Cleaning agent, cleaning method and cleaning machine for cleaning 3D printed components

Abstract

The present application discloses a cleaning agent, a cleaning method and a cleaning machine for cleaning 3D printed components, and relates to the field of 3D printing technology. Using alkaline inorganic compounds and water as the main raw materials of the cleaning agent, the alkaline inorganic compounds and esters can undergo saponification reaction to generate alcohols and carboxylates soluble in water, thereby achieving the purpose of cleaning. The use of traditional cleaning agents such as alcohol or isopropanol can be reduced or directly eliminated, thereby reducing costs and reducing the irritation of cleaning agents. At the same time, the use of flammable and explosive organic solvents such as alcohol is reduced, and the safety of operation is improved during the use and storage of cleaning agents.

Description

Technical Field

[0001] The present application relates to the field of 3D printing technology, and in particular to a cleaning agent, a cleaning method and a cleaning machine for cleaning 3D printed components. Background Art

[0002] There is a lot of liquid resin attached to the surface of the 3D printed components obtained by photocuring 3D printing, which needs to be cleaned. The resins used for photocuring 3D printing include water-based resins and solvent-based resins. Water-based resins are hydrophilic and can be dissolved in water. When cleaning the components obtained by 3D printing using them, the relevant technology can directly use water or aqueous solutions for cleaning; while non-hydrophilic resins are often not hydrophilic and are difficult to clean directly with water or aqueous solutions.

[0003] In the related art, when cleaning non-hydrophilic resins, organic solvents such as alcohol or isopropyl alcohol are used. However, this method often requires the use of a large amount of cleaning liquid, and has the following disadvantages: (1) high cost, strong pungent odor, and harmful to the human body; (2) the cleaning liquid is highly volatile, flammable and explosive, and large-scale use or storage is dangerous and poses a safety hazard. Therefore, the method used in the related art is difficult to meet the needs. Summary of the invention

[0004] The purpose of the present application is to provide a cleaning agent, a cleaning method and a cleaning machine for cleaning 3D printed components, aiming to reduce or directly avoid the use of traditional organic cleaning agents, thereby reducing costs, reducing the irritation of cleaning agents, and improving the safety of cleaning operations.

[0005] This application is implemented as follows:

[0006] In a first aspect, the present application provides a cleaning agent for cleaning 3D printed components, comprising water and an alkaline inorganic compound. The alkaline inorganic compound is used as the main raw material of the cleaning agent, and the alkaline inorganic compound and the ester can undergo a saponification reaction to generate alcohol and carboxylate that are soluble in water, thereby achieving the purpose of cleaning.

[0007] In a second aspect, the present application provides a cleaning method for cleaning a 3D printed component, comprising:

[0008] Providing a cleaning agent, wherein the cleaning agent is the cleaning agent in the above embodiment;

[0009] The cleaning agent is used to clean the components to be cleaned. Using alkaline inorganic compounds as the main raw materials as cleaning agents avoids the use of organic solvents such as alcohol or isopropyl alcohol, which is conducive to reducing costs, reducing the irritation of cleaning agents, avoiding the use of flammable and explosive raw materials, and improving the safety of the cleaning process operation.

[0010] In a third aspect, the present application also provides a cleaning machine for implementing the above cleaning method, comprising:

[0011] A cleaning agent supply mechanism, used for supplying cleaning agent or containing cleaning agent during cleaning;

[0012] The cleaning mechanism is used to cooperate with the cleaning agent providing mechanism to use the cleaning agent to clean the component to be cleaned.

[0013] The present application has the following beneficial effects: using alkaline inorganic compounds as the main raw materials of the cleaning agent, the alkaline inorganic compounds and the esters in the 3D printing material can undergo saponification reaction to generate alcohols and carboxylates soluble in water, thereby achieving the purpose of cleaning. The use of the cleaning agent provided by the present application can reduce or directly avoid the use of traditional flammable and explosive organic solvents such as alcohol or isopropanol, thereby reducing costs and reducing the irritation of the cleaning agent. At the same time, the safety of operation is improved during the use and storage of the cleaning agent, which is suitable for industrial production and has very good industrial application prospects.

[0014] It should be added that the surfactants and emulsifiers in the cleaning agent formula can also play a role in dissolving, emulsifying and dispersing, reducing the surface tension and thus removing most of the resin on the surface of the printed part. The introduction of additives is conducive to further improving the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic structural diagram of an embodiment of a cleaning machine provided in this application;

[0017] Figure 2 This is a schematic structural diagram of another embodiment of the cleaning machine provided in this application;

[0018] Figure 3 This is a schematic structural diagram of another embodiment of the cleaning machine provided in this application;

[0019] Figure 4 An exploded view of an embodiment of a cleaning machine is provided in the present application;

[0020] Figure 5 Figure 3 Working principle diagram of the middle nozzle;

[0021] Figure 6A schematic diagram of another embodiment of a cleaning machine provided in the present application;

[0022] Figure 7 A schematic diagram of another embodiment of a cleaning machine provided in the present application;

[0023] Figure 8 A schematic diagram of another embodiment of a cleaning machine provided in the present application;

[0024] Fig. 9 A schematic diagram of another embodiment of a cleaning machine provided in the present application;

[0025] Fig.10 Schematic diagram of the structure of the object to be cleaned in the embodiments and test examples of the present application.

[0026] Icons: 10-cleaning machine; 001-component to be cleaned; 002-printing platform; 003-exclusive ID; 100-cleaning agent supply mechanism; 110-containing chamber; 120-shock absorber; 130-support member; 140-liquid pump; 150-cleaning agent container; 200-cleaning mechanism; 210-physical flushing component; 211-nozzle; 212-guide rail; 213-slider; 214-hinge; 220-fixing component; 230-driving device; 231-rotating shaft component; 232-driving component; 240-feedback component; 241-trigger; 242-sensing component; 250-control mechanism; 300-collecting device; 310-liquid inlet pipe; 320-waste liquid container; 400-curing mechanism; 500-heating mechanism; 600-identification reading mechanism. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below. If the specific conditions are not specified in the embodiments, they are carried out according to the conventional conditions or the conditions recommended by the manufacturer. If the manufacturer is not specified for the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0028] Understandably, the surface of components obtained by 3D printing is often adhered to many raw materials used for printing. For example, the surface of components obtained by photocuring 3D printing will adhere to photocuring resin, and the adhered photocuring resin needs to be cleaned off with a cleaning agent after printing is completed.

[0029] The photocurable resins for 3D printing include water-based resins and solvent-based resins (i.e., hydrophilic resins and non-hydrophilic resins). Among them, water-based resins, such as water-based polyurethane acrylates, contain a certain number of hydrophilic groups and a certain number of unsaturated groups in the molecules. These two groups make the water-based resin hydrophilic and soluble in water. In the related art, when cleaning the components obtained by 3D printing using water-based resins, water or aqueous solutions can be used directly for cleaning. For solvent-based resins, such as UV polyether acrylates, they are often non-hydrophilic and can usually only be dissolved by organic solvents, but not by water. It is difficult to clean them directly with water. Therefore, in the related art, when cleaning the components obtained by 3D printing using solvent-based resins, organic solvents such as alcohol, isopropanol, etc. are often used, and water or aqueous solutions are not used for cleaning. However, when using organic solvents for cleaning, the amount used is often large, the cost is high, and the irritation is strong. In addition, the use and storage process of flammable and explosive reagents such as alcohol have great safety hazards.

[0030] In order to overcome the above technical problems, the inventors of the present application creatively use an aqueous solution of an alkaline inorganic compound to clean the solvent-based resin on the surface of a 3D printed component, thereby reducing or avoiding the use of organic solvents.

[0031] Specifically, the present application provides a cleaning agent for cleaning 3D printed components, comprising water and an alkaline inorganic compound.

[0032] It should be noted that the main components of 3D printing raw materials such as light-cured 3D printing resins are esters. The cleaning agent provided in this application uses OH- in the aqueous solution of alkaline inorganic compounds and -COO- in the resin remaining on the surface of the 3D printed component to undergo a saponification reaction to generate alcohol and carboxylate salts that are soluble in water, thereby achieving the purpose of cleaning. In this way, the above-mentioned cleaning agent can be used to replace the organic solvent to clean the component to be cleaned, or the cleaning agent provided in this application can be used for preliminary cleaning, and then the organic solvent can be used for re-cleaning, thereby avoiding or at least reducing the use of organic solvents, thereby improving the safety of cleaning and reducing the cleaning cost.

[0033] It should be noted that, although the above-mentioned cleaning agent is used to solve the problem that solvent-based resins can only be cleaned with organic solvents, in actual use it can of course also be used to clean components printed with water-based resins as raw materials, and this is not limited in this application.

[0034] In some embodiments, the cleaning agent used to clean 3D printed components includes, by mass percentage: 80%-99.5% water, 0.5%-20% alkaline inorganic compounds, 0-19.5% surfactants, 0-1% emulsifiers, and 0-1% defoamers. While the alkaline inorganic compounds and esters undergo saponification reactions, the surfactants and emulsifiers in the alkaline cleaning agent formula can also play a role in dissolving, emulsifying, and dispersing, reducing surface tension to remove most of the resin on the surface of the component to be cleaned, and improving the cleaning effect. In some embodiments, while the alkaline inorganic compounds and esters undergo saponification reactions, the surfactants and emulsifiers in the alkaline cleaning agent formula can also play a role in dissolving, emulsifying, and dispersing, reducing surface tension to remove most of the resin on the surface of the printed part, and improving the cleaning effect.

[0035] Specifically, the water content can be 80%, 82%, 84%, 86%, 88%, 90%, 92%, 94%, 96%, 98%, 99%, 99.5%, etc., or any value between the above adjacent content values; the content of the alkaline inorganic compound can be 0.5%, 1%, 2%, 4%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%, etc., or any value between the above adjacent content values; The content of surfactant can be 0%, 1%, 3%, 5%, 7%, 9%, 11%, 13%, 15%, 17%, 19%, 19.5%, etc., or any value between the above adjacent content values; the content of emulsifier can be 0%, 0.5%, 1.0%, etc., or any value between the above adjacent content values; the content of defoamer can be 0%, 0.5%, 1.0%, etc., or any value between the above adjacent content values.

[0036] Specifically, taking the alkaline inorganic compound as NaOH as an example, the above saponification reaction is as follows:

[0037] R′OOCR+3NaOH=3RCOONa+R′OH (wherein R and R′ represent hydrocarbon groups).

[0038] Based on the principle of saponification reaction, the efficiency of the saponification reaction can be further improved by some auxiliary means, thereby improving the cleaning efficiency of the cleaning agent on the components to be cleaned, such as heating, sufficient stirring, adding some alcohol, etc. Among them, the principle of adding alcohol to improve the reaction efficiency is: because oil and water are incompatible, adding an intermediate medium can increase the reaction rate.

[0039] Specifically, the emulsification effect is mainly that the emulsifier can reduce the interfacial tension. Under fluid dynamics, the oil film breaks into tiny beads, detaches from the interface to form an emulsion, and is carried away by water under the action of physical scouring; at the same time, the surfactant has the function of dispersing, suspending and wetting the surface of the workpiece, which can prevent the grease from being re-adsorbed on the surface of the workpiece.

[0040] Further, the alkaline inorganic compound is at least one of a soluble alkali, a soluble alkaline salt, etc. Among them, the soluble alkali can be sodium hydroxide, potassium hydroxide, etc.; the soluble alkaline salt is selected from at least one of carbonates, bicarbonates, hydrogen phosphates, sulfites, acetates, sulfides, silicates, phosphates, metaaluminates and hypochlorites; specifically, the soluble alkaline salt is a sodium salt and / or a potassium salt, for example, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, sodium hydrogen phosphate, potassium hydrogen phosphate, disodium hydrogen phosphate, dipotassium hydrogen phosphate, sodium sulfite, potassium sulfite, sodium acetate, potassium acetate, sodium sulfide, potassium sulfide, sodium silicate, potassium silicate, sodium phosphate, potassium phosphate, sodium metaaluminate, potassium metaaluminate, sodium hypochlorite, potassium hypochlorite, etc. However, the types of alkaline inorganic compounds are not limited to the above.

[0041] Furthermore, the surfactant is selected from at least one of anionic surfactants, cationic surfactants, zwitterionic surfactants and nonionic surfactants; wherein the anionic surfactant is selected from at least one of stearic acid and dodecylbenzene sulfonate; the cationic surfactant is a quaternary ammonium compound; the zwitterionic surfactant is selected from at least one of lecithin, amino acid type surfactant and betaine type surfactant; the nonionic surfactant is selected from at least one of alkyl glucoside and fatty acid glyceride. Commonly used anionic surfactants, cationic surfactants, zwitterionic surfactants and nonionic surfactants are all within the scope of protection of this application, and the above surfactant types are only examples.

[0042] Furthermore, the emulsifier is an anionic emulsifier; specifically, the emulsifier is selected from at least one of fatty acid soap, alkyl sulfate, sodium dodecylbenzene sulfonate and phosphate. The defoamer is a non-silicon defoamer, such as BYK-054, BYK-057, etc. By optimizing the composition and type of surfactants, emulsifiers and defoamers, the cleaning effect on the resin can be further improved and the cleaning time can be shortened.

[0043] The embodiment of the present application provides a cleaning method for cleaning a 3D printed component. In the cleaning method, a cleaning agent as described in the above cleaning agent embodiment may be provided, and the cleaning agent is used to clean the component to be cleaned, specifically comprising the following steps:

[0044] S1. Clean with the provided cleaning agent

[0045] The components to be cleaned are cleaned by using the provided cleaning agent, and alkaline inorganic compounds are used as the main raw materials as the cleaning agent, which can avoid or reduce the use of organic solvents such as alcohol or isopropyl alcohol, which is conducive to reducing costs, reducing the irritation of the cleaning agent, avoiding the use of flammable and explosive raw materials, and improving the safety of the cleaning process operation. Among them, the specific principle of achieving the cleaning effect is the same as that in the aforementioned cleaning agent embodiment. Please refer to the aforementioned embodiment for relevant details, which will not be repeated here.

[0046] In some embodiments, the step of cleaning the component to be cleaned with a cleaning agent includes: physically flushing the component to be cleaned with the cleaning agent.

[0047] It should be noted that the physical movement corresponding to the so-called "physical flushing" can be applied to the molded part, or to the cleaning agent, or both.

[0048] Among them, the physical flushing method includes at least one of flushing, spraying, bubbling, scrubbing, centrifugation, stirring, ultrasound and eddy current. The inventors found that the use of the cleaning agent in the present application to clean the resin on the component to be cleaned, combined with physical flushing, can significantly improve the cleaning effect and shorten the cleaning time. The cleaning agent can have a certain impact on the object to be cleaned under the action of physical flushing, so that it is easier to separate the object to be cleaned from the component to be cleaned, and it is also easier to take away the waste liquid after cleaning by the cleaning agent under the action of the impact force.

[0049] In some embodiments, the physical flushing method is flushing or spraying, which is simple and easy to use and has a good cleaning effect. In some embodiments, high pressure can be applied to the cleaning agent, so that cleaning is performed by high-pressure flushing or spraying, which can further improve the cleaning efficiency.

[0050] In some embodiments, the physical flushing method is stirring. The stirring can be mechanical stirring or magnetic stirring. For example, the component to be cleaned, the cleaning agent, and the magnet can be put into a container and then placed on a magnetic stirrer. The rotating magnetic field of the magnetic stirrer can be used to drive the magnet to rotate at a high speed. At the same time, the magnet will drive the cleaning agent to flow quickly and flush the resin on the surface of the component to be cleaned, so that the resin is quickly peeled off and dissolved by the cleaning machine, thereby cleaning the component to be cleaned. Of course, after the cleaning of the component to be cleaned is completed, the cleaning agent on the surface of the component to be cleaned can be blown dry with an air gun.

[0051] In some embodiments, the cleaning agent can be heated and the heated cleaning agent can be used to clean the component to be cleaned. Specifically, the cleaning agent can be heated first, and then the heated cleaning agent can be used for cleaning, for example, the heated cleaning agent can be poured or sprayed on the component to be cleaned for cleaning; or the cleaning agent can be heated while cleaning, for example, the cleaning agent and the component to be cleaned are placed in a container with a heating function, so as to clean while heating. The appropriate method can be selected according to actual needs, and is not limited here.

[0052] Specifically, when the cleaning agent is heated, the heating temperature is not limited, and can be selected according to the resin material of the component to be cleaned, as well as the current temperature, air pressure, etc. It should be noted that when the heated cleaning agent is used to clean the component to be cleaned, on the one hand, the cleaning agent at a higher temperature can increase the saponification and emulsification reaction rate and reduce the surface tension; on the other hand, it can increase the solubility of the resin in alkaline inorganic compounds, emulsifiers, etc., thereby increasing the concentration of alkaline inorganic compounds, emulsifiers, etc., and further increasing the saponification and emulsification reaction rate; on the other hand, high temperature can also reduce the viscosity of the resin. Experiments show that when the temperature rises, the viscosity of the resin can decrease exponentially, making it easier for the resin to detach from the surface of the component to be cleaned, especially in combination with physical flushing, especially in the case of high-speed physical flushing, it is easier to flush the resin from the component to be cleaned, thereby greatly reducing the difficulty of cleaning the resin. Moreover, experiments have shown that for some resin materials, the cleaning efficiency can be increased by nearly 1.5 times for every 20°C increase in temperature from room temperature. Therefore, cleaning with a heated cleaning agent can greatly improve the efficiency of resin cleaning.

[0053] In some specific embodiments, the cleaning agent can be heated to 20°C-100°C and used for cleaning. The heating method during cleaning can further improve the cleaning efficiency. Specifically, the heating temperature can be 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, etc., or any value between the above adjacent temperature values.

[0054] Of course, in addition to heating the cleaning agent, the component to be cleaned can also be heated to increase the temperature of the resin to be cleaned on the surface of the component to be cleaned to improve the efficiency of resin cleaning. The specific heating object can be selected according to actual conditions and is not limited here.

[0055] In some specific embodiments, multiple auxiliary means may be used, such as physical flushing and heating at the same time, which is conducive to further improving the cleaning effect. The physical flushing and heating temperatures may be any of the above embodiments, such as flushing or spraying for cleaning, the temperature of the cleaning agent during cleaning is 40°C-50°C, the cleaning time is 3-5 minutes, etc.

[0056] In addition, cleaning can also be carried out in conjunction with shaking. In one application scenario, the component to be cleaned can be swung while spraying; in another application scenario, swinging and spraying can be performed alternately.

[0057] Specifically, in some embodiments, the cleaning method may further include the following step: driving the component to be cleaned to rotate.

[0058] Before the step of cleaning the component to be cleaned with the cleaning agent, the component to be cleaned is driven to rotate so that at least part of the objects to be cleaned on the component to be cleaned are thrown away from the component to be cleaned.

[0059] It should be noted that since the objects to be cleaned before cleaning have a certain viscosity and adhere to the components to be cleaned, by driving the components to be cleaned to rotate centrifugally, part of the objects to be cleaned can be thrown out, which is beneficial to reducing the subsequent cleaning time and reducing the amount of cleaning agent used.

[0060] In one application scenario, the resin in the corners can be thrown out by means of variable speed during the swinging, thereby facilitating the cleaning of the corners of the component to be cleaned.

[0061] Of course, in some embodiments, the driving and rotating step may not be performed, and cleaning may be performed directly, depending on the amount of the object to be cleaned and other requirements.

[0062] In some embodiments, before the step of cleaning the component to be cleaned with the cleaning agent, the cleaning position of the component to be cleaned is first determined; then, based on the cleaning position of the component to be cleaned, the cleaning agent is sprayed onto the component to be cleaned.

[0063] It can be understood that in the embodiment of driving the component to be cleaned to rotate, taking the physical flushing method of spraying as an example, when the component to be cleaned is driven to rotate, it is not necessarily that the component to be cleaned is in the area that can be sprayed in every orientation. Therefore, it is necessary to ensure that the component to be cleaned can stay in the cleaning position after rotation, so that in the subsequent cleaning process, the component to be cleaned is in the area that can be sprayed, thereby achieving effective cleaning; or it can be cleaned while rotating. In this way, spraying is not required when the component to be cleaned is not in the area to be sprayed, and spraying is performed on the component to be cleaned when it is in the area to be sprayed, so as to save the amount of cleaning agent.

[0064] The position of the component to be cleaned may be determined based on the rotation of the component to be cleaned, the initial installation position, etc., and is not specifically limited here.

[0065] In some embodiments, the component to be cleaned is cyclically rotated and sprayed according to a preset number of cycles, and after the cyclic rotation and spraying are completed, the component to be cleaned is driven to rotate to throw the cleaning agent away from the component to be cleaned.

[0066] It is understandable that one rotation and spraying may not be able to completely remove the objects to be cleaned on the surface of the component to be cleaned, and multiple cycles may be required. That is, after one rotation + one spraying, a second rotation + a second spraying, or even another rotation + another spraying, the number of cycles can be determined according to actual needs. It should be pointed out that in the solution where the component to be cleaned requires a long time of rotation and spraying to be cleaned, the use of multiple cycles can improve the cleaning efficiency and reduce the amount of cleaning agent used.

[0067] Of course, in some embodiments, the objects to be cleaned adhering to the surface of the component to be cleaned are small and easy to wash off, and can be cleaned after one rotation and spraying, and circulation is not required at this time.

[0068] In addition, since the surface of the component to be cleaned will be attached with cleaning agent after spraying, the belt cleaning component can be driven to rotate again so that the cleaning agent on the surface can be shaken off by shaking, thereby completing the cleaning.

[0069] When cleaning the component to be cleaned, the state of the component to be cleaned is not limited. For example, during the cleaning process of the component to be cleaned, the component to be cleaned can remain stationary at the cleaning position, and the component to be cleaned can be cleaned with a cleaning agent; or in some embodiments, the component to be cleaned can be driven to perform at least one of differential motion and forward and reverse motion within a preset range of the cleaning position, and during the differential motion and / or forward and reverse motion of the component to be cleaned, the cleaning agent is sprayed on the component to be cleaned. Through differential motion and / or forward and reverse motion, on the one hand, the component to be cleaned can be cleaned more comprehensively, and on the other hand, the object to be cleaned and the cleaning agent can be thrown away from the component to be cleaned, especially the object to be cleaned in the corners of the component to be cleaned that are more difficult to clean can be thrown away, thereby improving the cleaning efficiency and the cleaning effect.

[0070] In some embodiments, the components to be cleaned can be cleaned by using an inorganic cleaning agent for preliminary cleaning and then using an organic solvent for further cleaning. The "inorganic cleaning agent" mentioned here refers to any of the cleaning agents in the aforementioned cleaning agent embodiments, and the "preliminary cleaning" can be any of the cleaning methods in the aforementioned cleaning method embodiments. For details, please refer to the aforementioned embodiments, which will not be repeated here.

[0071] Specifically, after the components to be cleaned are cleaned with the aforementioned inorganic cleaning agent, the components to be cleaned are further cleaned with an organic solvent. The number of cleaning and re-cleaning is one or more times; and when the number is multiple times, a cleaning + re-cleaning cycle can be used. The use of a cleaning agent combined with an organic solvent cleaning method can further improve the cleaning effect. Compared with the method of simply using an organic solvent for cleaning in the aforementioned related technology, the amount of organic solvent used can be significantly reduced, and the cost can also be reduced to a certain extent, and the safety of the cleaning process can be improved.

[0072] In some embodiments, the organic solvent is selected from at least one of ethyl acetate, propylene glycol methyl ether acetate, butyl acetate, alcohol and isopropanol, and can be a single solvent or a mixture of several solvents.

[0073] There is no limit to the method of re-cleaning with an organic solvent. In some embodiments, the step of re-cleaning the component to be cleaned with an organic solvent includes: physically flushing the component to be cleaned with an organic solvent; wherein the physical flushing method includes at least one of flushing, spraying, bubbling, scrubbing, centrifugation, stirring, ultrasound, and vortex. Of course, flushing may not be performed, for example, the component to be cleaned after being cleaned with an inorganic cleaning agent may be placed in an organic solvent and re-cleaned by soaking.

[0074] In addition to physical flushing, the organic solvent cleaning process may also be accompanied by heating and other means, which are not limited here.

[0075] Detergent cleaning (called "rough cleaning") and organic solvent cleaning (called "fine cleaning") can be combined with different cleaning methods, such as: flushing rough cleaning + ultrasonic fine cleaning, spraying rough cleaning + ultrasonic bubbling fine cleaning, spraying rough cleaning + spraying fine cleaning, etc. Among them, the number of rough cleaning and fine cleaning can be one or more times, that is, at least one rough cleaning + at least one fine cleaning. In this way, the components to be cleaned are first cleaned to a certain cleaning level using a rough cleaning process, and then cleaned to the required cleanliness through a fine cleaning process. The required cleanliness level can be cleaned in the shortest time and a certain amount of organic cleaning solvent can be saved. In actual operation, the components to be cleaned can be first cleaned with a detergent using a spray or flushing method, and then the components to be cleaned can be cleaned with an organic solvent using a spray or flushing method.

[0076] S2. Cleaning of cleaning waste liquid

[0077] In the related art, the cleaning waste liquid generated by cleaning the components to be cleaned is often directly discarded, which is not only wasteful but also environmentally unfriendly. In the cleaning method of the present application, after the components to be cleaned are cleaned with the aforementioned inorganic cleaning agent and / or organic solvent, the waste liquid generated by the cleaning can be further cleaned to obtain a reusable inorganic cleaning agent and / or organic solvent. In the actual operation process, the waste liquid after cleaning can be collected and then cleaned in a centralized manner.

[0078] In some embodiments, the step of cleaning the cleaning waste liquid generated by cleaning the component to be cleaned includes: cleaning the cleaning waste liquid by at least one of filtering, photocuring followed by filtering, distillation and rectification. Specifically, one of filtering, photocuring followed by filtering, distillation and rectification can be used, or a combination of several methods can be used.

[0079] Specifically, after cleaning the components to be cleaned with a cleaning agent, cleaning waste liquid is generated. If this part of the waste liquid is not recycled, it will inevitably lead to waste of raw materials. The inventor mainly proposes the following three treatment methods for the cleaning waste liquid, so as to recycle the cleaning waste liquid after treatment, reduce the waste liquid treatment cost, and at the same time improve the use efficiency of the cleaning liquid.

[0080] (1) Filter

[0081] There is no limit to the filtering method. Filter membrane or filter cotton can be used for filtering, so as to filter out the macromolecular substances in the cleaning waste liquid through the filter membrane or filter cotton, filter out the color powder and components with relatively large molecular weight in the waste liquid, especially filter out the residual resin and other organic matter in the cleaning liquid. After filtering out most of it, the cleaning liquid can be recycled and used to improve the cleaning efficiency of the cleaning agent.

[0082] Specifically, the material used for filtering is selected from at least one of ultra-permeable membrane, nano-permeable membrane, selective permeable membrane, polyester fiber filter cotton, synthetic fiber filter cotton, glass fiber filter cotton and activated carbon filter cotton; preferably, ultrafiltration membrane is used to improve the filtering effect and more fully remove the macromolecular substances in the cleaning waste liquid. The inventors found that filtering the used cleaning agent and then using it to clean the 3D printed components again can still achieve a good cleaning effect, and the utilization rate of raw materials is improved by recycling again, and the cleaning cost is reduced.

[0083] (2) Photocuring precipitation

[0084] The cleaning waste liquid obtained after the use of the cleaning agent is photocured and filtered. Photocuring utilizes the characteristics of photocurable resin to irradiate the cleaning waste liquid with ultraviolet light to cure the uncured resin therein, which is then removed after filtration.

[0085] In some embodiments, the cleaning waste liquid is stirred while being irradiated with ultraviolet light. Stirring is performed while curing to fully solidify the resin and form small particles, and then the cured resin is filtered, leaving the cleaning liquid for secondary use. Of course, in some embodiments, stirring is not necessary, and the specific choice can be made according to the actual situation.

[0086] Filtration and photocuring are two different treatment methods, which can be selected according to the different resin contents in the cleaning waste liquid. For example, for waste liquid with low resin content, photocuring and precipitation filtration can be used; for waste liquid with high resin content, filtration can be performed first to filter out the toner substances and a small amount of resin in the alcohol. Since the resin may not be completely precipitated when the resin content is high, photocuring can be used after filtration to precipitate most of the resin.

[0087] (3) Distillation or rectification tower treatment

[0088] The cleaning waste liquid is treated by distillation or rectification tower, the cleaning liquid is distilled out, the invalid residue is removed, and the cleaning liquid is recycled for secondary use. The rectification tower can also control the concentration of the distilled cleaning liquid according to the azeotropic point to obtain a cleaning liquid with a fixed concentration to make it more in line with the cleaning requirements.

[0089] S3, post-curing

[0090] After the step of cleaning the component to be cleaned with a cleaning agent, the component to be cleaned may be post-cured; wherein the post-curing treatment is to use a UV curing lamp and / or a thermal curing device to treat the component to be cleaned. Specifically, the post-curing treatment is not limited to the UV curing lamp and the thermal curing device, and may also be implemented in other ways.

[0091] It should be noted that S2-S3 in the present application specification can be performed selectively as needed, and the order is not limited to the current limitation. For example, the cleaning waste liquid can be cleaned first and then post-curing can be performed.

[0092] The present application also provides a cleaning machine 10 for implementing the above cleaning method. Figure 1 and Figure 2 , including: a cleaning agent providing mechanism 100 and a cleaning mechanism 200, the cleaning agent providing mechanism 100 is used to provide cleaning agent or contain cleaning agent during cleaning, and the cleaning mechanism 200 is used to cooperate with the cleaning agent providing mechanism 100 to use the cleaning agent to clean the component 001 to be cleaned.

[0093] It should be noted that the cleaning agent provided or contained by the cleaning agent providing mechanism 100 is the cleaning agent in the aforementioned cleaning agent embodiment, and the cleaning method implemented by the cleaning machine 10 is the method involved in the aforementioned cleaning method embodiment. For relevant details, please refer to the above embodiments and will not be repeated here.

[0094] In some embodiments, the cleaning method of the cleaning machine 10 for the component to be cleaned 001 is immersion cleaning. In this case, the cleaning agent providing mechanism 100 and the cleaning mechanism 200 can be the same mechanism; in other embodiments, such as the cleaning method of the cleaning machine 10 for the component to be cleaned 001 is ultrasonic cleaning, in this case, the cleaning agent providing mechanism 100 can be a mechanism for containing the cleaning agent and the component to be cleaned 001, and the cleaning mechanism 200 can be a mechanism with ultrasonic function, which cleans the component to be cleaned 001 by generating ultrasonic effect on the cleaning agent and / or the component to be cleaned 001.

[0095] In some embodiments, in order to improve the cleaning effect, physical flushing can be used for cleaning. Specifically, the cleaning agent providing mechanism 100 includes a containing chamber 110, which is used to contain the component to be cleaned 001 and / or the cleaning agent; the cleaning mechanism 200 includes a physical flushing component 210, which is connected to the containing chamber 110 and is used to generate relative movement between the cleaning agent and the component to be cleaned 001, so that the cleaning agent physically flushes the component to be cleaned 001.

[0096] like Figure 1 As shown, the storage bin 110 can contain cleaning agents, and the physical flushing generating component 210 can be a spray component, the outlet of the spray component can be arranged toward the component to be cleaned 001, and the inlet can be connected with the storage bin 110 through a pipeline, and the cleaning agent therein is extracted and sprayed on the component to be cleaned 001 through the outlet. It can be understood that the cleaning agent sprayed by the spray component can have a certain impact on the component to be cleaned 001, and under the impact, it can be easier to take away the object to be cleaned (such as the aforementioned photocurable resin) on the component to be cleaned 001.

[0097] Further, if Figure 2 As shown, the containing chamber 110 can contain the cleaning agent and the component to be cleaned 001, and the physical flushing generating assembly 210 can be a centrifugal rotating assembly, and the component to be cleaned 001 can be fixed on the centrifugal rotating assembly. During the cleaning process, the centrifugal rotating assembly drives the component to be cleaned 001 to rotate, so that the component to be cleaned 001 and the cleaning agent in the containing chamber 110 collide with each other, thereby accelerating the cleaning of the component to be cleaned 001.

[0098] Of course, the physical flushing component 210 is not limited to the above-mentioned components capable of spraying or centrifugal rotation, but can also be a component capable of at least one of flushing, bubbling, scrubbing, stirring, vortex, ultrasound, etc. In other words, the physical flushing component 210 can have one of the above-mentioned functions, or can have multiple functions, which can be selected according to actual needs and is not limited here.

[0099] Please also read Figure 3 and Figure 4 In some embodiments, the physical flushing component 210 includes a nozzle 211, the outlet of the nozzle 211 is connected to the containing chamber 110, and is used to spray the cleaning agent into the containing chamber 110 through the outlet of the nozzle 211. The nozzle 211 is used to spray the cleaning agent onto the component to be cleaned 001, so that the resin on the component to be cleaned 001 reacts with the cleaning agent and is washed away by the cleaning agent under the action of the spray.

[0100] In some embodiments, the cleaning agent providing mechanism 100 also includes a liquid pump 140 connected to the nozzle 211 and a cleaning agent container 150 for providing cleaning agent. The cleaning agent container 150 is located outside the containing chamber 110. One end of the liquid pump 140 is connected to the cleaning agent container 150 through a pipe, and the other end of the liquid pump 140 is connected to the nozzle 211 through a pipe. The nozzle 211 is at least partially located in the containing chamber, and is used to spray the cleaning agent on the component 001 to be cleaned.

[0101] In some embodiments, please combine Figure 3-5 The cleaning mechanism 200 also includes a fixing assembly 220 and a driving device 230. The fixing assembly 220 is at least partially located in the accommodating chamber 110 and is used to fix the component to be cleaned 001. The driving device 230 is connected to the fixing assembly 220 and is used to drive the fixing assembly 220 to rotate centrifugally to drive the component to be cleaned 001 to rotate centrifugally.

[0102] In one embodiment, the centrifugal rotation of the component to be cleaned 001 driven by the driving device 230 can be used to at least partially remove the objects to be cleaned adhering to the surface of the component to be cleaned 001, and then the cleaning agent is sprayed to the component to be cleaned 001 through the nozzle 211 for cleaning, thereby reducing the amount of cleaning agent used.

[0103] Specifically, before spraying, the driving device 230 can be controlled to centrifugally rotate the component to be cleaned 001. It should be pointed out that, especially when the component to be cleaned 001 is centrifugally rotated for the first time, the resin on the surface of the component to be cleaned 001 has not been mixed with the cleaning agent, the viscosity is high, and the amount of resin residue is large. The speed of centrifugal rotation can be increased to throw away most of the resin on the surface of the component to be cleaned 001 through high-speed centrifugal rotation, so that the cleaning agent can more easily dissolve and peel off the resin on the surface of the component to be cleaned 001.

[0104] Specifically, the driving device 230 may include a rotating shaft assembly 231 and a driving assembly 232, wherein one end of the rotating shaft assembly 231 is connected to the driving assembly 232, and the other end is connected to the fixing assembly 220. The rotating shaft assembly 231 rotates under the drive of the driving assembly 232, thereby driving the component to be cleaned 001 fixed on the fixing assembly 220 to rotate.

[0105] Among them, the vertical center line of the component to be cleaned 001 may or may not coincide with the rotation axis of the shaft assembly 231, as long as the component to be cleaned 001 can be rotated by the driving device 230, it belongs to the protection scope of the present application. When the placement position of the component to be cleaned 001 is not symmetrically designed based on the rotation axis of the shaft assembly 231, for example, in order to miniaturize the resin device, when the cleaning machine 10 only operates one component to be cleaned 001, in order to avoid the resin from shaking, the vertical center line of the component to be cleaned 001 may coincide with the rotation axis of the shaft assembly 231. In other preferred embodiments, the center of gravity of the component to be cleaned 001 is close to or coincides with the rotation axis of the shaft assembly 231. In other words, the center of gravity of the fixed assembly 220 will deviate from the rotation axis of the shaft assembly 231 by a distance to ensure that after the component to be cleaned 001 is placed in the cleaning machine 10, the vertical center line or center of gravity of the overall structure composed of the component to be cleaned 001 and the fixed assembly 220 coincides with the rotation axis of the shaft assembly 231.

[0106] It is understandable that during the 3D printing process, the printed part is formed by adhering layer by layer on the printing platform 002, so the component to be cleaned obtained after 3D printing is bonded to the printing platform 002. In the related art, the component to be cleaned needs to be removed from the printing platform 002 first, and then the component to be cleaned 001 is cleaned. In the present application, the printing platform 002 can be a disposable platform, and after printing, it can be post-processed together with the component to be cleaned 001, and the two can be separated in the subsequent appropriate link.

[0107] In some embodiments, the component to be cleaned 001 is connected to the printing platform 002. When the cleaning machine 10 is used for cleaning, the printing platform 002 can be fixed to the fixing assembly 220, so as to fix the component to be cleaned 001. In this embodiment, the component to be cleaned 001 is located on the side of the printing platform 002 away from the fixing assembly 220, and the component to be cleaned 001 is connected to the printing platform 002. The vertical center line of the fixing assembly 220 can be located on one side of the vertical center line (i.e., the rotation axis) of the shaft assembly 231, and the vertical center line of the component to be cleaned 001 is located on the other side of the vertical center line of the shaft assembly 231. By arranging the fixing assembly 220 on one side of the shaft assembly 231 and the component to be cleaned 001 on the other side of the shaft assembly 231, that is, adopting an asymmetric structural design, the size of the cleaning machine 10 is effectively reduced, and the problem of eccentric vibration is avoided.

[0108] If the component to be cleaned 001 is directly fixed on the fixing assembly 220, there is a risk that the fixing assembly 220 will damage the component to be cleaned 001, and the fixed position is difficult to clean. In the above embodiment, the method of fixing the printing platform 002 on the fixing assembly 220 can solve this problem, and the printing platform 002 is a disposable component and will be discarded later, so it does not matter even if it is damaged to some extent when connected to the fixing assembly 220.

[0109] Furthermore, as described in the aforementioned embodiment of the cleaning method, when the component to be cleaned 001 is driven to rotate, it is not necessarily that the component to be cleaned 001 is in the area that can be sprayed in every orientation. Therefore, in order to achieve effective cleaning, the position of the component to be cleaned 001 can be determined first, and then the nozzle 211 can be further controlled to perform spray cleaning based on its position.

[0110] In one embodiment, the cleaning machine 10 further includes a control mechanism 250 and a feedback component 240. The control mechanism 250 is connected to the driving device 230 and the cleaning mechanism 200, and is used to control the driving device 230 to drive the fixing component 220 to rotate, and control the cleaning mechanism 200 (such as the nozzle 211) to clean the component to be cleaned 001; the feedback component 240 is connected to the control mechanism 250, and is used to obtain the position information of the component to be cleaned 001, and feed it back to the control mechanism 250, so that the control mechanism 250 controls the driving of the driving device 230 according to the position information, and controls the cleaning mechanism 200 to clean the component to be cleaned 001. Among them, the connection between the control mechanism 250 and each component can be either a wired connection or a wireless connection, which is not limited here.

[0111] It should be noted that when the feedback component 240 recognizes that the component to be cleaned 001 is within the range of the cleaning position, the position information is fed back to the control mechanism 250, and the control mechanism 250 controls the nozzle 211 to spray the cleaning agent. It is understandable that when the driving device 230 includes a servo motor, the feedback component 240 can be a built-in encoder of the servo motor.

[0112] In some embodiments, the feedback component 240 includes a trigger 241 and a sensor 242. The trigger 241 is connected to the drive device 230 so as to rotate synchronously with the component to be cleaned 001 under the drive of the drive device 230. The position information of the trigger 241 can reflect the position information of the component to be cleaned 001. The sensor 242 is connected to the control mechanism 250 and has a trigger position. When the trigger 241 rotates to the trigger position, the position information is fed back to the control mechanism 250. Specifically, when the trigger 241 is in the trigger position, the component to be cleaned 001 is just within the range of the cleaning position. Therefore, it is only necessary to identify the position information of the trigger 241 to determine the position information of the component to be cleaned 001, and the control system makes a judgment on whether to spray the cleaning agent.

[0113] Specifically, the trigger member 241 includes but is not limited to a sensing sheet. The trigger member 241 is arranged along the horizontal direction of the accommodating bin 110 and is used to trigger the operation of the sensing member 242 when controlled by the sensing member 242 .

[0114] In some embodiments, the sensing member 242 is communicatively connected with the control mechanism 250, the trigger member 241 and the sensing member 242 can rotate relative to each other, and in the rotation direction of the trigger member 241 or the sensing member 242, the sensing member 242 is provided with a trigger station cooperating with the trigger member 241, and the sensing member 242 includes but is not limited to a photoelectric switch, the principle of which is to utilize the obstruction or reflection of the light beam by the detected object, and to select electricity through the synchronization circuit, thereby detecting the presence or absence of the obstructing object.

[0115] In some embodiments, the trigger member 241 rotates along the circumference of the containing chamber 110 through the driving device 230, and the sensing member 242 is connected to the containing chamber 110; in another embodiment, the sensing member 242 is connected to the driving device 230, and the trigger member 241 is connected to the containing chamber 110.

[0116] like Figure 5As shown, when the trigger member 241 is located at the triggering station, the nozzle 211 is set toward the component to be cleaned 001, and the nozzle 211 starts to work; when the trigger member 241 is misaligned with the triggering station by a certain angle, the nozzle 211 stops spraying the component to be cleaned 001. Preferably, the spraying operation is not limited to a single time. In order to make the cleaning more sufficient, the control mechanism 250 can drive the component to be cleaned 001 to return to the triggering station according to the feedback component 240, and clean the component to be cleaned 001 multiple times, and even make the nozzle 211 position aligned with the difficult-to-clean area on the component to be cleaned 001. The component to be cleaned 001 stops rotating within a preset time, and the nozzle 211 performs a targeted spraying operation; it can be understood that the preset stop time can be used as one of the control parameters of the cleaning machine 10. Such a setting can reduce the waste of cleaning solvent, and can fully spray the component to be cleaned 001, and the cleaning machine 10 is more targeted and more intelligent.

[0117] Exemplarily, in addition to obtaining the position information of the component to be cleaned 001 by the cooperation of the trigger member 241 and the sensor member 242 to enable the control mechanism 250 to obtain the number of rotations of the driving device 230, a camera can also be set up to capture the rotation angle of the component to be cleaned 001, etc., which is not limited here.

[0118] In a specific spray cleaning process, the control mechanism 250 can be used to control the spray head 211 to spray the cleaning agent onto the component to be cleaned 001 , thereby achieving cleaning of the component to be cleaned 001 .

[0119] It should be noted that the spray head 211 can be fixedly connected to the storage bin 110 or rotatably connected to the storage bin 110, which makes it convenient for the spray head 211 to spray different components 001 to be cleaned, and has a wider range of uses. Figure 6The physical flushing component may further include a guide rail 212 , a slider 213 and a hinge 214 . Specifically, the guide rail 212 can be set on the side wall of the accommodating bin 110 and arranged along the vertical direction of the accommodating bin 110. The slider 213 can be slidably connected to the guide rail 212. The nozzle 211 is hinged to the slider 213 by a hinge 214 to realize the angle adjustment and position adjustment of the nozzle 211, so as to facilitate the spraying of the parts that are difficult to clean (such as parts with undercuts, corners, etc.), wherein the position adjustment parameter can be set according to the digital three-dimensional model of the component to be cleaned 001. For example, through the 3D printing pre-processing software, the cleaning difficult area in the digital three-dimensional model is identified, and the movement path of the nozzle 211 and / or the component to be cleaned 001 is automatically calculated for the area, and the movement path is converted into the position adjustment parameter of the nozzle 211, and the position of the nozzle 211 on the guide rail 212, the angular position of the nozzle 211, and the rotational position of the component to be cleaned 001 relative to the nozzle 211 are controlled accordingly, thereby making the cleaning machine 10 more intelligent.

[0120] In addition, in addition to improving the cleaning effect by adjusting the position, angle, etc. of the nozzle 211, it can also be achieved by controlling the component to be cleaned 001.

[0121] Specifically, during the process of the nozzle 211 spraying the component to be cleaned 001, the driving device 230 can drive the component to be cleaned 001 to perform differential motion and forward and reverse motion, so as to diversify the working mode of the cleaning machine 10. The working mode of the cleaning machine 10 can be designed specifically for the type of the component to be cleaned 001. Exemplarily, the driving device 230 includes but is not limited to a motor, and the motor controls the component to be cleaned 001 to perform circular motion and reciprocating circular motion within a certain angle range. The driving component 232 and the rotating shaft component 231 can be arranged in the accommodating cavity.

[0122] During the process of spraying the component to be cleaned 001 by the nozzle 211 of the control mechanism 250 in this embodiment, the component to be cleaned 001 swings left and right relative to the nozzle 211 under the drive of the driving device 230, so that the cleaning agent can be fully sprayed onto the surface of the component to be cleaned 001, thereby maximizing the cleaning efficiency of the cleaning agent while saving spraying time and the amount of cleaning agent.

[0123] For example Figure 5 As shown, during spraying, the component to be cleaned 001 can rotate only along the A direction or the B direction relative to the spray head 211, or reciprocately swing along the A direction and the B direction.

[0124] In addition, in the early centrifugal rotation stage, the driving device 230 can also be controlled to drive the component to be cleaned 001 to perform differential motion and forward and reverse motion according to demand, and is not limited to the spray cleaning stage.

[0125] In some embodiments, after the spraying is finished, the driving device 230 can be further controlled to perform a final centrifugal rotation on the component to be cleaned 001 to remove the cleaning agent on the surface of the component to be cleaned 001 to complete the cleaning.

[0126] In other embodiments, according to the shape, size, etc. of the component to be cleaned 001, the control mechanism 250 may be provided with different times of centrifugal rotation and spraying cycle operations to meet its cleaning needs. Specifically, the control mechanism 250 may first control the drive device 230 to perform the first centrifugal rotation on the component to be cleaned 001 to shake off the resin on the surface of the component to be cleaned 001, and then control the spray head 211 to spray the component to be cleaned 001, and then when the number of cycles is greater than 1, continue to perform centrifugal rotation and spraying, and in this cycle, the cleaning agent on the surface of the component to be cleaned 001 can be shaken off and the resin on the surface of the component to be cleaned 001 can be further centrifugally shaken off; accordingly, after each cycle operation, the number of cycles becomes R-1, until the number of cycles is not greater than 1, then the control mechanism 250 can control the end of the cycle operation.

[0127] When the number of cycles is equal to 1, the control mechanism 250 can control the driving device 230 to centrifugally rotate the component to be cleaned 001 to remove the cleaning agent sprayed on the surface of the component to be cleaned 001 for the last time, so that the surface of the component to be cleaned 001 is clean and free of resin and cleaning agent residues, and the control mechanism 250 controls the physical flushing component 210 and the driving device 230 to stop working, thereby completing the entire cleaning process.

[0128] Exemplarily, after starting the cleaning machine 10, the control mechanism 250 can automatically obtain control parameters, including but not limited to the rotation speed, the first rotation time, the cycle rotation time, whether to turn on the reverse, the number of centrifugal rotation + spraying cycles, the spin-drying rotation time, and the spraying time. Among them, the rotation speed refers to the rotation speed of the driving device 230 during centrifugal rotation, including the rotation speed during the first centrifugal high-speed rotation, the cycle rotation, and the spin-drying rotation; the first rotation time refers to the movement time of the driving device 230 at a rotation speed of r during the first centrifugal rotation, because at this time the resin on the surface of the component 001 to be cleaned has not been mixed with the cleaning agent, the viscosity is relatively high, and a longer rotation time s is required; the cycle rotation time refers to the movement time of the driving device 230 at a rotation speed of r during centrifugal rotation other than the first time, because at this time the resin on the surface of the component 001 to be cleaned is mixed with the cleaning agent, the viscosity is relatively low, so the rotation time x can be relatively shorter than s; whether Turning on reverse rotation means that when performing centrifugal rotation other than the first time, the rotation direction of the driving device 230 is opposite to the direction of the previous rotation, forming a forward-reverse-forward-reverse alternating mode for centrifugal rotation, so as to ensure that the efficiency of the centrifugal rotation is maximized; the number of centrifugal rotation + spraying cycles refers to the total number R of centrifugal rotations (including the first rotation); the spin-drying rotation time refers to the rotation time of the driving device 230 corresponding to the time when the cleaning agent of the last spray on the surface of the component 001 to be cleaned is removed, so that the surface of the component 001 to be cleaned is clean and free of resin and cleaning agent residues; the spraying time refers to the time for spraying the cleaning agent on the component 001 to be cleaned after each centrifugal rotation is completed.

[0129] In the above-mentioned embodiment, the efficiency of resin removal is effectively improved by centrifugal rotation and the method of reducing resin viscosity. By accurately controlling the position of the component 001 to be cleaned, the cleaning operation of the component 001 to be cleaned is made more intelligent.

[0130] Furthermore, for the above-mentioned cleaning machine 10, corresponding components can be controlled to perform different functions according to different cleaning requirements.

[0131] In one embodiment, the cleaning of the component to be cleaned 001 includes rough cleaning and fine cleaning. Specifically, the component to be cleaned 001 and the printing platform 002 can be fixed on the fixing assembly 220, and the nozzle 211 can be connected to the cleaning agent supply mechanism 100 containing inorganic cleaning agent, and then the control mechanism 250 can control the nozzle 211 to spray the inorganic cleaning agent to the component to be cleaned 001 for rough cleaning; then the nozzle 211 is connected to the cleaning agent supply mechanism 100 containing organic solvent, and the control mechanism 250 controls the nozzle 211 to spray the organic solvent to the component to be cleaned 001 for fine cleaning. Of course, the rough cleaning and fine cleaning and the number of cycles can also be set to one or more times according to actual needs.

[0132] Of course, there can be more than one nozzle 211. In one application scenario, different nozzles 211 can be connected to the cleaning agent providing mechanism 100 of different cleaning agent types; in another application scenario, different nozzles 211 can be set at different positions to make the cleaning of the component 001 to be cleaned more comprehensive.

[0133] For further information, see Figure 7 In some embodiments, the cleaning machine 10 further includes a heating mechanism 500 for heating the component to be cleaned 001 and / or the cleaning agent. The heating mechanism 500 can be provided as required and can be located inside or outside the containing chamber 110. Specifically, the heating mechanism 500 can be selected from a hot air blower, a resistance heating element, and a heating tube, which is not limited in the present application, as long as the component to be cleaned 001 and / or the cleaning agent can be heated.

[0134] exist Figure 3 In the illustrated embodiment, the heating mechanism 500 may be disposed on the cleaning agent container 150 to heat the cleaning agent, so that when the nozzle 211 is used to spray the component to be cleaned 001 , what is sprayed out is the heated cleaning agent.

[0135] Please continue reading Figure 3 In some embodiments, the cleaning machine 10 further includes a collecting device 300, which includes a liquid inlet pipe 310 and a waste liquid container 320. One end of the liquid inlet pipe 310 is connected to the receiving chamber 110, and the other end is connected to the receiving chamber 110. During or after cleaning, the cleaning waste liquid in the receiving chamber 110 can be discharged into the waste liquid container 320 through the liquid discharge pipe, and the waste liquid can be recycled or cleaned.

[0136] In some embodiments, please refer to Figure 8 The cleaning machine 10 further includes a curing mechanism 400, which is arranged corresponding to the receiving chamber 110 and is used to perform a curing treatment on the component to be cleaned 001. At least one curing mechanism 400 is also installed in the receiving chamber 110, and the curing mechanism 400 is arranged corresponding to the fixing assembly 220 to perform a curing treatment on the component to be cleaned 001 on the fixing assembly 220. The curing means can be used to perform a curing treatment on the component to be cleaned 001 or the cleaning waste liquid while cleaning.

[0137] In some embodiments, the control mechanism 250 can obtain the position information of the component to be cleaned 001 through the feedback component 240, and then accurately control the rotation position of the component to be cleaned 001 through the driving device 230, so that the component to be cleaned 001 is in the optimal curing position angle, and the curing mechanism 400 performs sufficient post-curing operations on the component to be cleaned 001, making the post-curing operation more intelligent.

[0138] Please refer to Fig. 9 In order to achieve a more intelligent design, in another embodiment, an identification reading mechanism 600 such as a reader or a code scanning device is provided in the accommodating chamber 110, and a unique ID 003 is provided on the printing platform 002. The unique ID 003 is used to associate the component to be cleaned 001 and the control parameters. The unique ID 003 can be a matrix code (such as a two-dimensional code, a bar code, etc.), an electronic tag (RFID or NFC), or an identification code composed of contents including but not limited to numbers, letters and text. Of course, a matrix code or an identification code can also be directly formed on the component to be cleaned 001. Before the cleaning machine 10 is operated, the ID 003 is read by the identification reading mechanism 600, and the control parameters corresponding to the current component to be cleaned 001 can be matched and obtained.

[0139] Exemplarily, the user directly inputs the corresponding control parameters on the operation interface of the cleaning machine 10, or selects the application type of the current component to be cleaned 001. Different application types will have corresponding control parameters of the cleaning machine 10 in the database. The control parameters are mainly used to control the physical flushing component 210 and the driving device 230. The control parameters include but are not limited to the centrifugal speed, centrifugal rotation time, working parameters of the physical flushing component 210, etc. It can be understood that the structure of the physical flushing component 210 determines the type of the working parameters of the physical flushing component 210. In the present application, when the physical flushing component 210 includes a nozzle 211 for spraying a solvent, the working parameters of the physical flushing component 210 include the cleaning agent spraying time, the spraying pressure, etc.; when the physical flushing component 210 includes a heating mechanism 500 for heating the component to be cleaned 001, the working parameters of the physical flushing component 210 include the heating time, the heating temperature, the heating power, etc.; when the physical flushing component 210 includes a vacuum pump that puts the component to be cleaned 001 in a vacuum state, the working parameters of the physical flushing component 210 include the pressure, the vacuum maintenance time, etc.

[0140] It can be understood that the interconnection method between the cleaning machine 10 and the printer is automatically entered. Before printing, the user has set the corresponding printing process and the control parameters of the cleaning machine 10. Before printing starts, the printing process and the control parameters of the cleaning machine 10 have been sent to the printer and the cleaning machine 10 through a wired or wireless connection method (such as wifi, Bluetooth, network). The printing steps and the cleaning steps are continuous. After printing, the printer directly puts the component to be cleaned 001 into the containing chamber 110. When the component to be cleaned 001 is identified, the resin cleaning operation is automatically performed to realize intelligent work.

[0141] In some embodiments, it also includes an ultrasonic vibration mechanism for ultrasonically vibrating the component to be cleaned 001 and / or a vacuum pump for vacuuming the receiving chamber 110. That is, the cleaning machine 10 can also include structures such as an ultrasonic machine and a vacuum pump to assist ultrasonic and vacuum means.

[0142] The specific structure of the cleaning machine 10 provided in the embodiment of the present application is not limited. In a preferred embodiment, it can realize functions such as heating, physical flushing, waste liquid collection, and solidification, but the specific structure is not limited.

[0143] In some embodiments, in order to better support the storage bin 110, please continue to refer to Figure 3 and Figure 4 The cleaning agent providing mechanism 100 also includes a support member 130 and a shock-absorbing member 120 disposed between the accommodating bin 110 and the support member 130. At least one shock-absorbing member 120 is provided, and the shock-absorbing members 120 are distributed around the periphery of the support member 130. When two or more shock-absorbing members 120 are provided, two adjacent shock-absorbing members 120 are spaced apart.

[0144] Exemplarily, the shock absorbing member 120 includes but is not limited to a rubber pad, a shock absorbing pad, a spring, etc., and is used for shock absorption between the receiving bin 110 and the supporting member 130. The shock absorbing member 120 is helpful to reduce the vibration generated by the working between the receiving bin 110 and the supporting member 130, and improve the matching degree and working stability of the receiving bin 110 and the supporting member 130.

[0145] Exemplarily, the accommodating bin 110 and the support member 130 are distributed up and down. Of course, the accommodating bin 110 and the support member 130 can also be distributed in other ways. For example, the support member 130 is arranged on the outer surface of the accommodating bin 110; both the accommodating bin 110 and the support member 130 can be arranged in a cylindrical shape. Of course, the accommodating bin 110 and the support member 130 can also be in other shapes, such as square, etc., which are not specifically limited here.

[0146] The features and performance of the present application are further described in detail below in conjunction with the embodiments.

[0147] The component to be cleaned 001 and the cleaning effect evaluation method in the following embodiments and test examples are described:

[0148] Model HP 2.0 Gray photosensitive resin (mainly acrylic resin) of Heige Technology was used for photocuring 3D printing by UltraCraft A2D equipment of Heige Technology to obtain structural parts A and structural parts B as cleaning objects, such as Fig.10 As shown, the structure of structural part A is simpler than that of structural part B. Then different cleaning levels are formulated according to the final cleaning effect:

[0149] Cleaning level 4 means that the cleaning is very clean, there is no reflection on the surface, the sample is not sticky, and there is no resin residue in the details, pits, and pipes;

[0150] Cleaning level 3 means that there is no resin residue on the outer surface, only slight reflection, the surface is slightly sticky, and there is a trace amount of resin in the details;

[0151] Cleaning level 2 means that most of the resin on the outer surface has been removed, the surface is sticky, and there is more resin residue in the details;

[0152] Cleaning level 1 means that the thicker resin accumulated on the foot surface can be removed, leaving a thinner layer of resin on the surface, and a large amount of resin remains in the details;

[0153] Cleaning level 0 means no significant cleaning effect and the resin cannot be effectively removed.

[0154] Example 1

[0155] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0156] Alkaline inorganic substance NaOH is mixed with water to prepare an alkaline solution with a NaOH mass fraction of 2% and an alkalinity of 11.8. The solution is placed in a 70°C constant temperature water bath. After the temperature reaches 70°C, the 70°C alkaline cleaning solution is loaded into a water flosser. The model of structural part A is rinsed with the water flosser for 30 seconds, and then blown dry with an air gun. The cleaning steps are repeated four times and solidified. The model of structural part B is rinsed with the water flosser for 30 seconds, and then blown dry with an air gun. The cleaning steps are repeated four times and solidified.

[0157] Embodiment 2-4

[0158] The only difference from Example 1 is that the mass fraction of NaOH in the alkaline solution is 4%, 6%, and 8% respectively, and the corresponding alkalinity of Examples 2-4 is 12.44, 12.80, and 13.05 respectively.

[0159] Comparative Example 1

[0160] The only difference from Example 1 is that the mass fraction of NaOH in the alkaline solution is 0%, and the corresponding alkalinity is 6.5.

[0161] After testing, the cleaning levels of the cleaning methods of comparative example 1 and embodiments 1-4 after cleaning the structural part A were 1, 2, 3, 4 and 4 respectively; the cleaning levels of the cleaning methods of comparative example 1 and embodiments 1-4 after cleaning the structural part B were 1, 2, 2, 3 and 4 respectively.

[0162] Example 5

[0163] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0164] The alkaline inorganic substance NaHCO3 is mixed with water to prepare an alkaline solution with a NaHCO3 mass fraction of 2% and an alkalinity of 8.83. The solution is placed in a 70°C constant temperature water bath. After the temperature reaches 70°C, the 70°C alkaline cleaning solution is loaded into a water flosser. The structural part A model is rinsed with the water flosser for 30 seconds, and then blown dry with an air gun. The cleaning steps are repeated four times and solidified. The structural part B model is rinsed with the water flosser for 30 seconds, and then blown dry with an air gun. The cleaning steps are repeated four times and solidified.

[0165] Embodiment 6-8

[0166] The only difference from Example 5 is that the mass fractions of NaHCO3 in the alkaline solution are 4%, 6%, and 8%, respectively, and the corresponding alkalinity of Examples 2-4 is 9.40, 9.61, and 9.85, respectively.

[0167] Comparative Example 2

[0168] The only difference from Example 5 is that the mass fraction of NaHCO3 in the alkaline solution is 0%, and the corresponding alkalinity is 6.5.

[0169] After testing, the cleaning levels of structural part A after cleaning by the cleaning methods of comparative example 2 and embodiments 5-8 are 1, 2, 2, 3 and 4 respectively; the cleaning levels of structural part B after cleaning by the cleaning methods of comparative example 2 and embodiments 5-8 are 1, 1, 2, 2 and 3 respectively.

[0170] By comparison, it can be seen that the cleaning effect of NaOH is slightly better than that of NaHCO3.

[0171] Example 9

[0172] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0173] The alkaline inorganic substance Na2HPO3 is mixed with water to prepare an alkaline solution with a mass fraction of Na2HPO3 of 2%. The alkalinity is 8.7, and the solution is placed in a 70°C constant temperature water bath. After the temperature reaches 70°C, the 70°C alkaline cleaning solution is loaded into a water flosser. The model of structural part A is rinsed with the water flosser for 30 seconds, and then blown dry with an air gun. The cleaning steps are repeated four times and solidified. The model of structural part B is rinsed with the water flosser for 30 seconds, and then blown dry with an air gun. The cleaning steps are repeated four times and solidified.

[0174] Examples 10-12

[0175] The only difference from Example 5 is that the mass fractions of Na2HPO3 in the alkaline solution are 4%, 6%, and 8%, respectively, and the corresponding alkalinity of Examples 2-4 is 9.33, 9.70, and 9.91, respectively.

[0176] Comparative Example 3

[0177] The only difference from Example 9 is that the mass fraction of Na2HPO3 in the alkaline solution is 0%, and the corresponding alkalinity is 6.5.

[0178] After testing, the cleaning levels of the cleaning methods of comparative example 3 and embodiments 9-12 after cleaning the structural part A were 1, 2, 2, 3 and 4 respectively; the cleaning levels of the cleaning methods of comparative example 2 and embodiments 5-8 after cleaning the structural part B were 1, 1, 2, 2 and 3 respectively.

[0179] By comparison, it can be seen that the cleaning effect of Na2HPO3 is roughly the same as that of NaHCO3, and both are worse than NaOH.

[0180] It can be seen from the above embodiments and comparative examples that, under the condition that other conditions are the same, the alkaline solvent can clean the structural parts adhered with the resin, and the higher the proportion of the alkaline solvent, the higher the cleaning efficiency.

[0181] Example 13

[0182] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0183] Select the alkaline substance NaOH and prepare a solution with water at a mass percentage of 6%. Under the condition of a solvent temperature of 25°C, rinse the structural part A model with a water flosser for 30 seconds, and then blow it dry with an air gun. The cleaning steps are repeated. The test shows that the cleaning time is 10 minutes when the cleaning level 4 is reached.

[0184] Examples 14-16

[0185] The only difference from Example 13 is that the solvent temperature is 40° C., 50° C. and 70° C. In the tests of Examples 14 to 16, the cleaning time when the cleaning level 4 is reached is 4 min, 3 min and 2 min.

[0186] By comparing Examples 13-16, it can be seen that, when other conditions are the same, the higher the temperature of the alkaline solvent, the higher the cleaning efficiency.

[0187] Example 17 (Effect of recovery and filtration of alkaline cleaning solution on cleaning efficiency)

[0188] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0189] Select the alkaline substance NaOH, prepare the solution with water according to the mass percentage of 6%, put it into a 70℃ constant temperature water tank, and after the temperature reaches 70℃, load the 70℃ alkaline cleaning solution into the water flosser, rinse the structural part A model with the water flosser for 30s, and then blow it dry with an air gun, repeat the cleaning steps 4 times, and solidify; rinse the structural part B model with the water flosser for 30s, and then blow it dry with an air gun, repeat the cleaning steps 4 times, and solidify. The obtained cleaning grades are 4 and 3 respectively.

[0190] Take half of the above-mentioned cleaning waste liquid and repeat the normal cleaning solution cleaning steps, solidify, and the obtained cleaning grades are 3 and 2 respectively; the other half is filtered using an ultrafiltration membrane to obtain a first filtered NaOH recovery solution (pH value is 13.02), repeat the normal cleaning solution cleaning steps, solidify, and the obtained cleaning grades are 4 and 3 respectively; repeat the filtration of the cleaning waste liquid to obtain a second filtered NaOH solution (pH value is 12.96) and a third filtered NaOH solution (pH value is 12.93), repeat the normal cleaning solution cleaning steps, solidify, and the obtained cleaning grades are 4, 3 and 4, 3 respectively.

[0191] The experimental results show that ultrafiltration membrane filtration can restore the cleaning ability of alkaline cleaning agents to the greatest extent.

[0192] Embodiment 18

[0193] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0194] Select alkaline substance NaOH, prepare a solution with water according to 6% by mass, put it into a 70℃ constant temperature water bath, and after the temperature reaches 70℃, transfer the 70℃ alkaline cleaning solution to an ultrasonic machine, and ultrasonically rough clean structural parts A and B for 5 minutes, and blow dry; replace with new 70℃ alkaline cleaning solution, continue ultrasonic fine cleaning for 20 minutes, blow dry, and solidify, and the obtained cleaning grades are 2 and 1 respectively.

[0195] Embodiment 19

[0196] The only difference from Example 18 is that the cleaning method is different, as follows:

[0197] Select alkaline substance NaOH, prepare a solution with water according to 6% by mass, put it into a 70°C constant temperature water tank, and after the temperature reaches 70°C, transfer the 70°C alkaline cleaning solution to an ultrasonic machine, add a bubbling device at the bottom of the container, and use ultrasonic + bubbling to roughly clean structural parts A and structural parts B for 5 minutes, and blow dry; replace with a new 70°C alkaline cleaning solution, continue ultrasonic + bubbling fine cleaning for 20 minutes, blow dry, and solidify, and the cleaning grades obtained are 4 and 3, respectively.

[0198] It can be seen from Example 17 that rinsing with 70℃ NaOH cleaning solution for 2 minutes with a water flosser can achieve 4 and 3 for structure A and structure B, while in Examples 18 and 19, 5 minutes of ultrasonic rough cleaning + 20 minutes of fine cleaning can achieve 2 and 1, and 5 minutes of ultrasonic bubbling rough cleaning + 20 minutes of fine cleaning can achieve 4 and 3, indicating that for the same alkaline cleaning solution, the cleaning efficiency of different cleaning methods is different.

[0199] Embodiment 20

[0200] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0201] (1) Select an alkaline substance NaOH, prepare a solution with water according to a mass percentage of 6%, put it into a 50°C constant temperature water tank, and after the temperature reaches 50°C, add the 50°C alkaline cleaning solution into a water flosser, rinse the structure A model with the water flosser for 30 seconds, and then blow it dry with an air gun. Repeat the cleaning steps 4 times, and the cleaning level obtained is 3; rinse the structure B model with the water flosser for 30 seconds, and then blow it dry with an air gun. Repeat the cleaning steps 4 times, and the cleaning level obtained is 2.

[0202] (2) The cleaned structural parts A and B are placed in a container containing 99% isopropyl alcohol and ultrasonically cleaned for 30 seconds, blown dry, and cured, and the cleaning level is 4 for both.

[0203] Comparative Example 4

[0204] This comparative example provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0205] The uncleaned structural parts A and B were added to a container filled with 99% isopropanol and ultrasonically cleaned for 90 seconds, and then blown dry, and the cleaning grades obtained were 3 and 2 respectively; the cleaned structural parts A and B were added to a container filled with 99% isopropanol and ultrasonically cleaned for 30 seconds, blown dry, and solidified, and the cleaning grades obtained were both 4.

[0206] According to Example 20 and Comparative Example 4, it can be found that the alkaline cleaning solution combined with an organic solvent for rough cleaning + fine cleaning can completely achieve the cleaning effect of organic solvents for rough cleaning + fine cleaning, and the only disadvantage is that the cleaning time will be slightly extended. However, the use of an alkaline cleaning solution combined with an organic solvent for rough cleaning + fine cleaning can effectively reduce the amount of organic solvent used, reduce costs, and improve the safety of cleaning.

[0207] Examples 21-26

[0208] This embodiment provides a cleaning method for cleaning a 3D printed component, comprising the following steps:

[0209] The C-type dental model was obtained by using the Heige Technology Model HP 2.0 Gray photosensitive resin and 3D printing with the Heige Technology UltraCraft A2D equipment as the cleaning test model. The alkaline substance NaOH was selected and the solution was prepared with water according to the mass percentage of 6%. The dental model was rinsed with a water irrigator and ultrasonically cleaned at the solvent temperature of 40℃, 50℃ and 70℃ respectively. The cleaning accuracy reverse scanning data is shown in Table 1:

[0210] Table 1 Reverse scanning data of cleaning accuracy of different cleaning temperatures and cleaning methods

[0211]

[0212] The reverse scanning data in the table are obtained by comparing with the C-type dental model cleaned using the standard isopropyl alcohol cleaning process.

[0213] According to the data in the above table, the factor affecting the model accuracy by alkaline cleaning solution is mainly thermal deformation. The cleaning temperature, cleaning method and time can be selected according to the thermal deformation temperature of the resin and the acceptable degree of thermal deformation.

[0214] Embodiment 27

[0215] To explore the effect of organic cleaning agent recovery and filtration on cleaning efficiency, the specific methods and test results are as follows:

[0216] Four portions of isopropyl alcohol cleaning agents were selected, one was clean and marked as cleaning agent B, the other three had been used to clean structural parts and the cleaning capacity had reached saturation, one was marked as cleaning agent C, and the remaining two cleaning agents were filtered using ultrafiltration membrane and light-curing superimposed ultrafiltration membrane, respectively, to obtain cleaning agent D and cleaning agent F. These four cleaning agents were used to clean structural parts, and the cleaning efficiency was rated as level 4, among which cleaning agent B could clean 16 structural parts, C could clean 0 structural parts, cleaning agent D could clean 10 structural parts, and cleaning agent F could clean 12 structural parts.

[0217] It can be seen that the cleaning agent capabilities are cleaning agent B>cleaning agent F>cleaning agent D>cleaning agent C. The above tests show that the cleaning ability of the resin-containing cleaning agent can be improved to a certain extent by filtration through ultrafiltration membrane. The cleaning ability of the resin-containing cleaning agent can be further improved by superimposing photocuring with ultrafiltration membrane filtration.

[0218] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0219] Industrial Applicability

[0220] The cleaning agent, cleaning method and cleaning machine 10 for cleaning 3D printed components provided by the present application use alkaline inorganic compounds as the main raw materials of the cleaning agent. The alkaline inorganic compounds and esters can undergo saponification reaction to generate alcohols and carboxylates soluble in water, thereby achieving the purpose of cleaning. The use of the cleaning agent provided by the present application can reduce or directly eliminate the use of traditional cleaning agents such as alcohol or isopropanol, thereby reducing costs and reducing the irritation of the cleaning agent. At the same time, the use of flammable and explosive organic solvents such as alcohol is reduced, and the safety of operation is improved during the use and storage of the cleaning agent. It is suitable for industrial production and has very good industrial application prospects.

Claims

1. A cleaning method for cleaning a 3D printed component, characterized in that: include: Providing a cleaning agent, wherein the cleaning agent comprises water and an alkaline inorganic compound; The cleaning agent is heated to 50° C. to 100° C., and the 3D printed component to be cleaned is preliminarily cleaned with the heated cleaning agent, and the 3D printed component after the preliminarily cleaning is re-cleaned with an organic solvent; The alkaline inorganic compound is sodium hydroxide or potassium hydroxide; In terms of mass percentage, the cleaning agent includes: 80-98% water and 2-20% alkaline inorganic compound; The preliminary cleaning method includes at least one of flushing, spraying, bubbling, brushing, centrifugation, stirring and vortexing.

2. The cleaning method according to claim 1, characterized in that: In terms of mass percentage, the cleaning agent includes 80-96% water, 2-18% alkaline inorganic compound, 1%-17% surfactant, 0.5%-1.0% emulsifier and 0-1.0% defoamer; The surfactant is selected from at least one of anionic surfactants, cationic surfactants, zwitterionic surfactants and nonionic surfactants; wherein the anionic surfactant is dodecylbenzene sulfonate; the cationic surfactant is a quaternary ammonium compound; the zwitterionic surfactant is selected from at least one of lecithin, amino acid type surfactant and betaine type surfactant; the nonionic surfactant is selected from at least one of alkyl glucoside and fatty acid glyceride; The emulsifier is an anionic emulsifier and is selected from at least one of fatty acid soap, alkyl sulfate and phosphate; The defoamer is a non-silicon defoamer.

3. The cleaning method according to any one of claims 1 to 2, characterized in that: Before the step of using the cleaning agent to clean the 3D printed component to be cleaned, the cleaning method further includes: The 3D printed component to be cleaned is driven to rotate so that at least part of the objects to be cleaned on the 3D printed component to be cleaned are thrown away from the 3D printed component to be cleaned.

4. The cleaning method according to claim 3, characterized in that: Before the step of using the cleaning agent to clean the 3D printed component to be cleaned, the method further includes: Determining a cleaning position of the 3D printed component to be cleaned; The step of using the cleaning agent to clean the 3D printed component to be cleaned includes: Based on the cleaning position of the 3D printed component to be cleaned, the cleaning agent is sprayed onto the 3D printed component to be cleaned.

5. The cleaning method according to claim 1, characterized in that: The number of the preliminary cleaning and the re-cleaning is one or more times; The organic solvent is selected from at least one of ethyl acetate, propylene glycol methyl ether acetate, butyl acetate, alcohol and isopropanol; The re-cleaning method is physical flushing, and the physical flushing method includes at least one of flushing, spraying, bubbling, brushing, centrifugation, stirring, ultrasound and vortex.

6. The cleaning method according to claim 1, characterized in that: Also includes: Cleaning the cleaning waste liquid generated by cleaning the 3D printed component to be cleaned to obtain a reusable cleaning agent; Wherein, the cleaning treatment comprises at least one of filtration, photocuring treatment followed by filtration, distillation and rectification.

Images