Combination sensor, microphone and electronic device

Abstract

The application provides a combination sensor, a microphone and an electronic device, the combination sensor comprising a shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, the shell comprising a sound hole substrate, a welding substrate arranged opposite to the sound hole substrate and a side substrate connecting the sound hole substrate and the welding substrate, the sound hole substrate, the welding substrate and the side substrate of the welding substrate surrounding a containing cavity, the microphone MEMS chip and the pressure MEMS chip being arranged in the containing cavity respectively, the side substrate being formed with a first containing groove and a second containing groove, the pressure ASIC chip being arranged in the first containing groove and the microphone ASIC chip being arranged in the second containing groove; the pressure ASIC chip being electrically connected with the pressure MEMS chip and the welding substrate respectively, and the microphone ASIC chip being electrically connected with the microphone MEMS chip and the welding substrate respectively. The combination sensor reduces the size of the combination sensor, widens the application range of the combination sensor and can be applied to occasions requiring smaller product size.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of sensors, in particular to a combination sensor, a microphone and an electronic device. BACKGROUND

[0002] MEMS microphones and MEMS pressure sensors have become standard in smart hardware such as mobile phones, wristbands, etc. In order to reduce the client assembly space and the number of air passages, the development of microphone and pressure combination sensors (hereinafter referred to as "M-P combination sensors") has become a market trend. The M-P combination sensors on the market currently need to package four chips inside the combination sensor product, thus resulting in a larger product size and certain requirements for the packaging space, which limits the application range of the combination sensor.

[0003] In view of this, it is necessary to provide a new combination sensor, a microphone and an electronic device to solve or at least alleviate the above technical defects. SUMMARY

[0004] The main purpose of the present application is to provide a combination sensor, a microphone and an electronic device, which aims to solve the technical problem of large size of the combination sensor in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present application, a combination sensor is provided, comprising a shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, the shell comprising a sound hole base plate, a welding base plate arranged opposite to the sound hole base plate and a side base plate connecting the sound hole base plate and the welding base plate respectively, the sound hole base plate, the welding base plate and the side base plate of the welding base plate surrounding a receiving cavity, the microphone MEMS chip and the pressure MEMS chip being arranged in the receiving cavity respectively, the side base plate being formed with a first receiving groove and a second receiving groove, the pressure ASIC chip being arranged in the first receiving groove, and the microphone ASIC chip being arranged in the second receiving groove; the pressure ASIC chip is electrically connected with the pressure MEMS chip and the welding base plate respectively, and the microphone ASIC chip is electrically connected with the microphone MEMS chip and the welding base plate respectively.

[0006] In an embodiment, the side base plate is provided with a first bonding pad, the welding base plate is provided with a second bonding pad and a third bonding pad on the side facing the side base plate, and the welding base plate is provided with a fourth bonding pad on the side facing away from the receiving cavity, the pressure ASIC chip and the microphone ASIC chip are electrically connected with the first bonding pad, the microphone MEMS chip and the pressure MEMS chip are electrically connected with the third bonding pad, and the first bonding pad, the third bonding pad and the fourth bonding pad are electrically connected with the second bonding pad.

[0007] In an embodiment, the side substrate is electrically connected with the solder substrate.

[0008] In an embodiment, the side substrate is electrically connected with the solder substrate through a metal conductive piece.

[0009] In an embodiment, the metal conductive piece is a tin paste layer.

[0010] In an embodiment, the first pads are arranged on a side of the side substrate facing the solder substrate, the second pads are arranged around a periphery of the solder substrate, and the third pads are arranged at a middle position of the solder substrate.

[0011] In an embodiment, the number of the first pads and the second pads is multiple, wherein some of the first pads are electrically connected with the pressure ASIC chip, the rest of the first pads are electrically connected with the microphone ASIC chip, and the number of the first pads is consistent with and one-to-one corresponding to the number of the second pads.

[0012] In an embodiment, the pressure ASIC chip and the microphone ASIC chip are arranged on opposite sides of the side substrate, the microphone MEMS chip and the pressure MEMS chip are arranged on the solder substrate, the microphone MEMS chip is arranged close to the microphone ASIC chip, and the pressure MEMS chip is arranged close to the pressure ASIC chip.

[0013] In an embodiment, a back hole is formed in the solder substrate, an acoustic hole is formed on the acoustic hole substrate, the microphone MEMS chip and the solder substrate cooperate to form a back cavity, and the back cavity is in communication with the back hole.

[0014] In an embodiment, a communication hole is formed on the solder substrate, and the communication hole is in communication with the back hole and the back cavity.

[0015] In an embodiment, the microphone MEMS chip and the solder substrate, and the pressure MEMS chip and the solder substrate are electrically connected through gold wires.

[0016] According to another aspect of the present application, the present application also provides a microphone, which comprises the above-mentioned combined sensor.

[0017] According to another aspect of the present application, the present application also provides an electronic device, which comprises the above-mentioned microphone.

[0018] In the scheme, the combination sensor comprises a shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip. The shell comprises a sound hole base plate, a welding base plate arranged opposite to the sound hole base plate and a side base plate connecting the sound hole base plate and the welding base plate. The sound hole base plate, the welding base plate and the side base plate form a containing cavity. The microphone MEMS chip and the pressure MEMS chip are arranged in the containing cavity. The side base plate forms a first containing groove and a second containing groove. The pressure ASIC chip is arranged in the first containing groove, and the microphone ASIC chip is arranged in the second containing groove. The pressure ASIC chip is electrically connected with the pressure MEMS chip and the welding base plate, and the microphone ASIC chip is electrically connected with the microphone MEMS chip and the welding base plate. By arranging the first containing groove and the second containing groove in the side base plate, and arranging the pressure ASIC chip and the microphone ASIC chip in the first containing groove and the second containing groove respectively, the pressure ASIC chip and the microphone ASIC chip are equivalent to be embedded in the side base plate. The pressure ASIC chip is electrically connected with the pressure MEMS chip and the welding base plate, and the microphone ASIC chip is electrically connected with the microphone MEMS chip and the welding base plate, so that the signal transmission and output are realized. Compared with the prior art of arranging four chips on the welding base plate of the combination sensor in sequence, the size of the combination sensor is reduced, and the application range of the combination sensor is widened. The combination sensor has the advantage of small size. The combination sensor is especially suitable for a Top type (top opening sound hole) combination sensor. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on the drawings shown.

[0020] Figure 1 FIG. 1 is a sectional structure schematic diagram of a combination sensor according to an embodiment of the present application;

[0021] Figure 2 FIG. 2 is a structure schematic diagram of a side base plate in a combination sensor according to an embodiment of the present application;

[0022] Figure 3 FIG. 3 is a structure schematic diagram of a welding base plate in a combination sensor according to an embodiment of the present application from one perspective;

[0023] Figure 4 FIG. 4 is a structure schematic diagram of a welding base plate in a combination sensor according to an embodiment of the present application from another perspective.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1, accommodating cavity; 2, microphone MEMS chip; 3, microphone ASIC chip; 4, pressure MEMS chip; 5, pressure ASIC chip; 6, back cavity; 7, back hole; 8, communication hole; 9, gold wire; 11, sound hole substrate; 111, sound hole; 12, soldering substrate; 13, side substrate; 14, first solder pad; 15, second solder pad; 16, third solder pad; 17, fourth solder pad.

[0026] The implementation, functional features and advantages of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0028] It should be noted that all directional indications (such as up, down, …) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0029] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features.

[0030] In addition, the technical solutions of each embodiment of the present application can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection claimed by the present application.

[0031] Reference Figure 1According to one aspect of the present application, the present application provides a combination sensor, comprising a housing, a microphone MEMS chip 2, a microphone ASIC chip 3, a pressure MEMS chip 4 and a pressure ASIC chip 5, the housing comprising a sound hole base plate 11, a welding base plate 12 arranged opposite to the sound hole base plate 11 and a side base plate 13 connecting the sound hole base plate 11 and the welding base plate 12 respectively, the sound hole base plate 11, the welding base plate 12 and the side base plate 13 of the welding base plate 12 surround to form a containing cavity 1, the microphone MEMS chip 2 and the pressure MEMS chip 4 are arranged in the containing cavity 1 respectively, the side base plate 13 is formed with a first containing groove and a second containing groove, the pressure ASIC chip 5 is arranged in the first containing groove, and the microphone ASIC chip 3 is arranged in the second containing groove; the pressure ASIC chip 5 is electrically connected with the pressure MEMS chip 4 and the welding base plate 12 respectively, and the microphone ASIC chip 3 is electrically connected with the microphone MEMS chip 2 and the welding base plate 12 respectively.

[0032] In the above embodiment, by arranging the first containing groove and the second containing groove in the side base plate 13, the pressure ASIC chip 5 and the microphone ASIC chip 3 are arranged in the first containing groove and the second containing groove respectively, which is equivalent to burying the pressure ASIC chip 5 and the microphone ASIC chip 3 in the side base plate 13, and the pressure ASIC chip 5 is electrically connected with the pressure MEMS chip 4 and the welding base plate 12 respectively, and the microphone ASIC chip 3 is electrically connected with the microphone MEMS chip 2 and the welding base plate 12 respectively, so as to realize the transmission and output of signals. Compared with the prior art, in which four chips (referring to the microphone MEMS chip 2, the microphone ASIC chip 3, the pressure MEMS chip 4 and the pressure ASIC chip 5) are arranged on the welding base plate 12 of the combination sensor in sequence, the embodiment reduces the size of the combination sensor, widens the application range of the combination sensor, and can be applied to occasions where the product size is required to be small. The embodiment has the advantage of small size of the combination sensor. The embodiment is especially suitable for Top type (top opening sound hole) combination sensor.

[0033] Reference Figures 2 to 4In an embodiment, the side substrate 13 is provided with a first pad 14, the side of the solder substrate 12 facing the side substrate 13 is provided with a second pad 15 and a third pad 16, the side of the solder substrate 12 facing away from the accommodating cavity 1 is provided with a fourth pad 17, the pressure ASIC chip 5 and the microphone ASIC chip 3 are both electrically connected with the first pad 14, the microphone MEMS chip 2 and the pressure MEMS chip 4 are both electrically connected with the third pad 16, the first pad 14 is electrically connected with the second pad 15, part of the second pad 15 is also electrically connected with the third pad 16, and another part of the second pad 15 is also electrically connected with the fourth pad 17. The pad pins of the microphone ASIC chip 3 and the pressure ASIC chip 5 are led out to the first pad 14 of the side substrate 13 through the circuit design of the side substrate 13, the first pad 14 and the second pad 15 are connected by tin paste or other metal materials to realize electrical connection; the solder substrate 12 is designed with a circuit, and the second pad 15 is divided into two parts, one part of the second pad 15 is electrically connected with the third pad 16, and the microphone MEMS chip 2 and the pressure MEMS chip 4 are respectively electrically connected with the third pad 16, thereby realizing the electrical connection between the microphone MEMS chip 2 and the microphone ASIC chip 3 and the electrical connection between the pressure MEMS chip 4 and the pressure ASIC chip 5. The other part of the second pad 15 is on the fourth pad 17, realizing the signal output of the microphone and the pressure.

[0034] In an embodiment, the side substrate 13 is electrically connected with the solder substrate 12. Specifically, the side substrate 13 is electrically connected with the solder substrate 12 through a metal conductive piece. More specifically, the metal conductive piece is a tin paste layer. In addition to ensuring sealing, the connection between the side substrate 13 and the solder substrate 12 also needs to realize the connection of the signal circuit, that is, the side substrate 13 and the solder substrate 12 need to be connected by tin paste or other metal materials. The sound hole substrate 11 and the side substrate 13 only need to ensure sealing, and metal materials or non-metal materials can be selected.

[0035] Reference Figure 2 and Figure 3In an embodiment, the first pads 14 are arranged on one side of the side substrate 13 facing the welding substrate 12, the second pads 15 are arranged around the periphery of the welding substrate 12, and the third pads 16 are arranged at the middle position of the welding substrate 12, and the third pads 16 are arranged between the plurality of second pads 15. In this way, the first pads 14 and the second pads 15 are conveniently connected. The number of the first pads 14 and the second pads 15 is plural, and part of the first pads 14 are electrically connected to the pressure ASIC chip 5, and the rest of the first pads 14 are electrically connected to the microphone ASIC chip 3. The number of the first pads 14 is consistent with the number of the second pads 15, and the first pads 14 and the second pads 15 are arranged one by one. The first pads 14 are also divided into two parts. The part of the first pads 14 electrically connected to the pressure ASIC chip 5 are electrically connected to the pressure MEMS chip 4 through the second pads 15, and the rest of the first pads 14 electrically connected to the microphone ASIC chip 3 are electrically connected to the microphone MEMS chip 2 through the second pads 15. The signals of the ASIC chip and the MEMS chip are transmitted respectively, and they do not interfere with each other. Of course, the number of the third pads 16 and the fourth pads 17 is also plural. For reference Figure 4 Specifically, the fourth pads 17 are arranged on the side of the welding substrate 12 connected to the client FPC, and the fourth pads 17 can also be called client pads. The second pads 15 and the third pads 16 are arranged on the side of the welding substrate 12 away from the client FPC. The pressure signal of the pressure ASIC chip 5 and the microphone signal of the microphone ASIC chip 3 are both transmitted to the fourth pads 17, realizing the output of the signals.

[0036] For reference Figure 1 In an embodiment, the pressure ASIC chip 5 and the microphone ASIC chip 3 are arranged on the opposite sides of the side substrate 13 respectively, the microphone MEMS chip 2 and the pressure MEMS chip 4 are both arranged on the welding substrate 12, and the microphone MEMS chip 2 is arranged close to the microphone ASIC chip 3, and the pressure MEMS chip 4 is arranged close to the pressure ASIC chip 5. Arranging the pressure ASIC chip 5 and the microphone ASIC chip 3 far away from each other can reduce the mutual interference of the signals. Arranging the microphone MEMS chip 2 close to the microphone ASIC chip 3 and the pressure MEMS chip 4 close to the pressure ASIC chip 5 can reduce the length of the wiring, and reduce the difficulty and cost of production.

[0037] For reference Figure 1In an embodiment, the back cavity 6 is formed by the microphone MEMS chip 2 and the soldering substrate 12, and the back cavity 6 is communicated with the back hole 7. The housing is formed with a containing cavity 1, and the microphone MEMS chip 2, the microphone ASIC chip 3, the pressure MEMS chip 4 and the pressure ASIC chip 5 are arranged in the containing cavity 1, that is, the hollow cavity formed by the sound hole substrate 11, the soldering substrate 12 and the side substrate 13. The microphone MEMS chip 2 is arranged in the containing cavity 1, the microphone MEMS chip 2 and the soldering substrate 12 form the back cavity 6, and the back hole 7 can be a cavity with a communication hole 8 formed on the soldering substrate 12, the back hole 7 is communicated with the back cavity 6 through the communication hole 8, which is equivalent to increasing the volume of the back cavity 6, thereby improving the signal-to-noise ratio of the combined sensor to a certain extent, and meeting the high performance requirements of customers. The embodiment has the advantages of being capable of improving the signal-to-noise ratio of the combined sensor. The embodiment is particularly suitable for a Top type combined sensor. Specifically, the communication hole 8 is formed on the soldering substrate 12, and the communication hole 8 communicates the back hole 7 and the back cavity 6.

[0038] Referring to Figure 1 In an embodiment, the microphone MEMS chip 2 and the soldering substrate 12, and the pressure MEMS chip 4 and the soldering substrate 12 are electrically connected by gold wires 9. The pad pins of the microphone MEMS chip 2 are electrically connected by the gold wires 9 and the soldering substrate 12, the pad pins of the pressure MEMS chip 4 are connected by the gold wires 9 and the soldering substrate 12, and then the signal transmission of the pressure is realized. An adhesive layer can also be arranged to wrap the gold wires 9, which functions to fix the gold wires 9 and prevent the gold wires 9 from being broken or falling off during use or transportation, thereby causing product failure.

[0039] According to another aspect of the present application, the present application also provides a microphone comprising the combined sensor described above. Since the microphone comprises all the technical solutions of all the embodiments of the combined sensor described above, it at least has all the beneficial effects brought by all the technical solutions described above, which will not be repeated here.

[0040] According to another aspect of the present application, the present application also provides an electronic device comprising the combined sensor described above. The electronic device can be a mobile phone or a smart bracelet. Since the electronic device comprises all the technical solutions of all the embodiments of the combined sensor described above, it at least has all the beneficial effects brought by all the technical solutions described above, which will not be repeated here.

[0041] The above is only an optional embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A combined sensor, characterized in that, The device includes a housing, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip, and a pressure ASIC chip. The housing includes a sound hole substrate, a welding substrate disposed opposite to the sound hole substrate, and side substrates respectively connecting the sound hole substrate and the welding substrate. The sound hole substrate, the welding substrate, and the side substrates of the welding substrate surround and form a receiving cavity. The microphone MEMS chip and the pressure MEMS chip are respectively disposed in the receiving cavity. The side substrates form a first receiving groove and a second receiving groove. The pressure ASIC chip is disposed in the first receiving groove, and the microphone ASIC chip is disposed in the second receiving groove. The pressure ASIC chip is electrically connected to the pressure MEMS chip and the welding substrate, and the microphone ASIC chip is electrically connected to the microphone MEMS chip and the welding substrate, respectively. The pressure ASIC chip and the microphone ASIC chip are respectively disposed on opposite sides of the side substrate to reduce signal interference between the pressure ASIC chip and the microphone ASIC chip; A back hole is formed in the welding substrate, a sound hole is formed on the sound hole substrate, and the microphone MEMS chip cooperates with the welding substrate to form a rear cavity, which is connected to the back hole.

2. The combined sensor according to claim 1, characterized in that, The side substrate is provided with a first pad, the welding substrate is provided with a second pad and a third pad on the side facing the side substrate, and the welding substrate is provided with a fourth pad on the side away from the receiving cavity. The pressure ASIC chip and the microphone ASIC chip are both electrically connected to the first pad, the microphone MEMS chip and the pressure MEMS chip are both electrically connected to the third pad, and the first pad, the third pad, and the fourth pad are all electrically connected to the second pad.

3. The combined sensor according to claim 2, characterized in that, The side substrate is electrically connected to the welding substrate.

4. The combined sensor according to claim 3, characterized in that, The side substrate and the welding substrate are electrically connected through a metal conductive element.

5. The combined sensor according to claim 4, characterized in that, The metal conductive component is a solder paste layer.

6. The combined sensor according to claim 2, characterized in that, The first pad is disposed on the side of the side substrate facing the welding substrate, the second pad is disposed around the circumference of the welding substrate, and the third pad is disposed at the middle position of the welding substrate.

7. The combined sensor according to claim 6, characterized in that, There are multiple first pads and multiple second pads. Some of the first pads are electrically connected to the pressure ASIC chip, and the remaining first pads are electrically connected to the microphone ASIC chip. The number of first pads and second pads are the same and they are set in a one-to-one correspondence.

8. The combined sensor according to any one of claims 1 to 7, characterized in that, Both the microphone MEMS chip and the pressure MEMS chip are disposed on the bonding substrate, with the microphone MEMS chip disposed close to the microphone ASIC chip and the pressure MEMS chip disposed close to the pressure ASIC chip.

9. The combined sensor according to any one of claims 1 to 7, characterized in that, A connecting hole is formed on the welding substrate, and the connecting hole connects the back hole and the rear cavity.

10. The combined sensor according to any one of claims 1 to 7, characterized in that, The microphone MEMS chip and the welding substrate, as well as the pressure MEMS chip and the welding substrate, are all electrically connected by gold wires.

11. A microphone, characterized in that, The microphone comprises the combined sensor according to any one of claims 1 to 10.

12. An electronic device, characterized in that, The electronic device includes the microphone as described in claim 11.

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