A heating film control board circuit

Abstract

The application discloses a heating film control panel circuit, which comprises a first circuit, a second circuit, a third circuit, a fourth circuit and a fifth circuit, and is characterized in that the first circuit, the second circuit, the third circuit, the fourth circuit and the fifth circuit are arranged on the control panel; the first circuit comprises a resistor R6, a resistor R7, a resistor R8, a resistor R9, a resistor R10, a triode Q1, a triode Q2, a triode Q3, a triode Q4, a voltage stabilizing diode ZD1, a diode D2A, a diode D3, a capacitor C5, a capacitor C6 and a total ground joint GND; the second circuit comprises a port J1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a capacitor C1, a capacitor C3, a capacitor C4, a chip IC1, a diode D2B and a capacitor CA, and the capacitor CA is electrically connected to the chip IC1; the control panel circuit has the characteristics of wide applicability and three kinds of control modes for starting the heating film.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of control board circuit, in particular to a heating film control board circuit. BACKGROUND

[0002] At present, the battery technologies on the market are mainly divided into two types, namely ternary polymer lithium battery and iron phosphate lithium battery. They have different performances when facing low temperature, but in fact, no matter which battery technology, charging the battery when facing low temperature environment will cause the performance of the battery to decay or damage the battery. In order to maintain the performance and safety of the battery, most of the batteries currently need to be heated before charging in low temperature condition. Because in low temperature condition, lithium ion battery generally has the problems of poor charging acceptance, insufficient charging, at this time the charging voltage must be improved and the charging time must be prolonged, and the heat preservation and anti-freezing measures must be taken, so as to ensure sufficient charging and prolong the service life of the battery, therefore, a heating film control board circuit is designed. SUMMARY

[0003] The purpose of the present application is to provide a heating film control board circuit to solve the problems raised in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a heating film control board circuit, comprising a first line, a second line, a third line, a fourth line, and a fifth line, all of which are disposed on the control board. The first line includes resistors R6, R7, R8, R9, and R10, transistors Q1, Q2, Q3, and Q4, Zener diodes ZD1, D2A, and D3, capacitors C5 and C6, and a ground connector GND. The second line includes port J1, resistors R1, R2, R3, R4, and R5, capacitors C1, C3, and C4, a chip IC1, a diode D2B, and a capacitor CA. The capacitor CA is electrically connected to chip IC1. The third line includes ports J3 and J4. The circuit includes resistors R12, R14, R15, R17, R18, R20, R21, R22, R23, R24, R25, R28, R29, R30, and R34; Zener diodes ZD2 and ZD4; transistor V1; transistor Q7; diode D5; capacitors C7 and C8; and chip IC2. The fourth circuit includes resistors R11, R13, R16, R19, R26, R27, R31, R32, R33, and R35; transistors V2, V3, V4, V5, Q5, and Q6; diode D4; Zener diodes ZD3 and ZD5; ​​and semiconductor heating ceramics PTC1 and PTC2.

[0005] Pins 3 and 2 on chip IC1 are connected in series with resistor R5, port J1 and resistor R3 via wires. Meanwhile, pin 2 on chip IC1 is connected with capacitor C3 and capacitor C4 via wires. Capacitor C3 is connected in series with resistor R5, and capacitor C4 is connected in series with resistor R3. Resistor R3 is connected to resistor R1 via wires. Pins 3 and 1 on chip IC1 are connected in series with capacitor C1 and resistor R2 via wires. Pin 1 on chip IC1 is connected in series with resistor R4, diode D2B, resistor R14, resistor R18 and pin 1 on chip IC2.

[0006] A capacitor C8 and a Zener diode ZD4 are connected in parallel to pin 5 of the IC2 chip. Pin 2 of the IC2 chip is connected to ground. Pin 4 of the IC2 chip is connected in series with a resistor R12 and pin 1 of port J3 via a wire. Pin 2 of port J3 is connected to a resistor R15 via a wire. One end of the resistor R15 is connected to ground and a Zener diode ZD2, which is connected in series with the resistor R12. Pin 4 of the IC2 chip is connected to a capacitor C7 and one end of a resistor R17. The other end of the resistor R17 is connected to one end of a resistor R21 and one end of a resistor R24. The other end of the resistor R24 ​​is connected to pin 3 of the IC2 chip.

[0007] The resistor R24 ​​is connected in parallel with the resistor R23, and the other end of the resistor R24 ​​is connected to the ground wire. One end of the resistor R22 is connected to pin 3 of the chip IC2, and the other end of the resistor R22 is connected to the resistors R29 and R30 respectively. Both the resistors R29 and R30 are connected to the ground wire. The resistor R14 is connected in parallel with the transistor V1, and one end of the transistor V1 is connected to one end of the resistor R25. The other end of the resistor R25 is connected to one end of the resistor R28 and one end of the transistor Q7 respectively. The other end of the resistor R28 and the other end of the transistor Q7 are interconnected on the ground wire. The connection between the resistors R25 and R28 is connected in series with the resistor R34, the diode D5 and the port J4 in sequence, and the ground lead on the port J4 is connected to the ground wire. The end of the resistor R14 away from the resistor R18 is connected to one end of the diode D2A.

[0008] The other end of diode D2A is connected to one end of transistor Q2. The other end of transistor Q2 is connected to one end of resistor R6 and one end of resistor R9. The other end of resistor R6 is connected to the ground connector GND. Capacitors C5 and C6 are connected in parallel to the ground connector GND and are connected to the ground wire. One end of transistor Q1 is connected to the ground connector GND. The other end of transistor Q1 is connected to transistor Q3 and resistor R7. Transistor Q3 and resistor R7 are interconnected. Resistor R8 and Zener diode ZD1 are connected to transistor Q3. Resistor R8 and resistor R7 are interconnected. Zener diode ZD1 is connected to the ground wire. The other end of resistor R9 is fixedly connected to transistor Q4. Resistor R10 and diode D3 are connected to transistor Q4. Resistor R10 is connected to the ground wire. Resistor R10, diode D3, and resistor R9 are distributed on three pins of transistor Q4.

[0009] A resistor R16 and a transistor Q5 are connected sequentially to one pin of transistor Q7. A resistor R13 is connected in parallel with transistor Q5, and both resistor R13 and transistor Q5 are connected to a resistor R11. A resistor R19, a Zener diode ZD3, and a diode D4 are connected in series to one pin of transistor Q5. A transistor Q6 is connected in parallel with resistor R19. A resistor R35 and a transistor V5 are connected in series to one pin of transistor Q6. Resistor R35, transistor V5, and diode D4 are also connected in series. The transistors are connected in parallel. Transistor V5 is connected in series with transistor V2 and semiconductor heating ceramic PTC1. Resistor R35 is connected in parallel with resistor R31, Zener diode ZD5 and resistor R26, and resistor R26 is interconnected with transistor V2. Transistor V2 is connected in parallel with transistor V3 and semiconductor heating ceramic PTC2. Resistor R27 is connected to transistor V3. Transistor V5 is connected in parallel with transistor V4, and resistor R32 and resistor R33 are connected in parallel with transistor V4.

[0010] Preferably, the fifth line includes the cell's total negative terminal and the battery management system, and several corresponding resistors are connected in parallel on the cell's total negative terminal and the battery management system.

[0011] Compared with existing technologies, the advantages of this invention are: this circuit has three ways to control the opening of the heating film, making it widely applicable; the first method can be used with a BMS without low-temperature protection. When the battery is at a low temperature and the detected charging current is greater than a set value (this current is adjustable), the heating film opens, and the charger charges the battery and supplies power to the heating film at the same time; the second method can be used with a BMS with low-temperature protection. When the battery is at a low temperature (the temperature is lower than the BMS charging low-temperature protection value), the heating film opens, and the charger only supplies power to the heating film and does not charge the battery. Only when the battery temperature reaches the charging low-temperature protection release temperature does the charging MOS open, the heating film closes, and the charger charges the battery; the third method is used with a smart board BMS, which controls the opening of the heating film through an MCU; by using multiple ways to control the opening of the heating film, the market competitiveness of this circuit is improved. Attached Figure Description

[0012] Fig. 1 This is a circuit diagram of the present invention;

[0013] Fig. 2 This is a control principle diagram of the present invention;

[0014] In the diagram: 1. First route; 2. Second route; 3. Third route; 4. Fourth route; 5. Fifth route. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Please see Figs. 1-2This invention provides an embodiment of a heating film control board circuit, including a first line 1, a second line 2, a third line 3, a fourth line 4, and a fifth line 5. All five lines are disposed on the control board. The first line 1 includes resistors R6, R7, R8, R9, and R10; transistors Q1, Q2, Q3, and Q4; Zener diodes ZD1, D2A, and D3; capacitors C5 and C6; and a ground connector GND. The second line 2 includes port J1, resistors R1, R2, R3, R4, and R5; capacitors C1, C3, and C4; and a chip. IC1, diode D2B, and capacitor CA are electrically connected to IC1. The third circuit 3 includes ports J3 and J4, resistors R12, R14, R15, R17, R18, R20, R21, R22, R23, R24, R25, R28, R29, R30, and R34, Zener diodes ZD2 and ZD4, transistors V1 and Q7, diode D5, capacitors C7 and C8, and IC2. The fourth circuit 4 includes resistors R11, R13, R16, R19, R26, R27, R31, and R32. 33. Resistor R35, transistors V2, V3, V4, V5, Q5, Q6, diode D4, Zener diodes ZD3 and ZD5, semiconductor heating ceramic PTC1 and PTC2. Pins 3 and 2 of chip IC1 are connected in series with resistor R5, port J1, and resistor R3 via wires. Pin 2 of chip IC1 is connected with capacitors C3 and C4 via wires. Capacitor C3 is connected in series with resistor R5, and capacitor C4 is connected in series with resistor R3. Resistor R3 is connected to resistor R1 via wires. Pins 3 and 1 of chip IC1 are connected in series with capacitor C1 and resistor R2 via wires. Pin 1 of chip IC1... The series connection includes resistor R4, diode D2B, resistor R14, resistor R18, and pin 2 of chip IC2. Pin 5 of chip IC2 is connected in parallel with capacitor C8 and Zener diode ZD4. Pin 2 of IC2 is connected to ground. Pin 4 of IC2 is connected in series with resistor R12 and pin 1 of port J3. Pin 2 of port J3 is connected to resistor R15 via a wire. One end of resistor R15 is connected to ground and Zener diode ZD2, which is connected in series with resistor R12. Pin 4 of chip IC2 is connected to capacitor C7 and one end of resistor R17. The other end of resistor R17 is connected to one end of resistor R21 and one end of resistor R24.Meanwhile, the other end of resistor R24 ​​is connected to pin 3 of chip IC2. Resistor R23 is connected in parallel with resistor R24, and the other end of resistor R24 ​​is connected to ground. One end of resistor R22 is connected to pin 3 of chip IC2, and the other end of resistor R22 is connected to resistors R29 and R30 respectively. Resistors R29 and R30 are both connected to ground. Transistor V1 is connected in parallel with resistor R14, and one end of transistor V1 is connected to one end of resistor R25. The other end of resistor R25 is connected to one end of resistor R28 and one end of transistor Q7 respectively. The other ends of resistor R28 and transistor Q7 are interconnected to ground by wires. The connection between resistors R25 and R28 is open. A resistor R34, a diode D5, and port J4 are connected in series via a wire. The ground lead on port J4 is connected to the ground wire. The end of resistor R14 furthest from resistor R18 is connected to one end of diode D2A. The other end of diode D2A is connected to one end of transistor Q2. The other end of transistor Q2 is connected to one end of resistor R6 and one end of resistor R9. The other end of resistor R6 is connected to the main ground connector GND. Capacitors C5 and C6 are connected in parallel to the main ground connector GND and are connected to the ground wire. One end of transistor Q1 is connected to the main ground connector GND. The other end of transistor Q1 is connected to transistor Q3 and resistor R7. Transistor Q3 and resistor R7 are mutually... The transistor Q3 is connected to resistor R8 and Zener diode ZD1. Resistor R8 is interconnected with resistor R7. Zener diode ZD1 is connected to ground. The other end of resistor R9 is fixedly connected to transistor Q4. Transistor Q4 is connected to resistor R10 and diode D3. Resistor R10 is connected to ground. Resistor R10, diode D3, and resistor R9 are distributed on three pins of transistor Q4. One pin of transistor Q7 is connected to resistor R16 and transistor Q5 in sequence. Transistor Q5 is connected in parallel with resistor R13. Resistor R13 and transistor Q5 are connected together with resistor R11. One pin of transistor Q5 is connected in series with resistor R19 and Zener diode ZD1. 3. A diode D4 and a resistor R19 are connected in parallel with a transistor Q6. One lead of transistor Q6 is connected in series with a resistor R35 and a transistor V5. Resistor R35, transistor V5, and diode D4 are connected in parallel. Transistor V5 is connected in series with transistor V2 and a semiconductor heating ceramic PTC1. Resistor R31, a Zener diode ZD5, and a resistor R26 are connected in parallel with resistor R35. Resistor R26 is interconnected with transistor V2. Transistor V2 is connected in parallel with transistor V3 and a semiconductor heating ceramic PTC2. Resistor R27 is connected to transistor V3. Transistor V5 is connected in parallel with transistor V4, and resistor R32 and resistor R33 are connected in parallel with transistor V4.The fifth line, 5, includes the cell's total negative terminal and the battery management system, with several corresponding resistors connected in parallel across both.

[0017] Working Principle: This circuit has three ways to control the heating film to turn on; the first is simultaneous charging and heating: diode D2A is not attached, but diode D2B is attached. After chip IC1 detects a certain charging current, chip IC1 outputs a high level. At the same time, chip IC2 detects the set low temperature through the 100K-3950 NTC and outputs a low level. Transistor V1 turns on, and the heating film starts heating. When the temperature rises to a certain temperature or the current is less than the set value, chip IC2 outputs a high level or chip IC1 outputs a low level, and the heating film stops heating; the second is heating only without charging: diode D2B is not attached, but diode D2A is attached. When the BMS is in charging low temperature protection mode, the charging MOS is turned off, transistor Q4 turns on, and chip IC2 detects the set low temperature through the 100K-3950 NTC and outputs a low level. After the 0K-3950 NTC detects the set low temperature, the output pin of chip IC2 outputs a low level, transistor V1 activates, and the heating film begins to heat. When the temperature reaches the charging low temperature release temperature, the charging MOS turns on, transistor Q4 turns off, and the heating film stops heating. The third method is direct control via MCU: With direct MCU control, the circuits of both chip IC1 and chip IC2 are unnecessary, while still achieving the above two heating methods. A high level output at pin 1 of port J4 activates transistor Q7, and the heating film begins to heat. A low level output at pin 1 of port J4 deactivates transistor Q7, and the heating film stops heating. This heating film control board can also directly detect the current on the BMS via port J1. This is mainly for high-current BMS and is the first heating method.

[0018] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A heating film control board circuit, comprising a first line (1), a second line (2), a third line (3), a fourth line (4), and a fifth line (5), characterized in that: The first line (1), the second line (2), the third line (3), the fourth line (4), and the fifth line (5) are all set on the control board. The first line (1) includes resistors R6, R7, R8, R9, and R10, transistors Q1, Q2, Q3, and Q4, Zener diodes ZD1, D2A, and D3, capacitors C5 and C6, and the ground connector GND. Meanwhile, the second line (2) includes port J1, resistors R1, R2, R3, R4, and R5, capacitors C1, C3, and C4, chip IC1, diode D2B, and capacitor CA. The chip IC1 is electrically connected to capacitor CA. The third line (3) includes ports J3 and J4, resistors R12, R14, and R15. Resistors R17, R18, R20, R21, R22, R23, R24, R25, R28, R29, R30, R34, Zener diode ZD2, Zener diode ZD4, transistor V1, transistor Q7, diode D5, capacitor C7, capacitor C8 and chip IC2, the fourth line (4) includes resistors R11, R13, R16, R19, R26, R27, R31, R32, R33, R35, transistors V2, V3, V4, V5, Q5, Q6, diode D4, Zener diode ZD3, Zener diode ZD5, semiconductor heating ceramic PTC1 and semiconductor heating ceramic PTC2; Pins 3 and 2 on chip IC1 are connected in series with resistor R5, port J1 and resistor R3 via wires. Meanwhile, pin 2 on chip IC1 is connected with capacitor C3 and capacitor C4 via wires. Capacitor C3 is connected in series with resistor R5, and capacitor C4 is connected in series with resistor R3. Resistor R3 is connected to resistor R1 via wires. Pins 3 and 1 on chip IC1 are connected in series with capacitor C1 and resistor R2 via wires. Pin 1 on chip IC1 is connected in series with resistor R4, diode D2B, resistor R14, resistor R18 and pin 1 on chip IC2. A capacitor C8 and a Zener diode ZD4 are connected in parallel to pin 5 of the IC2 chip. Pin 2 of the IC2 chip is connected to ground. Pin 4 of the IC2 chip is connected in series with a resistor R12 and pin 1 of port J3 via a wire. Pin 2 of port J3 is connected to a resistor R15 via a wire. One end of the resistor R15 is connected to ground and a Zener diode ZD2, which is connected in series with the resistor R12. Pin 4 of the IC2 chip is connected to a capacitor C7 and one end of a resistor R17. The other end of the resistor R17 is connected to one end of a resistor R21 and one end of a resistor R24. The other end of the resistor R24 ​​is connected to pin 3 of the IC2 chip. The resistor R24 ​​is connected in parallel with the resistor R23, and the other end of the resistor R24 ​​is connected to the ground wire. One end of the resistor R22 is connected to pin 3 of the chip IC2, and the other end of the resistor R22 is connected to the resistors R29 and R30 respectively. Both the resistors R29 and R30 are connected to the ground wire. The resistor R14 is connected in parallel with the transistor V1, and one end of the transistor V1 is connected to one end of the resistor R25. The other end of the resistor R25 is connected to one end of the resistor R28 and one end of the transistor Q7 respectively. The other end of the resistor R28 and the other end of the transistor Q7 are interconnected on the ground wire. The connection between the resistors R25 and R28 is connected in series with the resistor R34, the diode D5 and the port J4 in sequence, and the ground lead on the port J4 is connected to the ground wire. The end of the resistor R14 away from the resistor R18 is connected to one end of the diode D2A. The other end of diode D2A is connected to one end of transistor Q2. The other end of transistor Q2 is connected to one end of resistor R6 and one end of resistor R9. The other end of resistor R6 is connected to the ground connector GND. Capacitors C5 and C6 are connected in parallel to the ground connector GND and are connected to the ground wire. One end of transistor Q1 is connected to the ground connector GND. The other end of transistor Q1 is connected to transistor Q3 and resistor R7. Transistor Q3 and resistor R7 are interconnected. Resistor R8 and Zener diode ZD1 are connected to transistor Q3. Resistor R8 and resistor R7 are interconnected. Zener diode ZD1 is connected to the ground wire. The other end of resistor R9 is fixedly connected to transistor Q4. Resistor R10 and diode D3 are connected to transistor Q4. Resistor R10 is connected to the ground wire. Resistor R10, diode D3, and resistor R9 are distributed on three pins of transistor Q4. A resistor R16 and a transistor Q5 are connected sequentially to one pin of transistor Q7. A resistor R13 is connected in parallel with transistor Q5, and both resistor R13 and transistor Q5 are connected to a resistor R11. A resistor R19, a Zener diode ZD3, and a diode D4 are connected in series to one pin of transistor Q5. A transistor Q6 is connected in parallel with resistor R19. A resistor R35 and a transistor V5 are connected in series to one pin of transistor Q6. Resistor R35, transistor V5, and diode D4 are also connected in series. The transistors are connected in parallel. Transistor V5 is connected in series with transistor V2 and semiconductor heating ceramic PTC1. Resistor R35 is connected in parallel with resistor R31, Zener diode ZD5 and resistor R26, and resistor R26 is interconnected with transistor V2. Transistor V2 is connected in parallel with transistor V3 and semiconductor heating ceramic PTC2. Resistor R27 is connected to transistor V3. Transistor V5 is connected in parallel with transistor V4, and resistor R32 and resistor R33 are connected in parallel with transistor V4.

2. The heating film control board circuit according to claim 1, characterized in that: The fifth line (5) includes the cell's total negative electrode and the battery management system, and several corresponding resistors are connected in parallel on the cell's total negative electrode and the battery management system.

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