Multi-chip module with cover and stiffener ring

Abstract

A multi-chip module (MCM) structure is described. In one embodiment, the module includes a first component and a second component located on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a cover mounted on the stiffener structure and covering the first and second components. The stiffener is joined to the cover within a groove formed in a top plate of the cover.

Description

[0001] background

[0002] Related patent applications

[0003] This patent application claims the benefit of priority to U.S. Provisional Patent Application Serial No. 63 / 002,888, filed on March 31, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0004] The embodiments described herein relate to multi-chip modules, and in particular to lids for the multi-chip modules. Background Art

[0005] Lids are widely used in multi-chip modules (MCMs) for a variety of reasons, such as to provide mechanical integrity, hermetic sealing to the environment, and thermal performance. In an exemplary implementation, one or more components are surface mounted to a module substrate and then optionally underfilled. The lid is then secured to the module substrate and positioned over the components. Summary of the Invention

[0006] Embodiments describe a multi-chip module (MCM) structure in which a lid and stiffener structure are fabricated as a combination to gain the mechanical integrity and thermal benefits of the lid while reducing warpage caused by the stiffener structure. Specifically, the stiffener structure can reduce warpage potentially caused by a mismatch between the coefficient of thermal expansion (CTE) of the lid and the rest of the MCM. Various lid designs are described that can further mitigate stress and warpage, including groove designs to increase the volume ratio of the stiffener structure to the lid, multi-piece lids, and split lids. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is an exploded isometric view illustration of a multi-chip module including a lid and a stiffener structure having an inner support structure and an outer support structure according to an embodiment.

[0008] Figure 2A is a schematic cross-sectional side view illustration of a cover design on inner and outer supports according to one embodiment.

[0009] Figure 2B is a schematic cross-sectional side view illustration of a cover design on an outer support according to one embodiment.

[0010] Figure 2C is a schematic top view illustration of a lid design over a module substrate according to one embodiment.

[0011] Figure 3is a schematic cross-sectional side view illustration of a grooved design of a cover on an outer support according to one embodiment.

[0012] Figure 4 is a schematic cross-sectional side view illustration of a partially grooved design of a cover on an inner support according to one embodiment.

[0013] Figure 5 is a schematic cross-sectional side view illustration of a partially grooved design of a cover on an outer support according to one embodiment.

[0014] Figure 6 is a schematic cross-sectional side view illustration of a partially grooved design of a cover on both an inner support and an outer support according to one embodiment.

[0015] Figure 7 is a schematic cross-sectional side view illustration of a partially grooved design of a cover on an inner or outer support according to one embodiment.

[0016] Figure 8 is a schematic cross-sectional side view illustration of a reinforcement structure formed from adjacent materials having different coefficients of thermal expansion, according to an embodiment.

[0017] Figure 9 is a schematic cross-sectional side view illustration of a reinforcement structure formed from stacked materials having different coefficients of thermal expansion, according to an embodiment.

[0018] Figure 10A is a schematic top view illustration of a multi-chip module with a multi-piece lid according to one embodiment.

[0019] Figure 10B is a schematic cross-sectional side view illustration of a multi-piece cover having a grooved design top plate component according to one embodiment.

[0020] Figure 10C is a schematic cross-sectional side view illustration of a multi-piece cover having component cavities according to one embodiment.

[0021] Figure 11A is a schematic top view illustration of a multi-chip module with a multi-piece lid according to one embodiment.

[0022] Figure 11B is a schematic cross-sectional side view illustration of a multi-piece cover having a groove design wall component according to one embodiment.

[0023] FIG. 12A to FIG. 12B is a schematic cross-sectional side view illustration of a multi-piece cover formed of different materials according to one embodiment.

[0024] Figure 12C is a schematic top view illustration of a multi-piece cover formed from different materials according to one embodiment.

[0025] Figure 13A is a schematic cross-sectional side view illustration of a multi-piece cover having a sealing gap according to one embodiment.

[0026] Figure 13B is a schematic top view illustration of a multi-piece cover having a sealing gap according to one embodiment.

[0027] Figure 14A is an exploded isometric view illustration of a multi-chip module including a split lid design according to one embodiment.

[0028] Figure 14B is a schematic cross-sectional side view illustration of a multi-chip module including a split lid design according to one embodiment.

[0029] Figure 14C is a schematic top view illustration of a multi-chip module including a split lid design according to one embodiment.

[0030] Figure 15A is a schematic cross-sectional side view illustration of a cover design on inner and outer supports and including a partial opening according to one embodiment.

[0031] Figure 15B is a schematic cross-sectional side view illustration of a cover design on an outer support and including a partial opening according to one embodiment.

[0032] Figure 15C is a schematic top view illustration of a cover design including a partial opening over a module substrate according to one embodiment.

[0033] Figure 16A is a schematic cross-sectional side view illustration of a cover design positioned on inner and outer supports with an outer connection area overhanging a module substrate according to one embodiment.

[0034] Figure 16B is a schematic cross-sectional side view illustration of a cover design positioned on an outer support with an outer connection area overhanging a module substrate according to one embodiment.

[0035] Figure 16C is a schematic top view illustration of a cover design including an external connection area that overhangs the module substrate in one direction according to one embodiment.

[0036] Figure 16D is a schematic top view illustration of a cover design including external connection areas that overhang the module substrate in multiple directions according to one embodiment.

[0037] Figure 16E is an enlarged schematic cross-sectional side view illustration of a cover and support structure overhanging a module substrate according to one embodiment.

[0038] Figure 16F is an enlarged schematic cross-sectional side view illustration of an L-shaped support structure suspended from a module substrate according to one embodiment.

[0039] Figure 16G is an enlarged schematic cross-sectional side view illustration of an L-shaped cover overhanging a module substrate according to one embodiment. DETAILED DESCRIPTION

[0040] While the cover can provide mechanical integrity to the MCM, it has been observed that the cover can also induce large stresses and high warpage in the MCM and cause mechanical failure. For example, a cover formed of copper can have a relatively high coefficient of thermal expansion (CTE) relative to other module features. When the cover is forcefully coupled to the rest of the module, this can result in thermal expansion and induce stresses and warpage in the MCM components (e.g., the package). In particular, it has been observed that mold cracks can be generated between overmolded side-by-side dies, which can be exacerbated by the stresses induced by the cover. According to an embodiment, various combinations of covers and stiffener structures (also referred to as stiffener rings) are provided to balance the ability of the cover to provide mechanical integrity to the module while not causing mechanical failure.

[0041] According to embodiments, the cover can include a grooved design. This grooved design provides sufficient cover volume on top of the module components to maintain adequate thermal performance, while the cover volume is reduced in the connection area to further reduce stress and warping caused by the cover. In some embodiments, the reduced cover volume can correspond to an increased volume of the stiffener structure, which increases the stiffener structure to cover volume ratio. This can further enhance the feasibility of selecting stiffener structure materials to reduce stress and warping in the MCM.

[0042] According to an embodiment, the reinforcement structure (e.g., a ring) can be formed entirely or partially of a low CTE material. In this regard, an increase in the volume ratio of the reinforcement structure to the cover (e.g., due to the grooved cover design) promotes the ability to reduce the effective CTE of the cover-reinforcement combination by selecting a reinforcement material with a lower CTE than the cover. Reducing the effective CTE of the cover-reinforcement structure can in turn reduce stress and warping issues of the MCM. In an exemplary embodiment, the low CTE reinforcement material can be a nickel-iron alloy (FeNi36), an iron-nickel-cobalt alloy (sold under the trademark KOVAR by CRS Holdings, Delaware), an iron-nickel alloy (Alloy42), stainless steel (SUS410, SUS430), etc., while the cover is formed of a higher CTE material such as copper.

[0043] According to an embodiment, a multi-piece cover design is described. The multi-piece cover design can reduce the coupling effect of the cover to the rest of the module and further reduce the stress caused by the cover. This can include reducing die-to-die molding compound stress and module warping. In some embodiments, the multi-piece cover design incorporates different cover materials to meet the different mechanical and thermal requirements of the MCM. A split cover design is also described, in which covers of different materials are combined together or embedded one within another. By combining different materials, the effective CTE and stiffness of the cover can be adjusted to match the target mechanical and thermal properties.

[0044] In various embodiments, description is made with reference to the accompanying drawings. However, certain embodiments may be practiced without one or more of these specific details or in combination with other known methods and constructions. In the following description, many specific details such as specific configurations, dimensions, and processes are shown to provide a thorough understanding of the embodiments. In other cases, well-known semiconductor processes and manufacturing techniques are not described in particular detail to avoid unnecessarily obscuring the embodiments. References to "one embodiment" throughout the specification refer to specific features, structures, constructions, or characteristics described in conjunction with the embodiments being included in at least one embodiment. Therefore, the phrase "in one embodiment" appearing in multiple places throughout the specification does not necessarily refer to the same embodiment. In addition, specific features, structures, constructions, or characteristics may be combined in one or more embodiments in any appropriate manner.

[0045] As used herein, the terms "on," "over," "to," "between," "spanning," and "over" may refer to the relative position of one layer relative to other layers. A layer that is "on," "over," "spanning," or "on" relative to another layer, or bonded "to," or "in contact with" another layer may be directly in contact with the other layer or may have one or more intervening layers. A layer that is "between" multiple layers may be directly in contact with the multiple layers or may have one or more intervening layers.

[0046] Now see Figure 1, provides a cross-sectional side view illustration of an MCM 150 including a cover 300 and a stiffener structure 200 having inner and outer supports 220 and 210, respectively. In an exemplary embodiment, the MCM 150 includes a module substrate 100 including a top side 102 and a bottom side 104. A plurality of first components 120 may be mounted on the top side 102 of the module substrate 100. The first components 120 may be active or passive devices and may be chips or packages. For example, the first components 120 may be memory packages, such as dynamic random access memory (DRAM), including one or more dies, which may be stacked or side-by-side. In an embodiment, the first components are chip-scale packages. The first components 120 may also be different types of components and need not be identical. One or second components 130 may also be mounted on the top side 102 of the module substrate 100. In an embodiment, the second component 130 is a package including multiple (e.g., two or more) side-by-side dies. For example, the second component 130 may include multiple side-by-side logic dies or system-on-chip dies.

[0047] Now refer to Figures 2A to 2C , schematic cross-sectional side and top view illustrations of a cover and stiffener structural arrangement according to an embodiment are provided. In an exemplary implementation, the first component 120 and the second component 130 are surface mounted to the module substrate 100 using any suitable technique, such as solder bumps 160, with an optional underfill 162 (e.g., epoxy). In the illustrated embodiment, the second component 130 is a package comprising a plurality of side-by-side dies 132 encapsulated in a mold compound 134. As shown, the space 133 laterally between the dies 132 can be filled with the mold compound 134. It has been observed that this can be a high stress location within the MCM due to the close proximity of the multiple materials and the MCM structure.

[0048] A thermal interface material (TIM) 170 may be located on the top sides of the first and second components 120 and 130 to secure to the cover 300. The TIM 170 may be applied using any suitable technique, such as dispensing or tape. Exemplary TIM 170 materials include, but are not limited to, thermal grease, solder, metal-filled polymer matrices, and the like.

[0049] According to an embodiment, the cover 300 can be bonded to the intermediate reinforcement structure 200 (also referred to as a reinforcement ring), which in turn is bonded to the module substrate 100. The reinforcement structure 200 and the cover 300 can be bonded using an adhesive material. For example, an adhesive can be dispensed onto the module substrate 100 at the connection areas (e.g., the external connection area 180 and the internal connection area 182), and then the reinforcement structure 200 is mounted. Exemplary adhesive materials include glass paste, epoxy resin, urethane, polyurethane, silicone elastomer, etc. The cover 300 can similarly be bonded to the reinforcement structure 200 after or before the reinforcement structure is mounted on the module substrate 100.

[0050] As shown, the cover 300 may include a top plate 330, an outer (perimeter) wall 310, and an optional inner wall 320. The bottom surface 302 of the top plate may be bonded to the TIM 170 on top of the second component 130 and the first component 120. The profile of the bottom surface 302 (the thickness of the top plate 330) may be adjusted to uniformly mate with the TIM 170 for various first and second components 120, 130. The outer wall 310 and the inner wall 320 may extend from the top plate 330 (e.g., protrude from the bottom surface) to form one or more cavities 305 that accommodate the second component 130 and the first component 120. According to an embodiment, the reinforcement structure 200 is shaped to mate with the outer wall 310 and the inner wall 320 of the cover 300. Specifically, the reinforcement structure 200 may include an outer support member (wall) 210 and an inner support member (wall) 220. The outer support member 210 and the inner support member 220 may be integrally formed from the same material. Alternatively, the outer support 210 and the inner support 220 can be formed of different materials having different CTEs. A variety of additional configurations with different materials are possible. The mating surfaces between the stiffener structure 200 and the cover 300 can have the same surface area. A plurality of module solder bumps 190 can optionally be applied to the bottom side 104 of the module substrate 100 for further integration.

[0051] According to embodiments, various combinations of cover and reinforcement structures are provided to balance the cover's ability to provide mechanical integrity to the module while not causing mechanical failure. Specifically, various combinations of grooved cover designs, ratios of reinforcement structure to cover volume, multi-piece cover designs, and combinations of materials with different CTEs are described.

[0052] Now refer to Figures 3 to 9, various grooved cover designs and reinforcement structures are described according to embodiments. As shown, MCM 150 may include module substrate 100, first component 120 located on top side 102 of the module substrate, and second component 130 located on top side 102 of the module substrate. Reinforcement structure 200 is mounted on top side 102 of the module substrate, and cover 300 is mounted on reinforcement structure 200 and covers both first component 120 and second component 130. According to various embodiments, reinforcement structure 200 may be coupled to cover 300 within groove 315 formed in a top plate 330 of the cover. Reinforcement structure 200 may include either or both of outer support members 210 and inner support members 220.

[0053] Figure 3 FIG2 is a schematic cross-sectional side view illustration of a grooved design of a cover positioned on an outer support 210, according to one embodiment. As shown, grooves 315 are formed in the bottom surface 302 of the top plate 330 of the cover 300. Each groove 315 may include one or more groove edges (sidewalls) 331 in the top plate 330. In this manner, the thickness of the top plate 330 in the region of the grooves 315 is less than the thickness of the top plate 330, where the cover 300 is connected to the second component 130 using the TIM 170, and where the cover 300 is connected to the first component 120 using the TIM. Thus, the grooves 315 reduce the volume of the cover 300 at the connection area. Specifically, the grooves 315 are formed at the outer (peripheral) connection region 180, where the grooves engage the outer support (wall) 210 of the reinforcement structure 200. In this illustration, the grooves do not include the outer sidewalls (groove edges). In the illustrated embodiment, the outer support 210 is joined to the cover 300 within the grooves 315. Although not shown, the cover 300 may additionally include an inner wall 320 connected to the inner support 220 of the reinforcement structure 200 .

[0054] Figure 4 FIG2 is a schematic cross-sectional side view illustration of a partially grooved design of a cover positioned on an inner support according to one embodiment. As shown, the inner support 220 is joined to the cover 300 within the groove 315. Additionally, the cover 300 includes an outer wall 310 joined to the outer support 210. In the illustrated embodiment, the inner support 220 is taller than the outer support 210.

[0055] Figure 5 FIG2 is a schematic cross-sectional side view illustration of a partially grooved design of a cover on an outer support according to one embodiment. As shown, the outer support 210 is joined to the cover 300 within the groove. The cover 300 further includes an inner wall 320 connected to the inner support 220. In the embodiment shown, the outer support 210 is taller than the inner support 220. Figure 5Also shown in FIG300 is an inner wall 320 extending from the groove 315. In an embodiment, the cover 300 can include both an outer wall 310 and an inner wall 320 extending from the groove 315.

[0056] Figure 6 is a schematic cross-sectional side view illustration of a partially grooved design of a cover on both an inner support and an outer support according to one embodiment. Figure 6 Similar to Figure 3 The embodiment shown, in which the added inner support 220 is also joined to the cover in a groove 315, which can be the same groove as the groove 315 in which the outer support 210 is joined to the cover or a separate groove.

[0057] Figure 7 is a schematic cross-sectional side view illustration of a partially grooved design of a cover located on an inner or outer support according to one embodiment. As shown in the figure, Figure 7 Combine Figures 4 to 6 The features are shown to illustrate that various configurations are possible, where portions of the inner support 220 and outer support 210 may have different heights, and the outer wall 310 and inner wall 320 may be discontinuous.

[0058] The grooved cover design according to the embodiment can reduce the volume of the cover at the connection area to reduce stress and warping caused by the cover. In addition, the reduction in the volume of the cover can correspond to an increase in the volume (height) of the reinforcement structure, which increases the volume ratio of the reinforcement structure to the cover. In the embodiment shown, the ratio of the reinforcement structure to the cover is greater than 1, which means that the reinforcement structure can be taller than the thickness of the grooved top plate of the cover.

[0059] According to an embodiment, the reinforcement structure can be formed entirely or partially from a low CTE material. In an exemplary embodiment, the low CTE reinforcement material can be a nickel-iron alloy (FeNi36), an iron-nickel-cobalt alloy (sold under the trademark KOVAR by CRS Holdings, Delaware), an iron-nickel alloy (Alloy42), stainless steel (SUS410, SUS430), etc., while the cover is formed from a higher CTE material such as copper. The reinforcement structure can also be formed from different materials (different chemical compositions or alloy ratios) to adjust stress and warpage.

[0060] Figure 8 2 is a schematic cross-sectional side view illustration of a reinforcement structure formed from adjacent materials having different coefficients of thermal expansion, according to an embodiment. For example, the outer support 210 and the inner support 220 can be formed from different materials 221, 223 having different CTEs. Furthermore, different regions of the outer support 210 and the inner support 220 can be formed from different materials 221, 223 to locally adjust stress and warpage.

[0061] Figure 9 is a schematic cross-sectional side view illustration of a reinforcement structure formed of build-up materials 221, 223 having different coefficients of thermal expansion according to an embodiment. Additionally, the relative thicknesses of the build-up materials 221, 223 can vary in different regions of the outer support 210 and the inner support 220.

[0062] The lid according to embodiments may also have multiple physically separate pieces. Such a multi-piece lid design can reduce the coupling effect between the lid and the rest of the module and further reduce stress induced by the lid. This can include reducing inter-die mold compound stress and module warpage.

[0063] Now see Figures 10A to 10C , schematic top view and cross-sectional side view illustrations of a multi-piece cover according to an embodiment are provided. In the illustrated embodiment, the cover 300 may include a plurality of physically separate top panels 330A, 330B, 330C coupled to the reinforcement structure 200. The top panels 330A, 330B, 330C may additionally have a groove design, including grooves 315. In the illustrated embodiment, grooves 315 may be formed along the sides of the top panels 330A, 330B, 330C such that a pair of top panels are coupled to each inner support 220 and a single top panel is coupled to each outer support 210. Each cover may be anchored to the inner support 220 and / or outer support 210 surrounding it. In Figure 10C In the particular embodiment shown, the cover can further include a component recess 335 that mates with the edge of a component (eg, the second component 130). The component recess 335 can facilitate the coverage of the TIM 170 with the component edge and reduce TIM peel stress.

[0064] Now see Figures 11A to 11B , schematic top view and cross-sectional side view illustrations of a multi-piece cover according to an embodiment are provided. Figures 11A to 11B and FIG. 10A to FIG. 10B The embodiment of the present invention differs in that a groove 225 is formed in the inner support member 220 and / or the outer support member 210, opposite the top plate of the cover. Similarly, the groove 225 may include a groove edge 227. In the particular embodiment shown, the inner support member 220 includes a groove 225 to accommodate the top plate 330A of the cover 300. Figures 11A to 11B The physically separate top plates 330A, 330B, 330C may have different thicknesses to manage stress and warping.

[0065] The multi-piece cover design according to embodiments may also include an inner wall and / or an outer wall. 12A to 12C , schematic cross-sectional side and top view illustrations of a multi-piece cover according to an embodiment are provided. It should be understood that although individually illustrated and described, 12A to 12CThe multi-piece cover embodiment can be used with Figures 10A to 11B and combinations of the multi-piece cover embodiments and other embodiments described herein.

[0066] As shown, the multi-piece lid 300 may include a first lid piece 300A that spans the first die 132 in the second component 130 and a second lid piece 300B that spans the second die 132 in the second component 130. Multiple lid pieces 300A, 300B, 300C, 300D, and so on may be included. As shown, the mold compound 134 may fill the space 133 laterally between the first and second dies 132, which may correspond to a high-stress area. A gap 325 may be located between the first and second lid pieces 300A, 300B. In the illustrated embodiment, the gap 325 is located directly above the space 133 laterally between the first and second dies 132 in the component 130. This space may be filled with the mold compound 134. The gap 325 may further reduce the coupling effect between the lid and the rest of the module and further reduce stress induced by the lid. Depending on the embodiment, the individual covers 300A, 300B, etc. may be formed of different materials 321, 323. The use of different cover materials may be tailored to meet the different mechanical and thermal requirements of the microelectronic module. The gap 325 may optionally be as 13A to 13B 4. As shown in FIG, the trough is filled with a filling material 400. For example, the filling material can be solder, adhesive, etc.

[0067] Now see 14A to 14C , provides exploded isometric, schematic cross-sectional side and top view illustrations of a multi-chip module including a split lid design according to an embodiment. In addition to or in lieu of the above-described structure, the split lid 300 design may include different materials bonded together or embedded one within another. By combining different materials, the effective CTE and stiffness of the lid can be adjusted to match target mechanical and thermal properties. In an embodiment, the lid 300 may include a first lid pattern 500 bonded to a top plate 330 of a main lid structure, wherein the first lid pattern 500 has a different CTE than the main lid structure. The main lid structure may be similar to the previously described lid 300, with the addition of a recessed pattern 360 to which the first lid pattern 500 is secured. The first lid pattern 500 may include various features, which may optionally include internal ribs 520 and an outer (peripheral) profile 510. The first lid pattern 500 may be located in high stress areas, such as at the connection areas (180, 182) and above the space between side-by-side dies. In an embodiment, the inner ribs 520 are above the spaces 133 between adjacent dies 132 .

[0068] Thus far, the cover structures have been illustrated and described as either single-piece or multi-piece cover arrangements. According to an embodiment, one or more localized openings may be formed in any cover structure to reduce stress and warping. Figures 15A to 15C An exemplary embodiment of such a partial opening 326 is shown. As shown, Figures 15A to 15C Similar to the previous Figures 2A to 2C The lid design shown and described, but the embodiment is not limited thereto. In an embodiment, one or more local openings 326 can be positioned directly above (above) the space 133 that is laterally located between the tube cores 132. One or more local openings 326 can overlap with the space 133 completely or partially. One or more local openings can also be located above other areas to relieve stress. In an embodiment, one or more local openings 326 are formed from the top side 304 of the top plate 330 to the bottom surface 302 completely through the top plate 330 of the lid.

[0069] The stiffener structure 200 and / or cover 300 may also be designed to overhang the peripheral edge of the module substrate 100 to reduce stress and warping. Figure 16A is a schematic cross-sectional side view illustration of a cover design positioned on inner and outer supports with the outer connection area 180 overhanging the module substrate 100 according to one embodiment. Figure 16B is a schematic cross-sectional side view illustration of a cover design on an outer support with the outer connection area 180 overhanging the module substrate 100 according to one embodiment. 16A to 16B The specific embodiment shown in FIG. 1 is similar to that previously described with respect to FIG. Figures 2A to 2B The embodiments shown and described are, however, merely exemplary, and the overhang design can be combined with the stiffener structure 200 inner support 220 and outer support 210 and the cover 300 assembly having corresponding inner wall 320 and outer wall 310. The overhang design is also compatible with the multi-piece cover structures described herein.

[0070] Overhanging cover designs according to embodiments can overhang one or more or all of the peripheral (lateral) edges 106 of the module substrate 100. Specifically, one or more peripheral edges 216 of the stiffener structure 200 and / or the peripheral edge 316 of the cover 300 corresponding to the outer connection area 180 can overhang one or more peripheral edges 106 of the module substrate. Specifically, the peripheral edge 216 of the outer support 210 and the peripheral edge 316 of the outer wall 310 of the cover 300 can overhang the peripheral edge 106 of the module substrate 100. Figure 16C FIG2 is a schematic top view illustration of a cover 300 design including an external connection area that overhangs the module substrate in one direction according to one embodiment. As shown, the peripheral edge 316 of the outer wall 310 of the cover 300 extends laterally past the peripheral edge 106 on two opposing sides of the module substrate 100. Figure 16D FIG is a schematic top view illustration of a cover 300 design including an external connection area that overhangs the module substrate in multiple directions according to one embodiment. As shown, the peripheral edge 316 of the outer wall 310 of the cover 300 extends laterally past the peripheral edge 106 on four sides of the module substrate 100. 16C to 16D It is not visible in the top view illustration of FIG, but the peripheral edge 216 of the outer support member 210 of the reinforcement structure 200 may be similarly oriented or alternatively oriented if the cover 300 does not include the outer wall 310. It should be understood that Figures 16B to 16C The specific orientation of is exemplary, and various alternative arrangements are possible in which the external connection region overhangs one or more peripheral edges 106 of the module substrate. Additionally, the external connection region 180 may partially or completely overhang the length of any peripheral edge 106 of the module substrate 100.

[0071] Now see Figure 16E , provides an enlarged schematic cross-sectional side view illustration of a cover 300 and a support structure 200 overhanging a module substrate according to one embodiment. In such a configuration, the bottom side 211 of the support structure 200 can be horizontal or planar. As shown, the peripheral edges 216, 316 of the support structure 200 and the cover 300 overlap (or extend beyond) the peripheral edge 106 of the module substrate 100 by a certain width (W). The support structure 200 and / or the cover 300 can also have an L-shaped configuration, wherein the overhanging portion of the support structure and / or the cover 300 is laterally adjacent to the peripheral edge 106 of the module substrate 100. In such a configuration, the bottom side 211 of the support structure 200 or the bottom side 311 of the cover 300 can have an L-shaped profile.

[0072] Figure 16F is an enlarged schematic cross-sectional side view illustration of an L-shaped support structure 200 overhanging a module substrate 100 according to one embodiment. As shown, the support structure 200 can overlap (or extend beyond) the peripheral edge 106 of the module substrate 100 by a certain width (W) and also include an overhang portion 213 that protrudes downwardly and is laterally adjacent to the peripheral edge 106 of the module substrate 100. The overhang portion 213 can include an inner edge 217 separated from the peripheral edge 106 by a gap (G).

[0073] Figure 16G is an enlarged schematic cross-sectional side view illustration of an L-shaped cover 300 overhanging a module substrate 100 according to one embodiment. As shown, the cover 300 can overlap (or extend beyond) the peripheral edge 106 of the module substrate 100 by a certain width (W) and also include an overhang portion 313 that protrudes downwardly and is laterally adjacent to the peripheral edge 106 of the module substrate 100. The overhang portion 313 can include an inner edge 317 separated from the peripheral edge 106 by a gap (G).

[0074] When utilizing various aspects of the embodiments, those skilled in the art will appreciate that combinations or variations of the above embodiments for integrating an MCM cover structure while mitigating module warpage are possible. Although the embodiments are described in language specific to structural features and / or methodological acts, it should be understood that the appended claims are not necessarily limited to the specific features or acts described. Instead, the specific features and acts disclosed should be understood as exemplary embodiments of the claims.

Claims

1. A module comprising: module substrate; a first component located on a top side of the module substrate; a second component located on the top side of the module substrate; a stiffener structure mounted on the top side of the module substrate; a cover mounted on the reinforcement structure and covering the first component and the second component, wherein the cover includes a top plate having a bottom surface, a groove is formed in the bottom surface of the top plate, and a component recess is formed in the bottom surface of the top plate, wherein the component recess cooperates with an edge of the second component and is separate from the groove, and the reinforcement structure is engaged to the cover within the groove formed in the top plate of the cover; and A thermal interface material secures the top side of the second component to the bottom surface of the top plate, wherein the thermal interface material is positioned within the component recess in the cover and at least partially along the edge of the second component.

2. The module of claim 1, wherein the reinforcement structure comprises an outer support and an inner support. 3 . The module of claim 2 , wherein the inner support is joined to the cover within the groove formed in the top plate of the cover.

4. The module of claim 2, wherein the outer support is joined to the cover within a second groove formed in the top plate of the cover.

5. The module of claim 2, wherein the stiffener structure is formed of a material having a lower CTE than the cover.

6. The module of claim 2, wherein the outer support and the inner support of the stiffener structure comprise different materials having different CTEs.

7. The module of claim 2, wherein the cover comprises physically separate pieces. 8 . The module of claim 7 , wherein the second component comprises a first die and a second die encapsulated within a mold compound, and the mold compound fills a space laterally between the first die and the second die. 9 . The module of claim 8 , wherein the cover comprises a first cover piece spanning the first die and a second cover piece spanning the second die.

10. The module of claim 9, wherein the first cover has a different chemical composition than the second cover.

11. The module of claim 9, further comprising a gap between the first cover and the second cover, wherein the gap is laterally located directly above the space between the first die and the second die.

12. The module of claim 11, wherein the gap is filled.

13. The module according to claim 1 : Also included is a partial opening in the top plate of the cover; wherein the second component comprises a first die and a second die encapsulated within a mold compound, and the mold compound fills a space laterally between the first die and the second die; and The partial opening is laterally located directly above the space between the first tube die and the second tube die.

14. The module of claim 1, wherein a peripheral edge of the cover overhangs a peripheral edge of the module substrate.

15. A module comprising: module substrate; a first component located on a top side of the module substrate; a second component located on the top side of the module substrate; a stiffener structure mounted on the top side of the module substrate; as well as a cover mounted on the reinforcement structure and covering the first component and the second component; wherein the cover comprises a first cover member spanning the first component and a second cover member spanning the second component, wherein the cover includes a top plate having a bottom surface, a groove is formed in the bottom surface of the top plate, and a component recess is formed in the bottom surface of the top plate, wherein the component recess cooperates with an edge of the second component and is separate from the groove, and the reinforcement structure is engaged to the cover within the groove formed in the top plate of the cover; and A thermal interface material secures the top side of the second component to the bottom surface of the top plate, wherein the thermal interface material is positioned within the component recess in the cover and at least partially along the edge of the second component. 16 . The module of claim 15 , wherein the second component comprises a first die and a second die encapsulated within a mold compound, and the mold compound fills a space laterally between the first die and the second die.

17. The module of claim 16, wherein the first cover spans the first die and the second cover spans the second die.

18. The module of claim 16, wherein the first cover has a different chemical composition than the second cover.

19. The module of claim 16, further comprising a gap between the first cover and the second cover, wherein the gap is laterally located directly above the space between the first die and the second die.

20. The module of claim 19, wherein the gap is filled.

21. A module comprising: module substrate; a first component located on a top side of the module substrate; a second component located on the top side of the module substrate; a stiffener structure mounted on the top side of the module substrate; as well as a cover mounted on the reinforcement structure and covering the first component and the second component; wherein the cover comprises a first cover mold bonded to a top plate of a main cover structure, wherein the first cover mold has a different CTE than the main cover structure, wherein the cover includes a top plate having a bottom surface, a groove is formed in the bottom surface of the top plate, and a component recess is formed in the bottom surface of the top plate, wherein the component recess cooperates with an edge of the second component and is separate from the groove, and the reinforcement structure is engaged to the cover within the groove formed in the top plate of the cover; and A thermal interface material secures the top side of the second component to the bottom surface of the top plate, wherein the thermal interface material is positioned within the component recess in the cover and at least partially along the edge of the second component.

22. The module of claim 21, wherein the main cover structure comprises a concave former into which the first cover former is fixed.

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