Method and device for placing vias on a printed circuit board

Abstract

The present application provides a method and apparatus for placing vias on a printed circuit board. The method comprises: obtaining a first position coordinate information table including position coordinate information of multiple vias on the target printed circuit board based on a design file of the target printed circuit board; inserting the position coordinate information of a basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein, in the second position coordinate information table, the i-th row is the position coordinate information of the basic via, and the i+1th row is the position coordinate information of the vias on the target printed circuit board, where i is an odd number; placing a basic via in a target drawing of the printed circuit board design software based on the position coordinate information of the basic via; and copying the position coordinates of the basic via from the i-th row to the i+1th row in the target drawing based on the second position coordinate information table. The above method can realize the automatic placement of multiple vias on the target printed circuit board.

Description

Technical Field

[0001] The present application relates to the field of printed circuit boards, and in particular to a method and device for placing vias on a printed circuit board. Background Art

[0002] With the rapid development of computer technology, printed circuit boards (PCBs), as a means of providing electrical connections for electronic components, have become widely used due to their advantages, such as reducing wiring and assembly errors, improving automation levels, and increasing production efficiency. Each hole in a PCB is called a via, and vias are generally used to secure electronic components or provide electrical connections between PCB layers. Before preparing a PCB, it is necessary to first create a PCB structure diagram using PCB design software. This diagram contains information about all the vias in the PCB.

[0003] Currently, PCB vias are placed manually in PCB design software drawings. That is, PCB engineers manually place the corresponding vias in the PCB design software drawings. PCB design software can automatically place regularly spaced vias. However, in actual PCB manufacturing, vias are often arranged at irregular intervals to secure multiple electronic components or make electrical connections. Currently, PCB engineers have to manually place these irregularly spaced vias one by one, which results in excessively high time and labor costs for placing PCB vias in PCB design software drawings. Summary of the Invention

[0004] The embodiments of the present application provide a method and apparatus for placing vias on a printed circuit board, which can realize automatic placement of multiple vias in a printed circuit board.

[0005] In view of this, a first aspect of an embodiment of the present application provides a method for placing vias on a printed circuit board, characterized in that the method includes:

[0006] Obtaining a first position coordinate information table of the target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of a plurality of via holes of the target printed circuit board;

[0007] Inserting the position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via on the target printed circuit board, where i is an odd number;

[0008] Based on the position coordinate information of the basic via hole, placing the basic via hole in a target drawing of a printed circuit board design software;

[0009] According to the second position coordinate information table, the basic via is copied from the position coordinates of the i-th row to the position coordinates of the i+1-th row in the target drawing, so as to realize the placement of multiple vias of the target printed circuit board in the target drawing.

[0010] A second aspect of an embodiment of the present application provides a device for placing vias of a printed circuit board, characterized in that the device includes a first generating unit, a second generating unit, a first placing unit, and a second placing unit:

[0011] The first generating unit is configured to obtain a first position coordinate information table of the target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of a plurality of vias of the target printed circuit board;

[0012] The second generating unit is configured to insert the position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via on the target printed circuit board, where i is an odd number;

[0013] The first placement unit is configured to place a basic via in a target drawing of a printed circuit board design software based on the position coordinate information of the basic via;

[0014] The second placement unit is used to copy the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing according to the second position coordinate information table, so as to realize the placement of multiple vias of the target printed circuit board in the target drawing.

[0015] A third aspect of an embodiment of the present application provides an electronic device, including:

[0016] a memory for storing executable instructions;

[0017] The processor is configured to implement the method for placing vias on a printed circuit board provided in an embodiment of the present application when executing the executable instructions stored in the memory.

[0018] A fourth aspect of an embodiment of the present application provides a computer-readable medium storing executable instructions for implementing the method for placing vias on a printed circuit board provided in an embodiment of the present application when executed by a processor.

[0019] An embodiment of the present application provides a method and apparatus for placing vias on a printed circuit board, the method comprising: obtaining a first position coordinate information table of a target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of multiple vias on the target printed circuit board; inserting position coordinate information of a basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the vias on the target printed circuit board, i being an odd number, i.e., the position information of the basic vias and the position information of the vias on the target printed circuit board in the second position coordinate information table are alternately arranged; based on the position coordinate information of the basic via, placing a basic via in a target drawing of printed circuit board design software so that the required multiple vias on the target printed circuit board can be subsequently copied according to the basic via; and according to the second position coordinate information table, copying the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing so that the multiple vias on the target printed circuit board can be placed in the target drawing. Through the above method, it is only necessary to place a basic via in the target drawing of the printed circuit board design software, that is, the basic via can be copied to the position coordinates of the via of the above target printed circuit board according to the second position coordinate information table in which the position coordinate information of the basic via and the position coordinate information of the via of the target printed circuit board are alternately sorted, thereby realizing the automatic placement of multiple vias of the target printed circuit board, reducing the corresponding time and labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0021] Figure 1 A flowchart of a method for placing vias on a printed circuit board provided in an embodiment of the present application;

[0022] Figure 2 Schematic diagram of the vias in the antenna feeder delivered to the antenna engineer;

[0023] Figure 3 This is a schematic diagram based on the target PCB via information in the design file;

[0024] Figure 4 It is a schematic representation of the second position coordinate information after inserting the basic via hole;

[0025] Figure 5 This is a schematic diagram of the copy script file for the antenna feeder part of the target PCB;

[0026] Figure 6 A schematic diagram showing the placement of vias for the antenna feeder in the target drawing of the PCB design software;

[0027] Figure 7 A schematic diagram of a device for placing vias on a printed circuit board provided in another embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to help those skilled in the art better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0029] The terms "first," "second," "third," "fourth," etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential sequence. It should be understood that the numbers used in this way are interchangeable where appropriate so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or apparatus.

[0030] Every hole in a PCB can be called a via. Vias are generally used to fix electronic components or as electrical connections between PCB layers. Before preparing a PCB, you need to first use PCB design software to draw a PCB structure diagram. The PCB structure diagram will contain information about all vias in the PCB.

[0031] Currently, PCB vias are placed manually in PCB design software drawings. That is, PCB engineers manually place the corresponding vias in the PCB design software drawings. For regularly spaced vias, the PCB design software can automatically place them. However, for irregularly spaced vias, PCB engineers currently have to manually place them one by one. This results in excessively high time and labor costs for placing vias in PCB design software drawings.

[0032] In view of this, an embodiment of the present application provides a method and device for placing vias on a printed circuit board, which can automatically place vias with regular spacing or irregular spacing on a PCB.

[0033] Specifically, the method includes: obtaining a first position coordinate information table of the target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of multiple vias of the target printed circuit board; inserting position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via of the target printed circuit board, i is an odd number, that is, the position information of the basic via in the second position coordinate information table and the position information of the via of the target printed circuit board are alternately arranged; based on the position coordinate information of the basic via, placing a basic via in the target drawing of the printed circuit board design software, so that the required multiple vias of the target printed circuit board can be subsequently copied according to the basic via; according to the second position coordinate information table, copying the basic via from the position coordinate of the i-th row to the position coordinate of the i+1-th row in the target drawing, so as to realize the placement of the multiple vias of the target printed circuit board in the target drawing. Through the above method, it is only necessary to place a basic via in the target drawing of the printed circuit board design software, that is, the basic via can be copied to the position coordinates of the via of the above target printed circuit board according to the second position coordinate information table in which the position coordinate information of the basic via and the position coordinate information of the via of the target printed circuit board are alternately sorted, thereby realizing the automatic placement of multiple vias of the target printed circuit board, reducing the corresponding time and labor costs.

[0034] The following describes a method and device for placing vias on a printed circuit board provided by the present application through a method embodiment. Figure 1 As shown, Figure 1 A flowchart of a method for placing vias on a printed circuit board provided in an embodiment of the present application is provided. The method for placing vias on a printed circuit board provided in an embodiment of the present application includes the following steps:

[0035] S101. Obtain a first position coordinate information table of a target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of a plurality of via holes of the target printed circuit board.

[0036] Specifically, because vias on a PCB are used to secure electronic components or conduct electrical transmission, their location and spacing cannot be arbitrarily set, taking into account factors such as electromagnetic fields. For example, in millimeter-wave radar projects, the antenna signal feeder has very strict requirements for the location and spacing of vias. R&D engineers generally need to use simulation and rigorous calculations to determine the location of vias in the PCB. Therefore, before placing vias on the drawings in the PCB design software, the location coordinate information of the vias in the target PCB is written in the design file of the target PCB. Based on this, a first position coordinate information table of the target PCB can be obtained based on the design file of the target PCB.

[0037] It should be noted that the first position coordinate information table including the position coordinate information of multiple vias in the target PCB can be the first position coordinate information table including the position coordinate information of all vias in the target PCB, or the first position coordinate information table including the position coordinate information of some vias in the target PCB. It can be set as needed and is not limited here.

[0038] Optionally, the plurality of via holes on the target printed circuit board include a plurality of irregularly arranged via holes.

[0039] Specifically, since the PCB design software cannot automatically place multiple irregularly arranged vias, the PCB engineer needs to manually place them one by one. Therefore, for the above-mentioned irregularly arranged vias, their position coordinate information can be added to the first position coordinate information table, so as to realize the automatic placement of multiple irregularly arranged vias according to the operation.

[0040] S102. Insert the position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein, the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via of the target printed circuit board, and i is an odd number.

[0041] Specifically, the first position coordinate information table includes the position coordinate information of multiple vias in the target PCB, and the position coordinate information of the same basic via is inserted before each position coordinate information to obtain a second position coordinate information table, wherein the odd rows (row i) in the second position coordinate information table are all the position coordinate information of the basic vias, and the even rows (row i+1) are the position coordinate information of the vias of the target printed circuit board. The position coordinate information of row i and the position coordinate information of row i+1 are a pair of position coordinate information pairs in subsequent operations.

[0042] It should be noted that the basic via can be a via at any position in the target drawing in the target PCB design software. It can be set as needed and is not limited here.

[0043] Optionally, the position coordinate information of the basic via is the position coordinate information of the i-th row in the first position coordinate information table, where i is an integer.

[0044] Specifically, if the basic via does not belong to the via in the target PCB, after completing the placement of the via in the PCB, the basic via needs to be deleted, and any position coordinate information in the first position coordinate information table can be selected as the position coordinate information of the basic via, that is, a via in the target PCB can be used as the basic via, so that after the subsequent copy operation realizes the placement of multiple vias in the target PCB, the basic via does not need to be deleted.

[0045] Optionally, the location coordinate information of the base via points to the origin of the target drawing.

[0046] Specifically, if the position coordinate information of the basic via points to the origin of the target drawing, that is, the position coordinate information of the odd rows in the second position coordinate information table are all (0,0), the amount of data in the second position coordinate information table can be effectively reduced, reducing the corresponding data cost.

[0047] S103 : Based on the position coordinate information of the basic via, place a basic via in a target drawing of a printed circuit board design software.

[0048] S104 . Copy the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing according to the second position coordinate information table, so as to place multiple vias on the target printed circuit board in the target drawing.

[0049] Specifically, after placing a basic via in the target drawing, the basic via can be copied from the position coordinates of the i-th row (i.e., the position coordinates of the basic via) to the position coordinates of the i+1-th row (i.e., the position coordinates of a via in the target PCB) according to the position coordinate information pairs of the i-th row and the i+1-th row in the second position coordinate information table. By copying multiple times, the placement of multiple vias in the target PCB can be achieved in the target drawing.

[0050] It should be noted that if the basic via is moved from the position coordinates of the i-th row to the position coordinates of the i+1-th row, then S103 needs to place the same number of basic vias as the position coordinate information in the first position coordinate information table, which will undoubtedly greatly increase the work cost and working time. Therefore, S104 copies the basic via from the position coordinates of the i-th row to the position coordinates of the i+1-th row, so that only one basic via needs to be placed in step S103.

[0051] Optionally, a copy command script file for multiple vias on the target printed circuit board can be obtained based on the second position coordinate information table and the copy command script file template of the printed circuit board design software; the copy command script file is executed to achieve the placement of multiple vias on the target printed circuit board in the target drawing.

[0052] Specifically, the PCB design software has a specific copy command script file template, which is a script file template for executing the copy command in the PCB software. By adding the position coordinate information of the second position coordinate information table to the copy command script file template, the corresponding copy command script file can be obtained. By executing the copy command script file, the placement of multiple vias on the target PCB can be achieved in the target drawing of the PCB software by copying the basic vias.

[0053] A specific application example of a method for placing vias on a printed circuit board according to an embodiment of the present application will be described below, taking the placement of vias in an antenna feeder portion of a PCB as an example.

[0054] like Figure 2 As shown, Figure 2 A schematic diagram of the via holes in the antenna feeder section is provided to the antenna engineer. In PCB design, the influence of various factors, such as electromagnetic fields, needs to be considered. For the location and spacing of the via holes in the antenna signal feeder section, the antenna engineer needs to perform simulation and rigorous calculations to obtain the design files for the antenna signal feeder section of the corresponding target PCB.

[0055] like Figure 3 As shown, Figure 3 Based on the information diagram of the target PCB via in the design file, various information of the via in the target PCB can be obtained according to the design file of the target PCB. For example, center-xy (311.22 1300.51) is the position coordinate information of a certain via. The machine can extract the position coordinate information of multiple vias in the target PCB and obtain a first position coordinate information table.

[0056] like Figure 4 As shown, Figure 4 To represent the second position coordinate information after inserting the basic via, the position coordinate information of the basic via is set to (0 0), and then the position coordinate information of the basic via is inserted before each position coordinate information in the target PCB to obtain a second position coordinate information table in which the position coordinate information of the basic via and the position coordinate information of the via in the target PCB are alternately arranged.

[0057] like Figure 5 As shown, Figure 5This is a schematic diagram of the copy script file for the antenna feeder part of the target PCB. The position coordinate information in the second position coordinate information table is added to the copy command script file template of the PCB design software to obtain the copy script file of the antenna feeder part.

[0058] like Figure 6 As shown, Figure 6 This is a schematic diagram of placing vias for the antenna feed line in the target drawing of the PCB design software. After placing basic vias in the target drawing of the PCB design software, execute the above-mentioned copy script file to realize the automatic placement of vias for the antenna feed line.

[0059] In summary, an embodiment of the present application provides a method for placing vias on a printed circuit board, the method comprising: obtaining a first position coordinate information table of a target printed circuit board according to a design file of a target printed circuit board; wherein the first position coordinate information table includes position coordinate information of multiple vias on the target printed circuit board; inserting position coordinate information of a basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein, the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position information of the vias on the target printed circuit board, i is an odd number, that is, the position information of the basic vias in the second position coordinate information table and the position information of the vias on the target printed circuit board are arranged alternately; based on the position coordinate information of the basic via, placing a basic via in a target drawing of printed circuit board design software, so that the required multiple vias on the target printed circuit board can be subsequently copied according to the basic via; according to the second position coordinate information table, copying the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing, so as to implement the placement of the multiple vias on the target printed circuit board in the target drawing. Through the above method, it is only necessary to place a basic via in the target drawing of the printed circuit board design software, that is, the basic via can be copied to the position coordinates of the via of the above target printed circuit board according to the second position coordinate information table in which the position coordinate information of the basic via and the position coordinate information of the via of the target printed circuit board are alternately sorted, thereby realizing the automatic placement of multiple vias of the target printed circuit board, reducing the corresponding time and labor costs.

[0060] Another embodiment of the present application provides a device for placing a via hole of a printed circuit board, such as Figure 7 As shown, Figure 7 A schematic diagram of a device for placing vias on a printed circuit board provided in another embodiment of the present application, the device comprising a first generating unit 701, a second generating unit 702, a first placing unit 703, and a second placing unit 704:

[0061] The first generating unit is configured to obtain a first position coordinate information table of the target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of a plurality of via holes of the target printed circuit board.

[0062] The second generating unit is used to insert the position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via of the target printed circuit board, and i is an odd number.

[0063] The first placement unit is used to place a basic via in a target drawing of printed circuit board design software based on position coordinate information of the basic via.

[0064] The second placement unit is used to copy the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing according to the second position coordinate information table, so as to realize the placement of multiple vias of the target printed circuit board in the target drawing.

[0065] Optionally, in a device for placing vias on a printed circuit board provided in another embodiment of the present application, the plurality of vias on the target printed circuit board include a plurality of irregularly distributed vias.

[0066] Optionally, in a device for placing vias on a printed circuit board provided in another embodiment of the present application, a second placement unit is used to obtain a copy command script file for multiple vias on a target printed circuit board based on a second position coordinate information table and a copy command script file template of the printed circuit board design software; and execute the copy command script file to achieve the placement of multiple vias on the target printed circuit board in the target drawing.

[0067] Optionally, in a device for placing vias on a printed circuit board provided in another embodiment of the present application, the position coordinate information of the basic vias points to the origin of the target drawing.

[0068] It should be noted that the specific working processes of the various modules provided in the above embodiments of the present application can refer to the corresponding implementation methods in the above method embodiments, and will not be repeated here.

[0069] Another embodiment of the present application provides an electronic device, including:

[0070] a memory for storing executable instructions;

[0071] The processor is used to implement the method in the above method embodiment of the embodiment of the present application when executing the executable instructions stored in the memory.

[0072] Another embodiment of the present application provides a computer-readable storage medium storing executable instructions for implementing the method in the above-mentioned method embodiment of the present application when executed by a processor.

[0073] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0074] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for placing vias on a printed circuit board, characterized in that: The method comprises: Obtaining a first position coordinate information table of the target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of a plurality of via holes of the target printed circuit board; Inserting the position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via on the target printed circuit board, where i is an odd number; Based on the position coordinate information of the basic via hole, placing the basic via hole in a target drawing of a printed circuit board design software; According to the second position coordinate information table, the basic via is copied from the position coordinates of the i-th row to the position coordinates of the i+1-th row in the target drawing, so as to realize the placement of multiple vias of the target printed circuit board in the target drawing.

2. The method according to claim 1, characterized in that The plurality of via holes in the target printed circuit board include a plurality of irregularly arranged via holes.

3. The method according to claim 1, characterized in that The step of copying the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing according to the second position coordinate information table, so as to achieve placement of multiple vias in the target printed circuit board in the target drawing, includes: Obtaining a copy command script file for a plurality of vias on the target printed circuit board according to the second position coordinate information table and a copy command script file template of printed circuit board design software; The copy command script file is executed to implement placement of a plurality of vias of the target printed circuit board in the target drawing.

4. The method according to claim 1, wherein The position coordinate information of the basic via points to the origin of the target drawing.

5. A device for placing a via hole on a printed circuit board, characterized in that: The device includes a first generating unit, a second generating unit, a first placing unit and a second placing unit: The first generating unit is configured to obtain a first position coordinate information table of the target printed circuit board according to a design file of the target printed circuit board; wherein the first position coordinate information table includes position coordinate information of a plurality of vias of the target printed circuit board; The second generating unit is configured to insert the position coordinate information of the basic via before each position coordinate information in the first position coordinate information table to obtain a second position coordinate information table; wherein the i-th row in the second position coordinate information table is the position coordinate information of the basic via, and the i+1-th row in the second position coordinate information table is the position coordinate information of the via on the target printed circuit board, where i is an odd number; The first placement unit is configured to place a basic via in a target drawing of a printed circuit board design software based on the position coordinate information of the basic via; The second placement unit is used to copy the position coordinates of the basic via from the i-th row to the i+1-th row in the target drawing according to the second position coordinate information table, so as to realize the placement of multiple vias of the target printed circuit board in the target drawing.

6. The device according to claim 5, characterized in that The plurality of via holes in the target printed circuit board include a plurality of irregularly distributed via holes.

7. The device according to claim 5, characterized in that The second placement unit is used to obtain a copy command script file for multiple vias of the target printed circuit board based on the second position coordinate information table and the copy command script file template of the printed circuit board design software; and execute the copy command script file to achieve the placement of multiple vias of the target printed circuit board in the target drawing.

8. The device according to claim 5, characterized in that The position coordinate information of the basic via points to the origin of the target drawing.

9. An electronic device, characterized in that: include: a memory for storing executable instructions; A processor, configured to implement the method for placing vias on a printed circuit board according to any one of claims 1 to 4 when executing the executable instructions stored in the memory.

10. A computer-readable storage medium, characterized in that Executable instructions are stored for implementing the method for placing vias on a printed circuit board according to any one of claims 1 to 4 when executed by a processor.

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