Heat dissipation device and electronic device

Abstract

The present application provides a heat dissipation device and an electronic device. The heat dissipation device includes at least one set of fan groups, and each fan group includes a plurality of fans arranged in sequence; each fan includes a fan blade and a fan frame, the fan frame surrounds the outer periphery of the fan blade and forms an air outlet, and there is an air flow channel between the fan blade and the fan frame; the fan frame includes a common part, and the common part is located between adjacent fans; a channel opening communicating with adjacent air flow channels is formed on the common part, and an openable and closable baffle is connected to the common part, and the baffle blocks or opens the channel opening; wherein, the opening directions of the baffles all face the same side of the fan group. The heat dissipation device of the present application has good dust removal effect and good heat dissipation performance.

Description

Technical Field

[0001] This application relates to the technical field of device heat dissipation, and particularly to a heat dissipation device and an electronic device. Background Art

[0002] In the heat dissipation devices of many electronic devices such as laptops, all-in-one computers, desktop computers, and servers, fans are used to dissipate heat from electronic components to maintain the stable operation of the electronic devices.

[0003] During the long-term operation of the fan, there is a serious problem of dust accumulation, which will affect the reliability of the heat dissipation device and the heat dissipation performance of the electronic device. Therefore, in related technologies, a dust cleaning port is usually provided between the fan and the heat sink of the heat dissipation device. Usually, the dust cleaning port is closed, and when dust needs to be cleaned, the dust cleaning port is opened from the outside of the electronic device, and the accumulated dust is cleaned out through the dust cleaning port. Among them, for a heat dissipation device provided with multiple fans, a dust cleaning port can be provided corresponding to each fan.

[0004] However, for a heat dissipation device with multiple fans, the dust removal effect of the above dust removal scheme is poor, and it has a greater impact on the heat dissipation performance of the heat dissipation device. Summary of the Invention

[0005] This application provides a heat dissipation device and an electronic device, which have good dust removal effect and good heat dissipation performance.

[0006] On the one hand, this application provides a heat dissipation device, which includes at least one group of fan groups, and each group of fan groups includes a plurality of fans arranged in sequence; the fan includes a fan blade and a fan frame, the fan frame surrounds the outer periphery of the fan blade and forms an air outlet, and there is an air flow channel between the fan blade and the fan frame;

[0007] The fan frame includes a common part, and the common part is located at the adjacent part between adjacent fans; a channel port communicating with adjacent air flow channels is opened on the common part, and an openable and closable baffle is connected to the common part, and the baffle blocks or opens the channel port; wherein, the opening directions of the baffles all face the same side of the fan group.

[0008] In a possible implementation manner, the two ends of the baffle extending along the circumferential direction of the fan frame are respectively a connection end and a free end, the connection end is rotatably connected to one side wall of the channel port, and the free end is connected to the other side wall of the channel port or disengages from the connection with the other side wall of the channel port.

[0009] In a possible implementation manner, the connection ends of the baffles are all connected to the same side wall of the channel port, or the connection ends of at least one baffle and the connection ends of other baffles are respectively located on different sides of the corresponding channel ports.

[0010] In a possible implementation, a first magnetic member is provided at the free end of the baffle, and a second magnetic member is provided on the side wall of the channel opening. The first magnetic member and the second magnetic member are attracted to each other.

[0011] In a possible implementation, a rotating shaft is connected to the fan frame, the rotating shaft is close to the side wall of the channel opening, and the connecting end of the baffle is sleeved on the rotating shaft.

[0012] In a possible implementation, the end face of the connecting end of the baffle is an arc surface, and the side wall of the channel opening has an arc-shaped groove matching the arc surface. The connecting end is accommodated in the arc-shaped groove.

[0013] In a possible implementation, a matching limiting structure is provided between the connecting end of the baffle and the side wall of the channel opening. The limiting structure is used to limit the maximum rotation angle of the baffle.

[0014] In a possible implementation, the limiting structure includes a limiting protrusion protruding from the outer wall of the connecting end of the baffle, and the limiting protrusion is connected to the wall surface outside the arc surface;

[0015] When the baffle is in the state of opening the channel opening, the limiting protrusion abuts against the outer edge of the arc-shaped groove.

[0016] In a possible implementation, the limiting structure includes a limiting boss located at the edge of the arc-shaped groove. When the baffle is in the state of opening the channel opening, the wall surface outside the arc surface of the baffle abuts against the limiting boss.

[0017] In a possible implementation, the throats of the fans in the fan group are all located on the same side of each fan;

[0018] The two opposite sides of the baffle are the first side and the second side respectively. The first side is the side close to the throat of the corresponding fan, and the second side is the side far from the throat of the corresponding fan. The opening direction of the baffle is from the side close to the throat to the side far from the throat.

[0019] In a possible implementation, when the fan group is in the heat dissipation state, along the opening direction of the baffle, the rotation speeds of the fans in the fan group increase in sequence.

[0020] In a possible implementation, the throats of at least one fan in the fan group are arranged opposite to the throats of its adjacent fans.

[0021] In a possible implementation, along the opening direction of the baffle, the last fan in the fan group has an ash accumulation groove;

[0022] The ash accumulation groove has an ash inlet and an ash outlet that communicate with each other. The ash inlet is communicated with the air flow channel, and the ash outlet is communicated with the outside.

[0023] In a possible implementation, in the last fan among them, the orientation of the dust inlet of the dust accumulation groove is opposite to the rotation direction of the fan blades in the dust removal state.

[0024] In a possible implementation, a partition wall extends from the inner wall surface of the fan frame. There is a gap between the end of the partition wall and the fan blades, and the partition wall and the fan frame jointly enclose the dust accumulation groove.

[0025] In a possible implementation, the dust accumulation groove is formed in the common part.

[0026] In a possible implementation, the dust discharge port is opened on the fan frame, and an openable and closable dust cleaning door is connected to the fan frame. The dust cleaning door blocks or opens the dust discharge port.

[0027] In a possible implementation, the dust discharge port is opened on the bottom wall surface of the fan frame in the direction of gravity.

[0028] In a possible implementation, the heat dissipation device further includes a radiator. The radiator is located at the air outlet of each fan in the fan group, and the radiator includes a plurality of heat dissipation fins arranged at intervals.

[0029] In a possible implementation, the dust discharge port is communicated with the air outlet of the fan, and an avoidance port is provided in the radiator, and the avoidance port is communicated with the dust discharge port.

[0030] In a possible implementation, at least one of the surface of the fan blades, the inner wall surface of the fan frame and the surface of the radiator is provided with an anti-static coating.

[0031] In a possible implementation, the fan frame includes a bottom plate, side plates and a top plate. The bottom plate and the top plate are arranged opposite to each other, the side plates are connected between the bottom plate and the top plate, and the side plates surround the periphery of the bottom plate and the top plate;

[0032] The fan blades are connected to the inner wall surface of the bottom plate, the top plate is provided with an air inlet, and at least part of the fan blades are exposed in the air inlet; the bottom plate, the side plates and the top plate jointly enclose the air outlet, and the gap between the fan blades and the side plates forms an air flow channel.

[0033] In a possible implementation, the fans in the fan group are arranged in a straight line.

[0034] On the other hand, the present application provides an electronic device, including a circuit board assembly, a heat conducting member and the heat dissipation device as described above. The circuit board assembly includes a circuit board and a plurality of components arranged on the circuit board, and the heat conducting member is connected between the heat dissipation device and at least part of the components.

[0035] In a possible implementation, the heat conducting member is a heat pipe.

[0036] The heat dissipation device and electronic device provided by the present application. The heat dissipation device opens a channel opening at the adjacent part between adjacent fans in the fan group, and sets an openable and closable baffle to block the channel opening. When the fan group is in the heat dissipation state, the baffle blocks each channel opening to keep each fan in a normal working state; when the fan group enters the dust removal state, each baffle is opened in sequence, and the dust in each fan is sequentially transferred to the adjacent fan through the channel opening, collecting the dust of the fan group into the fan at the end. By cleaning the dust in the end fan, the purpose of dust removal for the fan group is achieved. In this embodiment, by using the structure of the fan group, a dust transfer channel is formed between each fan. The dust removal method is simple and efficient, and the dust removal effect is good; moreover, the dust only accumulates in the fan at the end of the fan group, which has little impact on the heat dissipation performance of the entire fan group, and can improve the heat dissipation performance of the fan group. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0038] Figure 1 It is a top view of a heat dissipation device provided by an embodiment of the present application;

[0039] Figure 2a It is a cross-sectional view corresponding to A-A in Figure 1 when a heat dissipation device is in the heat dissipation state;

[0040] Figure 2b It is a cross-sectional view corresponding to A-A in Figure 1 when another heat dissipation device is in the heat dissipation state;

[0041] Figure 3 It is a schematic structural diagram of a baffle provided by an embodiment of the present application;

[0042] Figure 4a For Figure 2a a partial enlarged view at position A in

[0043] Figure 4b It is a structural diagram when the baffle is in the state of opening the channel opening;

[0044] Figure 5a For Figure 2a a schematic structural diagram of the fan group in the first dust removal state in

[0045] Figure 5b For Figure 2a a schematic structural diagram of the fan group in the second dust removal state in

[0046] Figure 5c is Figure 2a the schematic structural diagram of the fan group in the third dust removal state in

[0047] Figure 5d is Figure 2a the schematic structural diagram of the fan group in the fourth dust removal state in

[0048] Figure 5e is Figure 2a the schematic structural diagram of the fan group in the fifth dust removal state in

[0049] Figure 6 is the top view of another heat dissipation device provided by the embodiment of the present application;

[0050] Figure 7 is Figure 6 the sectional view taken along line B-B of the fan group in the heat dissipation state in the heat dissipation device in

[0051] Figure 8a is Figure 7 the schematic structural diagram of the fan group in the first dust removal state of the fan in

[0052] Figure 8b is Figure 7 the schematic structural diagram of the fan group in the second dust removal state of the fan in

[0053] Figure 9a is Figure 7 the partial structural diagram of the fan group in with the baffle removed;

[0054] Figure 9b is Figure 7 the partial structural diagram of the fan group in the baffle open state in

[0055] Figure 10 is the top view of the third heat dissipation device provided by the embodiment of the present application;

[0056] Figure 11 is Figure 10 the front view of the fan group in the heat dissipation state in the heat dissipation device in

[0057] Figure 12a is Figure 10 the sectional view taken along line C-C of the fan group in the first dust removal state in

[0058] Figure 12b is Figure 10 the sectional view taken along line C-C of the fan group in the second dust removal state in

[0059] Figure 12c is Figure 10 the sectional view taken along line C-C of the fan group in the third dust removal state in

[0060] Figure 12d is Figure 10 a C-C sectional view of the fan group in the fourth dust removal state in

[0061] Figure 12e is Figure 10 a C-C sectional view of the fan group in the fifth dust removal state in

[0062] Figure 12f is Figure 10 another C-C sectional view of the fan group in the fifth dust removal state in

[0063] Figure 13 a dust discharge structure diagram of the heat dissipation device provided by the embodiment of the present application;

[0064] Figure 14 another dust discharge structure diagram of the heat dissipation device provided by the embodiment of the present application;

[0065] Figure 15a is Figure 13 a left view when the dust cleaning door of the fan group in

[0066] Figure 15b is Figure 13 a left view when the dust cleaning door of the fan group in

[0067] Figure 16 a third dust discharge structure diagram of the heat dissipation device provided by the embodiment of the present application;

[0068] Figure 17a is Figure 16 a top view when the dust cleaning door of the fan group in

[0069] Figure 17b is Figure 16 a top view when the dust cleaning door of the fan group in

[0070] Figure 17c is Figure 16 a partial enlarged view of the heat dissipation device in

[0071] Figure 18 a schematic diagram of an electronic device provided by the embodiment of the present application.

[0072] Explanation of reference numerals:

[0073] 1 - Electronic device;

[0074] 10 - Heat dissipation device;

[0075] 100 - Fan group;

[0076] 110 - Fan; 110a - First fan; 110b - Second fan; 110c - Third fan;

[0077] 111 - Fan blade; 112 - Fan frame; 113 - Air outlet; 114 - Air flow channel; 115 - Common part; 116 - Baffle; 116a - First baffle; 116b - Second baffle; 117 - Throat; 118 - Dust accumulation groove; 119 - Ash cleaning door;

[0078] 1121 - Bottom plate; 1122 - Side plate; 1123 - Top plate; 1151 - Channel opening; 1151a - First channel opening; 1151b - Second channel opening; 1152 - Second magnetic part; 1153 - Arc groove; 1154 - Limit boss; 1161 - Connection end; 1162 - Free end; 1181 - Ash inlet; 1182 - Ash outlet; 1191 - Buckle part;

[0079] 1121a - Rotating shaft; 1121b - Partition wall; 1123a - Air inlet; 1161a - Positioning hole; 1161b - Arc surface; 1161c - Limit protrusion; 1162a - First magnetic part; 1182a - Card slot;

[0080] 200 - Radiator;

[0081] 210 - Heat dissipation fins; 220 - Avoidance notch;

[0082] 20 - Outer shell; 30 - Circuit board assembly; 40 - Heat conducting part; 50 - Battery; 60 - First sound cavity unit; 70 - Second sound cavity unit;

[0083] 31 - Circuit board; 32 - Components;

[0084] 321 - Central processing unit; 322 - Graphics processing unit; 323 - Memory chip; 324 - Solid state drive; 325 - First power management chip; 326 - Second power management chip; 327 - Charging chip; 328 - Interface. Detailed implementation manners

[0085] During the operation of an electronic device, heat is continuously generated. Therefore, a heat dissipation device is generally provided in the electronic device to dissipate heat and maintain the stable operation of the electronic device. Among them, for electronic devices with a relatively high power consumption density such as all-in-one computers, desktop computers, servers, and base stations, fans are widely used for heat dissipation; for portable terminal electronic devices, laptop computers usually use fans for heat dissipation, and a small number of mobile phones and tablet computers also use micro fans for heat dissipation.

[0086] During long-term operation of the fan, there is a serious problem of dust accumulation. Dust will accumulate on the fan and the heat sink located on the air outlet side of the fan, affecting the reliability of the heat dissipation device and the heat dissipation performance of the electronic device. Therefore, it is necessary to remove dust from the heat dissipation device. Currently, the dust-proof structure of the heat dissipation device is mainly designed for single-fan heat dissipation modules, and the technical solutions include: (1) setting an anti-static coating on the surface of the fan and / or the heat sink to prevent the adsorption and deposition of micron-sized dust on the fan blades and the heat sink due to static electricity; (2) setting a dust accumulation groove on the fan to store dust in the dust accumulation groove under the action of air flow. On this basis, a dust removal bypass communicating with the dust accumulation groove can also be designed on the heat sink, and the dust can flow out of the heat dissipation device through the dust removal bypass; or, a dust cleaning port can be set between the fan and the heat sink. Usually, the dust cleaning port is closed, and when dust needs to be cleaned, the dust cleaning port is opened from the outside of the electronic device, and the accumulated dust is cleaned out through the dust cleaning port.

[0087] The dust in the electronic device includes two types of dust, namely micron-sized dust particles and millimeter-sized fibers. However, in the current dust removal solutions, solution (1) mainly targets micron-sized dust. Moreover, in daily use, after micron-sized dust is deposited on the anti-static surface, it loses its function. It can only play a role in the initial stage of dust deposition. During long-term use, due to the micron-sized dust covering the inner surface of the fan frame, the fan blades and the heat sink surface, it cannot play an obvious anti-static role; although solution (2) can take into account micron-sized dust, it mainly focuses on millimeter-sized fibrous dust.

[0088] Furthermore, the above dust removal solutions are mainly for single-fan heat dissipation modules. For heat dissipation devices with two or more fans widely used in laptops, desktops, all-in-ones, servers, and base stations, usually, single fans with dust removal designs are directly combined together, without making full use of the relative positions between the fans for design, resulting in poor dust removal effect and a greater impact on the heat dissipation performance of the heat dissipation device.

[0089] In view of this, the embodiments of the present application provide a heat dissipation device and an electronic device. At least one group of fan groups is provided in the heat dissipation device, and each group of fan groups has multiple fans arranged in sequence. By opening channel openings on the common part of the fan frames of adjacent fans and setting an openable and closable baffle to block the channel openings, when the heat dissipation device needs to remove dust, each baffle can be opened in sequence, so that the dust in each fan is sequentially transferred to the adjacent fan through the channel openings. Finally, the dust of all fans is collected into the fan at the end of the fan group. Thus, by cleaning the dust in the end fan, the purpose of dust removal for the fan group is achieved. The heat dissipation device of the embodiments of the present application utilizes the structural design of the fan group to design a dust transfer channel, with good dust removal effect, less impact on the heat dissipation performance of each fan, and can improve the heat dissipation performance of the heat dissipation device.

[0090] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0091] Embodiment 1

[0092] Figure 1 This is a top view of a heat dissipation device provided in an embodiment of this application. Refer to Figure 1 As shown, the heat dissipation device 10 provided in this embodiment can be applied to electronic devices 1 with high power density such as all-in-one computers, desktop computers, servers, and base stations, and can also be applied to portable electronic devices 1 such as laptop computers, tablet computers, and mobile phones. The heat dissipation device 10 is used to dissipate heat from the electronic device 1.

[0093] Figure 2a This is a cross-sectional view taken along A-A in Figure 1 when the heat dissipation device is in a heat dissipation state. Refer to Figure 2a As shown, the heat dissipation device 10 includes at least one fan group 100. For example, according to the heat dissipation power required by the electronic device 1, the heat dissipation device 10 may include one fan group 100, two fan groups 100, or more than three fan groups 100, which is not limited in this embodiment. For the case where the heat dissipation device 10 includes more than two fan groups 100, the fan groups 100 may be arranged at intervals.

[0094] Each fan group 100 includes a plurality of fans 110, and the plurality of fans 110 are arranged in sequence. Each fan 110 includes a fan blade 111 and a fan frame 112. The fan blade 111 is installed in the fan frame 112, and the fan frame 112 surrounds the outer periphery of the fan blade 111. The adjacent part of adjacent fans 110 shares the fan frame 112. In this embodiment, this part of the fan frame 112 is defined as the common part 115, and the common part 115 serves as a part of the fan frames 112 of adjacent two fans 110 at the same time.

[0095] In addition, each fan 110 also includes a motor (not shown in the figure), and the motor is usually arranged at the center of the fan blade 111 to drive the fan blade 111 to rotate. In practical applications, the fan 110 may also include other components such as bearings, retaining rings, and magnets for supporting or fixing the fan blade 111, which will not be elaborated here.

[0096] Figure 2aAs shown, the fan group 100 includes three fans 110 arranged in sequence. It can be understood that in practical applications, the fan group 100 may also include two fans 110, four fans 110, or more fans 110. The fans 110 in the fan group 100 are arranged in sequence and adjacent to each other in pairs.

[0097] In addition, Figure 2a As shown, the fans 110 in the fan group 100 are arranged in a linear form. In practical applications, according to the spatial structure of the heat dissipation device 10 in the electronic device 1, the fans 110 in the fan group 100 may also be arranged in a curved form. For example, two adjacent fans 110 in the fan group 100 are arranged vertically at 90°. Hereinafter, the case where the fans 110 in the fan group 100 are arranged in a linear form will be taken as an example for description.

[0098] Among them, as shown in combination with Figure 1 and Figure 2a , the fan frame 112 of the fan 110 may include a bottom plate 1121, a side plate 1122, and a top plate 1123. The bottom plate 1121 and the top plate 1123 are oppositely arranged. The side plate 1122 is connected between the bottom plate 1121 and the top plate 1123, and the side plate 1122 surrounds the periphery of the bottom plate 1121 and the top plate 1123. The bottom plate 1121, the side plate 1122, and the top plate 1123 together enclose an accommodation space. The fan blade 111 is installed in the accommodation space, and there is a gap between the fan blade 111 and the side plate 1122, and this gap forms an air flow channel 114.

[0099] Exemplarily, the fan blade 111 may be installed on the inner wall surface of the bottom plate 1121. Similarly, the motor may also be installed on the bottom plate 1121. An air inlet 1123a may be opened on the top plate 1123. The side plate 1122 may adopt a semi-surrounding structural form. The bottom plate 1121, the side plate 1122, and the top plate 1123 together enclose an air outlet 113. The air outlet 113 is located on the side of the fan 110. Air enters the fan 110 from the air inlet 1123a, and after being accelerated by the fan blade 111, the air flow flows along the air flow channel 114 and is blown out from the air outlet 113 on the side of the fan 110.

[0100] In some embodiments, an air inlet (not shown in the figure) may also be opened on the bottom plate 1121, and air may also enter the fan 110 from the air inlet on one side of the bottom plate 1121. In this way, air enters from both sides of the top plate 1123 and the bottom plate 1121, which can increase the air intake of the fan 110 and improve the heat dissipation efficiency of the fan group 100.

[0101] In practical applications, the fan frame 112 of the fan group 100 can be designed as an integral fan frame 112. That is to say, all the fans 110 in the fan group 100 share a bottom plate 1121, a top plate 1123, and a side plate 1122. The bottom plate 1121, the top plate 1123, and the side plate 1122 can be connected together by bonding or mechanical connection. Among them, the common part 115 of the adjacent parts of the fan frame 112 located between adjacent fans 110 is equivalent to a partition arranged between adjacent fan blades 111, so as to separate the air flow channels 114 of each fan 110 through the common part 115.

[0102] Figure 2b For the cross-sectional view corresponding to A-A of another heat dissipation device when it is in the heat dissipation state Figure 1 shown in. Refer to Figure 2b As shown, in practical applications, especially in some high-power electronic devices 1, in addition to the fan group 100, the heat dissipation device 10 usually further includes a radiator 200. The radiator 200 is installed at the air outlet 113 of each fan 110 of the fan group 100. By means of the radiator 200, the heat dissipation area of the heat dissipation device 10 is increased, and the air convection is accelerated by the fan 110 to improve the heat dissipation efficiency of the heat dissipation device 10.

[0103] Exemplarily, the radiator 200 can be fixedly connected to the fan frame 112 of the fan group 100, or the radiator 200 can also be not connected to the fan group 100, but fixed inside the electronic device 1.

[0104] Among them, the radiator 200 includes a plurality of heat dissipation fins 210, and the heat dissipation fins 210 are arranged at intervals. Refer to Figure 2b As shown, the heat dissipation fins 210 can extend along the thickness direction of the fan group 100 ( Figure 2b the direction perpendicular to the paper surface in the figure), and the heat dissipation fins 210 extend along the arrangement direction of the fans 110. The heat dissipation area of the heat dissipation device 10 can be increased through the heat dissipation fins 210. Moreover, a heat dissipation channel is formed between adjacent heat dissipation fins 210. When the air flow blown out from the air outlet 113 of the fan 110 passes through the heat dissipation channel, the heat of the heat dissipation fins 210 is carried away. The heat dissipation channel can improve the rate of heat exchange, and further, improve the heat dissipation efficiency of the heat dissipation device 10.

[0105] The heat sink 200 generally further includes a heat-conducting substrate (not shown in the figure). The heat-conducting substrate can extend, for example, along the arrangement direction of the fan 110. All the heat-dissipating fins 210 are connected to the heat-conducting substrate, and the heat-dissipating fins 210 are arranged at intervals along the extending direction of the heat-conducting substrate. Exemplarily, the heat-dissipating fins 210 and the heat-conducting substrate can be an integral structure. Among them, the heat-conducting substrate can be connected to the components 32 that need to dissipate heat of the electronic device 1 (such as high-power devices like the central processing unit 321 and the graphics processing unit 322). The heat generated by these components 32 is transferred to the heat-conducting substrate, and the heat-conducting substrate conducts the heat to each heat-dissipating fin 210, and the heat on the heat-dissipating fins 210 is quickly dissipated by the airflow blown out by the fan 110.

[0106] In addition, Figure 2b In, matching the linearly arranged fan 110, the heat-conducting substrate of the heat sink 200 can extend linearly, and the heat-dissipating fins 210 are arranged in a straight line as a whole; it can be understood that for the fan 110 arranged in a curve, the heat-conducting substrate of the heat sink 200 can also extend in a curve, and the heat-dissipating fins 210 are arranged in a curve as a whole.

[0107] Referring to Figure 2a or Figure 2b As shown, in this embodiment, a channel opening (not shown in the figure) is provided on the common part 115 between adjacent fans 110. The channel opening can communicate with the air flow channels 114 of two adjacent fans 110. By providing channel openings on the common part 115 between each two adjacent fans 110, the air flow channels 114 of all the fans 110 in the fan group 100 can be connected. And, a baffle 116 is further connected to the common part 115, and the baffle 116 blocks the channel opening. The baffle 116 is in an openable and closable form. The baffle 116 can be in a state of blocking the channel opening or in a state of opening the channel opening.

[0108] In practical applications, when the fan group 100 is in a heat dissipation state, the baffles 116 on each common part 115 of the fan frame 112 can all be in a state of blocking the channel openings, and each fan 110 operates normally; when the fan group 100 enters the dust removal state, the baffles 116 on each common part 115 of the fan frame 112 are opened in sequence. The fan blades 111 of the fan 110 in the dust removal state rotate, driving the dust to flow in its own air flow channel 114 and being transferred to the air flow channel 114 of the next fan 110 through the opened channel opening. The air flow channels 114 of adjacent fans 110 form a dust transfer channel. In this way, by operating each baffle 116 in sequence, opening each channel opening in sequence, and through the dust transfer channels formed in sequence, the dust is finally accumulated in the fan 110 at the end of the fan group 100. After that, by cleaning the dust accumulated in the fan 110 at the end, the entire fan group 100 can be dusted.

[0109] It should be noted that in this embodiment, the opening directions of the baffles 116 between adjacent fans 110 in the fan group 100 should be kept consistent, and the opening directions of the baffles 116 all face the same side of the fan group 100. In this way, after the baffles 116 are opened in sequence, the dust can be transmitted along the dust transmission channel to one end of the fan group 100 and finally accumulate in the fan 110 at one end of the fan group 100, avoiding the phenomenon of reciprocating transmission of dust.

[0110] Exemplarily, referring to Figure 2a or Figure 2b As shown, in the last fan 110 in the dust transmission direction in the fan group 100, that is, in the last fan 110 in the fan group 100 along the opening direction of the baffle 116, an ash accumulation groove 118 can be provided. Among them, the ash accumulation groove 118 has an ash inlet 1181 and an ash discharge port 1182. The ash inlet 1181 is communicated with the air flow channel 114, and the ash discharge port 1182 is communicated with the outside. After the dust removal is completed, the dust in the fan group 100 accumulates in the ash accumulation groove 118 of this fan 110, and the ash accumulation groove 118 can be communicated with the outside to clean the dust of the fan group 100.

[0111] In this embodiment, by opening a channel port at the adjacent part between adjacent fans 110 in the fan group 100 and setting an openable and closable baffle 116 to block the channel port, when the fan group 100 is in a heat dissipation state, the baffle 116 blocks each channel port to keep each fan 110 in a normal working state; when the fan group 100 enters the dust removal state, each baffle 116 is opened in sequence, and the dust in each fan 110 is transmitted to the adjacent fan 110 through the channel port in sequence, collecting the dust of the fan group 100 into the fan 110 at the end, and achieving the purpose of dust removal for the fan group 100 by cleaning the dust in the end fan 110. This embodiment utilizes the structure of the fan group 100 to form a dust transmission channel between each fan 110. The dust removal method is simple, efficient, and has a good dust removal effect; moreover, the dust only accumulates in the fan 110 at the end of the fan group 100, which has little impact on the heat dissipation performance of the entire fan group 100 and can improve the heat dissipation performance of the fan group 100.

[0112] In order to enhance the dust removal effect of the heat dissipation device 10, an anti-static coating (not shown in the figure) can also be provided on the inner wall surface of the heat dissipation device 10. For example, an anti-static coating is provided on the inner wall surface of the fan 110 or the inner surface of the radiator 200, or an anti-static coating is provided on both the inner wall surface of the fan 110 and the surface of the radiator 200. The anti-static coating can be provided on the surface of the fan blade 111, the inner wall surface of the fan frame 112, the surface of the heat dissipation fins 210, and the surface of the heat conduction substrate close to the outgoing air flow, etc.

[0113] In this way, the adsorption and deposition of dust on the inner wall surface of the heat dissipation device 10 can be effectively reduced, especially the adsorption of dust at the micron level, preventing dust from adhering to the inner wall surface of the heat dissipation device 10. In cooperation with the dust removal process of the fan 110, millimeter-scale fibers and micron-scale dust are concentrated as much as possible in the fan 110 at the end of the fan group 100, so as to improve the dust removal effect of the heat dissipation device 10.

[0114] Exemplarily, the coating material constituting the antistatic coating is, for example, a composite antistatic coating (metal-based, zinc-carbon-based, or metal oxide-based), a surfactant-based coating (sulfonate, phosphate, etc.), or a deposition-based coating (metal-based such as gold and palladium, oxide-based such as indium tin oxide and cadmium tin oxide).

[0115] The following takes Figure 2a the fan group 100 shown in

[0116] Figure 3 as an example to introduce in detail the baffle 116 connected to the fan frame 112. Figure 3 As shown, in this embodiment, the baffle 116 is connected to the common part 115 in a rotatable connection manner. Among them, as shown in combination with Figure 2a and Figure 3 , the two ends of the baffle 116 extending along the circumferential direction of the fan frame 112 (the extending direction of the side plate 1122 of the fan frame 112) are respectively its connection end 1161 and free end 1162. The connection end 1161 of the baffle 116 is rotatably connected to one side wall of the channel opening, and the free end 1162 of the baffle 116 can be connected to or separated from the other side wall of the channel opening.

[0117] Among them, as shown in reference to Figure 2a , a rotating shaft 1121a is connected to the fan frame 112. The rotating shaft 1121a, for example, extends on the inner wall surface of the bottom plate 1121 of the fan frame 112, and the rotating shaft 1121a can be close to one side wall of the channel opening corresponding to the connection end 1161 of the baffle 116. As shown in combination with Figure 3 , a positioning hole 1161a can be opened at the connection end 1161 of the baffle 116. When installing the baffle 116, the rotating shaft 1121a on the bottom plate 1121 of the fan frame 112 passes through the positioning hole 1161a at the connection end 1161 of the baffle 116, and the connection end 1161 of the baffle 116 is sleeved outside the rotating shaft 1121a, so that the connection end 1161 of the baffle 116 rotates around the rotating shaft 1121a. Thus, the free end 1162 of the baffle 116 can rotate to be connected to the other side wall of the channel opening to block the channel opening; or, the free end 1162 of the baffle 116 can be separated from the connection with the side wall of the channel opening to open the channel opening.

[0118] In addition, Figure 2aThe case where the baffles 116 connected to the fan frame 112 are all arranged in the same direction is shown, that is, the connecting ends 1161 of the baffles 116 are all located on the same side, and the free ends 1162 of the baffles 116 are all located on the other side opposite to the connecting ends 1161. Specifically, the figure shows a structural form in which the connecting end 1161 of the baffle 116 is far from the air outlet 113 of the fan 110 and the free end 1162 is close to the air outlet 113. It can be understood that the baffles 116 on the fan frame 112 may also have other layout structures, which are not limited in this embodiment.

[0119] Figure 4a is Figure 2a the partial enlarged view at A in; Figure 4b the structural diagram when the baffle is in the state of opening the channel opening. Refer to Figure 4a As shown, the figure shows the state where the free end 1162 of the baffle 116 is connected to the channel opening. At this time, the baffle 116 is located at the closed position blocking the channel opening; refer to Figure 4b As shown, the figure shows the state where the free end 1162 of the baffle 116 is away from the channel opening 1151. At this time, the baffle 116 is in the position of opening the channel opening 1151.

[0120] In order to maintain the stability of the baffle 116 in the closed position, in some embodiments, the free end 1162 of the baffle 116 can be adsorbed on the side wall of the channel opening 1151 by magnetic adsorption. For example, a first magnetic member 1162a can be provided at the free end 1162 of the baffle 116, and a second magnetic member 1152 can be provided at the corresponding part on the side wall of the channel opening 1151. Through the magnetic force between the first magnetic member 1162a and the second magnetic member 1152, the free end 1162 of the baffle 116 is connected to the side wall of the channel opening 1151.

[0121] Refer to Figure 4a As shown, when the baffle 116 is in the closed position, the first magnetic member 1162a is adsorbed on the second magnetic member 1152. The magnetic force between the first magnetic member 1162a and the second magnetic member 1152 can stably connect the free end 1162 of the baffle 116 to the side wall of the channel opening 1151; refer to Figure 4b As shown, when the baffle 116 is subjected to an external force, for example, when the fan blades 111 of the fan 110 rotate to generate air pressure in the air flow channel 114, and the air pressure acts on the baffle 116, the free end 1162 of the baffle 116 can overcome the magnetic attraction force with the side wall of the channel opening 1151, and the external force pushes the free end 1162 of the baffle 116 to move away from the side wall of the channel opening 1151 to the open position.

[0122] In some other embodiments, the free end 1162 of the baffle 116 and the side wall of the channel opening 1151 can be connected by a snap-fit manner. For example, the free end 1162 of the baffle 116 can have a bent hook structure (not shown in the figure), and the side wall of the channel opening 1151 can have a slot structure that cooperates with the hook structure (not shown in the figure). The hook structure of the baffle 116 is snapped into the slot structure of the side wall of the channel opening 1151 to achieve the connection between the free end 1162 of the baffle 116 and the side wall of the channel opening 1151. Moreover, under the action of an external force such as air pressure, the hook of the baffle 116 can be disengaged from the slot structure of the side wall of the channel opening 1151, so that the baffle 116 rotates to the open position. Among them, the hook structure at the free end 1162 of the baffle 116 can have a certain elasticity, and the hook structure can be snapped into or disengaged from the slot structure through its own elastic deformation.

[0123] Regarding the mating structure between the connecting end 1161 of the baffle 116 and the corresponding side wall of the channel opening 1151, in combination with Figure 3 and Figure 4b as shown, the end face of the connecting end 1161 of the baffle 116 (the side surface of the connecting end 1161 of the baffle 116 facing the side wall of the corresponding side of the channel opening 1151) can be an outwardly convex arc surface 1161b. Correspondingly, the side wall of the channel opening 1151 can have an arc-shaped groove 1153, and the shape of the arc-shaped groove 1153 matches the arc surface 1161b of the baffle 116. The corresponding part of the arc surface 1161b of the connecting end 1161 of the baffle 116 is received in the arc-shaped groove 1153.

[0124] In this way, the connecting end 1161 of the baffle 116 and the side wall of the channel opening 1151 are in a manner of arc surface 1161b mating, which can ensure the smooth rotation of the connecting end 1161 of the baffle 116. Moreover, the gap between the arc surface 1161b of the connecting end 1161 and the arc-shaped groove 1153 of the side wall of the channel opening 1151 is small, uniform and a curved gap. When the baffle 116 is in the closed position of blocking the channel opening 1151, the independence of the air flow path 114 of the adjacent fans 110 can be ensured.

[0125] In addition, in order to limit the opening angle of the baffle 116 and avoid interference between the free end 1162 of the baffle 116 and the fan blade 111, in this embodiment, a mating limiting structure can also be provided between the connecting end 1161 of the baffle 116 and the side wall of the channel opening 1151. The maximum angle when the baffle 116 is opened is limited by the limiting structure, so that when the baffle 116 is in the open position, there is a gap between the free end 1162 of the baffle 116 and the edge of the fan blade 111 to ensure the smooth rotation of the fan blade 111.

[0126] In combination with Figure 3 and Figure 4bAs shown, as an implementation manner, a limit protrusion 1161c can be provided at the connection end 1161 of the baffle 116, and the limit protrusion 1161c extends out on the outer wall of the connection end 1161. When the baffle 116 is opened to a certain angle, the limit protrusion 1161c rotates to abut against the outer edge of the arc-shaped groove 1153 on the side wall of the passage opening 1151 to define the maximum rotation angle of the baffle 116. When the baffle 116 rotates until the limit protrusion 1161c abuts against the outer edge of the arc-shaped groove 1153, it is the open position of the baffle 116. Among them, the outer edge of the arc-shaped groove 1153 refers to the wall surface on the side wall of the passage opening 1151 within a certain distance range extending outward from the edge of the groove opening of the arc-shaped groove 1153; and, in order to ensure that the baffle 116 has a certain rotation space, the limit protrusion 1161c can be located on the wall surface outside the arc surface 1161b of the connection end 1161.

[0127] Taking the Figure 2a fan group 100 shown in as an example, the heat dissipation state of the fan group 100 will be introduced in detail.

[0128] Referring to Figure 2a shown, the throats 117 (the parts with the smallest cross-sectional area of the air flow passage 114 in the fan 110) of the fans 110 in the fan group 100 are all located on the same side. When the fan group 100 is in the normal operating heat dissipation state, the rotation directions of the fan blades 111 of the fans 110 are the same. Taking the Figure 2a structural form shown in as an example, the throats 117 of the fans 110 are located in the upper left side. Starting from the position where the throat 117 is located, the cross-sectional area of the air flow passage 114 of the fan 110 gradually increases in the counterclockwise direction, and finally when it returns to the throat 117, the cross-sectional area of the air flow passage 114 rapidly decreases. Therefore, when the fan group 100 is in the heat dissipation state, the fan blades 111 of the fans 110 usually rotate in the counterclockwise direction. At this time, each baffle 116 is in the closed state of blocking each passage opening 1151.

[0129] For the case where the throats 117 of the fans 110 in the fan group 100 are all located on the same side, for the baffle 116 located between adjacent fans 110, the two sides thereof are respectively the near-throat side (the side closer to the throat 117) and the far-throat side (the side farther from the throat 117) of the adjacent fans 110. Among them, the opening direction of the baffle 116 (shown by the dotted arrow in the figure) can be from the near-throat side to the far-throat side. On the one hand, the space of the air flow passage 114 corresponding to the far-throat side is larger, which is conducive to the baffle 116 opening to a larger angle; on the other hand, the air flow passage 114 corresponding to the near-throat side is narrower and the air pressure is larger, while the air flow passage 114 corresponding to the far-throat side is wider and the air pressure is smaller. Therefore, under the action of the air pressure, it is easy to open the baffle 116 in the direction from the near-throat side to the far-throat side.

[0130] Taking the Figure 2aTaking the arrangement of the fan group 100 in [[]] as an example, for the convenience of description, the fans 110 arranged in the direction from right to left in the fan group 100 are sequentially defined as fan one 110a, fan two 110b, and fan three 110c. Correspondingly, the channel openings 1151 opened in the direction from right to left in the fan frame 112 are sequentially defined as channel opening one 1151a and channel opening two 1151b, and the baffles 116 blocking the channel opening one 1151a and the channel opening two 1151b are respectively defined as baffle one 116a and baffle two 116b. For the structure form of the opening direction of the baffle 116 being from the near throat side to the far throat side, it can be that fan one 110a first enters the dust removal state, baffle one 116a opens first, then fan two 110b enters the dust removal state, baffle two 116b opens, and finally fan three 110c performs dust removal.

[0131] Contrary to opening the baffle 116, in order to ensure that each baffle 116 can stably block the channel opening 1151 when the fan group 100 is in the heat dissipation state, the air pressure on the far throat side of the baffle 116 can be made greater than the air pressure on the near throat side. In this way, the pressure received by the baffle 116 is opposite to its opening direction, which can provide assistance for maintaining the closed state of the baffle 116.

[0132] When the fan group 100 is in the heat dissipation state, in order to provide pressure to the baffle 116 to stably block the channel opening 1151, in this embodiment, along the opening direction of the baffle 116, the rotation speeds of the fans 110 in the fan group 100 increase sequentially. Taking Figure 2a the fan group 100 shown in [[]] as an example, when the fan group 100 is in the heat dissipation state and each fan 110 is running normally, from right to left, the rotation speeds of the fans 110 increase sequentially, and the air pressures in the air flow channels 114 of the fans 110 increase sequentially. In this way, the air pressure on the far throat side of the baffle 116 can be made greater than the air pressure on the near throat side, and this pressure can ensure that the baffle 116 firmly blocks the channel opening 1151.

[0133] The following takes Figure 2a the fan group 100 shown in [[]] as an example to introduce the dust removal state of the fan group 100 in detail.

[0134] It should be noted that in this embodiment, under certain conditions, the fan group 100 can automatically enter the dust removal state. In this way, during the long-term operation of the heat dissipation device 10, the problem of serious dust accumulation in the heat dissipation device 10 can be avoided, and the reliability of the heat dissipation device 10 and the heat dissipation performance of the electronic device 1 can be ensured.

[0135] Exemplarily, when the fan group 100 has been continuously operating for more than a certain period of time since the end of the last dust removal state, the fan group 100 automatically enters the dust removal state. Alternatively, at a specific rotational speed, if the temperature of a specific thermistor (such as a negative temperature coefficient thermistor) provided in the heat dissipation device 10 is higher than the set value, or the junction temperature of a specific device is higher than the set value, then the fan group 100 automatically enters the dust removal state.

[0136] Figure 5a is Figure 2a a schematic structural diagram of the fan group in the first dust removal state in Figure 5b is Figure 2a a schematic structural diagram of the fan group in the second dust removal state in Figure 5c is Figure 2a a schematic structural diagram of the fan group in the third dust removal state in Figure 5d is Figure 2a a schematic structural diagram of the fan group in the fourth dust removal state in Figure 5e is Figure 2a a schematic structural diagram of the fan group in the fifth dust removal state in

[0137] Referring to Figure 5a as shown, first, the fan one 110a enters the dust removal state. At this time, the fan blades 111 of the fan one 110a rotate, and the fan blades 111 of the fan two 110b do not rotate. The air pressure generated in the air flow channel 114 of the fan one 110a pushes the baffle one 116a to rotate to the open position, and the channel opening one 1151a opens. The air flow channels 114 of the fan one 110a and the fan two 110b are interconnected, and a dust transfer channel is formed between the fan one 110a and the fan two 110b. The dust in the fan one 110a enters the fan two 110b through the channel opening one 1151a under the pushing action of the air flow. After a period of time, all the dust in the fan one 110a enters the fan two 110b, and the dust removal of the fan one 110a is completed.

[0138] Referring to Figure 5b as shown, after the dust removal of the fan one 110a is completed, the fan blades 111 of the fan one 110a stop rotating, and the fan blades 111 of the fan two 110b rotate, pushing the baffle one 116a to rotate to the closed position, and the channel opening one 1151a closes.

[0139] During this process, the fan blades 111 of the fan three 110c maintain their counterclockwise rotation direction in the heat dissipation state to maintain the basic heat dissipation capacity of the heat dissipation device 10.

[0140] Referring to Figure 5cAs shown, the second fan 110b enters the dust removal state. At this time, the fan blades 111 of the second fan 110b rotate, while the fan blades 111 of the third fan 110c do not rotate. The air pressure generated in the air flow channel 114 of the second fan 110b pushes the second baffle 116b to rotate to the open position, and the second channel opening 1151b opens. The air flow channels 114 of the second fan 110b and the third fan 110c are interconnected, forming a dust transfer channel between the second fan 110b and the third fan 110c. The dust in the second fan 110b enters the third fan 110c through the second channel opening 1151b under the pushing action of the air flow. After a period of time, all the dust in the second fan 110b enters the third fan 110c, and the dust removal of the second fan 110b is completed.

[0141] During this process, the fan blades 111 of the first fan 110a keep rotating counterclockwise in its heat dissipation state to maintain the basic heat dissipation capacity of the heat dissipation device 10.

[0142] Refer to Figure 5d As shown, after the dust removal of the second fan 110b, the fan blades 111 of the second fan 110b stop rotating, and the fan blades 111 of the third fan 110c rotate, pushing the second baffle 116b to rotate to the closed position, and the second channel opening 1151b closes. At this time, the fan blades 111 of the first fan 110a stop rotating to prevent the first baffle 116a from being pushed open.

[0143] Refer to Figure 5e As shown, the third fan 110c enters the dust removal state. The fan blades 111 of the third fan 110c rotate, and the fan blades 111 drive the dust to flow in the air flow channel 114 along with the air. The solid arrows shown in the figure represent the air flow containing dust, and the dashed arrows represent the air flow separated from the dust. In practical applications, the dust collection tank 118 can be arranged close to the fan frame 112. Since the centrifugal force acting on the dust is large, the dust can be sent into the dust collection tank 118. By cleaning the dust in the dust collection tank 118 out of the electronic device 1, the dust removal process of the electronic device 1 is completed. The clean air flow separated from the dust then continues to be discharged from the air outlet 113 of the third fan 110c. Combining Figure 2b As shown, for the case where the air outlet 113 of the fan group 100 is provided with the radiator 200, the clean air flow is discharged out of the electronic device 1 after passing through the heat dissipation fin 210 area of the radiator 200.

[0144] Among them, in order to smoothly send the dust into the dust collection tank 118, the orientation of the dust inlet 1181 of the dust collection tank 118 should be opposite to the rotation direction of the fan blades 111 in the dust removal state. In this way, when the fan blades 111 rotate to drive the dust to flow in the air flow channel 114, the dust moves towards the dust inlet 1181 of the dust collection tank 118 under the action of the centrifugal force, ensuring that the dust can smoothly enter the dust collection tank 118. Exemplarily, refer to Figure 5eAs shown, for the dust collecting trough 118 disposed on the side of the third fan 110c away from the second fan 110b, and the dust inlet 1181 of the dust collecting trough 118 facing the throat 117 of the fan 110, when the third fan 110c is in the dust removal state, in order to make the rotation direction of the fan blade 111 opposite to the orientation of the dust inlet 1181 of the dust collecting trough 118, the fan blade 111 can rotate counterclockwise.

[0145] At this time, the first baffle 116a remains in the state of closing the first channel opening 1151a, and the second baffle 116b remains in the state of closing the second channel opening 1151b. Therefore, the first fan 110a and the second fan 110b can maintain their counterclockwise rotation directions when in the heat dissipation state to maintain the basic heat dissipation capacity of the heat dissipation device 10.

[0146] It can be understood that if the fan group 100 in the heat dissipation device 10 is a double-fan 110 structure, only a dust removal process similar to that Figures 5c - 5e shown can be performed; if the fan group 100 of the heat dissipation device 10 has more than four fans 110, for each additional fan 110, the added fan 110 and the adjacent fan 110 first perform a dust removal process similar to that Figures 5a - 5b shown, which will not be elaborated here.

[0147] In addition, in order to improve the dust removal efficiency and effect of the fan 110, the fan blades 111 of the fan 110 can first better shake off the dust on the fan blades 111 by alternately rotating forward and backward, and then the fan blades 111 rotate in one direction to send the dust into the next fan 110 through the channel opening 1151. Taking Figure 5a the dust removal state of the first fan 110a shown as an example, the fan blades 111 of the first fan 110a can first rotate in an alternating manner of counterclockwise forward rotation and clockwise reverse rotation to shake off the dust on the fan blades 111 faster and more completely, and then continue to rotate in the same direction to send the dust into the second fan 110b.

[0148] And, as shown in Figure 2a , when the fan group 100 is in the normal operating heat dissipation state, each fan 110 rotates counterclockwise forward. Since the connecting ends 1161 of the baffles 116 are far from the air outlet 113 and the free ends 1162 are close to the air outlet 113, referring to Figure 5a and Figure 5cAs shown, when the first fan 110a and the second fan 110b are dust-removed, the fan blades 111 of the first fan 110a and the second fan 110b can be changed to rotate counterclockwise. In this way, the air flow in the air flow channels 114 of the first fan 110a and the second fan 110b can push open the baffle 116 along the plate surface direction of the baffle 116. The air flow in the first fan 110a can smoothly flow into the second fan 110b through the channel opening 1151, and no eddy current will be generated at the channel opening 1151. Moreover, the dust in the air flow can enter the second fan 110b more quickly and smoothly along the direction of the centrifugal force received, without being blocked by the baffle 116.

[0149] Combined with Figures 5a to 5e As shown, in this embodiment, a channel opening 1151 is provided on the common part 115 between adjacent fans 110, and an openable and closable baffle 116 is connected at the channel opening 1151. By controlling each fan 110 to perform dust removal in sequence, the dust in the previous fan 110 is sequentially transferred backward. Finally, it is collected in the dust collection groove 118 provided in the fan 110 that is the last in the dust transfer direction, and then the dust in the dust collection groove 118 is cleaned out of the heat dissipation device 10. In this way, it can be ensured that the dust in the fan group 100 is cleaned up, the dust removal effect is good, and there is no need to provide a dust collection groove 118 in each fan 110, which has little impact on the heat dissipation performance of other fans 110, and the heat dissipation performance of the fan group 100 can be improved.

[0150] In addition, on this basis, by providing an anti-static coating on the inner wall surface of the heat dissipation device 10, the impedance of the inner wall surface of the heat dissipation device 10 can be reduced to 10 6 ~10 8 Ohm. When the first layer of dust is deposited on the inner wall surface of the heat dissipation device 10, by starting the above dust removal process, the millimeter-scale fibers in the fan 110 and the micron-scale dust adsorbed / deposited on the inner wall surface of the heat dissipation device 10 can be collected into the dust collection groove 118. At the same time, the anti-static coating is prevented from being covered so that the anti-static coating can continue to play a role in subsequent operation.

[0151] Embodiment 2

[0152] Figure 6 It is a top view of another heat dissipation device provided by an embodiment of the present application; Figure 7 is Figure 6 a cross-sectional view taken along B-B when the fan group in the heat dissipation device in

[0153] Combined with Figure 6 and Figure 7 shown, similar to Embodiment 1, the throats 117 of the fans 110 in the fan group 100 of this embodiment are all on the same side, and when the fan group 100 is in the normal heat dissipation state of operation, the rotation directions of the fan blades 111 of the fans 110 are the same. ToFigure 7 Taking the orientation of the fan group 100 shown in [description omitted] as an example, the throat 117 of each fan 110 in the fan group 100 is located at the upper left side. When the fan group 100 is in the heat dissipation state, the fan blades 111 of each fan 110 rotate forward in the counterclockwise direction.

[0154] Among them, when the fan group 100 is in the heat dissipation state, in order to ensure that each baffle 116 can stably block each channel opening 1151, from right to left, the rotational speeds of the fans 110 increase in sequence, and the air pressures in the air flow channels 114 of the fans 110 increase in sequence. In this way, the air pressure on the far-throat side of the baffle 116 can be made greater than the air pressure on the near-throat side, and this pressure can ensure that the baffle 116 firmly blocks the channel opening 1151.

[0155] And, referring to Figure 7 As shown, in this embodiment, the baffles 116 connected to the fan frame 112 of the fan group 100 are also arranged in the same direction. However, different from the first embodiment, the connecting end 1161 of the baffle 116 in this embodiment is close to the air outlet 113 of the fan 110, while the free end 1162 of the baffle 116 is far from the air outlet 113.

[0156] Figure 8a For Figure 7 the structural schematic diagram of the fan group in the first fan dust removal state; Figure 8b For Figure 7 the structural schematic diagram of the fan group in the second fan dust removal state.

[0157] Referring to Figure 8a As shown, since the connecting end 1161 of the baffle 116 is close to the air outlet 113 of the fan 110 and the free end 1162 is far from the air outlet 113, during the dust removal process of the fan group 100, when the first fan 110a performs dust removal, the fan blades 111 of the first fan 110a continue to rotate forward in the counterclockwise direction, and the rotation of the fan blades 111 drives the air flow in the air flow channel 114 to push open the baffle 116 along the plate surface direction of the baffle 116, and the dust in the first fan 110a can also enter the second fan 110b along the baffle 116, and both opening the baffle 116 and conveying the dust are relatively smooth. Similarly, referring to Figure 8b As shown, when the second fan 110b performs dust removal, the fan blades 111 of the second fan 110b can continue to rotate forward in the counterclockwise direction, which will not be elaborated here.

[0158] In other embodiments, when the first fan 110a and the second fan 110b perform dust removal, the fan blades 111 of the first fan 110a and the fan blades 111 of the second fan 110b can also adopt the method of rotating in the clockwise reverse direction for dust removal, and this embodiment does not make any restrictions.

[0159] For other steps in the dust removal process of the fan group 100, they are the same as those in the first embodiment Figure 5b andFigure 5d and Figure 5e The illustration is similar to that shown above, and will not be elaborated here.

[0160] Among them, for both the first fan 110a and the second fan 110b, the counterclockwise forward rotation dust removal method is adopted. The fan group 100 of this embodiment can be applied to a fan group 100 that can only rotate counterclockwise forward. At this time, in order to ensure that the dust in the third fan 110c can smoothly enter the dust accumulation groove 118, the dust accumulation groove 118 can be set at Figure 8b the opposite side of the dust accumulation groove 118 shown in

[0161] Figure 9a That is Figure 7 the partial structure diagram of the fan group in Figure 9b That is Figure 7 the partial structure diagram of the fan group in Figure 9a or Figure 9b shown. Different from setting the limit protrusion 1161c on the outer wall surface of the connection end 1161 of the baffle 116 in the first embodiment to limit the rotation angle of the baffle 116, in this embodiment, the edge of the arc-shaped groove 1153 provided on the side wall of the channel port 1151 has a limit boss 1154. When the baffle 116 rotates to a certain angle, the outer wall surface of the baffle 116 abuts against the limit boss 1154. At this time, the baffle 116 is in the open position.

[0162] It can be understood that the arc surface 1161b of the connection end 1161 of the baffle 116 can rotate and slide in the arc-shaped groove 1153, and when the wall surface of the baffle 116 outside its arc surface 1161b abuts against the limit boss 1154 at the edge of the arc-shaped groove 1153, the further rotation of the baffle 116 can be restricted to limit the baffle 116 at this position.

[0163] Embodiment Three

[0164] Figure 10 is the top view of the third heat dissipation device provided by the embodiment of the present application; Figure 11 That is Figure 10 the front view of the fan group in the heat dissipation device in

[0165] Combined with Figure 10 and Figure 11 shown, different from the fan group 100 in the first embodiment and the second embodiment, in this embodiment, the throats 117 of at least one fan 110 in the fan group 100 are arranged opposite to the throats 117 of its adjacent fans 110. That is to say, there is a situation where the rotation directions of two adjacent fans 110 in the fan group 100 are opposite in the heat dissipation state.

[0166] Exemplarily, Figure 11 as shown in Figure 11 , the throats 117 of both the first fan 110a and the third fan 110c are located on the right side in the illustrated direction, while the throat 117 of the second fan 110b is located on the left side in the illustrated direction, and the throats 117 of the second fan 110b and the third fan 110c face each other. In this regard, when the fan group 100 is in the heat dissipation state, both the first fan 110a and the third fan 110c rotate in the clockwise direction, while the second fan 110b rotates in the counterclockwise direction.

[0167] Since the opening directions of both the first baffle 116a and the second baffle 116b are from the first fan 110a towards the third fan 110c, thus, when the fan group 100 is in the heat dissipation state, from the first fan 110a to the third fan 110c, the rotational speeds of the respective fans 110 can increase in sequence to ensure that the baffle 116 stably blocks the channel opening 1151.

[0168] In addition, since the rotation directions of the fan blades 111 of adjacent fans 110 are opposite, in order to make the conversion of each fan 110 from the heat dissipation state to the dust removal state simpler and more convenient, the connection structure of each baffle 116 can be designed according to the rotation conditions of adjacent fans 110. For example, among the respective baffles 116, there is at least one baffle 116 whose connection end 1161 is arranged on the opposite side (different side) from the connection ends of other baffles 116.

[0169] Taking Figure 11 the fan group 100 shown in Figure 11 as an example, the connection end 1161 of the first baffle 116a can be far from the air outlet 113 and the free end 1162 can be close to the air outlet 113. The second baffle 116b is arranged in the opposite direction to the first baffle 116a, and the connection end 1161 of the second baffle 116b is close to the air outlet 113 and the free end 1162 is far from the air outlet 113. Thus, during the dust removal process, the first fan 110a and the second fan 110b do not need to adjust the rotation direction of the fan blades 111 of the fan 110. The following will introduce in detail Figure 10 the dust removal process of the fan group 100 shown in Figure 10 .

[0170] Figure 12a For Figure 10 the C-C cross-sectional view of the fan group in the first dust removal state in Figure 10 ; Figure 12b For Figure 10 the C-C cross-sectional view of the fan group in the second dust removal state in Figure 10 ; Figure 12c For Figure 10 the C-C cross-sectional view of the fan group in the third dust removal state in Figure 10 ; Figure 12d For Figure 10 the C-C cross-sectional view of the fan group in the fourth dust removal state in Figure 10 ; Figure 12e For Figure 10 a C-C cross-sectional view of the fan group in the fifth dust removal state in Figure 10 ; Figure 12fAnother C-C cross-sectional view of the fan group in Figure 10 under the fifth dust removal state. Figure 10 As shown in and

[0171] , when the first fan 110a is removing dust, the fan blades 111 of the first fan 110a rotate, while the fan blades 111 of the second fan 110b do not rotate. And the first fan 110a can continue to rotate in the clockwise direction as in the heat dissipation state, so as to smoothly push open the first baffle 116a along the plate surface direction of the first baffle 116a, and the first channel opening 1151a is opened. The dust in the first fan 110a can smoothly enter the second fan 110b along the plate surface of the first baffle 116a. After a period of time, the dust removal of the first fan 110a is completed.

[0171] Refer to Figure 12a As shown in Figure 12a , when the first fan 110a is removing dust, the fan blades 111 of the first fan 110a rotate, while the fan blades 111 of the second fan 110b do not rotate. And the first fan 110a can continue to rotate in the clockwise direction as in the heat dissipation state, so as to smoothly push open the first baffle 116a along the plate surface direction of the first baffle 116a, and the first channel opening 1151a is opened. The dust in the first fan 110a can smoothly enter the second fan 110b along the plate surface of the first baffle 116a. After a period of time, the dust removal of the first fan 110a is completed.

[0172] Refer to Figure 12b As shown in Figure 12b , after the dust removal of the first fan 110a is completed, the fan blades 111 of the first fan 110a stop rotating, and the fan blades 111 of the second fan 110b rotate. And the fan blades 111 of the second fan 110b can continue to rotate in the counterclockwise direction as in the heat dissipation state. The air flow in the air flow channel 114 of the second fan 110b can act more on the plate surface of the first baffle 116a, so as to quickly and smoothly push the first baffle 116a to rotate to the closed position, and the first channel opening 1151a is closed.

[0173] During this period, the fan blades 111 of the third fan 110c keep rotating in the clockwise direction as in the heat dissipation state to maintain the basic heat dissipation capacity of the heat dissipation device 10.

[0174] Refer to Figure 12c As shown in Figure 12c , when the second fan 110b enters the dust removal state, the fan blades 111 of the second fan 110b rotate, while the fan blades 111 of the third fan 110c do not rotate. And the fan blades 111 of the second fan 110b continue to rotate in the clockwise direction, so as to smoothly push open the second baffle 116b along the plate surface direction of the second baffle 116b, and the second channel opening 1151b is opened. The dust in the second fan 110b can smoothly enter the third fan 110c along the plate surface of the second baffle 116b. After a period of time, the dust removal of the second fan 110b is completed.

[0175] During this period, the fan blades 111 of the first fan 110a keep rotating in the clockwise direction as in the heat dissipation state to maintain the basic heat dissipation capacity of the heat dissipation device 10.

[0176] Refer to Figure 12dAs shown, after the dust removal of the second fan 110b is completed, the fan blades 111 of the second fan 110b stop rotating, and the fan blades 111 of the third fan 110c rotate. Moreover, the fan blades 111 of the third fan 110c can continue to rotate in the clockwise direction when in the heat dissipation state. The airflow in the air flow channel 114 of the third fan 110c can act more on the plate surface of the second baffle 116b, so as to quickly and smoothly push the second baffle 116b to rotate to the closed position, and the second channel opening 1151b is closed.

[0177] Refer to Figure 12e and Figure 12f As shown, the third fan 110c enters the dust removal state. The fan blades 111 of the third fan 110c rotate, and the fan blades 111 drive the dust to flow in the air flow channel 114 along with the air. The solid arrows shown in the figure represent the airflow containing dust, and the dashed arrows represent the airflow separated from the dust. Since the centrifugal force received by the dust is large, the dust can be sent into the dust accumulation groove 118 of the third fan 110c. By cleaning the dust in the dust accumulation groove 118 out of the electronic device 1, the dust removal process of the electronic device 1 is completed. The clean airflow separated from the dust then continues to be discharged from the air outlet 113 of the third fan 110c. Combining Figure 2b As shown, for the case where the radiator 200 is provided at the air outlet 113 of the fan group 100, the clean airflow is discharged outside the electronic device 1 after passing through the heat dissipation fin 210 area of the radiator 200.

[0178] Among them, refer to Figure 12e As shown, for the case where the throats 117 of the second fan 110b and the third fan 110c are arranged oppositely, the thickness space occupied by the common part 115 between the second fan 110b and the third fan 110c can be relatively large. Therefore, the dust accumulation groove 118 can be arranged by using the space of the common part 115, that is to say, the dust accumulation groove 118 can be opened on the common part 115. In this regard, in order to make the dust enter the dust accumulation groove 118 opened on the common part 115 more smoothly, when the third fan 110c performs dust removal, the fan blades 111 of the third fan 110c can rotate reversely in the counterclockwise direction, so that the airflow in the air flow channel 114 of the third fan 110c flows directly towards the dust inlet 1181 of the dust accumulation groove 118, and the dust in the third fan 110c can smoothly enter the dust accumulation groove 118 under the action of the centrifugal force.

[0179] Refer to Figure 12fAs shown, in addition to providing the dust accumulation groove 118 on the common part 115 between the second fan 110b and the third fan 110c, a dust accumulation groove 118 can also be provided on the side of the third fan 110c away from the second fan 110b. At this time, when the third fan 110c removes dust, the fan blades 111 of the third fan 110c can continue to rotate in the clockwise direction in the heat dissipation state. The air flow in the air flow channel 114 of the third fan 110c flows directly toward the dust inlet 1181 of the dust accumulation groove 118, and the dust in the third fan 110c can smoothly enter the dust accumulation groove 118 under the action of centrifugal force.

[0180] It can be understood that for Figure 12f the structural form in which the dust accumulation groove 118 in the third fan 110c shown is located on the side of the third fan 110c away from the second fan 110b, in combination with Figures 12a - 12d , since each fan 110 rotates in the same direction whether in the heat dissipation state or the dust removal state, it can thus be applied to the case where each fan 110 in the fan group 100 can only rotate in one direction.

[0181] Embodiment 4

[0182] This embodiment mainly describes the structural form of the dust accumulation groove 118 in the last fan 110 in the dust transfer direction in the fan group 100 and the way in which the dust accumulation groove 118 communicates with the outside.

[0183] Figure 13 It is a dust removal structure diagram of a heat dissipation device provided by an embodiment of the present application; Figure 14 It is another dust removal structure diagram of a heat dissipation device provided by an embodiment of the present application; Figure 15a It is Figure 13 a left view when the dust cleaning door of the fan group in Figure 15b It is Figure 13 a left view when the dust cleaning door of the fan group in Figure 16 It is a third dust removal structure diagram of a heat dissipation device provided by an embodiment of the present application; Figure 17a It is Figure 16 a top view when the dust cleaning door of the fan group in Figure 17b It is Figure 16 a top view when the dust cleaning door of the fan group in Figure 17c It is Figure 16 a partial enlarged view of the heat dissipation device in

[0184] The dust accumulation groove 118 in the last fan 110 in the dust transfer direction in the fan group 100 (hereinafter, the third fan 110c in the figure is taken as an example for description) can be formed in different ways. Refer to Figure 13As shown, as a possible implementation, a partition wall 1121b protrudes from the inner wall surface of the fan frame 112 (for example, the inner wall surface of the bottom plate 1121 of the fan frame 112). The partition wall 1121b and the bottom plate 1121, side plates 1122, and top plate 1123 of the fan frame 112 together enclose an ash accumulation groove 118. Among them, there is a gap between the partition wall 1121b and the edge of the fan blade 111, so that the ash accumulation groove 118 communicates with the air flow passage 114 of the fan 110, forming an ash inlet 1181 of the ash accumulation groove 118.

[0185] Referring to Figure 11 As shown, in combination with what is described in Embodiment 3, for the case where the common part 115 between adjacent fans 110 occupies a large space, the ash accumulation groove 118 can also be opened in the common part 115.

[0186] Whether it is the ash accumulation groove 118 formed by the partition wall 1121b and the fan frame 112 together, or the ash accumulation groove 118 formed in the common part 115, the ash accumulation groove 118 can be connected to the outside in the same way. Hereinafter, the ash accumulation groove 118 formed by the partition wall 1121b and the fan frame 112 together is taken as an example for description.

[0187] Continuing to refer to Figure 13 As shown, in some embodiments, for the ash accumulation groove 118 provided at the air outlet 113 of the fan 110, the ash discharge port 1182 of the ash accumulation groove 118 can face the air outlet 113, and the ash accumulation groove 118 can be connected to the outside through the radiator 200 located on one side of the air outlet 113 of the fan 110. For example, an avoidance notch 220 can be provided in the radiator 200, and the avoidance notch 220 corresponds to and communicates with the ash discharge port 1182 of the ash accumulation groove 118. During the dust removal process of the fan three 110c, the dust directly discharges from the avoidance notch 220 of the radiator 200.

[0188] Referring to Figure 14 As shown, in addition to the way of providing the avoidance notch 220 communicating with the ash accumulation groove 118 on the radiator 200, the ash discharge port (not shown in the figure) of the ash accumulation groove 118 can also be opened on the fan frame 112. By connecting a dust cleaning door 119 to the fan frame 112, the dust cleaning door 119 blocks the ash discharge port usually. When it is necessary to clean the accumulated ash, the dust cleaning door 119 is opened to clean the dust in the ash accumulation groove 118 out of the heat dissipation device 10.

[0189] In order to make the dust easier to discharge from the ash discharge port, the ash discharge port of the ash accumulation groove 118 and the dust cleaning door 119 can be set according to the gravity direction of the fan group 100. The ash discharge port of the ash accumulation groove 118 can be located at the bottom in the gravity direction of the fan group 100, and the dust cleaning door 119 is provided at the bottom in the gravity direction of the fan group 100. In this way, after the dust cleaning door 119 is opened, the dust can automatically discharge from the ash discharge port under the action of gravity, and it is relatively easy to clean the accumulated ash.

[0190] Of course, when it is not convenient to set the ash discharge port of the dust accumulation tank 118 according to the gravity direction of the fan group 100, it is only necessary to ensure that the ash discharge port of the dust accumulation tank 118 is located on the outer wall surface of the fan frame 112, and the ash cleaning door 119 is exposed outside the fan frame 112, so that it is convenient to open the ash cleaning door 119 to manually clean the accumulated dust.

[0191] Exemplarily, the ash cleaning door 119 can be connected to the fan frame 112 by a rotational connection. For example, one end of the ash cleaning door 119 is connected to one side wall of the ash discharge port through a rotating shaft, and the other end of the ash cleaning door 119 can be connected to the other side wall of the ash discharge port by a clamping method.

[0192] Continue to refer to Figure 14 As shown, taking the gravity direction of the fan group 100 shown in the figure being perpendicular to the paper surface and outward as an example, for example, the bottom of the gravity direction of the fan group 100 is the top plate 1123 of the fan frame 112, and the bottom of the gravity direction of the fan group 100 is the side where the air inlet 1123a is located. At this time, the ash discharge port of the dust accumulation tank 118 can be opened on the top plate 1123 of the fan frame 112, and the ash cleaning door 119 is connected to the top plate 1123 of the fan frame 112.

[0193] Among them, referring to Figure 15a As shown, when the fan group 100 is operating normally in the heat dissipation state, the ash cleaning door 119 is in a state of closing the ash discharge port; referring to Figure 15b As shown, when it is necessary to clean the accumulated dust of the fan group 100, open the ash cleaning door 119 to expose the ash discharge port 1182, and clean the dust in the dust accumulation tank 118 out of the heat dissipation device 10. Among them, the ash cleaning door 119 can be opened towards the outside of the fan frame 112, which is convenient for cleaning the dust in the dust accumulation tank 118 outwards.

[0194] Refer to Figure 16 As shown, taking the gravity direction of the fan group 100 shown in the figure being towards the left as an example, the bottom of the gravity direction of the fan group 100 can be the side plate 1122 of the fan frame 112 of the end fan 110. At this time, the ash discharge port of the dust accumulation tank 118 can be opened on the corresponding side plate 1122 of the fan frame 112, and the ash cleaning door 119 is connected to the side plate 1122 of the fan frame 112.

[0195] Among them, referring to Figure 17a As shown, when the fan group 100 is operating normally in the heat dissipation state, the ash cleaning door 119 is in a state of closing the ash discharge port; referring to Figure 17b As shown, when it is necessary to clean the accumulated dust of the fan group 100, open the ash cleaning door 119 to expose the ash discharge port 1182, and clean the dust in the dust accumulation tank 118 out of the heat dissipation device 10.

[0196] Figure 17c Shows Figure 16A specific structure of the dust cleaning door 119 of the fan group 100 in Figure 17c As shown, the ash discharge port 1182 is opened on the side plate 1122 of the fan frame 112. One end of the dust cleaning door 119 is rotatably connected to one side wall of the ash discharge port 1182. A buckle portion 1191 is provided at the other end of the dust cleaning door 119. A clamping groove 1182a is correspondingly provided on the other side wall of the ash discharge port 1182. The buckle portion 1191 of the dust cleaning door 119 can be snapped into or disengaged from the clamping groove 1182a to close or open the ash discharge port 1182.

[0197] Embodiment Five

[0198] Figure 18 is a schematic diagram of an electronic device provided by an embodiment of the present application. Refer to Figure 18 As shown, this embodiment provides an electronic device 1. The electronic device 1 includes a housing 20. A circuit board assembly 30, a heat conducting member 40, and the heat dissipation device 10 described in any one of Embodiments One to Four are provided inside the housing 20.

[0199] A plurality of components 32 are provided on the circuit board assembly 30. The heat dissipation device 10 is used to dissipate heat from the components 32 on the circuit board 31. Among them, the heat dissipation device 10 is mainly used to dissipate heat from some high-power components to accelerate the heat dissipation efficiency of these high-power components and ensure the working performance of high-power components.

[0200] Exemplarily, the heat dissipation device 10 can be arranged adjacent to the circuit board 31. The radiator 200 of the heat dissipation device 10 and the components 32 (such as high-power components) on the circuit board 31 are connected through the heat conducting member 40. The heat of the components 32 is transferred to the radiator 200 through the heat conducting member 40. The radiator 200 conducts the heat to all the heat dissipation fins 210. The airflow blown out from the air outlet 113 of the fan group 100 accelerates the dissipation of the heat on the heat dissipation fins 210 to the outside.

[0201] In some embodiments, the heat conducting member 40 connected between the component 32 and the radiator 200 can be a heat pipe. The heat pipe has good heat conduction performance and low cost. The heat of the component 32 is quickly transferred to the radiator 200 through the heat pipe, which can accelerate the heat dissipation efficiency of the component 32 and improve the working performance of the component 32. In other embodiments, a vapor chamber (VC) or a metal plate (such as an aluminum plate) with good heat conduction performance can also be used as the heat conducting member 40. This embodiment does not make any restrictions.

[0202] With Figure 18Taking the components 32 arranged on the circuit board 31 shown in the figure as an example, the components 32 include a central processing unit (CPU) 321, a graphics processing unit (GPU) 322, a memory chip 323, a solid state drive (SSD) 324, a first power management chip 325, a second power management chip 326, and a charging chip 327. The figure shows the connection of the heat conducting member 40 to the high-power central processing unit 321 and the graphics processing unit 322. In other embodiments, the heat conducting member 40 can also be connected to other components 32 such as the memory chip 323, the first power management chip 325, or the second power management chip 326.

[0203] In addition, an interface 328 for connecting to an external device can be provided on the circuit board 31, and components such as a battery 50, a first sound cavity unit 60, and a second sound cavity unit 70 can also be provided inside the housing 20 of the electronic device 1.

[0204] It can be understood that the terms indicating directions such as up, down, above, below, upper, lower, top, bottom, top end, bottom end, top end face, and bottom end face in this embodiment are based on the positional relationship in the installation and use state of the device or equipment.

[0205] In this specification, the embodiments or implementation manners are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0206] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device, characterized in that, It includes at least one set of fan groups, and each fan group includes a plurality of fans arranged in sequence; each fan includes fan blades and a fan frame, the fan frame surrounds the outer periphery of the fan blades and forms an air outlet, and there is an air flow channel between the fan blades and the fan frame; The fan frame includes a common part, and the common part is located between adjacent fans; a channel opening communicating with adjacent air flow channels is formed on the common part, and an openable and closable baffle is connected to the common part, and the baffle blocks or opens the channel opening; wherein, the opening directions of all the baffles are all towards the same side of the fan group; The two ends of the baffle extending along the circumferential direction of the fan frame are respectively a connection end and a free end, the connection end is rotatably connected to one side wall of the channel opening, and the free end is connected to the other side wall of the channel opening or disengages from the connection with the other side wall of the channel opening; A first magnetic member is provided at the free end of the baffle, and a second magnetic member is provided on the side wall of the channel opening, and the first magnetic member and the second magnetic member attract each other; The throats of the fans in the fan group are all located on the same side of the fans; The two opposite sides of the baffle are respectively a first side and a second side, the first side is the side close to the throat corresponding to the fan, the second side is the side far from the throat corresponding to the fan, and the opening direction of the baffle is from the side close to the throat to the side far from the throat.

2. The heat dissipation device according to claim 1, characterized in that, The connection ends of all the baffles are connected to the same side wall of the channel opening, or the connection ends of at least one baffle and the connection ends of other baffles are respectively located on different sides corresponding to the channel opening.

3. The heat dissipation device according to claim 1 or 2, characterized in that, The fan frame is connected with a rotating shaft, the rotating shaft is close to the side wall of the channel opening, and the connection end of the baffle is sleeved on the rotating shaft.

4. The heat dissipation device according to claim 1 or 2, characterized in that, The end face of the connection end of the baffle is an arc surface, and the side wall of the channel opening has an arc-shaped groove matching the arc surface, and the connection end is accommodated in the arc-shaped groove.

5. The heat dissipation device according to claim 4, characterized in that, A limiting structure is provided between the connection end of the baffle and the side wall of the channel opening, and the limiting structure is used to limit the maximum rotation angle of the baffle.

6. The heat dissipation device according to claim 5, characterized in that, The limiting structure includes a limiting protrusion protruding from the outer wall of the connection end of the baffle, and the limiting protrusion is connected to the wall surface outside the arc surface; When the baffle is in the state of opening the channel opening, the limiting protrusion abuts against the outer edge of the arc-shaped groove.

7. The heat dissipation device according to claim 5, characterized in that, The limiting structure includes a limiting boss located at the edge of the arc-shaped groove. When the baffle is in the state of opening the channel opening, the wall surface outside the arc surface of the baffle abuts against the limiting boss.

8. The heat dissipation device according to claim 1 or 2, characterized in that, When the fan group is in a heat dissipation state, along the opening direction of the baffle, the rotation speeds of the fans in the fan group increase in sequence.

9. The heat dissipation device according to claim 1 or 2, characterized in that, The throats of at least one of the fans in the fan group are arranged opposite to the throats of its adjacent fans.

10. The heat dissipation device according to claim 1 or 2, characterized in that, Along the opening direction of the baffle, the last fan in the fan group has a dust accumulation groove; The dust accumulation groove has a dust inlet and a dust outlet communicating with each other, the dust inlet is communicated with the air flow channel, and the dust outlet is communicated with the outside.

11. The heat dissipation device according to claim 10, characterized in that, In the last fan, the orientation of the dust inlet of the dust accumulation groove is opposite to the rotation direction of the fan blades in the dust removal state.

12. The heat dissipation device according to claim 11, characterized in that, A partition wall extends from the inner wall surface of the fan frame. There is a gap between the end of the partition wall and the fan blade. The partition wall and the fan frame jointly enclose the dust accumulation groove.

13. The heat dissipation device according to claim 11, characterized in that, The dust accumulation groove is formed in the common part.

14. The heat dissipation device according to claim 10, characterized in that, The ash discharge port is formed in the fan frame. An ash cleaning door that can be opened and closed is connected to the fan frame. The ash cleaning door blocks or opens the ash discharge port.

15. The heat dissipation device according to claim 14, characterized in that, The ash discharge port is formed in the bottom wall surface of the fan frame in the direction of gravity.

16. The heat dissipation device according to claim 10, characterized in that, It further includes a radiator. The radiator is located at the air outlet of each fan in the fan group. The radiator includes a plurality of heat dissipation fins arranged at intervals.

17. The heat dissipation device according to claim 16, wherein, The ash discharge port is communicated with the air outlet of the fan. An avoidance port is provided in the radiator. The avoidance port is communicated with the ash discharge port.

18. The heat dissipation device according to claim 16, wherein, At least one of the surface of the fan blade, the inner wall surface of the fan frame, and the surface of the radiator is provided with an anti-static coating.

19. The heat dissipation device according to claim 1 or 2, wherein, The fan frame includes a bottom plate, side plates, and a top plate. The bottom plate and the top plate are oppositely arranged. The side plates are connected between the bottom plate and the top plate, and the side plates surround the periphery of the bottom plate and the top plate. The fan blade is connected to the inner wall surface of the bottom plate. The top plate is provided with an air inlet. At least a part of the fan blade is exposed in the air inlet. The bottom plate, the side plates, and the top plate jointly enclose the air outlet. The gap between the fan blade and the side plate forms the air flow channel.

20. The heat dissipation device according to claim 1 or 2, wherein, Each fan in the fan group is arranged in a straight line.

21. An electronic device, wherein, It includes a circuit board assembly, a heat conducting member, and the heat dissipation device according to any one of claims 1-20. The circuit board assembly includes a circuit board and a plurality of components arranged on the circuit board. The heat conducting member is connected between the heat dissipation device and at least some of the components.

22. The electronic device according to claim 21, wherein, The heat conducting member is a heat pipe.

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