adjustment unit 21c (R4) is selected, the difference is A / 2. Therefore, in the case of Figure 3 In case (a), in the non-scanning direction (X direction), the distance between the center position of the connecting region 24 and the adjustment unit deviates by a maximum of A / 2.

[0034] On the other hand, Figure 3 In (b), the difference between the center position of the connecting area and the selected adjustment section 21c (L1~L5) is different when the selected adjustment section 21c (R1~R5) is selected. Figure 3 In (b), the interval between two adjacent adjustment parts 21c (L1~L5 or R1~R5) is also set to A, and the position symmetrical to the adjustment parts 21c (L1~L5) is indicated by a black circle with the center of the opening 21d (position X0) as the reference. In this embodiment, the arrangement is such that the position of one adjustment part 21c (R1~5) is at the midpoint of the position of the other adjustment part 21c (L1~5) (the midpoint between the black circles). Figure 3 In (b), for example, at the center of the connected region, is... Figure 3(b) Regarding the position of the four squares, the difference differs depending on whether adjustment part 21c (L5) or adjustment part 21c (R5) is selected. When adjustment part 21c (L5) is selected, the difference from the center position of the connected area is 3A / 4, but when adjustment part 21c (R5) is selected, the difference from the center position of the connected area is A / 4. That is, in Figure 3 In (b), selecting the nearest adjustment unit maximizes the deviation from the center position of the connected region to A / 4. Furthermore, since the difference from the center position of the connected region is also A / 4 when adjustment unit 21c (L4) is selected, adjustment unit 21c (L4) can also be selected. In other words, selecting the adjustment unit closest to the center position of the connected region is sufficient.

[0035] Here, we explain why the distance between the center position of the connecting region 24 and the adjustment unit 21c is minimized in the non-scanning direction (X direction), thereby improving the exposure accuracy in the connecting region 24. Figure 2 As shown in (d), when the distribution of the cumulative exposure in the connecting region 24 has a quadratic shape, the quadratic component of the cumulative exposure can be eliminated by adjusting the adjustment unit 21c.

[0036] At this point, the secondary component of the cumulative exposure has a peak at the center of the connection region 24. By adjusting the adjustment unit 21c, which corresponds to or is close to the peak of the secondary shape, the secondary component of the cumulative exposure can be removed more effectively.

[0037] For example, a first distance is defined as the distance between the position coordinates of the adjustment unit that adjusts the exposure amount of the connecting region 24 in the first exposure and the center position of the predetermined forming position of the connecting region 24 in the non-scanning direction (X direction). A second distance is defined as the distance between the position coordinates of the adjustment unit that adjusts the exposure amount of the connecting region 24 in the second exposure and the center position of the predetermined forming position of the connecting region 24 in the non-scanning direction (X direction). Then, the first distance and the second distance are compared. If the first distance is smaller than the second distance, the exposure amount of the connecting region 24 in the first exposure is adjusted; if the second distance is smaller than the first distance, the exposure amount of the connecting region 24 in the second exposure is adjusted, thereby effectively removing the secondary component of the accumulated exposure amount.

[0038] Here, the quadratic component represents the shape of the exposure distribution in the non-scanning direction (X direction) of the connection region 24, which includes a curve. By removing the quadratic component, the shape of the exposure distribution in the non-scanning direction (X direction) of the connection region 24 is changed from a curve to a straight line. In this embodiment, multiple adjustment units are controlled in such a way that the shape of the exposure distribution in the connection region 24 is changed from a curve to a straight line.

[0039] The reason why the cumulative exposure in the connecting region 24 has a quadratic component is mainly due to, for example, manufacturing errors in the optical components. For instance, manufacturing errors in the mirror used in the imaging optical system 10 are a major cause. In this embodiment, when the illumination shape illuminating the original 3 is an arc, the mirror used in the imaging optical system 10 is ground in the direction along the arc shape. By using a mirror ground in the direction along the arc shape, it is possible to generate uneven illumination along the scanning direction (Y direction) of the illumination shape. When uneven illumination exists in the scanning direction (Y direction), the cumulative exposure becomes the sum of the areas with higher and lower exposure, so the cumulative exposure becomes uniform, and most of the arc-shaped illumination area is not a problem.

[0040] However, at the ends of the arc-shaped illumination area (the illumination area near the edge of the exposure adjustment plate 19), areas where the exposure might increase are blocked, and only areas where the exposure might decrease are accumulated in the connecting area 24. Alternatively, areas where the exposure might decrease are blocked, and only areas where the exposure might increase are accumulated in the connecting area 24. In such cases, the result is that the accumulated exposure in the connecting area 24 becomes uneven, exhibiting a quadratic distribution of accumulated exposure, such as a peak at the center of the connecting area 24.

[0041] In this embodiment, the adjustment unit 21c is selected to correspond to the vicinity of the center of the connecting region 24, so that the secondary component in the distribution of cumulative exposure can be effectively removed, and the deviation of the cumulative exposure in the connecting region 24 can be effectively reduced. Furthermore, while maximizing the accuracy of the connecting exposure, the adjustment unit 21c is configured asymmetrically, and one side is selected to correct the secondary component, thereby improving the accuracy of the connecting exposure. Figure 3 In this configuration, all adjustment sections that are opposite to one adjustment section are arranged in the middle of their respective symmetrical positions. However, adjustment sections 21c that are not used in the connecting area (e.g., R1 and L1 near the center of the opening 21d) can also be arranged in a left-right symmetrical position. In addition, the shape of the exposed light defined by the variable slit 21 can be either an arc shape or a rectangular shape.

[0042] Next, the method for determining which of the multiple adjustment units 21c to drive and the method for determining the driving amount of the adjustment unit during the execution of the connection exposure will be explained. The acquisition unit 26 acquires information such as the layout of the panel to be produced, input by the user into the input device (not shown). Thus, the acquisition unit 26 can acquire the position information of the area where the connection area 24 is predetermined to be formed. The position information of the area where the connection area 24 is predetermined to be formed refers, for example, the coordinates of the center position of the connection area 24 in the non-scanning direction (X direction). Alternatively, the acquisition unit 26 can acquire the coordinates of the entire connection area 24, and the control unit 20 can calculate the coordinates of the center position of the connection area 24 in the non-scanning direction (X direction).

[0043] Based on the position information of the connection area 24, the control unit 20 determines the amount of light to be blocked in the connection area 24 exposed in the first and second exposures, and drives the exposure adjustment plate 19 in the non-scanning direction (X direction) to block a portion of the light path. Furthermore, to determine the driving amount of the adjustment unit 21c, the exposure distribution is measured using a light intensity sensor 18. Specifically, the substrate stage 17 is moved step-by-step in the non-scanning direction (X direction), and the light intensity is detected by the light intensity sensor 18. The measurement of the exposure distribution by the light intensity sensor 18 can be performed either before each connection exposure, or at a time when the layout of the panel to be produced is changed, or at a time when a predetermined time has elapsed since the previous measurement.

[0044] Reference Figure 4 This describes a method for making the cumulative exposure of the connection region 24 more uniform during the connection exposure in this embodiment. Figure 4 The following describes an example of connecting exposures using two scan exposures: the first exposure and the second exposure. Furthermore, in the exposure adjustment plate 19 described below, exposure adjustment plates 19a and 19b are set separately across the optical path.

[0045] Figure 4 (a) is a diagram showing the correspondence between the position of the exposure area 24 and the position of the variable slit 21 and the exposure adjustment plate 19a in the first exposure. In the first exposure, the exposure adjustment plate 19a is driven in the non-scanning direction (X direction) to adjust the exposure of the connecting area 24 to a continuous exposure distribution from 0% to 100%. Figure 4 (b) is a diagram showing the correspondence between the position of the exposure area 24 and the position of the variable slit 21 and the exposure adjustment plate 19b in the second exposure.

[0046] In the second exposure, the exposure adjustment plate 19b is driven in the non-scanning direction (X direction) to adjust the exposure of the connecting region 24 so that the exposure is a continuous exposure distribution from 0% to 100%. Additionally, refer to... Figure 4(a) and Figure 4 (b) The middle position of the exposure area 24 in the non-scanning direction (X direction) corresponds to the adjustment unit of the position of R3. Therefore, by driving the adjustment unit of the position of R3, correction is performed in a way that removes the quadratic shape of the cumulative exposure distribution.

[0047] Figure 4 (c) is a graph showing the position and cumulative exposure in the non-scanning direction (X direction) at a certain Y-coordinate position by connecting the exposed area and the position. The vertical axis of the graph is the cumulative exposure, and the horizontal axis is the position in the non-scanning direction (X direction). The dashed line in the graph represents the cumulative exposure distribution of the quadratic shape, which is the result of the exposure distribution measured in advance by the light sensor 18. The control unit 20 calculates the correction amount of the cumulative exposure of the quadratic shape, determines the driving amount of the adjustment unit for the position of R3, and the adjustment unit around the position of R3 associated with the correction. Figure 4 (c) If the cumulative exposure of the connecting region 24 shown is smaller than that of other regions, the adjustment part is adjusted in the direction of widening the opening 21d, so that the cumulative exposure is as shown. Figure 4 The solid line in (c) shows that even exposure is possible in the connected region 24.

[0048] This explains the sequence of linked exposures performed using the exposure device 100. Figure 5 This is a flowchart illustrating the processing method performed by linked exposure in this embodiment. The control unit 20 controls each part of the exposure apparatus 100, thereby executing the steps described below.

[0049] In step S501, the acquisition unit 26 acquires position information for the predetermined formation of the connecting region 24 based on the layout of the exposed areas on the substrate 16. The acquired position information is, for example, the coordinates of the midpoint of the predetermined formation position of the connecting region 24 in the non-scanning direction (X direction).

[0050] In step S502, in order to adjust the cumulative exposure of the connecting region 24 based on the position information of the connecting region 24 obtained in step S501, the control unit 20 drives the exposure adjustment plate 19. Furthermore, when driving the exposure adjustment plate 19, the exposure distribution is acquired using the light sensor 18. The cumulative exposure of the connecting region 24 is calculated based on the sum of the cumulative exposure in the first exposure and the cumulative exposure in the second exposure. If the measurement information in the connecting region from the previous exposure is used as the measurement information for the current exposure, step S502 is omitted.

[0051] In step S503, the adjustment unit 21c to be driven is selected, and the driving amount of the selected adjustment unit 21c is determined. The adjustment unit 21c to be driven is selected based on the position information of the connection region 24 obtained in step S501 and the position where the adjustment unit 21c is arranged. The control unit 20 determines the adjustment unit closest to the position coordinates of the center position in the non-scanning direction (X direction) of the predetermined connection region 24 based on the position coordinates of each axis of the adjustment unit 21c stored in advance in the control unit 20. The control unit 20 determines the driving amount of the selected adjustment unit and the surrounding adjustment units (e.g., adjustment units arranged adjacent to the selected adjustment unit).

[0052] In the above description, an example of controlling the adjustment unit 21c by removing the secondary component of the exposure distribution (i.e., correcting the exposure distribution so that the secondary shape becomes the primary shape) was explained. However, this alone cannot be said to mean that the cumulative exposure in the connecting region 24 is uniformly corrected. It is necessary for the adjustment unit 21c to be controlled in a way that removes not only the secondary component but also the primary component. Hereinafter, an example of removing the primary component will be described.

[0053] Here, the primary component represents the linear component of the exposure distribution in the non-scanning direction (X direction) within the connecting region 24. By removing the secondary and primary components, the shape of the exposure distribution in the non-scanning direction (X direction) within the connecting region 24 becomes a straight line without tilt. In this embodiment, multiple adjustment units are controlled to make the shape of the exposure distribution in the connecting region 24 a straight line without tilt, thereby ensuring uniform exposure of the connecting region 24.

[0054] In step S502, the adjustment section located opposite to the adjustment section selected for removing the secondary component is driven, thereby making the cumulative exposure more uniform. That is, when in Figure 4 In (a), when the adjustment unit at the position of R3 in the first exposure is selected to perform secondary shape correction, the adjustment unit located on the opposite side of the position of R3 in the second exposure is controlled, thereby removing the primary component. Specifically, the adjustment units L2 to L5, which affect the exposure amount of the exposure area 24, are each driven by a certain amount, thereby enabling the removal of the primary component.

[0055] Alternatively, in this embodiment, the primary component can be removed and the cumulative exposure amount can be made more uniform by driving the adjustment unit (the adjustment unit at position R3) which is located at the same position as the adjustment unit selected for removing the secondary component (the adjustment unit at position R3). That is, the secondary component can be removed in the first exposure and the primary component can be removed in the second exposure, or the correction can be performed using only the first exposure and the second exposure. Alternatively, the primary and secondary components can be removed in each of the first and second exposures in a predetermined proportion. In addition, after the correction drive is performed according to the correction amount determined in step S503, the cumulative exposure amount can be confirmed again by the light sensor 18 as in step S502, and the correction amount of the adjustment unit 21c can be calculated more accurately.

[0056] In step S504, the adjustment unit 21c is driven by the driving amount determined in step S503 to perform a connection exposure.

[0057] In this embodiment, even when the connection region 24 has a secondary component of exposure distribution, by selecting an appropriate adjustment section among the adjustment sections that are asymmetrically arranged relative to the centroid of the opening 21d and along a straight line in the scanning direction (Y direction) and driving it, the cumulative exposure can be uniformly corrected. Furthermore, connection exposure corresponding to various panel layouts can be performed.

[0058] <Second Implementation Method>

[0059] In the first embodiment, an example was described where a variable slit 21 having multiple adjustment sections 21c arranged asymmetrically on the left and right was used as the slit 9, thereby enabling uniform correction of the cumulative exposure in the connecting region. In this embodiment, an example is described where a variable adjustment plate 25 having multiple adjustment sections 27 arranged asymmetrically on the left and right is applied to the exposure adjustment plate 19. Furthermore, the structure of the exposure apparatus 100 is the same as in the first embodiment, so the description is omitted. In addition, matters not mentioned in this embodiment follow the first embodiment.

[0060] In this embodiment, the slit 9 is not configured to make the cumulative exposure of the connecting area uniform, but rather to define the illumination shape of the light illuminating the original image 3 as, for example, an arc shape. Therefore, if it is not necessary to define the illumination shape, it may not be included in the exposure apparatus 100. Furthermore, even when the slit 9 is configured, the slit 9 may not be a variable slit, or it may be a variable slit, similar to the first embodiment.

[0061] Figure 6This diagram shows a variable adjustment plate 25 (light-shielding plate) capable of locally adjusting the exposure. The variable adjustment plate 25 has two light-shielding plates 25a and 25b, one on the left and one on the right. The variable adjustment plate 25 has multiple adjustment sections 27 (L1-7, R1-7), each of which pushes or pulls the light-shielding plates 27a and 27b to locally adjust the exposure to be blocked. The adjustment sections 27 (L1-7) are arranged asymmetrically with respect to the adjustment sections 27 (R1-7). Specifically, when no force is applied to the light-shielding plates 27a and 27b, they are arranged asymmetrically with respect to a straight line passing through the center position of the light-shielding plates 27a and 27b along the scanning direction (Y direction). When the light-shielding plates are not driven in the non-scanning direction (X direction), the center of gravity of the illumination area based on the exposed light becomes the middle position of the light-shielding plates 27a and 27b. Figure 6 In the diagram, black circles represent positions symmetrical to L1 to L7. Adjustment units 27 (R1 to 7) are positioned differently from the black circles. The reason for asymmetrically arranging the adjustment units 27 is to allow for the selection of adjustment units for correction in a manner similar to that in the first embodiment, removing the secondary components of the connected exposure areas.

[0062] In this embodiment, similar to the first embodiment, even when the connection region 24 has a secondary component of exposure distribution, by selecting and driving an appropriate adjustment unit among the asymmetrically arranged adjustment units, the cumulative exposure can be uniformly corrected. Furthermore, connection exposure corresponding to various panel layouts can be performed.

[0063] <Implementation Method of Manufacturing the Item>

[0064] The article manufacturing method according to embodiments of the present invention is suitable, for example, for manufacturing flat panel displays (FPDs). The article manufacturing method of this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate using the aforementioned exposure apparatus (a step of exposing the substrate) and a step of developing the substrate on which the latent image pattern was formed in the aforementioned step. Furthermore, this manufacturing method includes other known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, encapsulation, etc.). Compared to conventional methods, the article manufacturing method of this embodiment is advantageous in at least one aspect of article performance, quality, productivity, and production cost.

[0065] The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments and various modifications and alterations can be made within the scope of its spirit.

Claims

1. An exposure apparatus that illuminates a master plate with light from a light source and performs scanning exposure by exposing a pattern of the master plate onto the substrate while moving the substrate in a scanning direction, the exposure apparatus performing linked exposures such that areas exposed by a first exposure and areas exposed by a second exposure partially overlap, the exposure apparatus being characterized by having: A projection optical system projects the original pattern onto the substrate; A light-blocking plate that blocks a portion of the light exposed in at least one of the first exposure and the second exposure; as well as Multiple adjustment parts apply force to the light-shielding plate to adjust the amount of light blocked by the light-shielding plate. The plurality of adjustment sections are configured to be asymmetrical relative to the optical axis of the projection optical system and along the scanning direction when no force is applied to the light shield.

2. The exposure apparatus according to claim 1, characterized in that, The light-shielding plate is a variable slit disposed between the light source and the original plate, defining the shape of the illumination directed toward the original plate.

3. The exposure apparatus according to claim 2, characterized in that, The exposure apparatus also includes an exposure adjustment plate, which is inserted into the optical path between the projection optical system and the substrate. The exposure adjustment plate reduces the exposure of areas that are repeatedly exposed in the linked exposure.

4. The exposure apparatus according to claim 1, characterized in that, The light-shielding plate is an exposure adjustment plate inserted between the projection optical system and the substrate in the optical path to reduce the exposure of areas that are repeatedly exposed in the linked exposure.

5. The exposure apparatus according to claim 1, characterized in that, The exposure apparatus also includes a control unit that controls the driving of the plurality of adjustment units. The control unit adjusts the cumulative exposure of the area that is repeatedly exposed in the linked exposure.

6. The exposure apparatus according to claim 5, characterized in that, The control unit adjusts the cumulative exposure of the area repeatedly exposed in the linked exposure based on the location information of the area repeatedly exposed in the linked exposure and the positions of the plurality of adjustment units.

7. The exposure apparatus according to claim 5, characterized in that, The control unit selects, based on the location information of the area repeatedly exposed in the linked exposure and the positions of the plurality of adjustment units, whether to adjust the exposure amount of the area repeatedly exposed in the linked exposure in the first exposure or to adjust the exposure amount of the area repeatedly exposed in the linked exposure in the second exposure.

8. The exposure apparatus according to claim 5, characterized in that, The exposure apparatus further includes an acquisition unit that acquires position information of the area repeatedly exposed in the linked exposure before performing the first exposure.

9. The exposure apparatus according to claim 8, characterized in that, The acquisition unit acquires the position coordinates of the center position of the region repeatedly exposed in the linked exposure in a direction orthogonal to the scanning direction.

10. The exposure apparatus according to claim 5, characterized in that, The exposure apparatus further includes a detection unit that detects light exposed on the surface of the substrate. The control unit adjusts the drive amount of the plurality of adjustment units based on the results detected by the detection unit.

11. The exposure apparatus according to claim 5, characterized in that, The control unit compares a first distance and a second distance. If the first distance is smaller than the second distance, it adjusts the exposure amount of the first exposure. If the second distance is smaller than the first distance, it adjusts the exposure amount of the second exposure. The first distance is the distance between the position coordinates of the adjustment unit that adjusts the exposure amount of the area repeatedly exposed in the connected exposure during the first exposure and the center position of the area repeatedly exposed in the connected exposure in a direction orthogonal to the scanning direction. The second distance is the distance between the position coordinates of the adjustment unit that adjusts the exposure amount of the area repeatedly exposed in the connected exposure during the second exposure and the center position of the area repeatedly exposed in the connected exposure in a direction orthogonal to the scanning direction.

12. The exposure apparatus according to claim 11, characterized in that, When the first distance is smaller than the second distance, the control unit drives the plurality of adjustment units in the first exposure in such a way that it removes the second component of the exposure amount distribution in the direction orthogonal to the scanning direction in the area repeatedly exposed in the connecting exposure. When the second distance is smaller than the first distance, the control unit drives the plurality of adjustment units in the second exposure in such a way that it removes the second component of the exposure amount distribution in the direction orthogonal to the scanning direction in the area repeatedly exposed in the connecting exposure.

13. An exposure method, wherein exposure is performed by an exposure apparatus, the exposure method being a scanning exposure method in which a pattern of the original is exposed onto a substrate while the substrate is moved in a scanning direction, the exposure apparatus performing linked exposures such that areas exposed by a first exposure and areas exposed by a second exposure partially overlap. The exposure apparatus has: A projection optical system projects the original pattern onto the substrate; A light-blocking plate that blocks a portion of the light exposed in at least one of the first exposure and the second exposure; and Multiple adjustment parts apply force to the light-shielding plate to adjust the amount of light blocked by the light-shielding plate. The exposure method includes the following steps: applying force to the light shield, which is configured to be asymmetrical with respect to the optical axis of the projection optical system and along the scanning direction, without applying force to the light shield, thereby adjusting the shape of the opening formed by the light shield.

14. A method for manufacturing an article, characterized in that, include: The exposure process involves exposing the substrate using the exposure apparatus described in any one of claims 1 to 12; as well as The developing process develops the substrate that was exposed in the exposure process. Articles are manufactured from the substrate that has been developed in the development process.

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