Reconfigurable host with replaceable interface board

Abstract

A host of a device manufacturing system includes a base, a plurality of floors on the base, and a cover above the plurality of floors. A first floor of the plurality of floors includes a frame. The base, the cover, and the plurality of floors together define an interior space that includes a robotic arm. A first replaceable interface plate is attached to the first frame of the first floor. The first replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide the robotic arm with access to a first process chamber. A second substrate access port of the plurality of substrate access ports is configured to provide the robotic arm with access to a second process chamber.

Description

[0001] This application is a divisional application of the invention patent application filed on December 7, 2020, with application number 202011439532.7 and invention title "Reconfigurable host with replaceable interface board". Technical Field

[0002] Embodiments of this disclosure generally relate to electronic device manufacturing systems, and more particularly to a reconfigurable mainframe for an electronic device manufacturing system, including a replaceable interface plate. Embodiments also relate to a replaceable interface plate for the mainframe. Background Technology

[0003] A conventional electronic device manufacturing system (also known as a device manufacturing system) may include a host computer with multiple process chambers and load-locking chambers arranged around it. The host computer may have multiple sidewalls (commonly referred to as "facets") to which the process chambers and / or load-locking chambers are coupled. The facets of a conventional host computer are machined to have a pre-arranged configuration, which includes substrate access ports of predetermined size, location, etc. Once the conventional host computer is manufactured, the type, size, arrangement, and location of the substrate access ports are fixed for that host computer. If the owner of the host computer desires a new configuration, they purchase a new host computer with the new configuration. Summary of the Invention

[0004] According to a first aspect of this disclosure, a host of a device manufacturing system includes: a base; a plurality of machine faces on the base; and a cover above the plurality of machine faces. A first machine face of the plurality of machine faces includes a first frame. The base, the cover, and the plurality of machine faces together define an interior space including a robotic arm. A first replaceable interface board is attached to the first frame of the first machine face. The first replaceable interface board includes a plurality of substrate in / out ports. A first substrate in / out port of the plurality of substrate in / out ports is configured to provide the robotic arm with access to a first process chamber. A second substrate in / out port of the plurality of substrate in / out ports is configured to provide the robotic arm with access to a second process chamber. In one embodiment, the first replaceable interface board is load-bearing, and the frame is not load-bearing.

[0005] According to a second aspect of this disclosure, a replaceable interface board is configured for attachment to the surface of a host computer. The replaceable interface board includes a plurality of substrate in / out ports. A first substrate in / out port of the plurality of substrate in / out ports is configured to provide passage from the host computer to a first process chamber. A second substrate in / out port of the plurality of substrate in / out ports is configured to provide passage from the host computer to a second process chamber. The replaceable interface board is carried by the host computer. Therefore, the replaceable interface board is configured to withstand vertical forces acting on the host computer caused by the pressure difference between the internal space of the host computer and the external space of the host computer.

[0006] According to a third aspect of this disclosure, a method of constructing a host computer includes: determining a first plurality of process chambers to be coupled to a first surface of the host computer; determining the positions of a plurality of substrate entry / exit ports on the surface to which the first plurality of process chambers will be adapted; determining the configuration of a first replaceable interface board, the first replaceable interface board having one of the plurality of substrate entry / exit ports at each of the positions; and manufacturing the first replaceable interface board. The method further includes: attaching the first replaceable interface board to the first surface of the host computer; and attaching the first plurality of process chambers to the first replaceable interface board, wherein each of the plurality of process chambers is accessible from the host computer through one of the plurality of substrate entry / exit ports. The method can be performed after the host computer has been manufactured (e.g., to modify the configuration of the host computer). Attached Figure Description

[0007] In the accompanying figures, this disclosure is illustrated by way of example rather than limitation, wherein similar reference numerals indicate similar elements. It should be noted that different references to “one” or “a” embodiment in this disclosure do not necessarily refer to the same embodiment, and such references imply at least one.

[0008] Figure 1A A schematic top view of an electronic device manufacturing system having a reconfigurable host employing a first construction, according to an embodiment of the present disclosure, is shown.

[0009] Figure 1B A schematic top view of an electronic device manufacturing system having a reconfigurable host with a second construction, according to an embodiment of the present disclosure, is shown.

[0010] Figure 1C A schematic top view of an electronic device manufacturing system having a reconfigurable host employing a third construction, according to an embodiment of the present disclosure, is shown.

[0011] Figure 2AA perspective view of a reconfigurable host according to an embodiment of this disclosure is shown.

[0012] Figure 2B A side view of a first example replaceable interface board according to an embodiment of this disclosure is shown.

[0013] Figure 2C A side view of a second example of an alternative interface board according to an embodiment of this disclosure is shown.

[0014] Figure 2D A side view of a third example of an alternative interface board according to an embodiment of this disclosure is shown.

[0015] Figure 3 A cross-sectional side view of the host computer and the attached replaceable interface board, taken at the location of the board entry / exit port according to an embodiment of the present disclosure, is depicted.

[0016] Figure 4 A cross-sectional side view of the host and the attached replaceable interface board, taken at the position of a column in the frame of the host according to an embodiment of the present disclosure, is depicted.

[0017] Figure 5 A process for a reconfigurable host for assembling an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Detailed Implementation

[0018] The embodiments pertain to a reconfigurable host (also referred to as a transfer chamber) having one or more replaceable interface boards. The reconfigurable host includes multiple facets, wherein at least one of these facets includes a frame configured to receive the replaceable interface board. In one embodiment, the reconfigurable host includes a frame for each facet of the reconfigurable host. The replaceable interface board can be attached to each frame. A cover can be located above these frames on these facets and can be secured to the replaceable interface board. In this embodiment, the replaceable interface board is load-bearing, while the frame is not. Therefore, when the internal space of the host is evacuated to a vacuum, the replaceable interface board experiences vertical (and horizontal) forces, while little or no force is applied to the frames.

[0019] In some embodiments, the host may have a square or rectangular shape. One or more load-locking chambers may be coupled to a facet of the host. In one embodiment, one or more load-locking chambers are coupled to a replaceable interface board on a facet of the host. In one embodiment, additional replaceable interface boards are connected to one or more additional facets of the host, and one or more process chambers are coupled to some or all of these additional replaceable interface boards. The process chambers may perform various substrate processes, and the process chambers coupled to different replaceable interface boards on these facets may have different sizes, different sizes of substrate in / out ports, different connection types, different heights, etc. For example, some substrate in / out ports may include different spacing to accommodate the heights of two terminal actuators. Moreover, each replaceable interface board may be configured to be coupled to the same or different numbers of process and / or load-locking chambers. For example, a replaceable interface board may be configured to be coupled to a single process chamber of a first size, a second replaceable interface board may be configured to be coupled to two process chambers each having a second size different from the first size, etc. One or more substrate in / out ports on each replaceable interface board can engage a loading locking chamber and a process chamber with a transfer chamber, allowing the substrate to be transferred between them. The substrate in / out ports can be sized and positioned on each replaceable interface board to accommodate the number and size of chambers that can be coupled to each machine face. An electronics manufacturing system with such a host allows for a wider range of substrate processes with more varied sequences to be performed in a single system, thereby increasing the versatility, capability, and / or efficiency of such an electronics manufacturing system. In other aspects, methods for assembling the electronics manufacturing system are provided.

[0020] The reconfigurable host and replaceable interface boards disclosed in the embodiments offer several advantages over conventional host systems. Conventional host systems have a single design determined at the time of manufacture. This single design has a fixed number of board ports of fixed size and fixed location. If it would be advantageous to change the construction of such a conventional host at any time, the available option is to purchase a new host with a new construction. In contrast, the reconfigurable host can be reconfigured at any time by manufacturing new replaceable interface boards. If the new construction would be advantageous, one or more new replaceable interface boards with the new construction can be manufactured. The existing replaceable interface boards can then be removed from the host, and the new replaceable interface boards can be attached to the host. Therefore, in the embodiments, the flexibility of the host is significantly improved. Furthermore, the lifespan of the host computer can be extended because new replaceable interface boards can be used to upgrade the host computer due to the availability of new process chambers, the development of new slit valve technologies, and the development of new local center finding (LCF) technologies (e.g., using light-emitting diodes (LEDs), lasers, and / or other scanning methods to determine the position of the wafer within a pocket of an end effector or robot blade). For example, older replaceable interface boards with outdated slit valve technologies and outdated LCF technologies can be replaced with new replaceable interface boards with new slit valve technologies and / or new LCF technologies.

[0021] As used herein, unless the context clearly indicates otherwise, the singular forms “an,” “a,” and “the” include plural references. Thus, for example, reference to “substrate” includes a single substrate (e.g., a single wafer) as well as a combination of two or more substrates; and reference to “process chamber” includes a single process chamber as well as a combination of two or more process chambers, etc.

[0022] As used herein, the term "about" in conjunction with the quantity being measured refers to the normal variation of that quantity, as would be expected by a person skilled in the art when performing the measurement and exercising a degree of caution, and given the accuracy of the measuring equipment. In some embodiments, the term "about" includes the referenced number ±10%, such that "about 10" would include 9 to 11.

[0023] Statements of ranges of values ​​herein are intended only as a brief way of referring individually to each individual value falling within the range, unless otherwise indicated herein, and each individual value is incorporated into this specification as if stated individually herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or clearly contradicted by the context. The use of any and all examples or exemplary language (e.g., “such as”) provided herein is intended only to illustrate certain materials and methods and does not constitute a limitation on the scope. The language in this specification should not be construed as indicating that any unclaimed element is necessary for the practice of the disclosed materials and methods.

[0024] Figures 1A to 1C A schematic top view of an electronic device manufacturing system with a reconfigurable host is shown. Figure 1A A schematic top view of a first configuration 100A of an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Figure 1B A schematic top view of a second configuration 100B of an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Figure 1C A schematic top view of a third configuration 100C of an electronic device manufacturing system according to an embodiment of the present disclosure is shown.

[0025] The electronic device manufacturing system is configured to process substrates and may include a host (also referred to as a transfer chamber) 104 having four machine faces 101A to 101D. Although the four machine faces 101A to 101D are shown in a rectangular configuration, the host 104 may alternatively have other numbers of machine faces (e.g., such as 5 machine faces, 6 machine faces, 7 machine faces, 8 machine faces, etc.) and / or other shapes. In embodiments, these machine faces may have the same dimensions (e.g., the same width) or different dimensions. In one embodiment, the host 104 has a rectangular shape, wherein machine faces 101A and 101C are approximately parallel to each other, machine faces 101B and 101D are approximately parallel to each other, and machine faces 101A and 101C are approximately perpendicular to machine faces 101B and 101D. In one embodiment, machine faces 101B and 101D have a first length that is at least twice the second length of machine faces 101A and 101C. In one embodiment, surfaces 101B and 101D are approximately 100 to 150 inches long, and surfaces 101A and 101C are approximately 40 to 60 inches long. In one embodiment, the main unit 104 has a pentagonal shape. In one embodiment, the main unit includes a first surface having a first length, second and third surfaces on either side of the first surface (each having a second length greater than the first length), and fourth and fifth surfaces connected to the second and third surfaces (each having a third length greater than or equal to the first length and less than the second length).

[0026] The main unit 104 may include an internal space 134, wherein facets 101A to 101D may define sidewalls of the internal space 134. The main unit 104 may additionally include a base (not shown) and a cover (not shown). Facets 101A to 101D, the base, and the cover may together define the internal space 134. A robotic arm (also referred to as a robotic assembly) 136 may be disposed within the internal space 134 of the main unit 104. The internal space 134 may typically be under a vacuum during operation of the main unit 104.

[0027] Each of the facets 101A to 101D may include a frame and may have replaceable interface plates attached. Alternatively, a subset of facets 101A to 101D may include multiple frames to which multiple replaceable interface plates are attached. Other facets with built-in sidewalls having a fixed construction can be manufactured in a conventional manner. For each facet having a frame instead of a fixed construction, a replaceable interface plate may be attached to the frame of that facet and may form the sidewall of that facet. At any time, an existing replaceable interface plate attached to a facet may be removed, and a new replaceable interface plate with a different design may be attached to that facet. Thus, host 104 is a reconfigurable host with a flexible design.

[0028] exist Figure 1A In this configuration, replaceable interface board 128A is attached to surface 101B, replaceable interface board 129 is attached to surface 101C, replaceable interface board 130A is attached to surface 101D, and replaceable interface board 131 is attached to surface 101A. Replaceable interface board 128A has three substrate in / out ports 132. Each substrate in / out port 132 can be configured to allow a horizontally oriented substrate 140 to pass through it. The substrate 140 can be a wafer (e.g., a semiconductor wafer or non-semiconductor device substrate), a glass plate or panel, and / or other workpieces used for manufacturing electronic devices or circuit components. Each substrate in / out port 132 may be, for example, an elongated slot or slit formed in the sidewall of the host 104 or in the replaceable interface plates 128A, 130A, and each may include, for example, a slit valve or other suitable means for opening and closing the substrate in / out port 132 and / or a local center finder (LCF) suitable for determining the position of the substrate 140 conveyed through the substrate in / out port 132. The slit valve may have any suitable conventional construction, such as, for example, an L-shaped motion slit valve. Other suitable means may also be used to open and close the substrate in / out port 132. In embodiments, the substrate in / out port 132 may include a single gate or a double gate (e.g., having a first gate at the substrate in / out port on the inside of the replaceable interface plate and a second gate at the substrate in / out port on the outside of the replaceable interface plate).

[0029] Three process chambers 106, 108, and 110 are attached to a replaceable interface board 128A. Each of the process chambers 106 to 110 has a chamber port aligned with the substrate in / out port 132 in the replaceable interface board 128A.

[0030] The replaceable interface board 130A has three substrate in / out ports 132. Three process chambers 112, 114, and 116 are attached to the replaceable interface board 130A. Each of the process chambers 112 to 116 has a chamber port aligned with the substrate in / out port 132 in the replaceable interface board 130A.

[0031] Replaceable interface board 129 is a solid board without substrate in / out ports. Replaceable interface board 131 includes two substrate in / out ports 132. Replaceable interface board 131 is coupled to one or more loading locking chambers 126 (e.g., loading locking chambers 126 may include two side-by-side loading locking chambers). Each loading locking chamber 126 has a chamber port that is aligned with one of the substrate in / out ports in replaceable interface board 131.

[0032] The loading lock chambers 126 can each be either batch-type or single-substrate-type loading lock chambers. In some embodiments, the loading lock chambers 126 can be stacked loading lock chambers. For example, the loading lock chambers 126 can be double-stacked loading lock chambers, triple-stacked loading lock chambers, loading lock chambers with four or more stacked loading locks (e.g., quad-loading lock chambers), etc. Alternatively, the loading lock chambers 126 can be single-space loading lock chambers. Each loading lock chamber 126 can have one or more chamber ports corresponding to a respective substrate in / out port 132. For example, a stacked loading lock chamber 126 that may have two separate substrate volumes may have vertically aligned chamber ports corresponding to vertically aligned substrate in / out ports 132. A triple-stacked loading lock chamber that may have three separate substrate volumes may have three vertically aligned chamber ports corresponding to vertically aligned substrate in / out ports. A single-space loading lock chamber may have a single chamber port corresponding to a single substrate in / out port 132. Any or more loading locking chambers in loading locking chambers 126 may be stacked loading locking chambers, triple-stacked loading locking chambers, and / or single-space loading locking chambers. Furthermore, in some embodiments, any or more loading locking chambers in loading locking chambers 126 may be chambers capable of performing process operations. That is, any or more loading locking chambers in loading locking chambers 126, or any space located therein, may be capable of performing substrate preheating processes, elimination processes, cooling processes, and / or other processing processes.

[0033] The host 104, process chambers 106 to 116, and / or loading and locking chamber 126 can each operate under vacuum pressure. Process chambers 106 to 116 can each perform the same or different processes on the substrate 140, including, for example, deposition, oxidation, nitriding, etching, polishing, cleaning, photolithography, inspection, or similar processes. Other processes can also be performed therein.

[0034] The host 104 may also include a robot assembly 136 within the internal space 134. The robot assembly 136 may be configured to move one or more substrates 140 into and out of each process chamber 106-116 and load locking chamber 126. The robot assembly 136 may be configured to directly transfer substrates 140 from any chamber to any other chamber attached to the host 104. In some embodiments, substrates 140 may be transferred by the robot assembly 136 in any order or orientation. In some embodiments, the robot assembly 136 may have dual transfer blades (or more transfer blades, also referred to as end effectors), each transfer blade capable of independently extending into and retracting from any chamber attached to the host 104, thereby increasing system throughput by enabling parallel substrate transfer. In some embodiments, the robot assembly 136 may have a single transfer blade and / or may be a SCARA (selective compliance articulated robotarm) robot. Alternatively, robot component 136 may be any suitable mechanism for transferring substrates between chambers attached to host 104, such as a linear or nonlinear robot.

[0035] Load locking chamber 126 may be coupled to factory interface 102, which may be coupled to one or more FOUPs (front opening unified pods) 118. One or more load locking chambers 126 may provide a first vacuum interface between factory interface 102 and host (transfer chamber) 104. In some embodiments, each load locking chamber 126 may increase substrate throughput by alternately communicating with host (transfer chamber) 104 and factory interface 102. That is, while any space of a stacked or triple-stacked load locking chamber or a load locking chamber 126 is in communication with host (transfer chamber) 104, other spaces of the stacked or triple-stacked locking chambers or other load locking chambers 126 may be in communication with factory interface 102. Substrate transfer between factory interface 102, load locking chamber 126, and host (transfer chamber) 104 may be performed in any other suitable manner.

[0036] Each FOUP 118 may be a container having a holding box for holding multiple substrates. Each FOUP 118 may have a front-opening interface configured for use with factory interface 102. Factory interface 102 may have a buffer chamber (not shown) and one or more robot assemblies 138 configured to transfer substrates 140 via linear, rotational, and / or vertical movement between FOUP 118 and loading locking chamber 126. Substrates may be transferred between FOUP 118 and loading locking chamber 126 in any order or direction. Each loading locking chamber 126 may be a batch-type or single-substrate-type loading locking chamber.

[0037] Controller 171 controls the operation of robot assembly 138, robot assembly 136, and / or the electronic device manufacturing system. Controller 171 controls the processing and transfer of substrate 140 within and through the electronic device manufacturing system. Controller 171 may be, for example, a general-purpose computer and / or may include a microprocessor or other suitable CPU (central processing unit), memory for storing software routines controlling the electronic device manufacturing system, input / output peripherals, and supporting circuitry (such as, for example, power supplies, clock circuitry, circuitry for driving robot assemblies 138, 136, caches, and / or the like). Controller 171 may be programmed to process one or more substrates sequentially, for example, through each process chamber attached to host 104. In other embodiments, controller 171 may be programmed to process substrates through process chambers in any order. In other embodiments, controller 171 may be programmed to skip and / or repeat processing of one or more substrates in one or more process chambers. Controller 171 may alternatively be programmed to process one or more substrates in the electronic device manufacturing system in any suitable manner.

[0038] The electronic device manufacturing system may have a suitable number of FOUP 118 and / or load-locking chambers 126 other than those shown. In some embodiments, the number of load-locking chambers coupled to machine face 101A may be independent of the number of process chambers coupled to any of machine faces 101B to 101D. For example, the number of load-locking chambers may differ from the maximum number of process chambers coupled to a single machine face. Moreover, in some embodiments, up to four process chambers may be coupled to a single machine face, or more than four process chambers may be coupled to a single machine face, depending on the dimensions of the host 104 relative to the dimensions of the four process chambers.

[0039] Figure 1B It shows the relationship with Figure 1A The same FOUP 118, factory interface 102, loading lock 126, and main unit 104 are shown. However, in Figure 1BIn the second configuration 100B, replaceable interface board 128A has been removed from surface 101B, and replaceable interface board 128B has been attached to surface 101B. Similarly, replaceable interface board 130A has been removed from surface 101D, and replaceable interface board 130B has been attached to surface 101D. Unlike the three substrate in / out ports 132 of replaceable interface board 128A, replaceable interface board 128B has two substrate in / out ports 132. Similarly, unlike the three substrate in / out ports 132 of replaceable interface board 130A, replaceable interface board 130B has two substrate in / out ports 132. Therefore, in the second configuration 100B, process chambers 106, 108, 112, and 114 have been repositioned, and process chambers 110 and 116 have been removed.

[0040] Figure 1C It shows the relationship with Figures 1A to 1B The same FOUP 118, factory interface 102, loading lock 126, and main unit 104 are shown. However, in Figure 1C In the first configuration 100C, replaceable interface board 128A has been removed from surface 101B, and replaceable interface board 128C has been attached to surface 101B. Similarly, replaceable interface board 130A has been removed from surface 101D, and replaceable interface board 130C has been attached to surface 101D. Unlike the three substrate in / out ports 132 of replaceable interface board 128A, replaceable interface board 128C has four substrate in / out ports 132. Replaceable interface board 130C has three substrate in / out ports 132, but they are in different positions than the three substrate in / out ports 132 of replaceable interface board 130A. In the third configuration 100C, process chamber 112 is in the same position, but process chambers 106, 108, 110, 114, and 116 have been removed and replaced with process chambers 122, 124, 125, and 127.

[0041] As shown, any type of process chamber can be connected to the front of the host 104 via a replaceable interface board. Some examples of process chambers include four process chambers (e.g., including process chambers 106 to 116), a single process chamber (e.g., including process chambers 125, 127), and a dual process chamber (e.g., including process chambers 122, 124).

[0042] The substrate entry / exit ports 132 may each share a common size or have different sizes. Each replaceable interface board 128A to 128C, 130A to 130C, 129, 131 may include the same or different numbers of substrate entry / exit ports 132, and these substrate entry / exit ports may have similar or different sizes. For example, some substrate entry / exit ports may have a first width (e.g., for receiving a 200mm wafer), some substrate entry / exit ports may have a second width (e.g., for receiving a 300mm wafer), and some substrate entry / exit ports may have a third width. The width of each substrate entry / exit port 132 is at least wide enough to allow the substrate 140 to pass through it. Different sized substrate entry / exit ports allow the robot assembly 136 to access different regions within the cavity coupled to one of the machine surfaces 101A to 101D. In some embodiments where the replaceable interface board has two or more substrate entry / exit ports, the substrate entry / exit ports may not be laterally centered in the substrate interface board and / or equidistant from each other. In some embodiments where the replaceable interface board has a single substrate inlet / outlet port, the substrate inlet / outlet port may be laterally centered or offset on the machine surface.

[0043] In one example, the replaceable interface board 128A is interchangeable with a plurality of additional replaceable interface boards having: a) a number of substrate in / out ports different from those of the replaceable interface board 128A; b) one or more substrate in / out ports located differently from those of the substrate in / out ports in the replaceable interface board 128A; c) one or more substrate in / out ports of a different size than those of those of the substrate in / out ports in the replaceable interface board 128A; d) slit valves of a different type than those of the replaceable interface board 128A; and / or e) local center probes of a different type than those of the replaceable interface board 128A.

[0044] Each replaceable interface board may have a variety of numbers, sizes, and / or combinations of substrate in / out ports, provided the width of the machine face is suitable for accommodating those numbers, sizes, and / or combinations of substrate in / out ports. For example, in some embodiments, a replaceable interface board may have one substrate in / out port 132 instead of three substrate in / out ports 132. In other embodiments, one replaceable interface board may have a first-width substrate in / out port 132 and a second-width substrate in / out port 132, while another replaceable interface board may have a first-width substrate in / out port and a third-width substrate in / out port. Various combinations of substrate in / out ports are possible if the machine face has a suitable width. This allows the host 104 to be customized to couple to a specific type and number of process and load locking chambers. In one example, the first width may be about 1.2 meters, the second width may be about 2.4 meters, and the third width may be about 800 mm.

[0045] In some embodiments, two electronic device manufacturing systems can be combined. That is, one facet of each host 104, such as, for example, facet 101C of the first host and facet 202 of the second host, may each include a replaceable interface board that allows the two hosts to be coupled (e.g., coupled to one or more loading locks sandwiched between the two hosts). These hosts can be coupled in a manner that provides a pass-through chamber for transferring substrates between the two hosts. This can further enhance the versatility, capability, and / or efficiency of such electronic device manufacturing systems.

[0046] Figure 2A A perspective view of a reconfigurable host 200 according to an embodiment of the present disclosure is shown. In the embodiment, the reconfigurable host 200 may correspond to Figures 1A to 1C Host 104.

[0047] The reconfigurable host 200 includes a base 206 on which a set of frames are mounted. Each frame may correspond to and frame a side or front of the host 200. This set of frames may conceptually be a single three-dimensional frame 201 having multiple frame faces, each of which frames a front of the host 200. Frame 201 may include columns 204A to 204D and may further include beams 208A to 208D connecting columns 204A to 204D. Each of these frames (or frame faces) may include a portion of the base, a pair of columns, and a corresponding beam connecting the pair of columns. For example, base 206, columns 204A to 204B and beam 208B can constitute a first frame (or frame surface) for a first machine surface, base 206, columns 204A and 204D and beam 208C can constitute a second frame (or frame surface) for a second machine surface, base 206, columns 204C to 204D and beam 208D can constitute a third frame (or frame surface) for a third machine surface, and base 206, columns 204B to 204C and beam 208A can constitute a fourth frame (or frame surface) for a fourth machine surface.

[0048] Each of these frames (or frame faces) may include lips 210A, 210B located in base 206. Lips 210A to 210B may be configured to support forces transmitted to lips 210A to 210B via a replaceable interface plate attached to the frame face. Additionally, each of these frames (or frame faces) may include grooves or other features that accept O-rings 215, 220. The O-rings may seal the replaceable interface plate to the frame (or frame face).

[0049] As shown in the figure, the replaceable interface board 230 is attached to the frame (or frame surface) of the host 200. The replaceable interface board 230 can be attached to the frame via bolts, screws, and / or other attachment mechanisms. The replaceable interface board 230 may include substrate access ports 234, 236 of a predetermined number, size, and location, each substrate access port being configured to provide access to the process chamber for the robotic arm. The replaceable interface board 230 may also have a slit valve (not shown), an LCF (not shown), and / or other components attached to or integrated into the replaceable interface board 230.

[0050] The replaceable interface board 230 may be a metal plate. For example, the replaceable interface board may be formed of aluminum, aluminum alloy, steel, or another metal. In some embodiments, the replaceable interface board includes surface treatment portions, such as coatings or anodized layers (e.g., Al2O3 anodized layers). Examples of coatings include coatings deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, etc. Some exemplary coatings include dielectric coatings, Al2O3 coatings, nickel plating, Y2O3 coatings, etc. The replaceable interface board 230 may be coated before being attached to the host 200. Alternatively, the host 200 may be coated after the replaceable interface board has been attached. Therefore, in some embodiments, portions of the replaceable interface board 230 have surface treatment portions.

[0051] The replaceable interface plate 230 additionally includes a step portion 232 on the inner bottom surface of the replaceable interface plate 230. The step portion can mate with a lip on the side wall of the base 206 to which the replaceable interface plate 230 is mounted.

[0052] The host is configured to operate under vacuum, which can result in large vertical and horizontal forces being applied to the host 200 due to the pressure difference between the host's exterior (e.g., possibly at atmospheric pressure) and its interior space. The frame 201 may bend and / or wrinkle under exposure to these forces. Therefore, in this embodiment, a replaceable interface plate (e.g., replaceable interface plate 230) is designed to support the host 200, and the frame of the first surface is not supported. Thus, the replaceable interface plate 230 bears the vertical forces acting on the host 200 caused by the pressure difference between the host's interior space and its exterior. These vertical forces can be transmitted from the replaceable interface plate 230 to the base at the interface between the lip of the base and the step 232, which mates with the step 232.

[0053] In one embodiment, when the host 200 is under vacuum, a vertical force of approximately 95,000 pounds of pressure is applied to the host. In embodiments where the two machine faces have a length of approximately 100 to 150 inches and the two machine faces have a length of approximately 40 to 60 inches, approximately 30% to 40% of this vertical force is supported by each replaceable interface plate attached to the longer machine face, and approximately 10% to 15% of the force is supported by each replaceable interface plate attached to the shorter machine face. Thus, a single replaceable interface plate can be configured to withstand a force of approximately 28,500 to 38,000 pounds without flexing.

[0054] In an alternative embodiment, instead of steps and lips, vertical force is transmitted from one or more replaceable interface plates to the base 206. Replaceable interface plate 230 may include pins on its inner bottom surface, instead of mating steps and lips. The pins may be, for example, square or round pins, and may be discontinuously spaced. Multiple pins may mate with one or more features in the sidewalls of the base, and vertical force may be transmitted from the replaceable interface plate to the base at the interface between one or more features and the multiple pins. These features may be, for example, holes, lips, or other features that mate with pins.

[0055] In an alternative implementation, the base extends below the replaceable interface plate, and vertical forces can be transmitted from the replaceable interface plate to the base without the use of any steps, lips, pins, or other features in the base or the replaceable interface plate.

[0056] Although not shown, an additional replaceable interface plate can be attached to the remaining surface of the main unit 200. Additionally, a cover can be secured to the top of the main unit above the frame 201 and above the replaceable interface plate. In this embodiment, the cover contacts the replaceable interface plate but not the frame 201. This ensures that even with slight misalignment in the vertical spacing of the lip, the step, the top of the replaceable interface plate, and / or the top of the frame 201, the frame will not bear any load.

[0057] Figure 2B A side view of a first example replaceable interface board 250 according to an embodiment of the present disclosure is shown. The first replaceable interface board 250 includes a stepped portion 232 and three substrate entry / exit ports 252, 254, and 256, all of which have the same width, height, and vertical position.

[0058] Figure 2C A side view of a second example replaceable interface board 260 according to an embodiment of the present disclosure is shown. The second replaceable interface board 260 includes a stepped portion 232 and three substrate entry / exit ports 262, 264, and 266, which have varying widths and heights.

[0059] Figure 2D A side view of a third example replaceable interface board 270 according to an embodiment of the present disclosure is shown. The third replaceable interface board 270 includes a stepped portion 232 and two substrate entry / exit ports 272, 274, which have the same width and height but different vertical positions.

[0060] In the implementation, any one of the first example replaceable interface board 250, the second example replaceable interface board 260, or the third example replaceable interface board 270 can be attached to the host 200.

[0061] Figure 3 A cross-sectional side view of the host 300 and the attached replaceable interface board 330, taken at a location machined into the substrate in / out port 335 of the replaceable interface board 330 according to an embodiment of the present disclosure, is depicted. The host 300 includes a base 315, a frame surface (including a portion of the base, beams 320, and a plurality of columns (not shown)), and a cover 325. The beams 320, base 315, and columns (not shown) define a frame (or frame surface) for the machine surface 310 of the host 300. The replaceable interface board 330 is attached to the frame that frames the machine surface 310 of the host 300.

[0062] The base 315 includes a lip 340 on its sidewall. The replaceable interface plate 330 includes a step 342 on its inner bottom surface, which mates with the lip 340 on the sidewall of the base 315. As previously described, when the internal space 305 of the host 300 is evacuated to a vacuum, a force 350 can be applied to the host 300. These forces may be concentrated forces 352 borne by the replaceable interface plate 330. As shown, the cover 325 may contact the replaceable interface plate 330 but may not contact the beam 320. For example, a small gap 354 may exist between the bottom of the cover 325 and the top of the beam 320. Therefore, forces are transmitted from the cover 325 to the lip 340 of the base 315 via the replaceable interface plate 330.

[0063] The cover 325 may include a notch or groove 346 into which an O-ring can be inserted to ensure a seal between the cover 325 and the beam 320 (e.g., between the cover and the top of a frame including the beam 320). Additionally, the frame for the machine surface to which the replaceable interface plate 330 is attached (e.g., including the beam 320, the column (not shown), and the sidewalls of the base) may each include a notch or groove 344 into which an O-ring can be inserted to ensure a seal between the replaceable interface plate 330 and the frame.

[0064] In one embodiment, the replaceable interface plate 330 includes a lip 390 at the top of its inner surface. The beam 320 may include a corresponding step 392 that mates with the lip 390. Notably, the top of the step 392 does not contact the bottom of the lip 390. In other embodiments, the replaceable interface plate 330 does not include a lip, and the beam 320 does not include a step.

[0065] Figure 4 A cross-sectional side view of a host 400 and an attached replaceable interface plate 430, taken at the location of a column 420 of the host frame according to an embodiment of the present disclosure, is depicted. The host 400 includes a base 415, a frame (including multiple portions of the base, multiple beams 421, and multiple columns 420), and a cover 425. A first portion of the base 415, a first beam (not shown), and columns 420 define a first frame surface for a front panel 410 of the host 400. A second portion of the base 415, a second beam 421, columns 420, and a second column (not shown) define a second frame surface for a second front panel. The replaceable interface plate 430 is attached to a frame that frames the front panel 410 of the host 400.

[0066] The base 415 includes a lip 440 on its sidewall. The replaceable interface plate 430 includes a step 442 on its inner bottom surface, which mates with the lip 440 on the sidewall of the base 415. As previously described, when the internal space of the host 400 is evacuated to a vacuum, a force 450 can be applied to the host 400. These forces may be concentrated forces 452 borne by the replaceable interface plate 430. As shown, the cover 425 may contact the replaceable interface plate 430 but may not contact the frame. For example, a small gap 454 may exist between the bottom of the cover 425 and the top of the frame. Therefore, forces are transmitted from the cover 425 to the lip 440 of the base 415 via the replaceable interface plate 430.

[0067] The cover 425 may include a pair of notches or grooves 446, 448 into which O-rings can be inserted to ensure a seal between the cover 425 and the frame. In one embodiment, notches 446 and 448 are approximately concentric. Additionally, the frame for the machine surface to which the replaceable interface plate 430 is attached (e.g., including beams (not shown), columns 420, additional columns (not shown), and sidewalls of the base) may each include a pair of notches or grooves 444, 445 into which O-rings can be inserted to ensure a seal between the replaceable interface plate 430 and the frame. In some embodiments, notches 444 and 445 may be approximately concentric.

[0068] The region between notches 446 and 448 may be an intermediate vacuum region. Similarly, the region between notches 444 and 445 may be another intermediate vacuum region. The post 420 may include one or more channels (i.e., orifices) that fluidly couple these intermediate vacuum regions to the vacuum port 490. For example, the post 420 may include a vertical channel 472 that fluidly couples the intermediate vacuum region between notches 446 and 448 to the vacuum port 490, and the post 420 may further include a horizontal channel 470 that fluidly couples the intermediate vacuum region between notches 444 and 445 to the vertical channel 472.

[0069] Differential pumping can be performed to pump these intermediate vacuum regions to a pressure between the pressure inside the main unit 400 and atmospheric pressure. A first O-ring can be disposed in a recess 445 of the frame, wherein the outer surface of the first O-ring is exposed to the external environment, and wherein the inner surface of the first O-ring is exposed to the intermediate vacuum region. A second O-ring can be disposed in a recess 444 of the frame, wherein the outer surface of the second O-ring is exposed to the intermediate vacuum region, and wherein the inner surface of the second O-ring is exposed to the internal space of the main unit 400. The external environment has a first pressure, the intermediate vacuum regions are maintained at a second pressure lower than the first pressure, and the internal space is maintained at a third pressure lower than the second pressure.

[0070] A second frame surface perpendicular to the second machine surface 410 is also shown. The second frame surface includes beams 421, columns 420, and a base 415. A large opening 405 is framed by the second frame surface. As shown, notches or grooves 460, 462 are machined into beams 421, base 415, and columns 420, wherein notches 460, 462 each receive an O-ring to seal an additional replaceable interface plate (not shown) to the second machine surface of the host 400. The frame (or frame surface) of machine surface 410 may further include one or more additional channels in columns 420, which are fluidly coupled to channel 472. These additional channels may fluidly couple an intermediate vacuum region between notches 460, 462 to a vacuum port 490.

[0071] The additional frame (or frame surface) of the main unit may also include channels drilled therein or otherwise formed. These channels may connect to additional intermediate vacuum regions between other pairs of notches / O-rings. These channels may be fluidly coupled to channel 472 in column 420 and thus to vacuum port 490. The frame (or frame surface) of machine face 410 may further include one or more additional channels in beam 421, and / or additional beams (not shown), and / or base 415, which are fluidly coupled to one or more channels in column 420. These channels may be further fluidly coupled to one or more additional channels in additional columns, which still further fluidly connect the intermediate vacuum region to vacuum port 490.

[0072] In one example, a first frame (or first frame surface) includes a first column on a first side of the first frame surface, a second column on a second side of the first frame surface, and a first beam connecting the first column to the second column. A second frame (or second frame surface) includes a first column on a first side of the second frame surface, a third column on a second side of the second frame surface, and a second beam connecting the first column to the third column. A third frame (or third frame surface) includes a second column on a first side of the third frame surface, a fourth column on a second side of the third frame surface, and a third beam connecting the second column to the fourth column. A fourth frame (or fourth frame surface) includes a third column on a first side of the fourth frame surface, a fourth column on a second side of the fourth frame surface, and a fourth beam connecting the third column to the fourth column.

[0073] The first frame may include one or more first channels in the first column, wherein the one or more first channels fluidly couple a first intermediate vacuum region to a vacuum port. The first frame may further include one or more second channels in the first beam, wherein the one or more second channels are fluidly coupled to the one or more channels in the first column.

[0074] The first frame may further include one or more third channels in the second column, said one or more third channels being fluidly coupled to one or more second channels in the beam. The one or more third channels may fluidly couple a vacuum port to an additional intermediate vacuum region disposed on the outer surface of the second frame between a pair of O-rings.

[0075] Alternatively or additionally, the third frame may include one or more additional channels in the third beam of the third frame. Additionally, the third frame may include one or more additional channels in the fourth column, said additional channels fluidly coupling one or more intermediate vacuum regions between additional pairs of O-rings to a vacuum port.

[0076] Vacuum port 490 can be coupled to a vacuum pump (not shown). Differential pumping can be performed to reduce the pressure differential on the O-rings. The O-rings may have a large linear surface area (e.g., in embodiments where the face may have a length of up to about 130 or 150 inches and a height of about 20 to 50 inches). This can increase leakage on the O-rings and reduce sealing capability. By using differential pumping, the leakage rate can be greatly reduced. In an embodiment, a single vacuum port 490 can be fluidly coupled to an intermediate vacuum region between all pairs of O-rings between the main unit and the cover and replaceable interface plate. These connections can be achieved by drilling channels (i.e., holes) in one or more beams and / or columns of one or more frames of the main unit 400, and connections to the vacuum port 490 can be provided without the use of plugs, lateral drilling, or welding (e.g., plug welding). This improves the operation of differential pumping by minimizing additional potential leakage points.

[0077] In another embodiment, multi-stage differential pumping is used, which may include multiple sets of three concentric notches or grooves, each with its own O-ring and two adjacent intermediate vacuum regions.

[0078] Figure 5 A method 500 for assembling a reconfigurable host for an electronic device manufacturing system according to an embodiment of the present disclosure is shown. Some operations of method 500 can be performed by processing logic, which can be executed on a computing device (such as a general-purpose computer). For example, some operations can be performed using computer-aided drawing and / or computer-aided manufacturing (CAM) software installed on a computer.

[0079] In method 500, at block 502, a host configuration is determined, including determining a first plurality of process chambers to be coupled to a first surface of the host. Additionally, loading locks and / or process chambers to be connected to one or more other surfaces of the host may be determined.

[0080] At block 504, the locations of substrate in / out ports suitable for the determined host configuration (e.g., pathways to each of the process chambers and / or loading locks) are determined. At block 506, the configuration of one or more replaceable interface boards is determined. The replaceable interface boards may be configured to have substrate in / out ports at each of the determined locations. At block 508, the replaceable interface boards may be manufactured. This may include machining a metal (e.g., aluminum) and / or applying a surface treatment to at least a portion of the replaceable interface board.

[0081] At block 510, a replaceable interface plate is attached to the host (transfer chamber). This may include screwing the replaceable interface plate onto the appropriate frame of the host using bolts or screws. At block 512, the determined process chamber and / or loading lock can then be attached to the appropriate interface plate according to the determined configuration.

[0082] Engineers can determine a new configuration of the host at any time. Method 500 can then be repeated. For example, a second plurality of process chambers to be coupled to a first surface of the host can be determined, new positions of a second plurality of substrate inlet / outlet ports on the surface to be adapted to the second plurality of process chambers can be determined, a configuration of a second replaceable interface board having one of the second plurality of substrate inlet / outlet ports at each of the new positions can be determined, and the second replaceable interface board can be manufactured. The second replaceable interface board may have at least one of the following: a) a number of substrate inlet / outlet ports different from the first replaceable interface board; b) one or more substrate inlet / outlet ports located differently from the plurality of substrate inlet / outlet ports in the first replaceable interface board; c) one or more substrate inlet / outlet ports with a size different from the plurality of substrate inlet / outlet ports in the first replaceable interface board; d) a slit valve of a different type than the first replaceable interface board; or e) a local center probe of a different type than the first replaceable interface board.

[0083] Prior to block 510, an existing process chamber can be removed from the first replaceable interface board, followed by removal of the first replaceable interface board from the host. Subsequently, the operations of blocks 510 and 512 can be performed to give the host a completely new configuration (e.g., different number of substrate entry / exit ports, substrate entry / exit ports in different locations, different number and / or types of process chambers, etc.).

[0084] In the foregoing description, numerous specific details, such as specific materials, dimensions, and process parameters, have been set forth to provide a thorough understanding of the contents of this disclosure. Specific features, structures, materials, or properties may be combined in any suitable manner in one or more embodiments. The terms “example” or “exemplary” are used herein to indicate that they are used as examples, illustrations, or descriptions. Any aspect or design described herein as “example” or “exemplary” is not necessarily to be construed as being more preferred or advantageous than other aspects or designs. Rather, the use of the terms “example” or “exemplary” is intended only to present the concept in a specific manner. As used in this application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or clear from the context, “X includes A or B” is intended to mean any of the natural inclusive permutations. That is, if X includes A; X includes B; or X includes both A and B, then “X includes A or B” is satisfied in any of the foregoing cases. Throughout this specification, references to "implementation," "certain embodiments," or "one embodiment" imply that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Therefore, the phrases "implementation," "certain embodiments," or "one embodiment" appearing throughout this specification do not necessarily all refer to the same embodiment.

[0085] This disclosure has been described with reference to specific exemplary embodiments thereof. Therefore, this specification and accompanying drawings are to be considered illustrative rather than restrictive. Various modifications to this disclosure, other than those shown and described herein, will become apparent to those skilled in the art and are intended to fall within the scope of the appended claims.

Claims

1. A host computer for a device manufacturing system, comprising: Base; Multiple machine surfaces, the multiple machine surfaces on the base, each of the multiple machine surfaces including a frame; A plurality of replaceable interface boards, each of the plurality of replaceable interface boards being attached to a corresponding surface of the plurality of surfaces, wherein each of the plurality of replaceable interface boards is load-bearing and wherein each of the plurality of frames is non-load-bearing; A cover, the cover being above the plurality of machine surfaces, wherein the base, the cover, and the plurality of machine surfaces, together with the attached plurality of replaceable interface plates, define an internal space; and A robotic arm, which is located in the interior space.

2. The host as claimed in claim 1, wherein the first surface of the plurality of surfaces has a first length, the first length being at least twice the second length of the second surface of the plurality of surfaces.

3. The host as claimed in claim 2, wherein the host has a rectangular shape, wherein the plurality of machine surfaces includes four machine surfaces, wherein the second machine surface is perpendicular to the first machine surface, and wherein the robot arm is an off-axis robot arm.

4. The host as claimed in claim 1, wherein the plurality of replaceable interface boards are disposed on the base.

5. The host as claimed in claim 1, wherein one or more of the plurality of replaceable interface boards bear a vertical force acting on the host caused by the pressure difference between the internal space of the host and the outside of the host.

6. The host as claimed in claim 5, wherein one or more of the plurality of replaceable interface boards include a stepped portion on the inner bottom surface of the one or more replaceable interface boards, wherein the stepped portion engages with a lip on the sidewall of the base, and wherein the vertical force is transmitted from the one or more replaceable interface boards to the base at the interface between the stepped portion and the lip.

7. The host as claimed in claim 5, wherein one or more of the plurality of replaceable interface boards include a plurality of pins on the inner bottom surface of the plurality of replaceable interface boards, wherein one or more features in one or more sidewalls of the base engage with the plurality of pins, and wherein the vertical force is transmitted from the one or more replaceable interface boards to the base at the interface between the plurality of pins and the one or more features.

8. The host as claimed in claim 1, wherein the cover engages with the top surface of one or more of the plurality of replaceable interface boards, wherein a gap exists between the cover and the top surface of the frame of one or more of the plurality of machine surfaces, such that the cover does not contact the frame of the one or more of the plurality of machine surfaces.

9. The host computer as claimed in claim 1, further comprising: A first O-ring is disposed on the outer surface of the first frame of the first surface of the plurality of surfaces, wherein the outer surface of the first O-ring is exposed to the external environment, and wherein the inner surface of the first O-ring is exposed to the intermediate vacuum region. and A second O-ring is disposed on the outer surface of the first frame, wherein the second O-ring is concentric with the first O-ring, wherein the outer surface of the second O-ring is exposed to the intermediate vacuum region, and wherein the inner surface of the second O-ring is exposed to the internal space. The external environment has a first pressure, the intermediate vacuum region is maintained at a second pressure lower than the first pressure, and the internal space is maintained at a third pressure lower than the second pressure.

10. The host as claimed in claim 1, wherein the first frame of the first surface of the plurality of surfaces comprises: The first pillar is located on the first side of the first machine surface; The second pillar is located on the second side of the first machine surface; A beam, the beam connecting the first column and the second column; and One or more channels, wherein the one or more channels are in the first column, and wherein the one or more channels fluidly couple a first intermediate vacuum region to a vacuum port.

11. The host computer of claim 1, wherein each of the plurality of replaceable interface boards is interchangeable with a plurality of additional replaceable interface boards having different features from each other, and wherein a first replaceable interface board includes a substrate entry / exit port and a local center probe disposed at the substrate entry / exit port, the first replaceable interface board being attached to a first frame of a first surface of the plurality of surfaces, wherein the robotic arm is used to convey one or more substrates through the substrate entry / exit port, and the local center probe is configured to determine the position of the one or more substrates conveyed through the substrate entry / exit port.

12. The host computer as claimed in claim 1, wherein: The first replaceable interface board of the plurality of replaceable interface boards has at least one of the following: a first number of first substrate in / out ports, a first position of each of the first number of first substrate in / out ports, a first size of the first number of first substrate in / out ports, a first type of slit valve, or a first type of local center probe; and The second replaceable interface board of the plurality of replaceable interface boards has at least one of the following: a second number of second substrate in / out ports, a second position of each of the second number of second substrate in / out ports, a second size of the second number of second substrate in / out ports, a second type of slit valve, or a second type of local center probe.

13. The host computer of claim 1, wherein the first replaceable interface board of the plurality of replaceable interface boards has a first size, and wherein the second replaceable interface board of the plurality of replaceable interface boards has a second size, the second size being different from the first size.

14. A device manufacturing system, the device manufacturing system comprising: The first host, comprising: First base; A plurality of machine surfaces, the plurality of machine surfaces being on the first base, wherein each of the plurality of machine surfaces includes a frame; A plurality of replaceable interface boards, each of the plurality of replaceable interface boards being attached to a corresponding surface of the plurality of surfaces; A first cover is positioned above the plurality of machine surfaces, wherein the first base, the first cover, and the plurality of machine surfaces, together with the attached plurality of replaceable interface boards, define a first internal space; and A first robotic arm, the first robotic arm being located in the first internal space; and The second host, the second host includes: Second base; The second plurality of machine surfaces are on the second base, and each of the second plurality of machine surfaces includes a frame; The second plurality of replaceable interface boards, each of the second plurality of replaceable interface boards being attached to a corresponding surface in the second plurality of surfaces; A second cover, situated above the plurality of machine surfaces, wherein the second base, the second cover, and the plurality of machine surfaces, together with the attached plurality of replaceable interface boards, define a second internal space; and A second robotic arm, which is located in the second internal space; The first replaceable interface board of the first plurality of replaceable interface boards is attached to the first surface of the plurality of first plurality of machine surfaces, the second replaceable interface board of the second plurality of replaceable interface boards is attached to the second surface of the second plurality of machine surfaces, and the first replaceable interface board is attached to the second replaceable interface board to provide a through cavity between the first host and the second host.

15. The device manufacturing system of claim 14, wherein the first host and the second host each have a rectangular shape.

16. The device manufacturing system of claim 14, wherein the first plurality of replaceable interface boards are disposed on the first base, and wherein the second plurality of replaceable interface boards are disposed on the second base.

17. The device manufacturing system of claim 14, wherein the first host is configured to operate under vacuum, wherein the frame of the first plurality of machine surfaces is not borne by the load caused by the vacuum, and wherein the first plurality of replaceable interface boards are borne by the load caused by the vacuum.

18. The device manufacturing system of claim 17, wherein the first plurality of replaceable interface boards bear a vertical force acting on the first host caused by the pressure difference between the first internal space of the first host and the outside of the first host.

19. The device manufacturing system of claim 14, wherein the first cover engages with the top surface of the first plurality of replaceable interface boards, wherein a gap exists between the first cover and the top surface of the frame of the first plurality of machine surfaces such that the first cover does not contact the frame of the first plurality of machine surfaces.

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