Optical element, its monitoring system and method, active light-emitting module, and terminal

Abstract

The present invention provides an optical element, its monitoring system and method, an active light-emitting module, and a terminal, relating to the technical field of electronic terminal devices, capable of real-time monitoring whether an optical element such as a diffractive optical component or a light homogenizing sheet in the active light-emitting module is damaged or detached, and turning off the laser when the optical element is damaged or detached to avoid laser leakage. The monitoring system of the optical element includes an optical element, a microprocessor, a power supply, and a laser that are connected in sequence. A detection line is arranged on the optical element, and both ends of the detection line are respectively connected to the microprocessor. The microprocessor is configured to monitor the resistance value of the detection line or the voltage value at both ends of the detection line in real time, determine whether the optical element is damaged or detached according to the monitored resistance value or voltage value, and control the power supply to stop supplying power to the laser when it is determined that the optical element is damaged or detached.

Description

[0001] This application is a divisional application. The application number of the original application is 201811198406.X, the original application date is October 15, 2018, and the entire content of the original application is incorporated herein by reference. Technical Field

[0002] The present invention relates to the technical field of electronic terminal devices, and in particular, to an optical element, its monitoring system and method, an active light-emitting module, and a terminal. Background Art

[0003] Currently, 3D sensing technology is a research hotspot in the field of electronic terminal devices (such as mobile phones). 3D sensing technology is a depth sensing technology that can further improve face recognition or iris recognition functions, enhance the face and object recognition functions of the terminal camera, and is applicable to functions such as augmented reality, gaming, and autonomous driving.

[0004] By integrating active light-emitting modules such as structured light and TOF (Time Of Flight) in the terminal, 3D sensing functions can be achieved. Such active light-emitting modules usually include high-power lasers. By actively emitting light from the lasers onto the human face, face recognition can be achieved. Since the lasers emit laser light, diffractive optical elements (Diffractive Optical Element, abbreviated as DOE) or diffusers (Diffuser) and other optical elements for astigmatism or light homogenization are usually provided in the light-emitting direction of the lasers to prevent the laser from directly irradiating the human eye and damaging the human eye vision.

[0005] However, if abnormal conditions such as breakage or detachment occur in optical elements such as diffractive optical elements or diffusers, it may cause the laser light emitted by the high-power lasers to leak out. Summary of the Invention

[0006] The present invention provides an optical element, its monitoring system and method, an active light-emitting module, and a terminal, which can monitor the abnormal states of breakage and detachment of optical elements such as diffractive optical elements or diffusers in the active light-emitting module in real time, and turn off the lasers when these optical elements are broken or detached, avoiding laser leakage.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] A first aspect of the present invention provides an optical element, including a substrate, and a detection line disposed on one surface of the substrate, the detection line being configured to transmit an electrical signal.

[0009] In this way, when the optical element is applied to an active light-emitting module, both ends of the detection line are respectively connected to the microprocessor of the active light-emitting module through wires. The microprocessor is used to monitor the resistance value of the detection line or the voltage value at both ends of the detection line in real time. When the resistance value of the detection line or the voltage value at both ends of the detection line changes abnormally, it indicates that the detection line is broken or there is an open circuit at the connection between the detection line and the wire. Thus, it can be judged that the optical element attached to the detection line is damaged or detached. At this time, the microprocessor is used to control the laser of the active light-emitting module to turn off, effectively avoiding the harm that the laser emitted by the laser may cause to the human eye when the optical element is damaged or detached. Moreover, this solution only needs to set one layer of optical element and detection line (i.e., only one conductive layer), with a simple structure, a simple manufacturing process, and a low cost.

[0010] Combined with the first aspect, in a possible design, the material of the detection line is a transparent conductive material to avoid blocking the light emitted by the laser.

[0011] Optionally, the material of the detection line includes any one or several of indium tin oxide, indium zinc oxide, indium gallium zinc oxide, indium tin zinc oxide, etc.

[0012] Combined with the first aspect, in a possible design, the surface of the substrate on which the detection line is located is equally divided into multiple regions, and at least one segment of the detection line covers each region. In this way, the detection line is made to cover as many regions of the optical element as possible, ensuring that damage to each region and even all regions of the optical element can be monitored, and improving the accuracy of monitoring.

[0013] Optionally, the coverage area of the detection line in each region is equal. Optionally, the width of the detection line in each region is equal. Optionally, the gap between adjacent parts of the detection line is equal. In this way, the accuracy and sensitivity of monitoring can be further improved.

[0014] Combined with the first aspect, in a possible design, the detection line extends in a zigzag or spiral shape to make the detection line cover as many regions of the optical element as possible.

[0015] Combined with the first aspect, in a possible design, the optical element further includes a conductive pad disposed on the same side surface of the substrate as the side where the detection line is located. The conductive pad is located at the end of the detection line and is electrically connected to the end of the detection line. In this way, the wire can be electrically connected to the detection line through the conductive pad.

[0016] Optionally, the material of the conductive pad is the same as that of the detection line, so as to facilitate their simultaneous formation in the same step and simplify the preparation steps.

[0017] Optionally, the optical element further includes a protective layer covering the detection line, and an opening is provided on the protective layer to expose the conductive pad. In this way, the protective layer can protect the detection line, and the setting of the opening facilitates the electrical connection between the end of the detection line or the conductive pad and the wire.

[0018] The second aspect of the present invention provides an active light-emitting module, which includes a module housing, a laser, a microprocessor, an optical element, and a wire. Among them, the module housing includes a bottom substrate and a side wall. The laser and the microprocessor are installed on the bottom substrate. The optical element is installed at one end of the side wall away from the bottom substrate, and the optical element is the optical element described in any one of the above. The wire is used to connect the two ends of the detection line of the optical element to the microprocessor respectively. The microprocessor is configured to monitor the resistance value of the detection line or the voltage value at both ends of the detection line in real time, and judge whether the optical element is damaged or detached according to the monitored resistance value or voltage value, and control the laser to turn off when it is determined that the optical element is damaged or detached, thereby effectively avoiding the laser emitted by the laser when the optical element is damaged or detached from leaking out and possibly causing harm to the human eye.

[0019] Combined with the second aspect, in a possible design, the wire extends from the end of the detection line to the microprocessor inside the side wall. Alternatively, the wire extends from the end of the detection line to the microprocessor on the inner surface of the side wall. Alternatively, the wire extends from the end of the detection line to the microprocessor on the outer surface of the side wall. In this way, the connection between the detection line and the microprocessor is realized.

[0020] Combined with the second aspect, in a possible design, the active light-emitting module further includes a conductive electrode provided at the junction of the end of the detection line and the wire, for electrically connecting the end of the detection line and the wire, thereby realizing the electrical connection between the detection line and the wire.

[0021] Optionally, the material of the conductive electrode is conductive silver paste or solder, and the manufacturing process is simple and easy to implement.

[0022] The third aspect of the present invention provides a terminal, which includes the active light-emitting module described in any one of the above. This active light-emitting module can produce the same beneficial effects as the active light-emitting module provided in the second aspect of the present invention, and will not be elaborated here.

[0023] The fourth aspect of the present invention provides a monitoring system for an optical element, which includes a microprocessor, a power supply, and a laser connected in sequence. The monitoring system for the optical element further includes the optical element as described in any one of the above. Both ends of the detection line of the optical element are respectively connected to the microprocessor. The microprocessor is configured to monitor in real time the resistance value of the detection line or the voltage value at both ends of the detection line, determine whether the optical element is damaged or detached according to the monitored resistance value or voltage value, and control the power supply to stop supplying power to the laser when it is determined that the optical element is damaged or detached, so that the laser is turned off, thereby effectively avoiding the damage that the laser emitted by the laser may cause to the human eye when the optical element is damaged or detached.

[0024] The fifth aspect of the present invention provides a monitoring method for an optical element, which is applied to the monitoring system for the optical element as described above. The monitoring method for the optical element includes the following steps: The microprocessor monitors in real time the resistance value of the detection line. The microprocessor determines whether the monitored resistance value exceeds the set resistance threshold range: if so, the microprocessor controls the power supply to stop supplying power to the laser; if not, the microprocessor monitors the resistance value of the detection line at the next moment. The set resistance threshold range is a numerical range that fluctuates above and below the resistance value of the detection line when it is not broken. Through the above monitoring method for the optical element, real-time monitoring of the abnormal state of damage or detachment of the optical element in the active light-emitting module is realized, and the laser can be turned off when the optical element is damaged or detached, avoiding laser leakage.

[0025] Combined with the fifth aspect, in a possible design, the microprocessor monitors in real time the resistance value at both ends of the detection line, including the following steps: The microprocessor monitors in real time the voltage value at both ends of the detection line. The microprocessor converts the monitored voltage value into a resistance value. In this way, a specific solution for monitoring in real time the resistance value of the detection line is provided.

[0026] The sixth aspect of the present invention provides a monitoring method for an optical element, which is applied to the monitoring system for the optical element as described above. The monitoring method for the optical element includes the following steps: The microprocessor monitors in real time the voltage value at both ends of the detection line. The microprocessor determines whether the monitored voltage value exceeds the set voltage threshold range: if so, the microprocessor controls the power supply to stop supplying power to the laser; if not, the microprocessor monitors the voltage value at both ends of the detection line at the next moment. The set voltage threshold range is a numerical range that fluctuates above and below the voltage value at both ends of the detection line when it is not broken. Through the above monitoring method for the optical element, real-time monitoring of the abnormal state of damage or detachment of the optical element in the active light-emitting module is realized, and the laser can be turned off when the optical element is damaged or detached, avoiding laser leakage. Description of the Drawings

[0027] Figure 1 Structural schematic diagram of the terminal provided by an embodiment of the present invention;

[0028] Figure 2 Schematic diagram of the application scenario of the monitoring system for optical elements provided by an embodiment of the present invention;

[0029] Figure 3 is Figure 2 partial enlarged view;

[0030] Figure 4a Typical structural schematic diagram of the active light-emitting module;

[0031] Figure 4b Top view of the supporting structure in the active light-emitting module;

[0032] Figure 5a Architecture diagram of the monitoring system for optical elements provided by an embodiment of the present invention;

[0033] Figure 5b Circuit diagram of the monitoring system for optical elements provided by an embodiment of the present invention;

[0034] Figure 6 First schematic diagram of the detection line in the monitoring system for optical elements provided by an embodiment of the present invention;

[0035] Figures 7a - 7c Three pattern design diagrams of the detection line in the monitoring system for optical elements provided by an embodiment of the present invention;

[0036] Figure 8 Second schematic diagram of the detection line in the monitoring system for optical elements provided by an embodiment of the present invention;

[0037] Figures 9a - 9c Three structural schematic diagrams of the active light-emitting module provided by an embodiment of the present invention;

[0038] Figure 10 Cross-sectional structural schematic diagram of the optical element provided by an embodiment of the present invention;

[0039] Figures 11a - 11d Top view structural schematic diagram of each film layer in the optical element provided by an embodiment of the present invention;

[0040] Figure 12 First flowchart of the monitoring method for optical elements provided by an embodiment of the present invention;

[0041] Figure 13 Second flowchart of the monitoring method for optical elements provided by an embodiment of the present invention;

[0042] Figure 14The third flowchart of the monitoring method for the optical element provided by the embodiment of the present invention. Detailed implementation manners

[0043] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present invention, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0044] The embodiments of the present invention provide a monitoring system and a monitoring method for an optical element. The monitoring system and the monitoring method for the optical element can be applied to any terminal such as a mobile phone, a wearable device, an AR (Augmented Reality) / VR (Virtual Reality) device, a tablet computer, a notebook computer, a UMPC (Ultra-Mobile Personal Computer), a netbook, a PDA (Personal Digital Assistant), etc., and the embodiments of the present invention do not make any restrictions thereon.

[0045] As Figure 1 and Figure 2 shown, the terminal in the embodiments of the present invention may be a mobile phone 100. Hereinafter, the embodiments will be specifically described by taking the mobile phone 100 as an example.

[0046] As Figure 1 shown, the mobile phone 100 may specifically include: a processor 101, a radio frequency (RF) circuit 102, a memory 103, a touch screen 104, a Bluetooth device 105, one or more sensors 106, a Wi-Fi device 107, a positioning device 108, an audio circuit 109, a peripheral interface 110, and a power supply device 111, etc. These components may communicate through one or more communication buses or signal lines ( Figure 2 not shown in the figure). Those skilled in the art can understand that Figure 2 the hardware structure shown in the figure does not constitute a limitation on the mobile phone, and the mobile phone 100 may include more or fewer components than shown in the figure, or combine certain components, or have different component arrangements.

[0047] Hereinafter, each component of the mobile phone 100 will be specifically introduced in combination with Figure 1 :

[0048] The processor 101 is the control center of the mobile phone 100, connects various parts of the mobile phone 100 through various interfaces and lines, runs or executes application programs (abbreviated as Apps) stored in the memory 103, and calls data stored in the memory 103 to execute various functions of the mobile phone 100 and process data. In some embodiments, the processor 101 may include one or more processing units. For example, the processor 101 may be a Kirin 960 chip manufactured by Huawei Technologies Co., Ltd.

[0049] The radio frequency circuit 102 can be used for receiving and transmitting wireless signals during the process of receiving and sending information or making a call. In particular, the radio frequency circuit 102 can receive the downlink data from the base station and send it to the processor 101 for processing. Additionally, it sends the data related to the uplink to the base station. Generally, the radio frequency circuit includes, but is not limited to, antennas, at least one amplifier, a transceiver, a coupler, a low-noise amplifier, a duplexer, etc. In addition, the radio frequency circuit 102 can also communicate with other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to Global System for Mobile Communications, General Packet Radio Service, Code Division Multiple Access, Wideband Code Division Multiple Access, Long Term Evolution, email, Short Message Service, etc.

[0050] The memory 103 is used to store application programs and data. The processor 101 executes various functions and data processing of the mobile phone 100 by running the application programs and data stored in the memory 103. The memory 103 mainly includes a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function (such as a sound playback function, an image playback function, etc.). The data storage area can store the data created when using the mobile phone 100 (such as audio data, a phone book, etc.). In addition, the memory 103 can include high-speed random access memory and can also include non-volatile memory, such as a disk storage device, a flash memory device, or other volatile solid-state storage devices, etc. The memory 103 can store various operating systems, for example, the iOS operating system developed by Apple Inc., the Android operating system developed by Google Inc., etc.

[0051] The touch screen 104 can include a touchpad 104-1 and a display screen 104-2. Among them, the touchpad 104-1 can collect the touch events of the user of the mobile phone 100 on or near it (such as the operations of the user using a finger, a stylus, or any suitable object on or near the touchpad 104-1), and send the collected touch information to other devices such as the processor 101.

[0052] Among them, the touch event of the user near the touchpad 104-1 can be called floating touch. Floating touch can mean that the user does not need to directly touch the touchpad to select, move, or drag a target (such as an icon, etc.), but only needs to be near the terminal to perform the desired function. In the application scenario of floating touch, terms such as "touch" and "contact" do not imply direct contact with the touch screen, but contact nearby or close.

[0053] Specifically, two types of capacitive sensors, namely mutual capacitance sensors and self-capacitance sensors, can be set within the touchpad 104-1, and these two capacitive sensors can be alternately arranged in an array on the touchpad 104-1. Among them, the mutual capacitance sensor is used to implement normal traditional multi-touch, that is, to detect the gestures of the user when touching the touchpad 104-1. And the self-capacitance sensor can generate a signal stronger than the mutual capacitance, so as to detect the finger sensing farther from the touchpad 104-1. Therefore, when the user's finger hovers over the screen, since the signal generated by the self-capacitance sensor is larger than the signal generated by the mutual capacitance sensor, the mobile phone 100 can detect the user's gesture above the screen, for example, at a position 20 mm above the touchpad 104-1.

[0054] Optionally, the touchpad 104-1 capable of implementing hovering touch can be realized by capacitive, infrared light sensing, ultrasonic, etc. In addition, various types such as resistive, capacitive, infrared, and surface acoustic wave can be used to implement the touchpad 104-1. The display screen 104-2 can be used to display the information input by the user or the information provided to the user as well as various menus of the mobile phone 100. The display screen 104-2 can be configured in the form of a liquid crystal display, an organic light-emitting diode, etc. The touchpad 104-1 can cover the display screen 104-2. After the touchpad 104-1 detects a touch event on or near it, it is transmitted to the processor 101 to determine the type of the touch event. Subsequently, the processor 101 can provide a corresponding visual output on the display screen 104-2 according to the type of the touch event.

[0055] Although in Figure 1 , the touchpad 104-1 and the display screen 104-2 are implemented as two independent components to realize the input and output functions of the mobile phone 100, in some embodiments, the touchpad 104-1 and the display screen 104-2 can be integrated to realize the input and output functions of the mobile phone 100.

[0056] It can be understood that the touch screen 104 is formed by stacking multiple layers of materials. Only the touchpad (layer) and the display screen (layer) are shown in the embodiments of the present invention, and other layers are not described in the embodiments of the present invention. Additionally, in some other embodiments of the present invention, the touchpad 104-1 can cover the display screen 104-2, and the size of the touchpad 104-1 is larger than that of the display screen 104-2, such that the display screen 104-2 is completely covered under the touchpad 104-1. Or, the above-mentioned touchpad 104-1 can be configured in the front of the mobile phone 100 in the form of a full panel, that is, all touches on the front of the mobile phone 100 can be sensed by the mobile phone, so that a full-touch experience on the front of the mobile phone can be achieved. In some other embodiments, the touchpad 104-1 is configured in the front of the mobile phone 100 in the form of a full panel, and the display screen 104-2 can also be configured in the front of the mobile phone 100 in the form of a full panel, so that a borderless structure can be achieved on the front of the mobile phone.

[0057] In the embodiments of the present invention, the mobile phone 100 may also have a fingerprint recognition function. For example, a fingerprint recognizer 112 can be configured on the back of the mobile phone 100 (such as below the rear camera), or a fingerprint recognizer 112 can be configured on the front of the mobile phone 100 (such as below the touch screen 104). Also, for example, a fingerprint acquisition device 112 can be configured in the touch screen 104 to implement the fingerprint recognition function, that is, the fingerprint acquisition device 112 can be integrated with the touch screen 104 to implement the fingerprint recognition function of the mobile phone 100. In this case, the fingerprint acquisition device 112 is configured in the touch screen 104, and can be a part of the touch screen 104 or configured in the touch screen 104 in other ways. Additionally, the fingerprint acquisition device 112 can also be implemented as a full-panel fingerprint acquisition device. Therefore, the touch screen 104 can be regarded as a panel where fingerprint recognition can be performed at any position. The fingerprint acquisition device 112 can send the acquired fingerprint to the processor 101 so that the processor 101 processes the fingerprint (such as fingerprint verification, etc.). The main component of the fingerprint acquisition device 112 in the embodiments of the present invention is a fingerprint sensor, and the fingerprint sensor can adopt any type of sensing technology, including but not limited to optical, capacitive, piezoelectric, or ultrasonic sensing technology, etc.

[0058] The mobile phone 100 may also include a Bluetooth device 105 for realizing data exchange between the mobile phone 100 and other short-range terminals (such as mobile phones, smart watches, etc.). The Bluetooth device 105 in the embodiments of the present invention can be an integrated circuit or a Bluetooth chip, etc.

[0059] The mobile phone 100 may also include at least one sensor 106, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. Among them, the ambient light sensor can adjust the brightness of the display screen of the touch screen 104 according to the brightness of the ambient light, and the proximity sensor can turn off the power of the display screen when the mobile phone 100 is moved to the ear. As a kind of motion sensor, the accelerometer sensor can detect the magnitude of acceleration in all directions (generally three axes). When stationary, it can detect the magnitude and direction of gravity, and can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc. As for other sensors such as gyroscopes, barometers, hygrometers, thermometers, and infrared sensors that the mobile phone 100 can also be configured with, they will not be elaborated here.

[0060] A Wi-Fi device 107 is used to provide the mobile phone 100 with network access that complies with Wi-Fi related standard protocols. The mobile phone 100 can access a Wi-Fi access point through the Wi-Fi device 107, thereby helping users to send and receive emails, browse the web, and access streaming media, etc. It provides users with wireless broadband Internet access. In some other embodiments, the Wi-Fi device 107 can also be used as a Wi-Fi wireless access point and can provide Wi-Fi network access for other terminals.

[0061] A positioning device 108 is used to provide the geographical location for the mobile phone 100. It can be understood that the positioning device 108 can specifically be a receiver of a global positioning system (GPS), or a Beidou satellite navigation system, a Russian GLONASS and other positioning systems. After receiving the geographical location sent by the above positioning system, the positioning device 108 sends this information to the processor 101 for processing, or sends it to the memory 103 for storage. In some other embodiments, the positioning device 108 can also be a receiver of an assisted global positioning system (AGPS). The AGPS system assists the positioning device 108 to complete ranging and positioning services by acting as an auxiliary server. In this case, the auxiliary positioning server communicates with the positioning device 108 (i.e., the GPS receiver) of the terminal such as the mobile phone 100 through a wireless communication network to provide positioning assistance. In some other embodiments, the positioning device 108 can also be a positioning technology based on Wi-Fi access points. Since each Wi-Fi access point has a globally unique MAC address, the terminal can scan and collect the broadcast signals of the surrounding Wi-Fi access points when the Wi-Fi is turned on, so that the MAC address broadcast by the Wi-Fi access point can be obtained. The terminal sends the data (such as the MAC address) that can identify the Wi-Fi access point to the location server through a wireless communication network. The location server retrieves the geographical location of each Wi-Fi access point, and combines the strength of the Wi-Fi broadcast signal to calculate the geographical location of the terminal and send it to the positioning device 108 of the terminal.

[0062] The audio circuit 109, the speaker 113, and the microphone 114 can provide an audio interface between the user and the mobile phone 100. The audio circuit 109 can transmit the electrical signal converted from the received audio data to the speaker 113, and the speaker 113 converts it into a sound signal for output. On the other hand, the microphone 114 converts the collected sound signal into an electrical signal, which is received by the audio circuit 109 and then converted into audio data. The audio data is then output to the RF circuit 102 to be sent to, for example, another mobile phone, or the audio data is output to the memory 103 for further processing.

[0063] The peripheral interface 110 is used to provide various interfaces for external input / output devices (such as keyboards, mice, external displays, external memories, user identification module cards, etc.). For example, it is connected to a mouse through a universal serial bus (USB) interface, and is connected to a user identification module card (SIM) card provided by a telecommunications operator through the metal contacts on the user identification module card slot. The peripheral interface 110 can be used to couple the above external input / output peripheral devices to the processor 101 and the memory 103.

[0064] The mobile phone 100 may also include a power supply device 111 (such as a battery and a power management chip) for powering each component. The battery can be logically connected to the processor 101 through the power management chip, so as to realize functions such as management of charging, discharging, and power consumption management through the power supply device 111.

[0065] Although Figure 1 not shown, the mobile phone 100 may also include a camera (front camera and / or rear camera), a flash, a micro projection device, a near field communication (NFC) device, etc., which will not be elaborated here.

[0066] For a terminal such as the above-mentioned mobile phone 100, a 3D sensing module can be integrated therein to enable the terminal to implement 3D sensing functions. An ordinary digital camera can only obtain a planar color image without depth information of the image. This means that when we see a photo, we only know how wide and high the person's face is, but we don't know the three-dimensional structure of his face. For example: the height of the nose bridge relative to the cheeks, the depth of the eye sockets relative to the cheeks, etc. By obtaining the depth information of the image through 3D sensing, the terminal can implement face recognition or gesture control. For example, the mobile phone can be unlocked by recognizing the user's face features, or when the user makes a waving gesture in front of the mobile phone, the terminal can be controlled to delete emails, etc.

[0067] The technologies for implementing 3D sensing mainly include the following two types:

[0068] (1) TOF (Time Of Flight) technology: A high-power laser (such as a VCSEL (Vertical-Cavity Surface-Emitting Laser)) is used to emit infrared light laser to irradiate the surface of an object. The laser is reflected by the surface of the object, and the reflected laser is captured by an infrared light image sensor. Since the speed of light of the laser is known, the infrared light image sensor can be used to measure the time when the laser reflected from different depths of the object surface returns, and calculate the distances (depths) of different positions on the object surface.

[0069] (2) Structured Light technology: Different light patterns (light with certain structural characteristics, called structured light) are emitted by a laser. After the light pattern is projected onto the surface of an object, it is reflected by different depths of the object surface, and the reflected light pattern will be distorted. For example: When a laser emits a straight stripe of light and projects it onto a finger, since the surface of the finger is a three-dimensional arc, the straight stripe reflected by the arc-shaped finger surface becomes an arc-shaped stripe. After the arc-shaped stripe is captured by the infrared light image sensor, the terminal can reverse the three-dimensional structure of the finger according to the reflected arc-shaped stripe.

[0070] Such asFigure 2 As shown, taking the mobile phone 100 as an example, the 3D sensing module of TOF or structured light can be set at the top of the mobile phone 100, such as the "notch" position of the mobile phone 100 (i.e., Figure 2 the area AA shown).

[0071] Such as Figure 3 As shown, taking the mobile phone 100 integrated with the structured light 3D sensing module 115 as an example, the layout form of the structured light 3D sensing module 115 in the mobile phone 100 is: the structured light 3D sensing module 115 includes modules such as an infrared camera 115-1, a flood illuminator 115-2, a proximity sensor 115-3, an infrared image sensor 115-4, and a dot projector 115-5. Among them, the flood illuminator 115-2 includes a low-power laser (such as VCSEL) and a light homogenizer, etc. The dot projector 115-5 includes a high-power laser (such as VCSEL) and a diffractive optical element, etc.

[0072] Exemplarily, the process of the above-mentioned structured light 3D sensing module 115 for face recognition is as follows: when an object (such as a face) approaches the mobile phone 100, the proximity sensor 115-3 senses that an object is approaching the mobile phone 100, and thus sends a signal that an object is approaching to the processor 101 of the mobile phone 100. The processor 101 receives the signal that an object is approaching, controls the flood illuminator 115-2 to start, and the low-power laser in the flood illuminator 115-2 projects infrared light laser onto the surface of the object. The infrared light laser projected by the flood illuminator 115-2 is reflected by the surface of the object, and the infrared camera 115-1 captures the infrared light laser reflected by the surface of the object, thereby obtaining the image information of the surface of the object, and then uploading the obtained image information to the processor 101. The processor 101 determines whether the object approaching the mobile phone 100 is a face according to the uploaded image information.

[0073] When the processor 101 determines that the object approaching the mobile phone 100 is a face, it controls the dot projector 115-5 to start. The high-power laser in the dot projector 115-5 emits infrared light laser, and these infrared light lasers form many (such as about 30,000) structured light spots through the action of structures such as diffractive optical elements in the dot projector 115-5 and are projected onto the surface of the face. The array formed by these structured light spots is reflected by different positions on the surface of the face, and the infrared camera 115-1 captures the structured light spots reflected by the surface of the face, thereby obtaining the depth information of different positions on the surface of the face, and then uploading the obtained depth information to the processor 101. The processor 101 compares and calculates the uploaded depth information with the user's facial feature data pre-stored in the mobile phone 100 to identify whether the face approaching the mobile phone 100 is the face of the user of the mobile phone 100. If so, it controls the mobile phone 100 to unlock; if not, it controls the mobile phone 100 to continue to remain in the locked state.

[0074] In the 3D sensing modules of TOF or structured light, both include a module capable of emitting laser light. For example, in the TOF 3D sensing module, there is a module including a high-power laser, and the dot projector 115-5 and the flood illuminator 115-2 in the structured light 3D sensing module 115. Hereinafter, such modules are referred to as active light-emitting modules.

[0075] As Figure 4a shown, a typical structure of the active light-emitting module 1 is shown. The active light-emitting module 1 mainly includes: an optical element 11, a laser 12, a microprocessor (MCU, Microcontroller Unit) 13, and a module housing 14. Among them, the module housing 14 includes a bottom substrate 14-2, a side wall 14-1, and a supporting structure 14-3. Please refer to Figure 4b , the supporting structure 14-3 is an annular structure, which is arranged on the inner surface of the side wall 14-1 to form a light passing aperture GG. The laser 12 and the microprocessor 13 are installed on the bottom substrate 14-2. The microprocessor 13 is connected to the processor integrated on the main board of the terminal. Exemplarily, if the active light-emitting module 1 is applied to the mobile phone 100, the microprocessor 13 of the active light-emitting module 1 is connected to the processor 101 of the mobile phone 100. The edge of the optical element 11 is fixed to the surface of the supporting structure 14-3 facing away from the laser 12 by an adhesive 17. The microprocessor 13 is connected to the laser 12 to control the laser 12 to emit laser light. The laser light passes through the light passing aperture GG and exits the active light-emitting module 1 through the optical element 11. The active light-emitting module 1 is installed in a terminal such as the mobile phone 100, and its laser 12 side (i.e., the light-emitting side) is close to the inside of the terminal, and the optical element 11 side (i.e., the light-emitting side) faces the outside of the terminal to project laser light outward.

[0076] In the active light-emitting module 1, the type of the laser 12 can specifically be VCSEL, DFB (Distributed Feedback Laser, distributed feedback laser, edge-emitting laser, etc.). The type of the optical element 11 can specifically be a light homogenizing sheet, a diffractive optical component, a Fresnel lens, etc. Exemplarily, if the active light-emitting module 1 is a module including a high-power laser in the TOF 3D sensing module, the optical element 11 can specifically be a light homogenizing sheet. If the active light-emitting module 1 is the dot projector in the structured light 3D sensing module, the optical element 11 can specifically be a diffractive optical component (DOE). If the active light-emitting module 1 is the flood illuminator in the structured light 3D sensing module, the optical element 11 can specifically be a light homogenizing sheet.

[0077] During the actual use of the terminal, as the usage time extends, the active light-emitting module 1 in the terminal ages and its reliability decreases. The occurrence of situations such as water ingress and corrosion may cause the optical elements 11 in the active light-emitting module 1 to be damaged or fall off. At this time, the laser light emitted by the laser 12 in the active light-emitting module 1 will directly shine into the human eye and harm the human eye. If the laser 12 in the active light-emitting module 1 emits high-power laser light, the harm to the human eye will be even more serious.

[0078] In view of the above problems, embodiments of the present invention provide a monitoring system for optical elements, as Figure 5a shown. The monitoring system for optical elements includes: an optical element 11, a laser 12, a microprocessor 13, and a power supply 2. Among them, the microprocessor 13, the power supply 2, and the laser 12 are connected in sequence, and the power supply 2 supplies power to the laser 12 under the control of the microprocessor 13. It should be noted that in the above-mentioned monitoring system for optical elements provided by the embodiments of the present invention, the "power supply 2" can be the power supply of the terminal, such as the power supply device 111 in the mobile phone 100.

[0079] A conductive detection line 11-1 is provided on the surface of the optical element 11. Both ends of the detection line 11-1 are respectively connected to the microprocessor 13 through wires 15. The microprocessor 13 monitors the resistance value of the detection line 11-1 or the voltage value at both ends of the detection line 11-1 in real time. The detection line 11-1, the wires 15, and the microprocessor 13 form a monitoring circuit.

[0080] When the resistance value of the detection line 11-1 or the voltage value at both ends of the detection line 11-1 changes abnormally, for example, the resistance value of the detection line 11-1 exceeds the set resistance threshold range, or the voltage value at both ends of the detection line 11-1 exceeds the set voltage threshold range, it indicates that the monitoring circuit formed by the detection line 11-1, the wires 15, and the microprocessor 13 is open-circuited. It may be that the detection line 11-1 is broken, or the connection between the detection line 11-1 and the wires 15 is open-circuited. The reason for the breakage of the detection line 11-1 may be that the optical element 11 to which the detection line 11-1 adheres is damaged. The reason for the open-circuit at the connection between the detection line 11-1 and the wires 15 may be that the optical element 11 to which the detection line 11-1 adheres falls off. When it is determined that the optical element 11 is damaged or falls off, at this time, the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12, and the laser 12 is turned off. Thus, it effectively avoids the laser light emitted by the laser 12 from directly shining into the human eye and causing harm to the human eye. Moreover, the above solution only needs to set one layer of optical element 11 and detection line 11-1 (that is, only one conductive layer), with a simple structure, a simple manufacturing process, and a low cost.

[0081] It should be noted that when the optical element 11 is damaged or detached, it will cause the detection line 11-1 to break itself, or cause the connection between the detection line 11-1 and the wire 15 to disconnect. Therefore, at this time, the resistance value of the detection line 11-1 monitored by the microprocessor 13 will become extremely large, even infinite (∞), or the voltage value across the detection line 11-1 will be close to or equal to the voltage value provided by the microprocessor 13 to the entire monitoring circuit. The above-mentioned "set resistance threshold range" can be set as a value range that fluctuates around the resistance value R of the detection line 11-1 when it is not broken. For example, the "set resistance threshold range" can be set to be greater than or equal to 80%R and less than or equal to 120%R. Exemplarily, if the resistance value R of the detection line 11-1 when it is not broken is 10 KΩ, then the "set resistance threshold range" can be set to be greater than or equal to 8 KΩ and less than or equal to 12 KΩ. The above-mentioned "set voltage threshold range" can be set as a value range that fluctuates around the voltage value U shared by the detection line 11-1 in the entire monitoring circuit when it is not broken. For example, the "set voltage threshold range" can be set to be greater than or equal to 80%U and less than or equal to 120%U. Exemplarily, if the voltage value U shared by the detection line 11-1 in the entire monitoring circuit when it is not broken is 0.8 V, then the "set voltage threshold range" can be set to be greater than or equal to 0.64V and less than or equal to 0.96V.

[0082] Based on the above technical solutions provided by the embodiments of the present invention, in some embodiments, the material of the detection line 11-1 can be selected as a transparent conductive material, such as: ITO, IZO (indium zinc oxide), IGZO (indium gallium zinc oxide), ITZO (indium tin zinc oxide), etc., to avoid blocking the light emitted by the laser 12. The material of the detection line 11-1 can also be selected as a metal conductive material, such as: silver (Ag), copper (Cu), chromium (Cr), etc. In some embodiments, to avoid the detection line 11-1 made of metal material from blocking the light, the width and thickness of the detection line 11-1 made of metal material can be set to be smaller to reduce its blocking area and improve the light transmittance of the optical element 11.

[0083] In some embodiments, in order to ensure that damage in all regions or even all areas of the optical element 11 can be detected and the detection accuracy can be improved, the detection lines 11-1 can be arranged to cover as many areas of the optical element 11 as possible. As a possible design, the optical element 11 is equally divided into multiple regions, and the coverage area of the detection lines 11-1 in each region is within the same set range. Further, the coverage area of the detection lines 11-1 in each region is made equal to ensure that damage in each region of the optical element 11 can be detected. It can be imagined that increasing the number of regions into which the optical element 11 is divided and arranging the detection lines 11-1 according to the detection line 11-1 arrangement principle described above can further improve the detection accuracy and sensitivity.

[0084] In some embodiments, the widths of the detection lines 11-1 in different regions of the optical element 11 can be equal or unequal. Further, the widths of the detection lines 11-1 in different regions of the optical element 11 are equal. Exemplarily, as Figure 6 shown, the widths d1 and d2 of the detection lines 11-1 in different regions of the optical element 11 are equal. Additionally, the gaps between adjacent portions of the detection lines 11-1 can be equal or unequal. Further, the gaps between adjacent portions of the detection lines 11-1 are equal. Exemplarily, as Figure 6 shown, the gaps h1 and h2 between adjacent portions of the detection lines 11-1 are equal. By making the widths of the detection lines 11-1 in different regions of the optical element 11 equal and the gaps between adjacent portions of the detection lines 11-1 equal, the width and the arrangement density of the detection lines 11-1 in each region of the optical element 11 can be made consistent, thereby further improving the detection accuracy and sensitivity.

[0085] The width of the detection line 11-1 should not be too wide, otherwise when the optical element 11 is locally damaged, the detection line 11-1 at the corresponding position may not break, or only a part of it is damaged and a part still remains connected, resulting in an inability to detect a significant change in the resistance value of the detection line 11-1, affecting the detection accuracy. The width of the detection line 11-1 should not be too narrow either, otherwise the detection line 11-1 is extremely likely to break, and there may be cases where the detection line 11-1 breaks due to factors other than damage and detachment of the optical element 11, such as electrostatic breakdown, causing misjudgment of damage or detachment of the optical element 11.

[0086] In some embodiments, the value range of the width of the detection line 11-1 is 1 μm to 500 μm, for example, within the range of 30 μm to 100 μm.

[0087] The gap between adjacent parts of the detection line 11-1 should not be too wide, otherwise when the optical element 11 is partially damaged, there may be no detection line 11-1 covering the corresponding position, resulting in the inability to monitor the damage here and affecting the sensitivity of the monitoring. The gap between adjacent parts of the detection line 11-1 should not be too narrow either, otherwise when the detection line 11-1 is etched, there is likely to be residual conductive detection line material between adjacent parts of the detection line 11-1, causing the adjacent parts of the detection line 11-1 to be connected and affecting the sensitivity of the monitoring.

[0088] In some embodiments, the value range of the gap between the detection lines 11-1 is 1 μm to 500 μm, for example, within the range of 30 μm to 100 μm.

[0089] The embodiments of the present invention do not limit the specific pattern of the detection line 11-1. The following gives several specific pattern designs of the detection line 11-1. (1) As Figure 7a , Figure 7b shown, the main part of the detection line 11-1 adopts a broken line design. (2) As Figure 7c shown, the main part of the detection line 11-1 adopts a spiral design. In addition, the line type of the detection line 11-1 is not limited to a straight line, and can also be designed as a continuous line type such as a wavy line or a broken line.

[0090] As a possible design, please refer to Figure 5a , Figure 5b , Figure 6 , Figures 7a - 7c , the number of the detection lines 11-1 can be only one. Under this design, the resistance value monitored by the microprocessor 13 is the overall resistance of this detection line 11-1, or the voltage value monitored by the microprocessor 13 is the voltage at both ends of this detection line 11-1. When the optical element 11 is damaged or falls off, this detection line 11-1 breaks, or the connection between this detection line 11-1 and the wire 15 is disconnected. The microprocessor 13 can monitor that the resistance value becomes infinite, or the voltage value becomes close to or equal to the voltage value provided by the microprocessor 13 to the entire monitoring circuit, so as to determine that the optical element 11 is damaged or falls off.

[0091] As another possible design, please refer to Figure 8, the number of the detection lines 11-1 can be multiple, such as two or more than two. Both ends of each detection line 11-1 are connected to the microprocessor 13, so that a parallel relationship is formed among the multiple detection lines 11-1. Under this design, the resistance value monitored by the microprocessor 13 is the parallel resistance after the multiple detection lines 11-1 are connected in parallel, or the voltage value monitored by the microprocessor 13 is the voltage value of the parallel resistance after the multiple detection lines 11-1 are connected in parallel and divided by the voltage in the entire monitoring circuit. When the optical element 11 is damaged, one or more of the detection lines 11-1 are broken, resulting in an increase in the parallel resistance. The microprocessor 13 monitors an increase in the resistance value or an increase in the voltage value, thereby determining that the optical element 11 is damaged. When the optical element 11 falls off, the entire monitoring circuit is open. The microprocessor 13 can monitor that the resistance value becomes infinite, or the voltage value becomes close to or equal to the voltage value provided by the microprocessor 13 to the entire monitoring circuit, thereby determining that the optical element 11 has fallen off.

[0092] For the setting position of the detection line 11-1, please refer to Figure 5a again. As a possible design, the detection line 11-1 can be set on the surface of the side of the optical element 11 facing away from the laser 12, which is convenient for electrical connection with the wire 15. Of course, the detection line 11-1 can also be set on the surface of the side of the optical element 11 facing the laser 12. The embodiments of the present invention do not limit this.

[0093] In some embodiments, the detection line 11-1 can be prepared by a photolithography process. The specific process may include: First, a thin film of the detection line material (such as ITO, IZO, IGZO, etc.) is formed on the substrate of the optical element 11. The thin film of the detection line material can be formed by processes such as CVD (Chemical Vapor Deposition), sputtering, coating, printing, etc. Then, a photoresist layer is coated on the formed thin film. The photoresist layer is exposed and developed using a mask plate with the pattern of the detection line 11-1 to form a photoresist layer with the pattern of the detection line 11-1. After that, using the photoresist layer with the pattern of the detection line 11-1 as a mask, the thin film of the detection line material is etched to form the detection line 11-1 with a set pattern. The thin film of the detection line material can be etched by processes such as dry etching and laser etching.

[0094] In some other embodiments, the detection line 11-1 can be prepared by a magnetron sputtering process. The specific process may include: A mask plate with the pattern of the detection line 11-1 is used to block the substrate of the optical element 11, and the detection line material is sputtered on the substrate of the optical element 11 to form the detection line 11-1 with a set pattern.

[0095] In some other embodiments, the detection line 11-1 can be prepared by a screen printing process, and a detection line 11-1 with a set pattern is printed directly on the substrate of the optical element 11.

[0096] Please refer to again Figure 5a 、 Figure 6 、 Figures 7a - 7c For the convenience of electrically connecting the detection line 11-1 and the wire 15, conductive pads (PADs) 11-2 can be respectively arranged at both ends of the detection line 11-1, and both ends of the detection line 11-1 are respectively electrically connected to the corresponding wires 15 through the corresponding conductive pads 11-2.

[0097] Optionally, the two conductive pads 11-2 can be respectively arranged at the edge or corner positions of the optical element 11. Further, they can be arranged at the positions of two corners on the same side of the optical element 11, which is convenient for connecting the wire 15.

[0098] In some embodiments, the material of the conductive pad 11-2 is the same as that of the detection line 11-1, so that the two can be formed simultaneously in the same step, simplifying the preparation steps.

[0099] In addition, as a possible design, the width of the conductive pad 11-2 is greater than the width of the detection line 11-1, so as to facilitate the electrical connection between the detection line 11-1 and the wire 15.

[0100] Regarding the setting method of the wire 15, as Figure 9a shown, in some embodiments, the wire 15 extends inside the side wall 14-1 of the module housing 14 of the active light-emitting module 1. One end of the wire 15 extends to the optical element 11 and is connected to the detection line 11-1 (one end of the wire 15 can be connected to the detection line 11-1 through the conductive pad 11-2), and the other end of the wire 15 extends to the bottom substrate 14-2 of the module housing 14 and is connected to the microprocessor 13. By arranging the wire 15 inside the side wall 14-1, on the basis of realizing the connection between the detection line 11-1 and the microprocessor 13, the wire 15 can be protected from being corroded by factors such as moisture and oxygen in the external environment.

[0101] In the above design as Figure 9a shown, the wire 15 and the module housing 14 can be integrally formed by an insert molding process. Or, a channel can be formed in the side wall 14-1 of the module housing 14, and then a solution of the wire material is poured into the channel to form the wire 15.

[0102] As Figure 9bAs shown, in some other embodiments, the wire 15 extends on the inner surface of the side wall 14-1 of the module housing 14 of the active light-emitting module 1. One end of the wire 15 extends to the optical element 11 and is connected to the detection line 11-1 (one end of the wire 15 can be connected to the detection line 11-1 through the conductive pad 11-2). The other end of the wire 15 extends to the bottom substrate 14-2 of the module housing 14 and is connected to the microprocessor 13.

[0103] As Figure 9c shown, in still some other embodiments, the wire 15 extends on the outer surface of the side wall 14-1 of the module housing 14 of the active light-emitting module 1. One end of the wire 15 extends to the optical element 11 and is connected to the detection line 11-1 (one end of the wire 15 can be connected to the detection line 11-1 through the conductive pad 11-2). The other end of the wire 15 extends to the bottom substrate 14-2 of the module housing 14 and is connected to the microprocessor 13.

[0104] In the above designs as Figure 9b and Figure 9c shown, the wire 15 can be formed on the inner surface or the outer surface of the side wall 14-1 of the module housing 14 by means of coating, printing, pasting, etc.

[0105] In addition, in the above designs as Figure 9b and Figure 9c shown, further, a protective layer can be formed on the wire 15 to cover the wire 15 and prevent the wire 15 from being exposed and corroded. The material of the protective layer can be selected from organic or inorganic materials with water and oxygen isolation and anti-corrosion properties.

[0106] The material of the wire 15 can be selected from metal conductive materials such as silver (Ag), copper (Cu), chromium (Cr), etc., or semiconductor conductive materials, or oxide conductive materials, etc., materials with conductive properties.

[0107] For the connection method between the detection line 11-1 and the wire 15, a conductive electrode can be used to attach to the junction of the detection line 11-1 and the wire 15, so as to realize the connection between the detection line 11-1 and the wire 15. Further, please refer to Figures 9a - 9c again. For the structure in which the detection line 11-1 and the wire 15 are connected through the conductive pad 11-2, a conductive electrode 16 can be used to attach to the junction of the conductive pad 11-2 and the wire 15, so as to realize the connection between the conductive pad 11-2 and the wire 15, and thus realize the connection between the detection line 11-1 and the wire 15.

[0108] In some embodiments, the material of the conductive electrode 16 can be a conductive adhesive, and further, a conductive silver adhesive can be selected. During preparation, the conductive adhesive is applied by dispensing at the connection between the detection line 11-1 and the wire 15, or at the connection between the conductive pad 11-2 and the wire 15. The material of the conductive electrode 16 can also be solder. During preparation, a soldering iron can be used to solder the solder at the connection between the detection line 11-1 and the wire 15, or at the connection between the conductive pad 11-2 and the wire 15.

[0109] Based on the above description of the monitoring system for the optical element provided by the embodiments of the present invention, the embodiments of the present invention also provide an optical element, such as Figure 10 、 Figure 11a As shown, the optical element 11 includes: a substrate substrate 11-4, and a detection line 11-1 disposed on one side surface of the substrate substrate 11-4.

[0110] For the design of the function of the detection line 11-1, the connection relationship with other components, the material, the width, the gap between adjacent parts, the specific pattern, the arrangement quantity, the setting position, the preparation process, etc., reference can be made to the description of the detection line 11-1 in the monitoring system for the optical element provided by the embodiments of the present invention, and details are not described here again.

[0111] As a possible design, the optical element 11 further includes a conductive pad 11-2. The conductive pad 11-2 is disposed on the same layer as the detection line 11-1. For the design of the function of the conductive pad 11-2, the connection relationship with other components, the material, the arrangement quantity, the setting position, the preparation process, etc., reference can be made to the description of the conductive pad 11-2 in the monitoring system for the optical element provided by the embodiments of the present invention, and details are not described here again.

[0112] Optionally, the optical element 11 further includes a first alignment mark 11-3. The first alignment mark 11-3 is disposed on the same layer as the detection line 11-1 and the conductive pad 11-2. When the optical element 11 is assembled in the active light-emitting module, the first alignment mark 11-3 is used to mark the position of the optical element 11, so as to accurately fix the position of the optical element 11 in the active light-emitting module. The material of the first alignment mark 11-3 can be the same as that of the detection line 11-1 and the conductive pad 11-2, so as to form the three in the same step and simplify the preparation process. Exemplarily, the number of the first alignment marks 11-3 is two, which are respectively located at two corner positions on the same side of the rectangular substrate substrate 11-4, for example, at the upper left corner and the upper right corner of the rectangular substrate substrate 11-4.

[0113] Such as Figure 10 、 Figure 11bAs shown, in some embodiments, the optical element 11 further includes a microstructure layer 11-5. The microstructure layer 11-5 is disposed on the other side of the substrate 11-4 opposite to the side where the detection line 11-1 is located. That is, the substrate 11-4 includes opposite A side and B side, the detection line 11-1 is disposed on the surface of the A side of the substrate 11-4, and the microstructure layer 11-5 is disposed on the surface of the B side of the substrate 11-4.

[0114] As a possible design, the microstructure layer 11-5 is disposed on the surface of the A side of the substrate 11-4, and the detection line 11-1 is disposed on the surface of the B side of the substrate 11-4. Of course, the microstructure layer 11-5 and the detection line 11-1 may also be disposed on the surface of the same side of the substrate 11-4, such as the surface of the A side or the surface of the B side. If the microstructure layer 11-5 and the detection line 11-1 are disposed on the surface of the same side of the substrate 11-4, the detection line 11-1 may be disposed on the side of the microstructure layer 11-5 facing away from the substrate 11-4, or the detection line 11-1 may be disposed between the microstructure layer 11-5 and the substrate 11-4.

[0115] The microstructures included in the microstructure layer 11-5 of different types of optical elements 11 are different. Exemplarily, if the optical element 11 is a diffractive optical component, the microstructure included in the microstructure layer 11-5 is a diffraction grating microstructure. If the optical element 11 is a light homogenizing sheet, the microstructure included in the microstructure layer 11-5 is a light homogenizing microstructure such as dot patterns.

[0116] As a possible design, please refer back to Figure 11b and refer to Figures 9a - 9c When the optical element 11 is installed in the active light emitting module, the edge of the optical element 11 is fixed to the surface of the supporting structure 14-3 of the module housing 14 facing away from the laser 12 through the adhesive 17. The microstructure layer 11-5 of the optical element 11 is located on the surface of the substrate 11-4 facing the laser 12. The area of the orthographic projection of the microstructure layer 11-5 on the substrate 11-4 is smaller than the area of the substrate 11-4 to reserve an edge area on the surface of the substrate 11-4 facing the laser 12. In this way, the adhesive 17 directly bonds the surface of the substrate 11-4 facing the laser 12 and the surface of the supporting structure 14-3 facing away from the laser 12, avoiding contact with the microstructure layer 11-5, making the bonding between the optical element 11 and the supporting structure 14-3 more firm.

[0117] Such as Figure 10 、 Figure 11cAs shown, in some embodiments, the optical element 11 further includes a second alignment mark 11-6. The second alignment mark 11-6 is disposed on the side of the detection line 11-1 of the substrate 11-4 where the second alignment mark 11-6 is located, and the second alignment mark 11-6 is formed after the detection line 11-1 is formed. That is, both the second alignment mark 11-6 and the detection line 11-1 are disposed on side A or side B of the substrate 11-4, and the second alignment mark 11-6 is formed after the detection line 11-1 is formed. The second alignment mark 11-6 is used to mark the position of the optical element 11 when the optical element 11 is assembled into the active light-emitting module, so as to accurately fix the position of the optical element 11 in the active light-emitting module.

[0118] It should be noted that the above is only an exemplary description of the setting position of the second alignment mark 11-6 in each film layer of the optical element 11. The embodiments of the present invention do not limit the setting position of the second alignment mark 11-6 in each film layer of the optical element 11. The second alignment mark 11-6 can be set at any position in each film layer of the optical element 11 as long as it can play the role of marking the position of the optical element 11. For example, the second alignment mark 11-6 is disposed between the detection line 11-1 and the substrate 11-4. Or, the second alignment mark 11-6 is disposed between the microstructure layer 11-5 and the substrate 11-4. Or, the second alignment mark 11-6 is disposed on the side of the microstructure layer 11-5 facing away from the substrate 11-4. And so on.

[0119] The embodiments of the present invention do not limit the number of the second alignment marks 11-6. In addition, the setting position of the second alignment mark 11-6 in the optical element 11 can be located at the edge or corner position of the optical element 1, that is, the position of the orthographic projection of the second alignment mark 11-6 on the substrate 11-4 can be located at the edge or corner position of the substrate 11-4. Exemplarily, for a rectangular optical element 11, a second alignment mark 11-6 can be provided at each of the four corner positions of the optical element 11.

[0120] In some other possible designs, if both the first alignment mark 11-3 and the second alignment mark 11-6 are provided in the optical element 11, the orthographic projections of the first alignment mark 11-3 and the second alignment mark 11-6 at the same position of the optical element 11 on the substrate 11-4 overlap. For example, if both the first alignment mark 11-3 and the second alignment mark 11-6 are provided at the upper left corner (or upper right corner, or lower left corner, or lower right corner) of the rectangular optical element 11, the orthographic projections of the first alignment mark 11-3 and the second alignment mark 11-6 at the upper left corner (or upper right corner, or lower left corner, or lower right corner) on the substrate 11-4 overlap.

[0121] The material of the second alignment mark 11-6 can be selected as a material with a relatively low transmittance, such as metal, so that when the optical element 11 is assembled into the active light-emitting module, the second alignment mark 11-6 can be observed more clearly.

[0122] As Figure 10 , Figure 11d As shown, in some embodiments, the optical element 11 further includes a protective layer 11-7. The protective layer 11-7 is disposed on the side where the detection line 11-1 of the substrate 11-4 is located. That is, both the protective layer 11-7 and the detection line 11-1 are disposed on side A or side B of the substrate 11-4. And the protective layer 11-7 covers the detection line 11-1. The protective layer 11-7 covering the detection line 11-1 serves to protect the detection line 11-1. The material of the protective layer 11-7 can be selected from organic or inorganic materials with water and oxygen isolation and corrosion resistance properties.

[0123] It should be noted that, as a possible design, please refer to Figure 10 again. If both the detection line 11-1 and the second alignment mark 11-6 are disposed on side A or side B of the substrate 11-4, and the second alignment mark 11-6 is formed of a material such as metal that is easily oxidized and corroded, the protective layer 11-7 can cover the detection line 11-1 and the second alignment mark 11-6 to protect the detection line 11-1 and the second alignment mark 11-6.

[0124] As a possible design, an opening 11-8 is provided on the protective layer 11-7 to expose the end of the detection line 11-1 or the conductive pad 11-2, facilitating the electrical connection between the end of the detection line 11-1 or the conductive pad 11-2 and the wire 15. The position of the opening 11-8 is determined according to the position of the end of the detection line 11-1 or the conductive pad 11-2.

[0125] Based on the above description of the monitoring system of the optical element and the optical element provided by the embodiments of the present invention, the embodiments of the present invention further provide an active light-emitting module. As Figures 9a - 9c shown, the active light-emitting module 1 includes: an optical element 11, a wire 15, a laser 12, a microprocessor 13, and a module housing 14. Among them, the module housing 14 at least includes a bottom substrate 14-2 and a side wall 14-1. The optical element 11 is installed at one end of the side wall 14-1 away from the bottom substrate 14-2. Further, the module housing 14 further includes a supporting structure 14-3. Please refer to Figure 4b, the supporting structure 14-3 is a ring structure, which is arranged on the inner surface of the side wall 14-1 in a ring shape to form a light passing aperture GG. The edge of the optical element 11 is fixed on the surface of the supporting structure 14-3 facing away from the laser 12 through an adhesive 17. The laser 12 and the microprocessor 13 are installed on the bottom substrate 14-2 and are connected to each other. The microprocessor 13 controls the laser 12 to emit laser light, and the laser light passes through the light passing aperture GG and is emitted out of the active light emitting module 1 through the optical element 11.

[0126] The optical element 11 includes a detection line 11-1. Both ends of the detection line 11-1 are respectively connected to the microprocessor 13 through wires 15. The microprocessor 13 monitors the resistance value of the detection line 11-1 or the voltage value at both ends of the detection line 11-1 in real time. When the resistance value of the detection line 11-1 exceeds the set resistance threshold range, or when the voltage value at both ends of the detection line 11-1 exceeds the set voltage threshold range, it is determined that the optical element 11 is damaged or detached. At this time, the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12, and the laser 12 is turned off, thus effectively avoiding the laser emitted by the laser 12 directly shining into the human eye and causing harm to the human eye. Moreover, only one layer of the optical element 11 and the detection line 11-1 (i.e., only one conductive layer) needs to be provided in the active light emitting module 1, with a simple structure, a simple manufacturing process, and a low cost.

[0127] In the above-mentioned active light emitting module 1, for the connection method between the detection line 11-1 and the wire 15, and the arrangement method of the wire 15 on the side wall 14-1 of the module housing 14, reference can be made to the description of the wire 15 in the optical element monitoring system provided by the embodiments of the present invention, which will not be elaborated here.

[0128] It should be noted that the active light emitting module 1 provided by the embodiments of the present invention is any module capable of emitting laser light, such as: a module including a high-power laser in a TOF 3D sensing module, a dot matrix projector 115-5 and a flood illuminator 115-2 in a structured light 3D sensing module 115, etc.

[0129] Based on the above description of the active light emitting module 1 provided by the embodiments of the present invention, the embodiments of the present invention also provide a terminal. The terminal includes the active light emitting module 1 provided by the embodiments of the present invention, which is used to provide specified laser light (for example, if the active light emitting module 1 is a dot matrix projector 115-5, the specified light that the active light emitting module 1 needs to provide is the light of the structured light) to assist the terminal in realizing the 3D sensing function. When the active light emitting module 1 is installed in a terminal such as a mobile phone 100, its laser 12 side (and the light emitting side) is close to the inside of the terminal, and the optical element 11 side (and the light output side) faces the outside of the terminal to project the specified laser light outward.

[0130] Based on the above description of the monitoring system for the optical element provided by the embodiments of the present invention, the embodiments of the present invention further provide a method for monitoring an optical element. This method for monitoring an optical element is applied to the monitoring system for the optical element provided by the embodiments of the present invention, as Figure 12 shown, and please refer to Figure 5a and Figure 5b again. This method for monitoring an optical element includes the following steps:

[0131] S1: The microprocessor 13 monitors the resistance value of the detection line 11-1 in real time.

[0132] As a possible implementation manner, as Figure 13 shown, step S1 may specifically include the following steps:

[0133] S11: The microprocessor 13 monitors the voltage value across the detection line 11-1 in real time. In this step, if the optical element 11 is not damaged or detached, the monitored voltage value is close to or equal to the voltage value divided by the detection line 11-1 in the entire monitoring circuit (i.e., the monitoring circuit composed of the detection line 11-1, the wire 15, and the microprocessor 13) when the detection line 11-1 is not broken. If the optical element 11 is damaged or detached and the monitoring circuit is open, the monitored voltage value is close to or equal to the voltage value provided by the microprocessor 13 to the entire monitoring circuit.

[0134] It should be noted that the microprocessor 13 monitors the voltage value across the detection line 11-1 by applying a voltage to the detection line 11-1. Specifically, the microprocessor 13 provides a certain voltage to the entire monitoring circuit, and the detection line 11-1 in the monitoring circuit divides the voltage, thereby realizing that the microprocessor 13 applies a voltage to the detection line 11-1. The voltage provided by the microprocessor 13 to the entire monitoring circuit can be a continuous voltage signal or a non-continuous voltage signal, such as a voltage signal in pulse mode, to reduce power consumption and reduce the corrosion caused by the voltage signal to the detection line 11-1. The voltage provided by the microprocessor 13 to the entire monitoring circuit is supplied by the power supply of the terminal (such as the power supply device 111 of the mobile phone 100). Exemplarily, the voltage value provided by the microprocessor 13 to the entire monitoring circuit is 2.85V, the resistance value of the detection line 11-1 when there is no break is 10KΩ, and in the case where there is no open circuit in the entire monitoring circuit, the detection line 11-1 divides 0.8V voltage, that is, the voltage value across the detection line 11-1 is 0.8V.

[0135] S12: The microprocessor 13 converts the monitored voltage value into a resistance value.

[0136] In this step, the microprocessor 13 converts the voltage value obtained by real-time monitoring into a resistance value. If the monitored voltage value is close to or equal to the voltage value of the detection line 11-1 when it is not broken and divides the voltage in the entire monitoring circuit, the converted resistance value should be close to or equal to the resistance value of the detection line 11-1 when it is not broken. If the monitored voltage value is close to or equal to the voltage value provided by the microprocessor 13 to the entire monitoring circuit, the converted resistance value is infinite.

[0137] S2: The microprocessor 13 determines whether the monitored resistance value exceeds the set resistance threshold range: if so, the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12; if not, it returns to step S1.

[0138] In the above step S2, the set resistance threshold range can be set as a numerical range that fluctuates around the resistance value R of the detection line 11-1 when it is not broken. Exemplarily, the set resistance threshold range can be set to be greater than or equal to 80%R and less than or equal to 120%R. If the resistance value obtained in step S1 exceeds this set resistance threshold range, it indicates that an open circuit has occurred in the monitoring circuit. It may be that the detection line 11-1 is broken, or the connection between the detection line 11-1 and the wire 15 is disconnected, which means that the optical element 11 is damaged or detached. At this time, the microprocessor 13 sends an interrupt signal to the power supply 2 to control the power supply 2 to stop supplying power to the laser 12, so that the laser 12 is turned off, avoiding the laser light directly shining into the human eye and damaging the human eye when the optical element 11 is damaged or detached. If the resistance value obtained in step S1 does not exceed the set resistance threshold range, it indicates that the monitoring circuit is working normally, the optical element 11 is normal, the power supply 2 can continue to supply power to the laser 12, and the microprocessor 13 can return to step S1 to monitor the resistance value of the detection line 11-1 at the next moment.

[0139] Exemplarily, the resistance value of the detection line 11-1 when it is not broken is 10 KΩ, and the set resistance threshold range is set to be greater than or equal to 8 KΩ and less than or equal to 12 KΩ. The voltage value provided by the microprocessor 13 to the entire monitoring circuit is 2.85 V, and in the case of no open circuit in the entire monitoring circuit, the detection line 11-1 divides 0.8 V voltage.

[0140] At time t1, the microprocessor 13 monitors that the voltage value U at both ends of the detection line 11-1 is 2.85 V. According to the principle of resistance voltage division, the converted resistance value R obtained from this voltage value U is infinite. It is determined that the converted resistance value R has exceeded the set resistance threshold range of 8 KΩ to 12 KΩ, so it is determined that the optical element 11 is damaged or detached, and the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12.

[0141] At time t2, the microprocessor 13 monitors that the voltage value U at both ends of the detection line 11-1 is 0.8V. According to the principle of resistor voltage division, the resistance value converted from this voltage value U is 10KΩ. It is determined that the converted resistance value R is within the set resistance threshold range of 8KΩ to 12KΩ, then it is determined that the optical element 11 is normal, and the power supply 2 can continue to supply power to the laser 12.

[0142] In some embodiments, it is also possible to judge whether the optical element 11 is damaged or detached by real-time monitoring of the voltage value at both ends of the detection line 11-1 and determining whether the monitored voltage value exceeds the set voltage threshold. Please refer to Figure 14 and please refer to again Figure 5a 、 Figure 5b The monitoring method of the optical element includes the following steps:

[0143] S1': The microprocessor 13 monitors the voltage value at both ends of the detection line 11-1 in real time.

[0144] For the detailed description of the above step S1', please refer to the description of step S11 above, which will not be elaborated here.

[0145] S2': The microprocessor 13 determines whether the monitored voltage value exceeds the set voltage threshold range: if so, the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12; if not, it returns to step S1'.

[0146] In the above step S2', the set voltage threshold range can be set as a numerical range that fluctuates up and down around the voltage value U shared by the detection line 11-1 in the entire monitoring circuit when it is not broken. Exemplarily, the set voltage threshold range can be set to be greater than or equal to 80%U and less than or equal to 120%U. If the voltage value monitored in step S1' exceeds this set voltage threshold range, it means that the monitoring circuit is open, which may be due to the breakage of the detection line 11-1 or the disconnection at the connection between the detection line 11-1 and the wire 15, indicating that the optical element 11 is damaged or detached. At this time, the microprocessor 13 sends an interrupt signal to the power supply 2 to control the power supply 2 to stop supplying power to the laser 12, so that the laser 12 is turned off, avoiding the direct irradiation of the laser light into the human eye and damaging the human eye when the optical element 11 is damaged or detached. If the voltage value monitored in step S1' does not exceed the set voltage threshold, it means that the monitoring circuit is working normally, the optical element 11 is normal, the power supply 2 can continue to supply power to the laser 12, and the microprocessor 13 can return to step S1 to monitor the voltage value at both ends of the detection line 11-1 at the next moment.

[0147] Exemplarily, the voltage value provided by the microprocessor 13 to the entire monitoring circuit is 2.85V. When there is no open circuit in the entire monitoring circuit, the detection line 11-1 is allocated 0.8V voltage, and the set voltage threshold range is set to be greater than or equal to 0.64V and less than or equal to 0.96V.

[0148] At the moment t1', the microprocessor 13 monitors that the voltage value U across the detection line 11-1 is 2.85V, and this voltage value U has exceeded the set voltage threshold range of 0.64V to 0.96V. Then it is determined that the optical element 11 is damaged or detached, and the microprocessor 13 controls the power supply 2 to stop supplying power to the laser 12.

[0149] At the moment t2', the microprocessor 13 monitors that the voltage value U across the detection line 11-1 is 0.8V, and this voltage value U is within the set voltage threshold range of 0.64V to 0.96V. Then it is determined that the optical element 11 is normal, and the power supply 2 can continue to supply power to the laser 12.

[0150] It can be understood that in order to implement the above functions, the above terminals and the like include the corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should easily realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed in this article, the embodiments of the present invention can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the embodiments of the present invention.

[0151] As described above, the above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An optical element, comprising a substrate, characterized in that, The optical element is a diffractive optical component or a light homogenizing sheet. The optical element further includes a detection line disposed on one surface of the substrate. The detection line is configured to transmit an electrical signal; Wherein, the detection line extends in a zigzag or spiral shape. The number of the detection lines is one, and the number of ends of the detection line is two; The surface of the substrate where the detection line is located is divided into multiple regions. The wire diameter width of the detection line in each region is equal, and the gap between adjacent portions of the detection line is equal.

2. The optical element according to claim 1, wherein The material of the detection line is a transparent conductive material.

3. The optical element according to claim 2, characterized in that, The material of the detection line includes any one or several of indium tin oxide, indium zinc oxide, indium gallium zinc oxide, and indium tin zinc oxide.

4. The optical element according to claim 1, characterized in that, The coverage area of the detection line in each region is within the same set range.

5. The optical element according to claim 4, characterized in that, The coverage area of the detection line in each region is equal.

6. The optical element according to claim 1, characterized in that, The wire diameter of the detection line ranges from 1 μm to 500 μm.

7. The optical element according to claim 1, characterized in that, The gap between adjacent portions of the detection line ranges from 1 μm to 500 μm.

8. The optical element according to claim 1, wherein, The optical element further includes a conductive pad disposed on the same surface of the substrate as the side where the detection line is located. The conductive pad is located at the end of the detection line and is electrically connected to the end of the detection line.

9. The optical element according to claim 8, characterized in that, The conductive pad has the same material as the detection line.

10. The optical element according to claim 8, characterized in that, The optical element further includes a protective layer covering the detection line. An opening is provided on the protective layer to expose the conductive pad.

11. An active light-emitting module, comprising a module housing, the module housing including a bottom substrate and side walls, characterized in that, The active light-emitting module further includes: A laser and a microprocessor mounted on the bottom substrate; An optical element mounted at one end of the side wall away from the bottom substrate. The optical element is the optical element according to any one of claims 1 to 10; A wire for connecting the two ends of the detection line of the optical element to the microprocessor respectively; The microprocessor is configured to monitor the resistance value of the detection line or the voltage value at both ends of the detection line in real time, determine whether the optical element is damaged or detached according to the monitored resistance value or voltage value, and control the laser to turn off when it is determined that the optical element is damaged or detached.

12. The active light-emitting module according to claim 11, wherein The wire extends from the end of the detection line to the microprocessor inside the side wall; or, The wire extends from the end of the detection line to the microprocessor on the inner surface of the side wall; or, The wire extends from the end of the detection line to the microprocessor on the outer surface of the side wall.

13. The active light-emitting module according to claim 11, characterized in that, The active light-emitting module further includes a conductive electrode disposed at the connection between the end of the detection line and the wire for electrically connecting the end of the detection line and the wire.

14. The active light-emitting module according to claim 13, wherein The material of the conductive electrode is conductive silver paste or solder.

15. A terminal, characterized in that, The terminal includes the active light-emitting module according to any one of claims 11 to 14.

16. A monitoring system for an optical element, characterized in that, The monitoring system of the optical element includes: A microprocessor, a power supply, and a laser connected in sequence; The optical element according to any one of claims 1 to 10. The two ends of the detection line of the optical element are respectively connected to the microprocessor; The microprocessor is configured to monitor in real time the resistance value of the detection line or the voltage value across the two ends of the detection line, determine whether the optical element is damaged or detached according to the monitored resistance value or voltage value, and control the power supply to stop supplying power to the laser when it is determined that the optical element is damaged or detached.

17. A monitoring method for an optical element, characterized in that, A monitoring system applied to the optical element as described in claim 16, the monitoring method of the optical element comprising: The microprocessor monitors in real time the resistance value of the detection line; The microprocessor determines whether the monitored resistance value exceeds a set resistance threshold range: if so, the microprocessor controls the power supply to stop supplying power to the laser; if not, the microprocessor monitors the resistance value of the detection line at the next moment; Wherein, the set resistance threshold range is a numerical range fluctuating above and below the resistance value of the detection line when it is not broken.

18. The monitoring method of the optical element according to claim 17, characterized in that, The step in which the microprocessor monitors in real time the resistance value across the two ends of the detection line comprises: The microprocessor monitors in real time the voltage value across the two ends of the detection line; The microprocessor converts the monitored voltage value into a resistance value.

19. A monitoring method for an optical element, characterized in that, A monitoring system applied to the optical element as described in claim 16, the monitoring method of the optical element comprising: The microprocessor monitors in real time the voltage value across the two ends of the detection line; The microprocessor determines whether the monitored voltage value exceeds a set voltage threshold range: if so, the microprocessor controls the power supply to stop supplying power to the laser; if not, the microprocessor monitors the voltage value across the two ends of the detection line at the next moment; Wherein, the set voltage threshold range is a numerical range fluctuating above and below the voltage value across the two ends of the detection line when it is not broken.

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