Wafer Calibration Mechanism

Abstract

The present invention discloses a wafer calibration mechanism, comprising: a calibration table, on the top of which there is a supporting plate; a positioning and calibration assembly rotatably installed in the central area of the calibration table; and a clamping assembly movably installed on the calibration table; wherein, a wafer to be calibrated is supported above the supporting plate, a calibration port is arranged on the outer periphery of the wafer, a photoelectric sensor is arranged on the supporting plate, and the photoelectric sensor is used for calibrating the wafer; the positioning and calibration assembly limits the wafer to be calibrated located on the supporting plate, and at the same time, under the action of a driving force, the positioning and calibration assembly drives the wafer to be calibrated along a rotation direction so that the calibration port cooperates with the photoelectric sensor to calibrate the wafer. According to the present invention, the positioning-calibration integrated operation of the wafer is realized, the calibration efficiency of the wafer is improved, and finally the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of non-standard automation. More specifically, the present invention relates to a wafer calibration mechanism. Background Art

[0002] In the field of non-standard automation, it is well known to use calibration devices with different structural forms to achieve the calibration of workpieces. In the process of researching and implementing the calibration of workpieces, the inventors found that the calibration devices in the prior art have at least the following problems:

[0003] The existing devices do not firmly position the workpiece, resulting in poor calibration effect of the workpiece and low work efficiency.

[0004] In view of this, it is necessary to develop a wafer calibration mechanism to solve the above problems. Summary of the Invention

[0005] Aiming at the deficiencies in the prior art, the main object of the present invention is to provide a wafer calibration mechanism, which preliminarily positions the wafer through a positioning and calibration component and drives the wafer to rotate to calibrate the wafer, and further positions the wafer through a clamping component to realize the integrated operation of wafer positioning and calibration, improve the calibration efficiency of the wafer, and ultimately improve the work efficiency.

[0006] To achieve these and other advantages in accordance with the present invention, there is provided a wafer calibration mechanism, comprising: a calibration table, on the top of which a supporting plate is provided;

[0007] A positioning and calibration component, which is rotatably installed in the central area of the calibration table; and

[0008] A clamping component, which is movably installed on the calibration table;

[0009] Wherein, a wafer to be calibrated is supported above the supporting plate, a calibration port is arranged on the outer periphery of the wafer, a photoelectric sensor is arranged on the supporting plate, and the photoelectric sensor is used for calibrating the wafer;

[0010] The positioning and calibration component limits the wafer to be calibrated located on the supporting plate. Meanwhile, under the action of a driving force, the positioning and calibration component drives the wafer to be calibrated along a rotation direction so that the calibration port cooperates with the photoelectric sensor to calibrate the wafer.

[0011] Preferably, there are at least two photoelectric sensors, and each photoelectric sensor is arranged in a diffusion manner from the center of the supporting plate towards the outer periphery.

[0012] Preferably, the positioning and calibration component comprises: a calibration driver, which is arranged below the calibration table through a fixing frame;

[0013] A rotating shaft, which is in transmission connection with the power output end of the calibration driver; and

[0014] A positioning plate, which is fixedly connected to one end of the rotating shaft;

[0015] Wherein, an adsorption groove is formed on the surface of the positioning plate, and the calibration driver drives the positioning plate to rotate in a rotation direction.

[0016] Preferably, a connecting air passage is formed inside the rotating shaft, a communication hole is formed in the central area of the positioning plate, and the first and last ends of the communication hole are respectively communicated with the adsorption groove and the connecting air passage.

[0017] The connecting air passage is externally connected to an air source device, and the air source device forms a negative pressure channel through the connecting air passage, the communication hole and the adsorption groove.

[0018] Preferably, an avoidance groove is formed in the central area of the supporting plate, and the positioning plate is arranged in the avoidance groove.

[0019] Preferably, the clamping assembly includes: a clamping driver, which is arranged below the calibration table through a fixing frame;

[0020] A transmission member, which is in transmission connection with the power output end of the clamping driver; and

[0021] At least 3 clamping members are provided, and each clamping member is in transmission connection with the transmission member;

[0022] The clamping driver uses the transmission member to synchronously drive the clamping members to clamp the wafer located on the supporting plate.

[0023] Preferably, at least 3 transmission grooves are formed on the surface of the transmission member, and each transmission groove is arranged in a same-layer array along an array direction, and the cross section of the transmission groove is in an involute shape.

[0024] The bottom of each clamping member is located in a corresponding transmission groove.

[0025] Preferably, the clamping assembly further includes: at least 3 guiding members, and each guiding member is movably connected to the middle area of a corresponding clamping member;

[0026] Guiding grooves are formed on the surface of the supporting plate, at least 3 guiding grooves are provided, and the top of each clamping member penetrates through a corresponding guiding groove.

[0027] Preferably, a feeding port is formed in the circumferential area of the supporting plate.

[0028] One of the technical solutions in the above technical solutions has the following advantages or beneficial effects: The present invention preliminarily positions the wafer through the positioning and calibration assembly and drives the wafer to rotate to calibrate the wafer, and further positions the wafer through the clamping assembly to achieve the integrated operation of wafer positioning and calibration, improving the calibration efficiency of the wafer and ultimately improving the working efficiency.

[0029] Other advantages, objectives and features of the present invention will be partially reflected by the following description and partially understood by those skilled in the art through the research and practice of the present invention. Brief Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention, where:

[0031] Figure 1 3D structural view of the wafer calibration mechanism proposed according to an embodiment of the present invention;

[0032] Figure 2 3D structural view of the wafer calibration mechanism with the wafer hidden proposed according to an embodiment of the present invention;

[0033] Figure 3 Cross-sectional view of the wafer calibration mechanism proposed according to an embodiment of the present invention;

[0034] Figure 4 For Figure 3 Partial enlarged view;

[0035] Figure 5 3D structural view of the positioning and calibration assembly in the wafer calibration mechanism proposed according to an embodiment of the present invention;

[0036] Figure 6 3D structural view of the clamping assembly in the wafer calibration mechanism proposed according to an embodiment of the present invention;

[0037] Figure 7 3D structural view of the clamping assembly in the wafer calibration mechanism from another perspective proposed according to an embodiment of the present invention. Detailed Embodiments

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0039] In the drawings, for clarity, the shapes and dimensions may be enlarged, and the same reference numerals will be used throughout the figures to indicate the same or similar components.

[0040] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art to which the present invention pertains. The terms "first", "second" and similar terms used in the description and claims of this patent application for the invention do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a", "an" or "the" do not denote a limitation of quantity, but indicate the presence of at least one. The terms such as "comprising" or "including" mean that the elements or items appearing before "comprising" or "including" cover the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items. The terms such as "upper", "lower", "left", "right" etc. are only used to indicate the relative positional relationship, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0041] In the following description, terms such as center, thickness, height, length, front, back, rear, left, right, top, bottom, upper, lower, etc. are defined with respect to the configurations shown in the respective drawings. In particular, "height" corresponds to the dimension from top to bottom, "width" corresponds to the dimension from left to right, and "depth" corresponds to the dimension from front to back. They are relative concepts and may therefore change accordingly depending on their different positions and different usage states. Therefore, these or other orientations should not be construed as restrictive terms.

[0042] Terms related to attachment, connection, etc. (e.g., "connect" and "attach") refer to the relationship in which these structures are directly or indirectly fixed or attached to each other through an intermediate structure, as well as the relationship of movable or rigid attachment, unless otherwise explicitly stated.

[0043] According to an embodiment of the present invention in combination with Figures 1 to 7 as shown, it can be seen that the wafer calibration mechanism 120 includes: a calibration table 121, on the top of which a support plate 1211 is provided;

[0044] a positioning and calibration assembly 122, which is rotatably mounted in the central area of the calibration table 121; and

[0045] a clamping assembly 123, which is movably mounted on the calibration table 121;

[0046] Wherein, a wafer 125 to be calibrated is supported above the supporting plate 1211. A calibration port 1251 is provided on the outer periphery of the wafer 125. A photoelectric sensor 1212 is provided on the supporting plate 1211, and the photoelectric sensor 1212 is used to calibrate the wafer 125.

[0047] The positioning and calibration assembly 122 positions and limits the wafer 125 to be calibrated on the supporting plate 1211. Meanwhile, under the action of a driving force, the positioning and calibration assembly 122 drives the wafer 125 to be calibrated in a rotation direction so that the calibration port 1251 cooperates with the photoelectric sensor 1212 to calibrate the wafer 125.

[0048] Furthermore, there are at least two photoelectric sensors 1212, and each photoelectric sensor 1212 is arranged in a diffusive manner from the center of the supporting plate 1211 towards the outer periphery.

[0049] It can be understood that by providing a plurality of photoelectric sensors 1212 and arranging each photoelectric sensor 1212 at different positions, the wafer calibration mechanism of the present invention can calibrate wafers 125 of different models and sizes, having versatility.

[0050] Furthermore, the positioning and calibration assembly 122 includes: a calibration driver 1221, which is arranged below the calibration table 121 through a fixing frame 1213;

[0051] a rotating shaft 1222, which is in transmission connection with the power output end of the calibration driver 1221; and

[0052] a positioning plate 1223, which is fixedly connected to one end of the rotating shaft 1222;

[0053] Wherein, an adsorption groove 12231 is formed on the surface of the positioning plate 1223, and the calibration driver 1221 drives the positioning plate 1223 to rotate in a rotation direction.

[0054] In a preferred embodiment of the present invention, the adsorption groove 12231 includes: at least two circular adsorption grooves 122311, and each circular adsorption groove 122311 is arranged in a diffusive manner from the center of the positioning plate 1223 towards the outer periphery; and

[0055] at least two connecting grooves 122312, each of the connecting grooves 122312 is arranged along the horizontal and vertical directions respectively, and the connecting groove 122312 is communicated with the circular adsorption groove 122311.

[0056] It is understandable that the wafer 125 to be calibrated is placed above the positioning plate 1223. The positioning plate 1223 is adsorbed and limited by a plurality of the circular adsorption grooves 122311 and the communication grooves 122312 to prevent the wafer 125 from moving randomly, thereby preventing the calibration operation of the wafer 125 from being affected. At the same time, in the present invention, by arranging a plurality of circular adsorption grooves 122311 and a plurality of communication grooves 122312, the wafer 125 can be adsorbed more firmly.

[0057] The calibration driver 1221 drives the positioning plate 1223 to rotate through the rotating shaft 1222, and then controls the rotation of the wafer 125 to perform a calibration operation on the wafer 125.

[0058] When the calibration port 1251 of the wafer 125 driven by the calibration driver 1221 reaches the position of the photoelectric sensor 1212, the photoelectric sensor 1212 senses the calibration port 1251 of the wafer 125, and at this time, the calibration of the wafer 125 is completed.

[0059] Specifically, a connection air passage 12221 is opened inside the rotating shaft 1222, a communication hole 12232 is opened in the central area of the positioning plate 1223, and the first and last ends of the communication hole 12232 are respectively communicated with the adsorption groove 12231 and the connection air passage 12221.

[0060] The connection air passage 12221 is externally connected with an air source device, and the air source device forms a negative pressure channel with the connection air passage 12221, the communication hole 12232 and the adsorption groove 12231.

[0061] In a preferred embodiment of the present invention, the communication hole 12232 is communicated with the communication groove 122312.

[0062] It is understandable that in the present invention, the air source device forms a negative pressure channel with the connection air passage 12221 and the communication hole 12232, and further forms a negative pressure channel with a plurality of circular adsorption grooves 122311 and a plurality of communication grooves 122312, so that the circular adsorption grooves 122311 and the communication grooves 122312 adsorb and fix the wafer 125, and further facilitate the calibration operation of the wafer 125.

[0063] Furthermore, an avoidance groove 12112 is opened in the central area of the supporting plate 1211, and the positioning plate 1223 is arranged in the avoidance groove 12112.

[0064] It is understandable that in the present invention, by arranging the positioning plate 1223 in the avoidance groove 12112, the overall structure is compact and the floor space is reduced.

[0065] Further, the clamping assembly 123 includes: a clamping driver 1231, which is arranged below the calibration table 121 through a fixing frame 1213;

[0066] a transmission member 1232, which is in transmission connection with the power output end of the clamping driver 1231; and

[0067] at least three clamping members 1233, each of the clamping members 1233 being in transmission connection with the transmission member 1232;

[0068] The clamping driver 1231 uses the transmission member 1232 to synchronously drive the clamping members 1233 to clamp the wafer 125 located on the support plate 1211.

[0069] It can be understood that the clamping driver 1231 drives the transmission member 1232 to rotate, thereby driving a plurality of clamping members 1233 to move, so as to control the clamping members 1233 to clamp or release the wafer.

[0070] In a preferred embodiment of the present invention, the top of the clamping member 1233 is coated with an outer layer made of a flexible material, so that when the clamping member 1233 clamps the wafer 125, the wafer 125 can be protected, preventing the clamping member 1233 from damaging the wafer 125 and thus increasing the cost.

[0071] Further, a transmission groove 12321 is formed on the surface of the transmission member 1232, and there are at least three transmission grooves 12321. Each transmission groove 12321 is arranged in an array in the same layer along an array direction, and the cross section of the transmission groove 12321 is in an involute shape.

[0072] The bottom of each clamping member 1233 is located in a corresponding transmission groove 12321.

[0073] It can be understood that in the present invention, by providing the involute-shaped transmission groove 12321 and the bottom of the clamping member 1233 being located in the transmission groove 12321, the clamping driver 1231 drives the transmission member 1232 to rotate, synchronously driving a plurality of clamping members 1233 to move, so as to control the clamping members 1233 to clamp or release the wafer.

[0074] Further, the clamping assembly 123 further includes: at least three guiding members 1234, and each guiding member 1234 is movably connected to the middle area of a corresponding clamping member 1233;

[0075] The surface of the supporting plate 1211 is provided with guiding grooves 12111. There are at least three guiding grooves 12111, and the top of each clamping member 1233 penetrates through a corresponding guiding groove 12111.

[0076] It can be understood that by providing the guiding member 1234 and the guiding grooves 12111, the present invention guides the clamping members 1233 to prevent the clamping members 1233 from moving randomly.

[0077] Furthermore, a feeding port 12113 is provided in the circumferential region of the supporting plate 1211.

[0078] It can be understood that by providing a feeding port 12113, the present invention facilitates the placement of the wafer 125 on the positioning plate 1223, and further facilitates the loading and unloading of the wafer 125.

[0079] The number of devices and the processing scale described here are used to simplify the description of the present invention. The application, modification, and variation of the present invention are obvious to those skilled in the art.

[0080] Although the embodiments of the present invention have been disclosed above, it is not limited to the applications listed in the specification and embodiments. It can be fully applied to various fields suitable for the present invention. For those familiar with the field, additional modifications can be easily achieved. Therefore, without departing from the general concept defined by the claims and the equivalent scope, the present invention is not limited to the specific details and the illustrated examples described herein.

Claims

1. A wafer calibration mechanism, characterized in that, Comprising: A calibration table (121) with a supporting plate (1211) provided on its top; A positioning and calibration assembly (122) rotatably installed in the central area of the calibration table (121); and A clamping assembly (123) movably installed on the calibration table (121); Wherein, a wafer (125) to be calibrated is supported above the supporting plate (1211), a calibration port (1251) is provided on the outer periphery of the wafer (125), a photoelectric sensor (1212) is provided on the supporting plate (1211), and the photoelectric sensor (1212) is used to calibrate the wafer (125); The positioning and calibration assembly (122) limits the wafer (125) to be calibrated located on the supporting plate (1211). Meanwhile, under the action of a driving force, the positioning and calibration assembly (122) drives the wafer (125) to be calibrated along a rotation direction so that the calibration port (1251) cooperates with the photoelectric sensor (1212) to calibrate the wafer (125); The clamping assembly (123) includes: a clamping driver (1231) arranged below the calibration table (121) through a fixing frame (1213); A transmission member (1232) drivingly connected to the power output end of the clamping driver (1231); and Clamping members (1233) with no less than 3 provided, and each clamping member (1233) is drivingly connected to the transmission member (1232); The clamping driver (1231) synchronously drives the clamping members (1233) through the transmission member (1232) to clamp the wafer (125) located on the supporting plate (1211); The surface of the transmission member (1232) is provided with transmission grooves (12321) with no less than 3 provided, and each transmission groove (12321) is arranged in a same-layer array along an array direction. The cross-section of the transmission groove (12321) is in an involute shape; The bottom of each clamping member (1233) is located in a corresponding transmission groove (12321).

2. The wafer calibration mechanism according to claim 1, wherein, The photoelectric sensor (1212) has no less than two provided, and each photoelectric sensor (1212) is arranged in a diffusive manner from the center of the supporting plate (1211) towards the outer periphery.

3. The wafer calibration mechanism according to claim 1, wherein, The positioning and calibration assembly (122) includes: a calibration driver (1221) arranged below the calibration table (121) through a fixing frame (1213); A rotating shaft (1222) drivingly connected to the power output end of the calibration driver (1221); and A positioning plate (1223) fixedly connected to one end of the rotating shaft (1222); Wherein, an adsorption groove (12231) is provided on the surface of the positioning plate (1223), and the calibration driver (1221) drives the positioning plate (1223) to rotate along a rotation direction.

4. The wafer calibration mechanism according to claim 3, wherein A connection air passage (12221) is provided inside the rotating shaft (1222). A communication hole (12232) is provided in the central region of the positioning plate (1223). The first and last ends of the communication hole (12232) are respectively communicated with the adsorption groove (12231) and the connection air passage (12221). The connection air passage (12221) is externally connected to a gas source device, and the gas source device forms a negative pressure channel through the connection air passage (12221), the communication hole (12232), and the adsorption groove (12231).

5. The wafer calibration mechanism according to claim 3, characterized in that, An avoidance groove (12112) is provided in the central region of the supporting plate (1211), and the positioning plate (1223) is arranged in the avoidance groove (12112).

6. The wafer calibration mechanism according to claim 1, wherein, The clamping assembly (123) further includes: guiding members (1234), at least 3 of them are provided, and each guiding member (1234) is movably connected to the middle region of a corresponding clamping member (1233). Guiding grooves (12111) are provided on the surface of the supporting plate (1211), at least 3 guiding grooves (12111) are provided, and the top of each clamping member (1233) penetrates through a corresponding guiding groove (12111).

7. The wafer calibration mechanism according to claim 1, wherein A feed port (12113) is provided in the circumferential region of the supporting plate (1211).

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