Loudspeaker module and electronic device including the same

Abstract

An example speaker module includes: a speaker housing including a channel extending into an interior space; a speaker assembly positioned in a first region of the interior space adjacent to the channel; a vent spaced apart from the speaker assembly and passing through at least a portion of the speaker housing; a sound absorbing material disposed in a second region of the interior space and positioned adjacent to the speaker assembly to absorb sound generated from the speaker assembly; and a guide structure disposed around the vent and including at least one protrusion protruding toward the interior space.

Description

Technical Field

[0001] The present disclosure relates to a speaker module and an electronic device including the speaker module. Background Art

[0002] The electronic device can output the stored information as voice or image. As electronic devices become highly integrated and high-speed, large-capacity wireless communications become common, electronic devices such as mobile communication terminals are equipped with various functions. For example, the electronic device has integrated functions including entertainment functions (such as playing video games), multimedia functions (such as playing music / video), communication and security functions for mobile banking, and scheduling or electronic wallet functions.

[0003] Electronic devices have become lighter, thinner, and more compact while providing more functions to meet customer needs. Among the various functions of electronic devices, some are derived from audio modules. The audio module (e.g., a speaker and / or a microphone) can send / receive voice signals related to the electronic device, receive voice signals from the outside of the electronic device or send voice signals to the outside of the electronic device, or receive voice signals from a user or send voice signals to the user.

[0004] The speaker module may include a speaker assembly, a vent, and a sound absorbing material for adjusting compliance due to the space behind the speaker assembly and the vibration plate. The use of a particle-type sound absorbing material may cause vibrations due to the dynamic movement of particles around the vent of the speaker module, thereby causing noise. The noise may deteriorate the sound quality of the speaker.

[0005] For the purpose of canceling noise, the speaker module may employ an additional member (eg, sponge), but this may result in increased cost, require additional design efforts, or be limited in space design.

[0006] The above information is presented as background information only to assist in understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above may be applicable as prior art with respect to the present disclosure. Summary of the invention

[0007] According to an embodiment, the guide structure may be formed as a vent hole surrounding the speaker module. This may allow noise to be removed by the sound absorbing material, save costs, and simplify the design and manufacturing process.

[0008] According to various embodiments, a speaker module includes: a speaker housing including a channel extending into an interior space; a speaker assembly positioned in a first area of ​​the interior space adjacent to the channel; an air vent spaced apart from the speaker assembly and passing through at least a portion of the speaker housing; a sound absorbing material disposed in a second area of ​​the interior space and positioned adjacent to the speaker assembly to absorb sound generated from the speaker assembly; and a guide structure disposed around the air vent and including at least one protrusion protruding toward the interior space.

[0009] According to various embodiments, an electronic device includes: a housing including a front plate, a rear plate, and a side surface member, the side surface member surrounding a first space between the front plate and the rear plate and including a first channel extending to the outside; a display configured to output a screen via the front plate; a battery disposed between the display and the rear plate; a speaker module disposed in the first space and including a second channel connected to the first channel; and a printed circuit board disposed adjacent to the speaker module and electrically connected to the speaker module. The speaker module includes: a speaker housing forming a second space separated from the first space; a speaker assembly positioned adjacent to the second channel in a first region of the second space; a vent spaced from the speaker assembly and passing through at least a portion of the speaker housing to the first space of the housing; a sound absorbing material disposed in a second region of the second space and positioned adjacent to the speaker assembly to absorb sound generated from the speaker assembly; and a guide structure disposed at least partially surrounding the vent and including at least one protrusion protruding toward the second space.

[0010] Other aspects, advantages, and salient features of the present disclosure will become readily apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses exemplary embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] A more complete understanding of the present disclosure and its many attendant aspects will be readily obtained as the disclosure and its many attendant aspects become better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings, wherein:

[0012] Figure 1 is a block diagram illustrating an example electronic device in a network environment according to various embodiments;

[0013] Figure 2 is a front perspective view showing an example electronic device according to various embodiments;

[0014] Figure 3is a rear perspective view showing an example electronic device according to various embodiments;

[0015] Figure 4 is an exploded perspective view showing an example electronic device according to various embodiments;

[0016] Figure 5 is an exploded perspective view showing a mounting structure of a speaker module formed on one side of an example electronic device according to various embodiments;

[0017] Figure 6 is along Figure 5 A cross-sectional view taken along line AA';

[0018] Figure 7 is along Figure 5 A cross-sectional view taken along line BB';

[0019] Figure 8 is a perspective view showing a guide structure and a vent hole of an example speaker module according to various embodiments;

[0020] Fig. 9 is a cross-sectional view showing a guide structure and a vent hole of an example speaker module according to various embodiments;

[0021] Fig.10 is a cross-sectional view showing a guide structure and a vent hole of an example speaker module according to various embodiments;

[0022] Fig.11 is a cross-sectional view showing a guide structure and a vent hole of an example speaker module according to various embodiments;

[0023] Fig.12 is a perspective view showing various shapes of guide structures and vents of an example speaker module according to various embodiments; and

[0024] Fig.13 , Fig.14 and Fig.15 are perspective views illustrating various shapes of guide structures of example speaker modules according to various embodiments.

[0025] Throughout the drawings, like reference numerals will be understood to refer to like parts, components and structures. DETAILED DESCRIPTION

[0026] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0027] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In various embodiments, at least one of the above components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In various embodiments, some of the above components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0028] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 combined with the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or optionally, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0029] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0030] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0031] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0032] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0033] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0034] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of a force caused by a touch.

[0035] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly coupled to the electronic device 101.

[0036] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0037] The interface 177 may support one or more specific protocols to be used to directly (e.g., wired) or wirelessly combine the electronic device 101 with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0038] The connection terminal 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0040] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0041] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))) to communicate with an external electronic device. These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in the communication network using the user information stored in the user identification module 196.

[0044] The antenna module 197 may transmit a signal or power to the outside (e.g., an external electronic device) or receive a signal or power from the outside (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna having a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)) or including a conductor or a conductive pattern formed on a substrate. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190. Then, a signal or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., a radio frequency integrated circuit (RFIC)) other than the radiator may be further formed as a part of the antenna module 197.

[0045] At least some of the above components may be coupled to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and transmit signals (e.g., commands or data) therebetween.

[0046] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 combined with the second network 199. Each of the electronic devices 102 and 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute additional functions or additional services related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0047] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance, etc. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0048] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0049] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0050] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. For example, the term "non-transitory" storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0051] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0052] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0053] Figure 2 is a front perspective view illustrating an example electronic device 101 according to various embodiments. Figure 3 is a rear perspective view illustrating an example electronic device 101 according to various embodiments.

[0054] Reference Figure 2 and Figure 3 According to an embodiment, the electronic device 101 may include a housing 310 having a first (or front) surface 310A, a second (or rear) surface 310B, and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. According to an embodiment (not shown), the housing may represent a Figure 3 The structure of a portion of the first surface 310A, the second surface 310B and the side surface 310C. According to an embodiment, at least a portion of the first surface 310A may have a substantially transparent front plate 302 (e.g., a glass plate or a polymer plate). The second surface 310B may be formed using a substantially opaque rear plate 311. The rear plate 311 may be formed using, for example, laminated glass or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of them. The side surface 310C may be formed using a side frame structure (or "side member") 318 that is bonded to the front plate 302 and the rear plate 311 and includes metal and / or polymer. According to an embodiment, the rear plate 311 and the side frame structure 318 may be formed integrally together and may include the same material (e.g., a metal (such as aluminum)).

[0055] In the illustrated embodiment, the front plate 302 may include two first regions 310D extending seamlessly and curvedly from the first surface 310A toward the rear plate 311 on the two long edges of the front plate 302. Figure 3), the rear plate 311 may include a second area 310E extending seamlessly and curvedly from the second surface 310B toward the front plate on both long edges. According to an embodiment, the front plate 302 (or the rear plate 311) may include only one of the first area 310D (or the second area 310E). Optionally, the first area 310D or the second area 310E may be partially excluded. According to an embodiment, in a side view of the electronic device 101, the side frame structure 318 may have a first thickness (or width) for a side without the first area 310D or the second area 310E, and may have a second thickness less than the first thickness for a side with the first area 310D or the second area 310E.

[0056] According to an embodiment, the electronic device 101 may include one or more of a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, camera modules 305, 312, and 313, a key input device 317, a light emitting device 306, and a connector hole 308. According to an embodiment, the electronic device 101 may not include at least one of the components (e.g., the key input device 317 or the light emitting device 306) or other components may be added.

[0057] According to an embodiment, the display 301 may be visually exposed through, for example, a large portion of the front plate 302. According to an embodiment, at least a portion of the display 301 may be exposed through the front plate 302 formed on the first surface 310A (including the first area 310D). According to an embodiment, the edge of the display 301 may be formed to be substantially the same shape as the adjacent outer edge of the front plate 302. According to an embodiment (not shown), the interval between the outer edge of the display 301 and the outer edge of the front plate 302 may be kept substantially uniform to give the display 301 a larger exposed area.

[0058] According to an embodiment (not shown), the screen display area of ​​the display 301 may have a recess or an opening in a portion thereof, and one or more of the audio module 314, the sensor module 304, the camera module 305, and the light emitting device 306 may be aligned with the recess or the opening. According to an embodiment (not shown), one or more of the audio module 314, the sensor module 304, the camera module 305, the fingerprint sensor 316, and the light emitting device 306 may be included on the rear surface of the screen display area of ​​the display 301. According to an embodiment (not shown), the display 301 may be provided in combination with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus. According to an embodiment, at least a portion of the sensor modules 304 and 319 and / or at least a portion of the key input device 317 may be provided in the first area 310D and / or the second area 310E.

[0059] According to an embodiment, the audio modules 303, 307 and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314. The interior of the microphone hole 303 may have a microphone for obtaining external sound. According to an embodiment, there may be multiple microphones to be able to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a telephone receiver hole 314. According to an embodiment, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without the speaker holes 307 and 314. The audio modules 303, 307 and 314 are not limited to the above structure. According to the structure of the electronic device 101, various design changes may be made--for example, only some of the audio modules may be installed, or new audio modules may be added.

[0060] According to an embodiment, the sensor modules 304, 316, and 319 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor modules 304, 316, and 319 may include a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed on the second surface 310B of the housing 310 as well as on the first surface 310A (e.g., the display 301). The electronic device 101 may further include a sensor module not shown, for example, at least one of a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 304. The sensor modules 304, 316, and 319 are not limited to the above-described structure. Various design changes may be made according to the structure of the electronic device 101 - for example, only some of the sensor modules may be installed, or new sensor modules may be added.

[0061] According to an embodiment, the camera modules 305, 312 and 313 may include a first camera device 305 disposed on a first surface 310A of the electronic device 101 and a second camera device 312 and / or a flash 313 disposed on a second surface 310B. The camera modules 305 and 312 may include one or more lenses, an image sensor and / or an image signal processor. The flash 313 may include, for example, a light emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101. The camera modules 305, 312 and 313 are not limited to the above-mentioned structures. Various design changes may be made according to the structure of the electronic device 101-for example, only some of the camera modules may be installed, or new camera modules may be added.

[0062] According to an embodiment, the key input device 317 may be provided, for example, on the side surface 310C of the housing 310. According to an embodiment, the electronic device 101 may not include all or some of the above-mentioned key input devices 317, and the key input device 317 not included may be implemented in other forms (for example, as a soft key) on the display 301. According to an embodiment, the key input device may include a sensor module 316 provided on the second surface 310B of the housing 310.

[0063] According to an embodiment, the light emitting device 306 may be disposed, for example, on the first surface 310A of the housing 310. The light emitting device 306 may provide, for example, information about the state of the electronic device 101 in the form of light. According to an embodiment, the light emitting device 306 may provide a light source that interacts with, for example, the camera module 305. The light emitting device 306 may include, for example, a light emitting device (LED), an infrared (IR) LED, or a xenon lamp.

[0064] According to an embodiment, the connector hole 308 may include a first connector hole 308 and / or a second connector hole (e.g., an earphone jack) (not shown), the first connector hole 308 being used to accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting power and / or data to an external electronic device or receiving power and / or data from an external electronic device, and the second connector hole (e.g., an earphone jack) being used to accommodate a connector for transmitting audio signals to an external electronic device or receiving audio signals from an external electronic device. The connector hole 308 is not limited to the above structure. Various design changes may be made depending on the structure of the electronic device 101 - for example, only some of the connector holes may be installed, or new connector holes may be added.

[0065] Figure 4 is an exploded perspective view illustrating an example electronic device 101 according to various embodiments.

[0066] Reference Figure 4According to an embodiment, the electronic device 101 (eg, Figure 1 , Figure 2 and Figure 3 The electronic device 101 may include a housing 310, a display 330, a printed circuit board 340, a battery 350, an antenna 370, and an audio module 390. According to an embodiment, the housing 310 may include a front panel 320, a side surface member (e.g., a side frame structure 331 or a first support member 332), and a rear panel 380. As another example, the electronic device 101 may include a second support member 360 (e.g., a rear shell). According to an embodiment, the electronic device 101 may not include at least one of the components (e.g., the first support member 332 or the second support member 360), or other components may be added. At least one of the components of the electronic device 101 may be different from the components of the electronic device 101. Figure 2 or Figure 3 At least one of the components of the electronic device 101 is the same or similar, and a repeated description is not provided below.

[0067] According to an embodiment, the electronic device 101 may include a rod-shaped mobile device, a foldable mobile device, or a slidable mobile device. For example, the electronic device 101 may include a plurality of housings that can rotate with each other or a plurality of housings that can slide relative to each other. As another example, the electronic device 101 may include a display 330 (e.g., a flexible display) that is bendable or curlable with a predetermined curvature. The housing 310 of the electronic device 101 can bend, curl, or unfold the electronic device without damaging the flexible display due to deformation. According to an embodiment, the first support member 332 may be disposed inside the electronic device 101 to be connected to the side frame structure 331 or integrated with the side frame structure 331. The first support member 332 may be formed using, for example, a metal material and / or a non-metal material (e.g., a polymer), or include, for example, a metal material and / or a non-metal material (e.g., a polymer). The display 330 may be bonded to one surface of the first support member 332, and the printed circuit board 340 may be bonded to the opposite surface of the first support member 332. The processor, memory, and / or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor.

[0068] Depending on the embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0069] According to an embodiment, the interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect, for example, the electronic device 101 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0070] According to an embodiment, the battery 350 may be a device for supplying power to at least one component of the electronic device 101. The battery 350 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the printed circuit board 340. The battery 350 may be integrally or detachably disposed inside the electronic device 101.

[0071] According to an embodiment, the antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may communicate with, for example, an external device over a short distance, or may wirelessly send or receive power required for charging. According to an embodiment, the antenna structure may be formed by a portion of the side frame structure 331 and / or the first support member 332 or a combination of the side frame structure 331 and / or the first support member 332.

[0072] According to an embodiment of the present disclosure, the audio module 390 may convert, for example, a sound signal into an electrical signal, and vice versa. According to an embodiment, as the audio module 390, a microphone for obtaining external sound may be installed inside the electronic device 101, or a speaker for outputting sound to the outside may be installed inside the electronic device 101. The microphone may be connected to the electronic device 101 through a microphone hole (e.g., Figure 2 The microphone hole 303) can obtain sound, and the speaker can be obtained through the speaker hole (for example, Figure 2 The speaker hole 307 or 314) outputs sound.

[0073] Figure 5 is an exploded perspective view illustrating a mounting structure of a speaker module formed on one side of an example electronic device according to various embodiments. Figure 6 is along Figure 5 A cross-sectional view taken along line AA'. Figure 7 is along Figure 5 A cross-sectional view taken along line BB'.

[0074] According to an embodiment, an electronic device (e.g., Figure 1 , Figure 2 , Figure 3 and Figure 4The electronic device 101 may include a speaker module 400 (eg, Figure 4 The speaker module 400 may be in the shape of a separate carrier including the speaker assembly 410. As another example, the speaker module 400 may be prepared in a structure that shields backward sounds from the speaker assembly (e.g., a board and / or a bracket) and the carrier included in the housing of the electronic device 101.

[0075] According to an embodiment, the speaker module 400 may include: a speaker housing 420, including a channel 424 extending to the interior space S; a speaker assembly 410, positioned in a first area S1 of the interior space S adjacent to the channel 424; a vent 430, spaced apart from the speaker assembly and passing through at least a portion of the speaker housing 420; a sound absorbing material 440, disposed in a second area S2 of the interior space S and positioned adjacent to the speaker assembly 410 to absorb sound generated from the speaker assembly 410; and a guide structure 450, disposed to surround the vent 430 and including at least one protrusion 450a toward the interior space S.

[0076] In the three-axis rectangular coordinate system, "Z" may refer to, for example, the thickness direction of the speaker module 400, "Y" may refer to, for example, the length direction of the speaker module 400, and "X" may refer to, for example, the width direction of the speaker module 400. According to an embodiment, "Z" may refer to, for example, the first direction (+Z axis direction, hereinafter "+Z") or the second direction (-Z axis direction, hereinafter "-Z"), "Y" may refer to, for example, the third direction (+Y axis direction or -Y axis direction, hereinafter "+Y" or "-Y"), and "X" may refer to, for example, the fourth direction (+X axis direction or -X axis direction, hereinafter "+X" or "-X").

[0077] According to an embodiment, the speaker housing 420 may include a front plate 421 facing a first direction +Z, a rear plate 422 facing a second direction -Z opposite to the first direction +Z, and a side surface plate 423 surrounding an inner space S between the front plate 421 and the rear plate 422 and having a channel 424 extending to the outside. As an example, the speaker housing 420 may include: an upper structure 510 including at least one surface facing the first direction +Z; and a lower structure 520 including at least one surface facing the second direction -Z opposite to the first direction +Z and formed to be combined with the upper structure 510.

[0078] According to an embodiment, the upper structure 510 may include a front surface 511 facing the first direction +Z and a first side surface 513 extending from the front surface 511 along the second direction -Z and facing the third direction +Y or -Y or the fourth direction +X or -X. The front surface 511 may include an opening 511a that passes through at least a portion of the front surface 511 and is formed to expose at least a portion of the front surface of the speaker assembly 410. As an example, in order to be combined with the lower structure 520, the upper structure 510 may provide an area for forming a combination hole (e.g., a screw hole) or an area formed along the inner side of the upper structure 510 to place a sealing member and / or an adhesive member. The sealing member and / or adhesive member provided in the upper structure 510 and / or the lower structure 520 may cut off a path for sound waves to leak from the internal space S to a portion other than a specified section, or prevent the inflow of foreign matter including a fluid. The sealing member and / or adhesive member may be formed using a sealing material or an adhesive material, for example, by a gasket and / or an adhesive tape.

[0079] According to an embodiment, the lower structure 520 may include a rear surface 521 facing the second direction -Z and a second side surface 523 extending from the rear surface 521 along the first direction +Z and facing the third direction +Y or -Y or the fourth direction +X or -X. The thickness of the second side surface 523 may be greater than the thickness of the first side surface 513. The lower structure 520 may have a vent 430 for providing an area in which most of the speaker assembly 410 is arranged, and the vent 430 passes through at least a portion of the rear surface 521. The vent 430 may be a structure for air circulation. One or more vents 430 may be formed to release the atmospheric pressure difference between the inside and the outside of the speaker module 400.

[0080] According to an embodiment, the channel 424 extending to the outside of the speaker module 400 may be provided in the region of the first side surface 513 and / or the second side surface 523. For example, the channel 424 may be connected to the outside of the speaker module 400 via a bond between the first side surface 513 and the second side surface 523. As an example, the channel 424 may be connected to a through hole formed to the outside of the electronic device 101 through a plate and / or a bracket included in the housing of the electronic device. The channel 424 of the speaker module 400 may be connected to the through hole of the housing of the electronic device 101, thereby providing air ventilation to the outside of the electronic device 101 and sound propagation from the speaker assembly 410 to the outside.

[0081] According to an embodiment, the inner space S of the speaker housing 420 may include a first area S1 where the speaker assembly 410 is disposed and a second area S2 formed to at least partially surround the speaker assembly 410 and provide a resonance space. The first area S1 may be formed to correspond to the shape of the speaker assembly 410 and connected to an area of ​​the first side surface 513 and / or the second side surface 523 where the channel 424 is formed. The elastic member 460 may be provided in the first area S1 to stably support the rear surface of the speaker assembly 410. The sound absorbing material 440 for absorbing sound from the speaker assembly 410, the vent 430 for releasing the atmospheric pressure difference, and the guide structure 450 provided adjacent to the vent 430 may be positioned in the second area S2.

[0082] According to an embodiment, the speaker assembly 410 may be substantially formed in a hexahedral shape and may be arranged so that a vibration plate formed in the front is exposed through an opening 511a of the upper structure 510. The speaker assembly 410 may include at least one side surface facing the third direction +Y or -Y or the fourth direction +X or -X. The side surface may be arranged adjacent to an edge of the speaker housing 420 and a housing of the electronic device 101, and a channel 424 may be formed along the direction faced by the side surface to guide sound propagation.

[0083] According to an embodiment, the sound absorbing material 440 may be formed with a plurality of particles and disposed in the second area S2 to cancel low-frequency sound generated from one surface of the speaker assembly 410 by destructive interference. The sound absorbing material 440 may be formed using a large number of spherical particles having a specified diameter. The sound absorbing material 440 may be formed using various sound absorbing materials such as sponge, cashmere, glass fiber, or wool.

[0084] According to an embodiment, the guide structure 450 may be disposed on the inner side surface of the lower structure 520 and around the vent 430. The guide structure 450 may include at least one protrusion 450a toward the internal space S. The at least one protrusion 450a may be formed to maintain air ventilation of the vent 430 without directly contacting the vent 430. For example, the guide structure 450 including one protrusion 450a may be formed in a closed loop shape formed along the vent 430, and an air circulation path having a specified thickness and having a front opening and / or a side opening extending into the second area S2 of the internal space S together with the vent 430 may be provided. As an example, in the guide structure 450 having a plurality of protrusions 450a, the plurality of protrusions 450a may be disposed separately from each other around the vent 430, so that the openings of the front surface and / or the side surface facing the vent 430 extend into the second area S2 of the internal space S together with the vent 430 to provide the air circulation path. The detailed structures of the vent hole 430 and the guide structure 450 will be described below with reference to the accompanying drawings.

[0085] Figure 8 is a perspective view illustrating a guide structure and a vent hole of an example speaker module according to various embodiments. Fig. 9 is a cross-sectional view illustrating a guide structure and a vent hole of an example speaker module according to various embodiments.

[0086] Figure 8 yes Figure 5 An enlarged stereogram of area C.

[0087] According to an embodiment, a speaker module (e.g., Figure 5 The speaker module 400 may include: a speaker housing 420; a speaker assembly (eg, Figure 5 A speaker assembly 410) is positioned in the internal space S of the speaker housing 420; a vent 430 formed to pass through at least a portion of the speaker housing 420; a sound absorbing material 440 for absorbing sound generated from the speaker assembly 410; and a guide structure 450, which at least partially protrudes toward the internal space S and is arranged to surround the vent 430.

[0088] Figure 8 and Fig. 9 The speaker housing 420, speaker assembly 410, vent hole 430, sound absorbing material 440 and guide structure 450 of the speaker module 400 shown in FIG. 4 can be similar in structure to the speaker housing 420, speaker assembly 410, vent hole 430, sound absorbing material 440 and guide structure 450 of FIG. Figure 5 , Figure 6 and Figure 7 The speaker housing 420, the speaker assembly 410, the vent hole 430, the sound absorbing material 440 and the guide structure 450 of the speaker module 400 shown in FIG. 4 are identical or partially identical.

[0089] exist Figure 8 and Fig. 9 In the 2-axis rectangular coordinate system, "Z" may refer to, for example, the thickness direction of the speaker module 400, and "Y" may refer to, for example, the length direction of the speaker module 400. According to an embodiment, "Z" may refer to, for example, a first direction (+Z axis direction, hereinafter "+Z") or a second direction (-Z axis direction, hereinafter "-Z"), and "Y" may refer to, for example, a third direction (+Y axis direction or -Y axis direction, hereinafter "+Y" or "-Y").

[0090] According to an embodiment, the vent hole 430 may be formed through a lower structure (eg, Figure 5 For example, the vent hole 430 may be disposed in a first area (eg, Figure 5 The speaker housing 420 may be formed in a second region separated from the first region S1 and may be formed to pass through a rear plate (eg, Figure 5at least a portion of the rear plate 422).

[0091] According to an embodiment, the vent hole 430 may include a central axis O, and when viewed from above the rear plate 422, the vent hole 430 may appear circular. The diameter of the vent hole 430 may gradually increase along the second direction -Z. For example, the vent hole 430 may be formed in the shape of a portion of a cone. However, the shape of the vent hole 430 is not limited thereto. For example, the vent hole 430 may be formed in a cylindrical shape or a shape in which its diameter gradually decreases along the second direction.

[0092] According to an embodiment, sound absorbing material 440 particles may be provided in the second region S2 of the speaker housing 420. The diameter of the sound absorbing material 440 particles may be greater than the diameter of the vent hole 430, thereby preventing the sound absorbing material 440 particles from entering the vent hole 430.

[0093] Generally, due to the operation of the speaker assembly 410, the sound absorbing material 440 may move around the vent 430. When moving, the sound absorbing material 440 may collide with its adjacent area, thereby causing noise. The movement of the sound absorbing material 440 may partially block the vent 430, thereby interfering with air circulation. According to an embodiment, the guide structure 450 formed around the vent 430 may prevent the sound absorbing material 440 from colliding near the vent 430. Therefore, noise can be suppressed. The guide structure 450 formed around the vent 430 may allow air to circulate stably to the inside of the vent 430.

[0094] According to an embodiment, the guide structure 450 may include a plurality of protrusions arranged around the vent hole 430. For example, the plurality of protrusions may include a first protrusion 610 and a second protrusion 620 spaced apart from each other. According to an embodiment, the plurality of protrusions may include a first protrusion 610, a second protrusion 620, and a third protrusion 630 spaced apart from each other. According to an embodiment, the plurality of protrusions may include a first protrusion 610, a second protrusion 620, a third protrusion 630, and a fourth protrusion 640 spaced apart from each other. According to an embodiment, the plurality of protrusions may be formed in the same shape or in different shapes. However, the number of protrusions is not limited thereto, and one or five or more protrusions may be provided.

[0095] According to an embodiment, the first protrusion 610 and the second protrusion 620 arranged around the vent hole 430 may be formed on one surface of the rear plate 422 facing the first direction +Z, protrude to the inner space S, and be spaced apart from each other.

[0096] According to an embodiment, the first protrusion 610 may include a front surface 615 facing the first direction +Z and a plurality of side surfaces facing the internal space S. For example, at least some of the plurality of side surfaces may have different sizes and different shapes. At least a portion of the first-first side surface 611 of the first protrusion 610 may be formed in a direction toward the central axis O of the vent 430. One end of the first-first side surface 611 may extend to the first-second side surface 612, the other end may extend to the first-third side surface 613 and the first-first side surface 611 may be curved. A specified angle may be formed between the first-third side surface 613 and the first-second side surface 612 around the central axis O of the vent 430. For example, the specified angle may be an acute angle. As an example, when viewed from above the rear plate 422, the first protrusion 610 may be formed in a triangular or fan-shaped shape.

[0097] According to an embodiment, the second protrusion 620 spaced apart from the first protrusion 610 may include a front surface 625 facing the first direction +Z and a plurality of side surfaces facing the internal space S. At least a portion of the second-first side surface 621 of the second protrusion 620 may be formed in a direction toward the central axis O of the vent 430. One end of the second-first side surface 621 may extend to the second-second side surface 622, the other end may extend to the second-third side surface 623 and the second-first side surface 621 may be curved. A specified angle may be formed between the second-third side surface 623 and the second-second side surface 622 around the central axis O of the vent 430. For example, the specified angle may be an acute angle. As an example, when viewed from above the rear plate 422, the second protrusion 620 may be formed in a triangular or fan-shaped shape.

[0098] According to an embodiment, the first-first side surface 611 and the second-first side surface 621 may be spaced apart from each other around the central axis O of the vent hole 430. A minimum distance (e.g., a first specified distance (e.g., Fig.10 The first designated distance D1)) may be smaller than the diameter of the vent hole 430.

[0099] According to an embodiment, the third protrusion 630 and the fourth protrusion 640 may be disposed between the first protrusion 610 and the second protrusion 620. For example, the third protrusion 630 may be disposed in an area adjacent to the first-second side surface 612 of the first protrusion 610, and the fourth protrusion 640 may be disposed in an area adjacent to the first-third side surface 613 of the first protrusion 610. At least a portion of the side surface (e.g., the first-second side surface 612) of the first protrusion 610 and at least a portion of the side surface 633 of the third protrusion 630 may face each other, and the minimum distance between the two side surfaces 612 and 633 may be less than the diameter of the sound absorbing material. The description of the structure of the first protrusion 610 may be applied to the third protrusion 630 and the fourth protrusion 640. The description of the arrangement between the first protrusion 610 and the second protrusion 620 may be applied to the arrangement between the third protrusion 630 and the fourth protrusion 640.

[0100] Fig.10 is a cross-sectional view illustrating a guide structure and a vent hole of an example speaker module according to various embodiments.

[0101] Fig.10 The speaker module shown in Figure 5 The speaker housing 420, the vent hole 430, the sound absorbing material 440 and the guide structure 450 of the speaker module 400 can be constructed in the same manner as Figure 8 and Fig. 9 The speaker housing 420, the vent hole 430, the sound absorbing material 440 and the guide structure 450 of the speaker module 400 shown in FIG. 4 are completely or partially the same.

[0102] exist Fig.10 In the 2-axis rectangular coordinate system, "Z" may refer to, for example, the thickness direction of the speaker module 400, and "Y" may refer to, for example, the length direction of the speaker module 400. According to an embodiment, "Z" may refer to, for example, a first direction (+Z axis direction, hereinafter "+Z") or a second direction (-Z axis direction, hereinafter "-Z"), and "Y" may refer to, for example, a third direction (+Y axis direction or -Y axis direction, hereinafter "+Y" or "-Y").

[0103] According to an embodiment, the vent hole 430 may be formed as a portion of the lower structure 520 that passes through the speaker housing 420. For example, the vent hole 430 may be provided at a portion where a speaker assembly (eg, Figure 5 The speaker assembly 410 of the speaker housing 420 is in a second area separated from the first area, and can be formed to pass through a rear plate (eg, Figure 5 at least a portion of the rear plate 422).

[0104] According to an embodiment, particles of the sound absorbing material 440 may be provided in the second region S2 of the speaker housing 420 .

[0105] According to an embodiment, the guide structure 450 may include a plurality of protrusions arranged around the vent hole 430. For example, the plurality of protrusions may include a first protrusion 610 and a second protrusion 620 spaced apart from each other around the central axis O of the vent hole 430. The spacing may be connected to the vent hole 430, thereby providing a path for air circulation.

[0106] According to an embodiment, the first-first side surface 611 of the first protrusion 610 and the second-first side surface 621 of the second protrusion 620 may be disposed to face each other, and the central axis O of the vent hole 430 is disposed between the first-first side surface 611 of the first protrusion 610 and the second-first side surface 621 of the second protrusion 620. The first-first side surface 611 and the second-first side surface 621 may be spaced apart from each other by at least a first specified distance D1. The first specified distance D1 may be smaller than the minimum diameter of the vent hole 430. As an example, the first specified distance D1 may be designed to be smaller than the diameter of the particles of the sound absorbing material 440 to prevent the sound absorbing material 440 from directly contacting or colliding with the vent hole 430.

[0107] According to an embodiment, the length (e.g., height) of the first protrusion 610 in the first direction +Z and / or the length (e.g., height) of the second protrusion 620 in the first direction +Z may be a second specified distance D2. The second specified distance D2 may be designed to be longer than half the diameter of the sound absorbing material 440 particles.

[0108] Although the spacing and height of the first protrusion 610 and the second protrusion 620 have been limited in the above embodiment, the embodiments of the present disclosure are not limited thereto, and various designs or shape changes may be made thereto to prevent collision between the sound absorbing material 440 and the vent hole 430 while achieving efficient air circulation.

[0109] Fig.11 is a cross-sectional view illustrating a guide structure and a vent hole of an example speaker module according to various embodiments.

[0110] Fig.11 The speaker module shown in Figure 5 The speaker housing 420, the vent hole 430, the sound absorbing material 440 and the guide structure 450 of the speaker module 400 can be constructed in the same manner as Figure 8 and Fig. 9 The speaker housing 420, the vent hole 430, the sound absorbing material 440 and the guide structure 450 of the speaker module 400 shown in FIG. 4 are completely or partially the same.

[0111] exist Fig.11In the 2-axis rectangular coordinate system, "Z" may refer to, for example, the thickness direction of the speaker module 400, and "Y" may refer to, for example, the length direction of the speaker module 400. According to an embodiment, "Z" may refer to, for example, a first direction (+Z axis direction, hereinafter "+Z") or a second direction (-Z axis direction, hereinafter "-Z"), and "Y" may refer to, for example, a third direction (+Y axis direction or -Y axis direction, hereinafter "+Y" or "-Y").

[0112] According to an embodiment, the vent hole 430 may be formed to penetrate a portion of the lower structure 520 of the speaker housing 420. According to an embodiment, particles of the sound absorbing material 440 may be provided in the second region S2 of the speaker housing 420.

[0113] According to an embodiment, the guide structure 450 may include at least one protrusion 450 a disposed around the vent hole 430 and a blocking member 450 b disposed on a front surface of the at least one protrusion 450 a facing the first direction +Z.

[0114] According to an embodiment, at least one protrusion 450a may be designed to surround the vent 430 and have a height not less than a predetermined thickness, thereby preventing the sound absorbing material 440 from directly contacting or colliding with the vent 430. The blocking member 450b may include a plurality of through holes H and the blocking member 450b may be formed in a shape corresponding to the shape of the front surface of the protrusion 450a. The plurality of through holes H may be designed so that a plurality of channels facing a direction perpendicular or parallel to the rear plate 422 are spatially connected to the vent 430, thereby providing efficient air circulation. Each of the plurality of through holes H may be designed to be smaller than the diameter of the particles of the sound absorbing material 440, thereby preventing the sound absorbing material 440 from blocking the air circulation path of the vent 430.

[0115] According to an embodiment, the blocking member 450b may be formed using an elastic member (e.g., at least one of sponge, rubber, polymer (polycarbonate (PC) or polyethylene terephthalate (PET)), silicone, foam rubber, or a membrane) to minimize noise generated when the sound absorbing material 440 collides with an area of ​​the blocking member 450b.

[0116] Fig.12 are perspective views illustrating various shapes of guide structures and vents of an example speaker module according to various embodiments.

[0117] According to an embodiment, a speaker module (e.g. Figure 5 The speaker module 400 may include: a speaker housing 420; a vent hole 430 formed to pass through at least a portion of the speaker housing 420; and a guide structure 450, which is arranged to surround the vent hole 430 and at least partially protrude into the internal space S of the speaker housing 420.

[0118] Fig.12 The speaker module 400 may include a speaker housing 420, a vent hole 430, and a guide structure 450, and each structure may be Figure 8 and Fig. 9 The speaker housing 420, the vent hole 430, and the guide structure 450 of the speaker module 400 are completely or partially identical in configuration. The following description mainly focuses on the differences.

[0119] Reference Fig.12 In order to improve the installation efficiency of the electronic device 101 and the freedom of the internal design of the speaker module 400, the vent hole 430 may be arranged adjacent to the edge of the speaker housing 420. Fig. 9 Unlike the structure of the speaker housing 420, the vent hole 430 formed through the edge portion of the rear plate 422 and the guide structure 450 provided therearound may be partially deformed in structure due to the side surface plate 423 of the speaker housing 420. For example, some protrusions of the guide structure 450 may be formed as if a portion of them is cut away by the side surface plate 423.

[0120] According to an embodiment, the guide structure 450 may include a plurality of protrusions arranged around the vent hole 430. For example, the guide structure 450 may include a first protrusion 610, a second protrusion 620, a third protrusion 630, and a fourth protrusion 640 spaced apart from each other.

[0121] According to an embodiment, respective side surface portions of the first protrusion 610 and the second protrusion 620 may be disposed to face each other, and respective side surface portions of the third protrusion 630 and the fourth protrusion 640 may be disposed to face each other.

[0122] According to an embodiment, Fig.12 The first protrusion 610 may be Figure 8 The second protrusion 620 may be formed in the same or similar shape as the first protrusion 610. The second protrusion 620 may include a front surface 625 facing the first direction +Z and a plurality of side surfaces facing the inner space S. For example, at least one of the plurality of side surfaces (e.g., the second-third side surfaces 623) may be formed in a shape that contacts the side surface plate 423 (e.g., the inner side surface). According to an embodiment, the second protrusion 620 may be formed using a rib protruding from the side surface plate 423 along the third direction -Y.

[0123] According to an embodiment, the second protrusion 620 may be formed to contact the bottom surface of the rear plate 422 of the speaker housing 420 facing the first direction +Z and the inner side surface of the side surface plate 423 of the speaker housing 420 facing the third direction -Y perpendicular to the first direction +Z.

[0124] According to an embodiment, the second protrusion 620 may extend from an area adjacent to the vent hole 430 (adjacent to the side surface plate 423). For example, compared to the first protrusion 610, the second protrusion 620 may be formed as if the shape of the area adjacent to the side surface plate 423 is cut away by the side surface plate 423.

[0125] According to an embodiment, the shape of the second protrusion 620 may be applied to the shape of the fourth protrusion 640 adjacent to the side surface plate 423. For example, the fourth protrusion 640 may include a front surface 645 facing the first direction +Z and a plurality of side surfaces facing the inner space S. At least one of the plurality of side surfaces may be formed in a shape in contact with the side surface plate 423. According to an embodiment, the fourth protrusion 640 may be formed using a rib protruding from the side surface plate 423 in the third direction -Y.

[0126] Fig.13 , Fig.14 and Fig.15 are perspective views illustrating various shapes of guide structures of example speaker modules according to various embodiments.

[0127] According to an embodiment, a speaker module (e.g., Figure 5 The speaker module 400 may include: a speaker housing 420; a vent hole 430 formed to pass through at least a portion of the speaker housing 420; and a guide structure 450, which is arranged to surround the vent hole 430 and at least partially protrude into the internal space S of the speaker housing 420.

[0128] Fig.13 , Fig.14 and Fig.15 The speaker module 400 may include a speaker housing 420, a speaker assembly 410, a vent hole 430, and a guide structure 450, and each structure may be Figure 8 and Fig. 9 The speaker housing 420, the speaker assembly 410, the vent hole 430 and the guide structure 450 of the speaker module 400 are identical or partially identical. The following description mainly focuses on Figure 8 The differences in the guidance structure.

[0129] According to an embodiment, the guide structure 450 may include a plurality of protrusions arranged around the vent hole 430. For example, the guide structure 450 may include a first protrusion 610, a second protrusion 620, a third protrusion 630, and a fourth protrusion 640 spaced apart from each other.

[0130] Reference Fig.13 , the first protrusion 610 and the second protrusion 620 arranged around the vent hole 430 may be formed on one surface of the rear plate 422 facing the first direction +Z, protrude into the inner space S, and be spaced apart from each other.

[0131] According to an embodiment, the first protrusion 610 may include a front surface 615 facing the first direction +Z and a plurality of side surfaces facing the internal space S. For example, at least some of the plurality of side surfaces may have different sizes and different shapes. At least a portion of the first-first side surface 611 of the first protrusion 610 may be formed in a direction toward the central axis O of the vent 430. One end of the first-first side surface 611 may extend to the first-second side surface 612, and the other end may extend to the first-third side surface 613. The front surface 615 of the first protrusion 610 may narrow as it moves away from the central axis O of the vent 430. As an example, when viewed from above the rear plate 422, Fig.13 The first protrusion 610 has Fig. 9 The first protrusion 610 has a left-right inverted shape.

[0132] According to an embodiment, the second protrusion 620 may be disposed to face the first protrusion 610 with the central axis O of the vent hole 430 disposed between the second protrusion 620 and the first protrusion 610, and the third protrusion 630 and the fourth protrusion 640 may be disposed to face each other with the central axis O of the vent hole 430 disposed between the third protrusion 630 and the fourth protrusion 640. The shape of the first protrusion 610 may be applied to Fig.13 The shapes of the second protrusion 620, the third protrusion 630 and the fourth protrusion 640 are shown in FIG.

[0133] Reference Fig.14 , the first protrusion 610 and the second protrusion 620 arranged around the vent hole 430 may be formed on one surface of the rear plate 422 facing the first direction +Z, protrude into the inner space S, and be spaced apart from each other.

[0134] According to an embodiment, the first protrusion 610 and the second protrusion 620 may be structurally identical to each other. Fig.13 The first protrusion 610 and the second protrusion 620 are completely identical or partially identical. The third protrusion 630 and the fourth protrusion 640 may be formed in shapes corresponding to each other. The third protrusion 630 is described below, and the description may be applied to the fourth protrusion 640.

[0135] According to an embodiment, the third protrusion 630 may be disposed between the first protrusion 610 and the second protrusion 620 and spaced apart from the first protrusion 610 and the second protrusion 620, respectively, and may include a first surface 635 facing the first direction +Z and a plurality of side surfaces facing the inner space S. The third-first side surface 631 of the third protrusion 630 may be formed to at least partially face the central axis O of the vent hole 430, and may be formed as a curved surface corresponding to the shape of the vent hole 430. As an example, other side surfaces 632, 633, and 634 except the third-first side surface of the third protrusion 630 may be formed in directions perpendicular to each other.

[0136] According to an embodiment, the third protrusion 630 may be formed substantially in a rectangular parallelepiped shape, and when viewed from above the rear plate 422 , the third protrusion 630 may appear rectangular.

[0137] Reference Fig.15 The first protrusion 610, the second protrusion 620 and the fourth protrusion 640 arranged around the vent hole 430 can be structurally similar to Fig.14 The first protrusion 610 , the second protrusion 620 and the fourth protrusion 640 are completely identical or partially identical.

[0138] According to an embodiment, the third protrusion 630 may be disposed between the first protrusion 610 and the second protrusion 620 and spaced apart from the first protrusion 610 and the second protrusion 620, respectively, and the third protrusion 630 may face the fourth protrusion 640 and may be formed in various shapes. The third protrusion 630 may include a side surface facing the vent hole 430 and other side surfaces that are partially curved or flat.

[0139] According to various embodiments, various shapes of protrusions included in the guide structure 450 are shown. However, the embodiments of the present disclosure are not limited thereto. For example, more protrusions may be formed or various shape changes may be made according to the internal space S of the speaker module 400.

[0140] According to an embodiment, a speaker module (eg, Figure 5 400) includes: a speaker housing (eg, Figure 5 420), including extending into the interior space (e.g., Figure 5 of S) channels (e.g., Figure 5 424); a speaker assembly 410, positioned in a first region S1 of the interior space adjacent to the channel; a vent (eg, Figure 5 430), spaced apart from the speaker assembly and passing through at least a portion of the speaker housing; a sound absorbing material (e.g., Figure 5 440), set in the second area of ​​the interior space ( Figure 5 S2) and positioned adjacent to the speaker assembly to absorb sound generated from the speaker assembly; and a guide structure (e.g., Figure 5 450), which is arranged to surround the vent hole and includes at least one protrusion (e.g., Figure 5 450a).

[0141] According to an embodiment, the sound absorbing material may be formed with a plurality of particles, and the sound absorbing material may be prevented from contacting the vent hole by a guide structure formed around the vent hole.

[0142] According to an embodiment, the vent hole may be formed in a second region of the inner space separated from the first region.

[0143] According to an embodiment, the guide structure may include first protrusions (eg, Figure 8 610) and a second protrusion (eg, Figure 8 620). A central axis (eg, Figure 8 The distance O) can be smaller than the diameter of the sound absorbing material.

[0144] According to an embodiment, the guide structure may include first protrusions (eg, Figure 8 610) and a second protrusion (eg, Figure 8 630). The first side surface of the first protrusion (eg, Figure 8 The first-second side surface 612 of the second protrusion may face the second side surface of the second protrusion (eg, Figure 8 The minimum distance between the first side surface and the second side surface may be smaller than the diameter of the sound absorbing material.

[0145] According to an embodiment, the guide structure may include a first protrusion having a specified thickness. The thickness of the first protrusion may be greater than half of the diameter of the sound absorbing material.

[0146] According to an embodiment, the guide structure may further include a third protrusion disposed between the first protrusion and the second protrusion. The third protrusion may be formed in a shape different from that of the first protrusion and the second protrusion.

[0147] According to an embodiment, a guide structure (e.g., Fig.11 450) may also include a blocking member (e.g., Figure 8 450b), the blocking member is disposed on the front surface of at least one protrusion and includes a plurality of through holes (eg, Fig.11 H).

[0148] According to an embodiment, the plurality of through holes of the blocking member may be formed to face a direction perpendicular or parallel to the vent hole. At least some of the plurality of through holes may be connected together and provide an air ventilation path toward the vent hole.

[0149] According to an embodiment, the blocking member may include an elastic member.

[0150] According to an embodiment, the guide structure may further include a fourth protrusion disposed between the first protrusion and the second protrusion and facing at least one side surface of the third protrusion, and the vent hole is disposed between the fourth protrusion and the third protrusion.

[0151] According to an embodiment, the first protrusion, the second protrusion, the third protrusion, and the fourth protrusion of the guide structure may be formed in shapes corresponding to each other.

[0152] According to an embodiment, at least one of the first protrusion, the second protrusion, the third protrusion, and the fourth protrusion of the guide structure may be formed in a shape different from shapes of the other protrusions.

[0153] According to an embodiment, the first protrusion of the guide structure (eg, Fig.12 620) or a second protrusion (eg, Fig.12 640) may be arranged to face the first direction (eg, Fig.12 +Z) of the bottom surface (e.g., Fig.12 The inner side surface of the rear plate 422) and the second direction perpendicular to the first direction (eg, Fig.12 -Y) inner surface (e.g., Fig.12 The inner surface of the side surface plate 423 is in contact.

[0154] According to an embodiment, an electronic device includes: a housing (eg, Figure 2 or Figure 3 310), including a front plate (e.g., Figure 4 320), rear plate (for example, Figure 4 380) and side surface members (e.g., Figure 4 331 and 332), the side surface member surrounds the first space between the front plate and the rear plate and includes a first channel extending to the outside (for example, Figure 2 and Figure 3 307); display (for example, Figure 4 330), configured to output the picture via the front panel; a battery (e.g., Figure 4 350), disposed between the display and the back panel; a speaker module (eg, Figure 5 400), disposed in the first space and including a second channel connected to the first channel; and a printed circuit board (eg, Figure 4 340), which is arranged adjacent to the speaker module and electrically connected to the speaker module. The speaker module may include: a speaker housing (eg, Figure 5 420), forming a second space separated from the first space (for example, Figure 5 S); a speaker assembly positioned to be in contact with a first area of ​​a second space (e.g., Figure 5 S1) in the second channel (e.g., Figure 5 424) adjacent; vents (e.g., Figure 7 430), which is spaced apart from the speaker assembly and passes through at least a portion of the speaker housing to the first space; a sound absorbing material (e.g., Figure 5 440), set in the second area of ​​the second space (for example, Figure 5S2) and positioned adjacent to the speaker assembly to absorb sound generated from the speaker assembly; and a guide structure (e.g., Figure 5 450), which is arranged to at least partially surround the vent hole and includes at least one protrusion (e.g., Figure 5 450a).

[0155] According to an embodiment, the sound absorbing material may be formed with a plurality of particles, and the sound absorbing material may be prevented from contacting the vent hole by a guide structure formed around the vent hole.

[0156] According to an embodiment, the guide structure may be integrally formed with the speaker housing and include an opening formed in a front surface or a side surface and extending to the vent hole.

[0157] According to an embodiment, the guide structure may include a first protrusion and a second protrusion spaced apart from each other. A distance between the first protrusion and the second protrusion passing through a central axis of the vent hole may be smaller than a diameter of the sound absorbing material.

[0158] According to an embodiment, the guide structure may include a first protrusion and a second protrusion disposed apart from each other. The first side surface of the first protrusion may face the second side surface of the second protrusion. The minimum distance between the first side surface and the second side surface may be smaller than the diameter of the sound absorbing material.

[0159] According to an embodiment, the guide structure may further include a third protrusion and a fourth protrusion, the third protrusion being disposed between the first protrusion and the second protrusion, the fourth protrusion being spaced apart from the third protrusion, and the vent hole being disposed between the third protrusion and the fourth protrusion.

[0160] As can be readily understood from the foregoing description, according to various embodiments, a speaker module for an electronic device can ensure an effective installation space in the electronic device by making design changes to the structure rather than by using a separate member (eg, sponge) that may limit the design.

[0161] According to various embodiments, a speaker module of an electronic device may include a guide structure formed to surround a vent hole, thereby eliminating noise around the vent hole while achieving smooth air circulation.

[0162] According to various embodiments, a speaker module of an electronic device has a guide structure formed integrally with a speaker housing, thereby achieving cost saving, simplified process, and better sound quality.

[0163] Although the present disclosure has been shown and described with reference to various exemplary embodiments, it will be understood that the various exemplary embodiments are intended to be illustrative rather than restrictive. It will be further understood by those skilled in the art that various changes may be made in form and detail without departing from the true spirit and full scope of the present disclosure, including the appended claims and their equivalents. It will also be understood that any embodiment described herein may be used in combination with any other embodiment described herein.

Claims

1. A speaker module, comprising: a speaker housing including an interior space and a passage adjacent to and extending into the interior space, the interior space including a first portion and a second portion spaced apart from the first portion; a speaker assembly positioned in the first portion; a vent hole spaced apart from the speaker assembly and extending through at least a portion of the speaker housing corresponding to the second portion of the interior space; a sound absorbing material disposed in the second portion and positioned adjacent the speaker assembly; as well as a guide structure disposed around the vent hole and including at least one protrusion protruding toward the inner space to prevent the sound absorbing material from contacting the vent hole, and The sound absorbing material is provided on a front surface of the at least one protrusion in a protruding direction and a surface of the second portion on which the at least one protrusion is provided.

2. The speaker module according to claim 1, wherein: The sound absorbing material is formed using a plurality of particles.

3. The speaker module according to claim 2, wherein: The sound absorbing material is formed of sponge, cashmere, glass fiber or wool.

4. The speaker module according to claim 2, wherein: The guide structure includes a first protrusion and a second protrusion spaced apart from each other, and wherein a distance between the first protrusion and the second protrusion passing through a central axis of the vent hole is smaller than a particle diameter of the sound absorbing material.

5. The speaker module according to claim 2, wherein: The guide structure includes a first protrusion and a second protrusion adjacent to and separated from each other, wherein a first side surface edge of the first protrusion faces a second side surface edge of the second protrusion, and wherein a minimum distance between the first side surface and the second side surface is less than a particle diameter of the sound absorbing material.

6. The speaker module according to claim 2, wherein: The guide structure includes a first protrusion having a specified thickness, and wherein the thickness of the first protrusion is greater than half of a particle diameter of the sound absorbing material.

7. The speaker module according to claim 4, wherein: The guide structure further includes a third protrusion disposed between the first protrusion and the second protrusion, and wherein the third protrusion is formed in a shape different from shapes of the first protrusion and the second protrusion.

8. The speaker module according to claim 1, wherein: The guide structure further includes a blocking member disposed on a front surface of the at least one protrusion and including a plurality of through holes, and wherein the plurality of through holes of the blocking member are formed to face in a direction perpendicular or parallel to the vent hole, and wherein at least some of the plurality of through holes are connected together and provide an air ventilation path toward the vent hole.

9. The speaker module according to claim 7, wherein: The guide structure further includes a fourth protrusion disposed between the first protrusion and the second protrusion and facing at least one side surface of the third protrusion, and the vent hole is disposed between the fourth protrusion and the second protrusion.

10. The speaker module according to claim 9, wherein: The first protrusion, the second protrusion, the third protrusion, and the fourth protrusion of the guide structure are formed in shapes corresponding to each other.

11. The speaker module according to claim 9, wherein: At least one of the first protrusion, the second protrusion, the third protrusion, and the fourth protrusion of the guide structure is formed in a shape different from shapes of the other protrusions.

12. The speaker module according to claim 4, wherein: The first protrusion or the second protrusion of the guide structure is disposed in contact with a bottom surface of the speaker housing facing a first direction and an inner side surface facing a second direction perpendicular to the first direction.

13. The speaker module according to claim 1, wherein: The guide structure is integrally formed with the speaker housing, and includes an opening formed in a front surface of the guide structure and a side surface of the guide structure and extending to the vent hole.

14. An electronic device comprising: a housing including a front plate, a rear plate, and a side surface member, the side surface member surrounding a first space between the front plate and the rear plate and including a first channel extending to the outside; A display configured to output images via the front panel; A battery, disposed between the display and the back panel; The speaker module according to any one of claims 1 to 13, arranged in the first space; and a printed circuit board, arranged adjacent to the speaker module and electrically connected to the speaker module, in, The inner space of the speaker housing is formed to be separated from the first space, and the passage of the speaker housing communicates with the first passage.

Images