Card aging status analysis method, system, computer product and storage medium

Abstract

The present invention relates to a method, system, computer product, and storage medium for analyzing the aging status of a card component. The method comprises: obtaining the appearance inspection results of the card component to be tested input by a tester; obtaining an infrared image of the card component to be tested while in operation from an infrared thermal imaging device, and determining the infrared inspection results of the card component to be tested based on the infrared image; inputting a corresponding excitation signal to the card component to be tested via a test signal source, obtaining a corresponding response signal from the card component to be tested from an acquisition control device, and determining the signal inspection results of the card component to be tested based on the response signal; and performing an aging status analysis on the card component to be tested based on the appearance inspection results, infrared inspection results, and signal inspection results to obtain a comprehensive analysis result. Implementing the technical solution of the present invention can reduce the occurrence of missed inspections and over-inspections.

Description

Technical Field

[0001] The present invention relates to the field of circuit board aging testing, and in particular to a method, system, computer product and storage medium for analyzing the aging state of a card. Background Art

[0002] The safety, reliability and economy of nuclear power generation are the foundation for the survival and development of nuclear power plants. UPS power supply cards for nuclear power plants are the key to the safe and stable operation of nuclear power plants.

[0003] A UPS (uninterruptible power supply) is an uninterruptible power supply (UPS) with an energy storage device. It is primarily used to provide uninterruptible power to devices requiring high power stability. When the mains power input is normal, the UPS stabilizes the mains voltage and supplies it to the load, while also charging the internal battery. In the event of a mains power outage (e.g., a power outage), the UPS immediately converts the battery's DC power into 220V AC power via an inverter, ensuring normal operation and protecting the load's software and hardware from damage. UPS devices typically provide protection against both overvoltage and undervoltage conditions, making the safety of UPS power components extremely important. Under certain conditions, after a period of operation, the parameters of some components within the UPS will change. This change is related to the aging of the components and is strictly prohibited for UPS power components. Currently, personnel are typically assigned to regularly inspect and maintain UPS power components, but under- and over-maintenance are common. Under-maintenance can cause malfunctioning nuclear power plant equipment, while over-maintenance can lead to waste of resources.

[0004] The above problems are not limited to UPS power supply components. Ordinary components also have the problem of under-maintenance and over-maintenance.

[0005] Therefore, a method is needed to accurately analyze and evaluate the aging status of card parts to reduce the occurrence of missed inspections and over-inspections of card parts. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a method, system, computer product and storage medium for analyzing the aging status of card parts in view of the defect that the maintenance of card parts in the prior art often results in under-repair and over-repair.

[0007] The technical solution adopted by the present invention to solve the technical problem is to construct a card aging state analysis method, including:

[0008] Obtain the appearance inspection results of the test parts input by the tester;

[0009] Acquire an infrared image of the card to be tested when it is working from the infrared thermal imaging device, and determine the infrared detection result of the card to be tested based on the infrared image;

[0010] Inputting a corresponding excitation signal to the card under test through the test signal source, obtaining a corresponding response signal of the card under test from the acquisition control device, and determining a signal detection result of the card under test according to the response signal;

[0011] An aging status analysis is performed on the card component to be tested based on the appearance detection result, the infrared detection result and the signal detection result to obtain a comprehensive analysis result.

[0012] Preferably, it also includes:

[0013] Acquire environmental information of the cabinet from an environmental sensor disposed in the cabinet, and determine an environmental detection result of the card to be tested based on the environmental information;

[0014] Furthermore, performing an aging status analysis on the card to be tested based on the appearance detection result, the infrared detection result, and the signal detection result includes:

[0015] An aging status analysis is performed on the card component to be tested according to the appearance detection result, the infrared detection result, the signal detection result and the environment detection result.

[0016] Preferably, an aging state analysis is performed on the card to be tested based on the appearance detection result, the infrared detection result and the signal detection result to obtain a comprehensive analysis result, including:

[0017] According to a preset weight ratio among appearance detection, infrared detection and signal detection, the appearance detection result, the infrared detection result and the signal detection result are calculated to obtain a comprehensive analysis result.

[0018] Preferably, determining the infrared detection result of the card to be tested according to the infrared image includes:

[0019] Identify a specific component of the card to be tested from the infrared image, and determine heating information of the specific component, wherein the heating information includes heating value and / or heating area and / or heating duration;

[0020] The determined heating information of the specific component is compared with the heating information of the standard card, and an infrared detection score is determined based on the comparison result.

[0021] Preferably, determining the signal detection result of the card to be tested according to the response signal includes:

[0022] The acquired response signal is compared with the corresponding response signal of the standard card component, and a signal detection score value is determined based on the comparison result.

[0023] Preferably, obtaining environmental information of the cabinet from an environmental sensor provided in the cabinet includes:

[0024] The temperature and / or humidity information of the cabinet is obtained from a temperature sensor and / or a humidity sensor disposed in the cabinet.

[0025] The present invention also constructs a computer product, comprising a processor, which implements the steps of the above-mentioned card component aging status analysis method when executing a computer program.

[0026] The present invention also provides a storage medium storing a computer program, which implements the above-mentioned card component aging status analysis method when executed by a processor.

[0027] The present invention also constructs a card aging status analysis system, including a background host and a front-end machine, an infrared thermal imaging device, a test signal source, and an acquisition control device arranged in a cabinet. The infrared thermal imaging device, the test signal source, and the acquisition control device are respectively connected to the background host through the front-end machine, and the background host includes a processor. When executing a computer program, the processor implements the steps of the above-mentioned card aging status analysis method.

[0028] Preferably, it also includes:

[0029] An environmental sensor is arranged in the cabinet, and the environmental sensor is connected to the background host through the front-end machine.

[0030] Preferably, the background host is further used to generate a test case for the card to be tested, and send the test case to the front-end, and analyze the received response signal to obtain a signal detection result;

[0031] The front-end processor is used to parse the received test case into multiple control commands and send them to the test signal source and the acquisition control device;

[0032] The test signal source is used to configure the output voltage according to the corresponding control command received to provide an excitation signal for the card to be tested;

[0033] The acquisition control device is used to acquire response signals from the card to be tested according to the corresponding control command received, and send the response signals to the background host through the front-end machine.

[0034] Preferably, the acquisition control device includes a main control board and a switch output board, a switch input board, and an analog input board respectively connected to the main control board. Moreover, the switch output board, the switch input board, and the analog input board are also respectively connected to the corresponding pins of the card to be tested through corresponding ports, wherein:

[0035] The main control board is used to receive corresponding control commands from the front-end machine and configure the on / off of corresponding channels in the switch output board and the switch input board according to the corresponding control commands; it is also used to collect switch response signals from the switch input board and analog response signals from the analog input board, and process the switch response signals and the analog response signals.

[0036] Preferably, the switch input board includes an optocoupler array, and the positive input end of each optocoupler is connected to the first end of the corresponding relay switch, the second end of the corresponding relay switch is connected to the positive end of the power supply, the negative input end and the negative output end of each optocoupler are grounded respectively, and the positive output end of each optocoupler is connected to the corresponding input end of the main control board.

[0037] Preferably, the test signal source includes:

[0038] The relay protection tester is used to configure the corresponding AC voltage or current according to the corresponding control command received;

[0039] The DC adjustable power supply is used to configure the corresponding DC voltage or current according to the corresponding control command received.

[0040] Preferably, it further comprises an adapting device arranged in the cabinet, and,

[0041] The adapting device is used to condition the excitation signal input to the card to be tested and / or the response signal output by the card to be tested.

[0042] The technical solution provided by the present invention conducts a comprehensive analysis of the aging status of the card from three aspects: appearance inspection, infrared inspection, and signal inspection. It can accurately evaluate the aging status of the card, thereby reducing the occurrence of missed inspections and over-inspections. Moreover, the entire inspection process does not require manual data recording, which reduces personnel workload and improves data integrity and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. In the drawings:

[0044] Figure 1 This is a flow chart of Example 1 of the card aging status analysis method of the present invention;

[0045] Figure 2 This is a logical structure diagram of a first embodiment of a card aging status analysis system according to the present invention;

[0046] Figure 3 This is a partial logical structure diagram of the second embodiment of the card aging status analysis system of the present invention. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0048] The purpose of the present invention is to provide a method and system for analyzing the aging status of a card component (such as a UPS power supply in a nuclear power plant), thereby evaluating the aging status of the card component, which can greatly improve reliability and safety.

[0049] Figure 1 Flowchart of Example 1 of the card aging status analysis method of the present invention. The aging status analysis method of this embodiment includes:

[0050] Step S10, obtaining the appearance inspection result of the card to be tested input by the tester;

[0051] This step evaluates the aging state of the card by inspecting its appearance. Appearance inspection is to evaluate the overall damage of the card by its appearance. The appearance inspection result can be characterized by an appearance inspection score (A). The level of the appearance inspection score is determined by the tester's evaluation of the overall damage of the appearance of the card. If the appearance is new and undamaged, the score is high, and if the appearance is seriously damaged, the score is low. In a specific embodiment, the appearance can be inspected by the following ten items (or one or more of them): color, size, board warping, board delamination, connected boards, fractures or damages, burrs, scratches, whether there are dirt and foreign matter on the board surface and in the holes, and open circuits. Moreover, the appearance indicators are divided into three levels: excellent, good, and poor. Each time you get an "excellent" level, you get ten points, a "good" level gets five points, and a "poor" level gets no points. The sum of the scores of all items is the appearance inspection score.

[0052] Step S20, obtaining an infrared image of the card to be tested when it is working from the infrared thermal imaging device, and determining the infrared detection result of the card to be tested based on the infrared image;

[0053] In this step, it should be noted that during normal operation of the card, some components will begin to rise in surface temperature due to the current flow and emit infrared thermal radiation. There is a certain correlation between infrared thermal imaging and the radiation power and temperature of components. Furthermore, because the radiation intensity of each component on the card varies, the temperature at each location also varies. Infrared thermal imaging can display a large amount of information about the card itself in the form of an infrared thermal field, objectively reflecting the status of the components. The infrared thermal imaging device includes an electrically connected short-wave infrared camera and an image generation module. The short-wave infrared camera can, for example, be a dual-spectrum temperature measurement camera, and is aimed at the card. The short-wave infrared camera focuses the infrared energy emitted from the card and generates an infrared thermal signal. The image generation module then processes the infrared thermal signal through A / D conversion, background noise removal, non-uniformity correction, sensor temperature measurement, storage, and pseudo-color encoding, ultimately converting the infrared thermal signal into an infrared image.

[0054] Step S30, inputting a corresponding excitation signal to the card under test through the test signal source, acquiring a corresponding response signal of the card under test from the acquisition control device, and determining a signal detection result of the card under test according to the response signal;

[0055] Step S40 , performing an aging status analysis on the card to be tested based on the appearance detection result, the infrared detection result and the signal detection result to obtain a comprehensive analysis result.

[0056] In this step, an aging status assessment model for the card can be established in advance. After the appearance inspection results, infrared inspection results and signal detection results are obtained, they are sent to the aging status assessment model, and the comprehensive analysis results are determined based on the output of the aging status assessment model.

[0057] In the technical solution of this embodiment, the aging status of the card is comprehensively analyzed from three aspects: appearance inspection, infrared inspection, and signal inspection, so as to reduce the occurrence of missed inspection and over-inspection. Moreover, the entire inspection process does not require manual data recording, which reduces the workload of personnel and improves data integrity and accuracy.

[0058] Furthermore, the card component aging status analysis method of the present invention is characterized by further comprising: obtaining cabinet environmental information from an environmental sensor disposed within the cabinet, and determining an environmental detection result of the card component to be tested based on the environmental information. Furthermore, step S40 comprises: performing an aging status analysis on the card component to be tested based on the appearance detection result, the infrared detection result, the signal detection result, and the environmental detection result. In this embodiment, the environmental sensor is, for example, a temperature sensor and / or a humidity sensor, and thus the acquired environmental information includes temperature information and / or humidity information. Moreover, the environmental monitoring index (E) can be used to characterize the environmental detection results. Assuming that the temperature range in the cabinet is 18℃~28℃ and the relative humidity range is 40%~70%, which is the normal fluctuation range, 23℃ is used as the standard temperature point T and 55% is used as the standard humidity point H. If the current temperature in the cabinet is t and the humidity is h, then the environmental detection score E=100-(m1*100*|tT| / T+m2*100*|hH| / H), where m1 and m2 are the weight values corresponding to the pre-set temperature and humidity, respectively. For example, m1=50%, m2=50%.

[0059] Furthermore, in an optional embodiment, the step S40 is: according to the preset weight ratio between the appearance detection, infrared detection, signal detection, and environmental detection, the appearance detection result, the infrared detection result, the signal detection result, and the environmental detection result are calculated to obtain a comprehensive analysis result. In this embodiment, the calculation formula of the comprehensive analysis result is: S = n1*A+n2*R+n3*O+n4*E, wherein A is the appearance detection score value, R is the infrared detection score value, O is the signal detection score value, E is the environmental detection score value, n1 is the weight value of the appearance detection, n2 is the weight value of the infrared detection, n3 is the weight value of the signal detection, n4 is the weight value of the environmental detection, and n1+n2+n3+n4=1, S is the score value of the comprehensive analysis result, the higher the score, the milder the aging state of the card; the lower the score, the more serious the aging state of the card, and the replacement and maintenance are required. For example, the weight ratio of the four is: 2:3:4:1, S = 20% * A + 30% * R + 40% * O + 10% * E. In addition, historical data can be used for analysis to timely and reasonably adjust the weight of the comprehensive evaluation level.

[0060] Of course, in other optional embodiments, when determining the comprehensive analysis results, one or more of the above-mentioned appearance detection, infrared detection, signal detection, and environmental detection can be canceled according to the specific usage scenario or needs. For example, the environmental detection item can be canceled. Accordingly, the weight values in the comprehensive analysis results can also be adjusted appropriately. Examples are not given one by one here.

[0061] Furthermore, in an optional embodiment, determining the infrared detection result of the card to be tested according to the infrared image in step S20 includes:

[0062] Identify a specific component of the card to be tested from the infrared image, and determine heating information of the specific component, wherein the heating information includes heating value and / or heating area and / or heating duration;

[0063] The determined heating information of the specific component is compared with the heating information of the standard card, and the infrared detection score value R is determined according to the comparison result.

[0064] In this embodiment, specific components (key components) in the infrared image are first identified, and then the heating information such as the heating value, heating area, and heating time of the key components are determined, and compared with the heating value, heating area, and heating time of the standard card working under the same working conditions, and the degree of deviation is calculated. The smaller the heating area, the lower the heating value, and the shorter the heating time, the higher the infrared detection score; conversely, the larger the heating area, the higher the heating value, and the longer the heating time, the lower the score.

[0065] In a specific embodiment, the abnormal points of the card to be tested can be further located based on the detected infrared image. Specifically, after obtaining the detected infrared image (test image), the test image is compared and analyzed with the standard image, and the identification of the abnormal component is determined based on the comparison and analysis results; wherein, the standard image is an image captured by the infrared thermal imaging device when the standard card works under standard working conditions; according to the pre-stored identifications corresponding to multiple components on the card and their respective positions on the card, the position of the abnormal component is found based on the identification of the abnormal component.

[0066] Furthermore, the identification of abnormal components can be determined in the following manner: performing image difference processing on the test image and the standard image to obtain a differential image; determining pixel points with pixel values greater than a first preset value in the differential image, and for each pixel point with a pixel value greater than the first preset value, using a specific graphic to perform a grid selection, for example, using the position of the pixel point as the center of a circle and a second preset value (for example, 40) as the diameter to perform a circular grid selection to obtain a corresponding image block; calculating the number of pixel points with pixel values greater than the first preset value in each image block, and determining whether the number value corresponding to each image block is greater than a threshold, and treating the image block greater than the threshold as an abnormal image block; determining an abnormal area in the test image or the standard image according to the position of the abnormal image block in the differential image; identifying the identification of the component from the abnormal area, and using the identified identification as the identification of the abnormal component.

[0067] Furthermore, since it has been found in actual applications that when collecting standard images and test images, there may be deviations in the relative positions of the standard card, the card under test and the camera in the infrared thermal imaging device, it is necessary to first perform image registration processing on the test image to make the position of each pixel in the test image consistent with the position of the corresponding pixel in the standard image.

[0068] Furthermore, in an optional embodiment, determining the signal detection result of the card to be tested based on the response signal in step S30 includes: comparing the acquired response signal with the corresponding response signal of the standard card, and determining the signal detection score value O based on the comparison result.

[0069] In this embodiment, the response signal value of the output pin of the card to be tested is compared with the response signal value of the corresponding output pin of the standard card, and the fluctuation range is scored. The smaller the fluctuation, the higher the score, and the larger the fluctuation, the lower the score. Specifically, the card to be tested can be tested multiple times, and for each response signal (each output pin) of each test, the deviation rate of the response signal relative to the corresponding standard signal is calculated, and then the average deviation rate of the multiple tests is calculated. Finally, if the full score is 100 points, the output signal value index score is in, are the average deviation rates of the 1st, 2nd, …, nth response signals, respectively, and n is the number of items.

[0070] The present invention also constructs a computer product, which includes a processor. When executing a computer program, the processor implements the steps of any of the above-mentioned methods for analyzing the aging status of a card component.

[0071] The present invention also provides a storage medium storing a computer program, which implements the above-mentioned card component aging status analysis method when executed by a processor.

[0072] Figure 2 This is a logical structure diagram of the first embodiment of the card component aging status analysis system of the present invention. The aging status analysis system of this embodiment includes a background host 107, a cabinet 101 and a front-end machine 102 arranged in the cabinet 101, an infrared thermal imaging device 108, a test signal source 103, an acquisition control device 104, and an environmental sensor 110. Moreover, the infrared thermal imaging device 108, the test signal source 103, the acquisition control device 104 and the environmental sensor 110 are respectively connected to the background host 107 through the front-end machine 102, and the background host 107 includes a processor. When the processor executes the computer program, it implements the steps of the above-mentioned card component aging status analysis method.

[0073] In a specific embodiment, the background host 107 is also used to generate test cases for the card to be tested (card 106), and send the test cases to the front-end 102, as well as analyze the received response signals to obtain signal detection results; the front-end 102 is used to parse the received test cases into multiple control commands, and send them to the test signal source 103 and the acquisition control device 104; the test signal source 103 is used to configure the output voltage according to the corresponding control commands received to provide an excitation signal for the card to be tested; the acquisition control device 104 is used to collect response signals from the card to be tested according to the corresponding control commands received, and send them to the background host 107 through the front-end 102.

[0074] Furthermore, the card aging status analysis system of this embodiment also includes a switching power supply 109 and an adapter device 105 arranged in the cabinet 102, wherein the switching power supply 109 is used to provide a power signal to the card to be tested; and the adapter device 105 is used to condition the excitation signal input to the card to be tested and / or the response signal output by the card to be tested. The circuit board of the adapter device 105 includes a signal input terminal block, a signal output terminal block and an intermediate circuit, wherein the signal input terminal block is connected to the signal input pins of the acquisition control device 104 and the card 106, and the signal output terminal block is connected to the response input pin of the card 106.

[0075] Furthermore, the test signal source 103 includes a relay protection tester 1031 and a DC adjustable power supply 1032, wherein the relay protection tester 1031 is used to configure the corresponding AC voltage or current according to the corresponding control command received, for example, to provide AC and DC voltages or currents that change according to a set step size; the DC adjustable power supply 1032 is used to configure the corresponding DC voltage or current according to the corresponding control command received, thereby providing a changing DC voltage or current.

[0076] Furthermore, the acquisition and control device 104 includes a main control board 1041 and a switch output board 1042, a switch input board 1044, and an analog input board 1043, each connected to the main control board 1041. Furthermore, the switch output board 1042, switch input board 1044, and analog input board 1043 are each connected to corresponding pins of the test card via corresponding ports. The main control board 1041 is configured to receive corresponding control commands from the front-end processor 102 and, based on the corresponding control commands, configure the on / off state of corresponding channels in the switch output board 1042 and switch input board 1044. It is also configured to collect switch response signals from the switch input board 1044 and analog response signals from the analog input board 1043, and process these signals. Furthermore, the main control board 1041 can also perform functions such as data acquisition and control, computation and processing, communication, and recording. The switch output board 1042 is connected to the test signal source 103 and is used to control the excitation signal (test signal) input to the test component. The switch input board 1044 and the analog input board 1043 are connected to the test component 106 via the adapter 105 and are used to collect the switch and analog values from the output pins of the test component. The models of the various boards include, but are not limited to, the following: the main control board model is RP7001, the switch input board model is RP7301, the switch output board model is RP7321, and the analog input board model is RP7105.

[0077] In one specific embodiment, the front-end processor 102 is connected to the back-end host 107 and the acquisition control device 104 via an Ethernet port. The test signal source 103 is connected to the front-end processor 102 and the acquisition control device 104, respectively. The switching power supply 109 is connected to the acquisition control device 104. The output of the acquisition control device 104 is connected to the adapter 105 to form an electrical port connection. Furthermore, the back-end host 107 can provide functions such as test configuration, modification of test cases (a test case is a structured test process document that defines the type, size, timing, duration, and acquisition target of each test signal during a test), real-time monitoring of the test process, and real-time waveform display of voltage signals of sensitive components through a human-computer interaction interface. It can also perform functions such as storage of test cases and test data, test result analysis, and test report generation. Therefore, the back-end host 107 integrates advanced functions such as test process backtracking, report generation, and historical record query, providing a reliable and comprehensive basis for protection control testing. The front-end processor 102 mainly implements the command parsing and issuance of test cases, and the analysis, processing, and storage of monitoring information. The acquisition control device 104 mainly realizes functions such as sequential execution of test cases, control of excitation signals, and acquisition of analog / digital quantities.

[0078] In addition, cabinet 101 is equipped, from top to bottom, with: a switching power supply 109 (e.g., a 24V switching power supply), a DC adjustable power supply 1032, an acquisition control device 104, an environmental sensor 110, an infrared thermal imaging device 108, and a front-end processor 102. Cabinet 101 is also equipped with multiple power switches. The operating power supply for cabinet 101, front-end processor 102, test signal source 103, acquisition control device 104, and switching power supply 109 is all AC 220V, and 220V mains electricity is uniformly used in this system. The adapter for the card 106 to be tested is fixed in the card slot. Furthermore, a preset distance is set between adjacent compartments within cabinet 101 to ensure that the cards do not affect each other and that heat can be dissipated properly.

[0079] Figure 3 This is a partial logical structure diagram of a second embodiment of the card component aging state analysis system of the present invention. In this embodiment, the specific components (sensitive components) of the card component to be tested 106 include relays, electrolytic capacitors, etc. The switching power supply 109 is a 24V switching power supply, the DC adjustable power supply 1032 is a 125V DC power supply, and the acquisition control device 104 includes a main control board, a switch output board 1042, a switch input board 1044, and an analog input board 1043. In addition, the switch input board 1044 includes an optical coupler array, which includes multiple optical couplers, and the positive input terminal of each optical coupler is connected to the first terminal of the corresponding relay switch, the second terminal of the corresponding relay switch is connected to the positive terminal of the switching power supply, the negative input terminal and negative output terminal of each optical coupler are grounded, and the positive output terminal of each optical coupler is connected to the corresponding input terminal of the main control board.

[0080] Specifically, the relay tester 1031 outputs a three-phase AC current with an amplitude of 1A, and the DC adjustable power supply 1032 outputs a DC voltage with an amplitude of 125V. The switch output board 1042 of the acquisition control device 104 connects the 125V DC voltage to pins X001:A22# and X001:A25# of the card under test 106 via channel switches CJ22 and CJ25, respectively. The AC current output by the relay tester 1031 is connected to pins X001:A1# / X001:A4#, X001:A2# / X001:A4#, and X001:A3# / X001:A4# of the card 106, respectively. The positive pole of the switching power supply is connected to the pins X001:C1# / X001:C2#, X001:C3# / X001:C4#, X001:C22#X001:C25#, X002:A12# / X002:A19#, X002:A21# / X002:A23#, X002:A29# / X002:A3 of the card 106. 0#, X002:C1# / X002:C3#, X002:C7# / X002:C12#, X002:C19# / X002:C21#, X002:23# / X002:29#, X002:30# / X002:31#, one end of the card 106 pins X001:C1# / X001:C2#, X001:C3 The other ends of # / X001:C4#, X001:C22#X001:C25#, X002:A12# / X002:A19#, X002:A21# / X002:A23#, X002:A29# / X002:A30#, X002:C1# / X002:C3#, X002:C7# / X002:C12#, X002:C19# / X002:C21#, X002:23# / X002:29#, X002:30# / X002:31# are respectively connected to the positive input ends of the optocouplers KI76, KI77, KI78, KI79, KI80, KI81, KI82, KI83, KI84, KI85, and KI86 of the switch input board 1044. KI76, KI77, KI78, KI79, KI80, KI81, KI82, KI83, KI84, KI85, and KI86 are connected in a common cathode configuration. Once the relay on card 106 is activated, the corresponding optocoupler output is activated, thereby collecting the corresponding response signal. Relay coil K1, electrolytic capacitors C5, C6, and C7 are connected to channels AD11, AD9, AD10, and AD12 of analog acquisition board 1043 of acquisition control device 104, respectively, via corresponding probes.

[0081] After the test experiment begins, the tester configures a sequential test process on the backend host. Test data is displayed in real time on the human-computer interface. Specifically, switch values are displayed via color-coded signal lights—for example, green for closed and red for open. Analog data undergoes waveform processing and is displayed as a real-time waveform. The interface also displays various prompts regarding the component testing process, such as cabinet usage, test progress information, the test status of the component under test, and any fault alarms. If an alarm occurs during the test, the tester can remotely terminate the test, ensuring the safety of the entire system. This enables fully automated, unattended testing, with user-friendly display and reminders of test results, enabling component aging analysis.

[0082] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be encompassed within the scope of the claims.

Claims

1. A method for analyzing the aging status of a card, characterized in that: include: Obtain the appearance inspection results of the test parts input by the tester; Acquire an infrared image of the card to be tested when it is working from the infrared thermal imaging device, and determine the infrared detection result of the card to be tested based on the infrared image; Determining an infrared detection result of the card to be tested based on the infrared image, including: identifying a specific component of the card to be tested from the infrared image, and determining heating information of the specific component, the heating information including a heating value, a heating area, and a heating duration; comparing the determined heating information of the specific component with the heating information of a standard card, and determining an infrared detection score value based on the comparison result; Inputting a corresponding excitation signal to the card under test through a test signal source, obtaining a corresponding response signal of the card under test from an acquisition control device, and determining a signal detection result of the card under test according to the response signal; determining the signal detection result of the card under test according to the response signal includes: comparing the obtained response signal with a corresponding response signal of a standard card, and determining a signal detection score value according to the comparison result; An aging status analysis is performed on the card component to be tested based on the appearance detection result, the infrared detection result and the signal detection result to obtain a comprehensive analysis result.

2. The card aging status analysis method according to claim 1, characterized in that: Also includes: Acquire environmental information of the cabinet from an environmental sensor disposed in the cabinet, and determine an environmental detection result of the card to be tested based on the environmental information; Furthermore, performing an aging status analysis on the card to be tested based on the appearance detection result, the infrared detection result, and the signal detection result includes: An aging status analysis is performed on the card component to be tested according to the appearance detection result, the infrared detection result, the signal detection result and the environment detection result.

3. The card aging status analysis method according to claim 1, characterized in that: Performing an aging status analysis on the card to be tested based on the appearance inspection result, the infrared inspection result, and the signal inspection result to obtain a comprehensive analysis result, including: According to a preset weight ratio among appearance detection, infrared detection and signal detection, the appearance detection result, the infrared detection result and the signal detection result are calculated to obtain a comprehensive analysis result.

4. The card aging state analysis method according to claim 2, characterized in that: The environmental information of the cabinet is obtained from the environmental sensors installed in the cabinet, including: The temperature and / or humidity information of the cabinet is obtained from a temperature sensor and / or a humidity sensor disposed in the cabinet.

5. A computer product comprising a processor, characterized in that: The processor implements the steps of the card component aging status analysis method according to any one of claims 1 to 4 when executing the computer program.

6. A storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for analyzing the aging status of a card component according to any one of claims 1 to 4 is implemented.

7. A card aging status analysis system, characterized in that: It includes a background host and a front-end machine, an infrared thermal imaging device, a test signal source, and an acquisition control device arranged in a cabinet. The infrared thermal imaging device, the test signal source, and the acquisition control device are respectively connected to the background host through the front-end machine, and the background host includes a processor. When executing a computer program, the processor implements the steps of the card aging status analysis method described in any one of claims 1 to 4.

8. The card aging status analysis system according to claim 7, characterized in that: Also includes: An environmental sensor is arranged in the cabinet, and the environmental sensor is connected to the background host through the front-end machine.

9. The card aging status analysis system according to claim 7, characterized in that: The backend host is further configured to generate a test case for the card to be tested, send the test case to the front-end processor, and analyze the received response signal to obtain a signal detection result; The front-end processor is used to parse the received test case into multiple control commands and send them to the test signal source and the acquisition control device; The test signal source is used to configure the output voltage according to the corresponding control command received to provide an excitation signal for the card to be tested; The acquisition control device is used to acquire response signals from the card to be tested according to the corresponding control command received, and send the response signals to the background host through the front-end machine.

10. The card aging status analysis system according to claim 9, characterized in that: The acquisition control device includes a main control board and a switch output board, a switch input board, and an analog input board respectively connected to the main control board. Moreover, the switch output board, the switch input board, and the analog input board are also connected to the corresponding pins of the card to be tested through corresponding ports, wherein: The main control board is used to receive corresponding control commands from the front-end machine and configure the on / off of corresponding channels in the switch output board and the switch input board according to the corresponding control commands; it is also used to collect switch response signals from the switch input board and analog response signals from the analog input board, and process the switch response signals and the analog response signals.

11. The card aging status analysis system according to claim 10, characterized in that: The switch input board includes an optocoupler array, and the positive input end of each optocoupler is connected to the first end of the corresponding relay switch, the second end of the corresponding relay switch is connected to the positive end of the power supply, the negative input end and the negative output end of each optocoupler are grounded respectively, and the positive output end of each optocoupler is connected to the corresponding input end of the main control board.

12. The card aging status analysis system according to claim 9, characterized in that: The test signal source includes: The relay protection tester is used to configure the corresponding AC voltage or current according to the corresponding control command received; The DC adjustable power supply is used to configure the corresponding DC voltage or current according to the corresponding control command received.

13. The card aging status analysis system according to claim 7, characterized in that: It also includes an adapter device arranged in the cabinet, and The adapting device is used to condition the excitation signal input to the card to be tested and / or the response signal output by the card to be tested.

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