Substrate liquid processing apparatus and substrate liquid processing method

Abstract

This invention provides a substrate liquid treatment apparatus and a substrate liquid treatment method. The substrate liquid treatment apparatus includes: a treatment tank; a substrate support member that arranges and supports a plurality of substrates in a vertical orientation at predetermined intervals in the horizontal direction; a lifting mechanism that moves the substrate support member up and down between a treatment position within the treatment tank and a retracted position above the treatment tank; a camera unit that is configured to capture images of the positions of the plurality of substrates in the treatment liquid stored in the treatment tank; a substrate position determination unit that determines the substrate position based on image data captured by the camera unit, wherein the substrate position determination determines whether the deviation between the actual position of the plurality of substrates supported by the substrate support member and a reference position where the substrates should be located is within an allowable range; and a control unit that controls the operation of the substrate liquid treatment apparatus. According to this invention, it is possible to confirm whether the substrates are properly held by the substrate support member while immersed in the treatment liquid stored in the treatment tank.

Description

Technical Field

[0001] This invention relates to a substrate liquid treatment apparatus and a substrate liquid treatment method. Background Technology

[0002] In the manufacturing process of semiconductor devices, there is a silicon nitride etching process, which involves immersing a substrate such as a semiconductor wafer in a phosphoric acid aqueous solution stored in a processing tank to perform wet etching of a silicon nitride film formed on the surface of the substrate. The substrate is immersed in the phosphoric acid aqueous solution while being arranged vertically at equal intervals in the horizontal direction and supported by a substrate support member.

[0003] In the substrate processing, a processing liquid flows from the bottom to the surface within the processing tank, and nitrogen bubbling is performed to improve processing uniformity. Therefore, the substrate is subjected to a force in the direction of buoyancy from the substrate holder. In the substrate liquid processing apparatus of Patent Document 1, to prevent the substrate from detaching from the substrate support member or becoming misaligned due to the force exerted on the substrate by the processing liquid, a substrate pressing member is provided on the cover of the processing tank to prevent upward displacement of the substrate.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent document 1: Japanese Patent Application Publication No. 2019-067995. Summary of the Invention

[0007] The problem the invention aims to solve

[0008] The present invention provides a technique for confirming whether a substrate is properly held by a substrate support member while it is immersed in a processing liquid stored in a processing tank.

[0009] Technical means for solving problems

[0010] According to one embodiment of the present invention, a substrate liquid processing apparatus is provided, comprising: a processing tank for storing processing liquid, having an upper opening for feeding and discharging substrates; a substrate support member for arranging and supporting a plurality of substrates in a vertical orientation at predetermined intervals in a horizontal direction; a lifting mechanism for moving the substrate support member up and down through the upper opening between a processing position within the processing tank and a retracted position above the processing tank; a camera unit disposed for capturing images of the positions of the plurality of substrates supported by the substrate support member within the processing liquid stored in the processing tank; a substrate position determination unit for determining the substrate position based on image data captured by the camera unit, wherein the substrate position determination determines whether the deviation between the actual position of the plurality of substrates supported by the substrate support member and a reference position where the substrates should be located is within an allowable range; and a control unit for controlling the operation of the substrate liquid processing apparatus.

[0011] Invention Effects

[0012] Based on the above embodiments, it can be confirmed whether the substrate is properly held by the substrate support member while it is immersed in the processing liquid stored in the processing tank. Attached Figure Description

[0013] Figure 1 This is a schematic plan view showing the overall structure of the substrate liquid treatment system.

[0014] Figure 2 This is a system diagram showing the structure of the etching apparatus assembled in the substrate liquid treatment system.

[0015] Figure 3 This is a rough cross-sectional view of the processing tank of the etching device.

[0016] Figure 4 This is a rough longitudinal section view of the treatment tank along its long side.

[0017] Figure 5 This is a rough plan view of the processing tank.

[0018] Figure 6 It is a longitudinal cross-sectional view of the processing tank, showing only the cover and surrounding components in their closed position.

[0019] Figure 7 It is a three-dimensional diagram of the cover.

[0020] Figure 8 This indicates that the cover is removed from... Figure 6 The diagram shows a longitudinal section in the transverse direction as the closed position is moved to the open position.

[0021] Figure 9This is a schematic diagram showing the camera and lighting positioned above the processing tank.

[0022] Figure 10 It is a schematic diagram showing the proper arrangement of the substrate between the substrate support member and the substrate pressing member.

[0023] Figure 11 It is a schematic diagram representing an image taken by a camera.

[0024] Figure 12 It is a chart that shows the distribution of grayscale values.

[0025] Figure 13 This is a schematic diagram showing a state in which the substrate is not properly positioned between the substrate support member and the substrate pressing member (resulting in a bridging state).

[0026] Figure 14 This is a rough diagram showing the distribution of grayscale values ​​generated during bridging.

[0027] Figure 15 This is a diagram illustrating the shaking of the substrate immediately after it has been immersed in the processing tank.

[0028] Figure 16 This is a schematic diagram showing other configurations of the camera and lighting.

[0029] Explanation of reference numerals in the attached figures

[0030] 34, 34A processing tanks

[0031] 36B substrate support component

[0032] 36 Lifting Mechanism

[0033] 90 Camera Department

[0034] 94 Substrate Position Determination Unit

[0035] 7. Control Department Detailed Implementation

[0036] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, the overall substrate liquid treatment system 1A assembled with a substrate liquid treatment apparatus 1 according to one embodiment of the present invention will be described.

[0037] like Figure 1 As shown, the substrate liquid processing system 1A has a carrier feeding and discharging unit 2, a batch forming unit 3, a batch placing unit 4, a batch conveying unit 5, a batch processing unit 6, and a control unit 7.

[0038] The carrier feeding and discharging unit 2 feeds in and out the carrier 9, which holds multiple (e.g., 25) substrates (silicon wafers) 8 arranged vertically in a horizontal orientation.

[0039] The carrier feeding / discharging unit 2 includes: a carrier platform 10 for holding multiple carriers 9; a carrier conveying mechanism 11 for conveying the carriers 9; carrier storage units 12 and 13 for temporarily storing the carriers 9; and a carrier placement platform 14 for placing the carriers 9. Here, carrier storage unit 12 serves as temporary storage for the substrate 8 of the product before processing in the batch processing unit 6. Furthermore, carrier storage unit 13 serves as temporary storage for the substrate 8 of the product after processing in the batch processing unit 6.

[0040] Furthermore, the carrier infeed / outfeed unit 2 transports the carrier 9, which is fed into the carrier platform 10 from the outside, to the carrier library 12 or the carrier placement platform 14 using the carrier conveying mechanism 11. Additionally, the carrier infeed / outfeed unit 2 transports the carrier 9 placed on the carrier placement platform 14 to the carrier library 13 or the carrier platform 10 using the carrier conveying mechanism 11. The carrier 9 transported to the carrier platform 10 is then discharged to the outside.

[0041] The batch forming unit 3 combines substrates 8 housed in one or more carriers 9 to form a batch consisting of multiple (e.g., 50) substrates 8 processed simultaneously. Furthermore, when forming a batch, the batch can be formed with the patterned surfaces of two adjacent substrates 8 facing each other, or the batch can be formed with all the patterned surfaces of the substrates 8 facing the same direction.

[0042] The batch forming section 3 is provided with a substrate transport mechanism 15 for transporting multiple substrates 8. In addition, the substrate transport mechanism 15 can change the orientation of the substrates 8 from horizontal to vertical and from vertical to horizontal during transport.

[0043] Furthermore, the batch forming unit 3 uses the substrate transport mechanism 15 to transport the substrates 8 from the carrier 9 placed on the carrier placement stage 14 to the batch placement unit 4, thus placing the batch of substrates 8 in the batch placement unit 4. Additionally, the batch forming unit 3 transports the batch placed in the batch placement unit 4 to the carrier 9 placed on the carrier placement stage 14 via the substrate transport mechanism 15. Moreover, the substrate transport mechanism 15, as a substrate support for supporting multiple substrates 8, has two types: a pre-processing substrate support for supporting substrates 8 before processing (before being transported by the batch transport unit 5) and a post-processing substrate support for supporting substrates 8 after processing (after being transported by the batch transport unit 5). This prevents particles or the like adhering to the pre-processing substrates 8 from transferring to the post-processing substrates 8.

[0044] The batch placement unit 4 temporarily places (standby) the batches transported between the batch forming unit 3 and the batch processing unit 6 via the batch transport unit 5 on the batch placement table 16.

[0045] The batch placement section 4 is provided with an infeed-side batch placement stage 17 for batches before placement processing (before being transported by the batch transport section 5) and an outfeed-side batch placement stage 18 for batches after placement processing (after being transported by the batch transport section 5). Multiple substrates 8 in one batch are placed in a vertical arrangement on the infeed-side batch placement stage 17 and the outfeed-side batch placement stage 18.

[0046] Furthermore, in the batch placement section 4, the batches formed by the batch forming section 3 are placed on the feed-side batch placement table 17, and these batches are fed into the batch processing section 6 via the batch transport section 5. In addition, in the batch placement section 4, the batches sent from the batch processing section 6 via the batch transport section 5 are placed on the output-side batch placement table 18, and these batches are transported to the batch forming section 3.

[0047] The batch transport unit 5 transports batches between the batch placement unit 4 and the batch processing unit 6, or within the batch processing unit 6.

[0048] The batch transport unit 5 is equipped with a batch transport mechanism 19 for transporting batches. The batch transport mechanism 19 consists of a guide rail 20 arranged along the batch placement unit 4 and the batch processing unit 6, and a movable body 21 that moves along the guide rail 20 while holding multiple substrates 8. A substrate holding body 22 is provided on the movable body 21 in a retractable manner to hold the multiple substrates 8 arranged in a vertical front-to-back posture.

[0049] Furthermore, the batch transport unit 5 receives batches placed on the feed-side batch placement stage 17 via the substrate holder 22 of the batch transport mechanism 19, and transfers these batches to the batch processing unit 6. Additionally, the batch transport unit 5 receives batches processed by the batch processing unit 6 via the substrate holder 22 of the batch transport mechanism 19, and transfers these batches to the output-side batch placement stage 18. Moreover, the batch transport unit 5 transports batches within the batch processing unit 6 via the batch transport mechanism 19.

[0050] The batch processing unit 6 processes multiple substrates 8 arranged vertically in a front-to-back manner as a batch for etching, cleaning, or drying.

[0051] The batch processing unit 6 is provided with the following in parallel: a drying processing device 23 for drying the substrate 8; a substrate holder cleaning processing device 24 for cleaning the substrate holder 22; a cleaning processing device 25 for cleaning the substrate 8; and two etching processing devices (substrate liquid processing devices) 1 of the present invention for etching the substrate 8.

[0052] The drying apparatus 23 includes a processing tank 27 and a substrate lifting mechanism 28 that is vertically mounted in the processing tank 27. A drying processing gas (IPA (isopropyl alcohol), etc.) is supplied to the processing tank 27. Multiple substrates 8 in one batch are held vertically in the substrate lifting mechanism 28. The drying apparatus 23 receives the batch from the substrate holder 22 of the batch transport mechanism 19 via the substrate lifting mechanism 28, and lifts the batch by the substrate lifting mechanism 28, thereby drying the substrates 8 using the drying processing gas supplied to the processing tank 27. Additionally, the drying apparatus 23 transfers the batch from the substrate lifting mechanism 28 to the substrate holder 22 of the batch transport mechanism 19.

[0053] The substrate holder cleaning and processing apparatus 24 has a processing tank 29, which is configured to supply a cleaning liquid and a drying gas to the processing tank 29. The substrate holder 22 is cleaned by supplying a cleaning liquid to the substrate holder 22 of the batch conveying mechanism 19 and then supplying a drying gas.

[0054] The cleaning and processing apparatus 25 includes a cleaning tank 30 and a rinsing tank 31, and substrate lifting mechanisms 32 and 33 are provided in each of the tanks 30 and 31 for vertical lifting. The cleaning tank 30 stores a cleaning solution (such as SC-1). The rinsing tank 31 stores a rinsing solution (such as pure water).

[0055] The etching processing apparatus 1 includes an etching tank 34 and a rinsing tank 35, and substrate lifting mechanisms 36 and 37 are provided in each of the tanks 34 and 35 in a vertically movable manner. The etching tank 34 stores an etching solution (aqueous phosphoric acid solution). The rinsing tank 35 stores a rinsing solution (pure water, etc.). As described above, the etching processing apparatus 1 becomes a substrate solution processing apparatus based on the present invention.

[0056] These cleaning processing apparatus 25 and etching processing apparatus 1 have the same structure. Regarding the etching processing apparatus (substrate solution processing apparatus) 1, a batch of substrates 8 is held vertically in a front-to-back arrangement in a substrate lifting mechanism 36. In the etching processing apparatus 1, the substrate lifting mechanism 36 receives the batch from the substrate holder 22 of the batch transport mechanism 19, and lifts the batch, thereby immersing the batch in the etching solution in the processing tank 34 for etching of the substrates 8. Afterwards, the etching processing apparatus 1 transfers the batch from the substrate lifting mechanism 36 to the substrate holder 22 of the batch transport mechanism 19. Additionally, the substrate lifting mechanism 37 receives the batch from the substrate holder 22 of the batch transport mechanism 19, and lifts the batch, thereby immersing the batch in the rinsing solution in the processing tank 35 for rinsing of the substrates 8. Afterwards, the batch is transferred from the substrate lifting mechanism 37 to the substrate holder 22 of the batch transport mechanism 19.

[0057] The control unit 7 controls the operation of each part of the substrate liquid treatment system 1A (carrier feeding and discharging unit 2, batch forming unit 3, batch placing unit 4, batch conveying unit 5, batch processing unit 6, etching processing device 1).

[0058] The control unit 7 is, for example, a computer, and has an M that can be read by a computer. The storage medium 38 stores programs that control various processes performed in the substrate liquid treatment apparatus 1. The control unit 7 reads and executes the programs stored in the storage medium 38, thereby controlling the operation of the substrate liquid treatment apparatus 1. Furthermore, the programs can be stored in the computer-readable storage medium 38, but they can also be programs installed in the storage medium 38 of the control unit 7 from other storage media. The computer-readable storage medium 38 can be, for example, a hard disk (HD), floppy disk (FD), optical disk (CD), magneto-optical disk (MO), memory card, etc.

[0059] As described above, in the processing tank 34 of the etching processing apparatus 1, an aqueous solution of a reagent (phosphoric acid) of a specified concentration (phosphoric acid aqueous solution) is used as a processing solution (etching solution) to perform liquid treatment (etching process) on the substrate 8.

[0060] Next, regarding the general results and piping system of the etching processing apparatus (substrate solution processing apparatus) 1, please refer to... Figure 2 Please provide an explanation.

[0061] The etching processing apparatus 1 has the aforementioned processing tank 34, which stores a phosphoric acid aqueous solution of a predetermined concentration as the processing liquid. The processing tank 34 has an inner tank 34A and an outer tank 34B. In the outer tank 34B, the phosphoric acid aqueous solution overflowing from the inner tank 34A flows in. The liquid level in the outer tank 34B is maintained lower than the liquid level in the inner tank 34A.

[0062] The upstream end of a circulation pipe 50 is connected to the bottom of the outer tank 34B. The downstream end of the circulation pipe 50 is connected to a treatment liquid supply nozzle 49 installed in the inner tank 34A. A pump 51, a heater 52, and a filter 53 are sequentially installed in the circulation pipe 50, starting from the upstream side. By driving the pump 51, a circulating flow of phosphoric acid aqueous solution is formed, which is transported from the outer tank 34B through the circulation pipe 50 and the treatment liquid supply nozzle 49 into the inner tank 34A and then flows out from the inner tank 34A back to the outer tank 34B.

[0063] The liquid treatment section 39 is formed by the treatment tank 34, the circulation pipeline 50, and the equipment (51, 52, 53, etc.) within the circulation pipeline 50. In addition, the treatment tank 34 and the circulation pipeline 50 constitute a circulation system.

[0064] Below the treatment liquid supply nozzle 49 in the inner tank 34A, there is a gas nozzle 60 (for bubbling) for discharging inert gases such as nitrogen bubbles from the phosphoric acid aqueous solution in the inner tank 34A. For the gas nozzle 60, inert gases such as nitrogen are supplied from the gas supply source 60B via a flow regulator 60C consisting of an on / off valve, a flow control valve, a flow meter, etc.

[0065] The processing tank 34 is equipped with the aforementioned substrate lifting mechanism 36. The substrate lifting mechanism 36 can maintain a plurality of substrates 8 in a vertically erected position, spaced apart in the horizontal direction, and can also lift them in this position.

[0066] The etching processing apparatus 1 includes: a phosphoric acid aqueous solution supply unit 40 that supplies phosphoric acid aqueous solution to the liquid treatment unit 39; a pure water supply unit 41 that supplies pure water to the liquid treatment unit 39; a silicon supply unit 42 that supplies silicon solution to the liquid treatment unit 39; and a phosphoric acid aqueous solution discharge unit 43 that discharges phosphoric acid aqueous solution from the liquid treatment unit 39.

[0067] The phosphoric acid aqueous solution supply unit 40 supplies a phosphoric acid aqueous solution of a predetermined concentration to any part of the circulation system (i.e., the liquid treatment unit 39) formed by the treatment tank 34 and the circulation pipeline 50, preferably as shown in the figure, to the outer tank 34B. The phosphoric acid aqueous solution supply unit 40 includes: a phosphoric acid aqueous solution supply source 40A consisting of a tank for storing the phosphoric acid aqueous solution; a phosphoric acid aqueous solution supply pipeline 40B connecting the phosphoric acid aqueous solution supply source 40A and the outer tank 34B; a flow meter 40C sequentially inserted from the upstream side of the phosphoric acid aqueous solution supply pipeline 40B; a flow control valve 40D; and an on / off valve 40E. The phosphoric acid aqueous solution supply unit 40 can supply the phosphoric acid aqueous solution to the outer tank 34B at a controlled flow rate via the flow meter 40C and the flow control valve 40D.

[0068] The pure water supply unit 41 supplies pure water to replenish the water evaporated due to heating the phosphoric acid aqueous solution. The pure water supply unit 41 includes a pure water supply source 41A that supplies pure water at a specified temperature, which is connected to the outer tank 34B via a flow regulator 41B. The flow regulator 41B can be composed of an on / off valve, a flow control valve, a flow meter, etc.

[0069] The silicon supply unit 42 includes a silicon supply source 42A consisting of a tank and a flow regulator 42B, the tank containing a liquid in which a silicon compound solution, such as colloidal silicon, is dispersed. The flow regulator 42B can be composed of an on / off valve, a flow control valve, a flow meter, etc.

[0070] The phosphoric acid aqueous solution discharge unit 43 is provided for discharging the phosphoric acid aqueous solution within the circulation system consisting of the liquid treatment unit 39 and the circulation pipeline 50, i.e., within the liquid treatment unit 39. The phosphoric acid aqueous solution discharge unit 43 includes: a discharge pipeline 43A branching from the circulation pipeline 50; and a flow meter 43B, a flow control valve 43C, an on / off valve 43D, and a cooling tank 43E arranged sequentially from the upstream side in the discharge pipeline 43A. The phosphoric acid aqueous solution discharge unit 43 can discharge the phosphoric acid aqueous solution at a controlled flow rate via the flow meter 43B and the flow control valve 43C.

[0071] Cooling tank 43E temporarily stores and cools the phosphoric acid aqueous solution flowing in discharge pipe 43A. The phosphoric acid aqueous solution flowing out of cooling tank 43E (refer to the attached drawing reference numeral 43F) can be disposed of in the plant waste system (not shown), or the silicon contained in the phosphoric acid aqueous solution can be removed by a regeneration device (not shown) and then transported to the phosphoric acid aqueous solution supply source 40A for reuse.

[0072] In the illustrated example, the discharge pipe 43A is connected to the circulation pipe 50 (the location of the filter discharge port in the figure), but it is not limited to this and can also be connected to other parts within the circulation system, such as the bottom of the inner tank 34A.

[0073] A silicon concentration meter 43G for measuring the silicon concentration in the phosphoric acid aqueous solution is installed in the discharge pipe 43A. Additionally, a phosphoric acid concentration meter 55B for measuring the phosphoric acid concentration in the phosphoric acid aqueous solution is inserted in the branch pipe 55A, which branches from the circulation pipe 50 and connects to the outer tank 34B. A level gauge 44 for detecting the liquid level in the outer tank 34B is installed in the outer tank 34B.

[0074] Next, refer to Figures 3-7The structure of the processing tank 34 of the etching processing apparatus 1 will be described in detail. For ease of explanation, an XYZ orthogonal coordinate system will be set up and referenced as needed. The negative X direction is referred to as "front side" or "front", the positive X direction is referred to as "rear side" or "rear", the negative Y direction is referred to as "right side" or "right side", and the positive Y direction is referred to as "left side" or "left side".

[0075] As described above, the treatment tank 34 has an inner tank 34A that is open at the top and an outer tank 34B that is also open at the top. The inner tank 34A is housed inside the outer tank 34B. The phosphoric acid aqueous solution overflowing from the inner tank 34A flows into the outer tank 34B. During the liquid treatment, most of the bottom of the inner tank 34A is immersed in the phosphoric acid aqueous solution within the outer tank 34B.

[0076] The outer tank 34B is housed inside the liquid receiver (water tank) 80, and a discharge space 81 is formed between the outer tank 34B and the liquid receiver 80. A discharge pipe 82 is connected to the bottom of the discharge space 81.

[0077] The treatment fluid supply nozzle 49 is composed of a cylindrical body extending along the X direction (horizontal direction) within the inner tank 34A. The treatment fluid supply nozzle 49 has multiple discharge ports 49D (see reference 34A) extending through its circumferential surface. Figure 3 and Figure 4 The processing liquid is discharged to the substrate 8 held by the substrate lifting mechanism 36. Two processing liquid supply nozzles 49 are provided in the figure, but three or more processing liquid supply nozzles 49 may also be provided. The processing liquid (phosphoric acid aqueous solution) is supplied to the processing liquid supply nozzles 49 from a pipe 49A extending in the vertical direction.

[0078] The gas nozzle 60 is a cylindrical body extending in the X direction (horizontal direction) at a height position lower than the treatment liquid supply nozzle 49 within the inner tank 34A. The gas nozzle 60 discharges from a plurality of outlets 60D (see reference 1) located on its circumference. Figure 3 and Figure 4 Bubbles of inert gases (such as nitrogen) are expelled. The bubbling of these inert gases stabilizes the boiling state of the phosphoric acid aqueous solution within the inner tank 34A. The treatment liquid (phosphoric acid aqueous solution) is supplied to the gas nozzle 60 from a vertically extending pipe 60A.

[0079] The substrate lifting mechanism 36 has a support plate 36A (not shown) that extends in the vertical direction (Z direction) and is lifted by the lifting mechanism; and a pair of substrate support members 36B (also see) that extend in the horizontal direction (X direction) and are supported at one end by the support plate 36A. Figure 9Each substrate support member 36B has a plurality of (e.g., 50 to 52) substrate holding slots (not shown) arranged at intervals in the horizontal direction (X direction). The peripheral edge of the substrate 8 is inserted into the substrate holding slot. The substrate lifting mechanism 36 is capable of holding the plurality of (e.g., 50 to 52) substrates 8 in a vertical position at intervals in the horizontal direction (X direction). Such a substrate lifting mechanism 36 is known in the art, and detailed illustrations and descriptions of its construction are omitted.

[0080] The processing tank 34 is provided with a first cover 71 and a second cover 72 for opening and closing the upper opening of the inner tank 34A. The first cover 71 and the second cover 72 are respectively connected to rotating shafts 71S and 72S extending in the horizontal direction (X direction). The rotating shafts 71S and 72S are connected to a bearing 83 fixed to the liquid receiver 80 and a rotary actuator 84 (see reference). Figure 4 , Figure 5 By actuating the rotary actuator 84, the first cover 71 and the second cover 72, centered on their respective rotation axes extending in the horizontal direction (X direction), are able to close in the first region (left half) and the second region (right half) of the upper opening of the inner groove 34A, respectively. Figure 3 and Figure 6 The position shown), and the opening position where the upper opening of the inner groove 34A is opened in a generally upright state, including the first and second regions. Figure 8 Rotate (or rotate) between the positions shown in the figure (see reference). Figure 3 (Arrows SW1 and SW2 in the image).

[0081] The first cover 71 and the second cover 72 do not cover the area in the upper opening of the inner groove 34A where the support plate 36A, pipes 49A and 60A are located.

[0082] During normal operation of the etching processing apparatus 1, the first cover 71 and the second cover 72 are in a closed position except when the substrate 8 held by the substrate lifting mechanism 36 is fed into / out of the inner tank 34A, to prevent the temperature of the phosphoric acid aqueous solution in the inner tank 34A from dropping and to suppress the escape of water vapor generated from the boiling phosphoric acid aqueous solution to the outside of the processing tank 34.

[0083] The first cover 71 has: a generally rectangular main body 71A when viewed from directly above; a first droplet shielding portion 71B, a second droplet shielding portion 71C, and a closing portion 71D extending in the X direction; and a third droplet shielding portion 71E extending in the Y direction. Similarly, the second cover 72 has: a generally rectangular main body 72A; a first droplet shielding portion 72B, a second droplet shielding portion 72C, and a closing portion 72D extending in the X direction; and a third droplet shielding portion 72E extending in the Y direction.

[0084] A large rectangular recess 71R is formed on the upper surface of the main body 71A. The recess 71R is divided by a bottom wall 711R and four side walls 712R, 713R, 714R and 715R.

[0085] When the first cover 71 is in the closed position, it does not obstruct the overflow of the phosphoric acid aqueous solution from the inner tank 34A to the outer tank 34B (see reference). Figure 6 As shown by the arrow OF, a gap is provided between the side wall of the inner groove 34A and the side walls 712R and 713R facing it to the ground. In addition, although not shown, multiple V-shaped notches are formed at intervals at the upper ends of the four side walls of the inner groove 34A to facilitate smooth overflow.

[0086] The bottom wall 711R of the first cover 71 is inclined in the Y direction as it moves away from the second cover 72 (as it moves closer to the side wall of the inner groove 34A in the Y direction). Due to this inclination, the aforementioned overflow can proceed smoothly.

[0087] Because the phosphoric acid aqueous solution in the inner tank 34A is boiling or being bubbled, droplets of the phosphoric acid aqueous solution, along with those overflowing from the inner tank 34A into the outer tank 34B, also fly out from the inner tank 34A. These droplets collide with the first droplet shielding portion 71B of the first cover 71 in the closed position and fall into the space between the side wall of the inner tank 34A and the side wall of the outer tank 34B, without scattering to the outside of the outer tank 34B. The lower end of the first droplet shielding portion 71B of the first cover 71 in the closed position is preferably located at least lower than the upper end of the adjacent side wall of the inner tank 34A.

[0088] The second droplet shielding part 71C, when the first cover 71 is in the open position, functions the same as the first droplet shielding part 71B when the first cover 71 is in the closed position. The lower end of the first droplet shielding part 71B of the first cover 71 in the open position is preferably located at least lower than the upper end of the adjacent inner groove 34A sidewall.

[0089] When the closure 71D is in the open position (refer to...) Figure 8 The liquid covering the upper end of the sidewall of the inner tank 34A and the upper end of the sidewall of the outer tank 34B, extending from the rotation shaft 71S to the area above the sidewall of the outer tank 34B, is contained within the gap between the upper end of the sidewall of the inner tank 34A and the upper end of the sidewall of the outer tank 34B. The sealing portion 71D guides liquid adhering to the upper surface of the main body 71A when the first cover 71 is in the closed position (e.g., liquid falling from the substrate as it passes over the processing tank 34) into the discharge space 81 between the outer tank 34B and the liquid receiver 80 when the first cover 71 is in the open position, preventing the liquid from flowing into the outer tank 34B. Liquid entering the discharge space 81 is discarded through the discharge pipe 82.

[0090] The third droplet shielding portion 71E is provided on the side farther from the substrate lifting mechanism 36, above the space between the sidewall of the inner groove 34A and the sidewall of the outer groove 34B. The third droplet shielding portion 71E extends along the entire length of the end edge of the first cover 71 from the rotation axis 71S in the Y direction. When the first cover 71 is in the closed position, the third droplet shielding portion 71E functions the same as the first droplet shielding portion 71B. When the first cover 71 is in the open position, the lower end of the third droplet shielding portion 71E is preferably located at a position at least lower than the upper end of the adjacent sidewall of the inner groove 34A.

[0091] On the side near the substrate lifting mechanism 36, the droplet shielding part extending along the edge of the first cover 71 in the Y direction may not be provided. This is because the phosphoric acid aqueous solution that is scattered in the positive X direction can hardly reach the outer tank 34B because it collides with the support plate 36A, pipes 49A, 60A, etc. of the substrate lifting mechanism 36.

[0092] The second cover 72 is formed approximately mirror-symmetrically with respect to the first cover 71, and both the first cover 71 and the second cover 72 are substantially identical to each other. The difference between them lies in the presence or absence of the auxiliary components (plate-like body 73P, substrate pressing member 74) described later. Therefore, the description of the structure and function of the first cover 71 can be referenced to the description of the structure and function of the second cover 72. The reference symbols of corresponding components of the first cover 71 and the second cover 72 (components in symmetrical positions, components with the same function) are marked with the same letter at the end, differing only in whether the first two digits of the reference symbol are "71" or "72".

[0093] like Figure 6 As shown, when the first cover 71 and the second cover 72 are in the closed position, the side wall 712R extending upward from the bottom wall 711R of the first cover 71 and the side wall 722R extending upward from the bottom wall 721R of the second cover 72 face each other, forming a gap G of height H between the two side walls. By providing the recesses 71R and 72R, the increase in weight of the first cover 71 and the second cover 72 caused by the gap of height H can be suppressed.

[0094] like Figure 6As shown, when the lower surface of the main body 71A of the first cover 71 (lower surface of the bottom wall 711R) and the lower surface of the main body 72A of the second cover 72 (lower surface of the bottom wall 721R) are in contact with the surface of the treatment liquid in the inner tank 34A, boiling or bubbling phosphoric acid aqueous solution may fly upwards and scatter around from the gap between the first cover 71 and the second cover. However, as described above, by setting the gap G with a height H, it is difficult for the treatment liquid to fly outwards from the gap G. To achieve this effect, the height H can be formed to be approximately 5 cm or more.

[0095] When the treatment solution in the inner tank 34A is a phosphoric acid aqueous solution, at least the main bodies 71A and 72A of the first cover 71 and the second cover 72 are not infiltrated by the treatment solution, for example, by being made of a material such as quartz. When the main bodies 71A and 72A are made of quartz, the quartz particles may collide and break or become damaged. To prevent this, it is preferable to provide a gap between the main bodies 71A and 72A when the first cover 71 and the second cover 72 are in the closed position, so that the main bodies 71A and 72A do not contact each other. With a gap between the main bodies 71A and 72A, the phosphoric acid aqueous solution in the treatment tank 34, especially in the inner tank 34A, may scatter outwards through this gap. However, by providing a gap G of height H as described above, the scattering of the phosphoric acid aqueous solution from the gap G can be significantly suppressed.

[0096] Furthermore, to ensure smooth overflow, the bottom wall 711R (721R) is inclined as described above, and when the bottom wall 711R (721R) is in contact with the phosphoric acid aqueous solution in the inner tank 34A, the front end of the bottom wall 711R (721R) is submerged in the phosphoric acid aqueous solution when there is no side wall 712R (722R) extending upward from the bottom wall 711R (721R). However, by providing the side wall 712R (722R) extending upward from the bottom wall 711R (721R) as described above, the height of the phosphoric acid aqueous solution can be lower than the upper end of the side wall 712R (722R).

[0097] like Figure 6 As shown, preferably, a cover portion 73 is provided on either the main body portion 71A of the first cover 71 or the main body portion 72A of the second cover 72 (here, main body portion 71A), extending above or beyond the front end of the other (here, main body portion 72A), covering the gap G from above. By providing the cover portion 73, it is possible to prevent the processing liquid from flying upwards from the gap G. Furthermore, please note that... Figures 3-5 In order to avoid complicating the accompanying drawings, the covering part 73 (and the plate-like body 73P) are not shown.

[0098] Furthermore, because the gap G has a height H, the momentum of the droplets of treatment liquid scattering from the surface of the phosphoric acid aqueous solution in the inner tank 34A weakens upon collision with the cover 73. Therefore, the treatment liquid colliding with the cover 73 does not fly out to the side.

[0099] Covering part 73, for example, Figure 6 As shown, a plate-shaped body 73P with a generally rectangular cutout 73Q that matches the contour of the recess 71R of the first cover 71 can be installed on the upper surface of the main body 71A of the first cover 71. In this case, the end edge of the plate-shaped body 73P constitutes the cover portion 73.

[0100] like Figure 6 As shown, when the first cover 71 and the second cover 72 are in the closed position, a gap may be provided between the covering portion 73 and the second cover 72. Alternatively, when the first cover 71 and the second cover 72 are in the closed position, the covering portion 73 may be in contact with the second cover 72. In this case, the covering portion 73 functions as a seal that closes the upper end of the gap G.

[0101] When the cover 73 contacts the second cover 72, it is preferable that the cover 73 is formed of a fluoropolymer resin material, such as PTFE or PFA, which has a degree of softness that will not cause damage to the quartz even if it collides with it.

[0102] Alternatively, the cover 73 can be integrally formed with the first cover 71. Alternatively, the cover 73 may be omitted. In the absence of the cover 73, it is preferable to have a higher height H compared to the case where the cover 73 is present.

[0103] Additionally, a substrate pressing member 74 is provided on either the main body portion 71A of the first cover 71 or the main body portion 72A of the second cover 72 (in the illustrated example, the front end of the main body portion 72A of the second cover 72). On the lower surface of the substrate pressing member 74, a substrate holding groove 36BG is formed along the arrangement direction (X direction) of the substrates 8 to engage with the substrate holding member 36B (see reference). Figure 10 Multiple substrate holding slots 74G with the same spacing and positioned in the same X direction (refer to) Figure 7 and Figure 10 The peripheral edge of one substrate 8 is housed in each slot of the substrate holding slot 74G. Furthermore, in... Figure 7 In the perspective view, the lower end of the substrate pressing member 74 (the part with the substrate holding groove 74G) can be seen, but please note that it is actually hidden in the bottom wall 721R of the recess 72R and cannot be seen.

[0104] In the illustrated embodiment, the substrate pressing member 74 is composed of an elongated plate-like body formed separately from the second cover 72, and is fixed to the main body 72A of the second cover 72 by threads. Alternatively, the substrate pressing member 74 may be integrally formed with the second cover 72. In any case, the substrate pressing member 74 constitutes part of the sidewall 722R of the main body 72A of the second cover 72.

[0105] When the substrate 8 is processed, the substrate pressing member 74 provided on the second cover 72 in the closed position engages with the substrate 8 supported by the substrate support member 36B, preventing or suppressing upward displacement of the substrate 8. Therefore, even if the processing liquid is discharged from the processing liquid supply nozzle 49 at a high flow rate, or even if the boiling level of the processing liquid in the inner tank 34A becomes high, or even if nitrogen bubbling is performed vigorously, the possibility of the substrate 8 falling off the substrate support member 36B can be eliminated.

[0106] like Figure 9 In a simplified representation, a camera 90 and an illumination 92 are disposed above the processing slot 34. The illumination 92 dedicated to the camera 90 can be omitted as long as the image necessary for the image processing described later can be obtained. The camera 90 outputs an image signal to a substrate position determination unit 94 with image processing capabilities via wired or wireless communication. The substrate position determination unit 94 may be part of the control unit 7 or a separate processing unit.

[0107] The camera 90 can be positioned directly above the upper opening of the inner groove 34A, and above the upper limit position of the substrate 8 supported by the substrate support member 36B (the height position at which the substrate 8 is transferred between the substrate support member 36B of the substrate lifting mechanism 36 and the substrate holder 22 of the batch transport mechanism 19). Alternatively, the camera 90 can be positioned at a lower position (close to the height of the upper opening of the inner groove 34A), and a movement mechanism can be provided that allows the camera 90 to move between a position directly above the inner groove 34A and a position offset from directly above the inner groove 34A. The camera 90 can also be positioned at a different position than described above, provided that the image necessary for determining the substrate position as described later can be obtained.

[0108] A fan filter unit (FFU) 100 is positioned above the camera 90. Clean air is blown downwards from the fan filter unit 100. Through this downward flow of clean air, even if there is gas or mist from the processing liquid (chemical solution) rising from the processing tank 34 that could potentially blur the lens of the camera 90 or corrode the camera 90, such gas or mist will not reach the camera 90.

[0109] By providing a cover (not shown) surrounding the camera 90, and allowing appropriate shielding gas (clean air or inert gas) to circulate within the cover, the camera 90 can be protected from gases or mists from the processing liquid.

[0110] Furthermore, when the processing liquid stored in the processing tank 34 is phosphoric acid, the gas rising above the processing tank 34 is essentially water vapor, which has little impact on the camera 90.

[0111] Next, the operation of the etching processing apparatus 1 described above will be explained. First, the phosphoric acid aqueous solution supply unit 40 supplies the phosphoric acid aqueous solution to the outer tank 34B of the liquid treatment unit 39. After a predetermined time has elapsed since the start of the phosphoric acid aqueous solution supply, the pump 51 of the circulation pipeline 50 is activated, forming a circulating flow that circulates within the aforementioned circulation system.

[0112] Furthermore, the heater 52 of the circulation pipe 50 is activated to heat the phosphoric acid aqueous solution in the inner tank 34A to a predetermined temperature (e.g., 160°C). The first cover 71 and the second cover 72 are kept in a closed position until at least the start of heating based on the heater 52. The phosphoric acid aqueous solution at 160°C reaches a boiling state (preferably a slight boiling state). If the phosphoric acid concentration exceeds a predetermined management upper limit due to the evaporation of water generated by boiling, as detected by the phosphoric acid concentration meter 55B, pure water is supplied from the pure water supply unit 41.

[0113] Before immersing a batch of substrates 8 into the phosphoric acid aqueous solution in the inner tank 34A, the silicon concentration in the phosphoric acid aqueous solution present in the circulation system (including the inner tank 34A, the outer tank 34B, and the circulation pipeline 50) is adjusted (as this concentration affects the etching selectivity of the silicon nitride film relative to the silicon oxide film). The silicon concentration can be adjusted by immersing the simulated substrate in the phosphoric acid aqueous solution in the inner tank 34A, or by supplying a silicon-containing compound solution from the silicon supply unit 42 to the outer tank 34B. To confirm that the silicon concentration in the phosphoric acid aqueous solution present in the circulation system is within a preset range, the phosphoric acid aqueous solution can be circulated in the discharge pipeline 43A, and the silicon concentration can be measured using a silicon concentration meter 43G.

[0114] After the silicon concentration adjustment is completed, the first cover 71 and the second cover 72 are moved to the open position. At this time, the substrate support member 36B of the substrate lifting mechanism 36, which receives the substrate 8 from the substrate holder 22 of the moving body 21 of the batch conveying mechanism 19, is ready above the processing tank 34. The substrate support member 36B appropriately supports multiple, i.e., multiple, for example, 50 substrates 8 forming one batch (also called a processing batch or batch). The term "appropriately supported" means, as shown in the schematic diagram... Figure 10As shown in the lower half, the lower peripheral edge of the substrate 8 is embedded in each substrate holding groove 36BG of the substrate support member 36B, and the substrates 8 are arranged horizontally in a vertical orientation at a predetermined spacing (e.g., 5 mm). Next, the substrate support member 36B descends, thereby submerging the substrate 8 supported by the substrate support member 36B into the phosphoric acid aqueous solution in the inner tank 34A. At this time, to prevent the substrate 9 from floating off the substrate support member 36B, bubbling is preferably stopped.

[0115] After the substrate 8 has been submerged in the phosphoric acid aqueous solution in the inner tank 34A for a predetermined time (e.g., 5 seconds), the second cover 72 is moved to the closed position. The substrate pressing member 74, provided on the second cover 72, engages with the upper peripheral edge of the substrate 8, constraining the substrate 8. Next, the substrate 8 is photographed using the camera 90. Based on the photographing result, it is possible to determine (hereinafter referred to as "substrate position determination") whether all of the substrates 8 are in the proper position (in particular, whether the substrate pressing member 74 is properly engaged with the substrate 8). The method for this determination will be described later. If it is determined that all of the substrates 8 are in the proper position, the first cover 71 is moved to the closed position.

[0116] Next, bubbling of nitrogen gas is started from gas nozzle 60. The substrate 8 is subjected to wet etching (liquid treatment) by immersing it in an aqueous phosphoric acid solution for a specified time.

[0117] During the etching process of substrate 8, the first cover 71 and the second cover 72 are pre-positioned in a closed position. This suppresses the temperature drop near the surface of the phosphoric acid aqueous solution in the inner tank 34A, thereby minimizing the temperature distribution of the phosphoric acid aqueous solution within the inner tank 34A. Furthermore, since the inner tank 34A is immersed in the phosphoric acid aqueous solution within the outer tank 34B, the temperature drop of the phosphoric acid aqueous solution within the inner tank 34A caused by heat dissipation from the walls of the inner tank 34A is suppressed, further minimizing the temperature distribution of the phosphoric acid aqueous solution within the inner tank 34A. Therefore, the in-plane and inter-plane uniformity of the etching amount on substrate 8 can be maintained to a high degree.

[0118] During the processing of one batch of substrate 8, the silicon concentration in the phosphoric acid aqueous solution present in the circulation system increases due to silicon leaching from the substrate 8. In order to maintain, or intentionally alter, the silicon concentration in the phosphoric acid aqueous solution present in the circulation system during the processing of one batch of substrate 8, the phosphoric acid aqueous solution in the circulation system can be discharged through the phosphoric acid aqueous solution discharge unit 43 while the phosphoric acid aqueous solution is supplied through the phosphoric acid aqueous solution supply unit 40.

[0119] As described above, after the processing of a batch of substrates 8 is completed, the first cover 71 and the second cover 72 are moved to the open position. Then, the substrate support member 36B is raised to deliver the substrate 8 out of the inner groove 34A.

[0120] After the substrate 8 is processed and before it is removed from the inner tank 34A, the second cover 72 is kept in the closed position while the first cover 71 is moved to the open position. In this state, the substrate position is determined. By doing so, any misalignment of the substrate 8 that may occur during processing can be detected (although the probability of this happening is very low).

[0121] Afterwards, the first cover 71 and the second cover 72 are moved to the closed position again. After adjusting the temperature, phosphoric acid concentration, and silicon concentration of the phosphoric acid aqueous solution in the circulation system, another batch of substrates 8 is processed in the same manner as above.

[0122] Next, one embodiment regarding substrate position determination will be described. Before substrate position determination, a plurality of substrates 8, for example 50, supported by substrate support member 36B, are immersed in the processing liquid stored in inner tank 34A. At this time, each substrate 8 is positioned below the surface of the processing liquid. Afterward, after a predetermined time (e.g., 5 seconds), the first cover 71 is kept in the open position. Figure 9 (The area indicated by dashed lines) remains unchanged, causing the second cover 72 with the substrate pressing member 74 attached to move to the closed position. Next, the substrate position is determined.

[0123] When determining the substrate position, illumination 92 is turned on, and in this state, camera 90 (image capture unit) captures an image of substrate 8. At this time, illumination light reaches substrate 8 through the area not closed by the first cover 71 in the upper opening of the inner groove 34A, and reflected light (object light) from substrate 8 reaches camera 90. Thus, camera 90 can acquire an image with sufficient sharpness to allow for unobstructed substrate position determination. In this image, essentially only the APEX (outermost peripheral edge of the substrate) and its vicinity are visible across the entire surface of each substrate 8; the surface (device forming surface) and back surface of the substrate are not visible (see reference). Figure 11 (Schematic diagram). Illumination 92 preferably illuminates the substrate 8 from the position that can reflect the APEX most brightly.

[0124] The substrate position determination unit 94 extracts a portion of the image region AR (see reference) in a manner that includes the portion of each substrate 8 near the liquid surface. Figure 11 (A schematic diagram). For example, the region AR can be formed as a strip-shaped region with the long side of the substrate 8's arrangement direction as its length. In the image of the region AR, in... Figure 11 The APEX of each substrate 8 seen in the image (especially the portion perpendicular to the optical axis of the illumination light) becomes the brightest in the image due to the good reflection of the illumination light.

[0125] The substrate position determination unit 94 determines the arrangement direction along the substrate 8 within the region AR (which is along the... Figure 11 The distribution of grayscale values ​​(values ​​corresponding to the brightness of the image) in the direction of the arrow XS parallel to the X-axis.

[0126] The grayscale value distribution can be a line-based distribution, where the line has a width corresponding to the number of pixels (e.g., a Y-direction width corresponding to the number of pixels corresponding to the width of region AR) extending along the arrangement direction (X direction) of substrate 8. In this case, the average grayscale value calculated based on signals from multiple pixels arranged in the Y direction at the same X-direction position can be used as the grayscale value at a certain X-direction position. This processing can improve detection accuracy.

[0127] Alternatively, instead of the above method, a line-based distribution can be used for the grayscale value distribution, where the line has a width (width in the Y direction) corresponding to 1 pixel extending in the direction of arrow XS. In this case, a linear sensor can be used instead of camera 90 as the imaging unit. The linear sensor can be disposed, for example, in the first cover 71 or the second cover 72. If the first cover 71 or the second cover 72 is transparent, the linear sensor can also be disposed, for example, inside the recesses 71R and 72R, in which case the linear sensor receives object light transmitted through the first cover 71 or the second cover 72.

[0128] exist Figure 12 The middle indicates along Figure 11 An example of the grayscale value distribution of arrow XS in the diagram. The image portion corresponding to the APEX of each substrate 8 has the highest brightness, with grayscale values ​​showing peaks. The image portion corresponding to the gap between adjacent substrates 8 has grayscale values ​​showing valleys. In all substrates 8, if the deviation between the actual position (X-coordinate) of each substrate 8 and the reference position where that substrate 8 should be located is within an allowable range, the peak values ​​are within the specified arrangement interval of the substrates 8 (e.g., an offset within 5mm ± an allowable range), and valley values ​​exist between adjacent peak values. In this case, as... Figure 10 In a general sense, a lower peripheral edge of a substrate 8 is embedded in each of the substrate holding grooves 36BG of the substrate support member 36B, and an upper peripheral edge of a substrate 8 is embedded in each of the substrate holding grooves 74G of the substrate pressing member 74. This is referred to as the "proper substrate holding state".

[0129] Figure 13 The text indicates the reasons for inappropriate substrate retention states. For example... Figure 13As shown on the left, when the upper peripheral edge of one substrate 8 is close to the upper peripheral edge of an adjacent substrate 8, and the second cover 72 is closed and the substrate pressing member 74 is brought close to the substrate 8, a phenomenon occurs where the upper peripheral edges of the adjacent substrates 8 are in contact with each other and embedded in the same substrate holding groove 74G. This is called "bridging (wafer bridging)". The flow of the processing liquid deteriorates between the two substrates 8 where bridging occurs; therefore, it is possible that the intended substrate processing result cannot be obtained (e.g., deterioration of in-plane uniformity).

[0130] Figure 12 This represents an example of the grayscale value distribution obtained relative to 50 substrates. Figure 12 In the process, at the ends of the substrate arrangement, the spacing between adjacent grayscale peaks widens. This is due to the aforementioned bridging. That is, when bridging occurs... Figure 13 When building a bridge as shown on the right, such as Figure 14 As shown by the dashed line, the peak value of the grayscale values ​​of the APEX images of two adjacent substrates 8 is detected as an inseparable peak. Furthermore, the distance between adjacent peaks also increases. Using this characteristic, bridging can be detected. Additionally, in... Figure 14 In the figure, the solid line represents the curve obtained when the substrate is held in an appropriate state.

[0131] Furthermore, the determination of whether bridging has occurred is at least included in the determination of whether the deviation between the actual position of one substrate 8 and the reference position is within the allowable range.

[0132] After closing the second cover 72 with substrate pressing member 74, the substrate position is determined. If it is confirmed that no bridging has occurred (i.e. all substrates 8 are in a proper holding state), nitrogen bubbling is started and the first cover 71 is closed. Liquid treatment (e.g., wet etching) is performed in this state.

[0133] Without bridging, open the second cover 72 and then close it (retry). At this point, it is not necessary to open the second cover 72 fully (even if it is moved to the open position); it is sufficient for the substrate pressing member 74 to temporarily disengage from the substrate 8. During this disengagement, the substrate support member 36B can be gently moved up and down slightly to shake the substrate 8. After closing the second cover 72, check the substrate position again. Once it is confirmed that the substrate 8 is properly positioned (i.e., no bridging has occurred), gas is released from the gas nozzle 60 (refer to...). Figures 2-4 Nitrogen gas is released and bubbling begins. The first cover 71 is then closed to continue the process.

[0134] If the bridging is not eliminated despite the above operations, the opening and closing of the second cover 72 and the substrate position determination are repeated until the bridging is eliminated. Alternatively, after a predetermined number of opening and closing of the second cover 72 and substrate position determination, bubbling begins and the first cover 71 is closed to continue liquid treatment, regardless of whether the bridging has been eliminated. Alternatively, even if bridging occurs when the second cover 72 is initially closed, bubbling begins and the first cover 71 is closed to continue liquid treatment.

[0135] Nitrogen bubbling is performed to improve the in-plane and inter-plane uniformity of the substrate 8 after processing. Therefore, it is not preferable to continue immersing the substrate 8 in the processing solution without bubbling. From this point of view, it is preferable to limit the number of tests for opening and closing the second cover 72 and determining the substrate position. However, depending on the type of processing, there may be cases where the above-mentioned problems do not occur, so it is also possible not to limit the number of retests.

[0136] Furthermore, if the substrate 8 is not pressed down using the substrate pressing member 74, the substrate 8 may lift off the substrate support member 36B due to bubbling, and there is a possibility that the lower peripheral edge of the substrate 8 may detach from the substrate holding groove of the substrate support member 36B. Therefore, regardless of the processing order, it is preferable to perform the bubbling while the second cover 72 is in the closed position.

[0137] Software marking can also be performed on substrates 8 that have experienced bridging. Software marking refers to, for example, storing information in the storage medium 38 of the control unit 7 such as, "During wet etching of substrates 8 in batch M (M being the batch ID) in processing tank 34, bridging occurred between the Nth substrate 8 and the (N+1)th substrate 8." Based on software marking, the bridging substrates 8 or the semiconductor devices obtained from those substrates 8 can be carefully inspected in subsequent processes. All substrates 8 that have experienced bridging even once can be targeted for software marking. Alternatively, only substrates 8 that have experienced bridging more than a predetermined number of times can be targeted for software marking. Alternatively, only substrates 8 that have undergone liquid treatment while maintaining a bridging state can be targeted for software marking.

[0138] If bridging occurs during the initial substrate position determination, the second cover 72 can be left open or closed (retried), and the substrate can be processed as is. In this case, the substrate 8 where bridging has occurred is marked by software. Whether to open or close the second cover 72 after bridging occurs during the initial substrate position determination can be set by the operator via a user interface (keyboard, touch panel, etc.) of the substrate liquid treatment system 1A (not shown).

[0139] If bridging is detected, the operator can also issue a warning notification via the unshown user interface (display, alarm light, alarm buzzer, etc.) of the substrate liquid treatment system 1A.

[0140] The timing for closing the second cover 72 with the substrate pressing member 74 can also be determined using the aforementioned substrate position determination. During the process of immersing the substrate 8 in the processing liquid stored in the inner tank 34A in a vertical position with equal intervals in the horizontal direction using the substrate support member 36B, the substrate 8 shakes due to the influence of Laplace pressure, causing a change in the distance between the upper peripheral edges of adjacent substrates 8. Figure 15 The diagram shows the change in distance between adjacent substrates 8 over time, with the instant the substrate 8 is immersed in the processing solution as reference (0 seconds). According to... Figure 15 As shown in the diagram, after the substrate 8 is immersed in the treatment liquid, the shaking of the substrate stops after a certain period of time (e.g., about 5 seconds). Once the shaking of the substrate 8 has decreased to a level that does not cause problems, the second cover 72 with the substrate pressing member 74 can be closed.

[0141] Experiments have confirmed that the time from when substrate 8 is immersed in the processing solution in inner tank 34A until the shaking of substrate 8 becomes sufficiently minimal (e.g., around 5 seconds) is approximately constant. Therefore, after a predetermined time (e.g., around 6 seconds with a slight safety margin) has elapsed since substrate 8 was placed in inner tank 34A, substrate position determination can be performed without checking the substrate position, and the second cover 72 can be closed. Even so, bridging issues are almost nonexistent. Even if bridging does occur, its occurrence can be detected by checking the substrate position after closing the second cover 72, allowing for appropriate intervention.

[0142] Alternatively, the substrate position can be determined by immersing the substrate 8 in the processing liquid and obtaining images after, for example, 5 seconds, 6 seconds, and 7 seconds. If it can be confirmed that the offset (position deviation) of the actual position of the substrate 8 relative to the reference position of the substrate 8 is stable and converges within a specified range, then the second cover 72 is closed. In this case, bridging can be prevented more reliably.

[0143] According to the above embodiment, the substrate 8 can be stably held in an appropriate position (reference position) by the substrate support member 36B and the substrate pressing member 74 for batch processing. If bridging occurs, the in-plane uniformity and inter-plane uniformity of the processing result (e.g., etching amount) of the substrate 8 may be reduced; however, according to this embodiment, such a situation will not occur.

[0144] In the above embodiments, the presence or absence of bridging is considered only in the substrate position determination, but it is not limited to this. In the substrate position determination, the deviation between the reference X-coordinate and the actual X-coordinate of each substrate 8 can also be determined separately. The reference X-coordinate of each substrate 8 is equal to the X-coordinate of the substrate holding groove 36BG of the substrate support member 36B that the substrate 8 should engage with (or the X-coordinate of the substrate holding groove 74G of the substrate pressing member 74). Regarding the deviation between the reference X-coordinate and the actual X-coordinate of each substrate 8, if the deviation exceeds a preset threshold in more than one substrate 8, it can be determined that an inappropriate substrate holding state has occurred.

[0145] In the above embodiment, all substrates 8 are photographed and their positions are determined. However, it is also possible to photograph only a portion of the substrates and determine their positions only for that portion. Due to the configuration of the inner groove 34A and the nozzle type, there may be cases where only substrates 8 located in specific locations experience positional shifts. In such cases, it is also possible to photograph and determine the positions of only a portion of the substrates. Therefore, a function to adjust the shooting range of the camera 90 based on past substrate position determinations can also be provided. By doing so, the computational processing burden can be reduced, and the accuracy of substrate position determination can be improved.

[0146] In the above embodiment, the camera is positioned above the upper opening of the inner tank 34A, and the substrate 8 is photographed with the first cover 71 in the open position. That is, the object light emitted from the object (the illumination light from the illumination 92 reflected by the substrate 8 and directed to the camera 90) enters the camera 90 without passing through the components of the processing tank 34 or the covers 71 and 72. In other words, the object light is only interfered with when it passes through the processing liquid and at the liquid surface (gas-liquid interface) of the processing liquid. As can be clearly seen from the structure illustrated in the above embodiment, the distance from the portion (upper peripheral edge) involved in determining the substrate position of the substrate 8 to the liquid surface of the processing liquid is relatively small. Therefore, it is possible to use the camera 90 to capture images with sufficient sharpness to enable unobstructed substrate position determination.

[0147] In addition, such as Figure 3 As shown, when the first cover 71 is in the closed position, if the first cover 71 is in close contact with the surface of the processing liquid and the first cover 71 is made of a transparent material such as quartz, then even with the first cover 71 in the closed position, there is a possibility that the camera 90 can capture an image with sufficient sharpness to allow for unobstructed determination of the substrate position. In such a case, the substrate position can also be determined based on the image obtained with the first cover 71 in the closed position.

[0148] Additionally, if the processing tank 34 is transparent, the substrate 8 can be photographed from below the processing tank 34. In this case, it is possible to determine whether there is a jump groove in the substrate support member 36B. The jump groove referred to here, for example, means that when the substrate is forcefully submerged in the processing liquid, an upward force is applied to the substrate 8, causing the lower peripheral edge of the substrate 8 to detach from the substrate holding groove 36BG of the substrate support member 36B, and the substrate 8 to move to an inappropriate position. Furthermore, typically, liquid supply lines, drainage lines, and various machines attached to these lines are provided in the space below the processing tank 34; preferably, these lines and machines are arranged in a manner that does not obstruct photography.

[0149] Additionally, if the processing tank 34 is transparent (e.g., in the case of a quartz tank), the camera 90 can also photograph the substrate 8 from the side of the inner tank 34A. In this case, from the viewpoint of obtaining a sharper image, such as... Figure 16 As shown, a processing groove of the type in which the outer groove (34B) only surrounds the upper part of the inner groove (34A) can be used. In this case, the camera 90 can also be set so that the camera lens is in close contact with the side of the inner groove 34A. Furthermore, if an image with sufficient sharpness to allow for unobstructed determination of the substrate position can be obtained, an image of the substrate 8 can also be captured via the outer groove (34B) and the inner groove (34A).

[0150] There are also substrate liquid treatment apparatuses that do not use the substrate pressing member (74) for holding the substrate 8, but instead use the substrate support member (36B) to support the substrate from below while processing the substrate. In this case, if the treatment liquid is boiled violently, or if gas is violently expelled for bubbling, the substrate may float from the substrate support member, potentially causing a jump. Such a jump can be detected by performing the same substrate position determination as described above, based on images captured by cameras positioned to the side or below the treatment tank 34.

[0151] Alternatively, a camera can be added to confirm the position of the substrate 8 held by the substrate support member 36B after it has been pulled from the liquid. This allows for the detection of substrate position shifts that occur during substrate processing or when the substrate is pulled from the processing liquid.

[0152] In the above embodiments, the processing solution is an aqueous phosphoric acid solution, but it is not limited to this. For example, SC1 or a processing solution containing additives such as acetic acid mixed in with the aqueous phosphoric acid solution may also be used. Furthermore, in the above embodiments, the film to be etched is a silicon nitride film, but it is not limited to this; other films that are to be etched may also be used. Additionally, the processing of the substrate in the processing tank may not include an etching step, and may only include a cleaning step. That is, the present invention can be applied when processing is performed in the processing tank under conditions where droplets can be generated from the surface of the processing solution. The substrate is not limited to a semiconductor wafer, and may also be a substrate made of other materials such as glass or ceramic.

[0153] In addition, please note that the serial numbers such as "first" and "second" that precede the components in the instruction manual may not be consistent with the serial numbers that precede the constituent elements described in the technical solution (e.g., regarding "cover").

Claims

1. A substrate liquid treatment apparatus, characterized in that, include: The treatment tank for storing the treatment liquid has an upper opening for feeding and discharging the substrate; A substrate support component that arranges and supports multiple substrates in a vertical orientation at predetermined intervals in the horizontal direction; A lifting mechanism that allows the substrate support member to move up and down between a processing position within the processing tank and a retracted position above the processing tank via the upper opening; A camera unit is positioned to capture images of the plurality of substrates supported by the substrate support member located at the processing position within the processing liquid stored in the processing tank. The substrate position determination unit determines the substrate position based on image data obtained by the camera unit from taking pictures of the plurality of substrates supported by the substrate support member located at the processing position in the processing liquid stored in the processing tank. The substrate position determination determines whether the deviation between the actual position of the plurality of substrates supported by the substrate support member and the reference position where the substrate should be located is within the allowable range. and A control unit that controls the operation of the substrate liquid treatment device. In determining the substrate position, if the distance between at least two adjacent substrates among the plurality of substrates supported by the substrate support member is less than a preset threshold, the substrate position determination unit determines that the deviation is not within the allowable range.

2. The substrate liquid treatment apparatus as described in claim 1, characterized in that: The substrate support member is configured to support the peripheral edge of the lower half of each substrate from below in a manner that allows each substrate to be moved upward. The substrate liquid treatment device includes: A first cover capable of closing at least a portion of the upper opening; A first cover opening and closing mechanism that opens and closes the first cover; and A substrate pressing component is disposed on the first cover, and when the substrate support component supporting the plurality of substrates is in the processing position and the first cover is in the closed position, it engages with the peripheral edge of the upper half of each of the substrates supported by the substrate support component, preventing the substrates from shifting upward and also preventing horizontal displacement.

3. The substrate liquid treatment apparatus as described in claim 2, characterized in that: The control unit, based on image data of the substrate captured at least at one of the first and second time moments, causes the substrate position determination unit to determine the substrate position, wherein... The first moment is the moment after the substrate support component supporting the plurality of substrates is submerged into the processing liquid stored in the processing tank and before the first cover is closed. The second moment is the moment after the substrate support member supporting the plurality of substrates is submerged into the processing liquid stored in the processing tank and the first cover is closed.

4. The substrate liquid treatment apparatus as described in claim 3, characterized in that: The substrate position determination unit determines the substrate position based on the image data of the substrate captured at the first moment. If the substrate position determination unit determines that the deviation is within the allowable range, the control unit moves the first cover to a closed position through the first cover opening and closing mechanism.

5. The substrate liquid treatment apparatus as described in claim 3 or 4, characterized in that: The substrate position determination unit determines the substrate position based on the image data of the substrate captured at the second time. If the substrate position determination unit determines that the deviation is not within the allowable range, the control unit causes the first cover opening and closing mechanism to perform an opening and closing operation of opening the first cover and then moving the first cover to a closed position.

6. The substrate liquid treatment apparatus as described in claim 5, characterized in that: Based on the result of the substrate position determination, the control unit causes the first cover opening and closing mechanism to repeatedly perform the opening and closing operation up to a preset number of times, until the deviation of the first cover after the last movement to the closed position converges within the allowable range.

7. The substrate liquid treatment apparatus as described in claim 5, characterized in that: During the process of opening the first cover and then moving the first cover to the closed position, the control unit uses the lifting mechanism to raise and lower the substrate support member to shake the substrate supported by the substrate support member.

8. The substrate liquid treatment apparatus as described in claim 5, characterized in that, Also includes: A gas nozzle is disposed in the processing tank below the substrate support member located at the processing position to discharge gas for bubbling. and The gas supply mechanism supplies gas to the gas nozzle. The control unit controls the gas supply mechanism to stop discharging bubbling gas from the gas nozzle during the period from opening the first cover to moving the first cover to the closed position.

9. The substrate liquid treatment apparatus as described in claim 5, characterized in that: The upper opening is composed of a first region and a second region, and the first cover is configured to close the first region. The substrate liquid treatment device further includes: A second cover is configured to close the second region; and A second cover opening and closing mechanism that opens and closes the second cover. When the substrate needs to be photographed at the second moment, the control unit uses the second cover opening and closing mechanism to open the second cover and photograph the substrate through the second area of ​​the upper opening.

10. The substrate liquid treatment apparatus as described in claim 2, characterized in that, Also includes: A gas nozzle is disposed in the processing tank below the substrate support member located at the processing position to discharge gas for bubbling. and A gas supply mechanism that supplies gas to the gas nozzle. The control unit controls the gas supply mechanism to stop the discharge of bubbling gas from the gas nozzle after the plurality of substrates supported by the substrate support member are submerged in the processing liquid stored in the processing tank, so that the first cover is moved to the closed position, and to discharge the bubbling gas from the gas nozzle after the first cover is moved to the closed position.

11. The substrate liquid treatment apparatus as described in claim 2, characterized in that: In determining the substrate position, the substrate position determination unit calculates the deviation between the reference position and the actual position of each substrate supported by the substrate support member, and determines whether the deviation is within the allowable range for each substrate.

12. The substrate liquid treatment apparatus according to any one of claims 1-4 and 6-11, characterized in that: The camera unit is positioned to capture images of the plurality of substrates from a predetermined direction. When capturing images of the plurality of substrates from this predetermined direction, only the outermost peripheral edges of the plurality of substrates, held by the substrate support member located at the processing position, are visible in the image.

13. The substrate liquid treatment apparatus as described in claim 12, characterized in that: The camera unit also includes an illumination unit that illuminates the light required to capture the substrate, the illumination unit being positioned to illuminate the light in a manner that makes the outermost peripheral edge of the substrate the brightest.

14. The substrate liquid treatment apparatus as described in claim 12, characterized in that: The substrate position determination unit is configured to determine the substrate position by assuming that the outermost edge of each substrate exists at the position of the peak brightness in the image acquired by the camera unit, and taking the position of each peak as the actual position of each substrate.

15. The substrate liquid treatment apparatus according to any one of claims 1-4 and 6-11, characterized in that: The camera unit includes one or more cameras, which are located at one or more of the following positions: above the processing tank, to the side of the processing tank, and below the processing tank.

16. The substrate liquid treatment apparatus according to any one of claims 1-4 and 6-11, characterized in that: The camera unit includes a linear image sensor having imaging elements arranged along the arrangement direction of the plurality of substrates supported by the substrate support member.

17. The substrate liquid treatment apparatus according to any one of claims 1-4 and 6-11, characterized in that: If the substrate position determination unit determines that two adjacent substrates are in contact, the control unit stores each of the two substrates as a substrate with a contact record with another substrate.

18. A method for substrate solution treatment using a substrate solution treatment apparatus. The substrate liquid treatment device includes: The treatment tank for storing the treatment liquid has an upper opening for feeding and discharging the substrate; A substrate support component that arranges and supports multiple substrates in a vertical orientation at predetermined intervals in the horizontal direction; and A lifting mechanism that allows the substrate support member to move up and down through the upper opening between a processing position within the processing tank and a retracted position above the processing tank. The substrate liquid treatment method is characterized in that... This includes the following steps: The camera is used to capture images of the plurality of substrates supported by the substrate support member located at the processing position within the processing liquid stored in the processing tank. The substrate position determination unit performs substrate position determination based on image data obtained by the camera unit from taking pictures of the plurality of substrates supported by the substrate support member located at the processing position in the processing liquid stored in the processing tank. The substrate position determination determines whether the deviation between the actual position of the plurality of substrates supported by the substrate support member and the reference position where the substrate should be located is within the allowable range. and The control unit controls the operation of the substrate liquid treatment device based on the result of determining the substrate position. In the determination of substrate position, if the distance between at least two adjacent substrates among the plurality of substrates supported by the substrate support member is smaller than a preset threshold, it is determined that the deviation is not within the allowable range.

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