High-precision bonding thickness control device

Abstract

The present invention discloses a high-precision bonding thickness control device, which includes an upper cover plate, a base plate and a control system. A first sample to be bonded is fixed to the bottom end face of the upper cover plate, and a second sample to be bonded is fixed to the top end face of the base plate. A height control device is provided between the base plate and the upper cover plate, which is configured to adjust the height between the upper cover plate and the base plate according to the thicknesses of the first and second samples to be bonded; the upper cover plate is connected to a driving structure through a distance control device, and the distance control device is configured to adjust the distance between the upper cover plate and the base plate; the height control device further includes a pressure sensor for detecting the pressure value of the upper cover plate, which can transmit the detected pressure value to the control system, and the control system regulates the pressure magnitude of the distance control device. It can control the flatness of the bonding of large-size thin glass, improve the bonding flatness of display products; after the bonding flatness is improved, the internal stress of the glue is reduced, effectively improving display defects and enhancing display quality.

Description

Technical Field

[0001] The present invention relates to the technical field of reinforced display devices, and in particular, to a high-precision bonding thickness control device. Background Art

[0002] When designing a reinforced display, corresponding functional components need to be installed at the front end of the display medium. Common installation methods include air bonding and glue bonding. Among them, the glue bonding method can effectively solve the reflection problem caused by air bonding and significantly improve the display quality. At the same time, it can also increase the fixing strength between the functional components and the display medium. Therefore, glue bonding has become the mainstream installation method in the industry.

[0003] However, during the bonding process of large-sized thin glass, affected by its own weight and the surface tension of the glue, the glue is prone to flow and form a curved shape after flowing across the screen. Placing it in the peripheral area using a conventional bonding scheme will instead exacerbate the deformation of the thin glass. Furthermore, once the upper thin glass deforms after bonding, it is easy to cause the glue layer to be uneven, increase the bonding internal stress, and generate bonding display Mura.

[0004] Therefore, there is an urgent need to provide a high-precision bonding thickness control device to solve the above technical problems. Summary of the Invention

[0005] The object of the present invention is to provide a high-precision bonding thickness control device, which can control the flatness of the bonding of large-sized thin glass and improve the bonding flatness of the display product. At the same time, after the bonding flatness is improved, the internal stress of the glue is reduced, effectively improving the display defects and enhancing the display quality.

[0006] To achieve the above object, the present invention provides a high-precision bonding thickness control device, which includes an upper cover plate, a base plate, and a control system. A first sample to be bonded is detachably fixed to the bottom end surface of the upper cover plate, and a second sample to be bonded is detachably fixed to the top end surface of the base plate. A height control device is provided between the base plate and the upper cover plate, and the height control device is configured to adjust the height between the upper cover plate and the base plate according to the thicknesses of the first sample to be bonded and the second sample to be bonded. The upper cover plate is connected to a driving structure through a distance control device, and the distance control device is configured to adjust the distance between the upper cover plate and the base plate. Among them,

[0007] The height control device further includes a pressure sensor for detecting the pressure value of the upper cover plate. The pressure sensor can transmit the detected pressure value to the control system, and the control system can regulate the pressure of the distance control device.

[0008] Preferably, the detachable fixing method includes vacuum adsorption and / or mechanical clamping.

[0009] Preferably, there are multiple distance control devices, which are arranged at the corners of the upper cover plate.

[0010] Preferably, the adjustment precision of the distance control device and the height control device is 1 micron.

[0011] Preferably, the control system is set to be able to control the distance adjustment of each individual distance control device respectively according to the analyzed pressure difference.

[0012] Preferably, when multiple distance control devices adjust the distance, the pressure value of the pressure sensor needs to be maintained within 0 - 10 N.

[0013] Preferably, there are multiple pressure sensors, and the difference between each pressure sensor is not greater than 10% of the average pressure.

[0014] Preferably, the central area of the top end face of the base plate is the fixing area for the second sample to be bonded, height control devices are arranged at the corners, and a bonding alignment area for the second sample to be bonded is formed at the position between adjacent height control devices.

[0015] Preferably, the bonding alignment area for the second sample to be bonded adopts CCD alignment technology, wherein the alignment marks are circular, square or cross-shaped.

[0016] Preferably, the central area of the bottom end face of the upper cover plate is the fixing area for the first sample to be bonded. The fixing area for the first sample to be bonded is divided into multiple partitions, and there are gaps between each partition. Each partition protrudes from the upper cover plate and is set to be able to move independently up and down along the plane normal direction of the upper cover plate under the control of the partition control mechanism, with a displacement precision of 1 micron; wherein, a pressure adsorption system that can be independently controlled is arranged in the partition control mechanism;

[0017] A plurality of bonding alignment areas for the first sample to be bonded are evenly spaced along the circumferential direction at the edge of the fixing area for the first sample to be bonded. The bonding alignment areas for the first sample to be bonded adopt CCD alignment technology, and the alignment marks are circular, square or cross-shaped.

[0018] According to the above technical solution, the present invention can be used for glue bonding of functional components of common display media such as liquid crystal displays and OLED displays. By precisely controlling the glue layer through an automatic thickness control system, and using an adjustable planar adjustment to level the thin glass, the flatness control of large-size thin glass bonding is achieved, effectively improving the bonding Mura phenomenon.

[0019] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation part. Description of the Drawings

[0020] The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation to the present invention. In the accompanying drawings:

[0021] Figure 1 is a schematic structural diagram of a high-precision bonding thickness control device provided by the present invention;

[0022] Figure 2 is a schematic structural diagram of a base plate in the high-precision bonding thickness control device provided by the present invention;

[0023] Figure 3 is a schematic structural diagram of an upper cover plate in the high-precision bonding thickness control device provided by the present invention.

[0024] Explanation of reference numerals

[0025] 1 - Upper cover plate 2 - First sample to be bonded

[0026] 3 - Second sample to be bonded 4 - Base plate

[0027] 5 - Height control device 6 - Distance control device

[0028] 1 - 1 - First fixed area of the sample to be bonded

[0029] 1 - 2 - First bonding alignment area of the sample to be bonded

[0030] 4 - 1 - Second fixed area of the sample to be bonded

[0031] 4 - 2 - Second bonding alignment area of the sample to be bonded Specific embodiments

[0032] The following is a detailed description of the specific embodiments of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0033] In the present invention, unless otherwise specified, the directional terms such as "top, bottom, upper, lower, center" included in the terms only represent the direction of the term in the normal use state, or the common name understood by those skilled in the art, and should not be regarded as a limitation to the term.

[0034] See Figure 1, the present invention provides a high-precision bonding thickness control device, which includes an upper cover plate 1, a base plate 4 and a control system. A first sample to be bonded 2 is detachably fixed to the bottom end surface of the upper cover plate 1, and a second sample to be bonded 3 is detachably fixed to the top end surface of the base plate 4. A height control device 5 is provided between the base plate 4 and the upper cover plate 1, and the height control device 5 is configured to adjust the height between the upper cover plate 1 and the base plate 4 according to the thicknesses of the first sample to be bonded 2 and the second sample to be bonded 3; the upper cover plate 1 is connected to a driving structure through a distance control device 6, and the distance control device 6 is configured to adjust the distance between the upper cover plate 1 and the base plate 4; wherein,

[0035] The height control device 5 further includes a pressure sensor for detecting the pressure value of the upper cover plate 1. The pressure sensor can transmit the detected pressure value to the control system, and the control system regulates the pressure magnitude of the distance control device 6.

[0036] In this embodiment, the above-mentioned detachable fixing method can be any common quick disassembly and assembly method in the art. However, from the perspective of facilitating operation and simplifying the structure, preferably, the detachable fixing method includes vacuum adsorption and / or mechanical clamping.

[0037] To optimize the overall structure and layout of the device, preferably, the distance control device 6 is multiple and is arranged at the corners of the upper cover plate 1.

[0038] Meanwhile, the regulation precision of the distance control device 6 and the height control device 5 is 1 micron. In this way, the distance of the device can be precisely controlled at the four-corner positions, greatly improving the precision of the device.

[0039] The overall flatness of the base plate 4 is high, which can ensure the flatness of the bonding bottom plane. The height control device 5 can be set to the required thickness through software control and can reach the corresponding thickness value by itself. The device has high precision, up to 1 micron; meanwhile, it also has a pressure sensor for detecting the pressure value between the upper cover plate 1 and it, and transmitting the pressure value to the control system. After analyzing the pressure difference at the four corners, the control system synchronously sends a distance regulation instruction to the distance control device 6 at the four corners of the upper cover plate 1 to adjust the distance and keep the pressure sensor within the designed pressure range (0 - 10N), and the difference of each sensor is not greater than 10% of the average pressure, ensuring the overall flatness.

[0040] As Figure 2 shown, the central area of the top end surface of the base plate 4 is a second sample to be bonded fixing area 4-1, and the sample can be fixed by means such as vacuum adsorption and mechanical clamping; height control devices 5 are arranged at the corners, and a second sample to be bonded bonding alignment area 4-2 is formed at the position between adjacent height control devices 5.

[0041] In addition, the above-mentioned second sample to be bonded bonding alignment area 4-2 adopts CCD alignment technology, where the alignment marks are circular, square, cross-shaped or other shapes.

[0042] In Figure 3 the center area of the bottom end face of the upper cover plate 1 is the first sample to be bonded fixing area 1-1. The first sample to be bonded fixing area 1-1 is divided into multiple partitions (the size of each area is 1-40 mm), and there is a gap between each partition (the gap is 1-10 mm). Each partition protrudes from the upper cover plate 1 (the protruding platform is 1-10 mm) and is set to be able to move independently up and down along the plane normal direction of the upper cover plate 1 under the control of the partition control mechanism, with a displacement accuracy of 1 micron; among them, a pressure adsorption system that can be independently controlled is arranged in the partition control mechanism; in this way, while the partition mechanisms move, they maintain local fixation of the sample to be bonded. By detecting the surface shape of the sample to be bonded, the uneven positions are fed back to the control system, and the system issues adjustment instructions to the control area according to the detected positions. The control area adjusts the surface shape of the sample to be bonded by moving up and down, so that the surface shape meets the design requirements before bonding.

[0043] Similarly, a plurality of first sample to be bonded bonding alignment areas 1-2 are evenly spaced along the circumferential direction at the edge of the first sample to be bonded fixing area 1-1. The first sample to be bonded bonding alignment areas 1-2 adopt CCD alignment technology, and the alignment marks are circular, square, cross-shaped or other shapes.

[0044] Through the above technical solutions, the glue layer is controlled by an accurate automatic thickness control system, the flatness of the plane can be adjusted, the flatness control of the bonding of large-size thin glass is realized, the bonding flatness of the display product is relatively high, the internal stress of the glue is reduced after the bonding flatness is improved, the display defects caused by uneven bonding are effectively improved, and the display quality is improved.

[0045] The preferred embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0046] In addition, it should be noted that, among the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without conflict. In order to avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.

[0047] In addition, any combination can be made between various different embodiments of the present invention, as long as it does not violate the idea of the present invention, it should also be regarded as the content disclosed by the present invention.

Claims

1. A high-precision bonding thickness control device, characterized in that, The device includes an upper cover plate (1), a base plate (4), and a control system. The bottom end surface of the upper cover plate (1) is detachably fixed with a first sample to be bonded (2), and the top end surface of the base plate (4) is detachably fixed with a second sample to be bonded (3). A height control device (5) is provided between the base plate (4) and the upper cover plate (1), and the height control device (5) is configured to adjust the height between the upper cover plate (1) and the base plate (4) according to the thicknesses of the first sample to be bonded (2) and the second sample to be bonded (3); the upper cover plate (1) is connected to a driving structure through a distance control device (6), and the distance control device (6) is configured to adjust the distance between the upper cover plate (1) and the base plate (4); wherein, The height control device (5) further includes a pressure sensor for detecting the pressure value of the upper cover plate (1), and the pressure sensor can transmit the detected pressure value to the control system, and the control system regulates the pressure of the distance control device (6); The distance control devices (6) are multiple and are arranged at the corners of the upper cover plate (1), and the control system is configured to respectively control each individual distance control device (6) to regulate the distance according to the analyzed pressure difference; The central area of the bottom end surface of the upper cover plate (1) is a first sample to be bonded fixing area (1-1), the first sample to be bonded fixing area (1-1) is divided into multiple partitions, gaps are formed between each partition, and each partition protrudes from the upper cover plate (1) and is configured to be able to move independently in the direction normal to the plane of the upper cover plate (1) under the control of a partition control mechanism, and the displacement accuracy reaches 1 micron; wherein, a pressure adsorption system capable of autonomous control is provided in the partition control mechanism; A plurality of first sample to be bonded bonding alignment areas (1-2) are evenly spaced along the circumferential direction at the edge of the first sample to be bonded fixing area (1-1), and the first sample to be bonded bonding alignment areas (1-2) adopt CCD alignment technology, and the alignment marks are circular, square or cross-shaped.

2. The high-precision bonding thickness control device according to claim 1, characterized in that, The detachable fixing method includes vacuum adsorption and / or mechanical clamping.

3. The high-precision bonding thickness control device according to claim 1, characterized in that, The regulation accuracy of the distance control device (6) and the height control device (5) is 1 micron.

4. The high-precision bonding thickness control device according to claim 1, characterized in that, When the multiple distance control devices (6) regulate the distance, the pressure value of the pressure sensor needs to be maintained between 0-10N.

5. The high-precision bonding thickness control device according to claim 4, characterized in that, There are multiple pressure sensors, and the difference between each pressure sensor is not greater than 10% of the average pressure.

6. The high-precision bonding thickness control device according to claim 1, characterized in that, The central area of the top end surface of the base plate (4) is a second sample to be bonded fixing area (4-1), and the height control device (5) is provided at the corners, and a second sample to be bonded bonding alignment area (4-2) is formed at the position between adjacent height control devices (5).

7. The high-precision bonding thickness control device according to claim 6, characterized in that, The second sample to be bonded bonding alignment area (4-2) adopts CCD alignment technology, and the alignment marks are circular, square or cross-shaped.

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