Wire hanging point load calculation method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application disclose a kind of wire hanging point load calculation method, device, electronic equipment and storage medium, wherein method includes: the first pixel length of the highest point of the other side tower is obtained in the current tower side split sub-conductor convergence point and another side tower, the second pixel length of the other side tower height is obtained;According to the first pixel length, second pixel length and first tower parameter, the inclination angle information at the conductor monitoring point is obtained, and the inclination angle information indicates the inclination angle between the conductor at the conductor monitoring point and horizontal plane;According to the inclination angle information, second tower parameter and first conductor parameter, based on the moment balance condition, the horizontal stress of the conductor is obtained;According to the horizontal stress of the conductor, the inclination angle information, third tower parameter and second conductor parameter, the conductor hanging point load is obtained, it is suitable for the monitoring design of strain tower conductor hanging point load, can improve the reliability and convenience of hanging point load monitoring.

Description

Technical Field

[0001] This invention relates to the field of automated testing technology, and in particular to a method, apparatus, electronic device, and storage medium for calculating the load at conductor suspension points. Background Technology

[0002] The load on the conductor suspension point of the overhead transmission line tower is an important input parameter for tower stability analysis, and it has important applications in conductor icing analysis, sag calculation, and galloping analysis.

[0003] Currently, the load on conductor suspension points is mainly obtained through tension sensors. Firstly, this method is costly because tension sensors require custom-designed shapes, typically costing 10,000 to 20,000 yuan each, and each suspension point needs to be installed, resulting in high overall costs. Secondly, sensor installation is difficult, as the tension sensor needs to replace the original suspension point hardware, making the installation process complex. Thirdly, monitoring reliability is insufficient; with multiple tension sensors, the failure of any one sensor will affect the overall monitoring accuracy. Summary of the Invention

[0004] The main objective of this invention is to provide a method, device, electronic device, and storage medium for calculating the load at conductor suspension points, thereby improving the reliability and convenience of conductor suspension point load monitoring.

[0005] To achieve the above objectives, the first aspect of this application provides a method for calculating the load at a conductor suspension point, the method comprising:

[0006] Obtain the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and obtain the second pixel length of the height of the tower on the other side;

[0007] Based on the first pixel length, the second pixel length, and the first tower parameter, the tilt angle information at the conductor monitoring point is calculated, and the tilt angle information indicates the tilt angle between the conductor and the horizontal plane at the conductor monitoring point.

[0008] Based on the tilt angle information, the parameters of the second tower and the parameters of the first conductor, the horizontal stress of the conductor is calculated based on the torque balance condition.

[0009] The load at the conductor suspension point is calculated based on the horizontal stress of the conductor, the tilt angle information, the parameters of the third tower and the second conductor.

[0010] Optionally, the parameters of the first tower include:

[0011] The horizontal distance between the conductor monitoring point and the current tower, the tower height of the other tower, the span between the current tower and the other tower, and the height difference of the conductor suspension point of the current tower relative to the other tower.

[0012] Optionally, the parameters of the second tower include:

[0013] The horizontal distance between the conductor monitoring point and the current tower, the tower height of the other tower, the span between the current tower and the other tower, the height difference of the conductor suspension point of the current tower relative to the other tower, and the height difference angle between the current tower and the other tower;

[0014] The first conductor parameter includes the conductor specific load.

[0015] Optionally, the parameters of the third tower include:

[0016] The horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side;

[0017] The second conductor parameters include conductor specific load, conductor split number, and conductor cross-sectional area.

[0018] Optionally, obtaining the first pixel length between the convergence point of the split sub-conductor and the highest point of the tower on the other side, and obtaining the second pixel length of the height of the tower on the other side, includes:

[0019] Monitoring images are acquired by an image monitoring device installed at the monitoring point of the conductor;

[0020] The monitoring image is identified to obtain the first pixel length between the convergence point of the split sub-conductor and the highest point of the other tower, and the second pixel length of the height of the other tower.

[0021] Optionally, the image monitoring device is powered by mutual inductance through wires;

[0022] The horizontal distance between the image monitoring device and the current tower is less than the horizontal distance between the image monitoring device and the tower on the other side, and the lens of the image monitoring device is facing the tower on the other side and the convergence point of the split sub-conductor.

[0023] To achieve the above objectives, a second aspect of this application provides a device for calculating the load of a conductor suspension point, comprising:

[0024] The acquisition module is used to acquire the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and to acquire the second pixel length of the height of the tower on the other side.

[0025] The calculation module is used to calculate the tilt angle information at the monitoring point of the conductor based on the first pixel length, the second pixel length and the first tower parameters;

[0026] The calculation module is also used to calculate the horizontal stress of the conductor based on the tilt angle information, the second tower parameters and the first conductor parameters, and the torque balance condition.

[0027] The calculation module is also used to calculate the load at the conductor suspension point based on the horizontal stress of the conductor, the tilt angle information, the parameters of the third tower and the parameters of the second conductor.

[0028] Optionally, the parameters of the first tower include:

[0029] The horizontal distance between the conductor monitoring point and the current tower, the tower height of the other tower, the span between the current tower and the other tower, and the height difference of the conductor suspension point of the current tower relative to the other tower.

[0030] Optionally, the computing module is specifically used for:

[0031] The first height difference is calculated based on the first pixel length, the second pixel length, and the tower height of the other side tower.

[0032] The second height difference is calculated based on the first height difference and the height difference of the conductor suspension point of the current tower relative to the other tower.

[0033] The tilt angle information is calculated based on the second height difference, the horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side.

[0034] Optionally, the parameters of the second tower include:

[0035] The horizontal distance between the conductor monitoring point and the current tower, the tower height of the other tower, the span between the current tower and the other tower, the height difference of the conductor suspension point of the current tower relative to the other tower, and the height difference angle between the current tower and the other tower;

[0036] The first conductor parameter includes the conductor specific load.

[0037] Optionally, the parameters of the third tower include:

[0038] The horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side;

[0039] The second conductor parameters include conductor specific load, conductor split number, and conductor cross-sectional area.

[0040] Optionally, the acquisition module is specifically used for:

[0041] Monitoring images are acquired by an image monitoring device installed at the monitoring point of the conductor;

[0042] The monitoring image is identified to obtain the first pixel length between the convergence point of the split sub-conductor and the highest point of the other tower, and the second pixel length of the height of the other tower.

[0043] Optionally, the image monitoring device is powered by mutual inductance through wires;

[0044] The horizontal distance between the image monitoring device and the current tower is less than the horizontal distance between the image monitoring device and the tower on the other side, and the lens of the image monitoring device is facing the tower on the other side and the convergence point of the split sub-conductor.

[0045] A third aspect of this application provides an electronic device including a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform steps as described in the first aspect and any possible implementation thereof.

[0046] To achieve the above objectives, a fourth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to perform the steps of the method described in the first aspect.

[0047] This application provides a method for calculating the load at a conductor suspension point. It obtains the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and the second pixel length of the height of the tower on the other side. Based on the first pixel length, the second pixel length, and the first tower parameter, it calculates the tilt angle information at the conductor monitoring point, indicating the tilt angle between the conductor at the monitoring point and the horizontal plane. Based on the tilt angle information, the second tower parameter, and the first conductor parameter, it calculates the horizontal stress of the conductor based on the moment balance condition. Based on the horizontal stress of the conductor, the tilt angle information, the third tower parameter, and the second conductor parameter, it calculates the load at the conductor suspension point. This method utilizes image recognition without requiring a tension sensor to accurately and quickly obtain the load at the conductor suspension point, simplifying the calculation and improving the reliability and convenience of conductor suspension point load monitoring. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] in:

[0050] Figure 1 A flowchart illustrating a method for calculating the load at a conductor suspension point, provided in an embodiment of this application;

[0051] Figure 2 This is a schematic diagram of a monitoring image provided in an embodiment of this application;

[0052] Figure 3 A schematic diagram of parameters for a two-sided tower provided in an embodiment of this application;

[0053] Figure 4 A flowchart illustrating another method for calculating conductor suspension point load provided in an embodiment of this application;

[0054] Figure 5 This is a schematic diagram of the structure of a conductor suspension point load calculation device provided in an embodiment of this application;

[0055] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0056] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0057] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0058] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0059] The embodiments of this application are described below with reference to the accompanying drawings.

[0060] Please see Figure 1 This is a flowchart illustrating a method for calculating the load at a conductor suspension point in an embodiment of this application. Figure 1 As shown, the method includes:

[0061] 101. Obtain the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and obtain the second pixel length of the height of the tower on the other side.

[0062] 102. Based on the first pixel length, the second pixel length and the first tower parameters, the tilt angle information at the above-mentioned conductor monitoring point is calculated and obtained. The tilt angle information indicates the tilt angle between the conductor and the horizontal plane at the above-mentioned conductor monitoring point.

[0063] 103. Based on the above tilt angle information, the parameters of the second tower and the parameters of the first conductor, the horizontal stress of the conductor is calculated based on the moment balance condition;

[0064] 104. Based on the above-mentioned horizontal stress of the conductor, the above-mentioned tilt angle information, the parameters of the third tower and the second conductor, the load at the conductor suspension point is calculated.

[0065] The execution subject in this application embodiment can be a wire hanging point load calculation device, which can be an electronic device in a specific implementation. The electronic device can be a terminal device, including but not limited to intelligent devices such as desktop computers.

[0066] In a specific implementation, an image monitoring device can collect monitoring images and transmit them back to the backend main station to obtain the aforementioned pixel length information. That is, the method in this application embodiment can be processed by the electronic equipment of the backend main station.

[0067] In one optional implementation, step 101 includes:

[0068] Monitoring images are acquired using image monitoring devices installed at the aforementioned conductor monitoring points;

[0069] The monitoring image is identified to obtain the first pixel length of the junction point of the split sub-conductor and the highest point of the other tower, and the second pixel length of the height of the other tower.

[0070] In one alternative implementation, the image monitoring device is powered by mutual inductance of wires.

[0071] The horizontal distance between the aforementioned image monitoring device and the aforementioned current tower is less than the horizontal distance between the aforementioned image monitoring device and the aforementioned other tower, and the lens of the aforementioned image monitoring device is facing the aforementioned other tower and the aforementioned split sub-conductor convergence point.

[0072] First, the image monitoring device (image sensor) in this embodiment can be installed on the conductor close to the current tower. It can be powered by the mutual inductance of the conductor, and the collected data can be transmitted back to the main station via a wireless IP network. Specifically, the image sensor can be installed on the high-voltage side of the tension clamp of the tension tower. The installation of the image monitoring device must ensure that its camera image includes the convergence point of the aforementioned split sub-conductors, and its shooting angle can be adjusted as needed; and its installation and connection method is not limited.

[0073] Specifically, the monitoring image captured by the image monitoring device can be processed through a series of preprocessing and image recognition processes to obtain the aforementioned first pixel length and second pixel length. The preprocessing may include, but is not limited to, image grayscale conversion, image filtering, edge detection, and edge comparison to improve the contrast of key image information. Image recognition processing can be performed manually or intelligently; this application embodiment does not impose any limitations on this.

[0074] For example, you can refer to Figure 2 The image shown is a schematic diagram of a monitoring image. Figure 2 As shown, the detection image captured by the image monitoring device includes four split sub-conductors. The first pixel length between the convergence point P of the split sub-conductors and the highest point of the tower on the other side is l1, and the second pixel length of the height of the tower on the other side is l2.

[0075] Furthermore, in this embodiment, the line design parameters and identification location are used to calculate the tilt angle information at the conductor monitoring point, that is, the tilt angle between the conductor and the horizontal plane at the conductor monitoring point; and the horizontal stress of the conductor is calculated using known parameters such as the tilt angle information and the conductor moment balance condition; finally, the horizontal stress of the conductor is converted into the load at the conductor suspension point. The tower parameters involved refer to: the characteristic parameters of the current tower, the characteristic parameters of the tower on the other side, and the relevant parameters between the current tower and the tower on the other side; the conductor parameters refer to: the relevant characteristic parameters of the conductor used; the above parameters can be preset values ​​or measured values, which will be described in detail later.

[0076] In one optional implementation, the parameters of the first tower mentioned above include:

[0077] The horizontal distance between the aforementioned conductor monitoring point and the aforementioned current tower, the tower height of the aforementioned other tower, the span between the aforementioned current tower and the aforementioned other tower, and the conductor suspension point height difference between the aforementioned current tower and the aforementioned other tower.

[0078] The horizontal distance between the conductor monitoring point and the current tower can be determined before or during the installation of the image monitoring device. However, some tower parameters in this application, such as the tower height h of the current tower (Tower A), are not specified. A The tower height h of the other tower (Tower B) B The span (i.e., horizontal distance) between the current tower and the tower on the other side. AB The height difference h between the current tower and the conductor suspension point of the other tower. AB This information can be found in the pole and tower details table for the line.

[0079] To more clearly illustrate the various parameters involved in the embodiments of this application, please refer to... Figure 3 , Figure 3 This is a schematic diagram of parameters for a two-sided tower provided as an embodiment of this application. Figure 3 As shown, based on the force analysis, the current tower height h of tower A is expressed. A The tower height h of the other tower (Tower B) B The span between tower A and tower B AB The height difference h between the conductor suspension points of tower A and tower B AB The horizontal distance Δl between the traverse monitoring point and tower A, and the tilt angle θ at the traverse monitoring point. AB The height difference angle β between tower A and tower B AB It also marks some relevant angles and height differences, which will be involved in subsequent calculations.

[0080] Further optionally, step 102 above includes:

[0081] The first height difference is calculated based on the first pixel length, the second pixel length, and the tower height of the other side tower.

[0082] The second height difference is calculated based on the first height difference and the height difference of the conductor suspension point of the current tower relative to the other tower.

[0083] The tilt angle information is calculated based on the second height difference, the horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side.

[0084] The tilt angle information can be represented by a trigonometric function of the tilt angle.

[0085] Specifically, since the image monitoring device is close to the suspension point of tower A, it can be assumed that the height of the image monitoring device is the same as the height of the conductor suspension point. Based on geometric relationships, the conductor satisfies the following:

[0086]

[0087] Δy=h Σ -h AB (2)

[0088] The first height difference mentioned above is represented by h. Σ The aforementioned second height difference is represented by Δy, which can be found in [reference needed]. Figure 3 As shown, the tilt angle θ at the conductor monitoring point AB It satisfies the following relationship:

[0089]

[0090] The tilt angle information obtained at the conductor monitoring point at this time is tanθ. AB .

[0091] In one optional implementation, the parameters of the second tower mentioned above include:

[0092] The horizontal distance between the aforementioned conductor monitoring point and the aforementioned current tower, the tower height of the aforementioned other tower, the span between the aforementioned current tower and the aforementioned other tower, the height difference of the conductor suspension point of the aforementioned current tower relative to the aforementioned other tower, and the height difference angle between the aforementioned current tower and the aforementioned other tower;

[0093] The first conductor parameter mentioned above includes the conductor specific load.

[0094] The load per unit length and unit cross-section of a conductor is called the specific load.

[0095] In this embodiment, based on the torque balance condition and ignoring the influence of the insulator string weight, the conductor monitoring point satisfies the torque balance equation:

[0096]

[0097] Wherein, σ0 represents the horizontal stress of the conductor, in MPa; g0 represents the specific load of the conductor, in N / (m·mm). 2 ); β AB The angle representing the height difference between the two towers.

[0098] In equation (4), only σ0 is an unknown parameter, that is, the horizontal stress σ0 of the conductor can be expressed as:

[0099]

[0100] Based on the steps described above, the load calculation for the conductor suspension point can be performed below.

[0101] In one optional implementation, the parameters of the third tower mentioned above include:

[0102] The horizontal distance between the aforementioned conductor monitoring point and the aforementioned current tower, and the span between the aforementioned current tower and the aforementioned tower on the other side;

[0103] The aforementioned second conductor parameters include conductor specific load, conductor split number, and conductor cross-sectional area.

[0104] Since Tower A is a tension tower, the combined load at its suspension point is the sum of the tensions of all sub-conductors at the suspension point, satisfying the following:

[0105]

[0106] Where N is the number of conductor splits; A is the cross-sectional area of ​​the conductor, in mm². 2 ;

[0107] T A This is the required load at the conductor suspension point (comprehensive load).

[0108] See also Figure 4 , Figure 4 This is a flowchart illustrating another method for calculating the load at a conductor suspension point, provided in an embodiment of this application. Figure 4 As shown, in practical applications, the technical approach for calculating the load at the conductor suspension point may include:

[0109] 1. Install an image monitoring device at the conductor clamp (conductor monitoring point). The setup of the image monitoring device and the acquisition of monitoring images are described in the foregoing embodiments and will not be repeated here.

[0110] 2. Identify the pixel height l1 of the split sub-conductor convergence point, and the pixel height l2 of one side of the tower (i.e., the first pixel length between the split sub-conductor convergence point and the highest point of the other side of the tower, and the second pixel length of the height of the other side of the tower). See details in [link to documentation]. Figure 1 The description of step 101 in the illustrated embodiment will not be repeated here.

[0111] 3. Based on parameters such as tower height, hanging point height difference, and the pixel height from step 2, calculate the tilt angle (or tilt angle information) at the conductor clamp. See [link to documentation] for details. Figure 1 The description of step 102 in the illustrated embodiment will not be repeated here.

[0112] 4. Calculate the horizontal stress in the conductor based on the torque balance condition. See [link to relevant documentation] for details. Figure 1 The description of step 103 in the illustrated embodiment will not be repeated here.

[0113] 5. Calculate the load at the conductor suspension points. See [link / reference needed] for details. Figure 1 The description of step 104 in the illustrated embodiment will not be repeated here.

[0114] Based on the description of the aforementioned method steps, the following is an application example:

[0115] At a certain monitoring tower location, h AB=50m, Tower B height h B =30m, gap l AB =350m, the conductor is 4-split, and the cross-sectional area of ​​the conductor is A = 338.99mm². 2 The specific load of the conductor g0 = 0.03278 N / (m·mm) 2 The distance between the monitoring point and the conductor hanging point is Δl = 10m. Based on edge extraction and calculation of the monitoring image, we have

[0116] According to the calculation method proposed in the embodiments of this application, the following can be obtained:

[0117] h Σ =30 × 5.2 = 156 (m)

[0118] Δy = 156 - 50 = 106 (m)

[0119]

[0120]

[0121] Therefore, the load at the conductor suspension point of tower A is:

[0122]

[0123] When the aggregation point of the split conductor changes in the monitoring image, the load of the corresponding conductor hanging point will also change accordingly. This can be obtained by the conductor hanging point load calculation method in the embodiments of this application, and the curve of image position and conductor hanging point load change can be generated. The embodiments of this application do not limit this.

[0124] In this embodiment, the first pixel length of the convergence point of the split sub-conductor on the current tower side and the highest point of the tower on the other side is obtained, and the second pixel length of the height of the tower on the other side is obtained. Based on the first pixel length, the second pixel length, and the first tower parameter, the tilt angle information at the conductor monitoring point is calculated, and the tilt angle information indicates the tilt angle between the conductor at the conductor monitoring point and the horizontal plane. Based on the tilt angle information, the second tower parameter, and the first conductor parameter, the horizontal stress of the conductor is calculated based on the moment balance condition. Based on the horizontal stress of the conductor, the tilt angle information, the third tower parameter, and the second conductor parameter, the load at the conductor hanging point is calculated. By using image recognition without the need for a tension sensor, the load at the conductor hanging point can be accurately and quickly obtained, the calculation is simple, and the reliability and convenience of conductor hanging point load monitoring are improved.

[0125] In this study, an image sensor is used instead of a tension sensor for monitoring. The image monitoring device is installed on the conductor and can be powered by the conductor, improving its reliability. Compared to tension sensors, the image monitoring device also has the advantages of convenient installation and maintenance, low monitoring cost, and high reliability. Furthermore, based on the monitoring of the convergence point of the split conductors, a method for calculating the comprehensive load of the tension tower conductor suspension point is proposed. This method requires fewer parameters, is simple to calculate, and has good practicality.

[0126] Based on the description of the above embodiments of the conductor suspension point load calculation method, this application also discloses a conductor suspension point load calculation device. Please refer to [link to relevant documentation]. Figure 5 The conductor suspension point load calculation device 500 includes:

[0127] The acquisition module 510 is used to acquire the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and to acquire the second pixel length of the height of the tower on the other side.

[0128] The calculation module 520 is used to calculate the tilt angle information at the monitoring point of the conductor based on the first pixel length, the second pixel length and the first tower parameters.

[0129] The aforementioned calculation module 520 is also used to calculate the horizontal stress of the conductor based on the aforementioned tilt angle information, the second tower parameters, and the first conductor parameters, according to the moment balance condition.

[0130] The aforementioned calculation module 520 is also used to calculate the load at the conductor suspension point based on the aforementioned horizontal stress of the conductor, the aforementioned tilt angle information, the parameters of the third tower and the parameters of the second conductor.

[0131] In one optional implementation, the parameters of the first tower mentioned above include:

[0132] The horizontal distance between the aforementioned conductor monitoring point and the aforementioned current tower, the tower height of the aforementioned other tower, the span between the aforementioned current tower and the aforementioned other tower, and the conductor suspension point height difference between the aforementioned current tower and the aforementioned other tower.

[0133] In one optional implementation, the above-mentioned calculation module 520 is specifically used for:

[0134] The first height difference is calculated based on the first pixel length, the second pixel length, and the tower height of the other side tower.

[0135] The second height difference is calculated based on the first height difference and the height difference of the conductor suspension point of the current tower relative to the other tower.

[0136] The tilt angle information is calculated based on the second height difference, the horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side.

[0137] In one optional implementation, the parameters of the second tower mentioned above include:

[0138] The horizontal distance between the aforementioned conductor monitoring point and the aforementioned current tower, the tower height of the aforementioned other tower, the span between the aforementioned current tower and the aforementioned other tower, the height difference of the conductor suspension point of the aforementioned current tower relative to the aforementioned other tower, and the height difference angle between the aforementioned current tower and the aforementioned other tower;

[0139] The first conductor parameter mentioned above includes the conductor specific load.

[0140] In one optional implementation, the parameters of the third tower mentioned above include:

[0141] The horizontal distance between the aforementioned conductor monitoring point and the aforementioned current tower, and the span between the aforementioned current tower and the aforementioned tower on the other side;

[0142] The aforementioned second conductor parameters include conductor specific load, conductor split number, and conductor cross-sectional area.

[0143] In an optional implementation, the acquisition module 510 is specifically used for:

[0144] Monitoring images are acquired using image monitoring devices installed at the aforementioned conductor monitoring points;

[0145] The monitoring image is identified to obtain the first pixel length of the junction point of the split sub-conductor and the highest point of the other tower, and the second pixel length of the height of the other tower.

[0146] In one alternative implementation, the image monitoring device is powered by mutual inductance of wires.

[0147] The horizontal distance between the aforementioned image monitoring device and the aforementioned current tower is less than the horizontal distance between the aforementioned image monitoring device and the aforementioned other tower, and the lens of the aforementioned image monitoring device is facing the aforementioned other tower and the aforementioned split sub-conductor convergence point.

[0148] Optionally, the conductor suspension point load calculation device 500 may also include a communication module, which is used to receive the monitoring images collected by the image monitoring device, so that the conductor suspension point load calculation device 500 can obtain the first pixel length and the second pixel length by performing image recognition processing on the monitoring images.

[0149] Understandably, this involves Figure 5The relevant content of each module in the above method embodiments has been described in detail, and you can refer to the content of the method embodiments for details; that is... Figure 5 The provided conductor suspension point load calculation device 500 can perform, for example... Figure 1 and Figure 4 Any steps in the illustrated embodiments will not be described in detail here.

[0150] The conductor suspension point load calculation device 500 in this embodiment can obtain the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and obtain the second pixel length of the height of the tower on the other side; based on the first pixel length, the second pixel length, and the first tower parameter, it calculates the tilt angle information at the conductor monitoring point, which indicates the tilt angle between the conductor at the monitoring point and the horizontal plane; based on the tilt angle information, the second tower parameter, and the first conductor parameter, it calculates the horizontal stress of the conductor based on the moment balance condition; based on the horizontal stress of the conductor, the tilt angle information, the third tower parameter, and the second conductor parameter, it calculates the conductor suspension point load. This device uses image recognition without the need for a tension sensor to accurately and quickly obtain the conductor suspension point load, simplifying the calculation and improving the reliability and convenience of conductor suspension point load monitoring.

[0151] In one embodiment of this application, an electronic device is also provided. See also... Figure 6 , Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 6 As shown, the electronic device 600 includes a processor 601 and a memory 602. The memory 602 stores a computer program, which, when executed by the processor 601, will perform actions such as... Figure 1 or Figure 4 Any step in the method embodiment shown. The electronic device 600 may also include input / output devices, etc. In specific embodiments, the electronic device may be a server, terminal device, etc.

[0152] In one embodiment, a computer-readable storage medium is also provided, which stores a computer program that, when executed by a processor 601, causes the processor 601 to perform any of the steps in the above method embodiments.

[0153] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0154] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0155] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for calculating the load at a conductor suspension point, characterized in that, The method includes: Obtain the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and obtain the second pixel length of the height of the tower on the other side; The first height difference is calculated based on the first pixel length, the second pixel length, and the tower height of the other side tower. The second height difference is calculated based on the first height difference and the height difference of the conductor suspension point of the current tower relative to the other tower. Based on the second height difference, the horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side, the tilt angle information is calculated, and the tilt angle information indicates the tilt angle between the conductor at the conductor monitoring point and the horizontal plane; Based on the tilt angle information, the second tower parameters, and the first conductor parameters, the horizontal stress of the conductor is calculated based on the moment balance condition. The first conductor parameters include the conductor specific load, and the second tower parameters include: the horizontal distance between the conductor monitoring point and the current tower, the tower height of the other tower, the span between the current tower and the other tower, the height difference of the conductor suspension point of the current tower relative to the other tower, and the height difference angle between the current tower and the other tower. The formula for calculating the horizontal stress of the conductor is: Where g0 is the specific load of the conductor, β AB Let tanθ be the elevation difference angle between the current tower and the tower on the other side. AB For the tilt angle information, l AB The span between the current tower and the tower on the other side is Δl, where Δl is the horizontal distance between the conductor monitoring point and the current tower, and h is the horizontal distance between the current tower and the tower on the other side. AB The difference in conductor suspension point height between the current tower and the other tower; Based on the horizontal stress of the conductor, the tilt angle information, the parameters of the third tower, and the parameters of the second conductor, the load at the conductor suspension point is calculated. The parameters of the third tower include: the horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the tower on the other side. The parameters of the second conductor include the conductor specific load, the number of conductor splits, and the conductor cross-sectional area. The formula for calculating the load at the conductor suspension point is: Among them, T A Let N be the load at the conductor suspension point, N be the number of conductor splits, and A be the cross-sectional area of ​​the conductor.

2. The method according to claim 1, characterized in that, The step of obtaining the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and obtaining the second pixel length of the height of the tower on the other side, includes: Monitoring images are acquired by an image monitoring device installed at the monitoring point of the conductor; The monitoring image is identified to obtain the first pixel length between the convergence point of the split sub-conductor and the highest point of the other tower, and the second pixel length of the height of the other tower.

3. The method according to claim 2, characterized in that, The image monitoring device is powered by mutual inductance through wires. The horizontal distance between the image monitoring device and the current tower is less than the horizontal distance between the image monitoring device and the tower on the other side, and the lens of the image monitoring device is facing the tower on the other side and the convergence point of the split sub-conductor.

4. A device for calculating the load at a conductor suspension point, characterized in that, The apparatus for performing the method as described in any one of claims 1-3, the apparatus comprising: The acquisition module is used to acquire the first pixel length between the convergence point of the split sub-conductors on the current tower side and the highest point of the tower on the other side, and to acquire the second pixel length of the height of the tower on the other side. The calculation module is used to calculate a first height difference based on the first pixel length, the second pixel length, and the tower height of the other tower; calculate a second height difference based on the first height difference and the conductor suspension point height difference between the current tower and the other tower; and calculate tilt angle information based on the second height difference, the horizontal distance between the conductor monitoring point and the current tower, and the span between the current tower and the other tower. The calculation module is also used to calculate the horizontal stress of the conductor based on the tilt angle information, the second tower parameters and the first conductor parameters, and the torque balance condition. The calculation module is also used to calculate the load at the conductor suspension point based on the horizontal stress of the conductor, the tilt angle information, the parameters of the third tower and the parameters of the second conductor.

5. An electronic device, characterized in that, It includes a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of the method as described in any one of claims 1-3.

6. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, the processor performs the steps of the method as described in any one of claims 1-3.

Images