Electronic Devices

Abstract

An electronic device. The electronic device includes a housing, a first circuit board and a first radiator; the housing forms a containing space; the first circuit board and the first radiator are contained in the containing space along the direction of gravity, and at least one electronic component is disposed on one side of the first circuit board; the first radiator has a first substrate and at least one first side plate, the first substrate is adjacent to the first circuit board, the at least one electronic component conducts heat energy to the first substrate, the at least one first side plate is connected to the first substrate and forms a first heat dissipation channel along the direction of gravity with the first substrate; at least one first side plate is adjacent to or in contact with the housing; so that the heat energy of at least one electronic component is dissipated to the outside through heat conduction and heat convection. The electronic device of the present invention can increase the efficiency of system heat dissipation and reduce the cost of the radiator through the mutual coordination and optimization of the overall stacking structure, the arrangement of electronic components and the radiator structure design, and avoid mutual influence by conducting heat separately for electronic components with high and low temperature specifications.

Description

Technical Field

[0001] The present invention relates to an electronic device, and in particular to an electronic device with a heat-generating electronic component. Background Art

[0002] With the development of semiconductor technology and the demand for high-speed electronic communications, the heat generated by integrated circuit chips (IC) and other heat generating elements (electronic components) is getting higher and higher, which has become a heat dissipation problem for electronic devices. The common heat dissipation technology currently provides a heat sink made of a metal material with good thermal conductivity (such as aluminum or copper), and makes the chip contact the heat sink so that the heat from the chip is transferred to the fins of the heat sink for heat dissipation. Usually, the heat sink process and materials account for a lot of manufacturing costs.

[0003] In addition, when facing electronic components with greater heat generation, fans are usually needed to forcefully exhaust hot air and introduce surrounding low-temperature air into the electronic components to dissipate heat. This method usually consumes additional energy and is usually accompanied by noise problems.

[0004] Another problem is that with the development, there are more and more types of electronic components, and their heat generation is also different. The heat resistance of the materials of electronic components must also be considered. Even if the heat sink is sufficient to dissipate the heat of all electronic components, if the electronic components are not placed in an appropriate position, the electronic components with higher heat generation may affect the electronic components with lower heat generation.

[0005] Therefore, how to overcome the above-mentioned defects through improvement of structural design has become a problem to be solved in this technical field. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide an electronic device and a radiator to address the deficiencies of the prior art, which can utilize airflow of thermal convection to improve heat dissipation efficiency and whose structure can reduce manufacturing costs.

[0007] The technical problem to be solved by the present invention is to provide an electronic device, which arranges the electronic components according to the temperature specification (Junction Temperature, Tj) and arranges them appropriately according to the hot air convection direction to prevent the waste heat of the electronic components from affecting each other.

[0008] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide an electronic device, which includes a shell, a first circuit board and a first radiator. The shell forms an accommodating space. The first circuit board is accommodated in the accommodating space along the direction of gravity, and at least one electronic component is arranged on one side of the first circuit board. The first radiator is accommodated in the accommodating space along the direction of gravity, and the first radiator has a first substrate and at least one first side plate. The first substrate is adjacent to the first circuit board. At least one electronic component conducts heat to the first substrate. At least one first side plate is connected to the first substrate and forms a first heat dissipation channel along the direction of gravity with the first substrate; at least one first side plate is adjacent to or in contact with the shell; so that the heat energy of at least one electronic component is dissipated to the outside through heat conduction and heat convection.

[0009] According to one of the feasible embodiments of the present invention, the electronic device further includes a second heat sink, which is located on the other side of the first circuit board opposite to the first heat sink; at least one electronic component includes a first electronic component and a second electronic component, which conduct heat to different heat sinks respectively.

[0010] According to one of the feasible embodiments of the present invention, the heat resistance temperature of the first electronic component is greater than the heat resistance temperature of the second electronic component, and the position of the first electronic component along the gravity direction is higher than the position of the second electronic component along the gravity direction.

[0011] According to one of the feasible embodiments of the present invention, the first electronic component and the second electronic component are staggered along a lateral direction perpendicular to the gravity direction.

[0012] One of the beneficial effects of the present invention is that the electronic device provided by the present invention can increase the efficiency of system heat dissipation and reduce the cost of the radiator through the mutual coordination and optimization of the overall stacking structure, the arrangement of electronic components and the radiator structure design. In particular, after the electronic components are arranged according to the temperature specifications (Junction Temperature, Tj), they are arranged according to the direction of hot air convection, and the electronic components with high and low temperature specifications are separated for heat conduction to avoid mutual influence. Finally, the heat dissipation channel of the radiator accelerates the removal of waste heat from the electronic components through air convection and heat conduction with the shell. In addition, the radiator of the present invention is suitable for sheet metal processing, which can reduce costs compared to die-casting and aluminum extrusion processes.

[0013] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 FIG. 4 is a cross-sectional view of an electronic device according to a first embodiment of the present invention.

[0015] Figure 2 FIG. 4 is a cross-sectional view of an electronic device according to a second embodiment of the present invention.

[0016] Figure 3 FIG. 4 is a cross-sectional view of an electronic device according to a third embodiment of the present invention.

[0017] Figure 4 FIG. 4 is a cross-sectional view of an electronic device according to a fourth embodiment of the present invention.

[0018] Figure 5 FIG. 4 is a side view of an electronic device according to a fourth embodiment of the present invention.

[0019] Figure 6 It is a side view of an electronic device according to a fifth embodiment of the present invention.

[0020] Figure 7 FIG. 4 is a cross-sectional view of an electronic device according to a sixth embodiment of the present invention.

[0021] Figure 8 FIG. 4 is a side view of an electronic device according to a seventh embodiment of the present invention.

[0022] Main component symbols:

[0023] 1, 2, 3, 4, 5, 6, 7 Vertical electronic devices

[0024] 10a, 10b, 10c, 10d Housing

[0025] 101, 102 Ventilation holes

[0026] 11 Storage Space

[0027] P1 First Circuit Board

[0028] P2 Second Circuit Board

[0029] 20a, 20b, 20c first heat sink

[0030] 21. First substrate

[0031] 22a, 22b, 22c first side plate

[0032] 200 First heat dissipation channel

[0033] 20d Second Radiator

[0034] 21d Second substrate

[0035] 22d Second side panel

[0036] 200d Second cooling channel

[0037] 30 Third Radiator

[0038] 31, 32 Thermal bumps

[0039] C1 First Electronic Components

[0040] C2 Second electronic component

[0041] C3 Third Electronic Components

[0042] C4 Fourth Electronic Component

[0043] C5, C6 electronic components

[0044] D1 Clearance

[0045] D2 Width

[0046] T1, T2, T3, T4 heat transfer interface layer

[0047] f1, f2, f3 hot air convection DETAILED DESCRIPTION

[0048] The following is an explanation of the disclosed embodiments of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it is stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0049] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0050] [First embodiment]

[0051] See also Figure 1 FIG. 4 is a cross-sectional view of an electronic device according to a first embodiment of the present invention. Figure 1The electronic device 1 shown has substantially the same structure along the upright direction, and may also be referred to as an upright electronic device hereinafter. The upright direction in the present invention refers to the direction of gravity, which means that the electronic device is placed upright on a desktop. Specifically, the present embodiment can be applied to an upright network communication electronic device. However, the present invention is not limited thereto. With the advancement of network communication functions and the rise of the "fifth-generation mobile communication technology", high transmission rates of network communication electronic devices are accompanied by higher power consumption and more difficult heat dissipation problems. How to further improve the internal structure under the upright placement architecture, increase the system heat dissipation efficiency and reduce the cost of the heat dissipation structure is the goal to be achieved by the present invention.

[0052] The upright electronic device 1 of the present embodiment includes a housing 10a, a first circuit board P1, and a first heat sink 20a. The cross-sectional shape of the housing 10a is rectangular, which is only partially illustrated. Specifically, the housing 10a of the present embodiment is an upright rectangular cuboid. The housing 10a forms a receiving space 11. One side of the first circuit board P1 is adjacent to the first heat sink 20a, and the first circuit board P1 and the first heat sink 20a are uprightly received in the receiving space 11 along the direction of gravity.

[0053] A plurality of electronic components (C1, C2) are arranged on one side of the first circuit board P1. Specifically, these electronic components are integrated circuit (IC) chips, such as central processing units, memory, radio frequency integrated circuit chips, or power amplifiers. The power amplifier is an important component in the radio frequency transmission circuit, and its main function is to amplify and push out the signal. It is usually designed at the front end of the antenna transmitter and is also the most power-consuming component in the entire radio frequency front-end circuit. In other words, the power amplifier is usually an electronic component with high power consumption and high temperature specification (Junction Temperature, Tj). The high temperature specification means that the material and structure of the power amplifier are designed to withstand higher temperatures. One of the features of the present invention is to arrange the height positions of these electronic components according to the temperature specification, which will be described in detail later.

[0054] The first heat sink 20a is uprightly accommodated in the accommodating space 11 along the direction of gravity. The first heat sink 20a has a first substrate 21 and a pair of first side panels 22a. The first substrate 21 is adjacent to the first circuit board P1, and the electronic components (C1, C2) conduct heat energy to the first substrate 21. The first side panels 22a are connected to the first substrate 21 and form a first heat dissipation channel 200 along the direction of gravity with the first substrate 21; at least one first side panel 22a is adjacent to or in contact with the shell 10a; thereby, the heat energy of at least one electronic component (C1, C2) is dissipated to the outside through heat conduction and heat convection. In conjunction with the heat dissipation airflow of the first heat sink 20a, a plurality of ventilation holes (101, 102, see FIG. 101 , FIG. 102 ) are formed on the top and bottom of the shell 10a. Figure 5 , 6 In other words, the first heat dissipation channel 200 of the first heat sink 20a corresponds to the ventilation holes (101, 102, see Figure 5 , 6 ). At least one electronic component (C1, C2) conducts heat to the first substrate 21 through a heat transfer interface layer T1. The heat transfer interface layer is a layer of thermal interface materials (TIM) coated between the electronic component and the heat sink to fill the micro gaps and holes on the uneven surface generated when the two materials are joined or contacted, reduce the impedance of heat transfer, and improve the heat dissipation, such as liquid thermal grease or thermal gap filling gasket.

[0055] The first heat sink 20a has a pair of first side plates 22a, which are bent and extended from both sides of the first substrate 21, so as to surround and form a first heat dissipation channel 200. The outer shape of the pair of first side plates 22a corresponds to the housing 10a. In other words, the pair of first side plates 22a maintains a substantially same gap D1 with the inner surface of the housing 10a. The pair of first side plates 22a extend along the inner surface of the housing 10a and are close to each other, and the edges of the pair of first side plates 22a are close to each other and are separated by a width D2. The width D2 can be as small as possible, and even the edges of the pair of first side plates 22a are close to each other and contact each other, so that the sealing property around the first heat dissipation channel 200 is better, which is more conducive to the guidance of airflow. The gap D1 is also as small as possible, so that the first side plate 22a is close to or in contact with the housing 10a, which is also conducive to heat passing through the housing 10a to the outside through heat conduction.

[0056] The first heat sink 20a of the present embodiment can be made by sheet metal processing technology, but the present invention is not limited to this, and can also be die-cast or extrusion-cast. In accordance with the shape of the first heat sink 20a of the present embodiment, sheet metal processing technology is preferably applicable. Compared with die-casting or aluminum extrusion molding technology, sheet metal processing technology can save molds to reduce costs. Another advantage of the present embodiment is that the heat energy on the electronic components (C1, C2) is dissipated to the outside through air convection and heat conduction with the housing 10a through the U-shaped sheet metal heat sink. After simulation, the heat sink made of sheet metal processing technology is even better than the heat sink made of die casting or aluminum extrusion.

[0057] [Second embodiment]

[0058] See also Figure 2 , which is a cross-sectional view of an upright electronic device 2 according to a second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the housing 10b is cylindrical. The shape of the first heat sink 20b of this embodiment is semi-cylindrical, matching the cylindrical housing 10b. The first heat sink 20b has a first substrate 21 and a pair of arc-shaped first side plates 22b. The pair of first side plates 22b extend along the inner surface of the housing 10b and are close to each other. The first heat sink 20b of this shape can also be applied to sheet metal processing technology, saving molds to reduce costs.

[0059] [Third embodiment]

[0060] See also Figure 3 , which is a cross-sectional view of the upright electronic device 3 of the third embodiment of the present invention. The difference between this embodiment and the first embodiment is that the shell 10c is a rectangular cuboid or a rhombus cuboid. The shape of the first radiator 20c of this embodiment is a hollow triangular prism in conjunction with the cylindrical shell 10c. The first radiator 20c has a first substrate 21 and a pair of first side plates 22c in the form of flat plates. The pair of first side plates 22c extend along the inner surface of the shell 10c and are close to each other. The first radiator 20c of this shape can also be applied to sheet metal processing technology, saving molds to reduce costs.

[0061] [Fourth embodiment]

[0062] See also Figure 4 and Figure 5, which are respectively a cross-sectional view and a side view of a vertical electronic device 4 according to a third embodiment of the present invention. Compared with the first embodiment, the vertical electronic device 4 according to this embodiment includes a second heat sink 20d in addition to the first heat sink 20a. The second heat sink 20d is located on the other side of the first circuit board P1 opposite to the first heat sink 20a. In this embodiment, the electronic components include a first electronic component C1 and a second electronic component C2, which conduct heat energy to different heat sinks respectively. Specifically, the first electronic component C1 conducts heat energy to the second heat sink 20d through the heat transfer interface layer T1, and the second electronic component C2 conducts heat energy to the first heat sink 20a through the heat transfer interface layer T2. However, the present invention is not limited thereto, and the first electronic component C1 may also conduct heat energy to the first heat sink 20a, and the second electronic component C2 may conduct heat energy to the second heat sink 20d.

[0063] The cross-sectional shape of the second radiator 20d of this embodiment is similar to that of the first radiator 20a. The second radiator 20d has a second substrate 21d and a pair of second side plates 22d. The pair of second side plates 22d are bent and extended from both sides of the second substrate 21d, thereby surrounding and forming a second heat dissipation channel 200d. The outer shape of the pair of second side plates 22d also corresponds to the shell 10a. The pair of second side plates 22d extend along the inner surface of the shell 10a and are close to each other, and the edges of the pair of second side plates 22d are close to each other. The shell 10a of this embodiment is similar to the first embodiment, and is an upright rectangular cuboid. However, it can also be the same shape as the second and third embodiments. Alternatively, the outer shape of the second radiator can also be different from the first radiator 20a, and the second radiator can be a plate-shaped heat dissipation plate. (such as Figure 6 The shape shown in the third heat sink 30 in the middle)

[0064] like Figure 5As shown, one of the other features of the present invention is that the height positions of the electronic components are arranged according to the temperature specifications of the electronic components. Specifically, the heat resistance temperature of the first electronic component C1 is greater than the heat resistance temperature of the second electronic component C2, that is, the temperature specification of the first electronic component C1 is higher than that of the second electronic component C2. For example, the first electronic component C1 is a power amplifier (PA), and the other electronic components C2, C5, and C6 are central processing units, memories, or radio frequency integrated circuit chips, which are components with low power consumption. In this embodiment, the position of the first electronic component C1 along the gravity direction is arranged to be higher than the position of the second electronic component C2 along the gravity direction. In other words, the first electronic component C1 with a high temperature specification is placed at the rear end (downstream) position of the hot air convection (f1, f2) direction, and the other second electronic components C2 are placed at the front end (upstream) position of the hot air convection (f1, f2) direction. Thereby, the more heat energy generated by the first electronic component C1 will not affect the second electronic component C2. Furthermore, in this embodiment, the heat energy generated by the first electronic component C1 is conducted to the second heat sink 20d through the back of the first circuit board P1, and is conducted separately from the second electronic component C2. The advantage of this arrangement is that the electronic components are arranged according to the temperature specification (Junction Temperature, Tj), and arranged according to the convection direction, and the components with high and low temperature specifications are conducted separately to avoid mutual influence.

[0065] Supplementary explanation: the first electronic component C1 is a power amplifier as an example. In the art, due to the packaging method and characteristics of the power amplifier, the heat energy can be conducted from the bottom of the power amplifier to the back through the vias (VIA, not shown) of the circuit board. By placing the first circuit board P1 vertically, the power amplifier (first electronic component C1) is conducted to one side of the larger heat dissipation space, and the other electronic components with lower temperature specifications are conducted to the other side, ensuring that the heat energy of the power amplifier will not affect other electronic components and cause thermal damage.

[0066] like Figure 4 As shown, in this embodiment, the first electronic component C1 is preferably staggered with the second electronic component C2 along a lateral direction perpendicular to the gravity direction. In other words, the first electronic component C1 and the second electronic component C2 are staggered along the hot air convection direction (f1, f2), thereby making the airflow smoother and avoiding heat accumulation.

[0067] [Fifth embodiment]

[0068] like Figure 6, which is a side view of a vertical electronic device according to a fifth embodiment of the present invention. The vertical electronic device 5 of this embodiment further includes a second circuit board P2 and a third heat sink 30. The second circuit board P2 is located on one side of the second heat sink 20d, and the third heat sink 30 is located between the first circuit board P1 and the second circuit board P2; the third heat sink 30 is located on one side of the second circuit board P2, and the second circuit board P2 is located between the second heat sink 20d and the third heat sink 30. The second circuit board P2 has a third electronic component C3 and a fourth electronic component C4, which conduct heat energy to different heat sinks respectively.

[0069] Specifically, the first electronic component C1 and the third electronic component C3 both conduct heat energy to the third heat sink 30. The first electronic component C1 and the third electronic component C3 can be electronic components with higher temperature specifications. The heat conduction third heat sink 30 has two heat conduction bumps 31 and 32, which protrude toward the first circuit board P1 and the second circuit board P2 respectively. The first electronic component C1 conducts heat energy to the heat conduction bump 31 through the heat transfer interface layer T1, and the third electronic component C3 conducts heat energy to the heat conduction bump 32 through the heat transfer interface layer T3. The second electronic component C2 and the fourth electronic component C4 can be electronic components with lower temperature specifications, and conduct heat energy to the first heat sink 20a and the second heat sink 20d respectively.

[0070] The heat-conducting bumps 31 and 32 of the third heat sink 30 are conducive to forming a heat convection space between the first circuit board P1 and the second circuit board P2, and are conducive to forming hot air convection f3. The heat-conducting bumps 31 and 32 can also provide a space between other thicker electronic components and the third heat sink 30 to avoid the thickness of the heat transfer interface layer being too thick.

[0071] [Sixth embodiment]

[0072] like Figure 7 , is a cross-sectional view of an upright electronic device according to the sixth embodiment of the present invention. In the upright electronic device 6 of this embodiment, the first electronic component C1 is staggered with the second electronic component C2 along a lateral direction perpendicular to the direction of gravity. The third electronic component C3 is staggered with the fourth electronic component C4 along a lateral direction perpendicular to the direction of gravity. In this embodiment, the second electronic component C2 of the first circuit board P1 faces the first heat sink 20a, and the fourth electronic component C4 of the second circuit board P2 faces the second heat sink 20d. The effect of the above-mentioned lateral staggered arrangement of the electronic components is that the electronic components are staggered with each other along the direction of hot air convection, thereby making the airflow smoother and avoiding heat accumulation.

[0073] In addition, this embodiment can also be connected to heat sinks of different areas according to the amount of waste heat emitted by the electronic components. The first electronic component C1 and the third electronic component C3 can be components with higher temperature specifications, such as power amplifiers (PA).

[0074] The third heat sink 30 of this embodiment has two thermally conductive bumps 31 and 32. The position of the left thermally conductive bump 31 corresponds to the position of multiple electronic components (including the first electronic component C1), and the position of the right thermally conductive bump 32 corresponds to the position of multiple electronic components (including the third electronic component C3).

[0075] [Seventh embodiment]

[0076] like Figure 8 FIG. 4 is a side view of a vertical electronic device according to a seventh embodiment of the present invention.

[0077] In the upright electronic device 7 of this embodiment, the first electronic component C1 of the first circuit board P1 faces away from the first heat sink 20a, and the other electronic components of the first circuit board P1 (including the second electronic component C2) face the third heat sink 30. The third electronic component C3 of the second circuit board P2 faces away from the second heat sink 20d, and the other electronic components of the second circuit board P2 (including the fourth electronic component C4) face the third heat sink 30. The first electronic component C1 and the third electronic component C3 can be components with higher temperature specifications, such as power amplifiers (PA).

[0078] [Beneficial Effects of Embodiments]

[0079] One of the beneficial effects of the present invention is that the electronic device provided by the present invention can increase the efficiency of system heat dissipation and reduce the cost of the radiator through the mutual coordination and optimization of the overall stacking structure, the arrangement of electronic components and the radiator structure design. In particular, after the electronic components are arranged according to the temperature specifications (Junction Temperature, Tj), they are arranged according to the direction of hot air convection, and the electronic components with high and low temperature specifications are separated for heat conduction to avoid mutual influence. Finally, the waste heat of the electronic components is taken away by air convection and heat conduction with the shell through the U-shaped sheet metal radiator. In addition, the radiator of the present invention is suitable for sheet metal processing. Compared with die-casting and aluminum extrusion processes, the present invention can reduce costs, making the product of the present invention more advantageous in price.

[0080] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the claims of the present invention.

Claims

1. An electronic device, comprising: A shell, wherein the shell forms a containing space; a first circuit board, the first circuit board is accommodated in the accommodating space along the gravity direction, at least one electronic component is disposed on one side of the first circuit board, the at least one electronic component includes a first electronic component and a second electronic component, and the position of the first electronic component along the gravity direction is higher than the position of the second electronic component along the gravity direction; as well as a first heat sink, the first heat sink is accommodated in the accommodation space along the gravity direction, the first heat sink has a first substrate and at least one first side plate, the first substrate is adjacent to the first circuit board, the at least one electronic component conducts heat energy to the first substrate, the at least one first side plate is connected to the first substrate and forms a first heat dissipation channel with the first substrate along the gravity direction and parallel to the first circuit board; the at least one first side plate is adjacent to or in contact with the housing; so that the heat energy of the first electronic component and the second electronic component is dissipated to the outside through heat conduction and heat convection; The heat-resistant temperature of the first electronic component is greater than the heat-resistant temperature of the second electronic component.

2. The electronic device as described in claim 1, wherein the first radiator has a pair of first side plates, the pair of first side plates are bent and extended from both sides of the first substrate to surround and form the first heat dissipation channel, the outer shape of the pair of first side plates corresponds to the shell, the pair of first side plates extend along the inner surface of the shell and are close to each other, and the edges of the pair of first side plates are close to each other.

3. The electronic device as described in claim 2 further includes a second radiator, which is located on the other side of the first circuit board opposite to the first radiator; wherein when the heat energy of the first electronic component is conducted away through the first radiator, the heat energy of the second electronic component is conducted away through the second radiator; wherein when the heat energy of the first electronic component is conducted away through the second radiator, the heat energy of the second electronic component is conducted away through the first radiator.

4. The electronic device as described in claim 3, wherein the second radiator has a second substrate and a pair of second side plates, the pair of second side plates are bent and extended from both sides of the second substrate to form a second heat dissipation channel, the outer shape of the pair of second side plates corresponds to the shell, the pair of second side plates extend along the inner surface of the shell and are close to each other, and the edges of the pair of second side plates are close to each other. 5 . The electronic device as claimed in claim 1 , wherein the first electronic component and the second electronic component are staggered with each other along a lateral direction perpendicular to a gravity direction.

6. The electronic device as described in claim 3 further includes a second circuit board and a third radiator, the second circuit board is located on one side of the second radiator, and the third radiator is located between the first circuit board and the second circuit board; the third radiator is located on one side of the second circuit board, and the second circuit board is located between the second radiator and the third radiator; the second circuit board has a third electronic component, and the heat energy of the third electronic component is conducted to the third radiator.

7. The electronic device as claimed in claim 6, wherein the third heat sink further has at least one heat conductive bump protruding to at least one side, and the position of the at least one heat conductive bump corresponds to the position of the at least one electronic component, so that the heat energy of the at least one electronic component is conducted to the third heat sink through the at least one heat conductive bump.

8. The electronic device of claim 6, wherein the first electronic component of the first circuit board faces the first heat sink, and the third electronic component of the second circuit board faces the second heat sink.

9. The electronic device as claimed in claim 6, wherein the first electronic component of the first circuit board faces the third heat sink, and the third electronic component of the second circuit board faces the third heat sink. 10 . The electronic device as claimed in claim 3 , wherein the first heat sink and the second heat sink are made by sheet metal processing.

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