Mobile terminal

Abstract

The mobile terminal comprises a middle frame, a shielding cover, a heat source module and a heat dissipation device. The middle frame comprises a first surface; the shielding cover is arranged at a distance from the first surface and is provided with a shielding cavity; the heat source module is arranged between the first surface and the shielding cover and comprises a circuit board arranged on the first surface and a first heat source component arranged on the circuit board, the first heat source component being arranged in the shielding cavity; and the heat dissipation device is used for dissipating heat from the shielding cover and / or the heat source module. The mobile terminal has good heat dissipation efficiency and can reduce or avoid local overheating.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of electronic technology, and in particular, to a mobile terminal. BACKGROUND

[0002] At present, electronic devices such as mobile phones, tablets, wearable devices, ranging devices, and scanning devices have become essential technology products in people's life, learning, and entertainment processes. With the development of electronic devices, the number of cores of the CPU (Central Processing Unit) used by the electronic devices increases, and the performance of the CPU is increasingly enhanced, resulting in that the heat generated by the electronic devices is increasingly large. In recent years, temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices.

[0003] However, in the related application electronic device heat dissipation technical solutions, there is still a problem of not timely heat dissipation, which leads to local overheating of the electronic device. SUMMARY

[0004] The present disclosure provides a mobile terminal with good heat dissipation efficiency, which can reduce or avoid the occurrence of local overheating.

[0005] The technical scheme is as follows:

[0006] According to the present disclosure, a mobile terminal is provided, which includes a middle frame, a shielding cover, a heat source module, and a heat dissipation device. The middle frame includes a first surface. The shielding cover is arranged at a distance from the first surface and is provided with a shielding cavity. The heat source module is arranged between the first surface and the shielding cover and includes a circuit board arranged on the first surface and a first heat source component arranged on the circuit board, and the first heat source component is arranged in the shielding cavity. The heat dissipation device is used for dissipating heat from the shielding cover and / or the heat source module. The heat dissipation device includes a heat spreader and a heat dissipation component. The heat spreader is in thermal contact with the first heat source component. The heat dissipation component includes a heat dissipation fan and a semiconductor refrigeration component. The heat absorption part of the semiconductor refrigeration component is in thermal contact with the heat spreader. The heat dissipation fan is arranged towards the heat release part of the semiconductor refrigeration component.

[0007] The mobile terminal further includes a protective cover that cooperates with the middle frame to form a protective space. The heat source module is arranged in the protective space. The heat dissipation fan is detachably arranged on the protective cover. The protective cover is provided with an air hole that communicates with the protective space. The protective cover is provided with a waterproof and breathable membrane that covers the air hole. When the semiconductor refrigeration component can meet the heat dissipation requirement of the mobile terminal, the heat dissipation fan is separated from the protective cover. When the semiconductor refrigeration component cannot meet the heat dissipation requirement, the heat dissipation fan is connected to an external power supply and is installed in the mobile terminal through the protective cover to send external air into the mobile terminal through the air hole.

[0008] The technical scheme provided by the embodiments of the present disclosure can include the following beneficial effects:

[0009] In use of the mobile terminal of the present disclosure, the first heat source component is fixedly arranged in the shielding cavity, and the shielding cover and / or the heat source module can be cooled by the heat dissipation device, so that the mobile terminal of the present disclosure can have good shielding effect and ensure heat dissipation efficiency, thereby avoiding local overheating of the first heat source component in the shielding cavity and improving operation stability and reliability. In addition, the heat source module is arranged on the middle frame, and the area of the middle frame can be fully utilized for heat dissipation, which is conducive to further improving the heat dissipation efficiency.

[0010] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0011] The accompanying drawings, which are included as part of the present disclosure, serve to provide further understanding of the present disclosure, and the illustrative embodiments of the present disclosure and their description serve to explain the present disclosure, and do not constitute improper limitations on the present disclosure.

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0013] Figure 1 It is an structural schematic diagram of the mobile terminal shown in an embodiment.

[0014] Figure 2 It is a structural front view schematic diagram of the middle frame shown. Figure 1

[0015] Figure 3 It is a partial structural exploded schematic diagram of the mobile terminal shown. Figure 1

[0016] Figure 4 It is a side view schematic diagram of the shielding module in the mobile terminal shown. Figure 3

[0017] It is a side view schematic diagram of the shielding module in the mobile terminal shown. Figure 5

[0018] It is a partial sectional view schematic diagram of the shielding module in the mobile terminal shown. Figure 6

[0019] Figure 7 It is a partial sectional view schematic diagram of the shielding module in the mobile terminal shown.

[0020] ​​​Figure 8 A top view of a passive heat dissipation structure according to an embodiment.

[0021] Figure 9 A structure rear view of a middle frame heat dissipation module according to an embodiment. Figure 2

[0022] Figure 10 A structure exploded view of a middle frame heat dissipation module according to an embodiment. Figure 9

[0023] Figure 11 A partial structure view of a middle frame heat dissipation module according to an embodiment. Figure 10

[0024] Figure 12 An enlarged view of A according to an embodiment. Figure 11

[0025] Figure 13 A heat dissipation state view of a middle frame heat dissipation module according to an embodiment. Figure 11

[0026] Figure 14 An enlarged view of B according to an embodiment. Figure 13

[0027] Figure 15 A structure view of another embodiment of a middle frame heat dissipation module according to an embodiment. Figure 9

[0028] A partial structure view of a middle frame heat dissipation module according to another embodiment. Figure 16 BRIEF DESCRIPTION OF DRAWINGS

[0029]

[0030] ​​​​​​​10, middle frame; 11, first surface; 12, second surface; 13, cooling part; 14, battery mounting part; 15, loop tube groove; 16, mounting groove; 20, shielding cover; 21, shielding cavity; 30, heat source module; 31, circuit board; 32, first heat source component; 33, second heat source component; 40, heat dissipation device; 100, vapor chamber; 110, first heat sink; 120, second heat sink; 130, connecting heat sink; 140, heat dissipation space; 150, heat conduction layer; 200, heat dissipation component; 210, heat dissipation fan; 220, passive heat dissipation structure; 221, heat conduction body; 222, heat dissipation fin; 230, semiconductor refrigeration component; 300, heat dissipation layer; 400, loop heat pipe; 410, evaporator; 411, liquid supplementing end; 412, gas outlet end; 413, evaporation part; 414, liquid storage cavity; 420, pipeline unit; 421, first conveying pipe; 422, second conveying pipe; 423, condensing pipe; 424, liquid supplementing branch; 425, gas outlet branch; 430, anti-backflow structure; 432, Tesla valve structure; 500, working fluid; 600, sealing cover; 700, heat-conducting adhesive layer; 50, protective cover; 51, air hole. DETAILED DESCRIPTION

[0031] In order to make the objects, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and do not limit the protection scope of the present disclosure.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the present disclosure herein is only for the purpose of describing specific embodiments and is not intended to limit the present disclosure.

[0033] For the convenience of understanding, the technical terms involved in the embodiments of the present disclosure will be explained and described below.

[0034] Vapor chamber (VC in English), a vacuum cavity with microstructure, has good heat dissipation function, its material includes but not limited to copper, stainless steel, titanium alloy, etc.

[0035] The heat dissipation fan includes a micro turbine fan or an axial flow fan, etc.

[0036] Thermal Electric Cooler (TEL in English), also known as Peltier refrigeration component.

[0037] Thermal Interface Material (TEL) has good thermal conductivity, and its specific implementation includes but is not limited to thermal silicone grease, thermal conductive glue, thermal pad, etc.

[0038] Loop Heat Pipe (LHP) is a closed loop heat pipe with good heat dissipation function.

[0039] Passive heat dissipation structure has sheet-shaped heat dissipation teeth and / or heat dissipation fins.

[0040] Resistor-capacitor element, a general term for resistor and capacitor elements.

[0041] At present, electronic devices such as mobile phones, tablets, wearable devices, ranging devices, and scanning devices have become essential technology products in people's life, learning and entertainment. With the development of electronic devices, the number of cores of the CPU (Central Processing Unit) used by the electronic devices increases, and the performance of the CPU increases, resulting in increasing heat generation of the electronic devices, which poses higher and higher challenges to the heat dissipation performance of the electronic devices. In recent years, temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices. At the same time, the better the heat dissipation performance, the more balanced the heat dissipation, the more likely consumers are to purchase, so improving the heat dissipation efficiency of electronic devices and avoiding local overheating has become a problem that the industry pays more and more attention to.

[0042] However, in related application electronic device heat dissipation technical solutions, heat dissipation is not timely, and the heat dissipation efficiency is difficult to improve. Heat dissipation is not timely, which will cause local overheating of the electronic device, which will affect the operation performance of the electronic device, and even cause the electronic device to crash.

[0043] Therefore, the present disclosure provides an electronic device that can improve heat dissipation efficiency and avoid local overheating to ensure the operation performance of the electronic device and improve the reliability of the electronic device.

[0044] The technical solutions of the present disclosure will be further described below in combination with specific structural drawings.

[0045] As shown in Figures 1 to 4 is a structural diagram of an electronic device and an electronic device according to an embodiment. Among them, Figure 1 is a structural diagram of a mobile terminal according to an embodiment. Figure 2 is Figure 1 is a partial structural explosion diagram of a mobile terminal according to an embodiment. Figure 3 is Figure 2 is a structural front view diagram of a middle frame according to an embodiment. Figure 4 is Figure 3 is a side view diagram of a shielding module in an electronic device according to an embodiment.

[0046] Embodiments of the present disclosure provide an electronic device, which can be a mobile phone, a tablet computer, an e-reader, a notebook computer, a vehicle-mounted device, a wearable device, a ranging device, a scanning device, etc., comprising a middle frame 10, a shielding cover 20, a heat source module 30, and a heat dissipation device 40.

[0047] The middle frame 10 comprises a first surface 11; the shielding cover 20 is arranged spaced apart from the first surface 11, and the shielding cover 20 is provided with a shielding cavity 21; the heat source module 30 is arranged between the first surface 11 and the shielding cover 20, and the heat source module 30 comprises a circuit board 31 arranged on the first surface 11 and a first heat source component 32 arranged on the circuit board 31, and the first heat source component 32 is arranged in the shielding cavity 21; and the heat dissipation device 40 is used for dissipating heat from the shielding cover 20 and / or the heat source module 30.

[0048] When the electronic device of the present disclosure is in use, the first heat source component 32 is fixedly arranged in the shielding cavity 21, and the heat dissipation device 40 can be fully utilized to dissipate heat from the shielding cover 20 and / or the heat source module 30, so that the electronic device of the present disclosure can have better shielding effect while ensuring heat dissipation efficiency, thereby avoiding local overheating of the first heat source component 32 arranged in the shielding cavity 21, and improving the operation stability and reliability.

[0049] In the embodiments of the present disclosure, the middle frame 10 can be a frame structure of the electronic device, and in addition to the heat spreader 100 and the heat source module 30, other parts or all components of the electronic device can be directly or indirectly arranged on the middle frame 10 to assemble the electronic device.

[0050] Optionally, the middle frame 10 can be arranged inside the electronic device, and the edge of the middle frame 10 can be designed as part of the shell of the electronic device. When the edge of the middle frame 10 serves as the shell of the electronic device, it can protect the electronic device.

[0051] Optionally, the middle frame 10 can have a planar or planar-like structure, so that two sides of the middle frame 10 can be visually distinguished, which can be referred to as the front and back of the middle frame 10, or the two sides can also be referred to as one side and the other side of the middle frame 10. Inside the middle frame 10, part of it can be partially hollowed out as needed to arrange other components in the electronic device.

[0052] Optionally, part or all of the middle frame 10 can be made of metal or alloy material (for example, aluminum alloy). Of course, the material of the middle frame 10 can also be other materials, which are not limited in the embodiments of the present disclosure.

[0053] In some embodiments, the heat dissipation device 40 comprises a heat plate 100 which is in thermal contact with the first heat source component 32. In this way, the heat dissipation efficiency and the heat conduction efficiency of the shielding cover 20 can be improved by using the heat plate 100, so as to dissipate heat from the first heat source component 32 and avoid overheating at the shielding cover 20.

[0054] On the basis of any of the above embodiments, in an embodiment, the heat plate 100 further comprises a phase change working medium. In this way, the phase change working medium can be selected according to actual needs to meet the heat dissipation needs of different electronic devices and obtain better cost performance.

[0055] On the basis of any of the above embodiments, in an embodiment, the boiling point of the phase change working medium is 20-90℃. In this way, the heat plate 100 has good heat conduction performance and heat dissipation performance under the working temperature of 10-45℃ of the electronic device. Further, the heat generated by the heat source module 30 can be promptly dissipated through the heat plate 100, and the heat can be promptly reduced or transferred to a lower temperature position by using the movement of the phase change working medium inside the heat plate, so that the heat dissipation inside the electronic device is uniform.

[0056] The phase change working medium includes but is not limited to formaldehyde, methanol, ethanol or a mixture thereof with pure water.

[0057] In addition, the starting temperature of the heat plate 100 can be adjusted as needed. For example, by adjusting the vacuum degree in the cavity of the heat plate 100 and / or using a phase change working medium with different boiling points to reduce the starting temperature of the heat plate 100, the equilibrium state of full phase change of gas and liquid can be achieved in advance.

[0058] In some embodiments, the heat plate 100 comprises a first heat sink 110, a connecting heat sink 130 and a second heat sink 120 which is in thermal contact with the first heat source component 32, the first heat sink 110 is fixed to the first surface 11, the second heat sink 120 is connected to the first heat sink 110 through the connecting heat sink 130, and the second heat sink 120 is arranged in opposite to the first heat sink 110 to form a heat dissipation space 140 accommodating the heat source module 30. In this way, the connecting heat sink 130 is used to bend the heat plate 100 to form the first heat sink 110 and the second heat sink 120 which are arranged in opposite to form the heat dissipation space 140, and the first heat sink 110 is arranged on the middle frame 10. The heat dissipation efficiency of the middle frame 10 can be improved, the heat source module 30 can be fixed in the heat dissipation space 140 through the middle frame 10, and the first heat sink 110, the second heat sink 120 and the connecting heat sink 130 can be fully utilized to dissipate heat from the heat source module 30, so that the electronic device has high heat dissipation efficiency and is beneficial to avoid local overheating of the heat source module 30, thereby further ensuring the operation stability of the electronic device.

[0059] On the basis of the above-mentioned embodiments, in an embodiment, at least part of the connecting heat sink 130 has flexibility. In this way, the second heat sink 120 can be bent over the first heat sink 110 to form the heat dissipation space 140.

[0060] Alternatively, in another embodiment, the vapor chamber 100 is a flexible vapor chamber. In this way, the first heat sink 110, the second heat sink 120, and the connecting heat sink 130 can be integrally formed and manufactured, the second heat sink 120 can be bent over the first heat sink 110 to form the heat dissipation space 140, and the heat transfer path can be shortened and the conduction thermal resistance can be reduced.

[0061] In addition, the integrally formed and manufactured vapor chamber 100 is beneficial to improve the reliability.

[0062] On the basis of any of the above-mentioned embodiments, in an embodiment, the phase change working medium is arranged in at least one of the first heat sink 110, the second heat sink 120, or the connecting heat sink 130. In this way, the phase change working medium can be selected according to actual needs to meet the heat dissipation needs of the electronic device and obtain better cost performance.

[0063] Alternatively, the phase change working medium is arranged in the first heat sink 110, the second heat sink 120, and the connecting heat sink 130. In this way, the heat dissipation of the vapor chamber 100 is more uniform, which is beneficial to further avoid local overheating of the electronic device caused by heat generation of the heat source module 30.

[0064] In addition to the vapor chamber, the heat dissipation device can also integrate other heat dissipation devices. For example, Figures 5 to 7 FIG. 1 is a structural diagram of a shielding module in an electronic device according to some embodiments. Figure 5 FIG. 2 is a side view of a shielding module according to another embodiment. Figure 6 FIG. 3 is a partial cross-sectional view of a shielding module according to another embodiment. Figure 7 FIG. 4 is a partial cross-sectional view of a shielding module according to another embodiment. Figure 8 FIG. 5 is a top view of a passive heat dissipation structure 220 according to an embodiment.

[0065] In some embodiments, the heat dissipation device 40 further includes a heat dissipation device 200 arranged outside the shielding cover 20, and the heat dissipation device 200 is used to actively dissipate heat from the vapor chamber 100. In this way, the heat dissipation device 200 can be used to actively dissipate heat from the vapor chamber 100 to further improve the heat dissipation efficiency of the shielding cover 20 and avoid overheating of the shielding cover 20. At the same time, the cooperation of the middle frame 10 and the heat dissipation device 200 makes the heat dissipation of the heat source module 30 more uniform, which is beneficial to further avoid local overheating.

[0066] In some embodiments, the vapor chamber 100 is a side wall of the shielding cavity 21.

[0067] There are several ways to implement the heat dissipation device 200:

[0068] For example, such as Figure 6 As shown, in one embodiment, the heat dissipation device 200 includes a cooling fan 210, which is positioned towards the heat spreader 100. Thus, the cooling fan 210 can generate turbulent airflow, further achieving uniform heat dissipation from the shield 20 and preventing overheating at the shield 20. Furthermore, by interacting with external gas and introducing cool external gas into the electronic device to cool it down, the heat dissipation efficiency of the electronic device can be further improved.

[0069] The cooling fan 210 can be installed inside the electronic device or it can be detached and installed inside the electronic device; no further restrictions are imposed here.

[0070] Alternatively, in another embodiment, the heat dissipation device includes a semiconductor cooler for actively dissipating heat from the heat spreader. Thus, by using a semiconductor cooler as an active heat dissipation element, the heat absorbed by the heat-absorbing part actively absorbs the heat transferred from the heat spreader, improving the heat dissipation performance of the heat spreader, reducing the temperature inside the shielding cavity, preventing overheating at the shielding cover 20, and consequently improving the reliability of the electronic equipment.

[0071] Alternatively, in another embodiment, the heat dissipation device includes a cooling fan and a thermoelectric cooler. The heat-absorbing portion (not labeled) of the thermoelectric cooler is thermally conductively connected to the heat spreader plate, and the cooling fan is positioned towards the heat-dissipating portion (not labeled) of the thermoelectric cooler. In this way, the heat-absorbing portion of the thermoelectric cooler actively absorbs heat from the heat spreader plate, improving its heat dissipation performance. Simultaneously, the cooling fan can actively blow air onto the thermoelectric cooler or create negative pressure, increasing the airflow speed outside the shielding cover, accelerating heat dissipation, further reducing the temperature inside the shielding cavity 21, and preventing overheating at the shielding cover 20.

[0072] In addition to active heat dissipation components, the heat dissipation device 200 can also integrate a passive heat dissipation structure 220.

[0073] For example, such as Figure 6 As shown, in one embodiment, the heat dissipation device 200 includes a cooling fan 210 and a passive heat dissipation structure 220. The passive heat dissipation structure 220 is fixed to the heat spreader 100, and the cooling fan 210 is disposed on the passive heat dissipation structure 220. Thus, the passive heat dissipation structure 220 absorbs heat from the heat spreader 100, accelerating the heat dissipation of the heat spreader 100. Simultaneously, the cooling fan 210 generates turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 220, resulting in high heat dissipation efficiency and uniform heat dissipation for the electronic device.

[0074] Or, refer to Figure 7 As shown, in another embodiment, the heat dissipation device 200 includes a passive heat dissipation structure 220 and a thermoelectric cooler 230. The heat-absorbing part of the thermoelectric cooler 230 is thermally conductively connected with the heat spreader 100, and the passive heat dissipation structure 220 is disposed on the heat-releasing part of the thermoelectric cooler 230. Thus, by using the thermoelectric cooler 230 as an active heat dissipation element, it actively absorbs the heat transferred from the heat spreader 100 through its heat-absorbing part and actively transfers the heat energy to the passive heat dissipation structure 220 through its heat-releasing part for heat dissipation, thereby improving heat dissipation efficiency and preventing overheating at the shielding cover 20.

[0075] Or, such as Figure 7 As shown, in another embodiment, the heat dissipation device 200 includes a passive heat dissipation structure 220, a cooling fan 210, and a thermoelectric cooler 230. The heat absorption portion of the thermoelectric cooler 230 is thermally conductively connected to the heat dissipation portion of the thermoelectric cooler 230. The passive heat dissipation structure 220 is disposed on the heat dissipation portion of the thermoelectric cooler 230, and the cooling fan 210 is disposed on the passive heat dissipation structure 220. Thus, the thermoelectric cooler 230 is used as an active heat dissipation element, actively absorbing the heat transferred from the heat dissipation portion through the heat absorption portion and actively transferring the heat energy to the passive heat dissipation structure 220 for heat dissipation through the heat dissipation portion. Furthermore, the cooling fan 210 can generate turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 220, resulting in high heat dissipation efficiency and uniform heat dissipation for the electronic device, preventing overheating at the shielding cover 20.

[0076] The cooling fan 210, or the cooling fan 210 and the passive cooling structure 220, can be detachably installed in the electronic device.

[0077] In some embodiments, the electronic device further includes a protective cover 50 that cooperates with the mid-frame 10 to form a protective space, and at least a portion of the heat dissipation device 200 is detachably connected to the protective cover 50. Thus, when the heat dissipation device 200 includes a cooling fan 210, the cooling fan 210 can be detachably mounted on the protective cover 50.

[0078] In some embodiments, when the electronic device is a mobile terminal, the protective cover 50 is a back cover.

[0079] Based on any of the above embodiments of the protective cover 50, in one embodiment, the protective cover 50 is provided with a vent 51 communicating with the protective space. Thus, when the electronic device can meet its heat dissipation requirements using the semiconductor cooler 230, the cooling fan 210 can be removed to reduce wear and tear. When the semiconductor cooler 230 cannot meet the heat dissipation requirements, the cooling fan 210 can be connected to an external power source and installed in the electronic device, using the vent 51 to deliver external air into the electronic device, thereby improving the heat dissipation efficiency of the electronic device.

[0080] Optionally, the electronic device is a smart TV, and the heat dissipation fan 210 in any of the above embodiments is detachably arranged on the rear cover. In this way, the heat dissipation fan 210 can be selectively installed according to different specifications of the central processing unit corresponding to different models of the smart TV, thereby reducing production costs, avoiding waste of heat dissipation performance, and reducing energy consumption.

[0081] Optionally, the protective cover 50 is provided with a waterproof and breathable film (not shown) covering the air hole 51. In this way, the waterproof and breathable film can ensure the heat exchange efficiency while improving the waterproof and / or dustproof performance of the electronic device.

[0082] In some embodiments, the air hole 51 includes an air inlet hole and an air outlet hole. In this way, the heat dissipation fan 210 cooperates with the air inlet hole and the air outlet hole to form a directional airflow in the protective space, thereby further improving the heat dissipation efficiency.

[0083] In some embodiments, the passive heat dissipation structure 220 includes a heat conductor 221 and a heat dissipation fin 222, and the heat dissipation fin 222 is arranged on the outer surface of the heat conductor 221. The heat conductor 221 transmits the heat generated by the heat source module 30 to the heat dissipation fin 222, and the heat dissipation fin 222 further transmits the heat to the external air, thereby enhancing the heat dissipation effect. For example, the heat conductor 221 and the heat dissipation fin 222 are respectively arranged as independent components, or the passive heat dissipation structure 220 is integrally cast to enhance the mechanical properties.

[0084] The material of the passive heat dissipation structure 220 is aluminum alloy. For example, the specific surface area of the heat dissipation fin 222 is 4 to 10 times that of the heat conductor 221, for example, the specific surface area of the heat dissipation fin 222 is 6.8 times that of the heat conductor 221.

[0085] When the heat dissipation fan 210 is combined with the passive heat dissipation structure 220, the heat dissipation fan 210 is arranged outside the heat conductor 221, and the heat dissipation fin 222 includes a plurality of fins. The heat dissipation flow channel is formed between adjacent two fins, and the heat dissipation flow channel is used to guide the airflow generated by the heat dissipation fan 210, thereby improving the heat dissipation efficiency.

[0086] Of course, in other embodiments, the semiconductor refrigeration device 230 can also be arranged on other components, such as the heat source module 30. The heat absorption part of the semiconductor refrigeration device 230 actively absorbs the heat of the heat source module 30, and the heat dissipation part transmits the heat to the heat conduction plate, thereby improving the heat dissipation efficiency of the electronic device.

[0087] In order to further improve the heat dissipation efficiency of the shielding cover 20, in some embodiments, the heat dissipation device 40 further includes a heat dissipation layer 300 arranged on the outer side wall of the shielding cover 20 and the heat conduction plate 100.

[0088] The heat dissipation layer 300 includes, but is not limited to, a graphene coating.

[0089] In the embodiments of the present disclosure, the heat source module 30 refers to a device that radiates more heat in the electronic device, and includes at least one heat source component, i.e., a heat generating element.

[0090] In an exemplary embodiment, the heat source module 30 further includes a second heat source component 33, which is arranged on the other side of the circuit board 31 relative to the first heat source component 32, and is in thermal conduction with the middle frame 10. In this way, the middle frame 10 can also dissipate heat for the second heat source component 33, so as to sufficiently dissipate heat for the heat source module 30, and avoid local overheating of the electronic device due to untimely heat dissipation of the heat source module 30.

[0091] In actual application, the heat radiated by the component is generally positively correlated with the power consumption of the component. The greater the power consumption of the component, the greater the heat radiated by the component. Correspondingly, the heat source component in the present disclosure can be a device in the electronic device whose power consumption exceeds M% of the total power consumption of the machine, and M can be 20, 30, 40, etc.

[0092] Optionally, the heat source component can include a central processing unit, a processor device integrating processing and storage functions, a power supply component (such as a battery), etc.

[0093] In an exemplary embodiment, the first heat source component 32 is a central processing unit (CPU), and the second heat source component 33 is a resistor-capacitor device, and is arranged on the two board surfaces of the circuit board 31, respectively. The central processing unit is arranged in the shielding cavity 21 and is in thermal conduction with the vapor chamber 100, and the resistor-capacitor device is in thermal conduction with the middle frame 10.

[0094] Optionally, the central processing unit is fixed on the vapor chamber 100 through the heat conduction layer 150. The heat conduction layer 150 can be arranged between the central processing unit and the vapor chamber 100 in various ways, such as pasting, smearing, spraying, or clamping the formed heat conduction layer 150 between the central processing unit and the vapor chamber 100 through a fixed connection mode.

[0095] In an exemplary embodiment, the heat conduction layer 150 is elastic and is squeezed between the central processing unit and the vapor chamber 100. In this way, the heat conduction layer 150 can fully fill the gap between the central processing unit and the vapor chamber 100, increase the contact area, and improve the heat dissipation efficiency of the central processing unit. In addition, the heat conduction layer 150 is elastic and can play a buffering role to protect the central processing unit.

[0096] In some exemplary embodiments, the heat conduction layer 150 is one of a heat-conducting silica gel, a heat-conducting rubber, and the like.

[0097] Similarly, the resistance-capacitance device can also be in thermal contact with the middle frame 10 through the heat-conducting layer 150. In this way, the middle frame 10 can be fully utilized for heat dissipation.

[0098] Of course, the heat source component can also be other, and the embodiments of the present disclosure do not make specific limitations on this.

[0099] In addition, in some embodiments, the heat-conducting layer 150 with elasticity can also be arranged between the above-mentioned independent adjacent components to improve the heat conduction effect between the adjacent components and accelerate the heat dissipation efficiency by using the heat-conducting layer 150.

[0100] The heat-conducting layer 150 can be arranged between the middle frame 10 and the first heat sink 110, and / or between the second heat sink 120 and the heat dissipation device 200, and / or between the first heat sink 110 and the heat source module 30, and so on.

[0101] In order to further improve the heat dissipation efficiency and effect of the electronic device, the heat dissipation efficiency of the middle frame 10 can be further improved, so that the components directly or indirectly arranged on the middle frame 10 have a good heat dissipation environment.

[0102] As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 9 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 14 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 9 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 2 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 10 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 9 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 11 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 10 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 12 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 11 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 13 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 11 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 14 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module. Figure 13 As shown in FIGS. 1 to 3, the middle frame 10 of the electronic device according to some embodiments of the present disclosure comprises a heat dissipation module.

[0103] In some embodiments, the middle frame 10 further comprises a cooling part 13 and a second surface 12 opposite to the first surface 11, and the heat dissipation device further comprises a loop heat pipe 400 and a working fluid 500; the loop heat pipe 400 is arranged on the second surface 12, and the loop heat pipe 400 comprises an evaporator 410 and a pipe unit 420; the evaporator 410 is arranged opposite to the second heat source component 33, and the evaporator 410 comprises a liquid supplementing end 411 and a gas outlet end 412; one end of the pipe unit 420 is in communication with the liquid supplementing end 411, and the other end of the pipe unit 420 is in communication with the gas outlet end 412; and part of the pipe unit 420 is in heat conduction cooperation with the cooling part 13; the working fluid 500 is arranged in the loop heat pipe 400, and the working fluid 500 in a liquid state can be converted into a gas state by the evaporator 410; the working fluid 500 in a gas state can flow into the pipe unit 420 through the gas outlet end 412; and the working fluid 500 in a gas state can be re-liquefied in the pipe unit 420 and then fed into the liquid supplementing end 411.

[0104] In this way, the loop heat pipe 400 is integrated on the middle frame 10, the heat of the second heat source component 33 is absorbed by the evaporator 410 to actively dissipate heat of the heat source module 30, and then the heat is transferred to the cooling part 13 by the pipe unit 420, so that the space of the middle frame 10 can be fully utilized for heat dissipation, and the heat dissipation performance of the middle frame 10 can be improved, thereby facilitating the improvement of the heat dissipation efficiency of the elements integrated on the middle frame 10, especially the heat source module 30 which is prone to heat.

[0105] In some embodiments, the first surface 11 is the front surface of the middle frame 10, and the second surface 12 is the back surface of the middle frame 10.

[0106] It should be noted that the "cooling part 13" generally refers to a position where the temperature of the heat source module 30 rises slowly, that is, a position where the temperature inside the electronic device is relatively lower than the temperature of the "heat source module 30" during use of the electronic device.

[0107] Optionally, the back surface area corresponding to the battery compartment and the small plate area far away from the "second heat source component 33" can be set as the cooling part 13 to accelerate the liquefaction of the working fluid 500.

[0108] It should be noted that the "working fluid 500" includes but is not limited to a cooling liquid (such as water) and other fluids that can be applied to the loop heat pipe 400, and the boiling point of the "working fluid 500" can be adjusted according to actual needs, which is not limited herein.

[0109] For example, the working fluid 500 includes but is not limited to formaldehyde, methanol, ethanol or a mixture thereof with pure water.

[0110] It should be noted that the "evaporator 410" comprises a capillary wick and other structures, and the specific structure thereof includes but is not limited to other evaporators 410 that can be applied to the loop heat pipe 400.

[0111] In some embodiments, when the electronic device of the present disclosure is in use, the heat source module 30 generates heat due to operation, and the evaporator 410 can actively absorb the heat transferred by the heat source module 30 through the middle frame 10, so that the liquid working fluid 500 in the evaporator 410 absorbs heat and evaporates, consumes heat energy, and flows to the cooling part 13 through the pipeline unit 420 due to volume expansion. In this process, the gaseous working fluid 500 will transfer heat to the middle frame 10, and can release a large amount of heat and condense into liquid when flowing through the cooling part 13. The liquefied working fluid 500 will return to the liquid supplement end 411 under the driving action of the capillary force of the capillary core in the evaporator 410. The liquid in the compensation cavity will be evaporated again by the evaporator 410 to continue to absorb heat. In this way, an evaporation-condensation cycle is formed, and the circulation of the working fluid 500 is driven by the capillary pressure generated by the capillary core of the evaporator 410, the flow direction of the working fluid 500 is regular and the flow rate is fast, which can accelerate heat dissipation. Further, the heat of the heat source module 30 can be actively cooled by the middle frame 10, and the heat can be transported and dissipated to the battery compartment and the small plate and other cooling parts 13 at a long distance, fully utilizing the size of the middle frame 10 for heat dissipation, and greatly improving the heat dissipation efficiency of the electronic device.

[0112] The heat dissipation device of the present disclosure realizes the core capability improvement of large heat transfer amount and long heat transfer distance without increasing the thickness of the traditional middle frame 10 and the whole machine stack, and combines the distribution of the heat source part and the non-heat source part (i.e. the cooling part 13), fully utilizing the entire middle frame 10 area for efficient heat dissipation.

[0113] In some embodiments, at least part of the loop heat pipe 400 is embedded on the middle frame 10. Further, the thickness space of the middle frame 10 can be fully utilized to integrate the loop heat pipe 400, that is, the contact area can be increased, thereby improving the heat dissipation efficiency, and actively reducing the thickness size of the heat dissipation structure. Further, the heat dissipation device of the present disclosure can adapt to the light and thin design needs of the electronic device, so that the electronic device of the present disclosure can be designed to be lighter and thinner, and at the same time has good heat dissipation performance, which can improve the product competitiveness.

[0114] As shown in FIG. 1, Figure 4 In some embodiments, the middle frame 10 and the cooling part 13 are arranged on both sides of the battery mounting part 14. In this way, the middle frame 10 and the cooling part 13 can be separated to fully dissipate heat. At the same time, the battery mounting part 14 can be cooled when flowing through the battery mounting part 14.

[0115] As shown in the drawings, the electronic device of the present disclosure can integrate the central processor as the heat source module 30 on the mainboard, and make the mainboard be arranged at one end of the battery, and the small board or the charging control board and the like be placed at the other end of the battery. When the battery is not charged and the electronic device is used, the central processor generates heat, and the heat is dissipated by using the loop heat pipe 400, and at the same time, the heat can also be dissipated by using the heat dissipation layer 300 of the battery and the heat dissipation layer 300 of the charging control board part, thereby further improving the heat dissipation efficiency. When the battery is charged, the heat can also be dissipated by using the loop heat pipe 400.

[0116] As shown in the drawings, Figure 2 and Figure 9 In some embodiments, at least part of the evaporator 410 is coincident with at least part of the second heat source component 33 in the projection plane of the front view of the middle frame 10. In this way, the second heat source component 33 is mounted on the middle frame 10. When the electronic device is used, the second heat source component 33 can be dissipated by using the middle frame 10, and at the same time, its heat energy only needs to pass through the thickness dimension of the middle frame 10 to transfer the heat to the evaporator 410, improve the heat absorption efficiency of the evaporator 410, make the working fluid 500 be heated and vaporized, and quickly dissipate the heat of the second heat source component 33, thereby further improving the heat dissipation efficiency.

[0117] On the basis of any of the above embodiments, as shown in the drawings, Figures 10 to 11 In some embodiments, the middle frame 10 is provided with a loop pipe groove 15, and the heat dissipation device further includes a sealing cover 600 which is arranged on the loop pipe groove 15 and forms at least part of the loop heat pipe 400. In this way, the loop pipe groove 15 is directly formed on the middle frame 10, and the sealing cover 600 is arranged thereon, so that at least part of the loop heat pipe, such as at least one of the pipe unit 420 or the liquid storage cavity 414, can be formed by fully utilizing the thickness dimension of the middle frame 10.

[0118] The loop pipe groove 15 can be formed by stamping, etching, laser engraving, turning and milling, etc.

[0119] In some embodiments, the loop pipe groove 15 is an etching groove. In this way, more loop heat pipe 400 structures, such as the pipe unit 420, the liquid storage cavity 414, the evaporator 410, the one-way valve and the like, can be formed on the middle frame 10 by using etching technology, and the thickness dimension of the middle frame 10 is fully utilized to accommodate more loop heat pipes 400, which is beneficial to the ultra-light and thin design of the electronic device. At the same time, more accurate loop heat pipe 400 structures can be obtained, and the reliability of the heat dissipation device is improved.

[0120] In an exemplary embodiment, the loop pipe groove 15 is an etching groove, and the etching groove includes a capillary groove. The loop pipe groove 15 cooperates with the sealing cover 600 to form the loop heat pipe 400. In this way, the evaporator 410 can also be directly etched on the middle frame 10, which can simplify the assembly process and improve the production efficiency of the heat dissipation device.

[0121] Optionally, in some embodiments, the sealing cover 600 is welded to the middle frame 10. In this way, the sealing cover 600 and the middle frame 10 are reliably sealed and fixed by using a welding sealing technology, and the two are more closely attached, which is conducive to reducing the size of the middle frame in the thickness direction.

[0122] On the basis of any of the above embodiments, as shown in Figure 9 or Figure 15 , in some embodiments, the loop heat pipe 400 is flat. In this way, the size of the middle frame 10 in the width direction and / or the length direction can be fully utilized to form a fluid channel, further reducing the size of the middle frame in the thickness direction, which is conducive to making the electronic device lighter and thinner. At the same time, the contact area of the two can be increased, so that the working fluid 500 can better absorb and dissipate heat.

[0123] Optionally, the maximum thickness of the loop heat pipe 400 is less than or equal to 0.5 mm. In this way, the electronic device can adapt to the ultra-thin design, or provide more space for other components. For example, using this space, a larger volume of battery can be accommodated, thereby improving the endurance of the electronic device.

[0124] Optionally, the maximum thickness of the loop heat pipe 400 is less than or equal to 0.4 mm.

[0125] The thickness of the loop heat pipe 400 includes but is not limited to 0.5 mm, 0.45 mm, 0.4 mm, 0.35 mm, 0.3 mm, etc.

[0126] In some embodiments, the evaporator 410 includes an evaporation portion 413, and in the projection plane of the front view direction of the middle frame 10, the evaporation portion 413 covers the middle frame 10, and the area of the evaporation portion 413 is 1.5 to 2 times the area of the middle frame 10. In this way, the evaporation portion 413 can fully dissipate heat from the heat source component, so that the heat source component is evenly and sufficiently cooled, and local overheating of the heat source component is avoided.

[0127] Optionally, the evaporation portion 413 includes a capillary core.

[0128] On the basis of any of the above embodiments, as shown in Figure 11 and Figure 13As shown, in some embodiments, the pipeline unit 420 includes a first conveying pipe 421, a second conveying pipe 422, and a condensing pipe 423 in heat transfer cooperation with the cooling part 13. The condensing pipe 423 includes a cold end and a hot end. The cold end is in communication with the liquid supplement end 411 through the first conveying pipe 421, and the hot end is in communication with the gas outlet end 412 through the second conveying pipe 422. In this way, by arranging the condensing pipe 423, a detour condensing channel can be formed, and the heat dissipation of the cooling part 13 can be fully utilized. At the same time, the condensing pipe 423 cooperates with the evaporator 410 through the first conveying pipe 421 and the second conveying pipe 422, realizing the cycle switching and orderly flow of the liquid working fluid 500 and the gaseous working fluid 500, so that the heat dissipation reliability of the loop heat pipe 400 is higher.

[0129] On the basis of any of the above embodiments, in some embodiments, the inner diameter of the second conveying pipe 422 is greater than the inner diameter of the first conveying pipe 421. In this way, after the liquid working fluid 500 is vaporized, it can quickly flow into the second conveying pipe 422 (easily produce a gas flow from positive pressure to negative pressure), and be conveyed to the condensing pipe 423 for cooling, which is conducive to the circulation of the gaseous working fluid 500 pushing the liquid working fluid 500.

[0130] Optionally, the inner diameter of the second conveying pipe 422 is equal to 1 times or 1.5 times or 2 times or the like of the inner diameter of the first conveying pipe 421.

[0131] On the basis of any of the above embodiments, in some embodiments, at least part of the condensing pipe 423 coincides with at least part of the cooling part 13 in the projection plane of the front view of the middle frame 10. In this way, the heat dissipation distance can be reduced as much as possible, and the low temperature of the cooling part 13 can be fully utilized to cool the gas of the condensing pipe 423.

[0132] On the basis of any of the above embodiments, as shown in Figure 11 and Figure 12 In some embodiments, the loop heat pipe 400 further includes an anti-backflow structure 430 arranged in the middle frame 10, so that the working fluid 500 passes through one end of the pipeline unit 420 and flows into the evaporator 410 through the anti-backflow structure 430. In this way, the anti-backflow structure 430 enables the working fluid 500 to stably circulate in the designed direction, so as to ensure the stability and reliability of the operation of the loop heat pipe 400.

[0133] The anti-backflow structure 430 includes but is not limited to a one-way valve structure and the like.

[0134] Optionally, the anti-backflow structure is a Tesla valve structure 432.

[0135] As shown in Figure 12 and Figure 14As shown, in some embodiments, the loop heat pipe 400 further comprises a Tesla valve structure 432, which is arranged in the middle frame 10 to enable the working fluid 500 to pass through one end of the pipe unit 420 and flow into the evaporator 410 through the Tesla valve structure 432. Due to the characteristics of small forward flow resistance and extremely large reverse flow resistance of the Tesla valve, the application of the Tesla valve structure 432 in the loop heat pipe 400 can realize low-resistance backflow of the liquid working fluid 500, prevent the occurrence of reverse flow of the liquid working fluid 500 in the evaporator 410, ensure the one-way low-resistance flow of the working fluid 500 in the evaporator 410 to generate driving force, and thus ensure the stable circulation of the loop heat pipe 400.

[0136] Optionally, the output area of the Tesla valve structure 432 is generally designed to be equal to or approximately equal to the input area of the capillary core of the evaporator 410.

[0137] On the basis of any of the above embodiments, in some embodiments, the evaporator 410 comprises an evaporation part 413 arranged between the liquid supplementing end 411 and the gas outlet end 412, and the Tesla valve structure 432 is arranged between the liquid supplementing end 411 and the evaporation part 413 to enable the working fluid 500 to flow into the evaporation part 413 through the Tesla valve structure 432. In this way, the evaporator 410 and the Tesla valve structure 432 are coupled into one body, which is beneficial to super-thin design, so that the loop heat pipe 400 is in the form of a super-thin flat plate and the overall thickness is less than 0.5 mm. At the same time, the evaporator 410 after structural integration can be flexibly arranged, that is, a plurality of evaporators 410 can be arranged according to the positions of multiple heat sources on the electronic device, and the Tesla valve structure 432 between the multiple evaporators 410 can effectively prevent turbulence, so that the operation of each evaporator 410 is stable, and the modular assembly is facilitated, which is beneficial to improve the production efficiency of the heat dissipation device.

[0138] On the basis of the above embodiments, as shown in Figure 13 and Figure 14 In some embodiments, the evaporator 410 comprises a liquid storage cavity 414 arranged between the liquid supplementing end 411 and the evaporation part 413, and the Tesla valve structure 432 is arranged in the liquid storage cavity 414. In this way, the arrangement of the Tesla valve structure 432 in the liquid storage cavity 414 can prevent the liquid working fluid 500 from flowing out of the evaporator 410, and is also beneficial to maintaining the liquid working fluid 500 in the liquid storage cavity 414, so that the evaporation part 413 can obtain the liquid working fluid 500 in time to continuously generate driving force. At the same time, the liquid working fluid 500 can also be stored in the liquid storage cavity 414 when the electronic device is not in use, for evaporation of the evaporation part 413.

[0139] On the basis of any of the above embodiments of the evaporation part 413, as shown in Figure 12 and Figure 14As shown, in some embodiments, the Tesla valve structure 432 is at least two, and is arranged in parallel between the liquid supplement end 411 and the evaporation part 413. In this way, by using at least two Tesla valve structures in parallel, the ability of the Tesla valve structure 432 of the present disclosure to guide flow in one direction is enhanced.

[0140] Optionally, the width of the Tesla valve structure 432 is less than 1 mm, the height is less than 0.5 mm, and the spacing between adjacent two Tesla valve structures 432 is less than 1.5 mm.

[0141] As shown, in some embodiments, the middle frame 10 is provided with a mounting groove 16 matched with the loop heat pipe 400, and at least part of the loop heat pipe 400 is embedded in the middle frame 10 through the mounting groove 16. In this way, the mounting groove 16 is used to accommodate at least part of the loop heat pipe 400, which facilitates the embedding of the loop heat pipe 400 in the middle frame 10, so as to reduce the thickness dimension of the middle frame. Figure 15 On the basis of the above-mentioned embodiments, in some embodiments, the middle frame further comprises a heat-conducting adhesive layer 700, and at least part of the loop heat pipe 400 is fixedly arranged in the mounting groove 16 through the heat-conducting adhesive layer 700. In this way, the loop heat pipe 400 can be preliminarily placed on the mounting groove 16, and then fixed by using the heat-conducting adhesive layer 700, which can not only improve the heat conduction efficiency, but also facilitate the assembly of the two.

[0142] The loop heat pipe 400 has a long heat transfer distance and strong anti-gravity ability, which can solve the problem that the traditional heat pipe is limited by the direction and length of use. In addition, the loop heat pipe 400 of the present disclosure separates the vapor channel and the liquid channel, and the vapor and the liquid are respectively transmitted in the respective pipelines (such as the vapor flows in the first conveying pipe 421 and the liquid flows in the second conveying pipe 422), so as to eliminate the occurrence of mutual carrying phenomenon, and the heat dissipation reliability is high; and the installation of the loop heat pipe 400 becomes flexible and convenient, and is no longer limited by the direction and distance of the heat source and the heat sink.

[0143] On the basis of any of the above-mentioned embodiments, as shown, in some embodiments, the evaporator 410 comprises two or more, and adjacent two evaporators 410 are arranged at intervals in the middle frame 10, the pipeline unit 420 comprises a liquid supplement branch 424 and an air outlet branch 425 corresponding to the evaporator 410, the liquid supplement branch 424 is in communication with the corresponding liquid supplement end 411, and the air outlet branch 425 is in communication with the corresponding air outlet end 412. In this way, the heat dissipation device 40 of the present disclosure can actively dissipate heat for different heat source components on the electronic equipment, and further improve the heat dissipation efficiency.

[0144] Figure 16

[0145] ​​In combination with the aforementioned Tesla valve structure 432 or the anti-backflow structure 430, each evaporator 410 has a one-way flow characteristic, which can ensure that each evaporator 410 can stably improve the circulation power when the heat load difference is large, and can improve the stable operation of the parallel evaporator 410 structure.

[0146] On the basis of any of the above embodiments, in some embodiments, the greater the vapor generation rate between the two adjacent evaporators 410, the greater the inner diameter of the liquid supplement branch 424 and / or the inner diameter of the gas outlet branch 425. In this way, the working fluid 500 can be reasonably distributed, so that the liquid working fluid 500 between the evaporators 410 is smoothly and sufficiently compensated, to improve the reliability and stability of the heat dissipation device 40 of the present disclosure when dissipating heat.

[0147] It should be noted that the "middle frame 10" can be "a part of the middle frame 10", that is, the "middle frame 10" is integrally formed with "other parts of the middle frame 10, such as the cooling part 13"; or it can be a separate component that can be separated from "other parts of the middle frame 10, such as the cooling part 13", that is, the "middle frame 10" can be independently manufactured, and then combined with "other parts of the middle frame 10, such as the cooling part 13" to form a whole.

[0148] Similarly, "a body" and "a part" can be a part of a "component", that is, "a body" and "a part" are integrally formed with "other parts of the component"; or it can be a separate component that can be separated from "other parts of the component", that is, "a body" and "a part" can be independently manufactured, and then combined with "other parts of the component" to form a whole. The expression of "a body" and "a part" in the present disclosure is only one of the embodiments, for the convenience of reading, and is not a limitation on the scope of protection of the present disclosure, as long as the above-mentioned features are included and the same effect is achieved, it should be understood as an equivalent technical solution of the present disclosure.

[0149] It should be noted that the "Tesla valve structure 432" can be one of the parts of the "evaporator 410" module, that is, assembled with "other components of the evaporator 410" to form a module, and then modularly assembled; or it can be relatively independent of "other components of the evaporator 410", and can be installed separately, that is, it can form a whole with "other components of the evaporator 410" in the device.

[0150] The components included in the heat dissipation device 200, the loop heat pipe and the electronic device can be flexibly combined, that is, they can be produced modularly according to actual conditions, and assembled as an independent module; or they can be assembled respectively to form a module in the device. The division of the components in the present disclosure is only one embodiment, and is not a limitation on the protection scope of the present disclosure, and as long as the components are included and have the same effect, it should be understood as an equivalent technical solution of the present disclosure.

[0151] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0152] In addition, the terms "first", "second", and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "a plurality of" is at least two, for example, two, three, and the like, unless otherwise explicitly specified and limited.

[0153] In the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0154] In the present disclosure, unless specifically defined and limited otherwise, a first feature "on" or "under" a second feature can be directly in contact with the second feature, or indirectly in contact with the second feature through an intermediate medium. Moreover, the first feature "over", "above" and "on top of" the second feature can be directly above or obliquely above the second feature, or simply means that the first feature is higher than the second feature in horizontal height. The first feature "under", "below" and "underneath" the second feature can be directly below or obliquely below the second feature, or simply means that the first feature is lower than the second feature in horizontal height.

[0155] It should be noted that when an element is referred to as being "fixed", "set", "secured" or "attached" to another element, it can be directly on the other element or there can be an intermediate element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as falling within the scope of the present disclosure.

[0156] The above embodiments only express several implementation manners of the present disclosure, and the description is specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present disclosure, a number of modifications and improvements can be made, which are all within the protection scope of the present disclosure.

Claims

1. A mobile terminal, characterized by comprising: The mobile terminal comprises: a middle frame comprising a first surface; a shielding cover arranged in a spaced-apart manner with the first surface, the shielding cover being provided with a shielding cavity; a heat source module arranged between the first surface and the shielding cover, the heat source module comprising a circuit board arranged on the first surface and a first heat source component arranged on the circuit board, the first heat source component being arranged in the shielding cavity; and a heat dissipation device for dissipating heat from the shielding cover and / or the heat source module, the heat dissipation device comprising a vapor chamber and a heat dissipation component, the vapor chamber being in heat-conducting cooperation with the first heat source component, the heat dissipation component comprising a heat dissipation fan and a semiconductor refrigeration component, a heat absorption part of the semiconductor refrigeration component being in heat-conducting cooperation with the vapor chamber, the heat dissipation fan being arranged towards a heat release part of the semiconductor refrigeration component. The mobile terminal further comprises a protective cover in cooperation with the middle frame to form a protective space, the heat source module being arranged in the protective space, the heat dissipation fan being detachably arranged on the protective cover, the protective cover being provided with a ventilation hole in communication with the protective space, the protective cover being provided with a waterproof and breathable membrane covering the ventilation hole, the heat dissipation fan being separated from the protective cover when the semiconductor refrigeration component can meet the heat dissipation requirement, the heat dissipation fan being connected with an external power supply and being mounted into the mobile terminal through the protective cover to send external air into the mobile terminal through the ventilation hole when the semiconductor refrigeration component cannot meet the heat dissipation requirement. The vapor chamber is provided with a phase-change working medium.

2. The mobile terminal of claim 1, wherein, The phase-change working medium has a boiling point of 20-90°C.

3. The mobile terminal of claim 2, wherein, The heat dissipation component comprises a passive heat dissipation structure detachably arranged on the mobile terminal, the passive heat dissipation structure being arranged on the heat release part of the semiconductor refrigeration component, the heat dissipation fan being arranged on the passive heat dissipation structure.

4. The mobile terminal of claim 1, wherein, The vapor chamber comprises a first heat sink, a connecting heat sink and a second heat sink in heat-conducting cooperation with the first heat source component, the first heat sink being fixedly arranged on the first surface, the second heat sink being connected with the first heat sink through the connecting heat sink, and the second heat sink being arranged in a spaced-apart manner with the first heat sink to form a heat dissipation space accommodating the heat source module.

5. The mobile terminal of claim 1, wherein, The heat source module further comprises a second heat source component arranged on another surface of the circuit board relative to the first heat source component, the second heat source component being in heat-conducting cooperation with the first surface.

6. The mobile terminal according to any one of claims 1 to 5, characterized in that The vapor chamber further comprises a heat-conducting layer arranged between the second heat source component and the first surface.

7. The mobile terminal of claim 6, wherein, The middle frame further comprises a cooling part and a second surface arranged in a spaced-apart manner with the first surface, the heat dissipation device further comprising:

8. The mobile terminal of claim 6, wherein, a loop heat pipe arranged on the second surface, the loop heat pipe comprising an evaporator and a pipeline unit, the evaporator being arranged in a spaced-apart manner with the second heat source component, the evaporator comprising a liquid supplementing end and a gas outlet end, one end of the pipeline unit being in communication with the liquid supplementing end, the other end of the pipeline unit being in communication with the gas outlet end, and part of the pipeline unit being in heat-conducting cooperation with the cooling part; and a heat dissipation fan arranged on the second surface. A working fluid is arranged in the loop heat pipe, and the working fluid in liquid state can be converted into gas state by the evaporator, and the working fluid in gas state can flow into the pipe unit through the gas outlet; the working fluid in gas state can be re-liquefied in the pipe unit and be sent into the liquid supplement end.

9. The mobile terminal of claim 8, wherein, The pipe unit comprises a first conveying pipe, a second conveying pipe and a condensing pipe in heat conduction cooperation with the cooling part, the condensing pipe comprises a cold end and a hot end, the cold end is communicated with the liquid supplement end through the first conveying pipe, and the hot end is communicated with the gas outlet through the second conveying pipe.

10. The mobile terminal of claim 8, wherein, The loop heat pipe further comprises an anti-backflow structure arranged in the middle frame, so that the working fluid passes through one end of the pipe unit and flows into the evaporator through the anti-backflow structure.

11. The mobile terminal of claim 8, wherein, The loop heat pipe further comprises a Tesla valve structure arranged in the middle frame, so that the working fluid passes through one end of the pipe unit and flows into the evaporator through the Tesla valve structure.

12. The mobile terminal of claim 11, wherein, The evaporator comprises an evaporation part arranged between the liquid supplement end and the gas outlet, and the Tesla valve structure is arranged between the liquid supplement end and the evaporation part, so that the working fluid flows into the evaporation part through the Tesla valve structure.

13. The mobile terminal of claim 12, wherein, The evaporator comprises a liquid storage cavity arranged between the liquid supplement end and the evaporation part, and the Tesla valve structure is arranged in the liquid storage cavity; and / or, the Tesla valve structure is at least two and is arranged in parallel between the liquid supplement end and the evaporation part.

14. The mobile terminal of claim 9, wherein, The first heat source part is a central processing unit, and the second heat source part is a resistance-capacitance device.

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