A wafer transfer robot for a clean environment

Abstract

The present invention discloses a wafer transfer robot for a clean environment, which includes a support base. The upper surface of the support base is rotatably connected with a rotating seat. The output end of the rotating seat is equipped with a robotic arm module. The output end of the robotic arm module is equipped with a fixing frame and a fixing ring. The bottom of the fixing frame is fixedly installed with an adsorption cover. The bottom of the adsorption cover is slidably connected with a bottom slide plate. The bottom of the fixing ring is fixedly installed with a fixing plate. The inner bottom of the fixing plate is fixedly installed with an electric push rod. For the wafer transfer robot for a clean environment of the present invention, the electric push rod pushes the bottom connecting plate to the lower side of the bottom slide plate, so that the folding net bag unfolds and spreads flat directly below the bottom slide plate. When the wafer adsorbed on the bottom slide plate drops during the transfer process, the folding net bag below catches the dropped wafer, so as to prevent the adsorbed wafer from dropping to the ground and being lost during the transfer process due to insufficient adsorption force of the negative pressure air pump.

Description

Technical Field

[0001] The present invention relates to the field of transfer robots, and particularly to a wafer transfer robot for a clean environment. Background Art

[0002] In the process of manufacturing ultra-large scale integrated circuits (ICs), wafers need to be frequently transferred between hundreds of processes. The wafer production line has concentrated processes, high processing speed, and high requirements for the cleanliness of the working environment. High-performance wafer transfer robots are required. Existing wafer transfer robots usually use a negative pressure adsorption method to transfer wafers, that is, use the negative pressure generated by the air pump installed at the working end to adsorb the wafers. In this way, due to the different positions of the wafers on the transfer template, when the wafers need to be adsorbed, it is necessary to align the adsorption module with the wafers, which wastes a lot of time. If not aligned, it may cause the wafers to fall off the adsorption module during the transfer process. At the same time, during the transfer process, a malfunction of the air pump or the shaking of the device may also cause the wafers to fall off the adsorption module. When the wafers fall off the adsorption module during the transfer process, it is impossible to protect the wafers in time, which is likely to cause the wafers to fall to the ground and be damaged. In view of this, we propose a wafer transfer robot for a clean environment. Summary of the Invention

[0003] The main object of the present invention is to provide a wafer transfer robot for a clean environment, which can effectively solve the problems in the background art: due to the different positions of the wafers on the transfer template, when the wafers need to be adsorbed, it is necessary to align the adsorption module with the wafers, which wastes a lot of time. If not aligned, it may cause the wafers to fall off the adsorption module during the transfer process. At the same time, during the transfer process, a malfunction of the air pump or the shaking of the device may also cause the wafers to fall off the adsorption module. When the wafers fall off the adsorption module during the transfer process, it is impossible to protect the wafers in time, which is likely to cause the wafers to fall to the ground and be damaged.

[0004] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0005] A wafer transfer robot for a clean environment, comprising a support base, a rotating seat is rotatably connected to the upper surface of the support base, a robotic arm module is installed at the output end of the rotating seat, a fixing frame and a fixing ring are installed at the output end of the robotic arm module, an adsorption cover is fixedly installed at the bottom of the fixing frame, a bottom slide plate is slidably connected to the bottom of the adsorption cover, a fixing plate is fixedly installed at the bottom of the fixing ring, an electric push rod is fixedly installed at the inner bottom of the fixing plate, a bottom connecting plate is fixedly installed at the output end of the electric push rod, a folding net bag is fixedly installed between the fixing plate and the bottom connecting plate, an indicator lamp frame is fixedly installed at the inner bottom of the bottom slide plate, the indicator lamp frame is in a cross shape, a negative pressure air pump is fixedly installed on the upper surface of the fixing frame, and the unfolded folding net bag is located directly below the bottom slide plate.

[0006] A further improvement of the present invention is that a protection pad is fixedly installed on the side of the bottom slide plate facing away from the adsorption cover, sliding sleeves are fixedly installed on both sides of the bottom slide plate, the upper end of the bottom slide plate slides inside the adsorption cover, the side of the bottom slide plate is connected to the inner edge of the adsorption cover through a piston ring, a fixing rod is fixedly installed on the inner edge of the adsorption cover, the sliding sleeve is slidably connected to the fixing rod, a return spring is fixedly installed on the upper surface of the sliding sleeve, and the upper end of the return spring is fixedly connected to the inner edge of the side groove.

[0007] A further improvement of the present invention is that a laser emitter and a laser receiver are respectively fixedly installed on both sides of the inner edge of the adsorption cover, the laser emitter and the laser receiver are connected by an optical path, and the optical path between the laser emitter and the laser receiver is blocked when the bottom slide plate moves to the highest point.

[0008] A further improvement of the present invention is that the folding net bag is located between two electric push rods, a cavity is formed inside the bottom connecting plate, an inner sliding plate is slidably connected inside the cavity, a pulling ring is fixedly installed at the left end of the inner sliding plate, a compression spring is fixedly installed on the side of the inner sliding plate, the end of the compression spring away from the inner sliding plate is fixedly connected to the inner edge of the cavity, and the end of the folding net bag away from the fixing plate is fixedly connected to the pulling ring.

[0009] A further improvement of the present invention is that an alarm switch is fixedly installed on the inner edge of the cavity, an alarm is fixedly installed on the upper surface of the rotating seat, and pressing the alarm switch controls the alarm to work.

[0010] A further improvement of the present invention is that the robotic arm module includes a fixed platform, one end of the fixed platform is fixedly installed on the side surface of the rotating seat, the upper surface of the end of the fixed platform away from the rotating seat is fixedly installed with a first motor, the output end of the first motor is fixedly installed with a first rotating column, the side surface of the first rotating column is rotatably connected with a second rotating column, the front surface of the second rotating column is fixedly installed with a second motor, the side surface of the second motor is fixedly installed with a fixed column, and the output end of the fixed column is fixedly connected with a fixed ring and a fixed bracket.

[0011] A further improvement of the present invention is that a controller is fixedly installed on the upper surface of the support base, and the controller controls the operation of the rotating seat, the first motor, the second motor, the negative pressure air pump and the electric push rod.

[0012] A further improvement of the present invention is a wafer transfer robot for a clean environment, and its usage method is as follows:

[0013] A: Fix the device on the side of the wafer transfer belt, control the operation of the rotating seat, the first motor and the second motor through the controller. The first motor drives the whole composed of the first rotating column, the fixed column, the fixed bracket and the bottom sliding plate to rotate in the XOY plane, and the second motor drives the whole composed of the fixed column, the fixed bracket and the bottom sliding plate to rotate in the XOZ plane, so as to drive the three-dimensional movement of the fixed bracket and the bottom sliding plate, so as to facilitate the suction and placement of wafers at different positions;

[0014] B: Operate the robotic arm module to work through the controller. Install the indicator lamp brackets evenly on the inner surface of the bottom sliding plate. When sucking and placing the wafers, turn on the indicator lamp brackets to accurately indicate the position of the bottom sliding plate, so that the user can align the bottom sliding plate with the wafer position, reduce the situation of wafer dropping caused by incorrect adsorption position, move the bottom sliding plate to directly above the wafer, turn on the negative pressure air pump through the controller, the negative pressure air pump evacuates the inside of the bottom sliding plate, so that negative pressure is generated inside the bottom sliding plate to adsorb the wafer. During the process of adsorbing the wafer to the surface of the protection pad, the adsorption force causes the bottom sliding plate to slide inside the adsorption cover, so that the bottom sliding plate blocks the optical path between the laser emitter and the laser receiver. At this time, the controller controls the electric push rod to work. A fixed ring is fixedly installed on the side surface of the fixed bracket, a fixed plate is fixedly installed at the bottom of the fixed ring, the bottom of the fixed plate is slidably connected with the bottom connecting plate, and the electric push rod pushes the bottom connecting plate out under the bottom sliding plate, so that the folding mesh bag unfolds and spreads flat under the bottom sliding plate. When the wafer adsorbed on the bottom sliding plate drops during the transmission process, the folding mesh bag below catches the dropped wafer, so as to avoid the loss of the adsorbed wafer dropping to the ground during the transmission process due to insufficient adsorption force of the negative pressure air pump;

[0015] C: The pulling ring on the surface of the fixing plate and the bottom connecting plate is connected by a folding mesh bag. When the wafer falls on the folding mesh bag, the gravity of the wafer acts on the folding mesh bag, pulling the pulling ring and the inner sliding plate, causing the inner sliding plate to slide inside the inner cavity, so that the inner sliding plate contacts and presses the alarm switch. By the action of pressing the alarm switch, the alarm on the upper surface of the rotating seat can work to give an alarm reminder of the wafer falling.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. By slidably connecting the bottom slide plate at the bottom of the adsorption cover, operating the robotic arm module through the controller, moving the bottom slide plate directly above the wafer, and opening the negative pressure air pump through the controller, the negative pressure air pump evacuates the inside of the bottom slide plate, generating negative pressure inside the bottom slide plate to adsorb the wafer. During the process of adsorbing the wafer onto the surface of the protective pad, the adsorption suction force causes the bottom slide plate to slide inside the adsorption cover, thereby blocking the optical path between the laser emitter and the laser receiver. At this time, when the controller receives the signal, it controls the electric push rod to work. A fixing ring is fixedly installed on the side of the fixing frame, a fixing plate is fixedly installed at the bottom of the fixing ring, the bottom of the fixing plate is slidably connected to the bottom connecting plate, and the electric push rod pushes the bottom connecting plate to the lower side of the bottom slide plate, causing the folding mesh bag to unfold and lay flat directly below the bottom slide plate. When the wafer adsorbed on the bottom slide plate falls during the transmission process, the folding mesh bag below catches the falling wafer to prevent the adsorbed wafer from falling to the ground and being lost due to insufficient adsorption force of the negative pressure air pump.

[0018] 2. The pulling ring on the surface of the fixing plate and the bottom connecting plate is connected by a folding mesh bag. When the wafer falls on the folding mesh bag, the gravity of the wafer acts on the folding mesh bag, pulling the pulling ring and the inner sliding plate, causing the inner sliding plate to slide inside the inner cavity, so that the inner sliding plate contacts and presses the alarm switch. Pressing the alarm switch makes the rotating seat on the upper surface of the rotating seat work to give an alarm reminder of the wafer falling.

[0019] 3. By using the rotating seat and the robotic arm module in cooperation, controlling the operation of the rotating seat, the first motor, and the second motor through the controller, the first motor drives the overall structure composed of the first rotating column, the fixed column, the fixing frame, and the bottom slide plate to rotate in the XOY plane, and the second motor drives the overall structure composed of the fixed column, the fixing frame, and the bottom slide plate to rotate in the XOZ plane, thereby driving the fixing frame and the bottom slide plate to move three-dimensionally to facilitate the picking and placing of wafers at different positions.

[0020] 4. Install the indicator lamp holder evenly on the inner surface of the bottom slide plate. When sucking and placing the wafer, turn on the indicator lamp holder to accurately indicate the position of the bottom slide plate, so as to facilitate the user to align the bottom slide plate with the wafer position and reduce the situation of wafer dropping caused by incorrect adsorption position.

[0021] 5. This device is controlled by electronic equipment and does not use transmission components such as transmission gears, avoiding the contamination of the wafer caused by the oil stains on the transmission components. Brief Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the overall structure of a wafer transfer robot for a clean environment according to the present invention.

[0023] Figure 2 It is a schematic diagram of the structure of the robotic arm module of a wafer transfer robot for a clean environment according to the present invention.

[0024] Figure 3 It is a schematic diagram of the structure of the adsorption hood of a wafer transfer robot for a clean environment according to the present invention.

[0025] Figure 4 It is a schematic cross-sectional view of the adsorption hood of a wafer transfer robot for a clean environment according to the present invention.

[0026] Figure 5 It is a schematic diagram of the connection structure of the fixing plate, electric push rod, bottom connecting plate, fixing ring and folding mesh bag of a wafer transfer robot for a clean environment according to the present invention.

[0027] Figure 6 It is a connection diagram of the fixing plate, electric push rod, bottom connecting plate, fixing ring and folding mesh bag of a wafer transfer robot for a clean environment according to the present invention.

[0028] Figure 7 It is a schematic cross-sectional view of the bottom connecting plate of a wafer transfer robot for a clean environment according to the present invention.

[0029] In the figure: 1. Support base; 2. Controller; 3. Rotating seat; 4. Alarm; 5. Robotic arm module; 6. Fixed frame; 7. Negative pressure air pump; 8. Adsorption hood; 9. Bottom slide plate; 10. Fixing plate; 11. Electric push rod; 12. Bottom connecting plate; 13. Fixing ring; 14. Folding mesh bag; 15. Protection pad; 16. Indicator lamp holder; 17. Laser emitter; 18. Laser receiver; 19. Fixed rod; 20. Sliding sleeve; 21. Return spring; 22. Inner cavity; 23. Inner sliding plate; 24. Compression spring; 25. Pulling ring; 26. Alarm switch; 501. First motor; 502. First rotating column; 503. Second rotating column; 504. Second motor; 505. Fixed column; 506. Fixed table. Detailed Embodiments

[0030] In order to make the technical means, creative features, achieved purposes and effects realized by the present invention easy to understand, in the description of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention. In addition, terms such as "No. 1", "No. 2", "No. 3" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. The present invention will be further described below in conjunction with specific embodiments.

[0031] Embodiment 1

[0032] As Figure 1 、 2 shown in 3, 5 and 6, a wafer transfer robot for a clean environment includes a support base 1. A rotating seat 3 is rotatably connected to the upper surface of the support base 1. The output end of the rotating seat 3 is equipped with a robotic arm module 5. The output end of the robotic arm module 5 is equipped with a fixing frame 6 and a fixing ring 13. The bottom of the fixing frame 6 is fixedly installed with a suction hood 8. A bottom sliding plate 9 is slidably connected to the bottom of the suction hood 8. The bottom of the fixing ring 13 is fixedly installed with a fixing plate 10. An electric push rod 11 is fixedly installed at the inner bottom of the fixing plate 10. The output end of the electric push rod 11 is fixedly installed with a bottom connecting plate 12. A folding mesh bag 14 is fixedly installed between the fixing plate 10 and the bottom connecting plate 12. An indicator lamp holder 16 is fixedly installed at the inner bottom of the bottom sliding plate 9. The indicator lamp holder 16 is arranged in a cross shape. A negative pressure air pump 7 is fixedly installed on the upper surface of the fixing frame 6. The unfolded folding mesh bag 14 is located directly below the bottom sliding plate 9. In this way, the indicator lamp holder 16 is evenly installed on the inner surface of the bottom sliding plate 9. When sucking and placing the wafer, the indicator lamp holder 16 is turned on to accurately indicate the position of the bottom sliding plate 9, so as to facilitate the user to align the bottom sliding plate 9 with the wafer position and reduce the situation of the wafer falling due to incorrect adsorption position.

[0033] Specifically, as Figure 4 shown, a protection pad 15 is fixedly installed on the side of the bottom sliding plate 9 facing away from the suction hood 8. Sliding sleeves 20 are fixedly installed on both sides of the bottom sliding plate 9. The upper end of the bottom sliding plate 9 slides inside the suction hood 8. The side surface of the bottom sliding plate 9 is connected to the inner edge of the suction hood 8 through a piston ring. A fixing rod 19 is fixedly installed on the inner edge of the suction hood 8. The sliding sleeve 20 is slidably connected to the fixing rod 19. A return spring 21 is fixedly installed on the upper surface of the sliding sleeve 20. The upper end of the return spring 21 is fixedly connected to the inner edge of the side groove;

[0034] Specifically, asFigure 4 As shown, on both sides of the inner edge of the adsorption hood 8, a laser emitter 17 and a laser receiver 18 are fixedly installed respectively. The laser emitter 17 and the laser receiver 18 are connected by an optical path. When the bottom slide plate 9 moves to the highest point, the optical path between the laser emitter 17 and the laser receiver 18 is blocked;

[0035] Specifically, as Figure 2 shown, the robotic arm module 5 includes a fixed platform 506. One end of the fixed platform 506 is fixedly installed on the side surface of the rotating base 3. On the upper surface of the end of the fixed platform 506 away from the rotating base 3, a first motor 501 is fixedly installed. The output end of the first motor 501 is fixedly installed with a first rotating column 502. The side surface of the first rotating column 502 is rotatably connected with a second rotating column 503. On the front surface of the second rotating column 503, a second motor 504 is fixedly installed. On the side surface of the second motor 504, a fixed column 505 is fixedly installed. The output end of the fixed column 505 is fixedly connected with the fixed ring 13 and the fixed frame 6. With such a setting, by controlling the operation of the rotating base 3, the first motor 501 and the second motor 504 through the controller 2, the first motor 501 drives the whole formed by the first rotating column 502, the fixed column 505, the fixed frame 6 and the bottom slide plate 9 to rotate in the XOY plane, and the second motor 504 drives the whole formed by the fixed column 505, the fixed frame 6 and the bottom slide plate 9 to rotate in the XOZ plane, thereby driving the fixed frame 6 and the bottom slide plate 9 to move three-dimensionally to facilitate the picking and placing of wafers at different positions;

[0036] Specifically, as Figure 1 shown, a controller 2 is fixedly installed on the upper surface of the support base 1. The controller 2 controls the operation of the rotating base 3, the first motor 501, the second motor 504, the negative pressure air pump 7 and the electric push rod 11.

[0037] Through this embodiment, the following can be achieved: By slidably connecting the bottom slide plate 9 to the bottom of the adsorption hood 8, operating the robotic arm module 5 through the controller 2 to move the bottom slide plate 9 directly above the wafer, turning on the negative pressure air pump 7 through the controller 2, the negative pressure air pump 7 evacuates the inside of the bottom slide plate 9 to generate negative pressure inside the bottom slide plate 9 to adsorb the wafer. During the process of adsorbing the wafer onto the surface of the protective pad 15, the adsorption suction force causes the bottom slide plate 9 to slide inside the adsorption hood 8, thereby blocking the optical path between the laser emitter 17 and the laser receiver 18 by the bottom slide plate 9. At this time, the controller 2 controls the electric push rod 11 to work. A fixing ring 13 is fixedly installed on the side of the fixing frame 6, a fixing plate 10 is fixedly installed at the bottom of the fixing ring 13, the bottom of the fixing plate 10 is slidably connected to the bottom connecting plate 12, and the electric push rod 11 pushes the bottom connecting plate 12 out below the bottom slide plate 9 to unfold and lay flat the folding mesh bag 14 directly below the bottom slide plate 9. When the wafer adsorbed on the bottom slide plate 9 drops during the transmission process, the folding mesh bag 14 below catches the dropped wafer to prevent the adsorbed wafer from dropping to the ground and being lost due to insufficient adsorption force of the negative pressure air pump 7.

[0038] Embodiment 2

[0039] The implementation method of adding the bottom connecting plate 12 in this embodiment on the basis of Embodiment 1 is as follows: As Figure 7 shown, the folding mesh bag 14 is located between the two electric push rods 11. An inner cavity 22 is formed inside the bottom connecting plate 12, an inner sliding plate 23 is slidably connected inside the inner cavity 22, a pulling ring 25 is fixedly installed at the left end of the inner sliding plate 23, and a compression spring 24 is fixedly installed on the side of the inner sliding plate 23. The purpose of setting the compression spring 24 in this way is to elastically buffer the pressure of the dropped wafer and reduce the damage to the wafer when it drops onto the surface of the folding mesh bag 14. The end of the compression spring 24 away from the inner sliding plate 23 is fixedly connected to the inner edge of the inner cavity 22, and the end of the folding mesh bag 14 away from the fixing plate 10 is fixedly connected to the pulling ring 25; An alarm switch 26 is fixedly installed on the inner edge of the inner cavity 22, and an alarm 4 is fixedly installed on the upper surface of the rotating seat 3. Pressing the alarm switch 26 controls the alarm 4 to work.

[0040] Through this embodiment, the following can be achieved: The fixing plate 10 and the pulling ring 25 on the surface of the bottom connecting plate 12 are connected by the folding mesh bag 14. When the wafer drops onto the folding mesh bag 14, the gravity of the wafer acts on the folding mesh bag 14, pulling the pulling ring 25 and the inner sliding plate 23, causing the inner sliding plate 23 to slide inside the inner cavity 22 so that the inner sliding plate 23 contacts and presses the alarm switch 26. Pressing the alarm switch 26 causes the alarm 4 on the upper surface of the rotating seat 3 to work, alarming and reminding of the situation of the dropped wafer. At the same time, the purpose of setting the compression spring 24 is to elastically buffer the pressure of the dropped wafer.

[0041] It should be noted that the present invention is a wafer transfer robot for a clean environment. When in use, first, the device is fixedly installed on the side of the wafer transfer belt. The controller 2 controls the operation of the rotating base 3, the first motor 501, and the second motor 504. The first motor 501 drives the whole composed of the first rotating column 502, the fixed column 505, the fixed frame 6, and the bottom sliding plate 9 to rotate in the XOY plane, and the second motor 504 drives the whole composed of the fixed column 505, the fixed frame 6, and the bottom sliding plate 9 to rotate in the XOZ plane, thereby driving the three-dimensional movement of the fixed frame 6 and the bottom sliding plate 9 to facilitate the suction and placement of wafers at different positions. Secondly, the manipulator module 5 is operated through the controller 2. The indicator lamp holders 16 are evenly installed on the inner surface of the bottom sliding plate 9. When sucking and placing the wafers, the indicator lamp holders 16 are turned on to accurately indicate the position of the bottom sliding plate 9, so as to facilitate the user to align the bottom sliding plate 9 with the wafer position and reduce the situation of the wafer falling due to incorrect adsorption position. The bottom sliding plate 9 is moved directly above the wafer, and the negative pressure air pump 7 is turned on through the controller 2. The negative pressure air pump 7 pumps air inside the bottom sliding plate 9 to generate negative pressure inside the bottom sliding plate 9 to adsorb the wafer. During the process of adsorbing the wafer onto the surface of the protection pad 15, the suction force of adsorption causes the bottom sliding plate 9 to slide inside the adsorption cover 8, so that the bottom sliding plate 9 blocks the optical path between the laser emitter 17 and the laser receiver 18. At this time, the controller 2 controls the electric push rod 11 to work. A fixed ring 13 is fixedly installed on the side of the fixed frame 6, a fixing plate 10 is fixedly installed at the bottom of the fixed ring 13, the bottom of the fixing plate 10 is slidably connected to the bottom connecting plate 12, and the electric push rod 11 pushes the bottom connecting plate 12 to the lower side of the bottom sliding plate 9 to unfold and lay flat the folding net pocket 14 directly below the bottom sliding plate 9. When the wafer adsorbed on the bottom sliding plate 9 falls during the transmission process, the folding net pocket 14 below catches the falling wafer to avoid the loss of the adsorbed wafer falling to the ground due to insufficient adsorption force of the negative pressure air pump 7. The pulling rings 25 on the surfaces of the fixing plate 10 and the bottom connecting plate 12 are connected through the folding net pocket 14. When the wafer falls on the folding net pocket 14, the gravity of the wafer acts on the folding net pocket 14, pulling the pulling ring 25 and the inner sliding plate 23, causing the inner sliding plate 23 to slide inside the inner cavity 22, so that the inner sliding plate 23 contacts and presses the alarm switch 26. Through the action of pressing the alarm switch 26, the alarm 4 on the upper surface of the rotating base 3 can work to alarm and remind of the situation of the wafer falling. This device is controlled by electronic equipment and does not use transmission components such as transmission gears, avoiding the contamination of the wafer caused by the oil stains on the transmission components and the debris generated by transmission.

[0042] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. A wafer transfer robot for a clean environment, comprising a support base (1), characterized in that: The upper surface of the support base (1) is rotatably connected to a rotating seat (3). The output end of the rotating seat (3) is equipped with a robotic arm module (5). The output end of the robotic arm module (5) is equipped with a fixing frame (6) and a fixing ring (13). The bottom of the fixing frame (6) is fixedly installed with a suction hood (8). The bottom of the suction hood (8) is slidably connected to a bottom slide plate (9). The bottom of the fixing ring (13) is fixedly installed with a fixing plate (10). The inner bottom of the fixing plate (10) is fixedly installed with an electric push rod (11). The output end of the electric push rod (11) is fixedly installed with a bottom connecting plate (12). A folding net bag (14) is fixedly installed between the fixing plate (10) and the bottom connecting plate (12). The inner bottom of the bottom slide plate (9) is fixedly installed with an indicator lamp bracket (16). The indicator lamp bracket (16) is arranged in a cross shape. The upper surface of the fixing frame (6) is fixedly installed with a negative pressure air pump (7). The unfolded folding net bag (14) is located directly below the bottom slide plate (9).

2. The wafer transfer robot for a clean environment according to claim 1, wherein: A protective pad (15) is fixedly installed on the side of the bottom slide plate (9) facing away from the suction hood (8). Sliding sleeves (20) are fixedly installed on both sides of the bottom slide plate (9). The upper end of the bottom slide plate (9) slides inside the suction hood (8). The side of the bottom slide plate (9) is connected to the inner edge of the suction hood (8) through a piston ring. A fixing rod (19) is fixedly installed on the inner edge of the suction hood (8). The sliding sleeve (20) is slidably connected to the fixing rod (19). The upper surface of the sliding sleeve (20) is fixedly installed with a return spring (21). The upper end of the return spring (21) is fixedly connected to the inner edge of the side groove.

3. The wafer transfer robot for a clean environment according to claim 2, wherein: A laser emitter (17) and a laser receiver (18) are respectively fixedly installed on both sides of the inner edge of the suction hood (8). The laser emitter (17) and the laser receiver (18) are connected by an optical path. When the bottom slide plate (9) moves to the highest point, it blocks the optical path between the laser emitter (17) and the laser receiver (18).

4. The wafer transfer robot for a clean environment according to claim 3, wherein: The folding net bag (14) is located between the two electric push rods (11). An inner cavity (22) is formed inside the bottom connecting plate (12). An inner sliding plate (23) is slidably connected inside the inner cavity (22). A pulling ring (25) is fixedly installed at the left end of the inner sliding plate (23). A compression spring (24) is fixedly installed on the side of the inner sliding plate (23). The end of the compression spring (24) away from the inner sliding plate (23) is fixedly connected to the inner edge of the inner cavity (22). The end of the folding net bag (14) away from the fixing plate (10) is fixedly connected to the pulling ring (25).

5. The wafer transfer robot for a clean environment according to claim 4, wherein: An alarm switch (26) is fixedly installed on the inner edge of the inner cavity (22). An alarm (4) is fixedly installed on the upper surface of the rotating seat (3). Pressing the alarm switch (26) controls the alarm (4) to work.

6. The wafer transfer robot for a clean environment according to claim 5, characterized in that: The robotic arm module (5) includes a fixed platform (506), one end of the fixed platform (506) is fixedly installed on the side surface of the rotating base (3), the upper surface of the end of the fixed platform (506) away from the rotating base (3) is fixedly installed with a first motor (501), the output end of the first motor (501) is fixedly installed with a first rotating column (502), the side surface of the first rotating column (502) is rotatably connected with a second rotating column (503), the front surface of the second rotating column (503) is fixedly installed with a second motor (504), the side surface of the second motor (504) is fixedly installed with a fixed column (505), and the output end of the fixed column (505) is fixedly connected with a fixed ring (13) and a fixed frame (6).

7. The wafer transfer robot for a clean environment according to claim 6, characterized in that: The upper surface of the support base (1) is fixedly installed with a controller (2), and the controller (2) controls the operation of the rotating base (3), the first motor (501), the second motor (504), the negative pressure air pump (7) and the electric push rod (11).

8. A wafer transfer robot for a clean environment according to claim 7, characterized in that: The usage method is as follows: A: Fix the device on the side of the wafer transfer belt, and control the operation of the rotating base (3), the first motor (501) and the second motor (504) through the controller (2). The first motor (501) drives the whole composed of the first rotating column (502), the fixed column (505), the fixed frame (6) and the bottom slide plate (9) to rotate in the XOY plane, and the second motor (504) drives the whole composed of the fixed column (505), the fixed frame (6) and the bottom slide plate (9) to rotate in the XOZ plane, so as to drive the three-dimensional movement of the fixed frame (6) and the bottom slide plate (9), so as to facilitate the picking and placing of wafers at different positions; B: Operate the robotic arm module (5) through the controller (2). Uniformly install the indicator lamp holder (16) on the inner surface of the bottom slide plate (9). When picking up and placing the wafer, turn on the indicator lamp holder (16) to accurately indicate the position of the bottom slide plate (9), so that the user can align the bottom slide plate (9) with the wafer position, reducing the situation of the wafer falling due to incorrect adsorption position. Move the bottom slide plate (9) directly above the wafer, and turn on the negative pressure air pump (7) through the controller (2). The negative pressure air pump (7) evacuates the inside of the bottom slide plate (9), creating negative pressure inside the bottom slide plate (9) to adsorb the wafer. During the process of adsorbing the wafer onto the surface of the protective pad (15), the adsorption suction force causes the bottom slide plate (9) to slide inside the adsorption cover (8), thereby blocking the optical path between the laser emitter (17) and the laser receiver (18). At this time, the controller (2) controls the electric push rod (11) to work. Fix the fixing ring (13) on the side of the fixing frame (6). Fix the fixing plate (10) at the bottom of the fixing ring (13). The bottom of the fixing plate (10) is slidably connected to the bottom connecting plate (12). The electric push rod (11) pushes the bottom connecting plate (12) below the bottom slide plate (9), causing the folding net bag (14) to unfold and spread flat directly below the bottom slide plate (9). When the adsorbed wafer on the bottom slide plate (9) falls during transmission, the folding net bag (14) below catches the falling wafer to prevent the adsorbed wafer from falling to the ground and being lost due to insufficient adsorption force of the negative pressure air pump (7). C: The pulling ring (25) on the surfaces of the fixing plate (10) and the bottom connecting plate (12) is connected by the folding net bag (14). When the wafer falls on the folding net bag (14), the gravity of the wafer acts on the folding net bag (14), pulling the pulling ring (25) and the inner sliding plate (23), causing the inner sliding plate (23) to slide inside the inner cavity (22), so that the inner sliding plate (23) contacts and presses the alarm switch (26). Through the action of pressing the alarm switch (26), the alarm (4) on the upper surface of the rotating seat (3) can be operated to alarm and remind of the situation of the wafer falling.

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