Embedded online chip optical inspection machine

Abstract

The application provides an embedded online chip optical detection machine, which comprises a mounting seat, a conveying mechanism, a blocking mechanism and a detection mechanism. The conveying mechanism is arranged on the mounting seat. One end of the conveying mechanism is provided with a feeding port for feeding materials, and the other end of the conveying mechanism is provided with a discharging port for discharging materials. The conveying mechanism has a detection station between the feeding port and the discharging port. The blocking mechanism is arranged on the mounting seat. The blocking mechanism has a blocking state and a avoiding state. When the blocking mechanism is in the blocking state, the blocking mechanism limits the materials on the detection station. When the blocking mechanism is in the avoiding state, the blocking mechanism releases the materials. The detection mechanism is arranged on the mounting seat and located above the detection station. When the blocking mechanism limits the materials on the detection station, the detection mechanism detects the chip.

Description

Technical Field

[0001] This invention relates to the technical field of chip inspection, and more particularly to an embedded in-line chip optical inspection machine. Background Technology

[0002] During the chip manufacturing process, the inspection items for die bonding and wire bonding include, but are not limited to: wire bonding short circuits, wire bonding deformation, multiple wire bonding, missing wire bonding, broken wires, collapsed wires, chip damage, chip contamination, solder pad contamination, foreign matter adhesion, solder joint misalignment, root crack of two solder joints, chip misalignment, chip tilt, chip cornering, and PCB (Printed Circuit Board) defects (gold finger contamination, foreign matter, deformation), so as to detect whether there are manufacturing defects in the chip in a timely manner.

[0003] After die bonding and / or wirebonding, the chips are first stored in cassettes, then transferred, and finally loaded onto an embedded in-line chip optical inspection machine for testing. Therefore, before testing, the chips need to go through storage, transfer, and loading processes, which can lead to chip damage during these processes. Summary of the Invention

[0004] The purpose of this invention is to provide an embedded online chip optical inspection machine to solve the technical problem in the prior art that chips need to go through a series of processes such as collection, transfer and loading before they can be inspected, which can lead to chip damage.

[0005] This invention provides an embedded in-circuit chip optical inspection machine, the embedded in-circuit chip optical inspection machine comprising: a mounting base;

[0006] A transmission mechanism is provided on the mounting base. One end of the transmission mechanism forms an inlet for introducing materials, and the other end forms an outlet for discharging materials. The transmission mechanism also has a detection station located between the inlet and the outlet.

[0007] A blocking mechanism is disposed on the mounting base. The blocking mechanism has a blocking state and a yielding state. When the blocking mechanism is in the blocking state, the blocking mechanism restricts the material at the detection station. When the blocking mechanism is in the yielding state, the blocking mechanism releases the material.

[0008] The detection mechanism is mounted on the mounting base and located above the detection station. When the blocking mechanism restricts the material at the detection station, the detection mechanism detects the material.

[0009] As one embodiment of the present invention, the detection station includes a first detection station;

[0010] The blocking mechanism includes a first blocking component, which has a first blocking state and a first yielding state. When the first blocking component is in the first blocking state, the first blocking component restricts the material at the first detection station; when the first blocking component is in the yielding state, the first blocking component releases the material.

[0011] The testing mechanism includes a bracket and a camera assembly. The bracket is mounted on the mounting base, and the camera assembly is mounted on the bracket and located above the first testing station.

[0012] As an embodiment of the present invention, the detection station further includes a second detection station located upstream of the first detection station;

[0013] The blocking mechanism further includes a second blocking component, which has a second blocking state and a second avoidance state. When the second blocking component is in the second blocking state, the second blocking component restricts the material at the second detection station; when the second blocking component is in the avoidance state, the second blocking component releases the material.

[0014] The testing mechanism also includes a barcode reader mounted on the bracket, and the barcode reader is located above the second testing station.

[0015] As an embodiment of the present invention, the detection mechanism further includes an adjustment component, which includes an X-axis adjustment component, a Y-axis adjustment component, a first Z-axis adjustment component, and a second Z-axis adjustment component. The X-axis adjustment component is disposed on the bracket, the Y-axis adjustment component is disposed on the X-axis adjustment component and can move along the X-axis, the first Z-axis adjustment component is disposed on the Y-axis adjustment component and can move along the Y-axis, and the second Z-axis adjustment component is disposed on the Y-axis adjustment component and can move along the Y-axis.

[0016] The camera assembly is mounted on the first Z-axis adjustment member and can move along the Z-axis, while the barcode reader is mounted on the second Z-axis adjustment member and can move along the Z-axis.

[0017] As an embodiment of the present invention, the blocking mechanism further includes a first positioning sensor and a second positioning sensor, both of which are disposed on the mounting base. The first positioning sensor is used to detect whether the material has reached the first detection station; the second positioning sensor is used to detect whether the material has reached the second detection station.

[0018] As an embodiment of the present invention, the transmission mechanism includes a first plate frame, a second plate frame, a first side transmission belt, a second side transmission belt, and a transmission drive assembly;

[0019] The first plate frame and the second plate frame are arranged at intervals on the mounting base. The first side transmission belt is arranged on the side of the first plate frame facing the second plate frame, and the second side transmission belt is arranged on the side of the second plate frame facing the first plate frame. The feed port is formed by one end of the first plate frame, one end of the first side transmission belt, one end of the second side transmission belt, and one end of the second plate frame. The discharge port is formed by the other end of the first plate frame, the other end of the first side transmission belt, the other end of the second side transmission belt, and the other end of the second plate frame. The detection station is formed by the first side transmission belt and the second side transmission belt. The transmission drive assembly is arranged on the mounting base, and the power output end of the transmission drive assembly is connected to the first side transmission belt and the second side transmission belt.

[0020] As an embodiment of the present invention, the transmission mechanism further includes a first guide rail, a first slider, and a first driving member. The first guide rail is disposed on the mounting base, the first slider is fixedly connected to the second plate frame and slidably connected to the first guide rail, and the first driving member is connected to the second plate frame. The first driving member drives the second plate frame to move toward or away from the first plate frame.

[0021] As an embodiment of the present invention, the transmission mechanism further includes a limit sensor disposed on the mounting base, and the limit sensor is located on the side of the second plate frame away from the first plate frame, and the limit sensor is used to sense the second plate frame.

[0022] As an embodiment of the present invention, the first side transmission belt includes a first transmission belt and a second transmission belt, wherein the tail end of the second transmission belt is adjacent to the head end of the first transmission belt; the second side transmission belt includes a third transmission belt and a fourth transmission belt that are spaced apart from the first transmission belt.

[0023] The first inspection station is formed by the first transmission belt and the third transmission belt, and the second inspection station is formed by the second transmission belt and the fourth transmission belt;

[0024] The transmission drive assembly includes a second drive member and a third drive member. The power output end of the second drive member is connected to the first transmission belt and the third transmission belt, and the power output end of the third drive member is connected to the second transmission belt and the fourth transmission belt.

[0025] As an embodiment of the present invention, the transmission mechanism further includes a first limiting plate and a second limiting plate. The first limiting plate is disposed on the first plate frame and is located above the first side transmission belt; the second limiting plate is disposed on the second plate frame and is located above the second side transmission belt.

[0026] As an embodiment of the present invention, the embedded online chip optical inspection machine further includes a top pressing mechanism, which includes a lifting drive assembly and a top pressing plate assembly. The top pressing plate assembly is located below the first inspection station and is offset from the first side transmission belt and the second side transmission belt. The lifting drive assembly is mounted on the mounting base, and the power output end of the lifting drive assembly is connected to the top pressing plate assembly. The lifting drive assembly drives the top pressing plate assembly to move toward or away from the first limiting plate and the second limiting plate.

[0027] As an embodiment of the present invention, the first plate frame is formed with a first stroke opening, and the second plate frame is formed with a second stroke opening;

[0028] The top pressure plate assembly includes a first top pressure plate and a second top pressure plate. The first top pressure plate includes a first main body, a first pressing part, and a first connecting part. The first main body is located on the side of the first plate frame away from the second plate frame, and the first pressing part is located on the side of the first plate frame facing the second plate frame. The first connecting part passes through the first stroke opening and connects the first main body and the first pressing part. The second top pressure plate includes a second main body, a second pressing part, and a second connecting part. The second main body is located on the side of the second plate frame away from the first plate frame, and the second pressing part is located on the side of the second plate frame facing the first plate frame. The second connecting part passes through the second stroke opening and connects the second main body and the second pressing part.

[0029] The lifting drive assembly includes a fourth drive member and a fifth drive member. The fourth drive member is disposed on the side of the first plate frame away from the second plate frame and is connected to the first main body. The fifth drive member is disposed on the side of the second plate frame away from the first plate frame and is connected to the second main body.

[0030] As an embodiment of the present invention, the first pressing part is formed with a first clearance channel, which is used to avoid the first side transmission belt; the second pressing part is formed with a second clearance channel, which is used to avoid the second side transmission belt.

[0031] Implementing the embodiments of the present invention will have the following beneficial effects:

[0032] In this invention, the embedded online chip optical inspection machine provided by this technical solution can be used to inspect chips. The embedded online chip optical inspection machine is directly connected in series to a chip production line, so that the inlet of the transmission mechanism is connected to the previous process equipment, and the outlet of the transmission mechanism is connected to the subsequent process equipment. Chips completed by the previous process equipment can directly flow into the transmission mechanism. When chip inspection is required, the stop mechanism switches to a blocking state to prevent the chip from continuing its transmission movement, thereby confining the chip to the first inspection station. The inspection mechanism can then inspect the chip remaining at the inspection station. After the inspection mechanism completes the inspection, the stop mechanism switches to an avoidance state to avoid the chip, allowing the chip to leave the inspection station and continue its transmission movement, finally exiting from the outlet. The chip flows into the subsequent process setup; when chip testing is not required, the stop mechanism remains in an avoidance state, ensuring DC flow through the transmission mechanism. Chips from the previous process equipment are transferred through the transmission mechanism into the subsequent process equipment. Therefore, this embedded online chip optical inspection machine has both a testing mode and a direct-flow mode. Connecting this embedded online chip optical inspection machine in series into the production line not only enables seamless communication between the previous and subsequent process equipment but also allows for chip positioning and testing. It eliminates the need for additional loading and unloading devices for the embedded online chip optical inspection machine, saving on storage, transfer, and loading lines. This solves the technical problem in existing technologies where chips need to pass through storage, transfer, and loading lines before testing, which can lead to chip damage. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a partial structural schematic diagram of an embedded online chip optical inspection machine according to one embodiment of the present invention;

[0035] Figure 2 This is a partial structural schematic diagram of an embedded online chip optical inspection machine according to one embodiment of the present invention;

[0036] Figure 3 for Figure 2 A schematic diagram of the decomposed structure;

[0037] Figure 4 for Figure 2 Top view;

[0038] Figure 5 for Figure 2A magnified view of a portion of point C in the middle;

[0039] Figure 6 This is a structural diagram of the first chassis structure;

[0040] Figure 7 This is a structural diagram of the first chassis structure.

[0041] Wherein: 10, mounting base; 11, locking component; 20, transmission mechanism; 20a, feed inlet; 20b, discharge outlet; 201, first plate frame; 2011, first stroke opening; 202, second plate frame; 203, first side transmission belt; 2031, first transmission belt; 2032, second transmission belt; 204, second side transmission belt; 2041, third transmission belt; 2042, fourth transmission belt; 205, transmission drive assembly; 2051, second drive component; 2052, third drive component; 206, ... 1. Guide rail; 207. First slider; 208. First driving component; 209. Limit sensor; 210. First limit plate; 211. Second limit plate; 30. Stop mechanism; 31. First stop assembly; 311. First blocking frame; 312. First blocking cylinder; 32. Second stop assembly; 321. Second blocking frame; 322. Second blocking cylinder; 33. First positioning sensor; 34. Second positioning sensor; 40. Detection mechanism; 41. Bracket; 42. Camera assembly; 43. Code reader; 44. 441. Adjustment component; 442. Y-axis adjustment component; 443. First Z-axis adjustment component; 444. Second Z-axis adjustment component; 50. Top pressing mechanism; 511. Fourth driving component; 52. Top pressing plate assembly; 521. First top pressing plate; 5211. First main body; 5213. First connecting part; 522. Second top pressing plate; 5222. Second top pressing part; 52221. Second clearance channel; 53. Second guide rail; 55. Second slider; 60. First housing mechanism; 601. First machine 602. Main electrical power supply; 603. Uninterruptible power supply; 604. Speed ​​controller; 605. Vision host; 606. Cooling fan; 607. Control module; 608. Communication interface; 609. Mode conversion switch; 610. Foot cup; 612. Casters; 70. Second chassis mechanism; 701. Alarm light; 702. Vision display screen; 703. Industrial control display screen; 704. Keyboard and mouse; 705. Button board; 706. Observation window; 707. Second chassis; 200. Chip; 300. Carrier. Detailed Implementation

[0042] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0043] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0045] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] See Figures 1-5This invention provides an embedded in-line chip optical inspection machine, comprising a mounting base 10, a transmission mechanism 20, a blocking mechanism 30, and a detection mechanism 40. The transmission mechanism 20 is mounted on the mounting base 10, with one end forming an inlet 20a for introducing material and the other end forming an outlet 20b for discharging material. The transmission mechanism 20 has a detection station located between the inlet 20a and the outlet 20b. The blocking mechanism 30 is configured... The blocking mechanism 30, placed on the mounting base 10, has a blocking state and a yielding state. When the blocking mechanism 30 is in the blocking state, it restricts the material at the detection station. When the yielding mechanism 30 is in the yielding state, it releases the material. The detection mechanism 40 is disposed on the mounting base 10 and is located above the detection station. When the blocking mechanism 30 restricts the material at the detection station, the detection mechanism 40 detects the chip 200.

[0048] In this invention, the embedded online chip optical inspection machine provided by this technical solution can be used to inspect chip 200. The embedded online chip optical inspection machine is directly connected in series to the chip 200 production line, so that the inlet 20a of the transmission mechanism 20 is connected to the previous process equipment, and the outlet 20b of the transmission mechanism 20 is connected to the subsequent process equipment. Chips 200 after completion by the previous process equipment can directly flow into the transmission mechanism 20. When chip 200 needs to be inspected, the stop mechanism 30 switches to a blocking state to prevent the chip 200 from continuing its transmission movement, thereby restricting the chip 200 to the first inspection station. The inspection mechanism 40 can then inspect the chip 200 that is stationed at the inspection station. After the inspection mechanism 40 completes the inspection, the stop mechanism 30 switches to an avoidance state to avoid the chip 200, allowing the chip 200 to leave the inspection station and continue its transmission. The material is transferred and flows into the subsequent process after exiting the discharge device. When chip 200 does not need to be inspected, the blocking mechanism 30 remains in a clearance state, allowing the transmission mechanism 20 to maintain direct current flow. Chips 200 from the previous process equipment are transferred through the transmission mechanism 20 into the subsequent process equipment. Therefore, this embedded online chip optical inspection machine has both inspection mode and direct-flow mode. Connecting this embedded online chip optical inspection machine in series into the production line not only enables the connection and flow between the previous and subsequent process equipment, but also allows for positioning and inspection of chips 200. It eliminates the need for additional loading and unloading devices for the embedded online chip optical inspection machine, saving the need for collection, transfer, and loading lines. This solves the technical problem in the prior art where chips 200 need to go through collection, transfer, and loading lines before inspection, which can lead to chip damage.

[0049] In some specific embodiments, see Figure 3 and Figure 4 The chip 200 on the production line is placed on the carrier 300 to avoid damage to the chip 200. That is, the transmission mechanism 20 transmits the chip 200 through the transmission carrier 300, and the blocking mechanism 30 blocks the chip 200 through the blocking carrier 300.

[0050] It should be noted that the embedded online chip optical inspection machine also includes a control module 607. The stop mechanism 30 and the detection mechanism 40 are both electrically connected to the control module 607. The control module 607 controls the stop mechanism 30 to switch between blocking and avoidance states, and controls the start / stop, detection mode, and reception of detection records from the detection mechanism 40.

[0051] In one embodiment, see Figure 1 The detection station includes a first detection station; the blocking mechanism 30 includes a first blocking component 31, which has a first blocking state and a first avoidance state. When the first blocking component 31 is in the first blocking state, it restricts the material at the first detection station; when the first blocking component 31 is in the avoidance state, it releases the material; the detection mechanism 40 includes a bracket 41 and a camera component 42. The bracket 41 is disposed on the mounting base 10, and the camera component 42 is disposed on the bracket 41, and the camera component 42 is located above the first detection station.

[0052] Specifically, the camera assembly 42 and the first blocking assembly 31 are both electrically connected to the control module 607. When the carrier 300 carrying the chip 200 arrives at the first detection station, the first blocking assembly 31 switches to the first blocking state to stop the chip 200 at the first detection station. The camera assembly 42 takes a picture of the chip 200 on the carrier 300 to obtain a visual image. The control module 607 then identifies and judges the detection image and outputs the detection result.

[0053] In some specific embodiments, the camera assembly 42 consists of three cameras, lenses, built-in coaxial light, multi-layer outer ring light, etc. When the chip 200 is photographed and detected, the control module 607 simultaneously starts the camera and triggers each light source.

[0054] In some specific embodiments, see Figure 3The first blocking component 31 includes a first blocking frame 311 and a first blocking cylinder 312 disposed on the first blocking frame 311. When the piston rod of the first blocking cylinder 312 extends, the first blocking cylinder 312 is in a first blocking state, and the piston rod of the first blocking cylinder 312 blocks the chip 200 from continuing to transmit, thereby restricting the chip 200 to the first detection station. When the piston rod of the first blocking cylinder 312 retracts, the first blocking cylinder 312 is in an avoidance state, and the piston rod of the first blocking cylinder 312 avoids the chip 200, allowing the chip 200 to leave the first detection station and continue to transmit.

[0055] In one embodiment, see Figure 1 The detection station further includes a second detection station located upstream of the first detection station; the blocking mechanism 30 further includes a second blocking component 32, which has a second blocking state and a second avoidance state. When the second blocking component 32 is in the second blocking state, it restricts the material at the second detection station; when the second blocking component 32 is in the avoidance state, it releases the material; the detection mechanism 40 further includes a barcode reader 43 disposed on the bracket 41, and the barcode reader 43 is located above the second detection station.

[0056] Specifically, the second stop component 32, the barcode reader 43, and the control module 607 are electrically connected. During the transmission of the chip 200 by the transmission mechanism 20, the carrier 300 carrying the chip 200 arrives at the second detection station first, and then at the first detection station. When the second stop component 32 switches to the second blocking state to restrict the carrier 300 carrying the chip 200 to the second detection station, the control module 607 controls the barcode reader 43 to scan the chip 200 on the carrier 300 to identify the chip 200's identity information, and the control module 607 stores the chip 200's identity information. After the barcode reader 43 completes the scanning and identification of the chip 200... Subsequently, the second stop component 32 switches to the second avoidance state so that the carrier 300 carrying the chip 200 can be transferred from the second detection station to the first detection station. When the first stop component 31 restricts the carrier 300 carrying the chip 200 to the first detection station, the control module 607 controls the camera component 42 to take a picture of the chip 200 on the carrier 300. The control module 607 identifies and judges the visual image of the chip 200 and matches the detection result with the identity information of the chip 200 to ensure the accuracy of the output detection result. This enables the subsequent process equipment to complete the subsequent related production process based on the output detection result.

[0057] In some specific embodiments, see Figure 3The second blocking component 32 includes a second blocking frame 321 and a second blocking cylinder 322 disposed on the second blocking frame 321. When the piston rod of the second blocking cylinder 322 extends, the second blocking cylinder 322 is in a second blocking state, and the piston rod of the second blocking cylinder 322 blocks the chip 200 from continuing to transmit, thereby restricting the chip 200 to the second detection station. When the piston rod of the second blocking cylinder 322 retracts, the second blocking cylinder 322 is in an avoidance state, and the piston rod of the second blocking cylinder 322 avoids the chip 200, allowing the chip 200 to leave the second detection station and continue to transmit.

[0058] In one embodiment, see Figure 1 The detection mechanism 40 further includes an adjustment component 44, which includes an X-axis adjustment component 441, a Y-axis adjustment component 442, a first Z-axis adjustment component 443, and a second Z-axis adjustment component 444. The X-axis adjustment component 441 is mounted on the bracket 41, the Y-axis adjustment component 442 is mounted on the X-axis adjustment component 441 and can move along the X-axis, the first Z-axis adjustment component 443 is mounted on the Y-axis adjustment component 442 and can move along the Y-axis, and the second Z-axis adjustment component 444 is mounted on the Y-axis adjustment component 442 and can move along the Y-axis. The camera component 42 is mounted on the first Z-axis adjustment component 443 and can move along the Z-axis, and the barcode reader 43 is mounted on the second Z-axis adjustment component 444 and can move along the Z-axis.

[0059] In this embodiment, the camera assembly 42 is moved along the X and Y axes by the X-axis adjustment member 441 and Y-axis adjustment member 442, enabling the camera assembly 42 to capture images of all chips 200 on the carrier 300 and adapt to the shooting requirements of chips 200 of different specifications. The camera assembly 42 is moved along the Z axis by the first Z-axis adjustment member 443, enabling the camera assembly 42 to perform autofocus and obstacle avoidance. The barcode reader 43 is moved along the X and Y axes by the X-axis adjustment member 441 and Y-axis adjustment member 442, enabling the barcode reader 43 to read and identify all chips 200 on the carrier 300 and adapt to the reading requirements of chips 200 of different specifications. The barcode reader 43 is moved along the Z axis by the second Z-axis adjustment member 444, enabling the barcode reader 43 to adjust its reading distance and avoid obstacles.

[0060] In one embodiment, see Figure 4 The blocking mechanism 30 also includes a first positioning sensor 33 and a second positioning sensor 34, both of which are disposed on the mounting base 10. The first positioning sensor 33 is used to detect whether the material has reached the first detection station; the second positioning sensor 34 is used to detect whether the material has reached the second detection station.

[0061] The first positioning sensor 33 and the second positioning sensor 34 are electrically connected to the control module 607. When the first positioning sensor 33 detects that the chip 200 has arrived at the first detection station, the control module 607 receives the positioning detection information from the first positioning sensor 33 and controls the first stop component 31 to switch to the first blocking state, so that the first stop component 31 restricts the chip 200 at the first detection station. When the second positioning sensor 34 detects that the chip 200 has arrived at the second detection station, the control module 607 receives the positioning detection information from the second positioning sensor 34 and controls the second stop component 32 to switch to the second blocking state, so that the second stop component 32 restricts the chip 200 at the second detection station.

[0062] See Figures 2-4 The transmission mechanism 20 includes a first plate frame 201, a second plate frame 202, a first side transmission belt 203, a second side transmission belt 204, and a transmission drive assembly 205. The first plate frame 201 and the second plate frame 202 are arranged opposite to each other on the mounting base 10. The first side transmission belt 203 is arranged on the side of the first plate frame 201 facing the second plate frame 202, and the second side transmission belt 204 is arranged on the side of the second plate frame 202 facing the first plate frame 201. The feed inlet 20a is formed by one end of the first plate frame 201, one end of the first side transmission belt 203, and the... One end of the second side transmission belt 204 and one end of the second plate frame 202 are jointly formed. The discharge port 20b is jointly formed by the other end of the first plate frame 201, the other end of the first side transmission belt 203, the other end of the second side transmission belt 204, and the other end of the second plate frame 202. The detection station is jointly formed by the first side transmission belt 203 and the second side transmission belt 204. The transmission drive assembly 205 is disposed on the mounting base 10, and the power output end of the transmission drive assembly 205 is connected to the first side transmission belt 203 and the second side transmission belt 204.

[0063] In this embodiment, the first board frame 201 and the second board frame 202 support the first side transmission belt 203 and the second side transmission belt 204 to be relatively spaced apart, so that the first side transmission belt 203 and the second side transmission belt 204 jointly transmit the chip 200; the first board frame 201 and the second board frame 202 restrict both sides of the chip 200 to prevent the chip 200 from shifting during the transmission process, thereby ensuring the stable transmission of the chip 200.

[0064] In one embodiment, see Figure 2 and Figure 3The transmission mechanism 20 further includes a first guide rail 206, a first slider 207, and a first driving member 208. The first guide rail 206 is disposed on the mounting base 10. The first slider 207 is fixedly connected to the second plate frame 202 and slidably connected to the first guide rail 206. The first driving member 208 is connected to the second plate frame 202 and drives the second plate frame 202 to move toward or away from the first plate frame 201.

[0065] In this embodiment, the position between the first board frame 201 and the mounting base 10 remains relatively stable. The second board frame 202 can be driven to move relative to the first board frame 201 on the mounting base 10 by the first driving member 208, thereby changing the distance between the first side transmission belt 203 and the second side transmission belt 204 to transport chips 200 of different specifications. Therefore, the distance between the first side transmission belt 203 and the second side transmission belt 204 can be adjusted according to the specifications of the chips 200 switched on the production line to meet the transmission requirements of the production line. At the same time, the movement of the first board frame 201 is guided by the cooperation of the first guide rail 206 and the first slider 207 to ensure that the first board frame 201 moves smoothly and avoids the first board frame 201 from swaying.

[0066] In some specific embodiments, see Figures 1-3 The mounting base 10 has a number of spaced-apart locking pieces 11; the first plate frame 201 has a number of locking slots, which are connected one-to-one with the locking pieces 11, so that the first plate frame 201 can be quickly installed on the mounting base 10.

[0067] In one embodiment, see Figure 4 The transmission mechanism 20 further includes a limit sensor 209 disposed on the mounting base 10, and the limit sensor 209 is located on the side of the second plate frame 202 away from the first plate frame 201. The limit sensor 209 is used to sense the second plate frame 202.

[0068] The limit sensor 209 is electrically connected to the control module 607. When the limit sensor 209 senses the second plate frame 202, it indicates that the distance between the second plate frame 202 and the first plate frame 201 has been adjusted to the maximum. The control module 607 controls the first drive member 208 to stop driving the second plate frame 202 to continue moving away from the first plate frame 201, so as to prevent the first slider 207 from detaching from the first guide rail 206.

[0069] In some specific embodiments, see Figure 4The first side transmission belt 203 includes a first transmission belt 2031 and a second transmission belt 2032, with the tail end of the second transmission belt 2032 adjacent to the head end of the first transmission belt 2031; the second side transmission belt 204 includes a third transmission belt 2041 and a fourth transmission belt 2042 that are spaced apart from the first transmission belt 2031 and spaced apart from the second transmission belt 2032; the first detection station is formed by the first transmission belt 2031 and the third transmission belt 2041, and the second detection station is formed by the second transmission belt 2032 and the fourth transmission belt 2042; the transmission drive assembly includes a second drive member 2051 and a third drive member 2052, with the power output end of the second drive member 2051 connected to the first transmission belt 2031 and the third transmission belt 2041, and the power output end of the third drive member 2052 connected to the second transmission belt 2032 and the fourth transmission belt 2042.

[0070] In this embodiment, the first drive unit 208 drives the first transmission belt 2031 and the third transmission belt 2041 synchronously and controls their transmission speeds; the second drive unit 2051 drives the second transmission belt 2032 and the fourth transmission belt 2042 synchronously and controls their transmission speeds. Specifically, when the second stop assembly 32 stops the carrier 300 carrying the chip 200 at the second detection station, the second drive unit 2051 stops driving the second transmission belt 2032 and the fourth transmission belt 2042; the first drive unit 208 can then continue driving the first transmission belt 2031. The first drive belt 2031 and the second drive belt 2032 are used to transport the chip 200 that has completed barcode scanning to the first inspection station, or to transport the chip 200 that has completed scanning. Similarly, when the first stop component 31 stops the carrier 300 carrying the chip 200 at the first inspection station, the first drive component 208 stops driving the first drive belt 2031 and the third drive belt 2041; the second drive component 2051 can then continue to drive the second drive belt 2032 and the fourth drive belt 2042 to transport the chip 200 to the second inspection station, or to transport the chip 200 that has completed barcode scanning to the first inspection station; thereby improving the inspection efficiency of the embedded online chip optical inspection machine.

[0071] In one embodiment, see Figure 2 and Figure 3The transmission mechanism 20 further includes a first limiting plate 210 and a second limiting plate 211. The first limiting plate 210 is disposed on the first plate frame 201 and is located above the first side transmission belt 203; the second limiting plate 211 is disposed on the second plate frame 202 and is located above the second side transmission belt 204. In this embodiment, the chip 200 is prevented from deviating from the first side transmission belt 203 and the second side transmission belt 204 by the joint restriction of the first limiting plate 210 and the second limiting plate 211.

[0072] In one embodiment, see Figures 1-5 The embedded online chip optical inspection machine further includes a top pressing mechanism 50, which includes a lifting drive assembly and a top pressing plate assembly 52. ​​The top pressing plate assembly 52 is located below the first inspection station and is offset from the first side transmission belt 203 and the second side transmission belt 204. The lifting drive assembly is mounted on the mounting base 10, and the power output end of the lifting drive assembly is connected to the top pressing plate assembly 52. ​​The lifting drive assembly drives the top pressing plate assembly 52 to move toward or away from the first limiting plate 210 and the second limiting plate 211.

[0073] Specifically, the lifting drive assembly is electrically connected to the control module 607. After the first stop group switches to the first blocking state, restricting the carrier 300 carrying the chip 200 to the first detection station, the control module 607 controls the lifting drive assembly to drive the top pressure plate assembly 52 toward the first limit plate 210 and the second limit plate 211, thereby lifting the carrier 300. The top pressure plate assembly 52, together with the first limit plate 210 and the second limit plate 211, clamps the carrier 300, making the carrier 300 stable, that is, making the chip 200 on the carrier 300 more flat. This allows the camera assembly 42 to accurately position and photograph the chip 200, improving the clarity of the visual image. After the camera assembly 42 completes the photograph of the chip 200, the drive assembly drives the top pressure plate assembly 52 to move away from the first limit plate 210 and the second limit plate 211, that is, the top pressure plate assembly 52 descends, placing the carrier 300 carrying the chip 200 onto the first side transmission belt 203 and the second side transmission belt 204. At the same time, the first blocking assembly 31 switches to the first avoidance state so that the chip 200 can continue to be transmitted and the chip 200 is conveyed out through the discharge.

[0074] In some specific embodiments, see Figures 2-5The first plate frame 201 has a first travel opening 2011, and the second plate frame 202 has a second travel opening. The top pressure plate assembly 52 includes a first top pressure plate 521 and a second top pressure plate 522. The first top pressure plate 521 includes a first main body portion 5211, a first pressing portion, and a first connecting portion 5213. The first main body portion 5211 is located on the side of the first plate frame 201 facing away from the second plate frame 202, and the first pressing portion is located on the side of the first plate frame 201 facing the second plate frame 202. The first connecting portion 5213 passes through the first travel opening 2011 and connects the first main body portion 5211 and the first pressing portion. The second top pressure plate 522 includes a second main body portion, a second pressing portion 5222, and a second pressing portion 5222. The second main body is located on the side of the second plate frame 202 away from the first plate frame 201, and the second pressing part 5222 is located on the side of the second plate frame 202 facing the first plate frame 201. The second connecting part passes through the second stroke opening and connects between the second main body and the second pressing part 5222. The lifting drive assembly includes a fourth drive member 511 and a fifth drive member. The fourth drive member 511 is disposed on the side of the first plate frame 201 away from the second plate frame 202 and is connected to the first main body 5211. The fifth drive member is disposed on the side of the second plate frame 202 away from the first plate frame 201 and is connected to the second main body.

[0075] By setting the fourth drive member 511 on the side of the first plate frame 201 away from the second plate frame 202 and setting the fifth drive member on the side of the second plate frame 202 away from the first plate frame 201, the adjustment distance between the first side transmission belt 203 and the second side transmission belt 204 is not limited due to setting the lifting drive assembly between the first plate frame 201 and the second plate frame 202. The top pressure plate assembly 52 is divided into a first top pressure plate 521 and a second top pressure plate 522, and the first pressing part of the first top pressure plate 521 and the pressing part of the second top pressure plate 522 are spaced apart, which further avoids the limitation of the adjustment distance between the first side transmission belt 203 and the second side transmission belt 204, and realizes the balanced and stable pressing of the chip 200 by the top pressure mechanism 50. The first main body 5211 is connected to the fourth driving member 511 to drive the first top pressure plate 521. The first top pressure part is used to press the chip 200. The first connecting part 5213 and the first stroke opening 2011 are used to connect the first main body 5211 and the first top pressure part. The second main body is connected to the fifth driving member to drive the second top pressure plate 522. The second top pressure part 5222 is used to press the chip 200. The second connecting part and the second stroke opening are used to connect the second main body and the second top pressure part 5222.

[0076] In some specific embodiments, the first pressing part is formed with a first clearance channel, which is used to avoid the first side transmission belt 203. Therefore, when the first pressing part moves toward the first limiting plate 210, the first side transmission belt 203 is embedded in the first clearance channel, and the portions of the chip 200 located on both sides of the first side transmission belt 203 will be pressed by the first pressing part. By opening the first clearance channel, the contact area between the first pressing part and the chip 200 is increased, and the stability of the first pressing part pressing the chip 200 is improved.

[0077] In some specific embodiments, see Figure 5 The second pressing part 5222 has a second clearance channel 52221, which is used to avoid the second side transmission belt 204. Therefore, when the second pressing part 5222 moves toward the second limiting plate 211, the second side transmission belt 204 is embedded in the second clearance channel 52221. The portions of the chip 200 located on both sides of the second side transmission belt 204 will be pressed by the second pressing part 5222. By opening the second clearance channel 52221, the contact area between the second pressing part 5222 and the chip 200 is increased, and the stability of the second pressing part 5222 pressing the chip 200 is improved.

[0078] In some specific embodiments, the pressing mechanism 50 further includes a second guide rail 53, a third guide rail, a second slider 55, and a third slider. The second guide rail 53 is disposed on the first plate frame 201, the second slider 55 is fixedly connected to the first main body 5211, and the second slider 55 is slidably connected to the second guide rail 53. The third guide rail is disposed on the second plate frame 202, the third slider is fixedly connected to the second main body, and the third slider is slidably connected to the third guide rail.

[0079] The sliding connection between the second guide rail 53 and the second slider 55 guides the lifting and lowering of the first top pressure plate 521 to ensure that the first top pressure plate 521 presses the chip 200 smoothly and evenly; the sliding connection between the third guide rail and the third slider guides the lifting and lowering of the second top pressure plate 522 to ensure that the second top pressure plate 522 presses the chip 200 smoothly and evenly.

[0080] See Figure 6 The embedded online chip optical inspection machine also includes a first chassis mechanism 60. The first chassis mechanism 60 includes a first chassis 601 and a main power supply 602, an uninterruptible power supply 603, a speed controller 604, a vision host 605, a cooling fan 606, and the aforementioned control module 607, all disposed within the first chassis 601. The main power supply 602 and the uninterruptible power supply 603 provide power to the transmission mechanism 20, the inspection mechanism 40, etc. The speed controller 604 is used to adjust the transmission speed of the transmission mechanism 20. The cooling fan 606 is used to dissipate heat from the first chassis 601. The vision host 605 is electrically connected to the inspection mechanism 40 and is also electrically connected to the control module 607.

[0081] The first chassis 601 is equipped with a communication interface 608 and a mode conversion switch 609. Both the communication interface 608 and the mode conversion switch 609 are electrically connected to the control module 607. The communication interface 608 is used to electrically connect with the upstream and downstream equipment to realize information exchange with them. The mode conversion switch 609 is used to switch the working mode of the embedded online chip optical inspection machine. Specifically, when a certain type of chip 200 does not need to be inspected, the mode conversion switch 609 can be rotated to switch the working mode of the embedded online chip optical inspection machine to the pass-through mode. At this time, the embedded online chip optical inspection machine only serves as a connection line between the upstream and downstream equipment. The production of different types of chips 200 can be switched without changing the layout and sorting of the automatic production line equipment, which greatly speeds up the changeover time, improves efficiency, and is compatible with more types of chips 200.

[0082] In some specific embodiments, the bottom of the first chassis 601 is also provided with feet 610 and casters 612, and the movement and positioning of the first chassis mechanism 60 are realized through the cooperation of feet 610 and casters 612.

[0083] See Figure 7 The embedded online chip optical inspection machine also includes a second chassis mechanism 70, which includes a second chassis 707 mounted on the first chassis 601, and an alarm light 701, a vision display screen 702, an industrial control display screen 703, a keyboard and mouse 704, a keypad 705, etc. mounted on the second chassis 707.

[0084] In some specific embodiments, the second chassis 707 is formed with a mounting cavity, and the mounting base 10 passes through the mounting cavity to protect the transmission mechanism 20 and the detection mechanism 40 on the mounting base 10.

[0085] In some specific embodiments, see Figure 7 The second chassis 707 also has an observation window 706, through which the interior of the mounting cavity can be observed.

[0086] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of the present invention according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of the present invention. These technical solutions also fall within the scope of protection of the present invention.

Claims

1. An inline embedded chip optical inspection machine characterized by, The application relates to a material detection device, which comprises the following components: a mounting base; a conveying mechanism arranged on the mounting base, one end of the conveying mechanism being provided with a feeding port for feeding materials, the other end of the conveying mechanism being provided with a discharging port for discharging materials, and the conveying mechanism being provided with a detection station between the feeding port and the discharging port, the detection station comprising a first detection station and a second detection station, the second detection station being located upstream of the first detection station; a blocking mechanism arranged on the mounting base, the blocking mechanism comprising a first blocking component and a second blocking component, the first blocking component having a first blocking state and a first avoiding state, when the first blocking component is in the first blocking state, the first blocking component limits materials on the first detection station, when the first blocking component is in the avoiding state, the first blocking component releases materials, the second blocking component having a second blocking state and a second avoiding state, when the second blocking component is in the second blocking state, the second blocking component limits materials on the second detection station, when the second blocking component is in the avoiding state, the second blocking component releases materials; a detection mechanism arranged on the mounting base and located above the detection station, the detection mechanism detects materials when the blocking mechanism limits the materials on the detection station, the detection mechanism comprising a support, a camera component and a code reader, the support is arranged on the mounting base, the camera component and the code reader are arranged on the support, the camera component is located above the first detection station, and the code reader is located above the second detection station.

2. The inline optical chip inspection machine of claim 1, wherein, The detection mechanism further comprises an adjusting component, the adjusting component comprising an X-axis adjusting piece, a Y-axis adjusting piece, a first Z-axis adjusting piece and a second Z-axis adjusting piece, the X-axis adjusting piece is arranged on the support, the Y-axis adjusting piece is arranged on the X-axis adjusting piece and can move along the X-axis, the first Z-axis adjusting piece is arranged on the Y-axis adjusting piece and can move along the Y-axis, and the second Z-axis adjusting piece is arranged on the Y-axis adjusting piece and can move along the Y-axis. The camera component is arranged on the first Z-axis adjusting piece and can move along the Z-axis, and the code reader is arranged on the second Z-axis adjusting piece and can move along the Z-axis.

3. The inline optical chip inspection machine of claim 1, wherein, The blocking mechanism further comprises a first arrival sensor and a second arrival sensor arranged on the mounting base, the first arrival sensor is used for detecting whether materials arrive at the first detection station, and the second arrival sensor is used for detecting whether materials arrive at the second detection station.

4. The inline optical chip inspection machine of claim 1, wherein, The conveying mechanism comprises a first plate frame, a second plate frame, a first side transmission belt, a second side transmission belt and a transmission driving component. The first plate frame and the second plate frame are oppositely arranged on the mounting base, the first side transmission belt is arranged on one side of the first plate frame facing the second plate frame, and the second side transmission belt is arranged on one side of the second plate frame facing the first plate frame; the feeding port is jointly formed by one end of the first plate frame, one end of the first side transmission belt, one end of the second side transmission belt, and one end of the second plate frame, the discharging port is jointly formed by the other end of the first plate frame, the other end of the first side transmission belt, the other end of the second side transmission belt, and the other end of the second plate frame, and the detection station is jointly formed by the first side transmission belt and the second side transmission belt; the transmission driving assembly is arranged on the mounting base, and a power output end of the transmission driving assembly is connected with the first side transmission belt and the second side transmission belt.

5. The inline optical chip inspection machine of claim 4, wherein, The transmission mechanism further comprises a first guide rail, a first sliding block, and a first driving member, the first guide rail is arranged on the mounting base, the first sliding block is fixedly connected with the second plate frame, and the first sliding block is slidingly connected with the first guide rail, the first driving member is connected with the second plate frame, and the first driving member drives the second plate frame to move towards or away from the first plate frame.

6. The inline optical chip inspection machine of claim 5, wherein, The transmission mechanism further comprises a limit sensor arranged on the mounting base, and the limit sensor is located on a side of the second plate frame away from the first plate frame, and the limit sensor is used for sensing the second plate frame.

7. The inline optical chip inspection machine of claim 4, wherein, The first side transmission belt comprises a first transmission belt and a second transmission belt, and a tail end of the second transmission belt is adjacent to a head end of the first transmission belt; the second side transmission belt comprises a third transmission belt oppositely arranged with the first transmission belt and a fourth transmission belt oppositely arranged with the second transmission belt; The first detection station is formed by the first transmission belt and the third transmission belt, and the second detection station is formed by the second transmission belt and the fourth transmission belt; The transmission driving assembly comprises a second driving member and a third driving member, a power output end of the second driving member is connected with the first transmission belt and the third transmission belt, and a power output end of the third driving member is connected with the second transmission belt and the fourth transmission belt.

8. The inline optical chip inspection machine of claim 4, wherein, The transmission mechanism further comprises a first limit plate and a second limit plate, the first limit plate is arranged on the first plate frame, and the first limit plate is located above the first side transmission belt; the second limit plate is arranged on the second plate frame, and the second limit plate is located above the second side transmission belt.

9. The inline optical chip inspection machine of claim 8, wherein, The embedded online chip optical detection machine further comprises a pressing mechanism, the pressing mechanism comprises a lifting driving assembly and a pressing plate assembly, the pressing plate assembly is located below the first detection station, and the pressing plate assembly is arranged staggered with the first side transmission belt and the second side transmission belt, the lifting driving assembly is arranged on the mounting base, a power output end of the lifting driving assembly is connected with the pressing plate assembly, and the lifting driving assembly drives the pressing plate assembly to move towards or away from the first limit plate and the second limit plate.

10. The inline optical chip inspection machine of claim 9, wherein, The first plate frame is formed with a first stroke opening, and the second plate frame is formed with a second stroke opening; The top pressing plate assembly comprises a first top pressing plate and a second top pressing plate. The first top pressing plate comprises a first main body portion, a first top pressing portion, and a first connecting portion. The first main body portion is located on a side of the first plate frame away from the second plate frame. The first top pressing portion is located on a side of the first plate frame facing the second plate frame. The first connecting portion passes through the first stroke opening and is connected between the first main body portion and the first top pressing portion. The second top pressing plate comprises a second main body portion, a second top pressing portion, and a second connecting portion. The second main body portion is located on a side of the second plate frame away from the first plate frame. The second top pressing portion is located on a side of the second plate frame facing the first plate frame. The second connecting portion passes through the second stroke opening and is connected between the second main body portion and the second top pressing portion. The lifting driving assembly comprises a fourth driving member and a fifth driving member. The fourth driving member is arranged on a side of the first plate frame away from the second plate frame, and the fourth driving member is connected with the first main body portion. The fifth driving member is arranged on a side of the second plate frame away from the first plate frame, and the fifth driving member is connected with the second main body portion.

11. The inline optical chip inspection machine of claim 10, wherein, The first top pressing portion is formed with a first avoiding groove for avoiding the first side transmission belt. The second top pressing portion is formed with a second avoiding groove for avoiding the second side transmission belt.

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