Method for manufacturing display panel, display panel and display device

Abstract

Embodiments of the present invention disclose a method for manufacturing a display panel, a display panel, and a display device. The manufacturing method includes the following steps: preparing a first electrode array and arranging it on an array substrate, with adjacent first electrodes forming a first spacing in a first direction and adjacent first electrodes forming a second spacing in a second direction; applying a negative material to the first electrodes and the array substrate; exposing and developing the entire layer of negative material, with the negative material within the first spacing forming a first hydrophobic pixel definition layer and the negative material within the second spacing forming a second hydrophobic pixel definition layer; and re-exposing the first pixel definition layer to impart hydrophilicity. According to the present invention, only one layer of negative material needs to be applied, and then exposed, developed, and re-exposed to obtain two pixel definition layers, saving material, equipment, and time costs and improving production efficiency.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 14, 2021, with application number 202111531929.3 and invention name “A Method for Preparing a Display Panel”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of display panels, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Art

[0003] Organic light-emitting diode (OLED) devices, with their self-luminescence, wide viewing angle, high contrast, fast response speed, and thinness, have become a major trend in display technology. Compared to OLED devices that use fine masks and vacuum evaporation, inkjet printing technology has attracted much attention due to its precise alignment, the absence of fine metal masks, and 100% material utilization, making it the mainstream trend in the production of large-scale OLED devices in the future.

[0004] Organic light-emitting diode (OLED) pixel arrangement is usually composed of multiple pixels, each of which contains a red (R) sub-pixel, a green (G) sub-pixel, and a blue (B) sub-pixel. The R, G, and B sub-pixels are arranged in a circular pattern to form a matrix. This traditional pixel arrangement structure has the following problems: (1) During the printing process, due to the instability of a certain print head nozzle, the volume of the ink droplets in the pixel printed by this nozzle is too large or too small, resulting in the appearance of bright or dark lines when the product is displayed, resulting in linear display unevenness; (2) Only the nozzles corresponding to the sub-pixels spray ink, while the nozzles between the sub-pixels do not spray ink, resulting in low nozzle utilization, many printing cycles, long printing time, and different evaporation and drying conditions of the ink printed successively, resulting in drying defects.

[0005] In order to solve the above technical problems, the technical solution adopted in the prior art is to connect all red sub-pixels, all green sub-pixels, and all blue sub-pixels to form a linear pixel row.

[0006] In this way, the ink printed into the pixels can circulate with each other, eventually averaging the volume and thus solving the above technical problems.

[0007] However, to achieve independent light emission, a first pixel definition layer and a second pixel definition layer must be fabricated separately in the horizontal and vertical directions. Because the first pixel definition layer is made of a hydrophilic material and the second pixel definition layer is made of a hydrophobic material, two separate coating, exposure, and development processes are required. This cumbersome process, high material costs, and increased equipment requirements increase both cost and time.

[0008] In view of this, it is necessary to develop a method for manufacturing a display panel to solve the problem of increased monetary and time costs in manufacturing two pixel definition layers. Summary of the Invention

[0009] Embodiments of the present invention provide a method for manufacturing a display panel, a display panel, and a display device, to solve the problem of increased monetary and time costs in manufacturing two pixel definition layers.

[0010] In order to solve the above technical problems, the embodiments of the present invention disclose the following technical solutions:

[0011] A method for preparing a display panel is provided, comprising the following steps: providing an array substrate; preparing first electrodes on the array substrate, wherein the first electrode array is arranged on the array substrate, adjacent first electrodes form a first interval in a first direction, and adjacent first electrodes form a second interval in a second direction; covering the first electrode and the array substrate with a whole layer of negative material; exposing and developing the whole layer of negative material, wherein the negative material in the first interval forms a first pixel definition layer having hydrophobicity, and the negative material in the second interval forms a second pixel definition layer having hydrophobicity; exposing the first pixel definition layer again to make the first pixel definition layer hydrophilic; and preparing a light-emitting layer on the first electrode.

[0012] In addition to or as an alternative to one or more features disclosed above, the thickness of the second pixel definition layer is greater than the thickness of the first pixel definition layer.

[0013] In addition to or as an alternative to one or more features disclosed above, the thickness of the first pixel definition layer is in the range of 0.2um-0.5um, and the thickness of the second pixel definition layer is in the range of 1um to 2um.

[0014] In addition to or as an alternative to one or more features disclosed above, the thickness of the first pixel definition layer is greater than the thickness of the first electrode.

[0015] In addition to or as an alternative to one or more features disclosed above, the thickness of the light emitting layer is less than the thickness of the second pixel definition layer.

[0016] In addition to or as an alternative to one or more features disclosed above, in the step of re-exposing the first pixel definition layer, the first pixel definition layer is re-exposed using UV light.

[0017] In addition to or as an alternative to one or more features disclosed above, the step of re-exposing the first pixel definition layer to make the first pixel definition layer hydrophilic comprises the following steps:

[0018] providing a mask;

[0019] placing the mask on the negative material so that the openings on the mask correspond to the first pixel definition layer;

[0020] exposing the first pixel definition layer again to change the material of the first pixel definition layer from hydrophobic to hydrophilic;

[0021] The mask is removed.

[0022] In addition to or as an alternative to one or more features disclosed above, providing a mask comprises the following steps:

[0023] providing a transparent substrate;

[0024] forming a metal layer on the transparent substrate, and etching the metal layer to form an opening on the metal layer;

[0025] A support column is formed on a side of the transparent substrate away from the metal layer to form a mask.

[0026] In addition to or as an alternative to one or more features disclosed above, the support pillar has a thickness greater than or equal to 0.2 microns and less than or equal to 0.8 microns.

[0027] In addition to or as an alternative to one or more features disclosed above, the thickness of the first pixel definition layer is less than the thickness of the light emitting layer.

[0028] In addition to one or more features disclosed above, or as an alternative, in the step of exposing and developing the entire layer of the negative material, a half-tone mask is used to expose and develop the entire layer of the negative material.

[0029] In addition to one or more features disclosed above, or as an alternative, a printing groove is formed between adjacent second pixel definition layers, and luminescent material can be continuously printed along an extension direction of the printing groove to form a luminescent layer.

[0030] In addition to or as an alternative to one or more features disclosed above, the step of preparing the light-emitting layer further includes: preparing a second electrode on the light-emitting layer and the second pixel electrode layer.

[0031] An embodiment of the present invention further provides a display panel, comprising:

[0032] an array substrate;

[0033] First electrodes are arranged in an array on the array substrate, with adjacent first electrodes forming a first interval in a first direction and adjacent first electrodes forming a second interval in a second direction;

[0034] A pixel definition structure is provided on the array substrate and the first electrode; the pixel definition structure includes a first pixel definition layer and a second pixel definition layer provided in the same layer, the first pixel definition layer is located in the first gap, and the second pixel definition layer is located in the second gap; the first pixel definition layer is hydrophilic, and the second pixel definition layer is hydrophobic;

[0035] The light-emitting layer is arranged on the first electrode.

[0036] In addition to or as an alternative to one or more of the features disclosed above, the light emitting layer covers the first electrode and the first pixel definition layer.

[0037] In addition to or as an alternative to one or more features disclosed above, the first pixel definition layer is partially overlapped on a side of the first electrode facing away from the array substrate.

[0038] An embodiment of the present invention further provides a display device, comprising any one of the display panels described above.

[0039] One of the above technical solutions has the following advantages or beneficial effects: only a layer of negative material needs to be coated, and then exposed, developed, and then exposed again to obtain two pixel definition layers, which saves the cost of materials, equipment, and time costs, and improves production efficiency; and after reducing the process of producing one pixel definition layer, the yield problem caused by this process is also reduced, thereby improving the yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0041] Figure 1 A schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0042] Figure 2 A schematic cross-sectional view of an array substrate provided in an embodiment of the present invention;

[0043] Figure 3 A schematic cross-sectional view of the display panel obtained in step 2 of the preparation method according to an embodiment of the present invention;

[0044] Figure 4 A schematic top view of the display panel produced in step 2 of the production method according to an embodiment of the present invention;

[0045] Figure 5 A schematic top view of the display panel produced in step 4 of the production method according to an embodiment of the present invention;

[0046] Figure 6 A schematic top view of the display panel produced in step 6 of the production method according to an embodiment of the present invention;

[0047] Figure 7 A schematic cross-sectional view of the display panel produced in step 6 of the production method according to an embodiment of the present invention;

[0048] Figure 8 A schematic cross-sectional view of the display panel obtained in step 7 of the preparation method according to an embodiment of the present invention;

[0049] Figure 9 A schematic cross-sectional structure diagram of a mask provided in an embodiment of the present invention;

[0050] Figure 10 A front view of a mask provided by an embodiment of the present invention;

[0051] Figure 11 A back view of a mask provided by an embodiment of the present invention;

[0052] Figure 12 A schematic diagram of a mask provided by an embodiment of the present invention when used in a display panel manufacturing process;

[0053] Figure 13 A schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0054] Figure 14 A schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0055] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0056] See also Figure 1 , Figure 1The present invention provides a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention. The method for manufacturing a display panel includes steps 1 to 7.

[0057] Step 1: Provide an array substrate.

[0058] See also Figure 2 A schematic cross-sectional structure diagram of an array substrate provided by an embodiment of the present invention.

[0059] Specifically, a base substrate 11 is provided, which can be a rigid substrate or a flexible substrate. When the base substrate 11 is a rigid substrate, it can include a hard substrate such as a glass substrate; when the base substrate 11 is a flexible substrate, it can include a flexible substrate such as a polyimide film or an ultra-thin glass film.

[0060] Optionally, a metal layer is deposited on the base substrate 11 . The metal layer may be a single layer or a stack of multiple metal layers. The metal layer is patterned to form a light shielding layer 12 having both routing and light shielding functions.

[0061] Optionally, a buffer layer 13 is deposited on the light shielding layer 12 and the base substrate 11 using a deposition process such as PECVD (Plasma Enhanced Chemical Vapor Deposition). The material of the buffer layer 13 can be an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride, for example, one or a combination of Si3N4, SiO2, and SiON. The thickness of the buffer layer 13 can be 1000 angstroms to 5000 angstroms.

[0062] Optionally, a metal oxide semiconductor material is deposited on the buffer layer 13 using a deposition process such as PVD (Physical Vapor Deposition). The metal oxide semiconductor material may be IGZO, ITZO, or IGZTO. The metal oxide semiconductor is patterned to form an active layer 14. The thickness of the active layer 14 may be 100 angstroms to 1000 angstroms.

[0063] Optionally, a gate dielectric material is deposited on the active layer 14 and the buffer layer 13 using a deposition process such as PECVD, wherein the gate dielectric material includes SiOx, etc. The thickness of the deposited gate dielectric material may be 500 angstroms to 2000 angstroms.

[0064] Optionally, a gate metal layer is deposited on the gate dielectric material using a deposition process such as PVD, and the gate metal layer is patterned to form a gate pattern. Using the gate pattern as a shield, the gate dielectric material is etched to self-align the gate 16, the gate insulating layer 15, and the channel region 141 of the active layer 14, thereby dividing the active layer 14 into the channel region 141, the source region 142, and the drain region 143.

[0065] Optionally, an inorganic thin film such as SiO2 is deposited on the gate 16, the active layer 14, and the buffer layer 13 using a deposition process such as PECVD to form an interlayer insulating layer 17. The thickness of the interlayer insulating layer 17 may be 2000 angstroms to 8000 angstroms. The interlayer insulating layer 17 and the buffer layer 13 are patterned to form a plurality of vias.

[0066] Optionally, a source-drain metal layer is deposited on the interlayer insulating layer 17 using a deposition process such as PVD, and the source-drain metal layer is patterned to form a source-drain layer 18. The source-drain layer 18 includes a source electrode 181 and a drain electrode 182. The drain electrode 182 is connected to the drain region 143 of the active layer 14 through a via in the interlayer insulating layer 17. The source electrode 181 is connected to the source region 142 of the active layer 14 through a via in the interlayer insulating layer 17, and is also connected to the light shielding layer 12 through a via that penetrates the interlayer insulating layer 17 and the buffer layer 13.

[0067] Optionally, an inorganic thin film such as SiO2 is deposited on the source / drain electrode layer 18 and the interlayer insulating layer 17 using a deposition process such as PECVD to serve as a passivation layer 19. The thickness of the passivation layer 19 may be 1000 to 5000 angstroms. A planarization layer 191 is then deposited on the passivation layer 19. The material of the planarization layer 191 may include an organic photoresist. The planarization layer 191 and the passivation layer 19 are patterned to form openings, thereby completing the fabrication of the array substrate 10.

[0068] Step 2: preparing first electrodes on the array substrate, and arranging the first electrode array on the array substrate; forming a first gap between adjacent first electrodes in the first direction X, and forming a second gap between adjacent first electrodes in the second direction Y.

[0069] See also Figure 3 and Figure 4 , Figure 3 and Figure 4The following are schematic cross-sectional and top-down views of the display panel produced in step 2, respectively. Specifically, electrode material is deposited on the array substrate 10 and patterned to form a plurality of first electrodes 20 arranged in an array. The electrode material comprises a transparent conductive electrode material, such as ITO (Indium Tin Oxide). Of course, the present invention is not limited thereto. The first electrode 20 of the present invention may also be an opaque electrode, which can be determined based on the light emission direction of the display panel. The first electrode is the anode.

[0070] Optionally, a plurality of first electrodes 20 are arranged in an array on the array substrate 10, with a first gap 211 formed between adjacent first electrodes 20 in the first direction X, and a second gap 222 formed between adjacent first electrodes 20 in the second direction Y. Exemplarily, the first electrodes 20 include short sides 21 and long sides 22, the short sides 21 being arranged along the first direction X, and the long sides 22 being arranged along the second direction Y. A first gap 211 is formed between the short sides 21 of adjacent first electrodes 20, and a second gap 222 is formed between the long sides 22 of adjacent first electrodes 20.

[0071] Step 3: Cover the entire layer of negative material on the first electrode and the array substrate.

[0072] Step 4: Expose and develop the entire layer of negative material using a halftone mask. The negative material in the first gap forms a first hydrophobic pixel definition layer, and the negative material in the second gap forms a second hydrophobic pixel definition layer.

[0073] See also Figure 5 The thickness of the first pixel definition layer 31 is greater than the thickness of the first electrode 20, and the thickness of the second pixel definition layer 32 is greater than the thickness of the first pixel definition layer 31, so that a printing groove 321 is formed between adjacent second pixel definition layers 32. In the overlapping portion of the first pixel definition layer 31 and the second pixel definition layer 32, the first pixel definition layer 31 is covered by the second pixel definition layer 32. The thickness of the first pixel definition layer 31 ranges from 0.2 μm to 0.5 μm, and the thickness of the second pixel definition layer 32 ranges from 1 μm to 2 μm.

[0074] Step 5: Expose the first pixel definition layer again to make the first pixel definition layer hydrophilic.

[0075] After the first pixel definition layer 31 and the second pixel definition layer 32 are formed, since the second pixel definition layer 32 is mainly used to define the position of the light-emitting pixels, the first pixel definition layer 31 is mainly used to separate the two adjacent first electrodes 20, that is, the main functions of the two are different, so the requirements for their hydrophilicity and hydrophobicity are also different. By adjusting the hydrophilicity and hydrophobicity of the first pixel definition layer 31, the contact angles of the surfaces of the first pixel definition layer 31 and the second pixel definition layer 32 are made different, which helps to improve the structural stability of the subsequent film layer, thereby improving the overall performance.

[0076] Optionally, step 5 in the embodiment of the present invention mainly includes the following contents:

[0077] See also Figure 12 First, a mask 90 is provided and placed on the negative material so that the opening 94 on the mask 90 corresponds to the first pixel definition layer 31; then the first pixel definition layer 31 is exposed again to change the material of the first pixel definition layer 31 from hydrophobic to hydrophilic; and then the mask 90 is removed.

[0078] Specifically, the first pixel definition layer 31 is exposed again to UV light using a mask 90 with openings 94 corresponding to the first pixel definition layer 31. The UV light destroys the hydrophobicity of the first pixel definition layer 31, rendering it hydrophilic. The UV light breaks the fluorine bonds of the fluorine ions on the surface of the first pixel definition layer 31. After the fluorine bonds are broken, the fluorine ions are released and volatilized, converting the hydrophobicity into a hydrophilicity.

[0079] It should be noted that the way the hydrophilicity and hydrophobicity of the material of the first pixel definition layer 31 change is related to the initial properties of the first pixel definition layer 31 and the hydrophilicity and hydrophobicity of the light-emitting layer 50. When the light-emitting layer 50 is hydrophilic and the first pixel definition layer 31 is hydrophobic, the first pixel definition layer 31 needs to be converted from hydrophobic to hydrophilic. When the light-emitting layer 50 is hydrophobic and the first pixel definition layer 31 is hydrophilic, the first pixel definition layer 31 needs to be converted from hydrophilic to hydrophobic to ensure that the hydrophilicity and hydrophobicity of the first pixel definition layer 31 are consistent with those of the light-emitting layer 50.

[0080] In other embodiments, the mask 90 with the opening 94 corresponding to the first pixel definition layer 31 and the first electrode 20 may be used to expose the first pixel definition layer 31 again, because the first electrode 20 is an anode, which is metal and has no effect on the anode due to UV light.

[0081] In this step, only one exposure step is required, and no development step is required to make the first pixel definition layer hydrophilic, thereby reducing process steps and saving costs.

[0082] In the prior art, two coatings, two exposures, and two developments are required to produce a hydrophilic first pixel definition layer and a hydrophobic second pixel definition layer. However, in the embodiments of the present application, only one coating and two exposures are required to produce both the hydrophilic first pixel definition layer and the hydrophobic second pixel definition layer. This reduces material, equipment, and time costs compared to the prior art, improving production efficiency.

[0083] Optionally, when providing a mask 90, the mask 90 needs to be manufactured first, which specifically includes the following steps:

[0084] See also Figure 9 First, a transparent substrate 91 is provided, and then a metal layer 92 is formed on the transparent substrate 91, and the metal layer 92 is etched to form an opening 94 on the metal layer; then, a support column 93 is formed on the side of the transparent substrate 91 away from the metal layer 92 to form a mask 90.

[0085] Specifically, the transparent substrate 91 serves as a support structure for the mask 90 to ensure the structural stability of the mask 90. ​​Using a transparent material to form the substrate facilitates light to pass through the transparent substrate 91 and illuminate the first pixel definition layer 31 when processing the first pixel definition layer 31.

[0086] When processing negative materials, only part of the structure needs to be processed, so part of it needs to be blocked. Figure 10 In the embodiment of the present application, a metal layer 92 is formed on a transparent substrate 91. Since the metal layer 92 itself is not light-transmitting, it can play a shielding role. Then, according to the light transmission requirements, the metal layer 92 is etched to remove the metal layer 92 in the corresponding area to form an opening 94 on the metal layer 92.

[0087] See also Figure 10 and Figure 11 After metal layer 92 is formed, support pillars 93 are formed on the side of transparent substrate 91 facing away from metal layer 92, thereby completing the fabrication of mask 90. ​​The placement of support pillars 93 on the side of transparent substrate 91 facing away from metal layer 92 must avoid openings 94 to prevent them from affecting the light transmission of mask 90. ​​Furthermore, the placement of support pillars 93 helps improve the stability of mask 90 during use, ensuring the processing effect of negative materials.

[0088] When the mask 90 includes multiple openings 94 and multiple support columns 93, the multiple support columns 93 are arranged between two adjacent openings 94 to avoid the setting of the support columns 93 affecting the light transmission effect of the mask 90 while further enhancing the stability of the mask 90 during use.

[0089] After the mask 90 is fabricated, it is placed on the negative material, with the support posts 93 abutting the second pixel definition layer 32. This means that the openings 94 now correspond to the first pixel definition layer 31, facilitating processing of the first pixel definition layer 31. Similarly, when processing the second pixel definition layer 32, the support posts 93 are abutted against the first pixel definition layer 31, with the openings 94 corresponding to the second pixel definition layer 32. This abutment of the support posts 93 against the second pixel definition layer 32 prevents frictional damage to the negative material caused by the mask 90 when placed on the negative material, thereby affecting the fabrication of subsequent film layers.

[0090] It should be noted that when the first pixel definition layer 31 is exposed again, the array substrate 10, the first electrode 20, the first pixel definition layer 31 and the second pixel definition layer 32 can be transferred as a whole to a cleaning device, and the first pixel definition layer 31 can be changed from hydrophobic to hydrophilic while being cleaned by the illumination device in the cleaning device. Compared with directly using traditional exposure and development equipment, this treatment method can effectively reduce the production cost and reduce the impact of light during exposure on the structure of the first pixel definition layer 31.

[0091] Optionally, in the embodiment of the present invention, the thickness of the support pillars 93 is greater than or equal to 0.2 microns and less than or equal to 0.8 microns. If the thickness of the support pillars 93 is too large, the distance between the transparent substrate 91 and the negative material will be too large. During the processing of the first pixel definition layer 31, due to the influence of the illumination angle, light may pass through the distance between the transparent substrate 91 and the negative material and illuminate the area blocked by the mask 90, thereby affecting the processing effect of the negative material. If the thickness of the support pillars 93 is too small, the support pillars 93 will not provide effective support, resulting in friction and damage to the negative material due to the mask 90.

[0092] In actual production, the thickness of support pillars 93 can be set to 0.2 microns, 0.4 microns, 0.6 microns, or 0.8 microns, etc. This effectively prevents the negative material from being damaged by friction with the mask 90 and prevents light from passing through the gap between the transparent substrate 91 and the negative material and irradiating the area blocked by the mask 90, thereby ensuring effective processing of the negative material. The specific thickness of support pillars 93 can be adjusted accordingly based on actual design requirements and is not particularly limited here.

[0093] It should be noted that the cross-section of the support column 93 in the embodiment of the present invention can be circular, elliptical, triangular or other regular or irregular shapes. It is only necessary to ensure that the support column 93 can stably place the mask 90 on the negative material. Its specific structural shape can be adjusted accordingly according to actual design requirements, and no special restrictions are made here.

[0094] Step 6: Prepare a light-emitting layer on the first electrode.

[0095] Specifically, the same color of luminescent material is continuously printed in the same printing slot 321 , and different colors of luminescent material are printed in different printing slots 321 to form a luminescent layer 50 , and the luminescent layer 50 is formed on the first electrode 20 ;

[0096] Different colors of luminescent materials are dissolved in solvents to form different inks, and then the inks are printed in the printing grooves 321 formed by the adjacent second pixel definition layer 32 using a process such as inkjet printing. Inks formed by luminescent materials of different colors are printed in different printing grooves 321, and the inks are solidified into films to form a luminescent layer 50.

[0097] See also Figure 6 and Figure 7 The red luminescent material 51, the green luminescent material 52 and the blue luminescent material 53 are spaced apart in different printing slots 321. Since the printing slots 321 are continuous, ink can be continuously printed in the printing slots 321. The concentration of the ink can be configured according to the thickness of the luminescent layer 50 to be prepared.

[0098] Figure 6 Although three printing slots 321 are schematically shown, the display panel may include more first electrodes 20, thereby providing more strips of the second pixel definition layer 32 to form more printing slots 321. The red light-emitting material 51, the green light-emitting material 52, and the blue light-emitting material 53 are sequentially and cyclically arranged in more printing slots 321. The thickness of the second pixel definition layer 32 is greater than that of the light-emitting layer 50.

[0099] At the same time, the luminescent materials of the same color between adjacent second pixel definition layers 32 are separated by the first pixel definition layer 31, so that the luminescent materials only cover the first electrode 20 in the light-emitting area and not the first pixel definition layer 31. Different printing slots 321 print luminescent materials of different colors, so luminescent materials of different colors are spaced apart between adjacent first pixel definition layers 31. In other words, the first pixel definition layer 31 is used to define luminescent materials of the same color, while the second pixel definition layer 32 is used to define luminescent materials of different colors.

[0100] When printing ink within the printing slots 321, the volume of the ink is significantly larger than the volume of the cured luminescent layer 50, and the ink is fluid. The hydrophilic nature of the first pixel definition layer 31 accelerates the flow of ink within the printing slots 321, quickly dispersing the printed ink within the area defined by the first pixel definition layer 31 and preventing ink accumulation and overflow in a particular area. This further improves the efficiency of continuous printing. The hydrophobic nature of the second pixel definition layer 32 also prevents the printed ink from overflowing into adjacent printing slots 321 and causing color mixing. The thickness of the second pixel definition layer 32 must, of course, match the height of the printed ink.

[0101] In other embodiments, the first pixel definition layer 31 between adjacent second pixel definition layers 32 may also be covered with the luminescent material. In this case, the thickness of the first pixel definition layer 31 may be smaller than the thickness of the luminescent layer 50. When printing the luminescent material to form the luminescent layer 50, continuous printing can still be used to improve printing efficiency, and the formed luminescent layer 50 is also continuous.

[0102] Step 7: Prepare a second electrode on the light-emitting layer and the second pixel electrode layer.

[0103] In order to realize the light emitting layer 50 to emit light, a second electrode 60 is also required to be provided. The second electrode 60 covers the light emitting layer 50 and the second pixel definition layer 32. Figure 8 As shown. The first electrode 20 is an anode, and the second electrode 60 is a cathode, but the present invention is not limited thereto. The light-emitting layer 50 emits light under the combined action of the first electrode 20 and the second electrode 60, and the array substrate 10 provides a driving voltage to the first electrode 20.

[0104] In the method for preparing the display panel provided in this embodiment, only a layer of negative material needs to be coated, and then exposed, developed, and then exposed again to obtain two pixel definition layers, which saves the cost of materials, equipment, and time costs, and improves production efficiency; and after reducing the process of producing one pixel definition layer, the yield problem caused by this process is also reduced, thereby improving the yield of the product.

[0105] The embodiment of the present invention further provides a display panel, see Figure 13 The display panel 1 includes an array substrate 10, in which a thin film transistor layer is provided. The thin film transistor layer includes a plurality of thin film transistors to form a plurality of switches. By designing the thin film transistor structure in the array substrate 10, it is possible to achieve regulation of different display modes of the display panel 1.

[0106] See also Figure 3 and Figure 4The display panel 1 includes first electrodes 20, which are arranged in an array on the array substrate 10. Adjacent first electrodes 20 form a first gap 211 in a first direction X, and adjacent first electrodes 20 form a second gap 222 in a second direction Y. Exemplarily, the first electrodes 20 include short sides 21 and long sides 22. The short sides 21 are arranged along the first direction X, and the long sides 22 are arranged along the second direction Y. A first gap 211 is formed between the short sides 21 of adjacent first electrodes 20, and a second gap 222 is formed between the long sides 22 of adjacent first electrodes 20.

[0107] The first electrodes 20 are electrically connected to the thin film transistors in the array substrate 10. The first electrodes 20 are controlled by turning the thin film transistors on and off. Adjacent first electrodes 20 are spaced apart to avoid interference between adjacent first electrodes 20, thereby enabling each first electrode 20 to independently control the corresponding light-emitting pixel.

[0108] The display panel 1 includes a pixel definition structure, which is arranged on the array substrate 10 and the first electrode 20. The pixel definition structure includes a first pixel definition layer 31 and a second pixel definition layer 32 arranged in the same layer, and the material of the first pixel definition layer 31 and the second pixel definition layer 32 has the function of converting between hydrophilicity and hydrophobicity. That is, when the first pixel definition layer 31 and the second pixel definition layer 32 are manufactured, according to the property requirements of the first pixel definition layer 31 and the second pixel definition layer 32, the first pixel definition layer 31 and the second pixel definition layer 32 can be set to be hydrophilic or hydrophobic respectively to improve the overall performance of the display panel 1.

[0109] Among them, the material of the first pixel definition layer 31 and the second pixel definition layer 32 has the function of converting between hydrophilicity and hydrophobicity and is arranged in the same layer, so that when manufacturing the pixel definition structure, the materials used for the first pixel definition layer 31 and the second pixel definition layer 32 can be the same. After forming the target structure of the first pixel definition layer 31 and the second pixel definition layer 32, the hydrophilicity or hydrophobicity of the first pixel definition layer 31 and the second pixel definition layer 32 is adjusted by using the material conversion function, so that the target structure of the first pixel definition layer 31 and the second pixel definition layer 32 can be formed simultaneously using a single mask, that is, the first pixel definition layer 31 and the second pixel definition layer 32 are formed in one piece, thereby simplifying the manufacturing process of the pixel definition structure and reducing production costs.

[0110] Furthermore, the first pixel definition layer 31 is located in the first interval 211 to separate adjacent first electrodes 20 to avoid mutual interference caused by conduction between adjacent first electrodes 20, thereby affecting the regulation of the display mode of the display panel 1; the second pixel definition layer 32 is located in the second interval 222, and a printing groove 321 is formed between adjacent second pixel definition layers 32 to limit the position of the light-emitting pixels.

[0111] It should be noted that the first pixel definition layer 31 and the second pixel definition layer 32 have different contact angles, that is, the first pixel definition layer 31 and the second pixel definition layer 32 have different hydrophilicity and hydrophobicity. For example, the first pixel definition layer 31 is hydrophilic, and the second pixel definition layer 32 is hydrophobic. Since the second pixel definition layer 32 is primarily used to define the position of the light-emitting pixels, and the first pixel definition layer 31 is primarily used to separate adjacent first electrodes 20, that is, the two have different primary functions, resulting in different requirements for their hydrophilicity and hydrophobicity. By setting the contact angles of the first pixel definition layer 31 and the second pixel definition layer 32 to be different, the structural stability of subsequent film layers is improved, thereby improving the overall performance of the display panel 1.

[0112] The display panel 1 includes a light-emitting layer 50, which is disposed on the first electrode 20. When manufacturing the light-emitting layer 50, different colored light-emitting materials are dissolved in a solvent to form different inks. The inks are then printed into adjacent printing slots 321 formed in the second pixel definition layer 32 using a process such as inkjet printing. Inks formed from different colored light-emitting materials are printed in different printing slots 321, and the inks are cured to form films to form the light-emitting layer 50.

[0113] See also Figure 6 and Figure 7 The red luminescent material 51, the green luminescent material 52 and the blue luminescent material 53 are spaced apart in different printing slots 321. Since the printing slots 321 are continuous, ink can be continuously printed in the printing slots 321, and the concentration of the ink can be configured according to the thickness of the luminescent layer 50 to be prepared.

[0114] Figure 6 Three printing slots 321 are schematically shown, but the display panel 1 may include more first electrodes 20, thereby setting more strips of the second pixel definition layer 32 to form more printing slots 321, and the red light-emitting material 51, the green light-emitting material 52 and the blue light-emitting material 53 are cyclically arranged in more printing slots 321 in sequence.

[0115] At the same time, the luminescent materials of the same color between adjacent second pixel definition layers 32 are separated by the first pixel definition layer 31, so that the luminescent materials only cover the first electrode 20 in the light-emitting area and not the first pixel definition layer 31. Different printing slots 321 print luminescent materials of different colors, so that luminescent materials of different colors are spaced apart between adjacent first pixel definition layers 31. In other words, the first pixel definition layer 31 is used to define luminescent materials of the same color, while the second pixel definition layer 32 is used to define luminescent materials of different colors.

[0116] In some embodiments, the light-emitting layer 50 covers both the first electrode 20 and the first pixel definition layer 31 , that is, when the light-emitting layer 50 is produced by inkjet printing, the printing ink in the printing slot 321 can flow between adjacent first electrodes 20 to form a pixel row in the printing slot 321 , thereby improving the structural uniformity of the light-emitting layer 50 in the printing slot 321 , which is beneficial to improving the display effect of the display panel 1 .

[0117] In the embodiment of the present invention, the first pixel definition layer 31 and the second pixel definition layer 32 are provided with different contact angles, and the first pixel definition layer 31 and the second pixel definition layer 32 can switch between hydrophilicity and hydrophobicity, so that the hydrophilicity and hydrophobicity of the first pixel definition layer 31 and the second pixel definition layer 32 can be adjusted according to the properties of the light-emitting layer 50, so as to improve the structural uniformity of the light-emitting layer 50, thereby improving the display effect of the display panel 1; at the same time, the first pixel definition layer 31 and the second pixel definition layer 32 are provided in the same layer, so that the first pixel definition layer 31 and the second pixel definition layer 32 can be formed under the same photomask, which helps to simplify the production process of the pixel definition structure and reduce the production cost of the display panel 1.

[0118] Optionally, the height of the second pixel definition layer 32 relative to the array substrate 10 on the side facing away from the array substrate 10 is greater than the height of the first pixel definition layer 31 relative to the array substrate 10 on the side facing away from the array substrate 10, that is, when the pixel definition structure is manufactured to form the first pixel definition layer 31 and the second pixel definition layer 32, the thickness of the second pixel definition layer 32 is greater than the thickness of the first pixel definition layer 31.

[0119] This structural design ensures that when the light-emitting layer 50 is manufactured, the first pixel definition layer 31 will not affect the circulation of the printing ink, ensuring the flow of the printing ink between adjacent first electrodes 20, thereby making the structure of the light-emitting layer 50 uniform; at the same time, the second pixel definition layer 32 can effectively confine the printing ink within the printing slot 321, preventing the printing ink from flowing out of the printing slot 321 and causing crosstalk with other pixels in adjacent printing slots 321, thereby affecting the display effect of the display panel 1.

[0120] Optionally, the thickness of the second pixel definition layer 32 is greater than or equal to 1 micron and less than or equal to 2 microns. If the thickness of the second pixel definition layer 32 is too small, the height difference between the second pixel definition layer 32 and the first electrode 20 will be too small, which is not conducive to the production of the light-emitting layer 50 covering the first electrode 20. It may even cause printing ink to overflow from the printing groove 321 on the second pixel definition layer 32 during the production of the light-emitting layer 50, causing crosstalk, thereby affecting the display effect of the display panel 1. If the thickness of the second pixel definition layer 32 is too large, the overall thickness of the display panel 1 will be too large, which is not conducive to the lightweight design of the display panel 1 and affects the installation and use of the display panel 1.

[0121] In actual production, the thickness of the second pixel definition layer 32 can be set to 1 micron, 1.2 microns, 1.5 microns, or 2 microns, etc., which can ensure that the second pixel definition layer 32 effectively defines the formation position of the light-emitting layer 50 while also preventing the overall thickness of the display panel 1 from being too large and affecting the normal use of the display panel 1. The specific thickness of the second pixel definition layer 32 can be adjusted accordingly according to actual conditions and is not particularly limited here.

[0122] Optionally, the thickness of the first pixel definition layer 31 is greater than or equal to 0.2 microns and less than or equal to 0.5 microns. If the thickness of the first pixel definition layer 31 is too thin, the first pixel definition layer 31 may have a poor isolation effect on adjacent first electrodes 20 or may not be able to effectively isolate adjacent first electrodes 20, thereby affecting the control of the display mode of the display panel 1. If the thickness of the first pixel definition layer 31 is too thick, the height difference between the first pixel definition layer 31 and the first electrode 20 may be too large, making it impossible for printing ink to effectively flow between adjacent first electrodes 20 during the process of manufacturing the light-emitting layer 50, thereby affecting the structural uniformity of the light-emitting layer 50.

[0123] In actual manufacturing, the thickness of the first pixel definition layer 31 can be set to 0.2 microns, 0.3 microns, 0.4 microns, or 0.5 microns, etc., to ensure that the first pixel definition layer 31 effectively isolates adjacent first electrodes 20 and that printing ink effectively flows between adjacent first electrodes 20, thereby ensuring the structural uniformity of the light-emitting layer 50. The specific thickness of the first pixel definition layer 31 can be adjusted accordingly based on actual conditions and is not particularly limited herein.

[0124] Optionally, in the embodiment of the present invention, the thickness difference between the first pixel definition layer 31 and the second pixel definition layer 32 is greater than or equal to 0.5 microns and less than or equal to 1.8 microns. If the thickness difference between the first pixel definition layer 31 and the second pixel definition layer 32 is too large, the thickness of the second pixel definition layer 32 will be too large while ensuring the first pixel definition layer 31's isolation effect on the first electrode 20, thereby causing the overall thickness of the display panel 1 to be too large, affecting the installation and use of the display panel 1. If the thickness difference between the first pixel definition layer 31 and the second pixel definition layer 32 is too small, during the fabrication process of the light-emitting layer 50, to ensure that the printing ink does not overflow from the printing groove 321 of the second pixel definition layer 32, the printing ink will not be able to effectively flow between adjacent first electrodes 20, thereby affecting the structural uniformity of the light-emitting layer 50.

[0125] In actual production, the thickness difference between the first pixel definition layer 31 and the second pixel definition layer 32 can be set to 0.5 microns, 0.8 microns, 1 micron, 1.5 microns, or 1.8 microns. This ensures that the second pixel definition layer 32 effectively defines the formation position of the light-emitting layer 50 while maintaining the structural uniformity of the light-emitting layer 50. It also prevents the overall thickness of the display panel 1 from being too large, which could affect the normal use of the display panel 1. The specific value of the thickness difference between the first pixel definition layer 31 and the second pixel definition layer 32 can be adjusted accordingly based on actual conditions and is not particularly limited herein.

[0126] Optionally, the height of the first pixel definition layer 31 on the side facing away from the array substrate 10 relative to the array substrate 10 is greater than the height of the first electrode 20 on the side facing away from the array substrate 10 relative to the array substrate 10, that is, the thickness of the first pixel definition layer 31 is greater than the thickness of the first electrode 20. This structural design enables the first pixel definition layer 31 to effectively isolate adjacent first electrodes 20 and avoid interference between adjacent first electrodes 20, thereby ensuring that each first electrode 20 effectively regulates the light-emitting mode of the corresponding light-emitting layer 50 area, thereby ensuring the display effect of the display panel 1.

[0127] The first pixel definition layer 31 partially overlaps the side of the first electrode 20 facing away from the array substrate 10, that is, the first pixel definition layer 31 wraps around the edge of the adjacent first electrode 20. During the manufacturing process of the first electrode 20, due to the influence of the manufacturing process and manufacturing precision, defects such as burrs may appear on the edge of the first electrode 20. By partially overlapping the first pixel definition layer 31 on the side of the first electrode 20 facing away from the array substrate 10, the burrs that may appear on the edge of the first electrode 20 can be wrapped, thereby reducing the risk of a short circuit between the first electrode 20 and the cathode disposed on the light-emitting layer 50, and ensuring normal display of the display panel 1.

[0128] Optionally, in the embodiment of the present invention, the height of the light-emitting layer 50 relative to the array substrate 10 is greater than the height of the first pixel definition layer 31 relative to the array substrate 10 and less than the height of the second pixel definition layer 32 relative to the array substrate 10. That is, the thickness of the light-emitting layer 50 is greater than the thickness of the first pixel definition layer 31 and less than the thickness of the second pixel definition layer 32. This structural design can ensure that the second pixel definition layer 32 effectively defines the location of the light-emitting layer 50, preventing the printing ink used to form the light-emitting layer 50 from overflowing from the printing groove 321 of the second pixel definition layer 32. It also ensures that the printing ink effectively flows within the printing groove 321 during the production of the light-emitting layer 50, thereby ensuring the structural uniformity of the light-emitting layer 50.

[0129] Optionally, the display panel 1 further includes an electron transport layer 70, a second electrode 60, and an encapsulation layer 80, which are sequentially arranged. The electron transport layer 70 is arranged on the light-emitting layer 50 to increase electron mobility and improve the luminescence effect of the light-emitting layer 50. The second electrode 60 is arranged on the electron transport layer 70, and the display mode of the display panel 1 is regulated by controlling the conduction and disconnection between the second electrode 60 and the first electrode 20. The encapsulation layer 80 is arranged on the second electrode 60 to encapsulate the internal structure of the display panel 1, preventing moisture or oxygen in the air from corroding the display panel 1 and affecting the display effect of the display panel 1.

[0130] An embodiment of the present invention further provides a display device including a display panel. The specific structure of the display panel is as described above. Since the present display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments. Detailed descriptions are omitted here.

[0131] Figure 14 A schematic structural diagram of a display device provided by an embodiment of the present invention is shown in FIG. Figure 14 As shown, the display device 4 includes a display panel 1, a control circuit 2, and a housing 3. The housing 3 is connected to the display panel 1 to support and fix the display panel 1. The control circuit 2 is disposed in the housing 3 and is electrically connected to the display panel 1 to control the display panel 1 to display images.

[0132] The display panel 1 can be fixed to the housing 3 to form an integral unit with the housing 3. The display panel 1 and the housing 3 form a sealed space for accommodating the control circuit 2. The control circuit 2 can be the mainboard of the display device 4. At the same time, the control circuit 2 can also integrate one or more functional components such as a battery, an antenna structure, a microphone, a speaker, a headphone jack, a universal serial bus interface, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor, so that the display device 4 can be adapted to various application fields.

[0133] It should be noted that the display device 4 is not limited to the above content and may also include other components, such as a camera, an antenna structure, a fingerprint unlocking module, etc., to expand its scope of use, which is not limited here. The display device 4 in the embodiment of the present invention has a wide range of applications, including televisions, computers, and flexible displays and lighting such as foldable or rollable displays, all of which fall within the scope of the application field of the display device 4 in the embodiment of the present invention.

[0134] The above is a detailed introduction to a method for preparing a display panel, a display panel, and a display device provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present invention. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a display panel, characterized in that: The following steps are involved: providing an array substrate; Prepare first electrodes on an array substrate, wherein the first electrode array is arranged on the array substrate, adjacent first electrodes form a first interval in a first direction, and adjacent first electrodes form a second interval in a second direction; A negative material is entirely covered on the first electrode and the array substrate; exposing and developing the entire layer of the negative material, so that the negative material in the first interval forms a first hydrophobic pixel definition layer, and the negative material in the second interval forms a second hydrophobic pixel definition layer; exposing the first pixel definition layer again to make the first pixel definition layer hydrophilic; A light-emitting layer is prepared on the first electrode, the light-emitting layer covers the first pixel definition layer between adjacent second pixel definition layers, and the light-emitting layer has hydrophilicity.

2. The preparation method according to claim 1, wherein The thickness of the second pixel definition layer is greater than the thickness of the first pixel definition layer.

3. The preparation method according to claim 2, wherein The thickness of the first pixel definition layer ranges from 0.2um to 0.5um, and the thickness of the second pixel definition layer ranges from 1um to 2um.

4. The preparation method according to claim 1, wherein The thickness of the first pixel definition layer is greater than the thickness of the first electrode.

5. The preparation method according to claim 1, wherein The thickness of the light emitting layer is smaller than the thickness of the second pixel definition layer.

6. The preparation method according to claim 1, wherein In the step of re-exposing the first pixel definition layer, UV light is used to re-expose the first pixel definition layer.

7. The preparation method according to claim 1, wherein The step of exposing the first pixel definition layer again to make the first pixel definition layer hydrophilic comprises the following steps: providing a mask; placing the mask on the negative material so that the openings on the mask correspond to the first pixel definition layer; exposing the first pixel definition layer again to change the material of the first pixel definition layer from hydrophobic to hydrophilic; The reticle is removed.

8. The preparation method according to claim 7, wherein The method of providing a mask comprises the following steps: providing a transparent substrate; forming a metal layer on the transparent substrate, and etching the metal layer to form an opening on the metal layer; A support column is formed on a side of the transparent substrate away from the metal layer to form a mask.

9. The preparation method according to claim 8, wherein The thickness of the support pillar is greater than or equal to 0.2 micrometers and less than or equal to 0.8 micrometers.

10. The preparation method according to claim 1, wherein The thickness of the first pixel definition layer is smaller than that of the light emitting layer.

11. The preparation method according to claim 1, wherein In the step of exposing and developing the entire layer of the negative material, a half-tone mask is used to expose and develop the entire layer of the negative material.

12. The preparation method according to claim 2, wherein A printing groove is formed between adjacent second pixel definition layers, and the luminescent material can be continuously printed along the extending direction of the printing groove to form a luminescent layer.

13. The preparation method according to claim 1, wherein After the step of preparing the light-emitting layer, the method further comprises: A second electrode is prepared on the light-emitting layer and the second pixel definition layer.

14. A display panel, characterized in that: include: array substrate; First electrodes are arranged in an array on the array substrate, with adjacent first electrodes forming a first interval in a first direction and adjacent first electrodes forming a second interval in a second direction; A pixel definition structure is provided on the array substrate and the first electrode; the pixel definition structure includes a first pixel definition layer and a second pixel definition layer provided in the same layer, the first pixel definition layer is located in the first interval, and the second pixel definition layer is located in the second interval; the first pixel definition layer is hydrophilic, and the second pixel definition layer is hydrophobic; the materials of the first pixel definition layer and the second pixel definition layer have the function of switching between hydrophilicity and hydrophobicity; The light-emitting layer is disposed on the first electrode, covers the first pixel definition layer between adjacent second pixel definition layers, and has hydrophilicity.

15. The display panel according to claim 14, wherein: The light emitting layer covers the first electrode and the first pixel definition layer.

16. The display panel according to claim 14, wherein: The first pixel definition layer is partially overlapped on a side of the first electrode facing away from the array substrate.

17. A display device, characterized in that: The display device comprises the display panel according to any one of claims 14 to 16.

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