Wafer cleaning system and method of operation thereof

Abstract

The application discloses a wafer cleaning system and a working method thereof. The wafer cleaning system comprises a cleaning cavity, a wafer supporting platform arranged in the cleaning cavity, a liquid film forming spraying device, a functional water supply device, and a cleaning spraying device. The output end of the functional water supply device is connected with the input end of the liquid film forming spraying device, and the functional water supply device is used for supplying a liquid mixed with a functional gas. The cleaning spraying device is used for spraying a cleaning liquid. Through the application of the application, the liquid mixed with the functional gas in the functional water supply system is sprayed by the liquid film forming spraying device before the wafer performs the main cleaning operation, so that the wafer surface is formed with a wet interface which is easy to be covered by the chemical cleaning liquid, and the cleaning effect of the chemical cleaning liquid on the wafer surface is improved, and the cleaning quality of the wafer is further improved.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and in particular to a wafer cleaning system and its operating method. Background Technology

[0002] Currently, wet cleaning processes are commonly used in the integrated circuit manufacturing industry to clean the surface of wafers. Specifically, this involves using a platform to rotate the wafer at high speed while simultaneously spraying chemical agents onto its surface. However, in practice, workers often directly spray chemicals onto relatively dry wafers. In this case, it's difficult for the chemicals to be evenly coated onto the wafer surface, resulting in poor cleaning performance. Summary of the Invention

[0003] In view of this, in order to solve the above problems, the object of the present invention is to provide a wafer cleaning system, comprising:

[0004] Cleaning chamber;

[0005] A wafer carrier platform is disposed within the cleaning chamber, and a wafer is placed on the wafer carrier platform;

[0006] A liquid film generating spray device is disposed outside the cleaning chamber, and the output end of the liquid film generating spray device is directed toward the wafer.

[0007] A functional water supply device is provided outside the cleaning chamber. The output end of the functional water supply device is connected to the input end of the liquid film generating spray device. The functional water supply device is used to supply a liquid mixed with functional gas.

[0008] A cleaning spray device is disposed above the wafer carrier platform, and the cleaning spray device is used to spray a cleaning solution.

[0009] In another preferred embodiment, the functional gas includes one or more of nitrogen, carbon dioxide, and hydrogen.

[0010] In another preferred embodiment, the liquid comprises one or a mixture of two of the following: a chemical cleaning solution and ultrapure water.

[0011] In another preferred embodiment, the functional water supply device includes: a gas-liquid mixing device, a gas input device, a liquid input device, and an output pipeline. The gas input device and the liquid input device are both connected to the gas-liquid mixing device. The gas-liquid mixing device is connected to one end of the output pipeline, and the other end of the output pipeline is connected to the liquid film generating spray device.

[0012] In another preferred embodiment, the functional water supply device includes a temperature control component installed on the output pipeline, the temperature control component being used to control the temperature of the liquid mixed with functional gas in the output pipeline.

[0013] In another preferred embodiment, the liquid film generating spray device includes: a base, a support, a small nozzle, an upper support arm, and a lower support arm. The base is disposed outside the cleaning chamber. The lower end of the support arm is connected to the base. The upper support arm is arranged horizontally. One end of the upper support arm is connected to the upper end of the support arm, and the other end of the upper support arm is connected to the head of the small nozzle. One end of the lower support arm is connected to the upper end of the support arm, and the other end of the lower support arm is connected to the tail of the small nozzle.

[0014] In another preferred embodiment, the cleaning spray device includes: a swing mechanism, a nozzle assembly, and a cleaning fluid supply device. The swing mechanism is disposed outside the cleaning chamber and has a movable end connected to the nozzle assembly. The nozzle assembly is connected to the cleaning fluid supply device via a pipeline.

[0015] In another preferred embodiment, the system further includes a mechanical transfer mechanism disposed outside the cleaning chamber, the mechanical transfer mechanism being used to transport the wafer.

[0016] In another preferred embodiment, the wafer carrier platform is provided with an air blowing assembly.

[0017] The present invention also aims to provide a method for operating a wafer cleaning system, comprising the wafer cleaning system described in any one of the above-mentioned embodiments, including the following steps:

[0018] Step S1: Place the wafer on the wafer carrier platform;

[0019] Step S2: The liquid film generating spray device sprays a liquid mixed with functional gas onto the upper surface of the wafer.

[0020] Step S3: Spray chemical cleaning solution onto the upper surface of the wafer using the cleaning spray device;

[0021] Step S4: Spray ultrapure water onto the upper surface of the wafer using the cleaning spray device.

[0022] The present invention, by employing the above-mentioned technical solution, has the following positive effects compared with the prior art: By applying the present invention, the wafer is sprayed with a liquid containing functional gas mixed in the functional water supply system before the main cleaning operation by the liquid film generation spray device. This removes some contaminants while forming a wet interface on the wafer surface that is easy to be coated with chemical cleaning liquid. This improves the cleaning effect of the chemical cleaning liquid at the spray point of the subsequent cleaning spray device on the wafer surface, and further improves the cleaning quality of the wafer. Attached Figure Description

[0023] Figure 1 This is an overall schematic diagram of a wafer cleaning system according to the present invention;

[0024] Figure 2 This is a partial schematic diagram of a wafer cleaning system according to the present invention.

[0025] In the attached image:

[0026] 1. Cleaning chamber; 2. Wafer carrier platform; 3. Liquid film generation spray device; 4. Functional water supply device; 5. Cleaning spray device; 6. Gas-liquid mixing device; 7. Gas input device; 8. Liquid input device; 9. Output pipeline; 10. Base; 11. Support; 12. Small nozzle; 13. Upper support arm; 14. Lower support arm; 15. Mechanical transfer mechanism; 16. Air blowing assembly. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0028] like Figure 1 and Figure 2The diagram illustrates a preferred embodiment of a wafer cleaning system, comprising: a cleaning chamber 1; a wafer carrier platform 2 disposed within the cleaning chamber 1, on which a wafer is placed; a liquid film generating spray device 3 disposed outside the cleaning chamber 1, with its output end facing the wafer; a functional water supply device 4 disposed outside the cleaning chamber 1, its output end connected to the input end of the liquid film generating spray device 3, the functional water supply device 4 supplying a liquid mixed with a functional gas; and a cleaning spray device 5 disposed above the wafer carrier platform 2, the cleaning spray device 5 spraying a cleaning solution. Furthermore, by using this wafer cleaning system, the wafer placed on the wafer carrier platform 2 is first pre-sprayed with the liquid film generation spray device 3 and the functional water supply device 4 to form a wet interface on the wafer surface that is easy to be coated with chemical cleaning solution. After the wet interface is coated, the conventional cleaning solution is sprayed onto the wafer surface by the cleaning spray device 5. At this time, the cleaning solution is easier to clean the wafer surface, thereby further improving the cleaning quality of the wafer surface.

[0029] Furthermore, as a preferred embodiment, the functional gas includes one or more of nitrogen, carbon dioxide, and hydrogen.

[0030] Furthermore, as a preferred embodiment, the liquid includes one or a mixture of two of the following: a chemical cleaning solution and ultrapure water.

[0031] Furthermore, as a preferred embodiment, the chemical cleaning solution is one or a mixture of CA cleaning solution, SPM cleaning solution, SC1 cleaning solution, SCI cleaning solution and EKC cleaning solution.

[0032] Furthermore, in a preferred embodiment, the functional water supply device 4 includes: a gas-liquid mixing device 6, a gas input device 7, a liquid input device 8, and an output pipeline 9. Both the gas input device 7 and the liquid input device 8 are connected to the gas-liquid mixing device 6. The gas-liquid mixing device 6 is connected to one end of the output pipeline 9, and the other end of the output pipeline 9 is connected to the liquid film generating spray device 3. Further, the gas-liquid mixing device 6 pre-mixes the nitrogen, carbon dioxide, or hydrogen gas supplied by the gas input device 7, the chemical cleaning solution provided by the liquid input device 8, and the ultrapure water, so that this gas-liquid mixture is sprayed onto the wafer surface by the liquid film generating spray device 3 through the output pipeline 9, thereby generating the aforementioned wetted interface.

[0033] Furthermore, as a preferred embodiment, the functional water supply device 4 includes a temperature control component installed on the output pipe 9. The temperature control component is used to control the temperature of the liquid mixed with the functional gas within the output pipe 9. Furthermore, the temperature control component controls the temperature of the gas-liquid mixture to ensure that a sufficiently high-performance wetting interface is formed on the wafer surface.

[0034] Furthermore, as a preferred embodiment, the temperature control component includes a temperature sensor, a heater, and a cooler. The temperature sensor, heater, and / or cooler are all disposed on the output pipe 9. The temperature sensor is used to detect the temperature of the fluid in the output pipe 9, the heater is used to heat the fluid in the output pipe 9, and the cooler is used to cool the fluid in the output pipe 9.

[0035] Furthermore, in a preferred embodiment, the output ends of the heater and the cooler are both provided with a sleeve-like structure and are sleeved at the corresponding positions of the output pipeline 9.

[0036] Furthermore, as a preferred embodiment, the cleaning chamber 1 includes an outer cavity and an inner cavity, with the inner cavity fitted inside the outer cavity. The wafer carrier platform 2 is disposed inside the inner cavity, and the upper parts of both the outer cavity and the inner cavity are open structures. An accommodating space is formed between the outer cavity and the inner cavity. An annular receiving port is formed between the upper parts of the outer cavity and the upper parts of the inner cavity. The annular receiving port is arranged around the wafer carrier platform 2 and is used to receive liquid splashed from the wafer surface during the cleaning process and contain it in the accommodating space.

[0037] Furthermore, as a preferred embodiment, the bottom of the accommodating space has a lowest point, and a discharge channel is provided at the lowest point for discharging liquid.

[0038] Furthermore, in a preferred embodiment, an annular cavity is formed at the bottom of the accommodating space, with the aforementioned lowest point at the bottom end of the annular cavity. A heat-conducting channel is formed on the inner side of the annular cavity, penetrating the accommodating space and isolated from it. The output pipe 9 passes through the heat-conducting channel. Furthermore, the heat-conducting channel is made of a material that facilitates heat transfer. Heat transfer occurs through the contact between the output pipe 9 and the inner wall of the heat-conducting channel, thereby utilizing the recovered liquid within the accommodating space to exchange heat with the fluid in the output pipe 9, thus adjusting the temperature of the fluid in the output pipe 9.

[0039] Furthermore, in a preferred embodiment, a rotating support portion is provided at the upper end of the wafer carrier platform 2. The rotating support portion is used to support the wafer and drive the wafer to rotate. Furthermore, the rotation of the wafer by the rotating support portion makes it easier for liquid to diffuse on the surface of the wafer.

[0040] Furthermore, as a preferred embodiment, the liquid film generating spray device 3 includes: a base 10, a bracket 11, a small nozzle 12, an upper support arm 13, and a lower support arm 14. The base 10 is disposed outside the cleaning chamber 1. The lower end of the bracket 11 is connected to the base 10. The upper support arm 13 is arranged in a horizontal direction. One end of the upper support arm 13 is connected to the upper end of the bracket 11, and the other end of the upper support arm 13 is connected to the head of the small nozzle 12. One end of the lower support arm 14 is connected to the upper end of the bracket 11, and the other end of the lower support arm 14 is connected to the tail of the small nozzle 12.

[0041] Furthermore, as a preferred embodiment, the horizontal height of the upper support arm 13 is greater than the horizontal height of the lower support arm 14.

[0042] Furthermore, as a preferred embodiment, the other end of the upper support arm 13 is provided with a first connector for rotatably connecting the small nozzle 12, and the other end of the lower support arm 14 is provided with a second connector for connecting the small nozzle 12.

[0043] Furthermore, as a preferred embodiment, the second connector is an adjustable telescopic structure, and the angle of the output end of the small nozzle 12 can be adjusted by extending or retracting the length of the second connector.

[0044] Furthermore, as a preferred embodiment, the telescopic structure includes: an adjusting plate and a fixing buckle. The adjusting plate has a waist-shaped hole. One end of the adjusting plate is rotatably connected to the small nozzle 12. The fixing buckle can operably fix the tail of the small nozzle 12 at any position in the waist-shaped hole. The fixing buckle is fixedly connected to the lower support arm 14.

[0045] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention.

[0046] In addition to the above, the present invention also has the following embodiments:

[0047] In a further embodiment of the present invention, it further includes: a working platform, wherein the cleaning spray device 5, the liquid film generating spray device 3 and the cleaning chamber 1 are all disposed on the working platform.

[0048] In a further embodiment of the present invention, the cleaning spray device 5 includes: a swing mechanism, a nozzle assembly, and a cleaning fluid supply device. The swing mechanism is disposed outside the cleaning chamber 1 and has a movable end connected to the nozzle assembly. The nozzle assembly is connected to the cleaning fluid supply device via a pipeline. Furthermore, the swing mechanism is used to drive the movable end to swing in an arc shape in the horizontal direction.

[0049] Furthermore, as a preferred embodiment, it also includes: a mechanical transfer mechanism 15, which is disposed on the outside of the cleaning chamber 1 and is used to transport wafers.

[0050] In a further embodiment of the present invention, the mechanical transfer mechanism 15 includes: a lifting component, a translation component, a transfer frame, and a vacuum adsorption component. The lifting component is connected to the translation component, and the lifting component is used to drive the translation component to move up and down. The translation component is connected to the transfer frame, and the translation component is used to drive the transfer frame to move horizontally. The vacuum adsorption component is disposed on the upper surface of the transfer frame, and the vacuum adsorption component is operably in contact with and adsorbs the lower surface of the wafer.

[0051] In a further embodiment of the present invention, an air blowing assembly 16 is provided on the wafer carrier platform 2. Further, the air blowing assembly 16 includes at least a plurality of air nozzles disposed on the wafer carrier platform 2. The air nozzles are used to blow out clean air. When the wafer is in a cleaning state, the air nozzles are used to blow a weak and stable airflow onto the lower surface of the wafer to prevent liquid from splashing into the lower surface of the wafer. After the wafer has been cleaned, the air nozzles are used to blow a strong and stable airflow to make the wafer float, facilitating the transfer frame to extend between the wafer and the carrier platform to support the lower surface of the wafer. Furthermore, when the transfer frame extends into the lower surface of the wafer, its main body structure should be staggered from the position of the air nozzles to avoid interfering with the air blowing.

[0052] In a further embodiment of the present invention, the transfer frame includes: a mounting part and two transfer arms, the two transfer arms are arranged in parallel, and one end of each transfer arm is connected to the mounting part and is spaced apart by a certain distance.

[0053] In a further embodiment of the present invention, a draining device is also included, which is connected to the gas-liquid mixing device 6 and is used to drain the residual liquid in the gas-liquid mixing device 6 after the work is completed.

[0054] In a further embodiment of the present invention, it further includes: a waste liquid recovery device, wherein the output end and the discharge channel of the discharge device are both connected to the waste liquid recovery device.

[0055] The present invention also illustrates a preferred embodiment of a wafer cleaning system operation method, comprising the wafer cleaning system of any one of the above, including the following steps:

[0056] Step S1: Place the wafer onto the wafer carrier platform 2;

[0057] Step S2: The liquid film generating spray device 3 sprays a liquid mixed with functional gas onto the upper surface of the wafer.

[0058] Step S3: The upper surface of the wafer is sprayed with chemical cleaning solution by the cleaning spray device 5.

[0059] Step S4: Ultrapure water is sprayed onto the upper surface of the wafer using the cleaning spray device 5.

[0060] The above description is merely a preferred embodiment of the present invention and does not limit the implementation and protection scope of the present invention. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer cleaning system, characterized in that, include: Cleaning chamber; A wafer carrier platform is disposed within the cleaning chamber, and a wafer is placed on the wafer carrier platform; A liquid film generating spray device is disposed outside the cleaning chamber, and the output end of the liquid film generating spray device is directed toward the wafer. A functional water supply device is provided outside the cleaning chamber. The output end of the functional water supply device is connected to the input end of the liquid film generating spray device. The functional water supply device is used to supply a liquid mixed with functional gas. A cleaning spray device is disposed above the wafer carrier platform, and the cleaning spray device is used to spray a cleaning solution. An air blowing assembly is provided on the wafer carrier platform. The air blowing assembly includes at least a plurality of air blowing nozzles disposed on the wafer carrier platform. The air blowing nozzles are used to blow clean air onto the lower surface of the wafer. When the wafer is in a cleaning state, the air nozzle is used to blow a weak and stable airflow onto the lower surface of the wafer to avoid liquid splashing into the lower surface of the wafer. After the wafer is cleaned, the air nozzle blows out a strong and stable airflow, causing the wafer to float in the air, so that a transfer rack can be inserted between the wafer and the wafer carrier platform to support the wafer.

2. The wafer cleaning system according to claim 1, characterized in that, The functional gas includes one or more of nitrogen, carbon dioxide, and hydrogen, and a mixture thereof.

3. The wafer cleaning system according to claim 1, characterized in that, The liquid includes one or a mixture of two of the following: chemical cleaning solution and ultrapure water.

4. The wafer cleaning system according to claim 1, characterized in that, The functional water supply device includes: a gas-liquid mixing device, a gas input device, a liquid input device, and an output pipeline. The gas input device and the liquid input device are both connected to the gas-liquid mixing device. The gas-liquid mixing device is connected to one end of the output pipeline, and the other end of the output pipeline is connected to the liquid film generating spray device.

5. The wafer cleaning system according to claim 4, characterized in that, The functional water supply device includes a temperature control component, which is installed on the output pipeline and is used to control the temperature of the liquid mixed with functional gas in the output pipeline.

6. The wafer cleaning system according to claim 1, characterized in that, The liquid film generating spray device includes: a base, a bracket, a small nozzle, an upper support arm, and a lower support arm. The base is disposed outside the cleaning chamber. The lower end of the bracket is connected to the base. The upper support arm is arranged horizontally. One end of the upper support arm is connected to the upper end of the bracket, and the other end of the upper support arm is connected to the head of the small nozzle. One end of the lower support arm is connected to the upper end of the bracket, and the other end of the lower support arm is connected to the tail of the small nozzle.

7. The wafer cleaning system according to claim 1, characterized in that, The cleaning spray device includes: a swing mechanism, a nozzle assembly, and a cleaning fluid supply device. The swing mechanism is located outside the cleaning chamber and has a moving end connected to the nozzle assembly. The nozzle assembly is connected to the cleaning fluid supply device through a pipeline.

8. The wafer cleaning system according to claim 1, characterized in that, Also includes: A mechanical transfer mechanism is disposed outside the cleaning chamber and is used to transport the wafer.

9. A method of operating a wafer cleaning system, comprising the wafer cleaning system according to any one of claims 1 to 8, characterized in that, Includes the following steps: Step S1: Place the wafer on the wafer carrier platform; Step S2: The liquid film generating spray device sprays a liquid mixed with functional gas onto the upper surface of the wafer. Step S3: Spray chemical cleaning solution onto the upper surface of the wafer using the cleaning spray device; Step S4: Spray ultrapure water onto the upper surface of the wafer using the cleaning spray device.

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