Low thermal resistance phase change heat sink

Abstract

The present application discloses a low thermal resistance phase change heat sink, which includes a shell unit and a heat dissipation unit. One end of the shell unit is used to contact the target electronic device, and the other end of the shell unit is provided with the heat dissipation unit, and the heat dissipation unit runs through the shell unit; that is, the heat dissipation unit includes a condensation zone located in the internal bearing cavity of the shell unit and a heat dissipation zone located outside the shell unit, and the condensation zone and the heat dissipation zone are integrally formed, so that liquid-cooled phase change heat dissipation of the target electronic device can be achieved by using a phase change liquid with a lower boiling point placed in the bearing cavity; compared with the structure of welding the heat dissipation unit on the shell unit, the low thermal resistance phase change heat sink of this embodiment can greatly reduce the thermal resistance in the heat dissipation process, improve the heat transfer efficiency, and then improve the heat dissipation efficiency, solve the technical problem that the heat dissipation efficiency of the existing liquid-cooled phase change heat sink is still low, can be compatible with target electronic devices with different power densities, and has a simple structure, strong adaptability and low cost.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a low thermal resistance phase change heat sink. Background Art

[0002] With the development of technology, electronic devices are gradually developing towards high performance and high integration, which leads to the continuous increase of heat flux density of electronic devices, thus putting forward higher requirements for the heat dissipation of electronic devices.

[0003] Since traditional air cooling can no longer meet the above-mentioned heat dissipation requirements, existing electronic devices have gradually adopted liquid-cooled phase change heat dissipation technology, that is, a low-boiling point coolant is used as a phase change working fluid. The phase change working fluid absorbs heat at the heat source end and changes from liquid to gas. The gaseous phase change working fluid then releases heat at the heat dissipation end and changes to liquid and flows back to the heat source end. This reciprocating cycle realizes liquid-cooled phase change heat dissipation.

[0004] However, the existing method of increasing the heat sink area has limited effect on improving the heat dissipation efficiency, and the heat dissipation efficiency of the liquid-cooled phase change heat sink is still relatively low. Summary of the invention

[0005] In response to at least one aspect of the above-mentioned technical problems, an embodiment of the present application provides a low thermal resistance phase change heat sink, which utilizes a heat dissipation unit that penetrates the shell unit to directly contact the phase change liquid inside the bearing cavity, thereby improving the heat transfer efficiency by reducing the thermal resistance, thereby improving the heat dissipation efficiency.

[0006] The embodiment of the present application provides a low thermal resistance phase change heat sink, and the low thermal resistance phase change heat sink comprises:

[0007] A housing unit, wherein the interior of the housing unit has a bearing cavity extending along a first direction, and a first end of the housing unit along the first direction is used to contact a target electronic device;

[0008] a heat dissipation unit, the heat dissipation unit being arranged at a second end of the housing unit along the first direction;

[0009] Wherein, the bearing cavity is used to bear the phase change liquid;

[0010] The heat dissipation unit passes through the housing unit, and the heat dissipation unit includes a condensation area located in the bearing cavity and a heat dissipation area located outside the housing unit, and the condensation area and the heat dissipation area are integrally formed;

[0011] So that the low thermal resistance phase change heat sink can dissipate heat for the target electronic device.

[0012] In one embodiment, the housing unit includes a carrying housing and a sealing cover arranged up and down along the first direction, the carrying housing is provided with an opening, the sealing cover is used to seal the carrying housing, and the outer bottom surface of the carrying housing is used to contact the target electronic device.

[0013] In one embodiment, thermal conductive silicone grease is coated between the outer bottom surface and the target electronic device.

[0014] In one embodiment, the heat dissipation unit includes a heat dissipation fin, the heat dissipation fin extends divergently along a plane perpendicular to the first direction, and the heat dissipation fin includes the condensation area and the heat dissipation area which are integrally formed.

[0015] In one embodiment, the condensation zone is provided with a reflux tip facing the phase change liquid.

[0016] In one embodiment, the heat dissipation area includes a plurality of heat dissipation arms, and the plurality of heat dissipation arms are arranged circumferentially relative to the first direction.

[0017] In one embodiment, the heat dissipation unit includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are stacked along the first direction.

[0018] In one embodiment, the low thermal resistance phase change heat sink further includes:

[0019] A liquid return unit, the liquid return unit is arranged in the bearing cavity;

[0020] A first end of the liquid return unit along the first direction is connected to the condensation zone, and a second end of the liquid return unit along the first direction extends into the phase change liquid.

[0021] In one embodiment, the liquid return unit comprises a liquid wick, and the liquid wick is made of a capillary porous material.

[0022] In one embodiment, the liquid return unit comprises a liquid wick extending along the first direction;

[0023] The condensation area includes a plurality of clamping arms extending in a radial direction of the first direction. The plurality of clamping arms are arranged circumferentially relative to the first direction so that the plurality of clamping arms clamp the liquid absorbent core.

[0024] In one embodiment, the outer diameter of the clamping arm gradually decreases from an end close to the heat dissipation zone to an end close to the liquid wick.

[0025] In one embodiment, the bearing chamber is in a negative pressure state.

[0026] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0027] An embodiment of the present application provides a low thermal resistance phase change heat sink, which includes a shell unit and a heat dissipation unit. One end of the shell unit is used to contact the target electronic device, and the other end of the shell unit is provided with the heat dissipation unit, and the heat dissipation unit runs through the shell unit; that is, the heat dissipation unit includes a condensation zone located in a bearing cavity inside the shell unit and a heat dissipation zone located outside the shell unit, and the condensation zone and the heat dissipation zone are integrally formed. In this way, liquid-cooled phase change heat dissipation of the target electronic device can be achieved by using a phase change liquid with a lower boiling point placed in the bearing cavity.

[0028] That is to say, in the low thermal resistance phase change heat sink of the present embodiment, the liquid phase change fluid first absorbs heat from the target electronic device at one end of the shell unit, and the liquid phase change fluid is rapidly boiled by the heat to become a gas, and the gaseous phase change medium can directly release heat on the surface of the condensation zone of the heat dissipation unit and condense back into a liquid state, and then flow back into the liquid phase change fluid by gravity; it can be understood that since the gaseous phase change medium can directly contact the condensation zone, and the internal condensation zone and the external heat dissipation zone are integrally formed, the heat released by the gaseous phase change medium in the condensation zone can be directly conducted to the heat dissipation zone for heat dissipation. Compared with the structure of welding the heat dissipation unit on the shell unit, the low thermal resistance phase change heat sink of the present embodiment can greatly reduce the thermal resistance in the heat dissipation process, improve the heat transfer efficiency, and then improve the heat dissipation efficiency, solve the technical problem that the heat dissipation efficiency of the existing liquid-cooled phase change heat sink is still low, can be compatible with target electronic devices with different power densities, has a simple structure, strong adaptability and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0030] Figure 1 It is a schematic diagram of the cross-sectional structure of the low thermal resistance phase change heat sink described in the embodiment of the present application.

[0031] Figure 2 Schematic diagram of the structure of the low thermal resistance phase change heat sink described in the embodiment of the present application.

[0032] Figure 3 This is a schematic diagram of the structure in which the condensation zone in the embodiment of the present application is provided with the reflux tip.

[0033] Figure 4 It is a schematic diagram of the structure of a plurality of heat sinks stacked in an embodiment of the present application.

[0034] Figure 5 Schematic diagram of the structure of the liquid return unit described in the embodiment of the present application.

[0035] Figure 6 for Figure 5 Schematic diagram of the assembly structure.

[0036] Wherein, the reference numerals are:

[0037] 10-housing unit, 11-bearing cavity, 12-bearing housing, 13-sealing cover,

[0038] 20- cooling unit, 21- condensation zone, 22- cooling zone, 23- heat sink, 24- reflux tip, 25- cooling arm, 26- clamping arm,

[0039] 30-Liquid return unit,

[0040] 40-Phase change fluid,

[0041] 50- Thermal grease,

[0042] 60-Target Electronics,

[0043] X - first direction. DETAILED DESCRIPTION

[0044] In order to better understand the above technical solution, the example embodiments of the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited to the exemplary embodiments described here.

[0045] With the advancement of modernization, the electronic device industry is gradually developing towards high performance and high integration, such as high-power LEDs and 5G chips. The ultra-high heat flux density makes the heat dissipation problem more prominent. If the chip heat dissipation problem cannot be effectively solved, the product performance and reliability will be greatly reduced.

[0046] At present, the traditional method in the industry is to use heat pipe radiators to dissipate chip heat. However, this method requires the chip heat to pass through the heat pipe and then be transferred to the radiator. The radiator and the heat pipe are usually connected by welding. Due to the large thermal resistance at the welding point, the heat transfer efficiency is low, resulting in reduced heat dissipation efficiency.

[0047] In response to the above situation, an embodiment of the present application provides a low thermal resistance phase change heat sink, which passes the heat dissipation unit through the shell unit so that the gaseous phase change medium inside the shell unit can release heat directly on the heat dissipation unit without having to be conducted through the shell unit, thereby reducing the thermal resistance in the heat dissipation process and improving the heat transfer efficiency.

[0048] Figure 1 It is a cross-sectional structural diagram of a low thermal resistance phase change heat sink. Figure 2 This is a schematic diagram of the appearance structure of a low thermal resistance phase change heat sink. First, Figure 1 and Figure 2 A low thermal resistance phase change heat sink, the low thermal resistance phase change heat sink comprises a shell unit 10 and a heat dissipation unit 20, the shell unit 10 has a bearing cavity 11 extending along a first direction X inside, the first end of the shell unit 10 along the first direction X is used to contact a target electronic device 60; the heat dissipation unit 20 is arranged at the second end of the shell unit 10 along the first direction X; wherein, the bearing cavity 11 is used to bear a phase change liquid 40; the heat dissipation unit 20 runs through the shell unit 10, the heat dissipation unit 20 comprises a condensation area 21 located in the bearing cavity 11 and a heat dissipation area 22 located outside the shell unit 10, the condensation area 21 and the heat dissipation area 22 are integrally formed; so that the low thermal resistance phase change heat sink dissipates heat to the target electronic device 60.

[0049] In this embodiment, the bearing cavity located inside the shell unit extends along a first direction, and the first direction is, for example, a vertical direction. The bottom end of the shell unit is used to contact the target electronic device, and a heat dissipation unit is provided at the top end of the shell unit; wherein, the heat dissipation unit runs through the shell unit, that is, the condensation zone of the heat dissipation unit is located in the bearing cavity, and the heat dissipation zone of the heat dissipation unit is located outside the shell unit, and the condensation zone and the heat dissipation zone are integrally formed, so that the low thermal resistance phase change heat sink realizes liquid-cooled phase change heat dissipation of the target electronic device.

[0050] Combination Figure 1 It can be understood that the bottom end of the shell unit contacts the target electronic device, and the phase change liquid placed in the bearing cavity absorbs heat from the target electronic device. As the heat accumulates, the phase change liquid is rapidly heated and boils to become a gas. The gaseous phase change medium contacts the condensation zone and releases heat to condense into a liquid. The liquid phase change medium then uses gravity to flow back to the phase change liquid below, completing the phase change cycle process, thereby achieving heat dissipation for the target electronic device.

[0051] In the above process, since the internal condensation zone and the external heat dissipation zone are integrally formed, after the gaseous phase change medium releases heat in the condensation zone, the heat can be directly conducted to the heat dissipation zone through the condensation zone, and the heat is dissipated in the heat dissipation zone through external air cooling or natural convection.

[0052] In other words, since the heat dissipation unit passes through the shell unit, the gaseous phase change medium inside the shell unit can directly contact the heat dissipation unit and release heat. Compared with the structure in which the heat dissipation unit is welded outside the shell unit, the thermal resistance of heat conduction to the heat dissipation unit through the shell unit is eliminated, thereby improving the heat transfer efficiency and thus improving the heat dissipation efficiency.

[0053] It can be understood that the shell unit should be made of metal or other materials to facilitate heat conduction of the target electronic device, and the internal bearing cavity should be sealed to prevent the loss of phase change liquid. The phase change liquid can be a low-boiling point phase change material, and the filling amount is determined according to actual needs.

[0054] An embodiment of the present application provides a low thermal resistance phase change heat sink, which includes a shell unit and a heat dissipation unit. One end of the shell unit is used to contact the target electronic device, and the other end of the shell unit is provided with the heat dissipation unit, and the heat dissipation unit runs through the shell unit; that is, the heat dissipation unit includes a condensation zone located in a bearing cavity inside the shell unit and a heat dissipation zone located outside the shell unit, and the condensation zone and the heat dissipation zone are integrally formed. In this way, liquid-cooled phase change heat dissipation of the target electronic device can be achieved by using a phase change liquid with a lower boiling point placed in the bearing cavity.

[0055] That is to say, in the low thermal resistance phase change heat sink of the present embodiment, the liquid phase change fluid first absorbs heat from the target electronic device at one end of the shell unit, and the liquid phase change fluid is rapidly boiled by the heat to become a gas, and the gaseous phase change medium can directly release heat on the surface of the condensation zone of the heat dissipation unit and condense back into a liquid state, and then flow back into the liquid phase change fluid by gravity; it can be understood that since the gaseous phase change medium can directly contact the condensation zone, and the internal condensation zone and the external heat dissipation zone are integrally formed, the heat released by the gaseous phase change medium in the condensation zone can be directly conducted to the heat dissipation zone for heat dissipation. Compared with the structure of welding the heat dissipation unit on the shell unit, the low thermal resistance phase change heat sink of the present embodiment can greatly reduce the thermal resistance in the heat dissipation process, improve the heat transfer efficiency, and then improve the heat dissipation efficiency, solve the technical problem that the heat dissipation efficiency of the existing liquid-cooled phase change heat sink is still low, can be compatible with target electronic devices with different power densities, has a simple structure, strong adaptability and low cost.

[0056] In one possible implementation, combining Figure 6 The housing unit 10 includes a carrying housing 12 and a sealing cover 13 arranged up and down along a first direction X. The carrying housing 12 is opened, and the sealing cover 13 is used to seal the carrying housing 12. The outer bottom surface of the carrying housing 12 is used to contact the target electronic device 60.

[0057] Among them, the bearing shell can be set with an upper opening, and the upper opening and the sealing cover are detachably connected and fixed, and the heat dissipation unit horizontally penetrates the bearing shell near the sealing cover. This makes it convenient to replace the internal phase change liquid and the filling amount of the phase change liquid according to actual needs, and is easy to use.

[0058] Of course, the upper opening and the sealing cover can also be fixed by welding.

[0059] In one embodiment, a thermal conductive silicone grease 50 is coated between the outer bottom surface and the target electronic device 60 , and the thermal conductive silicone grease 50 is used to fill the gap between the target electronic device 60 and the carrying shell 12 to reduce thermal resistance.

[0060] In a possible implementation manner, the heat dissipation unit 20 includes a heat dissipation fin 23 , which extends divergently along a plane perpendicular to the first direction X. The heat dissipation fin 23 includes an integrally formed condensation area 21 and a heat dissipation area 22 .

[0061] That is, the heat sink includes an integrally formed condensation zone and heat dissipation zone. The heat sink extends, for example, horizontally and circumferentially divergently relative to the shell unit, thereby increasing the heat dissipation area outside the shell unit and improving the heat dissipation efficiency.

[0062] Specifically, please combine Figure 2 or Figure 6 The heat dissipation area 22 includes a plurality of vertically extending heat dissipation arms 25, and the plurality of heat dissipation arms 25 are arranged circumferentially relative to the first direction X, thereby further increasing the heat dissipation area.

[0063] In one embodiment, in combination Figure 3 The condensation area 21 is provided with a reflux tip 24 facing the phase change liquid 40, so that the condensed phase change liquid can be gathered and then reflux into the phase change liquid below.

[0064] In one embodiment, the heat dissipation unit 20 includes a plurality of heat dissipation fins 23 , and the plurality of heat dissipation fins 23 are stacked along a first direction X.

[0065] In this embodiment, combined with Figure 4 , stack multiple heat sinks along the first direction, and please combine Figure 6 The condensation area of ​​the heat sink can be an unclosed structure, which allows the gaseous phase change medium to pass through. This can simultaneously increase the area of ​​the condensation area inside the bearing cavity and the heat dissipation area outside the shell unit, thereby improving the heat dissipation efficiency.

[0066] In one possible implementation, the low thermal resistance phase change heat sink further includes a liquid return unit 30, which is disposed in the carrying cavity 11; the first end of the liquid return unit 30 along the first direction X is connected to the condensation area 21, and the second end of the liquid return unit 30 along the first direction X extends into the phase change liquid 40.

[0067] That is, in this embodiment, the condensation zone and the phase-change liquid are connected via a liquid return unit, and the liquid return unit provides a carrier for the phase-change liquid to return after condensation above, thereby increasing the return speed.

[0068] Specifically, the liquid return unit includes a liquid absorbent core, which is composed of a capillary porous material; wherein, on the one hand, the liquid absorbent core serves as a carrier for the reflux of the above-mentioned phase change liquid, so that the phase change liquid with a lower temperature after condensation above flows back along the surface of the liquid absorbent core; on the other hand, the liquid absorbent core composed of a capillary porous material can also absorb the phase change liquid with a lower temperature above through capillary action, thereby increasing the circulation speed.

[0069] In one possible implementation, the liquid return unit 30 includes a liquid return pipe extending along a first direction X; the condensation zone includes a plurality of clamping arms extending in a radial direction of the first direction, and the plurality of clamping arms are arranged circumferentially relative to the first direction so that the plurality of clamping arms clamp the liquid return pipe.

[0070] Please combine Figure 6 On the one hand, as described above, the liquid return unit can be, for example, a liquid absorbent core; on the other hand, the condensation zone 21 includes a plurality of clamping arms 26, wherein the clamping arms 26 extend in the radial direction of the first direction X, and the plurality of clamping arms 26 are arranged in the circumferential direction relative to the first direction X; it can be understood that, in this way, the plurality of clamping arms 26 can clamp and fix the liquid absorbent core.

[0071] Specifically, the outer diameter of the clamping arm gradually decreases from one end close to the heat dissipation zone to the end close to the liquid absorption core; it can be understood that the outer diameter of the clamping wall at the end close to the heat dissipation zone is relatively thick, which can make the condensation zone more effective, and the outer diameter of the clamping arm at the end close to the liquid absorption core gradually decreases and occupies a small space, so that the gaseous phase change working fluid can be located more in the condensation zone, thereby improving the overall condensation and liquid return effect.

[0072] In a possible implementation manner, the bearing cavity is in a negative pressure state, and the negative pressure intensity can be determined according to actual needs. The negative pressure state inside the bearing cavity can further reduce the boiling point of the phase change liquid.

[0073] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation. The above details do not limit the present application to being implemented by adopting the above specific details.

[0074] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0075] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0076] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0077] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize that some variations, modifications, changes, additions and sub-combinations thereof should be included within the scope of protection of the present invention.

Claims

1. A low thermal resistance phase change heat sink, characterized in that: The low thermal resistance phase change heat sink comprises: A housing unit, wherein the interior of the housing unit has a bearing cavity extending along a first direction, and a first end of the housing unit along the first direction is used to contact a target electronic device; a heat dissipation unit, the heat dissipation unit being arranged at a second end of the housing unit along the first direction; Wherein, the bearing cavity is used to bear the phase change liquid; The housing unit comprises a bearing housing and a sealing cover arranged up and down along the first direction, the bearing housing is provided with an opening, the sealing cover is used to seal the bearing housing, the heat dissipation unit penetrates the housing unit from the inside of the housing unit and extends to the outside of the housing unit, the heat dissipation unit comprises a condensation area located in the bearing cavity and a heat dissipation area located outside the housing unit, and the condensation area and the heat dissipation area are integrally formed; So that the low thermal resistance phase change heat sink can dissipate heat for the target electronic device.

2. The low thermal resistance phase change heat sink according to claim 1, characterized in that: The outer bottom surface of the carrying shell is used to contact the target electronic device.

3. The low thermal resistance phase change heat sink according to claim 2, characterized in that: Thermal conductive silicone grease is coated between the outer bottom surface and the target electronic device.

4. The low thermal resistance phase change heat sink according to claim 1, characterized in that: The heat dissipation unit includes a heat dissipation fin, the heat dissipation fin extends divergently along a plane perpendicular to the first direction, and the heat dissipation fin includes the condensation area and the heat dissipation area which are integrally formed.

5. The low thermal resistance phase change heat sink according to claim 4, characterized in that: The condensation zone is provided with a reflux tip facing the phase change liquid.

6. The low thermal resistance phase change heat sink according to claim 4, characterized in that: The heat dissipation area includes a plurality of heat dissipation arms, and the plurality of heat dissipation arms are arranged circumferentially relative to the first direction.

7. The low thermal resistance phase change heat sink according to claim 4, characterized in that: The heat dissipation unit includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are stacked along the first direction.

8. The low thermal resistance phase change heat sink according to claim 1, characterized in that: The low thermal resistance phase change heat sink also includes: A liquid return unit, the liquid return unit is arranged in the bearing cavity; A first end of the liquid return unit along the first direction is connected to the condensation zone, and a second end of the liquid return unit along the first direction extends into the phase change liquid.

9. The low thermal resistance phase change heat sink according to claim 8, characterized in that: The liquid return unit comprises a liquid wick, which is made of a capillary porous material.

10. The low thermal resistance phase change heat sink according to claim 8, characterized in that: The liquid return unit includes a liquid wick extending along the first direction; The condensation area includes a plurality of clamping arms extending in a radial direction of the first direction. The plurality of clamping arms are arranged circumferentially relative to the first direction so that the plurality of clamping arms clamp the liquid absorbent core.

11. The low thermal resistance phase change heat sink according to claim 10, characterized in that: The outer diameter of the clamping arm gradually decreases from an end close to the heat dissipation zone to an end close to the liquid absorbing core.

12. The low thermal resistance phase change heat sink according to claim 1, characterized in that: The bearing chamber is in a negative pressure state.

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